Inlay sheet, portable electronic device, and method of manufacturing inlay sheet

Abstract

To provide an inlay sheet configured to improve holdability of an IC module, a portable electronic device, and a method of manufacturing the inlay sheet.SOLUTION: An inlay sheet includes a sheet-like substrate, a wireless module, and a coil antenna. The substrate includes an opening. The wireless module includes an IC chip and an antenna connection terminal to which the antenna is connected. The wireless module is arranged in the opening. Both ends of the coil antenna are connected from the substrate to the antenna connection terminal of the wireless module via the opening. A connection member is provided which is pasted between an edge of the opening and both ends of a module substrate of the wireless module, the module substrate having no antenna connection terminal, to connect the substrate to the wireless module substrate. The connection member is formed of the same material as that of the substrate.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] An embodiment of the present invention relates to an inlay sheet, a portable electronic device, and a method for manufacturing the inlay sheet. It concerns the method. [Background technology]

[0002] In portable electronic devices such as wireless IC cards, wireless IC modules are installed in the The wireless IC module uses a laminated structure in which a conductive sheet is laminated with other sheet materials. The module consists of a module board, an antenna connection terminal drawn on the module board, and a module and chip components such as LSIs mounted on a board.

[0003] In the manufacturing method of the inlay sheet, for example, an IC module is inserted into an opening of a sheet-like base material. The coil antenna is drawn on the surface of the substrate, and one end side and the other end side of the coil antenna are The antenna connection terminal of the wireless IC module is electrically and mechanically connected at the It is known that:

[0004] For example, the coil antenna is attached to the surface of the sheet-shaped substrate, and its end is connected to the wireless IC inside the opening. The inlay is connected to the antenna terminal of the module by soldering or other methods. In the sheet, there is a demand for improving the retention of an IC module placed in an opening in a substrate. can be. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2000-235635 A Summary of the Invention [Problem to be solved by the invention]

[0006] The problem to be solved by the present invention is to provide an inlay that can improve the retention of an IC module. The present invention provides a method for manufacturing a portable electronic device, a portable electronic device, and an inlay sheet. [Means for solving the problem]

[0007] The inlay sheet according to the embodiment includes a sheet-shaped base material, a wireless module, and a coil assembly. The wireless module includes an IC chip and an antenna. The substrate has an opening. and an antenna connection terminal to which the wireless module is joined. The wireless module is disposed in the opening. Both ends of the coil antenna are connected to the base material via the opening of the wireless module. The edge of the opening and the antenna connection terminal of the wireless module are joined to each other. The substrate is attached between both ends of a module substrate having no terminals, and the substrate and the wireless module are The connecting member is made of the same material as the base material. is. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a plan view showing a configuration of an IC card according to an embodiment. [Diagram 2] FIG. [Diagram 3] FIG. 2 is an explanatory diagram showing the configuration of an IC card. [Figure 4] FIG. 2 is a plan view showing a partial configuration of the IC card. [Diagram 5] FIG. 2 is a cross-sectional view showing a partial configuration of the IC card. [Figure 6] FIG. 2 is a plan view showing the configuration of the IC module. [Figure 7] FIG. 2 is a cross-sectional view showing the configuration of the IC module. [Figure 8]3A to 3C are explanatory diagrams showing the manufacturing process of the IC card. [Figure 9] FIG. 2 is a plan view showing an example of an inlay sheet according to an embodiment. [Figure 10] FIG. 13 is a plan view showing a partial configuration of an IC card according to another embodiment. [Figure 11] FIG. 13 is a plan view showing a partial configuration of an IC card according to another embodiment. [Figure 12] FIG. 13 is a plan view showing a partial configuration of an IC card according to another embodiment. [Figure 13] FIG. 2 is a cross-sectional view showing a configuration of a portion of the IC card according to the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] The configuration of an IC card 1 according to the first embodiment will be described below with reference to FIGS. 1 to 7. FIG. 1 is a plan view showing the configuration of an IC card 1 according to a first embodiment. FIG. 3 is a cross-sectional view of the C card 1. FIG. 4 and FIG. 5 is a plan view and a cross-sectional view showing a part of the configuration of an IC card. In the figure, arrows X, Y, and Z indicate 1 and 2 show a first direction, a second direction, and a third direction perpendicular to each other.

