Multilayer electronic component

Abstract

To provide a multilayer electronic component which is excellent in reliability and inhibits occurrence of electromagnetic interference.SOLUTION: A multilayer electronic component according to an embodiment of the invention can inhibit electromagnetic interference by placing a cover electrode, connected to the same external electrode with which an adjacent internal electrode is connected and having a width wider than that of the adjacent internal electrode, in a cover part.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to a multilayer electronic component. [Background technology]

[0002] Multi-Layer Ceramic Capacitor (MLCC), a type of multi-layer electronic component, is a chip-type capacitor that is mounted on the printed circuit boards of various electronic products such as visual devices such as liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, and mobile phones to charge and discharge electricity.

[0003] Multilayer ceramic capacitors have the advantages of being small yet having high capacitance and being easy to mount, and therefore can be used as components of various electronic devices. As various electronic devices such as computers and mobile devices become smaller and have higher output, there is an increasing demand for smaller multilayer ceramic capacitors with higher capacitance.

[0004] Multilayer ceramic capacitors can generate electromagnetic interference (EMI) when mounted on a circuit board. When multilayer ceramic capacitors emit EMI noise, it can cause performance degradation or malfunction of other nearby electronic devices. For example, wireless communication devices and sensitive electronic devices can suffer signal interference due to high-frequency noise generated by MLCCs, which can lead to degradation of communication quality and data loss.

[0005] Therefore, there is a need to develop a multilayer ceramic capacitor that suppresses the generation of EMI noise. Summary of the Invention [Problem to be solved by the invention]

[0006] One of the various objects of the present invention is to provide a multilayer electronic component having excellent reliability.

[0007] One of the various objects of the present invention is to provide a multilayer electronic component in which the generation of electromagnetic interference (EMI) is suppressed.

[0008] However, the object of the present invention is not limited to the above-mentioned contents, and can be more easily understood in the course of describing specific embodiments of the present invention. [Means for solving the problem]

[0009] A multilayer electronic component according to one embodiment of the present invention includes first internal electrodes and second internal electrodes alternately disposed in a first direction with a dielectric layer sandwiched therebetween, the first internal electrode being disposed at an uppermost end in the first direction and the second internal electrode being disposed at a lowermost end in the first direction, a first cover portion disposed on an upper surface of the capacitance forming portion in the first direction and including a first cover electrode, a second cover portion disposed on a lower surface of the capacitance forming portion in the first direction and including a second cover electrode, the multilayer electronic component including a first surface and a second surface facing each other in the first direction, a third surface connected to the first surface and the second surface and facing each other in the second direction, a main body including four sides, and fifth and sixth sides connected to the first, second, third and fourth sides and facing each other in a third direction; a first external electrode disposed on the third side and connected to the first internal electrode and the first cover electrode; and a second external electrode disposed on the fourth side and connected to the second internal electrode and the second cover electrode, wherein when average sizes in the third direction of the first internal electrode, the second internal electrode, the first cover electrode and the second cover electrode are Wi1, Wi2, Wc1 and Wc2, respectively, Wc1-Wi1>80 μm and Wc2-Wi2>80 μm can be satisfied. Effect of the Invention

[0010] One of the various advantages of the present invention is that the generation of electromagnetic interference (EMI) can be suppressed by disposing a cover electrode in the cover part, which is connected to the same external electrode as the adjacent internal electrodes and is wider than the adjacent internal electrodes.

[0011] However, the various yet significant advantages and effects of the present invention are not limited to the above, and can be more easily understood in the course of describing specific embodiments of the present invention. [Brief description of the drawings]

[0012] [Figure 1] 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention; [Diagram 2] 2 is a schematic cross-sectional view taken along line II' of FIG. 1. [Diagram 3] 2 is a schematic cross-sectional view taken along line II-II' in FIG. 1. [Figure 4] 2A and 2B are plan views of a first cover electrode, a first internal electrode, a second internal electrode, and a second cover electrode included in the multilayer electronic component of FIG. 1, in that order. [Diagram 5] 3 is a view corresponding to FIG. 2 of a multilayer electronic component according to a modified example of the present invention. [Figure 6] 5 is a view corresponding to FIG. 3 for a multilayer electronic component according to a modified example of the present invention. [Figure 7] 10 is a view corresponding to FIG. 2 and showing a multilayer electronic component according to another modified example of the present invention. [Figure 8] 11 is a view corresponding to FIG. 3 and showing a multilayer electronic component according to another modified example of the present invention. [Figure 9] 11 is a plan view showing a first cover electrode, a first internal electrode, a first margin electrode, and a second margin electrode, a second internal electrode, a first margin electrode, and a second margin electrode, and a second cover electrode, which are included in a multilayer electronic component according to another modified example of the present invention. [Figure 10] Magnetic field strength as a function of frequency. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] Hereinafter, the embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention may be modified into several other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, the embodiments of the present invention are provided to more completely explain the present invention to those skilled in the art. Therefore, the shapes and sizes of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

[0014] In addition, in the drawings, parts that are not relevant to the description are omitted in order to clearly explain the present invention, and the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of explanation, so the present invention is not necessarily limited by the drawings. Furthermore, components having the same function within the same concept may be described using the same reference numerals. Furthermore, throughout the specification, when a part "includes" a certain component, it does not mean that the part excludes other components, but that the part may further include other components, unless otherwise specified to the contrary.

