Signal transceiver device, power supply structure, and antenna

Abstract

To provide a signal transceiver device, a power supply structure, and an antenna, capable of improving passive intermodulation performance.SOLUTION: A signal transceiver device 101 contains: a first mold cavity 102 to which a first interface 1021 is arranged; a first filter circuit 105 that is arranged to the first mold cavity in which a first end part is connected to the first interface; a second mold cavity 104 in which the second interface 1041 and a third interface 1024 are arranged; a second filter circuit 107 that is arranged to the second mold cavity in which the first end part is connected to the second interface; and a connection construction element 108 that contains the first and second end parts being arranged on the sides opposite each other, in which the first end part is connected to the second end part of the first filter circuit, the third end part is connected to the second end part of the second filter circuit, and the second end part is connected to the third interface.SELECTED DRAWING: Figure 8

Description

[Technical field]

[0001] FIELD OF THE DISCLOSURE

[0001] Embodiments of the present application relate to the field of communications technology, and in particular to signal transceiver devices, feeding structures, and antennas. [Background technology]

[0002]

[0002] Signal transceiver device, such as combiner, is an important part of base station antenna. The function of signal transceiver device is to combine two or more paths of radio frequency signals transmitted from different transmitters into one path of signal, and send the path of signal to radio frequency device for antenna transmission, and at the same time avoid mutual influence between port signals.

[0003]

[0003] The signal transceiver device typically includes multiple cavities, and a section of a filter circuit is disposed in each cavity. As shown in Figures 1, 2, and 3, the signal transceiver device further includes a connecting member 01, where the connecting member 01 is configured to connect the filter circuits in adjacent cavities.

[0004]

[0004] However, the assembly tolerance of the connecting members is large, and the passive intermodulation (PIM) performance of the signal transceiver device is easily affected. Summary of the Invention

[0005]

[0005] The embodiments of the present application provide a signal transceiver device, a feeding structure, and an antenna to solve the problem of poor passive intermodulation performance of the signal transceiver device.

[0006]

[0006] In order to achieve the aforementioned objectives, the following technical solutions are used in this application:

[0007] According to a first aspect of the present application, there is provided a signal transceiver apparatus, the apparatus comprising: a first cavity, the first interface being disposed in the first cavity; a first filter circuit, the first filter circuit being disposed in the first cavity, the first filter circuit including a first end and a second end opposite each other, the first end of the first filter being connected to the first interface, the first filter circuit being configured to transmit a signal in a first frequency band; a second cavity, the second interface and the third interface being disposed in the second cavity, the first filter circuit and the second filter circuit being in parallel; a second filter circuit, the second filter circuit being disposed in the second cavity, the second filter circuit including a first end and a second end opposed to each other, the first end of the second filter circuit being connected to the second interface, the second filter circuit being configured to transmit signals in a second frequency band; and a connection component, the connection component including a first end and a second end opposite each other, and a third end between the first end of the connection component and the second end of the connection component, the first end of the connection component being disposed in a first cavity, the first end of the connection component being connected to a second end of a first filter circuit, the third end of the connection component being disposed in a second cavity, the third end of the connection component being connected to a second end of a second filter circuit, and the second end of the connection component being connected to a third interface; the connection component utilizing an integrated structure, the connection component being configured to transmit signals of a first frequency band and a second frequency band. Thus, compared with the prior art in which filter circuits in different cavities are connected via multiple connection structures, the integrated structure of the connection component reduces assembly tolerances and improves the passive intermodulation performance of the signal transceiver device.

[0008]

[0008] In an optional implementation, the signal transceiver device further includes: a first printed circuit board PCB, the first filter circuit is disposed on the first PCB, the first cavity is provided with a first mating slot, and the first PCB is removably connected to the first mating slot; and a second PCB, the second filter circuit is disposed on the second PCB, the second cavity is provided with a second mating slot, and the second PCB is removably connected to the second mating slot; Therefore, the assembly method is simpler and the assembly difficulty is reduced.

[0009]

[0009] In an optional implementation, the first cavity is provided with a first opening, and the shape of the first opening is matched with the shape of the first PCB, so that the first PCB can be engaged with the first engagement slot through the first opening; and the second cavity is provided with a second opening, and the shape of the second opening is matched with the shape of the second PCB, so that the second PCB can be engaged with the second engagement slot through the second opening. Thus, after the first cavity and the second cavity are formed respectively, the first PCB can be installed through the first opening, and the second PCB can be installed through the second opening, thereby reducing the difficulty of assembly.

[0010]

[0010] In an optional implementation, a first weld port is disposed on the first opening, and the first weld port is located on the first end of the connection component, so that the first end of the connection component and the second end of the first filter circuit are welded through the first weld port; and a second weld port is disposed on the second opening, and the second weld port is located on the third end of the connection component, so that the third end of the connection component and the second end of the second filter circuit are welded through the second weld port. Thus, after the first cavity and the second cavity are formed respectively, the connection component and the first filter circuit can be welded through the first weld port, and the connection component and the second filter circuit can be welded through the second weld port, thereby reducing the difficulty of assembly.

[0011]

[0011] In an optional implementation, the first cavity or the second cavity is provided with a third opening, and the shape of the third opening is consistent with the shape of the connection component, so that the connection component can enter the first cavity and the second cavity through the third opening. Therefore, after the first cavity and the second cavity are formed respectively, the connection component can be attached through the third opening, thereby reducing the difficulty of assembly.

[0012]

[0012] In an optional implementation, the signal transceiver device further includes: a third cavity, the third cavity being located between the first cavity and the second cavity, and a fourth interface being disposed in the third cavity; and a third filter circuit, the third filter circuit being disposed in the third cavity, the third filter circuit including a first end and a second end opposite each other, the first end of the third filter circuit being connected to the third interface and the second end of the third filter circuit being connected to a fourth end of the connection component, the third filter circuit being configured to transmit signals in a third frequency band; the fourth end of the connection component being located between the first end of the connection component and the third end of the connection component, and the connection component being further configured to transmit signals in the third frequency band. Therefore, the connection components can be connected to multiple filter circuits simultaneously, and multiple signal paths may be combined into one signal path, or one signal path may be split into multiple signal paths. Furthermore, the connection components utilize an integrated structure, which reduces assembly tolerances and improves the passive intermodulation performance of the signal transceiver device.

