Processing system of workpiece

Abstract

To provide a processing system of a workpiece, capable of reducing an unauthorized invador into a clean room where a manufacturing step is executed.SOLUTION: A processing system 1 of a workpiece, comprises: a first room 1000 including a plurality of processing devices 100 that divides the workpiece to manufacture a plurality of device chips, a conveyance path 10 that is installed on an upper surface of each processing device 100 over the plurality of processing devices 100, and a conveyance vehicle 20 that conveys the workpiece between the plurality of processing devices 100 while traveling in the conveyance path 10; and a second room 2000 including a stocker 190 housing a plurality of workpieces, and replacing each workpiece between the stocker 190 and the conveyance vehicle 20. The first room 1000 and the second room 2000 are connected by the conveyance path 10 in which the conveyance vehicle 20 travels.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a workpiece processing system. [Background technology]

[0002] A workpiece processing system is known in which a transport vehicle (automated transport vehicle) transports the workpieces, processing tools, consumables used for processing, and other items to a processing device that processes multiple workpieces (see, for example, Patent Documents 1 and 2). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-163920 [Patent Document 2] JP 2019-204929 A Summary of the Invention [Problem to be solved by the invention]

[0004] In a manufacturing process in which such a workpiece processing system is used to divide a workpiece such as a semiconductor wafer and manufacture a plurality of device chips, there is a demand for improving the quality of the device chips. In order to improve the quality of the device chips, it is required to prevent the inclusion of foreign matter, and in order to prevent the inclusion of foreign matter, the manufacturing process is carried out in a clean room, but the entry of workers into the clean room is seen as a problematic source of dust that can cause the inclusion of foreign matter.

[0005] The present invention has been made in consideration of such problems, and its object is to provide a workpiece processing system that can reduce the frequency with which workers need to enter a clean room where a manufacturing process is carried out. [Means for solving the problem]

[0006] In order to solve the above-mentioned problems and achieve the object, the workpiece processing system of the present invention is a workpiece processing system comprising: a first chamber having a plurality of processing devices for dividing the workpiece to manufacture a plurality of device chips, a transport path installed on the upper surface of the processing devices spanning the plurality of processing devices, and a transport car running on the transport path to transport the workpieces between the plurality of processing devices; and a second chamber having a stocker for storing a plurality of workpieces, and for transferring the workpieces between the stocker and the transport car, the first chamber and the second chamber being connected by the transport path along which the transport car runs.

[0007] The first room may be cleaner than the second room.

[0008] The workpiece has a device region in which a device is formed and a peripheral excess region surrounding the device region, and the first room is equipped with an inspection device having an imaging unit that images the device chip manufactured by dividing the device region in the processing device from at least one of the front, back, and side, and the processing system may have a memory section that stores images captured by the imaging unit, and a measurement section that at least measures chipping of the device chip from the images.

[0009] The transport vehicle may include a tray for accommodating at least one of workpieces or items to be used in the processing device, and a lifting mechanism for raising and lowering the tray relative to the processing device and the stocker. Effect of the Invention

[0010] The present invention separates a first room in which a processing device for manufacturing device chips is installed from a second room in which a stocker for storing multiple workpieces is installed, and transport between the first and second rooms is performed by a transport vehicle running on a transport path, thereby reducing the frequency with which workers need to enter the first room in which device chips are manufactured (inside the clean room where the manufacturing process is carried out). [Brief description of the drawings]

[0011] [Figure 1] FIG. 1 is a schematic diagram showing an example of the configuration of a workpiece processing system according to an embodiment. [Diagram 2] FIG. 2 is a perspective view showing an example of a workpiece to be processed by the workpiece processing system of FIG. [Diagram 3] FIG. 3 is a perspective view of a portion of the workpiece processing system of FIG. [Figure 4] FIG. 4 is a perspective view showing an example of a processing device of the workpiece processing system of FIG. [Diagram 5] FIG. 5 is a side cross-sectional view showing an example of a processing device of the workpiece processing system of FIG. [Figure 6] FIG. 6 is a side cross-sectional view showing an example of a processing device of the workpiece processing system of FIG. [Figure 7] FIG. 7 is a side cross-sectional view showing an example of an inspection device which is an example of a processing device of the workpiece processing system of FIG. [Figure 8] FIG. 8 is a side cross-sectional view showing a part of the inspection device of FIG. [Figure 9] FIG. 9 is a side cross-sectional view showing a stocker of the workpiece processing system of FIG. [Figure 10] FIG. 10 is a perspective view showing a transport vehicle of the workpiece processing system of FIG. [Figure 11] 11 is a side cross-sectional view showing the lifting mechanism of the transport vehicle of FIG. [Figure 12] FIG. 12 is a diagram showing an example of a notification image that the management unit of the workpiece processing system of FIG. 1 causes the notification unit to display. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] The form (embodiment) for carrying out the present invention will be described in detail with reference to the drawings. The present invention is not limited to the contents described in the following embodiment. Furthermore, the components described below include those that a person skilled in the art can easily imagine and those that are substantially the same. Furthermore, the configurations described below can be appropriately combined. Furthermore, various omissions, substitutions, or modifications of the configurations can be made without departing from the gist of the present invention.

[0013] [Embodiment] A workpiece processing system 1 according to an embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a schematic diagram (top view) showing an example of the configuration of the workpiece processing system 1 according to the embodiment. As shown in Fig. 1, the workpiece processing system 1 includes a first room 1000, a second room 2000, a connection unit 3000 that connects the first room 1000 and the second room 2000, a management unit 30 that centrally manages the overall control of the workpiece processing system 1, and an alarm unit 40.

[0014] The first room 1000 is constantly supplied with highly clean air from the ceiling and side walls through an ultra-high performance air filter or the like by fans 1001 (see FIG. 1 ) provided on the ceiling and side walls of the first room 1000, so that the pressure inside the first room 1000 is set to a more positive pressure than atmospheric pressure, and the pressure is set to a more positive pressure and a higher degree of cleanliness than the pressure inside the second room 2000. This prevents foreign matter from entering the first room 1000 from the second room 2000. The second room 2000 may be constantly supplied with highly clean air from the ceiling and side walls through an ultra-high performance air filter or the like by fans (not shown) provided on the ceiling and side walls.

[0015] 1, a first opening 3001 communicating with the inside of the first chamber 1000 is formed at one end, and a second opening 3002 communicating with the inside of the second chamber 2000 is formed at the other end. The connecting part 3000 communicates with the inside of the first chamber 1000 through the first opening 3001, and with the inside of the second chamber 2000 through the second opening 3002, thereby connecting the first chamber 1000 and the second chamber 2000, and communicating the inside of the first chamber 1000 and the second chamber 2000. The connection portion 3000 has a passage-like (tunnel-like) space extending in one direction between a first opening 3001 and a second opening 3002, and a conveying path 10 is installed along the one direction so as to pass through the first opening 3001 and the second opening 3002 inside the passage-like (tunnel-like) space, and the passage-like (tunnel-like) space is large enough to allow a conveying vehicle 20 to pass through by running on the conveying path 10.

[0016] In this embodiment, the connection part 3000 is formed into a rectangular tube extending in one direction, with side panels covering the sides, a top panel covering the top, and a bottom panel covering the bottom, and forms a passage-like (tunnel-like) space inside with a rectangular or square cross-sectional shape perpendicular to the one direction; however, the present invention is not limited to this, and the connection part 3000 may have any shape, such as an arc-shaped member covering the top, as long as it is formed into a tube extending in one direction with members covering the sides, top, and bottom, the conveying path 10 can be stably installed, and the conveying vehicle 20 is large enough to run and pass on the conveying path 10.

[0017] The connection part 3000 has members covering the sides, top, and bottom, which restrict and cut off the inflow and outflow of air from outside other than the first chamber 1000 and the second chamber 2000. In the internal space of the connection part 3000, the pressure in the first chamber 1000 is more positive than the pressure in the second chamber 2000, and therefore an air flow is formed in which the air in the first chamber 1000 flows in from the first opening 3001 and flows out from the second opening 3002 into the second chamber 2000.

[0018] 1, the first room 1000 has a plurality of processing devices 100 that divide a workpiece 200 (see FIG. 2) to manufacture a plurality of device chips, a transport path 10 installed on the upper surface of the plurality of processing devices 100 across the plurality of processing devices 100, and a transport vehicle 20 that travels on the transport path 10 to transport an article 210 (see FIG. 2) including the workpiece 200 between the plurality of processing devices 100. That is, as shown in FIG. 1, a plurality of processing devices 100 are installed in the first room 1000, the transport path 10 is installed on the upper surface of the plurality of processing devices 100 across the plurality of processing devices 100, and the transport vehicle 20 travels on the transport path 10.

[0019] In this embodiment, in the example shown in Fig. 1, seven processing devices 100 are installed in the first room 1000, and the seven processing devices 100 include a processing device 110 (cutting device), a tape attachment device 120, a processing device 130 (grinding device), a processing device 140 (tape expansion device), an inspection device 150, an inspection device 160, and an arbitrary processing device 170, but the present invention is not limited to this, and any number of processing devices 100 may be installed as long as the workpiece 200 can be divided by the multiple processing devices 100 to manufacture multiple device chips, and any combination of processing devices may be used. Also, in this embodiment, in the example shown in Fig. 1, the inspection device 150 is installed in the first room 1000, which is a preferable embodiment, but the present invention is not limited to this, and the installation of the inspection device 150 may be omitted.

[0020] 1, the second room 2000 has a stocker 190 that stores a plurality of workpieces 200, a transport path 10 installed on the upper surface of the stocker 190, and a transport vehicle 20 that travels on the transport path 10. That is, as shown in FIG. 1, the stocker 190 is installed in the second room 2000, the transport path 10 is installed on the upper surface of the installed stocker 190, and the transport vehicle 20 travels on the transport path 10.

