Electronic component
By using a defining portion made of a different material to maintain a constant contact surface between conductor members in electronic components, the issue of deviations affecting contact area and component characteristics is addressed, resulting in stable electronic component performance.
Patent Information
- Application Number
- JP2023169161
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2023-09-29
- Publication Date
- 2025-04-10
AI Technical Summary
The connection portions in electronic components, which consist of stacked conductor members, can experience deviations perpendicular to the stacking direction, leading to variations in contact area and consequently affecting the characteristics of the electronic components.
Incorporating a defining portion made of a material different from the conductor, positioned at the edges of the conductor members when viewed from the stacking direction, to define and maintain a constant contact surface between the conductor members.
This configuration ensures that even if deviations occur between the conductor members, the contact area remains constant, thereby suppressing variations in the characteristics of the electronic components.
Smart Images
Figure 2025059220000001_ABST
Abstract
Description
[Technical field]
[0001] The present invention relates to electronic components. [Background technology]
[0002] The electronic component includes an element body formed by stacking multiple insulator layers, a terminal electrode disposed on the element body, and a coil disposed within the element body and electrically connected to the terminal electrode (see, for example, Patent Document 1). The coil includes a first wiring portion, a second wiring portion, and a connection portion that extends in the stacking direction of the multiple insulator layers and connects the first wiring portion and the second wiring portion. [Prior art documents] [Patent documents]
[0003] [Patent Document 1] International Publication No. 2016 / 132911 Summary of the Invention [Problem to be solved by the invention]
[0004] The connection (conductor) that makes up the coil is constructed by stacking multiple components. Two components stacked in the stacking direction can be misaligned in a direction perpendicular to the stacking direction (parallel to the faces of the components facing each other). When a misalignment occurs between the two components, the contact area between the two components changes. This change in contact area affects the characteristics of the electronic component. The misalignment between the two components differs depending on the individual electronic component. This can result in variation in the characteristics of the electronic component.
[0005] An object of one embodiment of the present invention is to provide an electronic component capable of suppressing the occurrence of variations in characteristics. [Means for solving the problem]
[0006] (1) An electronic component according to one embodiment of the present invention comprises a base body formed by stacking a plurality of insulator layers, and a conductor disposed within the base body and extending in a stacking direction of the plurality of insulator layers, the conductor having a plurality of conductor members stacked in the stacking direction, and a defining portion defining a contact surface between two conductor members being provided between the two conductor members in the stacking direction, the defining portion being formed of a material different from the conductor and being disposed on an edge of the two conductor members as viewed from the stacking direction.
[0007] In an electronic component according to one aspect of the present invention, a defining portion is provided between two conductor members in the stacking direction to define the contact surface between the two conductor members. The defining portion is made of a material different from the conductor and is disposed at the edge of the two conductor members as viewed from the stacking direction. As a result, even if the two conductor members are misaligned in the stacking direction, the contact surface between the two conductor members is defined by the defining portion, so that the contact area between the two conductor members is kept constant. Therefore, even if the two conductor members are misaligned, the characteristics of the electronic component are not affected. As a result, the electronic component can suppress the occurrence of variations in characteristics.
[0008] (2) In the electronic component of (1) above, the conductor may be made of Cu, and the defining portion may be made of an inorganic material other than Cu. In this configuration, since the defining portion is made of an inorganic material other than Cu, even if a misalignment occurs between the two conductor members, the characteristics are not affected.
[0009] (3) In the electronic component of (1) or (2) above, the shape of the contact surface defined by the defining portion may be similar to the outer shape of the conductor when viewed in the stacking direction. With this configuration, a large tolerance for misalignment between the two conductor members can be ensured.
[0010] (4) In the electronic device of (1) above, the determining portion may be made of the same material as the element body. In this configuration, even if a misalignment occurs between the two conductor members, the characteristics are not affected.
[0011] (5) In the electronic component of (4) above, in one of the two conductor members, a side surface and a contact surface of the one conductor member may be connected by a curved surface, and the defining portion may be disposed at a position corresponding to the curved surface as viewed from the stacking direction. In this configuration, a space is formed between the two conductor members at the edge of the conductor member. Therefore, the element body can be used as the defining portion.
