Lighting module and lighting device comprising the same

By using at least two light sources and a photon conversion layer in the lamp, combined with the phosphor layer, light emission of three colors is achieved, which solves the problem of difficulty in realizing multi-color light design in the prior art and improves the light efficiency and light distribution characteristics.

JP2025072651AActive Publication Date: 2025-05-09LG INNOTEK CO LTD
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Patent Information

Application Number
JP2025024346
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2020-03-09
Filing Date
2025-02-18
Publication Date
2025-05-09
Estimated Expiration
2041-03-08

AI Technical Summary

Technical Problem

The prior art is difficult to realize the design of multi-color light, especially while maintaining the consistency of light and color, it is difficult to achieve the effect of multi-color light.

Method used

By using at least two light sources in the lamp, including a first light source covering the vertical direction of the light emitting region and a second light source not covering, combined with the photon conversion layer and the phosphorescent layer, light emission of three colors is achieved.

Benefits of technology

It realizes the provision of different colors of light sources in the same light emitting area, improves the light efficiency and light distribution characteristics, reduces color differences, and improves the optical reliability of the optical module.

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Abstract

To provide: a lighting module that provides light of different colors; and a lighting device, a light unit or a vehicle lamp that has the lighting module.SOLUTION: A lighting module 100 includes: a circuit board 11; a plurality of first light emitting devices 21 disposed on a first region of the circuit board; a plurality of second light emitting devices 31 disposed on a second region of the circuit board; a resin layer 41, 43 including a first resin portion 41 for sealing the first light emitting devices and a second resin portion 43 for sealing the second light emitting devices; a phosphor portion 45 disposed between the first and second resin portions; a diffusion layer 51 disposed on the first resin portion; and a reflective layer 61 disposed on an upper surface and an outer side surface of the second resin portion.SELECTED DRAWING: Figure 2
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Description

[Technical field]

[0001] An embodiment of the invention relates to a lighting module that provides different colors of light.

[0002] An embodiment of the invention is a lighting device, a light unit or a vehicle lamp having a lighting module. This is about the pool. [Background technology]

[0003] Light-emitting diodes (LEDs) consume less power and are semi-permanent compared to existing light sources such as fluorescent lamps and incandescent lamps. Such light emitting devices have the advantages of long life, fast response speed, safety, and environmental friendliness. The LEDs are applied to various display devices and various lighting devices such as indoor and outdoor lights. A lamp that uses a light-emitting element has been proposed as a light source for vehicles. The light-emitting element has the advantage of being low in power consumption. The small size allows greater freedom in lamp design, and the semi-permanent lifespan It's also economical. Summary of the Invention [Problem to be solved by the invention]

[0004] An embodiment of the invention can provide a lighting module that provides multiple color lights.

[0005] An embodiment of the invention includes a first light emitting element vertically overlapping the light emitting region, and a second light emitting element vertically overlapping the light emitting region. Lighting module capable of selectively emitting light from a second light-emitting element not overlapping in a direction - Patents.com An embodiment of the invention can provide at least two light sources. The present invention provides a lighting module capable of emitting light of three colors. Examples include a lighting module that irradiates surface light of different colors, a lighting device having the same, and a light unit. It is possible to provide a light source, a liquid crystal display device, or a vehicle lamp. [Means for solving the problem]

[0006] The lighting module according to an embodiment of the invention includes a circuit board and a light source disposed on a first region of the circuit board. a plurality of first light emitting elements disposed on the second region of the circuit board; a first resin portion that seals the optical element, the first light emitting elements, and the second light emitting elements; a resin layer including a second resin portion for sealing a semiconductor device; a phosphor portion formed on the upper surface of the first resin portion; a diffusion layer formed on the upper surface of the second resin portion; and a reflective layer disposed on an outer surface thereof, Each of the light elements has at least one row in a first direction and a second row perpendicular to the first direction. The second resin portion is arranged in two directions, and the width of the second resin portion in the first direction is smaller than the width of the first resin portion. It's okay.

[0007] According to an embodiment of the present invention, the first light emitting device comprises a first light emitting chip for emitting blue light; a wavelength conversion layer disposed on a surface of the first light emitting chip, the first light emitting chip emitting white light; According to an embodiment of the invention, the second light emitting element emits blue light, The phosphor portion covers the space between the first resin portion and the second resin portion and emits red or yellow light. According to another embodiment of the invention, a lighting module includes a circuit board and a A plurality of first light emitting elements are disposed on a first region of a circuit board, and a second light emitting element is disposed on a second region of the circuit board. a first resin portion that seals the plurality of first light-emitting elements; a resin layer including a second resin portion sealing the plurality of second light emitting elements; a phosphor layer disposed on the second resin portion; an ink layer disposed on the phosphor layer; a reflective layer disposed on an upper surface and an outer surface, Each of the second light emitting elements has at least one row in a first direction and is perpendicular to the first direction. the second resin portion is arranged in a second direction in which the first and second resin portions are aligned, and the width of the second resin portion in the first direction is greater than the width of the first resin portion. According to an embodiment of the invention, the first light emitting device emits blue light, and the The second light emitting element includes a second light emitting chip that emits blue light and a second light emitting chip disposed on a surface of the second light emitting chip. The second light emitting element can emit white light. According to an embodiment, the phosphor layer includes a red phosphor, and the ink layer includes red ink particles. The width of the first resin portion in the first direction may be greater than the width of the second resin portion in the first direction. The thickness may be more than twice as large as the thickness of the slit 10 or may range from 5 mm to 15 mm. In this case, a light emitting region where light is emitted on the first resin portion and a light emitting region where light is reflected on the second resin portion are formed. The non-light-emitting regions are disposed on both sides of the light-emitting region. According to another embodiment of the invention, a light emitting region on the first resin portion from which light is emitted; 2. A non-light-emitting region on the resin portion where light is reflected is provided, and the light-emitting region is According to another embodiment of the invention, a bonding layer is disposed between the resin layer and the circuit board. A reflective member may be included, the reflective member being in contact with the reflective layer. Effect of the Invention

