Substrate cleaning apparatus, substrate processing apparatus and substrate cleaning method

Abstract

To suppress recontamination in the cleaning process and reduce the amount of residual foreign matter on a substrate.SOLUTION: A substrate cleaning apparatus has a cleaning section for cleaning substrates, a foreign matter locating section for identifying the location of foreign matter remaining on the substrate after cleaning by the cleaning section, and a foreign matter removal section for locally removing the foreign matter by approaching the foreign matter specified position identified by the foreign matter locating section.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a substrate cleaning apparatus, a substrate processing apparatus, and a substrate cleaning method. [Background technology]

[0002] A substrate processing apparatus described in Patent Document 1 below has been known in the past. This substrate processing apparatus is a chemical mechanical polishing (CMP) apparatus that polishes the surface of a substrate such as a silicon wafer to a flat surface, and includes a substrate polishing apparatus that polishes the substrate, and a substrate cleaning apparatus that cleans the substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2010-50436 A Summary of the Invention [Problem to be solved by the invention]

[0004] The above-mentioned conventional technology includes multiple cleaning modules for primary and secondary cleaning of the substrate. However, even if multiple cleaning modules are used, there is a problem that the amount of foreign matter (particles) remaining on the substrate remains almost constant at a certain level due to recontamination caused by the cleaning process, and the amount does not decrease any more.

[0005] The present invention has been made in consideration of the above problems, and has an object to suppress recontamination in a cleaning process and reduce the amount of foreign matter remaining on a substrate. [Means for solving the problem]

[0006] (1): A substrate cleaning apparatus according to one embodiment of the present invention includes a cleaning unit that cleans a substrate, a foreign matter position identification unit that identifies a position of a foreign matter remaining on the substrate after cleaning by the cleaning unit, and a foreign matter removal unit that approaches the foreign matter identification position identified by the foreign matter position identification unit and locally removes the foreign matter.

[0007] (2) In the substrate cleaning apparatus according to (1), the foreign matter removal unit may include a tape member that removes the foreign matter, and a pressing device that presses the tape member against the foreign matter specified position.

[0008] (3) In the substrate cleaning apparatus according to (2), the foreign matter removal unit may include a supply reel that supplies the tape member, and a recovery reel that recovers the tape member.

[0009] (4) In the substrate cleaning apparatus relating to (3), the recovery reel may take up the portion of the tape member that is pressed against the foreign object identification position, and the supply reel may pay out the portion of the tape member that is not pressed against the foreign object identification position to a position opposite the pressing device.

[0010] (5): In the substrate cleaning apparatus according to any one of (2) to (4), the tape member may be thermoplastic, and the foreign matter removal unit may include a heating device that heats the tape member while it is pressed against the foreign matter identification position.

[0011] (6): In the substrate cleaning apparatus according to (5), the heating device may be provided in the pressing device.

[0012] (7) The substrate cleaning apparatus according to any one of (2) to (6) may further include a regeneration device that cleans the tape member and removes the foreign matter adhering to the tape member.

[0013] (8): In the substrate cleaning apparatus according to any one of (1) to (7), the foreign matter removal unit may remove the foreign matter while keeping the substrate stationary.

[0014] (9): In the substrate cleaning apparatus according to any one of (1) to (8), the cleaning unit may include a plurality of cleaning modules for cleaning the substrate, and the foreign matter position identification unit may identify a position of a foreign matter remaining on the substrate after cleaning by the plurality of cleaning modules.

[0015] (10): In the substrate cleaning apparatus according to any one of (1) to (9), the cleaning unit may include a plurality of cleaning modules that clean the substrate, and a drying module that dries the substrate after cleaning by the plurality of cleaning modules, and the foreign matter position identification unit may identify a position of a foreign matter remaining on the substrate after drying by the drying module.

[0016] (11): A substrate processing apparatus according to one aspect of the present invention includes a substrate polishing apparatus for polishing a substrate, and a substrate cleaning apparatus according to any one of (1) to (10) for cleaning the substrate.

