Electronic apparatus

Abstract

To provide an electronic apparatus which can stabilize cooling performance for an electronic component even when changes of external environment has occurred, while improving the cooling performance for the electronic component.SOLUTION: An electronic apparatus comprises: a cooling plate 5; and an electronic component 6 fitted to the cooling plate 5. The electronic component 6 includes: a substrate 7 having a first bottom surface 7a and a first top surface 7b; and a heating component 8 which is fitted to the first bottom surface 7a or the first top surface 7b of the substrate 7. Inside the cooling plate 5, there is provided a cooling passage 5e where a cooling liquid 9 having a phase that does not change flows. The cooling plate 5 has a first wall 5a which is a portion of a wall surrounding the cooling passage 5e. The first wall 5a is provided with an opening 5h which brings the cooling passage 5e into communication with the outside of the cooling plate 5. The substrate 7 is fitted to the cooling plate 5 so as to close the opening 5h. When viewed along a direction from the first top surface 7b toward the first bottom surface 7a of the substrate 7, at least part of the heating component 8 and the opening 5h are located such that they overlap each other.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present disclosure relates to an electronic device that cools electronic components with a coolant. [Background technology]

[0002] In general electronic devices, in order to ensure that the semiconductor elements mounted on the electronic components operate stably below a specified temperature, a structure is adopted in which a gas or liquid cooling medium is applied to fins that are thermally connected to the semiconductor elements to cool the semiconductor elements.

[0003] In addition, electronic devices such as phased array antennas use an indirect liquid cooling method in which a TIM (Thermal Interface Material) is placed between the heat dissipation surface of an electronic component and a cooling plate with built-in fins, and the heat generated by the electronic component is transferred to the cooling plate via the TIM to cool the electronic component. Examples of TIM include thermal grease applied to the heat dissipation surface of an electronic component and the cooling plate, and rubber sandwiched between the heat dissipation surface of an electronic component and the cooling plate.

[0004] However, when an intermediate component such as a TIM is interposed between the electronic component and the cooling plate, the contact thermal resistance of the intermediate component and the resistance of the heat conduction of the intermediate component cause a problem of reduced cooling performance for the electronic component.

[0005] Known as a technique for solving such problems is the technique disclosed in Patent Document 1. The technique disclosed in Patent Document 1 is a direct liquid cooling technique that includes a liquid sealing means for sealing the electronic components with a cooling liquid having a boiling point lower than the allowable operating ambient temperature of the electronic components, and a cooling means for cooling the cooling liquid, and cools the electronic components by having the cooling liquid absorb and evaporate the heat generated by the electronic components. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] JP 2000-277961 A Summary of the Invention [Problem to be solved by the invention]

[0007] However, in the technology disclosed in Patent Document 1, since electronic components are cooled by utilizing the phase change of the coolant filled in the sealed space, the cooling performance for the electronic components is affected by changes in the external environment such as the attitude of the electronic device, vibration of the electronic device, impact to the electronic device, acceleration load acting on the electronic device, etc. This causes a problem that the cooling performance for the electronic components is not stable.

[0008] The present disclosure has been made in consideration of the above, and aims to obtain an electronic device that can improve the cooling performance for electronic components while stabilizing the cooling performance for electronic components even when changes occur in the external environment. [Means for solving the problem]

[0009] In order to solve the above-mentioned problems and achieve the object, the electronic device according to the present disclosure includes a cooling plate and an electronic component attached to the cooling plate. The electronic component includes a substrate having a first bottom surface attached to the cooling plate and a first top surface facing away from the first bottom surface, and a heat-generating component attached to the first bottom surface or the first top surface of the substrate. A cooling flow path through which a cooling liquid that does not change phase flows is provided inside the cooling plate. The cooling plate has a first wall that is a part of a wall surrounding the cooling flow path. The first wall has an opening that communicates the cooling flow path with the outside of the cooling plate. The substrate is attached to the cooling plate so as to close the opening. When viewed along a direction from the first top surface toward the first bottom surface of the substrate, the substrate is located at a position where at least a part of the heat-generating component overlaps with the opening. Effect of the Invention

[0010] The electronic device according to the present disclosure has an advantage in that it is possible to improve the cooling performance for electronic components, while stabilizing the cooling performance for electronic components even when changes occur in the external environment. [Brief description of the drawings]

