Automated handling of edge rings that require rotational alignment

Abstract

To provide a ring storage station to allow replacement of consumable parts in a cluster tool assembly in a fast and efficient manner without exposing a substrate processing system to atmospheric conditions.SOLUTION: A ring storage station 108b includes a housing including a base plate 1134a and a rotating plate 1134b disposed on the base plate. An end effector opening is disposed on a first side of the housing and a service window opening is disposed on a second side of the housing. A plurality of finger support structures 160a to 160d connected to the rotating plate includes support posts and support fingers disposed thereon. At least two of the set of support posts have support fingers 163 with pins 161 for radially aligning the consumable parts when the consumable parts are disposed in the ring storage station.SELECTED DRAWING: Figure 3D

Description

[Technical field]

[0001] The present embodiment relates to a cluster tool assembly used in manufacturing semiconductor wafers, and more particularly to a ring storage station for pre-aligning consumable parts within a cluster tool assembly prior to delivery to a process module. [Background technology]

[0002] [Details of related technical fields] A typical cluster tool assembly used in processing semiconductor wafers includes a wafer storage box, such as a Front Opening Unified Pod (FOUP), used to deliver and store substrates, an Equipment Front End Module (EFEM) that interfaces between the FOUP and a load lock chamber, such as an airlock, and one or more process modules that are coupled to the load lock chamber. Each process module is used to perform a particular fabrication operation, such as cleaning, deposition, etching, rinsing, drying, etc. The chemicals and / or processing conditions used to perform these operations may cause wear to some of the hardware components of the process module that are continuously exposed to harsh conditions within the process module. The worn hardware components may generate harsh chemicals or impurities within the process module that must be periodically replaced to prevent them from depositing or wearing away on underlying hardware components within the process module during processing of semiconductor wafers. The hardware components may be, for example, an edge ring that is positioned adjacent to the semiconductor wafer within the process module. During an etching operation, the edge ring may wear away from continued exposure to ion bombardment from a plasma generated within the process module. Worn edge rings must be replaced so that run-to-run repeatability of the process and functionality of the underlying hardware components, such as the chuck, are not compromised.

[0003] It is within this context that embodiments of the present invention have been developed. Summary of the Invention

[0004] An embodiment of the present invention defines a ring storage station that is coupleable to a substrate processing system and designed to remove and replace worn or used hardware components, such as edge rings, of process modules disposed within the substrate processing system without the need for vacuum breaking (i.e., exposing the substrate processing system to atmospheric conditions). Herein, the substrate processing system is also referred to as a cluster tool assembly. Herein, the replaceable worn or used hardware components are also referred to as consumable parts. The substrate processing system includes one or more process modules, each configured to perform semiconductor wafer processing operations. When the consumable parts are exposed to the chemicals and process conditions therein, the consumable parts wear out, become used, or are consumed, and need to be replaced in a timely manner. The used consumable parts can be replaced without opening the substrate processing system by replacing them with new parts stored in the ring storage station that are attachable to the substrate processing system. The ring storage station includes a parts buffer with compartments used to store new consumable parts and / or removed used consumable parts. To allow replacement of consumable parts in a controlled environment, the components of the substrate processing system, including the ring storage station and various modules and process module(s), are coupled to a controller that allows regulating access between the ring storage station and the process module(s) while maintaining the process module(s) under vacuum conditions.

[0005] To provide easy access to used or consumed consumable parts, the process modules of the substrate processing system are designed to include a lift pin mechanism. The lift pin mechanism is configured to allow the consumable part to be moved from a set position to a replacement position when engaged, and a robot end effector available in the substrate processing system may be used to access and remove the elevated consumable part from the process module. A replacement consumable part (i.e., a new consumable part) is removed from the ring storage station and delivered to the process module, which uses the lift pin mechanism to receive the new consumable part and lower the consumable part into position within the process module.

[0006] The design of the ring storage station and the substrate processing system eliminates the need to open the substrate processing system to atmospheric conditions to access used consumable parts. For example, the substrate processing system may include an equipment front-end module (EFEM) maintained at atmospheric conditions. A first side of the EFEM may be coupled to one or more substrate storage stations (e.g., FOUPs) for transferring substrates to and from the substrate processing system. In addition to the substrate storage stations, one or more ring storage stations may be coupled to a second or third side of the EFEM. A vacuum transfer module may be coupled to the third side of the EFEM via one or more load lock chambers (also referred to herein as air locks). One or more process modules may be coupled to the vacuum transfer module.

[0007] A robot in the EFEM may be used to transfer the consumable parts between the ring storage station and the airlock. In such an embodiment, the airlock acts as an interface by allowing the consumable parts to be received from the EFEM while the airlock is maintained at atmospheric conditions. After receiving the consumable parts, the airlock is pumped to a vacuum and the robot in the vacuum transport module is used to move the consumable parts to the process module. The robot in the vacuum transport module is used to move the consumable parts into the process module. A lift pin mechanism in the process module provides access to the consumable parts by raising and lowering them, allowing replacement of the consumable parts under vacuum conditions to be performed by the robot in the vacuum transport module.

[0008] The robot in the vacuum transfer module in combination with the lift pin mechanism in the process module allows for precise feeding and unloading of the consumable parts, which eliminates the risk of damaging some hardware components in the process module during the replacement of the consumable parts. Since the consumable parts are moved into the process module in a controlled manner, the time required to recondition the process module to make it ready for operation after replacing the used consumable parts is significantly reduced.

[0009] In one embodiment, a ring storage station used to supply consumable parts to a substrate processing system is disclosed. The ring storage station includes a housing. The housing of the ring storage station includes a base plate and a rotating plate disposed on the base plate. An end effector access opening is disposed on a first side of the housing. A service window opening is disposed on a second side of the housing. A set of finger support structures is connected to the rotating plate within the housing. Each of the set of finger support structures includes a support post and a support finger defined thereon. At least two of the set of finger support structures include support fingers with an index pin. The index pin is configured to provide rotational alignment for the consumable part when the consumable part is disposed in the ring storage station.

[0010] In another embodiment, a ring storage station for use in supplying consumable parts to a substrate processing system is disclosed. The ring storage station includes a housing. The housing includes a base plate, an end effector access opening disposed on a first side of the housing, a service window opening disposed on a second side of the housing, and a set of finger support structures including support fingers disposed on corresponding support posts. The set of finger support structures is connected to the base plate within the housing. At least one of the finger support structures is an adjustable finger support structure. In yet another embodiment, a ring storage station for supplying consumable parts to a substrate processing system is disclosed. The ring storage station includes a base plate, a first opening disposed on a first side of the ring storage station, a second opening disposed on a second side of the ring storage station, and a set of finger support structures defined on the base plate. Each of the finger support structures includes a support post and a support finger extending from the support post toward a center of the ring storage station. At least two of the finger support structures have support fingers with index pins. The index pins are configured to provide rotational alignment for the consumable parts when the consumable parts are placed in the ring storage station. A carrier plate housing is defined on the base plate. The carrier plate housing is configured to receive a carrier plate used in transporting the consumable parts to and from the ring storage station.

[0011] In another embodiment, the loading of new and / or used consumable parts into a fixed ring storage station that can be attached to the EFEM may be done via a movable FOUP at the front end. This embodiment would allow for automated loading and unloading of consumable parts.

[0012] Other aspects of the present invention will become apparent from the following detailed description, taken in conjunction with the accompanying drawings, illustrating by way of example the principles of the invention. [Brief description of the drawings]

[0013] The invention may be best understood by referring to the following description taken in conjunction with the accompanying drawing figures.

[0014] [Figure 1] FIG. 1 illustrates a simplified block diagram of a substrate processing system that identifies alternative locations to which a ring storage station can be docked, in one embodiment of the present invention.

[0015] [Figure 1A]FIG. 1A illustrates a side view of a substrate processing system including, in one embodiment, a ring storage station disposed on a second side of an equipment front end module of the substrate processing system above a substrate storage station.

[0016] [Figure 2A] FIG. 2A illustrates, in one embodiment, a simplified block diagram of a consumable part, such as an edge ring, that requires replacement, used in one or more process modules of a substrate processing system.

[0017] [Figure 2B] FIG. 2B is an enlarged view of a portion of the bottom surface of a consumable part in one embodiment, detailing a groove defined thereon that is used to pre-align the consumable part prior to delivery to a process module.

[0018] [Figure 2C] FIG. 2C shows a close-up view of a groove defined in the bottom surface of the consumable part, in one embodiment.

[0019] [Figure 2D] FIG. 2D shows a close-up view of a groove defined in the bottom surface of the consumable part in an alternative embodiment.

[0020] [Figure 3A] FIG. 3A shows a perspective view of a ring storage station configured in one embodiment to be coupled to a second side of an equipment front end module (EFEM) with one or more substrate storage stations coupled to a first side of the EFEM and one or more airlocks coupled to a third side of the EFEM.

[0021] [Figure 3B]FIG. 3B is a perspective view of a ring storage station configured to be coupled to a third side of an equipment front end module (EFEM) above an airlock in an alternative embodiment, the third side facing a first side where one or more substrate storage stations are coupled to a first side of the EFEM.

[0022] [Figure 3C] FIG. 3C shows a top perspective view of various components of a ring storage station that, in some embodiments, is coupled to the upper third side of the airlock. [Figure 3D] FIG. 3D shows a top perspective view of various components of a ring storage station that, in some embodiments, is coupled to the upper third side of the airlock.

[0023] [Figure 3E] FIG. 3E shows an enlarged view of a portion of a support finger that includes an index pin that, in one embodiment, engages with a groove defined in the underside of a consumable part received in a ring storage station.

[0024] [Figure 3F] FIG. 3F shows an enlarged perspective view of a finger support structure defined in a ring storage station in one embodiment. [Figure 3G] FIG. 3G shows an enlarged perspective view of a finger support structure defined in a ring storage station in one embodiment. [Figure 3H] FIG. 3H shows an enlarged perspective view of a finger support structure defined in a ring storage station in one embodiment. [Figure 3I] FIG. 3I shows an enlarged perspective view of a finger support structure defined in a ring storage station in one embodiment.

[0025] [Figure 4A] FIG. 4A shows a view of an interior section of a ring storage station as seen through a window that is configured to be coupled to a side of an EFEM, in one embodiment.

[0026] [Figure 4B] FIG. 4B shows a view of an interior section of a ring storage station as viewed through a service window defined in the second side, in one embodiment.

[0027] [Figure 5A] FIG. 5A shows a top view of an airlock through which, in one embodiment, the end effector of the robot of the first embodiment of the vacuum transport module delivers used consumable parts and through which a carrier plate used by the robot of the EFEM removes used consumable parts.

[0028] [Figure 5B] FIG. 5B shows a top view of an airlock where, in an alternative embodiment, the robot of the second embodiment of the vacuum transport module delivers used consumable parts and where a ring carrier used by the robot of the EFEM removes used consumable parts.

[0029] [Figure 5C] FIG. 5C illustrates a top view of a ring storage station showing a carrier plate that supplies consumable parts to compartments within the ring storage station in one embodiment.

