Substrate processing apparatus

Abstract

To provide a substrate processing apparatus capable of cleaning a filter with a simpler configuration.SOLUTION: A substrate processing apparatus 100 processes a substrate W. The substrate processing apparatus 100 includes a storage portion 2, a circulation pipe 3, a filter 35, and a temperature control mechanism 5A. The storage portion 2 stores a processing liquid to be used to process the substrate W. The circulation pipe 3 circulates the processing liquid stored in the storage portion 2 through the storage portion 2. The filter 35 is provided in the circulation pipe 3, and removes particles from the processing liquid flowing through the circulation pipe 3. The temperature control mechanism 5A executes a temperature increase process. The temperature increase process indicates a process of increasing the temperature of the filter 35 to a temperature higher than the temperature of the processing liquid when processing the substrate W.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to a substrate processing apparatus. [Background technology]

[0002] Substrate processing apparatuses that process substrates using a processing liquid are known. This type of substrate processing apparatus includes a pipe through which the processing liquid flows to be supplied to the substrate, and a filter provided in the pipe (see, for example, Patent Document 1). The processing liquid may contain particles. If a substrate is processed using processing liquid containing particles, for example, the substrate may not be in a desired state after the substrate processing. The filter removes particles from the processing liquid. As a result, clean processing liquid is supplied to the substrate. This reduces the possibility that the substrate may not be in a desired state after the substrate processing.

[0003] However, repeated use of the filter during repeated substrate processing may reduce the particle capture efficiency of the filter, thereby reducing the cleanliness of the processing liquid. Therefore, the filter must be replaced, for example, periodically.

[0004] The substrate processing apparatus of Patent Document 1 includes a filter cleaning device. The filter cleaning device cleans the filter. Cleaning the filter can extend the filter's lifespan, thereby reducing the frequency of filter replacement. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2013-30690 Summary of the Invention [Problem to be solved by the invention]

[0006] However, the substrate processing apparatus of Patent Document 1 cleans the filter by alternately cooling and heating the filter. Specifically, the substrate processing apparatus of Patent Document 1 first supplies a cooling fluid to the filter to cool it. Then, it supplies a heating fluid to the filter to heat it. This requires a configuration for supplying the cooling fluid to the filter and a configuration for supplying the heating fluid to the filter. This makes the configuration of the substrate processing apparatus complex.

[0007] The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a substrate processing apparatus capable of cleaning a filter with a simpler configuration. [Means for solving the problem]

[0008] According to one aspect of the present invention, a substrate processing apparatus processes a substrate. The substrate processing apparatus includes a storage unit, a circulation pipe, a filter, and a temperature control mechanism. The storage unit stores a processing liquid used to process the substrate. The circulation pipe circulates the processing liquid stored in the storage unit through the storage unit. The filter is provided in the circulation pipe and removes particles from the processing liquid circulating through the circulation pipe. The temperature control mechanism performs a temperature increase process. The temperature increase process refers to a process of increasing the temperature of the filter to a temperature higher than the temperature of the processing liquid when processing the substrate.

[0009] In one embodiment, the substrate processing apparatus further includes a detector and a controller. The detector detects the number of particles contained in the processing liquid. The controller controls the temperature control mechanism. The controller causes the temperature control mechanism to perform the temperature increase process when the number of particles detected by the detector exceeds a first threshold.

[0010] In one embodiment, the control unit stops the temperature control mechanism's temperature increase process based on a predetermined condition after the start of the temperature increase process, and if the number of particles detected by the detection unit does not become equal to or less than a second threshold after the control unit stops the temperature increase process, the control unit causes the temperature control mechanism to perform the temperature increase process again.

[0011] In one embodiment, the control unit causes the temperature control mechanism to perform the temperature increase process, and after detecting that the number of particles detected by the detection unit has reached saturation, causes the temperature control mechanism to stop the temperature increase process.

[0012] In one embodiment, the temperature control mechanism causes a heated fluid to flow through the filter to increase the temperature of the filter.

[0013] In one embodiment, the temperature control mechanism includes a heating unit that heats the cleaning liquid, and the temperature control mechanism passes the cleaning liquid heated by the heating unit through the filter to increase the temperature of the filter.

[0014] In one embodiment, the cleaning liquid includes the treatment liquid.

[0015] In one embodiment, the reservoir is a first reservoir. The circulation pipe is a first circulation pipe. The temperature control mechanism further includes a second reservoir and a second circulation pipe. The second reservoir stores the cleaning liquid. The second circulation pipe is connected to the first circulation pipe on the upstream side and downstream side of the filter, and circulates the cleaning liquid stored in the second reservoir through a portion of the first circulation pipe, the second reservoir, and the filter. The heating unit is provided in the second circulation pipe.

[0016] In one embodiment, the temperature control mechanism further includes a pump that circulates the cleaning liquid through a portion of the first circulation pipe, the second circulation pipe, the second reservoir, and the filter. The pump delivers the cleaning liquid so that the cleaning liquid flows from the upstream side to the downstream side of the filter.

[0017] In one embodiment, the temperature control mechanism further includes a pump that circulates the cleaning liquid through a portion of the first circulation pipe, the second circulation pipe, the second reservoir, and the filter. The pump delivers the cleaning liquid so that the cleaning liquid flows from the downstream side to the upstream side of the filter.

[0018] In one embodiment, the substrate processing apparatus further includes a control unit that controls the temperature control mechanism. The temperature control mechanism further includes an on-off valve. The on-off valve is disposed in the first circulation pipe or the second circulation pipe upstream of the filter. The on-off valve controls the flow and stop of the cleaning liquid. The control unit opens and closes the on-off valve during the temperature increase process to vibrate the filter.

[0019] In one embodiment, the substrate processing apparatus further includes a control unit that controls the temperature control mechanism. After the temperature increase process is performed, the control unit lowers the temperature of the heating unit. The temperature control mechanism circulates the cleaning liquid through a portion of the first circulation piping, the second circulation piping, the filter, and the second reservoir to lower the temperature of the cleaning liquid, and passes the lowered cleaning liquid through the filter to lower the temperature of the filter.

[0020] In one embodiment, the heating unit is provided in the circulation pipe upstream of the filter. The temperature control mechanism includes a bypass pipe and a switching valve. The bypass pipe is connected to the circulation pipe between the heating unit and the filter and returns the treatment liquid flowing from the circulation pipe to the storage unit. The switching valve switches the destination of the treatment liquid stored in the storage unit between the filter and the bypass pipe.

[0021] In one embodiment, the substrate processing apparatus further includes a control unit that controls the temperature control mechanism, and the control unit circulates the processing liquid stored in the storage unit through a part of the circulation piping, the bypass piping, and the storage unit, and uses the heating unit to raise the temperature of the processing liquid to a temperature higher than the temperature of the processing liquid used to process the substrate, and then controls the switching valve to pass the heated processing liquid through the filter to raise the temperature of the filter.

[0022] In one embodiment, the switching valve is a first switching valve. The temperature control mechanism further includes a drainage pipe and a second switching valve. The drainage pipe is connected to the circulation pipe downstream of the filter and drains the treatment liquid flowing in from the circulation pipe. The second switching valve switches the destination of the treatment liquid that has passed through the filter between the storage section and the drainage pipe.

[0023] In one embodiment, the substrate processing apparatus further includes a control unit that controls the temperature control mechanism, and when increasing the temperature of the filter, the control unit controls the first and second switching valves to drain the processing liquid that has passed through the filter from the drain pipe.

[0024] In one embodiment, after the temperature-raising process is performed, the control unit lowers the temperature of the heating unit, and the control unit circulates the treatment liquid stored in the reservoir through a part of the circulation piping, the bypass piping, and the reservoir to lower the temperature of the treatment liquid, and then controls the switching valve to pass the temperature-lowered treatment liquid through the filter.

[0025] In one embodiment, the temperature control mechanism includes a heating unit that heats the filter to increase the temperature of the filter.

[0026] In one embodiment, the temperature control mechanism further includes a drainage pipe and a switching valve. The drainage pipe is connected to the circulation pipe downstream of the filter and drains the treatment liquid flowing in from the circulation pipe. The switching valve switches the destination of the treatment liquid that has passed through the filter between the reservoir and the drainage pipe.

[0027] In one embodiment, the substrate processing apparatus further includes a control unit that controls the temperature control mechanism, and after raising the temperature of the filter by the heating unit, controls the switching valve to drain the processing liquid stored in the storage unit through a part of the circulation piping, the filter, and the drainage piping.

[0028] In one embodiment, after the temperature increasing process is performed, the control unit reduces the temperature of the heating unit.

[0029] In one embodiment, the substrate processing apparatus further includes a vibrator that vibrates the filter. [Effects of the Invention]

[0030] According to the substrate processing apparatus of the present invention, the filter can be cleaned with a simpler configuration. [Brief explanation of the drawings]

[0031] [Figure 1] 1 is a schematic plan view of a substrate processing apparatus according to a first embodiment of the present invention. [Figure 2] 1 is a diagram showing the configuration of a substrate processing unit, a fluid box, and a fluid cabinet included in a substrate processing apparatus according to a first embodiment of the present invention. [Figure 3] 1 is a diagram showing a configuration of a fluid cabinet included in the substrate processing apparatus according to a first embodiment of the present invention. [Figure 4] FIG. 10 is a diagram showing an example of a fluid cabinet when a processing liquid is circulated through an external circulation pipe. [Figure 5] FIG. 10 is a diagram showing an example of a fluid cabinet during a filter temperature increase process. [Figure 6] FIG. 10 is a diagram showing an example of a fluid cabinet during drainage treatment. [Figure 7] FIG. 1 illustrates an example fluid cabinet during a refill process. [Figure 8] FIG. 10 is a diagram showing an example of a fluid cabinet during a filter temperature lowering process. [Figure 9] 5 is a flowchart showing an example of the operation of the substrate processing apparatus according to the first embodiment of the present invention. [Figure 10] 5 is a flowchart showing an example of the operation of the substrate processing apparatus according to the first embodiment of the present invention. [Figure 11] 10 is a flowchart showing another example of the operation of the substrate processing apparatus according to the first embodiment of the present invention. [Figure 12] FIG. 4 is a diagram showing another example of the configuration of the fluid cabinet included in the substrate processing apparatus according to the first embodiment of the present invention. [Figure 13] FIG. 10 is a diagram showing the configuration of a fluid cabinet included in a substrate processing apparatus according to a second embodiment of the present invention. [Figure 14] FIG. 10 is a diagram showing the configuration of a fluid cabinet included in a substrate processing apparatus according to a third embodiment of the present invention. [Figure 15] FIG. 10 is a diagram showing an example of a second state of the fluid cabinet during a filter temperature increase process. [Figure 16] FIG. 10 is a diagram showing an example of a fluid cabinet during a filter temperature lowering process. [Figure 17] FIG. 10 is a diagram showing the configuration of a fluid cabinet included in a substrate processing apparatus according to a fourth embodiment of the present invention. [Figure 18] FIG. 10 is a diagram showing the configuration of a fluid cabinet included in a substrate processing apparatus according to a fifth embodiment of the present invention. [Figure 19] FIG. 10 is a diagram showing an example of a fluid cabinet when a processing liquid is circulated through an external circulation pipe. [Figure 20] FIG. 10 is a diagram showing an example of a fluid cabinet during a liquid temperature increasing process. [Figure 21] FIG. 10 is a diagram showing an example of a fluid cabinet during a filter temperature increase process. [Figure 22] FIG. 10 is a diagram showing an example of a fluid cabinet during a liquid temperature lowering process. [Figure 23] FIG. 10 is a diagram showing an example of a fluid cabinet during a filter temperature lowering process. [Figure 24] 10 is a flowchart showing an example of the operation of the substrate processing apparatus according to the fifth embodiment of the present invention. [Figure 25] 10 is a flowchart showing an example of the operation of the substrate processing apparatus according to the fifth embodiment of the present invention. [Figure 26] FIG. 10 is a diagram showing the configuration of a fluid cabinet included in a substrate processing apparatus according to a sixth embodiment of the present invention. [Figure 27] FIG. 10 is a diagram showing an example of a fluid cabinet when a processing liquid is circulated through an external circulation pipe. [Figure 28] FIG. 10 is a diagram showing an example of a fluid cabinet during a filter temperature increase process. [Figure 29] FIG. 10 is a diagram showing an example of a fluid cabinet during a filter temperature lowering process. [Figure 30] 13 is a flowchart showing an example of the operation of the substrate processing apparatus according to the sixth embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0032] Hereinafter, embodiments of the substrate processing apparatus of the present invention will be described with reference to the drawings (FIGS. 1 to 30). However, the present invention is not limited to the following embodiments, and can be implemented in various forms without departing from the spirit of the present invention. Note that duplicated explanations may be omitted as appropriate. In addition, the same or equivalent parts in the drawings will be designated by the same reference numerals, and explanations will not be repeated.

[0033] The "substrate" to be processed in the substrate processing apparatus according to the present invention can be a semiconductor wafer, a glass substrate for a photomask, a glass substrate for a liquid crystal display, a glass substrate for a plasma display, a substrate for an FED (Field Emission Display), a substrate for an optical disk, a substrate for a magnetic disk, or a substrate for a magneto-optical disk. The following description of an embodiment of the present invention will be primarily focused on a case where a disk-shaped semiconductor wafer is the substrate to be processed. However, the substrate processing apparatus according to the present invention can be similarly applied to various substrates other than the semiconductor wafers described above. Furthermore, the shape of the substrate is not limited to a disk shape, and the substrate processing apparatus according to the present invention can be applied to substrates of various shapes.

[0034] [Embodiment 1] First, a first embodiment of the present invention will be described with reference to Figures 1 to 12. Figure 1 is a schematic plan view of a substrate processing apparatus 100 of this embodiment. The substrate processing apparatus 100 processes substrates W. More specifically, the substrate processing apparatus 100 is a single-wafer processing apparatus, and processes substrates W one by one using a processing liquid. Hereinafter, the processing of substrates W using a processing liquid may be referred to as "substrate processing."

[0035] 1, the substrate processing apparatus 100 includes a plurality of substrate processing units 200, a fluid cabinet 10A, a plurality of fluid boxes 10B, a plurality of load ports LP, an indexer robot IR, a center robot CR, and a control device 101. The substrate processing apparatus 100 of this embodiment is, for example, a cleaning apparatus or an etching apparatus.

[0036] Each load port LP accommodates a plurality of stacked substrates W. The indexer robot IR transports the substrates W between the load port LP and the center robot CR. The center robot CR transports the substrates W between the indexer robot IR and the substrate processing unit 200. Note that a placement stage (path) on which the substrate W is temporarily placed may be provided between the indexer robot IR and the center robot CR, and the device may be configured so that the substrates W are indirectly transferred between the indexer robot IR and the center robot CR via the placement stage.

[0037] The substrate processing units 200 form a plurality of towers TW (four towers TW in FIG. 1). The towers TW are arranged to surround the center robot CR in a plan view. Each tower TW is formed by a plurality of substrate processing units 200 (three substrate processing units 200 in FIG. 1) stacked one on top of the other.

[0038] The fluid cabinet 10A contains a processing liquid. For example, the fluid cabinet 10A contains IPA (isopropyl alcohol) as the processing liquid. Each fluid box 10B corresponds to one of the multiple towers TW. The processing liquid in the fluid cabinet 10A is supplied to all substrate processing units 200 included in the tower TW corresponding to the fluid box 10B via one of the fluid boxes 10B. Each of the substrate processing units 200 supplies the processing liquid to the upper surface of the substrate W. As a result, the substrate W is processed by the processing liquid.

[0039] The control device 101 controls the operation of each part of the substrate processing apparatus 100. For example, the control device 101 controls the fluid cabinet 10A, the fluid box 10B, the load port LP, the indexer robot IR, the center robot CR, and the substrate processing unit 200. The control device 101 includes a control unit 102 and a memory unit 103.

[0040] The control unit 102 controls the operation of each unit of the substrate processing apparatus 100 based on various information stored in the storage unit 103. The control unit 102 has, for example, a processor. The control unit 102 may have a CPU (Central Processing Unit) or an MPU (Micro Processing Unit) as the processor. Alternatively, the control unit 102 may have a general-purpose computing device or a dedicated computing device.

[0041] The memory unit 103 stores various information for controlling the operation of the substrate processing apparatus 100. For example, the memory unit 103 stores data and computer programs. The computer programs include a computer program that defines a procedure for cleaning the filter 35, which will be described later with reference to FIG. 3. The data includes various recipe data. The recipe data includes, for example, a process recipe. The process recipe defines a procedure for substrate processing. Hereinafter, the process for cleaning the filter 35 may be referred to as a "filter cleaning process."