[0015] In the drawings, the first direction can be defined as the stacking direction or thickness (T) direction, the second direction can be defined as the length (L) direction, and the third direction can be defined as the width (W) direction.

[0016] Multilayer Electronic Components FIG. 1 is a schematic perspective view of a multilayer electronic component according to an embodiment of the present invention, FIG. 2 is a schematic cross-sectional view taken along line I-I' in FIG. 1, FIG. 3 is a schematic cross-sectional view taken along line II-II' in FIG. 1, and FIG. 4 is a schematic plan view of a first cover electrode, a first internal electrode, a second internal electrode, and a second cover electrode included in the multilayer electronic component of FIG. 1, in that order.

[0017] A multilayer electronic component 100 according to one embodiment of the present invention will be described in detail below with reference to Figures 1 to 4. Also, a multilayer ceramic capacitor (hereinafter referred to as "MLCC") will be described as an example of the multilayer electronic component, but the present invention is not limited thereto.

[0018] A multilayer electronic component 100 according to an embodiment of the present invention includes first internal electrodes 121 and second internal electrodes 122 alternately arranged in a first direction with a dielectric layer 111 sandwiched therebetween, a capacitance forming portion Ac having a first internal electrode arranged at an upper end in the first direction and a second internal electrode arranged at a lower end in the first direction, a first cover portion 112 arranged on an upper surface of the capacitance forming portion in the first direction and including a first cover electrode 123, a second cover portion 113 arranged on a lower surface of the capacitance forming portion in the first direction and including a second cover electrode 124, a first surface 1 and a second surface 2 facing each other in the first direction, a second cover portion 113 connected to the first surface and the second surface and facing in the second direction, a main body including a third surface 3 and a fourth surface 4 mating with each other, and a fifth surface 5 and a sixth surface 6 connected to the first surface, the second surface, the third surface, and the fourth surface and facing each other in a third direction, a first external electrode 131 disposed on the third surface and connected to the first internal electrode and the first cover electrode, and a second external electrode 132 disposed on the fourth surface and connected to the second internal electrode and the second cover electrode, wherein when average sizes in the third direction of the first internal electrode, the second internal electrode, the first cover electrode, and the second cover electrode are Wi1, Wi2, Wc1, and Wc2, respectively, Wc1-Wi1>80 μm and Wc2-Wi2>80 μm can be satisfied.

[0019] Multilayer ceramic capacitors can generate electromagnetic interference (EMI) when mounted on a circuit board. When multilayer ceramic capacitors emit EMI noise, it can cause performance degradation or malfunction of other nearby electronic devices. For example, wireless communication devices and sensitive electronic devices can suffer signal interference due to high-frequency noise generated by MLCCs, which can lead to degradation of communication quality and data loss.

[0020] According to an embodiment of the present invention, the cover electrodes 123, 124, which are connected to the same external electrode as the adjacent internal electrodes and are wider than the adjacent internal electrodes, are disposed in the cover parts 112, 113, thereby suppressing the generation of electromagnetic interference (EMI). Although a current flows through the first internal electrodes 121 and the second internal electrodes 122, which are alternately disposed in the capacitance forming part Ac, the cover electrodes 123, 124 are connected to the same external electrode as the adjacent internal electrodes, so that almost no current flows through them, thereby providing a shielding effect. The cover electrodes 123, 124 can shield the magnetic field radiated from both ends of the internal electrodes 121, 122 in the width direction, thereby suppressing the electromagnetic waves generated in the near-field of the multilayer electronic component.

[0021] Hereinafter, each component included in the multilayer electronic component 100 according to one embodiment of the present invention will be described.

[0022] The body 110 may have dielectric layers 111 and internal electrodes 121 and 122 stacked alternately.

[0023] Although there is no particular limitation on the specific shape of the body 110, the body 110 may be hexahedral or a similar shape as shown in the figure. Due to shrinkage of the ceramic powder contained in the body 110 during the firing process, the body 110 may not be a hexahedral shape with perfectly straight lines, but may be substantially hexahedral.

[0024] The main body 110 may have a first surface 1 and a second surface 2 facing each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and facing each other in the second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1 and the second surface 2, connected to the third surface 3 and the fourth surface 4, and facing each other in the third direction.

[0025] As a marginal region where the internal electrodes 121, 122 are not disposed overlaps the dielectric layer 111, a step is generated due to the thickness of the internal electrodes 121, 122, and the corners connecting the first surface and the third to fifth surfaces and / or the corners connecting the second surface and the third to fifth surfaces may have a shape that is shrunk toward the center in the first direction of the main body 110 when viewed based on the first surface or the second surface. Alternatively, due to shrinkage behavior during the sintering process of the main body, the corners connecting the first surface 1 and the third to sixth surfaces 3, 4, 5, 6 and / or the corners connecting the second surface 2 and the third to sixth surfaces 3, 4, 5, 6 may have a shape that is shrunk toward the center in the first direction of the main body 110 when viewed based on the first surface or the second surface. Alternatively, in order to prevent chipping defects, the corners connecting each surface of the body 110 may be rounded through a separate process, so that the corners connecting the first surface and the third to sixth surfaces and / or the corners connecting the second surface and the third to sixth surfaces may have a rounded shape.