[0021] In the second room 2000, articles 210 including the workpieces 200 are transferred between the stocker 190 and the transport vehicle 20. In the second room 2000, a worker 500 (see FIG. 1) replenishes the workpieces 200 before processing that are to be transferred from the stocker 190 to the transport vehicle 20 and the articles 210 that can be used from now on, and collects the processed workpieces 200 (device chips) and used articles 210 that are to be transferred from the transport vehicle 20 to the stocker 190.

[0022] In this embodiment, in the example shown in Figure 1, three stockers 190 are installed in the second room 2000, and the worker 500 can replenish the stockers 190 with items 210 (workpieces 200 or items to be used in the first room 1000) to be transported by the transport vehicle 20 at any time, or can secure storage space (for example, the cassette loading section 340-6, temporary storage unit 336 described below) in the stockers 190 to store the items 210 retrieved from the transport vehicle 20. This allows the stockers 190 to automatically transfer the items 210 between the transport vehicle 20 and the stockers 190, so that the items 210 (workpieces 200) to be transported by the transport vehicle 20 can be transferred freely at any time, even when the transport vehicle 20 is not in the second room 2000. However, the present invention is not limited to this, and the stocker 190 may not be provided. In this case, the worker 500 can directly transfer the article 210 (workpiece 200) to be transported by the transport vehicle 20 without using the stocker 190. That is, in this case, in the second room 2000, the worker 500 directly collects the processed workpiece 200 (device chip) and the article 210 that cannot be used in the future from the transport vehicle 20, and replenishes the transport vehicle 20 with the workpiece 200 before processing and the article 210 that can be used in the future. Also, the second room 2000 does not need to have a transport path 10 along which the transport vehicle 20 travels across a plurality of stockers 190.

[0023] In the processing system 1 for workpieces according to the embodiment, as shown in Fig. 1, the conveying path 10 is installed on the upper surface of the processing devices 100 installed in the first room 1000, on the upper surface of the stocker 190 installed in the second room 2000, and in the connection part 3000, across the processing devices 100 and the stocker 190. In the processing system 1 for workpieces according to the embodiment, the conveying vehicle 20 conveys the article 210 including the workpiece 200 between the processing devices 100 and the stocker 190 by traveling on the conveying path 10 and passing through the connection part 3000. In this way, in the processing system 1 for workpieces according to the embodiment, the first room 1000 and the second room 2000 are connected by the conveying path 10 on which the conveying vehicle 20 travels.

[0024] 1, the first room 1000 includes a plurality of transport vehicles 20 (three in the example shown in FIG. 1), the second room 2000 includes one transport vehicle 20, and the connection part 3000 includes one transport vehicle 20, but the present invention is not limited to this, and there may be zero, one, or multiple transport vehicles 20 in each of the first room 1000, the second room 2000, and the connection part 3000, and there may be at least one transport vehicle 20 in the first room 1000, the second room 2000, and the connection part 3000, or there may be multiple transport vehicles 20. Note that in the drawings, some components are omitted as appropriate, and some components are simply shown by outlines only, etc.

[0025] In the workpiece processing system 1 according to the embodiment, the multiple processing devices 100 and the stocker 190 are arranged separately in the first room 1000 and the second room 2000, respectively, and not even one stocker 190 is installed in the first room 1000, and not even one processing device 100 is installed in the second room 2000. As a result, in the workpiece processing system 1 according to the embodiment, the first room 1000 is normally occupied by the worker 500 except for special cases such as maintenance (maintenance with worker) that requires the worker 500 to enter the first room 1000, and the first room 1000 is used to automatically divide the workpiece 200 into multiple device chips without the worker 500's intervention, and the manufactured device chips are inspected by the multiple processing devices 100, and the second room 2000 is normally occupied by the worker 500 to inspect the manufactured device chips. A second room 2000 is used to collect processed workpieces 200 (device chips) and replenish the stocker 190 with unprocessed workpieces 200, and to collect used items 210 from the stocker 190 and replenish the stocker 190 with items 210 that can be used in the future. The first room 1000 and the second room 2000 are separated from each other except for a transport path 10 for transporting items 210 including workpieces 200 between the first room 1000 and the second room 2000, and a connection part 3000 which provides a space for a transport vehicle 20 to run on the transport path 10, and are connected only by the connection part 3000.

[0026] Fig. 2 is a perspective view showing an example of a workpiece 200 to be processed by the workpiece processing system 1 of Fig. 1. The workpiece 200 is an example of an article 210 to be processed by the processing device 100 included in the workpiece processing system 1 and transported by the transport vehicle 20. As shown in Fig. 2, the workpiece 200 is a wafer such as a disk-shaped semiconductor wafer or an optical device wafer, whose base material is silicon, sapphire, silicon carbide (SiC), gallium arsenide, glass, or the like.

[0027] The workpiece 200 has, on a flat surface 201, a device region 207 in which chip-like devices 203 are formed in each region partitioned by a plurality of planned division lines 202 that intersect with each other, and a peripheral surplus region 208 in which no devices 203 are formed and which surrounds the periphery of the device region 207. The workpiece 200 is processed by the processing device 100 of the workpiece processing system 1 to divide the device region 207 along the planned division lines 202, thereby manufacturing chips of a plurality of devices 203 (device chips). The device chips manufactured from the workpiece 200 are included in the goods 210 to be transported by the transport vehicle 20.

[0028] Workpiece 200 has support tape 205 attached to back surface 204 behind front surface 201, and annular frame 206 is attached to the outer edge of support tape 205. That is, workpiece 200 is supported and fixed to the opening of annular frame 206 via support tape 205. In the present invention, workpiece 200 may be a rectangular package substrate having a plurality of devices sealed with resin, a ceramic plate, a glass plate, or the like.

[0029] The items 210 to be transported by the transport vehicle 20 include, in addition to the workpiece 200 and the device chips manufactured from the workpiece 200, processing tools used to process the workpiece 200, consumables used to inspect the state of the processing tools, cleaning tools for cleaning the processing device 100, maintenance parts for maintaining the processing device 100, and the like. The processing tools used to process the workpiece 200 and process the workpiece 200 are, for example, cutting blades, grinding wheels, and the like. Other consumables used to process the workpiece 200 are, for example, dressing boards, precut boards, dummy works, dummy workpieces, adhesive tapes, carbon pieces, and the like. The cleaning tools are cleaning supplies such as cleaning stones for cleaning the support surface on which the processing tools are attached, and the like. The maintenance parts are maintenance tools for maintaining any other mechanisms provided in the processing device 100, and the like. Regarding the workpiece 200 and the item 210 other than the device chip manufactured from the workpiece 200, in this embodiment, as shown in FIG. 2, a support tape 205 (adhesive tape) is attached to the back surface and an annular frame 206 is attached to the outer edge of the support tape 205, but the present invention is not limited to this, and the annular frame 206 may not be attached, and the support tape 205 may not be attached.

[0030] The article 210 is provided with a barcode, ID (IDentification), RFID (Radio Frequency IDentification) tag, or the like (all not shown) that indicates the type of the article 210. Here, the type of the article 210 refers to the type of the article 210, the specifications of the article 210, and information for distinguishing each article 210. The type of the article 210 is, for example, the workpiece 200 (or a device chip manufactured from the workpiece 200), a substrate, a cutting blade, a grinding wheel, a dressing board, a precut board, a dummy work, a dummy workpiece, an adhesive tape, a piece of carbon, a cleaning tool, a maintenance tool, and the like. For example, when the article 210 is a workpiece 200, the specifications of the article 210 include the diameter, thickness, composition and configuration of the base material, type and specifications of the device 203, the interval (index width), width and number of the planned division lines 202, the material, configuration, type and specifications of the attached support tape 205, and the material, configuration, type and specifications of the annular frame 206. Even when the article 210 is something other than the workpiece 200, the specification items of the article 210 are appropriately determined according to the type of the article 210. The information for distinguishing each article 210 is, for example, an identification number provided for each article 210. Furthermore, when the article 210 is a workpiece 200, the information for distinguishing each article 210 may include the lot number of the workpiece 200.

[0031] FIG. 3 is a perspective view showing a part of the workpiece processing system 1 of FIG. 1. FIG. 3 shows a processing device 110 (cutting device) which is an example of the processing device 100 of the workpiece processing system 1 of FIG. 1, a part of the conveying path 10, and a part of the conveying vehicle 20. FIG. 4 is a perspective view showing another example of the processing device 110 (cutting device) which is an example of the processing device 100 of the workpiece processing system 1 of FIG. 1. FIGS. 5 and 6 are side cross-sectional views showing a tape attachment device 120 and a processing device 130 (grinding device) which are examples of the processing device 100 of the workpiece processing system 1 of FIG. 1, respectively. Note that FIGS. 4, 5, and 6 only show a part of the processing unit 340 in the processing device 100 which is different from the processing device 100 (processing device 110) shown in FIG. 3, and omit the illustration of each component of the processing device 100 except for the processing unit 340 which is the same as the processing device 100 (processing device 110) shown in FIG. 3. 6 does not show the outer periphery of the support tape 205 attached to the workpiece 200 and the annular frame 206. In the present specification, hereinafter, similar (generally common) components and items among the processing device 110 (cutting device), the tape application device 120, the processing device 130 (grinding device), the processing device 140 (tape expanding device) shown in FIG. 1, and any processing device 170 shown in FIG. 1 will be described as components and items of the processing device 100.

[0032] 3, the processing device 100 of the workpiece processing system 1 includes a housing 310, a tray placement table 320, a transport unit 330, a processing unit 340, a receiving unit 350, a transmitting unit 360, and a control unit 370. The housing 310 houses each of the components of the processing device 100 except for the housing 310. An opening 312 is formed in a ceiling 311 above the housing 310, the opening having a size and shape that allows the tray 23 of the transport vehicle 20 that houses the article 210 (workpiece 200) to pass through.

