Compression molding apparatus and compression molding method

Abstract

To provide a compression molding apparatus and a compression molding method capable of preventing occurrence of molding defects caused by uneven spraying, residual gas, and dust generation during molding, and capable of preventing formation of thin burrs in sealing resin at exposed parts of a molded product.SOLUTION: A compression molding apparatus 1 uses a sealing mold 202 having a first mold 204 and a second mold 206, one of them serving as an upper mold and the other serving as a lower mold, to seal a workpiece W with a sealing resin R and process it into a molded product Wp. The sealing resin R is formed in a lattice shape having through holes Rh, the first mold 204 has a cavity 208 configured as a recess portion having a cavity piece 226 forming a bottom portion thereof, and the second mold 206 has a workpiece holding portion 205 for holding the workpiece W.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to a compression molding apparatus and a compression molding method. [Background technology]

[0002] 2. Description of the Related Art As an example of a resin sealing apparatus and a resin sealing method for sealing a workpiece having electronic components mounted on a substrate with a sealing resin and processing it into a molded product, a method using a compression molding method is known.

[0003] The compression molding method is a technique for resin sealing by supplying a predetermined amount of sealing resin to a sealing area (cavity) provided in a sealing mold comprising an upper mold and a lower mold, placing a workpiece in the sealing area, and clamping the upper mold and the lower mold. As an example, when a sealing mold having a cavity in the upper mold is used, a technique is known in which the sealing resin is supplied all at once to the center position on the workpiece to form the workpiece. On the other hand, when a sealing mold having a cavity in the lower mold is used, a technique is known in which a release film (hereinafter sometimes simply referred to as a "film") that covers the mold surface including the cavity and the sealing resin are supplied to form the workpiece (Patent Document 1: International Publication WO2015 / 159743). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] International Publication No. WO2015 / 159743 Summary of the Invention [Problem to be solved by the invention]

[0005] Traditionally, the compression molding method, in which the workpiece is held in the upper die, a cavity is created in the lower die, and sealing resin (granular resin, for example) is supplied into the cavity, has been widely adopted, as it was thought to have advantages in terms of preventing deformation of the workpiece due to the flow and contact of the sealing resin.

[0006] However, in a configuration in which a workpiece is held in the upper die and a cavity is provided in the lower die, there is a problem that if the workpiece is thin or large, it is difficult to hold it in the upper die and it is likely to fall. In addition, when granular resin is used as the sealing resin, there are problems such as dust generation during molding due to friction between resin particles, difficulty in handling, and difficulty in supplying (spreading) the sealing resin evenly over the entire area inside the cavity provided in the lower die, which tends to cause uneven spreading. In addition, there is a problem that air contained in the gaps between the particles when the sealing resin is spread and gas components caused by degassing from the sealing resin when melted do not escape and remain as voids in the molded product, which tends to cause molding defects.

[0007] On the other hand, regardless of the arrangement of the cavities, when forming a molded product in which electronic components such as a heat sink or a flip-chip connected chip are exposed, there was a problem that a thin burr of the sealing resin was likely to form on the exposed portion of the molded product (for a specific example, the top surface of the electronic component), resulting in incomplete exposure. [Means for solving the problem]

[0008] The present invention has been made in consideration of the above circumstances, and aims to provide a compression molding apparatus and a compression molding method that are capable of preventing the occurrence of molding defects due to uneven scattering, residual gas, and dust generation during molding, and that are capable of preventing the formation of thin burrs in the sealing resin at exposed portions of the molded product.

[0009] The present invention solves the above problems by the solution means described below as one embodiment.

[0010] In one embodiment, the sealing resin is a compression molding device that uses a sealing mold having a first mold and a second mold, one of which is an upper mold and the other is a lower mold, to seal a workpiece with sealing resin and process it into a molded product, with the sealing resin being formed in a lattice shape having through holes, the first mold having a cavity configured as a recess with a cavity piece forming the bottom, and the second mold having a work holding portion that holds the workpiece.

[0011] The sealing resin is preferably a solid resin formed by compressing a powder resin into tablets, or a sheet-like resin.

[0012] It is also preferable that the first mold further has a movable piece that is arranged inside the cavity at a position corresponding to the through hole in the sealing resin and is movable up and down, and that when the sealing mold is closed, the movable piece enters the through hole and abuts against the upper surface of the workpiece.

[0013] It is also preferable that the workpiece has a configuration in which electronic components are mounted on a base material, the sealing resin has a configuration in which a heat sink is fixed to block the through holes, and a member having elasticity and thermal conductivity is provided between a surface of the electronic components of the workpiece facing the heat sink and a surface of the sealing resin of the heat sink placed on the workpiece or inside the cavity facing the electronic components.

[0014] Moreover, a compression molding method according to one embodiment is a compression molding method in which a workpiece is sealed with sealing resin and processed into a molded product using a sealing mold including a first mold and a second mold, one of which is an upper mold and the other is a lower mold, and the method includes a work holding step of holding the workpiece in the second mold, a resin placing step of placing the sealing resin on the workpiece when the first mold is the upper mold, or placing the sealing resin inside the cavity of the first mold when the first mold is the lower mold, and a mold closing step of closing the sealing mold to seal the workpiece with the sealing resin and process the molded product. Effect of the Invention

[0015] The compression molding apparatus and compression molding method of the present invention make it possible to prevent molding defects caused by uneven scattering, residual gas, and dust generation during molding, and also to prevent the formation of thin burrs in the sealing resin at exposed areas of the molded product. [Brief description of the drawings]

