Manufacturing method of resin molded product, and resin molding device

Abstract

To provide a method for manufacturing a resin molded product, which enables stable transport of a resin molded product obtained by transfer molding.SOLUTION: A method for manufacturing a resin molded product using a molding die 10, includes the steps of: clamping an upper die 11 and a lower die 12 such that the upper die and the lower die sandwich an object W to be molded; performing transfer-type resin molding after the clamping step; performing die opening after the resin molding step; and transporting the object W to be molded after the die opening step. The method also includes the steps of, as the die opening step: moving the lower die 12 downward relative to the upper die 11 after the resin molding step; moving the lower die 12 upward relative to the upper die 11 after a first movement step to pressurize the object W to be molded and heating the object W to be molded simultaneously with the pressurization; and moving the lower die 12 downward relative to the upper die 11 after the pressurizing and heating step.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to a method for manufacturing a resin molded product and a resin molding apparatus. [Background technology]

[0002] In the production of resin molded products, the transfer type manufacturing method is widely used.

[0003] Patent Document 1 discloses a method for manufacturing a resin molded product, which has a pot for storing resin and a plunger for pressurizing the resin stored in the pot, and when a lower mold and an upper mold are clamped with a clamper, a resin flow path consisting of a cull portion and a runner portion connects the pot to a cavity, and molten resin is injected into the cavity by the plunger to resin seal electronic components of the molded object. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2023-84730 A Summary of the Invention [Problem to be solved by the invention]

[0005] In a typical transfer-type manufacturing method for resin molded products such as that described in Patent Document 1, when the mold is opened after resin molding, the resin molded product may warp due to the difference in thermal shrinkage rate between the molded object and the resin. Usually, the resin molded product is adsorbed and held in the mold by a suction mechanism. However, if the warping is large, the resin molded product is not stably adsorbed, and it may be difficult for the ejection mechanism to hold the resin molded product when it is ejected.

[0006] In view of the above, an object of the present disclosure is to provide a method for manufacturing a resin molded product and a resin molding apparatus for stably transporting a resin molded product obtained by transfer molding. [Means for solving the problem]

[0007] In order to achieve this object, the method for producing a resin molded product of the present disclosure includes: A method for manufacturing a resin molded product using a resin molding device, The resin molding device includes: A mold including an upper mold and a lower mold; a suction mechanism for sucking the object to be molded onto the lower die, the lower mold is provided with a suction hole and a suction path for suctioning the molding object by the suction mechanism, the suction hole is connected to the suction path, The method for producing a resin molded product is a method for producing the resin molded product by performing transfer-type resin molding on the molding object adsorbed to the lower mold, and includes a mold clamping step, a resin molding step, a mold opening step, and a conveying step, the mold clamping step is a step of clamping the upper mold and the lower mold so as to sandwich the molding object between them, The resin molding step is a step of performing transfer type resin molding after the mold clamping step, The mold opening step is a step of opening a mold after the resin molding step, the conveying step is a step of conveying the molding object after the mold opening step, The mold opening step includes a first moving step, a pressurizing and heating step, and a second moving step, the first moving step is a step of moving the lower die relatively downward with respect to the upper die after the resin molding step, the pressurizing and heating step is a step of pressing and heating the object by moving the lower mold upward relative to the upper mold after the first moving step, In the method for producing a resin molded product, the second moving step is a step of moving the lower mold relatively downward with respect to the upper mold after the pressurizing and heating step.

[0008] The resin molding apparatus of the present disclosure is A resin molding apparatus for manufacturing a resin molded product according to the manufacturing method of the resin molded product disclosed herein, The resin molding device includes: A mold including an upper mold and a lower mold; a clamping mechanism that clamps the upper mold and the lower mold; a conveying mechanism for removing and conveying a molded object after resin molding from the mold that has been opened, The mold is used to perform transfer type resin molding. Effect of the Invention