[0011] [Figure 1] FIG. 1 is a perspective view showing a phased array antenna according to a first embodiment; [Diagram 2] FIG. 1 is a perspective view showing a slice according to a first embodiment; [Diagram 3] FIG. 1 is a perspective view showing a cooling plate according to a first embodiment; [Figure 4] FIG. 3 is a cross-sectional view showing the slice according to the first embodiment, taken along line IV-IV shown in FIG. [Diagram 5] FIG. 4 is a cross-sectional view showing a slice according to a second embodiment, which corresponds to a cross-sectional view taken along line IV-IV shown in FIG. [Figure 6] FIG. 4 is a cross-sectional view showing a slice according to a third embodiment, which corresponds to a cross-sectional view taken along line IV-IV shown in FIG. [Figure 7] FIG. 4 is a cross-sectional view showing a slice according to a fourth embodiment, which corresponds to a cross-sectional view taken along line IV-IV shown in FIG. [Figure 8] FIG. 11 is a cross-sectional view showing a slice according to a fifth embodiment, which corresponds to a cross-sectional view taken along line IV-IV shown in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] Hereinafter, electronic devices according to embodiments will be described in detail with reference to the drawings.

[0013] Embodiment 1 FIG. 1 is a perspective view showing a phased array antenna 1 according to the first embodiment. FIG. 2 is a perspective view showing a slice 4 according to the first embodiment. FIG. 3 is a perspective view showing a cooling plate 5 according to the first embodiment. FIG. 4 is a cross-sectional view showing a slice 4 according to the first embodiment, taken along line IV-IV shown in FIG. 2. In the following description, directions are described according to the X-axis direction, the Y-axis direction, and the Z-axis direction shown in FIG. 1. The X-axis direction, the Y-axis direction, and the Z-axis direction shown in FIG. 1 are perpendicular to each other. As shown in FIG. 1, the phased array antenna 1 includes a frame 2 and a plurality of blocks 3. Although not shown, the phased array antenna 1 includes an element feed layer having a plurality of antenna elements. The phased array antenna 1 is an electronic device mounted on a moving object such as an aircraft or a ship.

[0014] The frame 2 is a framework that houses the blocks 3. The frame 2 is generally lattice-shaped. The frame 2 is formed with a plurality of holes 2a in which the blocks 3 are arranged. The plurality of holes 2a are formed aligned in the Y-axis direction and the Z-axis direction. One block 3 is arranged in one hole 2a.

[0015] Each block 3 has at least a transmitting function. Each block 3 may also have a transmitting and receiving function. The block 3 is inserted into the hole 2a of the frame 2 along the direction indicated by the arrow A in FIG. 1. By disposing the block 3 in the hole 2a of the frame 2, the block 3 is individually connected to an antenna element in an element feeding layer (not shown), and electromagnetic waves can be radiated through the antenna element. Each block 3 includes a plurality of slices 4. The plurality of slices 4 are disposed inside the block 3.

[0016] 2, each slice 4 includes a cooling plate 5, an electronic component 6 attached to the cooling plate 5, and a circuit board 18 attached to the cooling plate 5. The electronic component 6 includes a substrate 7 and a heat-generating component 8 mounted on the substrate 7. When the electronic component 6 is driven, heat is generated from the heat-generating component 8. The substrate 7 and the heat-generating component 8 form a transmitting module having a transmitting function or a transmitting and receiving function.

[0017] The cooling plate 5 is a member for cooling the electronic components 6. As shown in FIG. 3, the cooling plate 5 has a rectangular plate shape. In this embodiment, there is one cooling plate 5 for each slice 4, but this number may be changed as appropriate. The thickness direction of the cooling plate 5 is parallel to the Z-axis direction. The cooling plate 5 has a first wall 5a, a second wall 5b, a first connecting surface 5c, and a second connecting surface 5d.

[0018] The first wall 5a and the second wall 5b are disposed apart from each other in the Z-axis direction. The first wall 5a and the second wall 5b are walls parallel to the XY plane. A first bottom surface 7a of the substrate 7 shown in FIG. 2 is attached to the first wall 5a. The first connecting surface 5c and the second connecting surface 5d are disposed apart from each other in the Y-axis direction. The first connecting surface 5c and the second connecting surface 5d are surfaces parallel to the XZ plane. The first connecting surface 5c connects one end of the first wall 5a and the second wall 5b in the Y-axis direction. The second connecting surface 5d connects the other end of the first wall 5a and the second wall 5b in the Y-axis direction.

[0019] As shown in FIG. 4, a cooling flow passage 5e is provided inside the cooling plate 5, through which a cooling liquid 9 that does not change phase flows. An arrow B in FIG. 4 indicates the direction in which the cooling liquid 9 flows. The cooling liquid 9 is, for example, an ethylene glycol aqueous solution. The cooling flow passage 5e is provided between a first wall 5a and a second wall 5b. Each of the first wall 5a and the second wall 5b is a part of a wall that surrounds the cooling flow passage 5e. The second wall 5b is located on the opposite side of the cooling flow passage 5e to the first wall 5a.