[0042] The storage unit 103 includes a main storage device. The main storage device includes, for example, a semiconductor memory. The storage unit 103 may further include an auxiliary storage device. The auxiliary storage device includes, for example, at least one of a semiconductor memory and a hard disk drive. The storage unit 103 may also include removable media.

[0043] Next, the substrate processing apparatus 100 of this embodiment will be described with reference to Fig. 2. Fig. 2 is a diagram showing the configurations of a substrate processing unit 200, a fluid box 10B, and a fluid cabinet 10A included in the substrate processing apparatus 100 of this embodiment.

[0044] 2, each substrate processing unit 200 includes a chamber 200a, a spin chuck 28, and a nozzle 27. The chamber 200a accommodates the spin chuck 28 and the nozzle 27.

[0045] The spin chuck 28 holds the substrate W. Specifically, the substrate W is held in a horizontal position by the spin chuck 28. The spin chuck 28 also rotates the substrate W that it holds. Specifically, the spin chuck 28 rotates the substrate W around the center of the substrate W.

[0046] The nozzle 27 supplies the processing liquid to the substrate W. More specifically, the nozzle 27 ejects the processing liquid toward the rotating substrate W. The nozzle 27 may eject the processing liquid toward the substrate W from a position facing the center of the substrate W, or may eject the processing liquid toward the substrate W while moving above the substrate W.

[0047] 2, the substrate processing apparatus 100 includes a supply pipe 25 and an on-off valve 26 for each substrate processing unit 200. The on-off valve 26 is housed in a fluid box 10B. A portion of each supply pipe 25 is housed in the fluid box 10B, and another portion of each supply pipe 25 is housed in the chamber 200a.

[0048] The downstream end of each of the supply pipes 25 is connected to a corresponding nozzle 27. The supply pipes 25 are tubular members through which the processing liquid flows, and allow the processing liquid to flow up to the corresponding nozzle 27. The on-off valve 26 is provided in the supply pipes 25 and controls the start and stop of supply of the processing liquid to the nozzles 27. More specifically, the on-off valve 26 can be opened and closed. When the on-off valve 26 is opened, the supply of the processing liquid starts. When the on-off valve 26 is closed, the supply of the processing liquid stops. The opening and closing operation of the on-off valve 26 is controlled by the control device 101 (control unit 102).

[0049] The substrate processing apparatus 100 further includes a processing liquid tank 2, an inlet pipe 21, a plurality of external circulation pipes 22, and an outlet pipe 23. The processing liquid tank 2 stores a processing liquid. For example, the processing liquid tank 2 stores IPA. The processing liquid tank 2 is an example of a "storage section" and a "first storage section."

[0050] The inlet pipe 21, each external circulation pipe 22, and outlet pipe 23 are each tubular components through which the treatment liquid flows. Each external circulation pipe 22 corresponds to one of the multiple towers TW. In other words, each external circulation pipe 22 corresponds to one of the multiple fluid boxes 10B. The inlet pipe 21 and the outlet pipe 23 are housed in the fluid cabinet 10A. A portion of each external circulation pipe 22 is housed in the fluid cabinet 10A. Another portion of each external circulation pipe 22 is housed in the corresponding fluid box 10B.

[0051] The treatment liquid flows into the upstream end of the inlet pipe 21 from the treatment liquid tank 2. The upstream end of each external circulation pipe 22 is connected to the downstream end of the inlet pipe 21. As a result, the treatment liquid flows from the inlet pipe 21 into each external circulation pipe 22, and the treatment liquid flows through each external circulation pipe 22.

[0052] In each fluid box 10B, the upstream ends of the corresponding plurality of supply pipes 25 are connected to the corresponding external circulation pipes 22. When the on-off valves 26 are opened, part of the processing liquid circulating through the external circulation pipes 22 flows into the corresponding supply pipes 25. As a result, the processing liquid is supplied from the supply pipes 25 to the nozzles 27, and is discharged from the nozzles 27 toward the substrate W.

[0053] The downstream ends of the external circulation pipes 22 are connected to the upstream ends of the outflow pipes 23. Therefore, the treatment liquid that has flowed through the external circulation pipes 22 flows out into the outflow pipes 23. The downstream ends of the outflow pipes 23 are connected to the treatment liquid tank 2. The outflow pipes 23 allow the treatment liquid that has flowed out from each external circulation pipe 22 to flow to the treatment liquid tank 2.

[0054] The processing liquid flowing out of the processing liquid tank 2 returns to the processing liquid tank 2 via the inlet pipe 21, each external circulation pipe 22, and the outlet pipe 23. In other words, the processing liquid circulates via the processing liquid tank 2, the inlet pipe 21, each external circulation pipe 22, and the outlet pipe 23. When at least one of the on-off valves 26 is open, a portion of the processing liquid flowing out of the processing liquid tank 2 flows into the corresponding supply pipe 25, and the remaining processing liquid returns to the processing liquid tank 2 via the outlet pipe 23.

[0055] Next, the substrate processing apparatus 100 of this embodiment will be described with reference to Fig. 3. Fig. 3 is a diagram showing the configuration of a fluid cabinet 10A included in the substrate processing apparatus 100 of this embodiment.

[0056] 3, the substrate processing apparatus 100 further includes an internal circulation pipe 3, an internal circulation pump 33, an internal circulation heater 34, a filter 35, a detection unit 36, an internal circulation on-off valve 39, a replenishment mechanism 4, a first temperature control mechanism 5A, and a plurality of external circulation on-off valves 24. Each of the external circulation on-off valves 24 corresponds to one of the plurality of external circulation pipes 22.

[0057] Each external circulation on-off valve 24 is provided in the corresponding external circulation pipe 22. Each external circulation on-off valve 24 can be opened and closed. When an external circulation on-off valve 24 is opened, the treatment liquid flows through the corresponding external circulation pipe 22. When an external circulation on-off valve 24 is closed, the treatment liquid stops flowing through the corresponding external circulation pipe 22. The opening and closing operations of the external circulation on-off valves 24 are controlled by a control device 101 (control unit 102). The multiple external circulation on-off valves 24 are housed in a fluid cabinet 10A. The control device 101 (control unit 102) opens the external circulation on-off valve 24 when circulating the treatment liquid through the external circulation pipe 22.

[0058] The internal circulation piping 3 is a tubular member through which the treatment liquid flows. The internal circulation piping 3 is housed in the fluid cabinet 10A. The upstream end and downstream end of the internal circulation piping 3 are connected to the treatment liquid tank 2. The internal circulation piping 3 circulates the treatment liquid stored in the treatment liquid tank 2 through the treatment liquid tank 2 within the fluid cabinet 10A.

[0059] More specifically, the internal circulation piping 3 has an upstream piping 31 and a downstream piping 32. The upstream end of the upstream piping 31 is connected to the treatment liquid tank 2. The downstream end of the upstream piping 31 is connected to an inlet on the upstream side (primary side) of the filter 35. The upstream end of the downstream piping 32 is connected to an outlet on the downstream side (secondary side) of the filter 35. The downstream end of the downstream piping 32 is connected to the treatment liquid tank 2. The internal circulation piping 3 is an example of a "circulation piping" and a "first circulation piping".

[0060] The internal circulation pump 33 is provided in the internal circulation piping 3. When the internal circulation pump 33 is driven, the processing liquid in the processing liquid tank 2 is sent to the internal circulation piping 3. In other words, the internal circulation pump 33 sends the processing liquid in the processing liquid tank 2 to the internal circulation piping 3. More specifically, the internal circulation pump 33 is provided in the upstream piping 31. When the internal circulation pump 33 is driven, the processing liquid in the processing liquid tank 2 is sent to the upstream piping 31. The internal circulation pump 33 is controlled by the control device 101 (control unit 102).

[0061] The internal circulation heater 34 is provided in the internal circulation pipe 3. The internal circulation heater 34 heats the processing liquid flowing through the internal circulation pipe 3. Specifically, the internal circulation pipe 3 is provided in the upstream pipe 31. The internal circulation heater 34 heats the processing liquid at a first heating temperature. The first heating temperature is a temperature higher than room temperature (e.g., 23°C). For example, when the processing liquid is IPA, the internal circulation heater 34 may heat the IPA at 40°C. The internal circulation heater 34 is controlled by the control device 101 (control unit 102).

[0062] The filter 35 is provided in the internal circulation pipe 3 and removes particles from the processing liquid flowing through the internal circulation pipe 3. Specifically, the filter 35 removes particles from the processing liquid that has flowed into the filter 35 from the upstream pipe 31. As a result, the clean processing liquid from which the particles have been removed flows from the filter 35 into the downstream pipe 32. The internal circulation heater 34 is provided upstream of the filter 35.

[0063] The internal circulation on-off valve 39 is provided in the internal circulation piping 3. More specifically, the internal circulation on-off valve 39 is provided in the downstream piping 32. That is, the internal circulation on-off valve 39 is provided downstream of the filter 35. The internal circulation on-off valve 39 can be opened and closed. The opening and closing operation of the internal circulation on-off valve 39 is controlled by the control device 101 (control unit 102). The control device 101 (control unit 102) opens the internal circulation on-off valve 39 when circulating the processing liquid through the internal circulation piping 3.

[0064] The upstream end of the inlet pipe 21 described with reference to FIG. 2 is connected to the internal circulation pipe 3. Therefore, the treatment liquid flows from the internal circulation pipe 3 into the inlet pipe 21. More specifically, the upstream end of the inlet pipe 21 is connected to the internal circulation pipe 3 at a first connection position P1. The first connection position P1 is a position downstream of the filter 35. In other words, the inlet pipe 21 is connected to the downstream pipe 32. Therefore, the treatment liquid purified by the filter 35 flows into the inlet pipe 21.

[0065] More specifically, the first connection position P1 is a position upstream of the internal circulation on-off valve 39. In other words, the first connection position P1 is a position between the internal circulation on-off valve 39 and the filter 35. When circulating the treatment liquid through the internal circulation piping 3, the control device 101 (controller 102) closes the multiple external circulation on-off valves 24 and opens the internal circulation on-off valve 39. When circulating the treatment liquid through the external circulation piping 22, the control device 101 (controller 102) opens the multiple external circulation on-off valves 24 and closes the internal circulation on-off valve 39.

[0066] The detection unit 36 ​​detects the number of particles contained in the treatment liquid. Specifically, the detection unit 36 ​​detects the number of particles contained in the treatment liquid downstream of the filter 35. That is, the detection unit 36 ​​detects the number of particles contained in the treatment liquid flowing out from the filter 35. The control device 101 (control unit 102) obtains the number of particles contained in the treatment liquid based on the detection result of the detection unit 36. The control device 101 (control unit 102) may obtain the particle collection rate of the filter 35 based on the detection result of the detection unit 36.

[0067] The replenishment mechanism 4 replenishes the processing liquid tank 2 with the processing liquid. Specifically, the replenishment mechanism 4 includes a replenishment pipe 41 and a replenishment on-off valve 42. The replenishment pipe 41 is a tubular member through which the processing liquid flows. The replenishment pipe 41 flows the processing liquid up to the processing liquid tank 2. The replenishment on-off valve 42 is provided on the replenishment pipe 41. The replenishment on-off valve 42 can be opened and closed. When the replenishment on-off valve 42 is opened, the processing liquid is replenished into the processing liquid tank 2. When the replenishment on-off valve 42 is closed, the replenishment of the processing liquid into the processing liquid tank 2 stops.

[0068] The opening and closing operation of the replenishment on-off valve 42 is controlled by the control device 101 (controller 102). When the amount of processing liquid in the processing liquid tank 2 falls below a predetermined amount, the control device 101 (controller 102) opens the replenishment on-off valve 42 to replenish the processing liquid tank 2 with the processing liquid. More specifically, the substrate processing apparatus 100 may further include a liquid level sensor (not shown). The liquid level sensor detects the liquid level of the processing liquid in the processing liquid tank 2. When the liquid level of the processing liquid in the processing liquid tank 2 falls below a predetermined level, the control device 101 (controller 102) opens the replenishment on-off valve 42 to replenish the processing liquid tank 2 with the processing liquid.

[0069] The first temperature control mechanism 5A executes a filter temperature raising process. The filter temperature raising process is a process for raising the temperature of the filter 35 to a temperature higher than the temperature of the processing liquid during substrate processing. Specifically, the first temperature control mechanism 5A raises the temperature of the filter 35 when a filter cleaning process is executed. That is, the filter cleaning process includes a filter temperature raising process. For example, when processing a substrate W using IPA heated to 40°C by the internal circulation heater 34 during substrate processing, the first temperature control mechanism 5A may raise the temperature of the filter 35 to 70°C.

[0070] When the filter 35 is used repeatedly, the number of particles trapped by the filter 35 increases, and the particle trapping efficiency of the filter 35 decreases. When the particle trapping efficiency decreases, the number of particles contained in the processing liquid flowing from the filter 35 into the downstream pipe 32 increases, and the cleanliness of the processing liquid decreases. As a result, the processing liquid with reduced cleanliness may be stored in the processing liquid tank 2, and the processing liquid tank 2 may be contaminated by particles. Furthermore, the processing liquid with reduced cleanliness may circulate, and the internal circulation pipe 3, the inlet pipe 21, the multiple external circulation pipes 22, the outlet pipe 23, the multiple supply pipes 25 (see FIG. 2), and the multiple nozzles 27 (see FIG. 2) may be contaminated by particles. Furthermore, the processing liquid with reduced cleanliness may be supplied to the substrate W, and the substrate W may be contaminated by particles.

[0071] In contrast, according to the present embodiment, the temperature of the filter 35 can be raised by the first temperature control mechanism 5A, thereby cleaning the filter 35. As a result, the particle collection efficiency of the filter 35 can be increased, and the number of particles contained in the treatment liquid can be reduced. Specifically, by raising the temperature of the filter 35, the pore diameter of the filter 35 is enlarged, making it easier for particles adhering to the filter 35 to be released from the filter 35. Therefore, when the temperature of the filter 35 is raised, for example, by flowing a fluid through the filter 35, the particles can be released from the filter 35. When the particles are released from the filter 35, the number of particles trapped in the filter 35 decreases, and the collection efficiency of the filter 35 is increased.

[0072] In this embodiment, the first temperature control mechanism 5A raises the temperature of the filter 35 by flowing a heated fluid through the filter 35. As a result, particles adhering to the filter 35 are easily released from the filter 35. Furthermore, since the heated fluid is flowed through the filter 35, the particles can be released from the filter 35. The heated fluid is a fluid that has been heated.

[0073] More specifically, the first temperature control mechanism 5A includes a cleaning circulation heater 54. The cleaning circulation heater 54 heats the cleaning liquid. Specifically, the cleaning circulation heater 54 heats the cleaning liquid at a second heating temperature. The second heating temperature is a temperature higher than the temperature of the processing liquid during substrate processing. For example, when processing the substrate W using IPA at 40°C during substrate processing, the cleaning circulation heater 54 may raise the temperature of the cleaning liquid to 70°C. The cleaning circulation heater 54 is controlled by the control device 101 (control unit 102).

[0074] The first temperature control mechanism 5A passes the cleaning liquid heated by the cleaning circulation heater 54 through the filter 35, thereby raising the temperature of the filter 35. As a result, particles adhering to the filter 35 are easily released from the filter 35. Furthermore, since the cleaning liquid is passed through the filter 35, the particles can be released from the filter 35. The cleaning liquid heated by the cleaning circulation heater 54 is an example of a "heated fluid." The cleaning circulation heater 54 is an example of a "heating unit."

[0075] More specifically, the first temperature control mechanism 5A further includes a cleaning circulation tank 51 and a cleaning circulation pipe 52. The cleaning circulation tank 51 stores the cleaning liquid. The capacity of the cleaning circulation tank 51 is smaller than the capacity of the processing liquid tank 2. For example, the capacity of the processing liquid tank 2 is 40 liters, and the capacity of the cleaning circulation tank 51 is 5 liters. The cleaning circulation tank 51 is an example of a "second storage section."

[0076] The cleaning circulation pipe 52 is a tubular member through which the cleaning liquid flows. The cleaning circulation pipe 52 is connected to the internal circulation pipe 3 on the upstream and downstream sides of the filter 35. The cleaning circulation pipe 52 circulates the cleaning liquid stored in the cleaning circulation tank 51 through a part of the internal circulation pipe 3, the cleaning circulation pipe 52, the cleaning circulation tank 51, and the filter 35. The cleaning circulation pipe 52 is an example of a "second circulation pipe."

