Ceramic susceptor

Abstract

To provide a ceramic susceptor.SOLUTION: The ceramic susceptor may improve temperature uniformity over the entire area of an upper surface of the susceptor by arranging a heater pattern of a multilayer structure such that arcs thereof do not overlap or such that straight sections of the heater are arranged at mutually different angles with respect to the center in mutually different layers, or by arranging the straight sections of the heater at mutually different angles with respect to the center even in a heater pattern of a single-layer structure.SELECTED DRAWING: Figure 5A

Description

[Technical field]

[0001] The present invention relates to a ceramic susceptor, and more particularly to a ceramic susceptor having a heater pattern for improving temperature uniformity. [Background technology]

[0002] In general, semiconductor devices or display devices are manufactured by sequentially stacking a plurality of thin film layers, including a dielectric layer and a metal layer, on a glass substrate, a flexible substrate, or a semiconductor wafer substrate, and then patterning the layers. The thin film layers are sequentially deposited on the substrate by a chemical vapor deposition (CVD) process or a physical vapor deposition (PVD) process. The CVD process includes a low pressure chemical vapor deposition (LPCVD) process, a plasma enhanced chemical vapor deposition (PECVD) process, and a metal organic chemical vapor deposition (MOCVD) process. The CVD and PVD devices are provided with a ceramic susceptor that supports a glass substrate, a flexible substrate, a semiconductor wafer substrate, or the like, and generates a certain amount of heat or generates plasma by a radio frequency (RF) electrode. The ceramic susceptor is widely used due to the requirement of accurate temperature control and heat treatment in plasma deposition processes for precision processes such as fine wiring of semiconductor devices, and is also used for plasma generation or substrate heating in etching processes of thin film layers formed on semiconductor wafer substrates or photoresist baking processes.

[0003] A typical ceramic susceptor includes a heating element that functions as a heater and is disposed between ceramic materials. In the ceramic susceptor structure, when the heating element receives power to generate heat and heats a semiconductor wafer substrate, temperature uniformity of the substrate is important for improving yield through stable semiconductor processing.

[0004] FIG. 1A is a plan view of a heating element pattern of a conventional ceramic susceptor.

[0005] Referring to FIG. 1A, a conventional ceramic susceptor generally has a diametrically inner heating element pattern 10 and a diametrically outer heating element pattern 20 on the same plane, the inner heating element pattern 10 being a pattern that extends in an arc between a first terminal pair 10a, 10b in the center, and the outer heating element pattern 20 being a pattern that extends in an arc between a second terminal pair 20a, 20b in the center.

[0006] However, since conventional ceramic susceptors have an inner heating element pattern 10 and an outer heating element pattern 20 formed on the same plane in the same layer, if the temperature of the upper surface of the susceptor on which the substrate is placed is not uniform over the entire area, attempts are made to improve the temperature uniformity by adjusting the arrangement pitch of the heating elements to raise or lower the temperature of that portion.

[0007] In addition, in the conventional ceramic susceptor, one side of the straight line sections 21a, 21b is connected to the second terminal pair 20a, 20b and extended to two connection points of the outer heating element pattern 20 having a resistance pattern, thereby forming the outer heating element pattern 20 connected to the second terminal pair 20a, 20b. As a result, in the conventional ceramic susceptor, the heating element straight line sections 21a, 21b spaced apart at a narrow interval may develop defects such as cracks due to oxidation, as shown in FIG. 1B, causing changes in resistance value or short circuiting, which has a problem of affecting temperature uniformity. Summary of the Invention [Problem to be solved by the invention]

[0008] Therefore, the present invention has been devised to solve the above-mentioned problems, and an object of the present invention is to provide a ceramic susceptor that can improve temperature uniformity over the entire area of ​​the upper surface of the susceptor by arranging a multi-layered heating element pattern so that the arc portions do not overlap, or by arranging linear sections of the heating element at different angles to the center in different layers, or by arranging linear sections of the heating element at different angles to the center even in a single-layered heating element pattern. [Means for solving the problem]

[0009] First, to summarize the features of the present invention, a ceramic susceptor according to one aspect of the present invention for achieving the above-mentioned object includes an insulating plate on which a plurality of heater layers are arranged, the plurality of heater layers including a first heater layer having a first pattern including a first resistor portion and a first connecting portion connected between a first terminal pair, and a second heater layer having a second pattern including a second resistor portion and a second connecting portion connected between a second terminal pair, the first connecting portion connecting an end of the first resistor portion to any one of the first terminal pair, and the second connecting portion connecting an end of the second resistor portion to any one of the second terminal pair.