[0033] 3, the tray placement stage 320 is a stage on which the tray 23 descended by the lifting mechanism 24 from the transport vehicle 20 lands and is placed. The tray placement stage 320 supports the tray 23 that has landed and been placed thereon, facing upward.

[0034] The transport unit 330 is installed adjacent to the tray placement table 320, as shown in Fig. 3. The transport unit 330 takes out the article 210 (workpiece 200) accommodated in the tray 23 placed on the tray placement table 320 and places it at a predetermined position relative to the processing unit 340, and also takes the article 210 (workpiece 200) placed at a predetermined position around the processing unit 340 into the tray 23 placed on the tray placement table 320. Here, the predetermined position relative to the processing unit 340 is on a holding table (chuck table) around the processing unit 340-1 (cutting unit) and the processing unit 340-3 (imaging unit, inspection unit), or on a spinner table of the processing unit 340-2 (cleaning unit) in the example of this embodiment shown in Fig. 3.

[0035] In this embodiment, the transport unit 330 includes, for example, a first transport arm 331, a second transport arm 332, and a pair of rails 333. The first transport arm 331 transports the article 210 (workpiece 200) between inside the tray 23 placed on the tray placement table 320 and on the pair of rails 333. The second transport arm 332 transports the article 210 (workpiece 200) between on the pair of rails 333 and a predetermined position around the processing unit 340. The pair of rails 333 can approach or move away from each other while maintaining a parallel state, and the article 210 (workpiece 200) can be held between the pair of rails 333 via the annular frame 206. In addition, the conveying unit 330 is equipped with a reader that reads the barcode or ID of the item 210 (workpiece 200) when the item 210 (workpiece 200) is removed from or loaded onto the tray 23, thereby obtaining information on the type of item 210 (workpiece 200) and outputting the information to the control unit 370.

[0036] The processing unit 340 processes the workpiece 200. In this embodiment, the processing unit 340 is, for example, a processing unit that processes the workpiece 200, a cleaning unit that cleans the workpiece 200, an imaging unit that captures the workpiece 200, an inspection unit that inspects the workpiece 200, a tape attachment unit that attaches or peels off the support tape 205 or the like to the workpiece 200, a film formation unit that forms a film on the workpiece 200, or the like. That is, the processing device 100 including the processing unit 340 can perform at least one of processing, cleaning, inspection, imaging, attachment of the support tape 205 or the like, peeling off the support tape 205 or the like, and film formation on the workpiece 200.

[0037] In the processing apparatus 100 shown in Fig. 3, the processing unit 340 includes a processing unit 340-1, a processing unit 340-2, and a processing unit 340-3. In the processing apparatus 100 shown in Fig. 4, the processing unit 340 includes a processing unit 340-1 and a processing unit 340-3. In the processing apparatus 100 shown in Fig. 5, the processing unit 340 includes a processing unit 340-4. In the processing apparatus 100 shown in Fig. 6, the processing unit 340 includes a processing unit 340-5.

[0038] When the processing unit 340 is a processing unit, it may be, for example, a cutting processing unit having a spindle on which a cutting blade is rotatably mounted and cutting the workpiece 200 with the cutting blade, a grinding processing unit having a spindle on which a grinding wheel with a grinding wheel disposed thereon is rotatably mounted and grinding the workpiece 200 with the grinding wheel, a laser processing unit having a laser beam irradiator for irradiating the workpiece 200 with a laser beam and laser processing the workpiece 200 with the laser beam, a plasma processing unit for supplying plasma gas to the workpiece 200 for etching, an ultraviolet processing unit having an ultraviolet irradiator for irradiating the workpiece 200 with ultraviolet rays and performing an ultraviolet irradiation processing of the workpiece 200, a tape expansion unit for expanding the support tape 205 attached to the workpiece 200, dividing the workpiece 200 based on the division starting points to manufacture device chips and widening the intervals between the device chips, or a tape expansion processing for widening the intervals between the device chips manufactured by dividing the workpiece 200, etc. When the processing unit 340 is a processing unit, the processing device 100 is a processing device that processes the workpiece 200 .

[0039] The processing apparatus 100 shown in Fig. 3 and the processing apparatus 100 shown in Fig. 4 are both processing apparatuses 110 (cutting apparatuses) in which one processing unit 340, 340-1, is a cutting processing unit, and can perform cutting processing on the workpiece 200. The processing apparatus 100 shown in Fig. 6 is a processing apparatus 130 (grinding apparatus) in which one processing unit 340, 340-5, is a grinding processing unit, and can perform grinding processing on the workpiece 200. The processing apparatus 100 (processing apparatus 140) shown in Fig. 1 is a tape expansion apparatus in which the processing unit 340 is a tape expansion unit, and can perform tape expansion processing on the support tape 205 attached to the workpiece 200.

[0040] When the processing unit 340 is a cleaning unit, it is provided with a nozzle for supplying a cleaning liquid, a cleaning gas, or the like to the workpiece 200, and cleans the workpiece 200. When the processing unit 340 is a cleaning unit, the processing apparatus 100 is a cleaning apparatus that cleans the workpiece 200. In the processing apparatus 100 (processing apparatus 110) shown in FIG. 3, one of the processing units 340, processing unit 340-2, is a cleaning unit, and can perform a cleaning process on the workpiece 200.

[0041] When the processing unit 340 is an imaging section, it includes an imaging device that images the workpiece 200, and a work mover that moves the workpiece 200 to change and adjust the position and orientation of the workpiece 200 relative to the imaging device, and performs imaging processing of the workpiece 200. When the processing unit 340 is an imaging section, the processing device 100 can perform imaging processing on the workpiece 200. In both the processing device 100 (processing device 110) shown in Fig. 3 and the processing device 100 (processing device 110) shown in Fig. 4, one processing unit 340-3 of the processing unit 340 is an imaging section, and can perform imaging processing on the workpiece 200.

[0042] When the processing unit 340 is an inspection section, the processing unit 340 includes a laser beam irradiator that irradiates the workpiece 200 with an inspection laser beam, an electromagnetic wave irradiator that irradiates the workpiece 200 with an inspection electromagnetic wave, an ultraviolet irradiator that irradiates the workpiece 200 with an inspection ultraviolet ray, an imager that captures an inspection image of the workpiece 200, and an inspection and determination section that inspects and determines the workpiece 200 based on the results of the irradiation and imaging, and performs an inspection process on the workpiece 200. When the processing unit 340 is an inspection section, the processing device 100 can perform an inspection process on the workpiece 200. In both the processing device 100 (processing device 110) shown in FIG. 3 and the processing device 100 (processing device 110) shown in FIG. 4, the processing unit 340-3 can function as an imager, and the control unit 370 can function as an inspection and determination section, so that the processing device 100 is substantially equipped with an inspection section, and can perform an inspection process such as a so-called kerf check that automatically checks whether the cutting process has been performed on the workpiece 200 within a normal range.

[0043] When the processing unit 340 is a tape application unit, the processing unit 340 includes a support tape etc. supplying section for supplying the support tape 205 etc. to the workpiece 200, an application section for applying the supplied support tape 205 etc. to the workpiece 200, and a peeling section for peeling off the support tape 205 etc. applied to the workpiece 200, and performs application processing or peeling processing on the workpiece 200. When the processing unit 340 is a tape application unit, the processing device 100 is a tape application device that performs application processing or peeling processing on the workpiece 200. In the processing device 100 shown in FIG. 5, one processing unit 340-4 of the processing units 340 is a tape application device 120 that is a tape application unit, and can perform application processing or peeling processing on the workpiece 200.

[0044] When the processing unit 340 is a film forming unit, it includes a film forming section that forms a film on the workpiece 200, and performs a film formation process on the workpiece 200. When the processing unit 340 is a film forming unit, the processing device 100 is a film forming device that performs a film formation process on the workpiece 200.

[0045] In this embodiment, the optional processing device 170 shown in FIG. 1 may be equipped with a processing unit 340 similar to any one of the processing devices 110 (cutting device), tape application device 120, processing device 130 (grinding device), and processing device 140 (tape expansion device), or may be equipped with a processing unit 340 different from any of them.

[0046] 3, the processing device 100 may include an exchange unit 341 corresponding to the processing unit 340. The exchange unit 341 performs an exchange process for exchanging items 210 other than the workpiece 200, such as consumables including processing tools used to process the workpiece 200, cleaning tools for cleaning the processing device 100, and maintenance parts for maintaining the processing device 100, in the processing unit 340. The exchange unit 341 performs the exchange process by collecting used processing tools, consumables, etc. from the processing unit 340 and replenishing and mounting new processing tools, consumables, etc. in the processing unit 340.

[0047] After the replacement unit 341 has performed the replacement process, the used processing tools, consumables, etc. collected from the processing unit 340 are collected from the replacement unit 341 onto the tray 23 that has landed and been placed on the tray mounting table 320 and are transported out of the processing device 100 through the opening 312, and new processing tools, consumables, etc. are transported in from outside the processing device 100 through the opening 312 and replenished to the replacement unit 341 from the tray 23 that has landed and been placed on the tray mounting table 320.

[0048] The replacement unit 341 is a cutting blade replacement unit that replaces a cutting blade attached to the processing unit 340, which is a cutting processing unit, in the processing apparatus 100 (processing apparatus 110) which is a cutting apparatus shown in FIG.

