Substrate processing apparatus and method of use thereof

Abstract

To provide a technique that can suppress the occurrence of problems caused by air bubbles contained in a treatment liquid.SOLUTION: A substrate processing apparatus 1 includes a main pipe 20, a flow sensor 35, a flow control device 30, a bubble sensor 40, a first supply pipe 21, a second supply pipe 22, opening and closing devices 50, 51, and a control device 70. When the control device determines that the processing liquid contains bubbles on the basis of detection by the bubble sensor, it executes substrate processing stop control by controlling the opening and closing device to close the first supply pipe, thereby stopping the supply of the processing liquid to the substrate, and then executes flow increase control by controlling the opening and closing device to open the second supply pipe for a preset specified time, and by controlling the flow control device on the basis of detection by the flow sensor 35, thereby increasing the flow rate of the processing liquid passing through the main pipe.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a substrate processing apparatus and a method of using the substrate processing apparatus. [Background technology]

[0002] Conventionally, a substrate processing apparatus for processing a substrate is known (see, for example, Patent Document 1). Specifically, Patent Document 1 discloses a substrate processing apparatus that cleans a substrate by supplying a processing liquid, such as a cleaning liquid, to the substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2019-106424 A Summary of the Invention [Problem to be solved by the invention]

[0004] In the conventional substrate processing apparatus, the processing liquid supplied to the substrate may contain air bubbles, which may cause problems such as malfunction of a flow sensor or other device that detects the flow rate of the processing liquid supplied to the substrate, or adversely affect the processing of the substrate.

[0005] The present invention has been made in consideration of the above, and has an object to provide a technique capable of suppressing the occurrence of problems caused by air bubbles contained in a treatment liquid. [Means for solving the problem]

[0006] (Aspect 1) In order to achieve the above object, a substrate processing apparatus according to one aspect of the present invention includes a main pipe through which a processing liquid for processing a substrate passes, a flow rate sensor that detects a flow rate of the processing liquid passing through the main pipe, a flow rate adjustment device that adjusts the flow rate of the processing liquid passing through the main pipe, an air bubble sensor that detects the presence of air bubbles in the processing liquid upstream of the flow rate sensor and the flow rate adjustment device in the main pipe, a first supply pipe that supplies the processing liquid that has passed through the main pipe to the substrate, a second supply pipe that supplies the processing liquid that has passed through the main pipe to a predetermined location other than the substrate, and The system is equipped with an opening / closing device which selectively opens and closes a first supply pipe and the second supply pipe, and a control device, and when the control device determines that the processing liquid contains bubbles based on detection by the bubble sensor, the control device executes substrate processing stop control by controlling the opening / closing device to close the first supply pipe to stop the supply of the processing liquid to the substrate, and then executes flow rate increase control by controlling the opening / closing device to open the second supply pipe for a preset specified time, and controlling the flow rate adjustment device based on detection by the flow rate sensor to increase the flow rate of the processing liquid passing through the main pipe.

[0007] According to this configuration, when air bubbles are contained in the processing liquid upstream of the flow sensor and flow control device in the main piping, substrate processing stop control and flow rate increase control are executed, thereby preventing problems such as malfunctions of equipment such as the flow sensor or adverse effects on substrate processing due to air bubbles contained in the processing liquid.

[0008] (Aspect 2) In the above-mentioned aspect 1, the control device repeatedly executes the flow rate increase control until it is determined that the treatment liquid does not contain the air bubbles based on the detection of the air bubble sensor, When it is determined that the processing liquid does not contain bubbles, a substrate processing restart control may be executed in which the opening and closing device is controlled to close the second supply pipe and open the first supply pipe, thereby restarting the supply of the processing liquid to the substrate.

[0009] (Aspect 3) The above-mentioned first aspect further includes a discharge / circulation pipe that discharges the processing liquid that has passed the bubble sensor outside the substrate processing apparatus without allowing it to flow into the flow sensor and the flow rate control device, or circulates it to the upstream side of the bubble sensor in the main pipe, and the opening / closing device further selectively opens and closes the discharge / circulation pipe, and if the control device determines, based on the detection of the bubble sensor, that the processing liquid contains bubbles despite having performed the flow rate increase control, the control device may perform discharge / circulation control by controlling the opening / closing device to open the discharge / circulation pipe for a predetermined period of time.

[0010] According to this configuration, if air bubbles are contained in the processing liquid despite the execution of the flow rate increase control, the discharge / circulation control is executed, thereby suppressing the occurrence of problems caused by air bubbles contained in the processing liquid.

[0011] (Aspect 4) In the above aspect 3, the control device may further execute the flow rate increase control when, after executing the discharge / circulation control, it is determined that the treatment liquid does not contain air bubbles based on detection by the air bubble sensor.

