Cooling device

Abstract

To provide a cooling device capable of cooling a heating element with minimal power consumption.SOLUTION: A cooling device 1 includes: a housing 10 having an outer tube 11 extending in the vertical direction, a bottom plate 12 that closes the lower end of the outer tube, and a top plate 13 that closes the upper end of the outer tube to form a sealed space inside the outer tube together with the bottom plate; an inner tube 20 extending in the vertical direction inside the outer tube to form an ascending flow path on its inner side, and forming an annular descending flow path between the inner and outer tubes, the descending flow path being connected to the ascending flow path at both upper and lower ends; a heating element 2 provided inside the inner tube; and a refrigerant R sealed within the housing.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to cooling devices. [Background technology]

[0002] Patent Document 1 discloses an electronic device having a plurality of electronic components in a housing. This electronic device includes a heat sink, a refrigerant cooling section, a descending flow path, and an ascending flow path. The heat sink is disposed above the housing. The refrigerant cooling section is disposed above the housing and adjacent to the heat sink. The descending flow path guides the refrigerant from the refrigerant cooling section to the bottom of the housing. The ascending flow path guides the refrigerant that has moved to the bottom of the housing through the descending flow path back to the refrigerant cooling section. The refrigerant that has reached the refrigerant cooling section above the housing is cooled by the heat sink, and moves toward the descending flow path as if pushed by the high-temperature refrigerant that has risen up the ascending flow path, and moves to the bottom of the housing. That is, in this electrical device, the refrigerant is circulated by the principle of thermal convection. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 5720443 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in recent years, the heat density has been increasing along with the miniaturization of various devices. When a sudden load occurs, it is required to cool the device without exceeding the allowable temperature. Under these circumstances, it has been an issue to make it possible to cool the heating element with the minimum power.

[0005] The present disclosure has been made to solve the above-mentioned problems, and has an object to provide a cooling device that can cool a heat-generating body with minimal power. [Means for solving the problem]

[0006] In order to solve the above problems, the cooling device of the present disclosure comprises a housing having an outer tube extending in a vertical direction, a bottom plate closing the lower end of the outer tube, and a top plate closing the upper end of the outer tube and forming an airtight space within the outer tube together with the bottom plate, an inner tube extending in a vertical direction inside the outer tube to form an ascending flow path on the inside and forming a ring between the outer tube and a descending flow path connected to the ascending flow path at its upper and lower ends, a heating element provided inside the inner tube, and a refrigerant sealed within the housing.

[0007] The cooling device of the present disclosure comprises a housing having an outer tube extending in a vertical direction, a heating element provided inside the outer tube, and a high-temperature heat transport device provided within the outer tube, connecting the outer tube and the heating element and transferring heat from the heating element to the outer tube. Effect of the Invention

[0008] According to the cooling device of the present disclosure, a heat generating body can be cooled with a minimum of power. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a perspective view of a cooling device according to a first embodiment of the present disclosure. [Diagram 2] FIG. 2 is a top view of the cooling device according to the first embodiment of the present disclosure. [Diagram 3] FIG. 2 is a longitudinal cross-sectional view of the cooling device according to the first embodiment of the present disclosure. [Figure 4] FIG. 11 is a longitudinal cross-sectional view of a cooling device according to a second embodiment of the present disclosure. [Diagram 5] FIG. 11 is a perspective view of a cooling device according to a third embodiment of the present disclosure. [Figure 6] FIG. 13 is a top view of a cooling device according to a third embodiment of the present disclosure. [Figure 7] FIG. 11 is a longitudinal cross-sectional view of a cooling device according to a third embodiment of the present disclosure. [Figure 8] FIG. 13 is a top view of a cooling device according to a modified example of the third embodiment of the present disclosure. [Figure 9] FIG. 13 is a longitudinal sectional view of a cooling device according to a modified example of the third embodiment of the present disclosure. [Figure 10] FIG. 11 is a longitudinal cross-sectional view of a cooling device according to a fourth embodiment of the present disclosure. [Figure 11] FIG. 13 is a longitudinal sectional view of a cooling device according to a modified example of the fourth embodiment of the present disclosure. [Figure 12] FIG. 13 is a longitudinal cross-sectional view of a cooling device according to a fifth embodiment of the present disclosure. [Figure 13] FIG. 13 is a longitudinal sectional view of a cooling device according to a modified example of the fifth embodiment of the present disclosure. [Figure 14] FIG. 13 is a longitudinal cross-sectional view of a cooling device according to a sixth embodiment of the present disclosure. [Figure 15] FIG. 13 is a longitudinal sectional view of a cooling device according to a modified example of the sixth embodiment of the present disclosure. [Figure 16] FIG. 13 is a top view of a cooling device according to another embodiment of the present disclosure. [Figure 17] FIG. 13 is a longitudinal cross-sectional view of a cooling device according to another embodiment of the present disclosure. [Figure 18] FIG. 13 is a top view of a cooling device according to another embodiment of the present disclosure. [Figure 19] FIG. 13 is a longitudinal cross-sectional view of a cooling device according to another embodiment of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] First Embodiment (Cooling device configuration) Hereinafter, a cooling device 1 according to a first embodiment of the present disclosure will be described with reference to FIGS. The cooling device 1 is used to cool an electronic device having a heat generating body 2. The heat generating body 2 is a wide variety of electronic components housed in a casing (a housing 10 described below) of the electronic device and generates heat during operation. Examples of the heat generating body 2 include semiconductor chips such as a GPU or a CPU. As shown in Fig. 1, the cooling device 1 includes a housing 10, an inner cylinder 20, a heat generating element 2, a refrigerant R, and fins 3. In Fig. 1, the cooling device 1 is illustrated in a simplified schematic manner.