[0017] (12): A substrate cleaning method according to one embodiment of the present invention includes a cleaning step of cleaning a substrate, a foreign matter position identifying step of identifying a position of a foreign matter remaining on the substrate after cleaning in the cleaning step, and a foreign matter removal step of approaching the foreign matter identified position identified in the foreign matter position identifying step and locally removing the foreign matter. Effect of the Invention

[0018] According to the above aspect of the present invention, recontamination in the cleaning process can be suppressed, and the amount of foreign matter remaining on the substrate can be reduced. [Brief description of the drawings]

[0019] [Figure 1] 1 is a plan view showing an overall configuration of a substrate processing apparatus according to a first embodiment. [Diagram 2] FIG. 2 is a block diagram of a touch-up cleaning unit according to the first embodiment. [Diagram 3] 4 is a schematic diagram of a foreign matter removal section included in the touch-up cleaning section according to the first embodiment. FIG. [Figure 4] 5A to 5C are explanatory diagrams for explaining the operation of a foreign matter removal unit according to the first embodiment. [Diagram 5] 5A to 5C are explanatory diagrams for explaining the operation of a foreign matter removal unit according to the first embodiment. [Figure 6] 5A to 5C are explanatory diagrams for explaining the operation of a foreign matter removal unit according to the first embodiment. [Figure 7] 13 is a schematic diagram of a foreign matter removal section included in a touch-up cleaning section according to a second embodiment. FIG. [Figure 8] 13 is a schematic diagram of a foreign matter removal section 42 included in a touch-up cleaning section according to a third embodiment. FIG. [Figure 9] FIG. 13 is a block diagram of a touch-up cleaning unit according to a fourth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0020] Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0021] (First embodiment) FIG. 1 is a plan view showing an overall configuration of a substrate processing apparatus 1 according to a first embodiment. The substrate processing apparatus 1 shown in Fig. 1 is a chemical mechanical polishing (CMP) apparatus that polishes the surface of a substrate W to a flat surface. The substrate W may be, for example, a semiconductor wafer such as Si, SiC, GaAs, or GaN, but may be another substrate. The processed surface of the substrate W to be polished may have a thin film of a simple substance or compound such as SiO2, Cu, Al, or W formed thereon. Alternatively, the processed surface of the substrate W may contain a mixture of SiO2, Cu, or the like.

[0022] The substrate processing apparatus 1 includes a rectangular box-shaped housing 2. The housing 2 is formed into a substantially rectangular shape in a plan view. The housing 2 is provided with a load / unload device 10, a substrate polishing device 20, and a substrate cleaning device 30. The substrate processing apparatus 1 also includes a control device 3 that controls the operations of the load / unload device 10, the substrate polishing device 20, and the substrate cleaning device 30.

[0023] The load / unload device 10 includes a front load unit 11 that houses the substrate W. A plurality of front load units 11 are provided on one side surface in the longitudinal direction of the housing 2. The plurality of front load units 11 are arranged in the width direction of the housing 2 (a direction perpendicular to the longitudinal direction in a plan view). The front load unit 11 is equipped with, for example, an open cassette, a Standard Manufacturing Interface (SMIF) pod, or a Front Opening Unified Pod (FOUP). The SMIF and FOUP are airtight containers that house cassettes for substrates W therein and are covered with a partition wall, and can maintain an environment independent of the external space.

[0024] The load / unload device 10 also includes a transport robot 12 that takes in and out the substrate W from the front load section 11, and a traveling mechanism 13 that moves the transport robot 12 along the row of the front load section 11. The transport robot 12 has two hands, one above and one below, which are used before and after processing the substrate W. For example, the upper hand is used when returning the substrate W to the front load section 11, and the lower hand is used when removing the substrate W from the front load section 11 before processing. The load / unload device 10 and the substrate polishing apparatus 20 are separated by a partition wall inside the housing 2 and are normally closed by a shutter 2A. The shutter 2A is opened when the load / unload device 10 delivers the substrate W to the substrate polishing apparatus 20.

[0025] The substrate polishing apparatus 20 includes a plurality of polishing modules 21 (21A, 21B, 21C, 21D) for polishing (also referred to as grinding or planarizing) the substrate W. The plurality of polishing modules 21 (polishing apparatuses) are arranged in the longitudinal direction of the housing 2. The polishing module 21 includes a polishing table 23 for rotating a polishing pad 22 having a polishing surface, a top ring 24 for holding the substrate W and polishing the substrate W while pressing it against the polishing pad 22 on the polishing table 23, a polishing liquid supply nozzle 25 for supplying a polishing liquid or a dressing liquid (e.g., pure water) to the polishing pad 22, a dresser 26 for dressing the polishing surface of the polishing pad 22, and an atomizer 27 for spraying a mixed fluid of a liquid (e.g., pure water) and a gas (e.g., nitrogen gas) or a liquid (e.g., pure water) onto the polishing surface in the form of a mist.

