Substrate processing apparatus

Abstract

To provide a substrate processing apparatus capable of surely adjusting pressing force acting on a substrate from a cleaning tool with high responsiveness.SOLUTION: A substrate is held by a substrate holding device that is provided onto a floor surface of a chamber. A brush device 50 held by a brush arm 41 is depressed to the substrate to clean the substrate. In the brush arm 41, the brush device 50 is held by a brush device holding body to which a brush support shaft 34, a first coupling member 210, a second coupling member 220, and a rotational support mechanism 290 are coupled. The brush device holding body holding the brush device 50 is further supported by a poston 121 of a double-acting type air cylinder apparatus 100. At the time of a cleaning treatment of the substrate, a pressure of two spaces in an internal part of the double-acting type air cylinder apparatus 100 is adjusted so that force acting on the piston 121 from the brush device holding body is cancelled in a state where depression force set to the substrate from the brush device 50 acts.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a substrate processing apparatus that processes a substrate by bringing a cleaning tool into contact with the substrate. [Background technology]

[0002] Substrate processing apparatuses are used to perform various processes on substrates such as semiconductor substrates, substrates for FPDs (Flat Panel Displays) such as liquid crystal display devices or organic EL (Electro Luminescence) display devices, substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, substrates for photomasks, ceramic substrates, and substrates for solar cells.

[0003] As an example of such a substrate processing apparatus, a substrate processing apparatus described in Patent Document 1 includes a back surface cleaning unit that scrubs the back surface (one surface) of a substrate. The back surface cleaning unit includes a spin chuck, a brush, a holding arm, and a brush moving mechanism.

[0004] The spin chuck rotatably holds the substrate in a horizontal position. The holding arm holds a brush. A brush moving mechanism is connected to the holding arm. The brush moving mechanism moves the holding arm to bring the brush into contact with one surface of the substrate held and rotated by the spin chuck. The brush moving mechanism further moves the holding arm to move the brush over the one surface of the substrate. In this way, the one surface of the substrate is cleaned.

[0005] In the holding arm, the brush is attached to the lower end of a rotating shaft that extends in the vertical direction. The rotating shaft is supported by the housing of the holding arm via a coil spring. Therefore, when the brush is not in contact with the substrate, the weight of the structure including the rotating shaft and the brush is offset by the elastic force of the coil spring.

[0006] Furthermore, the holding arm includes a pressing actuator for pressing the rotating shaft downward to press the brush against the substrate while the brush is in contact with the substrate. The degree of cleaning power for the substrate varies depending on the pressing force (pressing force) applied from the brush to the substrate. Therefore, the pressing actuator presses the rotating shaft downward with a predetermined force to obtain a predetermined degree of cleaning power when cleaning the substrate. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] JP 2009-206139 A Summary of the Invention [Problem to be solved by the invention]

[0008] As various patterns formed on a substrate become finer, more precise processing of the substrate is required. One of such requirements is to accurately clean one surface of the substrate with a predetermined cleaning power.

[0009] On the other hand, the substrate to be cleaned may have one or more films formed thereon. Alternatively, the substrate to be cleaned may have been subjected to heat treatment or the like immediately before cleaning. In this way, if the substrate to be cleaned has been subjected to one or more treatments in advance, there is a possibility that distortion (such as a bulge or a depression) may occur in the substrate.

[0010] When a substrate having localized distortion is held by the spin chuck, the height positions of the one surface of the substrate held by the spin chuck will differ from one another. Therefore, when the holding arm moves in the horizontal direction during cleaning of the one surface of the substrate, the distance between the holding arm and the substrate will change depending on the position on the one surface of the substrate. When the distance between the holding arm and the substrate changes, the length of the coil spring built into the holding arm also changes.

[0011] The elastic force generated in the coil spring changes depending on the length of the coil spring. Therefore, if the elastic force generated in the coil spring varies in multiple parts of one surface of the board, it is difficult to accurately adjust the pressing force applied from the brush to the board. Taking into account the change in the elastic force generated in the coil spring, it is conceivable to measure the distance between the holding arm and the board and control the operation of the pressing actuator based on the measurement result. However, such control reduces the responsiveness of the adjustment of the pressing force applied from the brush to the board.

[0012] An object of the present invention is to provide a substrate processing apparatus that enables accurate adjustment of the pressing force applied from a cleaning tool to a substrate with high responsiveness. [Means for solving the problem]

[0013] According to one aspect of the present invention, there is provided a substrate processing apparatus comprising: a substrate holding section provided on a first installation surface and configured to hold a substrate; a cleaning tool for processing the substrate by contacting one side of the substrate; a cleaning tool holder for holding the cleaning tool in a state in which the cleaning tool faces the one side of the substrate held by the substrate holding section; a pressing device for supporting the cleaning tool holder; and a control section, wherein the pressing device is provided on a second installation surface having a predetermined positional relationship with the first installation surface and configured to include a cylinder member having an internal space; The cleaning tool holder includes a piston that divides the cleaning tool into first and second chambers, an axial member that extends from the piston above or below the cylinder member and has a tip connected to the cleaning tool holder, and a pressure adjustment device that adjusts the pressure in the first chamber and the pressure in the second chamber, and the control unit controls the pressure adjustment device to adjust the pressure in the first chamber and the pressure in the second chamber so that, when the cleaning tool processes the substrate, a predetermined set pressing force is applied from the cleaning tool to the substrate and a force acting on the piston from the cleaning tool holder via the axial member is canceled out. Effect of the Invention

[0014] According to the present invention, it is possible to accurately adjust the pressing force acting on a substrate from a cleaning tool with high responsiveness when the substrate is processed using the cleaning tool. [Brief description of the drawings]

[0015] [Figure 1] 1 is a schematic plan view of a substrate processing apparatus according to an embodiment of the present invention; [Diagram 2] 2 is a diagram for explaining a basic operation during a cleaning process of a substrate in the substrate processing apparatus of FIG. 1. [Diagram 3] FIG. 2 is a schematic plan view of the brush arm of FIG. [Figure 4] 4 is a vertical cross-sectional view of the brush arm taken along line AA in FIG. 3. [Diagram 5] 4 is a vertical cross-sectional view of the brush arm taken along line BB in FIG. 3. [Figure 6] 4 is a vertical cross-sectional view of the brush arm taken along line CC in FIG. 3. [Figure 7] 4A to 4C are diagrams illustrating a plurality of members supported by a piston of the double-acting air cylinder device. [Figure 8] 2 is a block diagram showing a configuration of a control system of the substrate processing apparatus of FIG. 1. [Figure 9] 9 is a diagram for explaining a first example of cleaning condition information stored in the storage device of FIG. 8. FIG. [Figure 10] 9 is a diagram for explaining a second example of the cleaning condition information stored in the storage device of FIG. 8. FIG. [Figure 11] 13 is a flowchart of a substrate cleaning process performed by a control unit. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0016] A substrate processing apparatus according to an embodiment of the present invention will be described below with reference to the drawings. In the following description, the term "substrate" refers to a substrate for a flat panel display (FPD) used in a liquid crystal display device or an organic electroluminescence (EL) display device, a semiconductor substrate, an optical disk substrate, a magnetic disk substrate, a magneto-optical disk substrate, a photomask substrate, a ceramic substrate, a solar cell substrate, or the like.

