Moisture absorption device for dehumidifier and dehumidifier

The moisture-absorbing device for dehumidifiers, utilizing a honeycomb structure with PTC materials and a voltage-driven heating mechanism, addresses the inefficiencies of conventional dehumidifiers by enabling efficient regeneration and reducing component size and heating loss.

JP2025068515APending Publication Date: 2025-04-28NGK INSULATORS LTD

Patent Information

Application Number
JP2023178479
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-10-16
Publication Date
2025-04-28

AI Technical Summary

Technical Problem

Conventional dehumidifiers face challenges in efficiently regenerating the moisture-absorbing material-containing layer without using a heater, leading to increased component count, larger size, and inefficient heating loss.

Method used

A moisture-absorbing device for dehumidifiers featuring a honeycomb structure with a moisture-absorbing material-containing layer on its surface, where the honeycomb structure is made of materials with PTC characteristics, allowing for efficient regeneration by applying a voltage without a heater.

Benefits of technology

The solution enables efficient regeneration of the moisture-absorbing material-containing layer, reduces the number and size of dehumidifier components, and minimizes heating loss, thereby improving dehumidification efficiency and compactness.

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Abstract

To provide a moisture absorption device for a humidifier that can efficiently regenerate a moisture absorbing material-containing layer without using a heater, and can be reduced in size by reducing components constituting a dehumidifier.SOLUTION: A moisture absorption device 1 for a dehumidifier is provided with a honeycomb structure which has an outer peripheral wall 10 and a bulkhead 13 which is arranged inside the outer peripheral wall 10 and which sections and forms a plurality of cells 12 constituting a flow path extending from a first end face 11a to a second end face 11b, and a moisture absorbing material-containing layer 20 formed on a surface of the bulkhead 13. A thickness of the bulkhead 13 of the honeycomb structure is 0.089-0.140 mm and a cell density thereof is 62.0-93.0 cell / cm2.SELECTED DRAWING: Figure 1A
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Description

[Technical field]

[0001] The present invention relates to a moisture absorbing device for a dehumidifier and a dehumidifier. [Background technology]

[0002] During the rainy season and winter, humidity is high, making it difficult to dry laundry by hanging it outdoors. In recent years, with changes in lifestyle, there has been an increasing demand for people to be able to dry their laundry indoors at any time. For this reason, dehumidifiers have become widespread to use the living or non-living parts of the room as a place to dry laundry. Dehumidifiers are also used as air conditioners to improve the indoor environment.

[0003] A conventional dehumidifier is known that includes a rotatably supported dehumidifying rotor, a heater that heats the dehumidifying rotor, a cooler that cools the air that is heated by the heater and has passed through the dehumidifying rotor, and a blower that sends air to the heater. A conventional dehumidifier having such a structure can regenerate the dehumidifying rotor (remove moisture adsorbed by the dehumidifying rotor) by supplying air heated by the heater to the dehumidifying rotor. However, since it is difficult for a heater to heat air uniformly, the temperature of the air supplied to the dehumidifying rotor becomes uneven, and regeneration of the dehumidifying rotor may not proceed efficiently.

[0004] In view of this, Patent Document 1 proposes a technique for making the temperature of air supplied to the dehumidifying rotor uniform by providing a straightening member that straightens the air sent by a blower and supplies the air to a heater. However, the dehumidifier of Patent Document 1 is premised on using a heater to regenerate the dehumidifier rotor, so the number of heater-related parts constituting the dehumidifier is large, and it is also disadvantageous in terms of miniaturization of the dehumidifier. In addition, this dehumidifier indirectly heats the dehumidifier rotor with air heated by the heater, and does not directly heat the dehumidifier rotor, so there is a lot of heat loss in the dehumidifier rotor. For these reasons, there is a demand for the development of a dehumidifier that does not use a heater.

[0005] On the other hand, as an air conditioning device that does not require the use of a heater, Patent Document 2 proposes a heater element with a functional material-containing layer, which comprises a honeycomb structure and a functional material (e.g., adsorbent)-containing layer provided on the surface of the partition walls that constitute the honeycomb structure. In this air conditioning device, the honeycomb structure generates heat when a voltage is applied to the honeycomb structure, so that the functional material-containing layer can be regenerated without using a heater. However, this air conditioning device is intended for use in the interior of a vehicle, which is a relatively small space, and therefore the desired effect cannot be obtained when used in a house, which has a large space. For example, when the air conditioning device of Patent Document 2, which uses a moisture-absorbing material as the functional material, is used in a house, the dehumidification amount is insufficient.

[0006] It is thought that the dehumidification amount can be improved by increasing the amount of moisture absorbent in the moisture absorbent (functional material)-containing layer, but the moisture absorbent cannot be effectively used as the thickness of the moisture absorbent-containing layer is increased, and the effect of improving the dehumidification amount is small. It is also possible to increase the surface area of ​​the moisture absorbent-containing layer by increasing the cell density of the honeycomb structure, but this increases the pressure loss. In addition, since current flows easily when voltage is applied, it is difficult to use it in a dehumidifier used indoors in a house. Conversely, if the cell density is low, current does not flow easily, and the honeycomb structure cannot be heated uniformly. For this reason, there are circumstances in which air conditioning devices used in vehicle cabins cannot be simply applied to dehumidifiers. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] JP 2021-151648 A [Patent Document 2] International Publication No. 2022 / 264886 Summary of the Invention [Problem to be solved by the invention]

[0008] The present invention has been made to solve the above-mentioned problems, and aims to provide a moisture absorption device for a dehumidifier that can efficiently regenerate an absorbent material-containing layer without using a heater and that can reduce the number of components that make up the dehumidifier, thereby making it smaller, and a dehumidifier that uses this moisture absorption device for a dehumidifier. [Means for solving the problem]

[0009] As a result of intensive research to solve the above problems, the present inventors have found that a moisture absorbing device suitable for a dehumidifier can be obtained by providing a moisture absorbent-containing layer on the surface of the partition walls of a honeycomb structure in which the partition wall thickness and cell density are controlled within a predetermined range, and have thus completed the present invention. That is, the present invention is exemplified as follows.

