Determination method, pattern transfer method, article production method, program, information processor and lithography system

Abstract

To provide a technology advantageous for improving pattern transfer accuracy relative to a substrate.SOLUTION: A determination method includes a generation process for generating revised measurement data by removing components dependent on the arrangement of multiple shot areas of a first substrate from the measurement data of the first substrate that has the multiple shot areas where patterns have been transferred by a lithography apparatus, and a determination process for determining correction values to be applied to the lithography apparatus when transferring patterns to a second substrate using the lithography apparatus based on the revised measurement data and the arrangement of multiple shot areas of the second substrate.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a determination method, a pattern transfer method, an article manufacturing method, a program, an information processing device, and a lithography system. [Background technology]

[0002] In recent years, the line width of patterns formed on a substrate has become very small due to the high integration and miniaturization of semiconductor integrated circuits. Accordingly, further miniaturization is required in the lithography process that forms resist patterns on a substrate. In step-and-repeat exposure devices and step-and-scan exposure devices, alignment between the original and the substrate is important. A common alignment method is to measure the positions of alignment marks in several sample shot areas selected from multiple shot areas on the substrate, and align the multiple shot areas by using this (global alignment). In recent years, high-order shot arrangement correction models and high-order shot shape correction models have been used to correct nonlinear distortion of the substrate. The main index of the alignment result is the overlay error. The overlay error indicates the relative positional deviation between layers formed in the lithography process. As the integration and miniaturization of semiconductor integrated circuits progress, the demand for reducing the overlay error is increasing.

[0003] Factors that cause nonlinear distortion of the substrate include the lithography process when forming a pattern on the substrate, and the characteristics of the substrate holding mechanism that holds the substrate in the exposure apparatus. Ideally, the substrate holding mechanism is configured to flatten the substrate warp caused by the lithography process. However, it is difficult to flatten the outer peripheral region of the substrate by the substrate holding mechanism, and the substrate inevitably becomes non-flat. When the substrate becomes non-flat, an error occurs in the position measurement of the alignment mark provided in the shot region of the substrate, which leads to deterioration of the overlay error, which is the alignment result between the previous layer and the new layer in the lithography process. In addition to the deterioration of the overlay error, the non-flatness of the substrate also affects the focus control, leading to deterioration of the resolution of the pattern formed on the substrate.

[0004] Patent Document 1 discloses a method for reducing deterioration of overlay and focus by determining the amount of bending of a substrate based on the characteristics of a substrate holding mechanism and calibrating alignment control in response to the non-flatness of the substrate. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent No. 6630839 Summary of the Invention [Problem to be solved by the invention]

[0006] However, because the substrate holding mechanism repeatedly comes into contact with the substrate over a long period of time, the members are deformed and scraped by collisions when holding the substrate and pressure when releasing the substrate. In addition, as overlay errors and focus requirements increase due to the high integration and miniaturization of semiconductor integrated circuits, individual differences in the substrate holding mechanism cannot be ignored. Therefore, it is necessary to reduce the impact on alignment accuracy of the localized and minute substrate distortion and bending caused by the substrate holding mechanism.

[0007] An object of the present invention is to provide a technique that is advantageous for improving the accuracy of transferring a pattern onto a substrate. [Means for solving the problem]

[0008] One aspect of the present invention relates to a determination method, which includes a generation step of generating corrected measurement data by removing components dependent on an arrangement of a plurality of shot areas of a first substrate from measurement data of the first substrate having a plurality of shot areas to which a pattern is transferred by a lithography apparatus, and a determination step of determining a correction value to be applied to the lithography apparatus when transferring a pattern to the second substrate using the lithography apparatus, based on the corrected measurement data and the arrangement of the plurality of shot areas of the second substrate. Effect of the Invention

[0009] According to the present invention, a technique is provided that is advantageous for improving the accuracy of transferring a pattern onto a substrate. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is a diagram showing the arrangement of an exposure apparatus according to an embodiment. [Diagram 2] FIG. 1 is a diagram showing the configuration of a lithography system according to an embodiment. [Diagram 3] FIG. 13 is a diagram showing a determination method according to an embodiment. [Figure 4] FIG. 4 is a diagram illustrating substrate measurement data. [Diagram 5] FIG. 13 is a diagram illustrating an example of an error component specific to a shot layout. [Figure 6] 5A and 5B are diagrams illustrating step drive directions during exposure processing. [Figure 7] 6A and 6B are diagrams illustrating error components caused by step drive directions. [Figure 8] 5A and 5B are diagrams illustrating examples of scan driving directions during exposure processing. [Figure 9] 11A and 11B are diagrams illustrating error components caused by the scan driving direction. [Figure 10] FIG. [Figure 11] 6A and 6B are diagrams illustrating an example of shape correction of a shot region. [Figure 12] FIG. 4 is a diagram illustrating periodic acquisition of measurement data of a substrate. [Figure 13] 5 is a diagram illustrating an example of the sparseness and density of measurement data of a substrate. [Figure 14] 11A and 11B are diagrams illustrating an example of interpolation of measurement data of a substrate. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, the embodiments will be described in detail with reference to the attached drawings. Note that the following embodiments do not limit the invention according to the claims. Although the embodiments describe a number of features, not all of these features are essential to the invention, and the features may be combined in any manner. Furthermore, in the attached drawings, the same reference numbers are used for the same or similar configurations, and duplicated descriptions are omitted.