[0008] According to an embodiment of the invention, a lighting module can provide different colors of light in the same light-emitting area. According to an embodiment of the invention, the device includes a light-emitting portion and a non-light-emitting portion. The light emitted from the light emitting portion can be emitted through the surface of the light emitting portion. This can improve the light efficiency and light distribution characteristics of the lighting module. It is possible to reduce the chromaticity difference between the appearance image and the luminous image of the resin layer of the luminous module. The disclosed embodiment can improve the color of the lamp depending on whether it is lit or not. Optical reliability of lighting module according to the embodiment and lighting device or vehicle lamp having the same An embodiment of the invention comprises a light unit having a lighting module, The present invention can be applied to various display devices, surface light source lighting devices, and vehicle lamps. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a plan view showing a lighting module according to a first embodiment of the invention. [Diagram 2] FIG. 2 is a side cross-sectional view of the lighting module of FIG. 1 taken along line AA. [Diagram 3] FIG. 3 shows a first variant of the lighting module of FIG. [Figure 4] 4 is a side cross-sectional view of the lighting module of FIG. 1 taken along line BB. [Diagram 5] 5 is a side cross-sectional view of the lighting module of FIG. 1 taken along line CC. [Figure 6] FIG. 6 shows a second variant of the lighting module of FIG. [Figure 7] FIG. 7 shows a third variant of the lighting module of FIG. [Figure 8] FIG. 8 is a side cross-sectional view of a lighting module according to a second embodiment of the invention. [Figure 9] FIG. 9 shows a first modification of the lighting module of FIG. [Figure 10]FIG. 10 shows a second modification of the lighting module of FIG. [Figure 11] FIG. 11 shows a third modification of the lighting module of FIG. [Figure 12] FIG. 12 is a plan view showing an example of a lighting module having a plurality of light-emitting units according to a modified example of the first embodiment of the invention. [Figure 13] FIG. 13 is a plan view showing an example of a lighting module having a plurality of reflecting portions according to a modified example of the first embodiment of the invention. [Figure 14] FIG. 14 is a plan view showing an example of a lighting module having a plurality of light-emitting units according to a modified example of the second embodiment of the invention. [Figure 15] FIG. 15 is a plan view showing an example of a lighting module according to a modified example of the second embodiment of the invention, which has a plurality of reflecting portions. [Figure 16] FIG. 16 shows another example of the invention, which is a modified example of the light emitting portion and the reflecting portion in the lighting module according to the first and second embodiments. [Figure 17] FIG. 17 shows another example of the invention, which is a modified example of the phosphor portion in the lighting module according to the first and second embodiments. [Figure 18] FIG. 18 shows another example of the invention, which is a modified example of the first light emitting element in the lighting modules according to the first and second embodiments. [Figure 19] FIG. 19 is an example of a side cross-sectional view having the first light emitting element of FIG. [Figure 20] FIG. 20 is a plan view of a vehicle to which a lamp having a lighting module according to an embodiment of the invention is applied. [Figure 21] FIG. 21 is an example of a vehicle front lighting device according to an embodiment of the invention. [Figure 22] FIG. 22 is a diagram showing an example of a vehicle rear lighting device according to an embodiment of the invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. The technical concept of the present invention is not limited to the embodiments described herein, and may be modified in various ways. The present invention may be embodied in various forms, and within the scope of the technical concept of the present invention, there may be cases where the differences between the embodiments are not necessarily the same. One or more of the components may be selectively combined or substituted for use. Terms (including technical and scientific terms) used in the embodiments of the present invention are clearly and specifically described. Unless otherwise stated, the present invention will be understood by those skilled in the art. Commonly used terms, such as dictionary-defined terms, are interpreted as meanings that are not necessarily consistent with the technology involved. The meaning of the term can be interpreted by considering the contextual meaning of the term. The terms used herein are merely for the purpose of describing the embodiments and are not intended to limit the present invention. In this specification, the singular form can also include the plural form unless otherwise specified. When "A and at least one of B and C" is stated, A, B , C can include one or more of all combinations that can be combined. In describing components of embodiments of the invention, terms such as first, second, A, B, (a), (b), etc. may be used. Such terms are used to distinguish the component from other components. The term does not limit the nature or order of the components. And when a component is described as being "connected," "coupled," or "connected" to another component, When mounted on a surface, the components may be directly connected or attached to other components or may be directly attached or attached to each other. When other components are "connected," "coupled," or "connected" between components, In addition, when it is described as being formed or disposed "on or under" each component, "Above or below" does not only refer to two components directly contacting each other, but also to one or more further components. This also includes cases where another component is formed or placed between the two components. When "down" is used, it refers to the downward direction as well as the upward direction based on one component. It can also have meaning.

[0011] The lighting device according to the present invention is applicable to various lamp devices that require lighting, such as for vehicles and the like. It can be applied to lamps, household lighting devices or industrial lighting devices. For example, vehicle lamps are For example, headlamps, width lamps, side mirror lamps, fog lamps, tail lamps, control lamps, etc. Moving lights, daytime running lights, vehicle interior lighting, door scuffs, rear combination lamps, back The lighting device of the present invention can be applied to indoor and outdoor advertising devices, display devices, etc. It can also be applied to various electric vehicle fields, and other fields are currently being developed and commercialized. It can be applied to all lighting-related fields and advertising-related fields that can be realized through future technological developments. It can be said that.

[0012] <First Example> FIG. 1 is a plan view showing a lighting module according to a first embodiment of the invention, and FIG. FIG. 3 is a side cross-sectional view of the lighting module of FIG. 2 along line AA; FIG. FIG. 4 is a cross-sectional view of the lighting module of FIG. 1 taken along line BB. FIG. FIG. 6 is a side cross-sectional view of the lighting module taken along the line CC; FIG. FIG. 7 shows a third modified example of the lighting module of FIG.

[0013] 1 to 5, the lighting module 100 includes a circuit board 11, The light emitting elements 21 and 31 are disposed on the circuit board 11. 1, a diffusion layer 51 on the first region of the resin layers 41 and 43, A reflective layer 61 is disposed on the second region of the resin layers 41 and 43, and a first resin portion 4 The upper portion of the first region may include a phosphor portion 45 between the first resin portion 1 and the second resin portion 43. The upper portion of the second region may be a non-light emitting region 72. The elements 21 and 31 are arranged in at least one row, and the first light-emitting elements 21 are arranged in at least one row. The resin layers 41 and 43 may include a second light emitting element 31 disposed on the first light emitting element 31. The first resin portion 41 covers the element 21, and the second resin portion 43 covers the second light emitting element 31. The phosphor portion 45 is disposed between the first resin portion 41 and the second resin portion 43. will be done.

[0014] The lighting module 100 emits light emitted from the light emitting elements 21 and 31 as surface light. The lighting module 100 can be configured to receive the first light emitted from the first light emitting element 21. The lighting module 100 can emit light emitted from the second light emitting element 23. The illumination module 100 can convert the wavelength of the second light emitted from the illumination module 100 into a third light. , a fourth light is generated by mixing the first and second light emitted from the first and second light emitting elements 21 and 31. The first to third lights may be lights of different colors. For example, the first light is white light, the second light is blue light, and the third light is red or The first light may be a yellow light, and the fourth light may be an amber light. The thickness of the circuit board 11 is 5.5 mm or less from the bottom of the circuit board 11, or 4.5 mm to 5.5 mm. The lighting module 10 may have a range of 1 mm to 4.5 mm or a range of 5 mm to 5 mm. The thickness of the light emitting element 10 may be the linear distance between the lower surface and the uppermost surface of the circuit board 11. The light module 100 is provided with a thickness of less than 5.5 mm, making it flexible and slim. The thickness of the lighting module 100 is If the thickness is less than the above range, the light diffusion space is reduced and hot spots may occur. If it is larger, the module thickness increases, resulting in spatial constraints and reduced design freedom. In the embodiment, the thickness of the lighting module 100 is set to 5.5 mm or less or 5 mm or less. It is provided as a module that can be curved, allowing for greater freedom of design and space. The circuit board 11 has a connector (not shown) on one side. The lighting module 1 can supply power to the light emitting elements 21 and 31. 00 is a lamp device for various lamps requiring illumination, such as a lamp for a moving object or a lamp for a vehicle. For example, the lighting module 10 can be used for front lighting or interior lighting. 0 may apply to daytime running lights, headlights, fog lights or turn signals.