[0049] The receiving unit 350 is connected to the management unit 30 of the workpiece processing system 1 so as to be able to communicate with the management unit 30, receives information transmitted from the management unit 30, and outputs the received information to the control unit 370. In this embodiment, the receiving unit 350 is connected to the management unit 30 so as to be able to communicate with the management unit 30 wirelessly, but the present invention is not limited to this, and the receiving unit 350 may be connected to the management unit 30 so as to be able to communicate with the management unit 30 by wire. In this embodiment, the information received by the receiving unit 350 from the management unit 30 is, for example, command information for an operation related to processing by the processing device 100, a transport status and transport history of the item 210 (workpiece 200) in the processing device 100, a processing status and processing history, information on the position of the item 210 (workpiece 200), information on the maintenance timing, and the like.

[0050] The transmission unit 360 is connected to the management unit 30 so as to be able to communicate information, and transmits information output from the control unit 370 to the management unit 30. In this embodiment, the transmission unit 360 is connected to the management unit 30 so as to be able to communicate information wirelessly, but the present invention is not limited to this, and the transmission unit 360 may be connected to the management unit 30 so as to be able to communicate information wired. In this embodiment, the information transmitted by the transmission unit 360 to the management unit 30 is, for example, information on the transport status and transport history of the item 210 (workpiece 200) in the processing device 100, the processing status and processing history, information on the position of the item 210 (workpiece 200), information on the maintenance timing, and the like.

[0051] The control unit 370 controls the operation of each component of the processing device 100 to cause the processing device 100 to perform various processing operations on the article 210 (workpiece 200). The control unit 370 controls the transport unit 330 to control the transport of the article 210 (workpiece 200) between the tray 23 placed on the tray placement table 320 and a predetermined position of the processing unit 340, and obtains information such as the transport status and transport history of the article 210 (workpiece 200) and the position of the article 210 (workpiece 200) from the transport unit 330. The control unit 370 controls the processing unit 340 to control the processing of the article 210 (workpiece 200) by the processing unit 340, and obtains information such as the processing status and processing history of the article 210 (workpiece 200) and the position of the article 210 (workpiece 200) from the processing unit 340.

[0052] In this way, the control unit 370 acquires information on the transport status and transport history of the article 210 (workpiece 200) in the processing device 100, the processing status and processing history, and the position of the article 210 (workpiece 200) from the transport unit 330 and the processing unit 340. The control unit 370 also includes a maintenance timing storage unit 371 (see FIG. 3) that stores information on the maintenance timing, which is the time (date and time) when manual maintenance is required. When the processing device 100 is started up or each time maintenance is performed by the operator 500, the maintenance timing storage unit 371 registers the information on the maintenance timing by the operator 500, and the information is linked to the type of the processing device 100.

[0053] The control unit 370 acquires information received by the receiving unit 350 from the management unit 30, and outputs information to be transmitted to the management unit 30 to the transmitting unit 360. The control unit 370 causes the processing device 100 to perform an operation according to the command information received by the receiving unit 350 from the management unit 30. The control unit 370 causes the transmitting unit 360 to transmit to the management unit 30 the transport status and transport history, the processing status and processing history, the position information of the item 210 (workpiece 200), the maintenance time information, and the like of the item 210 (workpiece 200) in the processing device 100, according to the request information received by the receiving unit 350 from the management unit 30. Even if the control unit 370 does not receive the request information from the management unit 30, it can also cause the transmitting unit 360 to transmit to the management unit 30 the transport status and transport history, the processing status and processing history, the position information of the item 210 (workpiece 200), the maintenance time information, and the like of the item 210 (workpiece 200) in the processing device 100.

[0054] Here, the information on the transport status and transport history of the article 210 (workpiece 200) and the position of the article 210 (workpiece 200) acquired from the transport unit 330 is information that is linked to the type of the article 210 (workpiece 200) and the type of processing equipment 100 into which the article 210 (workpiece 200) of that type was carried in and out, and the date and time (time) at which the article was carried in and out of the processing equipment 100. The type of processing equipment 100 refers to information that distinguishes each processing equipment 100, such as the type of processing performed by the processing equipment 100 and an identification number provided for each processing equipment 100.

[0055] In addition, the processing status of the processing device 100 includes, for example, the type of processing device 100 being processed, the item 210 (workpiece 200) brought into the housing 310 of the processing device 100, the transport status including positional information of the item 210 (workpiece 200) inside the housing 310 of the processing device 100, the processing status of the workpiece 200 by the processing unit 340, an error status regarding errors that have occurred in the processing unit 340 during processing or in the workpiece 200 during and after processing, and the replacement processing status by the replacement unit 341.

[0056] In addition, the processing history of the processing device 100 refers to the type of processing device 100, the transportation history, processing history, error history, and replacement processing history of the item 210 (workpiece 200) carried out within the housing 310 of the processing device 100 for each item 210 (workpiece 200) brought into the housing 310 of the processing device 100. Specifically, for each item 210 (workpiece 200), information on the transportation processing within the housing 310 of the processing device 100 and the history of the location information when the transportation processing was performed, information on the processing, the processing conditions at the time of processing, and the history of processing data obtained during processing, error history regarding errors that occurred in the processing unit 340 during processing or in the workpiece 200 during and after processing, information on the replacement processing, the replacement processing conditions at the time of replacement processing, and the history of replacement processing data obtained during replacement processing, all of which are linked to the date and time (time) when these processes were performed and the type of the item 210 (workpiece 200).

[0057] In this embodiment, the control unit 370 includes a computer system. The computer system included in the control unit 370 is a computer having an arithmetic processing device having a microprocessor such as a CPU (Central Processing Unit), a storage device having a memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory), and an input / output interface device. The arithmetic processing device of the control unit 370 performs arithmetic processing according to a computer program stored in the storage device of the control unit 370, and outputs a control signal for controlling the processing device 100 to each component of the processing device 100 via the input / output interface device of the control unit 370. The function of the maintenance timing storage unit 371 is realized by the storage device of the control unit 370.

[0058] Fig. 7 is a side cross-sectional view showing an example of an inspection device 150 which is an example of the processing device 100 of the workpiece processing system 1 of Fig. 1. Fig. 8 is a side cross-sectional view showing a part of the inspection device 150 of Fig. 7. As shown in Figs. 7 and 8, the inspection device 150 includes a holding table 151, a push-up pin 152, an imaging unit 155, a moving unit 156, a storage unit 158, and a measuring unit 159. The inspection device 150 also includes a housing 310, a tray placement table 320, a transport unit 330, a receiving unit 350, a transmitting unit 360, and a control unit 370 including a maintenance timing storage unit 371, similar to the processing device 100 (processing device 110) shown in Fig. 3. 7 and 8 is obtained by providing a holding table 151, a push-up pin 152, an imaging unit 155, and a moving unit 156 instead of the processing unit 340 in the processing device 100 (processing device 110) shown in Fig. 3, and adding the functions of a memory unit 158 ​​and a measuring unit 159 to a control unit 370. Note that the housing 310, the tray placement stand 320, and the transport unit 330 are not shown in Fig. 7.

[0059] The holding table 151 has a disc-shaped transparent member and an annular frame that holds the outer edge of the transparent member. The disc-shaped transparent member is made of a transparent material such as quartz glass, borosilicate glass, sapphire, calcium fluoride, lithium fluoride, magnesium fluoride, or the like, and is formed into a disc shape with a constant thickness. The outer diameter of the disc-shaped transparent member is larger than the outer diameter of the workpiece 200 and smaller than the inner diameter (opening diameter) of the annular frame 206. The disc-shaped transparent member is supported by the annular outer edge of the frame and is exposed above and below the holding table 151.

[0060] The upper surface of the disc-shaped transparent member serves as a holding surface on which the workpiece 200 (a device chip manufactured by dividing the workpiece 200) is placed and which holds one of the surfaces of the placed workpiece 200 (device chip). The holding surface of the disc-shaped transparent member is formed flat and parallel to the horizontal plane. In this embodiment, the holding surface of the disc-shaped transparent member holds the back surface 204 side of the workpiece 200 (device chip) via a support tape 205.

[0061] The annular frame is made of a metal such as stainless steel. The annular frame is formed with an inner diameter equal to the outer diameter of the disc-shaped transparent member, and is attached to the outer edge of the disc-shaped transparent member. The upper surface of the annular frame is formed flat along the horizontal direction, and is disposed on the same plane as the holding surface of the disc-shaped transparent member. The annular frame 206 attached to the workpiece 200 (device chip) is placed on the upper surface of the annular frame, and holds the placed annular frame 206. In this embodiment, the upper surface of the annular frame holds the annular frame 206 attached to the workpiece 200 (device chip) via a support tape 205.

[0062] The annular frame has a suction groove (not shown) that is recessed from the top surface and has a circular planar shape on the inner edge of the top surface, and is connected to a suction source (not shown) through a suction path (not shown) that is formed by penetrating the inside of the suction groove. The holding table 151 holds the workpiece 200 (device chip) and the annular frame 206 by suction via the support tape 205 on the holding surface of the disc-shaped transparent member and the top surface of the annular frame, as a suction source (not shown) sucks the suction groove through the suction path. The holding table 151 is provided so as to be rotatable about an axis parallel to the vertical direction by a rotation drive source (not shown).

[0063] The holding table 151 is provided with push-up pins 152 as shown in Fig. 8 within a disc-shaped transparent member. A plurality of push-up pins 152 are provided on the holding table 151 at positions corresponding to devices 203 (device chips manufactured by dividing the workpiece 200) of the workpiece 200 held on the holding surface of the holding table 151. Each of the push-up pins 152 is provided with a pin drive unit (not shown) that moves the push-up pin 152 up and down in a height direction perpendicular to the holding surface of the holding table 151. The push-up pins 152 are provided independently of each other so as to be freely moved up and down by the pin drive unit between a retracted position where the upper end of the push-up pin 152 is equal to or lower than the height of the holding surface of the holding table 151 and a push-up position where the upper end of the push-up pin 152 is higher than the height of the holding surface of the holding table 151.