[0077] The cleaning circulation heater 54 is provided in the cleaning circulation pipe 52 and heats the cleaning liquid flowing through the cleaning circulation pipe 52. The first temperature control mechanism 5A circulates the cleaning liquid heated by the cleaning circulation heater 54 through a portion of the internal circulation pipe 3, the cleaning circulation pipe 52, the cleaning circulation tank 51, and the filter 35. As a result, the heated cleaning liquid flows through the filter 35, and the temperature of the filter 35 increases. Hereinafter, the process of circulating the cleaning liquid stored in the cleaning circulation tank 51 through a portion of the internal circulation pipe 3, the cleaning circulation pipe 52, the cleaning circulation tank 51, and the filter 35 may be referred to as a "cleaning circulation process."

[0078] In this embodiment, the cleaning liquid includes a processing liquid. More specifically, the cleaning liquid is the same type of processing liquid as the processing liquid stored in the processing liquid tank 2. Therefore, the cleaning circulation tank 51 stores the same type of processing liquid as the processing liquid stored in the processing liquid tank 2. The cleaning circulation pipe 52 circulates the processing liquid (cleaning liquid) stored in the cleaning circulation tank 51 through a part of the internal circulation pipe 3, the cleaning circulation pipe 52, the cleaning circulation tank 51, and the filter 35. The cleaning circulation heater 54 is provided in the cleaning circulation pipe 52 and heats the processing liquid (cleaning liquid) flowing through the cleaning circulation pipe 52.

[0079] According to this embodiment, the processing liquid can be used as the cleaning liquid. Therefore, compared to a configuration in which a liquid other than the processing liquid is used as the cleaning liquid, the time required to switch from circulation of the processing liquid via the cleaning circulation pipe 52 to circulation of the processing liquid via the internal circulation pipe 3 or the external circulation pipe 22 can be shortened. More specifically, in a configuration in which a liquid other than the processing liquid is used as the cleaning liquid, a liquid other than the processing liquid used for substrate processing is passed through the filter 35 during the filter cleaning process. As a result, the liquid other than the processing liquid used for substrate processing adheres to the filter 35. Therefore, before switching to circulation of the processing liquid via the internal circulation pipe 3 or the external circulation pipe 22, it is necessary to perform a process to remove the liquid adhering to the filter 35 during the filter cleaning process. In contrast, according to this embodiment, because the processing liquid is used as the cleaning liquid, it is not necessary to perform a process to remove the liquid adhering to the filter 35 during the filter cleaning process.

[0080] The first temperature control mechanism 5A included in the substrate processing apparatus 100 of this embodiment will be further described with reference to Fig. 3. As shown in Fig. 3, the cleaning circulation pipe 52 includes a first pipe 52a and a second pipe 52b. The first temperature control mechanism 5A further includes a cleaning circulation pump 53, a first on-off valve 55a, a second on-off valve 55b, a cleaning drainage mechanism 56, a cleaning replenishment mechanism 57, an upstream on-off valve 58, and a downstream on-off valve 59.

[0081] One end of the first pipe 52a is connected to the cleaning circulation tank 51. The other end of the first pipe 52a is connected to the internal circulation pipe 3 (upstream pipe 31) at a second connection position P2. The second connection position P2 is a position upstream of the filter 35. More specifically, the second connection position P2 is a position downstream of the internal circulation heater 34. In other words, the second connection position P2 is a position between the filter 35 and the internal circulation heater 34. In this embodiment, the cleaning circulation heater 54 is provided in the first pipe 52a.

[0082] One end of the second pipe 52b is connected to the cleaning circulation tank 51. The other end of the second pipe 52b is connected to the internal circulation pipe 3 (downstream pipe 32) at a third connection position P3. The third connection position P3 is a position downstream of the filter 35. More specifically, the third connection position P3 is a position upstream of the first connection position P1. In other words, the third connection position P3 is a position between the filter 35 and the first connection position P1.

[0083] The cleaning circulation pump 53 is provided in the cleaning circulation pipe 52. When the cleaning circulation pump 53 is driven, the processing liquid (cleaning liquid) in the cleaning circulation tank 51 is sent to the cleaning circulation pipe 52. That is, the cleaning circulation pump 53 sends the processing liquid (cleaning liquid) in the cleaning circulation tank 51 to the cleaning circulation pipe 52. As a result, the processing liquid (cleaning liquid) circulates through a part of the internal circulation pipe 3, the cleaning circulation pipe 52, the cleaning circulation tank 51, and the filter 35. More specifically, the cleaning circulation pump 53 is provided in the first pipe 52a. When the cleaning circulation pump 53 is driven, the processing liquid (cleaning liquid) in the cleaning circulation tank 51 is sent to the first pipe 52a. As a result, the processing liquid (cleaning liquid) flows from the upstream side (primary side) of the filter 35 to the downstream side (secondary side). That is, the cleaning circulation pump 53 sends the processing liquid (cleaning liquid) so that the processing liquid (cleaning liquid) flows from the upstream side (primary side) to the downstream side (secondary side) of the filter 35. The cleaning circulation pump 53 is controlled by the control device 101 (control unit 102).

[0084] The first on-off valve 55a, the second on-off valve 55b, the upstream on-off valve 58, and the downstream on-off valve 59 are openable and closable. The first on-off valve 55a is provided in the first pipe 52a. The second on-off valve 55b is provided in the second pipe 52b. The upstream on-off valve 58 is provided in the internal circulation pipe 3 (upstream pipe 31). Specifically, the upstream on-off valve 58 is provided upstream of the filter 35. Even more specifically, the upstream on-off valve 58 is provided upstream of the second connecting position P2. Specifically, the upstream on-off valve 58 is provided between the internal circulation heater 34 and the second connecting position P2. The downstream on-off valve 59 is provided in the internal circulation pipe 3 (downstream pipe 32). Specifically, the downstream on-off valve 59 is provided downstream of the filter 35. Even more specifically, the downstream on-off valve 59 is provided downstream of the third connecting position P3. Specifically, the downstream on-off valve 59 is provided between the first connecting position P1 and the third connecting position P3.

[0085] The opening and closing operations of the first on-off valve 55a, the second on-off valve 55b, the upstream on-off valve 58, and the downstream on-off valve 59 are controlled by the control device 101 (controller 102). During the filter temperature increase process, the control device 101 (controller 102) opens the first on-off valve 55a and the second on-off valve 55b and closes the upstream on-off valve 58 and the downstream on-off valve 59. As a result, the processing liquid (cleaning liquid) flows from the first pipe 52a to the internal circulation pipe 3 (upstream pipe 31) at the second connecting position P2. The processing liquid (cleaning liquid) then flows through the section of the internal circulation pipe 3 between the second connecting position P2 and the third connecting position P3 and flows into the second pipe 52b. As a result, the processing liquid (cleaning liquid) circulates. That is, the cleaning circulation process is performed. At this time, the processing liquid (cleaning liquid) heated by the cleaning circulation heater 54 is passed through the filter 35. That is, the filter temperature increase process is performed. In this way, the filter cleaning process includes a cleaning circulation process and a filter temperature increase process.

[0086] The cleaning liquid drainage mechanism 56 drains the processing liquid (cleaning liquid) from the cleaning circulation tank 51. Specifically, the cleaning liquid drainage mechanism 56 includes a first liquid drainage pipe 561 and a liquid drainage opening / closing valve 562.

[0087] The first drainage pipe 561 is a tubular member through which a processing liquid (cleaning liquid) flows. An upstream end of the first drainage pipe 561 is connected to the cleaning circulation tank 51. The processing liquid (cleaning liquid) stored in the cleaning circulation tank 51 flows into the first drainage pipe 561. The first drainage pipe 561 distributes the processing liquid (cleaning liquid) to, for example, a waste liquid facility in a factory where the substrate processing apparatus 100 is installed.

[0088] The drainage on-off valve 562 is provided on the first drainage pipe 561. The drainage on-off valve 562 can be opened and closed. When the drainage on-off valve 562 is opened, the processing liquid (cleaning liquid) is drained from the cleaning circulation tank 51. When the drainage on-off valve 562 is closed, the processing liquid (cleaning liquid) is stored in the cleaning circulation tank 51. The opening and closing operation of the drainage on-off valve 562 is controlled by the control device 101 (control unit 102).

[0089] The cleaning replenishment mechanism 57 supplies (replenishes) the processing liquid (cleaning liquid) to the cleaning circulation tank 51. Specifically, the cleaning replenishment mechanism 57 includes a replenishment pipe 571 and a replenishment on-off valve 572. Hereinafter, the replenishment pipe 571 may be referred to as a "second replenishment pipe 571" to distinguish it from the replenishment on-off valve 41. Similarly, the replenishment on-off valve 572 may be referred to as a "second replenishment on-off valve 572" to distinguish it from the replenishment on-off valve 42.

[0090] The second replenishment pipe 571 is a tubular member through which the processing liquid (cleaning liquid) flows. The downstream end of the second replenishment pipe 571 is connected to the cleaning circulation tank 51. The second replenishment pipe 571 flows the processing liquid (cleaning liquid) up to the cleaning circulation tank 51.

[0091] The second replenishment on-off valve 572 is provided on the second replenishment piping 571. The second replenishment on-off valve 572 can be opened and closed. When the second replenishment on-off valve 572 is opened, the processing liquid (cleaning liquid) is supplied to the cleaning circulation tank 51 via the second replenishment piping 571. When the second replenishment on-off valve 572 is closed, the supply (replenishment) of the processing liquid (cleaning liquid) to the cleaning circulation tank 51 is stopped. The opening and closing operation of the second replenishment on-off valve 572 is controlled by the control device 101 (control unit 102).

[0092] Next, the operation of the fluid cabinet 10A will be described with reference to Figures 3 to 8. In other words, the processing executed by the control device 101 (control unit 102) will be described with reference to Figures 3 to 8.

[0093] 3 shows an example of the fluid cabinet 10A when circulating the processing liquid through the internal circulation piping 3. As shown in FIG. 3, when circulating the processing liquid through the internal circulation piping 3, the control device 101 (control unit 102) opens the upstream on-off valve 58, the downstream on-off valve 59, and the internal circulation on-off valve 39, and closes the multiple external circulation on-off valves 24, the first on-off valve 55a, and the second on-off valve 55b. The control device 101 (control unit 102) also drives the internal circulation pump 33. As a result, the processing liquid in the processing liquid tank 2 circulates through the internal circulation piping 3.

[0094] Furthermore, the control device 101 (control unit 102) drives the internal circulation heater 34 when circulating the processing liquid through the internal circulation pipe 3. As a result, while the processing liquid is circulating through the internal circulation pipe 3, the internal circulation heater 34 heats the processing liquid at the first heating temperature, thereby raising the temperature of the processing liquid. Furthermore, as the heated processing liquid flows through the filter 35, the temperature of the filter 35 is raised. More specifically, the processing liquid is raised to a temperature equal to the first heating temperature. As a result, the filter 35 is also raised to a temperature equal to the first heating temperature.

[0095] In this way, the control device 101 (control unit 102) circulates the processing liquid through the internal circulation pipe 3 to adjust the temperature of the processing liquid. Hereinafter, the process of circulating the processing liquid through the internal circulation pipe 3 to adjust the temperature of the processing liquid may be referred to as a "temperature adjustment process." Furthermore, the temperature of the processing liquid after being heated by the temperature adjustment process may be referred to as a "first temperature." More specifically, the first temperature refers to the temperature of the processing liquid heated at a first heating temperature. The temperature of the filter 35 is raised to the first temperature by the temperature adjustment process.

[0096] FIG. 4 is a diagram illustrating an example of the fluid cabinet 10A when the treatment liquid is circulated through the external circulation pipe 22. As illustrated in FIG. 4, when the treatment liquid is circulated through the external circulation pipe 22, the control device 101 (control unit 102) opens the upstream on-off valve 58, the downstream on-off valve 59, and the external circulation on-off valves 24, and closes the internal circulation on-off valve 39, the first on-off valve 55a, and the second on-off valve 55b. The control device 101 (control unit 102) also drives the internal circulation pump 33 and the internal circulation heater 34. As a result, the treatment liquid in the treatment liquid tank 2 circulates through the external circulation pipe 22. By driving the internal circulation heater 34, the temperature of the treatment liquid is maintained at the elevated temperature (first temperature).

[0097] The circulation of the processing liquid through the external circulation pipe 22 is performed after the temperature adjustment process. Specifically, after the temperature of the processing liquid reaches the first temperature through the temperature adjustment process, the circulation of the processing liquid through the external circulation pipe 22 is performed. As a result, the temperature-adjusted processing liquid is supplied to the substrate W.

[0098] More specifically, after the temperature of the processing liquid reaches the first temperature by the temperature adjustment process, the control device 101 (control unit 102) switches the external circulation on-off valves 24 from a closed state to an open state and switches the internal circulation on-off valve 39 from an open state to a closed state. As a result, the processing liquid path switches from a path in which the processing liquid circulates via the internal circulation piping 3 to a path in which the processing liquid circulates via the external circulation piping 22.

[0099] 5 is a diagram showing an example of the fluid cabinet 10A during the filter temperature raising process. As shown in FIG. 5, when the filter temperature raising process is being performed, the control device 101 (control unit 102) closes the upstream on-off valve 58, the downstream on-off valve 59, the drain on-off valve 562, and the second replenishment on-off valve 572, and opens the first on-off valve 55a and the second on-off valve 55b. The control device 101 (control unit 102) also drives the cleaning circulation pump 53. As a result, the processing liquid (cleaning liquid) in the cleaning circulation tank 51 circulates through the cleaning circulation piping 52.

[0100] More specifically, when performing the filter temperature raising process, the control device 101 (controller 102) stops driving the internal circulation pump 33. Then, the control device 101 (controller 102) switches the upstream on-off valve 58 and the downstream on-off valve 59 from an open state to a closed state, and switches the first on-off valve 55a and the second on-off valve 55b from a closed state to an open state. Thereafter, the control device 101 (controller 102) drives the cleaning circulation pump 53. As a result, the path of the treatment liquid is switched from a path in which the treatment liquid circulates via the internal circulation piping 3 or the external circulation piping 22 to a path in which the treatment liquid circulates via the cleaning circulation piping 52.

[0101] The control device 101 (control unit 102) drives the cleaning circulation heater 54 during the filter temperature raising process. As a result, while the processing liquid (cleaning liquid) is circulating through the cleaning circulation pipe 52, the cleaning circulation heater 54 heats the processing liquid (cleaning liquid) at the second heating temperature, thereby raising the temperature of the processing liquid (cleaning liquid). Furthermore, the heated processing liquid (cleaning liquid) flows through the filter 35, thereby raising the temperature of the filter 35. More specifically, the processing liquid (cleaning liquid) is raised to a temperature equal to the second heating temperature. As a result, the filter 35 is also raised to a temperature equal to the second heating temperature. Hereinafter, the temperature of the processing liquid after being raised by the second heating temperature may be referred to as the "second temperature." The second temperature is a temperature higher than the first temperature.

[0102] In this way, the temperature of the filter 35 is raised to the second temperature by the filter temperature raising process. As already described, particles can be released from the filter 35 by passing the processing liquid (cleaning liquid) at the second temperature through the filter 35 and raising the temperature of the filter 35 from the first temperature to the second temperature. Therefore, the number of particles adhering to the filter 35 can be reduced by the filter temperature raising process.

[0103] The control device 101 (controller 102) stores the processing liquid (cleaning liquid) in the cleaning circulation tank 51 before performing the filter temperature raising process. For example, the control device 101 (controller 102) controls the cleaning replenishment mechanism 57 to supply the processing liquid (cleaning liquid) to the cleaning circulation tank 51 before performing the filter temperature raising process. Alternatively, the control device 101 (controller 102) may supply the processing liquid stored in the processing liquid tank 2 to the cleaning circulation tank 51. In this case, the control device 101 (controller 102) may open the upstream on-off valve 58 and the second on-off valve 55b and close the first on-off valve 55a and the downstream on-off valve 59 to drive the internal circulation pump 33. Furthermore, when supplying the processing liquid stored in the processing liquid tank 2 to the cleaning circulation tank 51, the control device 101 (controller 102) may drive the internal circulation heater 34. However, the control device 101 (control unit 102) does not have to drive the internal circulation heater 34.