[0030] [Figure 5D] FIG. 5D illustrates a top view of a process module showing the robotic end effector of the vacuum transport module used to deliver consumable parts in one embodiment.

[0031] [Figure 6A] FIG. 6A shows, in some embodiments, the amount of adjustment of a rotating plate of a base plate structure in a ring storage station performed during a pre-alignment operation in a ring storage station used in a substrate processing system including a first embodiment of a vacuum transport module. [Figure 6B]FIG. 6B shows, in some embodiments, the amount of adjustment of the rotating plate of the base plate structure in the ring storage station performed during a pre-alignment operation in the ring storage station used in a substrate processing system including a first embodiment of a vacuum transport module. [Figure 6C] FIG. 6C shows, in some embodiments, the amount of adjustment of the rotating plate of the base plate structure in the ring storage station performed during a pre-alignment operation in the ring storage station used in a substrate processing system including a first embodiment of a vacuum transport module.

[0032] [Figure 6D] FIG. 6D illustrates the amount of baseplate adjustment that may be performed during a pre-alignment operation in a ring storage station used in a substrate processing system including the second embodiment of a vacuum transfer module, in some embodiments. [Figure 6E] FIG. 6E illustrates the amount of substrate adjustment that may be performed during a pre-alignment operation in a ring storage station used in a substrate processing system including the second embodiment of a vacuum transfer module, in some embodiments. [Figure 6F] FIG. 6F illustrates the amount of substrate adjustment that may be performed during a pre-alignment operation in a ring storage station used in a substrate processing system including the second embodiment of a vacuum transfer module, in some embodiments.

[0033] [Figure 7] FIG. 7 illustrates a control module (ie, controller) for controlling various aspects of a substrate processing system, according to one embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0034] An embodiment of the present disclosure defines a ring storage station coupled to a substrate processing system (i.e., substrate processing system) used to process semiconductor substrates. The substrate processing system includes multiple modules such as an equipment front-end module (EFEM), a vacuum transfer module (VTM), one or more load lock chambers disposed between the EFEM and the VTM, and one or more process modules used to perform process operations on the semiconductor substrates. The process modules and the one or more load lock chambers are distributed symmetrically around the VTM. Some of the process operations that can be performed in the different process modules include cleaning operations, deposition, etching operations, rinsing operations, drying operations, and the like. The wafer storage station is mounted to a load port defined on a first side of the EFEM and is used to provide substrates for processing. The ring storage station is mounted to a side of the EFEM and is used to supply consumable parts (e.g., edge rings) to the substrate processing system for replacement in the process modules. A dedicated robot in the substrate processing system is used to retrieve used consumable parts from the process modules and replace them with new consumable parts retrieved from the ring storage station. Consumable parts are replaced within the process module in a controlled manner to avoid any risk of contamination to the process module or components of the substrate processing system.

[0035] In conventional substrate processing system designs, it was necessary to open the substrate processing system to access and replace consumable parts, such as edge rings, in the process modules. Opening the substrate processing system required taking the substrate processing system offline and cleaning the substrate processing system to atmospheric conditions to allow access to the process modules. Once the substrate processing system was opened, trained technicians manually removed and replaced the consumable parts from the process modules. After the consumable parts were replaced, the substrate processing system had to be tuned up so that it could process semiconductor substrates. Because semiconductor substrates are valuable products, great care was required when tuning the substrate processing system. Tuning required cleaning the substrate processing equipment, pumping the substrate processing system to a vacuum, tuning the substrate processing system, and using test runs to meet the requirements of the substrate processing system. Each of these steps requires significant time and effort. In addition to the time required for all steps to tune the substrate processing system, further delays can occur when problems occur during one or more steps during tuning of the substrate processing system.

[0036] Some of the problems that typically occur during the adjustment of a substrate processing system may include misalignment of consumable parts during replacement, damage to new consumable parts when replacing used consumable parts, damage to other hardware components in the process module during removal or replacement of consumable parts, failure of the substrate processing system to obtain vacuum after pumping, substrate processing system not achieving process performance, etc. Depending on the severity of each problem, additional time and effort may be required and may cause delays in bringing the substrate processing system online, directly impacting the manufacturer's profit margins. When the consumable parts are delivered to the process module, they are designed to be pre-aligned in the ring storage station to engage with the lift pins of the lift pin mechanism employed in the process module. The design of the consumable parts and the design of the ring storage station ensure that the robot of the substrate processing system and the lift pin mechanism employed in the process module can replace the consumable parts without damaging the consumable parts or the process module or any components of the substrate processing system. The back side of the consumable parts is provided with a groove, which is used to align with the index pins provided on the finger support in the ring storage station when the consumable parts are loaded into the ring storage station. The base plate structure of the ring storage station is used to provide rotational alignment of the finger support structure of the ring storage station to the groove of the edge ring.

[0037] Grooves on the backside of the consumable part define an "anti-walk" feature that, when engaged by the lift pins, helps to keep the consumable part in place, thereby preventing the consumable part from "walking" or sliding. Pre-alignment of the consumable part using this groove feature and the use of a robot ensures that the edge ring is precisely aligned and delivered so that the edge ring replacement can be performed in a timely manner in a controlled environment. Timely replacement of the consumable part in a controlled environment reduces the time required to adjust the substrate processing system, thereby improving the quality and yield of semiconductor components defined on the semiconductor substrate.

[0038] In one embodiment, the ring storage station is mounted to the side of an Equipment Front End Module (EFEM) of the substrate processing system. A robot of the EFEM is used in conjunction with one or more robots of the substrate processing system to access and replace the consumable parts from the process modules. In other embodiments, the ring storage station is also designed to be mounted to a different module of the substrate processing system, allowing replacement of consumable parts without having to open the substrate processing system to atmospheric conditions to access the consumable parts.

[0039] For example, the ring storage station may be mounted directly to a vacuum transfer module (VTM) within the substrate processing system. The mounting of the ring storage station ensures that the symmetry of the VTM is maintained. The robot of the VTM used to transfer semiconductor substrates to and from the process modules may be used to retrieve and replace consumable parts located in one or more process modules.

[0040] In another example, the ring storage station may be attached directly to a process module of a substrate processing system that requires replacement of a consumable part, In such an embodiment, the ring storage station may include a robot that is used to retrieve and replace the consumable part from the process module.

[0041] By mounting the ring storage station on the substrate processing system and accessing the consumable parts through the ring storage station, the time and effort required to maintain the substrate processing system can be significantly reduced. The consumable parts are replaced using a robot available in the substrate processing system and a lift pin mechanism available in the process module, minimizing the risk of damage to the consumable parts, the process module, and / or the substrate processing system. The replacement of the consumable parts is performed in a controlled environment, which does not expose the inside of the substrate processing system to the outside atmosphere, minimizing the risk of contamination. The lift pin mechanism in the process module allows for more accurate alignment of the consumable parts in the process module. As a result, the time required to adjust the substrate processing system is significantly reduced. The timely replacement of the consumable parts improves the quality and yield of the semiconductor components defined on the semiconductor wafers.

[0042] A general understanding of embodiments of the present invention as well as details of specific embodiments are described with reference to the various figures.

[0043] FIG. 1 illustrates a simplified schematic diagram of a sample substrate processing system 100 that, in one exemplary embodiment, is used to process semiconductor substrates to which a ring storage station 108 can be bonded. The substrate processing system 100 includes multiple modules such that semiconductor substrates can be processed in a controlled environment. For example, the illustrated substrate processing system 100 includes an equipment front-end module (EFEM) 102, a general vacuum transfer module (VTM) 104, and one or more facets defined around the VTM 104 for integration with one or more process modules (e.g., 112). The facets are defined to provide symmetry to the VTM 104. One or more load ports 101a-101c are defined on a first side 102a of the EFEM 102, on which substrate storage stations (e.g., Front Opening Unified Pods, or FOUPs) 115 are received. The EFEM 102 operates under ambient (ie, atmospheric) conditions and is capable of transferring semiconductor substrates from the substrate storage station 115 to the integrated substrate processing system 100 for processing and returning the semiconductor substrates after processing.

[0044] The VTM 104 and process modules are operated under vacuum to minimize exposure of the semiconductor substrate surface to the atmosphere as the semiconductor substrate moves from one process module to another during processing. Because the VTM 104 is operating under vacuum and the EFEM 102 is operating at atmospheric conditions, one or more load lock chambers 110 are coupled between the EFEM 102 and the VTM 104 to provide a controlled interface for transporting semiconductor substrates from a substrate storage station 115, through the EFEM 102, and to the VTM 104. In FIG. 1, a right load lock chamber 110R and a left load lock chamber 110L are shown disposed between the EFEM 102 and the VTM 104.

[0045] In one embodiment, the ring storage station 108a is coupled to a second side 102b of the EFEM 102 (i.e., the position of option 1 shown in FIG. 1 ) and one or more load lock chambers 110A are coupled to a third side 102c opposite the first side 101a of the EFEM 102. The ring storage station 108a includes a part buffer having multiple horizontally stacked compartments or slots for holding consumable parts such as edge rings. In one embodiment, the ring storage station 108a coupled to the second side of the EFEM 102 may be located on top of a wafer storage station 115′ (not shown) coupled to the second side of the EFEM 102.

[0046] FIG. 1A illustrates one embodiment in which a ring storage station 108 a is coupled to the EFEM 102 above a wafer storage station 115 ′ defined on a second side of the EFEM 102 .

[0047] Returning to FIG. 1, in an alternative embodiment, the ring storage station 108b may be defined on a third side (i.e., the location of option 2 shown in FIG. 1) to which one or more load lock chambers 110 are coupled. In this embodiment, the ring storage station 108b may be located above a load lock chamber 110 (either 110L or 110R). It should be noted that the side and location at which the ring storage station is coupled to the EFEM are presented as examples, and other sides and locations may be considered as long as the design of the EFEM allows for such coupling.

[0048] The EFEM 102 includes a robot 103 for moving semiconductor substrates from the substrate storage station 115 to the load lock chamber 110. The robot 103 is a dry robot because the EFEM 102 is maintained at atmospheric conditions. The same robot 103 of the EFEM 102 used to move substrates may also be used to move consumable parts from the ring storage station (either 108a or 108b) to the load lock chamber 110.

[0049] In one implementation, to control the induced rotation, movement of consumable parts between the ring storage station and the VTM 104 may be limited to passing through one load lock chamber 110. In the exemplary embodiment shown in FIG. 1, the right load lock chamber 110R is used to move the edge ring 200 between the ring storage station 108 (i.e., the ring storage station 108a defined on a second side above the substrate storage station 115′ or the ring storage station 108b defined on a third side above the left load lock chamber 110L or both ring storage stations 108a, 108b) and the VTM 104, for example, to feed the process module 112. The decision of which airlock 110 (i.e., either the right airlock 110R or the left airlock 110L) to use may depend on the design of the VTM 102 used in the substrate processing system, the angle at which the edge ring is deposited in each of the process modules, the airlock 110, and the ring storage station. The design of the VTM 102 may depend on the number of process modules integrated with the VTM 102 in addition to the airlocks (110R, 110L).

