Inspection method, inspection device, and inspection system

Abstract

To provide technique capable of smoothly inspecting an object having a back-illumination type imaging device with a simple configuration.SOLUTION: An inspection method includes a step of (A) of fixing an inspection object and a jig board to form an assembly, and a step of (B) inspecting the inspection object by irradiating an imaging device as the inspection object with inspection light from an illumination unit after the step of (A). The jig board includes, on one surface thereof, a plurality of first connection portions, and a plurality of second connection portions which is electrically connected to the plurality of first connection portions and provided at positions adjacent to the plurality of first connection portions, respectively. In the step of (A), a surface of the inspection object on which pads connected to a wiring layer are provided is opposed to one surface of the jig board, and the pads and the plurality of first connection portions are electrically conducted to each other to form an assembly. In the step of (B), the inspection object is inspected in a state where the opposite surface of the inspection object in the assembly is opposed to the illumination unit, and a plurality of probes provided at a position adjacent to the illumination unit is brought into contact with the plurality of second connection portions, respectively.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present disclosure relates to an inspection method, an inspection apparatus, and an inspection system. [Background technology]

[0002] When inspecting an object (wafer) that has an imaging device such as a CMOS image sensor, inspection light is irradiated from an illumination unit toward the substrate to determine whether or not there is a defect in the imaging device. In recent years, for reasons such as improving the S / N ratio and reducing power consumption, back-illuminated imaging devices, in which light is incident from the side opposite the wiring layer, have been developed, and the development of inspection equipment for inspecting these imaging devices is also underway.

[0003] For example, Patent Document 1 discloses an inspection apparatus in which an inspection object having a back-illuminated imaging device is placed on a stage and equipped with an illumination unit (light irradiation unit) that irradiates the inspection object with inspection light from the same stage side. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2020-68329 A Summary of the Invention [Problem to be solved by the invention]

[0005] The present disclosure provides a technique capable of smoothly inspecting an object having a back-illuminated imaging device with a simple configuration. [Means for solving the problem]

[0006] According to one aspect of the present disclosure, there is provided an inspection method for an inspection object having an imaging device into which light is incident from a surface opposite a wiring layer, the inspection method comprising: (A) a step of fixing the inspection object and a fixture substrate to form an assembly; and (B) a step of inspecting the inspection object by irradiating the imaging device of the inspection object with inspection light from an illumination unit after the step (A), wherein the fixture substrate has a plurality of first connection parts on one surface thereof and a plurality of second connection parts which are electrically connected to each of the plurality of first connection parts and are provided adjacent to the plurality of first connection parts, and in the step (A), a surface of the inspection object having pads connected to the wiring layer is opposed to the one surface of the fixture substrate, and the pads are electrically connected to the plurality of first connection parts to form the assembly, and in the step (B), the inspection object is inspected in a state where the opposite surface of the inspection object in the assembly faces the illumination unit and a plurality of probes provided adjacent to the illumination unit are brought into contact with each of the plurality of second connection parts. Effect of the Invention

[0007] According to one aspect, an inspection object having a back-illuminated imaging device can be smoothly inspected with a simple configuration. [Brief description of the drawings]

[0008] [Figure 1] 1 is a schematic cross-sectional view showing a configuration of an inspection device according to an embodiment. [Diagram 2] Fig. 2A is a schematic cross-sectional view showing an enlarged image pickup device inspected by the inspection apparatus according to the embodiment, and Fig. 2B is a schematic cross-sectional view showing an enlarged image pickup device according to a comparative example. [Diagram 3] 4 is a schematic cross-sectional side view showing an enlarged inspection state of a wafer of an assembly in the inspection device; FIG. [Figure 4] 1 is a block diagram illustrating an inspection system according to an embodiment. [Diagram 5] FIG. 13 is a schematic side view showing the creation of an assembly by a positioning and fixing device. [Figure 6]4 is a flowchart illustrating a method for inspecting a wafer having imaging devices according to an embodiment. [Figure 7] Fig. 7(A) is a side cross-sectional view that shows a schematic diagram of an assembly according to a first modified example, and Fig. 7(B) is a side cross-sectional view that shows a schematic diagram of an assembly according to a second modified example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, an embodiment of the present disclosure will be described with reference to the drawings. In the drawings, the same components are denoted by the same reference numerals, and duplicated descriptions may be omitted.

[0010] Fig. 1 is a schematic cross-sectional view showing the configuration of an inspection apparatus 1 according to an embodiment. As shown in Fig. 1, the inspection apparatus 1 according to an embodiment is an apparatus that optically inspects an object to be inspected that has an imaging device. The object to be inspected by the inspection apparatus 1 is, for example, a substrate (hereinafter referred to as a wafer W) that is formed in a perfect circle shape in a plan view and has a plurality of imaging devices arranged in a matrix. Note that the object to be inspected is not limited to the wafer W, and may be a carrier on which one or a plurality of imaging devices are arranged, an electronic circuit board, or the like.

[0011] Fig. 2(A) is a schematic cross-sectional view showing an enlarged image pickup device 100 inspected by the inspection apparatus 1 according to the embodiment. Fig. 2(B) is a schematic cross-sectional view showing an enlarged image pickup device 200 according to a comparative example. As shown in Fig. 2(A), the multiple image pickup devices 100 inspected by the inspection apparatus 1 include solid-state image pickup elements using CMOS (Complementary Metal Oxide Semiconductor). Each CMOS image pickup device 100 includes one photodiode 113 for each pixel 110 arranged in a lattice pattern and a CMOS transistor switch 114s, and the switch 114s is switched for each pixel 110 to amplify the signal and directly read it out.

[0012] However, the performance of each imaging device 100 varies depending on the arrangement of the stacked structure that constitutes the pixel 110. In the following, in order to facilitate understanding of the imaging device 100 according to the embodiment, first, a comparative example (conventional) imaging device 200 will be described with reference to FIG.

[0013] A plurality of pixels 210 of an imaging device 200 according to the comparative example detects a color (e.g., any of RGB colors) that is resisted by a color filter 212 laminated on top of a photodiode 214. Each pixel 210 is formed in a layered structure in which an on-chip lens 211, a color filter 212, a wiring layer 213, and a photodiode 214 are laminated in this order.