[0010] Each of the first resistor portion and the second resistor portion may include a plurality of arc portions continuing in a circumferential direction and a plurality of bent portions connecting the arc portions, and when the arc portions of the first resistor portion and the arc portions of the second resistor portion are projected onto the plane of the insulating plate, the arc portions of the second resistor portion may be positioned between the arc portions of the first resistor portion.

[0011] Here, the first connection portion and the second connection portion may be disposed at different radial angles relative to a center of the insulating plate.

[0012] The multiple heating element layers may further include a third heating element layer having a third pattern including a third resistor portion and a third connecting portion connected between a third terminal pair, the third connecting portion connecting an end of the third resistor portion to any one of the third terminal pair, and the third resistor portion may include a plurality of arc portions continuing in the circumferential direction and a plurality of bent portions connecting the arc portions to each other.

[0013] When the arc portion of the first resistor portion, the arc portion of the second resistor portion, and the arc portion of the third resistor portion are projected onto the plane of the insulating plate, the arc portion of the third resistor portion may be positioned between the arc portion of the first resistor portion and the arc portion of the second resistor portion.

[0014] The first connection portion, the second connection portion, and the third connection portion may be disposed at different radial angles relative to a center of the insulating plate.

[0015] The first patterns and the second patterns may be arranged in the same number of one or more divided arrangement regions.

[0016] The first pattern and the second pattern may be arranged in one or more divided arrangement regions, the number of which is different from each other.

[0017] Each of the first connecting portion and the second connecting portion may include a wave-shaped connecting line.

[0018] As another example, each of the first resistance portion and the second resistance portion may include a plurality of arc portions continuing in the circumferential direction and a plurality of bend portions connecting the arc portions, each of the one or more first patterns and each of the one or more second patterns may be arranged in different arrangement regions that do not overlap between layers, each of the first patterns may include the arc portions that are symmetrical with respect to a center and the bend portions that are symmetrical with respect to the center, and the first connecting portion and the second connecting portion may be arranged at positions radially at different angles from each other with respect to the center.

[0019] It is preferable that the two connecting portions of the first heating element layer are arranged at 180° to each other in the radially outward direction, the two connecting portions of the second heating element layer are arranged at 180° to each other in the radially outward direction, and the extension lines of the two connecting portions of the first heating element layer and the extension lines of the two connecting portions of the second heating element layer are perpendicular.

[0020] And, a susceptor according to another aspect of the present invention includes an insulating plate on which a heating element is arranged, the heating element including respective patterns arranged in a plurality of divided arrangement areas on the same plane, each of the patterns including a resistive portion and a connecting portion connected between a terminal pair, and each of the connecting portions connecting an end of the resistive portion connected to a first terminal with a second terminal.

[0021] Each resistor portion may include a plurality of arc portions continuing in the circumferential direction and a plurality of bent portions connecting the arc portions.

[0022] The connecting portions of the respective patterns may be disposed at positions radially at different angles relative to the center of the insulating plate. Effect of the Invention

[0023] According to the ceramic susceptor of the present invention, the multi-layered heating element pattern is arranged so that the arc portions do not overlap, so that the heating elements are uniformly distributed in each region to generate heat, improving the temperature uniformity, and in the multi-layered heating element pattern, the multiple interlayer straight section connection lines are not arranged so as to overlap or be arranged side by side, or even in the single-layered heating element pattern, two or more straight section connection lines are arranged at different angles to the center, improving the temperature uniformity in the entire region of the upper surface of the susceptor. Also, with such a structure, it is possible to reduce the occurrence of defects such as cracks due to oxidation of the straight section connection lines, and the multi-layered heating element pattern can freely adjust the temperature for each arrangement region in each layer, improving the degree of freedom of temperature control for temperature uniformity. [Brief description of the drawings]

[0024] The accompanying drawings, which are included as part of the detailed description to aid in understanding the present invention, provide examples of the present invention and, together with the detailed description, explain the technical concepts of the present invention.