[0016] [Figure 1] FIG. 1 is a plan view showing an example of a compression molding device according to an embodiment of the present invention. [Diagram 2] FIG. 2 is a side view showing an example of a press device of the compression molding device according to the first embodiment of the present invention. [Diagram 3] FIG. 2 is a front cross-sectional view showing an example of a sealing mold of the compression molding apparatus according to the first embodiment of the present invention. [Figure 4] 4 is an explanatory diagram illustrating an example of a compression molding method using a compression molding apparatus equipped with the press apparatus shown in FIG. 2 and the sealing mold shown in FIG. 3. [Diagram 5] FIG. 5 is an explanatory diagram following FIG. [Figure 6] FIG. 6 is an explanatory diagram following FIG. [Figure 7] FIG. 7 is an explanatory diagram following FIG. [Figure 8] FIG. 8 is an explanatory diagram following FIG. [Figure 9] FIG. 9 is an explanatory diagram following FIG. [Figure 10] 4 is a front cross-sectional view showing another example of the sealing mold of the compression molding apparatus according to the first embodiment of the present invention. FIG. [Figure 11] 11 is an explanatory view for explaining an example of a compression molding method using a compression molding apparatus equipped with the press apparatus shown in FIG. 2 and the sealing mold shown in FIG. [Figure 12] FIG. 12 is an explanatory diagram following FIG. [Figure 13] FIG. 13 is an explanatory diagram following FIG. 12. [Figure 14] FIG. 14 is an explanatory diagram following FIG. 13. [Figure 15] FIG. 11 is a side view showing an example of a press device of a compression molding device according to a second embodiment of the present invention. [Figure 16] FIG. 11 is a front cross-sectional view showing an example of a sealing mold of a compression molding apparatus according to a second embodiment of the present invention. [Figure 17] 17 is an explanatory view for explaining an example of a compression molding method using a compression molding apparatus equipped with the press apparatus shown in FIG. 15 and the sealing mold shown in FIG. 16. [Figure 18] FIG. 18 is an explanatory diagram following FIG. 17. [Figure 19] FIG. 19 is an explanatory diagram following FIG. 18. [Figure 20] FIG. 20 is an explanatory diagram following FIG. 19. [Figure 21] FIG. 21 is an explanatory diagram following FIG. 20. [Figure 22] FIG. 22 is an explanatory diagram following FIG. 21. [Figure 23] FIG. 11 is a front cross-sectional view showing another example of a sealing mold of a compression molding apparatus according to a second embodiment of the present invention. [Figure 24] 24 is an explanatory diagram illustrating an example of a compression molding method using a compression molding apparatus equipped with the press apparatus shown in FIG. 15 and the sealing mold shown in FIG. 23. [Diagram 25] FIG. 25 is an explanatory diagram following FIG. 24. [Figure 26] FIG. 27 is an explanatory diagram following FIG. 25. [Figure 27] This is an explanatory diagram following Figure 26. [Figure 28]1 is a perspective view showing an example of a workpiece to be molded in a compression molding apparatus and a compression molding method according to an embodiment of the present invention; [Figure 29] 1 is a perspective view showing an example of a sealing resin used in a compression molding apparatus and a compression molding method according to an embodiment of the present invention. [Diagram 30] 30 is a perspective view showing an example of a molded product obtained by compression molding using the sealing resin shown in FIG. 29. [Diagram 31] FIG. 11 is a perspective view showing another example of a sealing resin used in the compression molding apparatus and the compression molding method according to the embodiment of the present invention. [Diagram 32] 32 is a perspective view showing an example of a molded product obtained by compression molding using the sealing resin shown in FIG. 31. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] [First embodiment] The compression molding apparatus 1 according to this embodiment is an apparatus that performs resin sealing (compression molding) of a workpiece (molded product) W using a sealing mold 202 that includes a first mold (upper mold in this embodiment) 204 and a second mold (lower mold in this embodiment) 206. Hereinafter, as the compression molding apparatus 1, a compression molding apparatus that holds the workpiece W with a workpiece holding portion 205 provided on the lower mold 206, covers a cavity 208 (including a part of the mold surface 204a) provided on the upper mold 204 in a corresponding arrangement with a release film F, performs a clamping operation between the upper mold 204 and the lower mold 206, and seals the workpiece W with a sealing resin R will be described as an example.

[0018] The workpiece W to be molded has a configuration in which electronic components Wb are mounted on a substrate Wa (see FIG. 28). More specifically, examples of the substrate Wa include plate-shaped members such as a resin substrate, a ceramic substrate, a metal substrate, a carrier plate, a lead frame, and a wafer. Examples of the electronic components Wb include a semiconductor chip, a MEMS chip, a passive element, a heat sink, a conductive member, a spacer, and a coil sheet (note that the workpiece W may be configured to include only the electronic components Wb). The substrate Wa generally has a rectangular (striped), square, circular, or other shape. The number of electronic components Wb mounted on one substrate Wa is set to one or more.

[0019] Examples of methods for mounting the electronic component Wb on the substrate Wa include flip-chip mounting and wire bonding mounting. Alternatively, in the case of a configuration in which the substrate (glass or metal carrier plate) Wa is peeled off from the molded product Wp after resin sealing, there is also a method of attaching the electronic component Wb using a thermally peelable adhesive tape or an ultraviolet-curable resin that is cured by ultraviolet light irradiation. In this embodiment, a configuration in which the electronic component Wb is flip-chip connected to the substrate Wa via the bumps Wc is described as an example, but the present invention is not limited to this. Also, it is possible to expose a part of the substrate Wa and perform resin sealing, and then mount the electronic component Wb on the exposed part after resin sealing.

[0020] A thermosetting resin (such as, but not limited to, an epoxy resin containing a filler) is used as the sealing resin R. The sealing resin R is formed as a solid resin having a predetermined shape whose overall shape corresponds to the shape of the workpiece W. Usually, one piece constitutes the "whole" amount of sealing required (one application per workpiece W), but it may be configured so that several pieces (e.g., two or three pieces) are divided to constitute the "whole" amount of sealing required.

[0021] The "predetermined shape" is a lattice shape having through holes Rh penetrating the plate surface of the main body part Ra (see FIG. 29). Here, the "lattice shape" in the present application is exemplified as a matrix shape including a single row shape, but is not limited thereto, and may be a matrix shape having multiple rows and columns, a random shape, etc. By performing resin sealing (compression molding) using the above sealing resin R (hereinafter, sometimes written as "R1" to distinguish it), it is possible to prevent the formation of thin burrs on the upper surface Wbf of the electronic component Wb, and to form a molded product Wp (see FIG. 30) in which the upper surface Wbf is reliably exposed (the details of the forming method will be described later). The through holes Rh are required to be slightly larger in size than each electronic component Wb and to have the same shape as the electronic component Wb. In addition, the resin amount (height) of the sealing resin R (R1) is required to be an amount that allows the resin to enter under the electronic component Wb and seal it without excess or deficiency.

[0022] In addition, the above-mentioned "solid" does not mean a completely solid state, but includes a state in which it has melted to the so-called B stage, or a state immediately before melting. As the solid sealing resin R, a solid resin formed by tableting a powder resin is preferably used. This allows the amount of resin to be adjusted and supplied extremely accurately, compared to tableted resins formed using granular resins or crushed resins. However, it is not limited to powder resin, and a configuration may be used in which a granular resin, crushed resin, solid resin, liquid resin, or a combination of a plurality of these resins is used. In addition, a sheet-like resin is also preferably used as the solid sealing resin R. By using the solid sealing resin R, it is possible to solve the problems of dust generation during molding, the problem of difficult handling, and the problem of uneven spreading, compared to conventional granular resins. In addition, since the generation of voids can be suppressed, it is possible to reliably perform mold underfill, especially for electronic components Wb connected by flip chips.

[0023] As examples of film F, film materials having excellent heat resistance, ease of peeling, flexibility, and extensibility, such as PTFE (polytetrafluoroethylene), ETFE (polytetrafluoroethylene polymer), PET, FEP, fluorine-impregnated glass cloth, polypropylene, and polyvinylidine chloride, are preferably used.

