Flexible substrate

Abstract

To provide a flexible substrate capable of reducing the fracture risk of wiring.SOLUTION: A flexible substrate comprises: an insulation base material including a plurality of first band parts extending in a first direction and disposed in parallel in a second direction crossing the first direction, a plurality of second band parts extending in the second direction and disposed in parallel in the first direction and a plurality of island-shaped parts positioned in crossing parts of the first band parts and the second band parts; a plurality of electric elements overlapping the island-shaped parts; a plurality of scan lines extending while overlapping the first band parts; a plurality of signal lines extending while overlapping the second band parts; a first organic insulator film which is positioned in an upper layer than the scan lines and the signal lines and overlaps the first band parts and the second band parts; a second organic insulator film which is positioned at an upper side of the first organic insulator film; a stopper layer which is positioned between the first organic insulator film and the second organic insulator film; and a barrier layer which is positioned at an upper side of the second organic insulator film.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] FIELD OF THE DISCLOSURE The present invention relates to a flexible substrate. [Background technology]

[0002] In recent years, the use of flexible substrates having flexibility and stretchability has been considered in various fields. For example, a flexible substrate having electrical elements arranged in a matrix may be attached to a curved surface of an electronic device housing, a human body, etc. As the electrical elements, various sensors such as a touch sensor and a temperature sensor, and display elements may be used.

[0003] In flexible substrates, measures must be taken to prevent the wiring from being damaged by stress caused by bending or stretching. As such measures, for example, it has been proposed to provide honeycomb-shaped openings in the substrate that supports the wiring, or to make the wiring meandering (meandering) shape. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2015-198101 A [Patent Document 2] JP 2015-198102 A [Patent Document 3] JP 2017-118109 A [Patent Document 4] JP 2017-113088 A Summary of the Invention [Problem to be solved by the invention]

[0005] An object of this embodiment is to provide a flexible substrate capable of reducing the risk of wiring breakage. [Means for solving the problem]

[0006] According to the present embodiment, there is provided a flexible substrate comprising: an insulating substrate having a plurality of first band portions extending in a first direction and aligned in a second direction intersecting the first direction, a plurality of second band portions extending in the second direction and aligned in the first direction, and a plurality of island-shaped portions located at intersections of the first band portions and the second band portions; a plurality of electric elements overlapping the island-shaped portions; a plurality of scanning lines extending and overlapping the first band portions, a plurality of signal lines extending and overlapping the second band portions, a first organic insulating film located in a layer above the scanning lines and the signal lines and overlapping the first band portions and the second band portions; a second organic insulating film located on the first organic insulating film; a stopper layer located between the first organic insulating film and the second organic insulating film; and a barrier layer located on the second organic insulating film. [Brief description of the drawings]

[0007] [Figure 1] FIG. 1 is a schematic plan view of a flexible substrate according to the present embodiment. [Diagram 2] FIG. 2 is an enlarged plan view of a portion of the flexible substrate shown in FIG. [Diagram 3] FIG. 3 is a cross-sectional view of the flexible substrate taken along line AB shown in FIG. [Figure 4] FIG. 4 is a cross-sectional view of the flexible substrate taken along line CD shown in FIG. [Diagram 5] FIG. 5 is a plan view showing the barrier layer and the stopper layer. [Figure 6] FIG. 6 is a cross-sectional view of the flexible substrate taken along line AB shown in FIG. [Figure 7] FIG. 7 is a cross-sectional view of the flexible substrate taken along line CD shown in FIG. [Figure 8] FIG. 8 is a plan view showing the stopper layer. [Figure 9] FIG. 9 is a cross-sectional view of the flexible substrate taken along line AB shown in FIG. [Figure 10] FIG. 10 is a cross-sectional view of the flexible substrate taken along line CD shown in FIG. [Figure 11] FIG. 11 is a cross-sectional view of the flexible substrate taken along line AB shown in FIG. [Figure 12] FIG. 12 is a cross-sectional view of the flexible substrate taken along line CD shown in FIG. [Figure 13] FIG. 13 is a cross-sectional view of the flexible substrate taken along line AB shown in FIG. [Figure 14] FIG. 14 is a cross-sectional view of the flexible substrate taken along line CD shown in FIG. [Figure 15] FIG. 15 is a cross-sectional view of the flexible substrate taken along line AB shown in FIG. [Figure 16] FIG. 16 is a cross-sectional view of the flexible substrate taken along line CD shown in FIG. [Figure 17] FIG. 17 is a plan view showing the stopper layer. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Hereinafter, the present embodiment will be described with reference to the drawings. Note that the disclosure is merely an example, and those who are skilled in the art can easily conceive of appropriate modifications while maintaining the gist of the invention are naturally included in the scope of the present invention. In addition, the drawings may be schematic in terms of width, thickness, shape, etc. of each part compared to the actual embodiment in order to make the explanation clearer, but they are merely examples and do not limit the interpretation of the present invention. In addition, in this specification and each figure, components that perform the same or similar functions as those described above with respect to the previous figures are given the same reference numerals, and duplicate detailed explanations may be omitted as appropriate.