[0025] [Figure 1A] FIG. 1 is a plan view of a heating element pattern of a conventional ceramic susceptor. [Figure 1B] 1 shows an exemplary defect in a straight section of a heating element of a conventional ceramic susceptor. [Diagram 2] 1 is a schematic cross-sectional view showing a ceramic susceptor according to an embodiment of the present invention. [Figure 3A-3D] FIG. 2 is a diagram for explaining various patterns of an exemplary one-layer structure of a heating element pattern of a ceramic susceptor of the present invention. [Figure 4] 1 shows a connection portion between a terminal and a resistor portion of a heating element pattern of a ceramic susceptor of the present invention. [Figure 5A-5D] FIG. 2 is a diagram illustrating an exemplary two-layer structure of a heating element pattern of a ceramic susceptor of the present invention. [Figures 6A-6D] FIG. 2 is a diagram for explaining another exemplary two-layer structure of the heating element pattern of the ceramic susceptor of the present invention. [Figure 7] FIG. 2 is a diagram for explaining an exemplary three-layer structure pattern of a heating element pattern of the ceramic susceptor of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0026] The present invention will be described in detail below with reference to the accompanying drawings. Here, the same components in each drawing are assigned the same reference numerals as much as possible. Also, detailed description of already known functions and / or configurations will be omitted. The contents disclosed below will be described with emphasis on parts necessary for understanding the operation of various embodiments, and description of elements that may make the gist of the description unclear will be omitted. Also, some components in the drawings may be exaggerated, omitted, or generally illustrated. The size of each component does not entirely reflect the actual size, and therefore the contents described herein are not limited by the relative sizes and intervals of the components depicted in each drawing.

[0027] When describing the embodiments of the present invention, if it is determined that a detailed description of a known technology related to the present invention may make the gist of the present invention unclear, the detailed description will be omitted. The terms described below are defined in consideration of the functions in the present invention, and may be changed according to the intention or practice of the user or operator. Therefore, the definitions should be based on the entire contents of this specification. The terms used in the detailed description are merely for describing the embodiments of the present invention and should not be limiting in any way. Unless otherwise specified, expressions in the singular form include the plural form. In this description, expressions such as "include" or "comprise" are intended to indicate certain features, numbers, steps, operations, elements, parts thereof, or combinations thereof, and should not be interpreted to exclude the presence or possibility of one or more features, numbers, steps, operations, elements, parts thereof, or combinations other than those described.

[0028] In addition, terms such as first, second, etc. may be used to describe various components, but these terms are not intended to limit the various components, and these terms are only used for the purpose of distinguishing one component from another component.

[0029] FIG. 2 is a schematic cross-sectional view showing a ceramic susceptor 100 according to an embodiment of the present invention.

[0030] Referring to FIG. 2, a (ceramic) susceptor 100 according to an embodiment of the present invention includes an insulating plate 110 and a shaft 120 .

[0031] The ceramic susceptor 100 according to an embodiment of the present invention is a semiconductor device that supports a substrate to be processed for various purposes, such as a semiconductor wafer, a glass substrate, a flexible substrate, etc., and heats the substrate to a predetermined temperature. The ceramic susceptor 100 may be used in a semiconductor process using plasma, such as plasma-enhanced chemical vapor deposition or dry etching.

[0032] The insulating plate 110 may be configured such that a high frequency electrode 112 for generating plasma and / or a heating element 114 for heating the substrate are disposed (embedded) at a predetermined distance within the ceramic material. The insulating plate 110 is configured to stably support the substrate to be processed, and to enable heating of the substrate using the heating element 114 and / or a semiconductor process using plasma by the high frequency electrode 112.

[0033] In the ceramic susceptor 100 of the present invention, although not shown, a chuck electrode having an electrostatic chuck function may be further disposed to hold the substrate 11 placed on the insulating plate 110. For example, the chuck electrode may be further configured to be disposed (embedded) above or below the high frequency electrode 112 or the heating element 114 at a predetermined interval.

[0034] The insulating plate 110 may be formed as a plate-like structure having a predetermined shape. For example, the insulating plate 110 may be formed as a circular plate-like structure, but is not necessarily limited thereto. Here, the ceramic material may be at least one of Al2O3, Y2O3, Al2O3 / Y2O3, ZrO2, AlC (autoclaved lightweight concrete), TiN, AlN, TiC, MgO, CaO, CeO2, TiO2, BxCy, BN, SiO2, SiC, YAG, mullite, and AlF3, and may be aluminum nitride (AlN). Furthermore, each ceramic powder may selectively contain about 0.1 to 10%, preferably about 1 to 5% of yttrium oxide powder.