[0014] In other words, the imaging device 200 has the wiring layer 213 disposed between the color filter 212 and the photodiode 214. The inspection light incident from the on-chip lens 211 passes through the color filter 212 and the wiring layer 213 and enters the photodiode 214. In this case, a pad (not shown) connected to the wiring layer 213 can be disposed on the on-chip lens 211 side, so that the inspection device can perform inspection by disposing an illumination unit that irradiates the imaging device 200 with inspection light and each probe that contacts the pad in the same direction. However, since the inspection light passes through the wiring layer 213, the photodiode 214 of the imaging device 200 receives the inspection light with a large loss.

[0015] 2A, the multiple pixels 110 of the imaging device 100 are formed in a layered structure in which an on-chip lens 111, a color filter 112, a photodiode 113, and a wiring layer 114 are layered in this order. In other words, the layered order of the photodiode 113 and the wiring layer 114 of the imaging device 100 is interchanged with the layered order of the wiring layer 213 and the photodiode 214 of the imaging device 200.

[0016] In the imaging device 100, a photodiode 113 is disposed on the back surface of the color filter 212. Light incident from the on-chip lens 111 enters the photodiode 113 immediately after passing through the color filter 112. In this case, the imaging device 100 is able to capture inspection light into the photodiode 113 without being hindered by the wiring layer 114, and detection sensitivity is significantly improved. Also, in the imaging device 100, an electrode pad (including a semiconductor bump or the like) 115 connected to the wiring layer 114 is disposed on the surface opposite to the on-chip lens 111.

[0017] 1, the inspection device 1 is configured to place the wafer W on the stage 30, move it, and inspect the wafer W at the inspection position. Also, the inspection device 1 preferably includes a temperature control module 36 or the like inside the stage 30 for controlling the temperature of the wafer W. For this reason, providing the illumination unit 23 for irradiating the imaging device 100 with inspection light on the stage 30 side significantly changes the configuration of a typical stage 30.

[0018] Therefore, the inspection device 1 according to the embodiment is configured such that the illumination unit 23 is installed on the same side as each probe 22 of the tester 20, but no illumination unit is installed on the side of the stage 30. The configuration of this inspection device 1 will be specifically described below with reference to FIG.

[0019] The inspection device 1 includes an inspection unit 10 that actually performs the inspection, a loader 13 installed adjacent to the inspection unit 10, and a tester 20 installed above the inspection unit 10. Furthermore, the inspection device 1 has a controller 90 that is a control unit that controls the operations of the inspection unit 10, the loader 13, and the tester 20.

[0020] The inspection unit 10 includes a rectangular parallelepiped housing 11, and an inspection chamber 12 is disposed inside the housing 11. A stage 30 for transporting a wafer W is housed in the inspection chamber 12. In the inspection device 1 according to the embodiment, the wafer W is formed into an assembly 70 integrated with a jig substrate 60 (see FIG. 3) described below, and is placed on the stage 30. The configuration of the assembly 70 will be described in detail later.

[0021] A carrier such as a FOUP (Front-Opening Unified Pod) (not shown) that holds a plurality of assemblies 70 is set in the loader 13. The loader 13 is equipped with a transport device (not shown), which removes the assemblies 70 from the carrier and delivers the assemblies 70 to the stage 30 in the inspection room 12. The loader 13 also removes the inspected assemblies 70 from the stage 30 by the transport device and stores them in the carrier.

[0022] The inspection section 10 includes a probe card 21 connected to a tester 20 above the inspection chamber 12. The probe card 21 has a plurality of probes 22 on its lower surface in the vertical direction. Each probe 22 comes into contact with a corresponding pad 621 (see FIG. 3) of the assembly 70 when the assembly 70 is moved by the stage 30. This allows the tester 20 to receive an electrical signal transmitted from the wafer W of the assembly 70 via the probe card 21.

[0023] The tester 20 includes a motherboard (not shown) therein that is electrically connected to the probe card 21. The motherboard has a number of slots to which a number of test boards (not shown) are attached, and is connected to a controller 90. The motherboard judges the quality of each imaging device 100 based on an electrical signal transmitted from the wafer W. By appropriately replacing the test board, the tester 20 can perform a number of types of inspections.

[0024] The tester 20 also has an illumination unit 23 that irradiates the wafer W of the assembly 70 with inspection light through a hole 21h provided in the center of the probe card 21. In other words, the probes 22 are arranged on the probe card 21 so as to circle around the hole 21h.

[0025] The illumination unit 23 includes a light source module that is a light source of the inspection light, and a lens module arranged in the irradiation direction (on the optical axis) of the inspection light from the light source module (both not shown). The light source module has, for example, a plurality of LEDs (Light Emitting Diodes) (not shown) that irradiate the inspection light vertically downward, and is electrically connected to the controller 90. When inspecting a plurality of colors in the imaging device 100, the light source module may be configured to irradiate a single color (e.g., white) inspection light, or may be configured to irradiate inspection light of a plurality of colors (e.g., red, green, and blue).

[0026] The lens module is a module that reproduces a lens portion of an imaging device (not shown) such as a camera on which the imaging device 100 is mounted, and is also called a pupil module (registered trademark). By using the lens module for inspection, the inspection device 1 can reproduce the environment in which the imaging device 100 is actually used, and can inspect whether the imaging device 100 is able to perform as specified in that environment. As an example, since many of the cameras mounted on smartphones have different numbers and shapes of lenses for each model of the smartphone, the lens module is designed according to the lens specifications of each camera and is replaced according to the inspection contents. The lens module has, for example, a matrix arrangement of multiple lenses with convex surfaces facing downward in the vertical direction, and can maintain uniformity in the light intensity of the inspection light transmitted through each lens.

[0027] Meanwhile, the stage 30 is installed in the inspection chamber 12 vertically below the probe card 21 (each probe 22) and the illumination unit 23 of the tester 20. The stage 30 transports the assembly 70 placed on the placement surface 31s to an appropriate three-dimensional coordinate position (X-axis direction, Y-axis direction, and Z-axis direction) in the inspection chamber 12. For example, the stage 30 moves in the horizontal direction (X-axis-Y-axis direction) between a position near (or inside) the loader 13 and a position facing the probe card 21 to adjust the horizontal position of the assembly 70. In addition, the stage 30 moves up and down in the vertical direction (Z-axis direction) at the position facing the probe card 21 and the assembly 70 to adjust the height position of the assembly 70.

