Head chip, liquid jet head, liquid jet recording device, and head chip manufacturing method

Abstract

To provide a head chip, a liquid jet head, a liquid jet recording device, and a head chip manufacturing method, capable of suppressing through-holes from being blocked by an adhesive while improving yield.SOLUTION: A head chip according to an aspect of the present disclosure includes: a first plate having a surface on which first wiring is formed; and a second plate bonded to the surface. The second plate is formed with a first recess opening in the first surface and a second recess opening in the second surface. The second recess includes a first inner surface portion extending in a thickness direction on an inner side with respect to the inner surface of the first recess when viewed in the thickness direction, and a second inner surface portion extending a thickness direction on an outer side with respect to the inner surface of the first recess. The second plate is formed with second wiring that penetrates the second plate through the first inner surface portion and the inner surface of the first recess and that connects the first wiring and external wiring provided on the first side of the second plate in the thickness direction.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present disclosure relates to a head chip, a liquid jet head, a liquid jet recording apparatus, and a method for manufacturing the head chip. [Background technology]

[0002] An inkjet head ejects ink onto a recording medium through a head chip. The head chip includes an actuator plate in which ejection channels are formed, and a cover plate overlaid on the actuator plate (see, for example, Patent Documents 1 and 2 below). The cover plate has a through hole formed therein that functions as a through hole. The through hole can be formed by sandblasting or etching. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2023-091543 A [Patent Document 2] JP 2018-122551 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, when the actuator plate and the cover plate are bonded together with an adhesive, the through-holes may be blocked with the adhesive, making it difficult to ensure electrical continuity between the wiring on the actuator plate side and the wiring on the cover plate side when forming a film of electrode material on the inner surface of the through-hole after the actuator plate and the cover plate are bonded together.

[0005] The present disclosure provides a head chip, a liquid jet head, a liquid jet recording apparatus, and a method for manufacturing a head chip that ensures electrical continuity between wiring on an actuator plate side and wiring on a cover plate side and can improve yields. [Means for solving the problem]

[0006] In order to solve the above problems, the present disclosure employs the following aspects. (1) A head chip according to one aspect of the present disclosure includes a first plate having first wiring corresponding to a pressure chamber in which liquid is accommodated formed on a surface facing a first side in a thickness direction, and a second plate bonded onto the surface, the second plate having a first recess opening on a first surface facing the first side in the thickness direction, and a second recess opening on a second surface facing a second side opposite to the first side in the thickness direction and communicating with the first recess, the second recess being located within a dimensional range of the first recess as viewed in the thickness direction, The second plate is provided with a first inner surface portion which extends in the thickness direction continuously with respect to the inner surface of the first recess or which extends in the thickness direction on the inside of the inner surface of the first recess, and a second inner surface portion which extends in the thickness direction on the outside of the inner surface of the first recess at a position different from the first inner surface portion when viewed from the thickness direction, and a second wiring is formed on the second plate which penetrates the second plate through the first inner surface portion and the inner surface of the first recess, and which connects between the first wiring and an external wiring provided on a first side of the second plate in the thickness direction.

[0007] According to this aspect, when the first wiring is formed through the first opening that opens onto the first surface of the first recess, the wiring can be easily formed continuously over the first inner surface portion and the inner surface of the first recess. In addition, a portion (outer protrusion) of the second recess is formed that is located outward from the first recess when viewed in the thickness direction. Therefore, when bonding the first plate and the second plate together, the outer protrusion functions as an adhesive reservoir. That is, the adhesive can be stored in a portion other than the communicating portion between the first recess and the second recess. This makes it possible to prevent the electrical continuity between the first wiring and the second wiring from being blocked by the adhesive, and to ensure the stability of the electrical continuity between the first wiring and the second wiring. As a result, the yield can be improved.

[0008] (2) In the head chip according to aspect (1) above, it is preferable that an opening area of ​​the second recess on the second surface is larger than an opening area of ​​the first recess on the first surface. According to this aspect, it becomes easier to ensure the volume of the outward protruding portion as an adhesive reservoir, and the stability of the electrical connection between the first wiring and the second wiring can be improved.

[0009] (3) In the head chip according to the above aspect (1) or (2), it is preferable that the first recesses are provided in a plurality of spaces spaced apart in a first direction intersecting the thickness direction, and the second recesses are provided in a plurality of spaces corresponding to the plurality of first recesses. According to this aspect, the first recess and the second recess are formed to correspond to each other, so that, for example, in a case where there are multiple second wirings, it is easier to ensure stable conduction compared to a case where adjacent second wirings are formed in the same first recess and second recess.

[0010] (4) In the head chip according to the above aspect (1) or (2), the first recesses are provided at intervals in a first direction intersecting the thickness direction, the second recesses extend in the first direction so as to straddle at least two adjacent first recesses among the plurality of first recesses, and the first inner surface portion extends in the thickness direction continuously with respect to the inner surface of the first recess in a second direction intersecting the first direction as viewed from the thickness direction, or extends in the thickness direction on the inside of the inner surface of the first recess, and the second inner surface portion extends in the thickness direction on the outside of the first direction with respect to the inner surface of the first recess among the inner surfaces of the second recess. According to this aspect, it is only necessary to provide one second recess for at least two adjacent first recesses among the multiple first recesses, which improves the manufacturing efficiency of the second recesses compared to the case where second recesses are separately formed corresponding to each first recess.

[0011] (5) In a head chip according to any one of aspects (1) to (4) above, the head chip preferably comprises an actuator plate having a drive unit arranged facing the pressure chamber and capable of deforming so as to expand or contract the pressure chamber, and a common electrode and individual electrodes formed on the actuator plate to generate an electric field in the actuator plate and deform the actuator plate, and the first wiring preferably includes a common outgoing wiring connected to the common electrode and an individual outgoing wiring connected to the individual electrodes. According to this aspect, it is easy to route the wires from the common electrode and the individual electrodes to the external wiring.

[0012] (6) In the head chip relating to the above aspect (5), it is preferable that the second wiring includes a common through wiring connected to the common outgoing wiring and an individual through wiring connected to the individual outgoing wiring, and that the common through wiring and the individual through wiring are formed independently of each other on the inner surfaces of one of the first recesses and one of the second recesses that are connected to each other. According to this aspect, the common wiring and the individual wiring are formed through the first recess and the second recess that communicate with each other, so that the number of the first recess and the second recess can be reduced compared to the case where separate first recess and second recess are formed for each common wiring and each individual wiring, which improves the degree of freedom in design, narrows the pitch of the pressure chambers, and reduces the size of the head chip. In addition, the opening area of ​​the first opening can be easily secured compared to the case where separate first and second recesses are formed for the common through wiring and the individual through wiring, so that the electrode material can be effectively introduced into the first and second recesses, improving the yield.

[0013] (7) In the head chip relating to the above aspect (5), it is preferable that the second wiring includes a common through wiring connected to the common outgoing wiring and an individual through wiring connected to the individual outgoing wiring, the second recess includes a common recess communicating with one of the first recesses and an individual recess communicating with the one first recess while being separated from the common recess by a partition wall, the common through wiring is formed across the inner surfaces of the one first recess and the common recess, and the individual through wiring is formed across the inner surfaces of the one first recess and the individual recess. According to this aspect, it is easier to ensure the opening area of ​​the first opening compared to the case where separate first and second recesses are formed for the common through wiring and the individual through wiring. In addition, since the second recess is partitioned by a partition wall, the area of ​​the first plate exposed through the second recess can be reduced. Therefore, it is possible to prevent different types of wiring from being connected to each other on the surface of the first plate.

[0014] (8) In a head chip according to any one of aspects (1) to (7) above, it is preferable that the first recess is tapered such that an inner diameter decreases toward a second side in the thickness direction, and the dimension of the first recess in the thickness direction is greater than the dimension of the second recess in the thickness direction. According to this aspect, when the first wiring is formed through the first opening of the first recess on the first surface by oblique deposition, for example, it is easy to form the wiring continuously over the first inner surface portion and the inner surface of the first recess, which results in a reduction in the cost of the head chip.

[0015] (9) In a head chip according to any one of aspects (1) to (7) above, it is preferable that the first recess is tapered such that an inner diameter gradually decreases toward a second side in the thickness direction, and the dimension of the first recess in the thickness direction is smaller than the dimension of the second recess in the thickness direction. According to this aspect, when the first recess is formed by sandblasting or the like, the inner diameter is tapered so that it gradually decreases from the first opening to a predetermined range in the thickness direction, but once the predetermined range is exceeded, the inner diameter may expand once and then decrease again. In this case, a constricted portion is formed in the middle of the thickness direction in the first recess. The constricted portion tends to be formed on the second side in the thickness direction as the inner diameter of the first opening increases. Therefore, in this embodiment, the thickness dimension of the first recess is made smaller than the thickness dimension of the second recess, thereby making it possible to reduce the inner diameter of the first opening, thereby improving design freedom, narrowing the pitch of the pressure chambers, and miniaturizing the head chip.

[0016] (10) A liquid jet head according to an aspect of the present disclosure preferably includes the head chip according to any one of the above aspects (1) to (9). According to this aspect, since the head chip according to the above aspect is included, a highly reliable liquid jet head can be provided.

[0017] (11) A liquid jet recording apparatus according to an aspect of the present disclosure preferably includes the liquid jet head according to aspect (10) above. According to this aspect, since the head chip according to the above aspect is included, a highly reliable liquid jet recording apparatus can be provided.

[0018] (12) A method for manufacturing a head chip according to one aspect of the present disclosure includes a first plate having a first wiring corresponding to a pressure chamber in which liquid is accommodated formed on a surface of the first plate facing a first side in a thickness direction, and a second plate having a first recess opening on a first surface facing the first side in the thickness direction and a second recess opening on a second surface facing a second side opposite to the first side in the thickness direction and communicating with the first recess, the method including the steps of: bonding the second plate to the surface of the first plate; and bonding the second plate to the first surface in the first recess. the wiring forming process includes forming a second wiring on an inner surface of the first recess and an inner surface of the second recess through an opening, the second wiring connecting an external wiring provided on a first side in the thickness direction of the second plate to the first wiring, the second recess being located within a dimensional range of the first recess as viewed from the thickness direction, and comprising a first inner surface portion which is continuous with the inner surface of the first recess and extends in the thickness direction or extends in the thickness direction on the inside of the inner surface of the first recess, and a second inner surface portion which is at a position different from the first inner surface portion as viewed from the thickness direction and extends in the thickness direction on the outside of the inner surface of the first recess.

[0019] (13) In the method for manufacturing a head chip relating to the above aspect (12), it is preferable that the first recess is formed by performing a sandblasting process from the first surface side, and the second recess is formed by performing a dicing process from the second surface side. According to this aspect, when the first recess is formed by sandblasting, the inner diameter is tapered so that it gradually decreases from the first opening to a predetermined range in the thickness direction, but once the predetermined range is exceeded, the inner diameter may expand once and then decrease again. In this case, a constricted portion is formed in the middle of the thickness direction in the first recess. The constricted portion tends to be formed on the second side in the thickness direction as the inner diameter of the first opening increases. Therefore, in this embodiment, the second recess is formed by dicing, so that the first recess and the second recess can penetrate the second plate while removing the constricted portion. Therefore, unlike the conventional case where the first recess is formed by sandblasting and then the second plate is ground to remove the constricted portion, the thickness of the second plate can be prevented from changing before and after processing. In other words, since the second plate can be processed while maintaining its thickness, the occurrence of cracks can be prevented and the handling property can be improved. As a result, the manufacturing efficiency can be improved. Effect of the Invention

[0020] According to one aspect of the present disclosure, electrical continuity between the wiring on the actuator plate side and the wiring on the cover plate side can be ensured, thereby improving yield. [Brief description of the drawings]

[0021] [Figure 1] 1 is a schematic configuration diagram of an inkjet printer according to a first embodiment. [Diagram 2] FIG. 2 is a schematic configuration diagram of an inkjet head and an ink circulation mechanism according to the first embodiment. [Diagram 3] FIG. 2 is an exploded perspective view of the head chip according to the first embodiment. [Figure 4] 4 is a cross-sectional view corresponding to line IV-IV in FIG. 3. [Diagram 5] 5 is a cross-sectional view corresponding to the line VV in FIG. [Figure 6] 6 is a cross-sectional view corresponding to the line VI-VI in FIG. 5. [Figure 7] 7 is a cross-sectional view corresponding to the line VII-VII in FIG. 5. [Figure 8] FIG. 4 is a bottom view of the actuator plate according to the first embodiment. [Figure 9] FIG. 2 is a plan view of the actuator plate according to the first embodiment. [Figure 10] FIG. 2 is a plan view of a cover plate according to the first embodiment. [Figure 11] 4 is a flowchart for explaining a method for manufacturing the head chip according to the first embodiment. [Figure 12] 2A to 2C are process diagrams illustrating a manufacturing method of the head chip according to the first embodiment. [Figure 13] 2A to 2C are process diagrams illustrating a manufacturing method of the head chip according to the first embodiment. [Figure 14] 2A to 2C are process diagrams illustrating a manufacturing method of the head chip according to the first embodiment. [Figure 15] 2A to 2C are process diagrams illustrating a manufacturing method of the head chip according to the first embodiment. [Figure 16] 2A to 2C are process diagrams illustrating a manufacturing method of the head chip according to the first embodiment. [Figure 17] 2A to 2C are process diagrams illustrating a manufacturing method of the head chip according to the first embodiment. [Figure 18] 2A to 2C are process diagrams illustrating a manufacturing method of the head chip according to the first embodiment. [Figure 19] 2A to 2C are process diagrams illustrating a manufacturing method of the head chip according to the first embodiment. [Figure 20] 2A to 2C are process diagrams illustrating a manufacturing method of the head chip according to the first embodiment. [Figure 21] 2A to 2C are process diagrams illustrating a manufacturing method of the head chip according to the first embodiment. [Figure 22] 2A to 2C are process diagrams illustrating a manufacturing method of the head chip according to the first embodiment. [Figure 23] 2A to 2C are process diagrams illustrating a manufacturing method of the head chip according to the first embodiment. [Figure 24] FIG. 11 is a cross-sectional view of a head chip according to a second embodiment. [Diagram 25] FIG. 11 is a cross-sectional view of a head chip according to a third embodiment. [Figure 26] FIG. 11 is a cross-sectional view of a head chip according to a fourth embodiment. [Figure 27] FIG. 11 is a cross-sectional view of a head chip according to a fourth embodiment. [Figure 28] FIG. 13 is an enlarged plan view of an actuator plate according to a fourth embodiment. [Figure 29] FIG. 13 is an enlarged plan view of a cover plate according to a fourth embodiment. [Diagram 30] FIG. 13 is a cross-sectional view of a head chip according to a fifth embodiment. [Diagram 31] FIG. 13 is a cross-sectional view of a head chip according to a sixth embodiment. [Diagram 32] FIG. 13 is a cross-sectional view of a head chip according to a seventh embodiment. [Diagram 33] FIG. 13 is a cross-sectional view of a head chip according to a seventh embodiment. [Diagram 34] FIG. 13 is a cross-sectional view of a head chip according to a seventh embodiment. [Diagram 35] FIG. 13 is a plan view of a cover plate according to the seventh embodiment. [Diagram 36] FIG. 13 is a cross-sectional view of a head chip according to an eighth embodiment. [Figure 37] FIG. 13 is an exploded perspective view of a head chip according to a ninth embodiment. [Figure 38] 38 is a cross-sectional view corresponding to line XXXVIII-XXXVIII in FIG. 37. [Figure 39] 38 is a cross-sectional view corresponding to line XXXIX-XXXIX in FIG. 37. [Diagram 40] FIG. 11 is a cross-sectional view of a head chip according to a modified example. [Diagram 41] FIG. 11 is a cross-sectional view of a head chip according to a modified example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0022] Hereinafter, an embodiment according to the present disclosure will be described with reference to the drawings. In the embodiments and modified examples described below, the same reference numerals may be used to designate corresponding configurations, and the description may be omitted. In the following description, expressions indicating relative or absolute arrangements, such as "parallel," "orthogonal," "center," and "coaxial," not only strictly indicate such arrangements, but also indicate a state in which the components are relatively displaced with a tolerance or an angle or distance to the extent that the same function is obtained. In the following embodiment, an inkjet printer (hereinafter, simply referred to as a printer) that uses ink (liquid) to record on a recording medium will be taken as an example for description. In the drawings used in the following description, the scale of each component has been appropriately changed so that each component can be recognized.