[0012] (6) An electronic component according to one embodiment of the present invention comprises a base body formed by stacking a plurality of insulating layers, a first conductor disposed within the base body and extending in the stacking direction of the plurality of insulating layers, and a second conductor connected to the first conductor, wherein a defining portion is provided between the first conductor and the second conductor to define a contact surface between the first conductor and the second conductor, the defining portion being formed of a material different from the first conductor and the second conductor and being disposed on an edge of the first conductor when viewed from the stacking direction.
[0013] In an electronic component according to one aspect of the present invention, a defining portion is provided between the first conductor and the second conductor to define the contact surface between the first conductor and the second conductor. The defining portion is made of a material different from the first conductor and the second conductor, and is disposed at the edge of the first conductor when viewed from the stacking direction. As a result, even if the first conductor and the second conductor are misaligned in the electronic component, the contact surface between the first conductor and the second conductor is defined by the defining portion, so that the contact area between the first conductor and the second conductor is kept constant. Therefore, even if the first conductor and the second conductor are misaligned in the electronic component, the characteristics are not affected. As a result, the electronic component can suppress the occurrence of variations in characteristics.
[0014] (7) In the electronic component of (6) above, the first conductor and the second conductor may be made of Cu, and the defining portion may be made of an inorganic material other than Cu. In this configuration, since the defining portion is made of an inorganic material other than the conductor made of Cu, even if the first conductor and the second conductor are misaligned, the characteristics are not affected.
[0015] (8) In the electronic component of (6) or (7) above, the shape of the contact surface defined by the defining portion may be similar to the outer shape of the first conductor when viewed in the stacking direction. With this configuration, a large tolerance for misalignment of the first conductor and the second conductor can be ensured.
[0016] (9) In the electronic component of (6) above, the defining portion may be made of the same material as the element body. In this configuration, even if the first conductor and the second conductor are misaligned, the characteristics are not affected. Effect of the Invention
[0017] According to one aspect of the present invention, the occurrence of variations in characteristics can be suppressed. [Brief description of the drawings]
[0018] [Figure 1] FIG. 1 is a perspective view of a coil component according to one embodiment. [Diagram 2] FIG. 2 is a view of the coil component shown in FIG. 1 as viewed from an end face side. [Diagram 3] FIG. 3 is an enlarged cross-sectional view showing a part of a pillar portion of the coil component according to the first embodiment. [Figure 4] FIG. 4 is a view of the defining portion as viewed from the lamination direction. [Diagram 5] 5(a), 5(b), 5(c), 5(d), 5(e), 5(f) and 5(g) are views for explaining the manufacture of the pillar portion. [Figure 6] FIG. 6(a) is a diagram showing a state in which there is no misalignment between the two pillar members, and FIG. 6(b) is a diagram showing a state in which there is a misalignment between the two pillar members. [Figure 7] FIG. 7 is an enlarged cross-sectional view showing a part of a pillar portion of a coil component according to the second embodiment. [Figure 8] FIG. 8 is a view of the defining portion as viewed from the lamination direction. [Figure 9]9(a), 9(b), 9(c), 9(d), 9(e) and 9(f) are views for explaining the manufacture of the pillar portion. [Figure 10] FIG. 10 is an enlarged cross-sectional view showing a portion of a pillar portion and a wiring portion of a coil component according to a third embodiment. [Figure 11] FIG. 11 is an enlarged cross-sectional view showing a portion of a pillar portion and a wiring portion of a coil component according to a fourth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0019] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same or corresponding elements are designated by the same reference numerals, and duplicated explanations will be omitted.
[0020] A coil component according to one embodiment will be described with reference to Fig. 1. Fig. 1 is a perspective view of the coil component according to one embodiment. Fig. 2 is a view of the coil component shown in Fig. 1 as viewed from the end face side. As shown in Figs. 1 and 2, the coil component (electronic component) 1 includes an element body 2, a first terminal electrode 3 and a second terminal electrode 4, a coil 5, a first connecting conductor 10 and a second connecting conductor 11. In Figs. 1 and 2, the element body 2 is indicated by a two-dot chain line. In Fig. 1, the coil 5 is shown in a see-through manner.