[0015] In the lighting module 100, a circuit board 11 includes the light emitting elements 21, 31, and It can function as a base member or a support member located under the resin layers 41 and 43. The circuit board 11 includes a printed circuit board (PCB). The circuit board 11 may be, for example, a resin-based printed circuit board (PCB), a metal core PCB, Includes at least one of flexible PCB, ceramic PCB or FR-4 substrate. The circuit board 11 may be, for example, a flexible PCB or a rigid PCB. The upper surface of the circuit board 11 has an X-axis-Y-axis plane, and the circuit board The thickness of 11 may be the height in the Z direction perpendicular to the X direction and the Y direction. The Z direction is a first direction, the Y direction is a second direction perpendicular to the X direction, and the Z direction is a second direction perpendicular to the X direction. The circuit board 11 may have a wiring layer (FIG. The wiring layer is electrically connected to the light emitting elements 21 and 31. The reflective member or protective layer disposed on the upper portion of the circuit board 11 can protect the wiring layer. Each of the first and second light emitting elements 21 and 31 is connected to the wiring of the circuit board 11. The first and second light emitting diodes may be connected in series, parallel or series-parallel by layers. Each of the elements 21 and 31 is a group having two or more elements connected in series or parallel. Alternatively, the groups may be connected in series or in parallel. The solder resist material may be a white material. The thickness of the circuit board 11 is 0.5 mm or less, for example. For example, the thickness of the circuit board 11 may be in the range of 0.3 mm to 0.5 mm. The thickness of the circuit board 11 is not increased. It is available with a thickness of less than 0.5mm, so it can support flexible modules. do.

[0016] As shown in FIG. 3 and FIG. 6, the lighting module 100 is disposed on the upper surface of the circuit board 11. The reflecting member 15 may be disposed on the circuit board 11. The reflecting member 15 can reflect light traveling on the upper surface of the circuit board 11. or disposed between the circuit board 11 and the resin layers 41, 43. Between the member 15 and the circuit board 11, an adhesive layer such as a UV adhesive, silicone or epoxy is provided. The reflecting member 15 is made of a material such as resin, transparent PET, white PET (white PET), etc. A film made of one of the following materials: polyethylene terephthalate, Ag sheet The reflective member 15 may be provided with a reflective dot. The reflective dots can include inks, such as TiO2, Ca It can be printed with any one of the following materials: CO3, BaSO4, Al2O3, Silicon, and PS. Here, the reflective member 15 has an open area, and the front side can be reflected through the open area. The first and second light emitting elements 21 and 31 are arranged on the reflective member 15. It may be formed on the entire circuit board 11 or on the region of the first resin portion 41 or the region of the second resin portion 43. As another example, the circuit board 11 may include a transparent material. When the circuit board 11 made of the transparent material is provided, the light emitting devices 21 and 31 emit light. The reflected light is emitted in the upward and downward directions of the circuit board 11 .

[0017] The light emitting elements 21 and 31 are arranged in a plurality of rows and / or columns on the circuit board 11. The first light emitting elements 21 may be arranged in one or more rows on the circuit board 11. The first light emitting element 21 may be arranged in a plurality of units in the second direction Y and may be arranged in a small number of units in the first direction X. The second light emitting elements 31 are arranged in a row or on the circuit board 11. The second light emitting elements 31 may be arranged in two or more rows. At least one of the first and second light emitting elements is arranged in one direction X. 21 and 31 are arranged to face each other in the first direction or are arranged in a zigzag shape. This is also fine.

[0018] The first light emitting element 21 overlaps the first resin portion 41 and the diffusion layer 51 in the vertical direction. The second light emitting element 31 is oriented in a direction perpendicular to the second resin portion 43 and the reflective layer 61. The first light emitting element 21 may be disposed in the first resin portion 41 or may be overlapped with the first light emitting element 21. The second light emitting element 31 is disposed in the second resin portion 43. The first light emitting element 21 includes a first light emitting chip 23 and a front surface 42. The first light emitting chip 23 may include a wavelength conversion layer 24 covering the first light emitting chip 23. 3 has multiple exposed pads on the bottom and can emit light through the top and sides The wavelength conversion layer 24 converts the wavelength of a part of the light emitted from the first light emitting chip 23. The wavelength conversion layer 24 is formed on the upper surface and / or the side surfaces of the first light emitting chip 23. Thus, the first light emitting chip 23 emits light from the first light emitting chip 23. The light thus emitted is a first light, which is a mixture of the light emitted from the first light source and the light whose wavelength has been converted by the wavelength conversion layer 24. The first light emitting chip 23 may be a blue LED chip. The chip 23 may be provided in flip chip form, or as a vertical or horizontal chip. The wavelength conversion layer 24 may be formed of at least one of red, yellow, and green phosphors. The wavelength conversion layer 24 may include one or more. The thickness of the wavelength conversion layer 24 is 200 μm or less. The thickness of the first light emitting chip 23 is, for example, in the range of 100 to 200 μm. The second light emitting element 31 may include a second light emitting chip. The second light emitting chip can emit at least one light of blue, green, or red. The second light emitting chip can emit, for example, blue light. The second light emitting element 31 is provided in a structure in which no wavelength conversion layer is formed on the surface of the second light emitting chip. The second light emitting chip may be provided in a flip chip form, a vertical chip form, or a horizontal chip form. The first light emitting element 21 may be provided as a flat chip. The second light emitting element 31 can emit blue light.

[0019] As shown in FIG. 2, the distance D1 between the first and second light emitting elements 21 and 31 is 3 mm or more. The first and second light emitting elements 21 may have a range of, for example, 3 mm to 5 mm. , 31 is smaller than the above range, the heat dissipation efficiency is reduced, As shown in FIG. 4, the distance D3 between the first light emitting elements 21 is The distance between the first and second light emitting elements 31 may be equal to or smaller than the distance between the first and second light emitting elements 31. The distance D3 between the light emitting elements 21 and 31 can be varied according to the required amount of light.