[0009] According to the present disclosure, it is possible to provide a method for manufacturing a resin molded product and a resin molding device for stably transporting a resin molded product obtained by transfer molding. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is a cross-sectional view illustrating an example of a resin molding apparatus according to the present disclosure and one step in a method for manufacturing a resin molded product using the same. [Diagram 2] FIG. 2 is a cross-sectional view illustrating another step in the method for producing a resin molded product according to the present disclosure. [Diagram 3] FIG. 3 is a cross-sectional view illustrating still another step in the method for producing a resin molded product according to the present disclosure. [Figure 4] FIG. 4 is a cross-sectional view illustrating still another step in the method for producing a resin molded product according to the present disclosure. [Diagram 5] FIG. 5 is a cross-sectional view illustrating still another step in the method for producing a resin molded product according to the present disclosure. [Figure 6] FIG. 6 is a cross-sectional view illustrating still another step in the method for producing a resin molded product according to the present disclosure. [Figure 7] FIG. 7 is a cross-sectional view illustrating still another step in the method for producing a resin molded product according to the present disclosure. [Figure 8] FIG. 8 is a cross-sectional view illustrating still another step in the method for producing a resin molded product according to the present disclosure. [Figure 9]FIG. 9 is a plan view showing an example of the configuration of a resin molding apparatus according to the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] In the present disclosure, the method for producing a resin molded product is a transfer type production method (transfer molding) as described above.

[0012] In the present disclosure, the molding tool is not particularly limited, but may be, for example, a metal mold or a ceramic mold.

[0013] In the present disclosure, the resin molded product is not particularly limited, but may be, for example, an electronic component in which an electronic element such as an IC or a semiconductor chip (hereinafter, simply referred to as a "chip") is resin-sealed. More specifically, for example, by resin-sealing a chip, the chip can be made into an electronic component in which the chip is resin-sealed (also referred to as an electronic component as a finished product, or a package, etc., hereinafter, simply referred to as an "electronic component"). In general, the term "electronic component" refers to a chip before resin-sealing, or to a state in which the chip is resin-sealed. However, in the present disclosure, the chip before resin-sealing is also referred to as an "electronic element," and the resin-sealed chip is referred to as an "electronic component" (electronic component as a finished product). In other words, in the present disclosure, the terms "chip" and "electronic element" are synonymous, and specific examples include chips such as ICs, semiconductor chips, semiconductor elements for power control, resistor elements, and capacitor elements. In addition, the term "semiconductor element" refers to, for example, a circuit element made of a semiconductor material. The "chip" or "electronic element" in the present disclosure is not particularly limited as long as it is a chip before being sealed with resin, and does not have to be in chip form.

[0014] In the present disclosure, the resin material before molding and the resin after molding are not particularly limited, and may be, for example, a thermosetting resin such as an epoxy resin or a silicone resin, or a thermoplastic resin. Also, it may be a composite material containing a thermosetting resin or a thermoplastic resin in part. In the present disclosure, examples of the form of the resin material before molding include powdered resin (including granular resin), liquid resin, sheet-shaped resin, tablet-shaped resin, and the like. In the present disclosure, the liquid resin may be liquid at room temperature, and also includes molten resin that is melted by heating and becomes liquid. The form of the resin may be other forms as long as it can be supplied to the pot of the molding mold, etc.

[0015] In the present disclosure, the object of resin molding is not particularly limited, but may be, for example, a substrate. In addition, in the present disclosure, for example, a resin molded product may be manufactured by resin sealing (resin molding) a component (e.g., a chip, flip chip, etc.) mounted on a substrate (object).

[0016] Hereinafter, specific embodiments of the present disclosure will be described with reference to the drawings. For the sake of convenience, the drawings are drawn in a schematic manner with appropriate omissions and exaggeration.

[0017] An example of a resin molding apparatus according to the present disclosure and an example of a method for manufacturing a resin molded product using the same will be described with reference to FIGS. 1 to 8. FIG.

[0018] First, an example of the configuration of a resin molding apparatus according to the present disclosure is shown using Fig. 1. Fig. 1 is a cross-sectional view that shows a schematic diagram of the resin molding apparatus according to the present disclosure. However, in Fig. 1, in order to simplify the illustration, a mold clamping mechanism is partially omitted.

[0019] 1, a resin molding apparatus 100 of the present disclosure includes a molding die 10 including an upper die 11 and a lower die 12, a mold clamping mechanism 30, and a conveying mechanism 40. The upper die 11 and the lower die 12 are arranged such that the lower surface of the upper die 11 and the upper surface of the lower die 12 face each other.

