Power module, circuit block capable of being mounted on power module, method for adjusting circuit constant and method for manufacturing power module

Abstract

To provide a power module which facilitates setting of a circuit constant relative to a parasitic inductance.SOLUTION: A power module includes a module internal circuit which is arranged on an insulating substrate 11 and has a first circuit element, a first conductive part and a second conductive part which are arranged on the insulating substrate, a first connection pin 16 whose one end is joined to the first conductive part positioned on one end side of the first circuit element, a second connection pin 17 whose one end is joined to the second conductive part positioned on the other end side of the first circuit element, a first resin 18 for sealing the module internal circuit, and a circuit block 19 which is exchangeably and electrically connected to the first circuit element, wherein the circuit block has a second circuit element 21, an other end 16b side of the first connection pin and other end 17b side of the second connection pin project from the first resin, and the circuit block is connected thereto by the first connection pin and the second connection pin.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a power module, a circuit block that can be mounted on a power module, a method for adjusting a circuit constant, and a method for manufacturing a power module. [Background technology]

[0002] A conventional power module is composed of, for example, power semiconductors, circuit components (circuit blocks), heat sinks, insulating materials, substrates, insulating resins, etc. A specific conventional power module can configure a compact power conversion circuit with insulating functions by connecting chip-state power semiconductors and circuit components at the shortest distance.

[0003] However, in conventional power modules, the substrate is covered with insulating resin, so it is not easy to change the internal circuit blocks and carry out trial and error to determine the circuit constants and ratings of the power module.

[0004] Although it may be possible to carry out this type of trial and error using the connection terminals that the power module originally has, even if circuit components that carry high frequency waves are implemented via connection terminals, it is difficult to determine the optimal circuit constants because of the addition of parasitic inductance due to the connection position of the circuit components on the internal board and the distance to the connection terminal.

[0005] Furthermore, when a power module with different circuit constants is required for each customer, it is not easy to change the circuit block. Incidentally, a technology related to a conventional power module is described in Patent Document 1. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] JP 2014-72316 A Summary of the Invention [Problem to be solved by the invention]

[0007] Various aspects of the present invention aim to provide a power module that facilitates setting of circuit constants for parasitic inductance. Another object of the various aspects of the present invention is to provide a power module with different circuit constants for each customer simply by changing the circuit block. [Means for solving the problem]

[0008] Various aspects of the present invention are described below.

[0009] [1] An insulating substrate; a module internal circuit disposed on the insulating substrate and having a first circuit element; a first conductive portion disposed on the insulating substrate and electrically connected to one end of the first circuit element; a second conductive portion disposed on the insulating substrate and electrically connected to the other end of the first circuit element; a first connection pin located on one end side of the first circuit element in the first conductive portion and having one end joined to the first conductive portion; a second connection pin located on the other end side of the first circuit element in the second conductive portion and having one end joined to the second conductive portion; a first resin that seals the module internal circuit, the first conductive portion, the second conductive portion, one end side of the first connection pin, and one end side of the second connection pin; a circuit block exchangeably and electrically connected to the first circuit element; Including, the circuit block has a second circuit element; the other end side of the first connection pin and the other end side of the second connection pin protrude from the first resin, A power module, wherein the circuit blocks are connected by the first connection pins and the second connection pins.

[0010] [2] In paragraph [1] above: one end of the second circuit element is electrically connected to the other end of the first connection pin; the other end of the second circuit element is electrically connected to the other end of the second connection pin; The power module is characterized in that the circuit block is sealed with a second resin on the power module.

[0011] [3] In [1] or [2] above, the second circuit element includes a capacitor and a resistor; a power module characterized in that one end of the resistor is configured to be electrically connected to the other end of the first connection pin, the other end of the resistor is configured to be electrically connected to a first electrode of the capacitor, and a second electrode of the capacitor is configured to be electrically connected to the other end of the second connection pin.

[0012] [4] In paragraph [3] above: the first circuit element includes a first switching element, a second switching element, a third conductive portion, and a fourth conductive portion; a power module characterized in that one end of the first switching element is electrically connected to the first conductive portion, the other end of the first switching element is electrically connected to the second conductive portion, the second conductive portion is electrically connected to the third conductive portion, the third conductive portion is electrically connected to one end of the second switching element, and the other end of the second switching element is electrically connected to the fourth conductive portion.

[0013] [5] In [1] or [2] above, the second circuit element includes a gate driver; one end of the second connection pin is electrically connected to a control terminal of the first circuit element; A power module characterized in that a control input terminal of the gate driver is configured to be electrically connected to the other end of the first connection pin, and an output terminal of the gate driver is configured to be electrically connected to the other end of the second connection pin.