[0064] When the workpiece 200 (device chip) and the annular frame 206 are suction-held on the holding table 151 via the support tape 205, if one push-up pin 152 is moved to a push-up position, the push-up pin 152 can push up the lower surface (the lower surface of the support tape 205 attached to the back surface 204) of the workpiece 200 (device chip) located on the push-up pin 152 above the holding surface of the holding table 151 via the support tape 205, as shown in FIG. 8. By pushing the workpiece 200 (device chip) upward in this manner, the push-up pin 152 makes it easier to image, by the side imaging unit 155-3 (see Figure 8), the side 221 (see Figure 8) of the division groove 220 (see Figures 5 and 7) of the workpiece 200 formed when the workpiece 200 is divided to manufacture the device chip, i.e., the side 221 of the device chip manufactured by dividing the workpiece 200.As a result, inspection based on the image of the side 221 of the device chip imaged by the side imaging unit 155-3 can be made easier and the accuracy of the inspection can be improved.

[0065] As shown in Fig. 7 and Fig. 8, the imaging unit 155 includes a front surface imaging unit 155-1, a back surface imaging unit 155-2, and a side surface imaging unit 155-3. As shown in Fig. 7, the front surface imaging unit 155-1 is provided at a position higher than the holding surface of the holding table 151 and facing downward toward the holding surface of the holding table 151, and images the surface side (front surface 201 side) of the workpiece 200 (device chip) held on the holding table 151 facing upward. As shown in Fig. 7, the back surface imaging unit 155-2 is provided at a position lower than the holding surface of the holding table 151 and facing upward toward the holding surface of the holding table 151, and images the surface side (back surface 204 side) of the workpiece 200 (device chip) held on the holding table 151 facing downward. As shown in FIG. 8, the side imaging unit 155-3 is disposed at a position higher than the holding surface of the holding table 151 and inclined horizontally downward from the holding surface of the holding table 151, and images the side 221 of the workpiece 200 (device chip) held on the holding table 151.

[0066] In this way, the imaging unit 155 can image the device chip manufactured by the multiple processing devices 100 from the front surface 201, the back surface 204, and the side surface 221. Note that the present invention is not limited to this, and the imaging unit 155 only needs to be able to image the device chip manufactured by the multiple processing devices 100 from at least one of the front surface 201, the back surface 204, and the side surface 221. In this embodiment, the imaging unit 155 is a line sensor camera in which light receiving sensor cameras are arranged in a line and has a field of view extending along one direction of the arrangement.

[0067] As shown in Fig. 7 and Fig. 8, the moving unit 156 includes a moving unit 156-1, a moving unit 156-2, and a moving unit 156-3. The moving unit 156-1 moves the front side imaging unit 155-1 along a direction parallel to the horizontal direction and perpendicular to the direction in which the imaging field of the front side imaging unit 155-1 extends. The moving unit 156-2 moves the back side imaging unit 155-2 along a direction parallel to the horizontal direction and perpendicular to the direction in which the imaging field of the back side imaging unit 155-2 extends. The moving unit 156-3 moves the side imaging unit 155-3 along a direction parallel to the horizontal direction and perpendicular to the direction in which the imaging field of the side imaging unit 155-3 extends.

[0068] In this manner, the inspection device 150 can image the entire surface of the upwardly facing surface side (the surface 201 side) of the workpiece 200 (device chip) held on the holding table 151 by the front surface imaging unit 155-1 by moving the moving unit 156-1. Also, the inspection device 150 can image the entire surface of the downwardly facing surface side (the back surface 204 side) of the workpiece 200 (device chip) held on the holding table 151 by the back surface imaging unit 155-2 by moving the moving unit 156-2. Also, the inspection device 150 can image the entire surface of the side surface 221 side of the workpiece 200 (device chip) held on the holding table 151 by rotating the holding table 151 and moving the side surface imaging unit 155-3 by the moving unit 156-3.

[0069] The storage unit 158 ​​stores the images captured by the imaging unit 155. The measurement unit 159 measures predetermined measurement items related to the workpiece 200 (device chip) from the images captured by the imaging unit 155. The measurement unit 159 acquires information on the images captured by the imaging unit 155 directly from the imaging unit 155, or acquires information on the images captured by the imaging unit 155 stored in the storage unit 158 ​​from the storage unit 158. The measurement unit 159 measures predetermined measurement items of the workpiece 200 (device chip) by carrying out predetermined image processing based on the acquired information on the images captured by the imaging unit 155.

[0070] The predetermined image processing performed by the measuring unit 159 is, for example, a process of detecting the edges (outer edges) of the front surface 201 and back surface 204 of the workpiece 200 (device chip) and the positional relationship between the edges (outer edges), and the surface properties of the side surface 221 of the workpiece 200 (device chip) by detecting shading and boundary lines within the image based on the image.

[0071] In this embodiment, the specified measurement items measured by the measuring unit 159 include at least chipping that has occurred on the front surface 201 side or the back surface 204 side of the workpiece 200 (device chip), as well as adhesion of foreign matter to the front surface 201 side or the back surface 204 side, the inclination (diagonal cut) from the edge (outer edge) on the front surface 201 side to the edge (outer edge) on the back surface 204 side, and whether or not the inclination (diagonal cut) exceeds a predetermined threshold value, the chip size of the workpiece 200 (device chip), and whether or not the chip size is outside a predetermined tolerance range, the surface roughness of saw marks on the side surface 221 or the back surface 204 of the workpiece 200 (device chip), and whether or not there are saw marks with a surface roughness that exceeds a predetermined threshold value, etc.

[0072] Chipping refers to minute chips or cracks that may occur on the outer periphery of a device chip separated from the workpiece 200. Saw marks refer to patterns or irregularities left by processing that may occur due to cutting or grinding, and in this embodiment, saw marks may occur on the side surface 221 of the workpiece 200 (device chip) due to cutting, and may occur on the back surface 204 of the workpiece 200 (device chip) due to grinding.

[0073] The inspection device 150 uses the imaging unit 155 and the moving unit 156 to image the entire surfaces of the front surface 201, back surface 204 and side surface 221 of all of the device chips manufactured by dividing the workpiece 200, stores the imaged images of the entire surfaces of all of these device chips in the memory unit 158, and inspects the above-mentioned specified measurement items for the entire surfaces of all of these device chips using the measurement unit 159, and stores an inspection record of all of the device chips obtained by this inspection.

[0074] In this embodiment, the memory unit 158 ​​and the measurement unit 159 are provided by the control unit 370 of the inspection device 150, the function of the memory unit 158 ​​is realized by a storage device of the control unit 370, and the function of the measurement unit 159 is realized by an arithmetic processing device of the control unit 370 executing a computer program stored in the storage device. Note that the present invention is not limited to this, and the memory unit 158 ​​and the measurement unit 159 may be provided in any form as long as they are provided by the workpiece processing system 1, and for example, they may be provided by the management unit 30, or may be provided in another control mechanism provided separately from the management unit 30, the control unit 370, and the control unit 29.

[0075] In this embodiment, the inspection device 160 shown in Fig. 1 is similar to the inspection device 150 shown in Fig. 7 and Fig. 8. Note that the inspection device 160 is not limited to this in the present invention, and may be, for example, a processing device 100 (processing device 110) shown in Fig. 3 that includes the above-mentioned inspection unit as a processing unit 340 and can perform any inspection process.

[0076] Fig. 9 is a side cross-sectional view showing a stocker 190 of the workpiece processing system 1 of Fig. 1. As shown in Fig. 9, the stocker 190 includes a housing 310, a tray placement stand 320, a transport unit 330, a cassette placement section 340-6, a receiving unit 350, a transmitting unit 360, and a control unit 370. The stocker 190 is a processing device 100 in which the processing unit 340 is changed to a cassette placement section 340-6, the transport unit 330 is changed to match the configuration of the stocker 190, and the maintenance timing memory section 371 is omitted. The housing 310, the tray placement stand 320, the transport unit 330, the receiving unit 350, the transmitting unit 360, and the control unit 370 are the same as those of the processing device 100.

[0077] 9, the cassette placement section 340-6 includes a support table 342, a placement table 343, an outer door 344, and an inner door 345. In the stocker 190, the housing 310 has an opening 313 formed in its side surface, the opening 313 being of a size and shape that allows a cassette 349 containing a plurality of articles 210 (workpieces 200) to pass through. The outer door 344 is provided in the opening 313 formed in the side surface of the housing 310, and is provided so as to be movable between an open position where the opening 313 is opened and a closed position where the opening 313 is closed.

[0078] The inner door 345 is provided at a position inside the housing 310 from the outer door 344 along a direction perpendicular to the side surface of the housing 310 in which the opening 313 is formed, and at least a length along a direction passing through the opening 313 of the cassette 349. The inner door 345 is provided inside the housing 310 at the opening 314 formed to a size and shape that allows the cassette 349 to pass through, and is provided so as to be movable between an open position where the opening 314 is opened and a closed position where the opening 314 is closed.

[0079] In the stocker 190, the control unit 370 controls so that at least one of the outer door 344 and the inner door 345 is positioned in the closed position. Therefore, in the stocker 190, when the inner door 345 is positioned in the closed position, the outer door 344 can be moved to the open position, and when the outer door 344 is positioned in the closed position, the inner door 345 can be moved to the open position.

[0080] Both the support base 342 and the mounting base 343 are formed in a rectangular flat plate shape, with a length in one direction that is equal to or greater than the length along the direction passing through opening 313 of cassette 349, and a length in another direction perpendicular to the one direction that is parallel to the horizontal direction and equal to or greater than the length along the direction perpendicular to the direction passing through opening 313 of cassette 349. The mounting base 343 is formed so that the lengths in both one and the other directions are shorter than those of the support base 342. Since the mounting base 343 has such a size and shape, the cassette 349 can be stably mounted thereon.