[0024] Next, an overview of the compression molding apparatus 1 according to the present embodiment will be described. As shown in FIG. 1, the compression molding apparatus 1 mainly includes a supply unit 10A that supplies the workpiece W and the sealing resin R, a press unit 10B that seals the workpiece W with the sealing resin R and processes it into a molded product Wp, and a storage unit 10C that stores the molded product Wp. As an example, the supply unit 10A, the press unit 10B, and the storage unit 10C are arranged in this order along the X direction in FIG. 1. However, the above configuration is not limited to this, and the equipment configuration within the unit, the number of units, the arrangement order of the units, etc. may be changed. For example, the supply unit 10A and the storage unit 10C may be arranged in reverse to each other in the X direction, or may be arranged to be concentrated in one position (not shown). In addition, the configuration may include units other than those described above (not shown).

[0025] In addition, the compression molding apparatus 1 has a guide rail 20 linearly provided between each unit, and a conveying device (first loader) 22 for conveying the work W and the sealing resin R (may be used for conveying things other than the work W and the sealing resin R) and a conveying device (second loader) 24 for conveying the molded product Wp (may be used for conveying things other than the molded product Wp) are provided so as to be movable between predetermined units along the guide rail 20. However, the above configuration is not limited, and a configuration may be provided with a common (single) conveying device (loader) for conveying the work W, the sealing resin R, the molded product Wp, etc. (not shown). Also, the conveying device may be configured to include a robot hand or the like instead of a loader.

[0026] In addition, in the compression molding apparatus 1, a control unit 90 that controls the operation of each mechanism in each unit is disposed in the supply unit 10A (it may be disposed in another unit).

[0027] (Supply unit) Next, the supply unit 10A included in the compression molding apparatus 1 will be described in detail.

[0028] The supply unit 10A includes a work supply magazine 12 that stores a plurality of workpieces W. Here, a known stack magazine, slit magazine, or the like is used as the work supply magazine 12. The supply unit 10A may also be configured to include a work stage (not shown) on which the workpieces W taken out of the work supply magazine 12 are placed.

[0029] The supply unit 10A also includes a resin supply section 14 that supplies the sealing resin R. Here, a known stack magazine, slit magazine, or the like is used as the resin supply section 14. The supply unit 10A may also be configured to include a resin stage or the like (not shown) on which the sealing resin R taken out from the resin supply section 14 is placed. The resin supply section 14 may also be configured to be disposed in the press unit 10B or the storage unit 10C (not shown). Alternatively, as another example, the resin supply section 14 may also be configured to be disposed outside the compression molding apparatus 1 and to be transported into the apparatus using a transport device such as a belt conveyor or a robot hand (not shown).

[0030] The workpiece W and the sealing resin R are held by the first loader 22 and carried into the press unit 10B, and are set at a predetermined position in the sealing mold 202. In this embodiment, the workpiece W is held by the workpiece holding portion 205 of the lower mold 206, and the sealing resin R is placed on the workpiece W held by the workpiece holding portion 205 (details of the process will be described later). Note that a known holding mechanism (e.g., a clamping configuration with holding claws, a suction hole communicating with a suction device and a suction configuration, etc.) is used as a holding mechanism for the workpiece W and the sealing resin R in the first loader 22 (not shown).

[0031] As a modified example of the above-described conveying device, instead of the first loader 22 moving in the X and Y directions, a separate conveying device (loader) that moves in the X direction to convey between units and a separate conveying device (loader) that moves in the Y direction to carry in and set into the sealing mold 202 may be provided (not shown).

[0032] The supply unit 10A also includes a preheater (not shown) for preheating the workpiece W and the sealing resin R. As an example, a known heating mechanism (e.g., an electric wire heater, an infrared heater, etc.) is used for the preheater. This allows the workpiece W and the sealing resin R to be preheated before being carried into the sealing mold 202. Note that a configuration without a preheater is also possible. Also, instead of or in addition to the preheater, a configuration in which a heater for preheating (not shown) is provided in the first loader 22 may also be used.

[0033] (Press unit) Next, the press unit 10B included in the compression molding apparatus 1 will be described in detail.

[0034] In this embodiment, two press units 10B (three or more or one) are provided. The press unit 10B is provided with a sealing die 202 having a pair of dies (for example, a plurality of die blocks, die plates, die pillars, etc., made of alloy tool steel, and other members are assembled) that are opened and closed. The press unit 10B is also provided with a press device 250 that drives the sealing die 202 to open and close to seal the workpiece W with resin. As an example, the press unit 10B is configured to include one press device 250, but may be configured to include multiple press devices (not shown). A side view (schematic view) of the press device 250 provided in the press unit 10B is shown in FIG. 2, and a front cross-sectional view (schematic view) of the sealing die 202 is shown in FIG. 3.

[0035] Here, as shown in FIG. 2, the press machine 250 is configured to include a pair of platens 254, 256, a plurality of tie bars 252 on which the pair of platens 254, 256 are supported, and a drive device for moving (raising and lowering) the platen 256. Specifically, the drive device is configured to include a drive source (e.g., an electric motor) 260 and a drive transmission mechanism (e.g., a ball screw or a toggle link mechanism) 262 (however, the present invention is not limited to this). In this embodiment, the platen 254 on the upper side in the vertical direction is set as a fixed platen (a platen fixed to the tie bars 252), and the platen 256 on the lower side is set as a movable platen (a platen slidably held by the tie bars 252 and raised and lowered). However, the present invention is not limited to this, and the platens may be set upside down, that is, the upper side may be set as a movable platen and the lower side as a fixed platen, or both the upper side and the lower side may be set as movable platens (neither is shown).

[0036] 3, the sealing mold 202 includes a first mold (upper mold) 204 (204A) and a second mold (lower mold) 206 as a pair of molds disposed between the pair of platens 254, 256 in the press device 250. The upper mold 204 (204A) is assembled to an upper platen (in this embodiment, the fixed platen 254), and the lower mold 206 is assembled to a lower platen (in this embodiment, the movable platen 256). The upper mold 204 (204A) and the lower mold 206 approach and move away from each other to close and open the mold (the mold is opened and closed in the vertical direction (up and down direction)).

[0037] In the present embodiment, as an example, a film supply mechanism 211 is provided that transports (supplies) a roll-shaped film F to the inside of the sealing die 202. Depending on the configuration of the workpiece W, the film F may be in a strip shape instead of a roll shape.

[0038] Next, a detailed description will be given of the lower mold 206 of the sealing mold 202. As shown in Fig. 3, the lower mold 206 includes a second chase 240, a second plate 242 held thereby, and the like.