[0011] (Housing) The housing 10 is a casing that houses the heating element 2. The housing 10 has an outer cylinder 11, a bottom plate 12, and a top plate 13.

[0012] (outer cylinder) The outer tube 11 is formed in a cylindrical shape extending in the vertical direction Dv. Both ends of the outer tube 11 in the vertical direction Dv are open in the vertical direction Dv. In the following description, the upper side in the vertical direction Dv is labeled with the symbol "Dvu" and the lower side is labeled with the symbol "Dvd".

[0013] An axis O of the outer tube 11 extends in the up-down direction Dv. In the following, the axis O of the outer tube 11 may be simply referred to as the "axis O". In addition, the radial direction about the axis O may be simply referred to as the "radial direction", and the circumferential direction about the axis O may be simply referred to as the "circumferential direction".

[0014] (bottom plate) The bottom plate 12 closes the lower end of the outer tube 11. The bottom plate 12 is a flat plate extending horizontally, and is formed in a circular shape when viewed from the up-down direction Dv. The bottom plate 12 is formed of a material (e.g., a heat-resistant material) having a lower thermal conductivity than the outer tube 11. As a result, the thermal conductivity of the outer tube 11 is greater than that of the bottom plate 12. The bottom plate 12 may be formed of the same material as the outer tube 11.

[0015] (Tabletop) The top plate 13 closes the upper end of the outer tube 11. The top plate 13, together with the bottom plate 12, closes the opening of the outer tube 11, forming an enclosed space within the outer tube 11. The top plate 13 is formed of a material (e.g., a heat-resistant material) that has a lower thermal conductivity than the outer tube 11, similar to the bottom plate 12. This makes the thermal conductivity of the outer tube 11 greater than that of the top plate 13. The top plate 13 may be formed of the same material as the outer tube 11. The top plate 13 may be formed of a material different from that of the bottom plate 12. The table top 13 is formed in a dome shape that protrudes upward (outward in the direction of the axis O). The table top 13 is smoothly curved, and the upper and lower surfaces of the table top 13 are formed in a smoothly curved shape.

[0016] (inner cylinder) The inner tube 20 is provided inside the outer tube 11. The inner tube 20 is formed in a cylindrical shape extending in the up-down direction Dv. The inner tube 20 is supported by a support member (not shown) at a position spaced above the bottom plate 12 and below the top plate 13. The axis of the inner tube 20 coincides with the axis O of the outer tube 11. The inner tube 20 is formed with a smaller diameter than the outer tube 11 and is located radially inward with respect to the inner wall surface 11a of the outer tube 11.

[0017] The inner tube 20 functions as a guide to rectify the flow of the refrigerant R generated inside the housing 10. The inner tube 20 divides the space inside the outer tube 11 into a radially inner side and an outer side, and forms an ascending flow passage 21 on the radially inner side and a descending flow passage 22 on the radially outer side. The ascending flow passage 21 extends in the vertical direction Dv along the axis O. The descending flow passage 22 forms a ring between itself and the outer tube 11 and extends in the vertical direction Dv. Furthermore, the descending flow passage 22 is connected to the ascending flow passage 21 at its upper and lower ends.