[0026] The multiple dielectric layers 111 forming the main body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated to such an extent that they are difficult to confirm without using a scanning electron microscope (SEM). There is no particular need to limit the number of laminated dielectric layers, and this can be determined in consideration of the size of the laminated electronic component. For example, the main body can be formed by laminating 400 or more dielectric layers.

[0027] The dielectric layer 111 can be formed by manufacturing a ceramic slurry containing ceramic powder, an organic solvent, and a binder, applying and drying the slurry on a carrier film to provide a ceramic green sheet, and then firing the ceramic green sheet. The ceramic powder is not particularly limited as long as sufficient capacitance can be obtained. For example, barium titanate (BaTiO3)-based powder or the like can be used as the ceramic powder. More specifically, as the ceramic powder, barium titanate (BaTiO3)-based powder, normal dielectric powder of a CaZrO3 substrate, and the like can be used. More specifically, as the barium titanate (BaTiO3)-based powder, BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), and Ba(Ti 1-y Zr y )O3 (0 < y < 1) can be one or more of them, and the normal dielectric powder of the CaZrO3 substrate can be (Ca 1-x Sr x )(Zr 1-y Ti y )O3 (0 < x < 1, 0 < y < 1).

[0028] Therefore, the dielectric layer 111 is BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3 (0 < y < 1), and (Ca 1-x Sr x )(Zr 1-y Ti y)One or more of O3 (0 < x < 1, 0 < y < 1) can be included.

[0029] The main body 110 includes a capacitance forming portion Ac that is disposed inside the main body 110 and in which a capacitance is formed by including a first internal electrode 121 and a second internal electrode 122 that are disposed to face each other with a dielectric layer 111 interposed therebetween, and cover portions 112 and 113 formed above and below the capacitance forming portion Ac in a first direction.

[0030] The capacitance forming portion Ac is a portion that contributes to the formation of the capacitance of the capacitor, and can be formed by repeatedly laminating a plurality of first internal electrodes 121 and second internal electrodes 122 with a dielectric layer 111 interposed therebetween. Also, a first internal electrode 121 can be disposed at the uppermost end of the capacitance forming portion Ac in the first direction, and a second internal electrode 122 can be disposed at the lowermost end of the first direction.

[0031] The internal electrodes 121 and 122 can include a first internal electrode 121 and a second internal electrode 122. The first internal electrode 121 and the second internal electrode 122 are alternately disposed so as to face each other with the dielectric layer 111 constituting the main body 110 interposed therebetween, and can be exposed on a third surface 3 and a fourth surface 4 of the main body 110, respectively.

[0032] The first internal electrode 121 is spaced apart from the fourth surface 4 and is exposed through the third surface 3, and the second internal electrode 122 is spaced apart from the third surface 3 and can be exposed through the fourth surface 4. A first external electrode 131 is disposed on the third surface 3 of the main body and is connected to the first internal electrode 121, and a second external electrode 132 is disposed on the fourth surface 4 of the main body and can be connected to the second internal electrode 122.

[0033] That is, the first internal electrode 121 is connected to the first external electrode 131 but not to the second external electrode 132, and the second internal electrode 122 is connected to the second external electrode 132 but not to the first external electrode 131. Therefore, the first internal electrode 121 may be formed to be spaced apart by a certain distance on the fourth surface 4, and the second internal electrode 122 may be formed to be spaced apart by a certain distance on the third surface 3. In addition, the first internal electrode 121 and the second internal electrode 122 may be disposed to be spaced apart from the fifth and sixth surfaces of the body 110.

[0034] The conductive metal contained in the internal electrodes 121, 122 may be one or more of Ni, Cu, Pd, Ag, Au, Pt, In, Sn, Al, Ti, and alloys thereof, but the present invention is not limited thereto.

[0035] The cover parts 112, 113 may include a first cover part 112 arranged on the upper surface of the capacitance forming part Ac in the first direction and including a first cover electrode 123, and a second cover part 113 arranged on the lower surface of the capacitance forming part Ac in the first direction and including a second cover electrode 124.

[0036] The cover parts 112 and 113 essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0037] The cover portions 112, 113 include cover electrodes 123, 124 and may include the same material as the dielectric layer 111. That is, the cover portions 112, 113 may include a ceramic material, for example, a barium titanate (BaTiO3) based ceramic material.

[0038] The cover electrodes 123, 124 may include a conductive metal, and the conductive metal included in the cover electrodes 123, 124 may be one or more of Ni, Cu, Pd, Ag, Au, Pt, In, Sn, Al, Ti, and alloys thereof, but the present invention is not limited thereto. Also, the conductive metal included in the cover electrodes 123, 124 may be the same as the conductive metal included in the internal electrodes 121, 122, but is not limited thereto.

[0039] Meanwhile, there is no need to particularly limit the average thickness td of the dielectric layer 111, the average thickness te of the internal electrodes 121, 122, and the average thickness tce of the cover electrodes 123, 124. For example, the average thickness td of the dielectric layer 111 may be 0.1 μm to 100 μm, the average thickness te of the internal electrodes 121, 122 may be 0.05 μm to 3.0 μm, and the average thickness tce of the cover electrodes 123, 124 may be 0.05 μm to 3.0 μm.