[0013]

[0013] In an optional implementation, the signal transceiver device further includes: a third PCB, the connection component is disposed on the third PCB, the third cavity is provided with a third mating slot, and the third PCB is removably connected to the third mating slot; and the third cavity is provided with a fourth opening, and the shape of the fourth opening matches the shape of the third PCB. Thus, after the third cavity is formed, the third PCB can be installed through the fourth opening, thereby reducing the difficulty of assembly.

[0014]

[0014] In an optional implementation, a third weld port is disposed in the third cavity, and the third weld port is located above the fourth end of the connection component, so that the fourth end of the connection component and the second end of the third filter circuit are welded through the third weld port. Thus, after the third cavity is formed, the connection component and the third filter circuit can be welded through the third weld port, thereby reducing the difficulty of assembly.

[0015]

[0015] In an optional implementation, the first interface, the second interface, and the fourth interface are configured to be connected to a signal input end, and the third interface is configured to be connected to a signal output end; or the first interface, the second interface, and the fourth interface are configured to be connected to a signal output end, and the third interface is configured to be connected to a signal input end. Thus, the signal transceiver device can combine multiple signal paths into one signal path through the connecting component, or split one signal path into multiple signal paths, so that the signal transceiver device is more widely used.

[0016]

[0016] In an optional implementation, each of the first filter circuit, the second filter circuit, and the third filter circuit includes a main transmission line and a plurality of open circuit filter stubs connected to the main transmission line, so that a passband signal can be transmitted through the main transmission line.

[0017]

[0017] In an optional implementation, the length of the open circuit filter stub is λ1 / 8 to λ1 / 2, where λ1 is a wavelength corresponding to a stopband signal frequency band. Thus, the open circuit filter stub may be used as a resonator to create a resonance in the stopband frequency band, and the stopband signal can be transmitted back and forth only through the open circuit filter stub, so that the stopband signal can be filtered out.

[0018]

[0018] In an optional implementation, the connection component includes at least one impedance-transforming transmission line segment, the length of the impedance-transforming transmission line segment being greater than λ2 / 12, where λ2 is a wavelength corresponding to a maximum frequency in the input signal. Thus, the impedance-transforming transmission line segment can perform impedance matching for signals of different frequency bands, so that the connection component can simultaneously transmit signals of different frequency bands.

[0019]

[0019] According to a second aspect of the present application, there is further provided a feeding structure, the feeding structure comprising: a phase shifter and the above-mentioned signal transceiver device, the phase shifter being electrically connected to the signal transceiver device. Thus, the above-mentioned signal transceiver device is used in the feeding structure, which reduces the assembly tolerance and improves the passive intermodulation performance of the system.

[0020]

[0020] According to a second aspect of the present application, an antenna is further provided, the antenna includes: at least one antenna array, the antenna array includes: at least one radiating element, a reflector panel, and the above-mentioned feeding structure, the radiating element is disposed on the reflector panel, and the feeding structure is connected to the radiating element. Thus, the antenna uses the above-mentioned feeding structure and has the same effect as the above-mentioned feeding structure. Details will not be described again here.

[0021]

[0021] In an optional implementation, the antenna further includes a radome, and the radiating element, the reflector panel, and the feeding structure are within a cavity enclosed by the radome. Thus, the radome can reduce the influence of the external environment on the antenna. [Brief description of the drawings]

[0022] [Figure 1] FIG. 1 is a schematic diagram of the structure of a signal transceiver device. [Diagram 2]

[0023] FIG. 2 is a schematic diagram of an exploded structure of the signal transceiver device in FIG. [Diagram 3]

[0024] FIG. 3 is a schematic diagram of the structure of the connection member. [Figure 4]

[0025] FIG. 2 is a schematic diagram of the structure of another signal transceiver device; [Diagram 5]

[0026] FIG. 5 is a schematic diagram of an exploded structure of the signal transceiver device in FIG. [Figure 6]

[0027] FIG. 6 is a schematic diagram of the structure of a signal transceiver device according to an embodiment of the present application. [Figure 7]

[0028] FIG. 7 is a schematic diagram of an exploded structure of the signal transceiver device in FIG. [Figure 8]

[0029] FIG. 8 is a schematic diagram of the structure of another signal transceiver device according to an embodiment of the present application. [Figure 9]

[0030] FIG. 9 is a schematic diagram of an exploded structure of the signal transceiver device in FIG. [Figure 10]

[0031] FIG. 10 is a plan view of the signal transceiver device in FIG. [Figure 11]

[0032] FIG. 9 is a schematic diagram of the structure of the connection component in FIG. 8. [Figure 12]

[0033] FIG. 12 is a schematic structural diagram of a power supply structure according to an embodiment of the present application. [Figure 13]

[0034] FIG. 13 is a schematic diagram of an exploded structure of a power supply structure according to an embodiment of the present application. [Figure 14]

[0035] FIG. 14 is a plan view of the power supply structure of FIG. [Figure 15]

[0036] FIG. 15 is a plan view of the phase shifter of FIG. [Figure 16]

[0037] FIG. 16 is a plan view of the signal transceiver device in FIG. [Figure 17]

[0038] FIG. 17 is a cross-sectional view of the power supply structure in FIG. [Figure 18]

[0039] FIG. 18 is a schematic diagram of an exploded structure of another power supply structure according to an embodiment of the present application. [Figure 19]

[0040] FIG. 19 is a plan view of the feed structure in FIG. [Figure 20]

[0041] FIG. 20 is a cross-sectional view of the power supply structure in FIG. [Figure 21]

[0042] FIG. 21 is a schematic diagram of an antenna structure according to an embodiment of the present application. [Figure 22]

[0043] FIG. 22 is a schematic diagram of the structure of a base station antenna feeder system according to an embodiment of the present application. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0023]

[0044] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be described in more detail hereinafter with reference to the accompanying drawings.