[0020] The first connecting surface 5c has an inlet 5f for allowing the cooling liquid 9 to flow into the cooling flow passage 5e. The second connecting surface 5d has an outlet 5g for allowing the cooling liquid 9 to be discharged from the cooling flow passage 5e. The cooling liquid 9 supplied to the cooling plate 5 from a cooling device (not shown) installed outside the phased array antenna 1 flows into the cooling flow passage 5e from the inlet 5f. The cooling liquid 9 that flows into the cooling flow passage 5e from the inlet 5f flows through the cooling flow passage 5e in the + direction of the Y axis direction and is discharged from the outlet 5g to the outside of the cooling flow passage 5e. A distribution manifold (not shown) is installed on the bottom surface of the frame 2 shown in FIG. 1, and a confluence manifold (not shown) is installed on the top surface or both side surfaces of the frame 2. The bottom surface of the frame 2 is the surface of the frame 2 facing the - side of the Y axis. The top surface of the frame 2 is the surface of the frame 2 facing the + side of the Y axis. Both side surfaces of the frame 2 are surfaces facing the + and - sides of the Z axis of the frame 2. The coolant 9 shown in Fig. 4 passes through the cooling flow passage 5e via a distribution manifold, and is then discharged to the outside of the phased array antenna 1 via a merging manifold. The coolant 9 is circulated between the cooling device and the phased array antenna 1 by a pump of a cooling device (not shown) installed outside the phased array antenna 1.

[0021] The first wall 5a is provided with openings 5h that communicate the cooling channels 5e with the outside of the cooling plate 5. As shown in FIG. 3, the number of openings 5h is four per slice 4 in this embodiment, but may be changed as appropriate. The four openings 5h are arranged in a line in the Y-axis direction. The four openings 5h are arranged apart from each other. The dashed lines in FIG. 3 diagrammatically show a part of the wall surrounding the cooling channels 5e.

[0022] 2, the number of substrates 7 is two per slice 4 in this embodiment, but may be changed as appropriate. The two substrates 7 are arranged side by side in the Y-axis direction. The thickness direction of the substrate 7 is parallel to the thickness direction of the cooling plate 5 and the Z-axis direction.

[0023] 4, the substrate 7 has a first bottom surface 7a attached to the cooling plate 5 and a first top surface 7b facing away from the first bottom surface 7a. The substrate 7 is attached to the cooling plate 5 so as to cover the opening 5h. The first bottom surface 7a of the substrate 7 is attached to the first wall 5a of the cooling plate 5.

[0024] The first bottom surface 7a of the substrate 7 is covered with a coating film 12 having corrosion resistance against the coolant 9. The coating film 12 needs to cover at least a portion of the first bottom surface 7a facing the opening 5h. In other words, the coating film 12 needs to cover at least a portion of the first bottom surface 7a that comes into contact with the coolant 9. The coating film 12 is, for example, a metal plating film that covers a copper pattern formed on the first bottom surface 7a.

[0025] 2 is, for example, a semiconductor element such as a power semiconductor. The heat generating components 8 are attached to the first top surface 7b of the substrate 7. The number of heat generating components 8 per slice 4 is eight in this embodiment, but may be changed as appropriate. The eight heat generating components 8 are arranged spaced apart from each other in the X-axis direction and the Y-axis direction.

[0026] The heat generating component 8 includes a first heat generating component 81 and a second heat generating component 82 that is one size smaller than the first heat generating component 81. In this embodiment, four first heat generating components 81 and four second heat generating components 82 are provided for one slice 4. The four first heat generating components 81 are arranged in a line in the Y-axis direction. The four second heat generating components 82 are arranged in a line in the Y-axis direction. The first heat generating component 81 and the second heat generating component 82 are arranged apart from each other in the X-axis direction. The first heat generating component 81 and the second heat generating component 82 are arranged offset from each other in the Y-axis direction.

[0027] 4, the heat-generating component 8 has a second bottom surface 8a, a second top surface 8b, and a side surface 8c. The second bottom surface 8a is a surface that is attached to the substrate 7. The second top surface 8b is a surface that faces away from the second bottom surface 8a. The side surface 8c is a surface that connects the second bottom surface 8a and the second top surface 8b.

[0028] When viewed in the direction from the first top surface 7b to the first bottom surface 7a of the substrate 7, at least a part of the heat generating component 8 and the opening 5h overlap. In this embodiment, when viewed in the direction from the first top surface 7b to the first bottom surface 7a of the substrate 7, a part of the first heat generating component 81 and the opening 5h overlap, but the entire first heat generating component 81 and the opening 5h may overlap.

