Component mounting device and component mounting method

Abstract

To smoothly insert a lead of a lead component into a hole of a substrate.SOLUTION: A component mounting device comprises: a holding member that can be moved in each of a flat surface direction that is parallel to a front surface of a substrate and a normal direction orthogonal to the front surface of the substrate in a state of holding a body of a lead component; a three-dimentional measurement device that measures a three-dimentional shape of each of a plurality of leads of the lead component in a state where the body is held by the holding member; a calculation part that calculates each control point of a plurality of positions in the normal direction on the basis of three-dimentional data indicating the three-dimentional shape in the case where an average value of a coordinate of the plurality of leads in the flat surface direction is defined as the control point; and a control part that moves the holding member holding the body so that each of the plurality of leads is inserted into each of a plurality of holes on the basis of position data of the plurality of holes provided to the substrate and the plurality of control points.SELECTED DRAWING: Figure 11

Description

[Technical field]

[0001] The technology disclosed in this specification relates to a component mounting apparatus and a component mounting method. [Background technology]

[0002] In the production of electronic devices, component mounting apparatuses that mount components on a board are used. Patent Document 1 discloses a component mounting apparatus that mounts lead components on a board. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-093560 Summary of the Invention [Problem to be solved by the invention]

[0004] A lead component is mounted on a board by inserting the lead of the lead component into a hole in the board. If the lead is bent, even if the tip of the lead is inserted into the hole in the board, if the lead component is pushed into the board so that the base end of the lead is inserted into the hole in the board, the middle or base end of the lead may come into contact with the inner surface of the hole in the board with a strong force. If the middle or base end of the lead receives a strong force from the inner surface of the hole in the board and the load on the lead increases, the quality of the lead component may deteriorate.

[0005] The technology disclosed in this specification aims to smoothly insert the leads of a lead component into holes in a substrate. [Means for solving the problem]

[0006] This specification discloses a component mounting device, which includes a holding member capable of moving in a planar direction parallel to a surface of a substrate and in a normal direction perpendicular to the surface of a substrate while holding a body of a lead component, a three-dimensional measuring device that measures the three-dimensional shape of each of a plurality of leads of the lead component while the body is held by the holding member, a calculation unit that calculates control points at each of a plurality of positions in the normal direction based on three-dimensional data indicating the three-dimensional shape when the average value of the coordinates of the plurality of leads in the planar direction is set as a control point, and a control unit that moves the holding member holding the body so that each of the plurality of leads is inserted into each of a plurality of holes based on position data of a plurality of holes provided in the substrate and the plurality of control points. Effect of the Invention

[0007] According to the component mounting device disclosed in this specification, the leads of the lead component can be smoothly inserted into the holes in the board. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view showing a component mounting apparatus according to the first embodiment. [Diagram 2] FIG. 2 is a side view showing the component mounting apparatus according to the first embodiment. [Diagram 3] FIG. 3 is a perspective view showing the robot hand according to the first embodiment. [Figure 4] FIG. 4 is a side view showing a lead component held by the robot hand according to the first embodiment. [Diagram 5] FIG. 5 is a view of the lead component according to the first embodiment as viewed from below. [Figure 6] FIG. 6 is a perspective view showing the three-dimensional measuring apparatus according to the first embodiment. [Figure 7] FIG. 7 is a diagram for explaining the operation of the robot manipulator according to the first embodiment. [Figure 8] FIG. 8 is a hardware configuration diagram showing the control device according to the first embodiment. [Figure 9]FIG. 9 is a block diagram showing the component mounting apparatus according to the first embodiment. [Figure 10] FIG. 10 is a diagram for explaining control points according to the first embodiment. [Figure 11] FIG. 11 is a diagram for explaining control points according to the first embodiment. [Figure 12] FIG. 12 is a flowchart showing the component mounting method according to the first embodiment. [Figure 13] FIG. 13 is a diagram for explaining the component mounting method according to the first embodiment. [Figure 14] FIG. 14 is a diagram for explaining a control point calculation method according to the second embodiment. [Figure 15] FIG. 15 is a flowchart showing a component mounting method according to the second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, an embodiment according to the present disclosure will be described with reference to the drawings, but the present disclosure is not limited to the embodiment. The components of the embodiments described below can be appropriately combined. In addition, some components may not be used.

[0010] In the embodiment, a local coordinate system is set in the component mounting device 1, and the positional relationship of each part will be described with reference to the local coordinate system. An XYZ Cartesian coordinate system is set as the local coordinate system. The direction parallel to the X axis on a predetermined plane is defined as the X axis direction. The direction parallel to the Y axis perpendicular to the X axis on the predetermined plane is defined as the Y axis direction. The direction parallel to the Z axis perpendicular to each of the X axis and the Y axis is defined as the Z axis direction. The direction of rotation or tilt around the X axis is defined as the θX direction. The direction of rotation or tilt around the Y axis is defined as the θY direction. The direction of rotation or tilt around the Z axis is defined as the θZ direction. The predetermined plane is the XY plane. The Z axis is perpendicular to the predetermined plane. In the embodiment, the predetermined plane is parallel to a horizontal plane. The Z axis direction is vertical. The predetermined plane may be tilted with respect to the horizontal plane.

[0011] [First embodiment] A first embodiment will be described.

[0012] <Component mounting equipment> Fig. 1 is a perspective view showing a component mounting apparatus 1 according to the first embodiment. Fig. 2 is a side view showing the component mounting apparatus 1 according to the first embodiment. As shown in Figs. 1 and 2, the component mounting apparatus 1 includes a base 2, a component supply member 3, a board support member 4, a robot hand 5, a robot manipulator 6, and a three-dimensional measuring device 7.