[0018] (heating element) As described above, the heating element 2 is a semiconductor chip, such as a GPU or a CPU, housed in the housing 10. For simplification, the board on which the heating element 2 is mounted, wiring, and the like are omitted. The heating element 2 is provided inside the inner tube 20. In the illustrated example, the heating element 2 is disposed on the lower side of the inner tube 20. The heating element 2 is supported at a position spaced upward from the bottom plate 12 by a support member (not shown). In this embodiment, an example in which only one heating element 2 is provided in the housing 10 will be described. In addition, the shape of the heating element 2 can be appropriately selected, but in this embodiment, the heating element 2 is formed in a rectangular flat plate shape.

[0019] (Refrigerant) The refrigerant R is sealed in the housing 10. In this embodiment, the housing 10 is filled with a single-phase refrigerant R. Here, the embodiment will be described taking as an example a case where the housing 10 is filled with a liquid-phase refrigerant R1. As the refrigerant R, for example, a hydrogen fluoride-based inactivated liquid can be used. Note that, in the first embodiment, the refrigerant R sealed in the housing 10 is preferably a liquid, but the refrigerant R may be a gas.

[0020] (fin) The fins 3 protrude radially outward from the outer wall surface 11b of the outer cylinder 11. In this embodiment, the fins 3 are heat dissipation plates formed in a rectangular flat plate shape extending in the up-down direction Dv. A plurality of the fins 3 are provided on the outer wall surface 11b of the outer cylinder 11 at equal intervals in the circumferential direction. The plurality of fins 3 are provided so as to extend radially in the radial direction when viewed from the up-down direction Dv.

[0021] (Action and effect) In this embodiment, the cooling device 1 includes a housing 10, an inner tube 20, a heating element 2, and a refrigerant R. The housing 10 includes an outer tube 11 extending in a vertical direction Dv, a bottom plate 12 closing the lower end of the outer tube 11, and a top plate 13 closing the upper end of the outer tube 11 and forming a sealed space in the outer tube 11 together with the bottom plate 12. The inner tube 20 extends in the vertical direction Dv inside the outer tube 11 to form an ascending flow passage 21 on the inside, and forms a descending flow passage 22 that is annular between the inner tube 11 and the outer tube 11 and is connected to the ascending flow passage 21 at its upper and lower ends. The heating element 2 is provided inside the inner tube 20, and the refrigerant R is sealed in the housing 10.

[0022] The refrigerant R heated by the heating element 2 in the inner cylinder 20 becomes less dense and rises in the ascending flow path 21. For example, when the heating element 2 suddenly generates heat, the temperature of the refrigerant R rises suddenly, and an ascending flow occurs. When the refrigerant R reaches the upper end of the outer cylinder 11, it flows along the top plate 13 and is guided to the inner wall surface 11a of the outer cylinder 11. The outer cylinder 11 is exposed to the outside air and is in a cooled state. Therefore, the refrigerant R is cooled by the inner wall surface 11a, and a downward flow is generated. The refrigerant R descends the descending flow path 22 due to the generated downward flow. The refrigerant R is cooled by the inner wall surface 11a in the process of flowing through the descending flow path 22. The cooled refrigerant R is heated again by the heating element 2 and rises. In this way, the refrigerant R naturally circulates in the housing 10, and the heating element 2 is cooled. In FIG. 3, the flow of the natural circulation of the refrigerant R is illustrated by arrows. In this manner, in this embodiment, the refrigerant R naturally circulates within the housing 10 due to thermal convection caused by heating by the heating element 2 and cooling by the outer cylinder 11. Therefore, since no separate power such as a pump for circulating the refrigerant R is required, the heating element 2 can be cooled with a minimum of power.

[0023] As described above, the refrigerant R is heated by the heating element 2 in the ascending flow path 21, and is cooled by heat exchange with the outer cylinder 11 in the descending flow path 22. In this manner, within the housing 10, an area for cooling the heating element 2 and an area in which the refrigerant R is cooled by the outer cylinder 11 are partitioned. Therefore, the heating element 2 can be efficiently cooled.

[0024] Furthermore, in the descending flow path 22, the refrigerant R descends while being cooled by the inner wall surface 11a of the outer cylinder 11. Therefore, as the refrigerant R descends, the flow velocity of the refrigerant R increases, and the refrigerant R is efficiently cooled.