[0010] [1] A honeycomb structure having an outer peripheral wall and partition walls disposed inside the outer peripheral wall and defining a plurality of cells that serve as flow paths extending from a first end surface to a second end surface; a moisture-absorbent material-containing layer provided on the surface of the partition wall; The honeycomb structure has a partition wall thickness of 0.089 to 0.140 mm and a cell density of 62.0 to 93.0 cells / cm. 2 A moisture absorbing device for a dehumidifier.

[0011] [2] The moisture absorption device for a dehumidifier according to [1], wherein at least the partition is made of a material having a PTC property.

[0012] [3] The moisture absorption device for a dehumidifier according to [1] or [2], wherein the partition wall has a thickness of 0.101 to 0.138 mm.

[0013] [4] The moisture absorption device for a dehumidifier according to any one of [1] to [3], further comprising a pair of electrodes provided on the first end face and the second end face of the honeycomb structure, or on opposing surfaces of the outer wall parallel to the extension direction of the cells, and terminals connected to the electrodes.

[0014] [5] The moisture absorbing device for a dehumidifier according to any one of [1] to [4], wherein the moisture absorbent-containing layer is capable of absorbing moisture and odorous components.

[0015] [6] A dehumidifier comprising the moisture absorbing device for a dehumidifier according to any one of [1] to [5].

[0016] [7] A casing having a dehumidification flow path and a regeneration flow path; The moisture absorbing device for a dehumidifier according to any one of [1] to [5], which is rotatably disposed across the dehumidification flow path and the regeneration flow path; a first fan disposed in the dehumidification flow path, which draws in ambient air and discharges the air dehumidified by the dehumidifier moisture absorption device to the surroundings; A second fan is disposed in the regeneration flow path and circulates the air dehumidified by the moisture absorption device for the dehumidifier; a heat exchanger disposed in the regeneration flow path for cooling and condensing the air dehumidified by the moisture absorption device for the dehumidifier; A tank for storing condensation water generated by the heat exchanger; Equipped with The moisture absorbing device for a dehumidifier is a dehumidifier that is capable of releasing moisture by being heated through application of a voltage.

[0017] [8] The dehumidifier according to [7], wherein a voltage applied to the moisture absorption device for a dehumidifier is 12 V or more and less than 200 V. Effect of the Invention

[0018] According to the present invention, it is possible to provide a moisture absorbing device for a dehumidifier that can efficiently regenerate a moisture absorbent-containing layer without using a heater and that can reduce the number of components constituting the dehumidifier to make it smaller, and a dehumidifier that uses this moisture absorbing device for a dehumidifier. [Brief description of the drawings]

[0019] [Figure 1A] 1 is a cross-sectional view of a moisture absorption device for a dehumidifier according to an embodiment of the present invention, taken along a line parallel to a flow path direction. [Figure 1B]1B is a cross-sectional view taken along line aa' in FIG. 1A. [Diagram 2] 1 is a schematic configuration diagram of a dehumidifier according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0020] A moisture absorbing device for a dehumidifier according to an embodiment of the present invention includes a honeycomb structure having an outer peripheral wall, partition walls disposed inside the outer peripheral wall and defining a plurality of cells that serve as flow paths extending from a first end face to a second end face, and a moisture absorbent-containing layer provided on the surface of the partition walls. The honeycomb structure has partition walls having a thickness of 0.089 to 0.140 mm and a cell density of 62.0 to 93.0 cells / cm. 2 With this configuration, the honeycomb structure can be heated by applying a voltage to the honeycomb structure without using a heater, so that the moisture absorbent-containing layer can be efficiently regenerated. In addition, the heater and related parts can be reduced, so that the dehumidifier can be made smaller.

[0021] Here, the term "dehumidifier" in this specification refers to a product that can be used in a general home or the like to dehumidify indoor air and can be freely placed in a desired location indoors. Dehumidifiers can be used not only for air conditioning (dehumidification) to improve the indoor environment, but also for drying clothes, etc. The dehumidifiers covered herein are desiccant-type dehumidifiers that remove moisture using a moisture absorbent.

[0022] Hereinafter, the embodiments of the present invention will be described in detail with reference to the drawings. The present invention is not limited to the following embodiments, and it should be understood that modifications and improvements to the following embodiments, which are made based on the ordinary knowledge of a person skilled in the art, fall within the scope of the present invention, without departing from the spirit of the present invention.

[0023] (1) Moisture absorption device Fig. 1A is a cross-sectional view parallel to the flow path direction of a moisture absorption device for a dehumidifier (hereinafter, sometimes abbreviated as "moisture absorption device") according to an embodiment of the present invention. Fig. 1B is a cross-sectional view taken along line a-a' in Fig. 1A (a cross-sectional view perpendicular to the flow path direction of the moisture absorption device for a dehumidifier according to an embodiment of the present invention). As shown in Figs. 1A and 1B, the moisture absorbing device 1 includes a honeycomb structure having an outer peripheral wall 10, partition walls 13 disposed inside the outer peripheral wall 10 and partitioning a plurality of cells 12 that serve as flow paths extending from a first end face 11a to a second end face 11b, and a moisture absorbent-containing layer 20 provided on the surface of the partition wall 13. The moisture absorbing device 1 may further include a pair of electrodes 30a, 30b provided on the first end face 11a and the second end face 11b of the honeycomb structure, and a terminal 40 connected to the pair of electrodes 30a, 30b. Although Figs. 1A and 1B show an example in which the pair of electrodes 30a, 30b are provided on the first end face 11a and the second end face 11b of the honeycomb structure, the pair of electrodes 30a, 30b may be provided on opposing surfaces of the outer peripheral wall 10 parallel to the extension direction of the cells 12.