[0012] FIG. 1 is a diagram showing the configuration of an exposure apparatus 204 according to an embodiment. The exposure apparatus 204 is an example of a lithography apparatus or a pattern transfer apparatus that transfers a pattern to a substrate. The lithography apparatus or the pattern transfer apparatus can be, for example, any of an exposure apparatus, an imprint apparatus, and an electron beam lithography apparatus. In this specification and the accompanying drawings, directions are shown in an XYZ coordinate system in which the surface of a substrate 4 (generally a horizontal plane) is the XY plane. The directions parallel to the X-axis, Y-axis, and Z-axis in the XYZ coordinate system are the X-direction, the Y-direction, and the Z-direction, respectively, and the rotations around the X-axis, the Y-axis, and the Z-axis are θX, θY, and θZ, respectively.

[0013] The exposure apparatus 204 can be configured as a step-and-scan type exposure apparatus that exposes the substrate 4 while synchronously driving a reticle stage (original stage) and a substrate stage, that is, a scanning exposure apparatus (scanner). Here, an example in which the exposure apparatus 204 is a scanning exposure apparatus will be described. However, the exposure apparatus 204 is not limited to a scanning exposure apparatus, and may be configured as, for example, a step-and-repeat type exposure apparatus (stepper) that exposes the substrate stage while it is stationary. The exposure apparatus 204 can include a light source 7, an illumination optical system 8, a reticle stage 2, a projection optical system 3, a substrate stage 6, a substrate holding mechanism 5, and a control unit 16. The exposure apparatus 204 can also include a laser interferometer 9, a laser interferometer 10, a focus sensor 11, a substrate transport unit 12, a reticle transport unit 14, and an alignment scope 15.

[0014] The light source 7 may be, for example, any one of a high-pressure mercury lamp, an ArF excimer laser, a KrF excimer laser, and an EUV light source. The light source 7 may be housed in a chamber of the exposure apparatus 204 or may be connected to the chamber. The light emitted from the light source 7 illuminates a reticle 1 (original) via an illumination optical system 8. The reticle 1 has a pattern to be transferred onto a substrate 4 coated with a photosensitive material, and is mounted on a reticle stage 2. The reticle stage 2 holds the reticle via a reticle holding mechanism (not shown), and is driven by a drive mechanism (e.g., a linear motor) not shown.

[0015] The projection optical system 3 projects the pattern of the reticle 1 onto the substrate 4 placed on the substrate holding mechanism 5. This causes the pattern of the reticle 1 to be transferred onto the (photosensitive material of) the substrate 4. Here, the pattern of the reticle 1 is projected (transferred) onto the substrate 4 at a projection magnification (e.g., 1 / 4) of the projection optical system 3. The area onto which the pattern of the reticle 1 is projected is called a shot area. A plurality of shot areas are set or defined on the substrate 4, and projection is performed onto the plurality of shot areas in a preset order.

[0016] The substrate stage 6 can be driven in the X and Y directions, for example, by a driving mechanism (linear motor) not shown. The substrate holding mechanism 5 is mounted on the substrate stage 6 and holds the substrate 4. The substrate stage 6 can be configured to position the substrate holding mechanism 5 in the Z direction, the θZ direction, the θX direction, and the θY direction. The substrate 4 held by the substrate holding mechanism 5 moves by driving the substrate stage 6 and the substrate holding mechanism 5.

[0017] The laser interferometer 9 measures the position of the reticle stage 2 in the Y direction, and measures the attitude of the reticle stage 2. The exposure apparatus 204 similarly includes a laser interferometer (not shown) for measuring the position of the reticle stage 2 in the X direction. In addition, the laser interferometer 10 measures the position of the substrate stage 6 on which the substrate 4 is mounted in the Y direction, and measures the attitude of the substrate stage 6. In addition, the exposure apparatus 204 similarly includes a laser interferometer (not shown) for measuring the position of the substrate stage 6 in the X direction. The control unit 16 controls the positions of the reticle stage 2 and the substrate stage 6 based on the positions measured by the laser interferometer 9 and the laser interferometer 10.

