In-air electroplating system

Abstract

To provide an in-air electroplating system in which an object can be efficiently plated in air without being detached regardless of shape or size of the object.SOLUTION: An in-air electroplating system, in which the plating-layer formation part of an object can be arranged so as to be encompassed, comprises: a plating solution immersion part immersed with a plating solution, from the surface of which the plating solution can be discharged; a metallic electrode holding part for holding the object via the plating solution immersion part; and a power supply unit for electrically connect the object as a cathode to the electrode holding part as an anode. The power supply unit energizes between the electrode holding part and the object in the state that the plating-layer formation part of the object contacts the plating solution immersion part.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to an air electroplating processing system. [Background technology]

[0002] Traditionally, silver plating has generally been carried out by dissolving the metal in water (forming a plating solution), using the object to be plated as the cathode and the plating metal as the anode, and passing an electric current between them, causing the metal cations in the plating solution to form a plating film on the cathode.

[0003] Disconnectors are used in substations and the like to open power circuits when performing inspections, maintenance, and the like. Disconnectors are equipped with contacts such as blades and fingers that repeatedly come into contact with and separate from each other. The surfaces of such contacts are silver-plated to improve electrical conductivity. The silver plating formed on such contacts wears away due to contact, and the copper base material may become exposed. For this reason, the disconnectors themselves have been replaced along with the worn contacts. However, because replacement requires time and money, a plating treatment system is known that repairs the silver plating on the contacts and reuses the disconnectors in order to reduce the maintenance costs of the power grid (see, for example, Patent Document 1).

[0004] Patent Document 1 discloses a plating system in which a metallic object is placed in a container formed of a metal mesh and the surface of the object is plated. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2008-223109 A Summary of the Invention [Problem to be solved by the invention]

[0006] However, the conventional plating system as shown in Patent Document 1 is configured to house the object in a container installed in a factory or the like. That is, when the object to be plated is a contact such as a blade of a disconnector, it is necessary to remove the blade from the disconnector and bring it into the container in the factory. In other words, the conventional method does not allow the object to be moved to a substation or the like where it is installed to plate the contact, and there is room for improvement in this respect.

[0007] Furthermore, when the object to be plated is a complex, large-sized contact such as a blade or finger, which is provided in a disconnector, there is a problem that it is physically difficult to place the object in a container that contains the above-mentioned conventional plating solution.

[0008] An object of the present invention is to provide an air electroplating system that can efficiently plate an object in air without removing the object, regardless of the shape or size of the object. [Means for solving the problem]

[0009] One aspect of the present invention is an air electroplating system that forms a plating layer by passing an electric current between a metal object placed in the air and the metal object, the system comprising: a plating solution penetration section that can be placed to cover a plating layer formation section of the object, through which a plating solution is penetrated and which can release the plating solution from its surface; a metal electrode holding section that holds the object via the plating solution penetration section; and a power supply section that electrically connects the object as a cathode and the electrode holding section as an anode, the power supply section passing an electric current between the electrode holding section and the object while the plating solution penetration section is in contact with the plating layer formation section of the object.

[0010] According to the present invention, the electrode gripping part is attached to the object via the plating solution permeation part, the electrode gripping part and the object are electrically connected to the electrode part, the electrode gripping part functions as an anode, and the object functions as a cathode. Then, by passing a current between the electrode gripping part and the object while the plating solution permeation part is in contact with the plating layer formation part of the object, a plating layer can be formed with high accuracy on the plating layer formation part of the object located at a predetermined position. In this way, in the present invention, a plating solution penetration section, which allows the plating solution to penetrate and release from the surface, is interposed between the object and the electrode holding section, so that plating can be performed efficiently in air without removing or moving the object from its designated location, regardless of the shape or dimensions of the object.

[0011] The present invention may further comprise a plating solution supply section for supplying the plating solution to the plating solution permeation section.

[0012] According to the present invention, since plating solution is constantly supplied from the plating solution supply section to the plating solution penetration section, it is possible to prevent burning caused by the plating solution in the plating solution penetration section drying up during electroplating processing, resulting in a shortage of silver and continued flow of current, and thus to prevent a deterioration in plating quality.