[0081] The support base 342 is fixed horizontally between the outer door 344 and the inner door 345 inside the housing 310, with the one direction being oriented along the direction in which the outer door 344 and the inner door 345 face each other. A support rail (not shown) is provided on the upper surface side of the support base 342, and the mounting base 343 is attached via this support rail. The mounting base 343 is provided so as to be slidable relative to the support base 342 along the direction in which the outer door 344 and the inner door 345 face each other by means of this support rail.

[0082] In the cassette mounting section 340-6, by positioning the inner door 345 in the closed position and the outer door 344 in the open position to open the opening 313 and then sliding the mounting base 343, the mounting base 343 can pass through the opened opening 313 and move between an internal position which is a position on the support base 342 inside the housing 310, and an external position where it is pulled out from the support base 342 outside the housing 310.

[0083] In the cassette placement unit 340-6, by positioning the placement table 343 at the external position, the operator 500 can retrieve the cassette 349 accommodating the processed workpiece 200 (device chip) or the article 210 that cannot be used in the future from the placement table 343, or place the cassette 349 accommodating the workpiece 200 before processing or the article 210 that can be used in the future on the placement table 343. Then, in the cassette placement unit 340-6, after a new cassette 349 is placed on the placement table 343, the placement table 343 is slid and moved, and the placement table 343 on which the new cassette 349 is placed can be positioned at the internal position, whereby the newly placed cassette 349 can be installed in the stocker 190 (inside the housing 310).

[0084] In this embodiment, two cassette placement sections 340-6 are provided at the first height and the second height, but the present invention is not limited to this, and one or three or more may be provided.

[0085] 9, the transport unit 330 in the stocker 190 includes a temporary placement unit 336, a lifting transport unit 337, and a gripping unit 338. The temporary placement unit 336 has a rectangular cylindrical housing with an opening formed on the side where the cassette placement part 340-6 is provided, and the article 210 (workpiece 200) is temporarily placed inside the housing. The lifting transport unit 337 is provided on the opposite side of the temporary placement unit 336 from the side where the cassette placement part 340-6 is provided, and moves the temporary placement unit 336 in the vertical direction between a tray height that is the same height as the tray 23 placed on the tray placement stand 320 and a cassette height that is the same height as the cassette placement part 340-6.

[0086] The gripping units 338 grip the article 210 (workpiece 200). A plurality of gripping units 338 (two in the example shown in FIG. 9) are provided in the housing of the temporary placement unit 336, and are provided movably within the housing of the temporary placement unit 336.

[0087] The transport unit 330 of the stocker 190 uses the lifting transport unit 337 to position the temporary placement unit 336 at the cassette height for one of the cassette loading sections 340-6, and then the gripping unit 338 can transport the item 210 (workpiece 200) between the cassette 349 placed on the cassette loading section 340-6 and the temporary placement unit 336.

[0088] The gripping unit 338 grips and removes the article 210 (workpiece 200) in the cassette 349 placed on the cassette placing section 340-6, and temporarily places it in the temporary placement unit 336, thereby transporting the article 210 (workpiece 200) from the cassette 349 placed on the cassette placing section 340-6 to the temporary placement unit 336. The gripping unit 338 grips the article 210 (workpiece 200) temporarily placed in the temporary placement unit 336 and carries it into the cassette 349 placed on the cassette placing section 340-6, thereby transporting the article 210 (workpiece 200) from the temporary placement unit 336 to the cassette 349 placed on the cassette placing section 340-6.

[0089] In addition, when the transport unit 330 of the stocker 190 positions the temporary placement unit 336 at tray height using the lifting transport unit 337, the gripping unit 338 can transport the item 210 (workpiece 200) between the tray 23 placed on the tray placement table 320 and the temporary placement unit 336.

[0090] The gripping unit 338 grips and removes the article 210 (workpiece 200) in the tray 23 placed on the tray placement table 320, and temporarily places it on the temporary placement unit 336, thereby transporting the article 210 (workpiece 200) from the tray 23 placed on the tray placement table 320 to the temporary placement unit 336. The gripping unit 338 grips the article 210 (workpiece 200) temporarily placed on the temporary placement unit 336 and carries it into the tray 23 placed on the tray placement table 320, thereby transporting the article 210 (workpiece 200) from the temporary placement unit 336 to the tray 23 placed on the tray placement table 320.

[0091] In this way, the transport unit 330 of the stocker 190 can transport the item 210 (workpiece 200) between the cassette 349 placed on the cassette placement section 340-6 and the tray 23 placed on the tray placement table 320 via temporary placement in the temporary placement unit 336.

[0092] In this way, when the cassettes 349 are placed on the cassette placement section 340-6, the stocker 190 stores the items 210 (workpieces 200) in the cassettes 349, and transports the items 210 (workpieces 200) from any of the cassettes 349 to the transport vehicle 20 through the opening 312 in the ceiling 311 above the housing 310.

[0093] As shown in Fig. 2, the transport path 10 of the workpiece processing system 1 includes a passage area 11, a transfer area 12, and a guide section 13. The passage area 11 is disposed above the housings 310 of the processing devices 100, straddling the passage area 11. The transfer area 12 is disposed adjacent to the passage area 11 above the housing 310 for each processing device 100. The passage area 11 and the transfer area 12 are provided with vertical and horizontal lines (not shown) that can be detected by sensors 21-3 and 21-4 of the transport vehicle 20 described later. The transfer area 12 has an opening 14 formed directly above the opening 312 of the housing 310, the opening 14 being of a size and shape that allows the vehicle body 21 of the transport vehicle 20 to pass through but allows the tray 23 of the transport vehicle 20 to pass through.

[0094] The guide parts 13 are disposed on both widthwise ends of the passage area 11 and the transfer area 12. The guide parts 13 are formed higher than the wheels 22 of the transport vehicle 20, thereby preventing the transport vehicle 20 from climbing over the guide parts 13 and falling off the passage area 11 and the transfer area 12.

[0095] Fig. 10 is a perspective view showing the transport vehicle 20 of the workpiece processing system 1 of Fig. 1. Fig. 11 is a side cross-sectional view showing the lifting mechanism 24 of the transport vehicle 20 of Fig. 10. The transport vehicle 20 is an automated guided vehicle (AGV) that runs unmanned, and as shown in Fig. 10, has a vehicle body 21, wheels 22, a tray 23, a lifting mechanism 24, a receiving unit 27, a transmitting unit 28, and a control unit 29.

[0096] The vehicle body 21 includes a flat first frame 21-1 and a flat second frame 21-2 arranged above the first frame 21-1 at a distance from the first frame 21-1. The transport vehicle 20 includes sensors 21-3 (only the rear end is shown in FIG. 10) at the front end (the end on the left rear side in FIG. 10) and the rear end (the end on the right front side in FIG. 10) of the first frame 21-1, and a pair of sensors 21-4 (only the left end is shown in FIG. 10) at both side ends of the first frame 21-1. The sensors 21-3 and 21-4 are mounted so as to face the passage area 11 and the transfer area 12 of the transport path 10 along which the transport vehicle 20 travels, respectively, and detect vertical and horizontal lines (not shown) provided in the passage area 11 and the transfer area 12. The sensors 21-3 and 21-4 output the detection results to the control unit 29.

[0097] The transport vehicle 20 is provided with a collision sensor 21-5 at the front end of the first frame 21-1 to detect when the transport vehicle 20 collides with an obstacle. For example, a push button switch is used as the collision sensor 21-5. When the front end of the transport vehicle 20 collides with an obstacle, the collision sensor 21-5 detects the collision of the transport vehicle 20 and outputs the detection result to the control unit 29.

[0098] The transport vehicle 20 is also provided with a cover 21-6 on the underside of the rear end of the first frame 21-1. The cover 21-6 covers an opening 23-1 of the tray 23 when the tray 23 is positioned in a storage position between the front wheels 22 and the rear wheels 22 on the underside of the first frame 21-1. By covering the opening 23-1, the cover 21-6 prevents foreign objects from entering the tray 23 while the transport vehicle 20 is traveling, prevents foreign objects from adhering to the article 210 (workpiece 200), and prevents the article 210 (workpiece 200) from falling out of the tray 23.

[0099] The wheels 22 include a pair of front wheels 22 provided at both ends of the front side of the lower surface of the first frame 21-1, and a pair of rear wheels 22 provided at both ends of the rear side of the lower surface of the first frame 21-1. The wheels 22 are provided to be rotatable independently of each other about their axis, and the orientation of the rotation axis and the rotation direction are controlled independently of each other. The outer circumferential surface of the wheels 22 contacts the passage area 11 or the transfer area 12 of the conveying path 10. The wheels 22 are each connected to a motor 22-1, and the motor 22-1 applies a rotational motion around the axis to the wheels 22, causing the wheels 22 to travel on the passage area 11 or the transfer area 12 of the conveying path 10. The motor 22-1 is connected to a battery 22-2, and is driven by power supplied from the battery 22-2. In this embodiment, the wheels 22 are, for example, Mecanum wheels having a plurality of inclined barrel-shaped (cylindrical) rotating bodies attached to the outer circumferential surface.

[0100] The tray 23 stores at least one of the workpiece 200 and the article 210 used in the processing device 100. The tray 23 is provided on the lower surface side of the first frame 21-1, and is formed in a flat box shape capable of storing the article 210 (workpiece 200) inside. The tray 23 has an opening 23-1 on the rear side of the transport vehicle 20 through which the article 210 (workpiece 200) can be freely inserted and removed. The tray 23 has a guide rail on the inside for holding the annular frame 206 that supports the stored article 210 (workpiece 200).