[0012] (Aspect 5) The above-mentioned first aspect further includes a bubble size detection device that detects the size of the bubbles contained in the processing liquid upstream of the flow rate sensor and the flow rate adjustment device in the main pipe, and a discharge / circulation pipe that discharges the processing liquid that has passed the bubble sensor to the outside of the substrate processing apparatus without flowing into the flow rate sensor and the flow rate adjustment device, or circulates the processing liquid upstream of the bubble sensor in the main pipe, wherein the opening / closing device further selectively opens and closes the discharge / circulation pipe, and when it is determined that the processing liquid contains bubbles based on the detection of the bubble sensor, the control device determines whether the size of the bubbles contained in the processing liquid is equal to or smaller than a reference value based on the detection of the bubble size detection device, and if the size of the bubbles is equal to or smaller than the reference value, executes the substrate processing stop control and the flow rate increase control, and if the size of the bubbles is larger than the reference value, In this case, the substrate processing stop control may be executed, and then the discharge / circulation control may be executed for controlling the opening / closing device to open the discharge / circulation piping for a preset predetermined time, or the substrate processing stop control may be executed, and then the flow rate increase control may be executed, and then, if it is determined based on detection by the air bubble sensor that the processing liquid contains air bubbles despite the execution of the flow rate increase control, the discharge / circulation control may be executed, or the substrate processing stop control may be executed, and then the flow rate increase control may be executed, and then, if it is determined based on detection by the air bubble sensor that the processing liquid contains air bubbles despite the execution of the flow rate increase control, the discharge / circulation control may be executed, and then, after the execution of the discharge / circulation control, if it is determined based on detection by the air bubble sensor that the processing liquid does not contain air bubbles, the flow rate increase control may be further executed.

[0013] (Aspect 6) In order to achieve the above object, a method of using a substrate processing apparatus according to one aspect of the present invention includes a substrate processing apparatus having a main pipe through which a processing liquid for processing a substrate passes, a flow rate sensor that detects a flow rate of the processing liquid passing through the main pipe, a flow rate adjustment device that adjusts the flow rate of the processing liquid passing through the main pipe, and an air bubble sensor that detects air bubbles in the processing liquid upstream of the flow rate sensor and the flow rate adjustment device in the main pipe. The method includes, when it is determined that the processing liquid contains bubbles based on detection by the bubble sensor, stopping the supply of the processing liquid to the substrate, and then supplying the processing liquid that has passed through the main piping to a predetermined location other than the substrate for a preset specified time, while increasing the flow rate of the processing liquid passing through the main piping based on detection by the flow rate sensor.

[0014] According to this configuration, when air bubbles are contained in the processing liquid upstream of the flow sensor and flow control device in the main piping, substrate processing stop control and flow rate increase control are executed, thereby preventing problems such as malfunctions of equipment such as the flow sensor or adverse effects on substrate processing due to air bubbles contained in the processing liquid. [Brief description of the drawings]

[0015] [Figure 1] FIG. 1 is a schematic diagram showing a configuration of a substrate processing apparatus according to an embodiment; [Diagram 2] Fig. 2(A) is a schematic front view showing a region near the downstream end of a first supply pipe according to the embodiment, and Fig. 2(B) is a schematic front view showing a region near the downstream end of a second supply pipe according to the embodiment. [Diagram 3] 5 is an example of a flowchart for explaining a control process according to the embodiment. [Figure 4] 13 is an example of a flowchart for explaining a control process according to a first modified example of the embodiment. [Diagram 5] 11 is an example of a flowchart for explaining a control process according to a second modified example of the embodiment. [Figure 6] 13 is an example of a flowchart for explaining a control process according to a third modified example of the embodiment. [Figure 7] 13 is an example of a flowchart for explaining a control process according to a fourth modified example of the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] Hereinafter, embodiments and modifications of the present invention will be described with reference to the drawings. The drawings are illustrated diagrammatically to facilitate understanding of the features, and the dimensional ratios of the components are not necessarily the same as those in reality. In addition, some drawings show XYZ orthogonal coordinates for reference. In this orthogonal coordinate, the Z direction corresponds to the upward direction, and the -Z direction corresponds to the downward direction (the direction in which gravity acts). In this embodiment, "upstream" and "downstream" respectively mean the upstream and downstream in the direction in which the fluid flows.

[0017] 1 is a schematic diagram showing the configuration of a substrate processing apparatus 1 according to this embodiment. The substrate processing apparatus 1 according to this embodiment is an apparatus for processing a substrate Wf by supplying a processing liquid Lq to the substrate Wf.

[0018] As long as the substrate processing apparatus 1 has such a function, the specific type of the substrate processing apparatus 1 is not particularly limited, but as an example, the substrate processing apparatus 1 according to the present embodiment is a cleaning processing apparatus configured to perform a cleaning process on the substrate Wf with a processing liquid Lq such as a cleaning liquid. In this case, the processing liquid Lq (cleaning liquid) may be water (including pure water), alcohol (e.g., isopropyl alcohol (IPA)), or other liquid.

[0019] Further, the specific type of the substrate Wf is not particularly limited, but in this embodiment, a semiconductor substrate is used as a specific example of the substrate Wf.

