Fluid control device for vacuum removal of wafer polishing facility

Abstract

To provide a fluid control device for vacuum removal of a wafer polishing facility.SOLUTION: This fluid control device comprises: a linear driver that drives a positioning pedestal so as to vertically move; a plurality of conduits respectively installed in the positioning pedestals; several elastic covers that respectively cover the conduits; an adaptor pedestal installed on a holding base; and several flow diverters spaced apart from each other on the holding base. Several relay paths are formed inside the adaptor pedestal. The elastic covers are formed sequentially corresponding to the upper and lower relay paths. The other ends of the relay paths are made to communicate with some relay tubes. Each relay tube is made to communicate with each flow diverter. The individual flow diverters are connected to some transportation tubes in a corresponding manner. Thus, control is performed so as to cause a fluid to enter between an upper polishing tray of a wafer polishing facility and a waver thin plate which receives its polishing.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to an assembly part for wafer polishing equipment, and in particular to a fluid control device for vacuum removal in wafer polishing equipment, which controls the entry of fluid between an upper polishing tray and a polished wafer sheet after the polishing process of the wafer sheet is completed, thereby releasing the state in which the upper polishing tray and the wafer sheet are adsorbed to each other. [Background technology]

[0002] Wafer polishing equipment is a type of tool for polishing wafer thin plates, and is equipped with a wafer holder driving mechanism, an upper polishing plate, and a lower polishing plate, in which one to several unequal wafer thin plates are placed on the wafer holder, and a robot arm transfers one to several unequal wafer holders to the wafer holder driving mechanism, and the upper polishing plate and the lower polishing plate perform polishing processing on the upper and lower surfaces of each of the wafer thin plates, respectively.

[0003] After one polishing process is completed, the operation of the upper polishing dish, the lower polishing dish and the wafer holder drive mechanism are stopped, and the upper polishing dish is raised to expose the wafer holder, and the robot arm can replace the wafer holder on which the wafer sheet is mounted.

[0004] When polishing of the upper surface located below the upper polishing dish is completed, the vacuum adsorption phenomenon causes the upper polishing dish and the wafer thin plate to adhere to each other, making it difficult to separate them from each other.In order to avoid this, after the polishing process is completed, a fluid must be injected between the upper polishing dish and the upper surface to prevent the wafer thin plate from moving upward when the upper polishing dish is raised.By releasing the mutual adsorption state between the upper polishing dish and the wafer thin plate, the upper polishing dish and the wafer thin plate are no longer adsorbed to each other, which causes the wafer thin plate to move upward along with the upper polishing dish.The fluid may be water or air, and the operation of injecting the fluid to release the mutual adsorption state between the upper polishing dish and the wafer thin plate is usually referred to as vacuum removal.

[0005] The fluid control device for controlling the fluid to perform the vacuum removal includes several linear actuators, several positioning pedestals, several guiding pipes, several flow diverters, and several transport pipes, in which the linear actuators are installed at intervals on the wafer polishing equipment providing a machine frame, machine stand, or other assembly parts for installing and positioning each component, the flow diverters are arranged at intervals along a circular path, the positioning pedestals are respectively connected to the linear actuators, and the linear actuators approach or move away from the top edge of the upper polishing tray in response to driving the positioning pedestals to move up and down, and the flow guiding pipes are respectively Each of the positioning pedestals is positioned on the upper polishing plate, and each of the flow ducts is connected to a fluid source, and each of the flow ducts is formed to face each of the flow diverters vertically. When each of the positioning pedestals is lowered, each of the flow ducts is connected to each of the flow diverters, and when each of the positioning pedestals is raised, each of the flow ducts is separated from each of the flow diverters. Each of the flow diverters is spaced apart along a separate circular path, and each of the flow diverters is correspondingly connected to several of the transport pipes, and each of the transport pipes is connected to one of several passages inside the upper polishing plate, and each of the passages extends to the bottom end of the upper polishing plate.

[0006] After the polishing process is completed, each of the linear actuators drives each of the positioning platforms to descend toward the top edge side of the upper polishing dish, and each of the guide pipes is connected to each of the diverters, and then the fluid passes through each of the guide pipes and enters each of the diverters, the fluid is diverted and flows into the inside of each of the diverters, and passes through each of the transport pipes and each of the passages to be released between the upper polishing dish and the wafer thin plate, the fluid releases the mutual adsorption state between the upper polishing dish and the wafer thin plate, and forms a pressing and abutting action against the upper polishing dish and the wafer thin plate, and the wafer polishing equipment is used to match the operation of a drive device that brakes the rise and fall of the upper polishing dish, controls the upper polishing dish to rise, and prevents the wafer thin plate from rising along with the upper polishing dish, and separates the upper polishing dish and the wafer thin plate from each other.