[0040] Also, the average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121, 122 can be arbitrarily set according to the desired characteristics and applications. For example, in the case of a high-voltage electric field electronic component to achieve miniaturization and high capacity, the average thickness td of the dielectric layer 111 can be less than 2.8 μm, and the average thickness te of the internal electrodes 121, 122 can be less than 1 μm. Also, in the case of a small IT electronic component to achieve miniaturization and high capacity, the average thickness td of the dielectric layer 111 can be 0.4 μm or less, and the average thickness te of the internal electrodes 121, 122 can be 0.4 μm or less.

[0041] The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121, 122 refer to the size of the dielectric layer 111 and the internal electrodes 121, 122 in the first direction, respectively. The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121, 122 may be measured by scanning the cross sections of the body 110 in the first direction and the second direction with a scanning electron microscope (SEM) with a magnification of 10,000. More specifically, the average thickness td of the dielectric layer 111 may be measured by measuring the thickness at a number of points of one dielectric layer 111, for example, 30 points equally spaced in the second direction, and then measuring the average value. In addition, the average thickness te of the internal electrodes 121, 122 may be measured by measuring the thickness at a number of points of one internal electrode 121, 122, for example, 30 points equally spaced in the second direction, and then measuring the average value. The 30 equally spaced points may be designated as a capacitance forming portion Ac. Meanwhile, by performing such average value measurements on 10 dielectric layers 111 and 10 internal electrodes 121, 122, respectively, and then measuring the average values, the average thickness td of the dielectric layers 111 and the average thickness te of the internal electrodes 121, 122 can be further generalized. In addition, the average thickness tce of the cover electrodes 123, 124 can also be obtained by applying the same method as the average thickness td of the dielectric layers 111 and the average thickness te of the internal electrodes 121, 122.

[0042] When the average sizes in the third direction of the first inner electrode, the second inner electrode, the first cover electrode and the second cover electrode are Wi1, Wi2, Wc1 and Wc2, respectively, Wc1-Wi1>80μm and Wc2-Wi2>80μm can be satisfied. This can significantly suppress the electromagnetic interference (EMI), and when Wc1-Wi1 is 80μm or less or Wc2-Wi2 is 80μm or less, the effect of suppressing the occurrence of electromagnetic interference (EMI) by the cover electrodes may be insufficient. More preferably, Wc1-Wi1≧90μm and Wc2-Wi2≧90μm can be satisfied, and even more preferably, Wc1-Wi1≧160μm and Wc2-Wi2≧160μm can be satisfied.

[0043] Here, the average size in the third direction of the first internal electrode, the second internal electrode, the first cover electrode, and the second cover electrode may refer to the average width of the first internal electrode, the second internal electrode, the first cover electrode, and the second cover electrode, respectively.

[0044] Wi1, Wi2, Wc1, and Wc2 may be measured by polishing the main body 100 in the first direction. Specifically, the main body 100 is polished until the first cover electrode 123 is exposed, and then the width (size in the third direction) of the first cover electrode 123 is measured at five points equally spaced in the second direction, and the average value is set as Wc1. Wi1, Wi2, and Wc2 may also be measured by applying a similar method.

[0045] In an embodiment, the first internal electrode 121 may be disposed to fully overlap the first cover electrode 123, and the second internal electrode 122 may be disposed to fully overlap the second cover electrode 124 in the first direction.

[0046] In this case, the first cover electrode 123 may be disposed to partially overlap the first internal electrode 121, and the second cover electrode 124 may be disposed to partially overlap the second internal electrode 122 in the first direction.

[0047] In addition, the first internal electrode 121 may be stacked so that the center in the third direction of the first cover electrode 123 substantially coincides with the center in the third direction of the first internal electrode 121, and the second internal electrode 122 may be stacked so that the center in the third direction of the second cover electrode 124 substantially coincides with the center in the third direction of the second cover electrode 124. That is, referring to Fig. 3, the first cover electrode 123 may be arranged so that the sizes b1 and b2 in the third direction of a region that does not overlap with the first internal electrode 121 are the same.

[0048] This allows the cover electrodes 123 and 124 to maximize the effect of suppressing the generation of EMI.

[0049] In one embodiment, when the average sizes in the second direction of the first inner electrode, the second inner electrode, the first cover electrode, and the second cover electrode are Li1, Li2, Lc1, and Lc2, respectively, Li1≦Lc1 and Li2≦Lc2 may be satisfied. If Li1>Lc1 or Li2>Lc2, the effect of suppressing EMI generation may be insufficient.

[0050] Here, the average size in the second direction of the first internal electrode, the second internal electrode, the first cover electrode, and the second cover electrode may mean the average length of the first internal electrode, the second internal electrode, the first cover electrode, and the second cover electrode, respectively.

[0051] Li1, Li2, Lc1, and Lc2 may also be measured using a method similar to that of Wi1, Wi2, Wc1, and Wc2. Specifically, the body 100 is polished until the first cover electrode 123 is exposed, and then the length (size in the second direction) of the first cover electrode 123 is measured at five points equally spaced in the third direction, and the average value is taken as Lc1. Li1, Li2, and Lc2 may also be measured using a similar method.

[0052] On the other hand, there is no need to particularly limit the thickness of the covers 112 and 113. For example, the thicknesses tc1 and tc2 of the covers 112 and 113 can be 100 to 700 μm, respectively.

[0053] The average thicknesses tc1 and tc2 of the cover parts 112 and 113 may refer to the size in the first direction, and may be the average value of the size in the first direction of the cover parts 112 and 113 measured at five equally spaced points on the upper or lower part of the capacitance forming part Ac.