[0017] In this embodiment, the substrate has a circular shape in plan view except for the portion where the notch is formed. The substrate has a front surface on which a circuit is formed and a back surface opposite to the circuit forming surface. In the following description, regardless of whether the front surface or back surface of the substrate is the substrate, the surface facing upward is referred to as the top surface of the substrate, and the surface facing downward is referred to as the bottom surface of the substrate.

[0018] The substrate processing apparatus described below performs a cleaning process using a brush on a substrate to be processed. During the cleaning process, a predetermined cleaning liquid is supplied to the upper surface of the substrate while a brush is pressed against the upper surface of the substrate.

[0019] 1. Overall configuration of substrate processing equipment Fig. 1 is a schematic plan view of a substrate processing apparatus according to an embodiment of the present invention. In Fig. 1 and certain figures following Fig. 2, arrows are provided to indicate mutually orthogonal X, Y, and Z directions to clarify positional relationships. The X and Y directions are mutually orthogonal in a horizontal plane, and the Z direction corresponds to the up-down direction (vertical direction).

[0020] As shown in FIG. 1, the substrate processing apparatus 1 has a configuration in which multiple members are accommodated in a chamber CH, and includes a substrate holding device 10, a cup device 20, a nozzle device 30, a brush arm device 40, a brush device 50, a waiting pod 49, and a control unit 900.

[0021] The chamber CH has four side surfaces, a ceiling surface, and a floor surface (bottom surface) CHB. A transfer opening (not shown) for transferring a substrate between the inside of the chamber CH and the outside of the chamber CH is formed in one side surface of the chamber CH.

[0022] A substrate holding device 10 is provided at approximately the center of the floor CHB of the chamber CH. The substrate holding device 10 includes a spin base 11, a plurality of holding pins 12, a substrate holding drive unit 13 (FIG. 8), and a substrate rotation drive unit 14 (FIG. 8). The substrate rotation drive unit 14 includes, for example, a motor, and is fixed to the floor CHB of the chamber CH so that the rotation shaft of the motor faces upward. A disk-shaped spin base 11 is attached to the upper end of the rotation shaft.

[0023] The spin base 11 has an outer diameter larger than that of the substrate W to be processed. A plurality of holding pins 12 are provided on the peripheral portion of the upper surface of the spin base 11. Each of the plurality of holding pins 12 has an abutment portion. When the substrate W is placed on the spin base 11, each holding pin 12 is configured to be able to transition between a holding state in which the abutment portion abuts against the outer peripheral end of the substrate W and a release state in which the abutment portion is separated from the substrate W. The substrate holding drive unit 13 includes, for example, a magnet, and switches each holding pin 12 between the holding state and the release state using the magnetic force of the magnet. The abutment portions of the plurality of holding pins 12 in the holding state abut against multiple portions of the outer peripheral end of the substrate W, thereby holding the substrate W on the spin base 11. In FIG. 1, the outer shape of the substrate W held by the substrate holding device 10 is indicated by a dashed line.

[0024] The cup device 20 includes a cup body 21 and a cup lifting drive unit 22. The cup body 21 has a substantially cylindrical shape, and is provided so as to surround the spin base 11 in a plan view and extend in the Z direction. The cup body 21 is also provided so as to be movable in the Z direction.

[0025] The cup lifting drive unit 22 includes an actuator such as a motor or an air cylinder, and moves the cup body 21 between a predetermined cup upper position and a cup lower position. The cup upper position is the height position (vertical position) of the cup body 21 when the upper end of the cup body 21 is located above the substrate W held by the substrate holding device 10. The cup lower position is the height position of the cup body 21 when the upper end of the cup body 21 is located below the substrate W held by the substrate holding device 10.

[0026] The nozzle device 30 includes a fluid nozzle 31 and a fluid supply system 32. The fluid nozzle 31 is provided at a predetermined position above the substrate holding device 10 and the cup device 20. The fluid nozzle 31 is fixed so that its discharge port faces the rotation center SC of the spin base 11 in the substrate holding device 10. The fluid supply system 32 supplies a cleaning liquid to the fluid nozzle 31 during cleaning processing of the substrate W. As a result, the cleaning liquid is supplied to the upper surface of the substrate W held by the substrate holding device 10. The cleaning liquid is, for example, pure water (deionized water). Note that, instead of pure water, carbonated water, ozone water, hydrogen water, electrolytic ionized water, SC1 (a mixed solution of ammonia and hydrogen peroxide), TMAH (tetramethylammonium hydroxide), or the like can also be used as the cleaning liquid. Furthermore, the nozzle device 30 may be configured to be able to spray a gas such as an inert gas from the fluid nozzle 31. Furthermore, the nozzle device 30 may have a plurality of fluid nozzles 31 capable of discharging or spraying different fluids from each other.

[0027] The brush arm device 40 includes a brush arm 41, a guide rail 43, an arm support unit 44, an arm horizontal drive unit 45, and an arm lift drive unit 46. In the chamber CH, the guide rail 43 is provided adjacent to the substrate holding device 10 in the Y direction. The guide rail 43 extends in the X direction.

[0028] The arm support portion 44 is provided so as to be movable in the X direction along the guide rail 43. The arm horizontal drive portion 45 of this example includes a motor, and moves the arm support portion 44 in the X direction under the control of a control portion 900, which will be described later. The brush arm 41 is supported by the arm support portion 44 so as to be movable (liftable) in the Z direction. The arm lift drive portion 46 of this example includes a motor, and moves the brush arm 41 in the Z direction under the control of a control portion 900, which will be described later.

[0029] The brush arm 41 has a substantially rectangular parallelepiped shape and extends in the Y direction from the arm support part 44 towards the substrate holding device 10. The tip part of the brush arm 41 is configured as a brush holding part 42 capable of holding a brush device 50 used for cleaning the substrate W. In the substrate processing apparatus 1 of Fig. 1, the brush holding part 42 is located on an imaginary straight line L1 that passes through the rotation center SC of the spin base 11 and extends in the X direction in a plan view.

[0030] The brush device 50 includes a brush, and has a cleaning surface capable of contacting the upper surface of the substrate W. The brush is formed of, for example, a PVA (polyvinyl alcohol) sponge or a PVA sponge with abrasive grains dispersed therein.

[0031] In a plan view, the waiting pod 49 and the substrate holding device 10 are aligned on the virtual straight line L1. The waiting pod 49 is configured to be capable of accommodating in a clean state the brush device 50 held by the brush holding portion 42 and to be washable. As indicated by the thick dotted line frame in Fig. 1, in the substrate processing apparatus 1, a waiting position SP is set at a position overlapping the waiting pod 49 in a plan view. A control unit 900 controls the operation of each unit of the substrate processing apparatus 1. The control unit 900 will be described in detail later.

[0032] 2. Basic cleaning operations in substrate processing equipment Fig. 2 is a diagram for explaining a basic operation during cleaning processing of a substrate W in the substrate processing apparatus 1 of Fig. 1. In Fig. 2, a schematic plan view of the substrate processing apparatus 1 is shown in the upper part, and a schematic side view of the substrate processing apparatus 1 is shown in the lower part.

[0033] In the initial state of the cleaning process of the substrate W, the brush holder 42 that holds the brush device 50 is located at the standby position SP. The brush device 50 is housed in a standby pod 49. In addition, the cup body 21 is located at the below-cup position, and the discharge of the cleaning liquid by the fluid nozzle 31 is stopped.