[0013] The base 2 supports a component supply member 3, a substrate support member 4, a robot manipulator 6, and a three-dimensional measuring device 7.

[0014] The component supplying member 3 supplies the lead components 100. The component supplying member 3 includes a tray on which the lead components 100 are arranged. A plurality of lead components 100 are arranged on the component supplying member 3. The types of the plurality of lead components 100 may be the same or different from each other.

[0015] The board support member 4 supports the board 200 on which the lead components 100 are mounted. The board support member 4 supports the board 200 so that the top surface (front surface) of the board 200 is parallel to the XY plane.

[0016] The robot hand 5 is a holding member that holds the lead component 100. The robot hand 5 is provided at the tip of a robot manipulator 6.

[0017] The robot manipulator 6 moves the robot hand 5. The robot manipulator 6 includes a multi-joint robot. The robot manipulator 6 is a vertical multi-joint robot. The robot manipulator 6 may be a horizontal multi-joint robot. The robot manipulator 6 has a base member 6A fixed to the base 2, a rotating member 6B supported by the base member 6A, a first arm 6C connected to the rotating member 6B, a second arm 6D connected to the first arm 6C, and a third arm 6E connected to the second arm 6D. The robot hand 5 is attached to the third arm 6E.

[0018] The rotating member 6B is supported by the base member 6A so as to be rotatable around a rotation axis TX. The rotation axis TX is parallel to the Z axis. The first arm 6C is connected to the rotating member 6B so as to be rotatable around a first rotation axis AX1. The first rotation axis AX1 is perpendicular to the Z axis. The second arm 6D is connected to the first arm 6C so as to be rotatable around a second rotation axis AX2. The second rotation axis AX2 is parallel to the first rotation axis AX1. The third arm 6E is connected to the second arm 6D so as to be rotatable around a third rotation axis AX3. The third rotation axis AX3 is parallel to the second rotation axis AX2.

[0019] The robot manipulator 6 has a rotation actuator that rotates the rotation member 6B, a first rotation actuator that rotates the first arm 6C, a second rotation actuator that rotates the second arm 6D, and a third rotation actuator that rotates the third arm 6E.

[0020] The three-dimensional measuring device 7 measures the three-dimensional shape of the lead component 100 held by the robot hand 5. The three-dimensional measuring device 7 detects the three-dimensional shape of the lead component 100 based on a phase shift method. The three-dimensional measuring device 7 can detect the coordinates (position) of the lead component 100 in a local coordinate system.

[0021] <Robot hand> 3 is a perspective view showing the robot hand 5 according to the first embodiment. The robot hand 5 has a connecting member 5A attached to a third arm 6E, a rotating member 5B supported by the connecting member 5A, and a pair of moving members 5C supported by the rotating member 5B.

[0022] The rotating member 5B is supported by the connecting member 5A so as to be rotatable around a rotation axis RX. The rotation axis RX is perpendicular to the third rotation axis AX3. The pair of moving members 5C move in a direction toward and away from each other. A grip portion 5D is provided at the lower end of the moving member 5C. The pair of grip portions 5D move toward and away from each other.

[0023] The robot hand 5 has a rotation actuator that rotates the rotation member 5B, and a grip actuator that moves the pair of moving members 5C closer to or farther away from each other.

[0024] With lead component 100 disposed between the pair of grip portions 5D, lead component 100 is held by grip portions 5D as the pair of grip portions 5D approaches each other. Lead component 100 is released from grip portions 5D as the pair of grip portions 5D moves away from each other.

[0025] The robot hand 5, while holding the lead component 100, can move in each of the planar directions parallel to the upper surface of the substrate 200 and the normal direction perpendicular to the upper surface of the substrate 200. As described above, the substrate support member 4 supports the substrate 200 so that the upper surface of the substrate 200 is parallel to the XY plane. The planar directions parallel to the upper surface of the substrate 200 include the X-axis direction and the Y-axis direction. The normal direction perpendicular to the upper surface of the substrate 200 is the Z-axis direction. The robot hand 5, while holding the lead component 100, can also move in the θX direction, the θY direction, and the θZ direction. That is, the lead component 100 can be moved by the robot hand 5 in each of the X-axis direction, the Y-axis direction, the Z-axis direction, the θX direction, the θY direction, and the θZ direction.

[0026] A force sensor 8 is disposed on one of the movable members 5C. The force sensor 8 can detect the load applied to the grip portion 5D.

[0027] <Lead components> Fig. 4 is a side view showing the lead component 100 held by the robot hand 5 according to the first embodiment. Fig. 5 is a view of the lead component 100 according to the first embodiment as viewed from below.

[0028] The lead component 100 has a body 101 and a plurality of leads 110 protruding from the body 101 .

[0029] The body 101 includes a housing made of synthetic resin. An element such as a coil is disposed in the internal space of the body 101. The lead 110 is a metal protrusion. The lead 110 is connected to the element disposed in the internal space of the body 101, for example.

[0030] Leads 110 protrude downward from the lower surface of body 101. A plurality of leads 110 are provided. Three leads 110 are provided. The number of leads 110 may be two, or any number of leads 110 such as four or more. When lead component 100 is mounted on substrate 200, the lower surface of body 101 and the upper surface of substrate 200 face each other.

[0031] The robot hand 5 holds the body 101 of the lead component 100. The pair of grip portions 5D hold the lead component 100 by sandwiching the body 101. While holding the body 101 of the lead component 100, the robot hand 5 is movable in both a planar direction parallel to the upper surface of the substrate 200 and a normal direction perpendicular to the upper surface of the substrate 200.