[0007] In order to enable the fluid to be released in a balanced manner at multiple points onto the bottom edge of the upper polishing dish, the flow diverters are arranged at intervals along the circular path, the axial direction of the upper polishing dish extends through the radial center of the circular path, and the positioning pedestals are arranged at intervals to match the flow diverters and are vertically opposite to the flow diverters, which complicates the arrangement of the positioning pedestals and the flow guide pipes. Summary of the Invention [Problem to be solved by the invention]

[0008] An elastic cover body is formed at the end of each of the flow tubes. When each of the flow tubes descends and communicates with each of the flow distributors, each of the cover bodies is pressed against each of the flow distributors to form a tight contact state. When the fluid passes through each of the flow tubes and each of the cover bodies and enters each of the flow distributors, the dynamic pressure of the fluid prevents each of the cover bodies from detaching from the corresponding flow distributors. As the cover bodies are used, they undergo elastic deformation and shape recovery repeatedly over a long period of time, and elastic fatigue gradually occurs. The elastic material constituting the cover bodies becomes brittle over time, so that each of the cover bodies must be able to be replaced in a timely manner. However, since a large number of the positioning seats and a large number of the flow tubes are arranged at intervals along a circular path, an operator must move around the radial exterior of the upper polishing dish to sequentially maintain or replace each of the flow tubes or each of the cover bodies, which causes inconvenience in maintenance and replacement of assembly parts.

[0009] SUMMARY OF THE PRESENT EMBODIMENT It is a primary object of the present invention to provide a fluid control system for vacuum removal in wafer polishing equipment. [Means for solving the problem]

[0010] In order to achieve the above objectives, the present invention adopts the following technical solutions:

[0011] A fluid control device for vacuum removal of a wafer polishing equipment, the wafer polishing equipment having an upper polishing plate used for polishing an upper surface of a wafer thin plate, the upper polishing plate having several passages extending therethrough, each of the passages extending to a top end and a bottom end of the upper polishing plate, the fluid control device being used to control a fluid to pass through each of the passages and enter between the upper polishing plate and the wafer thin plate, releasing the mutual adsorption state between the upper polishing plate and the wafer thin plate, the fluid being water or air,

[0012] The fluid control device includes a linear actuator fixedly installed on the wafer polishing equipment, a positioning base connected to the linear actuator, several inlet pipes positioned and installed on the positioning base, an adapter base installed on a support base, and several diverters arranged at intervals on the support base, and the positioning base is located between the linear actuator and the top edge side of the upper polishing tray, and the linear actuator is:

[0013] In response to driving the positioning base to move up and down, the positioning base approaches or moves away from the top edge of the upper polishing dish, each of the guide tubes is connected to a supply source of the fluid and extends toward the top edge of the upper polishing dish, several elastic covers are fitted to one end of each of the guide tubes facing the top edge, and each of the elastic covers has a cone-shaped space formed therein that communicates with each of the guide tubes, and the holding base is connected to the upper polishing dish,

[0014] a plurality of relay paths are formed inside the adapter base in accordance with each of the flow guide pipes, one end of each of the relay paths extends to the top edge of the adapter base, each of the conical spaces corresponds to each of the relay paths in a vertical direction, and the other end of each of the relay paths extends to one side of the adapter base and communicates with several relay pipes, each of the relay pipes communicates with each of the flow dividers, each of the flow dividers is correspondingly connected to several transport pipes, and each of the transport pipes communicates with each of the passages, thereby allowing the fluid to pass through each of the passages and enter between the upper polishing plate and the wafer thin plate. Effect of the Invention

[0015] The main effects and advantages of the present invention are that the flow pipes are positioned centrally on one positioning base, simplifying the arrangement of the positioning base and each of the flow pipes, and each of the relay pipes are connected centrally to the adapter base, allowing an operator to maintain and replace each of the flow pipes and each of the elastic covers simply by being in the vicinity of the positioning base, thereby improving the convenience of maintenance and replacement of assembly parts. [Brief description of the drawings]

[0016] [Figure 1] 1 is a perspective view showing the arrangement of a preferred embodiment of the present invention in a wafer polishing facility. [Diagram 2] FIG. 2 is a partially enlarged view of FIG. [Diagram 3] FIG. 2 is a partial front view of a preferred embodiment of the present invention, in which the obstruction wall is partially cut away. [Figure 4] 4 is a cross-sectional view taken along line 4-4 in FIG. 3. [Diagram 5] FIG. 2 is a partial front view of the preferred embodiment of the present invention in an operating state, in which the obstruction wall is partially cut away. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] Referring to the accompanying drawings, which show preferred embodiments of the fluid control device for vacuum removal of wafer polishing equipment of the present invention, it is to be understood that these embodiments are used for illustration purposes only and that the claims are not limited to this structure.