[0024] <Honeycomb structure> The shape of the honeycomb structure is not particularly limited, and may be adjusted appropriately depending on the type of dehumidifier in which the moisture absorbing device 1 is used. For example, when the moisture absorbing device 1 is used in place of a conventional rotatable dehumidifying rotor, the outer shape of the cross section perpendicular to the flow path direction (the direction in which the cells 12 extend) of the honeycomb structure may be circular. The outer shape of the cross section perpendicular to the flow path direction of the honeycomb structure may be a polygon such as a quadrangle (rectangle, square), pentagon, hexagon, heptagon, or octagon, or an oval shape (egg, ellipse, oval, rounded rectangle, etc.), in addition to a circle. The end faces (first end face 11a and second end face 11b) have the same shape as the cross section. When the cross section and the end faces are polygonal, the corners may be chamfered.

[0025] The shape of the cells 12 is not particularly limited, but may be a polygon such as a square, pentagon, hexagon, heptagon, or octagon, a circle, or an oval in a cross section perpendicular to the flow direction of the honeycomb structure. These shapes may be used alone or in combination of two or more. Among these shapes, a square or hexagon is preferable. By providing cells 12 of such a shape, the pressure loss during air flow can be reduced.

[0026] The honeycomb structure may be a honeycomb bonded body having a plurality of honeycomb segments and a bonding layer bonding the peripheral side surfaces of the plurality of honeycomb segments together. By using the honeycomb bonded body, it is possible to increase the total cross-sectional area of ​​the cells 12, which is important for ensuring the air flow rate, while suppressing the occurrence of cracks. The bonding layer can be formed using a bonding material. The bonding material is not particularly limited, but a ceramic material with a solvent such as water added thereto to form a paste can be used. The bonding material may contain a material having a PTC (Positive Temperature Coefficient) characteristic, or may contain the same material as the outer peripheral wall 10 and the partition walls 13. In addition to the role of bonding the honeycomb segments together, the bonding material can also be used as an outer peripheral coating material after bonding the honeycomb segments.

[0027] The honeycomb structure has a partition wall 13 having a thickness of 0.089 to 0.140 mm, preferably 0.101 to 0.138 mm. By controlling the thickness of the partition wall 13 within such a range, it is possible to suppress an increase in pressure loss while ensuring the strength of the honeycomb structure (moisture absorption device 1) required for use in a dehumidifier. In addition, since the electrical resistance of the honeycomb structure can be controlled within a range suitable for use in a dehumidifier, it is possible to uniformly heat the honeycomb structure while suppressing the flow of excessive current when a voltage is applied. Here, the thickness of the partition wall 13 refers to the length of the partition wall 13 between adjacent cells 12 in a cross section perpendicular to the flow path direction.

[0028] The thickness of the peripheral wall 10 of the honeycomb structure is not particularly limited, but is preferably 0.05 to 1.00 mm, and more preferably 0.08 to 0.50 mm. By controlling the thickness of the peripheral wall 10 within such a range, it becomes easier to ensure the strength of the honeycomb structure (moisture adsorption device 1) required for use in a dehumidifier. Here, the thickness of the peripheral wall 10 refers to the length in the normal direction of the side surface from the boundary between the peripheral wall 10 and the most peripheral cell 12 or partition wall 13 to the side surface of the honeycomb structure in a cross section perpendicular to the flow path direction.

[0029] The honeycomb structure has a cell density of 62.0 to 93.0 cells / cm 2 , preferably 62.0 to 88.0 cells / cm 2 By controlling the cell density within such a range, it is possible to increase the number of cells to a level suitable for use in a dehumidifier while suppressing an increase in pressure loss. As a result, it is possible to reduce the thickness of the moisture absorbent-containing layer 20 provided on the surface of the partition wall 13 constituting one cell 12, thereby improving the dehumidification amount. Furthermore, it is possible to control the electrical resistance of the honeycomb structure within a range suitable for use in a dehumidifier, so that the honeycomb structure can be uniformly heated while suppressing the flow of excessive current when a voltage is applied. Here, the cell density is a value obtained by dividing the number of cells by the area of ​​one end face (first end face 11a or second end face 11b) of the honeycomb structure (the total area of ​​the partition walls 13 and the cells 12 excluding the outer peripheral wall 10).

[0030] The length of the honeycomb structure in the flow path direction and the cross-sectional area perpendicular to the flow path direction are not particularly limited and may be adjusted according to the required size of the moisture absorbing device 1. For example, when used in a compact moisture absorbing device 1, the honeycomb structure has a length in the flow path direction of 2 to 20 mm and a cross-sectional area perpendicular to the flow path direction of 10 cm. 2 The upper limit of the cross-sectional area perpendicular to the flow path direction is not particularly limited, but may be, for example, 300 cm 2 The following is the result.

[0031] The partition walls 13 constituting the honeycomb structure are made of a material capable of generating heat by energization. In particular, the partition walls 13 are preferably made of a material having a PTC characteristic. If necessary, the outer peripheral wall 10 may also be made of a material having a PTC characteristic like the partition walls 13. With such a configuration, it is possible to directly heat the moisture absorbent-containing layer 20 by heat transfer from the partition walls 13 (and the outer peripheral wall 10, if necessary) that generate heat. In addition, a material having a PTC characteristic has a characteristic that, when the temperature rises and exceeds the Curie point, the resistance value rises rapidly and electricity becomes difficult to flow. Therefore, when the partition walls 13 (and the outer peripheral wall 10, if necessary) become hot, the current flowing through them is limited, so that excessive heat generation of the honeycomb structure is suppressed. Therefore, it is also possible to suppress thermal deterioration of the moisture absorbent-containing layer 20 caused by excessive heat generation.