[0029] A groove 5i is formed in the first wall 5a, surrounding the periphery of the opening 5h. A sealant 10 that provides a liquid-tight seal between the substrate 7 and the cooling plate 5 is disposed in the groove 5i. The sealant 10 is disposed between the first bottom surface 7a of the substrate 7 and the first wall 5a of the cooling plate 5 in a compressed state in the Z-axis direction, and is in contact with the first bottom surface 7a of the substrate 7 and the first wall 5a of the cooling plate 5. The sealant 10 is, for example, a gasket or an O-ring.

[0030] In the first wall 5a, an accommodation hole 5j is formed at a position away from the opening 5h and the groove 5i in the Y-axis direction. A heat transfer member 11 is disposed in the accommodation hole 5j. The heat transfer member 11 is, for example, a heat dissipation sheet. The heat transfer member 11 is in contact with the first bottom surface 7a of the substrate 7. The heat transfer member 11 serves to transfer heat from the substrate 7 to the cooling plate 5.

[0031] When viewed from the first top surface 7b to the first bottom surface 7a of the substrate 7, at least a part of the second heat generating component 82 and the heat transfer member 11 overlap. In this embodiment, when viewed from the first top surface 7b to the first bottom surface 7a of the substrate 7, the entire second heat generating component 82 and the heat transfer member 11 overlap, but it is sufficient that at least a part of the second heat generating component 82 and the heat transfer member 11 overlap. In reality, the accommodation hole 5j, the heat transfer member 11, and the second heat generating component 82 are located further back than the first heat generating component 81, but in FIG. 4, for convenience of explanation, the accommodation hole 5j, the heat transfer member 11, and the second heat generating component 82 are illustrated at the same position as the first heat generating component 81. In addition, in FIG. 3, the groove 5i, the accommodation hole 5j, the sealing material 10, and the heat transfer member 11 are omitted.

[0032] Due to restrictions on placement, it may not be possible to form the openings 5h at positions overlapping with each of the heat-generating components 8. In such a case, the heat transfer member 11 may be disposed between the electronic components 6 and the cooling plate 5 at a position overlapping with some of the heat-generating components 8 when viewed along a direction from the first top surface 7b toward the first bottom surface 7a of the substrate 7, thereby indirectly cooling the electronic components 6. In other words, a direct liquid cooling method for directly cooling the electronic components 6 and an indirect liquid cooling method for indirectly cooling the electronic components 6 may be used in combination.

[0033] As shown in FIG. 2, the circuit board 18 is a component that has a function of distributing and supplying power and control signals to the multiple boards 7 and the multiple heat-generating components 8. The circuit board 18 is electrically connected to the electronic components 6. The circuit board 18 is arranged side by side with the electronic components 6 in the X-axis direction. The circuit board 18 is attached to the first wall 5a of the cooling plate 5. In this embodiment, the number of circuit boards 18 is one per slice 4, but may be changed as appropriate. The thickness direction of the circuit board 18 is parallel to the thickness direction of the cooling plate 5 and the Z-axis direction.

[0034] Next, the effects of the phased array antenna 1 according to this embodiment will be described.

[0035] 4, in this embodiment, heat generated in heat generating components 8 of electronic component 6 is transferred from substrate 7 to cooling plate 5, and the heat transferred to cooling plate 5 is absorbed by cooling liquid 9 flowing in cooling flow path 5e. Therefore, electronic component 6 is cooled.

[0036] 4, in this embodiment, the phased array antenna 1 includes a cooling plate 5 and an electronic component 6 attached to the cooling plate 5. In this embodiment, the electronic component 6 includes a substrate 7 having a first bottom surface 7a attached to the cooling plate 5 and a first top surface 7b facing away from the first bottom surface 7a, and a heat-generating component 8 attached to the first top surface 7b of the substrate 7. With this configuration, no intermediate component such as a TIM is interposed between the electronic component 6 and the cooling plate 5, and therefore the contact thermal resistance and the resistance of heat conduction can be reduced to improve the cooling performance for the electronic component 6 compared to the case where an intermediate component is interposed.

[0037] In this embodiment, as shown in FIG. 4, the cooling plate 5 has a first wall 5a which is a part of the wall surrounding the cooling flow path 5e, and the first wall 5a has an opening 5h which communicates the cooling flow path 5e with the outside of the cooling plate 5. In this embodiment, the substrate 7 is attached to the cooling plate 5 so as to block the opening 5h. With these configurations, the cooling liquid 9 contacts the substrate 7 through the opening 5h, so that the cooling performance for the electronic components 6 can be improved. In this embodiment, when viewed along the direction from the first top surface 7b to the first bottom surface 7a of the substrate 7, at least a part of the heat generating component 8 and the opening 5h are overlapped. With this configuration, the heat generating component 8 can be brought close to the part of the substrate 7 that contacts the cooling liquid 9, so that the heat generated by the heat generating component 8 can be efficiently absorbed by the cooling liquid 9, and the cooling performance for the electronic components 6 can be improved.