[0032] <3D measuring device> Fig. 6 is a perspective view showing a three-dimensional measuring device 7 according to the first embodiment. As shown in Fig. 6, the three-dimensional measuring device 7 measures the three-dimensional shape of a lead component 100 with a body 101 held by a robot hand 5. The three-dimensional measuring device 7 measures the three-dimensional shape of each of a plurality of leads 110 with a body 101 held by a robot hand 5.

[0033] The three-dimensional measuring device 7 includes a projection device 7A, an imaging device 7B, and a calculation device 7C. The projection device 7A and the imaging device 7B are each housed in a housing 7D. The projection device 7A and the imaging device 7B are each fixed to the housing 7D. A transparent member 7E is disposed in an opening at the upper end of the housing 7D. An example of the transparent member 7E is a glass plate.

[0034] The projection device 7A irradiates stripe pattern light onto the lead component 100 while the body 101 is held by the robot hand 5. The projection device 7A has a light source, a light modulation element that optically modulates the light emitted from the light source to generate stripe pattern light, and an emission optical system that emits the stripe pattern light generated by the light modulation element. Examples of the light modulation element include a digital mirror device (DMD), a transmissive liquid crystal panel, or a reflective liquid crystal panel.

[0035] The imaging device 7B images the lead component 100 irradiated with the stripe pattern light from a predetermined viewpoint. The viewpoint of the imaging device 7B refers to the imaging position and imaging angle of the imaging device 7B relative to the lead component 100. The imaging device 7B has an imaging optical system that forms an image of the stripe pattern light reflected by the lead component 100, and an imaging element that obtains image data of the lead component 100 via the imaging optical system. Examples of the imaging element include a CMOS image sensor (Complementary Metal Oxide Semiconductor Image Sensor) and a CCD image sensor (Charge Coupled Device Image Sensor).

[0036] The arithmetic device 7C performs image processing on the imaging data of the lead component 100 captured by the imaging device 7B. The arithmetic device 7C includes a computer system. The arithmetic device 7C has a processor such as a CPU (Central Processing Unit), a memory such as a ROM (Read Only Memory) or a RAM (Random Access Memory), and an input / output interface including an input / output circuit capable of inputting and outputting signals and data.

[0037] Three-dimensional measuring device 7 measures the three-dimensional shape of lead component 100 held by robot hand 5 based on the phase shift method.

[0038] Projection device 7A irradiates lead component 100 with stripe pattern light having, for example, a sinusoidal brightness distribution while shifting the phase. Lead component 100 held by robot hand 5 is placed above transparent member 7E. The stripe pattern light emitted from projection device 7A is irradiated onto lead component 100 through transparent member 7E.

[0039] The imaging device 7B images the lead component 100 illuminated with stripe pattern light. The imaging device 7B images the lead component 100 through the transparent member 7E. The imaging device 7B images the lead component 100 from below the lead component 100. The viewpoint of the imaging device 7B is set below the lead component 100. When the robot manipulator 6 is actuated and the position and posture of the lead component 100 held by the robot hand 5 change, the relative position and relative angle between the lead component 100 and the imaging device 7B change. When the relative position and relative angle between the lead component 100 and the imaging device 7B change, the relative viewpoint of the imaging device 7B with respect to the lead component 100 changes.

[0040] The calculation device 7C processes the image data of the lead component 100 captured by the imaging device 7B based on a phase shift method to calculate three-dimensional data indicating the three-dimensional shape of the lead 110. The three-dimensional data of the lead 110 includes the amount of bending of the lead 110 and the coordinates (position) of the lead 110 in a three-dimensional space defined by a local coordinate system. If the angle of the lead 110 relative to the body 101 based on the design value is defined as an ideal angle, and the actual angle of the lead 110 relative to the body 101 is defined as an actual angle, the amount of bending of the lead 110 refers to the difference between the ideal angle and the actual angle.

[0041] <Robot manipulator movement> FIG. 7 is a diagram for explaining the operation of the robot manipulator 6 according to the first embodiment. The component mounting apparatus 1 includes a control device 9 that controls at least the robot manipulator 6. As shown in FIG. 7, holes 210 into which the leads 110 of the lead component 100 are inserted are provided in the substrate 200. The number of holes 210 is equal to the number of leads 110. When there are three leads 110, three holes 210 are provided. One lead 110 is inserted into one hole 210. The control device 9 controls the robot manipulator 6 based on the measurement data of the three-dimensional measuring device 7 so that each of the multiple leads 110 of the lead component 100 is inserted into each of the multiple holes 210 of the substrate 200.

[0042] <Control device> FIG. 8 is a hardware configuration diagram showing the control device 9 according to the first embodiment. The control device 9 includes a computer system 1000. The computer system 1000 includes a processor 1001 such as a CPU (Central Processing Unit), a main memory 1002 including a non-volatile memory such as a ROM (Read Only Memory) and a volatile memory such as a RAM (Random Access Memory), a storage 1003, and an interface 1004 including an input / output circuit. The functions of the control device 9 are stored in the storage 1003 as a computer program. The processor 1001 reads the computer program from the storage 1003, expands it in the main memory 1002, and executes the above-mentioned processing according to the computer program. The computer program may be distributed to the computer system 1000 via a network.

[0043] 9 is a block diagram showing the component mounting apparatus 1 according to the first embodiment. As shown in FIG. 9, the component mounting apparatus 1 has a three-dimensional measuring device 7, an input device 10, and a control device 9.