[0050] A separate robot 105 located within the VTM 104 is used to retrieve semiconductor substrates from the load lock chamber 110 and transfer them to and from the process modules (e.g., 112). In some embodiments, due to its location, the load lock chamber is also referred to as an "interfacing chamber" or "airlock." The airlock(s) 110 may be selectively maintained at ambient or vacuum conditions. For example, the airlock 110 is maintained at ambient conditions when substrates are moving between the substrate storage station 115 and the airlock 110 via the EFEM 102, and the airlock 110 is maintained at vacuum conditions when wafers are moving between the airlock 110 and the VTM 104. A similar process may be used where the robot 103 of the EFEM 102 is used when moving consumable parts between the ring storage station 108a or 108b and the airlock 110, and the robot 105 of the VTM 104 is used when transferring consumable parts between the airlock 110 and the process module 112.

[0051] In an alternative embodiment, the left airlock 110L may be used to move the edge ring 200 between the ring storage station 108 and the VTM 104. In this alternative embodiment, the ring storage station 108 may be defined on a second side of the EFEM 102, either on its own or on top of the substrate storage station 115', or on a third side of the EFEM 102 above the right airlock 110R (i.e., the airlock 110 opposite the airlock 110 used to move the edge ring). In a different embodiment, the ring storage station 108b may be located on the third side of the EFEM 102, for example, above the left airlock 110L, and the robot 103 of the EFEM 102 may be used to move the edge ring 200 from the ring storage station and deposit it in the left airlock 110L located below the ring storage station 108b. Alternatively, the ring storage station 108b may be located above the right airlock 110R, and the robot 103 of the EFEM 102 may be used to move the edge ring 200 from the ring storage station 108b to the right airlock 110R below the ring storage station 108b. The airlock (i.e., either the right or left airlock) 110 selected to move the consumable parts may depend on the design of the VTM and the angle at which the consumable parts are deposited into the airlock by the robot of the VTM 104 and the angle at which the consumable parts are deposited into the ring storage station by the robot of the EFEM 102. The design of the VTM 104 may depend on the number of facets defined in the VTM 104 for integrating the process modules. In the embodiment shown in FIG. 1, the VTM 104 is designed to include six facets, with four facets used to receive the four process modules and a fifth and sixth facet used to receive the airlock 110. Other designs of VTM 104 that can be used for the substrate processing system may include five, six or more facets, or fewer than four facets for connecting with the process modules, in addition to the two facets for coupling the airlock.The ring storage station is configured to receive and store consumable parts, such as edge rings, used in the process modules.

[0052] In a process module, the edge ring is positioned adjacent to the outer edge of the substrate when the substrate is received in the process module, and is also referred to as a "top ring" because the edge ring is positioned in the process module such that the top surface of the edge ring is flush with the top surface of the substrate.

[0053] The facets of the VTM 104 are defined such that the process modules 112-120 and the airlock 110 are symmetrically arranged around the periphery of the VTM 104. In some embodiments, the process modules 112-120 distributed symmetrically around the periphery of the VTM 104 are used to perform different process operations. Some of the process operations that can be performed using the process modules 112-120 include etching operations, rinsing, cleaning, drying operations, plasma operations, deposition operations, plating operations, and the like. As an example, the process module 112 may be used to perform a deposition operation, the process module 114 may be used to perform a cleaning operation, the process module 116 may be used to perform a second deposition operation, the process module 118 may be used to perform an etching operation or a stripping operation, and the like. The VTM 104 with its controlled environment allows the semiconductor substrate to be transferred to and from the process modules 112-120 without risk of contamination, and the robots within the VTM 104 assist in the transfer of the semiconductor substrate to and from the various process modules 112-120 integrated with the VTM 104.

[0054] Additionally, replacement of the consumable parts is performed in a controlled environment within the integrated substrate processing system that minimizes exposure of the substrate surface to the ambient atmosphere, minimizing the time required to condition the substrate processing system after replacement of the consumable parts in order to begin substrate processing, and ensuring that the processing environment is not contaminated during replacement of the consumable parts.

[0055] When the ring storage station is coupled to the second side of the EFEM or to the third side where an airlock is defined, an isolation valve or shutter may be provided to couple between the ring storage station and the EFEM 102. The isolation valve / shutter is used to isolate the ring storage station. Isolation of the ring storage station may be useful during loading of consumable parts into the ring storage station. Additional isolation valve(s) or gate 216 may be provided to couple between the process module and the VTM 104. Coordinated operation of the isolation valve, shutter(s) and gate(s) (if any) provides controlled access to the process module and the ring storage station.

[0056] The ring storage station is a removable modular unit designed to be temporarily attached to the EFEM 102 of a substrate processing system to complete the necessary operation of replacing a consumable part, such as an edge ring. After replacing the consumable part in the process module, the ring storage station may be removed and stored until a consumable part needs to be replaced in the same process module 112 or a different process module 114-120. Alternatively, the ring storage station may be permanently attached to the side of the EFEM and may be isolated from the rest of the substrate processing system by actuating a shutter or isolation valve that separates the ring storage station from the EFEM.

[0057] The ring storage station includes a parts buffer with multiple compartments for receiving and holding consumable parts. A separate set of compartments may be defined within the ring storage station for storing used consumable parts removed from a process module and new consumable parts to be supplied to the process module. In one embodiment, the size of the opening of the ring storage station and the isolation valves, shutters defined in one or each of the modules (e.g., EFEM, airlock, or process module) are designed to allow the movement of consumable parts between the ring storage station and the process module.

[0058] In the process modules, the consumable parts must be carefully monitored and replaced when necessary due to their close proximity to the semiconductor substrate and continuous exposure to the harsh process conditions used during processing of the semiconductor substrate. The consumable parts used in the process modules are replaceable components. In addition to being replaceable components, the height of the consumable parts (i.e., edge ring) can be adjusted by lifting them up or down to adjust the plasma at the wafer edge.

[0059] For example, in an etch process module, an edge ring is positioned adjacent to a semiconductor substrate mounted on a chuck assembly to extend the process region of the semiconductor substrate. During an etch operation, the edge ring is exposed to ion bombardment from a plasma used to form features on the surface of the semiconductor substrate. For example, during an etch operation, ions from the plasma impact the surface of the semiconductor substrate at an angle perpendicular to a plasma sheath formed in a process region defined above the semiconductor substrate received by the process module. Over time, continued exposure to the plasma results in wear of the top surface of the edge ring. As the layer of the edge ring wears away from the ion bombardment, the edge of the semiconductor substrate is exposed, causing the plasma sheath to roll along the contour of the edge of the semiconductor substrate. As a result, ions impacting the semiconductor substrate surface move along the contour of the plasma sheath, thereby creating a tilt mechanism toward the edge of the semiconductor substrate surface. These tilt mechanisms affect the overall yield of semiconductor components formed on the semiconductor substrate.

[0060] To improve yield, reduce edge exclusion, and avoid compromising the functionality of any underlying components, the edge ring is adjusted by moving it up so that the top surface of the edge ring is flush with the top surface of the substrate when the substrate is received for processing. The amount of edge ring adjustment is based on the thickness of the edge ring and the amount of wear on the top surface of the edge ring. When the edge ring height adjustment exceeds a threshold value, the edge ring may be replaced. A lift pin mechanism (not shown) in the process module 118 provides access to the consumable parts in the process module so that the edge ring can be removed and replaced.

[0061] After removing the used edge ring from the process module, a robot 103 on the EFEM 102 is used to transfer a new edge ring from the ring storage station to the airlock 110, and a dedicated robot 105 on the VTM 104 is used to transfer the new edge ring from the airlock 110 to the process module. Although some embodiments are described herein with reference to the ring storage station being coupled to a particular side(s) and / or location on the EFEM 102, the teachings are extendable to other embodiments in which the ring storage station is coupled to a different side and / or location on the EFEM 102. Additionally, the ring storage station 108a or 108b used to store the used edge ring may be different than the ring storage station used to store the new edge ring.

[0062] Access to the ring storage station and process modules is selectively enabled by coordinating the operation of different isolation valves and / or gates, shutter(s) located between the different modules and between the EFEM and the ring storage station. For example, in one embodiment, the isolation valves and / or gates located between the EFEM and the ring storage station and between the VTM 104 and one or more of the process modules 112-120, the robots of the EFEM 102 and VTM 104, and the lift pin mechanisms of one or more of the process modules may all be operatively connected to a controller 122. The controller 122 may be part of a computer or may provide inputs and be communicatively connected to a computer 124 that can be used to coordinate the operation of the isolation valves and / or gates, airlocks, certain of the robots 103, 105 of the EFEM and VTM, and the lift pin mechanisms of the process modules during removal and replacement of consumable parts.

[0063] An isolation valve or shutter defined between the ring storage station and the EFEM 102 may be used to isolate the ring storage station so that a consumable part can be placed on the ring storage station without affecting the processing of substrates in the substrate processing system. Similarly, a second isolation valve defined between the VTM 104 of the substrate processing system 100 and a process module (e.g., 112) in which a consumable part needs to be replaced may be used to isolate the process module 112 from the rest of the substrate processing system 100 so that replacement of the consumable part can be easily performed in the process module without affecting the operation of the other process modules of the substrate processing system 100. By providing a second isolation valve, it may be possible to take only the specific process module (112) offline, rather than the entire substrate processing system 100, while the remaining process modules (114-120) in the substrate processing system 100 may continue to process semiconductor substrates. Furthermore, because only the specific process module (e.g., 112) is taken offline for replacement of the consumable part(s), the time it takes to restore the process module (112) and the substrate processing system 100 to a fully operational state may be significantly reduced. As a result, adjustments and proper operation of the substrate processing system 100 take much less time.

[0064] In some implementations, when a consumable part, such as an edge ring, needs to be replaced in more than one process module, the operation of the robots and corresponding isolation valves may be coordinated within the substrate processing system 100 to allow the consumable part to be replaced sequentially in the different process modules. In such an embodiment, the selective isolation of the ring storage station and the process module(s) can significantly reduce the time it takes to replace the consumable part in multiple modules, thereby allowing substrate processing operations to continue in the remaining modules.

[0065] In one embodiment, a compartment in the part buffer of the ring storage station is used to store new and used edge rings together. Alternatively, in a second embodiment, the part buffer of the ring storage station may include two different holding areas, with a first holding area configured to hold used edge rings and a second holding area for holding new edge rings. In this embodiment, the area for storing new edge rings may be separated from the area for storing used edge rings using a separator plate. When an edge ring needs to be replaced in a process module of the substrate processing system, an appropriate ring storage station may be coupled to the EFEM based on how the ring storage station is configured.

[0066] Additionally, the ring storage station is used to pre-align the edge ring 200 before the robot 103 of the EFEM 102 moves the edge ring 200 to the airlock 110. Pre-aligning the edge ring ensures that when the edge ring 200 is delivered to a process module, the edge ring is aligned within the "capture range" of the lift pins of a lift pin mechanism employed with the process module 112. To aid in pre-aligning the edge ring 200, the edge ring 200 may include a groove defined in its underside.