[0104] FIG. 6 is a diagram showing an example of the fluid cabinet 10A during the drainage process. The drainage process refers to a process of draining the processing liquid (cleaning liquid) from the cleaning circulation tank 51. The control device 101 (control unit 102) controls the cleaning drainage mechanism 56 during the filter cleaning process to perform the drainage process. In this embodiment, the filter cleaning process includes the drainage process. The drainage process is performed after the filter temperature increase process.

[0105] Specifically, during the drainage process, the control device 101 (controller 102) switches the drainage on-off valve 562 from a closed state to an open state. As a result, the processing liquid (cleaning liquid) is drained from the cleaning circulation tank 51, and particles released from the filter 35 by the filter temperature increase process are discharged together with the processing liquid (cleaning liquid). Note that during the drainage process, the control device 101 (controller 102) stops driving the cleaning circulation pump 53. However, the control device 101 (controller 102) does not have to stop driving the cleaning circulation pump 53.

[0106] 7 is a diagram showing an example of the fluid cabinet 10A during a replenishment process. The replenishment process refers to a process of supplying (replenishing) a processing liquid (cleaning liquid) to the cleaning circulation tank 51. The control device 101 (control unit 102) controls the cleaning replenishment mechanism 57 during the filter cleaning process to perform the replenishment process. In this embodiment, the filter cleaning process includes the replenishment process.

[0107] The refilling process is performed after the draining process. For example, the refilling process is performed after the cleaning circulation tank 51 has been emptied by the draining process. Specifically, the control device 101 (control unit 102) switches the draining on-off valve 562 from an open state to a closed state, and switches the second refilling on-off valve 572 from a closed state to an open state. As a result, the processing liquid (cleaning liquid) is supplied to the cleaning circulation tank 51 via the second refilling pipe 571.

[0108] The control device 101 (control unit 102) executes the filter temperature increasing process again after replenishing the cleaning circulation tank 51 with the processing liquid (cleaning liquid) through the replenishing process, thereby increasing the number of particles released from the filter 35.

[0109] Specifically, the particle collection efficiency of the filter 35 depends on the temperature of the filter 35. In other words, the number of particles passing through the filter 35 depends on the temperature of the filter 35. Therefore, the number of particles passing through the filter 35 at the second temperature is approximately constant. Therefore, even if the execution time of the filter temperature increasing process is extended, the number of particles released from the filter 35 does not increase.

[0110] In contrast, in this embodiment, the control device 101 (controller 102) causes the first temperature control mechanism 5A to repeatedly execute the filter temperature raising process, the drainage process, and the supply process. That is, the control device 101 (controller 102) causes the first temperature control mechanism 5A to repeatedly execute the filter temperature raising process using a processing liquid (cleaning liquid) that is not contaminated with particles. As a result, particles are released from the filter 35 every time the filter temperature raising process is executed. Therefore, the number of particles released from the filter 35 can be increased.

[0111] FIG. 8 is a diagram showing an example of the fluid cabinet 10A during a filter temperature lowering process. The filter temperature lowering process refers to a process of lowering the temperature of the filter 35. More specifically, the filter temperature lowering process refers to a process of changing the temperature of the filter 35 from the second temperature to the first temperature. In other words, the filter temperature lowering process refers to a process of returning the temperature of the filter 35 from the second temperature to the first temperature. The control device 101 (control unit 102) controls the first temperature control mechanism 5A during the filter cleaning process to lower the temperature of the filter 35. In this embodiment, the filter cleaning process includes the filter temperature lowering process.

[0112] The filter temperature lowering process is performed at the end of the filter cleaning process. During the filter temperature lowering process, the control device 101 (controller 102) changes the heating temperature of the cleaning circulation heater 54 to a temperature lower than the second heating temperature. Specifically, the control device 101 (controller 102) adjusts the heating temperature of the cleaning circulation heater 54 to a temperature substantially equal to the temperature of the processing liquid during substrate processing. In other words, the control device 101 (controller 102) adjusts the heating temperature of the cleaning circulation heater 54 to a temperature equal to the heating temperature (first heating temperature) of the internal circulation heater 34. As a result, the processing liquid (cleaning liquid) is heated to the first heating temperature.

[0113] During the filter temperature lowering process, similarly to the filter temperature raising process, the control device 101 (controller 102) closes the upstream on-off valve 58, the downstream on-off valve 59, the drain on-off valve 562, and the second replenishment on-off valve 572 and opens the first on-off valve 55a and the second on-off valve 55b. The control device 101 (controller 102) also drives the cleaning circulation pump 53. As a result, the processing liquid (cleaning liquid) in the cleaning circulation tank 51 circulates through the cleaning circulation piping 52. While the processing liquid (cleaning liquid) is circulating through the cleaning circulation piping 52, the temperature of the processing liquid (cleaning liquid) becomes substantially equal to the temperature (first temperature) of the processing liquid during substrate processing. As a result, the temperature of the filter 35 becomes substantially equal to the temperature (first temperature) of the processing liquid during substrate processing.

[0114] After the filter temperature lowering process, the control device 101 (control unit 102) switches the path of the processing liquid from a path in which the processing liquid circulates via the cleaning circulation piping 52 to a path in which the processing liquid circulates via the internal circulation piping 3 described with reference to Figure 3, or a path in which the processing liquid circulates via the external circulation piping 22 described with reference to Figure 4.

[0115] According to this embodiment, a filter temperature-lowering process can be performed at the end of the filter cleaning process to lower the temperature of the filter 35. When the temperature of the filter 35 drops, the filter 35's collection efficiency increases, and particles contained in the processing liquid (cleaning liquid) are captured by the filter 35, thereby increasing the cleanliness of the processing liquid (cleaning liquid). As a result, the processing liquid path can be switched from a path in which the processing liquid circulates via the cleaning circulation pipe 52 to a path in which the processing liquid circulates via the internal circulation pipe 3 or the external circulation pipe 22, while increasing the cleanliness of the portion of the internal circulation pipe 3 (the section between the second connection position P2 and the third connection position P3) used in the filter cleaning process. Therefore, after the filter cleaning process, the processing liquid tank 2, the internal circulation pipe 3, the inlet pipe 21, the multiple external circulation pipes 22, the outlet pipe 23, the multiple supply pipes 25 (see FIG. 2), and the multiple nozzles 27 (see FIG. 2) are less likely to be contaminated.

[0116] Next, the operation of the substrate processing apparatus 100 of this embodiment will be described with reference to Figs. 1 to 10. Figs. 9 and 10 are flowcharts showing an example of the operation of the substrate processing apparatus 100 of this embodiment. In detail, Figs. 9 and 10 show an example of the flow of processes executed by the control device 101 (control unit 102). More specifically, Figs. 9 and 10 show an example of a filter cleaning process. The filter cleaning process shown in Figs. 9 and 10 includes steps S1 to S11.

[0117] 9, the control device 101 (control unit 102) determines whether the number of particles contained in the processing liquid is equal to or less than a first threshold value (step S1). This determination process is performed while the processing liquid is circulating through the internal circulation pipe 3 or the external circulation pipe 22. The first threshold value is stored in advance in the storage unit 103.

[0118] Specifically, as described with reference to Figure 3, the control device 101 (control unit 102) obtains the number of particles contained in the processing liquid based on the detection result of the detection unit 36, and determines whether the number of particles contained in the processing liquid is equal to or less than a first threshold value.

[0119] When the control device 101 (controller 102) determines that the number of particles contained in the processing liquid is equal to or less than the first threshold value (Yes in step S1), the control device 101 (controller 102) repeats the processing in step S1.

[0120] When the control device 101 (controller 102) determines that the number of particles contained in the processing liquid is not equal to or less than the first threshold value (No in step S1), the control device 101 (controller 102) executes a first switching process (step S2). The first switching process is a process of switching the processing liquid path from a path in which the processing liquid circulates via the internal circulation pipe 3 or the external circulation pipe 22 to a path in which the processing liquid circulates via the cleaning circulation pipe 52.

[0121] Execution of the first switching process causes the filter temperature increasing process to be executed (step S3), as described with reference to Fig. 5. In this way, the control device 101 (control unit 102) causes the first temperature control mechanism 5A to execute the filter temperature increasing process in response to the number of particles detected by the detection unit 36 ​​becoming larger than the first threshold value.

[0122] The control device 101 (control unit 102) stops the filter temperature increasing process by the first temperature control mechanism 5A based on a predetermined condition. In this embodiment, the control device 101 (control unit 102) determines whether the number of particles detected by the detection unit 36 ​​has reached saturation (step S4) while causing the first temperature control mechanism 5A to perform the filter temperature increasing process. As already described, the number of particles passing through the filter 35 depends on the temperature of the filter 35, and therefore, after the temperature of the filter 35 reaches the second temperature, the number of particles detected by the detection unit 36 ​​reaches saturation. Therefore, the control device 101 (control unit 102) can determine whether the number of particles has reached saturation based on the detection result of the detection unit 36.

[0123] If the control device 101 (control unit 102) determines that the number of particles detected by the detection unit 36 ​​is not saturated (No in step S4), the control device 101 repeats the processes of steps S3 and S4.

[0124] When the control device 101 (control unit 102) determines that the number of particles detected by the detection unit 36 ​​has reached saturation (Yes in step S4), the control device 101 determines whether the first elapsed time has reached a first predetermined time (step S5). Here, the first elapsed time indicates the time that has elapsed since it was determined that the number of particles detected by the detection unit 36 ​​has reached saturation.

[0125] If the control device 101 (control unit 102) determines that the first elapsed time has not reached the first predetermined time (No in step S5), the control device 101 (control unit 102) repeats the process of step S5. Note that the first predetermined time is stored in the storage unit 103 in advance.

[0126] When the control device 101 (controller 102) determines that the first elapsed time has reached the first predetermined time (Yes in step S5), it stops the filter temperature increasing process by the first temperature control mechanism 5A, as shown in Fig. 10, and executes the drainage process described with reference to Fig. 6 (step S6). In this way, the control device 101 (controller 102) stops the filter temperature increasing process by the first temperature control mechanism 5A after the number of particles detected by the detection unit 36 ​​becomes saturated.

[0127] After the drainage process, the control device 101 (controller 102) executes the refilling process described with reference to Fig. 7 (step S7). Then, after the refilling process, the control device 101 (controller 102) determines whether the number of times the filter temperature increase process has been repeated reaches a predetermined number (N times) (step S8). The predetermined number (N times) is stored in advance in the storage unit 103. The predetermined number (N times) indicates an integer equal to or greater than 1.

[0128] If the control device 101 (control unit 102) determines that the number of times the filter temperature increase process has been repeated has not reached the predetermined number of times (N times) (No in step S8), the control device 101 returns to step S3 shown in FIG. 9 and causes the first temperature control mechanism 5A to perform the filter temperature increase process again.

[0129] When the control device 101 (controller 102) determines that the number of times the filter temperature increasing process has been repeated reaches a predetermined number (N times) (Yes in step S8), it executes the filter temperature decreasing process described with reference to Fig. 8 (step S9). That is, after the number of times the filter temperature increasing process has been repeated reaches the predetermined number (N times), the control device 101 (controller 102) stops the process of increasing the temperature of the treatment liquid (cleaning liquid) (filter temperature increasing process) and decreases the temperature of the treatment liquid (cleaning liquid).

[0130] After performing the filter temperature lowering process, the control device 101 (control unit 102) determines whether the number of particles detected by the detection unit 36 ​​is equal to or less than a second threshold value (step S10). The second threshold value is pre-stored in the storage unit 103. The second threshold value may be the same value as the first threshold value.

[0131] If the control device 101 (control unit 102) determines that the number of particles detected by the detection unit 36 ​​is not equal to or less than the second threshold value (No in step S10), the control device 101 returns to step S3 shown in FIG. 9 and causes the first temperature control mechanism 5A to perform the filter temperature increase process again.

[0132] When the control device 101 (control unit 102) determines that the number of particles detected by the detection unit 36 ​​is equal to or less than the second threshold value (Yes in step S10), the control device 101 (control unit 102) executes a second switching process. As a result, the processes shown in Figures 9 and 10 end. Here, the second switching process refers to a process of switching the path of the processing liquid from a path in which the processing liquid circulates via the cleaning circulation pipe 52 to a path in which the processing liquid circulates via the internal circulation pipe 3 or the external circulation pipe 22.

[0133] 9 and 10, the process of step S5 may be omitted. That is, the liquid drainage process (step S6) may be performed when the number of particles detected by the detection unit 36 ​​reaches saturation.

[0134] Next, another example of the operation of the substrate processing apparatus 100 of this embodiment will be described with reference to Fig. 1 to Fig. 11. Fig. 11 is a flowchart showing another example of the operation of the substrate processing apparatus 100 of this embodiment. In detail, Fig. 11 shows another example of the flow of the process executed by the control device 101 (controller 102). More specifically, Fig. 11 shows another example of the filter cleaning process. The filter cleaning process shown in Fig. 11 includes steps S21 to S29.

[0135] The processing of steps S21 to S23 is the same as steps S1 to S3 shown in Fig. 9, and therefore a description thereof will be omitted. In the filter cleaning processing shown in Fig. 11, after the control device 101 (control unit 102) causes the first temperature control mechanism 5A to start the filter temperature raising processing, it determines whether the second elapsed time has reached a second predetermined time (step S24). Here, the second elapsed time indicates the time that has elapsed since the filter temperature raising processing started.

[0136] If the control device 101 (control unit 102) determines that the second elapsed time has not reached the second predetermined time (No in step S24), the control device 101 (control unit 102) repeats the process of step S24. Note that the second predetermined time is stored in the storage unit 103 in advance.

[0137] When the control device 101 (controller 102) determines that the second elapsed time has reached the second predetermined time (Yes in step S24), it stops the filter temperature raising process by the first temperature control mechanism 5A and executes the drainage process described with reference to Fig. 6 (step S25). In this way, the control device 101 (controller 102) may stop the filter temperature raising process by the first temperature control mechanism 5A after the predetermined time has elapsed since the start of the filter temperature raising process.

[0138] The processing of steps S25 to S28 is similar to steps S6 to S9 shown in Fig. 10, and therefore a description thereof will be omitted. In the processing shown in Fig. 11, the control device 101 (control unit 102) executes a filter temperature lowering processing (step S28) and then executes a second switching processing (step S29). The second switching processing is similar to step S11 shown in Fig. 10. In this way, the processing of step S10 shown in Fig. 10 may be omitted.

[0139] Next, another example of the substrate processing apparatus 100 of this embodiment will be described with reference to Fig. 12. Fig. 12 is a diagram showing another example of the configuration of the fluid cabinet 10A included in the substrate processing apparatus 100 of this embodiment. In detail, Fig. 12 shows another example of the first temperature control mechanism 5A. Fig. 12 also shows another example of the fluid cabinet 10A during a filter temperature increase process.

[0140] 12, the substrate processing apparatus 100 may further include a vibrator 7. The vibrator 7 is included in a fluid cabinet 10A. The vibrator 7 is controlled by a control device 101 (controller 102) to vibrate the filter 35. The vibrator 7 may be, for example, an ultrasonic vibrator.

[0141] More specifically, the control device 101 (control unit 102) drives the vibrator 7 when the filter temperature increasing process is executed. As a result, the vibrator 7 vibrates the filter 35 when the filter temperature increasing process is executed.

[0142] 12, the filter 35 is vibrated, which makes it easier for particles adhering to the filter 35 to be released from the filter 35. Therefore, by vibrating the filter 35 when the filter temperature increasing process is performed, the particles can be released from the filter 35 more efficiently.

[0143] 1 to 12, the first embodiment of the present invention has been described. According to the first embodiment, the filter 35 can be cleaned by increasing the temperature of the filter 35. Therefore, the filter 35 can be cleaned with a simpler configuration than a configuration in which the filter 35 is cleaned by alternately repeating cooling and heating of the filter 35.

[0144] Furthermore, according to the first embodiment, the cleaning circulation tank 51 is used for the filter cleaning process. As already explained, the capacity of the cleaning circulation tank 51 is smaller than that of the processing liquid tank 2. Therefore, compared to a configuration in which the filter 35 is cleaned using the internal circulation piping 3, the processing liquid tank 2, and the internal circulation heater 34, the amount of processing liquid used for the filter cleaning process can be reduced.

[0145] During the filter temperature increasing process, the control device 101 (controller 102) may hold the processing liquid (cleaning liquid) heated to the second temperature in the filter 35, thereby increasing the temperature of the filter 35. Specifically, while the processing liquid (cleaning liquid) heated to the second temperature is circulated through the cleaning circulation pipe 52, the control device 101 (controller 102) can hold the processing liquid (cleaning liquid) heated to the second temperature in the filter 35 by switching the first on-off valve 55a and the second on-off valve 55b from the open state to the closed state.