[0038] When the phased array antenna 1 is mounted on a moving object whose attitude changes, such as an aircraft or a ship, changes in the external environment occur, such as the attitude of the phased array antenna 1, vibration of the phased array antenna 1, impact on the phased array antenna 1, and acceleration load acting on the phased array antenna 1. In such a case, if the electronic components are cooled using a phase-changing coolant as in Patent Document 1, the cooling performance for the electronic components is affected by the change in the external environment. This causes a problem that the cooling performance for the electronic components is not stable. In this regard, in the present embodiment, as shown in FIG. 4, the cooling performance for the electronic components 6 can be stabilized even when the above-mentioned change in the external environment occurs by flowing the cooling liquid 9 that does not change phase through the cooling flow path 5e. Therefore, in the present embodiment, the cooling performance for the electronic components 6 can be stabilized even when the change in the external environment occurs while improving the cooling performance for the electronic components 6. Note that, in the present embodiment, the cooling liquid 9 does not change phase because the structure is such that the cooling liquid 9 passes through the cooling flow path 5e and circulates. If the cooling liquid 9 changes phase, if the cooling liquid 9 that has changed into a gas phase enters the circulation pump, a problem occurs in that the pump malfunctions, breaks down, or the like. Furthermore, if a cooling liquid 9 that changes phase at a desired temperature is used, there is a problem that there are restrictions on the type of cooling liquid 9. In this regard, in the present embodiment, the cooling liquid 9 does not change phase, so that the occurrence of the above two problems can be suppressed.

[0039] 4, the first bottom surface 7a of the substrate 7 is covered with a coating film 12 that is resistant to corrosion by the coolant 9. With this configuration, it is possible to prevent corrosion of the first bottom surface 7a of the substrate 7 due to contact with the coolant 9.

[0040] 4, in the present embodiment, a groove 5i surrounding the periphery of the opening 5h is formed in the first wall 5a, and a sealant 10 that seals between the substrate 7 and the cooling plate 5 is disposed in the groove 5i. This configuration ensures liquid-tightness between the substrate 7 and the cooling plate 5 at the opening 5h, and prevents a short circuit between the substrate 7 and the heat-generating component 8 due to the cooling liquid 9.

[0041] Next, a modification of the first embodiment will be described.

[0042] In this embodiment, the direct liquid cooling method for directly cooling the electronic components 6 and the indirect liquid cooling method for indirectly cooling the electronic components 6 are used in combination, but only the direct liquid cooling method may be used. When only the direct liquid cooling method is used, the accommodation hole 5j and the heat transfer member 11 shown in FIG. 4 are omitted. Also, when viewed along the direction from the first top surface 7b to the first bottom surface 7a of the substrate 7, an opening 5h may be provided separately at a position where the cooling plate 5 overlaps with the second heat generating component 82, or a single opening 5h may be provided at a position where the cooling plate 5 overlaps with both the first heat generating component 81 and the second heat generating component 82. In either case, it is preferable to form a groove 5i surrounding the periphery of the opening 5h and place the sealant 10 in the groove 5i.

[0043] Embodiment 2 Next, a phased array antenna 1A according to a second embodiment will be described with reference to FIG. 5. FIG. 5 is a cross-sectional view showing a slice 4 according to the second embodiment, and corresponds to a cross-sectional view taken along line IV-IV shown in FIG. 2. This embodiment differs from the first embodiment in that a heat-generating component 8 is attached to the first bottom surface 7a of the substrate 7 and disposed in the opening 5h, and that the heat-generating component 8 is covered with a coating film 13 that is waterproof against the cooling liquid 9. In the second embodiment, the same reference numerals are used for parts that overlap with those in the first embodiment, and description thereof will be omitted.

[0044] The heat-generating component 8 is attached to the first bottom surface 7a of the substrate 7. The second bottom surface 8a of the heat-generating component 8 is attached to the first bottom surface 7a of the substrate 7. The second top surface 8b of the heat-generating component 8 serves as a heat dissipation surface.

[0045] The first heat generating component 81 is disposed within the opening 5h. At the corner formed between the first heat generating component 81 and the substrate 7, a fillet 17 is formed by a sealing material. The first heat generating component 81 and the substrate 7 are covered with a coating film 13 having waterproofing properties against the coolant 9. The coating film 13 covers the second top surface 8b and the side surface 8c of the first heat generating component 81. The coating film 13 covers the first bottom surface 7a of the substrate 7. In detail, the coating film 13 covers a portion of the first bottom surface 7a of the substrate 7 facing the opening 5h, and covers a portion of the first bottom surface 7a of the substrate 7 excluding a portion where the first heat generating component 81 is attached and a portion where the fillet 17 is formed. The coating film 13 covers the fillet 17. The coating film 13 is, for example, a paraxylene coating film. The thickness of coating film 13 is preferably thin so as not to affect the heat dissipation performance of substrate 7 and heat-generating component 8.