[0032] From the viewpoint of obtaining an appropriate heat generation, the lower limit of the volume resistivity of the material having the PTC characteristics at 25°C is preferably 0.5 Ω·cm or more, more preferably 1 Ω·cm or more, and even more preferably 5 Ω·cm or more. From the viewpoint of generating heat at a low driving voltage, the upper limit of the volume resistivity of the material having the PTC characteristics at 25°C is preferably 30 Ω·cm or less, more preferably 18 Ω·cm or less, and even more preferably 16 Ω·cm or less. In this specification, the volume resistivity of the material having the PTC characteristics at 25°C is measured in accordance with JIS K6271:2008.

[0033] From the viewpoint of being able to generate heat when electricity is applied and having PTC characteristics, the outer peripheral wall 10 and the partition walls 13 are preferably made of a material mainly composed of barium titanate (BaTiO3). This material is more preferably a ceramic made of a material mainly composed of barium titanate (BaTiO3)-based crystal particles in which part of Ba is replaced with a rare earth element. In this specification, the term "main component" means a component that accounts for more than 50 mass% of the total components. The content of BaTiO3-based crystal particles can be determined by fluorescent X-ray analysis. Other crystal particles can also be measured in the same manner.

[0034] The composition formula of BaTiO3-based crystal particles in which part of Ba is replaced by rare earth elements is (Ba 1-x A x )TiO3, where A represents one or more rare earth elements and 0.0001≦x≦0.010. A is not particularly limited as long as it is a rare earth element, but is preferably one or more selected from the group consisting of La, Ce, Pr, Nd, Eu, Gd, Dy, Ho, Er, Y and Yb, and more preferably La. x is preferably 0.001 or more, more preferably 0.0015 or more, from the viewpoint of suppressing the electrical resistance at room temperature from becoming too high. On the other hand, x is preferably 0.009 or less, from the viewpoint of suppressing the electrical resistance at room temperature from becoming too high due to insufficient sintering. The content of BaTiO3-based crystal particles in the ceramics, in which a part of Ba is replaced by a rare earth element, is not particularly limited as long as it is the amount that serves as the main component, but is preferably 90 mass% or more, more preferably 92 mass% or more, and even more preferably 94 mass% or more. The upper limit of the content of BaTiO3-based crystal particles is not particularly limited, but is generally 99 mass%, preferably 98 mass%.

[0035] From the viewpoint of reducing the environmental load, it is desirable that the material used for the outer peripheral wall 10 and the partition wall 13 does not substantially contain lead (Pb). Specifically, the Pb content of the outer peripheral wall 10 and the partition wall 13 is preferably 0.01 mass% or less, more preferably 0.001 mass% or less, and even more preferably 0 mass%. With a low Pb content, for example, air heated by contacting the partition wall 13 during heat generation can be safely applied to living organisms such as humans. Note that the Pb content of the outer peripheral wall 10 and the partition wall 13, calculated as PbO, is preferably less than 0.03 mass%, more preferably less than 0.01 mass%, and even more preferably 0 mass%. The lead content can be determined by ICP-MS (inductively coupled plasma mass spectrometry).

[0036] The Curie point of the material constituting the outer peripheral wall 10 and the partition walls 13 is preferably in the temperature range at which the resistance value becomes at least twice the resistance at room temperature (25° C.). If the Curie point is in such a temperature range, the current flowing through them is limited when the moisture absorbing device 1 becomes hot, so that excessive heat generation in the moisture absorbing device 1 is efficiently suppressed. Therefore, the thermal deterioration of the moisture absorbent-containing layer 20 caused by excessive heat generation can be suppressed. The lower limit of the Curie point of the material constituting the outer peripheral wall 10 and the partition walls 13 is preferably 80° C. or higher, more preferably 100° C. or higher, even more preferably 110° C. or higher, and particularly preferably 125° C. or higher, from the viewpoint of efficient heating of the moisture absorbent-containing layer 20. The upper limit of the Curie point is preferably 200° C. or lower, more preferably 190° C. or lower, even more preferably 180° C. or lower, and particularly preferably 150° C. or lower, from the viewpoint of safety as a part placed indoors in an ordinary home or the like.

[0037] The Curie point of the material constituting the outer peripheral wall 10 and the partition walls 13 can be adjusted by the type and amount of the shifter added. For example, the Curie point of barium titanate (BaTiO3) is about 120°C, but by substituting a part of Ba and Ti with one or more of Sr, Sn, and Zr, the Curie point can be shifted to the lower temperature side.

[0038] In this specification, the Curie point is measured by the following method. A sample is attached to a sample holder for measurement and placed in a measurement tank (e.g., MINI-SUBZERO MC-810P, manufactured by Espec Corporation). The change in electrical resistance of the sample relative to the temperature change when the temperature is raised from 10°C is measured using a DC resistance meter (e.g., multimeter 3478A, manufactured by Hewlett-Packard Japan, LLC). The temperature at which the resistance value is twice the resistance value at room temperature (25°C) based on the electrical resistance-temperature plot obtained by the measurement is taken as the Curie point.

[0039] <Moisture absorbent layer 20> The moisture absorbent-containing layer 20 has a function of removing moisture in the air by adsorbing it. The moisture absorbent-containing layer 20 can be provided on the surface of the partition wall 13 (in the case of the outermost cell 12, the partition wall 13 and the outer peripheral wall 10 that define the outermost cell 12). By providing the moisture absorbent-containing layer 20 in this manner, the moisture absorption amount can be increased. In addition, since the moisture absorbent-containing layer 20 can be easily heated during regeneration, the dehumidification function of the moisture absorbent-containing layer 20 can be efficiently regenerated.

[0040] The moisture-absorbent contained in the moisture-absorbent-containing layer 20 is not particularly limited, and any material known in the art can be used. Examples of moisture absorbents include, but are not limited to, aluminosilicates, silica gel, silica, graphene oxide, polymer adsorbents, polystyrene sulfonic acid, and metal organic frameworks (MOFs). These may be used alone or in combination of two or more.

[0041] As the aluminosilicate, it is preferable to use AFI-type, CHA-type, BEA-type, FAU-type or LTA-type zeolite; or porous clay minerals such as allophane, imogolite, etc. Furthermore, it is more preferable that the aluminosilicate is amorphous.