[0026] The polishing module 21 presses the substrate W against the polishing pad 22 with the top ring 24 while supplying a polishing liquid onto the polishing pad 22 from the polishing liquid supply nozzle 25, and further moves the top ring 24 and the polishing table 23 relative to each other to polish the substrate W and flatten its surface. The dresser 26 has hard particles such as diamond particles and ceramic particles fixed to a rotating part at the tip that contacts the polishing pad 22, and uniformly dresses the entire polishing surface of the polishing pad 22 by rotating and oscillating the rotating part, thereby forming a flat polishing surface. The atomizer 27 washes away polishing debris and abrasive grains remaining on the polishing surface of the polishing pad 22 with a high-pressure fluid, thereby cleaning the polishing surface and performing a sharpening operation of the polishing surface by the dresser 26, which is a mechanical contact, i.e., regenerating the polishing surface.

[0027] The substrate polishing apparatus 20 further includes a transfer robot 28, a first exchanger 29a, and a second exchanger 29b. In the substrate polishing apparatus 20, a first transfer position TP1, a second transfer position TP2, a third transfer position TP3, and a fourth transfer position TP4 are set in order from the load / unload device 10 along the arrangement of the polishing modules 21. The first transfer position TP1, the second transfer position TP2, the third transfer position TP3, and the fourth transfer position TP4 are positions for transferring the substrate W to the polishing module 21A, the polishing module 21B, the polishing module 21C, and the polishing module 21D, respectively. Each polishing module 21 accesses the first transfer position TP1, the second transfer position TP2, the third transfer position TP3, and the fourth transfer position TP4 by rotating the arm of the top ring 24.

[0028] The transport robot 28 transfers the substrate W between the first exchanger 29a and the second exchanger 29b. The transport robot 28 includes a hand for holding the substrate W, an inversion mechanism for inverting the hand upside down, an extendable arm for supporting the hand, an arm up-down movement mechanism for moving the arm up and down, and an arm rotation mechanism for rotating the arm around an axis extending in the vertical direction. The transport robot 28 can move between the second transport position TP2 and the third transport position TP3, and distributes the substrate W received from the load / unload device 10 to the first exchanger 29a or the second exchanger 29b. The transport robot 28 also receives the substrate W polished in the polishing module 21 from the first exchanger 29a or the second exchanger 29b, and transfers it to the substrate cleaning device 30.

[0029] The first exchanger 29a is a mechanism for transporting the substrate W between the first transport position TP1 and the second transport position TP2. The first exchanger 29a includes a plurality of slide stages for supporting the substrate W, a stage moving mechanism for moving each slide stage horizontally at different heights, a first pusher disposed at the first transport position TP1, a second pusher disposed at the second transport position TP2, and the like. Each slide stage has a substantially U-shaped notch through which the first pusher and the second pusher can pass vertically, and is moved between the first transport position TP1 and the second transport position TP2 by the stage moving mechanism. The first pusher moves vertically at the first transport position TP1 to transfer the substrate W between the slide stage and the top ring 24 of the polishing module 21A. The second pusher moves vertically at the second transport position TP2 to transfer the substrate W between the slide stage and the top ring 24 of the polishing module 21B.

[0030] The second exchanger 29b is a mechanism for transporting the substrate W between the third transfer position TP3 and the fourth transfer position TP4. The second exchanger 29b includes a plurality of slide stages for supporting the substrate W, a stage moving mechanism for moving each slide stage horizontally at different heights, a third pusher disposed at the third transfer position TP3, a fourth pusher disposed at the fourth transfer position TP4, and the like. Each slide stage has a substantially U-shaped notch through which the third pusher and the fourth pusher can pass vertically, and is moved between the third transfer position TP3 and the fourth transfer position TP4 by the stage moving mechanism. The third pusher moves vertically at the third transfer position TP3 to transfer the substrate W between the slide stage and the top ring 24 of the polishing module 21C. The fourth pusher moves vertically at the fourth transfer position TP4 to transfer the substrate W between the slide stage and the top ring 24 of the polishing module 21D.

[0031] The substrate cleaning apparatus 30 includes a cleaning unit 31, a drying unit 32, and a touch-up cleaning unit 40 (additional cleaning unit). The cleaning unit 31, the drying unit 32, and the touch-up cleaning unit 40 are arranged in the longitudinal direction of the housing 2. The cleaning unit 31 is disposed adjacent to the transfer chamber 33. The transfer chamber 33 is provided with a stage on which the substrate W handed over from the transfer robot 28 is placed. The substrate cleaning apparatus 30 also includes a substrate transport mechanism (not shown) that picks up the substrate W placed on the stage in the transfer chamber 33 and transports the substrate W to the cleaning unit 31, the drying unit 32, and the touch-up cleaning unit 40.