[0010] As shown in FIG. 1 to FIG. 3, an IC card 1 as a portable electronic device is an inlay A first core sheet 11 is a laminate of a second core sheet 12 laminated on one side of the first core sheet 11. A first cover sheet 13 is laminated on the back surface of the first core sheet 11. and a second cover sheet 14 laminated on the surface of the second core sheet 12. For example, The IC card 1 is configured to be capable of contactless communication with a processing device such as a reader / writer, and is located close to the processing device. For example, IC cards1 are used for passports, transportation cards, credit cards, etc. It is used for credit cards, etc.

[0011] The IC card 1 is, for example, a laminate of a first core sheet 11 and a second core sheet 12. The first cover sheet 13 and the second cover sheet 14 are laid on the front and back of the body, respectively. For example, the components are bonded together by heat pressing.

[0012] The first core sheet 11 is made up of a sheet base material 15 (base material) having an opening 15a and a sheet base material 1 A non-contact coil antenna 17 drawn on the surface of the sensor 5 and a wireless module disposed in the opening 15a. and an IC module 20 serving as a module.

[0013] The sheet base material 15 is made of PVC (polyvinyl chloride), PET-G (glycol-modified polyethylene For example, rectangular sheets are made from resin materials such as polyethylene terephthalate (PET) and PC (polycarbonate). The sheet base material 15 is formed in a shape of a can. The sheet base material 15 has a predetermined portion on which the IC module 20 is accommodated. The opening 15a is a rectangular opening that constitutes a part of the sheet base material 15. A through hole that extends from the front surface on one side of the stacking direction (Z direction) to the back surface on the other side of the stacking direction, The IC module 20 is disposed inside the sheet base material 15. Wiring portions and various terminals may be formed on the sheet substrate 15 as mounting parts. In addition to the IC module 20, other electronic components may be mounted on the board.

[0014] As shown in FIG. 1 to FIG. 5, the coil antenna 17 is made of, for example, a copper wire and is attached to a sheet substrate. A predetermined pattern is drawn on the surface of the sheet substrate 15 and fixed to the sheet substrate 15. For example, the coil The antenna 17 is formed by heating a copper wire and pressing it against the sheet substrate 15. The coil antenna is then drawn in a predetermined pattern on the sheet substrate 15. The nozzle 17 may be fixed to the sheet base material 15 with an adhesive or the like instead of by thermocompression bonding. A portion of the coil antenna 17 may be embedded in the sheet substrate 15 .

[0015] The coil antenna 17 is a loop antenna having one end 17a and the other end 17 b, a loop portion 17c wound around the outer periphery of the sheet base material 15 several times, and the loop portion 17c and a passage portion 17d, 17b disposed over the opening 15a between the ends 17a, 17b. For example, the coil antenna 17 has ends 17a, 17b and a loop portion 17c. is placed on the surface of the sheet base material 15 and bonded to the sheet base material 15.

[0016] In the coil antenna 17, the passages 17d and 17e arranged above the opening 15a are For example, both sides of the IC chip 22 and the molded portion 28 on the module substrate 21 in the first direction In the portions adjacent to the first direction, the first and second portions extend linearly in a second direction perpendicular to the first direction. That is, the passing portions 17d and 17e are connected from one side to the other side in the second direction of the opening 15a. , is disposed passing over the module substrate 21 of the IC module 20. For example, The tenna 17 is connected to the IC module 20 at a total of three or more passing portions 17d and 17e. The coil antenna 17 has bent or folded parts at which the extending direction changes. For example, the end portions connected to the passing portions 17d and 17e and joined to the surface of the sheet base material 15 may be Folded portions at which the extending direction changes are formed at 17a and 17b.

[0017] Specifically, the coil antenna 17 includes passing portions 17d and 17e in the vicinity of the ends 17a and 17b of the coil antenna 17. However, when the IC module 20 is joined by soldering or welding, the electrical and mechanical properties are improved. As an example, the coil antenna 17 is mechanically connected to the passage portion 1 on the one end 17a side. 7d is joined to one antenna connection terminal 23 at two points, and the other end 17b side The passing portion 17e is joined to the other antenna connection terminal 23 at two points. A total of four joints 25 are formed on each of the tena connection terminals 23, two on each side.