[0028] The stage 30 includes a mounting table 31 having a flat mounting surface 31s capable of supporting the assembly 70, a moving unit 32 (X-axis moving mechanism 33, Y-axis moving mechanism 34, and Z-axis moving mechanism 35), and a stage control unit 37. The stage 30 may include a stage-side camera (not shown) that captures an image of a contact state between the assembly 70 and the probe card 21 or each probe 22.

[0029] In accordance with the stage 30, the frame structure 14 of the housing 11 has a two-stage structure including an upper base 141 that supports the moving part 32, a lower base 142 that supports the stage control part 37, and a number of pillars 143 that extend vertically and support each base.

[0030] The mounting table 31 is configured by stacking a plurality of structures, such as a bottom plate supported by the moving part 32 and a chuck top having a mounting surface 31s. The mounting surface 31s of the chuck top has a circular shape with a larger diameter than the assembly 70 in a plan view. The assembly 70 is not limited to being formed in a circular shape in a plan view, and may be, for example, a rectangular shape or another polygonal shape. Depending on the planar shape of this assembly 70, the mounting surface 31s of the chuck top may also be formed in a rectangular shape or another polygonal shape, without being limited to a circular shape.

[0031] The mounting table 31 also includes therein a temperature control module 36 that adjusts the temperature of the assembly 70 mounted on the mounting surface 31s. Although not shown, the stage 30 also includes a lifter mechanism that raises and lowers the assembly 70 to receive and deliver the assembly 70 to and from the transport device of the loader 13, a θ rotation mechanism (not shown) that rotates the chuck top around its central axis (around the θ axis), and the like. Furthermore, the chuck top may include a holding means (e.g., a vacuum suction mechanism, a mechanical chuck) that holds the wafer W on the mounting surface 31s, a temperature sensor that detects the temperature of the mounting surface 31s, and the like.

[0032] The X-axis movement mechanism 33 of the movement unit 32 includes a plurality of guide rails 330 fixed to the upper surface of the upper base 141 and extending along the X-axis direction, a plurality of X-axis movable bodies 331 arranged on each guide rail 330, and an X-axis stand 332 supported by each X-axis movable body 331. The X-axis stand 332 has an X-axis drive unit (motor, gear mechanism, etc.) not shown that is connected to the stage control unit 37. Based on the power supply from the stage control unit 37, the X-axis drive unit reciprocates each X-axis movable body 331 and the X-axis stand 332 in the X-axis direction to adjust the X coordinate of the assembly 70.

[0033] The Y-axis movement mechanism 34 includes a plurality of guide rails 340 fixed to the upper surface of the X-axis base 332 and extending along the Y-axis direction, a plurality of Y-axis movable bodies 341 arranged on each guide rail 340, and a Y-axis base 342 supported by each Y-axis movable body 341. The Y-axis base 342 has a Y-axis drive unit (motor, gear mechanism, etc.) not shown that is connected to the stage control unit 37. Based on the power supply from the stage control unit 37, the Y-axis drive unit reciprocates each Y-axis movable body 341 and the Y-axis base 342 in the axial direction to adjust the Y coordinate of the assembly 70.

[0034] The Z-axis movement mechanism 35 is installed on the Y-axis base 342, and supports the bottom plate of the mounting table 31 at its upper portion. The Z-axis movement mechanism 35 includes a fixed guide body 350, a plurality of Z-axis driving units 351, and a Z-axis movable body 352 that moves up and down along the fixed guide body 350 under the drive of each Z-axis driving unit 351. Each Z-axis driving unit 351 independently moves each Z-axis movable body 352 up and down based on the power supply from the stage control unit 37, thereby adjusting the Z coordinate of the assembly 70.

[0035] The stage control unit 37 of the stage 30 is connected to the controller 90 of the inspection device 1, and controls a motor driver unit (not shown) based on a command from the controller 90 to operate the stage 30. The stage control unit 37 has, for example, a main control unit that controls the operation of the entire stage 30, a PLC that controls the operation of the moving unit 32, a temperature controller that controls the temperature adjustment module 36, an illumination control unit, a power supply unit, and the like (all not shown). After the stage control unit 37 receives the assembly 70 from the loader 13 onto the mounting table 31, the stage control unit 37 operates the moving unit 32 to move the assembly 70 in the horizontal direction. Furthermore, the stage control unit 37 raises the assembly 70 at a position facing the probe card 21, and brings the assembly 70 into contact with each probe 22 of the probe card 21. In this state, the controller 90 starts the inspection by the tester 20. After the tester 20 finishes the inspection, the stage control unit 37 lowers and horizontally moves the inspected wafer W by the reverse operation to the above, and returns the wafer W to the loader 13.

[0036] The controller 90 of the inspection device 1 is a computer having a processor 91, a memory 92, an input / output interface and a communication interface (not shown), etc. The processor is one or a combination of a central processing unit (CPU), a graphics processing unit (GPU), an application specific integrated circuit (ASIC), a field-programmable gate array (FPGA), a circuit made of a plurality of discrete semiconductors, etc., and executes and processes a program stored in the memory. The memory includes a main storage device made of a semiconductor memory or the like, and an auxiliary storage device made of a disk, a semiconductor memory (flash memory), etc.

[0037] Fig. 3 is a schematic side cross-sectional view showing an enlarged inspection state of the wafer W of the assembly 70 in the inspection device 1. Next, the assembly 70 inspected by the inspection device 1 according to the embodiment will be described with reference to Fig. 3. The assembly 70 is formed by preparing a jig substrate 60 in addition to the wafer W, and fixing a lower surface Wsb, which is the surface of the wafer W facing the wiring layer 114, to an upper surface 60sa, which is one surface of the jig substrate 60.

[0038] The jig substrate 60 has a planar shape larger than the wafer W (a diameter larger than that of the wafer W). The jig substrate 60 protrudes radially outward beyond the outer edge of the wafer W when the wafer W and the jig substrate 60 are fixed to each other. During inspection by the inspection device 1, the jig substrate 60 positions the imaging devices 100 of the wafer W at positions facing the illumination unit 23 of the tester 20, while positioning the protruding portion at a position facing the probe card 21. The lower surface 60sb of the jig substrate 60 is formed flat, and allows the assembly 70 to be stably placed on the mounting surface 31s of the stage 30.