[0035] The shaft 120 has a pipe shape with a through hole, and is bonded or coupled to the lower surface of the insulating plate 110. The shaft 120 may be made of the same ceramic material as the insulating plate 110 and bonded or coupled thereto.

[0036] The high frequency electrode 112 or the chuck electrode may be made of tungsten (W), molybdenum (Mo), silver (Ag), gold (Au), niobium (Nb), titanium (Ti), aluminum nitride (AlN) or an alloy thereof, and preferably made of molybdenum (Mo). The high frequency electrode 112 may be connected to an RF (Radio) power source or to ground through a connecting rod 121 inside the hollow shaft 120, and the chuck electrode may be connected to a power source (DC or AC power source) for driving the chuck electrode through another connecting rod inside the hollow shaft 120. The high frequency electrode 112 has a wire type or sheet type mesh structure. Here, the mesh structure is a net-like structure formed by a plurality of metals arranged in a first direction and a plurality of metals arranged in a second direction intersecting each other with a shift.

[0037] The heating element 114 is made of tungsten (W), molybdenum (Mo), or an alloy or carbide thereof, and has a high melting point and high resistance. The heating element 114 may be formed in a plate-like coil shape using a heating wire (or a resistance wire or a heating electrode). The heating element 114 may also be formed in a multi-layer structure for precise temperature control. In a semiconductor manufacturing process, the heating element 114 is connected to a power source through a connecting rod 123 disposed inside a shaft 120, and serves to heat a substrate to be processed on the insulating plate 110 to a predetermined constant temperature in order to perform a smooth deposition process, etching process, etc.

[0038] In the ceramic susceptor 100 according to an embodiment of the present invention, the heating element 114 made of a heating wire (or a resistance wire) is arranged in a multi-layered heating element pattern as shown in Figs. 3A to 7 so that the arc portions do not overlap, so that the heating element is uniformly distributed in each region and generates heat, improving the temperature uniformity. In addition, the pattern of the heating element 114 having a multi-layered structure is arranged so that a plurality of interlayer straight sections (connecting sections connecting the terminal and the resistance section) in the pattern of the heating element 114 having a multi-layered structure are not arranged side by side or overlapping each other, so that the temperature uniformity can be further improved. In addition, even in the pattern of the heating element 114 having a single layered structure as shown in Figs. 3A to 3D, two or more straight sections (connecting sections connecting the terminal and the resistance section) are arranged at different angles from each other with respect to the center, so that the temperature uniformity can be improved in the entire region of the upper surface of the susceptor.

[0039] Hereinafter, the above-mentioned configuration of the present invention will be specifically described with reference to FIGS. 3A to 7. FIG.

[0040] 3A to 3D are diagrams for explaining various patterns of the heater 114 in the ceramic susceptor 100 of the present invention, in which the heater layer has a single-layer structure. FIG. 3A shows a structure in which a pattern 90 of the heater 114 having a single layer structure is arranged in each of the arrangement regions 311 and 312, which are divided into two equal parts in the plan view of the ceramic susceptor 100. FIG. 3B shows a structure in which a pattern 90 of the heater 114 having a single layer structure is arranged in each of the arrangement regions 321, 322, and 323, which are divided into three equal parts in the plan view of the ceramic susceptor 100. FIG. 3C shows a structure in which a pattern 90 of the heater 114 having a single layer structure is arranged in each of the arrangement regions 331, 332, and 333, which are divided into four equal parts in the plan view of the ceramic susceptor 100. FIG. 3D shows a structure in which a pattern 90 of a heating element 114 having a one-layer structure can be arranged in each of a number of equally divided arrangement areas in a plan view of the ceramic susceptor 100.

[0041] 3A to 3D, the heating elements 114 may include respective patterns arranged on the inside of the insulating plate 110 in an arrangement area divided into two or more equal parts or unequal parts on the same plane.

[0042] That is, the heating element 114 includes patterns 90 arranged in each of a plurality of divided arrangement regions on the same plane inside the insulating plate 110. Each pattern 90 includes a resistive portion 91 and a connecting portion 92 connected between the terminal pairs 81a and 81b.

[0043] Here, each connecting portion 92 connects the end of the resistor portion 91 connected to the first terminal 81a to the second terminal 81b, and each resistor portion 91 includes a plurality of arc portions 85 continuing in the circumferential direction and a plurality of bent portions 86 connecting the arc portions 85 together.