[0039] In this embodiment, a workpiece holding section 205 is provided to hold the workpiece W at a predetermined position on the upper surface of the second plate 242. As an example, the workpiece holding section 205 has a workpiece guide pin (not shown) and a suction passage (hole, groove, etc.) that is arranged penetrating the second plate 242 and communicates with a suction device (not shown). Specifically, one end of the suction passage is connected to the die surface 206a of the lower die 206, and the other end is connected to a suction device arranged outside the lower die 206. This makes it possible to suck the workpiece W from the suction passage by driving the suction device, and to hold the workpiece W by suction on the die surface 206a (here, the upper surface of the second plate 242). Instead of the above-mentioned suction holding mechanism, or together with the suction holding mechanism, a configuration may be provided with holding claws that clamp the outer periphery of the workpiece W (not shown). The shape and number of the workpiece holding sections 205 provided on one lower die 206 are appropriately set according to the shape and number of the workpieces W (one or multiple).

[0040] In this embodiment, a lower die heating mechanism (not shown) is provided to heat the lower die 206 to a predetermined temperature. This lower die heating mechanism includes a heater (e.g., an electric wire heater), a temperature sensor, a power source, etc., and heating is controlled by the control unit 90. As an example, the heater is built into the second chase 240 and configured to apply heat to the entire lower die 206 and the workpiece W held by the workpiece holding unit 205. The heater heats the lower die 206 to a predetermined temperature (e.g., 100°C to 300°C).

[0041] Next, the upper mold 204 (204A) of the sealing mold 202 will be described in detail. As shown in Fig. 3, the upper mold 204 (204A) includes a first chase 210, a cavity piece 226 held thereby, a clamper 228, and the like. The first chase 210 is fixed to the lower surface of a support plate 214 via a support pillar 212. A cavity 208 is provided on the lower surface (surface on the lower mold 206 side) of the upper mold 204 (204A).

[0042] The clamper 228 is configured in an annular shape so as to surround the cavity piece 226, and is assembled to be movable up and down while being spaced (floating) from the lower surface of the support plate 214 via a push pin 222 and a clamper spring (a biasing member exemplified by a coil spring, for example) 224 (however, the assembly structure is not limited to this). The cavity piece 226 constitutes the inner part (bottom part) of the cavity 208, and the clamper 228 constitutes the side part of the cavity 208. The shape and number of cavities 208 provided in one upper mold 204 (204A) are appropriately set according to the shape and number of the workpieces W (one or multiple).

[0043] Here, the cavity piece 226 (inside the cavity 208) is provided with a movable piece 236 at a position corresponding to the through hole Rh of the sealing resin R (R1) held by the workpiece holding part 205. The movable piece 236 is supported in a state in which it is biased toward the lower mold 206 by a movable piece spring 234 via a pushing pin 232, and is configured to be movable in the mold opening and closing direction. In addition, the movable piece 236 is set, as an example, to have an outer diameter that is a predetermined dimension larger than the outer shape of the electronic component Wb in a plan view. That is, the movable piece 236 is configured to enter the through hole Rh of the sealing resin R (R1) and abut against the entire upper surface Wbf of the electronic component Wb when the mold is closed. This makes it possible to form a molded product Wp in which the upper surface Wbf of the electronic component Wb is exposed.

[0044] In addition, suction paths (holes, grooves, etc.) (not shown) communicating with a suction device are provided on the lower surface of the clamper 228 and at the boundary between the clamper 228 and the cavity piece 226. This allows the film F supplied from the film supply mechanism 211 to be adsorbed and held on the mold surface 204a including the inner surface of the cavity 208. In addition, the cavity 208 can be degassed when the mold is closed and resin sealing is performed.

[0045] In this embodiment, an upper die heating mechanism (not shown) is provided to heat the upper die 204 (204A) to a predetermined temperature. This upper die heating mechanism includes a heater (e.g., an electric wire heater), a temperature sensor, a power source, etc., and heating is controlled by the control unit 90. As an example, the heater is built into the first chase 210 and configured to apply heat to the entire upper die 204 (204A) and the sealing resin R contained in the cavity 208. The heater heats the upper die 204 (204A) to a predetermined temperature (e.g., 100°C to 300°C).

[0046] (Storage unit) Next, the storage unit 10C included in the compression molding apparatus 1 will be described in detail.

[0047] The molded product Wp is held by the second loader 24, removed from the sealing mold 202, and transported to the storage unit 10C. Note that the second loader 24 uses a known holding mechanism for the molded product Wp (for example, a clamping mechanism with holding claws, a suction hole communicating with a suction device for suction, etc.) (not shown).

[0048] As a modified example of the above-described conveying device, instead of the second loader 24 moving in the X and Y directions, a separate conveying device (loader) that moves in the X direction to convey between units and a separate conveying device (loader) that moves in the Y direction to unload from the sealing mold 202 may be provided (not shown).

[0049] The storage unit 10C includes a storage magazine 18 that stores a plurality of molded products Wp. Here, a known stack magazine, slit magazine, or the like is used as the storage magazine 18. The storage unit 10C may also include a molded product stage (not shown) on which the molded products Wp transported from the press unit 10B are placed.

[0050] (Compression molding method) Next, there will be described steps of the compression molding method according to this embodiment, which is carried out using the compression molding apparatus 1. Here, Fig. 4 to Fig. 9 are explanatory views of each step, and are illustrated as front cross-sectional views taken in the same direction as Fig. 3.

[0051] First, as a preparation step, a heating step (upper die heating step) is performed in which the upper die 204 (204A) is heated to a predetermined temperature (e.g., 100°C to 300°C) by the upper die heating mechanism. In addition, a heating step (lower die heating step) is performed in which the lower die 206 is heated to a predetermined temperature (e.g., 100°C to 300°C) by the lower die heating mechanism. In addition, a film supplying step is performed in which the film supplying mechanism 211 is operated to supply new film F and adsorb it to cover a predetermined area of ​​the mold surface 204a including the inner surface of the cavity 208 in the upper die 204 (204A).

[0052] After the preparation step, a workpiece holding step is performed in which the workpiece W is held by the workpiece holding portion 205 of the lower die 206 (see FIG. 4). Specifically, the workpiece W supplied from the workpiece supply magazine 12 is held by the first loader 22 and carried into the sealing die 202, and is held by the workpiece holding portion 205 of the second plate 242 (die surface 206a).

[0053] After the work holding step, a resin placing step is performed in which the sealing resin R (R1) is placed on the work W held by the work holding part 205 (see FIG. 5). Specifically, the sealing resin R (R1) supplied from the resin supply part 14 is held by the first loader 22 (or another conveying device may be used), carried into the sealing mold 202, and placed on the work W held by the work holding part 205. When forming a molded product Wp in which the upper surface Wbf of the electronic component Wb is exposed, the work W and the sealing resin R are aligned with each other and placed so that the electronic component Wb is accommodated in the through hole Rh of the sealing resin R (R1).