[0025] In this embodiment, the thermal conductivity of the outer cylinder 11 is greater than the thermal conductivity of the top plate 13 .

[0026] As a result, the refrigerant R is more easily cooled by the outer cylinder 11 than by the top plate 13, and a downward flow is more easily generated in the downward flow passage 22. This makes it easier for the refrigerant R to circulate within the housing 10. This makes it possible to further improve the cooling efficiency.

[0027] In this embodiment, the cooling device 1 includes fins 3 protruding outward from the outer wall surface 11b of the outer cylinder 11.

[0028] This increases the surface area of ​​the outer wall surface 11b of the outer cylinder 11, promoting heat dissipation and thus further improving the cooling efficiency.

[0029] In this embodiment, the housing 10 is filled with a single-phase refrigerant R (liquid-phase refrigerant R1).

[0030] This stabilizes the flow of the refrigerant R. This makes it easier to control the cooling device 1.

[0031] <Second embodiment> Hereinafter, a cooling device 201 according to a second embodiment of the present disclosure will be described with reference to Fig. 4. Configurations similar to those in the above-described embodiment will be given similar names and reference numerals, and descriptions thereof will be omitted as appropriate.

[0032] In this embodiment, as shown in Fig. 4, liquid phase refrigerant R1 and gas phase refrigerant R2 are sealed in the housing 10. Specifically, the liquid phase refrigerant R1 is stored in the lower part of the housing 10, and the gas phase refrigerant R2 is sealed in the upper part of the housing 10. The heating element 2 is disposed below the liquid level S of the liquid phase refrigerant R1. As a result, the entire heating element 2 is immersed in the liquid phase refrigerant R1.

[0033] (Action and effect) In this embodiment, a liquid-phase refrigerant R1 is stored in the lower part of the housing 10, and a gas-phase refrigerant R2 is sealed in the upper part of the housing 10. The heating element 2 is immersed in the liquid-phase refrigerant R1.

[0034] For example, when the heat generating element 2 suddenly generates heat, the liquid phase refrigerant R1 stored in the housing 10 boils. This removes the heat of vaporization of the refrigerant R1 from the heat generating element 2, making it possible to suppress a sudden increase in temperature of the heat generating element 2. This makes it possible to cool the heat generating element 2 more efficiently.

[0035] <Third embodiment> Hereinafter, a cooling device 301 according to a third embodiment of the present disclosure will be described with reference to Fig. 5 to Fig. 7. Configurations similar to those in the above-described embodiments will be given similar names and reference numerals, and descriptions thereof will be omitted as appropriate.

[0036] In this embodiment, as shown in FIGS. 5 to 7, a cooling device 301 has a housing 310, a heat generating body 2, and a high-heat transport device 330. The housing 310 has an outer tube 11, a bottom plate 12, and a top plate 313. The top plate 313 is formed in a circular flat plate shape, similar to the bottom plate 12. Moreover, this embodiment will be described taking as an example a case where the refrigerant R is not sealed inside the housing 310. Note that the refrigerant R may be sealed inside the housing 310, similarly to the first and second embodiments.

[0037] The heating element 2 is provided inside the outer cylinder 11. In the illustrated example, the heating element 2 is disposed at a middle position in the vertical direction Dv of the outer cylinder 11, at the center position of the outer cylinder 11. The heating element 2 is formed in a cubic shape. Note that the shape of the heating element 2 can be changed as appropriate, and may be formed in a rectangular flat plate shape, for example, as in the first embodiment.

[0038] (High-temperature heat transport device) The high-temperature heat transport device 330 is provided inside the outer cylinder 11. The high-temperature heat transport device 330 connects the inner wall surface 11a of the outer cylinder 11 and the outer surface of the heating element 2, and transfers heat from the heating element 2 to the outer cylinder 11. The high-temperature heat transport device 330 is also formed of a material with high thermal conductivity, such as graphene. This allows for highly efficient heat transfer from the heating element 2 to the outer cylinder 11.

[0039] In this embodiment, a plurality of high-temperature heat transport devices 330 (four in the illustrated example) are provided in the circumferential direction so as to radially and externally surround the heat generating element 2. The high-temperature heat transport device 330 is formed in a frustum shape that gradually expands in length in the up-down direction Dv and in the circumferential direction from the heat generating element 2 toward the outer cylinder 11 on the radially outer side.