[0044] The input device 10 generates input data by being operated by an operator. Examples of the input device 10 include a computer keyboard, a touch panel, a mouse, and a voice input device.

[0045] The control device 9 includes an acquisition unit 11, a calculation unit 12, a determination unit 13, and a control unit .

[0046] The acquiring unit 11 acquires three-dimensional data indicating the three-dimensional shape of each of the multiple leads 110 measured by the three-dimensional measuring device 7. The acquiring unit 11 also acquires input data from the input device 10. The input data includes position data of multiple holes 210 provided in the substrate 200. The position data of the holes 210 indicates the coordinates (positions) of the holes 210 in a three-dimensional space defined by a local coordinate system. The position data of the holes 210 is known data derived from, for example, design data of the substrate 200. The operator can input the position data of the holes 210 to the control device 9 via the input device 10.

[0047] The calculation unit 12 calculates a control point CP related to the lead 110 based on the three-dimensional data of the lead 110.

[0048] 10 and 11 are diagrams for explaining control points CP according to the first embodiment. Fig. 10 shows control points CP set on a non-bent lead 110. Fig. 11 shows control points CP set on a bent lead 110.

[0049] The control point CP refers to the average value of the coordinates of the multiple leads 110 in the planar direction. In other words, the control point CP refers to the average value of the coordinates of the multiple leads 110 in each of the X-axis direction and the Y-axis direction. The control point CP may be regarded as the center of gravity or the centroid of the multiple leads 110 in the planar direction.

[0050] The coordinates of the lead 110 in the local coordinate system are measured by the three-dimensional measuring device 7. The calculation unit 12 can calculate the control point CP based on three-dimensional data indicating the three-dimensional shape of the lead 110 measured by the three-dimensional measuring device 7.

[0051] The lead 110 includes a first lead 111, a second lead 112, and a third lead 113. The first lead 111, the second lead 112, and the third lead 113 are arranged in the Y-axis direction. The control point CP includes an average value of the coordinates of the first lead 111, the coordinates of the second lead 112, and the coordinates of the third lead 113 in the X-axis direction, and an average value of the coordinates of the first lead 111, the coordinates of the second lead 112, and the coordinates of the third lead 113 in the Y-axis direction.

[0052] The calculation unit 12 calculates a control point CP at each of a plurality of positions in the normal direction. That is, the calculation unit 12 calculates a control point CP at each of a plurality of positions (heights) in the Z-axis direction. In this embodiment, the calculation unit 12 calculates a first control point CPa indicating a control point CP at the first height Ha, a second control point CPb indicating a control point CP at the second height Hb, and a third control point CPc indicating a control point CP at the third height Hc. The second height Hb is higher than the first height Ha. The third height Hc is higher than the second height Hb.

[0053] The first control point CPa indicates a control point CP at the tip (lower end) of the lead 110. The second control point CPb indicates a control point CP at the middle part of the lead 110, which is closer to the body 101 than the tip of the lead 110. The third control point CPc indicates a control point CP at the base (upper end) of the lead 110, which is closer to the body 101 than the middle part of the lead 110.

[0054] The first control point CPa is the average value of the coordinates (x1a, y1a) of the tip of the first lead 111 in the X-axis direction, the coordinates (x2a, y2a) of the tip of the second lead 112, and the coordinates (x3a, y3a) of the tip of the third lead 113 in the Y-axis direction. The coordinates of the first control point CPa in the X-axis direction are [(x1a+x2a+x3a) / 3]. The coordinates of the first control point CPa in the Y-axis direction are [(y1a+y2a+y3a) / 3].

[0055] The second control point CPb is the average value of the coordinates (x1b, y1b) of the middle part of the first lead 111 in the X-axis direction, the coordinates (x2b, y2b) of the middle part of the second lead 112, and the coordinates (x3b, y3b) of the middle part of the third lead 113 in the Y-axis direction. The coordinates of the second control point CPb in the X-axis direction are [(x1b+x2b+x3b) / 3]. The coordinates of the second control point CPb in the Y-axis direction are [(y1b+y2b+y3b) / 3].

[0056] The third control point CPc is the average value of the coordinates (x1c, y1c) of the base end of the first lead 111 in the X-axis direction, the coordinates (x2c, y2c) of the base end of the second lead 112, and the coordinates (x3c, y3c) of the base end of the third lead 113 in the Y-axis direction. The coordinate of the third control point CPc in the X-axis direction is [(x1c+x2c+x3c) / 3]. The coordinate of the third control point CPc in the Y-axis direction is [(y1c+y2c+y3c) / 3].

[0057] 10, when each of the three leads 110 (111, 112, 113) is not bent, that is, when each of the three leads 110 is parallel to the Z axis, the first control point CPa, the second control point CPb, and the third control point CPc are arranged parallel to the Z axis. That is, when each of the three leads 110 is not bent, the coordinates of the first control point CPa, the coordinates of the second control point CPb, and the coordinates of the third control point CPc match in the planar direction. Also, when each of the three leads 110 is not bent, the coordinates of the center of the body 101 match in the planar direction with the coordinates of the first control point CPa, the coordinates of the second control point CPb, and the coordinates of the third control point CPc.

[0058] In the following description, the coordinates of the control point CP when the lead 110 (111, 112, 113) is not bent will be referred to as the reference coordinates, where appropriate.

[0059] As shown in Fig. 11, when at least one of the multiple leads 110 is bent, the coordinates of the control point CP move in the planar direction from the reference coordinates. As an example, Fig. 11 shows an example in which the first lead 111 is bent in the -Y direction. As shown in Fig. 11, when the first lead 111 is bent in the -Y direction, the first control point CPa moves in the -Y direction from the reference coordinates of the first control point CPa, and the second control point CPb also moves in the -Y direction from the reference coordinates of the second control point CPb.