[0018] The focus sensor 11 may include a light projecting system 11a that projects light (multiple beams) onto the substrate 4, a light receiving system 11b that receives reflected light from the substrate 4, and a detection unit (not shown) that detects the light from the light receiving system 11b and outputs a detection signal to the control unit 16. The light projecting system 11a and the light receiving system 11b are installed on either side of the exit unit of the projection optical system 3, with the light projecting system 11a irradiating the substrate with obliquely incident light and the light receiving system 11b capturing the light reflected on the opposite side. The control unit 16 detects the position of the substrate 4 in the Z direction based on the detection signal detected by the focus sensor 11, and controls the movement of the substrate 4 by the substrate stage 6.

[0019] The substrate transport unit 12 transports the substrate 4. The substrate transport unit 12 transports the substrate 4 from a substrate storage container (not shown) or the like that stores the substrate 4 to the substrate stage 6. The substrate transport unit 12 also transports the substrate 4 from the substrate stage 6 to the substrate storage container or the like.

[0020] The reticle transport unit 14 transports the reticle 1. The reticle transport unit 14 transports the reticle 1 from a reticle storage container (not shown) or the like that stores the reticle 1 to the reticle stage 2. In addition, the reticle transport unit 14 transports the reticle 1 from the reticle stage 2 to the reticle storage container or the like.

[0021] The alignment scope 15 generates a digital image signal by capturing an image of a mark provided on the substrate 4 in order to perform positioning (alignment) of the substrate 4 held by the substrate holding mechanism 5. The alignment scope 15 may include an image sensor (not shown) that outputs a grayscale image signal according to the brightness of the reflected light from the substrate 4, i.e., the grayscale, and an A / D converter (not shown) that converts the grayscale image signal obtained from the image sensor into a digital image signal. The control unit 16 detects the position of the mark on the substrate 4 using the digital image signal output from the alignment scope 15, and controls the substrate stage 6 based on the detected position of the mark to perform positioning of the substrate 4.

[0022] The control unit 16 controls the operation and adjustment of each part of the exposure apparatus 204 to control the process of exposing the substrate 4. The control unit 16 is an information processing device that can be configured, for example, by a PLD (abbreviation of Programmable Logic Device) such as an FPGA (abbreviation of Field Programmable Gate Array), an ASIC (abbreviation of Application Specific Integrated Circuit), a computer with a program installed, a storage device, or a combination of all or part of these. The control unit 16 can be configured by a plurality of information processing devices. The control unit 16 can be configured integrally with other parts of the exposure apparatus 204 (in a common housing), or can be configured separately from other parts of the exposure apparatus 204 (in a different housing). The control unit 16 can control the exposure process (lithography process) of the substrate 4 to be performed by applying process conditions acquired from a storage device or the like. The process conditions applied to the exposure process can include, for example, positioning conditions that define the allowable error when positioning the substrate 4 by the substrate stage 6. Furthermore, the processing conditions applied to the exposure process may include, for example, measurement conditions that define the light irradiation time and irradiation timing when measuring by the focus sensor 11. Furthermore, the processing conditions applied to the exposure process may include, for example, exposure conditions that define the identifier of the reticle 1 when exposing the substrate 4, the layout of the shot area on the substrate 4, the illumination mode, etc. Furthermore, the processing conditions applied to the exposure process may include, for example, environmental conditions that define the temperature and air pressure inside the exposure apparatus, and setup conditions that include information such as the model of the exposure apparatus and the software version.

[0023] 2 is a diagram showing a configuration of a lithography system according to an embodiment. The lithography system according to an embodiment may include an exposure apparatus 204, a substrate measuring instrument 205 that measures a substrate 4 exposed by the exposure apparatus 204, and an information processing apparatus 206 that processes the measurement results of the substrate measuring instrument 205. The substrate measuring instrument 205 may measure an overlay error, which is an alignment result in the XY directions between a previous layer and a new layer thereon in a lithography process, and may measure a pattern shape and pattern dimensions, which are an alignment result in the Z direction. The overlay error is measured by measuring a box-in-box mark that is composed of marks formed on each of the two layers to be measured.