[0018] That is, the coil antenna 17 has a loop portion 17c joined to the surface of the sheet substrate 15. The other parts, ie, the passing parts 17d and 17e, are connected to the module board 21 or the antenna. The coil antenna 17 is joined to the connecting terminal 23. In the gap G1 between the edge of the opening 15a of the base material 15 and the module substrate 21, It has a portion that is not joined to the mold substrate 21.

[0019] As shown in FIG. 6 and FIG. 7, the IC module 20 includes a module substrate 21 and an IC chip. The antenna connector 20 includes a terminal 22, an antenna connection terminal 23, a wire 27, and a molded portion .

[0020] The module substrate 21 is configured in a rectangular plate shape and is disposed within the opening 15a of the sheet base material 15. The module substrate 21 is made of, for example, a glass epoxy material. The plate 21 is configured to be slightly smaller than the opening 15a. A gap is formed between the inner wall of 5a.

[0021] The IC chip 22 is, for example, an LSI (Large Scale Integration) The IC chip 22 is mounted on the module substrate 21. 2, the molded part 23 is connected to the conductive part 23a by wire bonding via the wire 27. For example, the IC chip 22 includes memories such as RAM and ROM, a CPU, The IC chip 22 is provided on the front side of the module substrate 21. The inside of the storage portion formed by the opening 15a and the opening 12a of the second core sheet 12 described later will be placed in.

[0022] The antenna connection terminal 23 is disposed on the module substrate 21 in a first direction of the IC chip 22. The antenna connection terminals 23 are provided on one and the other side of the metal layer 21, for example. The antenna connection terminal 23 is connected to a terminal on the IC chip 22 side. The antenna connection terminal 23 faces the IC chip 22 located in the center. The antenna connection terminals 23 each have a linear conductor portion 23a extending in the first direction. The antenna 17 is connected to an antenna joint 25 .

[0023] For example, in this embodiment, two antenna connections are provided on both sides of the IC chip 22. The coil antennas 17 are connected to the terminals 23 at two locations. Two antenna joints 25 are provided on each side, making a total of four.

[0024] The wire 27 is, for example, a gold wire, and connects the conductive portion 23a and the IC chip 22. For example, one end of the wire 27 is electrically connected to a terminal of the IC chip 22 and the other end is connected to an antenna. It is electrically connected to the conductive wire portion 23 a of the connecting terminal 23 .

[0025] The molded portion 28 is made of a resin material, and includes the IC chip 22, the wire 27, and the conductive wire portion 23. For example, the molded portion 28 is configured in a rectangular block shape.

[0026] The second core sheet 12 is made of a resin material and is formed in a rectangular shape that is long in one direction. The core sheet 12 is made of the same material as the sheet base material 15 of the first core sheet 11. For example, the second core sheet 12 is made of PVC, PETG, PC, etc. 2 is laminated on the front side of the first core sheet 11. The outer shape of the second core sheet 12 is the same as that of the first core The second core sheet 12 is formed in the same shape as the outer shape of the sheet 11. The opening 12a is a through hole having the same shape as the opening 15a or a size larger than the opening 15a. The opening 15a is overlapped with the opening 15a in the stacking direction to accommodate the IC module 20. For example, the opening 12a is formed in the outer periphery of the molded portion 28 of the IC module 20. The IC module 2 is formed in a rectangular shape along the edge of the first core sheet 11 and protrudes from the first core sheet 11. Contains at least a portion of 0.

[0027] The first cover sheet 13 and the second cover sheet 14 are formed in, for example, a rectangular plate shape. The outer periphery of the cover sheet 13 is the same as the outer shape of the first core sheet 11 and the second core sheet 12. The cover sheets 13 and 14 are formed in the same shape. For example, the cover sheets 13 and 14 are made of PVC, PETG, PC, etc. A base layer is formed of a resin material, and a pattern or letter is drawn on the surface of the base layer. For example, the cover sheets 13 and 14 are the sheet base material of the first core sheet 11. 15 and the second core sheet 12.