[0018] As shown in FIG. 1, the wafer polishing equipment has an upper polishing dish 11 used for polishing the upper surface of a wafer thin plate (not shown in the figure), and several passages (not shown in the figure) are formed through the upper polishing dish 11, each of which extends to the top and bottom ends of the upper polishing dish 11, respectively. The fluid control device is used to control the fluid to pass through each of the passages and enter between the upper polishing dish 11 and the wafer thin plate, thereby releasing the mutual adsorption state between the upper polishing dish 11 and the wafer thin plate, and the fluid may be water or air.

[0019] As shown in Figures 1 to 5, a preferred embodiment of such a fluid control device includes a linear actuator 20, a positioning base 30, several guide pipes 40, an adapter base 50, and several diverters 60, of which the linear actuator 20 is selected from an air cylinder or a hydraulic cylinder, and the linear actuator 20 is fixedly installed on the frame or base of the wafer polishing equipment, or on other structures used to position and install various assembly parts. In this embodiment, the linear actuator 20 is selectively installed on the dish base 12, the positioning base 30 is connected to the linear actuator 20, and the positioning base 30 is located between the linear actuator 20 and the top edge side 13 of the upper polishing dish 11, and the linear actuator 20 drives the positioning base 30 to move up and down, thereby moving the positioning base 30 closer to or away from the top edge side 13.

[0020] Each of the flow tubes 40 is positioned and installed on the positioning base 30, each of the flow tubes 40 is connected to a fluid supply source (not shown in the figure), and each of the flow tubes 40 extends toward the top edge side 13 of the upper polishing dish 11. Several elastic covers 42 are fitted to one end of each of the flow tubes 40 facing the top edge side 13, and each of the elastic covers 42 has a cone-shaped space 44 formed therein that connects each of the flow tubes 40.

[0021] The adapter base 50 is installed on the holding table 14, and the holding table 14 is connected to the upper polishing dish 11 so that the holding table 14 rotates and stops rotating together with the upper polishing dish 11. The adapter base 50 may be made of a resin material. Inside the adapter base 50, several relay paths 52 are formed to match each of the flow guide pipes 40, and one end of each of the relay paths 52 extends to the top edge of the adapter base 50. Each of the conical spaces 44 is formed in succession in upper and lower correspondence with each of the relay paths 52, and the other end of each of the relay paths 52 extends to one side of the adapter base 50 and is connected to several relay pipes 54.

[0022] The flow dividers 60 are arranged at intervals on the holding table 14, and each of the relay pipes 54 is connected to each of the flow dividers 60. Each of the flow dividers 60 is correspondingly connected to several transport pipes 62, and each of the transport pipes 62 is connected to each of the passages, so that the fluid passes through each of the passages and enters between the upper polishing dish 11 and the wafer thin plate.

[0023] When the polishing process of the wafer thin plate is completed, the upper polishing dish 11 and the holding table 14 stop rotating synchronously, and by utilizing a driving device that controls the rotation of the upper polishing dish 11, each of the relay paths 52 can be positioned corresponding to the lower part of each of the flow tubes 40. Then, the linear actuator 20 drives the positioning base 30 to lower, so that each of the elastic covers 42 can cover the top edge of each of the adapter bases 50. Each of the flow tubes 40 passes through each of the elastic covers 42 and communicates with each of the relay paths 52 so that an adsorption state can be formed between each of the elastic covers 42 and the adapter base 50 due to the material elasticity of each of the elastic covers 42. Then, The fluid passes through each of the guide pipes 40, each of the relay paths 52 and each of the relay pipes 54 and is diverted to each of the diverters 60, and the subsequent diverted flow of the fluid that enters each of the diverters 60 passes through each of the transport pipes 62 and enters between the upper polishing dish 11 and the wafer thin plate, releasing the mutual adsorption state between the upper polishing dish 11 and the wafer thin plate, and the fluid forms a pressing and abutting action against the upper polishing dish 11 and the wafer thin plate, respectively, and the wafer polishing equipment is used to match the operation of a driving device that brakes the rise of the upper polishing dish 11, and controls the upper polishing dish 11 to rise and separate from the wafer thin plate, and prevents the wafer thin plate from rising along with the upper polishing dish 11.

[0024] The flow pipes 40 are positioned centrally at one of the positioning bases 30, simplifying the arrangement of the positioning base 30 and the flow pipes 40, and the relay pipes 54 are connected centrally to one of the adapter bases 50. When performing maintenance or replacement of the flow pipes 40 and the elastic covers 42, an operator need only be near the positioning base 30 to perform maintenance or replacement of each of the flow pipes 40 and each of the elastic covers 42, thereby improving the convenience of maintenance and replacement of assembly parts.

[0025] The positioning base 30 has a support base 32, each of the flow tubes 40 is positioned on the support base 32, each of the elastic covers 42 is located between the support base 32 and the adapter base 50, and each of the elastic covers 42 is closely adjacent to the support base 32.