[0024] The information processing device 206 receives the measurement results of the substrate measuring device 205, generates alignment correction values ​​based on the measurement results, and provides the alignment correction values ​​to the exposure device 204. The alignment correction values ​​in the XY directions may include a center correction value of the shot area in the XY directions, a shape correction value of the shot area in the XY directions, and the like. The center correction value of the shot area and the shape correction value of the shot area may include non-linear correction values. The alignment correction value in the Z direction may include a rotation correction value θX around the X axis and a rotation correction value θY around the Y axis. In a step-and-scan exposure device, the alignment correction value in the Z direction may be determined for each position of the stage in the scanning direction during scanning exposure of one shot area.

[0025] The exposure apparatus 204 can improve alignment accuracy by storing alignment correction values ​​in a storage device of the control unit 16 and reflecting the correction values ​​in the control of the reticle stage 2 and the substrate stage 6 in the exposure process of the substrate 4. The information processing device 206 can be configured by a computer with a program installed, a storage device, or a combination of all or part of these. The program can be provided to the information processing device (computer) via a computer-readable memory medium, a data communication network, etc.

[0026] Fig. 3 is a flowchart showing the flow of a determination method according to an embodiment. Here, an example in which the process shown in Fig. 3 is executed by the information processing device 206 will be described, but the process may be executed by the exposure device 204 (controller 16). Note that the shot layout is an arrangement (layout) of a plurality of shot areas on a substrate. Also, the substrate error component common to the shot layouts is a substrate error component that does not depend on the shot layout, in other words, a substrate error component common to a plurality of shot layouts that can be applied to the exposure process.

[0027] First, in step 101 (acquisition step), the information processing device 206 acquires measurement data of the first substrate from, for example, the substrate measuring device 205. The information processing device 206 can be understood as a device having an acquisition unit that executes step 101. The first substrate is a substrate onto which a pattern is transferred by the exposure device 204 through the above-mentioned exposure process, and the transferred pattern is developed by a developing device (not shown), that is, converted into a physical pattern. The substrate as the material of the first substrate may be, for example, a substrate that is managed to correct the inter-device difference between a plurality of exposure devices, a substrate that is shipped as a product, or another substrate. The first substrate has marks such as box-in-box marks for measuring the overlay error between two layers formed through the exposure process by the exposure device 204. In order to acquire the overall characteristics of the first substrate without bias, it is desirable that several tens of box-in-box marks are evenly arranged in each shot area at a predetermined pitch (for example, 5 mm pitch) in the X direction and the Y direction. By narrowing the arrangement pitch of the box-in-box marks, more detailed substrate measurement data can be obtained, and the correction accuracy of substrate error components common to the shot layout can be improved. The measurement data of the first substrate can be, for example, data having measurement values ​​in the XY directions at each point on the substrate, as shown in Figure 4.

[0028] Next, in step 102 (generation step), the information processing device 206 generates corrected measurement data by removing components that depend on the shot layout (arrangement of multiple shot areas) of the first substrate from the measurement data of the first substrate. The information processing device 206 can be understood as a device having a generation unit that executes step 102. Here, the measurement data of the first substrate acquired in step 101 may include, for example, error components caused by the distortion of the substrate caused by the characteristics of the substrate holding mechanism 5, as well as error components caused by the exposure process specific to the exposure device 204. The former, i.e., error components caused by the distortion of the substrate caused by the characteristics of the substrate holding mechanism 5, are substrate error components common to the shot layout. On the other hand, the latter, i.e., error components caused by the exposure process specific to the exposure device 204, are error components that depend on the shot layout in the exposure process, i.e., error components specific to the shot layout. Therefore, by removing the error components (error components dependent on the shot layout) caused by the exposure process specific to the exposure device 204 from the measurement data acquired in step 101, it is possible to approximately obtain substrate error components common to the shot layout.

[0029] FIG. 5 illustrates a shot common shape component, which is one of the error components specific to the shot layout. The shot common shape component is a shape component common to multiple shot areas on a substrate. The shot common shape component is mainly generated by the shape characteristics of the reticle 1, the driving characteristics of the reticle stage 2, the driving characteristics of the projection optical system 3, and the driving characteristics of the substrate stage 6. FIG. 5 illustrates an example of a shot common shape component when four box-in-box marks are arranged in the X direction and six in the Y direction in a shot area. FIG. 5 illustrates an example in which the measurement data of the first substrate is processed to obtain the average value of each of the measurement data of multiple shot areas. This is obtained by calculating the average value of the measurement data at the same coordinates of multiple shot areas. The example of FIG. 5 is a diagram in which adjacent measurement data (average values) are connected by straight lines.

[0030] When there is no common shape distortion in multiple shot areas, the lattices intersect at right angles, but when there is a common shape distortion in multiple shot areas, the lattices do not intersect at right angles. Such shot common shape components are removed from the measurement data of each shot area of ​​the measurement data for the first substrate. This makes it possible to obtain corrected measurement data that indicates substrate error components common to the shot layout from which error components specific to the shot layout have been removed.