[0067] 2A-2D show the geometry of different embodiments of an edge ring 200 used in a process module of a substrate processing system that may need to be replaced in some embodiments. The edge rings shown in FIGS. 2A-2D are adjustable and replaceable edge rings. FIG. 2A shows a top view of the bottom surface of a first embodiment of an edge ring 200. The first embodiment of the edge ring 200 shown in FIG. 2A includes a bottom inner surface 204a, a bottom outer surface 204b, and a channel 206 defined between the bottom inner surface 204a and the bottom outer surface 204b. A set of three grooves 210 are defined in the bottom outer surface 204b such that the grooves are equidistant from one another (e.g., 120 degrees apart) and adjacent to the channel 206. An open end of each groove 210 opens into the channel 206, and a tip of the groove is defined proximate to the circumference of the edge ring.

[0068] 2B illustrates a close-up view of a portion of the bottom surface of the first embodiment of edge ring 200 showing different components of grooves 210 formed on edge ring 200. Grooves 210 defined on bottom exterior surface 204b open into channel 206. Grooves 210 define pin contact locations 212 where lift pins of a process module contact the edge ring when the lift pins are engaged. Additionally, the design of grooves 210 may include different shapes, for example, hemispherical, cylindrical (e.g., extending into the page as shown in FIG. 2A, or extending in three directions, etc.).

[0069] FIG. 2C shows a close-up view of a groove formed on the bottom surface of a first embodiment of the edge ring 200. The groove 210 of this embodiment is shown to have sloped sidewalls 210a, 210b that meet at an apex that defines a pin contact location 212, and a radially outer wall 204c is defined adjacent the bottom outer surface 204b. In one embodiment, the sidewalls 210a, 210b are each sloped at an angle between about 30 degrees and about 60 degrees. In an alternative embodiment, the sidewalls 210a, 210b are each sloped at an angle of about 45 degrees. The slope angles of the sidewalls 210a, 210b are presented by way of example and should not be considered limiting. The apex that defines the pin contact location 212 where the sidewalls 210a, 210b meet is shown to be sharp in this embodiment. In one embodiment, the depth of the groove is between about 0.075 inches (about 0.1905 centimeters) and about 0.1 inches (about 0.254 centimeters). In another embodiment, the depth of the groove is about 0.09 inches (about 0.2286 centimeters). In one embodiment, the width of the groove at the open end is between about 0.15 inches (about 0.381 centimeters) and about 0.20 inches (about 0.508 centimeters). In an alternative embodiment, the width of the groove 210 is about 0.180 inches (about 0.4572 centimeters). The groove defines an anti-walking feature to prevent the edge ring from sliding out or "walking" when engaged by the lift pins. Again, the dimensions shown herein are merely by way of example, and such dimensions and associated shapes can be adjusted so long as the anti-walk feature is provided.

[0070] FIG. 2D shows a close-up view of a portion of the bottom surface of a second embodiment of an edge ring 200 used in one or more process modules of a substrate processing system in one embodiment. In this embodiment, the tips of the grooves where the sidewalls meet and where the lift pins contact the grooves (i.e., pin contact locations 212) are rounded. Although the view in FIG. 2D shows sidewalls 210a, 210b perpendicular to the groove, the sidewalls 210a, 210b of the groove 210 are sloped to allow the lift pins to slide to the bottom of the groove and rest at the pin contact locations 212 (not shown). As in the first embodiment, the grooves 210 in the second embodiment of the edge ring are formed on the bottom outer surface 204b and are adjacent to and open into the channel 206. The geometries of the different components of the edge ring are given by way of example only and should not be considered as limiting. Other ranges and dimensions of the various components of the edge ring are also conceivable. Various embodiments of the edge ring define pin contact locations defined on a bottom surface that are used to pre-align the edge ring in a ring storage station in coordination with lift pins of a lift pin mechanism used in the process module prior to delivering the pre-aligned edge ring to the process module.

[0071] 3A-3I show various components of an example ring storage station used to deliver consumable parts to a substrate processing system, in one embodiment. The various components are used to receive, pre-align, and store the edge ring so that it properly interfaces with the lift pins when it is delivered to a process module. Different embodiments of the ring storage station 108 are used based on which side of the EFEM 102 the ring storage station is coupled to.

[0072] FIG. 3A shows a first embodiment of a ring storage station 108a coupled to the second side of the EFEM 102 in one embodiment. In the first embodiment, the ring storage station 108a includes a base plate structure with a front side, a rear side, a first side and a second side parallel to each other. The first side extends between a first end of the front side and the rear side, and the second side extends between a second end of the front side and the rear side. The base plate structure forms a foundation for the ring storage station 108a. A top plate is defined opposite the base plate structure. The ring storage station 108a includes a first opening or window 151 defined on the front side. A first shutter is defined on the front side and provides access to the ring storage station through the first opening 151 for depositing a used edge ring or removing a new edge ring. The front side is configured to be coupled to a second side of the EFEM 102 such that the opening 151 provides the robot of the EFEM 102 with access to the edge rings stored inside the ring storage station 108a. The front side 151 coupled to the EFEM is also referred to as an EFEM port. A second window 152 is defined on a back sidewall formed along a back side of the base plate structure, the back sidewall extending vertically from the base plate structure to the top plate. A second shutter is defined on the back sidewall and provides access to the ring storage station during loading or unloading of the edge rings to or from the ring storage station 108a. A first sidewall is defined along a first side of the base plate structure and extends vertically from the base plate structure to the top plate. A second sidewall is defined on a second side of the base plate structure and extends vertically from the base plate structure to the top plate.

[0073] A plurality of finger support structures 160a-160d are defined on the base plate structure 1134. Each finger support structure includes a support post and a plurality of finger supports defined horizontally along an inner length of a corresponding support post. Each finger support of each finger support post includes a first end attached to the support post and a second end extending toward an inner region of the ring support station 108a. In the embodiment shown in FIG. 3A, the plurality of finger support structures includes a first pair of finger support structures 160a, 160b defined along a first side of the base plate structure such that a first finger support structure 160a of the first pair is adjacent a front side and a second finger support structure 160b of the first pair is adjacent a rear side of the base plate structure. Similarly, a second pair of finger support structures 160c, 160d are defined along a second side of the base plate structure such that a third finger support structure 160c of the second pair is proximate a rear side of the base plate structure and a fourth finger support structure 160d of the second pair is proximate a front side of the base plate structure. The support posts 160a-160d are parallel to one another. The sizes of the support fingers in the first and second pairs of finger support structures are equal.

[0074] Each support finger on the first and fourth finger support structures 160a, 160d includes an index pin (not shown) defined on the top surface and proximate the second end. In one embodiment, the index pin is a raised pin with a defined tip. The index pin is used to engage a corresponding groove defined on the back surface of the edge ring 200 when the edge ring 200 is received in the ring storage station. If the edge ring groove properly aligns with the index pin on the corresponding finger defined on the first and fourth finger support structures 160a, 160d, the edge ring is lowered into position on the top surface of the finger support such that the corresponding index pin engages the edge ring. If the edge ring received in the ring storage station does not properly engage with the index pin, the edge ring is rotated or a portion of the base plate structure is rotated along a horizontal axis so that the edge ring groove properly aligns with the corresponding index pin on the corresponding finger support. The amount of rotation of the base plate structure is determined by calibration using a test run. The height of the index pins is defined to provide sufficient clearance for the edge rings to move into the ring storage station and be supported, respectively, on the support fingers.

[0075] In one embodiment, the support posts are made of an aluminum material. In other embodiments, the support posts are made of anodized aluminum or other corrosion resistant material. In some embodiments, the support fingers are made of aluminum or other lightweight material. The support fingers defined on the second and third support posts may include support pads (not shown) to provide a reliable contact surface for the edge ring when the edge ring is received. In some embodiments, the support pads may be made of a carbon-filled polyetheretherketone (PEEK) material to provide a scratch-free support surface for the edge ring. The materials used for the support posts, support fingers, and support pads are provided by way of example and should not be considered limiting. Other materials may be used as long as they maintain the functionality of the different components of the finger support structure.

[0076] The ring storage station also includes a housing for receiving the carrier plate 1104. In one embodiment, the housing includes a set of carrier supports 1137 defined on an upper surface of the base plate structure and configured to support the carrier plate 1104 received within the housing. The carrier supports 1137 are positioned on the base plate structure according to the shape of the carrier plate 1104 and are designed to hold the carrier plate in place when the carrier plate is received on the carrier supports. For example, when the carrier plate 1104 is triangular in shape, the carrier supports 1137 are positioned along the triangular contour of the carrier plate 1104. In some embodiments, the carrier supports are made of a carbon-filled PEEK material. In other embodiments, the carrier supports 1137 may be made of other materials selected to provide support to the ring carrier 1104 and prevent corrosion and other wear. Alternatively, the carrier supports 1137 may be made of metal and coated with a corrosion-resistant material, such as epoxy, Teflon, etc. The carrier supports are defined on the base plate structure such that the carrier plate is separated from the base plate structure. The height of the carrier supports is determined from the height at which the finger supports are defined along the length of the support posts of the finger support structures. The carrier plate 1104 is used to support the edge ring as it is loaded and unloaded from the ring storage station 108a. The top plate is configured to surround the multiple finger support structures.

[0077] FIG. 3B shows a simplified block diagram of a second embodiment of the ring storage station 108b used in one implementation to couple to the EFEM 102 on the third side above the airlock 110. In this implementation, the finger support structures and sidewalls are arranged differently than in the first embodiment. In the second embodiment, the rear sidewall is defined, for example, along the rear side of the baseplate structure 1134, and the sidewall for defining the second window 152 may be arranged along the first or second side of the baseplate structure depending on the airlock side of the EFEM 102 to which the ring storage station is coupled. In the example shown in FIG. 3B, the ring storage station 108b is coupled to the EFEM 102 above the left airlock 110L. As a result, the sidewall for defining the second window 152 is arranged along the second side. In one alternative example, when the ring storage station is coupled onto the right airlock 110R, the sidewall for defining the second window 152 may be arranged along the first side. The second window 152 is a service window through which edge rings are loaded / unloaded from the ring storage station 108b.

[0078] The finger support structures are defined in the ring storage station 108b. In the design of the ring storage station shown in FIG. 3B, the first finger support structure 160a is defined on a first sidewall disposed along a first side. The first pair of finger support structures 160b, 160c is defined on a rear sidewall disposed along a rear side of the base plate structure. The first pair of finger support structures 160b, 160c defined on the rear sidewall may be used to define the range over which the edge ring can move to the ring storage station. As a result, each of the support fingers on the first pair of finger support structures 160b, 160c may include a bumper to prevent damage to the surface of the edge ring when the edge ring moves against the first pair of finger support structures. Since the service window 152 is defined along the second side, the second finger support structure 160d is defined at the intersection of the second side and the front side of the base plate structure. Each of the finger support structures is oriented parallel to one another. In the embodiment shown in FIG. 3B, the first through third finger support structures 160a-160c are defined to be perpendicular to the sidewalls, respectively, while the second finger support structure 160d is defined at an angle less than 90 degrees. The second finger support structure 160d is a movable structure, and its position and the angle at which it is positioned within the ring storage station can be adjusted to not impede the movement of the carrier plate and edge ring 200 into and out of the ring storage station 108b. For example, the position of the support pillars at the first end of the second finger support structure can be adjusted to ensure that the support pillars of the second finger support structure do not impede the movement of the edge ring into and out of the ring storage station 108b through the EFEM port. Also, the position of the second end of the second finger support structure can be adjusted to prevent any interference when the edge ring is loaded / unloaded from the ring storage station.