[0014] [6] In [1] or [2] above, the second circuit element includes a third switching element; one end of the second connection pin is electrically connected to a control terminal of the first circuit element; a first electrode of the third switching element is configured to be electrically connected to the other end of the first connection pin, and a second electrode of the third switching element is configured to be electrically connected to the other end of the second connection pin.

[0015] [7] In [1] or [2] above, the first circuit element includes a current detection circuit including a resistor, a Hall element, and a current transformer; the second circuit element includes an overcurrent detection circuit; one end of the first connection pin is electrically connected to a first terminal of the current detection circuit, and one end of the second connection pin is electrically connected to a second terminal of the current detection circuit; A power module characterized in that a first terminal of the overcurrent detection circuit is configured to be electrically connected to the other end of the first connection pin, and a second terminal of the overcurrent detection circuit is configured to be electrically connected to the other end of the second connection pin.

[0016] [8] A circuit block electrically connected to a circuit block-replaceable power module, the circuit block having the other ends of the first connection pin and the second connection pin protruding, the circuit block has a second circuit element; one end of the second circuit element is configured to be electrically connectable to the other end of the first connection pin; A circuit block mountable on a power module, characterized in that the other end of the second circuit element is configured to be electrically connectable to the other end of the second connection pin.

[0017] [9] In paragraph [8] above: the second circuit element includes a capacitor and a resistor; A circuit block that can be mounted on a power module, characterized in that one end of the resistor is configured to be electrically connectable to the other end of the first connection pin, the other end of the resistor is configured to be electrically connectable to a first electrode of the capacitor, and a second electrode of the capacitor is configured to be electrically connectable to the other end of the second connection pin.

[0018]

[10] In paragraph [8] above: the second circuit element includes a gate driver; A circuit block that can be mounted on a power module, characterized in that a control input terminal of the gate driver is configured to be electrically connectable to the other end of the first connection pin, and an output terminal of the gate driver is configured to be electrically connectable to the other end of the second connection pin.

[0019]

[11] In paragraph [8] above: the second circuit element includes a third switching element; a first electrode of the third switching element configured to be electrically connectable to the other end of the first connection pin, and a second electrode of the third switching element configured to be electrically connectable to the other end of the second connection pin.

[0020]

[12] In paragraph [8] above: the second circuit element includes an overcurrent detection circuit; A circuit block that can be mounted on a power module, characterized in that a first terminal of the overcurrent detection circuit is configured to be electrically connectable to the other end of the first connection pin, and a second terminal of the overcurrent detection circuit is configured to be electrically connectable to the other end of the second connection pin.

[0021]

[13] A step (a) of electrically connecting the circuit block according to any one of claims 8 to 12 to a circuit block replaceable power module via the first connection pin and the second connection pin; a step (b) of adjusting the second circuit element of the circuit block described in the step (a); a step (c) of electrically connecting a circuit block having a second circuit element adjusted by the step (b) to the power module described in the step (a) by the first connection pin and the second connection pin; A method for adjusting a circuit constant comprising the steps of:

[0022]

[14] A step (a) of electrically connecting the circuit block according to any one of claims 8 to 12 to a circuit block replaceable power module via the first connection pin and the second connection pin; (b) sealing the circuit block on the power module with a second resin; A method for manufacturing a power module comprising the steps of: Effect of the Invention

[0023] According to various aspects of the present invention, it is possible to provide a power module that facilitates setting of circuit constants for parasitic inductance. Furthermore, according to various aspects of the present invention, it is possible to provide power modules with different circuit constants for each customer simply by changing the circuit blocks. [Brief description of the drawings]

[0024] [Figure 1] FIG. 1A is a perspective view showing a schematic diagram of a power module 21 according to one embodiment of the present invention, and FIG. 1B is a cross-sectional view showing the power module 21 shown in FIG. 1A and a circuit block 19 connected to the power module 21. [Diagram 2] FIG. 2A is a diagram showing an internal circuit of a module, and FIG. 2B is a schematic diagram for explaining the connection relationship between the internal circuit of the module and a circuit block. [Diagram 3] 1(A) is an oblique view showing a state in which the circuit block 19 shown in FIG. 1(B) is attached to the power module 20 shown in FIG. 1(A) and then sealed with a second resin 31, and FIG. 1(B) is a cross-sectional view showing a state in which the circuit block 19 shown in FIG. 1(A) is sealed with the second resin 31. [Figure 4]1 is a circuit diagram showing a decoupling capacitor and a damper resistor of a power supply line of a switching circuit, which is a module internal circuit 13a. [Diagram 5] 1A is a schematic circuit diagram for explaining a configuration in which a circuit block 19 is connected to a module internal circuit 13b, and FIG. 1B is a circuit diagram showing a gate driver in the module internal circuit 13b. [Figure 6] FIG. 13 is a circuit diagram of a fail-safe circuit when an overcurrent is detected. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0025] Hereinafter, the embodiments of the present invention will be described in detail with reference to the drawings. However, the present invention is not limited to the following description, and it is easily understood by those skilled in the art that the form and details of the present invention can be modified in various ways without departing from the spirit and scope of the present invention. Therefore, the present invention should not be interpreted as being limited to the description of the embodiments shown below.