[0054] Alternatively, as another example of the resin placing step, the sealing resin R (R1) may be placed on the workpiece W before the above-mentioned workpiece holding step. In this case, the workpiece holding step is a step of holding the workpiece W with the sealing resin R (R1) placed thereon in the workpiece holding section 205. That is, the first loader 22 holds the workpiece W with the sealing resin R (R1) placed thereon, carries it into the sealing die 202, and holds it in the workpiece holding section 205. In this case, there is an advantage in that the workpiece W and the sealing resin R (R1) are carried into the sealing die 202 at one time, rather than being carried out separately.

[0055] After the resin placing step, a mold closing step is performed in which the workpiece W is sealed with the sealing resin R (R1) and processed into a molded product Wp. Specifically, the sealing mold 202 is closed, and the cavity piece 226 is relatively lowered in the cavity 208 surrounded by the clamper 228 to heat and press the sealing resin R (R1) against the workpiece W.

[0056] More specifically, the upper die 204 (204A) and the lower die 206 are moved closer to each other. At this time, the movable piece 236 enters the through hole Rh of the sealing resin R (R1) and comes into contact with the upper surface Wbf of the electronic component Wb of the work W, covering the entire upper surface Wbf (see FIG. 6). Next, the clamper 228 comes into contact with the base material Wa of the work W via the film F, and the work W is clamped (see FIG. 7). These steps may be set in the reverse order or simultaneously. Next, the lower surface of the cavity piece 226 (the area where the movable piece 236 is not provided) comes into contact with the sealing resin R (R1) placed on the base material Wa of the work W, and is further pressurized. As a result, the sealing resin R (R1) is thermally cured, and the resin sealing (compression molding) is completed (see FIG. 8).

[0057] As a step following the above mold closing step, a mold opening step is performed in which the sealing mold 202 is opened and the molded product Wp is separated from the used film F so that the molded product Wp can be taken out (see FIG. 9). In this embodiment, as described above, the resin sealing is performed in a state in which the movable piece 236 covers the upper surface Wbf (entire surface) of the electronic component Wb of the work W, so that a thin burr is prevented from being formed on the upper surface Wbf of the electronic component Wb, and a molded product Wp is formed in a state in which the upper surface Wbf (entire surface) is reliably exposed. As a modified example, it is also possible to set a partial area as the exposed portion instead of the entire surface of the upper surface Wbf of the electronic component Wb (not shown). It is also possible to set a partial area of ​​the substrate Wa as the exposed portion and mount the electronic component Wb on the exposed portion after the resin sealing (not shown).

[0058] After the mold opening step, a molded product carrying-out step is performed in which the second loader 24 carries the molded product Wp out of the sealing mold 202 and transports it to the storage unit 10C. As an example, the transported molded product Wp is stored in the storage magazine 18. After or in parallel with the molded product carrying-out step, a step is performed in which the film supply mechanism 211 is operated to send out the used film F from the sealing mold 202 and send a new film F into the sealing mold 202 and set it therein.

[0059] The above are the main steps of the compression molding method performed using the compression molding apparatus 1 when the sealing mold 202 is provided. However, the above order of steps is only an example, and the order of steps can be changed or steps can be performed in parallel as long as there is no problem.

[0060] As another example, the workpiece W can be compression molded using a sealing resin R (hereinafter, sometimes referred to as "R2" to distinguish it) having a different configuration. Specifically, the sealing resin R (R2) is in a lattice shape having through holes Rh, and a heat sink H is fixed to one side to block the through holes Rh (all or part) (see FIG. 31). As an example, the heat sink H is a plate-like member formed with a thickness of about 0.1 mm to several mm using a metal material (e.g., copper alloy, aluminum alloy, etc.), but is not limited thereto. By performing resin sealing (compression molding) using the sealing resin R (R2), a molded product Wp (see FIG. 32) having a configuration in which the heat sink H is exposed on the upper surface can be easily formed (details of the forming method will be described later).

[0061] When forming a molded product Wp in which the heat sink H is exposed using the above-mentioned sealing resin R (R2), an upper die 204B (see FIG. 10) having a general configuration without a movable piece may be used as the upper die 204, instead of the upper die 204A (see FIG. 3) having the above-mentioned movable piece 236. The steps of the compression molding method carried out in this case will be described with reference to FIGS. 11 to 14.

[0062] First, as preparation steps, an upper die heating step, a lower die heating step, and a film supplying step are carried out.

[0063] After the preparation step, a workpiece holding step is performed in which the workpiece W is held by the workpiece holding portion 205 of the lower die 206 .

[0064] After the work holding step, a resin placing step is performed in which the sealing resin R (R2) is placed on the work W held by the work holding part 205. Alternatively, as another example of the resin placing step, the sealing resin R (R2) may be placed on the work W before the above-mentioned work holding step. By using the sealing resin R2, it is not necessary to carry the sealing resin R and the heat sink H separately into the sealing die 202 (i.e., they can be carried in as one component in one step), so that the process can be simplified and the time can be shortened.

[0065] After the resin placing step, a mold closing step is performed in which the work W is sealed with the sealing resin R (R2) and processed into a molded product Wp. Specifically, the upper mold 204 (204B) and the lower mold 206 are moved closer to each other. At this time, the clamper 228 comes into contact with the base material Wa of the work W via the film F, and the work W is clamped (see FIG. 11). Next, the lower surface of the cavity piece 226 comes into contact with the upper surface of the heat sink H of the sealing resin R (R2) placed on the base material Wa of the work W, and the entire surface of the heat sink H is covered (see FIG. 12). These steps may be set to occur simultaneously. Next, the lower surface of the heat sink H, which is in contact with the cavity piece 226, presses the sealing resin R (R2) placed on the base material Wa of the work W. This causes the sealing resin R (R2) to thermally harden, and the resin sealing (compression molding) is completed (see FIG. 13). In this example, sealing resin R2 with heat sink H in the shape of Fig. 31 is used, but it is not necessarily required to have the heat sink H. In that case, the same molding can be achieved by carrying out a work holding step, then a resin placing step in which sealing resin R1 without a heat sink in the shape of Fig. 29 is placed on work W, then a heat sink placing step in which heat sink H is placed on sealing resin R1, and then a mold closing step.

[0066] As a step following the mold closing step, the sealing mold 202 is opened to separate the molded product Wp from the used film F so that the molded product Wp can be removed (see FIG. 14). Since the resin sealing is performed with the cavity piece 226 covering the upper surface (entire surface) of the heat sink H of the sealing resin R (R2) as described above, thin burrs are prevented from being formed on the upper surface of the heat sink H, and a molded product Wp (see FIG. 32) is formed with the upper surface (entire surface) reliably exposed.