[0023] (First embodiment) [Printer 1] FIG. 1 is a schematic diagram of a printer 1. A printer (liquid jet recording apparatus) 1 shown in FIG. 1 includes a pair of transport mechanisms 2 and 3, an ink tank 4, an inkjet head (liquid jet head) 5, an ink circulation mechanism 6, and a scanning mechanism .

[0024] In the following explanation, an X, Y, Z Cartesian coordinate system is used as necessary. In this case, the X direction coincides with the transport direction (sub-scanning direction) of the recording medium P (e.g., paper, etc.). The Y direction coincides with the scanning direction (main scanning direction) of the scanning mechanism 7. The Z direction indicates the height direction (gravity direction) perpendicular to the X and Y directions. In the following explanation, the X, Y, and Z directions will be explained with the arrows on the figures as the plus (+) side and the opposite side to the arrows as the minus (-) side. In this specification, the +Z side corresponds to the upward direction of gravity, and the -Z side corresponds to the downward direction of gravity.

[0025] The transport mechanisms 2 and 3 transport the recording medium P to the +X side. The transport mechanisms 2 and 3 each include a pair of rollers 11 and 12 extending in the Y direction, for example. The ink tanks 4 each contain ink of four colors, for example, yellow, magenta, cyan, and black. Each inkjet head 5 is configured to be capable of ejecting ink of one of the four colors, yellow, magenta, cyan, or black, according to the ink tank 4 connected thereto.

[0026] FIG. 2 is a schematic diagram of the ink-jet head 5 and the ink circulation mechanism 6. As shown in FIG. 1 and 2, the ink circulation mechanism 6 circulates ink between the ink tank 4 and the inkjet head 5. Specifically, the ink circulation mechanism 6 includes a circulation flow path 23 having an ink supply pipe 21 and an ink discharge pipe 22, a pressure pump 24 connected to the ink supply pipe 21, and a suction pump 25 connected to the ink discharge pipe 22.

[0027] The pressure pump 24 applies pressure to the inside of the ink supply pipe 21, and sends ink to the inkjet head 5 through the ink supply pipe 21. As a result, the ink supply pipe 21 side relative to the inkjet head 5 is under positive pressure. The suction pump 25 reduces the pressure inside the ink discharge tube 22 and sucks ink from the inkjet head 5 through the ink discharge tube 22. This creates a negative pressure on the ink discharge tube 22 side relative to the inkjet head 5. By driving the pressure pump 24 and the suction pump 25, the ink can be circulated between the inkjet head 5 and the ink tank 4 through the circulation flow path 23.

[0028] 1, the scanning mechanism 7 causes the inkjet head 5 to scan back and forth in the Y direction. The scanning mechanism 7 includes a guide rail 28 extending in the Y direction, and a carriage 29 movably supported by the guide rail 28.

[0029] <Inkjet head 5> The inkjet head 5 is mounted on a carriage 29. In the illustrated example, a plurality of inkjet heads 5 are mounted side by side in the Y direction on one carriage 29. The inkjet head 5 includes a head chip 50, an ink supply unit (not shown) that connects the ink circulation mechanism 6 and the head chip 50, and a control unit (not shown) that applies a drive voltage to the head chip 50.

[0030] <Head chip 50> Fig. 3 is an exploded perspective view of head chip 50. Fig. 4 is a cross-sectional view of head chip 50 corresponding to line IV-IV in Fig. 3. Fig. 5 is a cross-sectional view of head chip 50 corresponding to line VV in Fig. 4. 3 to 5 is a so-called circulation type side shoot head chip 50 that circulates ink between ink tank 4 and ejects ink from the center of pressure chamber 61 in the extension direction (Y direction) described below. Head chip 50 includes nozzle plate 51, flow path member 52, film 53, actuator plate (first member) 54, and cover plate (second member) 55. In the following description, in the Z direction, the direction from nozzle plate 51 to cover plate 55 (+Z side) may be referred to as the upper side, and the direction from cover plate 55 to nozzle plate 51 (-Z side) may be referred to as the lower side.

[0031] <Flow path member 52> 3, the flow path member 52 is in the form of a plate with its thickness direction in the Z direction. The flow path member 52 is made of a material having ink resistance. Examples of such materials that can be used include metals, metal oxides, glass, resins, and ceramics. The flow path member 52 is formed with a flow path 60 through which the ink flows, and a plurality of pressure chambers 61 that communicate with the flow path 60 and contain the ink. The flow paths 60 and the pressure chambers 61 penetrate the flow path member 52 in the Z direction.

[0032] The pressure chambers 61 are arranged at intervals in the X direction. Therefore, the portions of the flow path member 52 located between the adjacent pressure chambers 61 constitute partition walls 62 that separate the adjacent pressure chambers 61 in the X direction. Each pressure chamber 61 is formed in a groove shape extending linearly in the Y direction. Each pressure chamber 61 penetrates the flow path member 52 over the entire area in the Y direction. However, the pressure chamber 61 may penetrate the flow path member 52 in a part in the Y direction. In the first embodiment, a configuration in which the channel extension direction coincides with the Y direction will be described, but the channel extension direction may intersect with the Y direction. The planar shape of the pressure chamber 61 is not limited to a rectangular shape (a shape in which one of the X direction and the Y direction is the long side direction and the other is the short side direction). The planar shape of the pressure chamber 61 may be a polygonal shape such as a square shape or a triangular shape, a circular shape, an elliptical shape, or the like.

[0033] The flow passage 60 includes an inlet side common flow passage 64 , an inlet side communication passage 65 , an outlet side common flow passage 66 , and an outlet side communication passage 67 . The inlet-side common flow path 64 extends in the X direction through a portion of the flow path member 52 that is located on the +Y side with respect to each pressure chamber 61. The -X side end of the inlet-side common flow path 64 is connected to an inlet port (not shown). The inlet port is directly or indirectly connected to the ink supply tube 21 (see FIG. 2). That is, the ink flowing through the ink supply tube 21 is supplied to the inlet-side common flow path 64 through the inlet port. The inlet side communication passages 65 connect the inlet side common flow path 64 and each pressure chamber 61. Specifically, each inlet side communication passage 65 branches off toward the -Y side from a portion of the inlet side common flow path 64 that overlaps with each pressure chamber 61 when viewed from the X direction. The -Y side end of the inlet side communication passage 65 is connected to the pressure chamber 61.

[0034] The outlet side common flow path 66 extends in the X direction through a portion of the flow path member 52 that is located on the -Y side with respect to each pressure chamber 61. The +X side end of the outlet side common flow path 66 is connected to an outlet port (not shown). The outlet port is directly or indirectly connected to the ink discharge tube 22 (see FIG. 2). That is, the ink flowing inside the outlet side common flow path 66 is supplied to the ink discharge tube 22 through the outlet port. The outlet side communication passages 67 connect between the outlet side common flow path 66 and each pressure chamber 61. Specifically, each outlet side communication passage 67 branches off toward the +Y side from a portion of the outlet side common flow path 66 that overlaps with each pressure chamber 61 when viewed from the X direction. The +Y side end of the outlet side communication passage 67 is connected to the pressure chamber 61.

[0035] <Nozzle plate 51> 4 and 5, the nozzle plate 51 is fixed to the lower surface of the flow path member 52 by adhesion or the like. The nozzle plate 51 closes the lower end openings of the flow paths 60 and the pressure chambers 61. In the first embodiment, the nozzle plate 51 is formed of a metal material such as SUS or Ni-Pd. However, the nozzle plate 51 may have a single layer structure or a multilayer structure made of a resin material (e.g., polyimide), glass, silicon, or the like in addition to the metal material.

[0036] The nozzle plate 51 is formed with a plurality of nozzle holes 51a penetrating the nozzle plate 51 in the Z direction. The nozzle holes 51a are arranged at intervals in the X direction. Each nozzle hole 51a communicates with a corresponding pressure chamber 61 at the center in the X direction and the Y direction. In the first embodiment, each nozzle hole 51a is formed in a tapered shape such that the inner diameter gradually decreases from the top to the bottom.

[0037] <Film 53> The film 53 is fixed to the upper surface of the flow path member 52 by adhesion or the like. The film 53 is disposed over the entire upper surface of the flow path member 52. As a result, the film 53 closes the upper end openings of the flow paths 60 and the pressure chambers 61. The film 53 is formed from a material that is insulating and resistant to ink and is elastically deformable. As such a material, the first film 53 is formed from, for example, a resin material (polyimide-based, epoxy-based, polypropylene-based, etc.).

[0038] <Actuator plate 54> The actuator plate 54 is fixed by adhesive or the like to the upper surface of the film 53 with the Z direction as its thickness direction. The actuator plate 54 faces each pressure chamber 61 in the Z direction with the film 53 sandwiched therebetween. The actuator plate 54 is not limited to a configuration in which it collectively covers each pressure chamber 61, and may be provided individually for each pressure chamber 61. In the first embodiment, the portion of the actuator plate 54 that faces the pressure chamber 61 constitutes a drive section 54p (see FIG. 4).

[0039] The actuator plate 54 is made of a piezoelectric material such as PZT (lead zirconate titanate), etc. The actuator plate 54 is set so that the polarization direction faces one direction on the +Z side.

[0040] FIG. 6 is a cross-sectional view taken along line VI-VI in FIG. As shown in Figs. 5 and 6, a first through hole 54a and a second through hole 54b are formed in the actuator plate 54. Each through hole 54a, 54b is formed in a tapered shape in which the inner diameter (inner dimension) in at least the Y direction gradually decreases from the top to the bottom. However, the inner diameter of each through hole 54a, 54b may be uniform over the entire Z direction. In addition, the planar shape of each through hole 54a, 54b can be appropriately changed to a circular shape, an elliptical shape, a polygonal shape, or the like. Each through hole 54a, 54b may have the same shape or different shapes.

[0041] The first through holes 54a penetrate in the Z direction through portions of the actuator plate 54 that overlap with the -Y side ends of the pressure chambers 61 in a plan view. The second through holes 54b penetrate in the Z direction through portions of the actuator plate 54 that overlap with the +Y side ends of the pressure chambers 61 in a plan view. The corresponding first through holes 54a and second through holes 54b are formed in positions facing each other in the Y direction. The first through holes 54a and second through holes 54b may be provided in positions shifted in the X direction with respect to the pressure chambers 61 in a plan view. The corresponding first through holes 54a and second through holes 54b may be provided so as not to face each other in the Y direction (shifted in the X direction).

[0042] <Cover plate 55> The cover plate 55 is fixed by adhesion or the like to the upper surface of the actuator plate 54, with the Z direction being the thickness direction. The thickness of the cover plate 55 in the Z direction is thicker than the actuator plate 54, the flow path member 52, and the film 53. In the first embodiment, the cover plate 55 is formed from an insulating material (for example, metal oxide, glass, resin, ceramics, etc.).

[0043] A first conductive portion 55a and a second conductive portion 55b are formed on the cover plate 55. The first conductive portion 55a is provided at the -Y side end of the cover plate 55. The second conductive portion 55b is provided at the +Y side end of the cover plate 55.

[0044] The first conductive portion 55a includes an upper recess (first recess) 71 and a lower recess (second recess) 72. The upper recesses 71 are formed separately in the cover plate 55 at a portion where at least a part of the upper recesses 71 overlaps the first through hole 54a in a plan view. That is, the upper recesses 71 are formed in a plurality of positions spaced apart in the X direction in correspondence with the first through hole 54a. The upper recesses 71 (first conductive portion 55a) may be arranged offset from the first through hole 54a in a plan view. When the first conductive portion 55a and the first through hole 54a are arranged to overlap each other, it is easy to ensure the reliability of the conduction between the first conductive portion 55a and the first through hole 54a. On the other hand, when the first conductive portion 55a and the first through hole 54a are arranged to be offset from each other, it is easy to ensure the strength of the head chip 50.

[0045] The upper recess 71 opens at the upper surface of the cover plate 55. That is, the upper recess 71 constitutes the upper end opening of the first conductive portion 55a. In plan view, the upper recess 71 is formed in a rectangular shape (or an oval shape) with the Y direction as the major axis direction. In cross-sectional view, the upper recess 71 is formed in a tapered shape in which the inner diameter (inner dimension) in at least the Y direction gradually decreases from the top to the bottom. The shape of the upper recess 71 in plan view can be appropriately changed to a perfect circle, a polygonal shape, or the like.

