Memory device formation method and memory device

Abstract

To provide a more appropriate 3D-memory device.SOLUTION: The present invention discloses a three-dimensional (3D) memory device having a step penetration contact (TSC). As an example, the 3D memory device (100) includes: a memory stack 104 having an interleaved conductive layer (a conductive layer 110) and a dielectric layer 112, that is a memory stack 104 having a step in a step region (an outer side region 118); a step penetration contact (TSC 136) that is extended through the memory stack 104 in the step region, in which the TSC 136 is a first conductive layer (a conductive layer 140); and a first space (a spacer 138) surrounding the first conductive layer, and that is the TSC 136 in which the first conductive layer of the TSC 136 is isolated from the conductive layer of the memory stack 104 by the first spacer.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] SUMMARY OF THE DISCLOSURE Embodiments of the present disclosure relate to three-dimensional (3D) memory devices and methods for manufacturing the same. [Background technology]

[0002] Planar memory cells are scaled to smaller sizes by improving process technology, circuit design, programming algorithms, and manufacturing processes. However, as memory cell feature sizes approach lower limits, planar processes and manufacturing techniques become difficult and expensive. As a result, the memory density of planar memory cells approaches an upper limit.

[0003] 3D memory architectures can address the density limitations of planar memory cells and include a memory array and peripheral devices for controlling signals to and from the memory array. Summary of the Invention [Problem to be solved by the invention]

[0004] Conventional 3D memory devices leave room for improvement, and a more suitable 3D memory device is provided herein. [Means for solving the problem]

[0005] Disclosed herein are embodiments of a 3D memory device.

[0006] In one example, a 3D memory device includes a memory stack having interleaved conductive and dielectric layers, the memory stack having a staircase in a staircase region, and a staircase through contact (TSC) extending through the memory stack in the staircase region, the TSC having a first conductor layer and a first spacer surrounding the first conductor layer, the first conductor layer of the TSC being insulated from the conductive layer of the memory stack by the first spacer.

[0007] In another example, a 3D memory device includes a memory stack having interleaved conductive and dielectric layers, a channel structure extending through the memory stack in a first region, and a step through contact (TSC) extending through the memory stack in a second region different from the first region, the TSC extending through a fewer number of the conductive and dielectric layers of the memory stack than the channel structure and including a conductor layer and a spacer laterally surrounding the conductor layer.

[0008] In a different example, a 3D memory device includes a memory stack having interleaved conductive and dielectric layers, the memory stack having a staircase in a staircase region, a word line contact contacting one of the conductive layers of the memory stack in the staircase region, and a staircase through contact (TSC) extending through the memory stack in the staircase region, the TSC and the word line contact each having a conductor layer having the same material.

[0009] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments of the present disclosure and, together with the description, further serve to explain the principles of the disclosure and to enable those skilled in the art to make and use the disclosure. Effect of the Invention

[0010] According to the present specification, a more suitable 3D memory device is provided. [Brief description of the drawings]

[0011] [Figure 1] 1 is a cross-sectional view of an exemplary 3D memory device according to some embodiments of the present disclosure. [Figure 2A] 1A-1C illustrate an exemplary manufacturing process for forming channel and stair structures of a 3D memory device according to some embodiments of the present disclosure. [Figure 2B]1A-1C illustrate an exemplary manufacturing process for forming channel and stair structures of a 3D memory device according to some embodiments of the present disclosure. [Figure 2C] 1A-1C illustrate an exemplary manufacturing process for forming channel and stair structures of a 3D memory device according to some embodiments of the present disclosure. [Figure 3A] 1A-1D illustrate an exemplary manufacturing process for forming TSCs, peripheral contacts, and wordline contacts of a 3D memory device according to various embodiments of the present disclosure. [Figure 3B] 1A-1D illustrate an exemplary manufacturing process for forming TSCs, peripheral contacts, and wordline contacts of a 3D memory device according to various embodiments of the present disclosure. [Figure 3C] 1A-1D illustrate an exemplary manufacturing process for forming TSCs, peripheral contacts, and wordline contacts of a 3D memory device according to various embodiments of the present disclosure. [Figure 3D] 1A-1D illustrate an exemplary manufacturing process for forming TSCs, peripheral contacts, and wordline contacts of a 3D memory device according to various embodiments of the present disclosure. [Figure 3E] 1A-1D illustrate an exemplary manufacturing process for forming TSCs, peripheral contacts, and wordline contacts of a 3D memory device according to various embodiments of the present disclosure. [Figure 4A] FIG. 1 illustrates another exemplary manufacturing process for forming TSCs, peripheral contacts, and wordline contacts of a 3D memory device according to some embodiments of the present disclosure. [Figure 4B] FIG. 1 illustrates another exemplary manufacturing process for forming TSCs, peripheral contacts, and wordline contacts of a 3D memory device according to some embodiments of the present disclosure. [Figure 4C] FIG. 1 illustrates another exemplary manufacturing process for forming TSCs, peripheral contacts, and wordline contacts of a 3D memory device according to some embodiments of the present disclosure. [Figure 4D] FIG. 1 illustrates another exemplary manufacturing process for forming TSCs, peripheral contacts, and wordline contacts of a 3D memory device according to some embodiments of the present disclosure. [Figure 5A] 1 is a flowchart of an exemplary method for forming a 3D memory device, according to some embodiments. [Figure 5B] 1 is a flowchart of an exemplary method for forming a 3D memory device, according to some embodiments. [Figure 5C] 1 is a flowchart of an exemplary method for forming a 3D memory device, according to some embodiments. [Figure 6] FIG. 13 illustrates a related art technique using different patterns to form dummy channel structures and TSCs in separate fabrication steps. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] Embodiments of the present disclosure will now be described with reference to the accompanying drawings.

[0013] While specific configurations and arrangements are described, it should be understood that this is done for illustrative purposes only. A person skilled in the art will recognize that other configurations and arrangements can be used without departing from the spirit and scope of the present disclosure. It will be apparent to one skilled in the art that the present disclosure can also be used in a variety of other applications.

[0014] References herein to "one embodiment," "one embodiment," "exemplary embodiment," "some embodiments," and the like indicate that the described embodiment may include a particular feature, structure, or characteristic, but it should be noted that all embodiments do not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases do not necessarily refer to the same embodiment. Moreover, if a particular feature, structure, or characteristic is described in connection with one embodiment, it will be within the knowledge of one of ordinary skill in the art that such feature, structure, or characteristic also is provided in connection with other embodiments, whether or not expressly described.