[0079] 3C is an overhead perspective view of the second embodiment of ring storage station 108b shown in FIG. 3B , showing that the ring storage station is coupled to a third side of EFEM 102 above left airlock 110L. The overhead view shows EFEM port 151 defined along the front side, a first finger support structure defined on the first side, a first pair of finger support structures 160b, 160c defined along the rear side, and a service window 152 defined along a second side of the base plate structure.

[0080] FIG. 3D shows an alternative perspective view of a second embodiment of the ring storage station 108b. The base plate structure 1134 of the second embodiment of the ring storage station includes a base plate 1134a forming a foundation (i.e., a bottom surface) of the base plate structure 1134 and a rotating plate 1134b forming an upper surface of the base plate structure 1134. Support pads are provided on the upper surface of the base plate 1134a to receive the rotating plate 1134b, and the number and position of the support pads are defined to provide kinematic support for the rotating plate 1134b. The contour of the rotating plate 1134b matches the contour of the base plate 1134a. A center pivot pin 162 extends from the center of the base plate 1134a through the center of the rotating plate 1134b. The center pivot pin 162 is used to rotate the rotating plate 1134b along a horizontal plane. A set of load path adjusters 1140 are defined on the rotating plate 1134b proximate to the support posts of the second finger support structure 160d defined at the intersection of the second side and the front side of the base plate structure. The load path adjusters 1140 are attached to the second finger support structure 160d and are used to adjust the position of the support posts of the second finger support structure 160d within the ring storage station 108b. This adjustment ensures that the second finger support structure does not impede movement of the edge ring in and out of the ring storage station 108b via the EFEM port 151.

[0081] Additionally, index pins 161 are disposed on each of the support fingers of the first and second finger support structures 160a, 160d and are used to engage corresponding grooves defined on the backside of the edge ring. The settings of the finger support structures are determined by calibrating the angular rotation of the edge ring removed from the process module and using that calibration to receive and remove the edge ring from the ring storage station. When the edge ring is initially loaded into the ring storage station 108 (either 108a or 108b), care is taken to ensure that the grooves of the pins are aligned with the index pins on the respective finger supports defined on the first and fourth finger support structures 160a, 160d. Additional adjustments to the alignment may be performed in the process module.

[0082] FIG. 3E shows an enlarged side view of a portion of a support finger of a fourth finger support structure with an index pin engaged with a first embodiment of a groove in an edge ring in one embodiment. Positional alignment of the edge ring to the index pin may be performed during initial loading of the edge ring into the ring storage station. The first embodiment of the groove is a V-shaped groove defined in the bottom surface of the edge ring 200, where the edge ring cooperates with an index pin 161 defined on the support finger 163 and engages the groove at a pin contact location 212. Based on the positioning of the finger support structure in the ring storage station, alignment allows the index pin 161 to contact a portion of the sloped sidewall of the groove and slide to the pin contact location 212. In one embodiment, loading of the edge ring is performed manually. In this embodiment, a person loading the edge ring may use the index pin 161 as a guide. In an alternative embodiment, the edge ring may be loaded into the ring storage station in an automated manner, and a robot may be trained to load the edge ring using the index pin as a guide.

[0083] 3F-3I show close-up views of a second finger support structure used in a second embodiment of a ring storage station that is adjustable at both ends to facilitate loading and unloading edge rings into and from the ring storage station 108b in some exemplary implementations. As shown in FIG. 3F, a load path adjuster 1140 is defined on the rotating plate 1134b proximate the support post 164 and connected to a second finger support structure 160d disposed on the rotating plate 1134b. The load path adjuster 1140 includes an adjuster plate having one or more open channels defined therein. In the exemplary load path adjuster 1140 shown in FIG. 3F, two open channels 1140a, 1140b are defined parallel to one another. When adjusting the position of the support post of the second finger support structure, one or more anchor pins 1140c are used in one or both of the open channels 1140a, 1140b to secure the rotating plate 1134b in a first position or a second position on the base plate 1134a. In the example shown in Figure 3F, one anchor pin 1140c is used in the open channel 1140a to secure the second finger support structure 160d in a first position on the base plate 1134a.

[0084] In addition to the load path adjuster 1140, one or more pivot points are defined on the rotating plate 1134b. In some implementations, the pivot points 1145a, 1145b are defined to extend through the rotating plate 1134b into the base plate 1134a. The pivot points 1145a, 1145b are defined proximate the second end of the second finger support structure 160d and are used to move the second end of the second finger support structure 160d. A corresponding pivot anchor point may be defined on a bottom support finger of the second finger support structure 160d and a pivot pin 1145c extending from the bottom support finger through the corresponding pivot point 1145a, 1145b may be used to secure the second end of the second finger support structure 160d to one of the first pivot points 1145a or 1145b. The locations of the first and second pivot points 1145a, 1145b are defined on the rotating plate 1134b to correspond to the design of the VTM 104. For example, in the case of a first embodiment of the VTM 104 (with either four or six facets for coupling with a process module), the first pivot point 1145a may be used to secure the second end of the second finger support structure 160d, and in the case of a second embodiment of the VTM 104 (with five facets for coupling with a process module), the second pivot point may be used to secure the second end of the second finger support structure 160d to the base plate structure 1134. The first and second pivot points are defined such that the second finger support structure does not enter the edge ring path. The length of the support fingers 163 in the second embodiment of the second finger support structure 160d of the ring storage station 108b is longer than the length of the support fingers in the remaining finger support structures 160a-160c.

[0085] FIG. 3H shows a top view of finger support structure 160d secured to a base plate using load path adjusters in one embodiment. As shown, finger support structure 160d is secured using two anchor pins 1140c, one anchor pin for each channel 1140a, 1140b. FIG. 3I shows a close-up view of a support post of finger support structure 160d. Support post 164 includes a finger cutout 1146 defined thereon at the location where a nut, such as PEM nut 1147, is defined in ring storage station 108b. This cutout is provided to prevent support post 164 from interfering with PEM nut 1147 as support post 164 is moved using load path adjuster 1140.

[0086] 4A shows a view of the inside of a second embodiment of the ring storage station 108b as seen through the EFEM port 151 of the ring storage station 108b. The view of the inside of the ring storage station 108b shows a first finger support structure 160a disposed on a first side wall, a first pair of finger support structures 160b, 160c defined on a rear side wall of the ring storage station 108b, and a second finger support structure 160d defined on a second side and at a front corner of the ring support structure 108b. Each of the finger support structures includes a corresponding support post 164 and a number of support fingers 163 attached to the support post 164. The figure also shows a number of carrier plate supports 1137 disposed on the base plate structure and finger cutouts 1146 on the support post 164 associated with the finger support structure 160d.

[0087] FIG. 4B shows a view of the inside of the second embodiment of the ring storage station 108b as seen through the service window 152 of the ring storage station 108b. As in the previous figure, the view through the service window 152 shows the second finger support structure 160d on the left side, the first finger support structure 160a on the side wall of the first side facing the service window 152, and the first pair of finger support structures 160b, 160c on the right side. Also shown is the carrier plate support 1137 arranged on the base plate structure. The views shown in FIGS. 4A and 4B relate to the second embodiment of the ring storage station 108b mounted on the side where the airlock is attached to the EFEM 102. The views of the inside of the first embodiment of the ring storage station 108a as seen through the corresponding EFEM port 151 and service window 152 are different due to the different positions of the service window and the finger support structures.

[0088] FIG. 5A shows the position of the edge ring received at the airlock in one embodiment. Calibration to determine the pre-alignment angle for the edge ring in the ring storage station begins by performing one or more test runs to remove a test edge ring 200 from the process module, move it to the ring storage station, and measure the angle at which the edge ring is deposited in the ring storage station. Once the pre-alignment angle is determined, the ring storage station can be set such that the calibrated pre-alignment angle of the edge ring places the corresponding groove in the edge ring within the capture range of the lift pins. As part of the test retrieval, the lift pin mechanism is actuated in the process module, and the lift pins extend from the lift pin housing to contact the backside of the edge ring. When the edge ring is properly positioned in the process module, the lift pins align with the grooves (e.g., V-shaped grooves) defined in the bottom surface of the edge ring. Thus, the lift pins contact the pin contact locations 212 of the edge ring defined at the tips of the grooves, lifting the edge ring from the installation position to the exchange position. In response, an end effector located on the arm of the robot 105 of the VTM 104 is extended into the process module to support the edge ring while the lift pins are retracted into the housing. The end effector is then retracted from the process module and the edge ring removed from the process module is transferred to an airlock used for such transfer and stored on a finger assembly defined therein. In the embodiment shown in FIG. 5A, the right airlock 110R is used to deposit the edge ring 200 removed from the process module by the end effector of the robot 105 of the VTM. In an alternative embodiment, a similar process can be followed when the left airlock 110L is used to transfer the edge ring. In an alternative embodiment, the ring storage station may be either positioned above the right airlock 110R or located on the second side of the EFEM 102. After depositing the edge ring in the airlock, the end effector is retracted into the VTM 104.

[0089] The end effector of the robot 105 extends into the process module orthogonally to the facet of the process module that mates with the VTM 104. Thus, for each process module located on a different facet of the VTM, the angle at which the end effector enters and exits is always 90 degrees relative to the facet of the process module that mates with the corresponding facet of the VTM 104. Similarly, the angle at which the robot 105 of the VTM 104 extends into the airlock 110R is also orthogonal to the facet of the airlock 110R that mates with the corresponding facet of the VTM 104. The facets of the VTM are defined to provide symmetry to the VTM 104. Thus, the angles of the facets of the VTM 104 vary based on the number of facets defined for the VTM, as each of the facets is defined to be equiangular and equilateral. Based on the design of the VTM 104 used in the substrate processing system (e.g., the number of facets on the VTM), the angle at which the extracted edge ring 200 is deposited in the airlock 110R depends on the angle at which the facet of the airlock that interfaces with the VTM is positioned relative to the facet of the airlock 110R that interfaces with the EFEM.