[0060] The determination unit 13 determines the insertion direction of the lead 110 based on the multiple control points CP. The determination unit 13 determines the line VC connecting the multiple control points CP as the insertion direction. In the example shown in FIG. 11, the determination unit 13 determines the line VC connecting the first control point CPa, the second control point CPb, and the third control point CPc as the insertion direction of the lead 110 into the board 200. In the example shown in FIG. 11, the line VC is inclined with respect to the Z axis. The line VC is inclined in the -Y direction toward the -Z direction. The insertion direction of the lead 110 is a direction inclined with respect to the Z axis.

[0061] Based on the position data of the holes 210 in the substrate 200 acquired by the acquisition unit 11 and the control points CP, the control unit 14 outputs a control command to move the robot hand 5 holding the body 101 so that each of the leads 110 is inserted into each of the holes 210. Based on the position data of the holes 210 and the control points CP, the control unit 14 outputs a control command to the robot manipulator 6 so that each of the three leads 110 is inserted into the holes 210 in the substrate 200 one by one.

[0062] After the tip of the lead 110 is inserted into the hole 210, the control unit 14 moves the robot hand 5 in an insertion direction determined based on a plurality of control points CP (CPa, CPb, CPc).

[0063] <Component mounting method> 12 is a flowchart showing the component mounting method according to the first embodiment. An operator operates the input device 10 to input position data of the hole 210 in the board 200 to the control device 9. The acquisition unit 11 acquires the position data of the hole 210 in the board 200 from the input device 10 (step SA1).

[0064] The control unit 14 controls the robot manipulator 6 so that the lead component 100 of the component supply member 3 is held by the robot hand 5. The robot hand 5 holds the body 101 of the lead component 100 to be mounted on the board 200 in the component supply member 3. As described with reference to FIG. 6, the control unit 14 controls the robot manipulator 6 so that the lead component 100 held by the robot hand 5 is measured by the three-dimensional measuring device 7. The three-dimensional measuring device 7 measures the three-dimensional shape of each of the multiple leads 110 of the lead component 100 with the body 101 held by the robot hand 5. The acquisition unit 11 acquires three-dimensional data indicating the three-dimensional shape of each of the multiple leads 110 from the three-dimensional measuring device 7 (step SA2).

[0065] The calculation unit 12 calculates control points CP at multiple positions in the normal direction based on the three-dimensional data indicating the three-dimensional shapes of each of the multiple leads 110 acquired in step SA2 (step SA3). As described with reference to Fig. 10 and Fig. 11, in this embodiment, the calculation unit 12 calculates a first control point CPa at the first height Ha, a second control point CPb at the second height Hb, and a third control point CPc at the third height Hc.

[0066] The determination unit 13 determines the insertion direction of the lead 110 based on the multiple control points CP (CPa, CPb, CPc) calculated in step SA3 (step SA4). As described with reference to Fig. 11, the determination unit 13 determines the line VC connecting the first control point CPa, the second control point CPb, and the third control point CPc as the insertion direction of the lead component 100 with respect to the board 200.

[0067] Based on the position data of the multiple holes 210 in the substrate 200 acquired in step SA1 and the multiple control points CP (CPa, CPb, CPc), the control unit 14 moves the robot hand 5 holding the body 101 so that each of the multiple leads 110 (111, 112, 113) is inserted into each of the multiple holes 210 (step SA5).

[0068] FIG. 13 is a diagram for explaining the component mounting method according to the first embodiment. The control unit 14 controls the robot manipulator 6 so that the tip of each of the multiple leads 110 (111, 112, 113) is inserted into the hole 210 of the substrate 200. The coordinates of the tip of each of the multiple leads 110 are measured by the three-dimensional measuring device 7. The coordinates of the hole 210 of the substrate 200 are input from the input device 10. The inner diameter of the hole 210 is larger than the diameter of the lead 110. The control unit 14 controls the robot manipulator 6 based on the measurement data of the three-dimensional measuring device 7 and the input data from the input device 10 so that the coordinates of the tip of the lead 110 and at least a part of the coordinates of the hole 210 of the substrate 200 coincide with each other. That is, the control unit 14 controls the robot manipulator 6 so that the tip of the lead 110 and the hole 210 of the substrate 200 are aligned.

[0069] The control unit 14 controls the robot manipulator 6 so that the tip of the lead 110 is aligned with the hole 210 of the substrate 200 based on the first control point CPa of the tip of the lead 110. The control unit 14 controls the robot manipulator 6 so that the average value (center of gravity) of the coordinates of the multiple (three) holes 210 in the planar direction coincides with the coordinates of the first control point CPa, and then inserts the tip of each of the multiple leads 110 into the hole 210 of the substrate 200.

[0070] After the tip of the lead 110 is inserted into the hole 210 of the substrate 200, the control unit 14 moves the robot hand 5 in the insertion direction determined in step SA4. For example, if the first lead 111 is bent in the -Y direction, the line VC connecting the first control point CPa, the second control point CPb, and the third control point CPc is inclined in the -Y direction toward the -Z direction. After the tip of the lead 110 is inserted into the hole 210 of the substrate 200, the control unit 14 moves the robot hand 5 in the insertion direction indicated by the line VC.