[0044] The connecting portions 92 of each pattern 90 are arranged so that no two connecting portions are parallel to each other, and the connecting portions 92 of each pattern 90 are arranged at different radial angles from each other with respect to the center. In other words, the connecting portions 92 of adjacent patterns 90 are not arranged so as to be adjacent to each other.

[0045] FIG. 4 shows a connection portion 92 between a terminal 81b and a resistor portion 91 in the pattern of a heating element 114 in a ceramic susceptor 100 of the present invention.

[0046] Referring to FIG. 4, each pattern 90 arranged in each of the multiple divided arrangement areas includes a resistor portion 91 and a connecting portion 92 connected between terminal pairs 81a, 81b, and the connecting portion 92 includes a wave-shaped connecting line such as a sine wave.

[0047] That is, the wave shape has one or more portions where a downwardly bulging portion and an upwardly bulging portion are connected, and the curvature of each bulging portion is preferably designed to be about R400 to R500. This is because by increasing the curvature to make a gentle curve, defects due to oxidation and the like can be reduced.

[0048] As described above, the resistive portion 91 and the connecting portion 92 of the heating element 114 are made of tungsten (W), molybdenum (Mo), or alloys or carbides thereof. The resistive portion 91 is a portion in which the material of the heating element 114 as described above is processed into a coil shape (a sawtooth zigzag shape is also possible in some cases) to increase the distance of electron movement and thereby increase resistance, and the connecting portion 92 is a connecting wire portion for electrical connection.

[0049] Similarly, the concepts of the pattern 90 of the heating element 114, the terminal pairs 81a, 81b, the arc portion 85, the bent portion 86, the resistive portion 91, the connecting portion 92, etc. described above also apply directly to a multi-layer structure having two or more heater layers.

[0050] 5A to 5D are diagrams for explaining a two-layer structure of an exemplary heater layer of the pattern of the heater 114 in the ceramic susceptor 100 of the present invention. FIG. 5A is a plan view showing a two-layer structure of the heater 114 pattern 90 arranged on different planes inside the ceramic susceptor 100. FIG. 5B shows a schematic laminated structure of an upper first heater layer 511 and a lower second heater layer 512 in the cross-sectional structure of FIG. 5A. FIG. 5C is a plan view showing the first heater layer 511 of FIG. 5A. FIG. 5D is a plan view showing the second heater layer 512 of FIG. 5A.

[0051] 5A to 5D, the two-layer laminated structure heating element 114 of the ceramic susceptor 100 of the present invention includes a first heating element layer 511 and a second heating element layer 512 formed at a predetermined distance apart with a ceramic material sandwiched therebetween.

[0052] The first heating element layer 511 includes a first pattern 90-1 including a first resistor portion 91-1 and a first connecting portion 92-1 connected between the terminal pair 81a-1, 81b-1, and the second heating element layer 512 includes a second pattern 90-2 including a second resistor portion 91-2 and a second connecting portion 92-2 connected between the terminal pair 81a-2, 81b-2 of another layer.

[0053] The first connecting portion 92-1 and the second connecting portion 92-2 connect the end of the resistor portion 91-1 / 91-2 connected to the first terminal 81a-1 / 81a-2 to the second terminal 81b-1 / 81b-2, respectively. The first resistor portion 91-1 and the second resistor portion 91-2 each include a plurality of arc portions 85-1 / 85-2 continuing in the circumferential direction, and bent portions 86-1 / 86-2 connecting the arc portions 85-1 / 85-2 to each other.

[0054] Here, the arc portion 85-1 of the first resistor portion 91-1 and the arc portion 85-2 of the second resistor portion 91-2 may be disposed in an overlapping arrangement region between layers as shown in Fig. 5A. That is, when the first pattern 90-1 and the second pattern 90-2 are projected onto the plane of the insulating plate 110, that is, when the arc portion 85-1 of the first resistor portion 91-1 and the arc portion 85-2 of the second resistor portion 91-2 are projected onto the plane of the insulating plate 110, the arc portion 85-2 of the second resistor portion 91-2 may be disposed between the arc portions 85-1 of the first resistor portion 91-1. At this time, the arc portion 85-1 of the first resistor portion 91-1 and the arc portion 85-2 of the second resistor portion 91-2 are disposed at positions of different radii from each other with respect to the center O, so that the heating temperatures between the patterns can be complemented to enhance the temperature uniformity.