[0034] When the cleaning process of the substrate W is started, the substrate W loaded into the substrate processing apparatus 1 is held by the substrate holding device 10 and rotated at a predetermined rotation speed. The cup body 21 is held at a position above the cup. Furthermore, a cleaning liquid is discharged from the fluid nozzle 31 toward the rotating substrate W.

[0035] In this state, the arm horizontal drive unit 45 and the arm elevation drive unit 46 in Fig. 1 are operated to move the brush arm 41 in the Z direction and the X direction. As a result, the brush device 50 held by the brush holder 42 is lifted up from the waiting pod 49 and pressed against the upper surface of the rotating substrate W. In this state, as shown by thick dashed double-dashed arrows a1 and a2 in Fig. 2, the brush device 50 is moved in the X direction along the imaginary straight line L1 in a plan view. In this manner, the upper surface of the substrate W is cleaned.

[0036] When the upper surface of the substrate W has been cleaned, the brush device 50 is returned to its initial position. In addition, the fluid nozzle 31 stops discharging the cleaning liquid, and the substrate holding device 10 stops rotating the substrate W. In addition, the cup body 21 moves from the cup upper position to the cup lower position. This completes the cleaning process of the substrate W.

[0037] 2, the brush device 50 moves back and forth between the outer circumferential edge of the substrate W and the rotation center SC of the spin base 11, but the brush device 50 may clean the substrate W by moving from one end to the other end of the substrate W along the imaginary straight line L1. Alternatively, the brush device 50 may clean the substrate W by moving only once between the outer circumferential edge of the substrate W and the rotation center SC of the spin base 11.

[0038] 3. Configuration of brush arm 41 Fig. 3 is a schematic plan view of the brush arm 41 of Fig. 1. The brush arm 41 according to this embodiment has a configuration in which a plurality of members are accommodated in a housing H. The housing H has an upper wall Ha (Fig. 4), a bottom wall Hb, and four side walls Hc, Hd, He, and Hf. In Fig. 3, the upper wall Ha is not shown. As a result, in Fig. 3, the internal configuration of the brush arm 41 is shown in plan view.

[0039] Fig. 4 is a vertical cross-sectional view of brush arm 41 taken along line AA in Fig. 3, Fig. 5 is a vertical cross-sectional view of brush arm 41 taken along line BB in Fig. 3, and Fig. 6 is a vertical cross-sectional view of brush arm 41 taken along line CC in Fig. 3. In each of Figs. 4 to 6, some members inside housing H are appropriately omitted from the illustration in order to make it easier to understand the internal configuration of brush arm 41.

[0040] 3 and 4, the bottom wall Hb of the housing H has a flat upper surface and is rectangular in shape extending in the Y direction in a plan view. The side walls Hc and Hd are formed so as to extend upward from two long sides of the bottom wall Hb that face each other in the X direction. The side walls He and Hf are formed so as to extend upward from two short sides of the bottom wall Hb that face each other in the Y direction.

[0041] An arm connection portion 41j is formed on one of the two side walls He, Hf of the housing H so as to extend in the Y direction outward from the housing H. The arm connection portion 41j is connected to the arm support portion 44 of FIG. 1. As a result, the brush arm 41 is supported by the arm support portion 44. The other of the two side walls He, Hf of the housing H constitutes a part of the brush holding portion 42. In other words, the side wall Hf is located at the tip of the brush arm 41.

[0042] A double-acting air cylinder device 100 is provided via a cylinder base 190 at approximately the center in the Y direction of the bottom wall Hb of the housing H. As shown in Fig. 4, the double-acting air cylinder device 100 includes a cylinder member 110, a piston 121, and an axis member 122. The cylinder member 110 is fixed onto the cylinder base 190 so that its axis extends in the Z direction.

[0043] The piston 121 is provided inside the cylinder member 110 and divides the internal space of the cylinder member 110 into a first chamber 111 and a second chamber 112 that are aligned in the Z direction. The first chamber 111 is located below the second chamber 112. The shaft member 122 is provided to extend from the piston 121 toward the upper part of the cylinder member 110. A portion of the shaft member 122 including its upper end protrudes above the cylinder member 110 and is exposed to the outside of the cylinder member 110.

[0044] A first electropneumatic regulator 131 and a second electropneumatic regulator 132 provided outside the brush arm 41 are connected to the cylinder member 110 via piping (not shown). The first electropneumatic regulator 131 operates under the control of a control unit 900 (described later) and adjusts the pressure in the first chamber 111 by supplying air into the first chamber 111. The second electropneumatic regulator 132 operates under the control of the control unit 900 (described later) and adjusts the pressure in the second chamber 112 by supplying air into the second chamber 112. A force according to the relationship between the pressure in the first chamber 111 and the pressure in the second chamber 112 acts on the piston 121.

[0045] A first connecting member 210 is connected to the upper end of the shaft member 122. The first connecting member 210 is composed of a rod-shaped member having high rigidity, and one end of the first connecting member 210 is rigidly connected (coupled) to the shaft member 122. In this state, the first connecting member 210 extends in the Y direction from the upper end of the double-acting air cylinder device 100 to the position of the brush holding part 42. A second connecting member 220 is rigidly connected (coupled) to the other end of the first connecting member 210.

[0046] 6, the second connecting member 220 is an inverted L-shaped member when viewed in the Y direction, and has a portion extending in the X direction and a portion extending in the Z direction. In the following description, the portion of the second connecting member 220 that extends in the X direction is called a horizontal portion 221. Also, the portion of the second connecting member 220 that extends in the Z direction is called a vertical portion 222.

[0047] In the brush holding portion 42 of the brush arm 41, a through hole 34h is formed in the bottom wall Hb, which communicates the internal space of the housing H with a space below the housing H. The horizontal portion 221 of the second connecting member 220 is disposed above the through hole 34h so as to overlap with the through hole 34h in the Z direction. A rotation support mechanism 290 is attached to the horizontal portion 221.

[0048] In the brush holding portion 42, the brush device 50 is supported by the brush support shaft 34 at a position below the bottom wall Hb. The rotation support mechanism 290 includes a bearing (not shown), and supports one end of the brush support shaft 34 rotatably about the axis of the brush support shaft 34. While being supported by the rotation support mechanism 290, the brush support shaft 34 extends in the Z direction through the through hole 34h to a position below the housing H. The brush device 50 is attached to the other end (lower end) of the brush support shaft 34.

[0049] A linear guide 230 is provided on the upper surface of the bottom wall Hb at a position to the side of the through hole 34h in the X direction (a position between the through hole 34h and the side wall Hd). The linear guide 230 extends upward from the bottom wall Hb. A guide groove extending in the Z direction is formed in the linear guide 230. The vertical portion 222 of the second connecting member 220 is fitted into the guide groove of the linear guide 230 along the Z direction. As a result, the linear guide 230 regulates the movement direction of the second connecting member 220 in the Z direction.

[0050] Here, in the brush arm 41 according to the present embodiment, the brush device 50 is supported by the brush support shaft 34 so as to be rotatable about an axis in the Z direction, i.e., so as to be able to rotate on its axis. By rotating the brush device 50 on its axis during the cleaning process of the substrate W, the efficiency of the cleaning process of the substrate W is improved. In order to rotate the brush device 50 on its axis, a motor 300 is provided in the brush arm 41 for rotating the brush support shaft 34 around the axis of the brush support shaft 34.