[0020] The substrate processing apparatus 1 illustrated in FIG. 1 includes a processing liquid supplying device 10, a main pipe 20, a first supply pipe 21, a second supply pipe 22, a flow rate adjusting device 30, a flow rate sensor 35, an air bubble sensor 40, a first opening / closing device 50, a second opening / closing device 51, and a control device 70. In addition, as illustrated in FIG. 1, the substrate processing apparatus 1 may further include a discharge pipe 23, a circulation pipe 24, a third opening and closing device 52a, a third opening and closing device 52a, a fifth opening and closing device 53, a recovery device 60, and a bubble size detection device 45.

[0021] The control device 70 is a device for controlling the substrate processing apparatus 1. The control device 70 according to the present embodiment includes, as an example, a microcomputer. The microcomputer includes a processor 71, a storage device 72 as a non-transitory storage medium, and the like. In the control device 70, the processor 71 operates based on commands of a program stored in the storage device 72 to control the operation of the substrate processing apparatus 1.

[0022] The processing liquid supplying apparatus 10 is an apparatus for supplying a processing liquid Lq for processing the substrate Wf. Although the specific configuration of the processing liquid supplying apparatus 10 is not particularly limited, the processing liquid supplying apparatus 10 according to the present embodiment includes, as an example, a reservoir tank for temporarily storing the processing liquid Lq, a supply pump configured to pressure-feed the processing liquid Lq from the reservoir tank to the main pipe 20, and the like.

[0023] The main pipe 20 is a main pipe through which the processing liquid Lq passes. The first supply pipe 21 is a pipe for supplying the processing liquid Lq that has passed through the main pipe 20 to the substrate Wf. The second supply pipe 22 is a pipe for supplying the processing liquid Lq that has passed through the main pipe 20 to "a predetermined location P1 other than the substrate Wf."

[0024] Specifically, the first supply pipe 21 and the second supply pipe 22 according to this embodiment are connected to a location in the main pipe 20 downstream of the flow rate control device 30. More specifically, the first supply pipe 21 and the second supply pipe 22 are connected to the downstream end of the main pipe 20.

[0025] The number of the first supply pipes 21 and the second supply pipes 22 is not limited to one. For example, the substrate processing apparatus 1 may have a plurality of the first supply pipes 21 and may have a plurality of the second supply pipes 22.

[0026] 2(A) is a schematic front view showing a region near the downstream end of the first supply pipe 21. FIG. 2(B) is a schematic front view showing a region near the downstream end of the second supply pipe 22. As illustrated in FIG. 2(A), a nozzle 25a may be disposed at the downstream end of the first supply pipe 21. In this case, the processing liquid Lq that has passed through the first supply pipe 21 is discharged from the nozzle 25a toward the substrate Wf. Also, as illustrated in FIG. 2(B), a nozzle 25b may be disposed at the downstream end of the second supply pipe 22. In this case, the processing liquid Lq that has passed through the second supply pipe 22 is discharged from the nozzle 25b toward a predetermined position P1.

[0027] Note that the specific example of the predetermined location P1 is not particularly limited as long as it is a location other than the substrate Wf. As a specific example, the predetermined location P1 may be a plate member (which is not a semiconductor substrate) that is cleaned by the processing liquid Lq that has passed through the second supply pipe 22.

[0028] 1, the flow rate sensor 35 is disposed in the main pipe 20. The flow rate sensor 35 detects the flow rate (ml / sec) of the treatment liquid Lq passing through the main pipe 20, and transmits the detection result to the control device 70.

[0029] The flow rate control device 30 is disposed in the main pipe 20. The flow rate control device 30 is configured to adjust the flow rate (ml / sec) of the treatment liquid Lq passing through the main pipe 20. The specific configuration of the flow rate control device 30 is not particularly limited as long as it has such a function, but the flow rate control device 30 according to this embodiment includes a flow rate adjustment valve, as an example. Note that in this embodiment, the operation of the flow rate control device 30 is controlled by the control device 70. It is under control.

[0030] The flow rate control device 30 according to this embodiment is configured to be able to adjust the flow rate of the treatment liquid Lq to any value between a lower limit value and an upper limit value. However, the configuration of the flow rate control device 30 is not limited to this, and for example, the flow rate control device 30 may be configured to switch the flow rate between a lower limit value and an upper limit value.

[0031] 1, the flow rate control device 30 is disposed downstream of the flow rate sensor 35 in the main pipe 20, but is not limited to this configuration. The flow rate control device 30 may be disposed upstream of the flow rate sensor 35 in the main pipe 20.

[0032] The air bubble sensor 40 is a sensor for detecting air bubbles contained in the treatment liquid Lq. Specifically, the air bubble sensor 40 according to this embodiment is disposed at a location upstream of the flow rate sensor 35 and the flow rate control device 30 in the main pipe 20, detects the presence of air bubbles in the treatment liquid Lq at this location, and transmits the detection result to the control device 70. The specific type of the air bubble sensor 40 is not particularly limited, and known sensors such as a photoelectric air bubble sensor, a capacitance air bubble sensor, and an ultrasonic air bubble sensor can be used.