[0020] The lower surface of the upper mold 11 is formed with a cavity 11a, a pin hole 11b, a cull portion 11c, and a runner portion 11d. After the upper mold 11 and the lower mold 12 are clamped, a molten resin material R is injected into the cavity 11a. The pin hole 11b is disposed at a position where it fits with a pin 122 described later. The cull portion 11c is a recess formed in a portion facing a pot 501a described later. The runner portion 11d is formed so as to connect the cavity 11a and the cull portion 11c. The lower surface of the upper mold 11 can hold a release film F so as to be aligned with the cavity 11a, the cull portion 11c, and the runner portion 11d. The upper mold 11 is provided with a release film suction mechanism (not shown). The release film suction mechanism sucks the release film F to reduce pressure, so that the release film F can be adsorbed to the lower surface of the upper mold 11. Although not shown, a vacuum pump or the like can be used as the release film suction mechanism. In addition, the upper mold 11 may have an ejector pin (not shown) for peeling off the resin material R (cured resin R') that adheres to the lower surface of the upper mold 11 in the mold opening process described later. The ejector pin is provided, for example, by providing a hole that communicates with the upper mold 11 and penetrating the hole that communicates with the upper mold 11. The resin material R that adheres to the lower surface of the upper mold 11 can be peeled off by piercing the ejector pin from the hole that communicates with the upper mold 11 toward the lower surface of the upper mold 11. The same applies when a release film F is provided between the lower surface of the upper mold 11 and the resin material R. In this case, the ejector pin may pierce the release film F to peel off the resin material R that adheres to the lower surface of the upper mold 11.

[0021] The lower mold 12 includes a lower mold cavity block 121, pins 122, and suction holes 123, and is provided with a resin injection mechanism 50. The suction holes 123 are connected to a suction path (not shown). The suction path is provided in the lower mold 12. Note that in Figs. 1 to 8, the lower mold 12 is provided with two each of the lower mold cavity block 121, the pins 122, and the suction holes 123. The two lower mold cavity blocks 121 are arranged on both sides of the pot block 501. The pins 122 are arranged at positions penetrating a part of the object W (for example, an end of the object W) so that the object W does not shift in position, and engage with the pin hole 11b. The suction holes 123 can suck the object W arranged on the upper surface of the lower mold cavity block 121 by a suction mechanism (not shown) to reduce the pressure, thereby allowing the object W to be sucked to the lower mold 12. The suction mechanism sucks the workpiece W placed on the upper surface of the lower die cavity block 121 through the suction path and the suction holes 123 to reduce the pressure, thereby adsorbing the workpiece W to the lower die 12. A vacuum pump or the like can be used as the suction mechanism. Although not shown in FIG. 1, the lower die 12 may have a cavity.

[0022] The resin injection mechanism 50 has a pot block 501 in which a pot 501a for accommodating the resin material R is formed, a plunger 502 for pumping the resin material R accommodated in the pot 501a, and a plunger driver 503 for driving the plunger 502. The resin injection mechanism 50 further includes a mechanism (not shown) for heating and melting the resin material R. The plunger 502 pumps the resin material R that has been heated and melted in the pot 501a.

[0023] The mold clamping mechanism 30 clamps the upper mold 11 and the lower mold 12. The mold clamping mechanism 30 is provided below the lower mold 12 via a platen 201 and a movable platen 202. When the upper mold 11 and the lower mold 12 are clamped by the mold clamping mechanism 30, a resin flow path consisting of the cull portion 11c and the runner portion 11d communicates the pot 501a and the cavity 11a. When the melted resin material R is injected into the cavity 11a by the plunger 502 in this state, the electronic components (not shown) of the molding object W can be resin-sealed. Note that, in FIG. 1, a resin molding device for resin-molding two molding objects W is described as an example of the resin molding device, but the present invention is not limited thereto, and may be, for example, a resin molding device for resin-molding one molding object W. That is, the upper mold 11 in FIG. 1 has two cavities 11a and two runner portions 11d, and is used to resin mold two molding objects W, but it may also be configured as one cavity and one runner portion, and used to resin mold one molding object W.