[0146] Similarly, the control device 101 (controller 102) may lower the temperature of the filter 35 by causing the filter 35 to retain the processing liquid (cleaning liquid) whose temperature has been lowered to the first temperature during the filter temperature lowering process.

[0147] Furthermore, in this embodiment, the cleaning liquid is the processing liquid, but the cleaning liquid may be a liquid different from the processing liquid.

[0148] Furthermore, although the substrate processing apparatus 100 includes the internal circulation heater 34 in this embodiment, the internal circulation heater 34 may be omitted. In this case, the temperature of the processing liquid circulating through the internal circulation piping 3 becomes approximately equal to room temperature. Therefore, the second heating temperature (second temperature) may be any temperature higher than room temperature. For example, when the temperature of the processing liquid during substrate processing is approximately equal to room temperature, the cleaning circulation heater 54 may set the temperature of the cleaning liquid to 40°C. Furthermore, the driving of the cleaning circulation heater 54 may be stopped during the filter temperature lowering process.

[0149] In addition, in the present embodiment, the first on-off valve 55a and the upstream on-off valve 58 switch the flow destination of the treatment liquid at the second connection position P2, but a three-way valve may be used instead of the first on-off valve 55a and the upstream on-off valve 58. Similarly, in the present embodiment, the second on-off valve 55b and the downstream on-off valve 59 switch the flow destination of the treatment liquid at the third connection position P3, but a three-way valve may be used instead of the second on-off valve 55b and the downstream on-off valve 59.

[0150] [Embodiment 2] Next, a second embodiment of the present invention will be described with reference to Fig. 13. However, differences from the first embodiment will be described, and a description of the same aspects as in the first embodiment will be omitted. The second embodiment differs from the first embodiment in the direction in which the processing liquid (cleaning liquid) flows during the filter cleaning process.

[0151] Fig. 13 is a diagram showing the configuration of a fluid cabinet 10A included in the substrate processing apparatus 100 of this embodiment. In detail, Fig. 13 shows an example of the fluid cabinet 10A during a filter temperature increasing process.

[0152] As shown in FIG. 13, in the substrate processing apparatus 100 of this embodiment, the first temperature control mechanism 5A includes a cleaning circulation tank 51, a cleaning circulation piping 52 (first piping 52a and second piping 52b), a cleaning circulation pump 53a, a cleaning circulation heater 54, a first on-off valve 55a, a second on-off valve 55b, a cleaning drainage mechanism 56, a cleaning replenishment mechanism 57, an upstream on-off valve 58, and a downstream on-off valve 59.

[0153] The cleaning circulation pump 53a is controlled by the control device 101 (control unit 102). The cleaning circulation pump 53a circulates the processing liquid (cleaning liquid) through a part of the internal circulation piping 3, the cleaning circulation piping 52, the cleaning circulation tank 51, and the filter 35. More specifically, when the cleaning circulation pump 53a is driven, the processing liquid (cleaning liquid) in the cleaning circulation tank 51 is sent to the second piping 52b. As a result, the processing liquid (cleaning liquid) flows from the downstream side (secondary side) of the filter 35 to the upstream side (primary side). In other words, the cleaning circulation pump 53a sends the processing liquid (cleaning liquid) so that the processing liquid (cleaning liquid) flows from the downstream side (secondary side) of the filter 35 to the upstream side (primary side).

[0154] The second embodiment of the present invention has been described above with reference to Fig. 13. According to the second embodiment, the filter 35 can be cleaned with a simpler configuration than the configuration in which the filter 35 is cleaned by alternately repeating cooling and heating of the filter 35, as in the first embodiment.

[0155] Furthermore, according to the second embodiment, during the filter cleaning process, the processing liquid (cleaning liquid) can be made to flow from the downstream side (secondary side) of the filter 35 toward the upstream side (primary side). Since particles flowing from the upstream side (primary side) toward the downstream side (secondary side) of the filter 35 during substrate processing adhere to the filter 35, flowing the processing liquid (cleaning liquid) in the opposite direction to that during substrate processing makes it easier for the particles adhering to the filter 35 to be released from the filter 35. Therefore, the particles can be released from the filter 35 more efficiently.

[0156] 12, the substrate processing apparatus 100 may further include a vibrator 7. By vibrating the filter 35 during the filter temperature increase process, particles can be released from the filter 35 more efficiently.

[0157] [Embodiment 3] Next, a third embodiment of the present invention will be described with reference to Figures 14 to 16. However, differences from the first and second embodiments will be described, and a description of the same aspects as the first and second embodiments will be omitted. The third embodiment differs from the first embodiment in the direction in which the processing liquid (cleaning liquid) flows during the filter cleaning process. The third embodiment also differs from the first and second embodiments in that the first temperature control mechanism 5A further includes a third on-off valve 55c.

[0158] 14 is a diagram showing the configuration of a fluid cabinet 10A included in the substrate processing apparatus 100 of this embodiment. As shown in Fig. 14, in the substrate processing apparatus 100 of this embodiment, the first temperature control mechanism 5A includes a cleaning circulation tank 51, a cleaning circulation pipe 52 (a first pipe 52a and a second pipe 52b), a cleaning circulation pump 53a, a cleaning circulation heater 54, a first on-off valve 55a, a second on-off valve 55b, a third on-off valve 55c, a cleaning drainage mechanism 56, a cleaning replenishment mechanism 57, an upstream on-off valve 58, and a downstream on-off valve 59.

[0159] The third on-off valve 55c can be opened and closed. The third on-off valve 55c is provided on the upstream side (primary side) of the filter 35. In this embodiment, the third on-off valve 55c is provided in the internal circulation piping 3 (upstream piping 31). More specifically, the third on-off valve 55c is provided between the filter 35 and the second connection position P2. The third on-off valve 55c controls the flow and stop of the processing liquid (cleaning liquid). More specifically, when the third on-off valve 55c is opened, the processing liquid (cleaning liquid) is passed through the filter 35. When the third on-off valve 55c is closed, the flow of the processing liquid (cleaning liquid) through the filter 35 is stopped.

[0160] The third on-off valve 55c is controlled by the control device 101 (control section 102). The control device 101 (control section 102) opens and closes the third on-off valve 55c to vibrate the filter 35 during the filter temperature increase process.

[0161] 13, the cleaning circulation pump 53a sends the processing liquid (cleaning liquid) so that the processing liquid (cleaning liquid) flows from the downstream side (secondary side) to the upstream side (primary side) of the filter 35. The control device 101 (control unit 102) opens and closes the third on-off valve 55c while driving the cleaning circulation pump 53a. As a result, when the third on-off valve 55c transitions from a closed state to an open state, the flow rate of the processing liquid (cleaning liquid) in the filter 35 changes suddenly, causing the filter 35 to vibrate.

[0162] Next, the operation of the fluid cabinet 10A will be described with reference to Figures 14 to 16. In other words, the processing executed by the control device 101 (control unit 102) will be described with reference to Figures 14 to 16.

[0163] Fig. 14 shows an example of a first state of the fluid cabinet 10A during the filter temperature increase process, and Fig. 15 shows an example of a second state of the fluid cabinet 10A during the filter temperature increase process.

[0164] As shown in Fig. 14, when the third on-off valve 55c is closed, the processing liquid (cleaning liquid) flows from the third on-off valve 55c to the first pipe 52a, and the flow of the processing liquid (cleaning liquid) from the second pipe 52b to the third on-off valve 55c is stopped. On the other hand, as shown in Fig. 15, when the third on-off valve 55c is opened, the processing liquid (cleaning liquid) flows from the second pipe 52b to the first pipe 52a. Therefore, when the third on-off valve 55c transitions from the closed state to the open state, the flow rate of the processing liquid (cleaning liquid) in the filter 35 changes suddenly. As a result, the pressure in the housing of the filter 35 changes suddenly, causing the filter 35 to vibrate.

[0165] During the filter temperature raising process, the control device 101 (control unit 102) vibrates the filter 35 by repeatedly opening and closing the third on-off valve 55c while driving the cleaning circulation pump 53a.

[0166] 16 is a diagram showing an example of the fluid cabinet 10A during the filter temperature lowering process. As shown in FIG. 16, the control device 101 (control unit 102) maintains the third on-off valve 55c in an open state during the filter temperature lowering process.

[0167] The third embodiment of the present invention has been described above with reference to Figures 14 to 16. According to the third embodiment, similar to the first and second embodiments, filter 35 can be cleaned with a simpler configuration than the configuration in which filter 35 is cleaned by alternately repeating cooling and heating of filter 35.

[0168] Furthermore, according to the third embodiment, similarly to the second embodiment, during the filter cleaning process, the processing liquid (cleaning liquid) can be made to flow from the downstream side (secondary side) of the filter 35 to the upstream side (primary side). Therefore, particles can be more efficiently released from the filter 35.

[0169] Furthermore, according to the third embodiment, by vibrating the filter 35 when the filter temperature increasing process is performed, particles can be released from the filter 35 more efficiently.

[0170] As described with reference to FIG. 12, the substrate processing apparatus 100 may further include a vibrator 7.

[0171] In this embodiment, the first temperature control mechanism 5A includes the first on-off valve 55a and the third on-off valve 55c, but the first temperature control mechanism 5A may include only the first on-off valve 55a out of the first on-off valve 55a and the third on-off valve 55c. In this case, the control device 101 (control unit 102) opens and closes the first on-off valve 55a in the same way as the third on-off valve 55c when the filter temperature increase process is performed.

[0172] [Embodiment 4] Next, a fourth embodiment of the present invention will be described with reference to Fig. 17. However, differences from the first to third embodiments will be described, and a description of the same aspects as the first to third embodiments will be omitted. Unlike the first to third embodiments, the fourth embodiment uses a heated gas as the heating fluid.

[0173] Fig. 17 is a diagram showing the configuration of a fluid cabinet 10A included in the substrate processing apparatus 100 of this embodiment. As shown in Fig. 17, the substrate processing apparatus 100 of this embodiment includes a second temperature control mechanism 5B.

[0174] The second temperature control mechanism 5B executes a filter temperature increasing process and a filter temperature decreasing process. That is, during the filter temperature increasing process, the second temperature control mechanism 5B increases the temperature of the filter 35 from a first temperature to a second temperature. During the filter temperature decreasing process, the second temperature control mechanism 5B decreases the temperature of the filter 35 from the second temperature to the first temperature.

[0175] In this embodiment, the second temperature control mechanism 5B flows a heated fluid through the filter 35 to raise the temperature of the filter 35. More specifically, the second temperature control mechanism 5B flows a heated gas through the filter 35 to raise the temperature of the filter 35. The heated gas refers to a gas that has been heated. The heated gas is an example of a "heated fluid." The type of gas to be heated is not particularly limited. For example, the gas to be heated may be an inert gas. The inert gas to be heated may be, for example, nitrogen gas.

[0176] More specifically, the second temperature control mechanism 5B includes a gas supply pipe 521, an exhaust pipe 522, a third on-off valve 523, a fourth on-off valve 524, a fluid heater 525, an upstream on-off valve 58, and a downstream on-off valve 59. The second temperature control mechanism 5B causes gas heated by the fluid heater 525 to flow through the filter 35, thereby raising the temperature of the filter 35.

[0177] Specifically, the gas supply pipe 521 and the exhaust pipe 522 are tubular members through which gas flows. The gas supply pipe 521 is connected to the internal circulation pipe 3 on the upstream side of the filter 35. The exhaust pipe 522 is connected to the internal circulation pipe 3 on the downstream side of the filter 35. Specifically, the downstream end of the gas supply pipe 521 is connected to the internal circulation pipe 3 (upstream pipe 31) at a second connecting position P2. The upstream end of the exhaust pipe 522 is connected to the internal circulation pipe 3 (downstream pipe 32) at a third connecting position P3.

[0178] The third on-off valve 523 and the fourth on-off valve 524 can be opened and closed. The third on-off valve 523 is provided in the gas supply pipe 521. The fourth on-off valve 524 is provided in the exhaust pipe 522. The opening and closing operations of the third on-off valve 523 and the fourth on-off valve 524 are controlled by the control device 101 (control unit 102).

[0179] Gas is supplied to the gas supply pipe 521. The fluid heater 525 is provided in the gas supply pipe 521 and heats the gas flowing through the gas supply pipe 521. As a result, heated gas is generated. More specifically, the fluid heater 525 heats the gas to a second heating temperature during the filter temperature increase process, similar to the cleaning circulation heater 54 described with reference to FIG. 3. Furthermore, the fluid heater 525 heats the gas to a first heating temperature during the filter temperature decrease process, similar to the cleaning circulation heater 54 described with reference to FIG. 3.

[0180] During the filter temperature increase process, the control device 101 (control unit 102) opens the third on-off valve 523 and the fourth on-off valve 524 and closes the upstream on-off valve 58 and the downstream on-off valve 59. As a result, heated gas is supplied from the upstream side of the filter 35 to the internal circulation pipe 3. More specifically, the gas supply pipe 521 circulates heated gas up to the second connection position P2. The fluid heater 525 is an example of a "heating unit."

[0181] The heated gas that flows from the gas supply pipe 521 into the internal circulation pipe 3 at the second connection position P2 flows through the section of the internal circulation pipe 3 between the second connection position P2 and the third connection position P3, and then flows into the exhaust pipe 522. At this time, the heated gas also flows through the filter 35. That is, a filter temperature increase process is performed. In this manner, the second temperature control mechanism 5B causes the gas heated by the fluid heater 525 to flow through the filter 35, thereby increasing the temperature of the filter 35. The exhaust pipe 522 distributes the heated gas, for example, to an exhaust facility in a factory where the substrate processing apparatus 100 is installed.

[0182] During the filter temperature lowering process, the control device 101 (control unit 102) changes the temperature of the fluid heater 525 from the second heating temperature to the first heating temperature, so that the temperature of the filter 35 becomes substantially equal to the temperature of the processing liquid during substrate processing.

[0183] According to this embodiment, the second temperature control mechanism 5B causes a heated gas (heated fluid) to flow through the filter 35, thereby increasing the temperature of the filter 35. As a result, particles adhering to the filter 35 are easily released from the filter 35. Furthermore, since the heated gas (heated fluid) is caused to flow through the filter 35, the particles can be released from the filter 35.

[0184] Furthermore, according to this embodiment, a filter temperature-lowering process can be performed at the end of the filter cleaning process to lower the temperature of the filter 35. As a result, the cleanliness of a portion of the internal circulation piping 3 used in the filter cleaning process (the section between the second connection position P2 and the third connection position P3) can be improved. Therefore, after the filter cleaning process, the processing liquid tank 2, the internal circulation piping 3, the inlet piping 21, the plurality of external circulation piping 22, the outlet piping 23, the plurality of supply piping 25 (see FIG. 2), and the plurality of nozzles 27 (see FIG. 2) are less likely to be contaminated.

[0185] The fourth embodiment of this embodiment has been described above with reference to Fig. 17. According to the fourth embodiment, the filter 35 can be cleaned by increasing the temperature of the filter 35. Therefore, the filter 35 can be cleaned with a simpler configuration than a configuration in which the filter 35 is cleaned by alternately repeating cooling and heating of the filter 35. Furthermore, according to the fourth embodiment, the temperature of the filter 35 is increased using heated gas, which reduces the amount of resources used in the filter cleaning process.

[0186] The substrate processing apparatus 100 may further include the vibrator 7 described with reference to FIG.

[0187] Furthermore, during the filter temperature increasing process, the control device 101 (control unit 102) may hold the heated gas in the filter 35 to increase the temperature of the filter 35. Specifically, while the heated gas is circulating, the third on-off valve 523 and the fourth on-off valve 524 are switched from the open state to the closed state, thereby allowing the heated gas to be held in the filter 35.

[0188] Furthermore, in this embodiment, the heating fluid is a heating gas, but the heating fluid may be steam.

[0189] In addition, although the substrate processing apparatus 100 includes the internal circulation heater 34 in this embodiment, the internal circulation heater 34 may be omitted. In this case, the second heating temperature (second temperature) may be any temperature higher than room temperature. When the temperature of the processing liquid during substrate processing is room temperature, the control device 101 (control unit 102) may stop driving the fluid heater 525 during the filter temperature lowering process.

[0190] [Embodiment 5] Next, a fifth embodiment of the present invention will be described with reference to Figures 18 to 25. However, differences from the first to fourth embodiments will be described, and a description of the same aspects as the first to fourth embodiments will be omitted. Unlike the first to fourth embodiments, the fifth embodiment does not circulate the heated treatment liquid during the filter temperature increasing process and the filter temperature decreasing process.