[0013] In addition, the present invention may be characterized in that the plating solution supply section includes a plating solution receiving section that receives and recovers the plating solution dripping from the plating solution penetrating section, and a plating solution circulating device that supplies the plating solution recovered in the plating solution receiving section back to the plating solution penetrating section.

[0014] According to the present invention, the plating solution that has overflowed from the plating solution permeation section is collected in the plating solution receiving section, and the plating solution is again supplied to the plating solution permeation section by the plating solution circulating device. In this way, since the plating solution circulating device can be provided for the plating solution permeation section that is attached to the object installed at a predetermined location, it is possible to create a state in which the plating solution is constantly circulated.

[0015] In the present invention, the electrode gripping portion may include a vibration portion.

[0016] According to the present invention, vibration can be applied to the plating solution permeated part from the vibration part via the electrode gripping part, so that silver ions soaked into the plating solution permeated part quickly become a silver coating by electroplating, and it is possible to prevent burning caused by continuing to pass current in a state where there is a shortage of silver ions between the plating solution permeated part and the target object and to prevent deterioration of plating quality.

[0017] In the present invention, the plating solution permeation portion may be made of a fabric material.

[0018] According to the present invention, the plating solution permeation section made of a cloth material can be freely deformed to fit the shape and area of ​​the plating layer formation section of the object on which the plating layer is to be formed, and can be arranged to cover the entire plating layer formation section. In addition, since the plating solution permeation section is a lightweight cloth material, it can be easily brought to the installation location of the object and attached.

[0019] In the present invention, the electrode gripping portion clamps the plating solution penetration portion between the electrode gripping portion and the plating layer formation portion of the object.

[0020] According to the present invention, the electrode gripping portion can clamp and hold the object with the plating solution penetrating portion interposed therebetween. This allows current from the power supply portion to flow reliably between the electrode gripping portion and the plating layer forming portion of the object. Furthermore, the plating solution penetrating portion can be reliably brought into contact with the plating layer forming portion, so that a uniform plating layer without unevenness can be formed over the entire surface.

[0021] In the present invention, the electrode holding portion is formed of titanium and iridium dioxide.

[0022] According to the present invention, by forming the electrode holding portion from titanium and iridium dioxide, the function of the anode can be efficiently exhibited. Effect of the Invention

[0023] According to the air electroplating system of the present invention, it is possible to efficiently plate an object in air without removing the object, regardless of the shape or size of the object. [Brief description of the drawings]

[0024] [Figure 1] 1 is a diagram showing a schematic configuration of an air electroplating processing system according to an embodiment of the present invention. [Diagram 2] 13 is a perspective view showing a state in which an electrode gripping portion is attached to a blade via a plating liquid permeation portion. FIG. [Diagram 3] FIG. 3 is a front view of FIG. 2 as seen from the longitudinal direction of the blade. [Figure 4] FIG. 2 is a diagram showing the state of electroplating by an air electroplating processing system. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0025] Hereinafter, an air electroplating system according to an embodiment of the present invention will be described with reference to the drawings.

[0026] The embodiment of the aerial electroplating system 1 shown in Fig. 1 forms a silver plating layer 10A (see Fig. 4) by passing electricity between the system and a metal object placed in the air. The object may be, for example, a device such as a blade or finger of a horizontal two-point disconnect switch used in outdoor electrical equipment for power transmission, which is silver plated to reduce power transmission loss. In this embodiment, the blade 10 (object) is described below as an example.

[0027] As shown in Figures 2 and 3, the blade 10 is silver-plated on a fixed contact attached to a horizontal double-break disconnector installed outdoors at a substation or the like, for example, at a position of 8 to 9 m above the ground. The blade 10 is formed in a generally flat plate shape that is long in one direction. The blade 10 is connected to a power supply unit 40 via an electric wire 41 (see Figure 4), which will be described later, and functions as a cathode.

[0028] As shown in FIGS. 1 and 4, the air electroplating system 1 includes a plating solution penetrating section 20, an electrode gripping section 30, a power supply device 40 (power supply section), and a plating solution supplying section 50.