[0024]

[0045] The terms "first" and "second" referred to below are intended for descriptive purposes only and shall not be understood as an indication or implication of relative importance or an implied indication of the number of technical features depicted. Thus, a feature defined by "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, unless otherwise stated, "plurality" means two or more.

[0025]

[0046] Furthermore, in this application, directional terms such as "top" and "bottom" are defined with respect to the orientation in which components are generally disposed in the accompanying drawings. It should be understood that these directional terms are relative concepts and are used for relative description and clarity, and may vary depending on the orientation in which components are disposed in the accompanying drawings.

[0026]

[0047] The following describes terms that may appear in the embodiments of the present application.

[0027]

[0048] Insertion loss is the loss of load power that occurs at a location in a transmission system due to the insertion of a component or device, expressed as the ratio in decibels of the power experienced by the load before the insertion of the component or device to the power experienced by the same load after the insertion.

[0028]

[0049] Passive Intermodulation (PIM): When two or more frequencies are mixed together in a nonlinear device, spurious signals are created.

[0029]

[0050] An embodiment of the present application provides a signal transceiver device. The signal transceiver device includes two or more cavities. As shown in FIG. 4, the signal transceiver device 101 includes a first cavity 102, a second cavity 104, and a third cavity 103.

[0030]

[0051] A first filter circuit 105 is disposed in the first cavity 102 , a second filter circuit 107 is disposed in the second cavity 104 , and a third filter circuit 106 is disposed in the third cavity 103 .

[0031]

[0052] The signal transceiver device 101 further includes a connection component 108, where the connection component 108 includes a first end and a second end opposite each other, and a third end and a fourth end located between the first end of the connection component 108 and the second end of the connection component 108.

[0032]

[0053] A first end of the connection component 108 is disposed in the first cavity 102, and the first end of the connection component 108 is connected to a second end of the first filter circuit 105. A third end of the connection component 108 is disposed in the second cavity 104, and the third end of the connection component 108 is connected to a second end of the second filter circuit 107. A fourth end of the connection component 108 is disposed in the third cavity 106, and the fourth end of the connection component 108 is connected to a second end of the third filter circuit 106. A second end of the connection component 108 is connected to an interface in the second cavity.

[0033]

[0054] In some embodiments of the present application, the connection component 108, the first filter circuit 105, the second filter circuit 107, and the third filter circuit 106 are integrally formed, and the connection component 108, the first filter circuit 105, the second filter circuit 107, and the third filter circuit 106 are all disposed on a Printed Circuit Board (PCB). The connection component 108 passes across the three cavities.

[0034]

[0055] 5 , the signal transceiver device 101 includes a base 001 and a cover plate 002. During assembly, the connection components 108, the first filter circuit 105, the second filter circuit 107, and the third filter circuit 106 are first assembled on a PCB, the assembled PCB is attached to the base 001, and finally the cover plate 002 is welded to the base 001.

[0035]

[0056] However, the above-mentioned assembly method is likely to affect the passive intermodulation (PIM) performance of the signal transceiver device 101, and has high requirements for the assembly process, which increases the difficulty of assembly and makes maintenance difficult.

[0036]

[0057] Thus, the embodiments of the present application provide an improved signal transceiver device 101.

[0037]

[0058] In some embodiments of the present application, as shown in FIGS. 6 and 7, a signal transceiver device 101 includes a first cavity 102 and a second cavity 104 .

[0038]

[0059] The first filter circuit 105 is disposed within the first cavity 102 , and the first interface 1021 is disposed in the first cavity 102 .

[0039]

[0060] The first filter circuit 105 includes a first end and a second end opposite to each other, the first end of the first filter circuit 105 is connected to the first interface 1021, and the first filter circuit 105 transmits a signal in a first frequency band.

[0040]

[0061] The second filter circuit 107 is disposed in the second cavity 104, the second interface 1041 is disposed in the second cavity 104, and the third interface 1024 is disposed in the first cavity 102. The first filter circuit 105 and the second filter circuit 107 are in parallel.

[0041]

[0062] It should be noted that the above parallel is not parallel in the strict mathematical sense, and there may be an error. If the error is less than a preset threshold, the first filter circuit and the second filter circuit are considered to be parallel.

[0042]

[0063] It should be noted that in some other embodiments of the present application, for example, the third interface 1024 may be disposed in the second cavity 104 .

[0043]

[0064] The second filter circuit 107 includes a first end and a second end opposite to each other, the first end of the second filter circuit 107 is connected to the second interface 1041, and the second filter circuit 107 is configured to transmit a signal in a second frequency band.

[0044]

[0065] The signal transceiver device 101 further includes a connection component 108, where the connection component 108 includes a first end and a second end opposite each other, and a third end located between the first end of the connection component 108 and the second end of the connection component 108.

[0045]

[0066] A first end of the connection component 108 is disposed in the first cavity 102, and the first end of the connection component 108 is connected to a second end of the first filter circuit 105. A third end of the connection component 108 is disposed in the second cavity 104, and the third end of the connection component 108 is connected to a second end of the second filter circuit 107. A second end of the connection component 108 is connected to the third interface 1024.

[0046]

[0067] The connection component 108 is configured to transmit signals in the first frequency band and the second frequency band.

[0047]

[0068] In use, the connection component 108 may combine multiple signal paths into one signal path for output, or may split one signal path into multiple signal paths for output.

[0048]

[0069] In some embodiments, the first interface 1021 and the second interface 1041 are configured to connect to a signal input end, and the third interface 1024 is configured to connect to a signal output end.

[0049]

[0070] In operation, the first interface 1021 may be configured to receive signals in a first frequency band and forward the received signals in the first frequency band to the first filter circuit 105. The first filter circuit 105 may communicate the signals to the connection component 108. The second interface 1041 may be configured to receive signals in a second frequency band and forward the received signals in the second frequency band to the second filter circuit 107, which then forwards the signals to the connection component 108.