[0021] The element body 2 has a rectangular parallelepiped shape. The rectangular parallelepiped shape includes a rectangular parallelepiped shape with chamfered corners and ridges, and a rectangular parallelepiped shape with rounded corners and ridges. The element body 2 has a pair of end faces 2a, 2b, a pair of main faces 2c, 2d, and a pair of side faces 2e, 2f as outer surfaces. The end faces 2a, 2b face each other. The main faces 2c, 2d face each other. The side faces 2e, 2f face each other. In the following, the facing direction of the end faces 2a, 2b is a first direction D1, the facing direction of the main faces 2c, 2d is a second direction D2, and the facing direction of the side faces 2e, 2f is a third direction D3. The first direction D1, the second direction D2, and the third direction D3 are approximately perpendicular to each other.
[0022] The end faces 2a, 2b extend in the second direction D2 to connect the main faces 2c, 2d. The end faces 2a, 2b also extend in the third direction D3 to connect the side faces 2e, 2f. The main faces 2c, 2d extend in the first direction D1 to connect the end faces 2a, 2b. The main faces 2c, 2d also extend in the third direction D3 to connect the side faces 2e, 2f. The side faces 2e, 2f extend in the first direction D1 to connect the end faces 2a, 2b. The side faces 2e, 2f also extend in the second direction D2 to connect the main faces 2c, 2d.
[0023] The main surface 2d is a mounting surface, and is a surface that faces another electronic device (not shown) when the coil component 1 is mounted on the other electronic device (for example, a circuit board or a coil component). The end surfaces 2a and 2b are surfaces that are continuous with the mounting surface (i.e., the main surface 2d).
[0024] 1 and 2, the length of the element body 2 in the first direction D1 is longer than the length of the element body 2 in the second direction D2 and the length of the element body 2 in the third direction D3. The length of the element body 2 in the second direction D2 is shorter than the length of the element body 2 in the third direction D3. That is, in this embodiment, the end faces 2a, 2b, the main faces 2c, 2d, and the side faces 2e, 2f have a rectangular shape. The length of the element body 2 in the second direction D2 may be equal to the length of the element body 2 in the third direction D3, or may be longer than the length of the element body 2 in the third direction D3.
[0025] In this embodiment, "equivalent" may mean not only equal but also values including slight differences or manufacturing errors within a preset range. For example, if multiple values are within a range of ±5% of the average value of the multiple values, the multiple values are defined as equivalent.
[0026] The element body 2 is formed by stacking multiple element body layers (insulator layers) in the second direction D2. That is, the stacking direction of the element body 2 is the second direction D2. In the actual element body 2, the multiple element body layers may be integrated to the extent that the boundaries between the layers are not visible, or may be integrated so that the boundaries between the layers are visible.
[0027] The element layer may be, for example, a resin layer. The material of the element layer includes, for example, at least one selected from liquid crystal polymer, polyimide resin, crystalline polystyrene, epoxy resin, acrylic resin, bismaleimide resin, and fluorine resin. The element layer may include a filler. The filler may be, for example, an inorganic filler. Examples of the inorganic filler include silica (SiO 2 The element layer does not necessarily need to contain a filler.
[0028] The base layer may be configured to include a magnetic material. The magnetic material of the base layer may include, for example, a Ni-Cu-Zn ferrite material, a Ni-Cu-Zn-Mg ferrite material, or a Ni-Cu ferrite material. The magnetic material of the base layer may include, for example, an Fe alloy. The base layer may include, for example, a non-magnetic material. The non-magnetic material of the base layer may include, for example, a glass ceramic material or a dielectric material.
[0029] The first terminal electrode 3 and the second terminal electrode 4 are provided on the element body 2. The first terminal electrode 3 and the second terminal electrode 4 are arranged on the main surface 2d of the element body 2. The first terminal electrode 3 and the second terminal electrode 4 are provided on the element body 2 and spaced apart from each other in the first direction D1. Specifically, the first terminal electrode 3 is arranged on the end surface 2a side of the element body 2. The second terminal electrode 4 is arranged on the end surface 2b side of the element body 2.
[0030] Each of the first terminal electrode 3 and the second terminal electrode 4 may have, for example, a rectangular shape (rectangular shape). Each of the first terminal electrode 3 and the second terminal electrode 4 is arranged so that each side is along the first direction D1 or the third direction D3. As shown in FIG. 2, the first terminal electrode 3 and the second terminal electrode 4 do not protrude beyond the main surface 2d. That is, in this embodiment, each surface of the first terminal electrode 3 and the second terminal electrode 4 is flush with the main surface 2d. The first terminal electrode 3 and the second terminal electrode 4 are made of a conductive material (for example, Cu).