[0090] After the end effector of the VTM robot is withdrawn from the airlock 110R, the robot 103 of the EFEM 102 is used to retrieve a carrier plate from the ring storage station 108 and the carrier plate is used to retrieve an edge ring from the airlock 110R. Similar to the robot of the VTM, the robot of the ATM enters and exits the airlock perpendicular to the facets of the airlock that mate with the facets of the EFEM 102. The retrieved edge ring 200 moves to the ring storage station. The robot 103 enters the ring storage station 108 perpendicular to the facets of the ring storage station that mate with the corresponding facets of the EFEM 102 and positions the edge ring on the support fingers of a compartment in the part buffer of the ring storage station. A manual assessment of the alignment may be performed during test runs to determine whether any adjustments are needed to the position of the edge ring to engage with index pins on the support fingers provided on the corresponding finger support structures (e.g., the first and fourth support finger structures in a first embodiment of the ring storage station when the ring storage station is coupled to the second side of the EFEM, or the first and second support finger structures in a second embodiment of the ring storage station when the ring storage station is coupled to the third side of the EFEM above the left airlock 110L, in this example using the right airlock 110R to move the edge ring).

[0091] FIG. 5A shows a first embodiment of a VTM in which four or six facets for interfacing with process modules are defined in addition to two facets for interfacing with the airlocks (right and left airlocks 110R, 110L). The angle between the airlock interface with the VTM facets and the airlock interface with the EFEM facets in the first embodiment of the VTM 104 is shown as φ degrees in FIG. 5A, and this angle will be the same as the angle between the direction of movement of the end effector of the robot 105 that delivers the edge ring into the airlock and the direction of movement of the end effector of the robot 103 that removes the edge ring from the airlock, where the edge ring is moved using a carrier plate. In some implementations, the robot may rotate the edge ring in the airlock to ensure that the edge ring is received in the airlock.

[0092] FIG. 5B illustrates a second embodiment of a VTM 104 employed in a substrate processing system. The second embodiment of the VTM 104 may include five facets for coupling to different process modules in addition to two facets for coupling to the airlocks (right and left airlocks 110R, 110L). In this second embodiment, the angle between the airlock interface with the VTM facet and the airlock interface with the EFEM facet is shown as α degrees in FIG. 5B, which is the same as the angle between the direction of movement of the robot 105 that delivers the edge ring into the airlock and the direction of movement of the robot 103 of the EFEM that removes the edge ring together with the carrier plate from the airlock. Furthermore, the angle α degrees of the second embodiment of the VTM is different from the angle φ degrees of the first embodiment of the VTM (i.e., α degrees is not equal to φ degrees) due to the difference in the angles at which the facets of the first and second embodiments of the VTM are defined.

[0093] Since the angle at which the edge ring is fed into the airlock depends on the design of the VTM (e.g., number of facets), the position of the edge ring groove changes when the edge ring moves from the process module to the ring storage station, and this change can be due to the angle at which the edge ring is fed into the airlock and the angle at which the edge ring is removed from the airlock. These angle changes are taken into account when configuring the ring storage station during pre-alignment. The ring storage station may be configured with different pivot points, pivot pins, and load path adjusters to accommodate different VTM designs. Additionally, the base plate structure of the ring storage station can be used to provide additional rotational adjustment to the finger support structure such that index pins defined on some support fingers of the finger support structure can align with or at least be within a capture range of the edge ring V groove. The capture range is defined as the amount by which the edge ring V groove can be offset relative to the lift pins when the edge ring is received into the process module. In some implementations, a ring storage station configuration for pre-aligning the edge ring within the ring storage station results in the edge ring being delivered to the process module within a capture range of between about ±0.75 degrees and about ±0.90 degrees from the lift pins. In an alternative embodiment, a ring storage station pre-alignment configuration results in the edge ring being delivered to the process module within a capture range of about ±0.82 degrees from the lift pins.

[0094] The accurate feeding can be attributed to the accurate calibration done in the test runs. When the edge ring is being moved by the robot of the substrate processing system, the angle at which the edge ring is removed from the process module and fed to the ring storage station is very consistent. Additional test runs are performed to verify the consistency of the angle of the edge ring being removed from the process module and fed to the ring storage station. These additional test runs can be performed between the same process module and the ring storage station of the substrate processing system or between other process modules and the ring storage station. The configuration of the finger support structures in the ring storage station can be fine-tuned based on the results of the additional test runs. The adjustments made in the ring storage station after the test runs are specific to the particular design of the VTM. As a result, by setting and using these adjustments, the edge ring can be loaded into the ring storage station such that the grooves properly engage with the lift pins or are within the capture range when the edge ring is fed to the process module.

[0095] 5A and 5B show the position of the grooves of the edge ring in airlock 110R as a function of the angle at which the edge ring is introduced into airlock 110R. As shown, the edge ring includes three grooves (grooves 1-3) defined on the bottom side of the edge ring, the grooves being equidistant from one another. The position of the grooves in airlock 110R in FIG. 5A may differ slightly from the position in FIG. 5B, and this difference may be due to the angle at which the edge ring is introduced into airlock 110R.

[0096] FIG. 5C shows a top view of the ring storage station where the carrier plate 1104 is received with the edge ring 200. The positions of the grooves 1-3 are shown relative to the index pins defined on the support fingers of the finger support structures 160a and 160d. In a test retrieval run performed, it may be determined that the edge ring grooves were slightly offset from the index pins on the support fingers of the finger support structures. Additional test runs are performed using the same or different process modules of the substrate processing system, each time recording the positions of the grooves 1-3 relative to the index pins. The purpose of these test runs is to determine the offset range of the grooves relative to the index pins as it relates to the position of the edge ring grooves relative to the lift pins of the process module(s). The offset range may be used to rotate and adjust the rotating plate 1134b so that the edge ring grooves can align with the index pins or be within the capture range.

[0097] In an embodiment where the first embodiment of the VTM is used, the configuration of the ring storage station includes fixing the second end of the finger support structure 160d at the first pivot point 1145a using a pivot pin 1145c, as shown in FIG. 3F. Similarly, in an embodiment where the second embodiment of the VTM is used, the second end of the finger support structure 160d is fixed at the second pivot point 1145b using a pivot pin 1145c, as shown in FIG. 3G. Furthermore, the support post of the finger support structure 160d is fixed at the first end using a support pin(s) 1140c so that the support post does not interfere with the edge ring when the edge ring is loaded and unloaded from the ring storage station. When the finger support structure 160d is fixed at both ends based on the embodiment of the VTM used in the substrate processing system, the rotating plate 1134b is adjustable to rotate along the central pivot point in the horizontal plane when the groove of the edge ring does not align with the index pin defined on the support finger.

[0098] In one embodiment, the pins described above may be used to provide a pre-alignment angle at the ring station. By way of example, one or more alignment pins 161 (i.e., fingers with pins 161) may be used to control alignment and ring rotation. Pocket features 167 may be used with one or two pins to prevent rotation around the pin and sliding along the radially aligned V-grooves. In one embodiment, pocket features 167 form a type of molded edge stop. Thus, pocket features 167 are used to complete the ring horizontal position and rotation control along with pins 161, as shown in more detail in FIG. 5C. In another embodiment, a three pin configuration may be used if clearance for robotic and manual / human handling is adequate. In a three pin 161 configuration, full dynamic alignment would be provided by the pins 161 themselves.

[0099] An alternative method of forming the ring support points is to use a single plate rather than the multiple support finger design described. Each slot in the ring station can be made from a plate cut into a general "C" shape that wraps around the ring with clearance for robotic ring transport. Pins can be attached to the plate with pocket features formed in the plate as needed. The current embodiment has pin features for the rings / slots on the different finger subassemblies. If the prealignment angle needs to be adjusted independently for each slot, mounting two or three pins on a single plate would facilitate that independent adjustment. Each plate is independently adjustable and the common rotating base plate is removable.

[0100] 6A-6C show the range of times when the rotating plate needs to be rotated to adjust the alignment of the grooves to the index pins for the edge ring through a substrate processing system employing a first embodiment of a VTM, in one embodiment. Based on the amount of offset, the rotating plate may need to move + or -θ degrees. For example, as shown in FIG. 6A, the rotating plate may need to move +θ degrees. In some embodiments, the value of θ degrees may be between about 1 degree and about 5 degrees. In an alternative embodiment, the rotating plate may be adjusted by rotating about 2 degrees. Alternatively, as shown in FIG. 6B, the grooves may be offset from the index pins by an amount (i.e., within the capture range) such that the index pins can contact the sloped sidewalls of the grooves instead of the pin contact location 212 defined in the grooves 210. In such a case, no further adjustment of the rotating plate is necessary since the edge ring may cooperate in a process module in a similar manner to the lift pins. FIG. 6C shows an example of when the rotating plate needs to be moved -θ degrees (i.e., in the opposite direction to that shown in FIG. 6A) to align with the index pins. As discussed with respect to Figure 6A, the value of θ degrees may be between about 1 degree and about 5 degrees in some embodiments. The rotating plate is received on a plurality of rest points distributed on the upper surface of the base plate. In one embodiment, a set of three rest points are defined on the base plate to receive the rotating plate and are distributed to provide kinematic support and allow the rotating plate to rotate about a central pivot point.

[0101] 6D-6F show similar adjustments that may be made to the rotating plate 1134b in an alternative embodiment to properly align the index pins on the support fingers of the finger support structure in the ring storage station with the grooves of the edge ring retrieved from the process module. The number of facets in the VTM used in this alternative embodiment differs from the number of facets in the VTM used in FIGS. 6A-6C. Thus, as shown in FIG. 6D, the rotating plate may be adjusted by about θ degrees in the positive direction (i.e., counterclockwise direction), where θ degrees may be between about 1 degree and about 5 degrees, or no adjustment needs to be made as shown in FIG. 6E, or may be adjusted by about θ degrees in the negative direction (e.g., clockwise direction) as shown in FIG. 6F. Note that minimal adjustments may need to be made to the rotating plate since the robot reliably moves the edge ring from the process module to the ring storage station.

[0102] Once the alignment of the rotating plate is defined, it is maintained during loading of the edge ring into the ring storage station. As previously described, the edge ring may be manually loaded into the ring storage station by engaging the grooves with the index pins. This pre-alignment of the edge ring allows it to be properly positioned into the process module during initial loading. It is noted that the pre-alignment of the edge ring is done taking into account the particular side airlock being used to move the edge ring into the VTM 104 to deliver it to the process module. It is also noted that the pre-alignment of the edge ring may be done taking into account the type of airlock being used. Some of the types of airlocks that can be used include side-by-side airlocks, stack airlocks, or other airlock types that affect the rotational alignment of the ring when passing from the EFEM to the VTM or back. When pre-aligning the edge ring, the particular type and side airlock used in the substrate processing system is taken into account to ensure that the angle at which the edge ring is delivered to the process module is consistent.

[0103] FIG. 5D illustrates one embodiment in which the edge ring is positioned in a process module using an end effector of the VTM robot such that grooves 1-3 in the edge ring align with lift pins 1-3 of the lift pin mechanism.