[0031] Another shot layout-specific error component is generated by the step drive direction of the substrate stage 6 between shot areas in the exposure device 204. In order to position the shot area to be exposed under the projection optical system 3 before performing the exposure process in the exposure device 204, the substrate stage 6 is driven. This operation is called step drive. FIG. 6 shows an example of the step drive direction during the exposure process of the exposure device 204. FIG. 7 shows an example of an error component generated by the step drive direction of the substrate stage 6, and shows a state in which an error component specific to the step drive direction is generated. This is mainly generated by the drive characteristics of the substrate stage 6 and the characteristics of the laser interferometer 10. The step drive direction during the exposure process is determined by a predetermined shot layout and shot exposure order. Information indicating the shot layout and shot exposure order is held, for example, by a storage device of the control unit 16. The step drive direction during the exposure process is derived based on the shot layout and shot exposure order. Then, for the measurement data of the first substrate, for example, an average value of the measurement data for each step drive direction can be calculated, thereby generating an error component generated by the step drive direction. Such error components caused by the step drive direction are removed from the measurement data of each shot area of ​​the measurement data of the first substrate, thereby obtaining corrected measurement data that indicates substrate error components common to all shot layouts, from which error components specific to the shot layout have been removed.

[0032] Another shot layout-specific error component is caused by the scan drive direction of the substrate stage 6 during exposure processing of the exposure apparatus 204. This can occur in a step-and-scan type exposure apparatus (scanner) that performs exposure while synchronously driving the reticle stage 2 and the substrate stage 6. FIG. 8 shows an example of the scan drive direction during exposure processing of the exposure apparatus 204. FIG. 9 shows an example of an error component caused by the scan drive direction, showing a state in which an error component specific to the scan drive direction occurs. Such an error component is mainly caused by the holding characteristics of the reticle 1, the drive characteristics of the reticle stage 2, the drive characteristics of the projection optical system 3, and the drive characteristics of the substrate stage 6.

[0033] The scan drive direction during the exposure process is determined by a predetermined shot layout and shot exposure order (exposure order of a plurality of shot areas). The shot layout, shot exposure order, and scan drive direction are held, for example, by a storage device of the control unit 16. For the measurement data of the first substrate, an average value of the measurement data for each scan drive direction is calculated based on the scan drive direction of each shot area, for example, to calculate an error component caused by the scan drive direction. Such an error component caused by the scan drive direction is removed from the measurement data of each shot of the substrate measurement data of the first substrate. This makes it possible to obtain corrected measurement data indicating substrate error components common to the shot layouts from which error components specific to the shot layouts have been removed.

[0034] As above, the shot common shape component, the error component due to the step drive direction, and the error component due to the scan drive direction have been described as error components specific to the shot layout. However, the error components are not limited to these, and this method can also be applied to error components common to the substrate that occur in the lithography process.

[0035] Next, in step 103 (determination step), the information processing device 206 determines a correction value to be applied to the exposure device 204 when the exposure device 204 is used to transfer a pattern to the second substrate, based on the corrected measurement data generated in step 102 and the shot layout of the second substrate. The information processing device 206 can be understood as a device having a determination unit that executes step 103. Fig. 10 shows a process of determining a correction value to be applied to the exposure device 204 when the pattern is transferred to the second substrate, using corrected measurement data obtained by removing error components specific to the shot layout from the measurement data of the first substrate.

[0036] The substrate measurement data in FIG. 10 illustrates corrected measurement data obtained by removing error components specific to the shot layout from the measurement data of the first substrate in step 102, and the corrected measurement data can be provided to the control unit 16, for example, and stored by a storage device of the control unit 16. The shot layout of the second substrate, which is the substrate to be processed, is stored by a storage device of the control unit 16, for example. When the second substrate, which is the substrate to be processed, is loaded into the exposure apparatus 204 and an exposure job is started, the control unit 16 acquires the shot layout of the second substrate from the storage device of the control unit 16, and extracts corrected measurement data corresponding to each shot area from the corrected measurement data. Next, the control unit 16 determines, for each shot area, a correction value for correcting, for example, the shape of the shot area from the corrected measurement data corresponding to the shot area. This correction value can include a high-order shape correction of the shot area in the XY direction, as shown in FIG. 11. The shot layout of the second substrate may be the same as that of the first substrate, or may be a different shot layout from that of the first substrate. Based on the corrected measurement data, the correction value can be flexibly and accurately determined for various shot layouts. The correction value may be determined by the information processing device 206, the exposure device 204, or another device. The device that performs steps 101 and 102 and the device that performs step 103 may be the same or different devices. By controlling the exposure of the second substrate using the correction value determined in step 103, substrate error components that do not depend on the shot layout can be corrected with high accuracy.