[0054] Moreover, margin portions 114 and 115 can be disposed on the side surfaces of the capacitance forming portion Ac.

[0055] The margin portions 114, 115 may include a first margin portion 114 disposed on the fifth surface 5 of the body 110 and a second margin portion 115 disposed on the sixth surface 6. That is, the margin portions 114, 115 may be disposed on both end surfaces of the ceramic body 110 in the width direction.

[0056] The margin portions 114, 115 may refer to the regions between both ends of the first internal electrode 121 and the second internal electrode 122 and the boundary surface of the body 110 in a cross-section of the body 110 cut in the width-thickness (WT) direction, as shown in FIG. 3.

[0057] The margins 114 and 115 essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0058] The margin portions 114 and 115 may be formed by applying a conductive paste to the ceramic green sheet except for the areas where the margin portions are to be formed, to form internal electrodes.

[0059] On the other hand, there is no need to particularly limit the width of the marginal portions 114, 115. For example, the average widths Wm1, Wm2 of the marginal portions 114, 115 can be 200 to 800 μm, respectively.

[0060] The average width of the margin portions 114, 115 may refer to the average size Wm1 in the third direction of the region where the internal electrode is separated from the fifth surface and the average size Wm2 in the third direction of the region where the internal electrode is separated from the sixth surface, and may be the average value of the sizes in the third direction of the margin portions 114, 115 measured at five equally spaced points on the side of the capacitance forming portion Ac.

[0061] Therefore, in one embodiment, the average sizes Wm1 and Wm2 in the third direction of the regions where the internal electrodes 121 and 122 are separated from the fifth and sixth faces may be 200 to 800 μm, respectively.

[0062] The external electrodes 131 , 132 may be disposed on the third surface 3 and the fourth surface 4 of the body 110 .

[0063] The external electrodes 131, 132 may include a first external electrode 131 and a second external electrode 132 disposed on the third surface 3 and the fourth surface 4 of the body 110, respectively, and connected to the first internal electrode 121 and the second internal electrode 122, respectively.

[0064] Referring to FIG. 1, the external electrodes 131 and 132 may be disposed to cover both end surfaces of the side margin portions 114 and 115 in the second direction.

[0065] In this embodiment, a structure in which the multilayer electronic component 100 has two external electrodes 131, 132 is described, but the number and shapes of the external electrodes 131, 132 can be changed depending on the configuration of the internal electrodes 121, 122 and other purposes.

[0066] Meanwhile, the external electrodes 131 and 132 may be formed using any material that has electrical conductivity, such as a metal, and the specific material may be determined taking into consideration electrical characteristics, structural stability, etc., and may further have a multi-layer structure.

[0067] For example, the external electrodes 131 and 132 may include electrode layers 131a and 132a disposed on the body 110 and plating layers 131b and 132b formed on the electrode layers 131a and 132a.

[0068] As a more specific example of the electrode layers 131a and 132a, the electrode layers 131a and 132a may be firing electrodes including a conductive metal and glass, or resin-based electrodes including a conductive metal and resin.

[0069] The electrode layers 131a and 132a may be formed by sequentially forming a fired electrode and a resin-based electrode on the main body, and may be formed by transferring a sheet containing a conductive metal onto the main body, or by transferring a sheet containing a conductive metal onto the fired electrode.

[0070] The conductive metal contained in the electrode layers 131a and 132a may be any material having excellent electrical conductivity, and is not particularly limited. For example, the conductive metal may be one or more of nickel (Ni), copper (Cu), and alloys thereof.

[0071] The plating layers 131b and 132b serve to improve mounting characteristics. The type of the plating layers 131b and 132b is not particularly limited, and may be a plating layer containing one or more of Ni, Sn, Pd, and alloys thereof, and may be formed of multiple layers.

[0072] As a more specific example of the plating layers 131b, 132b, the plating layers 131b, 132b may be Ni plating layers or Sn plating layers, and may be in a form in which a Ni plating layer and a Sn plating layer are sequentially formed on the electrode layers 131a, 132a, or in a form in which a Sn plating layer, a Ni plating layer, and a Sn plating layer are sequentially formed. The plating layers 131b, 132b may also include a plurality of Ni plating layers and / or a plurality of Sn plating layers.

[0073] There is no need to particularly limit the size of the multilayer electronic component 100. For example, the length L of the multilayer electronic component 100 can be 1.9 to 6.1 mm, the thickness T of the multilayer electronic component 100 can be 0.4 to 3.5 mm, and the width W of the multilayer electronic component 100 can be 1.15 to 5.40 mm.

[0074] Here, the length L of the multilayer electronic component 100 may refer to the maximum size of the multilayer electronic component 100 in a second direction, the thickness T of the multilayer electronic component 100 may refer to the maximum size of the multilayer electronic component 100 in a first direction, and the width W of the multilayer electronic component 100 may refer to the maximum size of the multilayer electronic component 100 in a third direction.

[0075] A multilayer electronic component 100' according to one modified example of the present invention and a multilayer electronic component 100'' according to another modified example will be described below, but content that overlaps with the content described above will be omitted.

[0076] FIG. 5 is a view corresponding to FIG. 2 and showing a multilayer electronic component according to a modified example of the present invention, and FIG. 6 is a view corresponding to FIG. 3 and showing a multilayer electronic component according to a modified example of the present invention.