[0029] The plating solution permeation section 20 is made of a cloth material including felt paper, and is arranged so as to cover the plating layer forming section 10a of the blade 10. For example, industrial felt paper can be made of wool, nylon, aramid, polyester, etc. The plating solution permeation section 20 is permeated in a state in which it is saturated with the silver plating solution M, and is capable of releasing the silver plating solution M from the surface. By bringing the plating solution permeation section 20 into contact with the blade 10, which is the object of plating, the silver plating solution M in which silver ions are dissolved is supplied to the blade 10. A plating solution supply nozzle 55, which will be described later, is detachably fixed to the plating solution permeation section 20, and the silver plating solution M is continuously supplied from this plating solution supply nozzle 55.

[0030] Since the plating solution permeation section 20 is formed of felt paper, it can be freely deformed according to the shape and area of ​​the plating layer formation section 10a of the blade 10, which is the object on which the silver plating layer 10A is formed, and can be arranged so as to cover the entire plating layer formation section. The plating solution permeation section 20 absorbs the silver plating solution M supplied from the plating solution supply nozzle 55, holds it inside, and gradually releases it to the outside. The plating solution permeation section 20 is arranged so as to cover the electrode gripping section 30 and the surface of the blade 10 (here, the plating layer formation section 10a). The plating solution permeation section 20 holds the silver plating solution M and gradually exudes the silver plating solution M and releases it to the outside, so that the silver plating solution M can be constantly maintained in contact with the surface of the plating layer formation section 10a of the blade 10.

[0031] Here, as the silver plating solution M, for example, Ecosilver PG (manufactured by Nisshin Seiki Co., Ltd.) silver plating solution can be used.

[0032] 2 and 3, the electrode holding part 30 is formed from a metal member and holds the blade 10 via the plating solution permeation part 20. As shown in FIG. 4, the electrode holding part 30 is connected to a power supply device 40 via an electric wire 41 and functions as an electrode (anode) that supplies current to the blade 10. The electrode holding part 30 is formed from a metal material that has good electrical conductivity, corrosion resistance, and rigidity. For example, the electrode holding part 30 is formed from copper, titanium, stainless steel, an aluminum alloy, or the like.

[0033] The part that acts as the anode is an iridium dioxide (IrO2) electrode connected to the electrode holder 30, and is covered by the plating solution permeation part 20. The entire electrode holder 30 does not act as the anode. The IrO2 electrode can also be a platinum titanium electrode or a ruthenium oxide electrode. The part of the blade 10 to be plated that contacts the plating solution permeated portion 20 of the anode acts as the cathode.

[0034] 2 and 3, the electrode gripping portion 30 sandwiches the plating solution penetrating portion 20 between itself and the plating layer forming portion 10a of the blade 10. Specifically, the electrode gripping portion 30 is a member that extends long in one direction and has a U-shaped cross section that opens downward. That is, the electrode gripping portion 30 has a pair of plate-shaped side walls 31, 31 on the left and right, and a plate-shaped upper wall portion 32 that connects the upper ends of the both side walls 31. The pair of side walls 31, 31 are arranged in parallel to the left and right with a gap between them. The distance between the side walls 31, 31 is set to a dimension slightly larger than the width of the blade 10.

[0035] The electrode gripping portion 30 is provided so as to hold both widthwise ends of the blade 10 by sandwiching them between a pair of side walls 31, 31 via the plating solution permeation portion 20. As shown in Figs. 2 and 3, the protruding end 31a of the side wall 31 is attached in a state covered by the plating solution permeation portion 20. In this manner, the electrode gripping portion 30 is detachable from the blade 10. As described above, the pair of side walls 31, 31 function as an anode, and the blade 10 sandwiched between the side walls 31, 31 functions as a cathode.

[0036] The electrode gripping part 30 includes a vibration device 33 (vibration part). The vibration device 33 includes a vibration base 331, is fixed to the upper wall part 32 of the electrode gripping part 30 via a metal vibration transmission plate 34, and vibrates the pair of side wall parts 31 with a predetermined vibration amount. The vibration transmission plate 34 is integrally provided with an upper fixing plate 341, a lower fixing plate 342, and a connecting plate 343 that connects both ends of the upper fixing plate 341 and the lower fixing plate 342. The upper fixing plate 341 is fixed to the vibration base 331 by bolt fastening, and the lower fixing plate 342 is fixed to the upper wall part 32 of the electrode gripping part 30 by bolt fastening. By vibrating with the vibration device 33, it is possible to stir silver in the silver plating solution M that has soaked into the plating solution penetration part 20 via the side wall part 31. By providing the vibration transmission plate 34 between the vibration device 33 and the electrode holding portion 30 as in this embodiment, the vibration of the vibration device 33 can be transmitted to the electrode holding portion 30 efficiently.