[0051] Specifically, as shown in Fig. 3, the motor 300 is provided via a motor base 390 at a position on the bottom wall Hb of the housing H between the double-acting air cylinder device 100 and the brush holder 42 in the Y direction. As shown in Fig. 5, the motor 300 is supported on the motor base 390 so that its rotation shaft extends downward. A rotation force transmission mechanism 310 is provided between the rotation shaft of the motor 300 and the brush support shaft 34 to transmit the rotation force generated in the motor 300 to the brush support shaft 34.

[0052] The rotational force transmission mechanism 310 includes two pulleys 311 and 312 and a belt 313. The pulley 311 is attached to the tip of the rotating shaft of the motor 300. More specifically, the pulley 311 is fixed to the rotating shaft of the motor 300 so as to be unrotatable and unmovable in the axial direction of the rotating shaft.

[0053] The pulley 312 is rotatably supported on the bottom wall Hb via a base (not shown) including a bearing. As a result, the pulley 312 is fixed at the same position (height position) as the pulley 311 in the Z direction. In this state, the pulley 312 is attached to the brush support shaft 34 by a serration structure. As a result, the pulley 312 is unable to rotate with respect to the brush support shaft 34 but is movable in the axial direction of the brush support shaft 34. The belt 313 is stretched between the two pulleys 311, 312.

[0054] 5, a motor drive circuit 301 provided outside the brush arm 41 is connected to the motor 300. The motor drive circuit 301 supplies a current to the motor 300 under the control of a control unit 900, which will be described later, to rotate the motor 300.

[0055] When the motor 300 is operating, a rotational force generated by the motor 300 is transmitted from the rotating shaft of the motor 300 to the brush support shaft 34 through the pulley 311, the belt 313, and the pulley 312. As described above, the pulley 312 is supported so as to be movable in the axial direction of the brush support shaft 34 relative to the brush support shaft 34. Therefore, even if the brush support shaft 34 moves in the Z direction, the movement does not affect the transmission of the rotational force from the motor 300 to the brush support shaft 34.

[0056] In the brush arm 41 having the above-mentioned configuration, the pressing force of the brush device 50 against the substrate W is adjusted by adjusting the force acting on the piston 121 of the double-acting air cylinder device 100 during cleaning processing of the substrate W.

[0057] When the brush device 50 is not in contact with the substrate W, the brush device 50 and a plurality of members constituting a part of the brush arm 41 are supported by the piston 121 of the double-acting air cylinder device 100. As a result, the weight of the plurality of members acts on the piston 121 of the double-acting air cylinder device 100 via the shaft member 122.

[0058] Fig. 7 is a diagram for explaining a plurality of members supported by the piston 121 of the double-acting air cylinder device 100. In Fig. 7, a schematic plan view of the brush arm 41 is shown in the upper part. In this schematic plan view, similar to the example of Fig. 3, the illustration of the upper wall Ha of the housing H is omitted. Furthermore, in Fig. 7, a vertical cross-sectional view taken along line AA in Fig. 3 is shown in the middle part, and a vertical cross-sectional view taken along line CC in Fig. 3 is shown in the lower part. In each view of Fig. 7, a dot pattern is applied to the plurality of members supported by the piston 121 so that the plurality of members supported by the piston 121 can be easily identified.

[0059] 7, in the brush arm 41 of this example, the first connecting member 210, the second connecting member 220, the rotation support mechanism 290, and the brush support shaft 34, which are integrally connected, correspond to a plurality of members supported by the piston 121. In the following description, the structure consisting of the first connecting member 210, the second connecting member 220, the rotation support mechanism 290, and the brush support shaft 34, which are integrally connected, is referred to as the brush device holder.

[0060] When the pressure in the first chamber 111 (FIG. 4) and the second chamber 112 (FIG. 4) in the cylinder member 110 is adjusted and the piston 121 moves in the Z direction, the brush device holder also moves in the Z direction, as shown by the outlined arrow in FIG 7. The range in the Z direction over which the brush device holder can move within the housing H is equal to the range over which the piston 121 can move up and down in the cylinder member 110.

[0061] 4. Control of the double-acting air cylinder device 100 during cleaning processing of the substrate W In the substrate processing apparatus 1 according to this embodiment, before the cleaning process of the substrate W, a pressing force (hereinafter referred to as a set pressing force) to be applied from the brush device 50 to each portion of the upper surface of the substrate W is determined. When determining the set pressing force, for example, the degree of contamination on the upper surface of the substrate W, the distribution of contamination on the upper surface of the substrate W, the method of the cleaning process of the substrate W, etc. are taken into consideration.

[0062] Here, the set pressing force corresponding to a portion of the upper surface of the substrate W is defined as "F", and the mass of the brush device holder is defined as "M". Moreover, the area of ​​one face of the piston 121 which forms the first chamber 111 of the cylinder member 110 and is perpendicular to the axial direction of the cylinder member 110 is defined as "S1", and the area of ​​the other face of the piston 121 which forms the second chamber 112 of the cylinder member 110 and is perpendicular to the axial direction of the cylinder member 110 is defined as "S2". Furthermore, the pressure in the first chamber 111 is defined as "P1", and the pressure in the second chamber 112 is defined as "P2".

[0063] In this case, in order to properly clean a portion of the upper surface of the substrate W with a set pressing force, the following formula (1) must be satisfied when the cleaning surface of the brush device 50 is in contact with the portion of the upper surface of the substrate W. In addition, "g" in formula (1) represents the acceleration of gravity.

[0064] F = Mg - (S1 × P1) + (S2 × P2) … (1) Of the multiple elements expressed in formula (1), "F" is a preset value, and "M," "S1," and "S2" are values ​​that cannot be changed due to the structure of the brush arm 41. Therefore, in this embodiment, the values ​​of "P1" and "P2" are determined for each part of the upper surface of the substrate W to establish the above formula (1). Furthermore, with the brush device 50 in contact with each part of the upper surface of the substrate W, the value of the pressure "P1" in the first chamber 111 and the value of the pressure "P2" in the second chamber 112 are adjusted to be predetermined values ​​corresponding to the parts.

[0065] When formula (1) is satisfied, when a set pressing force acts from the brush device 50 on a portion of the upper surface of the substrate W during cleaning processing of the substrate W, the force acting on the piston 121 from the brush device holder through the shaft member 122 is offset.

[0066] Here, in this embodiment, the value of pressure "P1" in first chamber 111 set for the entire upper surface of substrate W is set as a fixed value to a value that offsets the weight of the brush device holder acting on piston 121. In other words, the value of pressure "P1" in first chamber 111 is set as a fixed value to a value that offsets the force acting on piston 121 when the set pressing force is "0". This fixed value is a value obtained by multiplying the mass of the brush device holder by the gravitational acceleration (the weight of the brush device holder) and dividing it by the area "S1" of one face of piston 121.

[0067] On the other hand, the value of the pressure "P2" in the second chamber 112 set for each part on the upper surface of the substrate W is set to a value corresponding to the set pressing force of the part. The value corresponding to the set pressing force is a value obtained by dividing the set pressing force by the area "S2" of the other surface of the piston 121.