[0032] The cleaning section 31 includes a plurality of cleaning modules 31A and 31B for cleaning the substrate W. The cleaning module 31A is disposed adjacent to the transfer chamber 33 and performs primary cleaning of the substrate W (cleaning process). The cleaning module 31B is disposed adjacent to the cleaning module 31A and performs secondary cleaning of the substrate W (cleaning process). The cleaning modules 31A and 31B may be of the same type or different types, such as a cleaning module equipped with a roll-type or pencil-type substrate cleaning member, or a cleaning module equipped with a two-fluid jet nozzle of a two-fluid jet type that ejects gas and gas. Alternatively, the cleaning module may be a non-contact cleaning module that utilizes ultrasonic waves, Marangoni convection, or the like.

[0033] The drying section 32 is arranged adjacent to the cleaning module 31B and includes a drying module that performs, for example, Rotagoni drying (IPA (Iso-Propyl Alcohol) drying). The touch-up cleaning section 40 is arranged adjacent to the drying section 32. The configuration of the touch-up cleaning section 40 will be described later. After processing by the touch-up cleaning section 40, a shutter 2B provided in a partition between the touch-up cleaning section 40 and the load / unload device 10 is opened, and the substrate W is removed from the touch-up cleaning section 40 by the transport robot 12.

[0034] Fig. 2 is a block diagram of the touch-up cleaning section 40 according to the first embodiment. Fig. 3 is a schematic diagram of the foreign matter removal section 42 included in the touch-up cleaning section 40 according to the first embodiment. As shown in these figures, the touch-up cleaning unit 40 includes a foreign matter position identifying unit 41 and a foreign matter removal unit 42. The foreign matter position identifying unit 41 identifies the position of foreign matter X remaining on the substrate W after cleaning by the cleaning unit 31 (in this embodiment, after drying by the drying unit 32) (foreign matter position identifying step). The foreign matter position identifying unit 41 approaches the foreign matter identified position identified by the foreign matter position identifying unit 41 and locally removes the foreign matter X (foreign matter removal step).

[0035] A dark-field inspection device or other particle monitors can be used as the foreign object position identifying unit 41. It is preferable to adopt a system for identifying the presence or absence of a foreign object X and its position accurately without being influenced by the ability of an inspector. For example, the foreign object position identifying unit 41 may be a system for detecting only the foreign object X by irradiating the surface of the substrate W with a laser beam and optically removing the influence of the reflected light from the surface of the substrate W. Also, for example, the foreign object position identifying unit 41 may be a system for irradiating the surface of the substrate W with a laser beam to scan the surface, receiving the light reflected or scattered from the surface of the substrate W with a plurality of light receiving systems having different light receiving angles, and detecting the foreign object X present on the surface of the substrate W based on the light receiving intensity ratio in the plurality of light receiving systems.

[0036] The foreign matter position identifying section 41 stores the detection result related to the presence or absence of foreign matter X remaining on the substrate W and its position in a memory (not shown). The detection result of the foreign matter position identifying section 41 may be stored in the memory of the control device 3 shown in FIG. 1. Then, the foreign matter removing section 42 performs touch-up cleaning based on the detection result. The touch-up cleaning referred to here is a short-time process, which locally (partially) cleans the substrate W. Considering that a normal cleaning process usually takes about one minute per substrate W, the short-time process referred to here may be, for example, a process for removing one foreign matter X in about 0.8 to 5 seconds for a substrate W having several tens of foreign matters X. The foreign matter position identifying section 41 approaches the foreign matter identified position (for example, foreign matter identified positions P1 to P8 shown in FIG. 3) identified by the foreign matter position identifying section 41 and locally removes the foreign matter X. The foreign matter identified positions P1 to P8 are identified, for example, by a biaxial orthogonal coordinate system of X-axis and Y-axis set on the surface of the substrate W.

[0037] As shown in FIG. 3, the foreign matter removal unit 42 includes a tape member 50 that removes foreign matter X, and a pressing device 60 that presses the tape member 50 against foreign matter identification positions P1 to P8. The tape member 50 includes, for example, a strip-shaped base material and an adhesive layer provided on the surface of the base material. The tape member 50 may be any material capable of removing foreign matter X from the substrate W, and may be capable of physical adsorption using adhesion, bonding, intermolecular force (van der Waals force), etc., or chemical adsorption using electronic bonding force, etc., or may be capable of composite adsorption by combining these. At least a part of the tape member 50 of this embodiment is formed from, for example, PVA (polyvinyl alcohol), etc., and has thermoplasticity that softens at a predetermined temperature.