[0033] The bubble size detector 45 is a device for detecting the size (mm) of bubbles contained in the treatment liquid Lq. Specifically, the bubble size detector 45 according to this embodiment is disposed at a location upstream of the flow rate sensor 35 and the flow rate control device 30 in the main pipe 20, detects the size (specifically, diameter) of bubbles contained in the treatment liquid Lq at this location, and transmits the detection result to the control device 70. The specific configuration of the bubble size detector 45 is not particularly limited, and any known detection device capable of detecting the size of bubbles can be used.

[0034] There are various possible reasons why bubbles are contained in the processing liquid Lq. For example, bubbles may be generated in the processing liquid Lq when the processing liquid Lq becomes hot as the substrate processing is performed. Alternatively, air may be mixed into the processing liquid Lq and become bubbles. Alternatively, when the processing liquid Lq contains minute impurities or foreign matter, the impurities or foreign matter may be the cause of the generation of bubbles.

[0035] The first opening and closing device 50 is disposed on the first supply pipe 21, and is configured to open and close the first supply pipe 21 upon receiving an instruction from the control device 70. The specific configuration of the first opening and closing device 50 is not particularly limited, and for example, an opening and closing valve or the like can be used. When the first opening and closing device 50 opens the first supply pipe 21, the treatment liquid Lq can pass through the first supply pipe 21. On the other hand, when the first opening and closing device 50 closes the first supply pipe 21, the passage of the treatment liquid Lq through the first supply pipe 21 is stopped.

[0036] The second opening and closing device 51 is disposed on the second supply pipe 22, and is configured to open and close the second supply pipe 22 upon receiving an instruction from the control device 70. The specific configuration of the second opening and closing device 51 is not particularly limited, and for example, an opening and closing valve or the like can be used. When the second opening and closing device 51 is opened to open the second supply pipe 22, the processing liquid Lq can pass through the second supply pipe 22. On the other hand, when the second opening and closing device 51 is closed to close the second supply pipe 22, the passage of the processing liquid Lq through the second supply pipe 22 is stopped.

[0037] The first opening and closing device 50 and the second opening and closing device 51 are an example of an “opening and closing device” that selectively opens and closes the first supply pipe 21 and the second supply pipe 22.

[0038] The discharge pipe 23 is a pipe for discharging the processing liquid Lq that has passed through the air bubble sensor 40 to the outside P2 of the substrate processing apparatus 1 without allowing the processing liquid Lq to flow into the flow rate sensor 35 or the flow rate adjustment device 30. Specifically, the exhaust pipe 23 in this embodiment is, as an example, connected to a location in the main pipe 20 downstream of the bubble sensor 40 (in this embodiment, further downstream of the bubble size detection device 45) and upstream of the flow sensor 35 and the flow control device 30.

[0039] The treatment liquid Lq discharged to the outside P2 may thereafter be discarded or may be recovered and, for example, reused.

[0040] The circulation pipe 24 is a pipe for circulating the treatment liquid Lq, which has passed through the air bubble sensor 40, to the upstream side of the air bubble sensor 40 in the main pipe 20 without allowing it to flow into the flow sensor 35 and the flow rate control device 30. Specifically, the circulation pipe 24 according to the present embodiment communicates, for example, between a midpoint of the discharge pipe 23 and the treatment liquid supply device 10.

[0041] The exhaust pipe 23 and the circulation pipe 24 are an example of the "exhaust-circulation pipe".

[0042] The third opening and closing device 52a is disposed in the discharge pipe 23, and is configured to open and close the discharge pipe 23 upon receiving an instruction from the control device 70. The fourth opening and closing device 52b is disposed in a location downstream of the connection point of the discharge pipe 23 to the circulation pipe 24. The specific configurations of the third opening and closing device 52a and the fourth opening and closing device 52b are not particularly limited, and for example, an opening and closing valve or the like can be used.

[0043] When the third opening and closing device 52a and the fourth opening and closing device 52b are opened to open the discharge pipe 23, the treatment liquid Lq can pass through the discharge pipe 23. On the other hand, when the third opening and closing device 52a and the fourth opening and closing device 52b are closed to close the discharge pipe 23 (in this case, the circulation pipe 24 is also closed), the passage of the treatment liquid Lq through the discharge pipe 23 is stopped. Also, when the third opening and closing device 52a is opened and the fourth opening and closing device 52b is closed, the treatment liquid Lq can pass through the circulation pipe 24 without being discharged to the outside P2. That is, in this case, the circulation pipe 24 is opened.

[0044] The third opening and closing device 52a and the fourth opening and closing device 52b are also examples of the "opening and closing device".

[0045] The fifth opening and closing device 53 is disposed downstream of the air bubble sensor 40 in the main pipe 20 (in this embodiment, further downstream of the air bubble size detection device 45), upstream of the flow sensor 35 and the flow rate adjustment device 30, and downstream of the connection point of the discharge pipe 23 to the main pipe 20. The specific configuration of the fifth opening and closing device 53 is not particularly limited, and for example, an opening and closing valve or the like can be used. When the fifth opening and closing device 53 is opened, the treatment liquid Lq that has passed through the air bubble sensor 40 can pass through the flow sensor 35 and the flow rate adjustment device 30. On the other hand, when the fifth opening and closing device 53 is closed, the treatment liquid Lq that has passed through the air bubble sensor 40 cannot pass through the flow sensor 35 and the flow rate adjustment device 30. The fifth opening and closing device 53 is also an example of an "opening and closing device".