[0009] [First embodiment] First, the configuration of the first embodiment will be described with reference to FIGS.

[0010] FIG. 1 is a schematic plan view of a flexible substrate 100 according to the present embodiment. In this embodiment, a first direction D1, a second direction D2, and a third direction D3 are defined as shown in the figure. The first direction D1 and the second direction D2 are parallel to the main surface of the flexible substrate 100 and intersect with each other. The third direction D3 is a direction perpendicular to the first direction D1 and the second direction D2, and corresponds to the thickness direction of the flexible substrate 100. In this embodiment, the first direction D1 and the second direction D2 intersect perpendicularly, but may intersect at an angle other than perpendicular. In this specification, the direction toward the tip of the arrow indicating the third direction D3 is referred to as "up", and the direction in the opposite direction from the tip of the arrow is referred to as "down". In addition, it is assumed that there is an observation position at the tip side of the arrow indicating the third direction D3 for observing the flexible substrate 100, and a view from this observation position toward the D1-D2 plane defined by the first direction D1 and the second direction D2 is referred to as a planar view.

[0011] 1, the flexible substrate 100 includes a plurality of scanning lines 1, a plurality of signal lines 2, a plurality of electric elements 3, a resin layer 81, a scanning line driver DR1, and a signal line driver DR2. The plurality of scanning lines 1, the plurality of signal lines 2, the plurality of electric elements 3, the scanning line driver DR1, and the signal line driver DR2 are provided on the resin layer 81.

[0012] The multiple scanning lines 1 each extend in a first direction D1 and are arranged in a second direction D2. The multiple scanning lines 1 are each connected to a scanning line driver DR1. The multiple signal lines 2 each extend in the second direction D2 and are arranged in the first direction D1. The multiple signal lines 2 each are connected to a signal line driver DR2. The multiple electric elements 3 are each located at an intersection of the scanning lines 1 and the signal lines 2 and are electrically connected to the scanning lines 1 and the signal lines 2.

[0013] A scanning signal is supplied to the electric element 3 via the scanning line 1. For example, if the electric element 3 is an element that outputs a signal, such as a sensor, an output signal from the electric element 3 is supplied to the signal line 2. The scanning line 1 and the signal line 2 are examples of wiring provided in the flexible substrate 100. In addition to the scanning line 1 and the signal line 2, the flexible substrate 100 may also include other types of wiring, such as a power supply line that supplies power to the electric element 3.

[0014] The scanning line driver DR1 functions as a supply source that supplies scanning signals to each of the scanning lines 1. In addition, the signal line driver DR2 functions as a supply source that supplies drive signals to each of the signal lines 2, or as a signal processing unit that processes output signals output to each of the signal lines 2.