[0037] In a step-and-scan exposure apparatus (scanner), for example, the shape of the shot area can be corrected by changing the scanning speed of the substrate stage 6 relative to the reticle stage 2 according to a correction value during scanning exposure, or by changing the magnification of the projection optical system 3 according to a correction value during scanning exposure. Also, in a step-and-repeat exposure apparatus (stepper), the shape of the shot area can be corrected by driving the aspheric optical element of the projection optical system 3 according to a correction value during stationary exposure.

[0038] A specific example of the determination of the correction values ​​in step 103 will be described. The correction values ​​for correcting the shape of the shot area can be determined, for example, through fitting of a polynomial model as shown below. Dx is the amount of correction in the X direction at the coordinates (x, y) in the shot area, and Dy is the amount of correction in the Y direction at the coordinates (x, y) in the shot area. For each shot area, measurement data corresponding to each shot area is extracted from the corrected measurement data, and fitting of a polynomial model is performed to determine the correction coefficients k1 to k 42 Specifically, for example, the measurement positions in the measurement data corresponding to each shot area from the corrected measurement data are substituted for x and y in formula (1), and the measurement values ​​are substituted for Dx and Dy in formula (1). Then, a matrix is ​​created from the m pieces of corrected measurement data, and the inverse matrix is ​​obtained to determine the correction coefficients k1 to k 42 It should be noted that, depending on the correction capability of the exposure tool 204, higher-order correction coefficients may be added to the correction coefficients k1 to k42, or correction coefficients may be removed.

[0039]

number

[0040]

number

[0041] Hereinafter, another specific example of the process of removing the error components caused by the exposure process specific to the exposure device 204 from the measurement data of the first substrate in step 102 will be described. In the above description, the shot common shape component, the error component due to the step drive direction, and the error component due to the scan drive direction are given as the error components caused by the exposure process specific to the exposure device 204. However, the measurement data of the first substrate may be periodically acquired, and the difference between the previous measurement data of the first substrate and the latest measurement data of the first substrate may be calculated as the error components caused by the exposure process specific to the exposure device 204. By calculating and removing such error components from the measurement data, the error components caused by the change over time of the substrate holding mechanism 5 can be corrected. FIG. 12 shows a state in which the measurement data of the first substrate is acquired as reference data, and then the measurement data of the first substrate is acquired as periodic data A, B, and C, for example, three times per month. For example, by calculating a correction value based on the difference between the reference data and the periodic data A, the error components caused by the change over time of the substrate holding mechanism 5 between the acquisition of the reference data and the acquisition of the periodic data A can be corrected. By calculating a correction value based on the difference between the reference data and the periodic data C, it is possible to correct error components that occur due to changes over time in the substrate holding mechanism 5 between the time the reference data is acquired and the time the periodic data C is acquired.

[0042] Hereinafter, another specific example of the process of determining the correction value according to the shot layout of the second substrate in step 103 will be described. Depending on the arrangement of the measurement points when measuring the first substrate, the density of the corrected measurement data may vary when determining the correction value according to the shot layout of the second substrate. This will be described with reference to Figs. 13(a) and 13(b). The black circles indicate the measurement data. The thin-line rectangle indicates the shot layout of the first substrate, and the thick-line rectangle indicates the shot layout of the second substrate. Fig. 13(a) shows the shot layout of the first substrate. Fig. 13(b) shows the shot layout of the second substrate. As shown in Fig. 13(a), the measurement data (measurement points) are arranged up to the edge of the shot area in the first substrate. If the shot layout of the second substrate is similar to that of the first substrate, the correction value can be appropriately determined. However, as shown in Fig. 13(b), in the shot layout of the second substrate, the measurement data (measurement points) are not present at the edge of the shot area, and an excessive correction value may be obtained. In such a case, in the generation step of step 102, it is desirable to generate corrected measurement data by performing an interpolation process on the data obtained by removing components that depend on the shot layout from the measurement data acquired in step 101.

[0043] FIG. 14(a) illustrates an example of measurement points in the shot layout of the first substrate. In step 102, corrected measurement data for each measurement point may be generated according to the above-mentioned method. Also, in step 102, the information processing device 206 may define pseudo measurement points (intersections) at a fine pitch, such as 1 mm, as illustrated in FIG. 14(b). Also, in step 102, the information processing device 206 calculates corrected measurement data for the pseudo measurement points by interpolation based on the corrected measurement data for the measurement points in FIG. 14(a) for each shot area. In step 103, the information processing device 206 extracts measurement values ​​from the corrected measurement data for the measurement points and pseudo measurement points in accordance with the shot layout of the second substrate, and determines correction values. This makes it possible to determine correction values ​​without causing sparseness and density of measurement data.