[0037] 4, the power supply unit 40 is electrically connected to the blade 10 via a second electric wire 41B so that the blade 10 functions as a cathode, and is electrically connected to the electrode holding portion 30 via a first electric wire 41A so that the blade 10 functions as an anode. The power supply unit 40, the electric wire 41, the electrode holding portion 30, and the blade 10 form an electrical closed circuit.

[0038] The power supply unit 40 forms a silver plating layer 10A on the surface of the plating layer forming portion 10a of the blade 10 by passing a current between the electrode holding portion 30 and the blade 10 while the plating solution permeating portion 20 is in contact with the plating layer forming portion 10a of the blade 10. That is, the power supply unit 40 passes a current between the electrode holding portion 30 functioning as an anode and the blade 10 functioning as a cathode, while applying a negative voltage to the object to be plated, thereby transferring silver ions contained in the silver plating solution M permeated into the plating solution permeating portion 20 to the blade 10 functioning as a cathode.

[0039] The power supply device 40 includes a rectifier (not shown) that supplies direct current to the electrode holding portion 30, and a control device (not shown) that is electrically connected to the rectifier via a communication cable and controls the operation of the rectifier. The rectifier converts alternating current supplied from a commercial power source or the like into direct current.

[0040] The electric wires 41 (41A, 41B) are, for example, electric wires having a conductive core material with an insulating coating. The first electric wire 41A is provided at both ends with clips that can clamp and connect to the electrodes of the power supply device 40 and the electric wire connection portion 35 of the electrode holding portion 30. The second electric wire 41B is provided at both ends with clips that can clamp and connect to the electrodes of the power supply device 40 and the electric wire connection portion of the blade 10.

[0041] 1 , the plating solution supplying section 50 supplies a silver plating solution M to the plating solution permeating section 20. The plating solution supplying section 50 includes a plating solution receiving section 51 that receives and recovers the silver plating solution M dripping from the plating solution permeating section 20, and a plating solution circulating device 52 that supplies the silver plating solution M recovered in the plating solution receiving section 51 back to the plating solution permeating section 20.

[0042] The plating solution receiving portion 51 is a tray-shaped recovery container, and is disposed below the plating solution permeating portion 20. The size and shape of the plating solution receiving portion 51 are not particularly limited as long as they can receive all of the silver plating solution M dripping from the plating solution permeating portion 20. A first pipe 53A, which will be described later, is connected to a discharge port 51a formed at the bottom of the plating solution receiving portion 51, and the silver plating solution M recovered in the plating solution receiving portion 51 is discharged through the first pipe 53A.

[0043] The plating solution circulating device 52 includes a circulation pipe 53, a circulation pump 54, and a plating solution supply nozzle 55. The plating solution supply nozzle 55 is connected to the plating solution permeation section 20. The circulation pipe 53 connects the plating solution receiving section 51 and the plating solution supply nozzle 55.

[0044] The circulation pump 54 is an example of a driving means that is disposed midway through the circulation pipe 53 and circulates the silver plating solution M accumulated in the plating solution receiving section 51 through the circulation pipe and sends it out to the plating solution supply nozzle 55 side.

[0045] The circulation pipe 53 is a conduit capable of sending the silver plating solution M from the plating solution receiving portion 51 to the plating solution supply nozzle 55, and is in the form of a bendable tube. The circulation pipe 53 is formed of a resin material such as polyethylene or polyurethane. The circulation pipe 53 has a first pipe 53A that connects the outlet 51a of the plating solution receiving portion 51 to the circulation pump 54, and a second pipe 53B that connects the circulation pump 54 to the plating solution supply nozzle 55.

[0046] The plating solution supply nozzle 55 is detachably connected to the plating solution penetrating section 20, and supplies the silver plating solution M sent from the circulation pipe 53 into the plating solution penetrating section 20. The plating solution supply nozzle 55 is preferably disposed so that the silver plating solution M flows uniformly and smoothly throughout the plating solution penetrating section 20.