[0038] The foreign matter removal unit 42 includes a supply reel 51 that supplies the tape member 50, and a recovery reel 52 that recovers the tape member 50. One end of the tape member 50 is wound in a roll around the supply reel 51. The other end of the tape member 50 is wound in a roll around the recovery reel 52. The supply reel 51 and the recovery reel 52 are linked, and when the recovery reel 52 takes up the tape member 50, the supply reel 51 unwinds the tape member 50. The tape member 50 including the supply reel 51 and the recovery reel 52 can be moved in the vertical direction (perpendicular to the surface of the substrate W) and the horizontal direction (planar direction along the surface of the substrate W) by a moving device (not shown).

[0039] The pressing device 60 is disposed on the opposite side of the substrate W across the tape member 50, and presses the tape member 50 from the opposite side against the foreign object identification positions P1 to P8. The pressing device 60 is also movable in the vertical direction (perpendicular to the surface of the substrate W) and the horizontal direction (planar direction along the surface of the substrate W) by a moving device (not shown). The pressing surface (lower end surface) of the pressing device 60 may be larger than the size of the foreign object X, the position of which has been identified on the substrate W, and is preferably equal to or smaller than the die size (approximately a few millimeters square).

[0040] The pressing device 60 of this embodiment is provided with a heating device 61, as shown in Figs. 4 to 6 described below. The heating device 61 is disposed in the vicinity of the pressing surface of the pressing device 60, and is capable of heating the tape member 50 via the pressing surface of the pressing device 60. An example of the heating device 61 is a heater that generates heat when supplied with electricity, but a method of heating by supplying and circulating a heat medium (water, oil, etc.) may also be used.

[0041] Next, the operation of the foreign matter removing unit 42 configured as above will be described with reference to FIGS. 4 to 6 are explanatory diagrams for explaining the operation of the foreign matter removing unit 42 according to the first embodiment. In the following operation, the foreign matter removal unit 42 removes the foreign matter X while the substrate W is placed stationary. The substrate W is placed stationary on a table, stage, suction chuck, or the like (not shown).

[0042] 4(a), the foreign matter removal unit 42 approaches a foreign matter identification position (e.g., foreign matter identification position P1) identified by the foreign matter position identifying unit 41. At this time, the tape member 50 including the supply reel 51 and the recovery reel 52, and the pressing device 60 are moved to directly above the foreign matter identification position P1. If the tape member 50 is large enough to cover the entire substrate W, only the pressing device 60 may be moved to directly above the foreign matter identification position P1.

[0043] Next, as shown in FIG. 4(b), the foreign matter removal unit 42 uses the pressing device 60 to press the tape member 50 against the foreign matter identification position P1. If the tape member 50 has an adhesive layer on the substrate W side, the foreign matter X can be physically adsorbed by the adhesive layer. In this manner, in this embodiment, the foreign matter X is locally adsorbed without cleaning the entire substrate W, so that the foreign matter X can be reduced while suppressing re-contamination such as in a cleaning process. Note that in this embodiment, in order to reliably remove the foreign matter X, it is advisable to perform the process shown in FIG. 5(a) in addition to or instead of adhesion by the adhesive layer.

[0044] 5(a), a heating device 61 heats the tape member 50 pressed against the foreign object identification position P1. The tape member 50 has thermoplastic properties and softens when heated, and deforms so as to encase the foreign object X. Thereafter, when heating by the heating device 61 is stopped, the tape member 50 hardens by natural cooling, and the shape is fixed while holding the foreign matter X. In this state, when the pressing device 60 is lifted up as shown in FIG. 5(b), the foreign matter X adsorbed to the tape member 50 can be separated from the substrate W.

[0045] 6, the portion of the tape member 50 pressed against the foreign object identification position P1 is wound up by the recovery reel 52, and the portion of the tape member 50 not pressed against the foreign object identification position P1 is paid out by the supply reel 51 to the position A1 facing the pressing device 60. This makes it possible to use the adhesive layer of a new tape member 50 to go and remove the foreign object X at the next foreign object identification position P2. The order of removal of the foreign matter X may be in order of coordinates (e.g., in the order of the foreign matter identification positions P1 to P8 shown in FIG. 3), in order of size of the foreign matter X, or in order determined by AI (artificial intelligence) (e.g., in the order that maximizes the efficiency of removal of the foreign matter X).