[0020] At least one or two layers of a resin material are arranged on the upper part of the circuit board 11. At least one or two layers of a resin material are disposed on the upper portion of the first light emitting element 21. At least one layer of a resin material is formed on the upper portion of the second light emitting element 31. The resin layers 41 and 43 are formed on the first light emitting element 21. The first resin portion 43 may be disposed on the first light-emitting element 31 and the second light-emitting element 31. 41 is a transparent resin material, such as UV (Ultra violet) resin, silicone or epoxy. The first resin portion 41 may be a layer containing a diffusing agent. The second resin portion 43 may be made of a transparent resin material, for example, a UV-resistant resin material. (Ultra violet) Resin, silicone or epoxy resin materials are also acceptable. The second resin portion 43 may be a layer containing a diffusing agent or may be a layer not containing a diffusing agent. .

[0021] Each of the first and second resin portions 41 and 43 has a length in the second direction Y of The length in the second direction Y may be greater than the widths W1 and W2 in the first direction X. The first and second resin portions 41, 43 may be three times larger than the second direction Y The first and second resin portions 41 and 43 may have the same length in the first direction X. W1 and W2 may be different. For example, the width W1 of the first resin portion 41 is equal to the width W2 of the second resin portion 43. For example, the width W1 of the first resin portion 41 may be greater than the width W2 of the second resin portion 43. The width W2 of the second resin portion 43 may be twice or more the width W2 of the first resin portion 41. The first resin portion 41 may have a width equal to or smaller than 1 / 2 of the width W1. W1 is provided in the range of 5mm or more, e.g. 5mm-15mm or 5mm-10mm If the width W1 of the first resin portion 41 is smaller than the above range, the lighting function is deteriorated. The width W2 of the resin portion 43 is 3 mm or less, for example, 1.5 mm to 3 mm or 1.5 mm to 2.5 mm. If the width W2 of the second resin portion 43 is smaller than the above range, The wavelength conversion efficiency of the light emitted from the second light emitting element 31 is decreased. , which is disposed within the first resin portion 41 with a width smaller than the width W1 of the first resin portion 41, The light emitting element 31 is disposed within the second resin portion 43 with a width smaller than the width W2 of the second resin portion 43. The distance D2 between the first side surface S1 of the first resin portion 41 and the first light emitting element 21 is 2. The first resin portion may have a thickness of 5 mm or more, for example, in a range of 2.5 mm to 3.5 mm. If the distance D2 between the first side surface S1 of the first light emitting element 21 and the first side surface S1 of the first light emitting element 21 is smaller than the above range, The loss of light through the surface S1 increases. The distance K1 between the side surfaces S11 is 3.5 mm or less, for example, in the range of 2.5 mm to 3.5 mm. If the thickness is smaller than the above range, the heat dissipation efficiency may decrease or the wavelength conversion efficiency of the first light may not be increased. It can be added.

[0022] The second resin portion 43 may be provided without a phosphor. Since the width W2 of the second light source 3 is small, when a phosphor is added thereto, the wavelength of the second light is changed. Therefore, the second resin portion 43 does not include a phosphor, and the light conversion efficiency or light extraction efficiency is decreased. will be provided.

[0023] The first resin portion 41 and the second resin portion 43 may have the same thickness T1. The thickness T1 of the resin portion 41 may be the same as the maximum thickness of the second resin portion 43. In this way, the thickness T1 of the first resin portion 41 may be greater than the minimum thickness of the second resin portion 43. The thickness T1 of the first and second resin parts 41, 43 is 4 mm or less, for example, 1.8 mm. The first and second thicknesses may be in the range of 1.8 mm to 3.5 mm or in the range of 1.8 mm to 4 mm. Since the thickness T1 of the second resin portion 41, 43 is provided within the above range, a flexible module can be formed. The first resin part 4 is provided in a module, which can improve the light extraction efficiency and the light distribution. The upper surface area of ​​the first resin portion 41 may be larger than the upper surface area of ​​the second resin portion 43. The upper surface area of ​​the first resin portion 41 may be at least twice as large as the upper surface area of ​​the second resin portion 43. The upper surface of the resin portion 41 is provided as a surface from which light is emitted. The width of the upper surface of the first resin portion 41 may be the same as the width (for example, W1). The upper surface of the first resin portion 41 may be a flat surface or may include a concave or convex curved surface. The lighting module may include, but is not limited to, a concave-convex pattern. In the lens 100, the first side surface S1 is the outer side surface of the first resin portion 41, and light is emitted from the first side surface S1. Such an area of ​​the first side surface S1 is an area blocked by the housing or the bracket. Good too.

[0024] The phosphor portion 45 is disposed in the resin layers 41 and 43. The phosphor portion 45 is disposed between the first resin portion 41 and the second resin portion 43. The phosphor part 45 may include a phosphor in a transparent resin. may be added, and the resin may be a UV resin, silicone or epoxy material. The resin of the phosphor portion 45 is the same material as the resin of the first and second resin portions 41 and 43. The phosphor content of the phosphor part 45 may be 20 wt % or more, for example, 20 wt % to 98 wt %. The range of such fluorescent substances may be 50 wt% to 98 wt%. When the light source unit 45 is viewed from above the diffusion layer 51, the second light emitting element 31 is not visible or there is no hot spot. The phosphor part 45 may have a phosphor content that does not generate a light beam. The second light emitted from the molecule 31 is wavelength-converted and emitted as a third light. The wavelength-converted first light is more preferable than the light obtained by mixing the second light and the light whose wavelength has been converted by the phosphor. That is, the phosphor section 45 is designed to convert the wavelength of the light rather than extract the mixed light. As another example, the phosphor portion 45 has a high extraction efficiency of the light that is extracted from the first resin portion 4. The adhesive layer 44 may be attached to the inner surface of the first resin portion 1 or the inner surface of the second resin portion 43 in the form of dots.

[0025] The height of the phosphor portion 45 is set to the first resin portion 41 and / or the second resin portion 43 in the vertical direction. The width of the phosphor part 45 in the first direction X may be equal to the thickness T1 of the phosphor part 45. 500 μm or less, for example, in the range of 200 to 500 μm or 200 to 350 μm The width of the phosphor portion 45 can be varied according to the diameter of the phosphor. The area of ​​the vertical surface of the portion 45 is the area of ​​the inner surface of the first resin portion 41 and / or the area of ​​the second resin portion 43. The area of ​​the phosphor portion 45 may be the same as the area of ​​the inner surface of the first resin portion 41. and the first resin portion 41 and the second resin portion 43 are disposed along the inner surface of the first resin portion 41 and the second resin portion 43. The inner surface of the resin portion 43 can be prevented from contacting the reflective layer. At least one of the first reflecting portion 61A and the second reflecting portion 61B of 61 and the second resin portion 43 A layer of phosphor is further formed between the first resin layer and the second resin layer. The color conversion efficiency of the light traveling to the portion 41 can be improved.