[0026] FIG. 1(A) is a perspective view illustrating a power module 21 according to one embodiment of the present invention, and FIG. 1(B) is a cross-sectional view illustrating the power module 21 illustrated in FIG. 1(A) and a circuit block 19 connected to the power module 21.

[0027] A power module 20 shown in Figures 1(A) and (B) has an insulating substrate 11. A module internal circuit 13 having a first circuit element 12 shown in Figures 2(A) and (B) is disposed on the insulating substrate 11. The first circuit element 12 is a first switching element (e.g., a MOSFET).

[0028] A first conductive portion 14 is disposed on the insulating substrate 11, and the first conductive portion 14 is electrically connected to one end 12a of the first switching element 12. As shown in Fig. 2(B) , the first conductive portion 14 is formed of, for example, a copper clip.

[0029] A second conductive portion 15 is disposed on the insulating substrate 11, and is electrically connected to the other end 12b of the first switching element 12. The second conductive portion 15 is formed of, for example, a copper pattern. Note that reference numerals 12a and 12b shown in FIG. 2(B) indicate the positions of connection pins.

[0030] 2(A) and 2(B), one end 16a of the first connection pin 16 is joined to the first switching element 12 or the first conductive portion 14, and the joined portion is located on the one end 12a side of the first switching element 12 in the first conductive portion 14. In other words, one end 16a of the first connection pin 16 is joined to the one end 12a side of the first switching element 12 in the first conductive portion 14.

[0031] The one end 16a of the first connection pin 16 and the first conductive portion 14 may be joined by soldering or welding. Alternatively, the first connection pin 16 may be integrally formed with the first conductive portion 14 instead of being joined.

[0032] One end 17a of the second connection pin 17 is joined to the second conductive portion 15, and the joined portion is located on the other end 12b side of the first switching element 12 in the second conductive portion 15. In other words, one end 17a of the second connection pin 17 is joined to the other end 12b side of the first switching element 12 in the second conductive portion 15.

[0033] The method of joining one end 17a of the second connection pin 17 and the second conductive portion 15 can be soldering or welding. Instead of joining, the second connection pin 17 may be formed integrally with the second conductive portion 15.

[0034] The module internal circuit 13, the first conductive portion 14, the second conductive portion 15, one end 16a of the first connection pin 16, and one end 17a of the second connection pin 17 are sealed with a first resin 18 shown in Figures 1(A) and (B).

[0035] Each of the first connection pin 16 and the second connection pin 17 may be formed of a conductive material (for example, a metal such as copper). Each of the first connection pin 16 and the second connection pin 17 may be shaped like a round bar or a square bar, and although a straight-line connection pin is shown in FIG. 1, it may have a curved portion.

[0036] Furthermore, a plurality of connection terminals 52 protrude from first resin 18, and one end of each of the plurality of connection terminals 52 is connected to insulating substrate 11 (see FIGS. 1(A) and (B), 3(A) and (B)).

[0037] 1(A) and 1(B), the circuit block 19 is electrically connected to the first switching element 12 in an exchangeable manner. In other words, the power module 20 has the circuit block 19 that is exchangeably connected.

[0038] The circuit block 19 has a second circuit element 21 (see FIGS. 1 and 2).

[0039] As shown in FIGS. 1(A) and 1(B), the other end 16b of the first connection pin 16 and the other end 17b of the second connection pin 17 protrude from the first resin .

[0040] The circuit blocks 19 are connected by the first connection pins 16 and the second connection pins 17 .