[0050]

[0071] In this embodiment, the connection component 108 can combine the signals of the first frequency band and the signals of the second frequency band into one signal path and forward the signal path to the third interface 1024, which outputs the combined signal.

[0051]

[0072] In some other embodiments, the first interface 1021 and the second interface 1041 are configured to connect to a signal output end, and the third interface 1024 is configured to connect to a signal input end.

[0052]

[0073] In operation, the third interface 1024 can be configured to receive signals in a first frequency band and to forward received signals in the first frequency band to the connection component 108 .

[0053]

[0074] In this embodiment, the connection component 108 can split one signal path into two signal paths, and forward one signal path to the first filter circuit 105 and the other signal path to the second filter circuit 107. The first filter circuit 105 can transmit the signal to the first interface 1021, and the second filter circuit 107 can transmit the signal to the second interface 1041, so that the split signals are output via the first interface 1021 and the second interface 1041, respectively.

[0054]

[0075] The connection component 108 uses an integrated structure, a part of the connection component 108 is located in the first cavity 102, another part of the connection component 108 is located in the second cavity 104, and the connection component 108 is separately connected to the first filter circuit 105, the second filter circuit 107, and the third interface 1024. Compared with the prior art in which the filter circuits in different cavities and the second interface 1041 are connected through multiple connection structures, the assembly tolerance is reduced and the passive intermodulation performance of the signal transceiver device 101 is improved.

[0055]

[0076] The method of assembling the connection component 108 and the first filter circuit 105 and the second filter circuit 107 is not limited to the embodiments of the present application. In some embodiments, as shown in FIG. 3 , the signal transceiver device 101 further includes a first PCB 1050 and a second PCB 1070, where the first filter circuit 105 is disposed on the first PCB 1050, a first mating slot 1020 is provided in the first cavity 102, and the first PCB 1050 is removably connected to the first mating slot 1020.

[0056]

[0077] For example, a first opening 1022 is provided in the first cavity 102. The shape of the first opening 1022 matches the shape of the first PCB 1050, so that the first PCB 1050 can engage with the first engagement slot 1020 through the first opening 1022.

[0057]

[0078] When the first PCB 1050 is assembled, the first PCB 1050 on which the first filter circuit 105 is provided can be inserted into the first cavity 102 through the first opening 1022 and engaged with the first engagement slot 1020.

[0058]

[0079] The second filter circuit 107 is disposed on a second PCB 1070 , a second mating slot 1040 is provided in the second cavity 104 , and the second PCB 1070 is removably connected to the second mating slot 1040 .

[0059]

[0080] For example, the second opening 1042 is provided in the second cavity 104. The shape of the second opening 1042 matches the shape of the second PCB 1070, such that the second PCB 1070 can engage with the second engagement slot 1040 through the second opening 1042.

[0060]

[0081] When the second PCB 1070 is assembled, the second PCB 1070 on which the second filter circuit 107 is provided can be inserted into the first cavity 102 through the second opening 1042 and engaged with the second engagement slot 1040.

[0061]

[0082] Further, a third opening 1022 is provided in the first cavity 102, and the shape of the third opening 1022 is adapted to the shape of the connecting component 108, so that the connecting component 108 can enter the first cavity 102 and the second cavity 104 through the third opening 1022.

[0062]

[0083] In some other embodiments of the present application, the third opening 1022 may alternatively be provided in the second cavity 104 .

[0063]

[0084] In some embodiments, for example, a third engagement slot (not shown) is further provided in the first cavity 102 and the second cavity 104 to accommodate the connecting component 108 .

[0064]

[0085] When the connection component 108 is assembled, the connection component 108 can be inserted into the first cavity 102 and the second cavity 104 through the third opening 1022 and engaged with the third engagement slot.

[0065]

[0086] In some other embodiments, for example, a mounting base (not shown) is further disposed within the first cavity 102 and the second cavity 104 , the mounting base configured to mount the connecting component 108 .

[0066]

[0087] When the connection component 108 is assembled, the connection component 108 can be inserted into the first cavity 102 and the second cavity 104 through the third opening 1022 and is fixedly connected to the mounting base.

[0067]

[0088] The method of connecting the connection component 108 to the first filter circuit 105 and the second filter circuit 107 is not limited in the embodiments of the present application. In some embodiments of the present application, the connection component 108 and the first filter circuit 105 are connected by welding, and the connection component 108 and the second filter circuit 107 are connected by welding.

[0089] For example, the first weld port 1023 is disposed on the first cavity 102, and the first weld port 1023 is located on a first end of the connection component 108, such that the first end of the connection component 108 and the second end of the first filter circuit 105 are welded via the first weld port 1023.

[0068]

[0090] When the connection component 108 and the first filter circuit 105 are welded, the first end of the connection component 108 and the second end of the first filter circuit 105 can be heated to a molten state through the first welding port 1023, such that the first end of the connection component 108 and the second end of the first filter circuit 105 are connected as a whole after cooling.

[0069]

[0091] The second weld port 1043 is disposed on the second cavity 104, and the second weld port 1043 is located on the third end of the connection component 108, such that the third end of the connection component 108 and the second end of the second filter circuit 107 are welded via the second weld port 1043.

[0070]

[0092] When the connection component 108 and the second filter circuit 107 are welded, the third end of the connection component 108 and the second end of the second filter circuit 107 can be heated to a molten state through the second welding port 1043, so that the third end of the connection component 108 and the second end of the second filter circuit 107 are connected as a whole after cooling.

[0071]

[0093] In some other embodiments of the present application, the signal transceiver device 101 includes three cavities. As shown in Figures 8 and 9, the signal transceiver device 101 includes a first cavity 102, a second cavity 104, and a third cavity 103. For the structure of the first cavity 102 and the structure of the second cavity 104, and the connection manner between the first filter circuit 105, the second filter circuit 107, and the connection component 108, please refer to the previous embodiments. Details will not be described again here.