[0077] 5 and 6 showing a multilayer electronic component 100' according to a modified example of the present invention, in one embodiment, the first cover part 112' may include a plurality of first cover electrodes 123, and the second cover part 113' may include a plurality of second cover electrodes 124. This can further improve the effect of suppressing electromagnetic interference (EMI).

[0078] At this time, the plurality of first cover electrodes 123 may be arranged alternately with the dielectric layers in the first direction, and the plurality of second cover electrodes 124 may be arranged alternately with the dielectric layers in the first direction.

[0079] When the cover parts 112' and 113' include a plurality of cover electrodes 123 and 124, the number of the cover electrodes 123 and 124 does not need to be particularly limited, and the EMI suppression effect can be improved as the number of the cover electrodes 123 and 124 increases. For example, the first cover part 112' may include 2 to 6 first cover electrodes 123, and the second cover part 113' may include 2 to 6 second cover electrodes 124.

[0080] Fig. 7 is a view corresponding to Fig. 2 of a multilayer electronic component according to another modified example of the present invention, Fig. 8 is a view corresponding to Fig. 3 of a multilayer electronic component according to another modified example of the present invention, and Fig. 9 is a plan view sequentially showing a first cover electrode, a first internal electrode and a first margin electrode and a second margin electrode, a second internal electrode and a first margin electrode and a second margin electrode, and a second cover electrode included in the multilayer electronic component according to another modified example of the present invention. Meanwhile, Fig. 8 is a cross-sectional view cut in the first direction and the third direction at a position biased toward the first external electrode in the second direction of the body.

[0081] Referring to Figures 7 to 9 for a multilayer electronic component 100'' according to another modified example of the present invention, the body 110'' includes margin portions 114'', 115'' arranged on both sides of the capacitance forming portion Ac in the third direction, and the margin portions 114'', 115'' include a first margin electrode 125 connected to the first external electrode 131 and a second margin electrode 126 separated from the first margin electrode and connected to the second external electrode 132.

[0082] The margin portions 114'', 115'' include the first margin electrode 125 and the second margin electrode 126, so that the effect of suppressing electromagnetic interference (EMI) can be further improved.

[0083] The margin portions 114'', 115'' may include a first margin portion 114'' and a second margin portion 115'' that are respectively disposed on one surface and the other surface in the third direction of the capacitance forming portion Ac.

[0084] The first margin portion 114'' may include a 1-1 margin electrode 125-1 connected to the first external electrode and a 2-1 margin electrode 126-1 spaced apart from the 1-1 margin electrode and connected to the second external electrode.

[0085] The second margin portion 115'' may include a 1-2 margin electrode 125-2 connected to the first external electrode and a 2-2 margin electrode 126-2 spaced apart from the 1-2 margin electrode and connected to the second external electrode.

[0086] 9, in one embodiment, the first margin electrode 125 and the second margin electrode 126 may be disposed on the same plane as the first internal electrode 121 or the second internal electrode 122. However, without being limited thereto, the margin electrodes 125 and 126 may be printed on a dielectric sheet separate from the first internal electrode 121 and the second internal electrode 122, and may be disposed on a different plane from the first internal electrode and the second internal electrode.

[0087] The margin electrodes 125, 126 may include a conductive metal, and the conductive metal included in the margin electrodes 125, 126 may be one or more of Ni, Cu, Pd, Ag, Au, Pt, In, Sn, Al, Ti, and alloys thereof, but the present invention is not limited thereto. Furthermore, the conductive metal included in the margin electrodes 125, 126 may be the same as the conductive metal included in the cover electrodes 123, 124 and / or the internal electrodes 121, 122, but is not limited thereto.

[0088] The following description will focus on the case where the first margin electrode 125 and the second margin electrode 126 are arranged on the same plane as the first internal electrode 121, but the same can be applied to the case where the first margin electrode 125 and the second margin electrode 126 are arranged on the same plane as the second internal electrode 122.

[0089] In one embodiment, when the average size of the first internal electrode 121 in the third direction is Wi1, the average size of the first margin electrode 125 in the third direction is Ws1, and the average size of the gap between the first margin electrode 125 and the first internal electrode 121 in the third direction is Gs1, the following relationships can be satisfied: 0.01≦Ws1 / Wi1≦0.50 and 1 μm≦Gs1. If Ws1 / Wi1 is less than 0.01, the EMI suppression effect may be insufficient, and if it exceeds 0.50, the capacity per unit volume may decrease. Also, if Gs1 is less than 1 μm, the gap between the margin electrode and the internal electrode may be too narrow, and current may flow directly between the margin electrode and the internal electrode.

[0090] In addition, when the average size of the first internal electrode 121 in the third direction is Wi1, the average size of the second margin electrode 126 in the third direction is Ws2, and the average size in the third direction of the distance between the second margin electrode 125 and the first internal electrode 121 is Gs2, the relationships 0.01≦Ws2 / Wi1≦0.50 and 1 μm≦Gs2 can be satisfied.