[0042] As the silica gel, it is preferable to use type A silica gel. The polymer adsorbent is preferably one having a polyacrylic acid polymer chain, for example, sodium polyacrylate. The metal organic framework is a crystalline hybrid material containing metal ions and organic molecules (organic ligands). The metal ions are preferably hydrophilic metal ions (e.g., aluminum ions).

[0043] The moisture-absorbent-containing layer 20 (i.e., the moisture-absorbent contained in the moisture-absorbent-containing layer 20) is preferably capable of adsorbing moisture and odorous components. By providing the moisture-absorbent-containing layer 20 having such a function, not only can the moisture in the room be dehumidified but also odorous components can be removed. Examples of moisture-absorbing materials capable of absorbing odorous components include zeolite, silica gel, activated carbon, alumina, silica, low-crystalline clay, and amorphous aluminum silicate complexes. The type of moisture-absorbing material may be appropriately selected depending on the type of components to be removed. One type of moisture-absorbing material may be used alone, or two or more types may be used in combination. Specific examples of odorous components include ammonia, acetic acid, isovaleric acid, nonenal, formaldehyde, toluene, xylene, paradichlorobenzene, ethylbenzene, styrene, chlorpyrifos, di-n-butyl phthalate, tetradecane, di-2-ethylhexyl phthalate, diazinon, acetaldehyde, and N-methylcarbamate-2-(1-methylpropyl)phenyl.

[0044] The moisture-absorbing material-containing layer 20 may contain a catalyst as necessary. By containing a catalyst, it is possible to promote oxidation-reduction reactions and the like and purify odorous components. Examples of catalysts having such functions include metal catalysts such as Pt, Pd, and Ag, and oxide catalysts such as CeO2 and ZrO2. The catalyst may be used alone or in combination of two or more types. The catalyst may also be used in combination with the moisture-absorbing material or functional material described above.

[0045] The thickness of the moisture absorbent-containing layer 20 is not particularly limited and may be determined according to the size of the cells 12. For example, the thickness of the moisture absorbent-containing layer 20 is preferably 100 μm or more, more preferably 120 μm or more, and even more preferably 150 μm or more, from the viewpoint of ensuring sufficient contact with air and increasing the moisture absorption amount. On the other hand, from the viewpoint of suppressing peeling of the moisture absorbent-containing layer 20 from the partition wall 13 and the outer peripheral wall 10, the thickness of the moisture absorbent-containing layer 20 is preferably 350 μm or less, more preferably 340 μm or less, and even more preferably 330 μm or less.

[0046] The thickness of the moisture absorbent-containing layer 20 is measured by the following procedure. An arbitrary cross section parallel to the flow path direction of the honeycomb structure is cut out, and a cross-sectional image of about 50 times is obtained using a scanning electron microscope or the like. This cross section is also set to pass through the center of gravity of the cross section perpendicular to the flow path of the honeycomb structure. For each moisture absorbent-containing layer 20 visible from the cross-sectional image, the thickness is calculated by dividing the cross-sectional area by the length of the cell 12 in the flow path direction. This calculation is performed for all moisture absorbent-containing layers 20 visible from the cross-sectional image, and the overall average value is regarded as the thickness of the moisture absorbent-containing layer 20.

[0047] From the viewpoint of exhibiting a desired function in the moisture absorbing device 1, the amount of the moisture absorbent-containing layer 20 is preferably 50 to 500 g / L, more preferably 100 to 400 g / L, and further preferably 150 to 350 g / L, relative to the volume of the honeycomb structure. The volume of the honeycomb structure is a value determined by the outer dimensions of the honeycomb structure.

[0048] <Pair of electrodes 30a, 30b> The positions of the pair of electrodes 30a, 30b are not particularly limited, but may be provided on the first end face 11a and the second end face 11b as shown in Fig. 1A. The pair of electrodes 30a, 30b may also be provided on opposing surfaces of the outer peripheral wall 10 parallel to the extension direction of the cells 12. By applying a voltage between the pair of electrodes 30a, 30b, it becomes possible to cause the honeycomb structure to generate heat by Joule heat.

[0049] The pair of electrodes 30a, 30b is not particularly limited, and may be, for example, a metal or alloy containing at least one selected from Cu, Ag, Al, Ni, and Si. An ohmic electrode capable of making ohmic contact with the outer peripheral wall 10 and / or the partition wall 13 having PTC characteristics may also be used. The ohmic electrode may be, for example, an ohmic electrode containing at least one selected from Al, Au, Ag, and In as a base metal and at least one selected from Ni, Si, Zn, Ge, Sn, Se, and Te for n-type semiconductors as a dopant. The pair of electrodes 30a, 30b may have a single-layer structure or a laminated structure of two or more layers. When the pair of electrodes 30a, 30b has a laminated structure of two or more layers, the materials of the layers may be the same or different.

[0050] The thickness of the pair of electrodes 30a, 30b can be appropriately set depending on the method for forming the pair of electrodes 30a, 30b. Examples of the method for forming the pair of electrodes 30a, 30b include metal deposition methods such as sputtering, vapor deposition, electrolytic deposition, and chemical deposition. The pair of electrodes 30a, 30b can also be formed by applying an electrode paste and then baking it, or by thermal spraying. Furthermore, the pair of electrodes 30a, 30b may be formed by joining metal or alloy plates.

[0051] The thickness of the pair of electrodes 30a, 30b is preferably about 5 to 80 μm in baking of an electrode paste, about 100 to 1000 nm in dry plating such as sputtering and vapor deposition, about 10 to 100 μm in thermal spraying, and about 5 to 30 μm in wet plating such as electrolytic deposition and chemical deposition. In addition, in joining metal or alloy plates, the thickness is preferably about 5 to 100 μm.