[0046] The lower recess 72 opens on the lower surface of the cover plate 55. That is, the lower recess 72 constitutes the lower end opening of the first conductive portion 55a. The lower recess 72 is formed in a groove shape extending in the X direction so as to span all the upper recesses 71. The lower recess 72 communicates with the upper recess 71 through a portion overlapping with the upper recess 71 in a plan view. The portion of the first conductive portion 55a where the upper recess 71 and the lower recess 72 communicate with each other constitutes a first penetration portion 73 penetrating the cover plate 55 in the Z direction. The lower recess 72 does not necessarily have to span all the upper recesses 71, but may at least span between adjacent upper recesses 71.

[0047] The lower recess 72 has a dimension in the Y direction equal to the dimension in the Y direction at the lower end opening of the upper recess 71. In the illustrated example, the dimension in the Y direction of the lower recess 72 is uniform throughout the Z direction. As shown in FIG. 5, of a pair of inner surfaces facing each other in the Y direction in the lower recess 72, the +Y side inner surface (first inner surface portion) 72a is connected without a step from the same position in plan view as the portion located on the +Y side of the lower end opening edge of the upper recess 71 (hereinafter referred to as the +Y side opening edge) (disposed at the same position in plan view). Therefore, the +Y side inner surface 72a is located within the dimensional range of the lower end opening of the upper recess 71 as viewed in the Z direction, and extends continuously to the inner surface of the upper recess 71. Of the pair of inner surfaces facing each other in the Y direction in the lower recess 72, the -Y side inner surface (first inner surface portion) 72b is continuous without a step with a portion located on the -Y side of the lower end opening edge of the upper recess 71 (hereinafter referred to as the -Y side opening edge) (located at the same position in a plan view). Therefore, the +Y side inner surface 72b is located within the dimensional range of the lower end opening of the upper recess 71 as viewed in the Z direction, and extends continuously with respect to the inner surface of the upper recess 71.

[0048] In the first embodiment, the dimension in the Y direction of the lower recess 72 is larger than the dimension in the Y direction of the first through hole 54a. Therefore, the +Y side inner surface 72a and the -Y side inner surface 72b are located outside the first through hole 54a in the Y direction. However, the +Y side inner surface 72a and the -Y side inner surface 72b may be located at the same position as the upper end opening edge of the first through hole 54a. Also, when the first conductive portion 55a and the first through hole 54a are positioned so as to be misaligned, the dimension in the Y direction of the lower recess 72 may be smaller than that of the first through hole 54a.

[0049] 6, the +X side end of the lower recess 72 is located on the +X side with respect to the upper recess 71 located furthest on the +X side among the upper recesses 71. That is, the +X side inner surface (second inner surface portion) 72c of the inner surface of the lower recess 72 is located on the +X side with respect to any of the upper recesses 71. The -X side end of the lower recess 72 is located on the -X side relative to the upper recess 71 located furthest on the -X side among the upper recesses 71. That is, the -X side inner surface (second inner surface portion) 72d of the inner surface of the lower recess 72 is located on the -X side relative to any of the upper recesses 71. The lower recess 72 may be provided individually for each upper recess 71. The lower recess 72 may be provided across any two or more of the upper recesses 71 among all the upper recesses 71.

[0050] 5, the second conductive portion 55b has an upper recess 75 and a lower recess 76. The configuration of the second conductive portion 55b is similar to the configuration of the first conductive portion 55a. Therefore, in the following, description of the portions of the second conductive portion 55b that correspond to the first conductive portion 55a (the upper recess 71 and the lower recess 72) will be omitted as appropriate.

[0051] The upper recesses 75 are formed separately in portions of the cover plate 55, at least partially overlapping the second through holes 54b in a plan view.

[0052] The lower recess 76 is formed in a groove shape extending in the X direction so as to span all the upper recesses 75. That is, the lower recess 76 communicates with the upper recess 75 through the portion overlapping with the upper recess 75 in a plan view. The portion of the second conductive portion 55b where the upper recess 75 and the lower recess 76 communicate with each other constitutes a second through portion 77 penetrating the cover plate 55 in the Z direction. As shown in FIG. 5, among a pair of inner surfaces facing each other in the Y direction in the lower recess 76, the -Y side inner surface (first inner surface portion) 76a is connected without a step from the same position in a plan view as the portion (hereinafter referred to as the -Y side opening edge) located on the -Y side of the lower end opening edge of the upper recess 75 (they are disposed at the same position in a plan view). Therefore, the +Y side inner surface 76a is located within the dimensional range of the lower end opening of the upper recess 75 as viewed in the Z direction, and extends continuously with respect to the inner surface of the upper recess 75. Of the pair of inner surfaces facing each other in the Y direction in the lower recess 76, the +Y side inner surface (first inner surface portion) 76b is connected without a step from the same position in a plan view as the portion located on the +Y side of the lower end opening edge of the upper recess 75 (hereinafter referred to as the +Y side opening edge) (disposed at the same position in a plan view). Therefore, the +Y side inner surface 76b is located within the dimensional range of the lower end opening of the upper recess 75 as viewed in the Z direction, and extends continuously to the inner surface of the upper recess 75.

[0053] FIG. 7 is a cross-sectional view taken along line VII-VII in FIG. 7, the +X side end of the lower recess 76 is located on the +X side with respect to the upper recess 75 located furthest on the +X side among the upper recesses 75. That is, the +X side inner surface (second inner surface portion) 76c of the inner surface of the lower recess 76 is located on the +X side with respect to any of the upper recesses 75. The -X side end of the lower recess 76 is located on the -X side relative to the upper recess 75 located furthest on the -X side among the upper recesses 75. That is, among the inner surfaces of the lower recess 76, the -X side inner surface (second inner surface portion) 75d is located on the -X side relative to any of the lower recesses 76.

[0054] As shown in FIG. 5, in the first embodiment, the dimension in the Z direction of the upper recesses 71, 75 is larger than the dimension in the Z direction of the lower recesses 72, 76. The opening area of ​​the lower end opening of the lower recesses 72, 76 is larger than the opening area of ​​the upper end opening of one of the upper recesses 71, 75. However, the opening area of ​​the lower end opening of the lower recesses 72, 76 may be equal to or smaller than the opening area of ​​the upper end opening of one of the upper recesses 71, 75. In the first embodiment, the first conductive portion 55a and the second conductive portion 55b are formed to have the same shape, but this is not limited to the configuration. The first conductive portion 55a and the second conductive portion 55b may be formed to have different shapes.

[0055] Next, various wirings formed on the head chip 50 will be described. As shown in FIG. 4, the actuator plate 54 is provided with common wiring 81 and individual wiring 82 as drive wiring. The common wiring 81 includes a first common electrode 81a, a second common electrode 81b, a bottom surface wiring 81c (see FIG. 8), a top surface wiring 81d (see FIG. 9), and a first common through wiring 81e (see FIG. 5).

[0056] FIG. 8 is a bottom view of the actuator plate 54. As shown in FIG. 4 and FIG. 8, the first common electrodes 81a are formed on the lower surface of the actuator plate 54 at positions overlapping with the partition walls 62 when viewed from the Z direction. In the first embodiment, the first common electrode 81a located on the +X side of the first common electrodes 81a corresponding to one pressure chamber 61 is shared with the first common electrode 81a located on the -X side of the first common electrodes 81a of another pressure chamber 61 adjacent to the one pressure chamber 61 on the +X side. On the other hand, the first common electrode 81a located on the -X side of the first common electrodes 81a corresponding to one pressure chamber 61 is shared with the first common electrode 81a located on the +X side of the first common electrodes 81a corresponding to the other pressure chamber 61 adjacent to the one pressure chamber 61 on the -X side. Note that the first common electrodes 81a may be separated from each other between the pressure chambers 61.

[0057] FIG. 9 is a plan view of the actuator plate 54. As shown in FIG. 4 and 9, the second common electrode 81b is disposed on the upper surface of the actuator plate 54 at a position that overlaps with the corresponding pressure chamber 61 when viewed from the Z direction, but does not overlap with the first common electrode 81a when viewed from the Z direction. The second common electrode 81b extends linearly in the Y direction with a length equal to that of the pressure chamber 61.

[0058] 8, the underside wiring (first wiring) 81c is collectively connected to each of the first common electrodes 81a on the underside of the actuator plate 54. The underside wiring 81c extends in the X direction while being connected to the -Y side end of each of the first common electrodes 81a.

[0059] 9, the upper surface wiring 81d is connected to the second common electrode 81b on the upper surface of the actuator plate 54. The upper surface wiring 81d extends in the X direction while being connected to the -Y side end of each second common electrode 81b.

[0060] As shown in FIG. 5, the first common through wiring 81e connects the lower surface wiring 81c and the upper surface wiring 81d. The first common through wiring 81e is formed on the inner surface of the first through hole 54a over the entire length in the Z direction at least in the portion facing the -Y side. The lower end edge of the first common through wiring 81e is connected to the lower surface wiring 81c at the lower end opening edge of the first through hole 54a. The upper end edge of the first common through wiring 81e is connected to the upper surface wiring 81d at the upper end opening edge of the first through hole 54a. Note that the first common through wiring 81e does not have to be formed around the entire inner surface of the first through hole 54a as long as it connects the lower surface wiring 81c and the upper surface wiring 81d.

[0061] As shown in FIG. 4, the individual wiring 82 includes a first individual electrode 82a, a second individual electrode 82b, a bottom surface wiring 82c (see FIG. 8), an top surface wiring 82d (see FIG. 9), and a first individual through wiring 82e (see FIG. 5).

[0062] As shown in Fig. 4 and Fig. 8, the first individual electrode 82a generates a potential difference between itself and the first common electrode 81a, and also generates a potential difference between itself and the second common electrode 81b. The first individual electrodes 82a are formed between the first common electrodes 81a on the lower surface of the actuator plate 54. The first individual electrodes 82a extend in the Y direction while being spaced apart from the first common electrodes 81a in the X direction. The entire first individual electrodes 82a overlap with the corresponding pressure chambers 61 when viewed from the Z direction. In this case, at least a portion of the first individual electrodes 82a overlaps with the second common electrode 81b when viewed from the Z direction.

[0063] As shown in Fig. 4 and Fig. 9, the second individual electrode 82b generates a potential difference between itself and the second common electrode 81b, and generates a potential difference between itself and the first common electrode 81a. The second individual electrodes 82b are formed on the upper surface of the actuator plate 54 at portions located on both sides of the second common electrode 81b in the X direction. Each second individual electrode 82b extends in the Y direction with a gap in the X direction from the second common electrode 81b. Note that, between adjacent pressure chambers 61, the individual electrode 82b located on the +X side among the individual electrodes 82b corresponding to one pressure chamber 61 and the individual electrode 82b located on the -X side among the individual electrodes 82b corresponding to the other pressure chamber 61 are spaced apart in the X direction on the partition wall 62.

[0064] 8, the underside wiring 82c is connected to the first individual electrode 82a on the underside of the actuator plate 54. The underside wiring 82c extends from the +Y side end of the first individual electrode 82a to both sides in the X direction. The underside wiring 82c corresponding to adjacent pressure chambers 61 are separated from each other. As shown in FIG. 9, the upper surface lead-out wiring 82d connects the +Y side ends of the second individual electrodes 82b on the upper surface of the actuator plate 54.

[0065] 5 and 7, the first individual through wiring 82e connects the lower surface wiring 82c and the upper surface wiring 82d. The first individual through wiring 82e is formed on the inner surface of the second through hole 54b over the entire length in the Z direction at least in a portion facing the +Y side. Note that the first individual through wiring 82e does not have to be formed on the entire inner surface of the second through hole 54b as long as it connects the lower surface wiring 82c and the upper surface wiring 82d.

[0066] FIG. 10 is a plan view of the cover plate 55. As shown in FIG. As shown in Figures 5 and 10, the cover plate 55 is formed with a second common through wiring 85 and a second individual through wiring 86 as connection wiring (second wiring), and a common pad 87 and an individual pad 88 as terminal wiring (second wiring). The second common through wiring 85 connects between the first common through wiring 81e and the common pad 87. The second common through wiring 85 is formed on the inner surface of each first through portion 73 over the entire length in the Z direction. Specifically, the upper half of the second common through wiring 85 is formed on at least a portion of the inner surface of the upper recess 71 that is located on the +Y side. The upper end edge of the second common through wiring 85 is located on the upper end opening edge of the upper recess 71 (first through portion 73). The lower half of the second common through wiring 85 is formed on the +Y side inner surface 72a of the inner surface of the lower recess 72. The upper and lower halves of the second common through wiring 85 are connected at the boundary portion between the upper recess 71 and the lower recess 72. The lower end edge of the second common through wiring 85 is located on the lower end opening edge of the lower recess 72 (first through portion 73). The lower edge of the second common through wiring 85 is directly or indirectly connected to the upper edge of the first common through wiring 81e at the boundary between the first through hole 54a and the first through portion 73. In the first embodiment, the first common through wiring 81e and the second common through wiring 85 are indirectly connected to each other through an upper surface wiring 81d formed in a portion of the upper surface of the actuator plate 54 exposed through the first through portion 73.

[0067] 6, the second common through wiring 85 is not formed in a portion of the lower recess 72 located between the first through portions 73. That is, adjacent second common through wirings 85 are separated from each other by a portion of the lower recess 72 located between the first through portions 73. Note that the second common through wiring 85 may be formed, for example, around the entire periphery of the first through portion 73, as long as it connects the first common through wiring 81e and the common pad 87.

[0068] 5 and 10, the common pad 87 is formed on the upper surface of the cover plate 55. The common pad 87 extends in the Y direction on a portion of the upper surface of the cover plate 55 that overlaps with the pressure chamber 61 when viewed from the Z direction. The common pad 87 is connected to the upper edge of the second common through wiring 85 at the upper opening edge of the first through portion 73.

[0069] As shown in FIG. 5 and FIG. 7, the second individual through wiring 86 connects the second individual through wiring 82e and the individual pad 88. The second individual through wiring 86 is formed on the inner surface of each second through portion 77 over the entire length in the Z direction. Specifically, the upper half of the second individual through wiring 86 is formed on at least a portion of the inner surface of the upper recess 75 that is located on the -Y side. The upper end edge of the second individual through wiring 86 is located on the upper end opening edge of the upper recess 75 (second through portion 77). The lower half of the second individual through wiring 86 is formed on the -Y side inner surface 76a of the inner surface of the lower recess 76. The upper and lower halves of the second individual through wiring 86 are connected at the boundary portion between the upper recess 75 and the lower recess 76. The lower end edge of the second individual through wiring 86 is located on the lower end opening edge of the lower recess 76 (second through portion 77). The lower edge of the second individual through wiring 86 is directly or indirectly connected to the upper edge of the second individual through wiring 82e at the boundary between the second through hole 54b and the second through portion 77. In the first embodiment, the second individual through wiring 82e and the second individual through wiring 86 are connected through an upper surface lead-out wiring 82d formed in a portion of the upper surface of the actuator plate 54 exposed through the second through portion 77.