[0040] (Action and effect) In this embodiment, the cooling device 301 further includes a high-temperature heat transport device 330 that is provided inside the external cylinder 11 , connects the external cylinder 11 and the heating element 2 , and transfers heat from the heating element 2 to the external cylinder 11 .

[0041] With the above configuration, the heat of the heating element 2 can be directly transferred to the outer cylinder 11 via the high-temperature heat transport device 330. This promotes heat dissipation from the heating element 2 to the outside, improving the cooling efficiency. Therefore, it is no longer necessary to provide a separate power source required for cooling the heating element 2, and the heating element 2 can be cooled with a minimum of power.

[0042] In the present embodiment, the case where the housing 310 includes the outer tube 11, the bottom plate 12, and the top plate 313 has been described, but is not limited to this. For example, the housing 310 may be composed of only the outer tube 11 without including the bottom plate 12 and the top plate 313. Moreover, although the top plate 313 has been described as being formed in a flat plate shape, this is not limiting, and the flat plate may be formed in a dome shape that protrudes upward, similar to the first embodiment.

[0043] In addition, the high-temperature heat transport device 330 is formed from a material with high thermal conductivity such as graphene, thereby realizing highly efficient heat conduction from the heat generating body 2 to the external cylinder 11, but this is not limited thereto. For example, the high-temperature heat transport device 330 may employ a heat pipe mechanism to realize highly efficient heat conduction from the heat generating body 2 to the external cylinder 11.

[0044] <Modification of the third embodiment> A modification of the third embodiment will be described with reference to FIGS. As shown in FIGS. 8 and 9, a cooling device 301A may include a high heat transport device 330 of the third embodiment in addition to the same configuration as in the first embodiment. The high-temperature heat transport device 330 passes through the inner cylinder 20 and connects the outer cylinder 11 and the heating element 2 . This allows the cooling device 301A to have a function of cooling the heat generating body 2 by the circulating flow of the refrigerant R in the first embodiment, and a function of cooling the heat generating body 2 by the heat transfer of the high heat transport device 330 in the third embodiment.

[0045] <Fourth embodiment> Hereinafter, a cooling device 401 according to a fourth embodiment of the present disclosure will be described with reference to Fig. 10. Configurations similar to those in the above-described embodiments will be given similar names and reference numerals, and descriptions thereof will be omitted as appropriate.

[0046] In this embodiment, as shown in FIG. 10, a cooling device 401 further includes a cooling unit 440 in addition to the same configuration as in the first embodiment.

[0047] (cooling section) The cooling unit 440 is disposed further outside the external cylinder 11. The cooling unit 440 is a device that externally cools the external cylinder 11. A specific example of the cooling unit 440 will be described below. The cooling unit 440 in this embodiment is a fan 441 that blows cooling air A onto the outer wall surface 11b of the outer cylinder 11. In the example shown in the figure, the fan 441 is disposed below the outer cylinder 11 and blows the cooling air A upward along the outer wall surface 11b. Therefore, the cooling air A flows along the fins 3 extending in the vertical direction Dv.

[0048] (Action and effect) In this embodiment, the cooling device 401 further includes a cooling section 440 that is disposed outside the outer tube 11 and cools the outer tube 11 from the outside.

[0049] This makes it possible to cool the external cylinder 11 that has been heated by heat exchange with the refrigerant R, and promotes heat dissipation from the external cylinder 11 via the external cylinder 11. Therefore, it is possible to further improve the cooling efficiency.

[0050] In this embodiment, the fan 441 is disposed below the outer cylinder 11 and blows the cooling air A upward, but the arrangement and blowing direction of the fan 441 can be changed as appropriate. For example, the fan 441 may be disposed side by side in the horizontal direction relative to the outer cylinder 11 so as to blow air horizontally relative to the outer cylinder 11. However, in this embodiment, by positioning the fan 441 so as to blow cooling air A from the vertical direction Dv toward the fins 3 extending in the vertical direction Dv, the cooling air A becomes more likely to flow along the outer wall surface 11b of the outer tube 11, thereby promoting heat dissipation of the refrigerant R through the outer tube 11 and the fins 3.

[0051] <Modification of the Fourth Embodiment> A modification of the fourth embodiment will be described with reference to FIG. As shown in FIG. 11, a cooling device 401A may include a spray 442 that sprays cooling water W onto the outer cylinder 11 instead of a fan 441 as a cooling section 440A. In the illustrated example, the sprays 442 are arranged side by side in the horizontal direction relative to the outer cylinder 11. The sprays 442 spray the cooling water W horizontally relative to the outer cylinder 11. Note that the arrangement of the sprays 442 and the direction in which the cooling water W is sprayed can be changed as appropriate.