[0068] Pressure information indicating the value of the pressure "P1" in the first chamber 111 and the value of the pressure "P2" in the second chamber 112 set for each portion of the upper surface of the substrate W is stored in a storage device 904 (FIG. 8) of the control unit 900, which will be described later, as part of the cleaning conditions, which will be described later. During the cleaning process of the substrate W, the first electro-pneumatic regulator 131 and the second electro-pneumatic regulator 132 operate based on the cleaning conditions. Thereby, during the cleaning process of the substrate W, the value of the pressure "P1" in the first chamber 111 and the value of the pressure "P2" in the second chamber 112 of the double-acting air cylinder device 100 are adjusted to the set values.

[0069] 5. Control system of substrate processing apparatus 1 The control system of the substrate processing apparatus 1 will be described together with the configuration of the control unit 900 in FIG. 1. FIG. 8 is a block diagram showing the configuration of the control system of the substrate processing apparatus 1 in FIG. 1. As shown in FIG. 8, the control unit 900 includes a CPU (Central Processing Unit) 901, a RAM (Random Access Memory) 902, a ROM (Read Only Memory) 903, and a storage device 904. The RAM 902 is used as a working area for the CPU 901. The ROM 903 stores a system program. The storage device 904 includes a storage medium such as a hard disk or a semiconductor memory, and stores a substrate cleaning program for performing a cleaning process on the substrate W and cleaning conditions set in association with the cleaning process on the substrate W. The cleaning conditions include, in addition to the pressure information, rotation speed information related to the rotation speed of the substrate W, and path information indicating the moving path and moving speed of the brush device 50 on the upper surface of the substrate W during the cleaning process.

[0070] The substrate cleaning program may be provided in a state stored in a recording medium such as a CD-ROM 909, and may be installed in the ROM 903 or the storage device 904. Alternatively, the substrate cleaning program may be distributed from a server external to the substrate processing apparatus 1 via a communication network, and may be installed in the ROM 903 or the storage device 904.

[0071] The CPU 901 executes the substrate cleaning program to control the operation of each part of the substrate processing apparatus 1. Specifically, the control unit 900 controls the substrate holding and driving unit 13. As a result, the control unit 900 causes the state of the multiple holding pins 12 to transition from an open state to a holding state, thereby causing the substrate W to be carried into the substrate processing apparatus 1 to be held by the substrate holding device 10. The control unit 900 also causes the state of the multiple holding pins 12 to transition from a holding state to a release state in order to carry out the substrate W from the substrate processing apparatus 1. Furthermore, the control unit 900 controls the substrate rotation and driving unit 14 based on the cleaning conditions (rotation speed information) stored in the storage device 904. As a result, the substrate W held by the substrate holding device 10 rotates at a preset speed during the cleaning process of the substrate W.

[0072] The control unit 900 also controls the cup lifting drive unit 22. As a result, the cup body 21 in Fig. 1 moves between a cup upper position and a cup lower position during the cleaning process of the substrate W. The control unit 900 also controls the fluid supply system 32. As a result, a cleaning liquid is discharged from the fluid nozzle 31 in Fig. 1 onto the substrate W during the cleaning process of the substrate W.

[0073] Furthermore, the control unit 900 controls the arm horizontal drive unit 45 and the arm elevation drive unit 46 based on the cleaning conditions (path information) stored in the storage device 904. Thereby, the brush arm 41 moves within the chamber CH during the cleaning process of the substrate W.

[0074] In this embodiment, each of arm horizontal drive unit 45 and arm lift drive unit 46 includes a motor incorporating an encoder as a power source. Thus, control unit 900 obtains the positions of brush arm 41 in the X and Z directions based on the output of the encoders of arm horizontal drive unit 45 and arm lift drive unit 46. This allows control unit 900 to grasp the positional relationship between brush arm 41 and floor surface CHB of chamber CH.

[0075] Furthermore, the control unit 900 controls the motor drive circuit 301. Thereby, during cleaning processing of the substrate W, the control unit 900 operates the motor 300 built into the brush arm 41 to rotate the brush device 50 at a predetermined rotation speed.

[0076] Furthermore, during cleaning processing of the substrate W, the control unit 900 controls the first electropneumatic regulator 131 and the second electropneumatic regulator 132 based on the positional relationship between the substrate W and the brush arm 41 and the cleaning conditions (pressure information) stored in the storage device 904. As a result, the brush device 50 is pressed against each portion of the upper surface of the substrate W with a predetermined set pressing force.

[0077] 8, the substrate processing apparatus 1 further includes an operation unit 990. The operation unit 990 includes a keyboard and a pointing device, and is configured to be operable by a user. The user can input various pieces of information, such as the pressure information, rotation speed information, and path information, as cleaning conditions by operating the operation unit 990. When various pieces of information are input, the control unit 900 stores the input information in the storage device 904 as cleaning conditions.

[0078] 6. Example of washing conditions Fig. 9 is a diagram for explaining a first example of cleaning conditions stored in the storage device 904 of Fig. 8. The cleaning conditions according to the first example include the above-mentioned pressure information, rotational speed information, and path information. In the cleaning conditions according to the first example, the rotational speed information is set such that the rotational speed of the substrate W is maintained constant at a predetermined value during the cleaning process of the substrate W.

[0079] 9 shows pressure information indicating the value of the pressure "P1" in the first chamber 111, pressure information indicating the value of the pressure "P2" in the second chamber 112, and path information in a time chart. In a balloon on the left in the lower half of FIG. 9, a position on the substrate W of the brush device 50 to be disposed at time t1 when the cleaning process of the substrate W is started is shown in a plan view. In a balloon in the center of the lower half of FIG. 9, a position on the substrate W of the brush device 50 to be disposed at time t2, which is an intermediate time between the start and end of the cleaning process of the substrate W. In a balloon on the right in the lower half of FIG. 9, a position on the substrate W of the brush device 50 to be disposed at time t3 when the cleaning process of the substrate W is ended is shown in a plan view.

[0080] In the time chart of the path information in Fig. 9 and the plan views in the three speech bubbles, the symbol "EP" represents the position of the brush device 50 in the X direction when the brush device 50 overlaps with the outer circumferential edge of the substrate W or a portion in its vicinity on the virtual straight line L1. Furthermore, the symbol "CP" represents the position of the brush device 50 in the X direction when the brush device 50 overlaps with the center of rotation SC of the spin base 11 in Fig. 1. It is assumed that the center of the substrate W is located on the center of rotation SC of the spin base 11.

[0081] 9, when the cleaning process of the substrate W is started, the brush device 50 is pressed against the center of the rotating substrate W at time t1. Next, the brush device 50 moves toward the outer circumferential edge of the substrate W at a constant speed. At time t2, the brush device 50 is pressed against the peripheral portion of the upper surface of the rotating substrate W. Thereafter, the brush device 50 moves toward the center of the substrate W at a constant speed, and reaches the center of the substrate W at time t3.

[0082] In this manner, while the brush device 50 moves on the imaginary straight line L1, the pressure "P1" in the first chamber 111 of the double-acting air cylinder device 100 is maintained constant at a value α, and the pressure "P2" in the second chamber 112 is maintained constant at a value β.