[0046] The recovery device 60 is a device for recovering the processing liquid Lq after it has been supplied to the substrate Wf or the predetermined location P1, and returning it to the processing liquid supplying device 10. Although the specific configuration of the recovery device 60 is not particularly limited, the recovery device 60 according to the present embodiment includes, as an example, a recovery container 61 for recovering the processing liquid Lq, a recovery pipe 62 that connects the recovery container 61 with the processing liquid supplying device 10, and a recovery pump 63 arranged in the recovery pipe 62.

[0047] The substrate processing apparatus 1 may be configured without the recovery device 60.

[0048] 3 is an example of a flowchart for explaining a control process of the substrate processing apparatus 1 according to the present embodiment (or a method of using the substrate processing apparatus 1). Specifically, the processor 71 of the control device 70 executes the process based on a program. At the initial start of the flowchart in Fig. 3, the first opening and closing device 50 and the fifth opening and closing device 53 are open, and the second opening and closing device 51, the third opening and closing device 52a, and the fourth opening and closing device 52b are closed, so that the processing liquid Lq is supplied to the substrate Wf through the main pipe 20 and the first supply pipe 21 (i.e., in this case, substrate processing is being performed using the processing liquid Lq).

[0049] First, the control device 70 determines whether or not air bubbles are contained in the treatment liquid Lq based on the detection result of the air bubble sensor 40 (step S10). Step S10 is repeatedly executed until it is determined that air bubbles are contained in the treatment liquid Lq.

[0050] If it is determined in step S10 that the processing liquid Lq contains air bubbles (i.e., if the air bubble sensor 40 detects that the processing liquid Lq contains air bubbles), the control device 70 executes "substrate processing stop control" to stop the substrate processing (step S20). Specifically, in step S20, the control device 70 controls the first opening / closing device 50 to close, thereby closing the first supply pipe 21, thereby stopping the supply of the processing liquid Lq to the substrate Wf.

[0051] By executing step S20, it is possible to prevent the processing liquid Lq containing air bubbles from being supplied to devices such as the flow sensor 35 (specifically, sensor devices) and the substrate Wf.

[0052] Next, the control device 70 executes "flow rate increase control" (step S30). Specifically, in the flow rate increase control in step S30, the control device 70 controls the second opening and closing device 51 to open for a preset predetermined time (sec) to open the second supply pipe 22, and controls the flow rate adjustment device 30 based on the detection result of the flow rate sensor 35 to increase the flow rate of the processing liquid Lq passing through the main pipe 20. As a result, the processing liquid Lq passing through the main pipe 20 is supplied to the predetermined location P1 with its flow rate increased for the predetermined time (in this case, the processing liquid Lq is not supplied to the substrate Wf).

[0053] By executing this flow rate increase control, for example, air inside the main pipe 20 can be pushed out, and therefore air bubbles in the treatment liquid Lq can be removed or reduced. Note that this flow rate increase control is particularly effective when the size of the air bubbles contained in the treatment liquid Lq is relatively small.

[0054] In step S30, the amount of increase in the flow rate of the treatment liquid Lq is not particularly limited, but as a numerical example, it is preferable that the increase be at least twice the normal flow rate, more preferably at least four times, even more preferably at least six times, more preferably at least eight times, and even more preferably at least ten times.

[0055] As an example, the control device 70 according to this embodiment makes the flow rate of the processing liquid Lq 10 times or more higher than normal in step S30. To give a specific numerical example, the flow rate of the processing liquid Lq in normal times is 100 (ml / sec), whereas the flow rate of the processing liquid Lq during execution of step S30 is 1000 (ml / sec). Note that the "flow rate in normal times" specifically refers to the flow rate of the processing liquid Lq passing through the main pipe 20 before step S30 is executed (more specifically, before step S20 is executed).

[0056] The specific value of the predetermined time, which is the execution time of step S30, is not particularly limited, but the longer the predetermined time, the greater the degree to which air bubbles contained in the processing liquid Lq are removed. On the other hand, the longer the predetermined time, the longer the time until the processing of the substrate Wf with the processing liquid Lq can be resumed. Taking these points into consideration, an appropriate predetermined time is appropriately determined and the control is performed. The information may be stored in the storage device 72 of the control device 70.

[0057] During execution of the flow rate increase control in step S30, the control device 70 determines whether or not air bubbles are contained in the treatment liquid Lq based on the detection result of the air bubble sensor 40 (step S40). Specifically, the control device 70 according to the present embodiment monitors the detection result of the air bubble sensor 40 from the start to the end of execution of the flow rate increase control in step S30.

[0058] If it is determined in step S40 that the treatment liquid Lq contains air bubbles (i.e., if the treatment liquid Lq contains air bubbles despite the execution of the flow rate increase control), the control device 70 executes the flow rate increase control again (step S30). That is, step S30 according to the present embodiment is repeatedly executed until it is determined based on the detection of the air bubble sensor 40 that the treatment liquid Lq does not contain air bubbles.