[0024] The conveying mechanism 40 is a mechanism for removing and conveying the molding object W after resin molding from the mold 10 that has been opened. In FIG. 1, a conveying claw 40a is shown as an example of the conveying mechanism 40. The conveying claws 40a hook and hold both ends of the molding object W, forming a pair. The conveying claws 40a have a drive unit (not shown) that expands or reduces the distance between the conveying claws 40a. The drive unit reduces the distance between the conveying claws 40a to hook and hold the molding object W, and expands the distance between the conveying claws 40a to release the holding of the molding object W. In this disclosure, the conveying claw 40a is shown as an example of the conveying mechanism 40, but is not particularly limited as long as it can convey the molding object W. The conveying mechanism 40 may be, for example, a mechanism that adsorbs and conveys the molding object W.

[0025] Next, an example of a method for manufacturing a resin molded product using this resin molding device will be described. First, as shown in FIG. 1, the molding object W is adsorbed to the lower mold 12 by the adsorption mechanism, as shown by the arrow in FIG. 1. Also, the molding object W is penetrated by a pin 11b. A chip (not shown) may be fixed to the molding object W. During resin molding, the chip can be resin-sealed to manufacture an electronic component (resin molded product). However, this is not limited to this, and for example, a member such as a chip may not be fixed to the molding object W. Also, for example, a member other than the chip (for example, a wire, etc.) may be fixed to the molding object W. Then, the release film F is transported to the position of the lower surface of the upper mold 11. The means and method for transporting the release film F to a predetermined position are not particularly limited, and for example, a known means and method such as a loader 4a described later may be used appropriately. Then, as shown in the figure, the release film F is adsorbed by a release film suction mechanism (not shown) provided in the upper mold 11. After that, the resin material R is placed in the pot 501a. The resin material R is heated by a heating mechanism (not shown) provided in the resin injection mechanism 50 and melts.

[0026] Next, as shown in Fig. 2, a mold clamping process is performed. In the mold clamping process, the upper mold 11 and the lower mold 12 are clamped together by raising the lower mold 12 by the mold clamping mechanism 30. Here, the pin 122 and the pin hole 11b are fitted together by the mold clamping. In the mold clamping process, the suction mechanism is in a suction state.

[0027] Next, as shown in Fig. 3, the resin molding process is performed. The resin molding process is a process in which transfer-type resin molding is performed after the mold clamping process. In the resin molding process, when the plunger 502 is raised by the plunger driving unit 503, the molten resin material R in the pot 501a is injected into the cavity 11a through the resin flow path. Note that the suction mechanism is in a suction state in the mold clamping process.

[0028] Next, as shown in FIG. 4, a mold opening process is performed. The mold opening process is a process of opening the mold after the resin molding process. After the resin material R injected in the resin molding process is cured (cured resin R'), the mold opening process is performed. The mold opening process includes a first moving process, a pressurizing and heating process, and a second moving process. The first moving process is a process of moving the lower mold 12 relatively downward with respect to the upper mold 11 after the resin molding process. In the first moving process, the lower mold 12 is lowered by the mold clamping mechanism 30, so that the lower mold 12 moves relatively downward with respect to the upper mold 11. Note that the gap between the upper mold 11 and the lower mold 12 after the first moving process is preferably narrower than the gap between the upper mold 11 and the lower mold 12 immediately before the conveying process described later. Also, for convenience of illustration, the gap between the upper mold 11 and the lower mold 12 is shown to be large in FIG. 4, but this is a gap that does not allow the molding object W to come off the pin 122 that penetrates it, for example. 4, the resin molded product after the first moving step, which is made of the resin material R and the molding object W, is warped in a mountain shape because the thermal shrinkage rate of the molding object W is greater than that of the resin material R, but is not limited to this form and may be warped in a valley shape because the thermal shrinkage rate of the molding object W is smaller than that of the resin material R. Furthermore, the warping is not limited to a simple warp, and may be a case where the molding object W is twisted or curved.