[0083] In this example, the value α of the pressure "P1" in the first chamber 111 is a fixed value that offsets the weight of the brush device holder. On the other hand, the value β of the pressure "P2" in the second chamber 112 is a value that corresponds to the set pressing force. As a result, during the cleaning process of the substrate W, a set pressing force of a constant magnitude is applied to the entire surface of the substrate W from the brush device 50 that scans over the upper surface of the substrate W. Therefore, according to the cleaning conditions of the first example, the entire surface of the substrate W is cleaned with a uniform pressing force.

[0084] Fig. 10 is a diagram for explaining a second example of cleaning conditions stored in the storage device 904 of Fig. 8. In Fig. 10, similarly to the example of Fig. 9, the upper half of Fig. 10 shows pressure information indicating the value of the pressure "P1" in the first chamber 111, pressure information indicating the value of the pressure "P2" in the second chamber 112, and path information in a time chart. The lower half of Fig. 10 shows a plan view of the positions of the brush device 50 on the substrate W at three points in time t1, t2, and t3 from the start to the end of the cleaning process of the substrate W. Differences between the cleaning conditions according to the second example and the cleaning conditions according to the first example will be explained.

[0085] The cleaning conditions according to the second example are an example of cleaning conditions in which different magnitudes of set pressing forces are set in multiple parts of the upper surface of the substrate W, and as shown in Fig. 10, the pressure information indicating the value of the pressure "P2" in the second chamber 112 is different from that in the first example. Specifically, in this example, the value of the pressure "P2" in the second chamber 112 is set to continuously increase from 0 to β while the brush device 50 moves from the center of the substrate W toward the outer circumferential edge of the substrate W. Also, the value of the pressure "P2" in the second chamber 112 is set to continuously decrease from β to 0 while the brush device 50 moves from the outer circumferential edge of the substrate W toward the center of the substrate W.

[0086] As described above, in this embodiment, the value of the pressure "P2" in the second chamber 112 is a value according to the set pressing force of the relevant portion. Therefore, when the cleaning process of the substrate W is performed according to the cleaning conditions of the second example, the pressing force acting on the substrate W from the brush device 50 increases continuously while the brush device 50 moves from the center of the substrate W toward the outer peripheral edge of the substrate W. Also, the pressing force acting on the substrate W from the brush device 50 decreases continuously while the brush device 50 moves from the outer peripheral edge of the substrate W toward the center of the substrate W. Therefore, according to the cleaning conditions of the second example, the upper surface of the substrate W is cleaned with a lower pressing force closer to the center of the substrate W, and with a higher pressing force farther from the center of the substrate W.

[0087] 7. Substrate cleaning process 11 is a flowchart of the substrate cleaning process by the control unit 900. The substrate cleaning process described below is performed by the CPU 901 of the control unit 900 executing, on the RAM 902, a substrate cleaning program stored in the storage device 904.

[0088] When the substrate cleaning process is started, the CPU 901 reads out the value of the pressure "P1" of the first chamber 111 to be currently adjusted from the pressure information of the cleaning conditions stored in the storage device 904 (step S11). The CPU 901 also controls the first electropneumatic regulator 131 to adjust the pressure "P1" of the first chamber 111 to the read out value (step S12).

[0089] Next, the CPU 901 reads out the value of the pressure "P2" in the second chamber 112 to be currently adjusted from the pressure information of the cleaning conditions stored in the storage device 904 (step S13). The CPU 901 also controls the second electropneumatic regulator 132 to adjust the pressure "P2" in the second chamber 112 to the read out value (step S14).

[0090] Next, CPU 901 reads out the current destination position from the path information stored in storage device 904 (step S15). CPU 901 also controls arm horizontal drive unit 45 and arm lift drive unit 46 to move brush device 50 to the read out position (step S16). After that, CPU 901 detects the position of brush device 50 based on the output of the encoders of arm horizontal drive unit 45 and arm lift drive unit 46 (step S17).

[0091] Next, the CPU 901 reads the position (end position) of the brush device 50 at the end of the cleaning process from the path information stored in the storage device 904, and determines whether the brush device 50 detected in step S17 has reached the end position (step S18).

[0092] If the brush device 50 has reached the end position in step S18, the CPU 901 ends the process. On the other hand, if the brush device 50 has not reached the end position in step S18, the CPU 901 returns the process to step S11. The time required for the series of processes from steps S11 to S18 is very short, for example, within a few seconds.

[0093] In this embodiment, the value of the pressure "P1" in the first chamber 111 is maintained at a predetermined value (e.g., α in FIGS. 9 and 10) during the cleaning process of the substrate W. Therefore, after the substrate cleaning process is started and once the processes of steps S11 and S12 have been performed, the processes of steps S11 and S12 do not need to be performed. In other words, the CPU 901 may return the process to step S13 after the process of step S18.

[0094] 10, if the value of the pressure "P2" in the second chamber 112 is also maintained at a predetermined value (e.g., β in FIG. 10) during the cleaning process of the substrate W, the processes of steps S13 and S14 may not be performed after the substrate cleaning process is started and once the processes of steps S13 and S14 have been performed. That is, the CPU 901 may return the process to step S15 after the process of step S18.

[0095] 8. Effects (a) In the above-described substrate processing apparatus 1, the substrate W held by the substrate holding device 10 is cleaned using a brush device 50. The brush device 50 is held by a brush device holder of the brush arm 41, and the brush device holder is supported on the housing H of the brush arm 41 by a double-acting air cylinder device 100. The double-acting air cylinder device 100 includes a cylinder member 110, and a piston 121 that divides the internal space of the cylinder member 110 into a first chamber 111 and a second chamber 112 is provided within the cylinder member 110.

[0096] With this configuration, the pressing force acting from the brush device 50 on the upper surface of the substrate W can be adjusted by adjusting the pressure "P1" in the first chamber 111 and the pressure "P2" in the second chamber 112. When the substrate W is cleaned by the brush device 50, the first electropneumatic regulator 131 and the second electropneumatic regulator 132 are controlled in a state in which a predetermined set pressing force acts on the substrate W from the brush device 50. Thereby, the pressure "P1" in the first chamber 111 and the pressure "P2" in the second chamber 112 of the cylinder member 110 are adjusted, and the force acting from the brush device holder on the piston 121 of the double-acting air cylinder device 100 is offset.

[0097] As a result, even if the distance between the brush arm 41 and the substrate W changes due to distortion of the substrate W, one side of the substrate W is properly cleaned with the pressing force acting from the brush device 50 on the substrate W adjusted to the set pressing force. Furthermore, the shaft member 122 of the double-acting air cylinder device 100 is rigidly connected to the brush device holder. As a result, the pressure acting from the piston 121 on the shaft member 122 acts directly on the brush device 50 via the brush device holder. Therefore, the responsiveness of the adjustment of the pressing force of the brush device 50 by controlling the first electropneumatic regulator 131 and the second electropneumatic regulator 132 is high.

[0098] As a result, the pressing force applied from the brush device 50 to the substrate W can be adjusted accurately with high responsiveness.

[0099] (b) In the above-described substrate processing apparatus 1, the brush arm 41 moves in the X direction and the Z direction by the arm horizontal drive unit 45 and the arm lift drive unit 46. This allows a wider area of ​​the upper surface of the substrate W to be easily cleaned by the brush device 50.