[0039] The jig substrate 60 is configured by stacking a first substrate 61, which is continuous in a flat plate shape, and a ring-shaped second substrate 62, which has a hole 62h in the center. The first substrate 61 and the second substrate 62 are made of the same material and are inseparably joined by a joining means such as welding, adhesion, or mechanical engagement. The jig substrate 60 is not limited to a configuration formed by a plurality of parts (the first substrate 61, the second substrate 62), and may be formed by a single part. By stacking the first substrate 61 and the second substrate 62, a recess 60a corresponding to the hole 62h of the second substrate 62 is formed in the center of the upper surface 60sa of the jig substrate 60.

[0040] The first substrate 61 is made of an insulating material such as a resin material and is formed in a circular shape in a plan view. The first substrate 61 has a plurality of fixture probes 611 (first connection parts) protruding toward the opening direction (vertically upward) of the recess 60a at the center of the fixture substrate 60 (a part facing the hole 62h of the second substrate 62). The plurality of fixture probes 611 protrude inside the recess 60a. Each fixture probe 611 is made of a conductive material such as a metal, and in a state where the fixture substrate 60 and the wafer W are fixed, the protruding end portion thereof contacts an electrode pad 115 (see FIG. 2) connected to the wiring layer 114 of each imaging device 100. This allows each fixture probe 611 to be electrically connected to each imaging device 100.

[0041] The second substrate 62 is also made of an insulating material such as a resin material and has a circular ring shape in a plan view. The second substrate 62 has a jig substrate facing portion 622 facing the wafer W on a surface constituting the upper surface 60sa of the jig substrate 60 (the surface opposite to the fixing surface of the first substrate 61) and at a position radially outward from the hole portion 62h. The jig substrate facing portion 622 goes around the hole portion 62h in an annular shape. The jig substrate facing portion 622 has a test object side outer periphery Wsb on the outer periphery of the lower surface Wsb of the wafer W. out A fixing portion 71 for fixing the

[0042] Furthermore, the second substrate 62 has a plurality of pads 621 (second connection portions) at radially outer positions of the jig substrate facing portion 622. The plurality of pads 621 are formed of a conductive material such as metal, and are provided along the circumferential direction of the outer periphery of the second substrate 62 in the same number as the plurality of jig probes 611. The plurality of pads 621 are brought into contact with each of the probes 22 of the probe card 21 during testing, thereby being electrically connected to each of the probes 22.

[0043] The jig substrate 60 has a plurality of wirings 612 that electrically connect the plurality of jig probes 611 and the plurality of pads 621. For example, each wiring 612 includes a wiring 612a extending on the lower surface (lower surface 60sb of the jig substrate 60) of the first substrate 61, or a wiring 612b extending on the upper surface (interface with the second substrate 62) of the first substrate 61. Note that each wiring 612 is not limited to a configuration in which it extends while being exposed on the lower surface or upper surface of the first substrate 61, but may be a configuration in which it extends inside the substrate.

[0044] One end of each of the wires 612 is connected to a corresponding one of the jig probes 611, while the other end of each of the wires 612 is connected to a corresponding one of the pads 621. The wires 612 are not electrically connected to each other because they extend at intervals from each other. In other words, the jig probes 611, the wires 612, and the pads 621 are continuous between the center and the outer periphery of the jig substrate 60 in a 1:1:1 correspondence.

[0045] The jig substrate 60 configured as above is provided with a fixing portion 71 for fixing the lower surface Wsb of the wafer W to the jig substrate facing portion 622 surrounding the recess 60a on the upper surface 60sa. The fixing portion 71 may be applied with an adhesive having a suitable adhesive strength for fixing the wafer W before inspection so that it cannot be displaced, while allowing the wafer W to be detached after inspection. The type of the fixing portion 71 is not particularly limited, and for example, a microsphere (registered trademark) or the like may be applied. The fixing portion 71 is not limited to an adhesive, and may be appropriately configured to mechanically engage the wafer W with the jig substrate 60, or to temporarily weld the wafer W to the jig substrate 60. As an example, the jig substrate 60 may have a recess 60a having the same diameter as the diameter of the wafer W, and may be configured to fit and fix the outer edge of the wafer W.

[0046] The assembly 70 can be handled as an integrated member by fixing the wafer W and the jig substrate 60. When fixed, the jig probes 611 protruding into the recess 60a contact and conduct with the electrode pads 115 of the imaging devices 100 of the wafer W. As a result, the assembly 70 has a wiring structure in which conduction is provided between each imaging device 100 of the wafer W and each pad 621 provided radially outward of the wafer W.

[0047] Here, when forming the above-mentioned assembly 70, it is necessary to accurately align the wafer W and the jig substrate 60 and fix the wafer W and the jig substrate 60. For this reason, as shown in FIG. 4, in the embodiment, an inspection system 50 having an inspection device 1 and a positioning and fixing device 51 is constructed, and the assembly 70 is formed before the wafer W is inspected by the inspection device 1. FIG. 4 is a block diagram showing an outline of the inspection system 50 according to the embodiment. Note that the controller 90 of the inspection device 1 can be applied as a control unit that controls the entire inspection system 50. Alternatively, the inspection system 50 may be configured to include a control unit for each of the positioning and fixing device 51, the inspection device 1, and the transport robot, and each control unit may perform independent control (or linked control by information communication).

[0048] The inspection system 50 first uses a transfer robot (not shown) to transfer the wafer W and the jig substrate 60 to the positioning and fixing device 51, and fixes the wafer W and the jig substrate 60 in the positioning and fixing device 51 to create an assembly 70. Thereafter, the inspection system 50 uses the transfer robot to transfer the assembly 70 from the positioning and fixing device 51 to the inspection device 1, and inspects the wafer W of the assembly 70 in the inspection device 1. Note that the inspection system 50 is not limited to a configuration in which the wafer W and the jig substrate 60 are fixed by the positioning and fixing device 51, and for example, the assembly 70 may be created manually by an operator. At this time, it is preferable that the operator position the wafer W and the jig substrate 60 using a dedicated positioning jig (not shown).