[0015] Generally, terms may be understood, at least in part, from their use in context. For example, as used herein, the term "one or more" may be used to describe any feature, structure, or characteristic in the singular sense, or may be used to describe a combination of features, structures, or characteristics in the plural sense, depending at least in part on the context. Similarly, terms such as "a," "an," "the," etc. may be understood to convey a singular usage or to convey a plural usage, also depending at least in part on the context. Furthermore, the term "based on" may be understood as not necessarily intended to convey an exclusive set of factors, but instead may allow for the presence of additional factors, also not necessarily explicitly described, depending at least in part on the context.

[0016] It should be readily understood that the meanings of "on," "above," and "over" in this disclosure are to be interpreted in the broadest sense, such that "on" not only means "directly on" something, but also means "on" something with an intervening feature or layer, and such that "above" or "on" not only means "on" something or "on" something, but also means "on" something or "on" something without an intervening feature or layer (i.e., directly on)

[0017] Additionally, spatially relative terms such as "beneath," "below," "lower," "above," "upper," and the like may be used herein for ease of description to describe the relationship of one element or feature to another element(s) or feature(s) as illustrated in the figures. The spatially relative terms are intended to encompass various orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein may be interpreted accordingly.

[0018] As used herein, the term "substrate" refers to a material to which subsequent layers of material are added. The substrate itself can be patterned. The material added on top of the substrate can be patterned or left unpatterned. Additionally, the substrate can include a wide range of semiconductor materials such as silicon, germanium, gallium arsenide, indium phosphide, and the like. Alternatively, the substrate can be made of a non-conductive material such as glass, plastic, or a sapphire wafer.

[0019] As used herein, the term "layer" refers to a portion of material that includes a region of thickness. A layer can extend throughout an underlying or overlying structure, or can have an extent that is less than the extent of the underlying or overlying structure. Additionally, a layer can be a region of a uniform or non-uniform continuous structure that has a thickness that is less than the thickness of the continuous structure. For example, a layer can be located between any pair of horizontal surfaces between the top and bottom surfaces of a continuous structure, or at the top and bottom surfaces. A layer can extend laterally, vertically, and / or along tapered surfaces. A substrate can be a layer, can include one or more layers within the substrate, and / or can have one or more layers above, above, and / or below the substrate. A layer can include multiple layers. For example, an interconnect layer can include one or more conductor layers and contact layers (in which interconnect lines and / or via contacts are formed), and one or more dielectric layers.

[0020] As used herein, the term "nominal / nominal" refers to a desired or target value of a characteristic or parameter of a component or process operation, set during the design phase of a product or process, along with a range of values ​​above and / or below the desired value. The range of values ​​may result from slight variations in the manufacturing process or tolerances. As used herein, the term "about" refers to a value of a given quantity that may vary based on a particular technology node associated with the subject semiconductor device. Based on a particular technology node, the term "about" can refer to a value of a particular quantity that varies, for example, within 10-30% of the value (e.g., ±10%, ±20%, or ±30% of the value).

[0021] As used herein, the term "3D memory device" refers to a semiconductor device having vertically oriented strings of memory cell transistors (such as NAND memory strings, referred to herein as "memory strings") on a landscape substrate such that the memory strings extend in a direction perpendicular to the substrate. As used herein, the term "vertical" means nominally perpendicular to a side of the substrate.

[0022] In some 3D memory devices, step through contacts (TSCs) are used to provide vertical interconnects between memory devices and peripheral devices. In addition, dummy channel structures are used to provide structural support for the memory devices. In existing manufacturing processes, the TSCs and dummy channel structures are formed in separate steps using different patterns. Each pattern consumes its own area allocation on the die, limiting the available area on the die for other patterns.

[0023] FIG. 6 illustrates a related technique that uses different patterns to form dummy channel structures and TSCs in separate fabrication steps. As shown in FIG. 6, a memory device 600 includes a memory stack 604 above a substrate 602. The memory stack 604 can include an array of memory strings 606 and can include a staircase structure 642. The array of dummy channel structures 602 can be formed by first etching an array of dummy holes using a dummy pattern and then filling the dummy holes with a dielectric layer to form the dummy channel structures 602. After forming the dummy channel structures 602, the sacrificial layer 610, which was initially formed as part of a dielectric stack including the interleaved dielectric layer 612 and the sacrificial layer 610, can be replaced with a conductor layer (also referred to as a conductive layer) to form the word lines. After the word lines are formed, the TSC pattern can be used to etch an array of TSC holes, which are then filled with a conductor layer to form the TSCs 608. The fabrication process described above utilizes different patterns (the dummy channel structure pattern and the TSC pattern) to form the dummy channel structures 602 and the TSCs 608, respectively, in separate fabrication steps.

[0024] Various embodiments according to the present disclosure provide a 3D memory device with TSCs that share the same pattern for forming a dummy channel structure, thereby improving the efficiency of die usage. For example, by combining two separate patterns into a single pattern, the available area on the die can be increased, allowing additional patterns to be placed. Furthermore, various embodiments of the method for forming a 3D memory device disclosed herein allow the TSCs to be formed in the same manufacturing process(es) for making other structures (e.g., peripheral contacts), thus further simplifying the manufacturing flow and reducing process costs.

[0025] 1 illustrates a cross-section of an exemplary 3D memory device 100 according to some embodiments of the present disclosure. The 3D memory device 100 can include a substrate 102, which may include silicon (e.g., single crystal silicon), silicon germanium (SiGe), gallium arsenide (GaAs), germanium (Ge), silicon-on-insulator (SOI), or any other suitable material. In some embodiments, the substrate 102 is a thinned substrate (e.g., a semiconductor layer) that has been thinned from its normal thickness by grinding, wet / dry etching, chemical mechanical polishing (CMP), or any combination thereof.

[0026] The 3D memory device 100 may include a memory stack 104 above the substrate 102. The memory stack 104 may be a stacked storage structure in which memory strings (e.g., NAND memory strings 106) are formed. In some embodiments, the memory stack 104 includes multiple pairs of conductor / dielectric layers stacked vertically above the substrate 102. Each pair of conductor / dielectric layers may include a conductor layer 110 and a dielectric layer 112. That is, the memory stack 104 may include interleaved conductor layers 110 and dielectric layers 112 that are stacked vertically. As shown in FIG. 1, each NAND memory string 106 extends vertically through the interleaved conductor layers 110 and dielectric layers 112 in the memory stack 104. In some embodiments, the 3D memory device 100 is a NAND flash memory device with memory cells provided at the intersections of the NAND memory strings 106 and the conductor layers 110 (which function as word lines) of the 3D memory device 100. The number of conductor / dielectric layer pairs in the memory stack 104 (e.g., 32, 64, 96, or 128) can set the number of memory cells in the 3D memory device 100.