[0052] <Fifth embodiment> Hereinafter, a cooling device 501 according to a fifth embodiment of the present disclosure will be described with reference to Fig. 12. Configurations similar to those in the above-described embodiments will be given similar names and reference numerals, and descriptions thereof will be omitted as appropriate.

[0053] In this embodiment, as shown in FIG. 12, a cooling device 501 may further include a cooling section 440 of the fourth embodiment in addition to the same configuration as in the second embodiment. The cooling unit 440 of this embodiment is a fan 441 that blows cooling air to the outer wall surface 11b of the outer cylinder 11, similarly to the fourth embodiment. As a result, the cooling device 501 can have a function of cooling the heat generating body 2 by the circulating flow of the refrigerant R in the second embodiment, and a function of cooling the outer cylinder 11 by the cooling section 440 in the fourth embodiment.

[0054] <Modification of the Fifth Embodiment> A modification of the fifth embodiment will be described with reference to FIG. As shown in FIG. 13, a cooling device 501A may include a spray 442 that sprays cooling water onto the outer cylinder 11 instead of a fan 441 as a cooling section 440A, similar to the modification of the fourth embodiment.

[0055] Sixth embodiment Hereinafter, a cooling device 601 according to a sixth embodiment of the present disclosure will be described with reference to Fig. 14. Configurations similar to those in the above-described embodiments will be given similar names and reference numerals, and descriptions thereof will be omitted as appropriate.

[0056] In this embodiment, as shown in FIG. 14, a cooling device 601 may further include the cooling section 440 of the fourth embodiment in addition to the same configuration as in the third embodiment. The cooling unit 440 of this embodiment is a fan 441 that blows cooling air to the outer wall surface 11b of the outer cylinder 11, similarly to the fourth embodiment. As a result, the cooling device 601 can have a function of cooling the heat generating body 2 by the high heat transport device 330 of the third embodiment, and a function of cooling the outer cylinder 11 by the cooling section 440 of the fourth embodiment.

[0057] <Modification of the Sixth Embodiment> A modification of the sixth embodiment will be described with reference to FIG. As shown in FIG. 15, a cooling device 601A may include a spray 442 that sprays cooling water onto the outer cylinder 11 instead of the fan 441 as a cooling section 440A, similar to the modification of the fourth embodiment.

[0058] (Other embodiments) Although the embodiments of the present disclosure have been described in detail above with reference to the drawings, the specific configuration is not limited to this embodiment, and design changes and the like that do not depart from the gist of the present disclosure are also included. In the above embodiment, the outer tube 11 is formed in a cylindrical shape, but this is not limited thereto. The shape of the outer tube 11 can be changed as appropriate. For example, the outer tube 11 may be formed in a prismatic shape.

[0059] In the above embodiment, the inner tube 20 is formed in a cylindrical shape, but this is not limited thereto. The shape of the inner tube 20 can be appropriately changed. For example, the inner tube 20 may be formed in a prismatic shape.

[0060] In the above embodiment, the cooling devices 1, 201, 301, 301A, 401, 401A, 501, 501A, 601, and 601A have been described using an example in which only one heat generating element 2 is provided in the housing 10 or 310, but the number of heat generating elements 2 can be changed as appropriate. For example, a plurality of heat generating elements 2 may be provided in the housing 10 or 310.

[0061] In the above embodiment, the fins 3 are formed in a flat plate shape extending in the up-down direction Dv, and a plurality of fins 3 are provided at equal intervals in the circumferential direction. However, the present invention is not limited to this. 16 and 17, the fin 3 may be formed in a flange shape that protrudes radially outward from the outer wall surface 11b of the outer tube 11 so as to surround the entire circumferential circumference of the outer tube 11. A plurality of such fins 3 are formed at intervals in the vertical direction Dv, for example. The interval between the fins 3 in the vertical direction Dv can be changed as appropriate. In addition, the cooling device 1 of the first embodiment has been described as having the fins 3 formed in a flange shape, but the second to sixth cooling devices 201, 301, 301A, 401, 401A, 501, 501A, 601, and 601A may be provided with the flange-shaped fins 3.