[0049] Fig. 5 is a schematic side view showing the creation of the assembly 70 by the positioning and fixing device 51. As shown in Fig. 5, the positioning and fixing device 51 aligns the wafer W with the jig substrate 60 before fixing, and then fixes them together by bringing the lower surface Wsb of the wafer W into contact with the upper surface 60sa of the jig substrate 60.

[0050] For example, the positioning and fixing device 51 includes a hand mechanism 52 that grips the outer edge of the wafer W with a plurality of claws 53. The positioning and fixing device 51 detects the positions of the fixture probes 611 on the fixture board 60 and the positions of the imaging devices 100 on the wafer W by an imaging unit (not shown) and recognizes these positions. Based on the recognized positions, the positioning and fixing device 51 moves the hand mechanism 52 gripping the wafer W to an appropriate horizontal coordinate position and rotates it about an axis, thereby aligning the fixture probes 611 with the electrode pads 115 (see FIG. 2) of the imaging devices 100. The hand mechanism 52 also lowers the aligned wafer W toward the fixture board 60, thereby causing the inspection object side outer periphery W of the underside Wsb of the wafer W to be attached to the fixing portion 71 of the fixture board 60. out In this way, positioning and fixing device 51 can bring electrode pads 115 and jig probes 611 into contact with high precision, thereby obtaining assembly 70 in which wafer W and jig substrate 60 are integrated together.

[0051] The inspection apparatus 1 and inspection system 50 according to the embodiment are basically configured as described above, and a method for inspecting a wafer W will be described below with reference to Fig. 6. Fig. 6 is a flowchart showing a method for inspecting a wafer W having imaging devices 100 according to the embodiment.

[0052] In the method for inspecting the wafer W, the control unit (controller 90) of the inspection system 50 controls the positioning and fixing device 51, the inspection device 1, and the transfer robot to perform steps S101 to S107 shown in FIG.

[0053] In the inspection method, the controller 90 first controls the transfer robot to transfer the wafer W to be inspected to the positioning and fixing device 51 (step S101). Note that the inspection system 50 also transfers the fixture substrate 60 to the positioning and fixing device 51 in advance before or after the transfer of the wafer W.

[0054] Next, the controller 90 controls the positioning and fixing device 51 to bond the wafer W to be inspected to the jig substrate 60 to create an assembly 70 (step S102). For example, the positioning and fixing device 51 aligns the wafer W with the jig substrate 60 as shown in Fig. 5, and then lowers the wafer W onto the jig substrate 60. As a result, the lower surface Wsb of the wafer W and the upper surface 60sa of the jig substrate 60 are fixed by the fixing portion 71, and misalignment of the wafer W with respect to the jig substrate 60 is suppressed.

[0055] Thereafter, the controller 90 controls the transfer robot to transfer the created assembly 70 to the inspection device 1 (step S103). After transferring the assembly, the controller 90 proceeds to inspect the wafer W of the assembly 70 by the inspection device 1. At this time, it is preferable that the inspection device 1 adjusts the stage 30 (temperature adjustment module 36) to a target temperature under the control of the controller 90.

[0056] In the inspection device 1, the assembly 70 is placed on the stage 30 by the transport device of the loader 13, and then the stage 30 is moved horizontally and elevated under the control of the stage control unit 37 to bring each pad 621 of the assembly 70 into contact with each probe 22 (step S104). As shown in FIG. 3, each probe 22 corresponds to the position of each pad 621 of the jig substrate 60. The stage 30 moves the assembly 70 horizontally to a position where each pad 621 faces each probe 22, and then raises the assembly 70 until all the pads 621 come into contact with all the probes 22. This ensures that each probe 22 and each pad 621 come into contact with each other. In addition, when the assembly 70 and each probe 22 are in contact with each other, each imaging device 100 of the wafer W and the illumination unit 23 face each other in the vertical direction and are sufficiently close to each other.

[0057] In this state, the inspection apparatus 1 operates the tester 20 under the control of the controller 90 to inspect each imaging device 100 on the wafer W (step S105). The tester 20 irradiates the wafer W with inspection light from the illumination unit 23. Each imaging device 100 on the wafer W receives the inspection light through the on-chip lens 111, the color filter 112, and the photodiode 113 in this order (see FIG. 2(A)), and outputs an appropriate electric signal from the electrode pad 115 of the wiring layer 114. As shown in FIG. 3, when each jig probe 611 receives this electric signal, the jig substrate 60 passes the electric signal through each wiring 612 and each pad 621, and outputs it to each probe 22 in contact. This allows the tester 20 to obtain the inspection result of each imaging device 100 via each probe 22 and the probe card 21.

[0058] When the inspection of the wafer W is completed, the inspection device 1 performs a process of unloading the assembly 70 (step S106). The stage 30 separates the assembly 70 from each probe 22 by performing an operation reverse to that before the inspection, and transfers the assembly 70 to the transfer device of the loader 13. Then, the controller 90 causes the transfer robot of the inspection system 50 to unload the assembly 70 from the inspection device 1.

[0059] Finally, the inspection system 50 separates the wafer W from the jig substrate 60 of the assembly 70 and removes the wafer W (step S106). This process may be performed automatically by a separating device (not shown) after the assembly 70 is transported to the separating device, or may be performed manually by an operator after the assembly 70 is transported to a processing position (not shown).

[0060] The inspection method can stably inspect each imaging device 100 on the wafer W by the above process flow. The inspection apparatus 1 according to the embodiment does not need to adopt a configuration for irradiating the back side of the wafer W (a configuration in which the illumination unit 23 and each probe 22 are arranged on the opposite side of the wafer W), and can use a conventional general stage 30 (prober device). In addition, the jig substrate 60 has a sufficiently thin plate thickness to facilitate the transfer of temperature from the stage 30 to the wafer W. Therefore, the inspection apparatus 1 can smoothly adjust the temperature of the wafer W to a target temperature by the temperature adjustment module 36 in the mounting table 31.