[0044] The measurement data of the first substrate may be generated in the exposure apparatus 204 using the alignment scope 15 configured in the exposure apparatus 204, instead of the substrate measuring instrument 205. Furthermore, the measurement data of the first substrate may be a mark for measuring an absolute positional deviation amount, such as an alignment mark arranged on the substrate, instead of a mark for measuring a relative positional deviation amount, such as a box-in-box mark.

[0045] The measurement data of the first substrate may not be the amount of misalignment in the XY directions at multiple locations on the substrate, but may be, for example, the Z direction positions (heights) of multiple locations on the substrate obtained by measuring the substrate using the focus sensor 11 configured in the exposure apparatus 204. The unique error component in the measurement data of the first substrate can be, for example, a shot common component in the Z direction (a component common to multiple shot areas) that is an error component generated by a unique exposure process by the exposure apparatus 204, based on the same concept as the amount of misalignment in the XY directions. The correction value according to the shot layout of the second substrate may include a rotation correction value θX around the X axis and a rotation correction value θY around the Y axis. In a step-and-scan exposure apparatus, θX and θY may be corrected for each stage position in the scanning direction during scanning exposure of each shot area.

[0046] A pattern transfer method according to one embodiment determines a correction value based on measurement data of a first substrate onto which a pattern is transferred by an exposure tool 204 and a shot layout of a second substrate, in accordance with the determination method shown in Fig. 3. The pattern transfer method may include a transfer step of transferring a pattern onto the second substrate while correcting the exposure tool 204 in accordance with the correction value.

[0047] The article manufacturing method of one embodiment may include a transfer step of transferring a second substrate by the transfer method, and a processing step of processing the second substrate to which the pattern has been transferred in the transfer step to obtain an article. The processing step may include, for example, a step of developing the second substrate to which the pattern has been transferred in the transfer step, as well as other well-known steps. Other well-known steps include etching, resist stripping, dicing, bonding, packaging, etc. According to this article manufacturing method, it is possible to manufacture an article of higher quality than before.

[0048] The present specification and drawings include the following disclosure. (Item 1) a generating step of generating corrected measurement data by removing components that depend on an arrangement of a plurality of shot areas of a first substrate from measurement data of the first substrate having a plurality of shot areas to which a pattern is transferred by a lithography apparatus; a determination step of determining a correction value to be applied to the lithography apparatus when transferring a pattern to the second substrate using the lithography apparatus, based on the corrected measurement data and an arrangement of a plurality of shot areas of the second substrate; A method for determining whether a (Item 2) the metrology data includes metrology data relating to positions of a plurality of marks on the first substrate; 2. The method according to item 1, (Item 3) the arrangement-dependent components include components that are common to the plurality of shot regions of the first substrate; 2. The method according to item 1, (Item 4) the arrangement-dependent component includes an average of measurement data of each of the plurality of shot areas of the first substrate; 2. The method according to item 1, (Item 5) the lithography tool is an exposure tool; the arrangement-dependent component includes a component that depends on a step driving direction between the shot areas of the first substrate; 2. The method according to item 1, (Item 6) the lithography apparatus is a scanning exposure apparatus; the arrangement-dependent component includes a component that depends on a scanning direction in scanning exposure of each of the plurality of shot areas of the first substrate; 2. The method according to item 1, (Item 7) the array-dependent component includes a difference between a previous measurement data of the first substrate and a latest measurement data of the first substrate; 2. The method according to item 1, (Item 8) The metrology data includes metrology data of an overlay error. 8. The method according to any one of items 1 to 7, (Item 9) The measurement data includes measurement data regarding heights of a plurality of points of the first substrate. 2. The method according to item 1, (Item 10) The generating step generates the corrected measurement data by performing an interpolation process on data obtained by removing components that depend on the array from the measurement data. 10. The method according to any one of items 1 to 9, (Item 11) obtaining the metrology data by measuring the first substrate. 11. The method according to any one of items 1 to 10, (Item 12) A step of determining a correction value by the determination method according to any one of items 1 to 11; transferring a pattern onto the second substrate while correcting the lithography apparatus based on the correction value; A pattern transfer method comprising: (Item 13) A step of transferring a pattern to the second substrate by the pattern transfer method according to item 12; processing the second substrate to which the pattern has been transferred to obtain an article; A method for manufacturing an article, comprising: (Item 14) 11. A program for causing a computer to execute the determination method according to any one of items 1 to 10. (Item 15) a generation unit that generates corrected measurement data by removing, from measurement data of a first substrate having a plurality of shot areas to which a pattern is transferred by a lithography apparatus, components that depend on an arrangement of the plurality of shot areas of the first substrate; a determination unit that determines a correction value to be applied to the lithography apparatus when a pattern is transferred to the second substrate using the lithography apparatus, based on the corrected measurement data and an arrangement of shot areas of the second substrate; 13. An information processing device comprising: (Item 16) 1. A lithography system comprising a lithography apparatus, a generation unit that generates corrected measurement data by removing, from measurement data of a first substrate having a plurality of shot areas to which a pattern is transferred by the lithography apparatus, components that depend on an arrangement of the plurality of shot areas of the first substrate; a determination unit that determines a correction value to be used when transferring a pattern to the second substrate based on the corrected measurement data and an arrangement of a plurality of shot areas of the second substrate, transferring a pattern to the plurality of shot areas of the second substrate by the lithography apparatus while controlling the lithography apparatus according to the correction value; A lithography system comprising:

[0049] Although the preferred embodiments of the present invention have been described above, the present invention is not limited to these embodiments, and various modifications and changes are possible within the scope of the gist of the present invention.

Claims

1. a generating step of generating corrected measurement data by removing, from measurement data of a first substrate having a plurality of shot areas to which a pattern is transferred by a lithography apparatus, components that depend on an arrangement of the plurality of shot areas of the first substrate; a determination step of determining a correction value to be applied to the lithography apparatus when transferring a pattern to the second substrate using the lithography apparatus, based on the corrected measurement data and an arrangement of a plurality of shot areas of the second substrate; A method for determining whether a

2. the metrology data includes metrology data relating to positions of a plurality of marks on the first substrate; 2. The method of claim 1 .

3. the arrangement-dependent components include components that are common to the plurality of shot regions of the first substrate; 2. The method of claim 1 .

4. the arrangement-dependent component includes an average of measurement data of each of the plurality of shot areas of the first substrate; 2. The method of claim 1 .

5. the lithography tool is an exposure tool; the arrangement-dependent component includes a component that depends on a step driving direction between shot areas of the first substrate; 2. The method of claim 1 .

6. the lithography apparatus is a scanning exposure apparatus; the arrangement-dependent component includes a component that depends on a scanning direction in scanning exposure of each of the plurality of shot areas of the first substrate; 2. The method of claim 1 .

7. the array-dependent component includes a difference between a previous measurement data of the first substrate and a latest measurement data of the first substrate; 2. The method of claim 1 .

8. The metrology data includes metrology data of an overlay error.

2. The method of claim 1 .

9. The measurement data includes measurement data regarding heights of a plurality of points of the first substrate.

2. The method of claim 1 .

10. The generating step generates the corrected measurement data by performing an interpolation process on data obtained by removing components that depend on the array from the measurement data.

2. The method of claim 1 .

11. obtaining the metrology data by measuring the first substrate. The method according to any one of claims 1 to 10.

12. determining a correction value by a method according to any one of claims 1 to 10; transferring a pattern onto the second substrate while correcting the lithography apparatus based on the correction value; A pattern transfer method comprising:

13. transferring a pattern onto the second substrate by the pattern transfer method according to claim 12; processing the second substrate to which the pattern has been transferred to obtain an article; A method for manufacturing an article, comprising:

14. A program for causing a computer to execute the determination method according to any one of claims 1 to 10.

15. a generation unit that generates corrected measurement data by removing, from measurement data of a first substrate having a plurality of shot areas to which a pattern is transferred by a lithography apparatus, components that depend on an arrangement of the plurality of shot areas of the first substrate; a determination unit that determines a correction value to be applied to the lithography apparatus when a pattern is transferred to the second substrate using the lithography apparatus, based on the corrected measurement data and an arrangement of shot areas of the second substrate; 13. An information processing device comprising:

16. 1. A lithography system comprising a lithography apparatus, a generation unit that generates corrected measurement data by removing, from measurement data of a first substrate having a plurality of shot areas to which a pattern is transferred by the lithography apparatus, components that depend on an arrangement of the plurality of shot areas of the first substrate; a determination unit that determines a correction value to be used when transferring a pattern to the second substrate based on the corrected measurement data and an arrangement of a plurality of shot areas of the second substrate, transferring a pattern to the plurality of shot areas of the second substrate by the lithography apparatus while controlling the lithography apparatus according to the correction value; A lithography system comprising:

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