[0091] In one embodiment, when the average size of the body 110'' in the second direction is Lb, the average size of the first margin electrode 125 in the second direction is Ls1, and the average size of the second margin electrode 126 in the second direction is Ls2, 0.01≦Ls1 / Lb≦0.50 and 0.01≦Ls2 / Lb≦0.50 may be satisfied. If Ls1 / Lb is less than 0.01, the EMI suppression effect may be insufficient, and if it exceeds 0.50, it may be difficult to maintain the distance from the second margin electrode 126. If Ls2 / Lb is less than 0.01, the EMI suppression effect may be insufficient, and if it exceeds 0.50, it may be difficult to maintain the distance from the first margin electrode 125.

[0092] In addition, when the average distance in the second direction between the first margin electrode 125 and the second margin electrode 126 is Gs3, 1 μm≦Gs3 can be satisfied. If Gs3 is less than 1 μm, the distance between the first margin electrode and the second margin electrode is too narrow, and there is a possibility that a current will flow directly between the first margin electrode and the second margin electrode.

[0093] Wi1, Ws1, Gs1, Ws2, Gs2, Ls1, Ls2, and Gs3 may be measured after polishing the body 100 until the first internal electrode 121 is exposed. Wi1, Ws1, Gs1, Ws2, and Gs2 may be average values ​​of the magnitude (width) in the third direction measured at five equally spaced points in the second direction, and Ls1, Ls2, and Gs3 may be average values ​​of the magnitude (length) in the second direction measured at five equally spaced points in the third direction.

[0094] In one embodiment, the first margin electrode 125 may be arranged to completely overlap the first cover electrode 123, and the second margin electrode 126 may be arranged to completely overlap the second cover electrode 124 in the first direction.

[0095] 7 and 8, the first cover part 112'' includes two first cover electrodes 123, and the second cover part 113'' includes two second cover electrodes 124. However, this is not limited thereto, and the first cover part 112'' may include one or three or more first cover electrodes 123, and the second cover part 113'' may also include one or three or more second cover electrodes 124.

[0096] (Experimental Example) A sample chip of a multilayer electronic component was fabricated with a length L, width W, and thickness T of 3200 μm, 1600 μm, and 1600 μm, respectively. The width (Wi1, Wi2) of the internal electrodes was 1250 μm, and the length (Li1, Li2) was 2975 μm.

[0097] In order to confirm the EMI suppression effect of the cover electrodes 125, 126, in test number 1, no cover electrodes were formed, and in test numbers 2 to 6, sample chips were manufactured to have the configurations shown in Figures 1 to 4. In test numbers 2 to 6, the sample chips were manufactured by changing the widths Wc1 and Wc2 of the first and second cover electrodes so as to satisfy Wc1-Wi1 and Wc2-Wi2 in Table 1 below.

[0098] The maximum magnetic field strength was measured using an EMI scanner at a point 1 mm away from the top surface of the sample chip, and the maximum value of the magnetic field strength appearing in the range of 68 MHz to 140 MHz was taken as the maximum magnetic field strength.

[0099] The EMI reduction rate was measured based on the maximum magnetic field strength of test number 1.

[0100] [Table 1]

[0101] With reference to Test Nos. 2 and 3, it can be seen that even when a cover electrode is provided, when Wc1-Wi1 and Wc2-Wi2 are 80 μm or less, the EMI reduction rate is small.

[0102] On the other hand, when looking at test numbers 4 to 6 in which Wc1-Wi1 and Wc2-Wi2 exceed 80 μm, it can be confirmed that the EMI reduction rate is significantly high.

[0103] In addition, in order to confirm the EMI suppression effect depending on the number of layers of the cover electrode, sample chips were manufactured by increasing the number of layers of the cover electrode. Based on test number 6 in Table 1 above, the number of first cover electrodes and second cover electrodes included in test number 6 was increased to manufacture sample chips of test numbers 7 to 11.

[0104] [Table 2]

[0105] Referring to Table 2 above, it can be seen that the EMI reduction rate increases as the number of cover electrodes increases.

[0106] In order to confirm the shielding effect due to the addition of the margin electrodes 125, 126, a sample chip (test number 13) was prepared in which the margin electrodes 125, 126 were arranged on the side surfaces of all the first internal electrodes and the second internal electrodes, as shown in Figures 7 and 8. At this time, the cover electrodes 123, 124 of test number 13 were formed in the same manner as in test number 11.

[0107] In addition, in order to confirm the shielding effect when only a margin electrode is arranged without a cover electrode, a sample chip (test number 14) was prepared that had the same configuration as the sample chip of test number 13 except for the cover electrode, but did not have a cover electrode.

[0108] The magnetic field strength was measured by changing the frequency for the cases where there was no cover electrode and no margin electrode (test number 1), where there was only a cover electrode (test number 11), where there were both cover electrodes and margin electrodes (test number 13), and where there was only a margin electrode (test number 14). The results are shown in Figure 10.

[0109] 10, it can be seen that the EMI reduction rate is the largest when both the cover electrode and the margin electrode are present (Test No. 13). On the other hand, when only the margin electrode is present (Test No. 14), the EMI reduction rate is smaller than when only the cover electrode is present (Test No. 11), and it can be seen that the EMI suppression effect of the cover electrode is greater.

[0110] Although the embodiments of the present invention have been described in detail above, the present invention is not limited to the above-described embodiments and the accompanying drawings, but is limited by the scope of the accompanying claims. Therefore, various substitutions, modifications, and changes can be made by a person having ordinary knowledge in the art within the scope of the technical idea of ​​the present invention described in the claims, and these also belong to the scope of the present invention.