[0046] As described above, the substrate cleaning apparatus 30 according to this embodiment includes a cleaning unit 31 that cleans the substrate W, a foreign matter position identifying unit 41 that identifies the position of foreign matter X remaining on the substrate W after cleaning by the cleaning unit 31, and a foreign matter removal unit 42 that approaches the foreign matter identified position (e.g., foreign matter identified position P1) identified by the foreign matter position identifying unit 41 and locally removes the foreign matter X. This configuration makes it possible to suppress recontamination in the cleaning process and reduce the amount of foreign matter X remaining on the substrate W.

[0047] Moreover, in this embodiment, the foreign matter removal unit 42 includes a tape member 50 that removes foreign matter X, and a pressing device 60 that presses the tape member 50 against the foreign matter identification position P1. With this configuration, the foreign matter X remaining on the substrate W can be locally removed by physical adsorption.

[0048] Moreover, in this embodiment, the foreign matter removal unit 42 includes a supply reel 51 that supplies the tape member 50, and a recovery reel 52 that recovers the tape member 50. According to this configuration, the tape member 50 can be held compactly while ensuring the area of ​​the adhesive layer of the tape member 50.

[0049] Furthermore, in this embodiment, the recovery reel 52 takes up the portion of the tape member 50 pressed against the foreign object identification position P1, and the supply reel 51 pays out the portion of the tape member 50 that is not pressed against the foreign object identification position P1 to the position A1 facing the pressing device 60. With this configuration, after the foreign object X is adsorbed onto the tape member 50, a new surface from which the next foreign object X is to be removed can be exposed.

[0050] In this embodiment, the tape member 50 has thermoplastic properties, and the foreign matter removal unit 42 includes a heating device 61 that heats the tape member 50 while it is pressed against the foreign matter identification position P1. With this configuration, the tape member 50 is softened by heating and deformed to encase the foreign matter X, so that the foreign matter X can be removed more reliably.

[0051] Moreover, in this embodiment, the heating device 61 is provided in the pressing device 60. With this configuration, it becomes easier to heat the tape member 50 in a state where it is pressed against the foreign object identification position P1.

[0052] Furthermore, in this embodiment, the foreign matter removal unit 42 removes the foreign matter X while leaving the substrate W stationary. With this configuration, the substrate W does not move during processing, making it easy to position the tape member 50 and the pressing device 60 at the foreign matter identification position (e.g., foreign matter identification position P1).

[0053] Furthermore, in this embodiment, the cleaning section 31 includes a plurality of cleaning modules 31A, 31B that clean the substrate W, and the foreign matter position identifying section 41 identifies the position of the foreign matter X remaining on the substrate W after cleaning by the plurality of cleaning modules 31A, 31B. With this configuration, the foreign matter X remaining on the substrate W can be removed after the final cleaning, so that the amount of foreign matter X remaining on the substrate W can be reduced compared to the conventional method.

[0054] Furthermore, in this embodiment, the cleaning section 31 includes a plurality of cleaning modules 31A, 31B that clean the substrate W, and a drying section 32 (drying module) that dries the substrate W after cleaning by the plurality of cleaning modules 31A, 31B, and the foreign matter position identifying section 41 identifies the position of foreign matter X remaining on the substrate W after drying by the drying section 32. With this configuration, foreign matter X remaining on the substrate W after drying can be removed, so that the foreign matter removing section 42 is less susceptible to the influence of the cleaning liquid (the influence of wetting, etc.).

[0055] Moreover, the substrate processing apparatus 1 according to this embodiment includes a substrate polishing apparatus 20 that polishes the substrate W, and a substrate cleaning apparatus 30 that cleans the substrate W. This configuration can suppress recontamination in the cleaning process and reduce the amount of foreign matter X remaining on the substrate W.

[0056] Moreover, the substrate cleaning method according to this embodiment includes a cleaning step of cleaning the substrate W, a foreign matter position identifying step of identifying the position of a foreign matter X remaining on the substrate W after cleaning in the cleaning step, and a foreign matter removal step of approaching the foreign matter identified position identified in the foreign matter position identifying step and locally removing the foreign matter X. This method can suppress recontamination in the cleaning process and reduce the amount of foreign matter X remaining on the substrate W.

[0057] Second embodiment Next, a second embodiment of the present invention will be described. In the following description, the same or equivalent configurations as those in the above-described embodiment are given the same reference numerals, and the description thereof will be simplified or omitted.