[0072]

[0094] The third cavity 103 is located between the first cavity 102 and the second cavity 104 , and the fourth interface 1031 is disposed in the third cavity 103 .

[0073]

[0095] A third filter circuit 106 is disposed in the third cavity 103, where the third filter circuit 106 includes a first end and a second end opposite to each other, the first end of the third filter circuit 106 is connected to the third interface 1024, and the second end of the third filter circuit 106 is connected to the fourth end of the connection component 108. The third filter circuit 106 is configured to transmit a signal in a third frequency band.

[0074]

[0096] A fourth end of the connection component 108 is located between the first end of the connection component 108 and the third end of the connection component 108, and the connection component 108 is further configured to transmit signals in the third frequency band.

[0075]

[0097] The signal transceiver device 101 further includes a third PCB 1060, wherein the third filter circuit 106 is disposed on the third PCB 1060, a third engagement slot 1030 is provided in the third cavity 103, and the third PCB 1060 is removably connected to the third engagement slot 1030.

[0076]

[0098] For example, the third opening 1022 is provided in the third cavity 103 , and the shape of the third opening 1022 matches the shape of the third PCB 1060 .

[0077]

[0099] When the third PCB 1060 is assembled, the third PCB 1060 having the third filter circuit 106 provided thereon can be inserted into the third cavity 103 through the third opening 1022 and engaged with the third engagement slot 1030.

[0078]

[0100] Further, a third weld port 1033 is disposed in the third cavity 103, and the third weld port 1033 is located above the fourth end of the connection component 108, such that the fourth end of the connection component 108 and the second end of the third filter circuit 106 are welded through the third weld port 1033.

[0079]

[0101] When the connection component 108 and the third filter circuit 106 are welded, the fourth end of the connection component 108 and the second end of the third filter circuit 106 can be heated to a molten state through the third welding port 1033, so that the fourth end of the connection component 108 and the second end of the third filter circuit 106 are connected as a whole after cooling.

[0080]

[0102] In some embodiments of the present application, the first interface 1021, the second interface 1041, and the fourth interface 1031 are configured to connect to a signal input end, and the third interface 1024 is configured to connect to a signal output end.

[0081]

[0103] In operation, the first interface 1021 can be configured to receive signals in a first frequency band and forward the received signals in the first frequency band to the first filter circuit 105. The first filter circuit 105 can communicate the signals to the connection component 108. The second interface 1041 can be configured to receive signals in a second frequency band and forward the received signals in the second frequency band to the second filter circuit 107. The fourth interface 1031 can be configured to receive signals in a third frequency band and forward the received signals in the third frequency band to the second filter circuit 107, which then forwards the signals to the connection component 108.

[0082]

[0104] In this embodiment, the connection component 108 is capable of combining the signals of the first frequency band, the signals of the second frequency band, and the signals of the third frequency band into one signal path and forwarding the signal path to the third interface 1024, which outputs the combined signal.

[0083]

[0105] In some other embodiments of the present application, the first interface 1021, the second interface 1041, and the fourth interface 1031 are configured to connect to a signal output end, and the third interface 1024 is configured to connect to a signal input end.

[0084]

[0106] In operation, the third interface 1024 can be configured to receive a signal in a first frequency band and forward the received signal in the first frequency band to the connection component 108. The connection component 108 can split one signal path into three signal paths, and forward one signal path to the first filter circuit 105, one signal path to the second filter circuit 107, and the third signal path to the third filter circuit 106. The first filter circuit 105 forwards the signal to the first interface 1021, the second filter circuit 107 forwards the signal to the second interface 1041, and the third filter circuit 106 forwards the signal to the fourth interface 1031, so that the split signals are output via the first interface 1021 and the second interface 1041, respectively.

[0085]

[0107] The case where the signal transceiver device 101 includes frequency-divide-by-2 and frequency-divide-by-3 is used for the purpose of explanation. In another embodiment of the present application, the signal transceiver device 101 can include frequency-divide-by-N, where N is a positive integer greater than 1. For the frequency-divide-by-N signal transceiver device 101, please refer to the frequency-divide-by-2 and frequency-divide-by-3 structures. Details will not be described again here.

[0086]

[0108] The specific structures of the first filter circuit 105, the second filter circuit 107, and the third filter circuit 106 are not limited in the embodiments of the present application. For example, as shown in FIG 10, the first filter circuit 105, the second filter circuit 107, and the third filter circuit 106 each include a plurality of open circuit filter stubs.

[0087]

[0109] The first filter circuit 105 includes a first main transmission line 1055 , a first filter stub 1051 , a second filter stub 1052 , a third filter stub 1053 , and a fourth filter stub 1054 .

[0088]

[0110] One end of the first main transmission line 1055 is connected to the first interface 1021, and the other end of the first main transmission line 1055 is connected to the connection component 108. For example, the first main transmission line 1055 is configured to transmit signals in a first frequency band.

[0089]

[0111] One end of the first filter stub 1051, one end of the second filter stub 1052, one end of the third filter stub 1053, and one end of the fourth filter stub 1054 are connected to a first main transmission line 1055, and the other end of the first filter stub 1051, the other end of the second filter stub 1052, the other end of the third filter stub 1053, and the other end of the fourth filter stub 1054 are in an open circuit state. The first filter stub 1051, the second filter stub 1052, the third filter stub 1053, and the fourth filter stub 1054 may be configured to transmit a stopband signal. Because the filter stubs use an open circuit structure, the stopband signal can only be transmitted round trip through the first filter stub 1051, the second filter stub 1052, the third filter stub 1053, and the fourth filter stub 1054, thereby filtering out the stopband signal in the main transmission line.

[0090]

[0112] The lengths of the first filter stub 1051, the second filter stub 1052, the third filter stub 1053, and the fourth filter stub 1054 are, for example, λ1 / 8 to λ1 / 2, where λ1 is a wavelength corresponding to a stopband signal frequency band in the first frequency band, so that the first filter stub 1051, the second filter stub 1052, the third filter stub 1053, and the fourth filter stub 1054 can be used as resonators to generate resonance in the stopband frequency band, and the stopband signal can be transmitted round trip only in the open circuit filter stubs, and the stopband signal can be filtered out.