[0055] In addition, the first connecting portion 92-1 and the second connecting portion 92-2 are disposed at positions at different angles radially from the center O. In a structure in which one pattern 90-1 / 90-2 is disposed on each layer as in Fig. 5A, it is preferable that the first connecting portion 92-1 and the second connecting portion 92-2 are disposed at 180° angles from each other in the radially outward direction from the center O.

[0056] 5A, for example, instead of the first pattern 90-1 of the first heating element layer 511, a heating element layer having a pattern of heating elements 114 in two or more divided arrangement areas as shown in FIGS. 3A to 3D may be configured. In this case, the second pattern 90-2 may be applied as it is.

[0057] In addition, in the present invention, instead of the second pattern 90-2 of the second heating element layer 512 in Fig. 5A, a heating element layer having a pattern of heating elements 114 in two or more divided arrangement areas as shown in Fig. 3A to Fig. 3D can be configured. In this case, the first pattern 90-1 may be applied as it is.

[0058] That is, the present invention can be implemented in the above-mentioned manner in any combination of pattern structures in which each heater layer has a pattern of heaters 114 in one pattern or two or more divided arrangement areas (the divided arrangement areas for each layer may be the same or different) in a two-layer laminated structure of a first heater layer 511 and a second heater layer 512. Furthermore, this principle can be implemented in the above-mentioned manner when each heater layer in a laminated structure of heaters 114 (see FIG. 7) having three or more heater layers is configured in any combination of pattern structures in which each heater layer has a pattern of heaters 114 in one pattern or two or more divided arrangement areas (the divided arrangement areas for each layer may be the same or different).

[0059] 6A to 6D are diagrams for explaining other exemplary two-layered patterns of the heating element 114 in the ceramic susceptor 100 of the present invention. Fig. 6A to 6D illustrate a two-layered structure of a first heating element layer 511 and a second heating element layer 512, in which each heating element layer has the same heating element 114 pattern in an arrangement region divided into two, three, four, or other multiple divisions.

[0060] 6B to 6D, similarly to FIG. 5A, the arc portion 85-1 of the first resistor portion 91-1 included in the first pattern 90-1 of the first heating element layer 511 and the arc portion 85-2 of the second resistor portion 91-2 included in the second pattern 90-2 of the second heating element layer 512 may be disposed in an interlayer overlapping arrangement region. That is, when the first pattern 90-1 and the second pattern 90-2 are projected onto the plane of the insulating plate 110, that is, when the arc portion 85-1 of the first resistor portion 91-1 and the arc portion 85-2 of the second resistor portion 91-2 are projected onto the plane of the insulating plate 110, the arc portion 85-2 of the second resistor portion 91-2 may be disposed between the arc portions 85-1 of the first resistor portion 91-1 (see FIG. 5A). At this time, the arc portion 85-1 of the first resistor portion 91-1 and the arc portion 85-2 of the second resistor portion 91-2 are disposed at positions of different radii from each other with respect to the center O, thereby complementing the heat generation temperature between the patterns and improving the temperature uniformity. Also, the first connecting portion 92-1 of the first heating element layer 511 and the second connecting portion 92-2 of the second heating element layer 512 are disposed at positions of different angles from each other radially from the center O.

[0061] 6A, similarly to FIG. 5A, the first heating element layer 511 and the second heating element layer 512 include terminal pairs 81a and 81b, an arc portion 85, a bent portion 86, a resistive portion 91, a connecting portion 92, and the like.

[0062] However, here, the heating element 114 may include a first heating element layer 511 having one or more first patterns 90-1 including a first resistive portion 91-1 and a first connecting portion 92-1 connected between the terminal pair 81a-1, 81b-1, and a second heating element layer 512 having one or more second patterns 90-2 including a second resistive portion 91-2 and a second connecting portion 92-2 connected between the other terminal pair 81a-2, 81b-2.

[0063] In addition, one or more of the first patterns 90-1 and the second patterns 90-2 are arranged in different arrangement regions that do not overlap between layers (arrangement regions do not overlap). That is, one or more of the first patterns 90-1 may include an arc portion 85 that is point-symmetric with respect to the center O and a bent portion 86 that is point-symmetric with respect to the center O, and one or more of the second patterns 90-2 may include an arc portion 85 that is point-symmetric with respect to the center O and a bent portion 86 that is point-symmetric with respect to the center O.