[0061] Incidentally, in a configuration in which the imaging device 100 is irradiated on the surface (a configuration in which the illumination unit 23 and each probe 22 are arranged on the same side), it is also conceivable to arrange each pad 621 in contact with each probe 22 at a position horizontally distant from the wafer W having each imaging device 100. However, when the distance between the wafer W and each pad 621 is increased in this way, a chuck for supporting each pad 621 is required in addition to the chuck for supporting the wafer W, and the stage 30 becomes larger. In contrast, the jig substrate 60 according to the embodiment can arrange each pad 621 in the vicinity of the wafer W and over the entire circumference, and can support the assembly 70 with only one chuck. Therefore, the stage 30 can be made smaller, and the footprint of the inspection device 1 can be improved. Furthermore, for example, compared to a configuration in which each pad 621 is arranged at a position horizontally distant from the wafer W, the assembly 70 can shorten the wiring length from the electrode pad 115 of the wafer W to each pad 621 of the jig substrate 60. As a result, in the inspection of the wafer W, it is possible to reduce electrical noise and improve the accuracy of the inspection.

[0062] The inspection method, inspection device 1, and inspection system 50 according to the present disclosure are not limited to the above embodiment, and may take various modified forms. For example, the jig substrate 60 according to the embodiment has a recess 60a and a jig probe 611. However, the jig substrate 60 may be formed flat without the recess 60a, and may have a connection portion (a pad, a conductive sheet, adhesive, etc.) that contacts the electrode pad 115 of each imaging device 100 on the wafer W.

[0063] FIG. 7(A) is a side cross-sectional view that shows a schematic diagram of an assembly 70A according to a first modified example. FIG. 7(B) is a side cross-sectional view that shows a schematic diagram of an assembly 70B according to a second modified example. As shown in FIG. 7(A), the assembly 70A according to the first modified example differs from the assembly 70 according to the above embodiment in that a deformation suppressing member 80 is laminated on the upper surface Wsa side of the wafer W. In the following description of the modified examples, the same reference numerals are used to designate the same configurations or configurations having the same functions as those of the assembly 70 according to the embodiment, and detailed description thereof will be omitted.

[0064] The deformation suppression member 80 is laminated at a position opposite to the jig substrate 60 sandwiching the wafer W (on the upper surface 60sa of the wafer W), thereby suppressing deformation of the wafer W due to a contact load when each jig probe 611 of the jig substrate 60 is in contact with the wafer W. This makes it possible to prevent damage to the wafer W (for example, deformation of the outer periphery of the wafer W) and peeling off (release from fixation) from the jig substrate 60, even if each jig probe 611 applies a large contact load to the wafer W.

[0065] For example, the deformation suppression member 80 is formed of a material harder than the wafer W, and has a through hole 80h (or a recess) in the center facing each imaging device 100 of the wafer W. The through hole 80h serves as an optical path for guiding inspection light from the illumination unit 23 to each imaging device 100 when inspecting the wafer W. The deformation suppression member 80 is positioned relative to the jig substrate 60 when the wafers W are stacked, and may have a fixing protrusion 81 for fixing the deformation suppression member 80 to the jig substrate 60.

[0066] The deformation suppression member 80 may be formed of a material such as glass that is transmissive to the inspection light. In this case, the deformation suppression member 80 can guide the inspection light to each imaging device 100 even if the deformation suppression member 80 does not have the through-hole 80h. Alternatively, the deformation suppression member 80 may have a recess (not shown) to avoid contact with the on-chip lens 111.

[0067] 7B shows an assembly 70B according to a second modified example, which is different from the above assemblies 70 and 70A in that it has each jig probe 615 capable of controlling the contact load on the wafer W. For example, in the assembly 70B, the protruding length of the jig probe 615 located at the center is set to be longer than the protruding length of the jig probe 615b located at the outer periphery. The protruding length of each jig probe 615a, 615b may be designed in accordance with the warpage of the wafer W, by calculating the warpage of the wafer W in advance. This allows each jig probe 615 to apply a uniform contact load to the entire wafer W, and the contact state between each electrode pad 115 of the wafer W and each jig probe 615 can be stabilized.

[0068] Note that the adjustment of the contact load on the wafer W is not limited to varying the protrusion length of each jig probe 615. For example, the contact load can also be adjusted by changing the spring force of each jig probe 615 depending on the position (stronger at the center and weaker at the outer periphery, etc.).

[0069] The technical ideas and effects of the present disclosure explained in the above embodiments will be described below.

[0070] A first aspect of the present disclosure is a method for inspecting an object to be inspected (wafer W) having an imaging device 100 on which light is incident from a surface (upper surface Wsa) opposite to a wiring layer 114, the method including: (A) a step of fixing the object to be inspected and a fixture substrate 60 to form an assembly 70; and (B) after the step (A), a step of inspecting the object to be inspected by irradiating the imaging device 100 of the object to be inspected with inspection light from a lighting unit 23, the fixture substrate 60 having a plurality of first connection parts (fixture probes 611) and a plurality of first connection parts that are electrically connected to each of the plurality of first connection parts and are provided adjacent to the plurality of first connection parts. The test object has one surface (upper surface 60sa) having a plurality of second connection parts (pads 621), and in step (A), a surface (lower surface Wsb) having pads (electrode pads 115) connected to the wiring layer 114 of the test object is opposed to one surface of the jig substrate 60, and the pads (electrode pads 115) are electrically connected to the plurality of first connection parts to form an assembly 70, and in step (B), the opposite surface of the test object in the assembly 70 is faced to the illumination unit 23, and the plurality of probes 22 provided adjacent to the illumination unit 23 are brought into contact with each of the plurality of second connection parts, thereby inspecting the test object.

[0071] As described above, the inspection method can smoothly inspect the inspection object with a simple configuration by creating an assembly 70 in which the inspection object (wafer W) and the jig substrate 60 are fixed. That is, the assembly 70 is moved using a stage 30 having a similar configuration to the conventional stage 30 with respect to the tester 20 in which the multiple probes 22 and the illumination unit 23 are installed in the same direction. Then, the inspection method can stably inspect the imaging device 100 by irradiating inspection light from the illumination unit 23 and acquiring electrical signals of the imaging device 100 via the multiple probes 22 while each probe 22 is in contact with each of the multiple second connection parts (pads 621).