[0062] 18 and 19, the fins 3 may be formed in a protruding shape protruding radially outward from the outer wall surface 11b of the outer tube 11. For example, a plurality of such protruding fins 3 are formed at predetermined intervals over the entire outer wall surface 11b of the outer tube 11. The arrangement and number of the fins 3, the intervals between the fins 3, and the formation area of ​​the fins 3 can be changed as appropriate. In addition, the case where the fins 3 are formed in a protruding shape has been described using the cooling device 1 of the first embodiment as an example, but the second to sixth cooling devices 201, 301, 301A, 401, 401A, 501, 501A, 601, and 601A may be provided with the protruding fins 3.

[0063] In this way, the shape, number, and arrangement of the fins 3 can be changed as appropriate. Also, the fins 3 do not have to be provided on the outer cylinder 11. However, when the fins 3 are provided on the outer cylinder 11, it is advantageous in that the cooling performance is improved compared to when the fins 3 are not provided on the outer cylinder 11.

[0064] <Additional Notes> The cooling devices 1, 201, 301, 301A, 401, 401A, 501, 501A, 601, and 601A described in each embodiment can be understood, for example, as follows.

[0065] (1) The cooling device 1, 201, 301, 301A, 401, 401A, 501, 501A, 601, 601A of the first embodiment comprises a housing 10, 310 having an outer tube 11 extending in a vertical direction Dv, a bottom plate 12 closing the lower end of the outer tube 11, and a top plate 13, 313 closing the upper end of the outer tube 11 and forming an enclosed space within the outer tube 11 together with the bottom plate 12, an inner tube 20 extending in the vertical direction Dv inside the outer tube 11 to form an ascending flow path 21 on the inside and forming a descending flow path 22 that is annular between the inner tube 11 and connected to the ascending flow path 21 at its upper and lower ends, a heating element 2 provided inside the inner tube 20, and a refrigerant R sealed in the housing 10, 310. The heating element 2 may be, for example, a semiconductor chip such as a GPU or a CPU.

[0066] The refrigerant R heated by the heating element 2 inside the inner cylinder 20 becomes less dense and rises in the ascending flow path 21. When the refrigerant R reaches the upper end of the outer cylinder 11, it flows along the top plate 13, 313 and is guided to the inner wall surface 11a of the outer cylinder 11. The refrigerant R is cooled by the inner wall surface 11a, and a downward flow is generated. The refrigerant R descends in the descending flow path 22 due to the generated downward flow. The refrigerant R is cooled by the inner wall surface 11a while flowing through the descending flow path 22. The cooled refrigerant R is heated again by the heating element 2 and rises. In this way, the refrigerant R naturally circulates inside the housing 10, 310, and the heating element 2 is cooled.

[0067] (2) The cooling device 1, 201, 301, 301A, 401, 401A, 501, 501A, 601, 601A of the second embodiment is the cooling device 1, 201, 301, 301A, 401, 401A, 601A of the first embodiment, and the thermal conductivity of the outer cylinder 11 may be greater than the thermal conductivity of the top plate 13, 313.

[0068] As a result, the refrigerant R is more easily cooled by the outer cylinder 11 than by the top plate 13, 313, and a downward flow is more easily generated in the downward flow passage 22. Therefore, the refrigerant R is more easily circulated within the housings 10, 310.

[0069] (3) The cooling device 1, 201, 301A, 401, 401A, 501, 501A of the third embodiment may be the cooling device 1, 201, 301A, 401, 401A, 501, 501A of the first or second embodiment and may be provided with fins 3 protruding outward from the outer wall surface 11b of the outer cylinder 11.

[0070] This increases the surface area of ​​the outer wall surface 11b of the outer cylinder 11, facilitating heat dissipation.

[0071] (4) The cooling device 1, 301A, 401, 401A of a fourth embodiment may be the cooling device 1, 301A, 401, 401A of any one of the first to third embodiments, and the casing 10 may be filled with the single-phase refrigerant R1.

[0072] This stabilizes the flow of the refrigerant R1.

[0073] (5) A fifth aspect of the cooling device 201, 501, 501A is any one of the cooling devices 201, 501, 501A of the first to third aspects, wherein the liquid phase refrigerant R1 is stored in the lower part of the housing 10 and the gas phase refrigerant R2 is sealed in the upper part of the housing 10, and the heating element 2 may be immersed in the liquid phase refrigerant R1.