[0031] Each of the first terminal electrode 3 and the second terminal electrode 4 may be provided with a plating layer (not shown) containing, for example, Ni, Sn, Au, etc. by electrolytic plating or electroless plating. The plating layer may have, for example, a Ni plating film containing Ni and covering the first terminal electrode 3 and the second terminal electrode 4, and an Au plating film containing Au and covering the Ni plating film.
[0032] As shown in FIG. 1 and FIG. 2, the coil 5 is disposed within the element body 2. The coil 5 has a plurality of first wiring portions 6, a plurality of second wiring portions 7, and a plurality of pillar portions (conductors) 8. The coil 5 is configured by electrically connecting the first wiring portions 6, the second wiring portions 7, and the pillar portions 8. The coil axis of the coil 5 is provided along the third direction D3. The first wiring portions 6, the second wiring portions 7, and the pillar portions 8 are configured of a conductive material (e.g., Cu). The first wiring portions 6, the second wiring portions 7, and the pillar portions 8 are disposed away from the end faces 2a, 2b, the main faces 2c, 2d, and the side faces 2e, 2f.
[0033] Each of the first wiring portions 6 is disposed on the principal surface 2c side of the element body 2. Each of the first wiring portions 6 extends along a first direction D1. Each of the first wiring portions 6 connects two pillar portions 8. The first wiring portions 6 are bridged across the two pillar portions 8. One end of the first wiring portion 6 in the extension direction (the end on the end face 2a side) is connected to one end of the pillar portion 8 (the end on the principal surface 2c side). The other end of the first wiring portion 6 in the extension direction (the end on the end face 2b side) is connected to one end of the pillar portion 8 (the end on the principal surface 2c side).
[0034] Each of the second wiring parts 7 is disposed on the main surface 2d (mounting surface) side of the element body 2. Each of the second wiring parts 7 extends in a first direction D1. Each of the second wiring parts 7 connects two pillar parts 8. The second wiring part 7 is bridged across the two pillar parts 8. One end of the second wiring part 7 in the extension direction (end on the end surface 2a side) is connected to the other end of the pillar part 8 (end on the main surface 2d side). The other end of the second wiring part 7 in the extension direction (end on the end surface 2b side) is connected to the other end of the pillar part 8 (end on the main surface 2d side). The number of the multiple second wiring parts 7 is one less than the number of the multiple first wiring parts 6. That is, when the number of the first wiring parts 6 is n, the number of the second wiring parts 7 is n-1.
[0035] Each of the pillar portions 8 extends along the second direction D2. The pillar portions 8 connect the first wiring portion 6 and the second wiring portion 7. In this embodiment, the pillar portions 8 are prismatic. The cross-sectional shape of the pillar portions 8 (in a direction perpendicular to the second direction D2) is rectangular. One end of the pillar portion 8 is connected to an end of the first wiring portion 6. The other end of the pillar portion 8 is connected to an end of the second wiring portion 7.
[0036] The first connecting conductor 10 connects the first terminal electrode 3 and one end of the coil 5. The first connecting conductor 10 is connected to the other end of the pillar portion 8 of the coil 5. The first connecting conductor 10 is disposed at a position closer to the end face 2a and closer to the side face 2e. The first connecting conductor 10 is made of a conductive material. The first connecting conductor 10 is made of, for example, Cu.
[0037] The second connecting conductor 11 connects the second terminal electrode 4 and the other end of the coil 5. The second connecting conductor 11 is connected to the other end of the pillar portion 8 of the coil 5. The second connecting conductor 11 is disposed at a position closer to the end face 2b and closer to the side face 2f. The second connecting conductor 11 is made of a conductive material. The second connecting conductor 11 is made of, for example, Cu.
[0038] [First embodiment] Fig. 3 is an enlarged cross-sectional view showing a portion of the pillar portion according to the first embodiment. As shown in Fig. 3, the pillar portion 8 has a plurality of pillar members (conductor members) 12. In the pillar portion 8, the plurality of pillar members 12 are stacked in the second direction D2. In the following description, for convenience of description, the plurality of pillar members 12 may be distinguished from each other and shown as pillar member 12A and pillar member 12B. The pillar member 12A and the pillar member 12B are pillar members connected to each other (adjacent to each other).