[0029] In Fig. 4, the suction mechanism is in a suction state, but is not limited to this. In the mold clamping process, for example, a suction control process may be provided, in which suction of the lower mold 12 is stopped after the first moving process, and suction of the lower mold 12 is started before the pressurizing and heating process described later.

[0030] Next, as shown in FIG. 5 and FIG. 6, the pressurizing and heating process is performed. First, as shown in FIG. 5, the lower die 12 is moved upward relative to the upper die 11 after the first moving process. Then, as shown in FIG. 6, the pressurizing and heating process is a process of pressurizing and heating the molding object W (the resin molded product P consisting of the cured resin R' and the molding object W). Note that the pressure in the pressurizing and heating process is preferably smaller than the pressure in the mold clamping process from the viewpoint of manufacturing efficiency. In addition, the heating conditions in the pressurizing and heating process are not particularly limited, and can be any conditions depending on the state of the molding object W and the resin material R used, the curvature of the resin molded product P, and the like. Note that in FIG. 5 and FIG. 6, the pressurizing and heating process is performed with the suction of the suction mechanism stopped, but, for example, as described above, the suction of the suction mechanism may be stopped after the first moving process and the suction of the suction mechanism may be started before the pressurizing and heating process. That is, the pressurizing and heating process may be performed with the molding object W being sucked. By performing the pressurizing and heating process, the warpage of the resin molded product P is corrected.

[0031] Next, as shown in Fig. 7, a second moving step is performed. In the second moving step, the lower die 12 is moved downward relative to the upper die 11 after the pressurizing and heating step. As shown in Fig. 7, the lower die 12 is lowered by the clamping mechanism 30, whereby the lower die 12 moves downward relative to the upper die 11. Since the warpage of the resin molded product P in the second moving step has been corrected and improved, the resin molded product can be adsorbed by the suction mechanism.

[0032] Thereafter, as shown in Fig. 8, a conveying step is performed. The conveying step is a step of conveying the molding object W (a resin molded product P consisting of a cured resin R' and the molding object W) after the mold opening step. As shown in Fig. 8, since the warpage of the resin molded product P has been improved, the molding object W is conveyed while being hooked and held at both ends by conveying claws 40a (conveying mechanism 40). As described above, the conveying mechanism 40 is not particularly limited as long as it can convey the molding object W. The conveying mechanism 40 may be, for example, a mechanism that adsorbs and conveys the molding object W.

[0033] In the manner described above, the method for producing a resin molded product is carried out, and a resin molded product can be produced in which one surface of the molding object W is resin-molded with the resin material R'.

[0034] According to the method for producing a resin molded product of the present disclosure, for example, warping of the resin molded product is improved, and the resin molded product can be stably transported.

[0035] Another example of a resin molding apparatus according to the present disclosure and another example of a method for producing a resin molded product using the same will be described with reference to FIGS. 1 to 8. FIG.

[0036] In addition to the configuration described in the first embodiment, the lower mold 12 may further include an air pressure measuring mechanism (not shown) for measuring the air pressure in the suction holes 123 or the air pressure in the suction path. Here, the lower mold 12 has a plurality of suction holes 123. The plurality of suction holes 123 are connected to a common suction path, and the suction mechanism such as a vacuum pump sucks air to suck the molding object W and reduce the pressure. The air pressure measuring mechanism measures, for example, the air pressure in the suction holes 123 or the air pressure in the suction path, thereby determining whether the suction holes 123 or the suction path are in a suction state. The air pressure measuring mechanism may be, for example, a commonly used barometer. If the measured air pressure is lower than the air pressure in the gap between the upper mold 11 and the lower mold 12 in FIG. 7, it is determined that the molding object W has been successfully suctioned to the lower mold 12, and if it is higher, it is determined that the molding object W has not been successfully suctioned to the lower mold 12.

[0037] For the other configurations of the resin molding apparatus of this embodiment, the configuration and description of the resin molding apparatus 100 in the first embodiment described above can be applied.

[0038] Next, an example of a method for manufacturing a resin molded product using a resin molding device having an air pressure measurement mechanism will be described. The mold clamping process, mold opening process, and conveying process can be explained using the method for manufacturing a resin molded product in the first embodiment.