[0046] The second heat generating component 82 is disposed in the accommodation hole 5j together with the heat transfer member 11. The second heat generating component 82 is in contact with the cooling plate 5 via the heat transfer member 11. The heat transfer member 11 plays a role in transferring heat from the second heat generating component 82 to the cooling plate 5.

[0047] Next, the effects of the phased array antenna 1A according to this embodiment will be described.

[0048] In this embodiment, the same effects as those of the first embodiment can be achieved. In addition, in this embodiment, the first heat-generating component 81 is attached to the first bottom surface 7a of the substrate 7 and disposed in the opening 5h. With this configuration, the first heat-generating component 81 and the cooling liquid 9 come into contact with each other without the substrate 7, so that the cooling effect on the first heat-generating component 81 can be improved. In addition, in this embodiment, the first heat-generating component 81 is covered with a coating film 13 that is waterproof against the cooling liquid 9. With this configuration, it is possible to prevent the first heat-generating component 81 from being short-circuited by the cooling liquid 9.

[0049] In addition, at least one of the first heat-generating component 81 and the second heat-generating component 82 may be attached to the first bottom surface 7a of the substrate 7, placed within the opening 5h, and covered with a coating film 13 that is waterproof against the cooling liquid 9.

[0050] Embodiment 3 Next, a phased array antenna 1B according to a third embodiment will be described with reference to Fig. 6. Fig. 6 is a cross-sectional view showing a slice 4 according to the third embodiment, and corresponds to a cross-sectional view taken along line IV-IV shown in Fig. 2. In this embodiment, in addition to the configuration of the second embodiment, a heat sink 14 is attached to the heat generating component 8, and the heat sink 14 is covered with a coating film 15 having waterproofing against the cooling liquid 9. In the third embodiment, the same reference numerals are used for parts that overlap with the first and second embodiments, and description thereof will be omitted.

[0051] A heat sink 14 disposed in the cooling flow path 5e is attached to the second top surface 8b of the first heat generating component 81. The heat sink 14 serves to transfer heat generated in the first heat generating component 81 to the cooling liquid 9. The heat sink 14 has a plurality of cooling fins 14a. The plurality of cooling fins 14a are arranged at intervals from each other in the flow direction of the cooling liquid 9. The surface of the heat sink 14 is covered with a coating film 15 having waterproofing against the cooling liquid 9. In addition to the heat sink 14, the coating film 15 covers the side surface 8c of the first heat generating component 81, the first bottom surface 7a of the substrate 7, and the fillet 17. The portion of the first bottom surface 7a of the substrate 7 that is covered with the coating film 15 is the same as the portion of the first bottom surface 7a of the substrate 7 that is covered with the coating film 13 in the second embodiment. The coating film 15 is, for example, a paraxylene coating film. The coating film 15 is preferably thin so as not to affect the heat dissipation performance of the heat sink 14 .

[0052] Next, the effects of the phased array antenna 1B according to this embodiment will be described.

[0053] In this embodiment, the same effects as those of the first and second embodiments can be achieved. In this embodiment, the first heat generating component 81 is attached with a heat sink 14 disposed in the cooling flow path 5e. This configuration increases the heat dissipation area of ​​the first heat generating component 81, thereby improving the cooling effect on the first heat generating component 81. In this embodiment, the surface of the heat sink 14 is covered with a coating film 15 that is waterproof against the cooling liquid 9. This configuration prevents the first heat generating component 81 from being short-circuited by the cooling liquid 9.

[0054] At least one of the first heat generating component 81 and the second heat generating component 82 may be attached to the first bottom surface 7a of the substrate 7, disposed within the opening 5h, and equipped with the heat sink .

[0055] Embodiment 4 Next, a phased array antenna 1C according to a fourth embodiment will be described with reference to Fig. 7. Fig. 7 is a cross-sectional view showing a slice 4 according to the fourth embodiment, and corresponds to a cross-sectional view taken along line IV-IV shown in Fig. 2. This embodiment differs from the second embodiment in that the substrate 7 is covered with a coating film 12 having corrosion resistance against the coolant 9, and that the heat generating component 8 is covered with a metal plating film 16. In the fourth embodiment, the same reference numerals are used for parts that overlap with the first and second embodiments, and descriptions thereof will be omitted.

[0056] The substrate 7 is covered with a coating film 12 that is resistant to corrosion by the coolant 9. The coating film 12 covers the first bottom surface 7a of the substrate 7. More specifically, the coating film 12 covers a portion of the first bottom surface 7a of the substrate 7 that faces the opening 5h, and covers a portion of the first bottom surface 7a of the substrate 7 excluding a portion where the first heat generating component 81 is attached and a portion where the fillet 17 is formed. The coating film 12 covers the fillet 17.