[0070] 7, the second individual through wirings 86 are not formed in the portions of the lower recess 76 that are located between the second through portions 77. That is, adjacent second individual through wirings 86 are separated from each other by the portions of the lower recess 76 that are located between the second through portions 77. Note that the second individual through wirings 86 may be formed, for example, around the entire periphery of the second through portion 77, as long as they are configured to connect the second individual through wirings 82e and the individual pads 88.

[0071] 10, the individual pads 88 are formed on the upper surface of the cover plate 55. The individual pads 88 extend in the Y direction on a portion of the upper surface of the cover plate 55 that overlaps with the pressure chambers 61 when viewed from the Z direction. The individual pads 88 are connected to the upper edge of the second individual through-wires 86 at the upper opening edge of the second through portion 77.

[0072] A flexible printed circuit board (not shown) serving as external wiring is pressure-bonded to the upper surface of the cover plate 55. The flexible printed circuit board is mounted on the common pad 87 and the individual pads 88 on the upper surface of the cover plate 55.

[0073] [Printer 1 operation method] Next, a case where characters, figures, etc. are recorded on a recording medium P using the printer 1 configured as described above will be described below. 1 are each fully filled with ink of a different color. Also, the ink in the ink tanks 4 is filled in the inkjet head 5 via the ink circulation mechanism 6.

[0074] When the printer 1 is operated in this initial state, the recording medium P is conveyed to the +X side while being sandwiched between the rollers 11 and 12 of the conveying mechanisms 2 and 3. At the same time, the carriage 29 moves in the Y direction, causing the inkjet head 5 mounted on the carriage 29 to move back and forth in the Y direction. While the inkjet heads 5 are moving back and forth, ink is appropriately ejected from each inkjet head 5 onto the recording medium P. In this way, characters, images, etc. can be recorded on the recording medium P.

[0075] The movement of each ink-jet head 5 will now be described in detail. In the inkjet head 5 of the circulation side chute type as in the first embodiment, first, the pressurizing pump 24 and the suction pump 25 shown in FIG. 2 are operated to circulate ink in the circulation flow path 23. In this case, the ink circulating in the ink supply tube 21 is supplied into each pressure chamber 61 through the inlet side common flow path 64 and the inlet side communication path 65. The ink supplied into each pressure chamber 61 circulates in the Y direction in each pressure chamber 61. Thereafter, the ink is discharged into the outlet side common flow path 66 through the outlet side communication path 67, and then returned to the ink tank 4 through the ink discharge tube 22. In this way, ink can be circulated between the inkjet head 5 and the ink tank 4.

[0076] When the inkjet head 5 starts to move back and forth due to the movement of the carriage 29 (see FIG. 1), a drive voltage is applied between the common electrodes 81a, 81b and the individual electrodes 82a, 82b via the flexible printed circuit board. At this time, the drive voltage is applied with the common electrodes 81a, 81b at a reference potential GND and the individual electrodes 82a, 82b at a drive potential Vdd.

[0077] Application of the driving voltage generates a potential difference in the X direction between the first common electrode 81a and the first individual electrode 82a, and between the second common electrode 81b and the second individual electrode 82b. Due to the potential difference generated in the X direction, the actuator plate 54 undergoes thickness slip deformation in the Z direction due to the shear mode. Specifically, an electric field is generated between the first common electrode 81a and the first individual electrode 82a in a direction moving away from each other in the X direction. Also, on the upper surface of the actuator plate 54, an electric field is generated between the second common electrode 81b and the second individual electrode 82b in a direction moving toward each other in the X direction. As a result, the portions of the actuator plate 54 corresponding to each pressure chamber 61 shear upward from both ends toward the center in the X direction.

[0078] On the other hand, a potential difference occurs in the Z direction between the first common electrode 81a and the second individual electrode 82b, and between the first individual electrode 82a and the second common electrode 81b. Due to the potential difference occurring in the Z direction, an electric field is generated in the actuator plate 54 in a direction parallel to the polarization direction (Z direction). As a result, the actuator plate 54 expands and contracts in the Z direction due to the bend mode. That is, in the head chip 50 of the first embodiment, the deformations caused by the shear mode and the bend mode of the actuator plate 54 both extend in the Z direction. Specifically, due to the application of the drive voltage, the actuator plate 54 deforms in a direction away from the pressure chamber 61. This causes the volume in the pressure chamber 61 to expand. After that, when the drive voltage is set to zero, the actuator plate 54 restores, and the volume in the pressure chamber 61 tries to return to the original volume. In the process of the actuator plate 54 restoring, the pressure in the pressure chamber 61 increases, and the ink in the pressure chamber 61 is ejected to the outside through the nozzle hole 51a. When the ink ejected to the outside lands on the recording medium P, print information is recorded on the recording medium P.

[0079] <Method of Manufacturing Head Chip 50> Next, a method for manufacturing the above-mentioned head chip 50 will be described. Fig. 11 is a flowchart for explaining the method for manufacturing head chip 50. Figs. 12 to 23 are process diagrams for explaining the method for manufacturing head chip 50, and are cross-sectional views corresponding to Figs. 4 and 5. For convenience, the following description will be given taking as an example a case in which head chip 50 is manufactured at the chip level. As shown in FIG. 11, the manufacturing method for the head chip 50 includes a first actuator processing step S01, a first cover processing step S02, a first bonding step S03, a second actuator processing step S04, a second cover processing step S05, a second bonding step S06, a first flow path member processing step S07, a third bonding step S08, a second flow path member processing step S09, and a fourth bonding step S10.

[0080] 12, in the first actuator processing step S01, first, recesses 100, 101 to become the first through-hole 54a and the second through-hole 54b are formed (recess formation step). Specifically, a mask pattern is formed on the upper surface of the actuator plate 54, in which the regions for forming the first through-hole 54a and the second through-hole 54b are opened. Then, a sandblasting process or the like is performed on the upper surface of the actuator plate 54 through the mask pattern. As a result, the recesses 100, 101 that are recessed from the upper surface are formed in the actuator plate 54. The recesses 100, 101 may be formed by a dicing process, a precision drilling process, an etching process, or the like.

[0081] 13, in a first actuator processing step S01, the portions of the various wirings that are to be located on the upper surface of the actuator plate 54 are formed (first wiring formation step). In the first wiring formation step, a mask pattern having openings in areas where the wirings are to be formed is first formed on the upper surface of the actuator plate 54. Next, an electrode material is formed on the actuator plate 54 by, for example, oblique deposition. The electrode material is formed on the actuator plate 54 through the openings in the mask pattern. As a result, various wirings are formed on the upper surface of the actuator plate 54 and on the inner surfaces of the recesses 100 and 101.

[0082] In the first cover processing step S02, the first conductive portion 55a and the second conductive portion 55b are formed in the cover plate 55. The first cover processing step S02 includes an upper recess forming step and a lower recess forming step.

[0083] 14, in the upper recess forming step, a mask pattern having openings for forming the upper recesses 71, 75 is formed on the upper surface of the cover plate 55. Then, the upper surface of the cover plate 55 is sandblasted through the mask pattern. As a result, blast marks 110, 111 recessed into the upper surface of the cover plate 55 are formed.

[0084] Here, when the upper recesses 71, 75 are formed by sandblasting, the blast marks 110, 111 are formed in a tapered shape with the inner diameter gradually decreasing from the upper end opening to a predetermined range in the Z direction. However, when the depth (dimension in the Z direction) of the blast marks 110, 111 exceeds the predetermined range, the inner diameter may expand once and then decrease again. As a result, a constricted portion 112 is formed in the middle part of the blast marks 110, 111 in the Z direction, especially in the part facing the Y direction. Once the constricted portion 112 is formed, when an electrode material is formed on the inner surface of the blast marks 110, 111, the electrode material is unlikely to flow around the part of the blast marks 110, 111 located below the constricted portion 112. This may result in a decrease in yield, etc.

[0085] Therefore, in the first cover processing step S02, as shown in FIG. 15, after the upper recess forming step, a lower recess forming step is performed. In the lower recess forming step, a dicing process is performed on the lower surface of the cover plate 55. The width of the dicer 120 used in the lower recess forming step is set to be equal to or larger than the dimension of the constricted portion 112. When forming the lower recess 72, the dicer 115 is advanced to a position on the lower surface of the cover plate 55 that overlaps in plan view with at least one of the constricted portions 112 facing each other in the Y direction among the blast marks 110, with the rotation axis line coinciding with the Y direction. Then, the dicer 115 is caused to travel in the X direction so as to cross each blast mark 110. At this time, the dicing process is performed with the dicer 115 advanced to above the constricted portion 112 in the blast marks 110. As a result, the first conductive portion 55a is formed with the constricted portion 112 removed. That is, the portion machined by dicer 115 in the lower recess forming step constitutes lower recess 72, and the portion of blast mark 110 remaining after the lower recess forming step constitutes upper recess 71. Note that the blast mark 111 is also processed in the same manner as in the lower recess forming step described above. As a result, the portion machined by dicer 115 constitutes lower recess 76, and the portion of blast mark 111 remaining after the lower recess forming step constitutes upper recess 75.

[0086] As shown in FIG. 16, in the first bonding step S03, the cover plate 55 is attached to the upper surface of the actuator plate 54 by adhesive or the like. As a result, the first conductive portion 55a and the recess 100 communicate with each other, and the second conductive portion 55b and the recess 101 communicate with each other. In the first bonding step S03, the excess adhesive that is swept away when the actuator plate 54 and the cover plate 55 are pressure-bonded together is accommodated in the lower recesses 72, 75. That is, in the first embodiment, the lower recesses 72, 75 extend in the X direction so as to straddle all of the upper recesses 71, 76, respectively. Therefore, the excess adhesive is evenly accommodated in the lower recesses 72, 75. In addition, it is easier to ensure the opening area of ​​the lower recesses 72, 76 compared to when the lower recesses 72, 76 communicate with only the upper recesses 71, 72. As a result, the adhesive is prevented from flowing into the through-holes 73, 78 in a concentrated manner.

[0087] 17, in the second actuator processing step S04, a grinding process is performed on the lower surface of the actuator plate 54 (grinding step). At this time, the actuator plate 54 is ground to a position where the recesses 100, 101 are opened on the lower surface of the actuator plate 54, thereby forming a first through hole 54a and a second through hole 54b.

[0088] 18, various wirings such as the first common electrode 81a and the first individual electrodes 82a are formed on the lower surface of the actuator plate 54 (second wiring formation process). In the second wiring formation process, a mask pattern having openings in areas where the wirings are to be formed is first formed on the lower surface of the actuator plate 54. Then, an electrode material is formed on the actuator plate 54 by, for example, deposition. The electrode material is formed on the actuator plate 54 through the openings in the mask pattern.

[0089] Next, as shown in FIG. 19, in the second cover processing step S05, the through wirings 85, 86 and the pads 87, 88 are formed on the cover plate 55 (third wiring forming step). Specifically, a mask pattern is first formed on the upper surface of the cover plate 55, in which the through wirings 85, 86 and the pads 87, 88 are formed. Next, an electrode material is formed on the cover plate 55 by, for example, oblique deposition from the Y direction. A part of the electrode material is formed on the upper surface of the cover plate 55 through the opening of the mask pattern. This forms the pads 87, 88. A part of the electrode material enters the conductive parts 55a, 55b through the opening of the mask pattern and the upper end opening of each conductive part 55a, 55b (upper recess 71, 75). The electrode material that has entered the conductive parts 55a, 55b adheres to the inner surface of each through part 73, 78. As a result, through wirings 85 and 86 are formed on the inner surfaces of the through portions 73 and 78, respectively.

[0090] Here, for example, in the first conductive portion 55a, the lower recess 72 extends in the X direction so as to straddle all the upper recesses 71. Therefore, the electrode material is less likely to flow into the portion of the lower recess 72 located between the adjacent upper recesses 71. That is, the portion of the cover plate 55 located between the adjacent upper recesses 71 functions as a mask for the portion of the lower recess 72 located between the adjacent upper recesses 71. As a result, each second common through wiring 85 is formed in a state in which it is separated from each other between the adjacent first through portions 73. Note that, like the second common through wiring 85, the second individual through wirings 86 are also formed in a state in which it is separated from each other between the adjacent second through portions 78.

[0091] As shown in FIG. 20, in the second bonding step S06, the film 53 is attached to the lower surface of the actuator plate 54 with an adhesive or the like. 21, in the flow path member first processing step S07, the flow paths 60 (see FIG. 3) and the pressure chambers 61 are formed in the flow path member 52. The flow paths 60 and the pressure chambers 61 are formed by performing, for example, a dicing process or a sandblasting process on the flow path member 52. Then, in the flow path member 52, the portions that separate the adjacent pressure chambers 61 remain as partition walls 62.

[0092] As shown in FIG. 22, in the third bonding step S08, the flow path member 52 is attached to the lower surface of the first film 53 with an adhesive or the like.

[0093] 23, in a second flow path member processing step S09, a grinding process is performed on the lower surface of the flow path member 52 (grinding step). At this time, the flow path member 52 is ground to a position where the flow paths 60 and the pressure chambers 61 open on the lower surface of the flow path member 52.

[0094] In the fourth bonding step S10, the nozzle plate 51 is attached to the lower surface of the flow path member 52 in a state in which the nozzle holes 51a and the pressure chambers 61 are aligned. Through the above steps, the head chip 50 is completed.