[0039] The pillar portion 8 has a contact surface 13. The contact surface 13 is a surface where the two pillar components 12 are in contact with each other. In the example shown in Fig. 3, the contact surface 13 is a surface where the pillar component 12A and the pillar component 12B are in contact with each other.
[0040] In the pillar portion 8, a defining portion 14 is provided between the pillar member 12A and the pillar member 12B. In this embodiment, the defining portion 14 is disposed on the pillar member 12A. The defining portion 14 defines the contact surface 13 between the pillar member 12A and the pillar member 12B. The defining portion 14 defines the size of the contact area of the contact surface 13 between the pillar member 12A and the pillar member 12B. The defining portion 14 is formed of an inorganic material that is different from the material (Cu) that forms the pillar portion 8. In this embodiment, the defining portion 14 is, for example, Cr, titanium oxide, or the like. The conductivity of the defining portion 14 is lower than the conductivity of the pillar portion 8.
[0041] As shown in FIG. 3 and FIG. 4, the defining portion 14 is disposed on the edge portion 12E of the pillar members 12A, 12B when viewed from the second direction D2 (stacking direction). The edge portion 12E of the pillar members 12A, 12B is a concept including a portion that is a predetermined distance inward from the side surfaces 12Aa, 12Ba (side surfaces of the pillar portion 8) of the pillar members 12A, 12B. As shown in FIG. 4, in this embodiment, the defining portion 14 has a rectangular frame shape. The shape of the contact surface 13 defined by the defining portion 14 has a shape similar to the outer shape of the pillar portion 8. The shape of the contact surface 13 has a rectangular shape. That is, the inner shape of the defining portion 14 has a rectangular shape.
[0042] In this embodiment, the defining portion 14 defines the contact surface 13 so that the area of the contact surface 13 is 20% to 80% of the area of the end faces of the pillar members 12A, 12B. That is, the width W of the defining portion 14 is set so that the area of the contact surface 13 is 20% to 80% of the area of the end faces of the pillar members 12A, 12B. The thickness T of the defining portion 14 is, for example, 10 nm to 30 nm.
[0043] The defining portion 14 is provided between two adjacent pillar members 12 among the plurality of pillar members 12. That is, for example, when there are four pillar members 12, three defining portions 14 are provided.
[0044] The coil component 1 can be manufactured as follows. The element body 2 can be formed by laminating sheets that constitute element body layers. The coil 5 (first wiring portion 6, second wiring portion 7, pillar portion 8), first connecting conductor 10 and second connecting conductor 11 can be manufactured using a photolithography method. The "photolithography method" may be any method that processes a layer to be processed, which contains a photosensitive material, into a desired pattern by exposing and developing it, and is not limited to any type of mask.
[0045] The following describes in detail how to manufacture the pillar portion 8. As shown in Fig. 5(a), in a sheet S1 constituting an element layer, a conductor C1 (pillar member 12A) constituting the pillar portion 8 is formed by Cu plating, and then the sheet S1 is ground to expose the conductor C and to flatten the sheet S1.
[0046] Subsequently, as shown in FIG. 5(b), a first film M1 of Cr is formed on the sheet S1 by sputtering, and a second film M2 of Cu is formed on the first film M1 by sputtering.
[0047] 5(c), after a resist is spin-coated on the second film M2, the area corresponding to the conductor C1 is exposed and developed to remove the first film M1 and the second film M2 in the area corresponding to the conductor C, thereby forming an opening O in the first film M1 and the second film M2. The opening area of the opening O corresponds to the area of the contact surface 13 of the pillar portion 8. By adjusting (setting) the opening area of the opening O, the area of the contact surface 13 of the pillar portion 8 can be adjusted.
[0048] 5(d), resist R is spin-coated on the second film M2, and then exposed and developed to remove the resist R from the region corresponding to the conductor C. Then, as shown in FIG. 5(e), a conductor C2 (pillar member 12B) is formed by plating in the portion from which the resist R has been removed. The conductor C2 is Cu-plated.
[0049] Next, as shown in FIG. 5(f), the resist R is peeled off and the first film M1 and the second film M2 are removed. At this time, the first film M1 remains between the conductors C1 and C2. This first film M1 becomes the defining portion 14. Next, the sheet S2 that constitutes the element layer is embedded, and the element layer is hardened. In this manner, the pillar portion 8 provided with the defining portion 14 is manufactured.