[0015] FIG. 2 is an enlarged plan view of a portion of the flexible substrate 100 shown in FIG. 2, the flexible substrate 100 further includes an insulating substrate 4 that supports the scan lines 1 and the signal lines 2. The insulating substrate 4 has elasticity and flexibility. The insulating substrate 4 is formed using, for example, polyimide, but is not limited to this example.

[0016] The insulating base material 4 includes a plurality of island-shaped portions 40, and a plurality of first band portions 41 and a plurality of second band portions 42 formed integrally with the island-shaped portions 40. The insulating base material 4 is formed in a mesh shape. The plurality of island-shaped portions 40 are arranged in a matrix shape in the first direction D1 and the second direction D2 at intervals from each other. The plurality of island-shaped portions 40 are located at the intersections of the first band portions 41 and the second band portions 42. Each of the island-shaped portions 40 is formed, for example, in a quadrangle shape in a plan view. The island-shaped portions 40 may be formed in another polygonal shape, or may be formed in a circular or elliptical shape.

[0017] The first band portions 41 extend generally in the first direction D1 and are aligned in the second direction D2. The first band portions 41 connect the island portions 40 aligned in the first direction D1. The second band portions 42 extend generally in the second direction D2 and are aligned in the first direction D1. The second band portions 42 connect the island portions 40 aligned in the second direction D2. The first band portions 41 and the second band portions 42 are each formed in a wavy shape in a plan view. In other words, the first band portions 41 and the second band portions 42 are formed in a meandering shape (meander shape) in a plan view.

[0018] The multiple scanning lines 1 extend outwardly, overlapping with the first band portion 41. The multiple signal lines 2 extend outwardly, overlapping with the second band portion 42. In other words, the scanning lines 1 and the signal lines 2 are both formed in a meandering shape.

[0019] A plurality of electric elements 3 overlap the island-shaped portion 40. For example, the electric element 3 is a sensor, a semiconductor element, an actuator, or the like. For example, as the sensor, an optical sensor that receives visible light or near-infrared light, a temperature sensor, a pressure sensor, or a touch sensor can be applied. For example, as the semiconductor element, a light-emitting element, a light-receiving element, a diode, or a transistor can be applied. When the electric element 3 is a light-emitting element, a flexible display having flexibility and stretchability can be realized. As the light-emitting element, for example, a light-emitting diode having a size of about 100 μm such as a mini LED or a micro LED, or an organic electroluminescence element can be applied. When the electric element 3 is an actuator, for example, a piezoelectric element can be applied. Note that the electric element 3 is not limited to those exemplified here, and elements having various other functions can be applied. The electric element 3 may be a capacitor, a resistor, or the like. In addition, the arrangement position and shape of the electric element 3 are not limited to the example shown in FIG. 2.

[0020] FIG. 3 is a cross-sectional view of the flexible substrate 100 taken along the line AB shown in FIG. As shown in FIG. 3, the flexible substrate 100 further includes insulating films 51 to 57, a stopper layer ST, a barrier layer BR, and a resin layer .

[0021] The insulating base material 4 is located on the resin layer 81. The insulating film 51 is located on the insulating base material 4. The insulating film 52 is located on the insulating film 51. The insulating film 53 is located on the insulating film 52. The scanning line 1 is located on the insulating film 53. The insulating film 54 is located on the insulating film 53 and covers the scanning line 1. The insulating film 55 is located on the insulating film 54.

[0022] The insulating films 51 to 55 are all inorganic insulating films made of an inorganic insulating material such as silicon oxide (SiO), silicon nitride (SiN), or silicon oxynitride (SiON).

[0023] The insulating film (first organic insulating film) 56 is located on the insulating film 55. The insulating film 56 is located above the scanning lines 1 and overlaps with the first band portion 41. The stopper layer ST is located on the insulating film 56. The stopper layer ST prevents cracks from above from reaching the scanning lines 1 and the signal lines 2. The stopper layer ST is formed using any one of silicon oxide (SiO), silicon nitride (SiN), polysilicon (Poly-Si), aluminum (Al), titanium (Ti), and copper (Cu). The insulating film (second organic insulating film) 57 is located on the insulating film 56 and the stopper layer ST. The stopper layer ST is located between the insulating films 56 and 57.