[0100] (c) In the above-described substrate processing apparatus 1, cleaning conditions are stored in the storage device 904 for each substrate W to be processed. The cleaning conditions include pressure information as information on the set pressing force of each part of the substrate W. Thus, the CPU 901 of the control unit 900 controls the first electropneumatic regulator 131 and the second electropneumatic regulator 132 based on the pressure information stored in the storage device 904 during the cleaning process of the substrate W. In this case, feedback control is not required to measure the pressing force acting on the substrate W from the brush device 50 and adjust the drive unit so that the measurement result coincides with the set pressing force. Therefore, the upper surface of the substrate W can be cleaned easily and with high responsiveness with a compact and simple configuration.

[0101] 9. Other embodiments (a) The cleaning conditions stored in the memory device 904 may include, in addition to pressure information, rotational speed information and path information, information on the set pressing force of each part of the substrate W, and may also include information on the amount of cleaning liquid supplied to the fluid nozzle 31 during the cleaning process of the substrate W.

[0102] When the cleaning conditions include information on the set pressure, the CPU 901 of the control unit 900 may calculate the value of the pressure "P1" in the first chamber 111 and the value of the pressure "P2" in the second chamber 112 based on the information on the set pressure. In this case, the cleaning conditions do not need to include pressure information.

[0103] (b) In the above embodiment, the first example of cleaning conditions in Fig. 9 and the second example of cleaning conditions in Fig. 10 are shown. The rotational speed information of these cleaning conditions is set so that the rotational speed of the substrate W is maintained constant at a predetermined value during the cleaning process of the substrate W. However, the present invention is not limited to this. The rotational speed information of the cleaning conditions may be set so that the rotational speed of the substrate W changes during the cleaning process of the substrate W.

[0104] For example, the rotational speed information may be set so that the rotational speed of the substrate W becomes higher as the brush device 50 approaches the center of the substrate W and becomes lower as the brush device 50 approaches the outer circumferential edge of the substrate W. Alternatively, the rotational speed information may be set so that the rotational speed of the substrate W becomes lower as the brush device 50 approaches the center of the substrate W and becomes higher as the brush device 50 approaches the outer circumferential edge of the substrate W.

[0105] In this case, the rotation speed of the substrate W and the pressing force applied from the brush device 50 to the substrate W can be made different for a plurality of portions of the substrate W. This allows for diversification of cleaning methods.

[0106] (c) In the above embodiment, the value of the pressure "P1" in the first chamber 111 set for the entire upper surface of the substrate W is set as a fixed value, a value that offsets the weight of the brush device holder acting on the piston 121, but the present invention is not limited to this.

[0107] The value of the pressure "P1" in the first chamber 111 may be set as a fixed value different from the value that offsets the weight of the brush device holder. Even in such a case, the value of the pressure "P2" in the second chamber 112 is appropriately set so that the above formula (1) is satisfied, whereby the brush device 50 can be pressed against each part of the substrate W with a set pressing force.

[0108] (d) In the above embodiment, the value of pressure "P1" in first chamber 111 set for the entire upper surface of substrate W is set as a fixed value, which is a value that offsets the weight of the brush device holder acting on piston 121. On the other hand, the value of pressure "P2" in second chamber 112 is set to a value according to the set pressing force for each portion of substrate W. However, the present invention is not limited to this.

[0109] The value of pressure "P2" in the second chamber 112 may be set as a fixed value set for the entire upper surface of the substrate W, to a value that offsets the weight of the brush device holder acting on the piston 121. In this case, the value of pressure "P1" in the first chamber 111 may be set to a value according to the set pressing force for each part of the substrate W. In other words, the relationship between the role of the force acting on the piston 121 from the pressure "P1" in the first chamber 111 and the role of the force acting on the piston 121 from the pressure "P2" in the second chamber 112 may be reversed.

[0110] (e) The double-acting air cylinder device 100 according to the above embodiment may have a configuration in which an air bearing is provided between the cylinder member 110 and the piston 121. The double-acting air cylinder device 100 may also have a configuration in which an air bearing is provided between the cylinder member 110 and the shaft member 122. In this case, sliding resistance generated in each part of the double-acting air cylinder device 100 during operation of the double-acting air cylinder device 100 is reduced. This allows the pressing force acting on the substrate W from the brush device 50 to be adjusted with higher accuracy.

[0111] (f) Although the brush device 50 according to the above embodiment is supported by the brush support shaft 34 so as to be rotatable, the present invention is not limited to this. The brush device 50 may be supported by the brush support shaft 34 so as not to be rotatable. In this case, it is not necessary to provide the motor 300 and the rotational force transmission mechanism 310 in the brush arm 41. This makes it possible to reduce the size of the brush arm 41 and the number of parts of the brush arm 41.

[0112] (g) In the substrate processing apparatus 1 according to the above embodiment, the substrate holding device 10 has a so-called mechanical chuck type configuration in which the multiple holding pins 12 abut against the outer circumferential edge of the substrate W to hold the substrate W, but the present invention is not limited to this. The substrate holding device 10 may have a suction type configuration in which the central portion of the lower surface of the substrate W is suction-held.

[0113] 10. Correspondence between each component of the claims and each part of the embodiment Below, examples of the correspondence between each component of the claims and each element of the embodiment will be described, but the present invention is not limited to the following examples. Various other elements having the configuration or function described in the claims can also be used as each component of the claims.

[0114] In the above embodiment, the substrate processing apparatus 1 is an example of a substrate processing apparatus, the floor surface CHB of the chamber CH is an example of a first installation surface, the substrate holding device 10 is an example of a substrate holding part, the upper surface of the substrate W is an example of one surface of a substrate, the brush device 50 is an example of a cleaning tool, and the brush device holder (a structure consisting of the first connecting member 210, the second connecting member 220, the rotating support mechanism 290 and the brush support shaft 34) is an example of a cleaning tool holder.

[0115] In addition, the double-acting air cylinder device 100, the first electro-pneumatic regulator 131 and the second electro-pneumatic regulator 132 are examples of a pressing device, the control unit 900 is an example of a control unit, the bottom wall Hb of the housing H is an example of a second installation surface, the cylinder member 110 is an example of a cylinder member, the first chamber 111 is an example of a first chamber, the second chamber 112 is an example of a second chamber, and the piston 121 is an example of a piston.

[0116] Furthermore, the first electropneumatic regulator 131 and the second electropneumatic regulator 132 are examples of a pressure adjustment device, the guide rail 43, the arm support unit 44, the arm horizontal drive unit 45 and the arm lift drive unit 46 are examples of a holder moving device, pressure information of the cleaning conditions is an example of information related to the set pressing force, and the memory device 904 is an example of an information storage unit.

[0117] 11. Summary of the embodiment (Item 1) The substrate processing apparatus according to item 1 comprises: a substrate holder provided on the first installation surface and configured to hold a substrate; a cleaning tool for processing the substrate by contacting one side of the substrate; a cleaning tool holder that holds the cleaning tool in a state where the cleaning tool faces the one surface of the substrate held by the substrate holding part; A pressing device for supporting the cleaning tool holder; A control unit. The pressing device is a cylinder member having an internal space and disposed on a second installation surface having a predetermined positional relationship with the first installation surface; a piston housed within the cylinder member and dividing the internal space into a first chamber and a second chamber arranged vertically; a shaft member extending from the piston upward or downward to the cylinder member and having a tip portion connected to the cleaning tool holder; a pressure adjusting device for adjusting the pressure in the first chamber and the pressure in the second chamber, The control unit controls the pressure adjustment device to adjust the pressure in the first chamber and the second chamber so that, when the substrate is processed by the cleaning tool, a predetermined set pressing force acts on the substrate from the cleaning tool, and a force acting on the piston from the cleaning tool holder via the shaft member is canceled out.