[0041] According to the power module with replaceable circuit blocks according to the present embodiment, the first connection pin 16 electrically connected to one end 12a of the first switching element 12, which is the first circuit element 12 of the module internal circuit 13, and the second connection pin 17 electrically connected to the other end 12b of the first switching element 12, respectively, protrude from the first resin 18. Therefore, by preparing a circuit block 19 having a second circuit element 21, the second circuit element 21 of the circuit block can be easily electrically connected to the first switching element 12 of the power module by the first connection pin 16 and the second connection pin 17 protruding from the first resin 18. By preparing a plurality of circuit blocks 19 with the second circuit element 21 adjusted, trial and error for determining the circuit constants of the power module becomes easier. 2, one end 16a of the first connection pin 16 is joined to a portion of the first conductive section 14 located on one end 12a side of the first switching element 12, and one end 17a of the second connection pin 17 is joined to a portion of the second conductive section 15 located on the other end 12b side of the first switching element 12, so that the first connection pin 16 and the second connection pin 17 are arranged so as to be at the shortest distance from the first switching element 12. This makes it possible to reduce parasitic inductance. Since the second circuit element 21 of the circuit block 19 and the first switching element 12 are connected by such first connection pin 16 and second connection pin 17, it becomes possible to set a circuit constant for reduced parasitic inductance.

[0042] As shown in FIG. 2B, one end 21a of the second circuit element 21 is electrically connected to the other end 16b of the first connection pin 16.

[0043] The other end 21b of the second circuit element 21 is electrically connected to the other end 17b of the second connection pin 17. Note that reference characters 21a and 21b shown in Fig. 2(B) indicate the positions of the connection pins.

[0044] FIG. 3(A) is an oblique view showing a state in which circuit block 19 shown in FIG. 1(B) is attached to power module 20 shown in FIG. 1(A) and then sealed with second resin 31, and FIG. 3(B) is a cross-sectional view showing a state in which circuit block 19 shown in FIG. 3(A) is sealed with second resin 31.

[0045] When the circuit block 19 is made replaceable from the power module 20, the other end 16b of the first connection pin 16 and one end 21a of the second circuit element 21 can be connected using sockets 51a and 51b. The other end 16b of the first connection pin 16 is inserted into the socket 51a, and the other end 17b of the second connection pin 17 is inserted into the socket 51b (see Figs. 1B and 3B). After the circuit constants have been set and there is no need to replace the circuit block 19, the other end 16b of the first connection pin 16 and one end 21a of the second circuit element 21 can be joined by soldering or welding. Instead of joining, the other end 16b of the first connection pin 16 may be integrally formed with the circuit block 19.

[0046] The circuit block 19 is sealed on the power module 20 with a second resin 31 (see FIG. 3).

[0047] According to the power module of this embodiment, the circuit block 19, in which a suitable circuit constant for the parasitic inductance can be set, is electrically connected to the first circuit element 12 of the power module 20, and the circuit block 19 is sealed on the power module 20 with the second resin, making it possible to provide power modules with different circuit constants for each customer.

[0048] Fig. 2(A) is a circuit diagram showing a CR snubber of a three-phase inverter, which is the module internal circuit 13. Fig. 2(B) is a schematic circuit diagram for explaining a configuration in which a circuit block 19 is connected to the module internal circuit 13. As shown in Figs. 2(A) and 2(B), the second circuit element 21 has a capacitor 32 and a resistor 33.

[0049] 2(B), one end of resistor 33 is configured to be electrically connectable to the other end 16b of first connection pin 16. The other end of resistor 33 is electrically connected to a first electrode of capacitor 32. A second electrode of capacitor 32 is configured to be electrically connectable to the other end 17b of second connection pin 17.

[0050] According to this embodiment, by preparing a circuit block 19 having a capacitor 32 and a resistor 33 of a CR snubber, the capacitor 32 and the resistor 33 of the circuit block 19 can be easily electrically connected to the first switching element 12 of the power module by the first connection pin 16 and the second connection pin 17 protruding from the first resin 18 shown in Fig. 1. By preparing a plurality of circuit blocks 19 in which the capacitor 32 and the resistor 33 are adjusted, trial and error for determining the circuit constant of the power module becomes easy. In addition, since the capacitor 32 and the resistor 33 of the circuit block 19 are connected to the first switching element 12 by the first connection pin 16 and the second connection pin 17, it becomes possible to set the circuit constant for reduced parasitic inductance.

[0051] Fig. 4 is a circuit diagram of the module internal circuit 13a, showing a decoupling capacitor and a damper resistor in the power supply line of the switching circuit. The first circuit element 12d shown in Fig. 4 has a first switching element 34, a second switching element 35, and a third conductive part 36 and a fourth conductive part 37 shown in Fig. 2(B).