[0027] The conductor layers 110 may each have the same thickness or may have different thicknesses. Similarly, the dielectric layers 112 may each have the same thickness or may have different thicknesses. The conductor layers 110 may include a conductive material, including but not limited to tungsten (W), cobalt (Co), copper (Cu), aluminum (Al), polycrystalline silicon (polysilicon), doped silicon, silicide, or any combination thereof. The dielectric layers 112 may include a dielectric material, including but not limited to silicon oxide, silicon nitride, silicon oxynitride, or any combination thereof. In some embodiments, the conductor layers 110 include a metal, such as W, and the dielectric layers 112 include silicon oxide. It is understood that according to some embodiments, a silicon oxide film (not shown), such as in-situ steam generated (ISSG) silicon oxide, may be formed between the substrate 102 (e.g., a silicon substrate) and the memory stack 104.

[0028] Note that x, y, and z axes have been added to FIG. 1 (y direction points into the page) to further illustrate the spatial relationships of components in the 3D memory device 100. The x, y, and z directions are perpendicular to each other. The substrate 102 has two sides (e.g., top and bottom) that extend laterally in the xy plane in the x and y directions (laterally). As used herein, whether one component (e.g., layer or device) of a semiconductor device (e.g., 3D memory device 100) is "on," "above," or "below" another component (e.g., layer or device) is determined relative to the substrate of the semiconductor device in the z direction (e.g., substrate 102) when the substrate of the semiconductor device is positioned at the bottom surface of the semiconductor device in the z direction (vertical direction). The same concepts for describing spatial relationships are applied throughout this disclosure.

[0029] In some embodiments, the 3D memory device 100 is part of a monolithic 3D memory device, where the components of the monolithic 3D memory device (e.g., memory cells and peripheral devices) are formed on a single substrate (e.g., substrate 102). Peripheral devices 111, such as any suitable digital, analog, and / or mixed-signal peripheral circuitry used to facilitate operation of the 3D memory device 100, may also be formed on the substrate 102 outside of the memory stack 104. The peripheral devices 111 may be formed "on" the substrate 102, where the peripheral devices 111 are formed in whole or in part within (e.g., below the top surface of) and / or directly on the substrate 102. The peripheral devices 111 may include one or more of a page buffer, a decoder (e.g., row decoder and column decoder), a sense amplifier, a driver, a charge pump, a current or voltage reference, or any active or passive components of a circuit (e.g., a transistor, a diode, a resistor, or a capacitor). Isolation regions (e.g., shallow trench isolation (STI)) and doped regions (e.g., transistor source and drain regions) can also be formed in the substrate 102 outside the memory stack 104. It is understood that in some embodiments, the peripheral devices 111 are formed above or below the NAND memory strings 106, as opposed to on the side of the NAND memory strings 106 as shown in FIG. 1. It is further understood that in some embodiments, the 3D memory device 100 is part of a non-monolithic 3D memory device, and components are formed separately on different substrates and then bonded in a face-to-face, face-to-back, or back-to-back manner. The peripheral devices 111 can be formed on a separate substrate different from the substrate 102.

[0030] 1, the memory stack 104 can include an inner region 116 (also known as the "core array region") and an outer region 118 (also known as the "staircase region"). In some embodiments, the inner region 116 is a central region of the memory stack 104 where the array of NAND memory strings 106 are formed through pairs of conductor / dielectric layers, and the outer region 118 is the remaining region of the memory stack 104 surrounding the inner region 116 (including the sides and edges) without the NAND memory strings 106.

[0031] As shown in FIG. 1, each NAND memory string 106 may include a channel structure 108 that extends vertically through a pair of conductor / dielectric layers in the inner region 116 of the memory stack 104. The channel structure 108 may include a channel hole filled with a semiconductor material (e.g., forming a semiconductor channel) and a dielectric material (e.g., forming a memory film). In some embodiments, the semiconductor channel includes silicon, such as amorphous silicon, polysilicon, or single crystal silicon. In some embodiments, the memory film is a composite layer including a tunnel layer, an accumulation layer (also known as a "charge trap / accumulation layer"), and a blocking layer. Each NAND memory string 106 may have a cylindrical shape (e.g., a pillar shape). According to some embodiments, the semiconductor channel, the tunnel layer, the accumulation layer, and the blocking layer are arranged in this order along a direction from the center of the pillar toward the outer surface. The tunnel layer may include silicon oxide, silicon oxynitride, or any combination thereof. The accumulation layer may include silicon nitride, silicon oxynitride, silicon, or any combination thereof. The blocking layer may include silicon oxide, silicon oxynitride, a high dielectric constant (high-k) dielectric, or any combination thereof.

[0032] In some embodiments, the NAND memory string 106 includes multiple control gates (each part of a word line / conductor layer 110) of the NAND memory string 106. The conductor layer 110 of each conductor / dielectric layer pair can function as a control gate for a memory cell of the NAND memory string 106. The conductor layer 110 can include multiple control gates of multiple NAND memory strings 106 and can extend laterally as a word line that terminates in an outer region 118 of the memory stack 104.

[0033] In some embodiments, the NAND memory string 106 includes two plugs 117 and 119 at each end in the vertical direction. Each plug 117 or 119 can contact a respective end of the channel structure 108. The plug 117 can include a semiconductor material, such as silicon, epitaxially grown from the substrate 102. The plug 117 can function as a channel controlled by a source select gate of the NAND memory string 106. The plug 117 is at the bottom end of the NAND memory string 106 and can contact the channel structure 108 (e.g., at the bottom end of the channel structure 108). As used herein, when the substrate 102 is positioned at the bottom surface of the 3D memory device 100, the "top end" of a component (e.g., the NAND memory string 106) is the end that is away from the substrate 102 in the z direction, and the "bottom end" of a component (e.g., the NAND memory string 106) is the end that is closer to the substrate 102 in the z direction.

[0034] The plug 119 can include a semiconductor material (e.g., polysilicon) or a conductive material (e.g., metal). In some embodiments, the plug 119 includes an opening filled with titanium / titanium nitride (Ti / TiN as a barrier layer) and tungsten (as a conductor). By covering the top of the channel structure 108 during fabrication of the 3D memory device 100, the plug 119 can function as an etch stop layer that prevents etching of dielectrics filled in the channel structure 108, such as silicon oxide and silicon nitride. In some embodiments, the plug 119 functions as a drain of the NAND memory string 106.