[0026] The diffusion layer 51 is disposed on the first resin portion 41. The diffusion layer 51 may be bonded or attached to the upper surface of the first resin part 41. The upper surface of the first resin portion 41 may have an area equal to or larger than the area of ​​the upper surface of the first resin portion 41. On the first side S1 of the lighting module 100, the diffusion layer 51 may be provided. The side surface of the lighting module 1 and the side surface of the first resin portion 41 may be disposed on the same plane. On the third and fourth side surfaces S3 and S4 of the first resin portion 51, As another example, a portion of the diffusion layer 51 may be At least one or two of the side surfaces S1, S3, and S4 of the first resin portion 41 The diffusion layer 51 may be made of a transparent resin material containing a diffusion agent. The diffusion layer 51 can diffuse the incident light. The diffusion agent is PM At least one of MA (Poly Methyl Meth Acrylate), TiO2, SiO2, Al2O3, and silicone The upper surface of the diffusion layer 51 may be a light emitting surface S0. That is, the light emitting surface S0 may be provided as a light emitting area 70.

[0027] The reflective layer 61 is made of a reflective material such as a metal or non-metal material. It is made of materials such as aluminum or silver, and the non-metallic materials are resin materials, transparent PET, etc. , white polyethylene terephthalate (PET) material. The reflective layer 61 is made of a resin material having at least one of TiO2, CaCO3, BaSO4, Al2O3, silicon, and PS. The reflective layer 61 can reflect incident light. The reflective layer 61 is formed on the upper surface and the outer surface of the second resin portion 43. 1 is a first reflecting portion 61A disposed on the upper surface of the second resin portion 43 and the second resin portion 43 The second reflecting portion 61B may be disposed on the outer surface. The reflective layer 61 extends vertically from the first reflective portion 61A. 1 to prevent leakage of light emitted from the second light emitting element 31. The side surface S2 of the second reflecting portion 61B may face the first side surface S1. The reflective layer 61 may overlap the phosphor portion 45 in the vertical direction. The reflective layer 61 may include The reflective layer 61 may be in contact with an upper surface of the second resin portion 43. The upper surface of the phosphor portion 45 and the upper end of the phosphor portion 45 can be in contact with each other. When the upper end of the reflective layer 51 comes into contact with the diffusing layer 51, the light that has not been wavelength-converted leaks through the diffusing layer 51. As a result, the upper end of the phosphor portion 45 is not exposed to the reflective layer 61. The reflective layer 61 is disposed at a position in contact with the lower surface of the diffusion layer 51. The interface between the reflective layer 61 and the diffusion layer 51 extends from one surface of the phosphor portion 45. One surface of the phosphor part 45 may be in contact with the inner surface of the first resin part 41.

[0028] In the lighting module 100, the light-emitting region 70 which is the first region is formed by the first resin portion The second region, which is the non-light-emitting region 72, is the upper portion of the second resin portion 43. The light emitting region may be a region from which light is emitted. The non-light emitting region may be a region from which light is blocked. Alternatively, the light may be reflected and not emitted to the outside. 0 emits at least two colors of light or three or more colors of light through the light-emitting area 70. The second light emitting element 31 is provided in a structure that is not exposed to the outside.

[0029] The lighting module 100 according to the first embodiment is provided in a front module of a moving object. For example, the front module may be used as a headlamp, front light, etc., for front lighting of a vehicle lamp. The lighting module may be a fog lamp or a turn signal lamp. The lighting module is in a first lighting mode. In this case, the first light emitting element 21 is driven to emit the first light to the diffusion layer 51 or the light emitting region. In the second lighting mode, the second light-emitting element 31 may be in an off state. The second light emitting element 31 is driven, the first light emitting element 21 is turned off, and the second light emitting element 31 is turned on. The first light is converted into a third light by the phosphor section 45 and emitted to the light emitting region. The first light may be a white light, and the second light may be a red or yellow light. Depending on the mode, white light or red light (or yellow light) can be illuminated. In the flash mode, the first light emitting element 21 and the second light emitting element 31 are turned on, and the first and third light emitting elements can be mixed to emit yellow light.

[0030] As shown in FIG. 3, the reflecting member 15 is in contact with the first resin portion 41 and the second resin portion 43. The reflecting member 15 reflects the light incident on the lower portions of the first resin portion 41 and the second resin portion 43. A part of the reflective member 15 is disposed between the second light emitting element 31 and the reflective layer 61. A part of the reflective member 15 is disposed in the first resin portion 41 through the lower end of the phosphor portion 45. It extends to the lower part of the second resin portion 43.

[0031] As shown in FIG. 6, the outer portion 15A of the reflecting member 15 is exposed to the outside of the lower end of the reflecting layer 61. In this case, the reflective layer 61 can be made of a resin or metal material, and the reflective member 15 can be made of a resin or metal material. As shown in FIG. 7, the upper surface of the second resin portion 43 is curved to a concave curved surface portion R1. The light reflecting device may include a convex curved surface or a light reflecting pattern. The light can be reflected in other directions to improve the light extraction efficiency to the light emitting area. The portion R1 provides the first reflective portion 61A of the reflective layer 61 with a curved surface, thereby improving the reflection efficiency. The curved surface portion R1 has a height that gradually decreases at the upper end of the phosphor portion 45 adjacent to the first resin portion 41. The length may be provided as

[0032] A lighting module according to a second embodiment will be described with reference to FIGS. The lighting module according to the second embodiment has the same configuration as that of the first embodiment. The second embodiment includes the configuration and description of the first embodiment. The module is used for rear lamps of a moving object or vehicle, such as auxiliary brake lights, tail lights, brake lights, backlights, etc. The present invention can be applied to at least one of the backup lamp and tail lamp.

[0033] Referring to FIG. 8, the lighting module 100A includes a circuit board 11, a first light emitting element 21A, and and a plurality of light emitting elements having a second light emitting element 31A, a first resin portion 41 and a second resin portion 43. The insulating layer 52 may include a resin layer having the formula (I), a phosphor layer 52 , an ink layer 55 , and a reflective layer 61 . The first light emitting element 21A may be an LED chip that emits blue light, and the second light emitting element The element 31A may be an element that emits white light. The second light emitting chip 33 may include a wavelength conversion layer 34 around the second light emitting chip 33. The second light emitting element 31A emits white light by mixing blue light with light whose wavelength has been converted by the wavelength conversion layer 34. The distance D1 between the first light emitting element 21A and the second light emitting element 31A is At least, the distance D2 between the first light emitting element 21A and the first side surface S1 of the first resin portion 41 is larger than the distance D2. The distance K1 between the first light emitting element 21A and the second resin portion 43 is 3.5 mm or less, for example. For example, it may be in the range of 2.0 mm to 3.5 mm, and is smaller than the interval K1 in the first embodiment. The first light emitting element 21A is disposed below the first resin portion 41, and the second light emitting element 21B is disposed below the first resin portion 41. The element 31A is disposed under the second resin portion 43. The width, length and thickness of the portion 43 are to be determined by reference to the description of FIGS. 1 and 2. The first resin portion 41 and the second resin portion 43 can be in contact with each other. The interface S11 between the resin parts 43 is located at the interface between the reflective layer 61 and the phosphor layer 52, It may be disposed below the reflective layer 61 .