[0058] FIG. 7 is a schematic diagram of a foreign matter removal section 42 included in a touch-up cleaning section 40 according to the second embodiment. As shown in FIG. 7, the foreign substance removal section 42 according to the second embodiment includes a tape member 50 for removing foreign substance X, and a pressing device 60 for pressing the tape member 50 against foreign substance identification positions P1 to P8.

[0059] The tape member 50 of the second embodiment is provided on the pressing surface (lower end surface) of the pressing device 60. The pressing device 60 is movable in the vertical direction (the direction perpendicular to the surface of the substrate W) and the horizontal direction (the planar direction along the surface of the substrate W) by a moving device (not shown). Although not shown in Fig. 7, the pressing device 60 of the second embodiment may also be provided with the heating device 61 shown in Figs. 4 to 6.

[0060] According to the second embodiment having the above configuration, by using the pressing device 60 to press the tape member 50 against a foreign matter identification position (e.g., foreign matter identification position P1), recontamination during the cleaning process can be suppressed and the amount of foreign matter X remaining on the substrate W can be reduced, as in the first embodiment.

[0061] Third embodiment Next, a third embodiment of the present invention will be described. In the following description, the same or equivalent configurations as those in the above-described embodiment are given the same reference numerals, and the description thereof will be simplified or omitted.

[0062] FIG. 8 is a schematic diagram of a foreign matter removal section 42 included in a touch-up cleaning section 40 according to the third embodiment. As shown in FIG. 8, the foreign matter removal unit 42 according to the third embodiment includes a nozzle member 70 that removes foreign matter X by suction.

[0063] The nozzle member 70 includes an ejection flow path 71 that ejects a fluid toward the surface of the substrate W, and a suction flow path 72 that sucks in the fluid supplied to the surface of the substrate W together with foreign matter X. The ejection flow path 71 is formed in a plurality of tubular shapes or in a ring shape around the suction flow path 72. There is one suction flow path 72, but there may be multiple suction flow paths 72. The fluid ejected from the nozzle member 70 is not particularly limited as long as it is a clean fluid that does not recontaminate the substrate W. The nozzle member 70 is movable in a vertical direction (perpendicular to the surface of the substrate W) and a horizontal direction (planar direction along the surface of the substrate W) by a moving device (not shown).

[0064] According to the third embodiment having the above configuration, by bringing the nozzle member 70 close to a foreign matter identification position (e.g., foreign matter identification position P1) and ejecting a fluid, the fluid is sucked in together with the foreign matter X, thereby suppressing recontamination during the cleaning process and reducing the amount of foreign matter X remaining on the substrate W, as in the first and second embodiments.

[0065] (Fourth embodiment) Next, a fourth embodiment of the present invention will be described. In the following description, the same or equivalent configurations as those in the above-described embodiment are given the same reference numerals, and the description thereof will be simplified or omitted.

[0066] FIG. 9 is a block diagram of a touch-up cleaning unit 40 according to the fourth embodiment. As shown in FIG. 9, the touch-up cleaning section 40 according to the fourth embodiment includes a regenerating device 43 that removes the foreign matter X attached to the tape member 50 described above.

[0067] The regeneration device 43 has, for example, an injection device that sprays a mixed fluid of liquid (e.g., pure water) and gas (e.g., nitrogen gas) or liquid (e.g., pure water) in the form of a mist onto the adhesive surface of the tape member 50, similar to the atomizer 27 of the substrate polishing device 20 shown in FIG. 1. This makes it possible to remove the foreign matter X attached to the adhesive surface of the tape member 50 and regenerate the adhesive surface. If the tape member 50 is water-soluble and softens when wet, the foreign matter X can be easily removed by softening it with the spray of liquid. If the tape member 50 is thermoplastic, a separate heating device may be provided or the liquid to be sprayed may be heated to soften the tape member 50 and make it easier to remove the foreign matter X. Furthermore, if a thermosetting resin tape is used as the tape member 50, the tape member 50 may be pressed against the foreign matter X, and then the portion may be locally heated with infrared rays or the like to harden the resin and trap the foreign matter X, making it easier to remove the foreign matter X.

[0068] According to the fourth embodiment having the above configuration, a recycling device 43 is provided that cleans the tape member 50 and removes foreign matter X adhering to the tape member 50. According to this configuration, the tape member 50 can be recycled and reused, thereby suppressing waste of resources.

[0069] Although preferred embodiments of the present invention have been described and illustrated above, it should be understood that these are illustrative of the present invention and should not be considered as limiting. Additions, omissions, substitutions, and other modifications can be made without departing from the scope of the present invention. Thus, the present invention should not be considered as limited by the foregoing description, but rather by the scope of the claims.