[0024] The insulating films 56 and 57 are, for example, organic insulating films made of an organic insulating material such as an acrylic resin.

[0025] The insulating film 56 has a first film thickness TH1. The insulating film 57 has a second film thickness TH2. The first film thickness TH1 and the second film thickness TH2 are equal to each other. That is, the stopper layer ST is located approximately in the center of the sum of the film thicknesses of the insulating films 56 and 57.

[0026] The barrier layer BR is located on the insulating film 57. The barrier layer BR is formed using, for example, any one of silicon oxide (SiO), silicon nitride (SiN), polysilicon (Poly-Si), aluminum (Al), titanium (Ti), and copper (Cu). The barrier layer BR may be formed using the same material as the stopper layer ST. The barrier layer BR prevents moisture and the like from penetrating from above the flexible substrate 100. The barrier layer BR and the stopper layer ST overlap the scanning line 1 .

[0027] The rigidity of the stopper layer ST is equal to or less than the rigidity of the barrier layer BR. For example, when the stopper layer ST is formed using the same material as the barrier layer BR, the third film thickness TH3 of the stopper layer ST is equal to or less than the fourth film thickness TH4 of the barrier layer BR. When the stopper layer ST is formed using a material different from the barrier layer BR, the stopper layer ST is formed to have a lower rigidity than the barrier layer BR by adjusting the elastic modulus of the materials used for the stopper layer ST and the barrier layer BR and their respective film thicknesses. By making the stopper layer ST lower in rigidity than the barrier layer BR, the stopper layer ST can be made less likely to break. In addition, the flexibility of the flexible substrate 100 can be improved.

[0028] The resin layer 82 covers the insulating base 4, the insulating films 51 to 57, the stopper layer ST, and the barrier layer BR. The resin layer 82 is in contact with the resin layer 81.

[0029] FIG. 4 is a cross-sectional view of the flexible substrate 100 taken along line CD shown in FIG. The signal line 2 is located on the insulating film 54. The insulating film 55 is located on the insulating film 54 and covers the signal line 2. The insulating film 56 is located in a layer above the signal line 2 and overlaps the second band portion 42. The barrier layer BR and the stopper layer ST overlap the signal line 2. As shown in FIGS. 3 and 4, the scanning lines 1, the insulating film 54, the signal lines 2, and the insulating film 55 are laminated in this order.

[0030] According to this embodiment, the stopper layer ST is located between the barrier layer BR and the scanning line 1. Also, the stopper layer ST is located between the barrier layer BR and the signal line 2. For example, when the flexible substrate 100 is stretched, a crack may occur in the barrier layer BR. Even if a crack occurs in the barrier layer BR and the crack progresses in the film thickness direction, the stopper layer ST stops the crack from progressing, thereby reducing the risk of the scanning line 1 and the signal line 2 breaking.

[0031] Moreover, the first thickness TH1 of the insulating film 56 and the second thickness TH2 of the insulating film 57 are equal to each other. For example, when the stopper layer ST is located close to the barrier layer BR, the stopper layer ST is likely to break at the same timing as the barrier layer BR. For example, when the stopper layer ST is located close to the scanning line 1 and the signal line 2, the scanning line 1 and the signal line 2 are likely to break at the same timing as the stopper layer ST. By positioning the stopper layer ST at approximately the center of the sum of the thicknesses of the insulating films 56 and 57, the above-mentioned risk can be reduced.

[0032] 5 is a plan view showing the barrier layer BR and the stopper layer ST. In FIG. 5, the barrier layer BR and the stopper layer ST are located in the area indicated by dotted hatching.