[0034] The reflective layer 61 is disposed on the upper surface and the outer surface of the second resin portion 43 .

[0035] The phosphor layer 52 is disposed on the upper surface of the first resin portion 41. The ink layer 55 is disposed on the phosphor layer 52. The phosphor layer 52 is defined as a resin layer having phosphor. The ink layer 55 can be defined as a resin layer having ink particles. The first resin portion 41, the phosphor layer 52, and the ink layer 55 are overlapped in the vertical direction. The area of ​​the upper surface of the first resin portion 41 is the same as the area of ​​the lower surface of the phosphor layer 52. The upper surface area of ​​the phosphor layer 52 may be the same as the lower surface area of ​​the ink layer 55. As a result, the light traveling through the first resin portion 41 is reflected by the phosphor layer 52. The light is wavelength converted and emitted through the ink layer 55 .

[0036] The phosphor layer 52 may include at least one of a red phosphor and a yellow phosphor. In another example, the phosphor layer 52 may include at least one of red, green, yellow, and blue phosphors. The phosphor layer 52 is formed on the first light emitting element 21A. When the emitted first light is incident on the second light emitting element 31A, the second light emitting element 31A converts the wavelength of the first light into red light. When the emitted light is incident, it can be wavelength converted and emitted as yellow light. On the first resin portion 41, a single resin layer containing phosphor and ink particles may be formed. As another example, a single resin having a diffusion agent, a phosphor, and ink particles may be provided on the first resin portion 41. A layer may be formed.

[0037] The ink layer 55 and the phosphor layer 52 may be in contact with the reflective layer 61. At least one or both of the ink layer 55 and the phosphor layer 52 are formed on the reflective layer 61. This is because the ink layer 55 and the phosphor layer 56 may be arranged to overlap each other in the vertical direction. The ink layer 55 is formed on the reflective layer 61. The surface can be a light emitting surface S0. That is, the light emitting surface S0 is a light emitting area which is a first region. In the phosphor layer 52, the phosphor content is 50. wt% or less, for example, in the range of 10wt% to 50wt% or 10wt% to 30wt% When viewed from above the ink layer 55, the phosphor layer 52 has a first The phosphor content of the two light emitting elements 21A and 31A is set so that the light emitting elements 21A and 31A are not visible or do not generate hot spots. Here, the phosphor content of the phosphor layer 52 can be adjusted so that the ink layer 55 on the surface Since the light transmittance may be reduced by the addition of a small amount of the compound, the first embodiment The ink particles added to the ink layer 55 may be metal ink, UV ink or curable ink. The ink particles may include at least one of the phosphor particles. The surface colors of the ink particles may be green, red, yellow, blue, or the like. The type of ink may be PVC (Polyvinyl Chloride) ink. Ink, PC (Polycarbonate) ink, ABS (acrylonitrile butadiene styrene copolymer) ink Ink, UV resin ink, epoxy ink, silicone ink, PP (polypropylene) ink, Water-based ink, plastic ink, PMMA (poly methyl methacrylate) ink, PS (Polysty In this case, the ink particle width or The diameter may be 5 μm or less, for example, in the range of 0.05 μm to 1 μm. At least one of the ink particles may be smaller than the wavelength of light. , red, green, yellow, and blue. For example, For example, the ink may emit red wavelengths and the ink particles may include a red color. The red color of the ink particles may be darker than the color of the phosphor or the wavelength of light. The particles have a different color from the color of the light emitted from the light emitting elements 21A and 31A. The ink particles may have the effect of blocking or blocking incident light. The ink particles added to the ink layer 55 are 12 wt % or less, for example, 4 wt % to 1 The content of the phosphor may be in the range of 2 wt %. It is possible to prevent the color difference of the surface color depending on the content of the ink particles. The phosphor content of the ink particles is preferably 0.01 to 0.15. The content is 3wt% or more, or may be added in the range of 3wt% to 13wt%. The color of the surface of the ink layer 55 may be provided by the color of the ink particles. The ink particles can suppress light transmission, reducing hot spots. do.

[0038] The lighting module 100A according to the second embodiment is provided with a red surface in the non-light-emitting mode. In the first lighting mode, the first light emitting element 21A is driven and the second light emitting element 31A is In the second illumination mode, the red light is emitted through the ink layer 55. The first light emitting element 21A is turned off, the second light emitting element 31A is turned on, and light is emitted through the ink layer 55. Yellow light is emitted.

[0039] As shown in FIG. 9, the upper surface of the circuit board 11 and the first resin portion 41 are The reflecting member 15 is disposed between the first and second resin portions 43. The reflecting member 15 is The reflecting member 15 can contact the second resin portions 41 and 43. As shown in FIG. 10, the outer portion 15A of the reflecting member 15 is a reflecting The reflective member 15 may be protruded or exposed to the outside through the reflective layer 61. 11, the upper surface of the second resin portion 43 is curved in a concave shape. The surface portion R1 may include a convex curved surface portion or a light reflecting pattern. , the incident light can be reflected in other directions to improve the light extraction efficiency to the light emitting area. The curved surface portion R1 provides the first reflecting portion 61A of the reflecting layer 61 with a curved surface, thereby improving the reflection efficiency. The curved surface portion R1 is an upper end of the phosphor layer 52 adjacent to the first resin portion 41. It may be provided in decreasing heights.

[0040] 12 and 13 show a modification of the first embodiment. With reference to FIG. 12 and FIG. On both sides of the non-light emitting region 72, first and second light emitting regions 70, 7 That is, a non-light emitting area 72 is disposed between the first light emitting area 70 and the second light emitting area 70A. In the first light-emitting region 70 and the second light-emitting region 70A, The first light emitting elements 21 and 22, the first resin portion 41, and the diffusion layers 51 and 51A are provided. The non-light-emitting region 72 includes the second light-emitting element 31, the second resin portion 43, the phosphor portion 45, and the like. , 45A and a reflective layer 61 are disposed. The boundary between the first resin portion 41 of the optical region 70 and the first resin portion 41 of the second light-emitting region 70A are placed on the boundaries of the respective

[0041] 13 and 2, first and second non-light-emitting regions 72 are provided on either side of the light-emitting region 70. That is, a light emitting area is disposed between the first non-light emitting area 72 and the second non-light emitting area 72A. The light-emitting region 70 is provided with the first light-emitting element 21 and the second light-emitting element 22 as disclosed in the first embodiment. The first and second non-light emitting regions are provided with a resin portion 41 and a diffusion layer 51, respectively. The second light emitting elements 31, 32, the second resin portion 43, the phosphor portions 45, 45B, and the reflective layer 61-1 , 61-2 are arranged in the first non-light emitting region. The inner surfaces of the second resin portion 43 of the second non-light-emitting regions 72 and 72A and the second resin portion 43 of the second non-light-emitting regions 72 and 72A They are respectively arranged on the inner surface of the grease portion 43.