[0095] Thus, in the first embodiment, the cover plate (second plate) 55 is formed with upper recesses (first recesses) 71, 72 that open on the upper surface (first surface facing the first side in the thickness direction) and lower recesses (second recesses) 72, 76 that open on the lower surface (second surface facing the second side in the thickness direction) and communicate with the upper recesses 71, 72. For example, the lower recess 72 includes a +Y side inner surface (first inner surface portion) 72a and a -Y side inner surface 72b that extend in the Z direction continuously with respect to the lower end opening edge (inner surface) of the upper recess 71 within the dimensional range of the lower end opening of the upper recess 71 as viewed from the Z direction, and a +X side inner surface (second inner surface portion) 72c and a -X side inner surface 72d that are located outside in the X direction with respect to the inner surface of the upper recess 71 and extend in the Z direction. The cover plate 55 is configured to have a second common penetrating wiring (second wiring) 85 formed therein, which penetrates the cover plate 55 through the +Y side inner surface 72a and the inner surface of the upper recess 71, and connects between the common wiring (first wiring) 81 formed on the actuator plate (first plate) 54 and the flexible printed circuit board (external wiring). According to this configuration, when the second common through wiring 85 is formed through the upper end opening of the upper recess 71, it is easy to form the wiring continuously over the +Y side inner surface 72a and the inner surface of the upper recess 71. In addition, since the lower recess 72 has a +X side inner surface 72c and a -X side inner surface 72d located outside the inner surface of the upper recess 71 in the X direction, an outer protrusion 70 is formed in the part of the lower recess 72 located outside the upper recess 71 in the X direction. Therefore, when the actuator plate 54 and the cover plate 55 are bonded together, the outer protrusion 70 functions as an adhesive reservoir. That is, compared to a case where the opening area of ​​the lower recess 72 is formed to be equal to that of the upper recess 71, adhesive can be stored in a part other than the communication part (first through part 73) between the upper recess 71 and the lower recess 72. This makes it possible to prevent the conduction between the common wiring 81 and the second common through wiring 85 from being interrupted by the adhesive, and the conduction between the common wiring 81 and the second common through wiring 85 can be stabilized. As a result, the yield can be improved. The above-mentioned action and effect are similar between the individual wiring 82 and the second individual through wiring 86 formed in the upper recess 75 and the lower recess 76.

[0096] In head chip 50 of the first embodiment, the opening area of ​​the lower end opening of lower recesses 72, 76 is larger than the opening area of ​​the upper end opening of one of upper recesses 71, 75. With this configuration, it becomes easier to secure the volume required for the adhesive reservoir in the lower recesses 72, 76, and it is possible to ensure stable conductivity between the common wiring 81 and the second common through wiring 85, and between the individual wiring 82 and the second individual through wiring 86.

[0097] In the head chip 50 of the first embodiment, the upper recesses 71, 75 are provided at intervals in the X direction (first direction), and the lower recesses 72, 76 extend in the X direction so as to straddle adjacent upper recesses 71, 75 among the multiple upper recesses 71, 75. For example, the Y-side inner surfaces 72a, 72b extend in the Z direction continuously with respect to the inner surface of the lower recess 72 (they are disposed at the same position in a plan view). The X-side inner surfaces 72c, 72d are inner surfaces of the lower recess 72 that extend in the Z direction outside the X direction with respect to the inner surfaces of the upper recesses 71, 75. According to this configuration, it is sufficient to provide one lower recess 72, 76 for each of the multiple upper recesses 71, 75. Therefore, it is possible to improve the manufacturing efficiency of the lower recesses 72, 76 compared to a case in which the lower recesses 72, 76 are separately formed corresponding to each of the upper recesses 71, 75.

[0098] In head chip 50 of the first embodiment, upper recesses 71, 75 are tapered such that the inner diameter decreases downward, and the Z direction dimension of upper recesses 71, 75 is greater than the Z direction dimension of lower recesses 72, . According to this configuration, for example, when the second common through wiring 85 and the second individual through wiring 86 are formed through the upper end openings of the upper recesses 71, 75 by oblique deposition, the second common through wiring 85 and the second individual through wiring 86 can be easily formed continuously on the inner surfaces of the through portions 73, 77. As a result, the cost of the head chip 50 can be reduced.

[0099] Since the inkjet head 5 and printer 1 of the first embodiment include the head chip 50 described above, it is possible to provide an inkjet head 5 and printer 1 with excellent reliability.

[0100] In the head chip 50 of the first embodiment, the upper recesses 71, 75 are formed by performing sandblasting processing from the upper surface side of the cover plate 55, and the lower recesses 72, 76 are formed by performing dicing processing from the lower surface side of the cover plate 55. According to this configuration, by forming the lower recesses 72, 76 by dicing, the upper recesses 71 and the lower recesses 72, and the upper recesses 72 and the lower recesses 76 can penetrate the cover plate 55 while removing the constricted portion 112 formed by sandblasting. Therefore, unlike the conventional case where the cover plate 55 is ground to remove the constricted portion 112 after the first recess 71 is formed by sandblasting, it is possible to suppress the change in thickness of the cover plate 55 before and after processing. In other words, since processing can be performed on the cover plate 55 while maintaining the thickness of the cover plate 55, the occurrence of cracks can be suppressed and the handleability can be improved. As a result, the manufacturing efficiency can be improved.

[0101] Second embodiment FIG. 24 is a cross-sectional view of the head chip 50 according to the second embodiment, which corresponds to FIG. In head chip 50 shown in FIG. 24, the dimension of upper recess 71 in the Z direction is smaller than the dimension of lower recess 72 in the Z direction.

[0102] Here, the constriction 112 shown in FIG. 14 tends to be formed at a deeper position (−Z side) of the blast mark 110 as the inner diameter of the upper end opening of the blast mark 110 (upper recess 71) increases. Therefore, as in the second embodiment, the Z-direction dimension of the upper recess 71 is made smaller than the Z-direction dimension of the lower recess 76, thereby making it possible to reduce the inner diameter of the upper end opening of the upper recess 71. As a result, it is possible to improve the degree of freedom in design, to narrow the pitch of the pressure chambers 61, and to reduce the size of the head chip 50.

[0103] In the second embodiment, the first conductive portion 55a (upper recess 71 and lower recess 72) is taken as an example for description, but is not limited to this configuration. The same applies to the second conductive portion 55b (upper recess 72 and lower recess 76).

[0104] Third embodiment FIG. 25 is a cross-sectional view of head chip 50 according to the third embodiment, corresponding to FIG. In the head chip 50 shown in FIG. 25, the lower recess 76 is provided individually in correspondence with the upper recess 75. The inner surfaces of the lower recess 76, both ends in the X direction, are located outside the lower end opening edge of the upper recess 75 in the X direction. Specifically, the +X side inner surface (second inner surface portion) 76c of the inner surfaces of the lower recess 76 is located on the +X side with respect to the lower end opening edge of the upper recess 75. The -X side inner surface (second inner surface portion) 76d of the inner surfaces of the lower recess 76 is located on the -X side with respect to the lower end opening edge of the upper recess 75. Note that the +X side inner surface 76c and the -X side inner surface 76b may be located outside at least the lower end opening edge of the inner surfaces of the upper recess 75. In this case, the +X side inner surface 76c and the -X side inner surface 76d may be located outside the upper end opening edge of the inner surfaces of the upper recess 75, for example. The opening area of ​​the lower end opening of the lower recess 76 may be larger or smaller than the opening area of ​​the upper end opening of the upper recess 71 .

[0105] In the head chip 50 of the third embodiment, the upper recess 75 and the lower recess 76 are formed corresponding to each other, so that it is easier to ensure stability of conduction compared to, for example, a case in which adjacent second individual through wirings 86 are formed in the same lower recess 76. Note that, although the second embodiment has been described taking the second conductive portion 55b as an example, the first conductive portion 55a (upper recess 71 and lower recess 72) can also adopt a similar configuration.

[0106] (Fourth embodiment) 26 and 27 are cross-sectional views of a head chip 200 according to the fourth embodiment. 26 and 27 includes a nozzle plate 201, an actuator plate 202, and a cover plate 203. The head chip 200 has a configuration in which the nozzle plate 201, the actuator plate 202, and the cover plate 203 are stacked in this order in the Z direction.

[0107] <Actuator plate 202> The actuator plate 202 is formed with a channel row 210. The channel row 210 has ejection channels 211 that are filled with ink, and non-ejection channels 212 that are not filled with ink. The channels 211, 212 are arranged alternately in the actuator plate 202 with an interval therebetween in the X direction.

[0108] 26, the discharge channel 211 is formed in the +Y side portion of the actuator plate 202. The discharge channel 211 is formed in a circular arc shape that protrudes downward when viewed from the X direction. The discharge channel 211 opens on the upper and lower surfaces of the actuator plate 202. The dimension of the discharge channel 211 in the Y direction becomes smaller as it goes downward.

[0109] 27, the non-ejection channel 212 extends linearly over the entire length of the actuator plate 202 in the Y direction, penetrating the actuator plate 202 in the Z direction. Parts of the actuator plate 202 located between adjacent ejection channels 211 and non-ejection channels 212 constitute driving walls (driving parts) 215 facing the ejection channels 211, respectively.

[0110] <Cover plate 203> 26 and 27, the cover plate 203 is laminated by adhesion or the like on the upper surface of the actuator plate 202 so as to cover the upper end openings of the channels 211, 212. An inlet common flow path 220 is formed in the cover plate 203 at a position overlapping the -Y side end of the ejection channel 211 in a plan view. The inlet common flow path 220 extends in the X direction, for example, by a length spanning the channel row 210, and opens at the upper surface of the cover plate 203. In the inlet common flow channel 220, an inlet slit 221 is formed at a position overlapping with the discharge channel 211 in a plan view. The inlet slit 221 individually communicates between the -Y side end of each discharge channel 211 and the inside of the inlet common flow channel 220.

[0111] An outlet common flow channel 225 is formed in the cover plate 203 at a position overlapping in plan view with the +Y side end of the discharge channel 211. The outlet common flow channel 225 extends in the X direction, for example, by a length spanning the channel row 210, and opens at the upper surface of the cover plate 203. In the outlet common flow path 225, an outlet slit 226 is formed at a position overlapping with the non-ejection channel 212 in a plan view. The outlet slit 226 separately communicates between the +Y side end of each ejection channel 211 and the inside of the outlet common flow path 225. Therefore, the inlet slit 221 and the outlet slit 226 communicate with each ejection channel 211, but do not communicate with the non-ejection channel 212.

[0112] <Nozzle plate 201> The nozzle plate 201 is laminated on the lower surface of the actuator plate 202 by adhesion or the like. Nozzle holes 201a are formed in the nozzle plate 201 at positions overlapping with the centers of the ejection channels 211 in the Y direction. An intermediate plate (not shown) may be interposed between the nozzle plate 201 and the actuator plate 202. In this case, the ejection channels 211 and the nozzle holes 201a are communicated with each other through communication holes formed in the intermediate plate.

[0113] Next, a description will be given of the drive wiring (common wiring 230 and individual wiring 235) formed on the actuator plate 202. FIG. As shown in FIGS. 26 and 28, the common wiring 230 includes a common electrode 231 and a common lead wiring 232.

[0114] The common electrodes 231 are formed on at least the inner surfaces of the ejection channels 211 that face each other in the X direction. The common outgoing wiring 232 is formed on the upper surface of a portion (hereinafter referred to as tail portion 202a) of the actuator plate 202 located on the -Y side with respect to the ejection channel 211. The common outgoing wiring 232 is provided on the upper surface of the tail portion 202a in correspondence with each ejection channel 211. Each common outgoing wiring 232 extends linearly in the Y direction with respect to the corresponding ejection channel 211. The +Y side end of the common pad 255 is connected to the common electrode 231 at the upper opening edge of the ejection channel 211.

[0115] As shown in FIGS. 27 and 28, the individual wiring 235 includes an individual electrode 236 and an individual lead-out wiring 237. The individual electrodes 236 are formed on the inner surfaces of the non-ejection channels 212 that face each other in the X direction. The individual lead-out wiring 237 is formed on the upper surface of the tail portion 202a in a portion located on the -Y side of the common lead-out wiring 232. The individual lead-out wiring 237 is in a belt shape extending in the X direction. The individual lead-out wiring 237 connects the individual electrodes 236 that face each other in the X direction with the ejection channel 211 therebetween at the upper opening edges of the non-ejection channels 212 that face each other in the X direction with the ejection channel 211 therebetween.

[0116] FIG. 29 is an enlarged plan view of the cover plate 203. As shown in FIG. As shown in FIGS. 26 and 29, the cover plate 203 is formed with a first conductive portion 240 and a second conductive portion 245. The first conductive portion 240 includes an upper recess 241 and a lower recess 242 . The upper recess 241 is formed in a portion of the cover plate 203 that overlaps with the tail portion 202a in a plan view. A plurality of upper recesses 241 are formed at intervals in the X direction corresponding to each of the discharge channels 211.

[0117] The upper recess 241 opens at the upper surface of the cover plate 203. That is, the upper recess 241 constitutes an upper end opening of the first conductive portion 240. The upper recess 241 is formed in a tapered shape in which the inner diameter in at least the Y direction gradually decreases from the top to the bottom in a cross-sectional view.

[0118] The lower recess 242 opens at the lower surface of the cover plate 203. That is, the lower recess 242 constitutes the lower end opening of the first conductive portion 241. The lower recess 242 is formed in a groove shape extending in the X direction so as to span all of the upper recesses 241. The lower recess 242 communicates with the inside of the upper recess 241 through a portion that overlaps with the upper recess 241 in a plan view. In the first conductive portion 240, a portion where the upper recess 241 and the lower recess 242 communicate with each other constitutes a first penetrating portion 243 that penetrates the cover plate 203 in the Z direction.

[0119] The lower recess 242 has a dimension in the Y direction equal to the dimension in the Y direction at the lower end opening of the upper recess 241. In the illustrated example, the dimension in the Y direction of the lower recess 242 is uniform throughout the Z direction. Of a pair of inner surfaces facing each other in the Y direction in the lower recess 242, the +Y side inner surface (first inner surface portion) 242a is connected without a step from the same position as the +Y side opening edge of the lower end opening edge of the upper recess 241 in a plan view (disposed at the same position in a plan view). Therefore, the +Y side inner surface 242a is located within the dimensional range of the lower end opening of the upper recess 241 as viewed in the Z direction, and extends continuously to the inner surface of the upper recess 241. Of the pair of inner surfaces facing each other in the Y direction in the lower recess 242, the -Y side inner surface (first inner surface portion) 242b is connected without a step from the same position in a plan view as the -Y side opening edge of the lower end opening edge of the upper recess 241 (disposed at the same position in a plan view). Therefore, the -Y side inner surface 242b is located within the dimensional range of the lower end opening of the upper recess 241 as viewed in the Z direction, and extends continuously to the inner surface of the upper recess 241.