[0059] On the other hand, if it is not determined in step S40 that the processing liquid Lq contains air bubbles (i.e., if no air bubbles are contained), the control device 70 executes "substrate processing restart control" to restart the substrate processing (step S50). Specifically, the control device 70 controls the flow rate adjustment device 30 to return the flow rate of the processing liquid Lq passing through the main pipe 20 to a normal flow rate (e.g., 100 ml / sec), closes the second opening and closing device 51, and opens the first opening and closing device 50. As a result, the processing liquid Lq passes through the main pipe 20 and the first supply pipe 21 and is supplied to the substrate Wf at the normal flow rate.

[0060] Note that step S50 may be performed immediately if it is determined in step S40 that the treatment liquid Lq does not contain any air bubbles, or step S50 may be performed after waiting for the predetermined time of step S30 to elapse if it is determined in step S40 that the treatment liquid Lq does not contain any air bubbles and the predetermined time has not yet elapsed.

[0061] According to the present embodiment as described above, when air bubbles are contained in the processing liquid Lq upstream of the flow rate sensor 35 and the flow rate control device 30 in the main piping 20, substrate processing stop control and flow rate increase control are executed, thereby preventing problems caused by air bubbles contained in the processing liquid Lq, such as malfunction of equipment such as the flow rate sensor 35 or adverse effects on the processing of the substrate Wf.

[0062] (Variation 1) Fig. 4 is an example of a flowchart for explaining the control process according to Modification 1 of the embodiment. The flowchart in Fig. 4 differs from the flowchart in Fig. 3 in the process carried out when it is determined in step S40 that air bubbles are contained in the treatment liquid Lq.

[0063] Specifically, when it is determined in step S40 that the treatment liquid Lq contains air bubbles (i.e., when the treatment liquid Lq contains air bubbles despite the execution of the flow rate increase control), the control device 70 in this modified example executes "discharge / circulation control" (step S60).

[0064] Specifically, in step S60, the control device 70 according to this modified example controls the third opening / closing device 52a and the fourth opening / closing device 52b to open the "discharge / circulation piping (discharge piping 23 or circulation piping 24)" for a predetermined period of time.

[0065] More specifically, in step S60, the control device 70 opens the third opening / closing device 52a and the fourth opening / closing device 52b for a preset predetermined time period and opens the discharge pipe 23, thereby introducing the treatment liquid Lq that has passed through the air bubble sensor 40 into the discharge pipe 23. Alternatively, The control device 70 opens the third opening / closing device 52a, closes the fourth opening / closing device 52b, and opens the circulation pipe 24 for a predetermined period of time, thereby introducing the treatment liquid Lq that has passed through the air bubble sensor 40 into the circulation pipe 24.

[0066] Furthermore, when performing step S60, it is preferable that the control device 70 closes the first opening and closing device 50, the second opening and closing device 51, and the fifth opening and closing device 53. Furthermore, the flow rate of the treatment liquid Lq in the main pipe 20 when performing step S60 may be a normal value, or may be increased or decreased compared to normal.

[0067] By executing step S60, the processing liquid Lq that has passed through the air bubble sensor 40 can be discharged to the outside P2 of the substrate processing apparatus 1 through the discharge pipe 23, or can be circulated to the upstream side of the air bubble sensor 40 in the main pipe 20 through the circulation pipe 24. This makes it possible to prevent the processing liquid Lq containing air bubbles from flowing into devices such as the flow sensor 35 or being supplied to the substrate Wf. As a result, it is possible to effectively prevent the occurrence of problems caused by air bubbles contained in the processing liquid Lq.

[0068] Although the specific value of the predetermined time, which is the execution time of step S60, is not particularly limited, the longer the predetermined time, the longer the time until the processing of the substrate Wf with the processing liquid Lq is resumed. Taking this into consideration, an appropriate time can be set as appropriate and stored in the storage device 72 of the control device 70. The predetermined time of step S60 may be the same value as the predetermined time of step S30, or may be a different value.

[0069] During the execution of the discharge and circulation control in step S60, the control device 70 determines whether or not air bubbles are contained in the treatment liquid Lq based on the detection result of the air bubble sensor 40 (step S70). Specifically, in this case, the control device 70 may monitor the detection result of the air bubble sensor 40 from the start to the end of the discharge and circulation control in step S60.

[0070] If it is not determined in step S70 that the processing liquid Lq contains air bubbles (i.e., if no air bubbles are contained), the control device 70 executes "substrate processing restart control" to restart the substrate processing (step S80). Specifically, the control device 70 controls the flow rate adjustment device 30 to set the flow rate of the processing liquid Lq passing through the main pipe 20 to the normal flow rate, closes the third opening and closing device 52a and the fourth opening and closing device 52b, closes the second opening and closing device 51, opens the fifth opening and closing device 53, and opens the first opening and closing device 50. As a result, the processing liquid Lq passes through the main pipe 20 and the first supply pipe 21 and is supplied to the substrate Wf at the normal flow rate.