[0026] Both sides of the support base 32 are connected to two contact pressure elements 34, each extending toward the adapter base 50. The linear actuator 20 drives the positioning base 30 to move downward. When each of the contact pressure elements 34 contacts the adapter base 50, the adapter base 50 can urge the linear actuator 20 to stop operating by the force passing through each of the contact pressure elements 34 and feeding back toward the positioning base 30, thereby avoiding excessive compressive deformation of each of the elastic covers 42 and improving the service life of each of the elastic covers 42.

[0027] The two obstruction walls 70 abut on opposite sides of the adapter base 50, and each of the elastic covers 42 is located between each of the obstruction walls 70. More specifically, each of the obstruction walls 70 is an annular plate body, each of the obstruction walls 70 is installed coaxially, and the axial direction of the upper polishing dish 11 extends through the radial center of each of the obstruction walls 70. The obstruction walls 70 shown in Figures 3 and 5 are partially cut out, which is advantageous for displaying each of the elastic covers 42.

[0028] When water is selected as the fluid and the fluid passes through the elastic cover 42 and enters the relay path 52, if a small amount of the fluid passes between the elastic cover 42 and the adapter base 50 and splashes to the outside, each of the obstruction walls 70 forms an obstruction prevention thereagainst, preventing other structures or assembly parts arranged around the preferred embodiment of the wafer polishing equipment from being affected by the fluid; for example, each of the obstruction walls 70 can prevent the fluid from splashing to the outside and prevent contamination of the cutting fluid. [Explanation of symbols]

[0029] 11: Upper polishing plate 12:Plate pedestal 13: Apex side 14: Holding stand 20: Linear actuator 30: Positioning base 32: Support stand 34: Contact pressure element 40: Flow guide tube 42: Elastic cover 44: Cone-shaped space 50: Adapter base 52: Relay route 54: Relay tube 60: Flow divider 62: Transport pipe 70: Obstruction Wall

Claims

1. A fluid control device for vacuum removal of a wafer polishing equipment, the wafer polishing equipment having an upper polishing plate used for polishing an upper surface of a wafer thin plate, the upper polishing plate having several passages extending therethrough, each of the passages extending to a top end and a bottom end of the upper polishing plate, the fluid control device being used to control a fluid to pass through each of the passages and enter between the upper polishing plate and the wafer thin plate, releasing the mutual adsorption state between the upper polishing plate and the wafer thin plate, the fluid being water or air, The fluid control device includes a linear actuator fixed to the wafer polishing equipment, a positioning base connected to the linear actuator, several guide pipes positioned and installed on the positioning base, an adapter base installed on a holding base, and several diverters arranged at intervals on the holding base, the positioning base being located between the linear actuator and the top edge side of the upper polishing dish, the linear actuator moving closer to or farther away from the top edge side of the upper polishing dish as the positioning base is driven to move up and down, each of the guide pipes is connected to a supply source of the fluid, and each of the guide pipes extends toward the top edge side of the upper polishing dish, and several elastic covers are fitted to one end of each of the guide pipes facing the top edge side, and each of the elastic covers is fitted to one end of each of the guide pipes facing the top edge side. a cone-shaped space formed therein communicating with each of the guide pipes, the holding stand being connected to the upper polishing dish, several relay paths formed inside the adapter base to match each of the guide pipes, one end of each of the relay paths extending to the top edge of the adapter base, each of the cone-shaped spaces corresponding to each of the relay paths above and below, the other end of each of the relay paths extending to one side of the adapter base and communicating with several relay pipes, each of the relay pipes communicating with each of the flow dividers, each of the flow dividers correspondingly connected to several transport pipes, each of the transport pipes communicating with each of the passages, thereby allowing the fluid to pass through each of the passages and enter between the upper polishing dish and the wafer thin plate.

2. 2. The fluid control device for vacuum removal of wafer polishing equipment as described in claim 1, characterized in that the positioning base has a support base, each of the flow tubes is positioned on the support base, each of the elastic covers is located between the support base and the adapter base, and each of the elastic covers is closely adjacent to the support base.

3. The fluid control device for vacuum removal of wafer polishing equipment as described in claim 2, characterized in that both sides of the support base are connected to two contact pressure elements, each of which extends toward the adapter base.

4. The fluid control device for vacuum removal of wafer polishing equipment as described in claim 1, 2 or 3, characterized in that two obstruction walls abut on both opposite sides of the adapter base, respectively, and each of the elastic covers is located between each of the obstruction walls.

5. The fluid control device for vacuum removal of wafer polishing equipment as described in claim 4, characterized in that each of the coaxially installed obstruction walls is an annular plate body, and the axial direction of the upper polishing dish extends to pass through the radial center of each of the obstruction walls.

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