Liquid jet head and liquid jet device

Abstract

To provide a liquid jet head which enables reduction of warpage of a passage member, and to provide a liquid jet device.SOLUTION: A liquid jet head includes: a plurality of head chips which is arranged in a first direction and jets liquid in a jet direction; a resin first passage member which is elongated in the first direction and supplies the liquid to the head chips in a distributed manner; and a metallic support member which is elongated in the first direction and supports the first passage member. The first passage member is arranged in the jet direction relative to the support member. It is preferable that the first passage member includes: a first passage substrate to which the head chips are fixed; and a second passage substrate disposed between the first passage substrate and the support member, and the first passage member is supported by the support member by fixing the first passage substrate to the support member.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present disclosure relates to a liquid ejection head and a liquid ejection device.

Background Art

[0002] Conventionally, a liquid ejection device including a liquid ejection head that ejects a liquid such as ink onto a medium such as printing paper has been proposed.

[0003] The liquid ejection head described in Patent Document 1 includes a plurality of head chips provided with a plurality of nozzles for ejecting a liquid, a long metal holder (corresponding to a support member) that holds the plurality of head chips, and a long resin flow path member having a distribution flow path for distributing the liquid to the plurality of head chips. By fixing the flow path member to a highly rigid holder, warping of the flow path member due to linear expansion and swelling is reduced.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In a conventional liquid ejection head, a flow path member for distributing a liquid is disposed above a support member. For this reason, it is necessary to provide a large number of holes for flow path connection in the support member, and there is a risk that the rigidity of the support member may decrease. As a result, there is a risk that warping of the flow path member made of a long resin cannot be sufficiently reduced.

Means for Solving the Problems

[0006] A liquid ejection head according to one aspect of the present disclosure includes a plurality of head chips arranged in a first direction and ejecting liquid in an ejection direction, a resin-made first flow path member that is long in the first direction and distributes and supplies liquid to the plurality of head chips, and a metal-made support member that is long in the first direction and supports the first flow path member. The first flow path member is arranged in the ejection direction with respect to the support member.

[0007] A liquid ejection device according to one aspect of the present disclosure includes a liquid ejection head and a liquid storage unit for storing liquid to be supplied to the liquid ejection head.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

Figure 14

Figure 15

Embodiments for Carrying Out the Invention

[0009] Hereinafter, preferred embodiments according to the present disclosure will be described with reference to the accompanying drawings. Note that the dimensions and scales of each part in the drawings are appropriately different from the actual ones, and there are also some parts shown schematically for easy understanding. Further, the scope of the present disclosure is not limited to these embodiments unless otherwise specifically stated in the following description.

[0010] In the following description, the X-axis, Y-axis, and Z-axis that intersect each other are appropriately used. Also, one direction along the X-axis is referred to as the X1 direction, and the direction opposite to the X1 direction is referred to as the X2 direction. Similarly, the directions opposite to each other along the Y-axis are referred to as the Y1 direction and the Y2 direction. Also, the directions opposite to each other along the Z-axis are referred to as the Z1 direction and the Z2 direction. Typically, the Z-axis is a vertical axis, and the Z1 direction corresponds to the downward direction in the vertical direction. However, the Z-axis does not have to be a vertical axis. Also, the X-axis, Y-axis, and Z-axis are typically perpendicular to each other, but are not limited thereto, and may intersect at an angle within a range of 80° or more and 100° or less, for example.

[0011] The Y1 direction or the Y2 direction is an example of the "first direction". The X1 direction or the X2 direction is an example of the "second direction". The Z1 direction is the ejection direction of the ink as the "liquid", and the Z2 direction is the direction opposite to the ejection direction of the ink. Hereinafter, looking from the Z1 direction or the Z2 direction is referred to as "plan view".

[0012] 1. First Embodiment 1-1. Schematic Configuration of Liquid Jetting Device 100 FIG. 1 is a schematic diagram showing a configuration example of a liquid ejection device 100 according to the first embodiment. The liquid ejection device 100 is an inkjet printing device that ejects ink, which is an example of a liquid, as droplets onto a medium M. The medium M is typically printing paper. Note that the medium M is not limited to printing paper, and may be a printing target made of any material such as a resin film or fabric, for example.

[0013] As shown in FIG. 1, the liquid ejection device 100 includes a liquid storage unit 10, a control unit 20, a conveyance unit 90, and a liquid ejection head 30.