[0072] Furthermore, the jig substrate 60 has a plurality of second connection parts (pads 621) arranged around the periphery of the plurality of first connection parts (jig probes 611). This allows the assembly 70 in which the test object (wafer W) and the jig substrate 60 are fixed to have the plurality of second connection parts (pads 621) arranged close to the test object, shortening the wiring length and reducing noise, etc.

[0073] Moreover, the jig substrate 60 has a planar shape larger than the inspection object (wafer W), and in step (A), the imaging device 100 of the inspection object is placed on the multiple first connection parts (jig probes 611) to stack the inspection object and the jig substrate 60, thereby exposing the multiple second connection parts (pads 621) to the outside of the inspection object. This allows the inspection method to create an assembly 70 in which the imaging device 100 and the second connection parts of the inspection object face the same direction, and the second connection parts are disposed adjacent to the imaging device 100.

[0074] Furthermore, the multiple probes 22 are arranged so as to circle around the illumination unit 23, and in step (B), with the multiple probes 22 and the multiple second connection parts (pads 621) in contact with each other, inspection light is irradiated from the illumination unit 23 inside the multiple probes 22 to the imaging device 100 inside the multiple second connection parts. This allows the inspection method to irradiate appropriate inspection light from the illumination unit 23 to the imaging device 100 inside the multiple probes 22 and the multiple second connection parts.

[0075] Moreover, in step (B), the assembly 70 is placed on the mounting surface 31s of the stage 30, and the stage 30 is moved in the horizontal direction and raised vertically upward to bring the second connection parts (pads 621) into contact with the probes 22. Thereby, in the inspection method, a state in which each second connection part of the assembly 70 and each probe 22 are in contact with each other can be smoothly formed under the operation of the stage 30.

[0076] In step (B), the temperature of the assembly 70 is adjusted by the temperature adjustment module 36 provided inside the stage 30. This allows the inspection method to accurately adjust the temperature of the object to be inspected (wafer W) to a target temperature using the temperature adjustment module 36, thereby enabling inspection of the object to be inspected.

[0077] At least one of the inspection object side outer periphery of the inspection object (wafer W) outside the imaging device 100 and the jig substrate facing portion facing the inspection object side outer periphery of the jig substrate 60 has a fixing portion 71 for fixing the inspection object and the jig substrate 60, and in step (A), with the inspection object side outer periphery and the jig substrate facing portion facing each other, the pads (electrode pads 115) of the inspection object and the multiple first connection portions (jig probes 611) are positioned, and the inspection object and the jig substrate 60 are fixed by the fixing portion 71. This makes it possible for the inspection method to produce an assembly 70 in which the inspection object is accurately positioned relative to the jig substrate 60.

[0078] Furthermore, the jig substrate 60 has a recess 60a at a position facing the imaging device 100 of the inspection object (wafer W), and the multiple first connection portions are multiple jig probes 611 that protrude into the recess 60a and contact pads (electrode pads 115) of the inspection object. According to the above, the inspection method can easily create an assembly 70 in which the wiring layer 114 of the inspection object and the jig probes 611 are in contact with each other.

[0079] Furthermore, the multiple jig probes 611 have different protrusion lengths or spring forces. This allows the assembly 70B to appropriately adjust the contact load applied to the test object from the multiple jig probes 611. For example, the assembly 70 can suppress deformation of the test object by applying a uniform contact load to the test object.

[0080] Furthermore, in the assembly 70A, a deformation suppressing member 80 for suppressing deformation of the inspection object (wafer W) is laminated at a position opposite the jig substrate 60 sandwiching the inspection object. By laminating this deformation suppressing member 80, the inspection method can suppress deformation of the inspection object caused by a contact load, which may result in damage or the like.

[0081] A second aspect of the present disclosure is an inspection apparatus 1 for an inspection object (wafer W) having an imaging device 100 into which light is incident from a surface (upper surface Wsa) opposite to a wiring layer 114, in which a jig substrate 60 has, on one surface (upper surface 60sa), a plurality of first connection portions (jig probes 611) and a plurality of second connection portions (pads 621) that are electrically connected to each of the plurality of first connection portions and are provided at positions adjacent to the plurality of first connection portions, and the one surface of the jig substrate 60 is fixed opposite a surface (lower surface Wsb) having pads (electrode pads 115) connected to the wiring layer 114 of the inspection object, so that the inspection object is formed into an assembly 70 in which the pads (electrode pads 115) are electrically connected to the plurality of first connection portions. The inspection apparatus includes a stage 30 on which a fixture substrate 60 of the assembly 70 is placed, an illumination unit 23 that irradiates inspection light onto the inspection object of the assembly 70, a plurality of probes 22 that are provided adjacent to the illumination unit 23 and can contact each of the plurality of second connection parts, and a control unit (controller 90) that controls the stage 30 and the illumination unit 23. The control unit operates the stage 30 to face the opposite side of the inspection object in the assembly 70 to the illumination unit 23 and bring the plurality of probes 22 into contact with each of the plurality of second connection parts, and inspects the inspection object by irradiating inspection light from the illumination unit 23 and acquiring electrical signals of the imaging device 100 via the plurality of probes 22.

[0082] A third aspect of the present disclosure is an inspection system 50 for an inspection object (wafer W) having an imaging device 100 on which light is incident from a surface (upper surface Wsa) opposite to a wiring layer 114, the inspection system including a positioning and fixing device 51 for forming an assembly 70 in which one surface (upper surface 60sa) of a jig substrate 60 is provided with a plurality of first connection portions (jig probes 611) and a plurality of second connection portions (pads 621) that are electrically connected to each of the plurality of first connection portions and are provided at positions adjacent to the plurality of first connection portions, and the one surface (upper surface 60sa) of the inspection object is fixed opposite to a surface (lower surface Wsb) having pads (electrode pads 115) connected to the wiring layer 114 of the inspection object, and the pads (electrode pads 115) are electrically connected to the plurality of first connection portions. The inspection apparatus 1 includes a stage 30 on which the jig substrate 60 of the assembly 70 is placed, an illumination unit 23 that irradiates the inspection object of the assembly 70 with inspection light, a plurality of probes 22 that are provided adjacent to the illumination unit 23 and can contact each of the second connection parts, and a control unit (controller 90) that controls the stage 30 and the illumination unit 23, and the control unit operates the stage 30 to make the opposite surface of the inspection object in the assembly 70 face the illumination unit 23 and bring the plurality of probes 22 into contact with each of the second connection parts, irradiates the inspection light from the illumination unit 23, and acquires electrical signals of the imaging device 100 via the plurality of probes 22, thereby inspecting the inspection object. In the second and third aspects described above, the inspection of the inspection object can be smoothly performed by a simple configuration.