[0033] The barrier layer BR has a plurality of strip-shaped first portions BR11 extending generally in the first direction D1 and aligned in the second direction D2, a plurality of strip-shaped second portions BR12 extending generally in the second direction D2 and aligned in the first direction D1, and a third portion BR13 located at an intersection of the first portions BR11 and the second portions BR12. The first portions BR11 extend overlapping the first band portion 41. The second portions BR12 extend overlapping the second band portion 42. The first portions BR11 and the second portions BR12 are each formed in a wavy shape in a plan view. The plurality of third portions BR13 overlap the island portions 40. The third portions BR13 are aligned in a matrix shape in the first direction D1 and the second direction D2 at intervals from each other.

[0034] The stopper layer ST has a plurality of strip-shaped first portions ST11 extending generally in the first direction D1 and aligned in the second direction D2, a plurality of strip-shaped second portions ST12 extending generally in the second direction D2 and aligned in the first direction D1, and a third portion ST13 located at an intersection of the first portions ST11 and the second portions ST12. The first portions ST11 extend overlapping the first band portion 41. The second portions ST12 extend overlapping the second band portion 42. The first portions ST11 and the second portions ST12 are each formed in a wavy shape in a plan view. The plurality of third portions ST13 overlap the island portions 40. The third portions ST13 are aligned in a matrix shape in the first direction D1 and the second direction D2 at intervals from each other.

[0035] The barrier layer BR and the stopper layer ST are located in the same region. That is, the first portion BR11 and the first portion ST11 overlap each other. The second portion BR12 and the second portion ST12 overlap each other. The third portion BR13 and the third portion ST13 overlap each other. Moreover, the first portion BR11 and the first portion ST11 overlap with the scanning line 1. The second portion BR12 and the second portion ST12 overlap with the signal line 2. The third portion BR13 and the third portion ST13 overlap with the electric element 3.

[0036] Next, the configuration of a modified example of the first embodiment will be described with reference to FIGS.

[0037] Fig. 6 is a cross-sectional view of the flexible substrate 100 taken along the line AB shown in Fig. 2. The configuration shown in Fig. 6 differs from the configuration shown in Fig. 3 in that the flexible substrate 100 includes insulating films 61 and 62 instead of the insulating films 51 to 55.

[0038] The insulating film 61 is located on the insulating base material 4. The scanning lines 1 are located on the insulating film 61. The insulating film 62 is located on the insulating film 61 and covers the scanning lines 1. The insulating film 56 is located on the insulating film 62.

[0039] The insulating films 61 and 62 are, for example, organic insulating films made of an organic insulating material such as an acrylic resin.

[0040] Fig. 7 is a cross-sectional view of the flexible substrate 100 taken along line CD shown in Fig. 2. The configuration shown in Fig. 7 differs from the configuration shown in Fig. 4 in that the flexible substrate 100 includes insulating films 61 and 62 instead of the insulating films 51 to 55.

[0041] The insulating film 61 is located on the insulating base material 4. The insulating film 62 is located on the insulating film 61. The signal line 2 is located on the insulating film 62. The insulating film 56 is located on the insulating film 62 and covers the signal line 2. Even in this modified example, the same effects as in the first embodiment can be obtained.

[0042] [Second embodiment] Next, the configuration of the second embodiment will be described with reference to Figures 8 to 10. The second embodiment is different from the first embodiment in that the stopper layer ST has slits 5.

[0043] FIG. 8 is a plan view showing the stopper layer ST. The stopper layer ST has a plurality of slits 5. In the illustrated example, the slits 5 are linear in plan view. The width of the slits 5 in a direction perpendicular to the extension direction is, for example, 3 μm or more. The pattern of the slits 5 may be regularly repeated at regular intervals, or may be irregular. For example, the slits 5 penetrate from one outer edge to the other outer edge of the stopper layer ST in plan view. The shape of the slits 5 is not limited to the illustrated example, and may be curved, for example.

[0044] Fig. 9 is a cross-sectional view of the flexible substrate 100 taken along the line AB shown in Fig. 8. The configuration shown in Fig. 9 differs from the configuration shown in Fig. 3 in that the stopper layer ST has a slit 5. The slit 5 penetrates the stopper layer ST from the insulating film 56 to the insulating film 57 .