[0071] For example, when the first lead 111 is bent, even if the tip ends of the multiple leads 110 (111, 112, 113) are inserted into the hole 210 of the substrate 200, if the lead component 100 is pushed into the substrate 200 parallel to the Z axis so that the lead 110 is inserted into the hole 210 of the substrate 200 up to the base end of the lead 110, the middle or base end of the first lead 111 may come into contact with the inner surface of the hole 210 of the substrate 200 with a strong force. That is, if the lead component 100 is lowered parallel to the Z axis from the state shown in FIG. 13, the middle or base end of the first lead 111 may come into contact with the inner surface of the hole 210 of the substrate 200 with a strong force. If the middle or base end of the first lead 111 receives a strong force from the inner surface of the hole 210 of the substrate 200 and the load applied to the first lead 111 increases, the quality of the lead component 100 may be degraded.

[0072] In the embodiment, a plurality of control points CP (CPa, CPb, CPc) are calculated, and the insertion direction of the lead component 100 is determined based on a line VC connecting the plurality of control points CP. The line VC can be regarded as an average value of the bending amounts of the plurality of leads 110 (111, 112, 113). By inserting the lead component 100 into the substrate 200 along the line VC, it is possible to prevent a force that one of the plurality of leads 110 receives from the inner surface of the hole 210 from becoming excessively large. In other words, even if the lead 110 is bent, by inserting the lead component 100 into the substrate 200 along the line VC, the force that the lead 110 receives from the inner surface of the hole 210 is distributed (averaged) to the plurality of leads 110. This prevents the load on the lead 110 from becoming large, and prevents deterioration in the quality of the lead component 100.

[0073] <Effects> As described above, according to the embodiment, the component mounting apparatus 1 includes a robot hand 5 which is a holding member capable of moving in both a planar direction parallel to the surface of the substrate 200 and a normal direction perpendicular to the surface of the substrate 200 while holding the body 101 of the lead component 100, a 3D measuring device 7 which measures the 3D shape of each of the multiple leads 110 (111, 112, 113) of the lead component 100 while the body 101 is held by the robot hand 5, a calculation unit 12 which calculates control points CP (CPa, CPb, CPc) at multiple positions (heights) in the normal direction based on 3D data indicating the 3D shape of each of the multiple leads 110 when the average value of the coordinates of the multiple leads 110 in the planar direction is defined as the control point CP, and a control unit 14 which moves the robot hand 5 holding the body 101 so that each of the multiple leads 110 is inserted into each of the multiple holes 210 based on the position data of the multiple holes 210 provided in the substrate 200 and the multiple control points CP.

[0074] According to this embodiment, even if the lead 110 is bent, after the tip end of the lead 110 is inserted into the hole 210 of the substrate 200, the control unit 14 can smoothly insert the lead 110 into the hole 210 of the substrate 200 up to the base end of the lead 110 based on multiple control points CP (CPa, CPb, CPc).

[0075] In this embodiment, the component mounting apparatus 1 includes a determination unit 13 that determines the insertion direction of the lead 110 based on a plurality of control points CP (CPa, CPb, CPc). The insertion direction is defined by a line connecting the plurality of control points CP (CPa, CPb, CPc). After the tip of the lead 110 is inserted into the hole 210 of the substrate 200, the control unit 14 moves the robot hand 5 in the insertion direction.

[0076] The line VC can be regarded as an average value of the amount of bending of the multiple leads 110 (111, 112, 113). By inserting the lead component 100 into the substrate 200 along the line VC, the force that one of the multiple leads 110 receives from the inner surface of the hole 210 is prevented from becoming excessively large. In other words, even if the lead 110 is bent, by inserting the lead component 100 into the substrate 200 along the line VC, the force that the lead 110 receives from the inner surface of the hole 210 is distributed (averaged) among the multiple leads 110. This prevents the load on the lead 110 from becoming too large, and prevents deterioration in the quality of the lead component 100.

[0077] The control points CP include a first control point CPa of the tip of the lead 110. When inserting the tip of the lead 110 into the hole 210 of the substrate 200, the control unit 14 can control the robot manipulator 6 so that the tip of the lead 110 and the hole 210 of the substrate 200 are aligned based on the first control point CPa of the tip of the lead 110. The control unit 14 can then insert the tip of each of the multiple leads 110 (111, 112, 113) into the hole 210 of the substrate 200 after controlling the robot manipulator 6 so that the average value (center of gravity point) of the coordinates of the multiple (three) holes 210 in the planar direction coincides with the coordinates of the first control point CPa.

[0078] [Second embodiment] A second embodiment will be described below. In the following description, components that are the same as or equivalent to those in the first embodiment described above are given the same reference numerals, and descriptions of those components will be simplified or omitted.

[0079] 14 is a diagram for explaining a method of calculating a control point CP according to the second embodiment. In this embodiment, the calculation unit 12 calculates a first control point CPa indicating a control point CP of the tip end of the lead 110 based on three-dimensional data indicating the three-dimensional shape of the lead 110, and calculates a third control point CPc indicating a control point CP of the base end of the lead 110 closer to the body 101 than the tip end of the lead 110 based on the position of the robot hand 5 holding the body 101, the first control point CPa, and the length of the lead 110.

[0080] 14, a center line CL is defined on the body 101. The center line CL passes through the center of the body 101 in the planar direction. That is, the center line CL passes through the center of the body 101 in each of the X-axis direction and the Y-axis direction. The center line CL is parallel to the Z-axis.

[0081] The robot hand 5 holds the center of the body 101 in a planar direction. In the example shown in Fig. 14, the robot hand 5 holds the center of the body 101 in the Y-axis direction. The robot hand 5 is capable of moving in both the planar direction and the normal direction while holding the center of the body 101 in the planar direction. The three-dimensional measuring device 7 measures the three-dimensional shape of each of the multiple leads 110 while the center of the body 101 is held by the robot hand 5.