[0083] The inspection method, the inspection device 1, and the inspection system 50 according to the embodiments disclosed herein are illustrative and not restrictive in all respects. The embodiments can be modified and improved in various forms without departing from the spirit and scope of the appended claims. The matters described in the above embodiments can be configured in other ways as long as they are not inconsistent, and can be combined as long as they are not inconsistent. [Explanation of symbols]

[0084] 1. Inspection equipment 23 Lighting Department 50 Inspection Systems 60 Jig Board 60sa top 611 Jig Probe 621 Pad 70 Assembly 100 Imaging Device 114 Wiring layer W wafer Wsa top side Wsb bottom side

Claims

1. A method for inspecting an object to be inspected having an imaging device into which light is incident from a surface opposite to a wiring layer, comprising the steps of: (A) fixing the test body and a jig substrate to form an assembly; (B) after the step (A), a step of inspecting the inspection object by irradiating the imaging device of the inspection object with inspection light from an illumination unit, the jig substrate includes a plurality of first connection portions and a plurality of second connection portions on one surface thereof, the second connection portions being electrically connected to the plurality of first connection portions, the second connection portions being provided at positions adjacent to the plurality of first connection portions, In the step (A), a surface of the test body having pads connected to the wiring layer is opposed to the one surface of the jig substrate, and the pads and the plurality of first connection portions are electrically connected to form the assembly; In the step (B), the opposite surface of the inspection body in the assembly is made to face the illumination unit, and a plurality of probes provided at positions adjacent to the illumination unit are brought into contact with each of the plurality of second connection portions, thereby inspecting the inspection body. Testing method.

2. The jig substrate has the second connection portions arranged around the first connection portions. The inspection method according to claim 1 .

3. the jig substrate has a planar shape larger than the test object, In the step (A), the imaging device of the inspection body is overlapped with the plurality of first connection portions, and the inspection body and the jig substrate are laminated to expose the plurality of second connection portions to the outside of the inspection body. The inspection method according to claim 2.

4. the plurality of probes are arranged so as to circle around the periphery of the illumination unit, In the step (B), inspection light is irradiated from the illumination unit inside the plurality of probes to the imaging device inside the plurality of second connection portions in a state in which the plurality of probes and the plurality of second connection portions are in contact with each other. The inspection method according to claim 3.

5. In the step (B), the assembly is placed on a mounting surface of a stage, and the stage is moved in a horizontal direction and raised upward in a vertical direction to bring the second connection portions into contact with the probes. The inspection method according to any one of claims 1 to 4.

6. In the step (B), a temperature of the assembly is adjusted by a temperature control module provided inside the stage. The inspection method according to claim 5.

7. At least one of an inspection object side outer periphery portion of the inspection object that is located outside the imaging device and a jig substrate facing portion that faces the inspection object side outer periphery portion of the jig substrate has a fixing portion that fixes the inspection object and the jig substrate, In the step (A), the pads of the test body and the plurality of first connection portions are positioned in a state in which the test body side outer peripheral portion and the jig substrate facing portion are opposed to each other, and the test body and the jig substrate are fixed by the fixing portion. The inspection method according to any one of claims 1 to 4.

8. the jig substrate has a recess at a position facing the imaging device of the inspection object, the plurality of first connection portions are a plurality of jig probes that protrude from inside the recess and contact the pads of the test device; The inspection method according to any one of claims 1 to 4.

9. The plurality of jig probes have different protrusion lengths or spring forces. The inspection method according to claim 8.

10. The assembly includes a deformation suppression member for suppressing deformation of the inspection object, the deformation suppression member being laminated on an opposite side of the jig substrate with the inspection object sandwiched therebetween. The inspection method according to any one of claims 1 to 4.

11. An inspection apparatus for an inspection object having an imaging device into which light is incident from a surface opposite to a wiring layer, a surface of a fixture substrate having a plurality of first connection portions and a plurality of second connection portions on one surface thereof, the second connection portions being electrically connected to the plurality of first connection portions and being provided at positions adjacent to the plurality of first connection portions, is fixed opposite to a surface of the test body having a pad connected to the wiring layer, so that the test body is formed into an assembly in which the pad and the plurality of first connection portions are electrically connected to each other; a stage on which the jig substrate of the assembly is placed; an illumination unit that irradiates the inspection object of the assembly with inspection light; a plurality of probes provided adjacent to the illumination unit and capable of contacting each of the second connection portions; a control unit for controlling the stage and the lighting unit, the control unit operates the stage to bring the opposite surface of the inspection object in the assembly into contact with the illumination unit and to bring the multiple probes into contact with each of the multiple second connection portions, and then irradiates the inspection light from the illumination unit and acquires an electrical signal from the imaging device via the multiple probes, thereby inspecting the inspection object. Inspection equipment.

12. An inspection system for an inspection object having an imaging device into which light is incident from a surface opposite to a wiring layer, a positioning and fixing device for fixing one side of a fixture substrate, the one side of which has a plurality of first connection parts and a plurality of second connection parts that are electrically connected to each of the plurality of first connection parts and are provided at positions adjacent to the plurality of first connection parts, opposite to a surface of the test object having pads connected to the wiring layer, to form an assembly in which the pads and the plurality of first connection parts are electrically connected; an inspection device for inspecting the inspection object of the assembly; The inspection device includes: a stage on which the jig substrate of the assembly is placed; an illumination unit that irradiates the inspection object of the assembly with inspection light; a plurality of probes provided adjacent to the illumination unit and capable of contacting each of the second connection portions; a control unit for controlling the stage and the lighting unit, the control unit operates the stage to bring the opposite surface of the inspection object in the assembly into contact with the illumination unit and to bring the multiple probes into contact with each of the multiple second connection portions, and then irradiates the inspection light from the illumination unit and acquires an electrical signal from the imaging device via the multiple probes, thereby inspecting the inspection object. Inspection system.

Images