[0047] Next, an air electroplating process procedure for forming the silver plating layer 10A on the blade 10 using the above-mentioned air electroplating process system 1 will be described with reference to the drawings.

[0048] 2 and 3, the electrode holding part 30 is attached to the blade 10 to be silver plated. In this embodiment, the electrode holding part 30 is attached to the blade 10 located outdoors at a height of 8 m or more above the ground, without removing the blade 10.

[0049] Specifically, the plating solution penetrating part 20 is attached so as to cover the protruding end 31a of the side wall part 31 of the electrode gripping part 30. Then, the pair of side wall parts 31 to which the plating solution penetrating part 20 is attached clamps both end edges 10b of the blade 10 in the width direction, thereby fixing the electrode gripping part 30 to the blade 10. That is, the electrode gripping part 30 is fixed with the plating solution penetrating part 20 interposed between it and the blade 10. At this time, the plating solution penetrating part 20 is arranged so as to be in contact with the plating layer forming part 10a of the blade 10. In addition, a vibration device 33 is fixed to the upper wall part 32 of the electrode gripping part 30.

[0050] 4, the power supply unit 40 is connected to the electrode holding portion 30 and the blade 10 using electric wires 41A and 41B. The first electric wire 41A electrically connects the power supply unit 40 and the electric wire connection portion 35 of the electrode holding portion 30, causing the electrode holding portion 30 to function as an anode. The second electric wire 41B electrically connects the power supply unit 40 and the electric wire connection portion of the blade 10, causing the blade 10 to function as a cathode.

[0051] Next, as shown in Fig. 1, a plating solution supply unit 50 is installed. A plating solution receiving unit 51 is installed below the plating solution penetrating unit 20 attached to the blade 10, and a plating solution supply nozzle 55 is connected to the plating solution penetrating unit 20. The plating solution receiving unit 51 and the plating solution supply nozzle 55 are connected by circulation pipes 53A and 53B. For example, about 1 liter of silver plating solution M is placed in the plating solution receiving unit 51. This completes preparation for the air electroplating process.

[0052] Next, the circulation pump 54 disposed between the circulation pipes 53A and 53B is driven to cause the silver plating solution M to flow inside the circulation pipe 53, and the silver plating solution M is supplied from the plating solution supply nozzle 55 so as to be poured onto the felt paper of the plating solution permeation section 20 attached to the electrode gripping section 30. The silver plating solution M that overflows from the plating solution permeation section 20 is collected in the plating solution receiving section 51 and sent back to the plating solution permeation section 20 via the circulation pipe 53, so that the silver plating solution M is constantly circulated.

[0053] As shown in FIG. 4, the silver plating solution M is kept circulating, the electrode holder 30 is used as the anode, the blade 10 is used as the cathode, and the power supply 40 is used to maintain the plating solution at room temperature with a current density of 4 A / dm 2 By passing a current between the electrode gripping portion 30 and the blade 10, silver ions in the silver plating solution M that has soaked into the felt paper of the plating solution permeation portion 20 are supplied and generated as a silver plating film on the blade 10, and a silver plating layer 10A is formed on the plating layer forming portion 10a of the blade 10.

[0054] During the electroplating process, the vibrator 33 vibrates the plating solution permeable section 20 via the electrode gripping section 30, so that the silver in the silver plating solution M contained in the felt paper of the plating solution permeable section 20 is constantly stirred. This makes it possible to suppress a shortage of silver in the plating solution permeable section 20. By applying vibration in this manner, the silver ions soaked into the plating solution permeable section 20 quickly become a silver coating by performing the electroplating process, and the silver ions between the felt paper of the plating solution permeable section 20 and the blade 10 are depleted, which prevents burning caused by continuing to pass a current in a state of a shortage of silver ions, and prevents a deterioration in plating quality.

[0055] Next, the operation of the air electroplating processing system 1 will be described in detail with reference to FIG. The aerial electroplating system 1 according to the present embodiment forms a silver plating layer 10A by passing electricity between the system and a metal object placed in the air. The aerial electroplating system 1 includes a plating solution permeation section 20 that can be placed to cover the plating layer forming section 10a of the blade 10, in which silver plating solution M is permeated and which can release the silver plating solution M from its surface, a metal electrode holding section 30 that holds the blade 10 via the plating solution permeation section 20, and a power supply unit 40 that electrically connects the blade 10 as a cathode and the electrode holding section 30 as an anode. The power supply unit 40 passes electricity between the electrode holding section 30 and the blade 10 while the plating solution permeation section 20 is in contact with the plating layer forming section 10a of the blade 10.