[0052] <Terminal 40> The terminal 40 is connected to the pair of electrodes 30a, 30b and is provided on at least a part of the pair of electrodes 30a, 30b. The provision of the terminal 40 facilitates connection to an external power source. The terminal 40 is connected to a conductor connected to the external power source.

[0053] The material of the terminal 40 is not particularly limited, but may be, for example, a metal. As the metal, a simple metal or an alloy may be adopted, but from the viewpoint of corrosion resistance, electrical resistivity, and linear expansion coefficient, for example, an alloy containing at least one selected from the group consisting of Cr, Fe, Co, Ni, Cu, Al, and Ti is preferable, and stainless steel, Fe-Ni alloy, and phosphor bronze are more preferable.

[0054] The size and shape of the terminal 40 are not particularly limited. For example, the terminal 40 may be provided on a part or the whole of the pair of electrodes 30a, 30b on the outer peripheral wall 10, or may be provided so as to extend outward beyond the outer edges of the pair of electrodes 30a, 30b on the outer peripheral wall 10. In addition, the terminal 40 may be provided on a part of the pair of electrodes 30a, 30b on the partition wall 13, or may be provided so as to cover some of the cells 12. Furthermore, the thickness of the terminal 40 is not particularly limited, but is, for example, 0.01 to 10 mm, typically 0.05 to 5 mm.

[0055] The method of connecting the terminal 40 and the pair of electrodes 30a, 30b is not particularly limited as long as they are electrically connected, and they can be connected by, for example, diffusion bonding, a mechanical pressure mechanism, welding, or the like.

[0056] <Method of Manufacturing Moisture Absorption Device 1> The method for producing the moisture absorbing device 1 is not particularly limited and can be carried out in accordance with a known method. The method for producing the moisture absorbing device 1 will be described below as an example. The method for manufacturing the honeycomb structure constituting the moisture absorbing device 1 includes a molding step and a firing step. In the forming step, a clay containing ceramic raw materials including BaCO3 powder, TiO2 powder, and powder of a rare earth nitrate or hydroxide is formed to produce a honeycomb formed body having a relative density of 60% or more. The ceramic raw material can be obtained by dry mixing each powder so as to obtain a desired composition. The clay can be obtained by adding a dispersion medium, a binder, a plasticizer, and a dispersant to a ceramic raw material and kneading the mixture. The clay may contain additives such as a sifter, a metal oxide, a property improver, and a conductive powder, as necessary. The blending amount of components other than the ceramic raw materials is not particularly limited as long as the blending amount is such that the relative density of the honeycomb formed body is 60% or more.

[0057] Here, in this specification, the "relative density of the honeycomb formed body" means the ratio of the density of the honeycomb formed body to the true density of the entire ceramic raw material. Specifically, it can be calculated by the following formula. Relative density of honeycomb formed body (%) = Density of honeycomb formed body (g / cm 3 ) / True density of ceramic raw material (g / cm 3 ) x 100 The density of the honeycomb molded body can be measured by the Archimedes method using pure water as a medium. The true density of the entire ceramic raw material is calculated by multiplying the total mass (g) of each raw material by the total actual volume (cm 3 ) can be calculated by dividing it by

[0058] The dispersion medium may be water or a mixed solvent of water and an organic solvent such as alcohol, with water being particularly preferred.

[0059] Examples of the binder include organic binders such as methyl cellulose, hydroxypropoxyl cellulose, hydroxyethyl cellulose, carboxymethyl cellulose, and polyvinyl alcohol. In particular, it is preferable to use methyl cellulose and hydroxypropoxyl cellulose in combination. The binder may be used alone or in combination of two or more kinds, but it is preferable that the binder does not contain an alkali metal element.

[0060] Examples of the plasticizer include polyoxyalkylene alkyl ethers, polycarboxylic acid polymers, and alkyl phosphate esters.

[0061] The dispersant may be a surfactant such as polyoxyalkylene alkyl ether, ethylene glycol, dextrin, fatty acid soap, polyalcohol, etc. The dispersant may be used alone or in combination of two or more kinds.

[0062] The honeycomb formed body can be produced by extruding a clay. In the extrusion molding, a die having a desired overall shape, cell shape, partition wall thickness, cell density, etc. can be used.

[0063] The relative density of the honeycomb molded body obtained by extrusion molding is 60% or more, preferably 65% ​​or more. By controlling the relative density of the honeycomb molded body within this range, it is possible to densify the honeycomb molded body and reduce the electrical resistance at room temperature. The upper limit of the relative density of the honeycomb molded body is not particularly limited, but is generally 80%, preferably 75%.

[0064] The honeycomb molded body can be dried before the firing step. The drying method is not particularly limited, and for example, a conventionally known drying method such as hot air drying, microwave drying, dielectric drying, reduced pressure drying, vacuum drying, freeze drying, etc. Among these, a drying method that combines hot air drying with microwave drying or dielectric drying is preferred because it can quickly and uniformly dry the entire molded body.

[0065] The firing step involves holding the material at 1150-1250° C., then increasing the temperature to a maximum temperature of 1360-1430° C. at a rate of 20-600° C. / hour, and holding the temperature for 0.5-10 hours. By holding the honeycomb formed body at a maximum temperature of 1360 to 1430° C. for 0.5 to 10 hours, a honeycomb structure mainly composed of BaTiO3-based crystal grains in which part of Ba has been substituted with a rare earth element can be obtained. Moreover, by maintaining the temperature at 1150 to 1250°C, Ba2TiO4 crystal particles generated during the firing process are easily removed, so that the honeycomb structure can be densified. Furthermore, by setting the heating rate from 1150-1250°C to the maximum temperature of 1360-1430°C at 20-600°C / hour, 1.0-10.0 mass% of Ba6Ti 17 O 40 Crystal grains can be formed in a honeycomb structure.

[0066] The holding time at 1150 to 1250° C. is not particularly limited, but is preferably 0.5 to 10 hours. By setting the holding time in this range, Ba2TiO4 crystal particles formed during the firing process can be stably and easily removed.