[0014] The liquid storage unit 10 is a container that stores ink. Specific examples of the liquid storage unit 10 include, for example, a cartridge that is detachable from the liquid ejection device 100, a bag-shaped ink pack formed of a flexible film, and an ink tank that can be refilled with ink. Note that the type of ink stored in the liquid storage unit 10 is not particularly limited and is arbitrary.

[0015] The control unit 20 controls the operations of the respective elements of the liquid ejection device 100. The control unit 20 includes, for example, a processing circuit such as a CPU (Central Processing Unit) or an FPGA (Field Programmable Gate Array), and a storage circuit such as a semiconductor memory, and controls the operations of the respective elements of the liquid ejection device 100.

[0016] The conveyance unit 90 conveys the medium M in the direction DM under the control of the control unit 20. The direction DM in the present embodiment is the X1 direction. In the example shown in FIG. 1, the conveyance unit 90 includes a long conveyance roller along the Y axis and a motor that rotates the conveyance roller. Note that the conveyance unit 90 is not limited to a configuration using a conveyance roller, and may be a configuration using a drum or an endless belt that conveys the medium M in a state where the medium M is adsorbed to the outer peripheral surface by an electrostatic force or the like, for example.

[0017] The liquid ejection head 30 ejects ink supplied from the liquid storage unit 10 in the Z1 direction from each of a plurality of nozzles N onto the medium M under the control of the control unit 20. The liquid ejection head 30 is a line head that is long in the direction in which the Y-axis extends. The liquid ejection head 30 has a plurality of head chips 3 arranged such that a plurality of nozzles N are distributed over the entire range in the direction along the Y-axis of the medium M. By ejecting ink from the liquid ejection head 30 in parallel with the conveyance of the medium M by the conveyance unit 90, an image made of ink is formed on the surface of the medium M.

[0018] Note that the number and arrangement of the head chips 3 of the liquid ejection head 30 are not limited to the example shown in FIG. 1 and are arbitrary. Further, when the liquid ejection head 30 is configured to be able to circulate ink, the liquid ejection head 30 may be connected to the liquid storage unit 10 via a circulation mechanism for circulating the ink in the liquid ejection head 30.

[0019] Such a liquid ejection device 100 includes, as described above, a liquid ejection head 30 and a liquid storage unit 10 for storing ink to be supplied to the liquid ejection head 30. As will be described later, the liquid ejection head 30 has a reduced risk of warpage. Therefore, according to the liquid ejection device 100 including such a liquid ejection head 30, a decrease in printing quality can be suppressed.

[0020] 1-2. Liquid Ejection Head 30 FIG. 2 is an exploded perspective view of the liquid ejection head 30 shown in FIG. 1. FIG. 3 is a cross-sectional view of the liquid ejection head 30 shown in FIG. 1. As shown in FIGS. 1 and 2, the liquid ejection head 30 is a long member along the Y1 direction. The liquid ejection head 30 includes a plurality of head chips 3, a fixing plate 4, a first flow path member 5, a support member 6, an intermediate substrate 7, and a second flow path member 8.

[0021] 1-2A. Head Chip 3 and Fixing Plate 4 FIG. 4 is a bottom view of the liquid ejection head 30 shown in FIG. 1. In the example shown in FIG. 4, the liquid ejection head 30 has head chips 3-1 to 3-7. Each of the head chips 3-1 to 3-7 is a head chip 3. Hereinafter, each of the head chips 3-1 to 3-7 may be referred to as a head chip 3.

[0022] The head chips 3-1 to 3-7 are arranged in the Y1 direction. Specifically, the head chips 3-1 to 3-7 are arranged in a staggered pattern along the Y1 direction as viewed in the Z1 direction. The head chips 3-1, 3-3, 3-5, and 3-7 are arranged in a row in the Y1 direction in this order. The head chips 3-1, 3-3, 3-5, and 3-7 are arranged so that their positions align with each other in the direction along the X-axis. Also, the head chips 3-2, 3-4, and 3-6 are arranged in a row in the Y1 direction in this order. The head chips 3-2, 3-4, and 3-6 are arranged at a position in the X1 direction relative to the head chips 3-1, 3-3, 3-5, and 3-7 so that their positions align with each other in the direction along the X-axis.

[0023] Each head chip 3 includes a plurality of nozzles N arranged along the Y-axis. The plurality of nozzles N are divided into a nozzle row La and a nozzle row Lb that are arranged side by side at intervals along the X-axis. Each of the nozzle row La and the nozzle row Lb is a set of a plurality of nozzles N linearly arranged along the Y-axis.