[0101] The lifting mechanism 24 raises and lowers the tray 23 relative to the first frame 21-1 of the vehicle body 21. The lifting mechanism 24 raises and lowers the tray 23 between a storage position where the tray 23 is positioned between the front wheels 22 and the rear wheels 22 on the underside of the first frame 21-1, and a lowered position where the tray 23 is positioned below the wheels 22. In the storage position, the underside of the tray 23 is positioned above the lower ends of the wheels 22 that run on the transport path 10. Therefore, the tray 23 does not come into contact with the transport path 10 while the transport vehicle 20 is traveling on the transport path 10.

[0102] Each component of the lifting mechanism 24, except for the hanging member 59 whose lower end is attached and connected to the tray 23, is disposed in the space between the first frame 21-1 and the second frame 21-2. When the transport vehicle 20 is positioned above the opening 14 of the transfer area 12, the lifting mechanism 24 lowers the tray 23 positioned at the storage position, and positions the tray 23 on the tray placement table 320 of the processing device 100 or the stocker 190. The lifting mechanism 24 also raises the tray 23 positioned on the tray placement table 320 of the processing device 100 or the stocker 190, and positions the tray 23 at the storage position.

[0103] As shown in FIG. 11 , the lifting mechanism 24 comprises a motor 52 fixed to the upper surface of the first frame 21-1 and having a rotating shaft 51, a first rotating shaft 53 and a second rotating shaft 54 ​​supported for free rotation on the upper surface of the first frame 21-1 and parallel to each other, a pulley 56 fixed to one end of the first rotating shaft 53 and around which an endless connecting member 55 such as a belt or chain is hung between the rotating shaft 51 of the motor 52, pulleys (not shown) fixed to the other ends of the first rotating shaft 53 and the second rotating shaft 54 ​​and around which endless connecting members such as a belt or chain are hung, cylindrical reels 57 fixed to both ends of the first rotating shaft 53 and around which a hanging member 59 is wound, cylindrical reels 58 fixed to both ends of the second rotating shaft 54 ​​and around which a hanging member 59 is wound, and a hanging member 59.

[0104] The lifting mechanism 24 rotates the first rotating shaft 53 and the second rotating shaft 54 ​​about their axes using the motor 52, and rotates the reels 57, 58 about their axes, thereby winding up the hanging members 59 onto the reels 57, 58 and feeding out the hanging members 59 from the reels 57, 58.

[0105] When the lifting mechanism 24 winds the hanging members 59 on the reels 57 and 58, it positions the tray 23 in the storage position. When the lifting mechanism 24 unwinds the hanging members 59 from the reels 57 and 58, it positions the tray 23 in the lowered position.

[0106] In this embodiment, four hanging members 59 are provided. For example, a belt having a predetermined width is used as the hanging members 59. The lower ends of the four hanging members 59 are attached to the upper surface of the tray 23 at intervals from each other. Note that in the present invention, instead of a belt, a wire rope that can be wound up and let out may be used as the hanging member 59.

[0107] When the transport vehicle 20 is first set on the transport path 10 of the workpiece processing system 1, the location where the transport vehicle 20 is set and the type of the transport vehicle 20 are registered in the control unit 29 and the management unit 30. After the transport vehicle 20 is set, in this embodiment, as described above, the position of the transport vehicle 20 on the transport path 10 is detected by the sensors 21-3 and 21-4. Note that the transport vehicle 20 is not limited to this configuration in the present invention, and may be configured to detect a mark (not shown) by a line sensor instead of this configuration, or to detect the position of the transport vehicle 20 by a plurality of sensors installed on the transport path 10, or to wirelessly connect the transport vehicle 20 to a GPS (Global Positioning System) so as to be able to communicate information, and to acquire the position of the transport vehicle 20 using the GPS. Any configuration capable of acquiring the position of the transport vehicle 20 may be used.

[0108] The receiving unit 27 is connected to the management unit 30 so as to be able to communicate with it, receives information transmitted from the management unit 30, and outputs the received information to the control unit 29. In this embodiment, the receiving unit 27 is connected to the management unit 30 so as to be able to communicate with it wirelessly, but the present invention is not limited to this, and the receiving unit 27 may be connected to the management unit 30 so as to be able to communicate with it by wire. In this embodiment, the information received by the receiving unit 27 from the management unit 30 is, for example, command information for operations related to the travel of the transport vehicle 20 and the lifting and lowering of the tray 23, and request information for prompting the transmission of the transport status and transport history of the transport vehicle 20 including the position of the transport vehicle 20 and the position of the tray 23.

[0109] The transmission unit 28 is connected to the management unit 30 so as to be able to communicate with the management unit 30, and transmits information output from the control unit 29 to the management unit 30. In this embodiment, the transmission unit 28 is connected to the management unit 30 so as to be able to communicate with the management unit 30 wirelessly, but the present invention is not limited to this, and the transmission unit 28 may be connected to the management unit 30 so as to be able to communicate with the management unit 30 via a wire. In this embodiment, the information transmitted by the transmission unit 28 to the management unit 30 is, for example, information on the transportation status and transportation history of the transportation vehicle 20.

[0110] The control unit 29 controls the operation of each component of the transport vehicle 20, and causes the transport vehicle 20 to perform operations related to the travel of the transport vehicle 20 and the lifting and lowering of the tray 23. The control unit 29 controls the travel of the transport vehicle 20 by controlling the motor 22-1 connected to the wheels 22 and the angle of the wheels 22, etc. The control unit 29 controls the motor 52 of the lifting mechanism 24, thereby controlling the lifting and lowering movement of the tray 23.

[0111] The control unit 29 controls the sensors 21-3 and 21-4 to acquire the position of the transport vehicle 20 on the transport path 10. The control unit 29 generates information on the transport status and transport history of the transport vehicle 20 based on information on the position of the transport vehicle 20 on the transport path 10 and information on the type of the article 210 (workpiece 200) transported by the transport vehicle 20.

[0112] The control unit 29 acquires information received by the receiving unit 27 from the management unit 30, and outputs information to be transmitted to the management unit 30 to the transmitting unit 28. The control unit 29 causes the transport vehicle 20 to perform an operation according to the command information received by the receiving unit 27 from the management unit 30. The control unit 29 causes the transmitting unit 28 to transmit information on the transport status and transport history of the transport vehicle 20 to the management unit 30 in response to request information received by the receiving unit 27 from the management unit 30. Even if the control unit 29 does not receive request information from the management unit 30, it can also cause the transmitting unit 28 to transmit information on the transport status and transport history of the transport vehicle 20 to the management unit 30 on its own initiative.

[0113] Here, the transportation status of the transport vehicle 20 includes, for example, the item 210 (workpiece 200) being transported, the type of transport vehicle 20 being transported, the type of transport path 10 on which the transport vehicle 20 is transporting and the position on the transport path 10, the transport speed, and error status related to errors that occurred in the transport vehicle 20 during transport and the workpiece 200 after transport. In addition, the transportation history of the transport vehicle 20 includes, for each transported item 210 (workpiece 200), the type of transport vehicle 20 that transported the item, the history of the type of transport path 10 on which the transport vehicle 20 transported the item, the passing history of the position on the transport path 10, the transport speed history, and the error history related to errors that occurred in the transport vehicle 20 during transport and the workpiece 200 after transport, all of which are associated with the time when the transport was performed and the type of the item 210 (workpiece 200).

[0114] In this embodiment, the control unit 29 includes a computer system similar to the above-mentioned control unit 370. The arithmetic processing device of the control unit 29 performs arithmetic processing in accordance with a computer program stored in the storage device of the control unit 29, and outputs control signals for controlling the transport vehicle 20 to each component of the transport vehicle 20 via the input / output interface device of the control unit 29.

[0115] The management unit 30 centrally manages the overall control of the workpiece processing system 1. The management unit 30 is communicably connected to the receiving units 350 and transmitting units 360 of each processing device 100 and each stocker 190, and is communicably connected to the receiving units 27 and transmitting units 28 of each transport vehicle 20. The management unit 30 transmits command information to each receiving unit 350, 27, thereby remotely controlling and operating each processing device 100, each stocker 190, and each transport vehicle 20 via each control unit 370, 29.

[0116] The management unit 30 can receive and grasp information on the processing status and processing history of each processing device 100 and each stocker 190, processing information and maintenance timing information, and a total inspection record of the device chips by the inspection device 150 from the transmission unit 360, and can receive and grasp information on the transport status and transport history of each transport vehicle 20 from the transmission unit 28. In this way, the management unit 30 can comprehensively control and operate each processing device 100, each stocker 190, and each transport vehicle 20, which are components of the workpiece processing system 1. The management unit 30 also functions as a server that collectively manages various information (data) received from each processing device 100 and each stocker 190 and various information (data) received from each transport vehicle 20. The management unit 30 can also analyze each processing device 100 that is the cause of the defect and provide feedback to each processing device 100 that is the cause of the defect, if there is a defect in the device chip, based on the total inspection record of the device chips by the inspection device 150.

[0117] Fig. 12 is a diagram showing an example of a notification image 600 that the management unit 30 of the workpiece processing system 1 in Fig. 1 causes the notification unit 40 to display. The management unit 30 generates maintenance time data 601 (see Fig. 12) that links the type of each processing device 100 with the maintenance time of each processing device 100 based on the maintenance time information received and acquired from each processing device 100.

[0118] The management unit 30 also calculates the first maintenance time, which is the earliest maintenance time, based on the maintenance time data 601. The management unit 30 also extracts, as maintenance-requiring devices, each processing device 100 linked to all maintenance times that will come within a predetermined period based on the first maintenance time in the maintenance time data 601, based on the maintenance time data 601, the first maintenance time, and a predetermined period registered in advance. The management unit 30 also generates, based on the information on the extracted maintenance-requiring devices, maintenance-requiring device notification information 602 (see FIG. 12) for notifying the worker 500 that all of the maintenance-requiring devices will be performed by a worker in accordance with the first maintenance time.