[0045] Fig. 10 is a cross-sectional view of the flexible substrate 100 taken along line CD shown in Fig. 8. The configuration shown in Fig. 10 differs from the configuration shown in Fig. 4 in that the stopper layer ST has a slit 5. The slit 5 penetrates the stopper layer ST from the insulating film 56 to the insulating film 57 .

[0046] According to the second embodiment, the stopper layer ST has slits 5. Therefore, even if a crack occurs in the barrier layer BR and progresses to the stopper layer ST, the slits 5 can disperse the stress in a direction parallel to the D1-D2 plane, and can prevent the crack from progressing to layers below the stopper layer ST. In the second embodiment, the same effects as in the first embodiment can be obtained.

[0047] Next, the configuration of a first modified example of the second embodiment will be described with reference to FIGS.

[0048] Fig. 11 is a cross-sectional view of the flexible substrate 100 taken along the line AB shown in Fig. 8. The configuration shown in Fig. 11 differs from the configuration shown in Fig. 6 in that the stopper layer ST has a slit 5. The configuration shown in Fig. 11 also differs from the configuration shown in Fig. 9 in that the flexible substrate 100 includes insulating films 61 and 62 instead of the insulating films 51 to 55. The slit 5 penetrates the stopper layer ST from the insulating film 56 to the insulating film 57 .

[0049] Fig. 12 is a cross-sectional view of the flexible substrate 100 taken along line CD shown in Fig. 8. The configuration shown in Fig. 12 differs from the configuration shown in Fig. 7 in that the stopper layer ST has a slit 5. The configuration shown in Fig. 12 also differs from the configuration shown in Fig. 10 in that the flexible substrate 100 includes insulating films 61 and 62 instead of the insulating films 51 to 55. The slit 5 penetrates the stopper layer ST from the insulating film 56 to the insulating film 57 . In this first modified example as well, the same effects as those of the second embodiment can be obtained.

[0050] Next, the configuration of a second modified example of the second embodiment will be described with reference to FIGS.

[0051] Fig. 13 is a cross-sectional view of the flexible substrate 100 taken along the line AB shown in Fig. 8. The configuration shown in Fig. 13 differs from the configuration shown in Fig. 9 in that the slits 5 do not penetrate the stopper layer ST. The slit 5 is formed in an upper surface STU of the stopper layer ST. The stopper layer ST is interposed between the slit 5 and the insulating film 56.

[0052] Fig. 14 is a cross-sectional view of the flexible substrate 100 taken along line CD shown in Fig. 8. The configuration shown in Fig. 14 differs from the configuration shown in Fig. 10 in that the slits 5 do not penetrate the stopper layer ST. The slit 5 is formed in an upper surface STU of the stopper layer ST. The stopper layer ST is interposed between the slit 5 and the insulating film 56. In this second modified example as well, the same effects as those of the second embodiment can be obtained.

[0053] Next, the configuration of a third modified example of the second embodiment will be described with reference to FIGS.

[0054] Fig. 15 is a cross-sectional view of the flexible substrate 100 taken along the line AB shown in Fig. 8. The configuration shown in Fig. 15 differs from the configuration shown in Fig. 11 in that the slits 5 do not penetrate the stopper layer ST. The configuration shown in Fig. 15 also differs from the configuration shown in Fig. 13 in that the flexible substrate 100 includes insulating films 61 and 62 instead of the insulating films 51 to 55. The slit 5 is formed in an upper surface STU of the stopper layer ST. The stopper layer ST is interposed between the slit 5 and the insulating film 56.

[0055] Fig. 16 is a cross-sectional view of the flexible substrate 100 taken along line CD shown in Fig. 8. The configuration shown in Fig. 16 differs from the configuration shown in Fig. 12 in that the slits 5 do not penetrate the stopper layer ST. The configuration shown in Fig. 16 also differs from the configuration shown in Fig. 14 in that the flexible substrate 100 includes insulating films 61 and 62 instead of the insulating films 51 to 55. The slit 5 is formed in an upper surface STU of the stopper layer ST. The stopper layer ST is interposed between the slit 5 and the insulating film 56. In the third modified example as described above, the same effects as those of the second embodiment can be obtained.