[0052] As shown in FIG. 2(B), one end of the first switching element 34 is electrically connected to the first conductive portion 14, and the other end of the first switching element 34 is electrically connected to the second conductive portion 15. The second conductive portion 15 is electrically connected to the third conductive portion 36. The third conductive portion 36 is electrically connected to one end of the second switching element 35, and the other end of the second switching element 35 is electrically connected to the fourth conductive portion 37. Each of the first conductive portion 14 and the third conductive portion 36 is formed, for example, by a copper clip. Each of the second conductive portion 15 and the fourth conductive portion 37 is formed, for example, by a copper pattern.

[0053] According to this embodiment, by preparing a circuit block 19 having a decoupling capacitor 32a and a damper resistor 33a, the decoupling capacitor 32a and the damper resistor 33a of the circuit block 19 can be easily electrically connected to the first switching element 34 and the second switching element 35 of the power module by the first connection pin 16 and the second connection pin 17 protruding from the first resin 18 shown in FIG. 1. By preparing a plurality of circuit blocks 19 in which the decoupling capacitor 32a and the damper resistor 33a are adjusted, trial and error for determining the circuit constant of the power module becomes easy. In addition, since the decoupling capacitor 32a and the damper resistor 33a of the circuit block 19 are connected to the first switching element 34 and the second switching element 35 by the first connection pin 16 and the second connection pin 17, it is possible to set the circuit constant for reduced parasitic inductance.

[0054] Fig. 5(A) is a schematic circuit diagram for explaining a configuration in which the circuit block 19 is connected to the module internal circuit 13b. Fig. 5(B) is a circuit diagram showing a gate driver in the module internal circuit 13b. The second circuit element 21 has a gate driver 38.

[0055] As shown in FIG. 5(A), one end 17a of the second connection pin 17 is electrically connected to the control terminal 12c of the first switching element 12.

[0056] A control input terminal 39 of the gate driver 38 is configured to be electrically connectable to the other end 16b of the first connection pin 16. An output terminal 40 of the gate driver 38 is configured to be electrically connectable to the other end 17b of the second connection pin 17.

[0057] According to this embodiment, by preparing a circuit block 19 having a gate driver 38, the gate driver 38 of the circuit block 19 can be easily electrically connected to the first switching element 12 of the power module by the first connection pin 16 and the second connection pin 17 protruding from the first resin 18 shown in Fig. 1. By preparing a plurality of circuit blocks 19 with adjusted gate drivers 38, trial and error for determining the circuit constants of the power module becomes easy. In addition, since the gate driver 38 of the circuit block 19 is connected to the first switching element 12 by the first connection pin 16 and the second connection pin 17, it becomes possible to set the circuit constants for reduced parasitic inductance.

[0058] 6 is a circuit diagram of a fail-safe circuit when an overcurrent is detected. The second circuit element 21 has a bipolar transistor 41 as a third switching element.

[0059] One end of the second connection pin 17 is electrically connected to a control terminal of a first switching element 12 serving as a first circuit element.

[0060] An emitter electrode 43 as a first electrode of bipolar transistor 41 as a third switching element is configured to be electrically connectable to the other end of first connection pin 16. A collector electrode 42 as a second electrode of bipolar transistor 41 as a third switching element is configured to be electrically connectable to the other end of second connection pin 17.

[0061] The module internal circuit shown in FIG. 6 has a current detection circuit 45 as a first circuit element that includes a resistor, a Hall element, and a current transformer.

[0062] The second circuit element 21 includes an overcurrent detection circuit 44 .

[0063] One end 16a of the first connection pin 16 shown in FIG. 1 is electrically connected to a first terminal of the current detection circuit 45, and one end 17a of the second connection pin 17 is electrically connected to a second terminal of the current detection circuit 45.

[0064] A first terminal of the overcurrent detection circuit 44 is configured to be electrically connectable to the other end 16b of the first connection pin 16 shown in Fig. 1. A second terminal of the overcurrent detection circuit 44 is configured to be electrically connectable to the other end 17b of the second connection pin 17 shown in Fig. 1.

[0065] According to this embodiment, by preparing a circuit block 19 having an overcurrent detection circuit 44, the overcurrent detection circuit 44 of the circuit block 19 can be easily electrically connected to the current detection circuit 45 of the power module by the first connection pin 16 and the second connection pin 17 protruding from the first resin 18 shown in Fig. 1. By preparing a plurality of circuit blocks 19 with adjusted overcurrent detection circuits 44, trial and error for determining the circuit constant of the power module becomes easy. In addition, since the overcurrent detection circuit 44 and the current detection circuit 45 of the circuit block 19 are connected by the first connection pin 16 and the second connection pin 17, it becomes possible to set the circuit constant for reduced parasitic inductance.

[0066] As shown in FIG. 1, the circuit block 19 is electrically connected to a power module 20 which is a replaceable circuit block, and the other ends 16b, 17b of the first connection pin 16 and the second connection pin 17 of the power module 20 protrude.