[0091]

[0113] The first filter stub 1051, the second filter stub 1052, the third filter stub 1053, and the fourth filter stub 1054 are configured to filter out a stopband signal. It should be noted that in this embodiment, the stopband signal refers to another signal other than the signal in the first frequency band, for example, a signal in the second frequency band and a signal in the third frequency band.

[0092]

[0114] The second filter circuit 107 includes a second main transmission line 1074 , a fifth filter stub 1071 , a sixth filter stub 1072 , and a seventh filter stub 1073 .

[0093]

[0115] One end of the second main transmission line 1074 is connected to the second interface 1041, and the other end of the second main transmission line 1074 is connected to the connection component 108. For example, the second main transmission line 1074 is configured to transmit a passband signal in a second frequency band.

[0094]

[0116] One end of the fifth filter stub 1071, one end of the sixth filter stub 1072, and one end of the seventh filter stub 1073 are connected to the second main transmission line 1074, and the other end of the fifth filter stub 1071, the other end of the sixth filter stub 1072, and the other end of the seventh filter stub 1073 are in an open circuit state. The fifth filter stub 1071, the sixth filter stub 1072, and the seventh filter stub 1073 can be configured to transmit a stopband signal. Because the fifth filter stub 1071, the sixth filter stub 1072, and the seventh filter stub 1073 use an open circuit structure, the stopband signal can be transmitted round trip only in the filter stubs, and as a result, the stopband signal in the main transmission line can be filtered out.

[0095]

[0117] The lengths of the fifth filter stub 1071, the sixth filter stub 1072, and the seventh filter stub 1073 are, for example, λ2 / 8 to λ2 / 2, where λ2 is a wavelength corresponding to a stopband signal frequency band in the second frequency band, so that the fifth filter stub 1071, the sixth filter stub 1072, and the seventh filter stub 1073 can be used as resonators to generate resonance in the stopband frequency band, and the stopband signal can be transmitted round trip only in the open circuit filter stubs, and the stopband signal can be filtered out.

[0096]

[0118] The third filter circuit 106 includes a third main transmission line 1064 , an eighth filter stub 1061 , a ninth filter stub 1062 , and a tenth filter stub 1063 .

[0097]

[0119] One end of the third main transmission line 1064 is connected to the fourth interface 1031, and the other end of the third main transmission line 1064 is connected to the connection component 108. For example, the third main transmission line 1064 is configured to transmit a passband signal in a third frequency band.

[0098]

[0120] One end of the eighth filter stub 1061, one end of the ninth filter stub 1062, and one end of the tenth filter stub 1063 are connected to the third main transmission line 1064, and the other end of the eighth filter stub 1061, the other end of the ninth filter stub 1062, and the other end of the tenth filter stub 1063 are in an open circuit state. The eighth filter stub 1061, the ninth filter stub 1062, and the tenth filter stub 1063 can be configured to transmit a stopband signal. Because the filter stubs use an open circuit structure, the stopband signal can be transmitted round trip only through the eighth filter stub 1061, the ninth filter stub 1062, and the tenth filter stub 1063, so that the stopband signal in the third main transmission line 1064 can be filtered out.

[0099]

[0121] The length of the eighth filter stub 1061, the ninth filter stub 1062, and the tenth filter stub 1063 is, for example, λ3 / 8 to λ3 / 2, where λ3 is a wavelength corresponding to a stopband signal frequency band in the third frequency band, so that the eighth filter stub 1061, the ninth filter stub 1062, and the tenth filter stub 1063 can be used as a resonator to generate a resonance in the stopband frequency band, and the stopband signal can only be transmitted round trip in the open circuit filter stub, and the stopband signal can be filtered out. It should be noted that in this embodiment, the stopband signal refers to another signal other than the signal in the third frequency band, for example, the signal in the first frequency band and the signal in the second frequency band.

[0100]

[0122] The first main transmission line 1055, the second main transmission line 1074, the third main transmission line 1064, the first filter stub 1051, the second filter stub 1052, the third filter stub 1053, the fourth filter stub 1054, the fifth filter stub 1071, the sixth filter stub 1072, the seventh filter stub 1073, the eighth filter stub 1061, the ninth filter stub 1062, and the tenth filter stub 1063 may use a bent structure, which can reduce the space size of the filter circuit and promote the miniaturization of the device.

[0101]

[0123] 11, the connection component 108 includes at least one impedance-transformed transmission-line segment. The impedance-transformed transmission-line segment has a length L, where L is greater than λ / 12 and λ is the wavelength corresponding to the maximum frequency in the input signal.

[0102]

[0124] 12 is a schematic structural diagram of a feeding structure according to the present application. As shown in FIG. 12, the feeding structure includes a phase shifter 200 and the above-mentioned signal transceiver device 101, where the phase shifter 200 is electrically connected to the signal transceiver device 101.

[0103]

[0125] Example 1:

[0126] As shown in Figures 13, 14, 15, 16 and 17, the power supply structure includes a transceiver module 100 and a phase shifter 200 stacked in the Z direction.

[0104]

[0127] As shown in Figures 16 and 17, the signal transceiver module 100 includes a first cavity 1011, a second cavity 1012, and a third cavity 1013 arranged in the Y direction, where five signal transceiver devices: a first signal transceiver device 01, a second signal transceiver device 02, a third signal transceiver device 03, a fourth signal transceiver device 04, and a fifth signal transceiver device 05 shown in Figures 9 and 10, are arranged side by side in the X direction within the first cavity 1011, the second cavity 1012, and the third cavity 1013.

[0105]

[0128] For the installation manner of each signal transceiver device, please refer to the related description in Figure 8 and Figure 9. The details will not be described again here.

[0106]

[0129] 15, the phase shifter 200 includes a fourth cavity 2001, a fifth cavity 2002, and a sixth cavity 2003, where each cavity is provided with a phase shifting structure. The fourth cavity 2001 faces the first cavity 1011, the fifth cavity 2002 faces the second cavity 1012, and the sixth cavity 2003 faces the third cavity 1013. The phase shifter is configured to adjust the phase of a signal.