[0082] The calculation unit 12 calculates a first control point CPa indicating a control point CP of the tip of the lead 110 based on three-dimensional data indicating the three-dimensional shape of each of the multiple leads 110 measured by the three-dimensional measurement device .

[0083] The calculation unit 12 calculates a third control point CPc indicating a control point CP of the base end of the lead 110 based on the position of the robot hand 5 holding the center of the body 101 in the planar direction, a first control point CPa calculated based on the three-dimensional data, and the length of the lead 110. The center line CL passes through the robot hand 5. The calculation unit 12 can calculate the third control point CPc of the base end of the lead 110 based on the position of the robot hand 5, the first control point CPa of the tip end of the lead 110, and the length of the lead 110 according to the theorem of trigonometric functions.

[0084] The robot manipulator 6 is provided with a position sensor capable of detecting the position of the robot hand 5. An example of the position sensor is an encoder capable of detecting the amount of operation of the robot manipulator 6. The position sensor detects the position of the robot hand 5 in a local coordinate system. The detection data of the position sensor is transmitted to the control device 9. The length of the lead 110 is known data derived from, for example, design data of the lead component 100. An operator can input the design data including the length of the lead 110 to the control device 9 via the input device 10.

[0085] After the first control point CPa and the third control point CPc are calculated, the determination unit 13 determines the insertion direction of the lead 110 relative to the board 200 based on the first control point CPa and the third control point CPc. The determination unit 13 determines the insertion direction of the lead 110 relative to the board 200 based on the line VC connecting the first control point CPa and the third control point CPc.

[0086] The control unit 14 moves the robot hand 5 holding the center of the body 101 so that each of the multiple leads 110 (111, 112, 113) is inserted into each of the multiple holes 210 based on the position data of the multiple holes 210 in the substrate 200, the first control point CPa, and the third control point CPc.

[0087] 15 is a flowchart showing a component mounting method according to the second embodiment. An operator operates the input device 10 to input position data of the hole 210 in the board 200 to the control device 9. The acquisition unit 11 acquires the position data of the hole 210 in the board 200 from the input device 10 (step SB1).

[0088] Three-dimensional measuring device 7 measures the three-dimensional shape of each of the multiple leads 110 of lead component 100 while the center of body 101 in a planar direction is held by robot hand 5. Acquiring unit 11 acquires three-dimensional data indicating the three-dimensional shape of each of the multiple leads 110 from three-dimensional measuring device 7 (step SB2).

[0089] The operator operates the input device 10 to input design data including the length of the lead 110 to the control device 9. The acquisition unit 11 acquires the design data including the length of the lead 110 from the input device 10 (step SB3).

[0090] The calculation unit 12 calculates a first control point CPa of the tip of the lead 110 based on the three-dimensional data indicating the three-dimensional shape of each of the multiple leads 110 acquired in step SA2 (step SB4).

[0091] The calculation unit 12 calculates a third control point CPc of the base end of the lead 110 based on the position of the robot hand 5 holding the center of the body 101, the first control point CPa calculated in step SB4, and the length of the lead 110 obtained in step SB3 (step SB5).

[0092] The determination unit 13 determines the insertion direction of the lead 110 based on the first control point CPa calculated in step SB4 and the third control point CPc calculated in step SB5 (step SB6). As described with reference to Fig. 14, the determination unit 13 determines the line VC connecting the first control point CPa and the third control point CPc as the insertion direction of the lead component 100 with respect to the board 200.

[0093] Based on the position data of the multiple holes 210 in the substrate 200 acquired in step SB1 and the first control point CPa and the third control point CPc, the control unit 14 moves the robot hand 5 holding the body 101 so that each of the multiple leads 110 (111, 112, 113) is inserted into each of the multiple holes 210 (step SB7).

[0094] 13, the control unit 14 controls the robot manipulator 6 so that the tip of the lead 110 is aligned with the hole 210 of the substrate 200, for example, based on the first control point CPa of the tip of the lead 110. After the tip of the lead 110 is inserted into the hole 210 of the substrate 200, the control unit 14 moves the robot hand 5 in the insertion direction determined in step SB6.

[0095] As described above, in this embodiment as well, the lead 110 is smoothly inserted into the hole 210 of the substrate 200 up to the base end of the lead 110. Even if the three-dimensional measuring device 7 cannot measure the three-dimensional shape of the base end of the lead 110 due to, for example, the shape of the lead component 100, etc., the control point CP of the base end of the lead 110 is calculated according to this embodiment.

[0096] In this embodiment, the calculation unit 12 may calculate a second control point CPb indicating a control point CP at the middle part of the lead 110 closer to the body 101 than the tip of the lead 110 based on the position of the robot hand 5 holding the center of the body 101, the first control point CPa, and the length of the lead 110.

[0097] [Another embodiment] The components described in the first embodiment and the components described in the second embodiment may be combined. For example, the first control point CPa at the first height Ha and the second control point CPb at the second height Hb may be calculated based on three-dimensional data of the lead 110, and the third control point CPc at the third height Hc may be calculated based on the position of the robot hand 5 holding the center of the body 101, the first control point CPa calculated previously, and the length of the lead 110.

[0098] In the above-described embodiment, the control points CP include a first control point CPa, a second control point CPb, and a third control point CPc. At least two control points CP may be calculated. As the control points CP, only the control point CP of the tip end of the lead 110 and the control point CP of the base end of the lead 110 may be calculated. By calculating the control point CP of the base end of the lead 110, the control unit 14 can smoothly insert the lead 110 into the hole 210 of the substrate 200 up to the base end of the lead 110 based on the control point CP of the base end of the lead 110.