[0067] The circuit block 19 has a second circuit element 21 (see FIGS. 1 and 2).

[0068] One end 21 a of the second circuit element 21 is configured to be electrically connectable to the other end 16 b of the first connection pin 16 .

[0069] The other end 21 b of the second circuit element 21 is configured to be electrically connectable to the other end 17 b of the second connection pin 17 .

[0070] According to this embodiment, a power module 20 with replaceable circuit blocks is prepared. In this power module 20 with replaceable circuit blocks, the other ends 16b, 17b of the first connection pin 16 and the second connection pin 17 protrude. A circuit block 19 having a second circuit element 21 is prepared, and one end 21a of the second circuit element 21 is configured to be electrically connectable to the other end 16a of the first connection pin 16, and the other end 21b of the second circuit element 21 is configured to be electrically connectable to the other end 17b of the second connection pin 17. Since such a circuit block 19 can be electrically connected to the power module 20 with replaceable circuit blocks, various circuit blocks can be prepared, and a power module with different circuit constants for each customer can be realized.

[0071] As shown in FIGS. 2A and 2B, the second circuit element 21 includes a capacitor 32 and a resistor 33.

[0072] 2(B), one end of resistor 33 is configured to be electrically connectable to the other end 16b of first connection pin 16. The other end of resistor 33 is electrically connected to a first electrode of capacitor 32. A second electrode of capacitor 32 is configured to be electrically connectable to the other end 17b of second connection pin 17.

[0073] According to this embodiment, by preparing a circuit block 19 having a capacitor 32 and a resistor 33 of a CR snubber, the capacitor 32 and the resistor 33 of the circuit block 19 can be easily electrically connected to the first switching element 12 of the power module by the first connection pin 16 and the second connection pin 17 protruding from the first resin 18 shown in Fig. 1. By preparing a plurality of circuit blocks 19 in which the capacitor 32 and the resistor 33 are adjusted, trial and error for determining the circuit constant of the power module becomes easy. In addition, since the capacitor 32 and the resistor 33 of the circuit block 19 are connected to the first switching element 12 by the first connection pin 16 and the second connection pin 17, it becomes possible to set the circuit constant for reduced parasitic inductance.

[0074] The second circuit element 21 shown in FIGS. 5(A) and 5(B) has a gate driver 38.

[0075] A control input terminal 39 of the gate driver 38 is configured to be electrically connectable to the other end 16b of the first connection pin 16. An output terminal 40 of the gate driver 38 is configured to be electrically connectable to the other end 17b of the second connection pin 17.

[0076] According to this embodiment, by preparing a circuit block 19 having a gate driver 38, the gate driver 38 of the circuit block 19 can be easily electrically connected to the first switching element 12 of the power module by the first connection pin 16 and the second connection pin 17 protruding from the first resin 18 shown in Fig. 1. By preparing a plurality of circuit blocks 19 with adjusted gate drivers 38, trial and error for determining the circuit constants of the power module becomes easy. In addition, since the gate driver 38 of the circuit block 19 is connected to the first switching element 12 by the first connection pin 16 and the second connection pin 17, it becomes possible to set the circuit constants for reduced parasitic inductance.

[0077] The second circuit element 21 shown in FIG. 6 has a bipolar transistor 41 as a third switching element.

[0078] An emitter electrode 43 as a first electrode of bipolar transistor 41 as a third switching element is configured to be electrically connectable to the other end of first connection pin 16. A collector electrode 42 as a second electrode of bipolar transistor 41 as a third switching element is configured to be electrically connectable to the other end of second connection pin 17.

[0079] The second circuit element 21 shown in FIG.

[0080] A first terminal of the overcurrent detection circuit 44 is configured to be electrically connectable to the other end 16b of the first connection pin 16 shown in Fig. 1. A second terminal of the overcurrent detection circuit 44 is configured to be electrically connectable to the other end 17b of the second connection pin 17 shown in Fig. 1.

[0081] According to this embodiment, by preparing a circuit block 19 having an overcurrent detection circuit 44, the overcurrent detection circuit 44 of the circuit block 19 can be easily electrically connected to the current detection circuit 45 of the power module by the first connection pin 16 and the second connection pin 17 protruding from the first resin 18 shown in Fig. 1. By preparing a plurality of circuit blocks 19 with adjusted overcurrent detection circuits 44, trial and error for determining the circuit constant of the power module becomes easy. In addition, since the overcurrent detection circuit 44 and the current detection circuit 45 of the circuit block 19 are connected by the first connection pin 16 and the second connection pin 17, it becomes possible to set the circuit constant for reduced parasitic inductance.