[0057] The first heat generating component 81 is covered with a metal plating film 16. The metal plating film 16 covers the second top surface 8b and the side surface 8c of the first heat generating component 81.

[0058] Next, the effects of the phased array antenna 1C according to this embodiment will be described.

[0059] This embodiment can achieve the same effects as those of the above-described embodiments 1 and 2. In addition, in this embodiment, the second top surface 8b and the side surface 8c of the first heat-generating component 81 are covered with the metal plating film 16. With this configuration, not only the second top surface 8b but also the side surface 8c of the first heat-generating component 81 become heat dissipation surfaces, so that the heat dissipation area of ​​the first heat-generating component 81 can be enlarged, and the cooling effect on the first heat-generating component 81 can be improved.

[0060] In addition, at least one of the first heat-generating component 81 and the second heat-generating component 82 may be attached to the first bottom surface 7a of the substrate 7, positioned within the opening 5h, and have a second top surface 8b and a side surface 8c covered with the metal plating coating 16.

[0061] Embodiment 5. Next, a phased array antenna 1D according to a fifth embodiment will be described with reference to Fig. 8. Fig. 8 is a cross-sectional view showing a slice 4 according to the fifth embodiment, which corresponds to a cross-sectional view taken along line IV-IV shown in Fig. 2. This embodiment differs from the first embodiment in that, in addition to the configuration of the second embodiment, a protrusion 5k protruding toward the inside of the cooling flow passage 5e is provided on the second wall 5b. In the fifth embodiment, the same reference numerals are used for parts that overlap with the first and second embodiments, and descriptions thereof will be omitted.

[0062] The second wall 5b is provided with a protrusion 5k that protrudes toward the inside of the cooling flow path 5e. The shape of the protrusion 5k is rectangular in this embodiment, but may be changed as appropriate. When viewed along the direction from the first top surface 7b toward the first bottom surface 7a of the substrate 7, the protrusion 5k is located at a position where at least a part of the first heat generating component 81 overlaps with the protrusion 5k. The portion of the cooling flow path 5e between the first heat generating component 81 and the protrusion 5k is the narrowest in the cooling flow path 5e.

[0063] Next, the effects of the phased array antenna 1D according to this embodiment will be described.

[0064] In this embodiment, the same effects as those of the first and second embodiments can be achieved. In addition, in this embodiment, the second wall 5b is provided with a protrusion 5k that protrudes toward the inside of the cooling flow path 5e, and when viewed along a direction from the first top surface 7b to the first bottom surface 7a of the substrate 7, the protrusion 5k is located at a position where at least a part of the first heat generating component 81 overlaps with the protrusion 5k. With this configuration, the portion of the cooling flow path 5e between the first heat generating component 81 and the protrusion 5k becomes narrow, so that the flow rate of the cooling liquid 9 increases. Then, by bringing the cooling liquid 9 with an increased flow rate into contact with the first heat generating component 81, the convection heat transfer coefficient between the first heat generating component 81 and the cooling liquid 9 can be increased, so that the cooling effect on the first heat generating component 81 can be improved.

[0065] At least one of the first heat-generating component 81 and the second heat-generating component 82 is attached to the first bottom surface 7a of the substrate 7 and positioned within the opening 5h, and is positioned so as to overlap with the protrusion 5k when viewed along the direction from the first top surface 7b to the first bottom surface 7a of the substrate 7.

[0066] The electronic device to be cooled is not limited to the phased array antennas 1, 1A, 1B, 1C, and 1D, as long as the electronic device has a structure in which a coolant is supplied to cool electronic components. For example, the present disclosure can be applied to electronic devices that generate high heat, such as high-performance PCs (Personal Computers) and servers.

[0067] The configurations shown in the above embodiments are merely examples, and may be combined with other known technologies, or the embodiments may be combined with each other. Also, parts of the configurations may be omitted or modified without departing from the spirit of the invention.

[0068] Various aspects of the present disclosure are summarized below as appendices.