[0107]

[0130] The feeding structure further includes an input port Pin, a first output port Pout 1, a second output port Pout 2, a third output port Pout 3, and a fourth output port Pout 4.

[0108]

[0131] The feed structure further includes a conductive insert sheet 205, where each of the five signal transceiver units is electrically connected to the phase shift structure via the conductive insert sheet 205.

[0109]

[0132] The connection structure of the fifth signal transceiver device 05 is connected to the input port, and the fifth signal transceiver device 05 includes three filter circuits, and the fifth signal transceiver device 05 is configured to split the received signal into three paths.

[0110]

[0133] Each filter circuit of the fifth signal transceiver unit 05 is connected to an input port of a phase shifter via a conductive insert sheet.

[0111]

[0134] The four output ports of the phase shifter are connected to the filter circuits of the first signal transceiver device 01, the second signal transceiver device 02, the third signal transceiver device 03, and the fourth signal transceiver device 04, respectively, via conductive insert sheets.

[0112]

[0135] In the use process, the input port Pin receives input signals of frequency band 1, frequency band 2, and frequency band 3, the signals are divided into three paths after passing through the third signal transceiver device 03, and the three signal paths are respectively sent to the input ports of the filter circuit of the third signal transceiver device 03, and then the three signal paths are input into the input ports of each phase shift structure through the conductive insert sheet 205, and the corresponding power division and phase shift are performed by using each phase shift structure. Furthermore, the three paths of the signal are output through the four output ports of the phase shifter 200 and input to the input ends of the filter circuits of the first signal transceiver device 01, the second signal transceiver device 02, the third signal transceiver device 03, and the fourth signal transceiver device 04 through the insert sheet PCB, and finally, the three signal paths are output at the output ports (first output port Pout 1, second output port Pout 2, third output port Pout 3, and fourth output port Pout 4) of the first signal transceiver device 101, the second signal transceiver device 101, the third signal transceiver device 101, and the fourth signal transceiver device 101.

[0113]

[0136] In addition, the power supply structure further includes a first pull rod 2011 , a second pull rod 2012 , a third pull rod 2013 , a first sliding medium 202 , a second sliding structure 203 , and a third sliding medium 204 .

[0114]

[0137] The first pull rod 2011 is connected to the first sliding media 202. When the first pull rod 2011 is pushed or pulled, the first sliding media 202 slides relative to the first cavity 1011.

[0115]

[0138] The second pull rod 2012 is connected to the second sliding media 203. As the second pull rod 2012 is pushed or pulled, the second sliding media 203 slides relative to the second cavity 1012.

[0116]

[0139] The third pull rod 2013 is connected to the third sliding medium 204. As the third pull rod 2013 is pushed or pulled, the third sliding medium 204 slides relative to the third cavity 1013.

[0117]

[0140] For example, each of the four output ports (first output port Pout 1, second output port Pout 2, third output port Pout 3, and fourth output port Pout 4) is connected to a radiating element of the array antenna. After the first pull rod 2011, the second pull rod 2012, and the third pull rod 2013 respectively drive the first sliding medium 202, the second sliding structure 203, and the third sliding medium 204 to move a certain distance, the signals of frequency band 1, frequency band 2, and frequency band 3 input by Pin are adjusted by the three phase shifters 200 to provide the required signal current intensity and phase to the radiating elements in frequency band 1, frequency band 2, and frequency band 3, respectively. Thus, the direction of the radiation pattern of the array antenna in each of frequency band 1, frequency band 2, and frequency band 3 is changed.

[0118]

[0141] Example 2:

[0142] An embodiment of the present application further provides a feed structure. As shown in Figures 18, 19 and 20, the feed structure includes a signal transceiver module 100 and a phase shifter 200 stacked in the Z direction. The signal transceiver module 100 includes two cavities arranged in the Y direction, where five signal transceiver devices 101 shown in Figures 6 and 7 are arranged side by side in the two cavities in the X direction.

[0119]

[0143] The phase shifter also includes two cavities. For the specific structure and operation process of the signal transceiver device 100 and the phase shifter 200, please refer to the first embodiment. The details will not be described again here.

[0120]

[0144] An embodiment of the present application further provides an antenna 01. As shown in Fig. 21, the antenna 01 includes at least one antenna array 004, where the antenna array 004 includes at least one radiating element 0041, a reflector panel 0042, and the above-mentioned feed structure 010.

[0121]

[0145] The radiating element 0041 is a unit forming the basic structure of the antenna array, and can effectively radiate or receive radio waves. The frequencies of the radiating elements 0041 may be the same or different, and the radiating elements 0041 are disposed above the reflecting panel 0042.

[0122]

[0146] The reflector panel 0042 (also called bottom panel, antenna panel, or metal reflector panel) can improve the reception sensitivity of the antenna signal and concentrate the reflection of the antenna signal at the receiving point, which not only greatly improves the receiving / transmitting ability of the antenna, but also blocks and shields the interference of other radio waves from the rear (opposite direction) to the received signal.

[0123]

[0147] The feed structure 010 is connected to the radiating elements 0041 such that the antenna array 004 can receive or transmit radio frequency signals through each feed structure 010 .

[0124]

[0148] The feeding structure 010 may feed a signal to the radiating element 0041 with a specific amplitude and a specific phase, or may send a received radio signal to a signal processing unit of a base station with a specific amplitude and a specific phase. The feeding structure 010 is typically formed by a controlled impedance transmission line. The feeding structure 010 typically includes a phase shifter 200, and may possibly include further components such as combiners and filters.

[0125]

[0149] The feed structure 010 may provide different radiation beam directions through a transmission section or may be connected to a transmission network (or calibration network) 003 to obtain calibration signals required by the system.

[0126]

[0150] The antenna 01 further includes a radome 006 , where the radiating element 0041 , the reflector panel 0042 , and the feed structure 010 are disposed within a cavity enclosed by the radome 006 .