[0067] Here, an elastic heat conductive resin sheet S may be disposed between the surface of the electronic component Wb mounted on the work W facing the heat sink H and the surface of the sealing resin R (R2) mounted on the work facing the electronic component Wb on the heat sink H. This fills the gap between the electronic component Wb and the heat sink H, preventing the upper surface of the electronic component Wb from being resin-sealed. In addition, the sealing resin R (R2) can be pressed down and pressurized via the heat sink H, and the clamping force at the time of closing the mold can be absorbed to prevent the electronic component Wb from being damaged. The elastic heat conductive resin sheet S may be provided (attached, for example) on the work W (electronic component Wb) in advance, or may be provided in the device (for example, the supply unit 10A) to supply the elastic heat conductive resin sheet S onto the work W (electronic component Wb) before resin sealing (not shown).

[0068] After the mold opening step, a molded product carrying-out step is performed in which the second loader 24 carries the molded product Wp out of the sealing mold 202 and transports it to the storage unit 10C. After or in parallel with the molded product carrying-out step, a film supply mechanism 211 is operated to send out the used film F from the sealing mold 202 and to feed a new film F into the sealing mold 202 and set it therein.

[0069] [Second embodiment] Next, a second embodiment of the present invention will be described. The compression molding apparatus 1 and the compression molding method according to this embodiment are basically the same as those of the first embodiment described above, but have differences in the configuration of the press unit 10B (particularly, the configuration of the press device and the sealing die) and the process performed mainly by the press unit 10B. Hereinafter, this embodiment will be described focusing on the differences.

[0070] The press unit 10B according to this embodiment includes a sealing die 302 having a pair of dies (for example, a plurality of die blocks, die plates, die pillars, and other members made of alloy tool steel assembled together) that are opened and closed. The press unit 10B also includes a press device 350 that drives the sealing die 302 to open and close to resin seal the workpiece W. As an example, the press unit 10B is configured to include one press device 350, but may include multiple press devices (not shown). A side view (schematic view) of the press device 350 provided in the press unit 10B is shown in FIG. 15, and a front cross-sectional view (schematic view) of the sealing die 302 is shown in FIG. 16.

[0071] Here, as shown in FIG. 16, the press machine 350 is configured to include a pair of platens 354, 356, a plurality of tie bars 352 on which the pair of platens 354, 356 are supported, and a drive device for moving (raising and lowering) the platen 356. Specifically, the drive device is configured to include a drive source (e.g., an electric motor) 360 and a drive transmission mechanism (e.g., a ball screw or a toggle link mechanism) 362 (however, the present invention is not limited to this). In this embodiment, the platen 354 on the upper side in the vertical direction is set as a fixed platen (a platen fixed to the tie bars 352), and the platen 356 on the lower side is set as a movable platen (a platen slidably held by the tie bars 352 and raised and lowered). However, the present invention is not limited to this, and the platens may be set upside down, that is, the upper side may be set as a movable platen and the lower side as a fixed platen, or both the upper side and the lower side may be set as movable platens (neither is shown).

[0072] 16, the sealing mold 302 includes a first mold (lower mold) 306 and a second mold (upper mold) 304 as a pair of molds disposed between the pair of platens 354, 356 in the press device 350. The upper mold 304 is assembled to the upper platen (in this embodiment, the fixed platen 354), and the lower mold 306 is assembled to the lower platen (in this embodiment, the movable platen 356). The upper mold 304 and the lower mold 306 move toward and away from each other to close and open the mold (the mold is opened and closed in the vertical direction (up and down direction)).

[0073] In the present embodiment, as an example, a film supply mechanism 313 is provided that transports (supplies) a roll-shaped film F to the inside of the sealing die 302. Depending on the configuration of the workpiece W, the film F may be in a strip shape instead of a roll shape.

[0074] Next, a detailed description will be given of the upper mold 304 of the sealing mold 302. As shown in Fig. 16, the upper mold 304 includes a second chase 340, a second plate 342 held thereby, and the like.

[0075] In this embodiment, a workpiece holding section 305 is provided to hold the workpiece W at a predetermined position on the lower surface of the second plate 342. As an example, the workpiece holding section 305 has a workpiece guide pin (not shown) and a suction passage (hole, groove, etc.) that is arranged penetrating the second plate 342 and communicates with a suction device (not shown). Specifically, one end of the suction passage is connected to the die surface 304a of the upper die 304, and the other end is connected to a suction device arranged outside the upper die 304. This makes it possible to suck the workpiece W from the suction passage by driving the suction device, and to hold the workpiece W by suction on the die surface 304a (here, the lower surface of the second plate 342). Instead of the above-mentioned suction holding mechanism, or together with the suction holding mechanism, a configuration may be provided with holding claws that clamp the outer periphery of the workpiece W (not shown). The shape and number of the workpiece holding sections 305 provided on one upper die 304 are appropriately set according to the shape and number of the workpieces W (one or multiple).

[0076] In this embodiment, an upper die heating mechanism (not shown) is provided to heat the upper die 304 to a predetermined temperature. This upper die heating mechanism includes a heater (e.g., an electric wire heater), a temperature sensor, a power source, etc., and heating is controlled by the control unit 90. As an example, the heater is built into the second chase 340 and configured to apply heat to the entire upper die 304 and the workpiece W held by the workpiece holding unit 305. The heater heats the upper die 304 to a predetermined temperature (e.g., 100°C to 300°C).

[0077] Next, the lower mold 306 (306A) of the sealing mold 302 will be described in detail. As shown in Fig. 16, the lower mold 306 (306A) includes a first chase 310, a cavity piece 326 held thereby, a clamper 328, and the like. The first chase 310 is fixed to the lower surface of a support plate 314 via a support pillar 312. A cavity 308 is provided on the upper surface (surface on the upper mold 304 side) of the lower mold 306 (306A).

[0078] The clamper 328 is formed in an annular shape so as to surround the cavity piece 326, and is assembled to be movable up and down while being spaced (floating) from the lower surface of the support plate 314 via a pushing pin 322 and a clamper spring (a biasing member exemplified by a coil spring, for example) 324 (however, the assembly structure is not limited to this). The cavity piece 326 constitutes the inner part (bottom part) of the cavity 308, and the clamper 328 constitutes the side part of the cavity 308. The shape and number of cavities 308 provided in one lower die 306 (306A) are appropriately set according to the shape and number of the workpieces W (one or multiple).