[0191] Fig. 18 is a diagram showing the configuration of a fluid cabinet 10A included in the substrate processing apparatus 100 of this embodiment. As shown in Fig. 18, the substrate processing apparatus 100 of this embodiment includes a third temperature control mechanism 5C.

[0192] The third temperature control mechanism 5C executes a filter temperature increasing process and a filter temperature decreasing process. That is, during the filter temperature increasing process, the third temperature control mechanism 5C increases the temperature of the filter 35 from a first temperature to a second temperature. During the filter temperature decreasing process, the third temperature control mechanism 5C decreases the temperature of the filter 35 from the second temperature to the first temperature.

[0193] In this embodiment, the third temperature control mechanism 5C raises the temperature of the filter 35 by flowing a heated fluid through the filter 35. More specifically, the third temperature control mechanism 5C includes an internal circulation heater 341, a bypass pipe 531, a second drainage pipe 532, a fifth on-off valve 533, a sixth on-off valve 534, an upstream on-off valve 58, and a downstream on-off valve 59. The internal circulation heater 341 is provided in the internal circulation pipe 3 (upstream pipe 31) similarly to the internal circulation heater 34 described with reference to FIG. 3. The internal circulation heater 341 heats the treatment liquid to a first heating temperature when the treatment liquid is circulated through the internal circulation pipe 3 or the external circulation pipe 22 similarly to the internal circulation heater 34 described with reference to FIG. 3.

[0194] The control device 101 (control unit 102) changes the heating temperature of the internal circulation heater 341 from the first heating temperature to the second heating temperature during the filter temperature increase process. Also, the control device 101 (control unit 102) returns the heating temperature of the internal circulation heater 341 from the second heating temperature to the first heating temperature during the filter temperature decrease process. In this embodiment, the internal circulation heater 341 is an example of a "heating unit."

[0195] The bypass pipe 531 is a tubular member through which the processing liquid flows. The bypass pipe 531 is connected to the internal circulation pipe 3 between the internal circulation heater 341 and the filter 35, and returns the processing liquid flowing in from the internal circulation pipe 3 to the processing liquid tank 2. In other words, the bypass pipe 531 allows the processing liquid flowing in from the internal circulation pipe 3 to flow to the processing liquid tank 2. More specifically, the downstream end of the bypass pipe 531 is connected to the internal circulation pipe 3 (upstream pipe 31) at a second connection position P2.

[0196] The second drainage pipe 532 is a tubular member through which the processing liquid flows. The second drainage pipe 532 is connected to the internal circulation pipe 3 downstream of the filter 35, and drains the processing liquid flowing in from the internal circulation pipe 3. Specifically, the upstream end of the second drainage pipe 532 is connected to the internal circulation pipe 3 (downstream pipe 32) at a third connection position P3. The second drainage pipe 532 flows the processing liquid, for example, to a waste liquid facility in a factory where the substrate processing apparatus 100 is installed.

[0197] The fifth on-off valve 533 is provided in the bypass piping 531 and controls the start and stop of the flow of the processing liquid through the bypass piping 531. Specifically, the fifth on-off valve 533 can be opened and closed. The opening and closing operation of the fifth on-off valve 533 is controlled by the control device 101 (control unit 102). When the fifth on-off valve 533 is opened, the processing liquid flows from the internal circulation piping 3 into the bypass piping 531. When the fifth on-off valve 533 is closed, the flow of the processing liquid from the internal circulation piping 3 into the bypass piping 531 stops.

[0198] Specifically, the control device 101 (controller 102) opens the upstream on-off valve 58 and closes the fifth on-off valve 533 when passing the processing liquid that has flowed from the processing liquid tank 2 into the internal circulation piping 3 through the filter 35. The control device 101 (controller 102) closes the upstream on-off valve 58 and opens the fifth on-off valve 533 when passing the processing liquid that has flowed from the processing liquid tank 2 into the internal circulation piping 3 into the bypass piping 531. In this way, the upstream on-off valve 58 and the fifth on-off valve 533 switch the destination of the processing liquid stored in the processing liquid tank 2 between the filter 35 and the bypass piping 531. The upstream on-off valve 58 and the fifth on-off valve 533 are examples of a "first switching valve."

[0199] The sixth on-off valve 534 is provided in the second drainage pipe 532 and controls the start and stop of the flow of the processing liquid through the second drainage pipe 532. More specifically, the sixth on-off valve 534 can be opened and closed. The opening and closing operation of the sixth on-off valve 534 is controlled by the control device 101 (control unit 102). When the sixth on-off valve 534 is opened, the processing liquid flows from the internal circulation pipe 3 into the second drainage pipe 532. When the sixth on-off valve 534 is closed, the flow of the processing liquid from the internal circulation pipe 3 into the second drainage pipe 532 stops.

[0200] Specifically, the control device 101 (controller 102) opens the downstream on-off valve 59 and closes the sixth on-off valve 534 when circulating the treatment liquid that has passed through the filter 35 to the treatment liquid tank 2 or the external circulation piping 22. The control device 101 (controller 102) closes the downstream on-off valve 59 and opens the sixth on-off valve 534 when circulating the treatment liquid that has passed through the filter 35 to the second drainage piping 532. In this way, the downstream on-off valve 59 and the sixth on-off valve 534 switch the destination of the treatment liquid that has passed through the filter 35 between the second drainage piping 532 and the treatment liquid tank 2 or the external circulation piping 22. The downstream on-off valve 59 and the sixth on-off valve 534 are examples of a "second switching valve."

[0201] Next, the operation of the fluid cabinet 10A will be described with reference to Figures 18 to 23. In other words, the processing executed by the control device 101 (control unit 102) will be described with reference to Figures 18 to 23.

[0202] FIG. 18 shows an example of the fluid cabinet 10A when circulating the processing liquid through the internal circulation piping 3. In other words, FIG. 18 shows an example of the fluid cabinet 10A during temperature control processing. As shown in FIG. 18, when circulating the processing liquid through the internal circulation piping 3, the control device 101 (control unit 102) opens the upstream on-off valve 58, the downstream on-off valve 59, and the internal circulation on-off valve 39, and closes the multiple external circulation on-off valves 24, the fifth on-off valve 533, and the sixth on-off valve 534. In addition, the control device 101 (control unit 102) drives the internal circulation pump 33. As a result, the processing liquid in the processing liquid tank 2 circulates through the internal circulation piping 3.

[0203] Furthermore, the control device 101 (controller 102) drives the internal circulation heater 341 when circulating the processing liquid through the internal circulation pipe 3. Specifically, the control device 101 (controller 102) adjusts the heating temperature of the internal circulation heater 341 to a first heating temperature. As a result, while the processing liquid is circulating through the internal circulation pipe 3, the internal circulation heater 341 heats the processing liquid at the first heating temperature, and the temperature of the processing liquid is raised to the first temperature. Furthermore, as the processing liquid heated to the first temperature flows through the filter 35, the temperature of the filter 35 is raised to the first temperature.

[0204] FIG. 19 is a diagram illustrating an example of the fluid cabinet 10A when the treatment liquid is circulated through the external circulation pipe 22. As illustrated in FIG. 19, when circulating the treatment liquid through the external circulation pipe 22, the control device 101 (control unit 102) opens the upstream on-off valve 58, the downstream on-off valve 59, and the external circulation on-off valves 24, and closes the internal circulation on-off valve 39, the fifth on-off valve 533, and the sixth on-off valve 534. The control device 101 (control unit 102) also drives the internal circulation pump 33 and the internal circulation heater 341. As a result, the treatment liquid in the treatment liquid tank 2 circulates through the external circulation pipe 22. By driving the internal circulation heater 341, the temperature of the treatment liquid is maintained at a first temperature. As described with reference to FIG. 4, the treatment liquid is circulated through the external circulation pipe 22 after the temperature adjustment process.

[0205] 20 is a diagram showing an example of the fluid cabinet 10A during the liquid temperature raising process. The liquid temperature raising process is a process in which the temperature of the processing liquid stored in the processing liquid tank 2 is raised to a second temperature by the internal circulation heater 341 while circulating the processing liquid through a part of the internal circulation piping 3, the bypass piping 531, and the processing liquid tank 2. In this embodiment, the filter cleaning process includes the liquid temperature raising process.

[0206] 20 , when performing the liquid temperature increasing process, the control device 101 (control unit 102) closes the upstream on-off valve 58 and opens the fifth on-off valve 533. The control device 101 (control unit 102) also drives the internal circulation pump 33. As a result, the processing liquid in the processing liquid tank 2 circulates via the bypass piping 531.

[0207] More specifically, the processing liquid flows from the processing liquid tank 2 into the internal circulation piping 3 when the internal circulation pump 33 is driven. The processing liquid that flows into the internal circulation piping 3 flows up to the second connection position P2 and then flows into the bypass piping 531. The bypass piping 531 distributes the processing liquid that flows in from the internal circulation piping 3 to the processing liquid tank 2. As a result, the processing liquid stored in the processing liquid tank 2 circulates via a part of the internal circulation piping 3, the bypass piping 531, and the processing liquid tank 2. Therefore, the filter 35 is not included in the path along which the processing liquid circulates via the bypass piping 531.

[0208] Specifically, at the start of the liquid temperature increasing process, the control device 101 (controller 102) switches the upstream on-off valve 58 from an open state to a closed state and switches the fifth on-off valve 533 from a closed state to an open state. As a result, the path of the processing liquid is switched from a path in which the processing liquid circulates via the internal circulation pipe 3 or the external circulation pipe 22 to a path in which the processing liquid circulates via the bypass pipe 531.

[0209] During the liquid temperature increasing process, the control device 101 (control unit 102) changes the heating temperature of the internal circulation heater 341 from the first heating temperature to the second heating temperature. As a result, while the processing liquid is circulating through the bypass piping 531, the internal circulation heater 341 heats the processing liquid at the second heating temperature, and the temperature of the processing liquid is increased from the first temperature to the second temperature, and the processing liquid heated to the second temperature is stored in the processing liquid tank 2.

[0210] 21 is a diagram showing an example of the fluid cabinet 10A during a filter temperature increase process. The filter temperature increase process is performed after the liquid temperature increase process. Specifically, the filter temperature increase process is performed after the temperature of the processing liquid reaches the second temperature by the liquid temperature increase process.

[0211] 21, when the filter temperature increasing process is performed, the control device 101 (control unit 102) closes the fifth on-off valve 533 and the downstream on-off valve 59 and opens the upstream on-off valve 58 and the sixth on-off valve 534. The control device 101 (control unit 102) also drives the internal circulation pump 33 and the internal circulation heater 341. As a result, the processing liquid in the processing liquid tank 2 passes through the filter 35 and flows into the second drainage pipe 532 from the third connection position P3. By driving the internal circulation heater 341, the temperature of the processing liquid is maintained at the second temperature.

[0212] The temperature of the filter 35 is raised to the second temperature while the treatment liquid heated to the second temperature is passed through the filter 35. In this way, the control device 101 (controller 102) raises the temperature of the treatment liquid to the second temperature, and then passes the heated treatment liquid through the filter 35 to raise the temperature of the filter 35. Furthermore, when raising the temperature of the filter 35, the control device 101 (controller 102) drains the treatment liquid that has passed through the filter 35 from the second drainage pipe 532.

[0213] According to the present embodiment, when the temperature of the processing liquid is raised to the second temperature, the processing liquid does not pass through the filter 35, and therefore the processing liquid can be raised to the second temperature without releasing particles from the filter 35. Therefore, compared to a configuration in which the processing liquid is raised to the second temperature while circulating the processing liquid through the internal circulation piping 3, for example, the internal circulation piping 3 and the processing liquid tank 2 are less likely to be contaminated by particles.

[0214] 22 is a diagram showing an example of the fluid cabinet 10A during the liquid temperature lowering process. The liquid temperature lowering process is a process in which the temperature of the processing liquid stored in the processing liquid tank 2 is lowered from the second temperature to the first temperature by the internal circulation heater 341 while circulating the processing liquid through a part of the internal circulation piping 3, the bypass piping 531, and the processing liquid tank 2. In this embodiment, the filter cleaning process includes the liquid temperature lowering process.

[0215] 22, when the liquid temperature lowering process is performed, the control device 101 (control unit 102) closes the upstream on-off valve 58 and opens the fifth on-off valve 533. The control device 101 (control unit 102) also drives the internal circulation pump 33. As a result, similar to the liquid temperature raising process, the processing liquid in the processing liquid tank 2 circulates via the bypass piping 531. Therefore, the processing liquid does not pass through the filter 35 during the liquid temperature lowering process.

[0216] During the liquid temperature lowering process, the control device 101 (control unit 102) lowers the heating temperature of the internal circulation heater 341 from the second heating temperature to the first heating temperature. As a result, while the processing liquid is circulating through the bypass piping 531, the temperature of the processing liquid is lowered from the second temperature to the first temperature by the internal circulation heater 341, and the processing liquid at the first temperature is stored in the processing liquid tank 2.

[0217] 23 is a diagram showing an example of the fluid cabinet 10A during the filter temperature lowering process. The filter temperature lowering process is performed after the liquid temperature lowering process. Specifically, the filter temperature lowering process is performed after the temperature of the treatment liquid reaches a first temperature by the liquid temperature lowering process.

[0218] 23, when performing the filter temperature lowering process, the control device 101 (control unit 102) closes the fifth on-off valve 533 and the downstream on-off valve 59 and opens the upstream on-off valve 58 and the sixth on-off valve 534. The control device 101 (control unit 102) also drives the internal circulation pump 33 and the internal circulation heater 341. As a result, the processing liquid in the processing liquid tank 2 passes through the filter 35 and flows into the second drainage pipe 532 from the third connection position P3. By driving the internal circulation heater 341, the temperature of the processing liquid is maintained at the first temperature.

[0219] The temperature of the filter 35 decreases from the second temperature to the first temperature while the treatment liquid, whose temperature has been decreased to the first temperature, is passed through the filter 35. In this way, the control device 101 (controller 102) decreases the temperature of the treatment liquid from the second temperature to the first temperature, and then passes the treatment liquid at the first temperature through the filter 35 to decrease the temperature of the filter 35. Furthermore, when decreasing the temperature of the filter 35, the control device 101 (controller 102) drains the treatment liquid that has passed through the filter 35 from the second drainage pipe 532.

[0220] According to the present embodiment, when the temperature of the processing liquid is lowered from the second temperature to the first temperature, the processing liquid does not pass through the filter 35, and therefore the processing liquid can be lowered from the second temperature to the first temperature without releasing particles from the filter 35. Therefore, compared to a configuration in which the processing liquid is lowered from the second temperature to the first temperature while circulating the processing liquid through the internal circulation piping 3, for example, the internal circulation piping 3 and the processing liquid tank 2 are less likely to be contaminated by particles.

[0221] Furthermore, the section of the internal circulation piping 3 from the outlet on the secondary side of the filter 35 to the third connecting position P3 may have a low cleanliness level because particles released from the filter 35 during the filter cleaning process pass through it. According to this embodiment, the treatment liquid can be circulated from the filter 35 to the second drainage pipe 532 in a state in which the collection rate of the filter 35 is increased by the filter temperature decreasing process. Therefore, the treatment liquid whose cleanliness has been increased by the filter 35 can be circulated from the filter 35 to the second drainage pipe 532. Therefore, the cleanliness of the section from the outlet on the secondary side of the filter 35 to the third connecting position P3 can be increased compared to before the filter temperature decreasing process.

[0222] Next, the operation of the substrate processing apparatus 100 of this embodiment will be described with reference to Figs. 18 to 25. Figs. 24 and 25 are flowcharts showing an example of the operation of the substrate processing apparatus 100 of this embodiment. In detail, Figs. 24 and 25 show an example of the flow of processes executed by the control device 101 (controller 102). More specifically, Figs. 24 and 25 show an example of a filter cleaning process. The filter cleaning process shown in Figs. 24 and 25 includes steps S31 to S43.

[0223] 24, the control device 101 (control unit 102) determines whether the number of particles contained in the processing liquid is equal to or less than a first threshold value (step S31). The processing in step S31 is the same as step S1 shown in FIG. 9, and therefore a description thereof will be omitted.

[0224] When the control device 101 (controller 102) determines that the number of particles contained in the processing liquid is not equal to or less than the first threshold value (No in step S31), the control device 101 (controller 102) executes a third switching process (step S32). The third switching process is a process of switching the processing liquid path from a path in which the processing liquid circulates via the internal circulation piping 3 or the external circulation piping 22 to a path in which the processing liquid circulates via the bypass piping 531.