[0064] Furthermore, the first connecting portion 92-1 of the first heating element layer 511 and the second connecting portion 92-2 of the second heating element layer 512 are arranged at positions at different radial angles relative to the center O, and it is particularly preferable that the two connecting portions 92-1 of the first heating element layer 511 are arranged at 180° angles to each other in the radially outward direction, and the two connecting portions 92-2 of the second heating element layer 512 are arranged at 180° angles to each other in the radially outward direction, and that the extension lines of the two connecting portions 92-1 of the first heating element layer 511 and the extension lines of the two connecting portions 92-2 of the second heating element layer 512 are perpendicular to each other.

[0065] FIG. 7 is a diagram illustrating an exemplary pattern of the heater 114 in the ceramic susceptor 100 of the present invention, in which the heater layer has a three-layer structure.

[0066] Referring to FIG. 7, the heating element 114 of the ceramic susceptor 100 of the present invention may have the same or similar structure as the first heating element layer 511 and the second heating element layer 512 in the embodiment such as FIG. 5A or FIGS. 6A to 6D, and may further include a third heating element layer 513 separated from the second heating element layer 512 by a ceramic material.

[0067] As mentioned above, each of the first heating element layer 511, the second heating element layer 512 and the third heating element layer 513 can have any combination of pattern structures having a pattern of heating elements 114 in one pattern or two or more multiply divided arrangement areas as described above (the divided arrangement areas for each layer may be the same or different).

[0068] The configurations of the first heating element layer 511 and the second heating element layer 512 are as described in the description of Figure 5A, and the third heating element layer 513 may include a third pattern 90-3 including a third resistive portion 91-3 and a third connecting portion 92-3 connected between the third terminal pair 81a-3, 81b-3.

[0069] The third connecting portion 92-3 includes a wave-shaped connecting wire as described above that connects the end of the resistor portion 91-3 connected to the first terminal 81a-3 of the third terminal pair 81a-3, 81b-3 and the second terminal 81b-3 of the third terminal pair 81a-3, 81b-3.

[0070] The third resistor portion 91-3 includes arc portions 85-3 continuing in the circumferential direction and bent portions 86-3 connecting the arc portions 85-3 to each other.

[0071] Similar to the two-layer laminated structure of Figure 5A, the arc portions 85-1, 85-2, 85-3 of the resistor portions 91-1, 91-2, 91-3 of the first heating element layer 511, the second heating element layer 512, and the third heating element layer 513 may be arranged in overlapping arrangement areas between the layers, and in this case, may be arranged at positions of different radii from each other relative to the center O. That is, when the first pattern 90-1, the second pattern 90-2, and the third pattern 90-3 are projected onto the plane of the insulating plate 110, that is, when the arc portion 85-1 of the first resistor portion 91-1, the arc portion 85-2 of the second resistor portion 91-2, and the arc portion 85-3 of the third resistor portion 91-3 are projected onto the plane of the insulating plate 110, the arc portion 85-3 of the third resistor portion 91-3 may be disposed between the arc portion 85-2 of the second resistor portion 91-2 and the arc portion 85-1 of the first resistor portion 91-1 (arranged so that the arc portions of the three layers do not overlap each other). This is to ensure that the arc portions present in any two layers of the first heating element layer 511, the second heating element layer 512, and the third heating element layer 513 do not overlap each other. This makes it possible to complement the heat generation temperature between the patterns and improve the temperature uniformity.

[0072] In addition, the connecting portions 92-1, 92-2, and 92-3 of the first heating element layer 511, the second heating element layer 512, and the third heating element layer 513 are disposed at positions radially at different angles from each other with respect to the center O. This can also be established between adjacent layers among the first heating element layer 511, the second heating element layer 512, and the third heating element layer 513.

[0073] As described above, the ceramic susceptor 100 of the present invention has improved temperature uniformity since the heating elements 114 are uniformly distributed in each region and generate heat by arranging the patterns of the heating elements 114 with a multi-layer structure so that the arc portions do not overlap, and the multiple connecting parts 92, which are interlayer straight section sections, are not arranged side by side or overlap each other in the pattern of the heating elements 114 with a multi-layer structure, or two or more straight section connecting parts 92 are arranged at different angles to the center in the pattern of the heating elements 114 with a single layer structure, thereby improving temperature uniformity in the entire region of the upper surface of the susceptor. In addition, such a structure can reduce the occurrence of defects such as cracks due to oxidation of the connecting parts 92, and the pattern of the heating elements 114 with a multi-layer structure can freely adjust the temperature for each arrangement region in each layer, improving the degree of freedom of temperature control for temperature uniformity.