[0050] As described above, in the coil component 1 according to the present embodiment, between the two pillar members 12A, 12B of the pillar portion 8, a defining portion 14 is provided that defines the contact surface 13 of the two pillar members 12A, 12B. The defining portion 14 is formed of a material different from that of the pillar portion 8. The defining portion 14 is disposed at the edge portion 12E of the two pillar members 12A, 12B when viewed from the second direction D2. As a result, even if a lamination misalignment occurs in the two pillar members 12A, 12B in the coil component 1, the contact surface 13 of the two pillar members 12A, 12B is defined by the defining portion 14, so that the contact area of the two pillar members 12A, 12B is kept constant. Therefore, in the coil component 1, even if a misalignment occurs in the two pillar members 12A, 12B, the characteristics are not affected. As a result, in the coil component 1, the occurrence of variation in characteristics can be suppressed.
[0051] FIG. 6(a) is a diagram showing a state where no misalignment occurs between the two pillar members 12A and 12B. FIG. 6(b) is a diagram showing a state where a misalignment occurs between the two pillar members 12A and 12B. As shown in FIG. 6(b), even if a misalignment occurs between the two pillar members 12A and 12B, the area of the contact surface 13 defined by the defining portion 14 is the same as the contact surface 13 (FIG. 6(a)) when no misalignment occurs between the two pillar members 12A and 12B. That is, even if a misalignment occurs between the two pillar members 12A and 12B, the area of the contact surface 13 does not change. Therefore, in the coil device 1, even if a misalignment occurs between the two pillar members 12A and 12B, the characteristics are not affected, and the occurrence of variation in characteristics can be suppressed.
[0052] In the coil device 1 according to this embodiment, when viewed from the second direction D2 (the extending direction of the pillar portion 8), the shape of the contact surface 13 defined by the defining portion 14 has a shape similar to the outer shape of the pillar portion 8. With this configuration, a large tolerance for misalignment between the two pillar members 12A, 12B can be ensured.
[0053] [Second embodiment] Next, a second embodiment will be described. Fig. 7 is an enlarged cross-sectional view showing a portion of a pillar portion according to the second embodiment. In the coil component 1A, a defining portion 20 is provided between the pillar member 12A and the pillar member 12B in the pillar portion 8. The defining portion 20 defines the contact surface 13 between the pillar member 12A and the pillar member 12B. The defining portion 20 defines the size of the contact area of the contact surface 13 between the pillar member 12A and the pillar member 12B. The defining portion 20 is constituted by a portion of the element body 2.
[0054] 7 and 8, the defining portion 20 is disposed at an edge portion 12E of the pillar members 12A, 12B when viewed from the second direction D2 (stacking direction). The edge portion 12E of the pillar members 12A, 12B is a concept including a portion that is a predetermined distance inward from the side surface of the pillar members 12A, 12B. The edge portion 12E of the pillar member 12A is configured by a curved surface that connects the side surface 12Aa of the pillar member 12A and the contact surface 13. The defining portion 20 is disposed at a position corresponding to the curved surface when viewed from the second direction D2.
[0055] 8, in this embodiment, the defining portion 20 has a rectangular frame shape. In this embodiment, the defining portion 20 defines the contact surface 13 so that the area of the contact surface 13 is 20% to 80% of the area of the end faces of the pillar members 12A and 12B.
[0056] The following describes in detail how to manufacture the pillar portion 8. As shown in Fig. 9(a), in a sheet S1 constituting an element layer, a conductor C1 (pillar member 12A) constituting the pillar portion 8 is formed by Cu plating, and then the sheet S1 is ground to expose the conductor C and to flatten the sheet S1.
[0057] Subsequently, as shown in FIG. 9(b), a Cu film M is formed on the sheet S1 by a sputtering method.
[0058] 9(c), a resist R is spin-coated on the film M, and then exposed and developed to remove the resist R from the region corresponding to the conductor C1. Then, as shown in FIG. 9(d), a conductor C2 (pillar member 12B) is formed by plating in the portion from which the resist R has been removed. The conductor C2 is Cu-plated.
[0059] 5(e), the resist R is peeled off and the film M is removed. At this time, when the film M is removed, a part of the conductor C1 is removed to form the defining portion 20. Next, the sheet S2 that constitutes the element layer is embedded, and the element layer is hardened. In this manner, the pillar portion 8 provided with the defining portion 20 is manufactured.