[0067] The firing step preferably includes holding the mixture at 900 to 950° C. for 0.5 to 5 hours during heating. Holding the mixture at 900 to 950° C. for 0.5 to 5 hours allows BaCO3 to efficiently decompose, making it easier to obtain a honeycomb structure having a predetermined composition.

[0068] Before the firing step, a degreasing step may be carried out to remove the binder. The degreasing step is preferably carried out in an air atmosphere in order to completely decompose the organic components. Moreover, it is preferable that the firing step be performed in an air atmosphere from the viewpoints of controlling electrical characteristics and reducing manufacturing costs. The firing furnace used in the firing step and the degreasing step is not particularly limited, but an electric furnace, a gas furnace, or the like can be used.

[0069] A pair of electrodes 30a, 30b are formed on the honeycomb structure thus obtained. The pair of electrodes 30a, 30b can be formed by a metal deposition method such as sputtering, vapor deposition, electrolytic deposition, or chemical deposition. The pair of electrodes 30a, 30b can also be formed by applying an electrode paste and then baking it. Furthermore, the pair of electrodes 30a, 30b can also be formed by thermal spraying. The pair of electrodes 30a, 30b may be formed of a single layer, but may also be formed of multiple electrode layers with different compositions. A representative method for forming the pair of electrodes 30a, 30b will be described below.

[0070] First, an electrode slurry containing an electrode material, an organic binder, and a dispersion medium is prepared and applied to the first end face 11a or the second end face 11b of the honeycomb structure. The dispersion medium can be water, an organic solvent (e.g., toluene, xylene, ethanol, n-butanol, ethyl acetate, butyl acetate, terpineol, dihydroterpineol, texanol, ethylene glycol monobutyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether acetate, diethylene glycol monobutyl ether), or a mixture thereof. Excess slurry on the outer periphery of the honeycomb structure is removed by blowing and wiping. Thereafter, the slurry is dried to form a pair of electrodes 30a, 30b on the first end face 11a or the second end face 11b of the honeycomb structure. Drying can be performed while heating the honeycomb structure to a temperature of, for example, about 120 to 600°C. The series of steps of coating, slurry removal, and drying may be carried out only once, but by repeating the steps multiple times, a pair of electrodes 30a, 30b having a desired thickness can be provided.

[0071] Next, terminals 40 are placed at predetermined positions of the pair of electrodes 30a, 30b, and the pair of electrodes 30a, 30b are connected to the terminals 40. The method for connecting the pair of electrodes 30a, 30b to the terminals 40 can be the method described above. The terminal 40 may be provided after the moisture-absorbent material-containing layer 20 described below is formed.

[0072] Next, the moisture absorbent-containing layer 20 is formed on the surfaces of the partition walls 13 and the like of the honeycomb structure. The method for forming the moisture absorbent-containing layer 20 is not particularly limited, but for example, the moisture absorbent-containing layer 20 can be formed by the following process. The honeycomb structure is immersed in a slurry containing a moisture absorbent, an organic binder, and a dispersion medium for a predetermined time, and excess slurry on the end face and outer periphery of the honeycomb structure is removed by blowing and wiping. The dispersion medium can be water, an organic solvent (e.g., toluene, xylene, ethanol, n-butanol, ethyl acetate, butyl acetate, terpineol, dihydroterpineol, texanol, ethylene glycol monobutyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether acetate, diethylene glycol monobutyl ether), or a mixture thereof. Thereafter, the slurry is dried to form the moisture absorbent-containing layer 20 on the surface of the partition wall 13. Drying can be performed while heating the honeycomb structure to a temperature of, for example, about 120 to 600°C. The series of steps of immersion, slurry removal, and drying may be carried out only once, but by repeating the steps several times, a moisture-absorbent-containing layer 20 of a desired thickness can be provided on the surfaces of the partition walls 13 and the like.

[0073] (2)Dehumidifier A dehumidifier according to an embodiment of the present invention includes the moisture absorbing device 1 described above. The moisture absorbing device 1 can heat the honeycomb structure by applying a voltage to the honeycomb structure without using a heater. Therefore, unlike conventional dehumidifying rotors that are indirectly heated by air heated by a heater, the moisture absorbing device 1 can directly heat the moisture absorbent-containing layer 20 in the dehumidifier according to the embodiment of the present invention, which reduces heat loss and enables efficient regeneration of the moisture absorbent-containing layer 20. Furthermore, the dehumidifier according to the embodiment of the present invention does not require the use of a heater, and the heater and related parts can be reduced, making it possible to reduce the size.

[0074] The structure of the dehumidifier according to the embodiment of the present invention is not particularly limited as long as it includes the moisture absorbing device 1, and a known structure can be adopted. That is, the moisture absorbing device 1 can be used as a substitute for a rotatable dehumidifying rotor in a conventional dehumidifier. It can also be used as a substitute for a fixed dehumidifying member in a conventional dehumidifier. When used as a fixed dehumidifying member, for example, a slide-type flap is provided in the flow path, and the flap can be switched to perform dehumidification by the dehumidifying member and regeneration of the dehumidifying member. However, unlike known dehumidifiers, the dehumidifier according to the embodiment of the present invention preferably does not include a heater and related parts. Hereinafter, a structural example of a dehumidifier according to an embodiment of the present invention will be described.

[0075] FIG. 2 is a schematic configuration diagram of a dehumidifier according to an embodiment of the present invention. As shown in FIG. 2, the dehumidifier 100 includes a casing 110 having a dehumidification flow path 111 and a regeneration flow path 112, a moisture absorbing device 1 rotatably arranged across the dehumidification flow path 111 and the regeneration flow path 112, a first fan 120 arranged in the dehumidification flow path 111 to draw in ambient air and discharge the air dehumidified by the moisture absorbing device 1 to the surroundings, a second fan 130 arranged in the regeneration flow path 112 to circulate the air dehumidified by the moisture absorbing device 1, a heat exchanger 140 arranged in the regeneration flow path 112 to cool and condense the air dehumidified by the moisture absorbing device 1, and a tank 150 to store the condensed water 151 generated by the heat exchanger 140. The moisture absorbing device 1 can be heated and dehumidified by application of a voltage. By adopting such a configuration, the dehumidifier 100 having the above-mentioned effect can be easily realized. The dehumidifier 100 may further include known components such as a control unit (not shown) for controlling the moisture absorbing device 1, the first fan 120, the second fan 130, and the like.