[0225] By executing the third switching process, the liquid temperature increasing process is executed as described with reference to FIG. 20 (step S33).

[0226] The control device 101 (controller 102) executes a fourth switching process after the liquid temperature increasing process (step S34). For example, the control device 101 (controller 102) may execute the fourth switching process after the temperature of the treatment liquid measured by a temperature sensor (not shown) reaches the second temperature. Alternatively, the control device 101 (controller 102) may execute the fourth switching process after a predetermined time has elapsed since the start of the liquid temperature increasing process. The fourth switching process refers to a process of switching the flow path of the treatment liquid from a path in which the treatment liquid circulates via the bypass piping 531 to a path in which the treatment liquid is drained via the second drainage piping 532.

[0227] Execution of the fourth switching process causes the filter temperature increasing process to be executed (step S35), as described with reference to Fig. 21. In this way, the control device 101 (control unit 102) causes the third temperature control mechanism 5C to execute the liquid temperature increasing process and the filter temperature increasing process in response to the number of particles detected by the detection unit 36 ​​becoming larger than the first threshold value.

[0228] The control device 101 (controller 102) stops the filter temperature increasing process by the third temperature control mechanism 5C based on a predetermined condition. In this embodiment, the control device 101 (controller 102) determines whether the number of particles detected by the detection unit 36 ​​has reached saturation (step S36) while causing the third temperature control mechanism 5C to perform the filter temperature increasing process. The processes of steps S36 and S37 are similar to steps S4 and S5 shown in FIG. 9, and therefore will not be described further.

[0229] When the control device 101 (controller 102) determines that the first elapsed time has reached the first predetermined time (Yes in step S37), it executes a fifth switching process (step S38) as shown in Fig. 25. The fifth switching process is a process of switching the flow path of the treatment liquid from a path in which the treatment liquid is drained via the second drainage pipe 532 to a path in which the treatment liquid is circulated via the bypass pipe 531.

[0230] By executing the fifth switching process, the liquid temperature lowering process is executed as described with reference to FIG. 22 (step S39).

[0231] The control device 101 (controller 102) executes a sixth switching process after the liquid temperature decreasing process (step S40). For example, the control device 101 (controller 102) may execute the sixth switching process after the temperature of the treatment liquid measured by a temperature sensor (not shown) has decreased and reached the first temperature. Alternatively, the control device 101 (controller 102) may execute the sixth switching process after a predetermined time has elapsed since the start of the liquid temperature decreasing process. The sixth switching process refers to a process of switching the flow path of the treatment liquid from a path in which the treatment liquid circulates via the bypass piping 531 to a path in which the treatment liquid is drained via the second drainage piping 532.

[0232] By executing the sixth switching process, the filter temperature decreasing process is executed (step S41) as described with reference to Fig. 23. After executing the filter temperature decreasing process, the control device 101 (control unit 102) determines whether the number of particles detected by the detection unit 36 ​​is equal to or less than the second threshold value (step S42), similar to step S10 described with reference to Fig. 10.

[0233] If the control device 101 (control unit 102) determines that the number of particles detected by the detection unit 36 ​​is not equal to or less than the second threshold value (No in step S42), the control device 101 returns to step S32 shown in FIG. 24 and executes the third switching process.

[0234] When the control device 101 (control unit 102) determines that the number of particles detected by the detection unit 36 ​​is equal to or less than the second threshold value (Yes in step S42), the control device 101 (control unit 102) executes a seventh switching process. As a result, the processes shown in Figures 24 and 25 end. Here, the seventh switching process refers to a process of switching the path of the processing liquid from a path in which the processing liquid is drained via the second drainage pipe 532 to a path in which the processing liquid is circulated via the internal circulation pipe 3 or the external circulation pipe 22.

[0235] According to the present embodiment, the third temperature control mechanism 5C raises the temperature of the filter 35 by flowing a heated fluid through the filter 35. As a result, particles adhering to the filter 35 are easily released from the filter 35. Furthermore, since the heated fluid is flowed through the filter 35, the particles can be released from the filter 35.

[0236] Furthermore, according to this embodiment, a filter temperature-lowering process can be performed at the end of the filter cleaning process to lower the temperature of the filter 35. As a result, the path of the treatment liquid can be switched from a path in which the treatment liquid is discharged via the second drainage pipe 532 to a path in which the treatment liquid is circulated via the internal circulation pipe 3 or the external circulation pipe 22, while maintaining an increased level of cleanliness in a portion of the internal circulation pipe 3 used in the filter cleaning process (the section from the outlet on the secondary side of the filter 35 to the third connection position P3). Therefore, after the filter cleaning process, the treatment liquid tank 2, the internal circulation pipe 3, the inlet pipe 21, the multiple external circulation pipes 22, the outlet pipe 23, the multiple supply pipes 25 (see FIG. 2), and the multiple nozzles 27 (see FIG. 2) are less likely to be contaminated.

[0237] Furthermore, according to the present embodiment, particles released from the filter 35 are discharged from the third connecting position P3 to the second drainage pipe 532. Therefore, it is possible to prevent the processing liquid tank 2 and the upstream side of the filter 35 from being contaminated by particles released from the filter 35.

[0238] Furthermore, according to this embodiment, the section through which the particles released from the filter 35 pass through the internal circulation piping 3 can be limited to a short section between the outlet on the downstream side (secondary side) of the filter 35 and the third connection position P3. Therefore, the internal circulation piping 3 is less likely to be contaminated by the particles released from the filter 35.

[0239] 18 to 25, the fifth embodiment of the present invention has been described above. According to the fifth embodiment, the filter 35 can be cleaned by increasing the temperature of the filter 35. Therefore, the filter 35 can be cleaned with a simpler configuration than a configuration in which the filter 35 is cleaned by alternately repeating cooling and heating of the filter 35.

[0240] The substrate processing apparatus 100 may further include the vibrator 7 described with reference to FIG.

[0241] Furthermore, during the filter temperature increasing process, the control device 101 (control unit 102) may hold the treatment liquid heated to the second temperature in the filter 35, thereby increasing the temperature of the filter 35. Specifically, while the treatment liquid heated to the second temperature is being passed through the filter 35, the control device 101 (control unit 102) can hold the treatment liquid heated to the second temperature in the filter 35 by switching the upstream on-off valve 58 and the sixth on-off valve 534 from an open state to a closed state.

[0242] In the present embodiment, the substrate processing apparatus 100 heats the processing liquid at the first heating temperature while circulating the processing liquid through the internal circulation pipe 3 or the external circulation pipe 22. However, the temperature of the processing liquid while circulating the processing liquid through the internal circulation pipe 3 or the external circulation pipe 22 may be room temperature. In this case, the second heating temperature (second temperature) may be any temperature higher than room temperature. When the temperature of the processing liquid during substrate processing is room temperature, the control device 101 (control unit 102) may stop driving the internal circulation heater 341 during the filter temperature lowering process.

[0243] In addition, in the present embodiment, the destination of the treatment liquid at the second connection position P2 is switched by the fifth on-off valve 533 and the upstream on-off valve 58, but a three-way valve may be used instead of the fifth on-off valve 533 and the upstream on-off valve 58. Similarly, in the present embodiment, the destination of the treatment liquid at the third connection position P3 is switched by the sixth on-off valve 534 and the downstream on-off valve 59, but a three-way valve may be used instead of the sixth on-off valve 534 and the downstream on-off valve 59.

[0244] [Embodiment 6] Next, a sixth embodiment of the present invention will be described with reference to Figures 26 to 30. However, differences from the first to fifth embodiments will be described, and a description of the same aspects as the first to fifth embodiments will be omitted. Unlike the first to fifth embodiments, the sixth embodiment directly heats the filter 35.

[0245] Fig. 26 is a diagram showing the configuration of a fluid cabinet 10A included in the substrate processing apparatus 100 of this embodiment. As shown in Fig. 26, the substrate processing apparatus 100 of this embodiment includes a fourth temperature control mechanism 5D.

[0246] The fourth temperature control mechanism 5D executes a filter temperature increasing process and a filter temperature decreasing process. That is, during the filter temperature increasing process, the fourth temperature control mechanism 5D increases the temperature of the filter 35 from a first temperature to a second temperature. During the filter temperature decreasing process, the fourth temperature control mechanism 5D decreases the temperature of the filter 35 from the second temperature to the first temperature. Specifically, the fourth temperature control mechanism 5D includes a filter heating unit 541, a third drainage pipe 542, a seventh on-off valve 543, and a downstream on-off valve 59.

[0247] The filter heating unit 541 heats the filter 35 to increase the temperature of the filter 35. The filter heating unit 541 is an example of a “heating unit.” The filter heating unit 541 is controlled by the control device 101 (control unit 102) to heat the filter 35.

[0248] Specifically, during the filter temperature increasing process, the filter heating unit 541 heats the filter 35 at the second heating temperature to change the temperature of the filter 35 from the first temperature to the second temperature. Furthermore, during the filter temperature decreasing process, the filter heating unit 541 heats the filter 35 at the first heating temperature to change the temperature of the filter 35 from the second temperature to the first temperature.

[0249] The filter heating unit 541 includes, for example, a wrap-around heater. A wrap-around heater is a linear heater that can be bent. When a wrap-around heater is used as the filter heating unit 541, the wrap-around heater may be wrapped around the filter 35. Note that the filter heating unit 541 is not limited to a wrap-around heater. For example, the filter heating unit 541 may include a panel-shaped heater that can be bent, or may include a heater that cannot be bent. Alternatively, the filter heating unit 541 may include a heater that heats the filter 35 by radiant heat.

[0250] The third drainage pipe 542 is a tubular member through which the processing liquid flows. The third drainage pipe 542 is connected to the internal circulation pipe 3 downstream of the filter 35, and drains the processing liquid flowing in from the internal circulation pipe 3. Specifically, the upstream end of the third drainage pipe 542 is connected to the internal circulation pipe 3 (downstream pipe 32) at a third connection position P3. The third drainage pipe 542 flows the processing liquid, for example, to a waste liquid facility in a factory where the substrate processing apparatus 100 is installed.

[0251] The seventh on-off valve 543 is provided in the third drainage pipe 542 and controls the start and stop of the flow of the processing liquid through the third drainage pipe 542. More specifically, the seventh on-off valve 543 can be opened and closed. The opening and closing operation of the seventh on-off valve 543 is controlled by the control device 101 (control unit 102). When the seventh on-off valve 543 is opened, the processing liquid flows from the internal circulation pipe 3 into the third drainage pipe 542. When the seventh on-off valve 543 is closed, the flow of the processing liquid from the internal circulation pipe 3 into the third drainage pipe 542 stops.

[0252] Specifically, the control device 101 (controller 102) opens the downstream on-off valve 59 and closes the seventh on-off valve 543 when circulating the treatment liquid that has passed through the filter 35 to the treatment liquid tank 2 or the external circulation piping 22. The control device 101 (controller 102) closes the downstream on-off valve 59 and opens the seventh on-off valve 543 when circulating the treatment liquid that has passed through the filter 35 to the third drainage piping 542. In this way, the downstream on-off valve 59 and the seventh on-off valve 543 switch the destination of the treatment liquid that has passed through the filter 35 between the third drainage piping 542 and the treatment liquid tank 2 or the external circulation piping 22. The downstream on-off valve 59 and the seventh on-off valve 543 are examples of a "switching valve."

[0253] Next, the operation of the fluid cabinet 10A will be described with reference to Figures 26 to 29. In other words, the processing executed by the control device 101 (control unit 102) will be described with reference to Figures 26 to 29.

[0254] FIG. 26 shows an example of the fluid cabinet 10A when circulating the processing liquid through the internal circulation piping 3. In other words, FIG. 26 shows an example of the fluid cabinet 10A during temperature control processing. As shown in FIG. 26, when circulating the processing liquid through the internal circulation piping 3, the control device 101 (control unit 102) opens the downstream on-off valve 59 and the internal circulation on-off valve 39 and closes the multiple external circulation on-off valves 24 and the seventh on-off valve 543. In addition, the control device 101 (control unit 102) drives the internal circulation pump 33. As a result, the processing liquid in the processing liquid tank 2 circulates through the internal circulation piping 3.

[0255] Furthermore, the control device 101 (controller 102) drives the internal circulation heater 34 when circulating the processing liquid through the internal circulation pipe 3. Specifically, the control device 101 (controller 102) adjusts the heating temperature of the internal circulation heater 34 to a first heating temperature. As a result, while the processing liquid is circulating through the internal circulation pipe 3, the internal circulation heater 34 heats the processing liquid at the first heating temperature, and the temperature of the processing liquid increases. In addition, the heated processing liquid flows through the filter 35, and the temperature of the filter 35 also increases.

[0256] FIG. 27 is a diagram illustrating an example of the fluid cabinet 10A when the processing liquid is circulated through the external circulation pipe 22. As illustrated in FIG. 27, when circulating the processing liquid through the external circulation pipe 22, the control device 101 (control unit 102) opens the downstream on-off valve 59 and the multiple external circulation on-off valves 24 and closes the internal circulation on-off valve 39 and the seventh on-off valve 543. The control device 101 (control unit 102) also drives the internal circulation pump 33 and the internal circulation heater 34. As a result, the processing liquid in the processing liquid tank 2 circulates through the external circulation pipe 22. By driving the internal circulation heater 34, the temperature of the processing liquid is maintained at the first temperature. As described with reference to FIG. 4, the processing liquid is circulated through the external circulation pipe 22 after the temperature adjustment process.

[0257] 28 is a diagram showing an example of fluid cabinet 10A during a filter temperature increase process. As shown in FIG. 28, when the filter temperature increase process is performed, control device 101 (control unit 102) drives filter heating unit 541 to heat filter 35 at the second heating temperature. As a result, the temperature of filter 35 is increased to the second temperature.

[0258] Furthermore, when performing the filter temperature increasing process, the control device 101 (controller 102) switches the seventh on-off valve 543 from a closed state to an open state and switches the downstream on-off valve 59 from an open state to a closed state. The control device 101 (controller 102) also drives the internal circulation pump 33 and the internal circulation heater 34. As a result, the processing liquid in the processing liquid tank 2 passes through the filter 35, which has been heated to the second temperature, and flows into the third drainage pipe 542 from the third connection position P3. By driving the internal circulation heater 34, the processing liquid heated to the first temperature passes through the filter 35. Therefore, the temperature of the filter 35 is less likely to drop from the second temperature than when, for example, room temperature processing liquid is flowed through the filter 35. However, the internal circulation heater 34 does not have to be driven during the filter temperature increasing process.

[0259] According to this embodiment, the filter 35 is heated to the second temperature by the filter heating unit 541, so that the pore diameter of the filter 35 is enlarged, and particles adhering to the filter 35 are easily released from the filter 35. Furthermore, the processing liquid is caused to flow through the filter 35 heated to the second temperature, so that the particles can be released from the filter 35. The particles released from the filter 35 are discharged from the third drainage pipe 542 together with the processing liquid.

[0260] 29 is a diagram showing an example of the fluid cabinet 10A during the filter temperature lowering process. The filter temperature lowering process is performed after the filter temperature raising process. As shown in FIG. 29, the control device 101 (control unit 102) stops driving the filter heating unit 541 when the filter temperature lowering process is performed. As a result, the temperature of the filter 35 is lowered.

[0261] Furthermore, the control device 101 (control unit 102) drives the internal circulation pump 33. As a result, the processing liquid in the processing liquid tank 2 passes through the filter 35 whose temperature has been lowered, and flows into the third drainage pipe 542 from the third connection position P3.

[0262] In the internal circulation piping 3, the section from the outlet on the secondary side of the filter 35 to the third connection position P3 may have a low cleanliness level because particles released from the filter 35 during the filter cleaning process pass through the section. According to this embodiment, the filter temperature lowering process increases the collection rate of the filter 35, and the treatment liquid can then be circulated from the filter 35 to the third drainage piping 542. Therefore, the treatment liquid whose cleanliness has been increased by the filter 35 can be circulated from the filter 35 to the third drainage piping 542. Therefore, the cleanliness of the section from the outlet on the secondary side of the filter 35 to the third connection position P3 can be increased compared to before the filter temperature lowering process.

[0263] Next, the operation of the substrate processing apparatus 100 of this embodiment will be described with reference to Fig. 26 to Fig. 30. Fig. 30 is a flowchart showing an example of the operation of the substrate processing apparatus 100 of this embodiment. In detail, Fig. 30 shows an example of the flow of processes executed by the control device 101 (controller 102). More specifically, Fig. 30 shows an example of a filter cleaning process. The filter cleaning process shown in Fig. 30 includes steps S51 to S58.