[0127]

[0151] The radome 006 is a structural part that can protect the antenna 01 from the external environment, has good electromagnetic wave transmission characteristics from the viewpoint of electrical properties, and is capable of withstanding harsh external environments from the viewpoint of mechanical performance.

[0128]

[0152] An embodiment of the present application further provides a base station antenna feeder system. As shown in Fig. 22, the base station antenna feeder system includes the above-mentioned antenna 01. The base station antenna feeder system further includes a feeder 05, a pole 02, and an antenna adjustment support 03, where the feeder 05 is connected to the antenna 01, for example, via an antenna connector 005, and a connector sealing member 04 is disposed outside the antenna connector 005. The connector sealing member 04 can use one of an insulating sealing tape or a PVC insulating tape.

[0129]

[0153] The above description is merely a specific implementation of the present application, and is not intended to limit the scope of protection of the present application. Any variations and replacements within the technical scope disclosed in the present application shall be included within the scope of protection of the present application. Therefore, the scope of protection of the present application shall be subject to the scope of protection of the claims.

Claims

1. 13. A signal transceiver apparatus comprising: a first cavity, the first cavity having a first interface; a first filter circuit, the first filter circuit in the first cavity, the first filter circuit including opposing first and second ends, the first end of the first filter connected to the first interface, the first filter circuit configured to transmit signals in a first frequency band; a second cavity, the second cavity having a second interface and a third interface; a second filter circuit, the second filter circuit in the second cavity, the second filter circuit including opposing first and second ends, the first end of the second filter circuit connected to the second interface, the second filter circuit configured to transmit signals in a second frequency band; and a connection component including a first end and a second end opposite each other and a third end between the first end of the connection component and the second end of the connection component, the first end of the connection component being disposed in the first cavity, the first end of the connection component being connected to the second end of the first filter circuit, the third end of the connection component being disposed in the second cavity, the third end of the connection component being connected to the second end of the second filter circuit, and the second end of the connection component being connected to the third interface; a third opening in the first cavity or the second cavity, the shape of the third opening conforming to a shape of the connection component such that the connection component enters the first cavity or the second cavity through the third opening.

2. 2. The signal transceiver device of claim 1, further comprising: a first printed circuit board PCB, the first filter circuit being on the first PCB, the first cavity having a first mating slot, the first PCB being removably connected to the first mating slot; and a second PCB, the second filter circuit being on the second PCB, the second cavity having a second mating slot, the second PCB being removably connected to the second mating slot; 23. A signal transceiver apparatus comprising:

3. 3. The signal transceiver apparatus of claim 2, the first cavity has a first opening, the shape of the first opening conforming to the shape of the first PCB, such that the first PCB can engage with the first engagement slot through the first opening; and A signal transceiver device, wherein the second cavity has a second opening, the shape of the second opening conforming to the shape of the second PCB, such that the second PCB can engage with the second engagement slot through the second opening.

4. A signal transceiver device according to any one of claims 1 to 3, comprising: a first weld port in the first cavity, the first weld port being located above the first end of the connection component such that the first end of the connection component and the second end of the first filter circuit are welded through the first weld port; and A signal transceiver apparatus, wherein the second cavity has a second weld port, the second weld port being located over the third end of the connection component, such that the third end of the connection component and the second end of the second filter circuit are welded through the second weld port.

5. 5. A signal transceiver device according to any one of claims 1 to 4, further comprising: a third cavity, the third cavity being located between the first cavity and the second cavity, the third cavity having a fourth interface; and a third filter circuit, the third filter circuit in the third cavity, the third filter circuit including a first end and a second end opposite each other, the first end of the third filter circuit connected to the third interface and the second end of the third filter circuit connected to a fourth end of the connection component, the third filter circuit configured to transmit signals in a third frequency band; wherein the fourth end of the connection component is located between the first end of the connection component and the third end of the connection component, and the connection component is further configured to transmit a signal in the third frequency band.

6. 6. The signal transceiver apparatus of claim 5, further comprising: a third PCB, the connection component being on the third PCB, the third cavity having a third mating slot, the third PCB being removably connected to the third mating slot; a third opening in the third cavity, the shape of the third opening conforming to a shape of the third PCB.

7. 7. The signal transceiver device according to claim 5 or 6, wherein the third cavity has a third weld port, the third weld port being located above the fourth end of the connection component, such that the fourth end of the connection component and the second end of the third filter circuit are welded through the third weld port.

8. A signal transceiver apparatus according to any one of claims 5 to 7, comprising: the first interface, the second interface, and the fourth interface are configured to be connected to a signal input end, and the third interface is configured to be connected to a signal output end; or A signal transceiver device, wherein the first interface, the second interface, and the fourth interface are configured to be connected to a signal output end, and the third interface is configured to be connected to a signal input end.

9. 9. The signal transceiver apparatus of claim 5, wherein each of the first filter circuit, the second filter circuit, and the third filter circuit includes a plurality of open circuit filter stubs.

10. 10. The signal transceiver apparatus of claim 9, wherein the length of the open circuit filter stub is λ 1 / 8 or λ 1 / 2, and λ 1 is a wavelength corresponding to a stopband signal frequency band of the signal transceiver device.

11. 11. A signal transceiver device according to any one of claims 1 to 10, wherein the connection component comprises at least one impedance-transforming transmission line segment, the length of the impedance-transforming transmission line segment being λ 2 / 12 or more, λ 2 is the wavelength corresponding to the maximum frequency in the input signal.

12. A feed structure comprising a phase shifter and a signal transceiver apparatus according to any one of claims 1 to 11, said phase shifter being electrically connected to said signal transceiver apparatus.

13. 13. An antenna including at least one antenna array, the antenna array including at least one radiating element, a reflector panel, and a feed structure according to claim 12, the radiating element being on the reflector panel and the feed structure being connected to the radiating element.

14. 14. The antenna of claim 13, further comprising a radome, the radiating element, the reflector panel, and the feed structure being within a cavity enclosed by the radome.

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