[0039] The mold opening step may further include an air pressure measurement step in addition to the steps described in the first embodiment. The air pressure measurement step is a step of measuring the air pressure in the suction hole 123 or the air pressure in the suction path after the first movement step. In the air pressure measurement step, if the air pressure is equal to or higher than the threshold, the pressurizing and heating step and the second movement step are performed, and if the air pressure is lower than the threshold, the second movement step is performed. That is, if the air pressure is equal to or higher than the threshold, the molding object W is not adsorbed to the lower die 12 (the resin molded product is warped), so the pressurizing and heating step is performed to improve the warpage of the resin molded product P. On the other hand, if the air pressure is lower than the threshold, the molding object W is adsorbed to the lower die 12 (the resin molded product P is not warped), so there is no need to perform the pressurizing and heating step to improve the warpage of the resin molded product P. Therefore, if the air pressure is lower than the threshold, the second movement step is performed, and then the resin molded product is transported by the transport step. The first movement step, the adsorption control step, the pressurizing and heating step, and the second movement step can be described in the method for manufacturing a resin molded product in the first embodiment.

[0040] In the manner described above, the method for producing a resin molded product is carried out, and a resin molded product can be produced in which one surface of the molding object W is resin-molded with the resin material R'.

[0041] According to the method for producing a resin molded product of this embodiment, for example, when the resin molded product is attached to the lower die, the second moving step and the conveying step can be performed without performing the pressurizing and heating step, thereby improving production efficiency.

[0042] The overall configuration of the resin molding apparatus 100 will be described with reference to Fig. 9. Fig. 9 is a plan view showing an example of the configuration of the resin molding apparatus of the present disclosure.

[0043] 9, the resin molding apparatus 100 includes, as its components, a supply module A that supplies the molding object W and the resin material R before resin sealing, a resin molding module B that corresponds to the resin molding section and performs resin molding, a transport module C for transporting the resin molded product P, and a control unit COM. Note that the components, supply module A, resin molding module B, and transport module C, can be attached to and detached from the other components, and can be replaced. Also, the number of modules can be increased or decreased, for example, by increasing the number of resin molding modules B to two or three.

[0044] The resin molding apparatus 100 includes a loader 4a that transports the molding object W and resin material R supplied by the supply module A to the resin molding module B all at once, and an unloader 4b that transports the resin molded product P resin molded by the resin molding module B to the transport module C.

[0045] The unloader 4b includes a conveying mechanism 40 for holding the resin molded product P, and a cleaning mechanism 3.

[0046] The supply module A includes a molding object supply mechanism 1 and a resin supply mechanism 2, as shown in FIG.

[0047] The molding object supply mechanism 1 has a molding object sending section 1a and a molding object supply section 1b. The molding object sending section 1a sends out molding objects W to the molding object supply section 1b. The molding object supply section 1b receives molding objects W from the molding object sending section 1a, aligns the received molding objects W in a predetermined direction, and delivers them to the loader 4a.

[0048] The resin supply mechanism 2 has a resin delivery section 2a and a resin supply section 2b. The resin delivery section 2a delivers the resin material R to the resin supply section 2b. The resin supply section 2b receives the resin material R from the resin delivery section 2a, aligns the received resin material R in a predetermined direction, and delivers it to the loader 4a.

[0049] The resin molding module B has a molding die 10 and a mold clamping mechanism 30 (not shown).

[0050] The transfer module C has a molding object accommodation section 5 for accommodating the resin molded product P that has been resin-sealed by the resin molding module B, as shown in FIG.

[0051] The control unit COM is configured to control at least the cleaning mechanism 3. The control unit COM includes a CPU (Central Processing Unit), a RAM (Random Access Memory), a ROM (Read Only Memory), etc., and is configured to control each component in response to information processing. The control unit COM may be configured to control the entire resin molding apparatus.

[0052] Next, the basic operation of resin molding by the resin molding apparatus 100 will be described with reference to FIG.

[0053] As shown in Fig. 9, the molding object delivery section 1a delivers the molding objects W in the magazine to the molding object supply section 1b. The molding object supply section 1b aligns the received molding objects W in a predetermined direction and delivers them to the loader 4a. In parallel with this, the resin delivery section 2a delivers the resin material R to the resin supply section 2b. The resin supply section 2b delivers the required number of pieces of the received resin material R (three pieces in Fig. 9) to the loader 4a.