[0069] (Appendix 1) A cooling plate; An electronic component attached to the cooling plate; Equipped with The electronic component includes: a substrate having a first bottom surface attached to the cooling plate and a first top surface facing away from the first bottom surface; a heat generating component attached to the first bottom surface or the first top surface of the substrate; Including, A cooling flow passage through which a cooling liquid that does not change phase flows is provided inside the cooling plate, the cooling plate has a first wall that forms part of a wall surrounding the cooling passage; The first wall has an opening that communicates the cooling flow path with the outside of the cooling plate, the substrate is attached to the cooling plate so as to cover the opening; An electronic device characterized in that, when viewed along a direction from the first top surface to the first bottom surface of the substrate, at least a portion of the heat-generating component and the opening are positioned so as to overlap with each other. (Appendix 2) The electronic device described in Appendix 1, characterized in that the first bottom surface of the substrate is covered with a coating film that is corrosion-resistant to the cooling liquid. (Appendix 3) The first wall has a groove formed therein surrounding the opening, 3. The electronic device described in claim 1 or 2, wherein a sealing material is disposed in the groove to seal between the substrate and the cooling plate. (Appendix 4) the heat generating component is attached to the first bottom surface of the substrate and disposed within the opening; 4. The electronic device according to claim 1, wherein the heat-generating component is covered with a coating film that is waterproof against the cooling liquid. (Appendix 5) a heat sink disposed within the cooling flow path is attached to the heat generating component; The electronic device described in Appendix 4, wherein a surface of the heat sink is covered with a coating film that is waterproof against the cooling liquid. (Appendix 6) the heat generating component is attached to the first bottom surface of the substrate and disposed within the opening; the heat generating component has a second bottom surface attached to the board, a second top surface facing away from the second bottom surface, and a side surface connecting the second bottom surface and the second top surface; 4. The electronic device according to claim 1, wherein the second top surface and the side surface are covered with a metal plating film. (Appendix 7) the cooling plate has a second wall that is a part of a wall surrounding the cooling flow passage and is located on the opposite side of the cooling flow passage from the first wall, The second wall is provided with a protrusion protruding into the cooling flow passage, The electronic device described in any one of appendixes 1 to 6, characterized in that at least a portion of the heat-generating component and the protrusion are positioned so as to overlap when viewed along a direction from the first top surface to the first bottom surface of the substrate. [Explanation of symbols]

[0070] 1, 1A, 1B, 1C, 1D phased array antenna, 2 frame, 2a hole, 3 block, 4 slice, 5 cooling plate, 5a first wall, 5b second wall, 5c first connecting surface, 5d second connecting surface, 5e cooling flow path, 5f inlet, 5g outlet, 5h opening, 5i groove, 5j accommodation hole, 5k protrusion, 6 electronic component, 7 board, 7a first bottom surface, 7b first top surface, 8 heat generating component, 8a second bottom surface, 8b second top surface, 8c side, 9 coolant, 10 sealing material, 11 heat transfer member, 12, 13, 15 coating film, 14 heat sink, 14a cooling fin, 16 metal plating film, 17 fillet, 18 circuit board, 81 first heat generating component, 82 second heat generating component.

Claims

1. A cooling plate; An electronic component attached to the cooling plate; Equipped with The electronic component includes: a substrate having a first bottom surface attached to the cooling plate and a first top surface facing away from the first bottom surface; a heat generating component attached to the first bottom surface or the first top surface of the substrate; Including, A cooling flow passage is provided inside the cooling plate, through which a cooling liquid that does not change phase flows, The cooling plate has a first wall that forms part of a wall surrounding the cooling passage; an opening is formed in the first wall, the opening communicating the cooling passage with the outside of the cooling plate; the substrate is attached to the cooling plate so as to cover the opening; an electronic device, characterized in that, when viewed along a direction from the first top surface to the first bottom surface of the substrate, at least a portion of the heat-generating component and the opening are positioned so as to overlap with each other.

2. 2. The electronic device according to claim 1, wherein the first bottom surface of the substrate is covered with a coating film having corrosion resistance against the cooling liquid.

3. The first wall has a groove formed therein surrounding the opening, 2. The electronic device according to claim 1, wherein a sealant for sealing between the substrate and the cooling plate is disposed in the groove.

4. the heat generating component is attached to the first bottom surface of the substrate and disposed within the opening; 2. The electronic device according to claim 1, wherein the heat generating component is covered with a coating film that is waterproof against the cooling liquid.

5. a heat sink disposed within the cooling flow path is attached to the heat generating component; 5. The electronic device according to claim 4, wherein a surface of the heat sink is covered with a coating film that is waterproof against the cooling liquid.

6. the heat generating component is attached to the first bottom surface of the substrate and disposed within the opening; the heat generating component has a second bottom surface attached to the board, a second top surface facing away from the second bottom surface, and a side surface connecting the second bottom surface and the second top surface; The electronic device according to claim 1 , wherein the second top surface and the side surface are covered with a metal plating film.

7. the cooling plate has a second wall that is a part of a wall surrounding the cooling flow passage and is located on the opposite side of the cooling flow passage from the first wall, The second wall is provided with a protrusion protruding into the cooling flow passage, 2. The electronic device according to claim 1, wherein at least a portion of the heat generating component and the protrusion are positioned so as to overlap when viewed in a direction from the first top surface to the first bottom surface of the substrate.

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