[0056] Next, the configuration of a fourth modified example of the second embodiment will be described with reference to FIG.

[0057] Fig. 17 is a plan view showing the stopper layer ST. The configuration shown in Fig. 17 is different from the configuration shown in Fig. 8 in the shape of the multiple slits 5 that the stopper layer ST has. In the illustrated example, the slits 5 are curved in plan view. The pattern of the slits 5 may be regularly repeated at regular intervals or may be irregular. For example, the slits 5 penetrate from one outer edge to the other outer edge of the stopper layer ST in plan view. In addition, the same configurations as those in the cross-sectional views shown in FIGS. 9 to 16 can be applied to the example shown in FIG. In the fourth modified example as described above, the same effects as those of the second embodiment can be obtained.

[0058] As described above, according to this embodiment, a flexible substrate capable of reducing the risk of breakage of wiring can be obtained.

[0059] Although several embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their modifications are included in the scope and spirit of the invention, and are included in the scope of the invention and its equivalents described in the claims. [Explanation of symbols]

[0060] 100...flexible substrate, D1...first direction, D2...second direction, 41: first belt portion, 42: second belt portion, 40: island portion, 4: insulating base material, 3...electrical element, 1...scanning line, 2...signal line, 56, 57...insulating film, ST... stopper layer, BR... barrier layer, TH1... first film thickness, TH2... second film thickness, TH3…Third film thickness, TH4…Fourth film thickness, 5…Slit, ST11...first part, ST12...second part.

Claims

1. an insulating substrate including: a plurality of first band portions extending in a first direction and aligned in a second direction intersecting the first direction; a plurality of second band portions extending in the second direction and aligned in the first direction; and a plurality of island portions located at intersections of the first band portions and the second band portions; A plurality of electric elements overlapping the island-shaped portion; A plurality of scanning lines each extending to overlap the first band portion; A plurality of signal lines each extending to overlap the second band portion; a first organic insulating film located above the scanning lines and the signal lines and overlapping the first band portion and the second band portion; a second organic insulating film located on the first organic insulating film; a stopper layer located between the first organic insulating film and the second organic insulating film; a barrier layer located on the second organic insulating film.

2. The flexible substrate according to claim 1 , wherein the first film thickness of the first organic insulating film and the second film thickness of the second organic insulating film are equal to each other.

3. The flexible substrate according to claim 1 , wherein the stopper layer has a rigidity equal to or less than that of the barrier layer.

4. the stopper layer is formed using the same material as the barrier layer; The flexible substrate according to claim 3 , wherein the third thickness of the stopper layer is equal to or smaller than a fourth thickness of the barrier layer.

5. 2. The flexible substrate according to claim 1, wherein the stopper layer is made of any one of silicon oxide, silicon nitride, polysilicon, aluminum, titanium, and copper.

6. The flexible substrate according to claim 1 , wherein the stopper layer has a slit.

7. The flexible substrate according to claim 6 , wherein the slit is linear in a plan view.

8. The flexible substrate according to claim 6 , wherein the slit is curved in a plan view.

9. The flexible substrate according to claim 6 , wherein the slit penetrates the stopper layer.

10. The flexible substrate according to claim 6 , wherein the slit does not penetrate the stopper layer.

11. the stopper layer has a plurality of strip-shaped first portions extending in the first direction and aligned in the second direction, and a plurality of strip-shaped second portions extending in the second direction and aligned in the first direction, The first portion extends to overlap the first band portion, The flexible substrate according to claim 1 , wherein the second portion extends to overlap the second band portion.

12. The flexible substrate according to claim 11 , wherein the first band portion and the second band portion are each formed in a wavy shape.

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