[0104] In various embodiments described herein, the ATM 102 and VTM 104 robots used to transport substrates are also used to transport consumable parts, such as edge rings, to and from process modules, allowing consumable parts to be replaced in a fast and efficient manner. The ring storage station design described in various embodiments allows the edge ring to be rotationally aligned by passing through the dynamic aligner of the substrate processing system and instead using the ring storage station components so that when the edge ring is delivered to the process module, contact occurs between the V-shaped grooves of the edge ring and the tops of the lift pins used in the process module. The pre-alignment performed in the ring storage station allows the EFEM and VTM robots to deliver the edge ring with sufficient precision so that the lift pins engage the edge ring or are within a capture range defined by the dimensions of the V-groove, and when the lift pins engage the edge ring, they can contact the sidewalls of the V-groove and slide into the pin contact position of the V-groove. As the lift pins move the edge ring away from the end effector, any fine adjustments to the X, Y coordinate position and / or rotational alignment are corrected by the lift pins. The final alignment of the edge ring around the electrostatic chuck or pedestal that receives it is controlled by the lift pins.

[0105] The ring storage station described in various implementations / embodiments is similar in structure to a substrate storage station such as a Front Opening Unified Pod (FOUP), but is specifically designed for edge rings and / or other consumable parts used in a process module that require replacement. The rotational alignment of the edge ring to feed into the process module is controlled by pre-aligning the ring angle to a fiducial (e.g., index pin) in the ring storage station, which is used to interface with the V-groove. In addition to pre-aligning the edge ring, the path of the edge ring through the substrate processing system is restricted to one side airlock (e.g., the right airlock in the embodiment shown in Figures 5A, 5B) to limit angular changes. When the edge ring is allowed to pass through a different airlock (i.e., the right airlock vs. the left airlock), angular changes may occur due to the angle at which the right airlock is positioned relative to the left airlock. To avoid variations in feed angle and keep the edge ring angle constant, the path of the edge ring is restricted to one side airlock. The decision as to which side of the airlock to use to move the edge ring may be made based on which side provides a rotation angle advantage.

[0106] The pre-alignment adjustments made at the ring storage station take into account system tolerances such as hardware assembly tolerances, repeatability of the EFEM and VTM robots during edge ring feeding and retrieval, calibration of coordinates during placement or removal from the ring storage station, dynamic alignment corrections to center the edge ring, minor variations caused by leveling during handoff and other factors, and ring angle pre-alignment tolerances, to name a few. The tolerances affecting the rotation of the edge ring between the ring storage station and the process module are determined by performing multiple test runs of retrieving edge rings from the process module and feeding them to the ring storage station. Based on the results of the test runs, the tolerances are addressed by calibrating the index pins at the ring storage station. The calibration of the index pins is performed by rotating the rotating plate about a central pivot pin such that a finger support structure attached to the rotating plate rotates about a horizontal axis and the rotating plate pivots between about ±1 degree and about ±5 degrees. In some implementations, an initial test run may be used to identify an initial alignment angle for the edge ring, and additional test runs may be used to identify the angle tolerance (i.e., variation after each test run from the same process module or variation between process modules) so that an average offset angle can be determined and used to fine-tune the initial alignment angle.

[0107] In some implementations, each slot of the ring storage station used to store an edge ring may be individually calibrated and the edge ring in the slot may be used to assign to a particular process module, hi an alternative implementation, the calibration of the index pin is common to all slots and an edge ring from any slot may be delivered to any process module within the substrate processing system.

[0108] A service window defined on one side of the ring storage station is used to load and unload the edge ring. A shutter or door defined for the service window provides access to the ring storage station. A shutter or door defined between the ring storage station and the EFEM allows the ring storage station to be isolated from the rest of the substrate processing system. The operation of these shutters is coordinated to allow loading of the edge ring into the ring storage station and continued processing of the substrate in the substrate processing system.

[0109] If the edge ring is manually loaded into the ring storage station, any error in the alignment of the edge ring to the index pin can be detected using a mapping sensor. Also, for example, a mapping sensor located on the end effector of the robot 103 of the EFEM 102 used to detect the presence or absence of the edge ring in the ring storage station can be used to detect any tilt of the ring that may occur when the edge ring is not aligned with the index pin during loading. The same mapping sensor can also be used to detect any misalignment of the edge ring delivered from the process module. In some implementations, the tilt of the used edge ring returned from the process module may be used to provide a pre-alert via computer software if the tilt in the ring does not violate the clearance required for the transport of the edge ring in the upper or lower slot or compartment. In some implementations, this pre-alert may be identified as a non-fatal error so that the system can continue processing the substrate. In some implementations, the mapping sensor may use laser technology to detect the presence or absence of an edge ring in a particular slot and whether the edge ring in a slot is correctly positioned or misaligned in the particular slot / compartment. In one configuration, an EFEM robot mapping sensor may be used to detect when a ring is not properly positioned in a slot or buffer slot, e.g., not positioned in a horizontal plane. Illustratively, this error detection capability is a combination of the engagement of the pins in the anti-walk grooves and the height measurement capabilities of the mapping sensor.

[0110] In some embodiments, the end effector mechanisms used by the EFEM and VTM robots are designed to support not only the substrate but also the edge ring. In some embodiments, the end effector of the robot in the EFEM is configured to support a carrier plate and an edge ring received on the carrier plate, while the end effector of the VTM robot is expanded to accommodate both the substrate and the consumable part such as the edge ring. The finger assembly in the airlock is designed to support the consumable part as well as the substrate. In some embodiments, the end effector mechanism of the VTM robot and the finger assembly of the airlock include multiple contact pads that provide mutually exclusive contact points for the substrate and the edge ring to avoid cross contamination. The contact pads for the substrate and the edge ring (consumable part contact pads, substrate contact pads) may be designed to provide contact points at different heights or radial distances to achieve exclusive separation within the expected substrate or consumable part position error. To accommodate the increased payload and reduce deflection, the end effector mechanism of the robot in the EFEM may be made of a higher stiffness material, such as ceramic, to limit the increase in deflection or thickness while reducing the total payload on a robot using the redesigned end effector mechanism.

[0111] In an alternative embodiment, the ring rotational alignment features described herein can be integrated into a removable box or “front-opening ring pod (FORP)” like a wafer FOUP. The FORP is modified to hold an edge ring instead of a wafer as is done in standard FOUPs. Thus, integrating one or more rotational alignment features into the FORPs can help to efficiently load and unload the edge ring (i.e., consumable parts) from the FORP into the tool and obtain the desired alignment. In some cases, depending on where the FORP is loaded into the tool (i.e., load position), the angle of alignment may need to be modified to account for the angle at which the robot accesses the FORP. In one embodiment, the FORP can be coupled to the tool via a standard or modified load port. The load port can be coupled to the EFEM. In some cases, the FORPs may be coupled to the process tool itself, either directly or through an interface.

[0112] Various embodiments described herein provide an efficient, cost-effective method of replacing consumable parts in a substrate processing system without breaking a vacuum seal, thereby reducing downtime of the substrate processing system, which may lead to increased wafer throughput.

[0113] FIG. 7 illustrates a control module (also referred to as a "controller") 220 for controlling the substrate processing system described above. In an embodiment, the controller 220 may include several exemplary components, such as a processor, a memory, and one or more interfaces. The controller 220 may be employed to control devices of the substrate processing system 100 based in part on sensed values. For example, the controller 220 may only control one or more of the valves 602 (including the isolation valves 216, 216' of FIGS. 5A, 5B, 5C), the filter heater 604, the pump 606 (including the pump 233), and other devices 608 based on the sensed values ​​and other control parameters. The controller 220 may only receive sensed values ​​from, for example, the pressure manometer 610, the flow meter 612, the temperature sensor 614, and / or other sensors 616. The controller 220 may also be employed to control process conditions during precursor delivery and film deposition. The controller 220 will typically include one or more memory devices and one or more processors.

[0114] The controller 220 may control the precursor delivery system and the movement of the deposition apparatus. The controller 220 executes a computer program that includes a set of instructions for controlling the timing of the process, the temperature of the delivery system, the pressure differential across the filter, the valve positions, the robot and end effectors, the mixture of gases, the chamber pressure, the chamber temperature, the wafer temperature, the RF power levels, the position of the wafer chuck or pedestal, and other parameters of a particular process. The controller 220 may also monitor the pressure differential and automatically switch the delivery of the gas phase precursors from one or more paths to one or more other paths. Other computer programs stored in a memory device associated with the controller 220 may be employed in some embodiments.

[0115] Typically, there is a user interface associated with the controller 220. The user interface may include a display 618 (e.g., a display screen and / or graphical software that displays equipment and / or process conditions) and user input devices 620, such as a pointing device, keyboard, touch screen, microphone, etc.

[0116] Computer programs for controlling precursor delivery, deposition and other processes in a process sequence can be written in any conventional computer readable programming language, such as assembly language, C, C++, Pascal, Fortran, etc. The collected object code or script is executed by a processor to perform the tasks specified in the program.

[0117] The control module (i.e., controller) parameters relate to process conditions such as, for example, filter pressure differential, process gas composition and flow rate, temperature, pressure, plasma conditions such as RF power level and low frequency RF frequency, cooling gas pressure, and chamber wall temperature.

[0118] The system software may be designed or configured in many different ways. For example, various chamber component subroutines or control objects may be written to control the operation of the chamber or process module components necessary to carry out the deposition process of the present invention. Examples of programs or sections of programs for this purpose include substrate positioning code, process gas control code, pressure control code, heater control code, plasma control code, lift mechanism control code, robot position code, end effector position code, and valve position control code.

[0119] The substrate positioning program may include program code for controlling chamber components used to mount the substrate on the pedestal or chuck, and may include program code for controlling the space between the substrate and other parts of the chamber, such as gas inlets and / or targets. The process gas control program may include code for controlling gas composition and flow rates, and optionally code for flowing gas into the chamber before deposition to stabilize the pressure in the chamber. The filter monitoring program includes code for comparing the measured deviation(s) with a predetermined value(s) and / or code for switching paths. The pressure control program may include code for controlling the pressure in the chamber, for example, by adjusting a throttle valve in the exhaust system of the chamber. The heater control program may include code for controlling current to a heating unit for heating components of the precursor delivery system, the substrate, and / or other parts of the system. Alternatively, the heater control program may control the supply of a heat carrier gas, such as helium, to the wafer chuck. The valve position control code may include code for controlling access to a process module or substrate processing system, for example, by controlling an isolation valve that provides access to the process module or cluster tool. The lift mechanism control code may include, for example, code to operate an actuator drive such that the actuator moves the lift pins. The robot position code may include code for manipulating the position of the robot, including, for example, manipulating the robot to move along a lateral, longitudinal, or radial axis. The end effector position code may include code for manipulating the position of the end effector, including, for example, manipulating the robot to extend, retract, or move along a lateral, longitudinal, or radial axis.

[0120] Examples of sensors that may be monitored during deposition include, but are not limited to, mass flow control modules, pressure sensors such as pressure manometers 610, and thermocouples (e.g., temperature sensors 614) located in the delivery system, pedestal, or chuck. Appropriately programmed feedback and control algorithms may be used with data from these sensors to maintain desired process conditions. The foregoing describes the implementation of embodiments of the present invention in single or multi-chamber semiconductor processing tools.