[0035] As shown in FIG. 1, at least one side in the lateral direction (e.g., in the x-direction), the outer region 118 of the memory stack 104 can include a staircase structure 142. In some embodiments, another staircase structure (not shown) is disposed on the opposite side of the memory stack 104 in the x-direction. Each "level" of the staircase structure 142 can include one or more pairs of conductor / dielectric layers, each including a conductor layer 110 and a dielectric layer 112. The top layer of each level of the staircase structure 142 can be the conductor layer 110 for vertical interconnection. In some embodiments, each two adjacent levels of the staircase structure 142 are offset by nominally the same distance vertically and nominally the same distance laterally. For each two adjacent levels of the staircase structure 142, the first level (and the conductor and dielectric layers therein) closer to the substrate 102 can extend laterally further than the second level (and the conductor and dielectric layers therein), thereby forming a "landing area" on the first level for vertical interconnection.

[0036] The staircase structure 142 can be used to land wordline contacts 144. A bottom end of each wordline contact 144 can contact the top conductor layer 110 (wordline) of the respective level of the staircase structure 142 to individually address a corresponding wordline of the 3D memory device 100. The wordline contacts 144 can include openings (e.g., via holes or trenches) that extend vertically through one or more dielectric layers and are filled with a conductive material, including but not limited to W, Co, Cu, Al, silicide, or any combination thereof.

[0037] As shown in FIG. 1, the 3D memory device 100 further includes TSCs 136 each extending vertically through a conductor / dielectric layer pair in the staircase structure 142. Each TSC 136 can extend vertically through the interleaved conductor layers 110 and dielectric layers 112. In some embodiments, the TSCs 136 can extend through the entire thickness of the staircase structure 142 (e.g., all vertical conductor / dielectric layer pairs at a lateral position of the staircase structure 142) and reach the substrate 102. In some embodiments, the TSCs 136 further extend through at least a portion of the substrate 102. The TSCs 136 can shorten interconnect routing to carry electrical signals from and / or to the 3D memory device 100, such as a portion of a power bus. In some embodiments, the TSCs 136 can provide electrical connections between the 3D memory device 100 and the peripheral device 111, and / or between the back-end wiring (BEOL) interconnects (not shown) and the peripheral device 111. The TSC 136 may also provide mechanical support to the stair structure 142 .

[0038] The TSC 136 may be formed by filling a vertical opening through the staircase 142 with a material. In some embodiments, the TSC 136 includes a conductor layer 140 surrounded by a spacer 138. For example, the sidewalls of the TSC 136 may be in contact with the spacer 138. The conductor layer 140 may include a conductive material, including but not limited to W, Co, Cu, Al, doped silicon, silicide, or any combination thereof. The spacer 138 may electrically insulate the conductor layer 140 of the TSC 136 from the surrounding conductor layer 110 within the staircase structure 142. In some embodiments, the TSC 136 has a substantially circular shape in a plan view, with the conductor layer 140 and the spacer 138 disposed radially from the center of the TSC 136 in this order. The spacer 138 may include a dielectric material, including but not limited to silicon oxide, silicon nitride, silicon oxynitride, or any combination thereof.

[0039] As shown in FIG. 1, the 3D memory device 100 may further include peripheral contacts 148 that extend vertically through one or more dielectric layers and contact peripheral devices 111 outside the memory stack 104. The peripheral contacts 148 may provide electrical connections to the peripheral devices 111. The peripheral contacts 148 may be formed by filling the vertical openings with a material. In some embodiments, similar to the TSCs 136, the peripheral contacts 148 may include a conductor layer 152 surrounded by spacers 150. The conductor layer 152 may include a conductive material, including but not limited to W, Co, Cu, Al, doped silicon, silicide, or any combination thereof. In some embodiments, the peripheral contacts 148 have a substantially circular shape in a plan view, with the conductor layer 152 and the spacers 150 being radially arranged in this order from the center of the peripheral contact 148. The spacers 150 may include a dielectric material, including but not limited to silicon oxide, silicon nitride, silicon oxynitride, or any combination thereof. In some embodiments, spacer 150 and spacer 138 have nominally the same thickness in a lateral direction (e.g., radial direction). In some embodiments, both spacer 150 and spacer 138 comprise silicon oxide. It is understood that peripheral device 111 may not be formed on substrate 102 and peripheral contacts 148 may be of a different configuration in some embodiments, such as, for example, 3D memory device 100 being a non-monolithic 3D memory device.

[0040] It is understood that the 3D memory device 100 may include additional components and structures not shown in FIG. 1 , including, but not limited to, other local contacts and interconnects in one or more BEOL interconnect layers above the memory stack 104 and / or below the substrate 102.

[0041] 2A-2C illustrate an exemplary fabrication process for forming a channel structure and a staircase structure of a 3D memory device according to some embodiments of the present disclosure. FIGs. 3A-3E illustrate an exemplary fabrication process for forming a TSC, a peripheral contact, and a word line contact of a 3D memory device according to various embodiments of the present disclosure. FIGs. 4A-4D illustrate another exemplary fabrication process for forming a TSC, a peripheral contact, and a word line contact of a 3D memory device according to some embodiments of the present disclosure. FIGs. 5A-5C are flow charts of exemplary methods 500, 500′, and 500″ for forming a 3D memory device according to some embodiments. An example of a 3D memory device illustrated in FIGs. 2-5 includes the 3D memory device 100 illustrated in FIG. 1. FIGs. 2-5 are described together. It is understood that the operations illustrated in the methods 500, 500′, and 500″ are not exhaustive and that other operations can be performed before, after, or between any of the illustrated operations. Additionally, some of the operations may be performed simultaneously or in a different order than that illustrated in FIGs. 5A-5C.

[0042] With reference to Figure 5A, method 500 begins at operation 502 where a dielectric stack including multiple interleaved dielectric layers and a sacrificial layer is formed on a substrate. The substrate may be a silicon substrate. Method 500 proceeds to operation 504 where a channel structure is formed that extends vertically through the dielectric stack, as shown in Figure 5A. Method 500 proceeds to operation 506 where a stair structure is formed on one side of the dielectric stack.

[0043] As shown in FIG. 2A, a dielectric deck 204 including multiple interleaved dielectric and sacrificial layers is formed on a silicon substrate 202. In some embodiments, the sacrificial layer 206 and the dielectric layer 208 are alternately deposited by one or more thin film deposition processes, including but not limited to physical vapor deposition (PVD), chemical vapor deposition (CVD), atomic layer deposition (ALD), or any combination thereof. In some embodiments, the sacrificial layer 206 includes silicon nitride and the dielectric layer 208 includes silicon oxide. It is understood that the order of depositing the sacrificial layer 206 and the dielectric layer 208 is not limited. The deposition can start with the sacrificial layer 206 or the dielectric layer 208, and can end with the sacrificial layer 206 or the dielectric layer 208.