[0042] The lighting modes of the lighting module disclosed in FIG. 12 and FIG. 13 are the modes of the first embodiment. As an example of another lighting mode, as shown in FIG. When the first light emitting elements 21 of 70 and 70A emit light of different colors, for example, The first light-emitting element 21 in the light-emitting region 70 emits white light, and the first light-emitting element 2 in the second light-emitting region 70A emits white light. 2 can emit yellow light. As shown in FIG. 13, the first and second non-light-emitting regions 72 and 72A When the second light emitting elements 31 and 32 emit light of different colors, for example, the first non-light emitting region The second light-emitting element 31 in the second non-light-emitting area 72A emits blue light, and the second light-emitting element 32 in the second non-light-emitting area 72B emits blue light. It can emit green or yellow light. Here, the multiple The phosphor portions 45, 45A, and 45B may contain phosphors of the same color or different colors. The phosphor portion 45, 45A, as shown in FIG. 12 or FIG. 13, Any one of 45B may be removed.

[0043] 14 and 15 show a modified example of the second embodiment. With reference to FIG. 14 and FIG. The first and second light emitting regions 70, 70A are disposed on both sides of the non-light emitting region 72. A non-light-emitting area 72 is disposed between the light-emitting area 70 and the second light-emitting area 70A. The first light-emitting element 21, 21 of the second embodiment is disposed in the light-emitting region 70 and the second light-emitting region 70A. B, the first resin portion 41, the phosphor layer 52 and the ink layer 55 are provided. In the region 72, the second light emitting element 31A, the second resin portion 43, and the reflective layer 61 are disposed. The second resin portion 43 of the non-light emitting region 72 is the first resin portion 41 of the first light emitting region 70 and It may be in contact with the first resin portion 41 of the second light-emitting region 70A or may be formed integrally therewith.

[0044] 15 and 8, first and second non-light-emitting regions 72 are provided on either side of the light-emitting region 70. That is, a light emitting area is disposed between the first non-light emitting area 72 and the second non-light emitting area 72A. The light-emitting region 70 is provided with the first light-emitting element 21 disclosed in the second embodiment. , a first resin portion 41, a phosphor layer 52, and an ink layer 55 are provided. The second non-light emitting regions 72 and 72A include the second light emitting elements 31A and 31B, the second resin portion 43, and The reflective layers 61-1 and 61-2 are disposed on the first resin layer 70. The two side surfaces of the portion 41 are in contact with the inner side surfaces of the second resin portion 43 of the first non-light emitting region 72 and the inner side surfaces of the second resin portion 43 of the second non-light emitting region 73. The inner surfaces of the second resin portion 43 in the region 72A can come into contact with each other.

[0045] The lighting modes of the lighting module disclosed in FIG. 14 and FIG. 15 are the modes of the second embodiment. As an example of another lighting mode, the first and second light emitting regions may be the same as those shown in FIG. When the first light emitting elements 21A and 21B of the elements 70 and 70A emit light of different colors, For example, the first light-emitting element 21A of the first light-emitting region 70 emits blue light, and the second light-emitting element 21B of the second light-emitting region 70A emits blue light. The first light emitting element 21B can emit green or yellow light. The second light emitting elements 31A and 31B of the non-light emitting areas 72 and 72A emit light of different colors. In this case, for example, the second light-emitting element 31A in the first non-light-emitting region 72 emits white light, and the second non-light-emitting element 31B in the second non-light-emitting region 73 emits white light. The second light emitting element 31B in the region 72A can emit yellow light. The multiple phosphor layers 52 disclosed in FIG. 15 may contain phosphors of the same color or may be different from each other. The phosphor layer 52 shown in FIG. 14 or FIG. 15 may include a phosphor of a different color. Any one of them may be removed.

[0046] FIG. 16 shows a modification of the lighting module according to the first and second embodiments of the invention.

[0047] Referring to FIG. 16, the sub-regions A1 and A2 of the light-emitting region 70 are arranged on either side of the non-light-emitting region 72. Alternatively, the non-light emitting area 72 extends to both sides of the light emitting area 70. As described above, the phosphor portion 45 disposed under the non-light-emitting region 72 is in contact with the light-emitting region 70 and its subregion. For example, the first and second sub-regions A1 and A2 of the light-emitting region 70 are arranged along the sub-regions A1 and A2. The first and second phosphor elements 45 and 45A may be further disposed. At this time, the reflective layer 61 The second resin portion 43 is disposed only on the second side surface S2 of the second resin portion 43. A layer having a phosphor is further disposed on the second side S2. When the ink layer 55 is disposed on the first resin portion 41, the light-emitting region 70 is a non-light-emitting region. A phosphor layer 52 / an ink layer 55 are laminated along the reflective layers 61 arranged on both sides of 72 . When the ink layer 55 is disposed on the first resin portion 41, the light-emitting region 70 is A phosphor layer 52 / an ink layer 55 are laminated along the reflective layers 61 arranged on both sides of the substrate 2 .

[0048] FIG. 17 shows a modification of the lighting module according to the first and second embodiments of the invention.

[0049] Referring to FIG. 17, a light emitting region 70 may face a non-light emitting region 72. The phosphor portion 45 is disposed on the inner surface of the first resin portion 41 along each of the side surfaces S1, S3, and S4. The extensions P10, P11, and P12 of the phosphor portion 45 are formed by the first resin. The ink layer 55 extends to the inner surface and each side surface of the resin portion 41. For example, the phosphor portion 45 When the first resin portion 41 and the second resin portion 43 are disposed in the above-mentioned manner, the boundary portion between the first resin portion 41 and the second resin portion 43 and the first resin portion 41 are disposed in the above-mentioned manner. The ink layers 55 are arranged on the outer surfaces S1, S3, and S4, respectively. For example, when the ink layer 55 is arranged The ink layer 55 is disposed on the upper surface and each of the side surfaces S1, S3, and S4 of the first resin portion 41. do.