[0071] Note that step S80 may be executed immediately when it is determined in step S70 that the treatment liquid Lq does not contain any air bubbles, or step S80 may be executed after waiting for the predetermined time of step S60 to elapse if it is determined in step S70 that the treatment liquid Lq does not contain any air bubbles and the predetermined time has not yet elapsed.

[0072] According to this modified example as described above, if air bubbles are contained in the treatment liquid Lq despite the execution of the flow rate increase control in step S30, the discharge / circulation control in step S60 is further executed, thereby suppressing the occurrence of problems caused by air bubbles contained in the treatment liquid Lq.

[0073] (Variation 2) 5 is an example of a flowchart for explaining a control process according to the second modification of the embodiment. The flowchart in FIG. 5 shows a process in which it is determined in step S70 that the treatment liquid Lq does not contain any air bubbles. The processing contents when this determination is made are different from those in the flowchart of FIG.

[0074] Specifically, the control device 70 of this modified example further executes the flow rate increase control of step S30 after performing the discharge / circulation control of step S60 and determining in step S70 that the treatment liquid Lq does not contain any air bubbles.

[0075] According to this modification, it is possible to effectively prevent problems caused by air bubbles contained in the treatment liquid Lq.

[0076] (Variation 3) Fig. 6 is an example of a flowchart for explaining a control process according to Modification 3 of the embodiment. The flowchart in Fig. 6 differs from the flowchart in Fig. 4 in that steps S30, S40, and S50 are not executed.

[0077] Specifically, the control device 70 according to this modification executes the discharge / circulation control in step S60 after executing step S20.

[0078] In this modified example, step S60 is also performed, so that the occurrence of problems caused by air bubbles contained in the treatment liquid Lq can be suppressed.

[0079] (Variation 4) Fig. 7 is an example of a flowchart for explaining a control process according to Modification 4 of the embodiment. The flowchart in Fig. 7 differs from the flowchart in Fig. 4 in that steps S15, S100, and S110 are executed after step S10 is executed.

[0080] Specifically, when the control device 70 of this modified example determines in step S10 that the treatment liquid Lq contains air bubbles, in step S15, based on the detection result of the bubble size detection device 45, determines whether the size of the air bubbles contained in the treatment liquid Lq is equal to or smaller than a preset reference value.

[0081] The reference value for this bubble size (e.g., bubble diameter (mm)) can be set to an appropriate value by conducting experiments in advance and stored in the memory device 72 of the control device 70 (i.e., learned).

[0082] A specific example of this is as follows. First, a processing liquid Lq containing air bubbles of a variety of sizes is prepared. Then, the above-described flow rate increase control is executed using this prepared processing liquid Lq to investigate the size of the air bubbles that will disappear if the flow rate increase control is executed. Then, based on the results of this investigation, a "reference value for air bubble size" is obtained that determines whether the flow rate increase control should be executed or the above-described discharge / circulation control should be executed in order to remove the air bubbles contained in the processing liquid Lq. Then, this obtained reference value is stored in the storage device 72.

[0083] If it is determined in step S15 that the size of the air bubbles is equal to or smaller than the reference value (i.e., if the size of the air bubbles is relatively small), the controller 70 executes steps S20 to S50 in Fig. 3 described above (step S100). That is, in step S100, the controller 70 executes at least substrate processing stop control and flow rate increase control.

[0084] On the other hand, if it is determined in step S15 that the size of the air bubbles is larger than the reference value (i.e., if the size of the air bubbles is relatively large), the control device 70 performs steps S20 to S30 in FIG. In step S110, the controller 70 executes at least the substrate processing stop control and the discharge / circulation control.

[0085] 4. That is, in step S110, the controller 70 at least executes substrate processing stop control and flow rate increase control, and if air bubbles are still contained in the processing liquid Lq even after executing the flow rate increase control, further executes discharge and circulation control.

[0086] Alternatively, in step S110, the controller 70 may execute steps S20 to S70 in Fig. 5. That is, in step S110, the controller 70 executes at least the substrate processing stop control and the flow rate increase control, and if air bubbles are still contained in the processing liquid Lq even after execution of the flow rate increase control, executes the discharge / circulation control, and if air bubbles are no longer contained in the processing liquid Lq as a result of the discharge / circulation control, executes the flow rate increase control again.

[0087] In this modified example as well, it is possible to suppress the occurrence of problems caused by air bubbles contained in the treatment liquid Lq.