[0060] As described above, in the coil component 1A according to the present embodiment, the defining portion 20 that defines the contact surface 13 of the two pillar members 12A, 12B is provided between the two pillar members 12A, 12B of the pillar portion 8. The defining portion 20 is formed of a material different from that of the pillar portion 8. The defining portion 20 is disposed at the edge portion 12E of the two pillar members 12A, 12B when viewed from the second direction D2. As a result, even if a lamination misalignment occurs in the two pillar members 12A, 12B in the coil component 1A, the contact surface 13 of the two pillar members 12A, 12B is defined by the defining portion 20, so that the contact area of the two pillar members 12A, 12B is kept constant. Therefore, in the coil component 1A, even if a misalignment occurs in the two pillar members 12A, 12B, the characteristics are not affected. As a result, in the coil component 1A, the occurrence of variation in characteristics can be suppressed.
[0061] Although the embodiment of the present invention has been described above, the present invention is not necessarily limited to the above-described embodiment, and various modifications are possible without departing from the gist of the present invention.
[0062] In the above embodiment, a configuration has been described in which the defining portions 14, 20 are provided on the edge portions 12E of the two pillar members 12A, 12B of the pillar portion 8. However, the defining portions may be provided between other conductors.
[0063] As shown in FIG. 10, in the coil component 1B, the pillar portion 8 and the first wiring portion 6 have a contact surface 21. The contact surface 21 is a surface where the pillar portion 8 and the first wiring portion 6 are in contact with each other. A defining portion 22 is provided between the pillar portion (first conductor) 8 and the first wiring portion (second conductor) 6. The defining portion 22 is disposed on the pillar portion 8. The defining portion 22 defines the contact surface 21 between the pillar portion 8 and the first wiring portion 6. The defining portion 22 defines the size of the contact area of the contact surface 21 between the pillar portion 8 and the first wiring portion 6. The defining portion 22 is formed of an inorganic material that is different from the material (Cu) that forms the pillar portion 8 and the first wiring portion 6. The defining portion 22 is, for example, Cr, titanium oxide, or the like. The conductivity of the defining portion 22 is lower than the conductivity of the pillar portion 8 and the first wiring portion 6.
[0064] The defining portion 22 is disposed on an edge portion 8E of the pillar portion 8 when viewed from the second direction D2 (stacking direction). The edge portion 8E of the pillar portion 8 is a concept including a portion that is a predetermined distance inward from the side surface of the pillar portion 8. The defining portion 22 has a rectangular frame shape. The shape of the contact surface 21 defined by the defining portion 22 has a shape similar to the outer shape of the pillar portion 8. The shape of the contact surface 21 has a rectangular shape. In other words, the inner shape of the defining portion 22 has a rectangular shape.
[0065] The defining portion 22 defines the contact surface 21 so that the area of the contact surface 21 is 20% to 80% of the area of the end face of the pillar portion 8. In other words, the width of the defining portion 22 is set so that the area of the contact surface 21 is 20% to 80% of the area of the end face of the pillar portion 8. The defining portion 22 has a thickness T of, for example, 10 nm to 30 nm.
[0066] In the coil component 1B, a defining portion 22 is provided between the pillar portion 8 and the first wiring portion 6 to define a contact surface 21 between the pillar portion 8 and the first wiring portion 6. The defining portion 22 is made of a material different from that of the pillar portion 8 and the first wiring portion 6, and is disposed at an edge portion 8E of the pillar portion 8 as viewed from the second direction D2. As a result, even if a lamination misalignment occurs between the pillar portion 8 and the first wiring portion 6 in the coil component 1B, the contact surface 21 between the pillar portion 8 and the first wiring portion 6 is defined by the defining portion 22, so that the contact area between the pillar portion 8 and the first wiring portion 6 is kept constant. Therefore, even if a misalignment occurs between the pillar portion 8 and the first wiring portion 6 in the coil component 1B, the characteristics are not affected. As a result, the coil component 1B can suppress the occurrence of characteristic variations.
[0067] 11 , in the coil device 1C, a defining portion 23 is provided between the pillar portion 8 and the first wiring portion 6. The defining portion 23 defines a contact surface 21 between the pillar portion 8 and the first wiring portion 6. The defining portion 23 defines the size of the contact area of the contact surface 21 between the pillar portion 8 and the first wiring portion 6. The defining portion 23 is formed by a part of the element body 2.