[0050] FIG. 18 and FIG. 19 are another example of the invention, and FIG. 18 is related to the first and second embodiments. FIG. 19 shows a modification of the first light emitting element in the lighting module. 1 is an example of a cross-sectional side view of a lighting module having

[0051] 18 and 19, the first resin portion 41 of the light-emitting region 70 has a plurality of first light-emitting The elements 25 and 27 are arranged apart from each other, and the second resin portion 43 has a small number of second light-emitting elements 31. The first light emitting elements 25 and 27 are arranged in at least one row. The first side surface S3 and the second side surface S4 are adjacent to each other. The optical elements 25 and 27 are embodied as a side-view package, and are arranged on the inner side of the first resin portion 41. In other words, light is provided toward the center between the first light emitting elements 25 and 27. The second light emitting element 31 is arranged in a side view package or a top view package at positions spaced apart from each other. The first light emitting elements 25 and 27 are disposed on the circuit board 11 as a single package. A lead frame is bonded to the upper electrode 16 of the light emitting diode 10 by a bonding member 17, and the light is emitted in one direction Y0. The first light emitting device 21 has a light emitting chip 7 disposed in the cavity 2 of the body 3. The cavity 2 may include a molding portion 8 for covering the light emitting chip 7. The molding part 8 may contain a phosphor. The light-transmitting portion 8 may be a wavelength conversion layer as disclosed in the embodiments. 0, 100A is for vehicle lamps, display devices with Micro LEDs, or various lighting devices. The above-mentioned lighting module provides a surface light source, and thus the lighting device can be applied to the above-mentioned lighting device. The lighting module 100 can be used without the need for an additional inner lens. , 100A, when viewed from the side, is a flat plate shape, a convex curved shape, or The illumination module may be provided with a concave curved shape or with a concave / convex shape. When viewed from the top, the shapes of the stripes are bar-shaped, polygonal, circular, It may be elliptical, convex sided, or concave sided. Good too.

[0052] FIG. 20 is a plan view of a vehicle to which a lamp having a lighting module according to an embodiment is applied. FIG. 21 is a diagram showing an example of a front lamp in the vehicle of FIG. 20, and FIG. This is a drawing showing the tail lights of 20 vehicles.

[0053] 20 to 22, in a vehicle 900, a front lamp 850 includes one or more The lighting modules 855 may be included, and the driving time of these lighting modules 200 may be individually In addition to functioning as a normal headlight, the headlights are automatically controlled to turn on when the driver opens the vehicle door. Additional lighting such as welcome lights or celebration effects The lamps can provide a daytime running light, high beam, low beam, It can be applied to fog lamps or turn signals.

[0054] The tail lamp 800 of the vehicle 900 includes a first lamp unit 812 and a second lamp unit 814, a third lamp unit 816, and a housing 810. The first lamp unit 812 is a lighting module that serves as a direction indicator. The second lamp unit 814 may be a lighting module for serving as a parking light. The third lamp unit 816 may be a lighting module for serving as a brake light. However, the present invention is not limited to this. At least one or all of 814, 816 may be a lighting module as disclosed in the embodiment. The housing 810 includes first to third lamp units 812, 813, and 814. 14, 816 and may be made of a light-transmitting material. The first to third lamp units 81 may have a bend depending on the design of the vehicle body. 2, 814, and 816 embody a surface light source having a curved surface according to the shape of the housing 810. Such a vehicle lamp can be used as a tail light, a brake light, or the like of a vehicle. , if applied to a turn signal lamp, apply to the turn signal lamp of the vehicle can be done.

[0055] The features, structures, effects, etc. described in the above embodiments may be used in at least one embodiment of the present invention. The present invention is not limited to any one embodiment. The features, structures, effects, etc. of the present invention may be easily understood by those having ordinary skill in the art to which the embodiments pertain. The present invention can be implemented in combination or modification with the above examples. The above description should be construed as being included in the scope of the present invention. Although the above description is given with a particular focus, it is merely illustrative and does not limit the scope of the present invention. A person having ordinary knowledge in the field of the present invention can easily understand the present invention without departing from the essential characteristics of the present invention. Therefore, various modifications and applications not exemplified above are possible. Each of the components presented can be modified and implemented. Any differences in application are to be construed as falling within the scope of the invention as defined in the appended claims. It should be.

Claims

1. A circuit board; a plurality of first light emitting elements disposed on a first region of the circuit board; a plurality of second light emitting elements disposed on a second region of the circuit board; a first resin portion that seals the first light-emitting elements, and a second resin portion that seals the second light-emitting elements a resin layer including a second resin portion; a phosphor portion disposed between the first resin portion and the second resin portion; a diffusion layer disposed on an upper portion of the first resin portion; a reflective layer disposed on an upper surface and an outer surface of the second resin portion, Each of the first light emitting elements and the second light emitting elements has at least a second row arranged in a second direction perpendicular to the first direction; a width of the second resin portion in the first direction being smaller than a width of the first resin portion; Ru.

2. The first light emitting element includes a first light emitting chip that emits blue light, and a surface of the first light emitting chip. a wavelength-converting layer disposed on The lighting module of claim 1 , wherein the first light-emitting element emits white light.

3. The second light emitting element emits blue light, The phosphor portion covers a space between the first resin portion and the second resin portion, and emits red or yellow light. The lighting module of claim 2 , which emits

4. A circuit board; a plurality of first light emitting elements disposed on a first region of the circuit board; a plurality of second light emitting elements disposed on a second region of the circuit board; a first resin portion that seals the first light-emitting elements, and a second resin portion that seals the second light-emitting elements a resin layer including a second resin portion; a phosphor layer disposed on the first resin portion; an ink layer disposed on the phosphor layer; a reflective layer disposed on an upper surface and an outer surface of the second resin portion, Each of the first light emitting elements and the second light emitting elements has at least a second row arranged in a second direction perpendicular to the first direction; a width of the second resin portion in the first direction being smaller than a width of the first resin portion; Ru.

5. the first light emitting element emits blue light, The second light emitting element includes a second light emitting chip that emits blue light, and a surface of the second light emitting chip. a wavelength converting layer disposed on The lighting module according to claim 4 , wherein the second light-emitting element emits white light.

6. the phosphor layer includes a red phosphor; The lighting module of claim 5 , wherein the ink layer comprises red ink particles.

7. The width of the first resin portion in the first direction is at least twice as large as the width of the second resin portion in the first direction or at least 5 times as large as the width of the second resin portion in the first direction.

7. The lighting module according to claim 1, wherein the thickness of the light source is in the range of 1 mm to 15 mm.

8. A light emitting region on the first resin portion from which light is emitted and a light emitting region on the second resin portion from which light is reflected. a non-light-emitting region; 7. The method according to claim 1, wherein the non-light emitting regions are disposed on both sides of the light emitting region.

13. The lighting module according to claim 12 .

9. A light emitting region on the first resin portion from which light is emitted and a light emitting region on the second resin portion from which light is reflected. a non-light-emitting region; 7. The method according to claim 1, wherein the light emitting regions are disposed on both sides of the non-light emitting region.

13. The lighting module according to claim 12 .

10. a reflective member between the resin layer and the circuit board; The lighting device according to claim 1 , wherein the reflective member is in contact with the reflective layer. Module.

11. A vehicle lighting device comprising a lighting module according to any one of claims 1 to 6.

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