[0056] According to the aerial electroplating system 1 of this embodiment, the electrode gripping part 30 is attached to the blade 10 via the plating solution penetrating part 20, the electrode gripping part 30 and the blade 10 are electrically connected to the electrode part, the electrode gripping part 30 functions as an anode, and the blade 10 functions as a cathode. Then, by passing electricity between the electrode gripping part 30 and the blade 10 while the plating solution penetrating part 20 is in contact with the plating layer forming part 10a of the blade 10, it is possible to form a silver plating layer 10A with high accuracy on the plating layer forming part 10a of the blade 10 located at a predetermined position.

[0057] As described above, in this embodiment, the plating solution penetration section 20, which is permeated with silver plating solution M and can release the silver plating solution M from its surface, is interposed between the blade 10 and the electrode holding section 30. Therefore, regardless of the shape or dimensions of the blade 10, plating can be performed efficiently in the air without removing or moving the blade 10 from its designated location.

[0058] In addition, this embodiment includes a plating solution supply unit 50 that supplies silver plating solution M to the plating solution permeating unit 20. Therefore, since silver plating solution M is constantly supplied from the plating solution supply unit 50 to the plating solution permeating unit 20, it is possible to prevent burning caused by continuing to flow current in a state where the silver plating solution M in the plating solution permeating unit 20 is depleted during electroplating processing, and to prevent deterioration of plating quality.

[0059] In this embodiment, the plating solution supply unit 50 includes a plating solution receiving unit 51 that receives and recovers the silver plating solution M dripping from the plating solution permeating unit 20, and a plating solution circulating device 52 that supplies the silver plating solution M recovered in the plating solution receiving unit 51 to the plating solution permeating unit 20 again. Therefore, the silver plating solution M that overflows from the plating solution permeating unit 20 is recovered in the plating solution receiving unit 51, and the silver plating solution M is again supplied to the plating solution permeating unit 20 by the plating solution circulating device 52. In this way, the plating solution circulating device 52 can be provided for the plating solution permeating unit 20 attached to the blade 10 installed at a predetermined location, so that a state in which the silver plating solution M is always circulated can be created.

[0060] In this embodiment, the electrode gripping part 30 is provided with a vibration device 33, so that vibration can be applied from the vibration device 33 to the plating solution permeating part 20 via the electrode gripping part 30. Therefore, the silver ions soaked into the plating solution permeating part 20 quickly become a silver coating when electroplating is performed, and the silver ions are depleted between the plating solution permeating part 20 and the blade 10. This prevents burnout caused by continuing to pass current in a state of silver ion deficiency, and prevents deterioration of plating quality.

[0061] In this embodiment, the plating solution permeation section 20 is made of felt paper, and therefore can be freely deformed to fit the shape and area of ​​the plating layer forming section 10a of the blade 10 on which the silver plating layer 10A is formed, and can be positioned so as to cover the entire plating layer forming section 10a. Furthermore, since the plating solution permeation section 20 is made of lightweight felt paper, it can be easily brought to the installation location of the blade 10 and attached.

[0062] In this embodiment, the electrode gripping part 30 clamps the plating solution permeation part 20 between itself and the plating layer forming part 10a of the blade 10. Therefore, the electrode gripping part 30 can clamp and hold the blade 10 with the plating solution permeation part 20 interposed therebetween. This ensures that a current from the power supply 40 flows between the electrode gripping part 30 and the plating layer forming part 10a of the blade 10. Furthermore, since the plating solution permeation part 20 can be reliably brought into contact with the plating layer forming part 10a, a uniform and even silver plating layer 10A can be formed over the entire surface.

[0063] Although some embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These embodiments can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their modifications are included in the scope of the invention and its equivalents described in the claims, as well as in the scope and spirit of the invention.

[0064] For example, in this embodiment, the blade 10 of a disconnector of a power transmission facility has been described as an example of the target object, but the target object is not limited to the blade 10 and may be, for example, a finger of the disconnector or another target object.