[0082] The method for adjusting the circuit constants will be described below.

[0083] First, the above-mentioned circuit block 19 is electrically connected to the power module 20, which has replaceable circuit blocks, via the first connection pins 16 and the second connection pins 17 (step (a)).

[0084] The second circuit element 21 of the circuit block 19 described in the above step (a) is adjusted (step (b)).

[0085] The circuit block 19 having the second circuit element 21 adjusted by the above step (b) is electrically connected to the power module 20 described in step (a) by the first connection pin 16 and the second connection pin 17 (step (c)).

[0086] According to the above-mentioned method for adjusting the circuit constant, since it includes the step (b) of adjusting the second circuit element 21 of the circuit block 19, the circuit block 19 having the adjusted second circuit element 21 can be electrically connected to the power module 20 described in the step (a) by the first connection pin 16 and the second connection pin 17. Therefore, it is possible to provide power modules with different circuit constants for each customer.

[0087] The manufacturing method of the power module will be described below.

[0088] The circuit block 19 according to claim 3 is electrically connected to the power module 20, which is a replaceable circuit block, by the first connection pin 16 and the second connection pin 17 (step (a)).

[0089] As shown in FIGS. 3(A) and 3(B), the circuit block 19 is sealed with a second resin (31) on the power module 20 (step (b)).

[0090] According to the above-mentioned method for manufacturing a power module, the circuit block 19 according to claim 3 is electrically connected to the power module 20, which is circuit block replaceable, by the first connection pin 16 and the second connection pin 17, and the circuit block 19 is sealed on the power module 20 by the second resin (31). As a result, even when a power module with a different circuit constant is required for each customer, it is only necessary to change the circuit block, which makes it easier to adjust production and improves productivity. [Explanation of symbols]

[0091] 11 Insulating substrate 12, 12d First circuit element 12a One end of the first circuit element 12b the other end of the first circuit element 12c Control terminal 13 Module internal circuit 14 First conductive part 15 Second conductive part 16 First connecting pin 16a One end of the first connecting pin 16b The other end of the first connecting pin 17 Second connecting pin 17a One end of the second connecting pin 17b The other end of the second connecting pin 18 First Resin 19 Circuit Blocks 20 Power Module 21 Second circuit element 21a One end of the second circuit element 21b the other end of the second circuit element 31 Second Resin 32,32a capacitor 33,33a resistance 34 First switching element 35 Second switching element 36 Third conductive part 37 Fourth conductive part 38 Gate Driver 39 Control input terminal 40 Gate driver output terminal 41 Third switching element 42 Second electrode of third switching element 43 First electrode of third switching element 44 Overcurrent detection circuit 45 Current detection circuit

Claims

1. An insulating substrate; a module internal circuit disposed on the insulating substrate and having a first circuit element; a first conductive portion disposed on the insulating substrate and electrically connected to one end of the first circuit element; a second conductive portion disposed on the insulating substrate and electrically connected to the other end of the first circuit element; a first connection pin located on one end side of the first circuit element in the first conductive portion and having one end joined to the first conductive portion; a second connection pin located on the other end side of the second conductive portion relative to the first circuit element, the second connection pin having one end joined to the second conductive portion; a first resin that seals the module internal circuit, the first conductive portion, the second conductive portion, one end side of the first connection pin, and one end side of the second connection pin; a circuit block exchangeably and electrically connected to the first circuit element; Including, the circuit block includes a second circuit element; the other end side of the first connection pin and the other end side of the second connection pin protrude from the first resin, the circuit blocks are connected by the first connection pins and the second connection pins; the second circuit element includes a gate driver; one end of the second connection pin is electrically connected to a control terminal of the first circuit element; A power module characterized in that a control input terminal of the gate driver is configured to be electrically connected to the other end of the first connection pin, and an output terminal of the gate driver is configured to be electrically connected to the other end of the second connection pin.

2. An insulating substrate; a module internal circuit disposed on the insulating substrate and having a first circuit element; a first conductive portion disposed on the insulating substrate and electrically connected to one end of the first circuit element; a second conductive portion disposed on the insulating substrate and electrically connected to the other end of the first circuit element; a first connection pin located on one end side of the first circuit element in the first conductive portion and having one end joined to the first conductive portion; a second connection pin located on the other end side of the second conductive portion relative to the first circuit element, the second connection pin having one end joined to the second conductive portion; a first resin that seals the module internal circuit, the first conductive portion, the second conductive portion, one end side of the first connection pin, and one end side of the second connection pin; a circuit block exchangeably and electrically connected to the first circuit element; Including, the circuit block includes a second circuit element; the other end side of the first connection pin and the other end side of the second connection pin protrude from the first resin, the circuit blocks are connected by the first connection pins and the second connection pins; the second circuit element includes a third switching element; one end of the second connection pin is electrically connected to a control terminal of the first circuit element; a first electrode of the third switching element is configured to be electrically connectable to the other end of the first connection pin, and a second electrode of the third switching element is configured to be electrically connectable to the other end of the second connection pin.