[0074] Although the present invention has been described above by using specific details such as specific components, limited examples, and drawings, these are provided only to assist in a more general understanding of the present invention, and the present invention is not limited to these examples, and various modifications and variations may be made by those skilled in the art to which the present invention pertains without departing from the essential characteristics of the present invention. Therefore, the idea of ​​the present invention should not be limited to the described examples, and any technical idea that is equivalent to or has been modified in accordance with the appended claims should be interpreted as being included in the scope of the present invention, in addition to the scope of the appended claims. [Explanation of symbols]

[0075] 110 Insulation plate 114 Heating element 90 Patterns 81a, 81b terminal pair 85 Arc section 86 Bending section 91 Resistance section 92 Connecting part 511 First heating element layer 512 Second Heating Layer 513 3rd heating element layer

Claims

1. an insulating plate having a plurality of heating element layers disposed thereon; The plurality of heater layers include a first heater layer having a first pattern including a first resistor portion and a first connection portion connected between a first terminal pair, and a second heater layer having a second pattern including a second resistor portion and a second connection portion connected between a second terminal pair, the first connecting portion connects an end of the first resistor portion to any one of the terminals of the first terminal pair, and the second connecting portion connects an end of the second resistor portion to any one of the terminals of the second terminal pair.

2. each of the first resistor portion and the second resistor portion includes a plurality of arc portions extending in a circumferential direction and a plurality of bent portions connecting the arc portions; The susceptor of claim 1 , wherein when the arcuate portion of the first resistor portion and the arcuate portion of the second resistor portion are projected onto a plane of the insulating plate, the arcuate portion of the second resistor portion is positioned between the arcuate portions of the first resistor portion.

3. The susceptor according to claim 1 , wherein the first connecting portion and the second connecting portion are disposed at different radial angles relative to a center of the insulating plate.

4. the plurality of heater layers further include a third heater layer having a third pattern including a third resistor portion and a third connector portion connected between a third terminal pair, 2. The susceptor according to claim 1, wherein the third connecting portion connects an end of the third resistor portion to any one of the terminals of the third terminal pair, and the third resistor portion includes a plurality of arc portions continuing in a circumferential direction and a plurality of bent portions connecting the arc portions to each other.

5. 5. The susceptor according to claim 4, wherein when the arc portions of the first resistor portion, the second resistor portion, and the third resistor portion are projected onto a plane of the insulating plate, the arc portion of the third resistor portion is positioned between the arc portions of the first resistor portion and the second resistor portion.

6. The susceptor according to claim 4 , wherein the first connecting portion, the second connecting portion, and the third connecting portion are disposed at positions radially at different angles relative to a center of the insulating plate.

7. The susceptor according to claim 1 , wherein the first patterns and the second patterns are arranged in the same number of one or more divided arrangement regions.

8. The susceptor according to claim 1 , wherein the first pattern and the second pattern are disposed in one or more divided arrangement regions, the number of which is different from each other.

9. The susceptor according to claim 1 , wherein each of the first connecting portion and the second connecting portion includes a wave-shaped connecting line.

10. each of the first resistor portion and the second resistor portion includes a plurality of arc portions continuing in a circumferential direction and a plurality of bent portions connecting the arc portions; each of the one or more first patterns and the one or more second patterns is arranged in different arrangement regions that do not overlap between layers, and includes the arc portions that are symmetrical with respect to a center and the bent portions that are symmetrical with respect to a center; The susceptor according to claim 1 , wherein the first connecting portion and the second connecting portion are disposed at positions radially at different angles from each other with respect to the center.

11. The susceptor of claim 10, wherein the two connecting portions of the first heating element layer are arranged at 180° to each other in a radially outward direction, the two connecting portions of the second heating element layer are arranged at 180° to each other in a radially outward direction, and the extension lines of the two connecting portions of the first heating element layer and the extension lines of the two connecting portions of the second heating element layer are perpendicular to each other.

12. an insulating plate on which a heating element is disposed; The heating element includes patterns arranged in a plurality of divided arrangement regions on the same plane, each of the patterns including a resistor portion and a connection portion connected between a terminal pair, Each of the connecting portions connects the end of the resistor portion connected to the first terminal and a second terminal.

13. The susceptor according to claim 12 , wherein the connecting portions of the respective patterns are disposed at positions at different radial angles relative to the center of the insulating plate.

14. The susceptor of claim 12 , wherein each of the patterned connectors comprises a wave-shaped connector line.

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