[0076] The casing 110 can be made up of multiple members (e.g., cover members). The casing 110 has an intake port for taking in ambient air into the dehumidifier 100 and an exhaust port for discharging the air in the dehumidifier to the outside.

[0077] The dehumidification flow path 111 is a flow path that extends from the intake port to the exhaust port of the casing 110. In the middle of the dehumidification flow path 111, a moisture absorbing device 1 that adsorbs moisture contained in the air passing through the dehumidification flow path 111 and a first fan 120 that forms a flow of the air are provided.

[0078] The regeneration flow path 112 is a flow path for removing the moisture adsorbed from the moisture absorbent device 1. In the middle of the regeneration flow path 112, a second fan 130 for forming a flow of air released from moisture by the moisture absorbent device 1, and a heat exchanger 140 for cooling the air and condensing it are provided.

[0079] The moisture absorbing device 1 is rotatably disposed across the dehumidification flow path 111 and the regeneration flow path 112. The rotation of the moisture absorbing device 1 can be achieved by a known structure. For example, the moisture absorbing device 1 may be configured to be supported by a central shaft.

[0080] The first fan 120 and the second fan 130 are not particularly limited, and may be any known fan such as a sirocco fan. The heat exchanger 140 is not particularly limited, and any known heat exchanger can be used.

[0081] In the dehumidifier 100 having the above structure, in the dehumidification mode, the first fan 120 is driven to cause the ambient air to flow through the dehumidification flow path 111. In the dehumidification flow path 111, when the ambient air taken in from the air intake of the casing 110 passes through the moisture absorbing device 1, moisture is adsorbed by the moisture absorbent-containing layer 20 constituting the moisture absorbing device 1, and then the dry air is discharged from the exhaust port of the casing 110.

[0082] On the other hand, in the regeneration mode, the second fan 130 is driven to cause air to flow through the regeneration flow path 112. In the regeneration flow path 112, a voltage is applied to the moisture absorbing device 1, whereby the moisture absorbing device 1 (honeycomb structure and moisture absorbent-containing layer 20) is heated, and the adsorbed moisture is released from the moisture absorbent-containing layer 20 into the air. At this time, the air is in a hot and humid state. The air is cooled by the heat exchanger 140, and condensed water 151 is generated. The condensed water 151 is led to the tank 150.

[0083] In the regeneration mode, from the viewpoint of preventing electric shock, the voltage applied to the moisture absorbing device 1 is 12 V or more and less than 200 V, preferably 15 to 150 V. Since the honeycomb structure used in the moisture absorbing device 1 has low electrical resistance at room temperature, it is possible to heat the honeycomb structure at such a relatively low driving voltage. [Explanation of symbols]

[0084] 1 Moisture absorption device 10 Peripheral wall 11a First end surface 11b Second end surface 12 Cells 13 Bulkhead 20 Moisture absorbent layer 30a, 30b Pair of electrodes 40 Terminals 100 dehumidifier 110 Casing 111 Dehumidification channel 112 Regeneration flow path 120 No. 1 Fan 130 Second Fan 140 Heat exchanger 150 Tank 151 Condensation water

Claims

1. A honeycomb structure having an outer peripheral wall and partition walls disposed inside the outer peripheral wall and defining a plurality of cells that serve as flow paths extending from a first end surface to a second end surface; a moisture-absorbent material-containing layer provided on the surface of the partition wall; The honeycomb structure has a partition wall thickness of 0.089 to 0.140 mm and a cell density of 62.0 to 93.0 cells / cm. 2 A moisture absorbing device for a dehumidifier.

2. 2. The moisture absorbing device for a dehumidifier according to claim 1, wherein at least the partition wall is made of a material having a PTC characteristic.

3. 3. The moisture absorbing device for a dehumidifier according to claim 1, wherein the partition has a thickness of 0.101 to 0.138 mm.

4. The moisture absorption device for a dehumidifier according to claim 1 or 2, further comprising a pair of electrodes provided on the first end face and the second end face of the honeycomb structure, or on opposing surfaces of the outer wall parallel to the direction in which the cells extend, and terminals connected to the electrodes.

5. 3. The moisture absorbing device for a dehumidifier according to claim 1, wherein the moisture absorbent-containing layer is capable of absorbing moisture and odorous components.

6. A dehumidifier comprising the moisture absorbing device for a dehumidifier according to claim 1 or 2.

7. a casing having a dehumidification flow path and a regeneration flow path; The moisture absorbing device for a dehumidifier according to claim 1 or 2, which is rotatably disposed across the dehumidification flow path and the regeneration flow path; a first fan disposed in the dehumidification flow path for sucking in ambient air and discharging the air dehumidified by the dehumidifier moisture absorption device to the surroundings; a second fan disposed in the regeneration flow path for circulating the air dehumidified by the moisture absorption device for the dehumidifier; a heat exchanger disposed in the regeneration flow path for cooling and condensing the air dehumidified by the moisture absorption device for the dehumidifier; A tank for storing condensation water generated by the heat exchanger; Equipped with The moisture absorbing device for a dehumidifier is a dehumidifier that is capable of releasing moisture by being heated through application of a voltage.

8. 8. The dehumidifier according to claim 7, wherein a voltage applied to the moisture absorption device for a dehumidifier is equal to or higher than 12 V and lower than 200 V.

Citation Information

Patent Citations

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    JP2021151648A

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