[0028] In the IC card 1 configured in this manner, the IC module 20 is The coil spring 14 has three or more joints to be joined to the base material 15. The antenna 17 is connected to the antenna connection terminals 23 of the IC module 20 at four points. A joint 25 is formed.

[0029] Such an IC card 1 has a first core sheet 11 and a laminated material on the surface of the first core sheet 11. The first core sheet 11 is then laminated with the second core sheet 12, and a first cover sheet 13 is placed on the back side of the first core sheet 11. The second cover sheet 14 is placed on the front side of the second core sheet 12 and then heated and pressed. In this way, the stacked sheets 11 to 14 are joined together.

[0030] FIG. 8 is an explanatory diagram showing the manufacturing process of an IC card, and FIG. 9 shows an example of an inlay sheet. As shown in FIG. 8, the method for producing the first core sheet 11 includes the steps of: The IC module 20 is placed in the opening 15a. and the antenna 17 is joined at least at three or more points. An opening 15a is formed in the substrate 15 (ST1), and an IC module 20 is disposed in the opening 15a. Then, the IC module in the opening 15a is placed on the sheet base material 15 from the front surface of the sheet base material 15 (ST2). The coil antenna 17 is formed in a predetermined pattern passing through the wire 20 (ST3). A part of the antenna 17 is disposed on the antenna connection terminal 23 of the IC module 20, and the connection terminal 23 The parts are joined by welding or soldering (ST4).

[0031] For example, the first core sheet 11 is a sheet unit 110 in which a plurality of inlets are arranged. After being integrally formed as a single piece, the pieces are cut into a predetermined shape and separated into individual pieces. A plurality of openings 15a are formed in a large-sized base sheet material 150 having a continuous base substrate 15 (ST 1), an IC module 20 is placed in each opening 15a (ST2). The coil antenna 17 corresponding to the C module is drawn (ST3), and each IC module 20 The antenna 17 is joined onto the antenna connection terminal 23 to form three or more joints 25 (S T4) As a result of the above, a plurality of IC modules 20 are mounted on the base sheet material 150. The sheet unit 110, which is a lay sheet, is completed. Then, a plurality of IC modules 20 and a sheet unit 110 on which the first core sheet 12 is to be divided into a plurality of second core sheets 12. The first cover sheet 110 is laminated on the second sheet material, and the first cover sheet 110 is individually attached to the back side of the sheet unit 110. A third sheet material is laminated, and a second cover sheet is formed on the front side of the second sheet material by individualization. The fourth sheet material, which will be the sheet 14, is then laminated and heat-pressed to form a laminate of multiple sheet materials. and bond them together (ST5) to form a card unit on which a plurality of IC modules 20 are mounted. The card unit is then cut into individual pieces (ST6), and multiple IC cards are assembled. In addition, an IC module 1 is formed as a part of the laminated structure of one IC card 1. The first core sheet 11 having the 20 is called an inlay sheet, and is also called an inlay sheet before being divided into individual pieces during the manufacturing process. The sheet unit 110, in which a plurality of IC modules 20 are mounted on a large sheet material, It is called an inlay sheet.

[0032] As described above, the first core sheet 11 and the IC card 1 according to the first embodiment are The module 20 is connected to the coil antenna 17 or the substrate 15 at three or more points, for example, four points. For this purpose, for example, two points are bonded to each side of the IC chip 22. In comparison with a configuration in which the first core sheet 11 is bonded by bonding, the IC module 20 is held more firmly and the first core sheet 11 is This improves ease of handling during transportation. A coil antenna is disposed in the sheet substrate through a gap and extends from the sheet substrate to the IC module. The inlay configuration, which is connected to the connector at only two points, provides unstable support. If the inlay is transported to the next process in this state, the wireless module will be greatly damaged by the vibrations. The antenna wire may break near the joint due to shaking. According to the embodiment, the IC module 20 and the coil antenna 17 are joined at three or more points. In addition, the antenna can be supported at two positions by the passages 17d and 17e. and a distance between the multiple joints 25, 25 is ensured, This improves stability and strength. In addition, it prevents the IC module 20 from being displaced or coming off during the manufacturing process. This can prevent the product from falling off, and improve positional accuracy when it is commercialized.