[0044] As shown in FIG. 2B, an array of channel structures 210 is formed, each of which extends vertically through the interleaved sacrificial layers 206 and dielectric layers 208 in the dielectric deck 204. In some embodiments, the fabrication process for forming the channel structures 210 includes using dry and / or wet etching, such as deep reactive ion etching (DRIE), to form a channel hole through the interleaved sacrificial layers 206 and dielectric layers 208 in the dielectric deck 204, and then using a thin film deposition process to fill the channel hole with multiple layers, such as dielectric layers and semiconductor layers. In some embodiments, the dielectric layer is a composite dielectric layer, such as a combination of multiple dielectric layers, including but not limited to a tunnel layer, an accumulation layer, and a blocking layer. The tunnel layer can include a dielectric material, including but not limited to silicon oxide, silicon nitride, silicon oxynitride, or any combination thereof. The accumulation layer can include a material for storing charge for memory operations. The accumulation layer material can include but is not limited to silicon nitride, silicon oxynitride, a combination of silicon oxide and silicon nitride, or any combination thereof. The blocking layer may include a dielectric material including, but not limited to, silicon oxide or a combination of silicon oxide / silicon oxynitride / silicon oxide (ONO). The blocking layer may further include a high-k dielectric layer, such as an aluminum oxide (Al2O3) layer. The semiconductor layer may include polysilicon, which functions as the semiconductor channel. The semiconductor layer and the dielectric layer may be formed by processes such as ALD, CVD, PVD, or any combination thereof.

[0045] In some embodiments, the dielectric stack 204 may be bonded by another dielectric stack to form a multi-stack structure via a bonding layer 212. As shown in FIG. 2B, the bonding layer 212 may be formed on the dielectric deck 204 by depositing a dielectric layer, such as a silicon oxide layer, using a thin film deposition process, such as ALD, CVD, PVD, or any combination thereof. An array of inter-deck plugs 214 may be formed in the bonding layer 212 and contact the array of channel structures 210, respectively. The inter-deck plugs 214 may be formed by patterning and etching openings through the bonding layer 212, followed by depositing a semiconductor material, such as polysilicon, using a thin film deposition process, such as ALD, CVD, PVD, or any combination thereof. In the following, for brevity and simplicity, the embodiments of the present disclosure are described with respect to a single stack structure. It is understood that the technical solutions disclosed herein are also applicable to a multi-stack structure.

[0046] 2C, a staircase structure 224 is formed on the side of the dielectric stack 218. The staircase structure 224 may be formed by a so-called "trim etch" process in which, in each cycle, a patterned photoresist layer is trimmed (e.g., incrementally and inwardly, often by etching from all directions), followed by etching the exposed portions of the dielectric / sacrificial layer pair using the trimmed photoresist layer as an etch mask to form one step of the staircase structure 224.

[0047] The method 500 proceeds to operation 508, as shown in FIG. 5A, where dummy channel structures are formed that extend vertically through the staircase structure. In some embodiments, the dummy channel structures are formed as intermediate structures that are later replaced by TSCs. As shown in FIG. 3B, an array of dummy channel structures 302 is formed through the staircase structure 342 of the dielectric stack 304. The dielectric stack 304 includes interleaved dielectric layers 312 and sacrificial layers 310.

[0048] The dummy channel structure 302 may have a vertical opening that extends vertically through the staircase structure 342 and is filled with the same material as the channel structure 108. According to some embodiments, unlike the channel structure 108, no contacts are formed on the dummy channel structure 302 to provide electrical connection with other components of a 3D memory device, such as the 3D memory device 100. In some embodiments, the dummy channel structure 302 is completely filled with a dielectric material, including, but not limited to, silicon oxide, silicon nitride, silicon oxynitride, or any combination thereof.

[0049] The dummy channel structures 302 can be used to balance loads during certain processes during fabrication (e.g., etching and chemical mechanical polishing (CMP)) and provide mechanical support to memory array structures such as the staircase structure 342. Embodiments of the present disclosure can form TSCs from dummy channel structures, thereby using the same pattern to form both the dummy channel structures and the TSCs. The resulting TSCs can provide the balancing and support functions for the dummy channel structures.

[0050] 3A, the dummy channel structure 302 may be formed by first etching dummy holes 322 through one or more dielectric layers in the staircase structure 342 using a wet etch and / or a dry etch, such as DRIE. In some embodiments, the dummy holes 322 may extend vertically through all of the dielectric layers in the staircase structure 342 to expose a portion of the silicon substrate 202 (e.g., the dummy holes 322 may extend down to the silicon substrate 202). In some embodiments, the dummy holes 322 may extend into the silicon substrate 202 (e.g., a portion of the silicon substrate 202 may be etched away during the etching process).

[0051] In some embodiments, dummy holes 324 outside the dielectric stack 304 may be formed simultaneously (e.g., in the same manufacturing step) with the formation of dummy holes 322. Dummy holes 324 may be used to form peripheral contacts that provide interconnections to peripheral devices 311. In some embodiments, dummy holes 322 and 324 may have a nominally circular shape in plan view, as shown in FIG. 3A. In some embodiments, the sizes of dummy holes 322 and 324 may be nominally the same.

[0052] 3B, the dummy holes 322 shown in FIG. 3A can be filled (deposited) with a dielectric layer 352, such as a silicon oxide layer, using one or more thin film deposition processes, such as ALD, CVD, PVD, or any combination thereof, to form the dummy channel structure 302. In some embodiments, the dummy channel structure 302 is formed simultaneously with the channel structure 210 in the same fabrication step, such that the dummy holes 322 are filled with at least a portion of the material that fills the channel structure 210.

[0053] In some embodiments, the dummy channel structures 303 outside the dielectric stack 304 are formed at the same time (e.g., in the same manufacturing step) as forming the dummy channel structures 302 by depositing a dielectric layer 354 in the dummy holes 324. The dielectric layer 354 may have the same material as the dielectric layer 352.

[0054] In some embodiments, the dummy holes 322 / 324 may be completely filled with the dielectric layer 352 / 354, respectively. In other embodiments, the dummy holes 322 or 324 may be partially filled, as shown in FIG. 3B. In such a case, the resulting dummy channel structure 302 / 303 may have top, bottom, and sidewall portions with the dielectric layer 352 / 354 deposited thereon. The central region may not be completely filled.

[0055] The method 500 proceeds to operation 510, as shown in FIG. 5, where a plurality of word lines are formed by replacing a sacrificial layer in a dielectric stack with a conductor layer. As shown in FIG. 3C, the sacrificial layer 310 is replaced with a conductor layer 309 (functioning as a word line). Replacing the sacrificial layer 310 with the conductor layer 309 can be performed by wet etching the sacrificial layer 310 (e.g., silicon nitride) selectively to the dielectric layer 304 (e.g., silicon oxide) and filling the structure with the conductor layer 309 (e.g., W). The conductor layer 309 can be deposited by PVD, CVD, ALD, electrochemical deposition, or any combination thereof. The conductor layer 309 can include a conductive material, including but not limited to W, Co, Cu, Al, polysilicon, silicide, or any combination thereof. As a result, after the gate replacement process, the dielectric stack 304 of FIGS. 3A-3B becomes a memory stack 305 including a conductor / dielectric layer pair, namely an interleaved conductor layer 309 and a dielectric layer 312, on the silicon substrate 202.