[0054] Next, the loader 4a simultaneously transports the two molding objects W and the three resin materials R received to the molding die 10. The loader 4a supplies the molding objects W to the upper surface of the lower die 12, and supplies the resin materials R to the inside of the pot 501a formed in the lower die 12.

[0055] Next, the "mold clamping step", "resin molded product" and "mold opening step" described in the first or second embodiment are carried out.

[0056] Thereafter, the "transport step" described in embodiment 1 or 2 is performed. Specifically, the resin molded product P resin-sealed by the resin molding module B is accommodated in the molding target object accommodation section 5 of the transport module C using the unloader 4b (corresponding to the transport mechanism 40 described in embodiment 1 and 2). At this time, before transporting the resin molded product P to the transport module C, the unloader 4b cleans the surface of the molding die 10 using the cleaning mechanism 3 provided in the unloader 4b while holding the resin molded product P.

[0057] The present disclosure is not limited to the above-described embodiments, and can be arbitrarily and appropriately combined, modified, or selected and adopted as needed within the scope not departing from the spirit of the present disclosure.

[0058] A part or all of the above-described embodiments may be described as follows, but is not limited to the following. (Appendix 1) A method for manufacturing a resin molded product using a resin molding device, The resin molding device includes: A mold including an upper mold and a lower mold; a suction mechanism for sucking the object to be molded onto the lower die, the lower mold is provided with a suction hole and a suction path for suctioning the molding object by the suction mechanism, the suction hole is connected to the suction path, The method for producing a resin molded product is a method for producing the resin molded product by performing transfer-type resin molding on the molding object adsorbed to the lower mold, and includes a mold clamping step, a resin molding step, a mold opening step, and a conveying step, the mold clamping step is a step of clamping the upper mold and the lower mold so as to sandwich the molding object between them, The resin molding step is a step of performing transfer type resin molding after the mold clamping step, The mold opening step is a step of opening a mold after the resin molding step, the conveying step is a step of conveying the molding object after the mold opening step, The mold opening step includes a first moving step, a pressurizing and heating step, and a second moving step, the first moving step is a step of moving the lower die relatively downward with respect to the upper die after the resin molding step, the pressurizing and heating step is a step of pressing and heating the object by moving the lower mold upward relative to the upper mold after the first moving step, The second moving step is a step of moving the lower mold relatively downward with respect to the upper mold after the pressurizing and heating step. A method for manufacturing a resin molded product. (Appendix 2) The mold opening step further includes a suction control step, The adsorption control step includes: After the first moving step, the suction of the lower mold is stopped, a step of starting the suction of the lower mold before the pressurizing and heating step; A method for producing the resin molded product according to claim 1. (Appendix 3) a distance between the upper mold and the lower mold after the first moving step is narrower than a distance between the upper mold and the lower mold immediately before the transporting step; A method for producing a resin molded product according to claim 1 or 2. (Appendix 4) The pressure in the pressurizing and heating step is smaller than the pressure in the mold clamping step. A method for producing a resin molded product according to any one of claims 1 to 3. (Appendix 5) A method for manufacturing a resin molded product using a resin molding device, The resin molding device includes: A mold including an upper mold and a lower mold; a suction mechanism for sucking the object to be molded onto the lower die, the lower mold is provided with a suction hole and a suction path for suctioning the molding object by the suction mechanism, the suction hole is connected to the suction path, The method for producing a resin molded product is a method for producing the resin molded product by performing transfer-type resin molding on the molding object adsorbed to the lower mold, and includes a mold clamping step, a resin molding step, a mold opening step, and a conveying step, the mold clamping step is a step of clamping the upper mold and the lower mold so as to sandwich the molding object between them, The resin molding step is a step of performing transfer type resin molding after the mold clamping step, The mold opening step is a step of opening a mold after the resin molding step, the conveying step is a step of conveying the molding object after the mold opening step, The mold opening step includes a first moving step, an air pressure measuring step, a pressurizing and heating step, and a second moving step, the first moving step is a step of moving the lower die relatively downward with respect to the upper die after the resin molding step, the air pressure measuring step is a step of measuring an air pressure in the suction hole or an air pressure in the suction path after the first moving step, In the air pressure measuring step, When the air pressure is equal to or higher than the threshold value, the pressurizing and heating step and the second moving step are carried out, When the air pressure is less than the threshold value, the second moving step is performed; the pressurizing and heating step is a step of pressurizing and heating the object after the air pressure measuring step, The second moving step is a step of moving the lower mold relatively downward with respect to the upper mold after the air pressure measuring step or the pressurizing and heating step. A method for manufacturing a resin molded product. (Appendix 6) A resin molding apparatus for manufacturing a resin molded product according to the manufacturing method according to any one of claims 1 to 5, The resin molding device includes: A mold including an upper mold and a lower mold; a clamping mechanism that clamps the upper mold and the lower mold; a conveying mechanism for removing and conveying a molded object after resin molding from the mold that has been opened, Transfer type resin molding is performed using the molding die. Resin molding equipment. [Explanation of symbols]