[0070] For example, in the above embodiment, it has been described that the touch-up cleaning unit 40 performs cleaning after drying by the drying unit 32, but the touch-up cleaning unit 40 may perform cleaning after cleaning by the cleaning unit 31 and before drying by the drying unit 32. Also, the touch-up cleaning unit 40 may perform cleaning during the cleaning process by the cleaning unit 31 (for example, between cleaning modules 31A and 31B). In addition, in the case where the tape member 50 is water-soluble and becomes soft when wetted with a cleaning liquid, the effect of the cleaning liquid can be used in reverse to soften the tape member 50 and deform it so as to encase the foreign matter X, thereby more reliably removing the foreign matter X. [Explanation of symbols]

[0071] 1...substrate processing apparatus, 2...housing, 2A...shutter, 2B...shutter, 3...control device, 10...unload device, 11...front load section, 12...transport robot, 13...traveling mechanism, 20...substrate polishing apparatus, 21...polishing module, 21A...polishing module, 21B...polishing module, 21C...polishing module, 21D...polishing module, 22...polishing pad, 23...polishing table, 24...top ring, 25...polishing liquid supply nozzle, 26...dresser, 27...atomizer, 28...transport robot, 29a...first exchanger, 29b...second exchanger JA, 30...substrate cleaning device, 31...cleaning section, 31A...cleaning module, 31B...cleaning module, 32...drying section, 33...transport chamber, 40...touch-up cleaning section, 41...foreign matter position identifying section, 42...foreign matter removal section, 43...recycling device, 50...tape member, 51...supply reel, 52...recovery reel, 60...pressing device, 61...heating device, 70...nozzle member, 71...ejection flow path, 72...suction flow path, A1...opposing position, P1-P8...foreign matter identifying position, TP1...first transport position, TP2...second transport position, TP3...third transport position, TP4...fourth transport position, W...substrate, X...foreign matter

Claims

1. a cleaning unit for cleaning the substrate; a foreign matter position identifying unit that identifies a position of a foreign matter remaining on the substrate after cleaning by the cleaning unit; a foreign object removal unit that approaches the foreign object identification position identified by the foreign object position identification unit and locally removes the foreign object. Substrate cleaning equipment.

2. The foreign matter removal unit includes: A tape member for removing the foreign matter; a pressing device that presses the tape member against the foreign object identification position, The substrate cleaning apparatus according to claim 1 .

3. The foreign matter removal unit includes: a supply reel for supplying the tape member; and a recovery reel for recovering the tape member. The substrate cleaning apparatus according to claim 2 .

4. the recovery reel winds up the portion of the tape member that was pressed against the foreign object identification position, the supply reel unwinds a portion of the tape member that is not pressed against the foreign object identification position to a position facing the pressing device. The substrate cleaning apparatus according to claim 3 .

5. The tape member has thermoplastic properties, the foreign substance removal unit includes a heating device that heats the tape member in a state where the tape member is pressed against the foreign substance identification position. The substrate cleaning apparatus according to any one of claims 2 to 4.

6. The heating device is provided in the pressing device. The substrate cleaning apparatus according to claim 5 .

7. a regenerating device that cleans the tape member and removes the foreign matter adhering to the tape member; The substrate cleaning apparatus according to any one of claims 2 to 4.

8. the foreign matter removal unit removes the foreign matter while the substrate is placed stationary. The substrate cleaning apparatus according to any one of claims 1 to 4.

9. the cleaning unit includes a plurality of cleaning modules for cleaning the substrate; the foreign matter position identifying unit identifies a position of the foreign matter remaining on the substrate after cleaning by the plurality of cleaning modules. The substrate cleaning apparatus according to any one of claims 1 to 4.

10. The cleaning unit includes: a plurality of cleaning modules for cleaning the substrate; a drying module that dries the substrate after cleaning by the plurality of cleaning modules, the foreign matter position identifying unit identifies a position of the foreign matter remaining on the substrate after drying by the drying module. The substrate cleaning apparatus according to any one of claims 1 to 4.

11. a substrate polishing apparatus for polishing a substrate; and a substrate cleaning apparatus according to any one of claims 1 to 4 for cleaning the substrate. Substrate processing equipment.

12. a cleaning step of cleaning the substrate; a foreign matter position identifying step of identifying a position of a foreign matter remaining on the substrate after cleaning in the cleaning step; a foreign object removal step of approaching the foreign object identified position identified by the foreign object position identifying step and locally removing the foreign object. A method for cleaning a substrate.

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