[0120] The +X side end of the lower recess 242 is located on the +X side of the upper recess 241 that is located furthest on the +X side among the upper recesses 241. The -X side end of the lower recess 242 is located on the -X side of the upper recess 241 that is located furthest on the -X side among the upper recesses 241.

[0121] The second conductive portion 245 is formed in a portion of the cover plate 203 that is located on the −Y side with respect to the first conductive portion 240. The second conductive portion 245 includes an upper recess 246 and a lower recess 247. A plurality of upper recesses 246 are formed in the cover plate 203 at intervals in the X direction corresponding to each of the discharge channels 211 .

[0122] The lower recess 247 is formed in a groove shape extending in the X direction so as to span all the upper recesses 246. That is, the lower recess 247 communicates with the upper recess 246 through a portion that overlaps with the upper recess 246 in a plan view. In the second conductive portion 245, a portion where the upper recess 246 and the lower recess 357 communicate with each other constitutes a second penetrating portion 248 that penetrates the cover plate 203 in the Z direction. Of a pair of inner surfaces of the lower recess 247 facing each other in the Y direction, the +Y side inner surface (first inner surface portion) 247a is connected without a step to the +Y side opening edge of the lower end opening edge of the upper recess 246 from the same position in a plan view (disposed at the same position in a plan view). Of the pair of inner surfaces facing each other in the Y direction in the lower recess 247, the +Y side inner surface (first inner surface portion) 247b is connected without any steps to the +Y side opening edge of the lower end opening edge of the upper recess 246 from the same position in a planar view (it is arranged at the same position in a planar view).

[0123] The +X side end of the lower recess 247 is located on the +X side of the upper recess 246 that is located furthest on the +X side among the upper recesses 246. The -X side end of the lower recess 247 is located on the -X side of the upper recess 246 that is located furthest on the -X side among the upper recesses 246.

[0124] On the cover plate 203, a common through wire 251 and an individual through wire 252 as connection wires (second wires), and a common pad 255 and an individual pad 256 as terminal wires (second wires) are formed. The common through wiring 251 connects between the common lead wiring 232 and the common pad 255. The common through wiring 251 is formed on the inner surface of each first through portion 243 over the entire length in the Z direction. Specifically, the upper half of the common through wiring 251 is formed on at least a portion of the inner surface of the upper recess 241 that is located on the +Y side. The upper end edge of the common through wiring 251 is located on the upper end opening edge of the upper recess 241 (first through portion 243). The lower half of the common through wiring 251 is formed on the +Y side inner surface 242a of the inner surface of the lower recess 242. The upper and lower halves of the common through wiring 251 are connected at the boundary portion between the upper recess 241 and the lower recess 242. The lower end edge of the common through wiring 251 is located on the lower end opening edge of the lower recess 242 (first through portion 243). A lower end edge of the common through wiring 251 is connected to the common lead-out wiring 232 on the upper surface of the tail portion 202a. As shown in Fig. 27, adjacent common through wirings 251 are separated from each other at a portion of the lower recess 242 located between the first through portions 243.

[0125] 26 and 29, the common pad 255 is formed on the upper surface of the cover plate 203. The common pad 255 extends in the Y direction on the upper surface of the cover plate 203. A -Y side end of the common pad 255 is connected to the upper edge of the common through wiring 251 at the upper opening edge of the first through portion 243.

[0126] The individual through wiring 252 connects between the individual lead wiring 237 and the individual pad 256. The individual through wiring 252 is formed on the inner surface of each second through portion 248 over the entire length in the Z direction. Specifically, the upper half of the individual through wiring 252 is formed on at least a portion of the inner surface of the upper recess 246 that is located on the -Y side. The upper end edge of the individual through wiring 252 is located on the upper end opening edge of the upper recess 246 (second through portion 248). The lower half of the individual through wiring 252 is formed on the -Y side inner surface 247b of the inner surface of the lower recess 247. The upper and lower halves of the individual through wiring 252 are connected at the boundary portion between the upper recess 246 and the lower recess 247. The lower end edge of the individual through wiring 252 is located on the lower end opening edge of the lower recess 247 (second through portion 248). The lower end edges of the individual through wirings 252 are connected to the individual lead-out wirings 237 on the upper surface of the tail portion 202a. As shown in Fig. 27, adjacent individual through wirings 252 are separated from each other at a portion of the lower recess 247 that is located between the second through portions 248.

[0127] 29, the individual pads 256 are formed on the upper surface of the cover plate 203. The individual pads 256 extend in the Y direction on the upper surface of the cover plate 203. A +Y side end of the individual pads 256 is connected to the upper edge of the individual through wiring 252 at the upper opening edge of the second through portion 248. A flexible printed circuit board (not shown) is pressure-bonded to the upper surface of the cover plate 203.

[0128] In the head chip 200 of the fourth embodiment, ejection channels (ejection channels) 211 and non-ejection channels (non-ejection channels) 212 are formed in the actuator plate 202, and common lead-out wiring 232 and individual lead-out wiring 237 are formed on the upper surface of the actuator plate 202. According to this configuration, the common electrode 231 formed on the inner surface of the ejection channel 211 can be easily routed to the common through-wire 251 , and the individual electrodes 236 formed on the inner surface of the non-ejection channel 212 can be easily routed to the individual through-wire 252 . Moreover, compared to a configuration in which a flexible printed circuit board is pressure-bonded to actuator plate 202, the thickness of the portion of head chip 200 to which the flexible printed circuit board is pressure-bonded can be ensured. Therefore, the work of pressure-bonding the flexible printed circuit board becomes easier, and manufacturing efficiency and yield can be improved.

[0129] Fifth embodiment FIG. 30 is a cross-sectional view of head chip 200 according to the fifth embodiment, corresponding to FIG. In the above-described fourth embodiment, the common through wiring 251 and the individual through wiring 252 are formed on the inner surfaces of the corresponding through portions 243, 248 that are farther in the Y direction (for example, the +Y side inner surface 242a or the -Y side inner surface 247b), but this is not limited to the configuration. For example, in the head chip 200 shown in Fig. 30, the common through wiring 251 and the individual through wiring 252 may be formed on the inner surfaces of the corresponding through portions 243, 248 that are closer in the Y direction.

[0130] Specifically, the common through wiring 251 is formed in a portion located on the -Y side of the inner surface of the first through portion 243. The common pad 255 extends on the upper surface of the cover plate 203 from the upper opening edge of the first through portion 243 to the -Y side. The individual through wiring 252 is formed in a portion located on the +Y side of the inner surface of the second through portion 248. The individual pad 256 extends from the upper opening edge of the second through portion 248 to the +Y side on the upper surface of the cover plate 203. Therefore, the common pad 255 and the individual pad 256 are disposed in a portion of the upper surface of the cover plate 203 that is located between the conductive portions 240, 250.

[0131] According to the configuration of the fifth embodiment, common pad 255 and individual pad 256 can be arranged close to each other while reducing the wiring length of common pad 255 and individual pad 256 on the upper surface of cover plate 203. This makes it possible to reduce the electrostatic capacitance of head chip 200. As a result, the responsiveness of head chip 200 can be improved, and heat generation in head chip 200 can also be suppressed.

[0132] Sixth embodiment FIG. 31 is a cross-sectional view of head chip 200 according to the sixth embodiment, corresponding to FIG. The sixth embodiment differs from the above-described embodiments in that a common through wire 251 and an individual through wire 252 are formed on the inner surfaces of corresponding through portions 243, 248 that face in the same direction.

[0133] 31, common through wiring 251 is formed in a portion located on the +Y side of the inner surface of first through portion 243. Common pad 255 extends from the upper opening edge of first through portion 245 to the +Y side on the upper surface of cover plate 203. The individual through wiring 252 is formed in a portion located on the +Y side of the inner surface of the second through portion 248. The individual pad 256 extends on the upper surface of the cover plate 203 from the upper opening edge of the second through portion 248 to the +Y side.

[0134] According to the configuration of the sixth embodiment, when the common through wiring 251 and the individual through wiring 252 are formed by, for example, oblique deposition, the films can be formed from the same direction (for example, the -Y side), which can improve manufacturing efficiency.

[0135] Seventh embodiment 32 and 33 are cross-sectional views of head chip 200 according to the seventh embodiment. The seventh embodiment differs from the above-described embodiments in that two systems of wiring are formed in one through-hole. In the head chip 200 shown in FIGS. 32 and 33, the conductive portion 260 includes an upper recess 261 and a lower recess 262. As shown in FIG. The upper recess 261 is formed in a tapered shape in which the inner diameter in at least the Y direction gradually decreases from the top to the bottom in a cross-sectional view.

[0136] The lower recess 262 is formed in a groove shape extending in the X direction so as to span all of the upper recesses 261. The lower recess 262 communicates with the inside of the upper recess 261 through a portion that overlaps with the upper recess 261 in a plan view. In the first conductive portion 260, a portion where the upper recess 261 and the lower recess 262 communicate with each other constitutes a through portion 263 that penetrates the cover plate 203 in the Z direction.

[0137] Of the pair of inner surfaces facing each other in the Y direction in the lower recess 262, the +Y side inner surface (first inner surface portion) 262a is connected without a step from the same position in a plan view as the +Y side opening edge of the lower end opening edge of the upper recess 261 (disposed at the same position in a plan view). Therefore, the +Y side inner surface 262a is located within the dimensional range of the lower end opening of the upper recess 261 as viewed in the Z direction, and extends continuously to the inner surface of the upper recess 261. Of the pair of inner surfaces of the lower recess 262 facing each other in the Y direction, the -Y side inner surface (first inner surface portion) 262b is connected to the -Y side opening edge of the lower end opening edge of the upper recess 261 without any step from the same position in a plan view (disposed at the same position in a plan view). Therefore, the -Y side inner surface 262b is located within the dimensional range of the lower end opening of the upper recess 261 as viewed from the Z direction, and extends continuously to the inner surface of the upper recess 261. The +X side end of the lower recess 262 is located on the +X side with respect to the upper recess 261 located closest to the +X side among the upper recesses 261. The -X side end of the lower recess 262 is located on the -X side with respect to the upper recess 261 located closest to the -X side among the upper recesses 261.

[0138] As shown in FIG. 32, the common through wiring 251 is formed over the entire length in the Z direction on a portion of the inner surface of the through portion 263 located on the +Y side. Specifically, the upper half of the common through wiring 251 is formed on at least a portion of the inner surface of the upper recess 261 located on the +Y side. The upper edge of the common through wiring 251 is located on the upper opening edge of the upper recess 261 (through portion 263). The lower half of the common through wiring 251 is formed on the +Y side inner surface 262a of the inner surface of the lower recess 262. The upper and lower halves of the common through wiring 251 are connected at the boundary between the upper recess 261 and the lower recess 262. The lower edge of the common through wiring 251 is located on the lower opening edge of the lower recess 262 (through portion 263).

[0139] FIG. 34 is a plan view of the cover plate 203. As shown in FIGS. 32 and 34, the common pad 255 extends on the upper surface of the cover plate 203 from the upper opening edge of the through portion 263 toward the +Y side.

[0140] As shown in FIG. 32, the individual through wiring 252 is formed over the entire length in the Z direction in a portion located on the -Y side of the inner surface of the through portion 263. Specifically, the upper half of the individual through wiring 252 is formed in at least a portion located on the -Y side of the inner surface of the upper recess 261. The upper end edge of the individual through wiring 252 is located at the upper end opening edge of the upper recess 261 (through portion 263). The lower half of the individual through wiring 252 is formed on the -Y side inner surface 262b of the inner surface of the lower recess 262. The upper and lower halves of the individual through wiring 252 are connected at the boundary portion between the upper recess 261 and the lower recess 262. The lower end edge of the individual through wiring 252 is located at the lower end opening edge of the lower recess 262 (through portion 263).

[0141] The common through wiring 251 and the individual through wiring 252 are separated from each other at the through portion 263. Specifically, the common through wiring 251 and the individual through wiring 252 are not formed on the inner surface of the upper recess 261 facing the X direction. Therefore, the upper halves of the common through wiring 251 and the individual through wiring 252 are separated from each other by the inner surface of the upper recess 261 facing the X direction. On the other hand, the lower recess 262 extends outward in the X direction with respect to the lower end opening edge of one of the upper recesses 261. Therefore, the lower halves of the common through wiring 251 and the individual through wiring 252 are separated from each other by the lower recess 262. Note that in order to separate the common through wiring 251 and the individual through wiring 252, a separating groove or the like may be formed in the through portion 263.

[0142] As shown in FIGS. 32 and 34, the individual pads 256 extend on the upper surface of the cover plate 203 from the upper opening edge of the through portion 263 to the −Y side.

[0143] In the seventh embodiment, both the common through wiring 251 and the individual through wiring 252 are formed in a through portion 263 formed by an upper recess 261 and a lower recess 262 that communicate with each other. Therefore, the number of through portions can be reduced compared to a case where separate through portions are formed for the common through wiring 251 and the individual through wiring 252. This allows for improved design freedom, narrower channel pitch, and smaller head chip 200. In addition, it is easier to ensure the opening area of ​​the upper end opening of the through portion 263 compared to the case where separate through portions are formed for the common through wiring 251 and the individual through wiring 252. Therefore, the electrode material can be effectively introduced into the through portion 263, and the yield can be improved.

[0144] Eighth embodiment FIG. 35 is a cross-sectional view of a head chip 200 according to the eighth embodiment. The eighth embodiment differs from the above-described embodiments in that the conductive portion 260 includes a partition wall 270 that partitions the lower recess 262 in the Y direction. 35, lower recess 262 includes common recess 271 located on the +Y side of partition wall 270, and individual recess 272 located on the -Y side of partition wall 270. Note that common recess 271 and individual recess 272 are formed by performing dicing in two rows using a dicer with a size smaller than that of constricted portion 112 in the lower recess forming step.

[0145] The lower half of the common through wiring 251 is formed on an inner surface located on the +Y side of the inner surfaces of the common recess 271 (a +Y side inner surface 262a of the lower recess 262). The lower half of the individual through-wire 252 is formed on an inner surface located on the -Y side among the inner surfaces of the individual recess 272 (the -Y side inner surface 262b of the lower recess 262).

[0146] In the eighth embodiment, as in the seventh embodiment described above, it is easier to ensure the opening area of ​​the upper end opening of the through portion 263 compared to the case where separate through portions are formed for the common through wiring 251 and the individual through wiring 252. In addition, by partitioning the lower recess 262 by the partition wall 270, the area of ​​the actuator plate 202 exposed through the through portion 263 can be reduced. Therefore, it is possible to prevent wirings of different systems from being connected to each other on the upper surface of the actuator plate 202. Note that, when there is a possibility that wirings of different systems will be connected to each other on the upper surface of the partition wall 270, the electrode material formed on the upper surface of the partition wall 270 may be appropriately removed.