[0059] 100 Resin molding equipment 10 mold 11 Upper mold 11a Cavity 11b pin hole 11c Culture Club 11d Runner section 12 Lower mold 121 Lower cavity block 122 pin 123 Adsorption hole 201 Platen 202 Movable plate 30 Mold clamping mechanism 40 (40a) Transport mechanism (transport claw) 50 Resin injection mechanism 501 Pot Block 501a Pot 502 Plunger 503 Plunger drive unit 1. Molding object supply mechanism 1a Molding object delivery section 1b Molding object supply section 2 Resin supply mechanism 2a Resin delivery section 2b Resin supply section 3 Cleaning mechanism 4a Loader 4b Unloader 5 Molding object storage section A Supply Module B Resin molding module C. Transfer module W Molding object R Resin material R' Resin material (cured resin) F Release film P Resin molded product

Claims

1. A method for manufacturing a resin molded product using a resin molding device, The resin molding device includes: A mold including an upper mold and a lower mold; a suction mechanism for sucking the object to be molded onto the lower die, the lower mold is provided with a suction hole and a suction path for suctioning the molding object by the suction mechanism, the suction hole is connected to the suction path, The method for producing a resin molded product is a method for producing the resin molded product by performing transfer-type resin molding on the molding object adsorbed to the lower mold, and includes a mold clamping step, a resin molding step, a mold opening step, and a conveying step, the mold clamping step is a step of clamping the upper mold and the lower mold so as to sandwich the molding object between them, The resin molding step is a step of performing transfer type resin molding after the mold clamping step, The mold opening step is a step of opening a mold after the resin molding step, the conveying step is a step of conveying the molding object after the mold opening step, The mold opening step includes a first moving step, a pressurizing and heating step, and a second moving step, the first moving step is a step of moving the lower mold relatively downward with respect to the upper mold after the resin molding step, the pressurizing and heating step is a step of pressing and heating the object by moving the lower mold upward relative to the upper mold after the first moving step, The second moving step is a step of moving the lower mold relatively downward with respect to the upper mold after the pressurizing and heating step. A method for manufacturing a resin molded product.

2. The mold opening step further includes a suction control step, The adsorption control step includes: After the first moving step, the suction of the lower mold is stopped, a step of starting the suction of the lower mold before the pressurizing and heating step; A method for producing the resin molded product according to claim 1.

3. a distance between the upper mold and the lower mold after the first moving step is narrower than a distance between the upper mold and the lower mold immediately before the transporting step; A method for producing the resin molded product according to claim 1 or 2.

4. The pressure in the pressurizing and heating step is smaller than the pressure in the mold clamping step. A method for producing the resin molded product according to any one of claims 1 to 3.

5. A resin molding apparatus for manufacturing a resin molded product according to the manufacturing method according to any one of claims 1 to 4, The resin molding device includes: A mold including an upper mold and a lower mold; a clamping mechanism that clamps the upper mold and the lower mold; a conveying mechanism for removing and conveying a molded object after resin molding from the mold that has been opened, Transfer type resin molding is performed using the molding die. Resin molding equipment.

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