[0111] In addition, the expression "one embodiment" used in the present disclosure does not mean the same embodiment, but is provided to emphasize and describe each unique feature that is different from the others. However, the above-mentioned one embodiment does not exclude being realized in combination with the features of another embodiment. For example, even if a matter described in a specific embodiment is not described in another embodiment, it can be understood as a description related to the other embodiment, unless there is a description that is opposite or contradictory to the matter in the other embodiment.

[0112] The terms used in the present disclosure are merely used to describe one embodiment and are not intended to limit the present disclosure. In this case, the singular expression includes the plural expression unless the context clearly indicates otherwise. [Explanation of symbols]

[0113] 100 Multilayer electronic components 110 Main unit 111 Dielectric layer 112, 113 Cover part 114, 115 Margin 121, 122 Internal electrode 123, 124 Cover electrode 125, 126 Margin electrodes 131, 132 External electrode 131a, 132a electrode layer 131b, 132b plating layer

Claims

1. a capacitance forming portion including first internal electrodes and second internal electrodes alternately disposed in a first direction with a dielectric layer interposed therebetween, the first internal electrode being disposed at an uppermost end in the first direction and the second internal electrode being disposed at a lowermost end in the first direction; a first cover portion disposed on an upper surface of the capacitance forming portion in the first direction and including a first cover electrode; a second cover portion disposed on a lower surface of the capacitance forming portion in the first direction and including a second cover electrode; a main body including first and second surfaces facing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in the second direction, and fifth and sixth surfaces connected to the first, second, third and fourth surfaces and facing each other in the third direction; a first external electrode disposed on the third surface and connected to the first internal electrode and the first cover electrode; a second external electrode disposed on the fourth surface and connected to the second internal electrode and the second cover electrode, a multilayer electronic component in which, when average sizes in a third direction of the first internal electrode, the second internal electrode, the first cover electrode, and the second cover electrode are Wi1, Wi2, Wc1, and Wc2, respectively, Wc1-Wi1>80 μm and Wc2-Wi2>80 μm are satisfied.

2. 2 . The multilayer electronic component according to claim 1 , wherein the first internal electrodes are arranged to completely overlap the first cover electrodes, and the second internal electrodes are arranged to completely overlap the second cover electrodes in the first direction.

3. 2. The multilayer electronic component according to claim 1, wherein when average sizes in the second direction of the first internal electrode, the second internal electrode, the first cover electrode and the second cover electrode are Li1, Li2, Lc1 and Lc2, respectively, Li1≦Lc1 and Li2≦Lc2 are satisfied.

4. 2. The multilayer electronic component according to claim 1, wherein the first cover portion includes a plurality of the first cover electrodes, and the second cover portion includes a plurality of the second cover electrodes.

5. 5. The multilayer electronic component according to claim 4, wherein the first cover portion includes two to six of the first cover electrodes, and the second cover portion includes two to six of the second cover electrodes.

6. 6. The multilayer electronic component according to claim 1, wherein the main body includes margin portions arranged on both sides of the capacitance forming portion in a third direction, the margin portions including a first margin electrode connected to the first external electrode and a second margin electrode spaced apart from the first margin electrode and connected to the second external electrode.

7. 7. The multilayer electronic component according to claim 6, wherein the first margin electrode and the second margin electrode are disposed on the same plane as the first internal electrode or the second internal electrode.

8. 7. The multilayer electronic component according to claim 6, wherein the first margin electrode is disposed so as to completely overlap the first cover electrode, and the second margin electrode is disposed so as to completely overlap the second cover electrode in the first direction.

9. the margin portion includes a first margin portion and a second margin portion respectively disposed on one surface and the other surface of the capacitance forming portion in a third direction, 7. The multilayer electronic component of claim 6, wherein the first margin portion includes a 1-1 margin electrode connected to the first external electrode and a 2-1 margin electrode spaced apart from the 1-1 margin electrode and connected to the second external electrode, and the second margin portion includes a 1-2 margin electrode connected to the first external electrode and a 2-2 margin electrode spaced apart from the 1-2 margin electrode and connected to the second external electrode.

10. the first margin electrode and the second margin electrode are disposed on the same plane as the first internal electrode, 7. The multilayer electronic component according to claim 6, wherein, when an average size of the first internal electrodes in the third direction is Wi1, an average size of the first margin electrodes in the third direction is Ws1, and an average size in the third direction of the separation between the first margin electrodes and the first internal electrodes is Gs1, 0.01≦Ws1 / Wi1≦0.50 and 1 μm≦Gs1 are satisfied.

11. 11. The multilayer electronic component according to claim 10, wherein, when an average size of the second margin electrode in the third direction is Ws2 and an average size of the separation between the second margin electrode and the first internal electrode in the third direction is Gs2, 0.01≦Ws2 / Wi1≦0.50 and 1 μm≦Gs2 are satisfied.

12. 7. The multilayer electronic component according to claim 6, wherein, when an average size of the main body in the second direction is Lb, an average size of the first margin electrode in the second direction is Ls1, and an average size of the second margin electrode in the second direction is Ls2, 0.01≦Ls1 / Lb≦0.50 and 0.01≦Ls2 / Lb≦0.50 are satisfied.

13. 7. The multilayer electronic component according to claim 6, wherein, when an average size of the distance between the first margin electrode and the second margin electrode in the second direction is Gs3, 1 μm≦Gs3 is satisfied.

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