[0147] In the fourth to eighth embodiments described above, side shoot head chip 200 has been described as an example, but the present disclosure is not limited to this configuration. For example, as shown in Fig. 36, the configuration according to the present disclosure may be adopted in a so-called edge shoot type head chip 200 that ejects ink from the end of ejection channel 211 in the extension direction (Y direction).

[0148] Ninth embodiment Fig. 37 is an exploded perspective view of head chip 300 according to the ninth embodiment. Fig. 38 is a cross-sectional view corresponding to line XXXVIII-XXXVIII in Fig. 37. Fig. 39 is a cross-sectional view corresponding to line XXXIX-XXXIX in Fig. 37. In each of the above-mentioned embodiments, the actuator plate corresponds to the first plate according to the present disclosure, and the cover plate corresponds to the second plate according to the present disclosure, but the present disclosure is not limited to this configuration. The ninth embodiment differs from the above-mentioned embodiments in that it includes an intermediate plate corresponding to the first plate and a surface plate corresponding to the second plate.

[0149] 37 to 39, head chip 300 includes nozzle plate 301, actuator plate 302, intermediate plate (first plate) 303, and surface plate (second plate) 304. Head chip 300 has nozzle plate 301, actuator plate 302, intermediate plate 303, and surface plate 304 stacked in this order in the Z direction.

[0150] A channel array 310 is formed in the actuator plate 302. The channel array 310 has ejection channels 311 that are filled with ink, and non-ejection channels 312 that are not filled with ink. 37 and 38, the discharge channel 311 penetrates the actuator plate 302 in the Z direction and extends linearly in the Y direction over the entire length of the actuator plate 302. The +Y side opening of each discharge channel 311 communicates with an inlet common flow path (not shown). Meanwhile, the -Y side opening of each discharge channel 311 communicates with an outlet common flow path (not shown). That is, the inlet common flow path and the outlet common flow path communicate with each discharge channel 311.

[0151] 37 and 39, the non-ejection channels 312 extend linearly in the Y direction in the portions of the actuator plate 302 that are located between adjacent ejection channels 311. The portions of the actuator plate 302 that are located between adjacent ejection channels 311 and non-ejection channels 312 each constitute a driving wall (driving portion) 313.

[0152] Both ends of the non-ejection channel 312 in the Y direction terminate within the actuator plate 302. Therefore, the non-ejection channel 312 does not communicate with the inlet common flow path and the outlet common flow path. The non-ejection channel 312 is formed in a circular arc shape that protrudes downward when viewed from the X direction. Specifically, the non-ejection channel 312 has a through portion 312a located in the center in the Y direction and cut-up portions 312b that are continuous with both sides of the through portion 312a in the Y direction.

[0153] The through portion 312a passes through the actuator plate 302 in the Z direction. The raised portion 312b opens on the upper surface of the actuator plate 302, and its dimension in the Z direction gradually decreases with increasing distance from the through portion 312a in the Y direction. That is, the upper end opening of the non-ejection channel 312 is formed by the through portion 312a and the raised portion 312b. On the other hand, the lower end opening of the non-ejection channel 312 is formed by the through portion 312a. A dividing groove 312c is formed in the center of the bottom surface of each raised portion 312b in the X direction.

[0154] In the following description, the portion of the actuator plate 302 located between adjacent ejection channels 311 and on the -Y side of the non-ejection channels 312 is referred to as the first tail 302a. The portion of the actuator plate 302 located between adjacent ejection channels 311 and on the +Y side of the non-ejection channels 312 is referred to as the second tail 302b.

[0155] <Intermediate plate 303> 37 to 39, the intermediate plate 303 functions as a connection substrate between various drive wirings formed on the actuator plate 302 and various terminal wirings formed on the surface plate 304. The intermediate plate 303 is a plate material made of a piezoelectric material such as PZT, a resin material such as polyimide, or other non-conductive material. The intermediate plate 303 has the same outer shape as the actuator plate 302 in a plan view, and is superimposed on the entire upper surface of the actuator plate 302. The intermediate plate 303 is bonded to the upper surface of the actuator plate 302 with an adhesive or the like.

[0156] 37 and 39, an intermediate common hole 303a, a first intermediate individual hole 303b, and a second intermediate individual hole 303c are formed in the intermediate plate 303. Each of the intermediate holes 303a to 303c is formed in a tapered shape such that the inner diameter gradually decreases from the top to the bottom.

[0157] The intermediate common hole 303a penetrates in the Z direction through a portion of the intermediate plate 303 that overlaps with the first tail portion 302a in a plan view. That is, the intermediate common hole 303a is provided between adjacent discharge channels 311. The first intermediate individual hole 303b and the second intermediate individual hole 303c are formed separately on both sides in the Y direction with respect to the non-ejection channel 312. Specifically, the first intermediate individual hole 303b penetrates in the Z direction a portion of the intermediate plate 303 that overlaps with the first tail portion 302a in a plan view and is located on the +Y side of the intermediate common hole 303a. The second intermediate individual hole 303c penetrates in the Z direction a portion of the intermediate plate 303 that overlaps with the second tail portion 302b in a plan view. In other words, the first intermediate individual hole 303b and the second intermediate individual hole 303c are provided for each non-ejection channel 311.

[0158] <Surface plate 304> The surface plate 304 is used for connecting the head chip 300 to a flexible printed circuit board (external wiring). The surface plate 304 is a plate material made of a piezoelectric material such as PZT, a resin material such as polyimide, or other non-conductive material. In this case, the intermediate plate 303 and the surface plate 304 may be made of the same material or different materials.

[0159] The surface plate 304 has the same outer shape as the intermediate plate 303 in a plan view, and is superimposed on the entire upper surface of the intermediate plate 303. The surface plate 304 is bonded to the upper surface of the intermediate plate 303 with an adhesive or the like.

[0160] As shown in FIGS. 37 and 38, the surface plate 304 is formed with a surface common hole 304a and surface individual holes 304b. The surface common hole 304a penetrates in the Z direction through a portion of the surface plate 304 that overlaps with the -Y side end of the discharge channel 311 in a plan view (a portion located between adjacent first tail portions 302a). That is, the surface common hole 304a is provided corresponding to each discharge channel 311. In a plan view, the surface common hole 304a is disposed so as to be shifted in the X direction relative to the intermediate common hole 303a. Meanwhile, in a side view, the lower end opening of the surface common hole 304a is located on the +Y side relative to the intermediate common hole 303a.

[0161] The surface common hole 304a has an upper recess 321 and a lower recess 322, similar to the above-described embodiments. The surface common hole 304a opens at the upper surface of the surface plate 304. That is, the upper recess 321 constitutes the upper end opening of the surface common hole 304a. The upper recess 321 is formed in a tapered shape in which the inner diameter in at least the Y direction gradually decreases from the top to the bottom in a cross-sectional view.

[0162] The lower recess 322 opens on the lower surface of the surface plate 304. That is, the lower recess 322 constitutes the lower end opening of the surface common hole 304a. The lower recess 322 is formed in a groove shape extending in the X direction so as to span all of the upper recesses 322. The lower recess 322 communicates with the upper recess 321 through a portion that overlaps with the upper recess 321 in a plan view. The portion of the surface common hole 304a where the upper recess 321 and the lower recess 322 communicate with each other constitutes a first penetration portion 325 that penetrates the surface plate 304 in the Z direction.

[0163] The lower recess 322 has a dimension in the Y direction equal to the dimension in the Y direction of the lower end opening of the upper recess 321. In the illustrated example, the dimension in the Y direction of the lower recess 322 is uniform throughout the Z direction. Of a pair of inner surfaces facing each other in the Y direction in the lower recess 322, the +Y side inner surface (first inner surface portion) 322a is connected without a step from the same position as the +Y side opening edge of the lower end opening edge of the upper recess 321 in a plan view (disposed at the same position in a plan view). Therefore, the +Y side inner surface 322a is located within the dimensional range of the lower end opening of the upper recess 321 as viewed in the Z direction, and extends continuously to the inner surface of the upper recess 321. Of the pair of inner surfaces facing each other in the Y direction in the lower recess 322, the -Y side inner surface (first inner surface portion) 322b is connected without a step from the same position in a plan view as the -Y side opening edge of the lower end opening edge of the upper recess 321 (disposed at the same position in a plan view). Therefore, the -Y side inner surface 322b is located within the dimensional range of the lower end opening of the upper recess 321 as viewed in the Z direction, and extends continuously to the inner surface of the upper recess 321.

[0164] The +X side end of the lower recess 322 is located on the +X side of the upper recess 322 that is located furthest on the +X side among each upper recess 321. The -X side end of the lower recess 322 is located on the -X side of the upper recess 322 that is located furthest on the -X side among each upper recess 321.

[0165] As shown in FIG. 37 and FIG. 39, the surface individual hole 304b penetrates in the Z direction through a portion of the surface plate 304 that overlaps with the +Y side end of the non-ejection channel 312 in a plan view (a portion located on each second tail portion 302b). That is, the surface individual hole 304b is provided corresponding to each non-ejection channel 312. The surface individual hole 304b and the intermediate individual holes 303b and 303c are aligned in a straight line in the Y direction. Specifically, the lower end opening of the surface individual hole 304b is located on the +Y side relative to the second intermediate individual hole 303c. However, the lower end opening of the surface individual hole 304b may be provided on the -Y side relative to the second intermediate individual hole 303c, or may be formed at a position that overlaps with the first tail portion 302a in a plan view.

[0166] The surface individual hole 304 b includes an upper recess 326 and a lower recess 327 . A plurality of upper recesses 326 are formed in the surface plate 304 at intervals in the X direction.

[0167] The lower recess 327 is formed in a groove shape extending in the X direction so as to span all the upper recesses 326. That is, the lower recess 327 communicates with the upper recess 326 through the portion overlapping with the upper recess 326 in a plan view. The portion of the surface individual hole 304b where the upper recess 326 and the lower recess 327 communicate with each other constitutes a second through portion 328 penetrating the surface plate 304 in the Z direction. Of a pair of inner surfaces facing each other in the Y direction in the lower recess 327, the +Y side inner surface (first inner surface portion) 327a is connected without a step from the same position as the +Y side opening edge of the lower end opening edge of the upper recess 326 in a plan view (disposed at the same position in a plan view). Therefore, the +Y side inner surface 327a is located within the dimensional range of the lower end opening of the upper recess 326 as viewed in the Z direction, and extends continuously with respect to the inner surface of the upper recess 326. Of the pair of inner surfaces of the lower recess 327 facing each other in the Y direction, the -Y side inner surface (first inner surface portion) 327b is continuous without a step from the same position in plan view as the -Y side opening edge of the lower end opening edge of the upper recess 326 (disposed at the same position in plan view). Therefore, the -Y side inner surface 327b is located within the dimensional range of the lower end opening of the upper recess 326 as viewed in the Z direction, and extends continuously to the inner surface of the upper recess 326.

[0168] The +X side end of lower recess 327 is located on the +X side of upper recess 326 that is located furthest on the +X side among each upper recess 326. The -X side end of lower recess 327 is located on the -X side of upper recess 326 that is located furthest on the -X side among each upper recess 326.

[0169] Next, various wirings formed on the head chip 300 will be described. As shown in FIGS. 37 to 39, the actuator plate 302 is formed with common wiring 331 and individual wiring 332 as drive wiring.

[0170] The common wiring 331 includes a common electrode 335 and a common output wiring 336 . The common electrodes 335 are formed on the inner surfaces of the ejection channel 311 that face each other in the X direction. Each common electrode 335 is formed on the inner surface of the ejection channel 311 over the entire area in the Y and Z directions. 37, the common output wiring 336 extends in a strip shape in the X direction on the upper surface of the first tail portion 302a. The common output wiring 336 connects the common electrodes 335 that face each other in the X direction with the non-ejection channel 312 therebetween at the upper opening edges of the ejection channels 311 that face each other in the X direction with the non-ejection channel 312 therebetween.

[0171] As shown in FIGS. 37 and 39, the individual wiring 332 includes an individual electrode 338 and an individual extraction wiring 339. The individual electrodes 338 include a first individual electrode 338a formed on the inner surface facing the -X side of the inner surface of the non-ejection channel 312, and a second individual electrode 338b formed on the inner surface facing the +X side. Each individual electrode 338 is formed over the entire area in the Y direction and the Z direction on the inner surface of the non-ejection channel 312. The first individual electrode 338a and the second individual electrode 338b formed in the same non-ejection channel 312 are separated from each other by a separating groove 312c.

[0172] The individual output wiring 339 includes a first individual output wiring 339a and a second individual output wiring 339b. The first individual output wire 339a extends in the Y direction on the upper surface of the first tail portion 402a. The first individual output wire 339a is connected to the first individual electrode 338a at the upper opening edge of the non-ejection channel 312. The first individual output wire 339a is separated from the common output wire 336 on the surface of the first tail portion 402a.

[0173] The second individual output wires 339b extend in the Y direction on the upper surface of the second tail portion 402b. The second individual output wires 339b are connected to the second individual electrodes 338b at the edges of the upper openings of the non-ejection channels 312.

[0174] On the intermediate plate 303, common connection wiring 341 and individual connection wiring 342 are formed as connection wiring. The common connection wiring 341 includes a common through wiring 345 and a common lead-out wiring (first wiring) 346. The common through wiring 345 is formed on the inner surface of the intermediate common hole 303a. Specifically, the common through wiring 345 is formed around the entire inner surface of the intermediate common hole 303a and is formed over the entire Z direction. The common through wiring 345 is connected to the common output wiring 336 at the lower opening edge of the intermediate common hole 303a.

[0175] The common lead-out wiring 346 extends in the X direction so as to cross between the respective intermediate common holes 303a on the upper surface of the intermediate plate 303. The common lead-out wiring 346 is connected to the common through wiring 345 at the upper opening edge of the intermediate common hole 303a.

[0176] The individual connection wiring 342 includes a first individual through wiring 351 , a second individual through wiring 352 , and an individual lead-out wiring (first wiring) 353 . The first individual through wires 351 are formed on the inner surface of the first intermediate individual hole 303b over the entire Z direction. The first individual through wires 351 are connected to the first individual output wires 339a at the lower opening edge of the first intermediate individual hole 303b. The second individual through wires 352 are formed on the inner surface of the second intermediate individual hole 303c over the entire Z direction. The second individual through wires 352 are connected to the second individual output wires 339b at the lower opening edge of the second intermediate individual hole 303c.