[0121] In one embodiment, a ring storage station for supplying consumable parts to a substrate processing system is disclosed. The ring storage station includes a base plate structure defined at a base of the ring storage station. An end effector access opening is defined along a front side of the base plate structure. A first sidewall is disposed along a first side of the base plate structure. A rear sidewall is disposed along a rear side of the base plate structure. A service window opening is defined in a second side of the base plate structure. A plurality of finger support structures are mounted on the base plate structure. Each finger support structure includes a support post and a support finger defined thereon, the support finger having a first end attached to the support post and a second end extending toward a center of the ring storage station. The plurality of finger support structures includes a first finger support structure disposed on the first side of the base plate structure, a first pair of finger support structures disposed along the rear side, and a second finger support structure disposed at an intersection of the second side and the front side. The support fingers of the first and second finger support structures include index pins defined proximate the second ends thereof for use in coordinating with consumable parts received within the ring storage station.

[0122] In some implementations, the base plate structure includes a base plate defining a bottom surface of the base plate structure and a rotating plate disposed on the top surface of the base plate to define an upper side of the base plate structure, a central pivot pin extending from a center of the base plate through a center of the rotating plate, and the rotating plate configured to rotate about the central pivot pin along a horizontal axis during position calibration.

[0123] In some implementations, a plurality of finger support structures are defined on the rotating plate.

[0124] In some implementations, the second finger support structure is an adjustable finger support structure. The load path adjuster is defined on the rotation plate proximate to the support post of the adjustable finger support structure and configured to adjust a position of the support post of the adjustable finger support structure.

[0125] In some embodiments, the load path adjuster includes an adjuster plate having one or more open channels and one or more adjuster pins that secure support posts of an adjustable finger support structure to the base plate using the one or more open channels in a position that allows unhindered movement of the consumable parts into and out of the ring storage station.

[0126] Furthermore, in some embodiments, the consumable parts may have one or more laser engraved markers in or on the material to aid in location detection during transport of the consumable parts between the ring storage and the process module.

[0127] Various embodiments described herein allow for the replacement of consumable parts in a fast and efficient manner without exposing the substrate processing system to atmospheric conditions. As a result, the time to replace the consumable parts, as well as any risk of contaminating the chamber during replacement of the consumable parts, is significantly reduced, which allows the substrate processing system to be brought online faster. Furthermore, the risk of accidental damage to process modules, consumable parts, and other hardware components in the process modules is significantly reduced.

[0128] The above description of the embodiments has been provided for purposes of illustration and description. The above description of the embodiments is not intended to be exhaustive or limiting of the invention. Individual elements or features of a particular embodiment are generally not limited to that particular embodiment, but may be interchanged, where applicable, and may be used in selected embodiments even if not specifically shown or described. Also, individual elements or features of a particular embodiment may be varied in various ways. Such variations should not be considered as a departure from the invention, and all such modifications are intended to be included within the scope of the invention.

[0129] Although the foregoing embodiments have been described in some detail for purposes of clarity of understanding, it will be apparent that certain changes and modifications can be practiced within the scope of the appended claims. The present embodiments are therefore to be considered as illustrative and not restrictive, and the present embodiments are not to be limited to the details given herein, but may be modified within the scope and equivalents of the claims.

Claims

1. 1. A ring storage station for supplying consumable parts for use in a substrate processing system, comprising: A housing, A base plate; a rotating plate disposed on the base plate; an end effector access opening disposed on a first side of the housing; a service window opening disposed on a second side of the housing; A set of finger support structures including support fingers disposed on corresponding support posts. A set of finger support structures connected to the rotating plate within the housing. Construction and Including, housing A ring storage station comprising:

2. 2. The ring storage station of claim 1, A ring storage station, wherein at least two of the finger support structures are finger supports including index pins configured to radially align the consumable parts when positioned in the ring storage station.

3. 2. The ring storage station of claim 1, The ring storage station, wherein the rotating plate is configured to rotate along a horizontal plane about a center pivot pin disposed at the center of the base plate and extending through the center of the rotating plate.

4. 2. The ring storage station of claim 1, A ring storage station, wherein the second side including the service window opening is disposed adjacent to the first side including the end effector access opening.

5. 5. A ring storage station according to claim 4, comprising: A ring storage station, wherein one of the finger support structures is an adjustable finger support structure, the adjustable finger support structure being defined at an intersection of the first side and the second side.

6. 6. A ring storage station according to claim 5, comprising: a ring storage station, the rotating plate including a load path adjuster defined thereon, the load path adjuster defined proximate to the support post of the adjustable finger support structure and configured to adjust a position of the support post of the adjustable finger support structure.

7. 7. A ring storage station according to claim 6, comprising: A ring storage station, wherein the load path adjuster includes an adjuster plate having one or more open channels and one or more adjuster pins for engaging the rotating plate to the base plate through the one or more open channels when the load path adjuster fixes the support posts of the adjustable finger support structure in a position that allows the consumable parts to enter and exit the ring storage station unhindered.

8. 6. A ring storage station according to claim 5, comprising: the rotating plate includes a first pivot point and a second pivot point defined proximate to a second end of the adjustable finger support structure, the first pivot point and the second pivot point being used to fix the second end of the adjustable finger support structure at a first position or a second position; A ring storage station, wherein the fixation of the adjustable finger support structure in the first position or the second position is based on a design of a module within the substrate processing system.

9. 2. The ring storage station of claim 1, A ring storage station, wherein the second side including the service window opening is positioned opposite the first side including the end effector access opening.

10. 10. The ring storage station of claim 9, further comprising: The set of finger support structures comprises: a first pair of finger support structures disposed on a first side of the ring storage station such that a first finger support structure of the first pair is disposed proximate to the first side and a second finger support structure of the first pair is disposed proximate to the second side; a second pair of finger support structures disposed on a second side of the ring storage station such that a third finger support structure of the second pair is disposed proximate to the first side and a fourth finger support structure of the second pair is disposed proximate to the second side; Includes a ring storage station.

11. 2. The ring storage station of claim 1, A ring storage station, wherein the end effector access opening and the service window opening include shutters cooperatively operable to isolate the ring storage station or the substrate processing system.

12. 2. The ring storage station of claim 1, A ring storage station, wherein the rotating plate includes a carrier plate housing defined thereon, the carrier plate housing configured to store a carrier plate used to transport the consumable parts to and from the ring storage station.

13. 2. The ring storage station of claim 1, A ring storage station, wherein the consumable part is an edge ring used in a process module within the substrate processing system.

14. 1. A ring storage station for supplying consumable parts to a substrate processing system, comprising: A base plate; a first opening disposed on a first side of the ring storage station; a second opening disposed on a second side of the ring storage station; a set of finger support structures defined on the base plate, each of the finger support structures including a support post and a support finger extending from the support post toward a center of the ring storage station, at least two of the finger support structures having support fingers with index pins configured to radially align the consumable parts when the consumable parts are placed in the ring storage station; A ring storage station comprising:

15. 15. A ring storage station according to claim 14, comprising: The ring storage station further comprises a carrier plate housing defined on the base plate, the carrier plate housing configured to accommodate a carrier plate used in transporting the consumable parts to and from the ring storage station.

16. 15. A ring storage station according to claim 14, comprising: A ring storage station, wherein the second side including a service window opening is disposed adjacent to the first side including an end effector access opening.

17. 17. A ring storage station according to claim 16, comprising: A ring storage station, wherein one of the finger support structures is an adjustable finger support structure, the adjustable finger support structure being defined at an intersection of the first side and the second side.

18. 20. The ring storage station of claim 17, further comprising: a ring storage station, the base plate including a load path adjuster defined thereon, the load path adjuster being defined proximate to the support post of the adjustable finger support structure and configured to adjust a position of the support post of the adjustable finger support structure.

19. 20. The ring storage station of claim 18, further comprising: A ring storage station, wherein the load path adjuster includes an adjuster plate having one or more open channels and one or more adjuster pins for engaging a rotating plate to the base plate through the one or more open channels when the load path adjuster fixes the support posts of the adjustable finger support structure in a position that allows the consumable parts to enter and exit the ring storage station unhindered.

20. 20. The ring storage station of claim 17, further comprising: the base plate includes a first pivot point and a second pivot point defined proximate to a second end of the adjustable finger support structure, the first pivot point and the second pivot point being used to secure the second end of the adjustable finger support structure at a first position or a second position; A ring storage station, wherein the fixation of the adjustable finger support structure in the first position or the second position is based on a design of a module within the substrate processing system.

21. 15. A ring storage station according to claim 14, comprising: A ring storage station, wherein the second side including the service window opening is positioned opposite the first side including the end effector access opening.

22. 22. The ring storage station of claim 21, comprising: The set of finger support structures comprises: a first pair of finger support structures disposed on a first side of the ring storage station such that a first finger support structure of the first pair is disposed proximate to the first side and a second finger support structure of the first pair is disposed proximate to the second side; a second pair of finger support structures disposed on a second side of the ring storage station such that a third finger support structure of the second pair is disposed proximate to the first side and a fourth finger support structure of the second pair is disposed proximate to the second side; Includes a ring storage station.

23. 15. A ring storage station according to claim 14, comprising: a ring storage station, wherein the consumable part includes three grooves uniformly defined on a bottom surface of the consumable part, the grooves being adapted to cooperate with the index pins on the at least two finger support structures;

24. 1. A ring storage station for supplying consumable parts for use in a substrate processing system, comprising: A housing, A base plate; an end effector access opening disposed on a first side of the housing; a service window opening disposed on a second side of the housing; A set of finger support structures including support fingers disposed on corresponding support posts. and connected to the base plate within the housing, At least one of the finger support structures is an adjustable finger support structure. a set of finger support structures; Including, housing A ring storage station comprising:

25. 25. A ring storage station according to claim 24, comprising: A ring storage station, wherein the second side including the service window opening is disposed adjacent to the first side including the end effector access opening.

26. 25. A ring storage station according to claim 24, comprising: a ring storage station, the base plate having a load path adjuster defined thereon, the load path adjuster being defined proximate to the support post of the adjustable finger support structure and configured to adjust a position of the support post of the adjustable finger support structure.

27. 25. A ring storage station according to claim 24, comprising: the base plate includes a first pivot point and a second pivot point defined proximate a second end of the adjustable finger support structure, the second end being opposite an end where the support post is defined, the first pivot point and the second pivot point being used to secure the second end of the adjustable finger support structure at a first position or a second position; A ring storage station, wherein the fixation of the adjustable finger support structure in the first position or the second position is based on a design of a module within the substrate processing system.

28. 25. A ring storage station according to claim 24, comprising: A ring storage station, wherein at least one of the set of finger support structures has finger supports with index pins, the index pins configured to radially align the consumable parts when the consumable parts are placed in the ring storage station.

29. 25. A ring storage station according to claim 24, comprising: The ring storage station is coupled to an equipment front end module (EFEM) and the EFEM has a robot end effector with a mapping sensor, the mapping sensor being used to detect when a substrate is not correctly positioned in a slot associated with the set of finger support structures.

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