[0079] Here, the cavity piece 326 (inside the cavity 308) is provided with a movable piece 336 at a position corresponding to the through hole Rh of the sealing resin R (R1) held by the workpiece holding part 305. The movable piece 336 is supported in a state in which it is biased toward the upper mold 304 by a movable piece spring 334 via a pushing pin 332, and is configured to be movable in the mold opening and closing direction. In addition, the movable piece 336 is set, as an example, to have an outer diameter that is a predetermined dimension larger than the outer shape of the electronic component Wb in a plan view. That is, the movable piece 336 is configured to enter the through hole Rh of the sealing resin R (R1) and abut against the entire upper surface Wbf of the electronic component Wb when the mold is closed. This makes it possible to form a molded product Wp in which the upper surface Wbf of the electronic component Wb is exposed.

[0080] In addition, suction paths (holes, grooves, etc.) (not shown) communicating with a suction device are provided on the upper surface of the clamper 328 and at the boundary between the clamper 328 and the cavity piece 326. This allows the film F supplied from the film supply mechanism 313 to be adsorbed and held on the mold surface 306a including the inner surface of the cavity 308. In addition, the cavity 308 can be degassed when the mold is closed and resin sealing is performed.

[0081] In this embodiment, a lower die heating mechanism (not shown) is provided to heat the lower die 306 (306A) to a predetermined temperature. This lower die heating mechanism includes a heater (e.g., an electric wire heater), a temperature sensor, a power source, etc., and heating is controlled by the control unit 90. As an example, the heater is built into the first chase 310 and configured to apply heat to the entire lower die 306 (306A) and the sealing resin R contained in the cavity 308. The heater heats the lower die 306 (306A) to a predetermined temperature (e.g., 100°C to 300°C).

[0082] Next, there will be described steps of the compression molding method according to this embodiment, which is carried out using the compression molding apparatus 1. Here, Fig. 17 to Fig. 22 are explanatory views of each step, and are illustrated as front cross-sectional views in the same direction as Fig. 16.

[0083] First, as a preparation step, a heating step (upper die heating step) is performed in which the upper die 304 is adjusted to a predetermined temperature (e.g., 100°C to 300°C) and heated by the upper die heating mechanism (upper die heating step). In addition, a heating step (lower die heating step) is performed in which the lower die 306 (306A) is adjusted to a predetermined temperature (e.g., 100°C to 300°C) and heated by the lower die heating mechanism (lower die heating step). In addition, a film supplying step is performed in which the film supplying mechanism 313 is operated to supply new film F and adsorb it to cover a predetermined area of ​​the die surface 306a including the inner surface of the cavity 308 in the lower die 306 (306A).

[0084] After the preparation step, a workpiece holding step is performed in which the workpiece W is held by the workpiece holding portion 305 of the upper die 304 (see FIG. 17). Specifically, the workpiece W supplied from the workpiece supply magazine 12 is held by the first loader 22 and carried into the sealing die 302, and is held by the workpiece holding portion 305 of the second plate 342 (die surface 304a).

[0085] After or in parallel with the workpiece holding step, a resin placing step is performed in which the sealing resin R (R1) is placed (accommodated) in the cavity 308 of the lower die 306 (306A) (see FIG. 18). Specifically, the sealing resin R (R1) supplied from the resin supply unit 14 is held by the first loader 22 (or another conveying device may be used) and carried into the sealing die 302, and is accommodated in the cavity 308 of the lower die 306 (306A) (specifically, placed on the upper surface of the cavity piece 326). When forming a molded product Wp in which the upper surface Wbf of the electronic component Wb is exposed, the workpiece W and the sealing resin R (R1) are aligned with each other and placed so that the electronic component Wb is accommodated in the through hole Rh of the sealing resin R (R1).

[0086] After the resin placing step, a mold closing step is performed in which the workpiece W is sealed with the sealing resin R (R1) and processed into a molded product Wp. Specifically, the sealing mold 302 is closed, and the cavity piece 326 is relatively lowered in the cavity 308 surrounded by the clamper 328, and the sealing resin R is heated and pressurized against the workpiece W.

[0087] More specifically, the upper die 304 and the lower die 306 (306A) are moved closer to each other. At this time, the movable piece 336 enters the through hole Rh of the sealing resin R (R1) and comes into contact with the upper surface Wbf (facing downward) of the electronic component Wb of the work W, covering the entire upper surface Wbf (see FIG. 19). Next, the clamper 328 comes into contact with the base material Wa of the work W via the film F, and the work W is clamped (see FIG. 20). These steps may be set in the reverse order or simultaneously. Next, the sealing resin R (R1) is pressurized by the upper surface (area where the movable piece 336 is not provided) of the cavity piece 326 and the base material Wa of the work W. This causes the sealing resin R (R1) to thermally harden, completing the resin sealing (compression molding) (see FIG. 21).

[0088] As a step following the above mold closing step, the mold opening step is performed in which the sealing mold 302 is opened and the molded product Wp is separated from the used film F so that the molded product Wp can be taken out (see FIG. 22). In this embodiment, as described above, the resin sealing is performed in a state in which the movable piece 336 covers the upper surface Wbf (entire surface) of the electronic component Wb of the work W, so that the formation of a thin burr is prevented on the upper surface Wbf of the electronic component Wb, and the molded product Wp is formed in a state in which the upper surface Wbf (entire surface) is reliably exposed. As a modified example, it is also possible to set a partial area as the exposed portion instead of the entire surface of the upper surface Wbf of the electronic component Wb (not shown). It is also possible to set a partial area of ​​the substrate Wa as the exposed portion and mount the electronic component Wb on the exposed portion after the resin sealing (not shown).

[0089] After the mold opening step, a molded product carrying-out step is performed in which the second loader 24 carries the molded product Wp out of the sealing mold 302 and transports it to the storage unit 10C. As an example, the transported molded product Wp is stored in the storage magazine 18. After or in parallel with the molded product carrying-out step, a step is performed in which the film supply mechanism 313 is operated to send out the used film F from the sealing mold 302 and send a new film F into the sealing mold 302 and set it therein.

[0090] The above are the main steps of the compression molding method performed using the compression molding apparatus 1 when the sealing mold 302 is provided. However, the above order of steps is only an example, and the order of steps can be changed or steps can be performed in parallel as long as no problems occur.

[0091] As another example, the workpiece W can be compression molded using a sealing resin R (R2) having a different configuration. When forming a molded product Wp in which the heat sink H is exposed using the sealing resin R (R2), a lower die 306B (see FIG. 23) having a general configuration without a movable piece may be used as the lower die 306, instead of the lower die 306A (see FIG. 16) having the above-mentioned movable piece 336. The steps of the compression molding method carried out in this case will be described with reference to FIGS. 24 to 27.

[0092] First, as preparation steps, an upper die heating step, a lower die heating step, and a film supplying step are carried out.

[0093] After the preparation step, a workpiece holding step is performed in which the workpiece W is held by the workpiece holding portion 305 of the upper die 304 .