[0065] In this embodiment, the blade 10 is used as the object, and the electrode gripping part 30 is attached to the blade 10 at the installation location without removing the blade 10, but if the object can be easily removed, it is also possible to move the object located at a high place to the ground, and use the aerial electroplating system of the present invention to attach the electrode gripping part 30 and the like to the object on the ground and perform electroplating in the air. Even in this case, it is not necessary to move the object to a specific factory, etc., and the object can be moved to a location where it is easy to work and then plated.

[0066] In addition, in this embodiment, a plating solution supply section is provided to supply plating solution to the plating solution penetration section, but if a sufficient amount of silver plating solution M capable of forming a predetermined plating layer 10A has been pre-penetrated into the plating solution penetration section, it is possible to omit the plating solution supply section.

[0067] Furthermore, in the present embodiment, the plating solution supply unit 50 is configured to include a plating solution receiving unit 51 and a plating solution circulating device 52, but is not limited thereto and may have another configuration. For example, instead of the configuration in which the plating solution circulating device 52 is provided to circulate the silver plating solution M as in the present embodiment, a configuration in which only new plating solution is supplied to the plating solution penetrating unit 20 may be used.

[0068] Furthermore, in this embodiment, the electrode gripping part 30 is provided with a vibration device 33 (vibration part) for applying vibration to the plating solution permeating part 20, but such a vibration device 33 may be omitted.

[0069] Furthermore, in this embodiment, the plating solution permeation section 20 is made of felt paper, but is not limited to felt paper. In short, any material may be used as long as it can be arranged to cover the plating layer formation section of the object, the plating solution can be permeated, and the plating solution can be released from the surface.

[0070] Furthermore, the shape, size, and other configuration of the electrode gripping part 30 are not limited to the above-mentioned U-shaped cross section consisting of a pair of side walls 31 and an upper wall 32, and an electrode gripping part having a configuration matching the shape and size of the target object can be adopted. In short, it is sufficient that the electrode gripping part has a configuration capable of sandwiching the plating solution penetration part between itself and the plating layer formation part of the target object. [Explanation of symbols]

[0071] 1 Air electroplating system, 10 Blade (subject), 10a Plating layer forming section, 10A Silver plating layer, 20 Plating solution penetration section, 30 Electrode gripping section, 31 Side wall section, 32 Upper wall section, 33 Vibration device (vibration section), 35 Electric wire connection section, 40 Power supply device (power supply section), 41, 41A, 41B Electric wire, 50 Plating solution supply section, 51 Plating solution receiving section, 52 Plating solution circulation device, 53, 53A, 53B Circulation pipe, 54 Circulation pump, 55 Plating solution supply nozzle, M Silver plating solution

Claims

1. An air electroplating processing system for forming a plating layer by passing electricity between a metal object placed in air and the metal object, a plating solution permeation section that can be arranged to cover a plating layer formation section of the object, the plating solution permeating therethrough, and the plating solution being capable of being released from the surface; a metal electrode holder that holds the object via the plating solution penetration portion; a power supply unit which electrically connects the target object as a cathode and the electrode holding unit as an anode, The power supply unit passes electricity between the electrode gripping unit and the object while the plating solution penetration unit is in contact with a plating layer formation portion of the object.

2. 2. The air electroplating processing system according to claim 1, further comprising a plating solution supply section that supplies the plating solution to the plating solution penetrating section.

3. The plating solution supply unit includes: a plating solution receiving section that receives and recovers the plating solution dripping from the plating solution permeation section; 3. The air electroplating processing system according to claim 2, further comprising: a plating solution circulating device that supplies the plating solution recovered in the plating solution receiving section again to the plating solution penetrating section.

4. The air electroplating processing system of claim 1 , wherein the electrode gripper comprises a vibrating part.

5. 2. The air electroplating processing system according to claim 1, wherein the plating solution permeation section is made of a cloth material.

6. The air electroplating processing system according to claim 1 , wherein the electrode gripping unit clamps the plating solution penetration unit between the electrode gripping unit and the plating layer forming unit of the target object.

7. 10. The air electroplating processing system of claim 1, wherein the electrode gripper is formed of titanium and iridium dioxide.

Images