[0177] The individual lead-out wiring 353 is formed on the upper surface of the intermediate plate 303. The individual lead-out wiring 353 connects between the first individual through wiring 351 located on the -X side of one ejection channel 311 and the second individual through wiring 352 located on the +X side of one ejection channel 311. This connects the individual electrodes 338a, 338b facing each other in the X direction with one ejection channel 311 in between (the second individual electrodes 338b of the non-ejection channels 312 located on the +X side of one ejection channel 311, and the first individual electrodes 338a of the non-ejection channels 312 located on the -X side of one ejection channel 311).

[0178] On the surface plate 304, a common terminal wiring 361 and individual terminal wiring 362 are formed as terminal wirings (second wirings). The common terminal wiring 361 includes a surface common wiring 361a and a common pad 361b.

[0179] The surface common wiring 361a is formed on the inner surface of the surface common hole 304a over the entire length in the Z direction. Specifically, the upper half of the surface common wiring 361a is formed on at least a portion of the inner surface of the upper recess 321 located on the +Y side. The upper end edge of the surface common wiring 361a is located at the upper end opening edge of the upper recess 321 (first through portion 323). The lower half of the surface common wiring 361a is formed on at least the +Y side inner surface 322a of the lower recess 322. The upper and lower halves of the surface common wiring 361a are connected at the boundary between the upper recess 321 and the lower recess 322. The lower end edge of the surface common wiring 361a is located at the lower end opening edge of the lower recess 322 (first through portion 323). The lower end edge of the surface common wiring 361a is connected to the common lead wiring 346 on the upper surface of the first tail portion 302a. In addition, the front surface common wiring 361a is not formed in the portion of the lower recess 322 located between the first through portions 323. In other words, the adjacent front surface common wirings 361a are separated from each other by the portion of the lower recess 322 located between the first through portions 323.

[0180] The common pad 361b extends in the Y direction on the upper surface of the surface plate 304. A -Y side end of the common pad 361b is connected to the upper edge of the surface common wiring 361a at the upper opening edge of the first penetrating portion 323.

[0181] The individual terminal wiring 362 includes a surface individual wiring 362a and an individual pad 362b. The surface individual wiring 362a is formed on the inner surface of the surface individual hole 304b over the entire length in the Z direction. Specifically, the upper half of the surface individual wiring 362a is formed on at least a portion of the inner surface of the upper recess 326 that is located on the -Y side. The upper end edge of the surface individual wiring 362a is located at the upper end opening edge of the upper recess 326 (second through portion 328). The lower half of the surface individual wiring 362a is formed on at least the -Y side inner surface 327a of the lower recess 327. The upper and lower halves of the surface individual wiring 362a are connected at the boundary portion between the upper recess 326 and the lower recess 327. The lower end edge of the surface individual wiring 362a is located at the lower end opening edge of the lower recess 327 (second through portion 328). The lower end edge of the surface individual wiring 362a is connected to the individual lead wiring 353 on the upper surface of the tail portion 302b. It should be noted that no surface individual wiring 362a is formed in the portion of the lower recess 327 that is located between the second through-holes 328. In other words, adjacent surface individual wirings 362a are separated from each other by the portion of the lower recess 327 that is located between the second through-holes 328.

[0182] The individual pad 362b extends in the Y direction on the upper surface of the surface plate 304. A +Y side end of the individual pad 362b is connected to the upper edge of the individual common wiring 362a at the upper opening edge of the second penetrating portion 328. A flexible printed circuit board (not shown) is pressure-bonded to the upper surface of the surface plate 304.

[0183] <Nozzle plate 301> The nozzle plate 301 is bonded to the lower surface of the actuator plate 302 via an adhesive or the like. The nozzle plate 301 is formed with a plurality of nozzle holes 301a penetrating the nozzle plate 301 in the Z direction.

[0184] The ninth embodiment can also achieve the same effects as the above-described embodiments.

[0185] (Other variations) The technical scope of the present disclosure is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present disclosure. For example, in the above embodiment, the inkjet printer 1 has been described as an example of a liquid jet recording apparatus, but the liquid jet recording apparatus is not limited to a printer. For example, the liquid jet recording apparatus may be a fax machine, an on-demand printer, or the like. In the above-described embodiment, a configuration in which the inkjet head moves relative to the recording medium during printing (so-called shuttle machine) has been described as an example, but the present disclosure is not limited to this configuration. The configuration according to the present disclosure may be adopted in a configuration in which the recording medium moves relative to the inkjet head while the inkjet head is fixed (so-called fixed head machine). In the above embodiment, the recording medium P is paper, but this is not limited to the above configuration. The recording medium P is not limited to paper, and may be a metal material, a resin material, or a food product. In the above-described embodiment, the liquid ejection head is mounted on the liquid ejection recording device, but the present invention is not limited to this configuration. In other words, the liquid ejected from the liquid ejection head is not limited to the liquid that is to be landed on the recording medium, and may be, for example, a medicinal liquid to be mixed in a medicine, a food additive such as a seasoning or a fragrance to be added to food, or an aromatic to be sprayed into the air.

[0186] In the above embodiment, the configuration has been described in which the Z direction coincides with the direction of gravity, but the present invention is not limited to this configuration, and the Z direction may be aligned with the horizontal direction. In the above embodiment, the upper recess is formed by sandblasting and the lower recess is formed by dicing, but the present invention is not limited to this configuration. The upper recess and the lower recess may be formed by a method appropriately selected from various processing methods such as sandblasting, dicing, and etching.

[0187] In each of the above-described embodiments, the first plate is an actuator plate or an intermediate plate, and the second plate is a cover plate or a surface plate, but the present invention is not limited to this configuration. In each of the above-described embodiments, the pads are formed on the second plate itself, but the present invention is not limited to this configuration. The pads may be formed on another plate disposed on the opposite side of the second plate from the first plate.

[0188] In the above-mentioned embodiment, the configuration in which the surfaces on both sides in the Y direction of the inner surface of the lower recess extend continuously from the same position as the lower end opening edge of the upper recess has been described, but the present invention is not limited to this configuration. It is sufficient that at least a part of the inner surface of the lower recess extends continuously from the same position as the lower end opening edge of the upper recess. In this case, in the above-mentioned embodiment, the configuration in which the constriction 112 formed by the blast mark 110 is completely removed has been described, but the present invention is not limited to this configuration. For example, as in the conductive portion 400 shown in FIG. 40, the constriction 112 may remain at a part of the boundary between the upper recess 401 and the lower recess 402. In this case, the part of the lower recess 402 from which the constriction 112 has been removed functions as the second inner surface portion. In the above-described embodiment, the configuration in which the inner surfaces of the lower recess on both sides in the X direction are disposed outside the lower end opening edge of the upper recess has been described, but the present invention is not limited to this configuration. It is sufficient that at least a part of the inner surface of the lower recess is disposed outside the lower end opening edge of the upper recess.

[0189] In the above-described embodiment, the upper recess is provided individually for each pressure chamber or ejection channel, but the present invention is not limited to this configuration. One upper recess may be provided for multiple pressure chambers (or ejection channels). In the above-described embodiment, the through hole and the conductive portion overlap each other in a plan view. However, the present invention is not limited to this configuration. In the above embodiment, the upper recess is tapered, but the present invention is not limited to this configuration. The upper recess may have a uniform inner diameter.

[0190] In the above-described embodiment, a configuration has been described in which a part of the inner surface of the lower recess extends continuously from the same position as the lower end opening edge of the upper recess, but the present invention is not limited to this configuration. For example, as in the conductive portion 410 shown in FIG. 41, a part of the inner surface of the lower recess 411 (first inner surface portion) may be located inside the lower end opening edge of the upper recess 412 (second inner surface portion). Furthermore, a part of the inner surface of the lower recess may be disposed flush with the inner surface of the upper recess 412 (on the same plane).

[0191] In addition, within the scope of the present disclosure, the components in the above-described embodiments may be replaced with well-known components as appropriate, and the above-described modified examples may be combined as appropriate. [Explanation of symbols]

[0192] 1: Printer (liquid jet recording device) 5: Inkjet head (liquid ejection head) 50: Head chip 54: Actuator plate (first plate) 54p: Drive unit 61: Pressure chamber 70:Outer overhang 71: Upper recess (first recess) 72: Lower recess (second recess) 75: Upper recess (first recess) 76: Lower recess (second recess) 81d: Top surface wiring (first wiring) 82d: Top surface wiring (first wiring) 85: Second common through wiring (second wiring) 86: Second individual through wiring (second wiring) 87: Common pad (second wiring) 88: Individual pad (second wiring) 200: Head chip 202: Actuator plate (first plate) 215: Drive wall (drive section) 232: Common lead wiring (1st wiring) 237: Individual lead-out wiring (1st wiring) 241: Upper recess (first recess) 242: Lower recess (second recess) 246: Upper recess (first recess) 247: Lower recess (second recess) 251: Common through wiring (second wiring) 252: Individual through wiring (second wiring) 255: Common pad (second wiring) 256: Individual pad (second wiring) 261: Upper recess (first recess) 262: Lower recess (second recess) 270: Partition wall 271: Common recess 272: Individual recess 300: Head chip 303: Intermediate plate (first plate) 304: Surface plate (second plate) 313: Drive wall (drive section) 321: Upper recess (first recess) 322: Lower recess (second recess) 345: Common through-hole wiring 346: Common wiring (first wiring) 353: Individual wiring (first wiring) 361: Common terminal wiring (second wiring) 362: Individual terminal wiring (second wiring)

Claims

1. a first plate having a first wiring formed on a surface facing a first side in a thickness direction, the first wiring corresponding to a pressure chamber in which liquid is accommodated; a second plate attached onto the surface; The second plate has: a first recess that opens onto a first surface facing a first side in the thickness direction; a second recess that opens onto a second surface facing a second side that is opposite to the first side in the thickness direction and communicates with the first recess; The second recess is a first inner surface portion that is located within a dimensional range of the first recess as viewed in the thickness direction and extends in the thickness direction continuously with respect to an inner surface of the first recess, or extends in the thickness direction on the inner side of the first recess; a second inner surface portion extending in the thickness direction on the outer side of the inner surface of the first recess at a position different from the first inner surface portion when viewed in the thickness direction, A head chip in which a second wiring is formed on the second plate, the second wiring penetrating the second plate through the first inner surface portion and the inner surface of the first recess, and connecting between an external wiring provided on a first side of the second plate in the thickness direction and the first wiring.

2. The head chip according to claim 1 , wherein an opening area of ​​the second recess on the second surface is larger than an opening area of ​​the first recess on the first surface.

3. The first recesses are provided in a plurality of spaces in a first direction intersecting the thickness direction, 3. The head chip according to claim 1, wherein a plurality of the second recesses are provided corresponding to the plurality of the first recesses, respectively.

4. The first recesses are provided in a plurality of spaces in a first direction intersecting the thickness direction, The second recess extends in the first direction so as to straddle at least two adjacent first recesses among the plurality of first recesses, the first inner surface portion is an inner surface of the second recess, and extends in the thickness direction continuously with respect to the inner surface of the first recess in a second direction intersecting the first direction as viewed from the thickness direction, or extends in the thickness direction on the inner side of the first recess, 3 . The head chip according to claim 1 , wherein the second inner surface portion is an inner surface of the second recess that extends in the thickness direction on an outer side in the first direction with respect to the inner surface of the first recess.

5. an actuator plate having a drive portion disposed facing the pressure chamber and deformable so that the pressure chamber expands or contracts; a common electrode and an individual electrode formed on the actuator plate to generate an electric field in the actuator plate and to deform the actuator plate; The first wiring is a common lead wire connected to the common electrode; 3. The head chip according to claim 1, further comprising: individual lead wires connected to the individual electrodes.

6. The second wiring is a common through wiring connected to the common lead wiring; an individual through wiring connected to the individual lead wiring; The head chip according to claim 5 , wherein the common through wire and the individual through wires are formed independently of each other on inner surfaces of one of the first recesses and one of the second recesses which are in communication with each other.

7. The second wiring is a common through wiring connected to the common lead wiring; an individual through wiring connected to the individual lead wiring; The second recess is A common recess communicating with one of the first recesses; an individual recess communicating with the one first recess in a state separated from the common recess by a partition wall, the common through-hole wiring is formed across the inner surfaces of the one first recess and the common recess, The head chip according to claim 5 , wherein the individual through-wiring is formed across the inner surfaces of the one first recess and the individual recess.

8. The first recess is formed in a tapered shape in which an inner diameter decreases toward a second side in the thickness direction, 3. The head chip according to claim 1, wherein a dimension of the first recess in the thickness direction is larger than a dimension of the second recess in the thickness direction.

9. The first recess is formed in a tapered shape such that an inner diameter gradually decreases toward the second side in the thickness direction, 3. The head chip according to claim 1, wherein a dimension of the first recess in the thickness direction is smaller than a dimension of the second recess in the thickness direction.

10. A liquid jet head comprising the head chip according to claim 1 or 2.

11. A liquid jet recording apparatus comprising the liquid jet head according to claim 10.

12. a first plate having a first wiring corresponding to a pressure chamber in which liquid is accommodated formed on a surface of the first plate facing a first side in a thickness direction; a second plate having a first recess that opens on a first surface facing a first side in the thickness direction, and a second recess that opens on a second surface facing a second side opposite to the first side in the thickness direction and communicates with the first recess, a wiring forming step of forming a second wiring on an inner surface of the first recess and an inner surface of the second recess through an opening on the first surface of the first recess in a state where the second plate is bonded to the front surface of the first plate, the second wiring connecting an external wiring provided on a first side in the thickness direction of the second plate to the first wiring, The second recess is a first inner surface portion that is located within a dimensional range of the first recess as viewed in the thickness direction and extends in the thickness direction continuously with respect to an inner surface of the first recess, or extends in the thickness direction on the inner side of the first recess; A method for manufacturing a head chip comprising: a second inner surface portion extending in the thickness direction, outside the inner surface of the first recess, at a position different from the first inner surface portion when viewed in the thickness direction.

13. the first recess is formed by performing a sandblasting process from the first surface side, The method for manufacturing a head chip according to claim 12 , wherein the second recess is formed by performing a dicing process from the second surface side.

Images