[0056] The method 500 proceeds to operation 512, where an opening extending vertically through a central portion of the dummy channel structure is etched to form a spacer. Referring to FIG. 3D, an opening 372 (TSC hole) is etched through the dummy channel structure 302 (shown in FIGS. 3B-3C) to form a spacer 362. In some embodiments, the opening 372 / spacer 362 can extend vertically through the interleaved dielectric layer 312 and conductor layer 309 in the staircase structure 342 to reach the silicon substrate 202. In some embodiments, a second opening 374 (peripheral contact hole) can be simultaneously formed from the dummy channel structure 303 (shown in FIGS. 3B-3C). The opening 372 / 374 can be etched using a wet etching and / or dry etching process, such as DRIE. For example, as shown in FIG. 3D, a central portion of the dummy channel structure 302 / 303 can be etched away to form a spacer 362 / 364 having a hollow core. In some embodiments, the sidewalls of spacers 362 and 364 can have nominally the same thickness. The depths of TSC holes 372 and peripheral contact holes 374 in the vertical direction can be nominally the same. The lateral dimensions, such as diameters, of TSC holes 372 and peripheral contact holes 374 can be nominally the same or different in various embodiments. For example, according to some embodiments, the diameter of TSC holes 372 can be larger than the diameter of peripheral contact holes 374.

[0057] As shown in FIG. 3D , the TSC holes 372 and the peripheral contact holes 374 can reach the silicon substrate 202, and the bottom ends of the peripheral contact holes 374 can contact the peripheral devices 311 formed on the silicon substrate 202. In some embodiments, the peripheral devices 311 include transistors that can be formed by multiple processes, including but not limited to photolithography, wet / dry etching, thin film deposition, thermal growth, implantation, CMP, and any other suitable processes. In some embodiments, doped regions are formed in the silicon substrate 202 by ion implantation and / or thermal diffusion, which function as, for example, source and / or drain regions of the transistors. In some embodiments, isolation regions (e.g., STI) are also formed in the silicon substrate 202 by wet and / or dry etching and thin film deposition processes. The manufacturing process for forming the peripheral devices 311 can be performed at any manufacturing stage before the etching of the peripheral contact holes 374.

[0058] The opening 372 / 374 is etched from the dummy channel structure 302 / 303 by removing a portion of the dielectric layer deposited thereon, so that the remaining portion including the sidewall of the dummy channel structure 302 / 303 after the opening 372 / 374 is formed becomes the spacer 362 / 364. The spacer 362 / 364 can provide mechanical support to the memory stack 305 including the staircase structure 342, similar to the dummy channel structure 302 / 303. In addition, the spacer 362 / 364 can function as an insulating layer surrounding the conductor layer deposited in the opening 372 / 374 to form the TSC / periphery contact.

[0059] In some embodiments, opening 372 / 374 (defined by the inner walls of spacers 362 / 364) may have a nominally circular shape in plan view, as shown in FIG. 3D. In some embodiments, the side walls of spacers 362 and 364 may have nominally the same thickness. In some embodiments, spacers 362 and 364 may have the same or different sizes. For example, the diameter of spacer 364 (e.g., measured from the inner or outer side wall) may be smaller than the diameter of spacer 362.

[0060] The method 500 proceeds to operation 514, as shown in FIG. 5, where the word line contact and the TSC are simultaneously formed. In some embodiments, a conductor layer is deposited in the opening to form the TSC. In some embodiments, the conductor layer is a composite layer including an adhesion / barrier layer and a conductor. As shown in FIG. 3E, a conductor layer 382 is deposited in the opening 372 (as shown in FIG. 3D) to fill the remaining space of the opening 372, thereby forming the TSC 336 that extends vertically through the staircase structure 342. In some embodiments, the conductor can be formed in the remaining space of the opening 372 by depositing a metal, such as tungsten, using one or more thin film deposition processes, such as ALD, CVD, PVD, electrochemical deposition, or any combination thereof. The same deposition process can be used to simultaneously form a conductor layer 384 in the opening 374 (as shown in FIG. 3D) to form the peripheral contact 348 that contacts the peripheral device 311. In some embodiments, the conductor layers 382 and 384 can use the same material (e.g., tungsten (W)). After deposition, excess conductor layer can be removed by CMP.

[0061] The word line contacts 344 can be formed simultaneously (e.g., in the same fabrication step) with the TSCs. Each word line contact 344 contacts each of the conductor layers 309 of the conductor / dielectric layer pairs in the staircase structure 342. The word line contacts 344 are formed through one or more dielectric layers by first etching vertical openings (e.g., by wet etching and / or dry etching) and then filling the openings with a conductive material using ALD, CVD, PVD, electrochemical deposition, or any combination thereof. In some embodiments, another conductive material fills the openings to act as an adhesion / barrier layer. The etching of the dielectric layers to form the openings of the word line contacts 344 can be controlled by an etch stop at a different material. For example, the etching of the dielectric layers can be stopped when the conductor layer 309 in the staircase structure 342 is reached.

[0062] In some embodiments, the TSCs 336, the word line contacts 344, and the peripheral contacts 348 may have a nominally circular shape in a plan view, as shown in FIG. 3E. The TSCs 336, the word line contacts 344, and the peripheral contacts 348 may have the same or different sizes. For example, according to some embodiments, the TSCs 336 and the peripheral contacts 348 may have a diameter larger than the diameter of the word line contacts 344.

[0063] FIG. 5B is a flow chart of another exemplary method 500′ for forming a 3D memory device according to some embodiments of the present disclosure. Operations 502′, 504′, 506′, and 508′ are similar to operations 502, 504, 506, and 508, respectively, and therefore are not repeated. The method 500′ proceeds to operation 520, as shown in FIG. 5B, where an opening extending vertically through a central portion of the dummy channel structure is etched to form a spacer. Operation 520 is similar to operation 512, except that the etching of the opening in operation 520 is performed before forming the word lines. As shown in FIG. 4A, the opening 372 / 374 is etched before the sacrificial layer 310 is replaced with the conductor layer 309.

[0064] The method 500' continues with operation 522, as shown in Figure 5B, where a TSC is formed that extends vertically through the staircase structure by depositing a conductive layer in the opening. Operation 522 is similar to 514 with respect to the formation of the TSC. Unlike operation 514, where the word line contact is formed simultaneously with the TSC, in operation 522, the word line contact is not formed because the word line has not yet been formed prior to operation 522. Referring to Figure 4B, TSC 336 is formed before sacrificial layer 310 is replaced with conductive layer 309.