3. An insulating substrate; a module internal circuit disposed on the insulating substrate and having a first circuit element; a first conductive portion disposed on the insulating substrate and electrically connected to one end of the first circuit element; a second conductive portion disposed on the insulating substrate and electrically connected to the other end of the first circuit element; a first connection pin located on one end side of the first circuit element in the first conductive portion and having one end joined to the first conductive portion; a second connection pin located on the other end side of the second conductive portion relative to the first circuit element, the second connection pin having one end joined to the second conductive portion; a first resin that seals the module internal circuit, the first conductive portion, the second conductive portion, one end side of the first connection pin, and one end side of the second connection pin; a circuit block exchangeably and electrically connected to the first circuit element; Including, the circuit block includes a second circuit element; the other end side of the first connection pin and the other end side of the second connection pin protrude from the first resin, the circuit blocks are connected by the first connection pins and the second connection pins; the first circuit element includes a current detection circuit including a resistor, a Hall element, and a current transformer; the second circuit element includes an overcurrent detection circuit; one end of the first connection pin is electrically connected to a first terminal of the current detection circuit, and one end of the second connection pin is electrically connected to a second terminal of the current detection circuit; A power module characterized in that a first terminal of the overcurrent detection circuit is configured to be electrically connected to the other end of the first connection pin, and a second terminal of the overcurrent detection circuit is configured to be electrically connected to the other end of the second connection pin.

4. In any one of claims 1 to 3, one end of the second circuit element is electrically connected to the other end of the first connection pin; the other end of the second circuit element is electrically connected to the other end of the second connection pin; The power module is characterized in that the circuit block is sealed with a second resin on the power module.

5. a circuit block electrically connected to a power module in which the other ends of the first connection pin and the second connection pin protrude, the power module being replaceable with a circuit block; the circuit block has a second circuit element; one end of the second circuit element is configured to be electrically connectable to the other end of the first connection pin; the other end of the second circuit element is configured to be electrically connectable to the other end of the second connection pin; the second circuit element includes a gate driver; A circuit block that can be mounted on a power module, characterized in that a control input terminal of the gate driver is configured to be electrically connectable to the other end of the first connection pin, and an output terminal of the gate driver is configured to be electrically connectable to the other end of the second connection pin.

6. a circuit block electrically connected to a power module in which the other ends of the first connection pin and the second connection pin protrude, the power module being replaceable with a circuit block; the circuit block has a second circuit element; one end of the second circuit element is configured to be electrically connectable to the other end of the first connection pin; the other end of the second circuit element is configured to be electrically connectable to the other end of the second connection pin; the second circuit element includes a third switching element; a first electrode of the third switching element is configured to be electrically connectable to the other end of the first connection pin, and a second electrode of the third switching element is configured to be electrically connectable to the other end of the second connection pin.

7. a circuit block electrically connected to a power module in which the other ends of the first connection pin and the second connection pin protrude, the power module being replaceable with a circuit block; the circuit block has a second circuit element; one end of the second circuit element is configured to be electrically connectable to the other end of the first connection pin; the other end of the second circuit element is configured to be electrically connectable to the other end of the second connection pin; the second circuit element includes an overcurrent detection circuit; A circuit block that can be mounted on a power module, characterized in that a first terminal of the overcurrent detection circuit is configured to be electrically connectable to the other end of the first connection pin, and a second terminal of the overcurrent detection circuit is configured to be electrically connectable to the other end of the second connection pin.

8. A step (a) of electrically connecting the circuit block according to any one of claims 5 to 7 to a circuit block replaceable power module by the first connection pins and the second connection pins; a step (b) of adjusting the second circuit element of the circuit block described in the step (a); a step (c) of electrically connecting a circuit block having a second circuit element adjusted by the step (b) to the power module described in the step (a) via the first connection pin and the second connection pin; A method for adjusting a circuit constant comprising the steps of:

9. A step (a) of electrically connecting the circuit block according to any one of claims 5 to 7 to a circuit block replaceable power module by the first connection pins and the second connection pins; (b) sealing the circuit block on the power module with a second resin; A method for manufacturing a power module comprising the steps of:

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