[0094] After or in parallel with the work holding step, a resin placing step is performed in which the sealing resin R (R2) is placed (contained) in the cavity 308 of the lower die 306 (306B). By using the sealing resin R2, it is not necessary to carry the sealing resin R and the heat sink H separately into the sealing die 302 (i.e., they can be carried in as one component in one step), which simplifies the process and shortens the time.

[0095] After the resin placing step, a mold closing step is performed in which the work W is sealed with the sealing resin R (R2) and processed into a molded product Wp. Specifically, the upper mold 304 and the lower mold 306 (306B) are moved closer to each other. At this time, the clamper 328 comes into contact with the base material Wa of the work W via the film F, and the work W is clamped (see FIG. 24). Next, the base material Wa of the work W comes into contact with the upper surface (the surface to which the heat sink H is not fixed) of the sealing resin R (R2) (see FIG. 25). These may be set to occur simultaneously. Next, the sealing resin R (R2) is pressurized by the heat sink H that is in contact with the cavity piece 326 and the base material Wa of the work W. This causes the sealing resin R (R2) to thermally harden, completing the resin sealing (compression molding) (see FIG. 26). In this example, sealing resin R2 with heat sink H in the shape of Fig. 31 is used, but it is not necessarily required to have the heat sink H. In that case, the same molding can be achieved by carrying out a work holding step, then a heat sink placing step in which the heat sink H is simply placed in cavity 308 in Fig. 23, then a resin placing step in which sealing resin R1 without a heat sink in the shape of Fig. 29 is placed on the heat sink H, and then a mold closing step. However, the work holding step and the heat sink placing step may be carried out in the reverse order or simultaneously.

[0096] As a step following the above mold closing step, the molding die 302 is opened to separate the molded product Wp from the used film F so that the molded product Wp can be removed (see FIG. 27). Since the resin sealing is performed with the cavity piece 326 covering the upper surface (entire surface) of the heat sink H of the sealing resin R (R2) as described above, thin burrs are prevented from being formed on the upper surface of the heat sink H, and a molded product Wp (see FIG. 32) is formed with the upper surface (entire surface) reliably exposed.

[0097] Here, an elastic heat conductive resin sheet S may be disposed between the surface of the electronic component Wb mounted on the work W facing the heat sink H and the surface of the sealing resin R (R2) placed on the work W facing the electronic component Wb on the heat sink H. This fills the gap between the electronic component Wb and the heat sink H, preventing the upper surface of the electronic component Wb from being resin-sealed. In addition, the sealing resin R (R2) can be pressed down via the heat sink H to apply pressure, and the clamping force at the time of mold closing can be absorbed to prevent the electronic component Wb from being damaged.

[0098] After the mold opening step, a molded product carrying-out step is performed in which the second loader 24 carries out the molded product Wp from the sealing mold 302 and transports it to the storage unit 10C. After or in parallel with the molded product carrying-out step, a film supply mechanism 313 is operated to send out the used film F from the sealing mold 302 and to feed a new film F into the sealing mold 302 and set it therein.

[0099] As described above, the molding device and molding method according to the present invention can prevent molding defects caused by uneven distribution, residual gas, and dust generation during molding, and can prevent the formation of thin burrs in the sealing resin at exposed parts of the molded product. In addition, handling before resin sealing can be simplified. Furthermore, by using a lattice-shaped solid sealing resin to which a heat sink is fixed, a molded product with a configuration in which the heat sink is exposed on the upper surface can be easily formed, and the compression molding process can be simplified and the time can be reduced.

[0100] The present invention is not limited to the above-described embodiment, and various modifications are possible without departing from the scope of the present invention. [Explanation of symbols]

[0101] 1. Compression molding equipment 202, 302 Sealing mold 236, 336 Movable piece H Heat sink R Sealing resin Rh through hole W work Wa substrate Wb Electronic Components

Claims

1. A compression molding apparatus for molding a workpiece into a molded product by sealing the workpiece with a sealing resin using a sealing mold having a first mold and a second mold, one of which is an upper mold and the other is a lower mold, The sealing resin is formed in a lattice shape having through holes, The first mold has a cavity formed as a recess having a bottom portion formed by a cavity piece, The second die has a work holding portion for holding the work. A compression molding apparatus comprising:

2. The sealing resin is a solid resin formed by compressing a powder resin into tablets, or a sheet-like resin.

2. The compression molding apparatus according to claim 1,

3. the first mold further includes a movable piece disposed inside the cavity at a position corresponding to the through hole of the sealing resin and movable up and down; When the sealing mold is closed, the movable piece enters the through hole and comes into contact with the upper surface of the work.

3. The compression molding apparatus according to claim 2,

4. The workpiece has a configuration in which an electronic component is mounted on a substrate, the sealing resin has a configuration in which a heat sink is fixed to close the through hole, A member having elasticity and thermal conductivity is provided between a surface of the electronic component of the workpiece facing the heat sink and a surface of the heat sink of the sealing resin placed on the workpiece or inside the cavity facing the electronic component.

4. The compression molding apparatus according to claim 2 or 3,

5. A compression molding method for molding a workpiece into a molded product by sealing the workpiece with a sealing resin using a sealing mold having a first mold and a second mold, one of which is an upper mold and the other is a lower mold, comprising: As the sealing resin, a sealing resin formed in a lattice shape having through holes is used, a workpiece holding step of holding the workpiece in the second die; a resin placing step of placing the sealing resin on the work when the first mold is an upper mold, and placing the sealing resin inside a cavity of the first mold when the first mold is a lower mold; a mold closing process in which the sealing mold is closed to seal the workpiece with the sealing resin and process it into the molded product; To be prepared A compression molding method comprising the steps of:

6. The sealing resin is a solid resin formed by tableting a powder resin, or a sheet-like resin. The compression molding method according to claim 5,

7. a heat sink placing step of placing a heat sink on the sealing resin after the resin placing step when the first mold is an upper mold, and a heat sink placing step of placing the heat sink inside the cavity of the first mold before the resin placing step when the first mold is a lower mold. The compression molding method according to claim 5 or 6, characterized in that

8. the mold closing step includes a step of, when the sealing mold is closed, a movable piece that is disposed inside the cavity of the first mold at a position corresponding to the through hole of the sealing resin and is movable up and down, entering the through hole and coming into contact with an upper surface of the workpiece. The compression molding method according to claim 6,

9. As the workpiece, a workpiece having a configuration in which an electronic component is mounted on a substrate is used, As the sealing resin, a sealing resin having a configuration in which a heat sink is fixed to close the through hole is used, A member having elasticity and thermal conductivity is provided between a surface of the electronic component of the workpiece facing the heat sink and a surface of the heat sink of the sealing resin placed on the workpiece or inside the cavity facing the electronic component. The compression molding method according to claim 6,

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