[0065] The method 500' continues with operation 524, as shown in Figure 5B, where wordlines are formed by replacing a sacrificial layer in the dielectric stack with a conductor layer. Operation 524 is similar to operation 510. Referring to Figure 4C, wordlines 309 are formed by replacing sacrificial layer 310 with conductor layer 309. Note in Figure 4C that TSC 336 and peripheral contacts 348 have been formed.

[0066] The method 500' continues with operation 526, as shown in Figure 5B, where wordline contacts are formed. Operation 526 is similar to operation 514 with respect to forming the wordlines. After TSCs 336 and peripheral contacts 348 are formed, wordline contacts 344 are formed, as shown in Figure 4D.

[0067] FIG. 5C is a flowchart of a further exemplary method 500″ for forming a 3D memory device according to some embodiments of the present disclosure. Operations 502″, 504″, and 506″ are similar to operations 502, 504, and 506, respectively, and thus are not repeated. The method 500″ proceeds to operation 530, as shown in FIG. 5C, where a dummy hole is formed that extends vertically through the staircase structure. As shown in FIG. 3A, the dummy hole 322 can be formed through one or more dielectric layers in the staircase structure 342 using a wet etch and / or a dry etch, such as DRIE. In some embodiments, the dummy hole 322 can extend vertically through all of the dielectric layers in the staircase structure 342 to reach the silicon substrate 202. In some embodiments, the dummy hole 322 may extend into the silicon substrate 202 (e.g., a portion of the silicon substrate 202 may be etched away during the etching process).

[0068] In some embodiments, dummy holes 324 outside the dielectric stack 304 may be formed simultaneously (e.g., in the same manufacturing step) with the formation of dummy holes 322. Dummy holes 324 may be used to form peripheral contacts that provide interconnections to peripheral devices 311. In some embodiments, dummy holes 322 and 324 may have a nominally circular shape in plan view, as shown in FIG. 3A. In some embodiments, the sizes of dummy holes 322 and 324 may be nominally the same.

[0069] The method 500″ continues at operation 532, as shown in FIG. 5C, where a spacer having a hollow core is formed in the dummy hole. As shown in FIGS. 3B-3D, the spacer 362 may be formed by depositing the dielectric layer 352 in the dummy hole 322, as described above in connection with steps 512 and 520, followed by removing a portion of the dielectric layer 352 to form the spacer 362. In some embodiments, the spacer 362 may be formed directly by depositing the dielectric layer 352 in the dummy hole 322, without an additional etching operation to remove a portion of the deposited dielectric material to form the spacer 362. The spacer 364 may be formed similarly.

[0070] The method 500'' continues with operation 534, as shown in FIG. 5C, where a TSC is formed that extends vertically through the staircase structure by depositing a conductive layer within the hollow core of the spacer. Operation 534 is similar to operation 522.

[0071] The method 500'' continues with operation 536, as shown in FIG. 5C, where wordlines are formed by replacing a sacrificial layer in the dielectric stack with a conductor layer. Operation 536 is similar to operation 524. Referring to FIG. 4C, wordlines 309 are formed by replacing sacrificial layer 310 with conductor layer 309. Note in FIG. 4C that TSC 336 and peripheral contacts 348 have been formed.

[0072] The method 500'' continues with operation 538, as shown in FIG. 5C, where a wordline contact is formed. Operation 538 is similar to operation 526. As shown in FIG. 4D, after the TSCs 336 and peripheral contacts 348 are formed, the wordline contacts 344 are formed.

[0073] According to one aspect of the disclosure, a method for forming a 3D memory device is provided. A dielectric stack including a plurality of interleaved dielectric layers and a sacrificial layer is formed on a substrate. A staircase structure is formed on one side of the dielectric stack. A dummy hole is formed that extends vertically through the staircase structure to the substrate. A spacer having a hollow core is formed in the dummy hole. A TSC in contact with the substrate is formed by depositing a conductor layer in the hollow core of the spacer. The TSC extends vertically through the staircase structure.

[0074] In some embodiments, prior to forming the spacers, the wordlines are formed by replacing a sacrificial layer in the dielectric stack with a conductor layer.

[0075] In some embodiments, a plurality of word line contacts, each contacting a respective one of the word lines, are formed simultaneously with the formation of the TSC.

[0076] In some embodiments, after forming the TSC, multiple wordlines are formed by replacing a sacrificial layer in the dielectric stack with a conductor layer.

[0077] In some embodiments, a plurality of word line contacts are formed, each contacting a respective one of the word lines.

[0078] In some embodiments, a dielectric layer is formed in the dummy holes to form spacers.

[0079] In some embodiments, the dielectric layer comprises silicon oxide.

[0080] In some embodiments, the dielectric layer forms a spacer.

[0081] In some embodiments, to form the spacers, the hollow cores are etched through a dielectric layer deposited in the dummy holes.

[0082] In some embodiments, a second dummy hole outside the dielectric stack is formed simultaneously with the dummy hole.

[0083] In some embodiments, the peripheral contacts are formed by depositing a second conductor layer in the second dummy holes simultaneously with the formation of the TSC, the peripheral contacts being in contact with the substrate.

[0084] In some embodiments, the first conductor layer and the second conductor layer comprise the same material.

[0085] In some embodiments, the TSC has a nominally circular shape in plan view.

[0086] In some embodiments, the conductor layer comprises tungsten (W).

[0087] In some embodiments, the dielectric layers within the interleaved dielectric layers and the sacrificial layers comprise silicon oxide and the sacrificial layers within the interleaved dielectric layers and the sacrificial layers comprise silicon nitride.

[0088] According to another aspect of the disclosure, a method for forming a 3D memory device is provided. A dielectric stack including a plurality of interleaved dielectric layers and a sacrificial layer is formed on a substrate. A staircase structure is formed on one side of the dielectric stack. A dummy channel structure is formed that reaches the substrate. The dummy channel structure extends vertically through the staircase structure. A spacer is formed by removing a portion of the dummy channel structure. The spacer has a hollow core. A TSC in contact with the substrate is formed by depositing a conductor layer within the hollow core of the spacer. The TSC extends vertically through the staircase structure.

[0089] In some embodiments, prior to forming the spacers, the wordlines are formed by replacing a sacrificial layer in the dielectric stack with a conductor layer.

[0090] In some embodiments, a plurality of word line contacts, each contacting a respective one of the word lines, are formed simultaneously with the formation of the TSC.