[0119] Further, the management unit 30 generates a notification image 600 shown in FIG. 12, which displays the maintenance time data 601 and the maintenance-required device notification information 602 on one screen, based on the generated maintenance time data 601 and the maintenance-required device notification information 602, and causes the notification unit 40 to display (notify) the notification image 600. The management unit 30 may highlight the maintenance-required devices in the table of the maintenance time data 601 or highlight the maintenance-required device notification information 602 in the notification image 600 so that it is highly visible to the worker 500, as shown in FIG. 12. In the workpiece processing system 1, the management unit 30 thus notifies the notification unit 40 of the maintenance-required device notification information 602, thereby reducing the frequency with which the worker 500 enters the first room 1000 (inside the clean room where the manufacturing process is carried out) where the device chips are manufactured.

[0120] In this embodiment, the management unit 30 applies a DBG (Dicing Before Grinding) process to the workpiece 200 in the workpiece processing system 1, and carries out transport, processing, and inspection of the workpiece 200 so as to divide the workpiece 200 and manufacture device chips. That is, the management unit 30 applies a process of performing a cutting process (dicing) before performing a grinding process (grinding) on ​​the workpiece 200 in the workpiece processing system 1, and carries out transport, processing, and inspection of the workpiece 200 so as to divide the workpiece 200 and manufacture device chips.

[0121] Specifically, in the workpiece processing system 1, the management unit 30 first performs a cutting process on the workpiece 200 from the front surface 201 side along the planned division line 202, thereby forming a half-cut groove having a depth equal to or greater than the finishing thickness but not completely dividing the workpiece 200, then peels off the support tape 205 and the annular frame 206 from the back surface 204 side of the workpiece 200 in which the half-cut groove has been formed, and attaches the support tape 205 and the annular frame 206 to the front surface 201 side, and then performs a grinding process on the back surface 204 side of the workpiece 200 until the bottom surface of the half-cut groove is reached and the thickness of the workpiece 200 reaches the finishing thickness, thereby completely dividing the workpiece 200 along the planned division line 202 to form device chips having the finishing thickness, and then divides the workpiece 200 to manufacture the device chips, thereby transporting and processing the workpiece 200.

[0122] When the DBG process is applied as described above, the management unit 30 first carries the workpiece 200 before the support tape 205 and the annular frame 206 are attached from the stocker 190 to the transport vehicle 20, and the transport vehicle 20 transports the workpiece 200 before processing to the processing device 110 (cutting device), which performs cutting processing on the workpiece 200 to form a half-cut groove, and returns it to the transport vehicle 20. The management unit 30 then transports the workpiece 200 with the half-cut groove formed thereon to the tape application device 120 by the transport vehicle 20, and the tape application device 120 attaches the support tape 205 and the annular frame 206 to the surface 201 side, and returns it to the transport vehicle 20. The management unit 30 then transports the workpiece 200, with the support tape 205 and the annular frame 206 attached to the front surface 201 side, to the processing device 130 (grinding device), which performs a grinding process on the back surface 204 side of the workpiece 200 to divide the workpiece 200 into device chips, and returns the workpiece 200 to the transport vehicle 20. The management unit 30 then transports the workpiece 200 divided into device chips to the processing device 140 (tape expansion device), which expands the support tape 205 attached to the device chips to widen the gaps between the device chips, and returns the workpiece 200 to the transport vehicle 20. The management unit 30 then uses the transport vehicle 20 to sequentially transport the device chips, which are manufactured by dividing the workpiece 200 and have their intervals widened, to the inspection devices 150, 160, which measure predetermined measurement items of the workpiece 200 divided into device chips, and return the workpiece 200 to the transport vehicle 20. The management unit 30 then uses the transport vehicle 20 to transport the workpiece 200 divided into device chips to the stocker 190, which collects the workpiece 200 divided into device chips. In this way, the management unit 30 applies the DBG process in the workpiece processing system 1 to transport, process, and inspect the workpiece 200.

[0123] By applying the DBG process to the workpiece 200 in this manner, the workpiece processing system 1 can reduce the risk of chipping occurring on the back surface 204 of the device chip manufactured by dividing the workpiece 200, and this can significantly reduce the number of times that the worker 500 needs to enter the first room 1000 in which the processing device 100 is installed to perform processing such as worker maintenance in order to deal with the occurrence of a large number of chippings. Note that the management unit 30 is not limited to this in the present invention, and any control may be performed on the workpiece processing system 1 as long as it is possible to divide the workpiece 200 and manufacture a plurality of device chips.

[0124] In this embodiment, the management unit 30 includes a computer system similar to the control units 370, 29. The arithmetic processing device of the management unit 30 performs arithmetic processing in accordance with a computer program stored in the storage device of the management unit 30, and outputs control signals for controlling the workpiece processing system 1 to each component of the workpiece processing system 1 via the input / output interface device of the management unit 30.

[0125] The alarm unit 40 is connected to the management unit 30 so that information can be communicated, and based on instructions from the management unit 30, displays to the operator various information such as a screen of historical information relating to the item 210 (workpiece 200) to be transported by the transport vehicle 20 in the workpiece processing system 1, for example, a screen of the processing status and processing history of the processing device 100 relating to the workpiece 200, and a screen of the transport status and transport history of the transport vehicle 20, a screen of processing information of the processing device 100 including the position of the processing device 100 and the processing history of the processing device 100, and a screen of information on maintenance timing such as an alarm image 600, in a manner that is visible to the operator.

[0126] The notification unit 40 is configured with a liquid crystal display device or the like. The notification unit 40 is provided with an input unit that is used when an operator inputs information related to the display of the above-mentioned screen of the workpiece processing system 1. The input unit provided in the notification unit 40 is configured with at least one of a touch panel provided in the notification unit 40 and a keyboard or the like. Note that, although the notification unit 40 is installed in the second room 2000 in this embodiment, the present invention is not limited to this form, and the notification unit 40 may be installed at the end of any wireless or wired communication device connected to the management unit 30.

[0127] The workpiece processing system 1 of the embodiment having the above-mentioned configuration separates a first room 1000 in which a processing device 100 for manufacturing device chips is installed, and a second room 2000 in which a stocker 190 for storing a plurality of workpieces 200 is installed, and transportation between the first room 1000 and the second room 2000 is performed by a transport vehicle 20 traveling on a transport path 10, thereby achieving the advantageous effect of reducing the frequency with which workers 500 enter the first room 1000 (inside the clean room where the manufacturing process is carried out) where device chips are manufactured.

[0128] Furthermore, in the workpiece processing system 1 according to the embodiment, it is preferable that the first chamber 1000 is cleaner than the second chamber 2000, thereby reducing the risk of foreign matter being mixed in when processing the workpiece 200 to manufacture device chips.

[0129] In addition, in the workpiece processing system 1 according to the embodiment, the workpiece 200 has a device region 207 in which a device 203 is formed and a peripheral excess region 208 surrounding the device region 207, the first room 1000 is provided with an inspection device 150 having an imaging unit 155 that images the device chip manufactured by dividing the device region 207 from at least one of the front surface 201, the back surface 204, and the side surface 221, and the workpiece processing system 1 has a memory section 158 that stores the image captured by the imaging unit 155 and a measurement section 159 that measures at least chipping of the device chip from the image. Therefore, the workpiece processing system 1 can easily acquire and manage the total inspection record of the device chips.

[0130] Moreover, in the workpiece processing system 1 according to the embodiment, the transport vehicle 20 includes a tray 23 for storing at least one of the workpiece 200 or the article 210 used in the processing device 100, and a lifting mechanism 24 for raising and lowering the tray 23 relative to the processing device 100 and the stocker 190. Therefore, in the workpiece processing system 1 according to the embodiment, the transport vehicle 20 can smoothly transport the article 210 (workpiece 200) between the processing device 100 and the stocker 190 by passing through the transport path 10 for transporting the article 210 (workpiece 200) connecting the first room 1000 and the second room 2000 and the space in which the transport vehicle 20 runs on the transport path 10.

[0131] It should be noted that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the gist of the present invention. [Explanation of symbols]

[0132] 1 Workpiece processing system 10 Transport path 20 Transport vehicle 23 Tray 24 Lifting mechanism 100 Processing equipment 150,160 Inspection equipment 158 Memory section 159 Measuring section 190 Stocker 200 Workpiece 201 Surface 204 Back side 207 Device Area 208 Surplus outer area 221 Side 1000 First Room 2000 Second Room

Claims

1. 1. A system for processing a workpiece, comprising: a first room having a plurality of processing devices for dividing a workpiece to manufacture a plurality of device chips, a transport path installed on an upper surface of the processing devices spanning the plurality of processing devices, and a transport vehicle running on the transport path to transport the workpiece between the plurality of processing devices; The machine includes a stocker for storing a plurality of workpieces, and a second chamber for transferring the workpieces between the stocker and the transport vehicle; The first room and the second room are connected by the transport path along which the transport vehicle travels.

2. 2. The system for processing a workpiece according to claim 1, wherein the first chamber is cleaner than the second chamber.

3. The workpiece has a device region in which a device is formed and a peripheral excess region surrounding the device region, The first room comprises: an inspection device having an imaging unit for imaging at least one of a front surface, a back surface, and a side surface of the device chip manufactured by dividing the device region by the processing device is disposed; The processing system includes: A storage unit that stores an image captured by the imaging unit; a measuring unit that measures at least chipping of the device chip from the image; 3. The workpiece processing system according to claim 1, further comprising:

4. The transport vehicle is A tray for accommodating at least one of a workpiece or an item to be used in the processing device; a lifting mechanism for lifting and lowering the tray relative to the processing device and the stocker; 3. The workpiece processing system according to claim 1 or 2, comprising:

Images