[0118] In the substrate processing apparatus, a substrate is held by a substrate holding part. A cleaning tool is held by a cleaning tool holder, and the cleaning tool holder is supported by a pressing device. In the pressing device, the pressure in the first and second chambers of the cylinder member is adjusted by a pressure adjusting device so that a force acting on the piston from the cleaning tool holder via the shaft member is cancelled out in a state where a predetermined pressing force is applied from the cleaning tool to the substrate.

[0119] As a result, even if the distance between the second installation surface and the one side of the substrate changes due to distortion of the substrate, the pressing force acting on the substrate from the cleaning tool is adjusted to the set pressing force, and the one side of the substrate is properly cleaned. Furthermore, since the shaft member is connected to the cleaning tool holder, the pressure acting on the shaft member acts directly on the cleaning tool via the cleaning tool holder. Therefore, the responsiveness of the pressure adjustment of the cleaning tool by controlling the pressure adjustment device is high.

[0120] As a result, the pressure applied from the cleaning tool to the substrate can be adjusted accurately with high responsiveness.

[0121] (2) In the substrate processing apparatus according to the first aspect, The substrate processing apparatus includes: The cleaning tool holder further includes a holder moving device for moving or rotating the cleaning tool holder in a horizontal plane. The control unit may control the holder moving device.

[0122] In this case, a wide area on one surface of the substrate can be easily treated with the cleaning tool.

[0123] (Item 3) In the substrate processing apparatus according to item 2, the set pressing force is set to a different value corresponding to each of a plurality of portions on the one surface of the substrate, The control unit may adjust the pressure in the first chamber and the pressure in the second chamber so that the set pressing force, which is set at a position on the one surface of the substrate where the cleaning tool is located, acts.

[0124] In this case, the degree of processing on the substrate can be appropriately adjusted at multiple portions on one surface of the substrate.

[0125] (4) In the substrate processing apparatus according to the third aspect, The substrate processing apparatus includes: The apparatus may further include an information storage unit that stores information regarding set pressing forces of a plurality of portions on the one surface of the substrate.

[0126] In this case, multiple portions on one side of the substrate can be appropriately cleaned based on the information on the set pressure stored in the information storage unit. Therefore, feedback control such as measuring the pressure actually acting on the substrate and adjusting the drive unit so that the measurement result coincides with the set pressure is not required. Therefore, with a compact and simple configuration, one side of the substrate can be easily processed with high responsiveness.

[0127] (Item 5) In the substrate processing apparatus according to any one of items 1 to 4, The first chamber is located below the second chamber, The control unit may maintain the pressure value of the first chamber at a predetermined value by controlling the pressure adjustment device.

[0128] In this case, the pressing force acting on the substrate from the cleaning tool can be adjusted by adjusting the pressure in the second chamber located above the first chamber.

[0129] (Item 6) In the substrate processing apparatus according to item 5, The control unit may control the pressure regulating device to maintain the pressure value of the first chamber at the predetermined value, which is a pressure value that offsets the force acting on the piston when the set pressure is 0.

[0130] In this case, the weight of the structure including the cleaning tool and the cleaning tool holder is offset by the pressure in the first chamber, and therefore the pressing force acting from the cleaning tool to the substrate can be easily and accurately adjusted by adjusting the pressure in the second chamber to a value corresponding to the desired set pressing force. [Explanation of symbols]

[0131] 1 ... substrate processing apparatus, 10 ... substrate holding device, 11 ... spin base, 12 ... holding pin, 13 ... substrate holding drive unit, 14 ... substrate rotation drive unit, 20 ... cup device, 21 ... cup body, 22 ... cup lift drive unit, 30 ... nozzle device, 31 ... fluid nozzle, 32 ... fluid supply system, 34 ... brush support shaft, 34h ... through hole, 40 ... brush arm device, 41 ... brush arm, 41j ... arm connection unit, 42 ... brush holding unit, 43 ... guide rail, 44 ... arm support unit, 45 ... arm horizontal drive unit, 46 ... arm lift drive unit, 49 ... waiting pod, 50 ... brush device, 100 ... double-acting air cylinder device, 110 ... cylinder member, 111 ... first chamber, 112 ... second chamber, 121 ... piston, 122 ... shaft member, 131 ... First electropneumatic regulator, 132...second electropneumatic regulator, 190...cylinder base, 210...first connecting member, 220...second connecting member, 221...horizontal portion, 222...vertical portion, 230...linear guide, 290...rotation support mechanism, 300...motor, 301...motor drive circuit, 310...rotational force transmission mechanism, 311, 312...pulley, 313...belt, 390...motor base, 900...control unit, 901...CPU, 902...RAM, 903...ROM, 904...storage device, 909...CD-ROM, 990...operation unit, CH...chamber, CHB...floor surface, H...housing, Ha...upper wall, Hb...bottom wall, Hc, Hd, He, Hf...side wall, L1...virtual straight line, SC...center of rotation, SP...standby position, W...substrate

Claims

1. a substrate holder provided on the first installation surface and configured to hold a substrate; a cleaning tool for processing the substrate by contacting one side of the substrate; a cleaning tool holder that holds the cleaning tool in a state where the cleaning tool faces the one surface of the substrate held by the substrate holding part; A pressing device for supporting the cleaning tool holder; A control unit. The pressing device is a cylinder member having an internal space and disposed on a second installation surface having a predetermined positional relationship with the first installation surface; a piston housed within the cylinder member and dividing the internal space into a first chamber and a second chamber arranged vertically; a shaft member extending from the piston upward or downward to the cylinder member and having a tip portion connected to the cleaning tool holder; a pressure adjusting device for adjusting the pressure in the first chamber and the pressure in the second chamber, The control unit controls the pressure adjustment device to adjust the pressure in the first chamber and the second chamber so that, when the substrate is processed by the cleaning tool, a predetermined set pressing force acts on the substrate from the cleaning tool and a force acting on the piston from the cleaning tool holder via the shaft member is canceled out.

2. The cleaning tool holder further includes a holder moving device for moving or rotating the cleaning tool holder in a horizontal plane. The substrate processing apparatus according to claim 1 , wherein the control unit controls the holder moving device.

3. the set pressing force is set to a different value corresponding to each of a plurality of portions on the one surface of the substrate, The substrate processing apparatus according to claim 2 , wherein the control unit adjusts the pressure in the first chamber and the pressure in the second chamber so that the set pressing force, which is set at a position on the one surface of the substrate where the cleaning tool is located, acts.

4. The substrate processing apparatus according to claim 3 , further comprising an information storage unit that stores information regarding set pressing forces for a plurality of portions on said one surface of said substrate.

5. The first chamber is located below the second chamber, 5. The substrate processing apparatus according to claim 1, wherein the control unit controls the pressure adjustment device to maintain a pressure value of the first chamber at a predetermined value.

6. 6. The substrate processing apparatus of claim 5, wherein the control unit controls the pressure adjustment device to maintain the pressure value of the first chamber at the predetermined value, which is a pressure value that offsets the force acting on the piston when the set pressing force is 0.

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