[0091] In some embodiments, after forming the TSC, multiple wordlines are formed by replacing a sacrificial layer in the dielectric stack with a conductor layer.

[0092] In some embodiments, a plurality of word line contacts are formed, each contacting a respective one of the word lines.

[0093] In some embodiments, prior to forming the dummy channel structure, a dummy hole is formed that extends vertically through the stair structure and exposes a portion of the substrate.

[0094] In some embodiments, a dielectric layer is deposited in the dummy holes to form a dummy channel structure.

[0095] In some embodiments, the dielectric layer comprises silicon oxide.

[0096] In some embodiments, openings are etched through a dielectric layer deposited in the dummy holes to form spacers.

[0097] In some embodiments, portions of the dielectric layer deposited in the dummy holes are removed to form spacers.

[0098] In some embodiments, a second spacer, outside the dielectric stack, is formed simultaneously with the spacer.

[0099] In some embodiments, a peripheral contact is formed by depositing a second conductor layer in the second spacer simultaneously with the formation of the TSC, the peripheral contact being in contact with the substrate.

[0100] In some embodiments, the first conductor layer and the second conductor layer comprise the same material.

[0101] In some embodiments, the spacer and the second spacer have nominally the same thickness.

[0102] In some embodiments, the conductor layer comprises tungsten (W).

[0103] In some embodiments, the dielectric layers within the interleaved dielectric layers and the sacrificial layers comprise silicon oxide and the sacrificial layers within the interleaved dielectric layers and the sacrificial layers comprise silicon nitride.

[0104] According to yet another aspect of the present disclosure, a 3D memory device is provided. The 3D memory device includes a substrate, a memory stack on the substrate including a plurality of interleaved conductor and dielectric layers, a staircase structure on one side of the memory stack, and a TSC extending vertically through the staircase structure of the memory stack. The TSC is in contact with the substrate.

[0105] In some embodiments, the 3D memory device further includes a peripheral contact outside the memory stack, the peripheral contact being in contact with the substrate.

[0106] In some embodiments, the peripheral contacts and the TSC comprise the same material.

[0107] In some embodiments, the sidewalls of each of the TSCs and the peripheral contacts are surrounded by spacers having nominally the same thickness.

[0108] In some embodiments, the spacer comprises silicon oxide.

[0109] In some embodiments, the 3D memory device further includes a plurality of word line contacts each contacting a respective one of the conductor layers in the staircase structure.

[0110] The foregoing description of specific embodiments makes clear the general nature of the present disclosure, so that those skilled in the art can easily modify such specific embodiments and / or adapt them to various applications without undue experimentation by applying knowledge within the skill of the art, without departing from the general concept of the present disclosure. Therefore, such adaptations and modifications are intended to be within the meaning and range of equivalents of the disclosed embodiments, based on the teaching and guidance presented herein. It should be understood that the phraseology or terminology used herein is for purposes of explanation and not limitation, and thus the terminology or terminology used herein should be interpreted by those skilled in the art in light of the teaching and guidance.

[0111] The embodiments of the present disclosure have been described above using functional components that indicate the implementation of specific functions and the relationship of the implementation of specific functions. The boundaries of these functional components are arbitrarily defined in this specification for the convenience of description. Alternative boundaries may be defined as long as the specified functions and the specified functional relationships are appropriately performed.

[0112] The Summary and Abstract sections may describe one or more example embodiments of the present disclosure, but not all, contemplated by the inventor(s) and are therefore not intended to be in any way limiting of the scope of the disclosure and the appended claims.

[0113] The breadth and scope of the present disclosure should not be limited by any of the above-described exemplary embodiments, but should be defined only in accordance with the following claims and their equivalents.

Claims

1. a memory stack having interleaved conductive and dielectric layers, the memory stack having a staircase in a staircase region; a step through contact (TSC) extending through the memory stack in the step region, the TSC having a first conductor layer and a first spacer surrounding the first conductor layer, the first conductor layer of the TSC being insulated from the conductive layer of the memory stack by the first spacer; Three-dimensional (3D) memory devices.

2. the first spacer comprises a dielectric material; 10. The 3D memory device of claim 1 .

3. a channel structure extending through the memory stacks in a core array region adjacent the staircase region.

10. The 3D memory device of claim 1 .

4. the TSC extends vertically through a fewer number of the conductive and dielectric layers of the memory stack than the channel structure; 4. The 3D memory device of claim 3.

5. further comprising a first substrate on which the memory stack is formed; 10. The 3D memory device of claim 1 .

6. the first substrate comprises silicon; the TSC contacts the first substrate; 6. The 3D memory device of claim 5.

7. further comprising a peripheral contact outside the memory stack, the peripheral contact having a second conductor layer and a second spacer surrounding the second conductor layer; 10. The 3D memory device of claim 1 .

8. a word line contact contacting one of the conductive layers of the memory stack in the staircase region.

10. The 3D memory device of claim 1 .

9. a cross section of the word line contact and a cross section of the TSC have the same shape; 9. The 3D memory device of claim 8.

10. The cross section of the TSC has a circular shape.

10. The 3D memory device of claim 1 .

11. Further comprising peripheral devices above or below the memory stack.

10. The 3D memory device of claim 1 .

12. further comprising a second substrate on which the peripheral device is formed; 12. The 3D memory device of claim 11.

13. a memory stack having interleaved conductive and dielectric layers; a channel structure extending through the memory stack in a first region; a step through contact (TSC) extending through the memory stack in a second region different from the first region, the TSC extending through a fewer number of the conductive and dielectric layers of the memory stack than the channel structure and having a conductor layer and a spacer laterally surrounding the conductor layer; Three-dimensional (3D) memory devices.

14. a word line contact contacting one of the conductive layers of the memory stack in the second region.

14. The 3D memory device of claim 13.

15. a lateral dimension of the word line contact is smaller than a lateral dimension of the conductor layer of the TSC; 15. The 3D memory device of claim 14.

16. the word line contact and the conductor layer of the TSC have the same conductive material; 15. The 3D memory device of claim 14.

17. a memory stack having interleaved conductive and dielectric layers, the memory stack having a staircase in a staircase region; a word line contact contacting one of the conductive layers of the memory stack in the staircase region; a step through contact (TSC) extending through the memory stack in the step region, the TSC and the word line contact each having a conductor layer having the same material. Three-dimensional (3D) memory devices.

18. The TSC further includes a spacer surrounding the conductor layer; the conductor layer of the TSC is insulated from the conductive layer of the memory stack by the spacer; 20. The 3D memory device of claim 17.

19. a channel structure extending through the memory stacks in a core array region adjacent the staircase region.

20. The 3D memory device of claim 17.

20. a substrate on which the memory stack is formed; the TSC contacts the substrate; 20. The 3D memory device of claim 17.

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