[0033] Although one embodiment of the present invention has been described in detail above, the present invention is not limited to the above-described embodiment. The present invention is not limited to the above, and modifications and improvements are possible as appropriate.

[0034] For example, in the first embodiment, the IC chip 22 is provided on both sides in one direction with The coil antenna 17 is provided with antenna connection terminals 23 at both ends 17a, 17b of the coil antenna 17. The passage portions 17d and 17e passing over the opening 15a in the vicinity of b are joined to the connection terminal 23. However, the present invention is not limited to this. For example, the antenna connection terminal 23 The coil antenna 17 is connected to each antenna connection terminal 23. It may be possible.

[0035] For example, as another embodiment, a first core sheet 11A shown in FIG. In addition to the pair of antenna connection terminals 23 at both ends in the first direction, A pair of antenna connection terminals 29 are formed, and the antenna connection terminals 2 3 and 29 are provided with a joint 25 to which the antenna 17 is joined. The coil antenna 17 has a passing portion 17d joined to one of the connection terminals 23, and The end portion of the sheet 15 extends over the sheet base material 15 and is joined to the sheet base material 15. The portion on the end side of the second antenna connection terminal 29 extends to the second antenna connection terminal 29. It is joined to child 29.

[0036] That is, the coil antenna 17 has passing portions 17d and 17e and ends 17a and 17b. Between them, relay portions 17f and 17g are joined to the surface of the sheet base material 15, and an antenna connection terminal 2 9 and includes extensions 17h and 17i joined to an antenna connection terminal 29. For example, the relay portions 17f and 17g form a rectangular pattern. The semiconductor laser device is disposed on a mold substrate 21.

[0037] The connection terminal 23 and the connection terminal 29 are electrically connected by a conductor portion 23b.

[0038] In this embodiment, the joints 25 are provided at three or more locations, so that the IC module The coil antenna 17 has relay portions 17f and 17b. The passages 17d and 17e are connected to the antenna connection terminals 23 and 29 by the connection portion 25 via the g. Therefore, the stability can be further improved.

[0039] In the above-mentioned example, the antenna connection terminals 23 and 29 are electrically connected to the conductor portions 23a and 23b. The antenna connection terminals 23 and 29 are electrically connected to the IC chip. For example, as another embodiment, the first core sheet 1 shown in FIG. 1B, the second connection terminal 29 is not connected to the connection terminal 23 by the conductor portion 23b, It may also be an auxiliary terminal for connecting the antenna 17 .

[0040] In the above embodiment, the coil antenna 17 is connected to the antenna connection terminal 23 at four points. However, the present invention is not limited to this. For example, the joint may be a coil a It may be a connection portion connected to the base material 15 instead of the antenna 17 .

[0041] For example, as another embodiment, as shown in FIG. 12 and FIG. 13, a first inlay sheet The core sheet 11C has two connectors that are attached to the edge of the opening 15a and the module substrate 21. A member 18 is provided, and the antenna 17 is joined to the IC module 20 by the connecting member 18. A joint 19 is formed. That is, in this embodiment, the antenna 17 is The number of joints 25 to be joined to the IC module 20 and the number of joints 25 to be joined to the IC module 20 by the connection members 18 The total number of joints 19 connected to the first connector 18 is 3 or more. At least the sheet base material 15 of the sheet 11, the second core sheet 12, and the cover sheets 13 and 14 For example, the connecting member 18 is made of PVC, PETG, PC, etc. It is formed of a resin material.

[0042] As a method for producing such a first core sheet 11C, for example, a method for forming an opening 1 in a sheet substrate 15 is described below. 5a is formed (ST1), and an IC module 20 is placed in the formed opening 15a. (ST2) A coil is formed in a predetermined pattern from the surface of the sheet substrate 15 to the IC module 20. The antenna 17 is formed (ST3) and the antenna 1 is connected to the IC module 20. 7 to form a joint 25, and the edge of the opening 15a of the sheet base material 15 and the IC module The joint portion 19 is formed by attaching the connecting member 18 extending from the upper portion 18 to the lower portion 20 at two points. (ST3), for example, a first core sheet 11C, a second core sheet 12, and a cover When the sheets 13 and 14 are laminated and heat-pressed, the first core sheet 11C and the second core sheet The connecting member 18, which is made of the same material as 12, is melted and integrated.