[0264] 30, the control device 101 (control unit 102) determines whether the number of particles contained in the processing liquid is equal to or less than a first threshold value (step S51). The processing in step S51 is the same as step S1 shown in FIG. 9, and therefore a description thereof will be omitted.

[0265] When the control device 101 (controller 102) determines that the number of particles contained in the processing liquid is not equal to or less than the first threshold value (No in step S51), it executes an eighth switching process (step S52). The eighth switching process refers to a process of switching the processing liquid path from a path in which the processing liquid circulates via the internal circulation piping 3 or the external circulation piping 22 to a path in which the processing liquid is drained via the third drainage piping 542.

[0266] After executing the eighth switching process, the control device 101 (controller 102) causes the filter heating unit 541 to heat the filter 35 at the second heating temperature. As a result, the filter temperature increasing process described with reference to Fig. 28 is executed (step S53). In this way, the control device 101 (controller 102) causes the fourth temperature control mechanism 5D to execute the filter temperature increasing process in response to the number of particles detected by the detector 36 becoming larger than the first threshold value.

[0267] The control device 101 (controller 102) stops the filter temperature increasing process by the fourth temperature control mechanism 5D based on a predetermined condition. In this embodiment, the control device 101 (controller 102) determines whether the number of particles detected by the detection unit 36 ​​has reached saturation (step S54) while causing the fourth temperature control mechanism 5D to perform the filter temperature increasing process. The processes of steps S54 and S55 are similar to steps S4 and S5 shown in FIG. 9, and therefore will not be described further.

[0268] When the control device 101 (control unit 102) determines that the first elapsed time has reached the first predetermined time (Yes in step S55), it stops driving the filter heating unit 541. As a result, as described with reference to Fig. 29, the filter temperature decreasing process is executed (step S56). After executing the filter temperature decreasing process, the control device 101 (control unit 102) determines whether the number of particles detected by the detection unit 36 ​​is equal to or less than the second threshold value (step S57), similar to step S10 described with reference to Fig. 10.

[0269] When the control device 101 (control unit 102) determines that the number of particles detected by the detection unit 36 ​​is not equal to or less than the second threshold value (No in step S57), the control device 101 (control unit 102) returns to step S53 and executes the filter temperature increase process. Specifically, the control device 101 increases the heating temperature of the filter heating unit 541 to the second heating temperature.

[0270] When the control device 101 (control unit 102) determines that the number of particles detected by the detection unit 36 ​​is equal to or less than the second threshold value (Yes in step S57), the control device 101 (control unit 102) executes a ninth switching process. As a result, the process shown in Fig. 30 ends. Here, the ninth switching process refers to a process of switching the path of the processing liquid from a path in which the processing liquid is drained via the third drainage pipe 542 to a path in which the processing liquid is circulated via the internal circulation pipe 3 or the external circulation pipe 22.

[0271] According to this embodiment, the fourth temperature control mechanism 5D directly heats the filter 35 to raise the temperature of the filter 35. As a result, particles adhering to the filter 35 are easily released from the filter 35. Furthermore, since the processing liquid is caused to flow through the heated filter 35, the particles can be released from the filter 35.

[0272] Furthermore, according to this embodiment, a filter temperature-lowering process can be performed at the end of the filter cleaning process to lower the temperature of the filter 35. As a result, the cleanliness of a portion of the internal circulation piping 3 used in the filter cleaning process (the section from the secondary outlet of the filter 35 to the third connection position P3) can be increased, and the path of the treatment liquid can be switched from a path in which the treatment liquid is discharged via the third drainage piping 542 to a path in which the treatment liquid is circulated via the internal circulation piping 3 or the external circulation piping 22. Therefore, after the filter cleaning process, the treatment liquid tank 2, the internal circulation piping 3, the inlet piping 21, the multiple external circulation piping 22, the outlet piping 23, the multiple supply piping 25 (see FIG. 2), and the multiple nozzles 27 (see FIG. 2) are less likely to be contaminated.

[0273] Furthermore, according to the present embodiment, particles released from the filter 35 are discharged from the third connection position P3 to the third drainage pipe 542. Therefore, it is possible to prevent the processing liquid tank 2 and the upstream side of the filter 35 from being contaminated by particles released from the filter 35.

[0274] Furthermore, according to this embodiment, the section through which the particles released from the filter 35 pass through the internal circulation piping 3 can be limited to a short section between the outlet on the downstream side (secondary side) of the filter 35 and the third connection position P3. Therefore, the internal circulation piping 3 is less likely to be contaminated by the particles released from the filter 35.

[0275] 26 to 30, the sixth embodiment of the present invention has been described. According to the sixth embodiment, the filter 35 can be cleaned by increasing the temperature of the filter 35. Therefore, the filter 35 can be cleaned with a simpler configuration than a configuration in which the filter 35 is cleaned by alternately repeating cooling and heating of the filter 35.

[0276] The substrate processing apparatus 100 may further include the vibrator 7 described with reference to FIG.

[0277] In the present embodiment, the substrate processing apparatus 100 heats the processing liquid at the first heating temperature while circulating the processing liquid through the internal circulation piping 3 or the external circulation piping 22. However, the temperature of the processing liquid may be room temperature while circulating the processing liquid through the internal circulation piping 3 or the external circulation piping 22. In this case, the second heating temperature (second temperature) may be any temperature higher than room temperature.

[0278] In addition, in this embodiment, the seventh on-off valve 543 and the downstream on-off valve 59 are used to switch the destination of the processing liquid at the third connection position P3, but a three-way valve may be used instead of the seventh on-off valve 543 and the downstream on-off valve 59.

[0279] Furthermore, in this embodiment, the driving of the filter heating unit 541 is stopped during the filter temperature lowering process, but the heating temperature of the filter heating unit 541 may be changed from the second heating temperature to the first heating temperature during the filter temperature lowering process.

[0280] The embodiments of the present invention have been described above with reference to the drawings (FIGS. 1 to 30). However, the present invention is not limited to the above embodiments and can be embodied in various forms without departing from the spirit of the present invention. Furthermore, the components disclosed in the above embodiments can be modified as appropriate. For example, some of the components shown in one embodiment may be added to the components of another embodiment, or some of the components shown in one embodiment may be deleted from the embodiment.

[0281] The drawings mainly show each component in a schematic manner to facilitate understanding of the invention, and the thickness, length, number, spacing, etc. of each component shown in the drawings may differ from the actual ones due to the convenience of creating the drawings. Furthermore, the configuration of each component shown in the above embodiment is merely an example and is not particularly limited, and it goes without saying that various modifications are possible within a range that does not substantially deviate from the effects of the present invention.

[0282] For example, the filter heating unit 541 shown in the sixth embodiment may be added to the first temperature control mechanism 5A to the third temperature control mechanism 5C shown in the first to fifth embodiments.

[0283] 1 to 30, a cleaning apparatus and an etching apparatus are exemplified as the substrate processing apparatus 100, but the substrate processing apparatus 100 is not limited to a cleaning apparatus or an etching apparatus. The substrate processing apparatus 100 may be any apparatus that processes a substrate W using a processing liquid. For example, the substrate processing apparatus 100 may be a coating apparatus, a developing apparatus, a coater developer, or a film forming apparatus.

[0284] 1 to 30, the substrate processing apparatus 100 is a single-wafer processing apparatus, but the substrate processing apparatus 100 may also be a batch processing apparatus. In the batch processing apparatus 100, the filter to be cleaned may be a filter provided in a fluid cabinet, or may be a filter provided in a circulation pipe that circulates the processing liquid stored in a processing tank.

[0285] 1 to 30, IPA (isopropyl alcohol) is used as the processing liquid, but the processing liquid is not limited to IPA. The processing liquid may be any liquid that can be used to process the substrate W. The processing liquid may be a chemical liquid such as dilute hydrofluoric acid (DHF), hydrofluoric acid (HF), hydrofluoric nitric acid (a mixture of hydrofluoric acid and nitric acid (HNO3)), buffered hydrofluoric acid (BHF), ammonium fluoride, HFEG (a mixture of hydrofluoric acid and ethylene glycol), phosphoric acid (H3PO4), sulfuric acid, acetic acid, nitric acid, hydrochloric acid, ammonia water, hydrogen peroxide water, organic acid (e.g., citric acid, oxalic acid), organic alkali (e.g., tetramethylammonium hydroxide (TMAH)), sulfuric acid hydrogen peroxide water mixture (SPM), ammonia hydrogen peroxide water mixture (SC1), hydrochloric acid hydrogen peroxide water mixture (SC2), isopropyl alcohol (IPA), surfactant, or corrosion inhibitor, or may be a rinse liquid such as pure water (e.g., deionized water), carbonated water, electrolytic ionized water, hydrogen water, ozone water, or hydrochloric acid water with a diluted concentration (e.g., about 10 ppm to 100 ppm). [Industrial Applicability]

[0286] The present invention is useful in an apparatus for processing a substrate. [Explanation of symbols]

[0287] 2: Processing liquid tank 3: Internal circulation piping 5A: 1st temperature control mechanism 5B: Second temperature control mechanism 5C: Third temperature control mechanism 5D: 4th temperature control mechanism 7: Vibrator 10A: Fluid cabinet 35: Filter 36:Detection unit 51: Cleaning circulation tank 52: Cleaning circulation piping 53: Cleaning circulation pump 53a: Cleaning circulation pump 54: Cleaning circulation heater 55a: First opening / closing valve 55b: Second opening / closing valve 55c: Third shut-off valve 58: Upstream shut-off valve 59: Downstream shut-off valve 100: Substrate processing apparatus 101: Control device 102: Control unit 341: Internal circulation heater 521: Gas supply piping 522: Exhaust pipe 523: Third shut-off valve 524: 4th shut-off valve 525: Fluid heater 531: Bypass piping 532: Second drainage pipe 533: 5th shut-off valve 534: 6th shutoff valve 541: Filter heating section 542: Third drainage pipe 543: 7th shutoff valve W: Substrate

Claims

1. A substrate processing apparatus for processing a substrate, a storage section for storing a processing liquid to be used for processing the substrate; a circulation pipe for circulating the treatment liquid stored in the storage section through the storage section; a filter provided in the circulation pipe to remove particles from the treatment liquid flowing through the circulation pipe; a temperature control mechanism that performs a temperature raising process to raise the temperature of the filter to a temperature higher than the temperature of the processing liquid when processing the substrate; The substrate processing apparatus includes:

2. A detection unit that detects the number of particles contained in the processing liquid; A control unit that controls the temperature control mechanism; Further comprising: The substrate processing apparatus according to claim 1 , wherein the control unit causes the temperature control mechanism to execute the temperature increase process in response to the number of the particles detected by the detection unit becoming greater than a first threshold value.

3. The control unit is After the start of the temperature increase process, the temperature control mechanism stops the temperature increase process based on a predetermined condition; The substrate processing apparatus according to claim 2 , further comprising: a control unit for controlling the temperature control mechanism to perform the heating process again when the number of particles detected by the detection unit does not become equal to or less than a second threshold value after the heating process is stopped.

4. 4. The substrate processing apparatus according to claim 3, wherein the control unit causes the temperature control mechanism to execute the heating process, and after detecting that the number of the particles detected by the detection unit has reached saturation, causes the temperature control mechanism to stop the heating process.

5. The substrate processing apparatus according to claim 1 , wherein the temperature control mechanism causes a heated fluid to flow through the filter to increase the temperature of the filter.

6. the temperature control mechanism includes a heating unit that heats a cleaning liquid; The substrate processing apparatus according to claim 5 , wherein the temperature control mechanism causes the cleaning liquid heated by the heating unit to pass through the filter, thereby increasing the temperature of the filter.

7. The substrate processing apparatus according to claim 6 , wherein the cleaning liquid includes the processing liquid.

8. The reservoir is a first reservoir, The circulation pipe is a first circulation pipe, The temperature control mechanism includes: A second reservoir that stores the cleaning liquid; a second circulation pipe connected to the first circulation pipe on the upstream side and downstream side of the filter, and circulating the cleaning liquid stored in the second reservoir through a part of the first circulation pipe, the second reservoir, and the filter; Further comprising: The substrate processing apparatus according to claim 6 , wherein the heating section is provided in the second circulation piping.

9. the temperature control mechanism further includes a pump that circulates the cleaning liquid through a portion of the first circulation pipe, the second circulation pipe, the second reservoir, and the filter; The substrate processing apparatus according to claim 8 , wherein the pump delivers the cleaning liquid such that the cleaning liquid flows from an upstream side to a downstream side of the filter.

10. the temperature control mechanism further includes a pump that circulates the cleaning liquid through a portion of the first circulation pipe, the second circulation pipe, the second reservoir, and the filter; The substrate processing apparatus according to claim 8 , wherein the pump delivers the cleaning liquid such that the cleaning liquid flows from a downstream side to an upstream side of the filter.

11. A control unit for controlling the temperature control mechanism is further provided. the temperature control mechanism further includes an on-off valve disposed in the first circulation pipe or the second circulation pipe upstream of the filter and configured to control a flow and a stop of a flow of the cleaning liquid; The substrate processing apparatus according to claim 10 , wherein the control unit opens and closes the on-off valve during the temperature increase process to vibrate the filter.

12. A control unit for controlling the temperature control mechanism is further provided. The control unit reduces the temperature of the heating unit after the temperature increase process is performed, 9. The substrate processing apparatus of claim 8, wherein the temperature control mechanism circulates the cleaning liquid through a portion of the first circulation piping, the second circulation piping, the filter, and the second storage section to lower the temperature of the cleaning liquid, while passing the temperature-lowered cleaning liquid through the filter to lower the temperature of the filter.

13. The heating unit is provided in the circulation pipe upstream of the filter, The temperature control mechanism includes: a bypass pipe connected to the circulation pipe between the heating unit and the filter, for returning the treatment liquid flowing from the circulation pipe to the storage unit; a switching valve that switches a flow destination of the treatment liquid stored in the storage section between the filter and the bypass pipe; The substrate processing apparatus of claim 7 .

14. A control unit for controlling the temperature control mechanism is further provided.

14. The substrate processing apparatus of claim 13, wherein the control unit circulates the processing liquid stored in the storage unit through a part of the circulation piping, the bypass piping, and the storage unit, while raising a temperature of the processing liquid by the heating unit to a temperature higher than a temperature of the processing liquid when processing the substrate, and then controls the switching valve to pass the heated processing liquid through the filter and raise the temperature of the filter.

15. The switching valve is a first switching valve, The temperature control mechanism includes: a drainage pipe connected to the circulation pipe downstream of the filter and configured to drain the treatment liquid flowing in from the circulation pipe; a second switching valve that switches a destination of the treatment liquid that has passed through the filter between the storage section and the drainage pipe; The substrate processing apparatus of claim 13 further comprising:

16. A control unit for controlling the temperature control mechanism is further provided. The substrate processing apparatus according to claim 15 , wherein the control unit controls the first switching valve and the second switching valve when increasing the temperature of the filter, to drain the processing liquid that has passed through the filter from the drainage pipe.

17. The control unit reduces the temperature of the heating unit after the temperature increase process is performed, 15. The substrate processing apparatus of claim 14, wherein the control unit circulates the processing liquid stored in the storage unit through a part of the circulation piping, the bypass piping, and the storage unit to lower the temperature of the processing liquid, and then controls the switching valve to pass the temperature-lowered processing liquid through the filter.

18. The substrate processing apparatus according to claim 1 , wherein the temperature control mechanism includes a heating unit that heats the filter to increase the temperature of the filter.

19. The temperature control mechanism includes: a drainage pipe connected to the circulation pipe downstream of the filter and configured to drain the treatment liquid flowing in from the circulation pipe; a switching valve that switches the destination of the treatment liquid that has passed through the filter between the storage section and the drainage pipe; The substrate processing apparatus of claim 18 further comprising:

20. A control unit for controlling the temperature control mechanism is further provided.

20. The substrate processing apparatus of claim 19, wherein the control unit controls the switching valve to discharge the processing liquid stored in the storage unit through a portion of the circulation piping, the filter, and the drainage piping after raising the temperature of the filter by the heating unit.

21. The substrate processing apparatus according to claim 20 , wherein the control unit reduces the temperature of the heating unit after the temperature increasing process is performed.

22. The substrate processing apparatus according to claim 1 , further comprising an oscillator that vibrates the filter.

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