[0099] In the above-described embodiment, the three-dimensional measuring device 7 measures the three-dimensional shape of the lead 110 based on a phase shift method. The three-dimensional measuring device 7 may measure the three-dimensional shape of the lead 110 using a stereo camera method or a laser scanner method. [Explanation of symbols]

[0100] 1...component mounting device, 2...base, 3...component supply member, 4...substrate support member, 5...robot hand (holding member), 5A...connecting member, 5B...rotating member, 5C...moving member, 5D...grip portion, 6...robot manipulator, 6A...base member, 6B...rotating member, 6C...first arm, 6D...second arm, 6E...third arm, 7...three-dimensional measuring device, 7A...projection device, 7B...imaging device, 7C...computing device, 7D...housing, 7E...transparent member, 8...force sensor, 9...control device, 10...input device, 11...acquisition unit, 12...calculation unit, 13...determination unit, 14...control unit, 100...re board part, 101...body, 110...lead, 111...first lead, 112...second lead, 113...third lead, 200...substrate, 210...hole, 1000...computer system, 1001...processor, 1002...main memory, 1003...storage, 1004...interface, AX1...first rotating axis, AX2...second rotating axis, AX3...third rotating axis, CL...center line, CP...control point, CPa...first control point, CPb...second control point, CPc...third control point, Ha...first height, Hb...second height, Hc...third height, RX...rotation axis, TX...swivel axis, VC...line.

Claims

1. a holding member that is movable in a planar direction parallel to a surface of a substrate and in a normal direction perpendicular to the surface of the substrate while holding a body of a lead component; a three-dimensional measuring device that measures a three-dimensional shape of each of the plurality of leads of the lead component while the body is held by the holding member; a calculation unit that calculates the control points at each of a plurality of positions in the normal direction based on three-dimensional data indicating the three-dimensional shape when an average value of coordinates of the plurality of leads in the planar direction is set as a control point; and a control unit that moves the holding member holding the body so that each of the plurality of leads is inserted into each of the plurality of holes, based on position data of a plurality of holes provided in the substrate and the plurality of control points. Component mounting equipment.

2. a determination unit that determines an insertion direction of the lead based on a plurality of the control points; the control unit moves the holding member in the insertion direction after the tip portion of the lead is inserted into the hole. The component mounting device according to claim 1 .

3. The control points include a first control point indicating a control point of the tip portion of the lead, and a second control point indicating a control point of an intermediate portion or a base end portion of the lead closer to the body than the tip portion. The component mounting device according to claim 1 .

4. the holding member holds a center of the body in the planar direction, the calculation unit calculates a third control point indicating a control point of an intermediate portion or a base end portion of the lead that is closer to the body than the tip end portion, based on a position of the holding member, the first control point, and a length of the lead. The component mounting apparatus according to claim 3 .

5. a holding member that is movable in a plane direction parallel to a surface of a substrate and in a normal direction perpendicular to the surface of the substrate while holding a center of a body of the lead component in the plane direction; a three-dimensional measuring device that measures a three-dimensional shape of each of a plurality of leads of the lead component while the center of the body is held by the holding member; a calculation unit which calculates a first control point indicating a control point of a tip portion of the lead based on three-dimensional data indicating the three-dimensional shape when an average value of coordinates of the multiple leads in the planar direction is set as a control point, and calculates a second control point indicating a control point of an intermediate portion or a base portion of the lead closer to the body than the tip portion based on a position of the holding member, the first control point, and a length of the lead; and a control unit that moves the holding member holding a center of the body so that each of the plurality of leads is inserted into each of the plurality of holes, based on position data of a plurality of holes provided in the substrate, the first control point, and the second control point. Component mounting equipment.

6. a determination unit that determines an insertion direction of the lead based on the first control point and the second control point, the control unit moves the holding member in the insertion direction after the tip portion of the lead is inserted into the hole. The component mounting apparatus according to claim 5 .

7. holding a body of the lead component with a holding member movable in a planar direction parallel to a surface of the substrate and in a normal direction perpendicular to the surface of the substrate; measuring a three-dimensional shape of each of a plurality of leads of the lead component while the body is held by the holding member; calculating the control points at a plurality of positions in the normal direction based on three-dimensional data indicating the three-dimensional shape when the average value of the coordinates of the plurality of leads in the planar direction is defined as a control point; and moving the holding member holding the body so that each of the plurality of leads is inserted into each of the plurality of holes, based on position data of a plurality of holes provided in the substrate and the plurality of control points. Component mounting method.

8. holding the center of the body of the lead component in a planar direction parallel to a surface of the substrate and in a normal direction perpendicular to the surface of the substrate by a holding member movable in the planar direction and a normal direction perpendicular to the surface of the substrate; measuring a three-dimensional shape of each of a plurality of leads of the lead component while the center of the body is held by the holding member; calculating a first control point indicating a control point of a tip of the lead based on three-dimensional data indicating the three-dimensional shape, when an average value of coordinates of the plurality of leads in the planar direction is defined as a control point; calculating a second control point indicating a control point of an intermediate portion or a base end portion of the lead that is closer to the body than the tip end portion, based on a position of the holding member, the first control point, and a length of the lead; and moving the holding member holding the center of the body so that each of the plurality of leads is inserted into each of the plurality of holes based on position data of a plurality of holes provided in the substrate, the first control point, and the second control point. Component mounting method.

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