[0043] In this embodiment, three or more joints or connections are provided. This improves the holding performance of the IC module 20.

[0044] Also, the number of joints is not limited to four. For example, it may be three or five or more. The wiring shape of the antenna is not limited to that in the above embodiment. For example, in the first embodiment, on the distal end side that has passed through the opening 15a, In the above embodiment, the ends 17a and 17b are folded back, but they may extend linearly.

[0045] In addition to the above configuration, the IC card 1 may be provided with other configurations as necessary. In addition, the IC card 1 may be made of four layers of sheets 11 to 1. However, this is not limited to a four-layer structure, and any of the sheets may be omitted to form a three-layer structure or less. It may be a lower layer, or it may be five layers or more.

[0046] In addition, the openings 15a and 12a constituting the storage portion are through holes, but For example, either or both of the first and second electrodes may be recessed.

[0047] Although the IC card 1 is exemplified as a portable electronic device, the present invention is not limited to this. , and can be used in various electronic devices.

[0048] According to at least one of the above-described embodiments, the holding property of the wireless module can be improved. do.

[0049] Although several embodiments of the present invention have been described, these embodiments are presented by way of example only. These novel embodiments are not intended to limit the scope of the invention. It is possible to implement the present invention in various other forms, and various modifications are possible without departing from the spirit and scope of the present invention. Omissions, substitutions, and modifications may be made. These embodiments and their modifications are within the scope of the invention and The invention is included in the abstract and in the scope of the claims and their equivalents. . [Explanation of symbols]

[0050] 1...IC card, 11, 11A, 11B, 11C...first core sheet (inlay sheet), 12... second core sheet, 12a... opening, 13... first cover sheet, 14... second cover sheet 15...sheet substrate, 15a...opening, 17...coil antenna, 17a...end, 17b... End portion, 17c...loop portion, 17d...passing portion, 17e...passing portion, 17f...relay portion, 17g... Relay portion, 17h...extension portion, 17i...extension portion, 18...connection member (joint portion), 20...IC module module (wireless module), 21...module board, 22...IC chip, 23...antenna Connection terminal, 23a...conductor portion, 23b...conductor portion, 25...joint portion, 27...wire, 28...motor ld section, 29...connection terminal, 110...seat unit (inlay sheet), 150...base Sheet material, G1...gap.

Claims

1. A sheet-like substrate having an opening; The module includes a module substrate, an IC chip, and an antenna connection terminal to which an antenna is connected. a wireless module disposed in the opening; A coil antenna provided on a surface of the substrate; Equipped with Both ends of the coil antenna are connected to the base material via the opening of the wireless module. It is connected to the antenna connection terminal, The edge of the opening and the module substrate not having the antenna connection terminal of the wireless module A connection portion that is attached between both ends of the plate and connects the base material and the wireless module board. It has materials, The connection member is made of the same material as the base material. Inlay sheet.

2. The inlay sheet according to claim 1; The inlay sheet is laminated on one side of the inlay sheet in the lamination direction, and the wireless module is disposed. A second core sheet having an opening through which the second core sheet is inserted; One side and the other side in the stacking direction of the laminate of the inlay sheet and the second core sheet A portable electronic device comprising: a cover sheet disposed in at least one direction.

3. The module substrate and the I arranged on the module substrate are inserted into the opening formed in the sheet base material. and an antenna connection terminal formed on both ends of the module substrate. Placing the modules; An antenna is formed from the surface of the sheet base material to the wireless module, and The wireless module is connected to two antenna connection terminals at both ends of the wireless module. Joining both ends of the antenna; The edge of the opening of the sheet base material and the antenna connection terminal of the wireless module are not included. A connecting member made of the same material as the base material is attached between both ends of the module substrate. and attaching the inlay sheet to the substrate.

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