[0074] For example, if the heating element 2 suddenly generates heat, the liquid-phase refrigerant R1 stored in the housing 10 boils. This removes the heat of vaporization of the refrigerant R1 from the heating element 2, making it possible to suppress a sudden increase in temperature of the heating element 2.

[0075] (6) The cooling device 301, 301A, 601, 601A of the sixth aspect may be any one of the cooling devices 301, 301A, 601, 601A of the first to fifth aspects, and may further include a high-temperature heat transport device 330 provided within the outer tube 11, connecting the outer tube 11 and the heating element 2 and transferring heat from the heating element 2 to the outer tube 11. Examples of the high-temperature heat transport device 330 include a material with high thermal conductivity such as graphene, a heat pipe, and the like.

[0076] With the above configuration, the heat of the heating element 2 can be directly transferred to the external cylinder 11 via the high-temperature heat transport device 330 .

[0077] (7) The cooling device 401, 401A, 501, 501A, 601, 601A of the seventh aspect may be any one of the cooling devices 401, 401A, 501, 501A, 601, 601A of the first to sixth aspects, and may further include a cooling section 440, 440A installed outside the outer tube 11 and cooling the outer tube 11 from the outside.

[0078] This allows the external cylinder 11, which has been heated by heat exchange with the refrigerant R, to be cooled, and heat dissipation from the external cylinder 11 can be promoted.

[0079] (8) The cooling device 301, 301A, 601, 601A of the eighth aspect comprises a housing 10, 310 having an outer tube 11 extending in a vertical direction Dv, a heating element 2 provided inside the outer tube 11, and a high-temperature heat transport device 330 provided within the outer tube 11, connecting the outer tube 11 and the heating element 2 and transferring heat from the heating element 2 to the outer tube 11.

[0080] (9) The cooling device 601, 601A of a ninth aspect may be the cooling device 601, 601A of the eighth aspect, further comprising a cooling unit 440, 440A that is installed outside the external cylinder 11 and cools the external cylinder 11 from the outside. [Explanation of symbols]

[0081] REFERENCE SIGNS LIST 1...cooling device 2...heat generating element 10...casing 11...outer tube 11a...inner wall surface 11b...outer wall surface 12...bottom plate 13...top plate 20...inner tube 21...ascending flow path 22...descending flow path 3...fin Dv...vertical direction O...axis R, R1, R2...refrigerant 201...cooling device S...liquid level 301...cooling device 310...casing 313...top plate 330...high heat transport device 301A…Cooling device 401...cooling device 440...cooling section 441...fan A...cooling air 401A...cooling device 440A...cooling part 442...spray W...cooling water 501…Cooling device 501A…Cooling device 601...Cooling device 601A…Cooling device

Claims

1. a housing including an outer tube extending in a vertical direction, a bottom plate closing a lower end of the outer tube, and a top plate closing an upper end of the outer tube and forming an enclosed space within the outer tube together with the bottom plate; an inner tube extending vertically inside the outer tube to form an ascending flow passage therein, and forming a ring-shaped inner tube between the outer tube and the inner tube to form a descending flow passage connected at its upper and lower ends to the ascending flow passage; A heating element provided inside the inner cylinder; A refrigerant sealed in the housing; A cooling device comprising:

2. The cooling device of claim 1 , wherein the thermal conductivity of the outer cylinder is greater than the thermal conductivity of the top plate.

3. The cooling device according to claim 1 or 2, further comprising fins protruding outward from an outer wall surface of the outer cylinder.

4. The cooling device according to claim 1 or 2, wherein the housing is filled with a single-phase refrigerant.

5. The refrigerant in a liquid phase is stored in a lower portion of the housing, and the refrigerant in a gas phase is sealed in an upper portion of the housing, The cooling device according to claim 1 or 2, wherein the heating element is immersed in the refrigerant in a liquid phase.

6. The cooling device according to claim 1 or 2, further comprising a high-temperature heat transport device provided within the outer tube, connecting the outer tube and the heating element and transferring heat from the heating element to the outer tube.

7. The cooling device according to claim 1 , further comprising a cooling unit disposed outside the outer tube and configured to cool the outer tube from the outside.

8. A housing having an outer cylinder extending in a vertical direction; A heating element provided inside the outer cylinder; a high-temperature heat transport device provided in the outer tube, connecting the outer tube and the heating element and transferring heat from the heating element to the outer tube; A cooling device comprising:

9. The cooling device according to claim 8 , further comprising a cooling unit disposed outside the outer cylinder and configured to cool the outer cylinder from the outside.

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