[0068] The defining portion 23 is disposed at an edge 8E of the pillar portion 8 when viewed from the second direction D2 (stacking direction). The edge 8E of the pillar portion 8 is a concept including a portion that is a predetermined distance inward from the side surface of the pillar portion 8. The edge 8E of the pillar portion 8 is formed by a curved surface that connects the side surface of the pillar portion 8 and the contact surface 21. The defining portion 23 is disposed at a position corresponding to the curved surface when viewed from the second direction D2.
[0069] In the coil component 1C, a defining portion 23 is provided between the pillar portion 8 and the first wiring portion 6 to define a contact surface 21 between the pillar portion 8 and the first wiring portion 6. The defining portion 23 is formed of a part of the element body 2, and is disposed at an edge portion 8E of the pillar portion 8 when viewed from the second direction D2. As a result, even if a lamination misalignment occurs between the pillar portion 8 and the first wiring portion 6 in the coil component 1C, the contact surface 21 between the pillar portion 8 and the first wiring portion 6 is defined by the defining portion 23, so that the contact area between the pillar portion 8 and the first wiring portion 6 is kept constant. Therefore, in the coil component 1C, even if a misalignment occurs between the pillar portion 8 and the first wiring portion 6, the characteristics are not affected. As a result, in the coil component 1B, the occurrence of characteristic variations can be suppressed.
[0070] In the above modified example, an example has been described in which defining portions 22, 23 are provided between the pillar portion 8 and the first wiring portion 6, but defining portions may also be provided between the pillar portion 8 and the second wiring portion 7.
[0071] In the above embodiment, the first terminal electrode 3 and the second terminal electrode 4 do not protrude beyond the main surface 2d. That is, the first terminal electrode 3 and the second terminal electrode 4 have their respective surfaces flush with the main surface 2d. However, the first terminal electrode 3 and the second terminal electrode 4 may protrude beyond the main surface 2d. [Explanation of symbols]
[0072] 1, 1A, 1B, 1C... coil component (electronic component), 2... element body, 6... first wiring portion (second conductor), 8... pillar portion (conductor, first conductor), 8E, 12E... edge portion, 12, 12A, 12B... pillar member (conductor member), 13... contact surface, 14, 20, 22, 23... defining portion, 21... contact surface.
Claims
1. An element body formed by laminating a plurality of insulating layers; a conductor disposed within the element body and extending in a stacking direction of the plurality of insulator layers; the conductor has a plurality of conductor members stacked in the stacking direction, a defining portion defining a contact surface between the two conductor members is provided between the two conductor members in the stacking direction, An electronic component, wherein the defining portion is formed of a material different from the conductors and is disposed on the edges of the two conductor members when viewed from the stacking direction.
2. The conductor is made of Cu, The electronic component according to claim 1 , wherein the defining portion is made of an inorganic material other than Cu.
3. The electronic component according to claim 1 , wherein a shape of the contact surface defined by the defining portion is similar to an outer shape of the conductor when viewed in the stacking direction.
4. The electronic component according to claim 1 , wherein the defining portion is made of the same material as the element body.
5. the edge portion of one of the two conductor members is formed by a curved surface connecting a side surface of the one conductor member and the contact surface, The electronic component according to claim 4 , wherein the defining portion is disposed at a position corresponding to the curved surface when viewed from the stacking direction.
6. An element body formed by laminating a plurality of insulating layers; a first conductor disposed within the element body and extending in a stacking direction of the plurality of insulator layers; a second conductor connected to the first conductor; a defining portion defining a contact surface between the first conductor and the second conductor is provided between the first conductor and the second conductor, An electronic component, wherein the defining portion is formed of a material different from the first conductors and the second conductors, and is positioned on an edge of the first conductors when viewed from the stacking direction.
7. the first conductor and the second conductor are formed of Cu, The electronic component according to claim 6 , wherein the defining portion is made of an inorganic material other than Cu.
8. The electronic component according to claim 6 , wherein a shape of the contact surface defined by the defining portion, as viewed from the stacking direction, is similar to an outer shape of the first conductor.
9. The electronic component according to claim 6 , wherein the defining portion is made of the same material as the element body.
Citation Information
Patent Citations
Substrate with built-in coil and method for producing same
WO2016132911A1