[0088] Although the embodiments and modifications of the present invention have been described in detail above, the present invention is not limited to such specific embodiments and modifications, and various modifications and variations are possible within the scope of the present invention described in the claims. [Explanation of symbols]

[0089] 1. Substrate Processing Equipment 20 Main piping 21 1st supply piping 22 2nd supply piping 23 Discharge piping ("discharge / circulation piping") 24 Circulation piping (“discharge / circulation piping”) 30 Flow rate adjustment device 35 Flow Sensor 40 Air bubble sensor 45 Bubble size detector 50 First switchgear 51 Second switchgear 52a Third switchgear 52b 4th switchgear 53 5th switchgear 70 Control device Lq Processing liquid P1 designated location P2 external Wf substrate

Claims

1. a main pipe through which a processing liquid for processing the substrate passes; a flow rate sensor for detecting a flow rate of the treatment liquid passing through the main pipe; a flow rate adjusting device for adjusting a flow rate of the treatment liquid passing through the main pipe; an air bubble sensor that detects air bubbles contained in the treatment liquid upstream of the flow rate sensor and the flow rate control device in the main pipe; a first supply pipe that supplies the processing liquid that has passed through the main pipe to the substrate; a second supply pipe that supplies the processing liquid that has passed through the main pipe to a predetermined location other than the substrate; an opening and closing device that selectively opens and closes the first supply pipe and the second supply pipe; A control device, when it is determined that the processing liquid contains bubbles based on the detection by the air bubble sensor, the control device executes a substrate processing stop control, in which the control device controls the opening and closing device to close the first supply pipe to stop the supply of the processing liquid to the substrate; Next, the substrate processing apparatus executes a flow rate increase control by controlling the opening and closing device to open the second supply pipe for a preset specified time, and controlling the flow rate control device based on detection by the flow rate sensor to increase the flow rate of the processing liquid passing through the main pipe.

2. the control device repeatedly executes the flow rate increase control until it is determined that the treatment liquid does not contain air bubbles based on the detection by the air bubble sensor; 2. The substrate processing apparatus of claim 1, further comprising: a substrate processing restart control that, when it is determined that the processing liquid does not contain bubbles, controls the opening and closing device to close the second supply pipe and open the first supply pipe to restart the supply of the processing liquid to the substrate.

3. a discharge / circulation pipe for discharging the processing liquid that has passed through the air bubble sensor to the outside of the substrate processing apparatus without allowing the processing liquid to flow into the flow rate sensor and the flow rate control device, or for circulating the processing liquid to a portion upstream of the air bubble sensor in the main pipe, The opening and closing device further selectively opens and closes the exhaust and circulation pipes, 2. The substrate processing apparatus of claim 1, wherein when the control device determines based on detection of the bubble sensor that the processing liquid contains bubbles despite having executed the flow rate increase control, the control device executes discharge / circulation control by controlling the opening / closing device to open the discharge / circulation piping for a preset predetermined time.

4. 4. The substrate processing apparatus of claim 3, wherein the control device further performs the flow rate increase control when, after performing the discharge / circulation control, it is determined that the processing liquid does not contain bubbles based on detection by the bubble sensor.

5. a bubble size detection device for detecting the size of the bubbles contained in the treatment liquid on an upstream side of the flow rate sensor and the flow rate control device in the main pipe; a discharge / circulation pipe for discharging the processing liquid that has passed through the air bubble sensor to the outside of the substrate processing apparatus without allowing the processing liquid to flow into the flow rate sensor and the flow rate adjustment device, or for circulating the processing liquid to a portion of the main pipe upstream of the air bubble sensor, The opening and closing device further selectively opens and closes the exhaust and circulation pipes, The control device includes: when it is determined that the treatment liquid contains bubbles based on the detection by the bubble sensor, it is determined whether or not the size of the bubbles contained in the treatment liquid is equal to or smaller than a reference value based on the detection by the bubble size detection device; When the size of the bubble is equal to or smaller than the reference value, the substrate processing stop control and the flow rate increase control are executed. If the size of the air bubbles is larger than the reference value, Executing the substrate processing stop control, and then executing discharge / circulation control for opening the discharge / circulation pipe by controlling the opening / closing device for a preset predetermined time, or executing the substrate processing stop control, then executing the flow rate increase control, and then, if it is determined based on the detection of the air bubble sensor that the processing liquid contains air bubbles despite the execution of the flow rate increase control, executing the discharge and circulation control; or 2. The substrate processing apparatus of claim 1, further comprising: executing the substrate processing stop control, then executing the flow rate increase control, and then, if it is determined based on detection by the bubble sensor that the processing liquid contains bubbles despite the execution of the flow rate increase control, executing the discharge / circulation control, and then, after executing the discharge / circulation control, further executing the flow rate increase control if it is determined based on detection by the bubble sensor that the processing liquid does not contain bubbles.

6. A method of using a substrate processing apparatus having a main pipe through which a processing liquid for processing a substrate passes, a flow rate sensor that detects a flow rate of the processing liquid passing through the main pipe, a flow rate adjustment device that adjusts a flow rate of the processing liquid passing through the main pipe, and an air bubble sensor that detects air bubbles contained in the processing liquid upstream of the flow rate sensor and the flow rate adjustment device in the main pipe, comprising: when it is determined that the processing liquid contains air bubbles based on the detection by the air bubble sensor, stopping the supply of the processing liquid to the substrate; Next, the processing liquid that has passed through the main piping is supplied to a predetermined location other than the substrate for a preset predetermined time, while increasing a flow rate of the processing liquid passing through the main piping based on detection by the flow sensor.

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