[0024] The fixing plate 4 has a plurality of openings 4h. Each opening 4h is a hole that penetrates the fixing plate 4 in the direction along the Z-axis. The plurality of openings 4h are arranged in a staggered pattern along the Y1 direction. The plurality of nozzles N included in each head chip 3 are exposed from each opening 4h. The material of the fixing plate 4 is, for example, a metal such as stainless steel.

[0025] FIG. 5 is a cross-sectional view of the head chip 3 shown in FIG. 2. The liquid ejection head 30 has a structure in which elements related to each nozzle N of the nozzle row La and elements related to each nozzle N of the nozzle row Lb are arranged in a substantially plane-symmetrical manner. The nozzle N on the right side in FIG. 5 belongs to the nozzle row La, and the nozzle N on the left side in FIG. 5 belongs to the nozzle row Lb. In the following description, the elements corresponding to the nozzle row La will be mainly described, and the description of the elements corresponding to the nozzle row Lb will be omitted as appropriate. Also, hereinafter, when the nozzle row La and the nozzle row Lb are not distinguished, they will be denoted as the nozzle row L.

[0026] As shown in FIG. 5, the head chip 3 includes a communication plate 31, a pressure chamber substrate 32, a diaphragm 33, a nozzle plate 37, a vibration absorber 38, a plurality of drive elements 34, a sealing substrate 35, a housing portion 36, and a flexible substrate 39.

[0027] Each of the communication plate 31, the pressure chamber substrate 32, the diaphragm 33, the nozzle plate 37, and the vibration absorber 38 is a long plate-like member along the Y axis. The pressure chamber substrate 32 and the housing portion 36 are installed on the surface of the communication plate 31 in the Z2 direction. The nozzle plate 37 and the vibration absorber 38 are installed on the surface of the communication plate 31 in the Z1 direction. For example, the members are fixed to each other by an adhesive.

[0028] The nozzle plate 37 is a plate-like member in which a plurality of nozzles N are formed. Each of the plurality of nozzles N is a circular through-hole for ejecting ink. For example, the nozzle plate 37 is manufactured by processing a single-crystal substrate of silicon (Si) using semiconductor manufacturing techniques such as photolithography and etching.

[0029] The communication plate 31 is formed with a plurality of throttle portions 312, a plurality of communication channels 314, a communication space Ra, and a common channel Rb. Each of the throttle portion 312 and the communication channel 314 extends in the Z1 direction and is a through hole formed for each nozzle N. The communication channel 314 overlaps the nozzle N in plan view. The communication space Ra is an opening formed in a long shape along the Y axis. The communication space Ra extends along the Y axis. The common channel Rb communicates with the communication space Ra and overlaps the communication space Ra in plan view. The common channel Rb extends along the Y axis. The common channel Rb communicates with the plurality of throttle portions 312. Further, the communication space Ra communicates the common channel Rb and the external channel of the head chip 3 through a space Rc and a supply port 361 described later.

[0030] A plurality of pressure chambers C1 are formed in the pressure chamber substrate 32. The pressure chamber C1 is located between the communication plate 31 and the diaphragm 33 and is a space formed by the wall surface 320 of the pressure chamber substrate 32. The pressure chamber C1 is formed for each nozzle N. The pressure chamber C1 is a long space extending in the X1 direction. The plurality of pressure chambers C1 are arranged along the Y axis. Further, the pressure chamber C1, the nozzle N, the communication channel 314, and the throttle portion 312 constitute an individual channel for each nozzle N.

[0031] The communication plate 31 and the pressure chamber substrate 32 are manufactured by processing a semiconductor substrate such as a single crystal silicon substrate.

[0032] An elastically deformable diaphragm 33 is disposed above the pressure chamber C1. The diaphragm 33 is laminated on the pressure chamber substrate 32 and contacts the surface of the pressure chamber substrate 32 opposite to the communication plate 31. The diaphragm 33 is a plate-like member formed in a long rectangular shape along the Y axis in plan view. The pressure chamber C1 communicates with the communication channel 314 and the throttle portion 312. Therefore, the pressure chamber C1 communicates with the nozzle N through the communication channel 314 and communicates with the communication space Ra through the throttle portion 312. In FIG. 5, for ease of explanation, the pressure chamber substrate 32 and the diaphragm 33 are illustrated as separate substrates, but in actuality, they are laminated on one silicon substrate.

[0033] On the surface of the diaphragm 33 on the side opposite to the pressure chamber C1, drive elements 34 are formed for each pressure chamber C1. The drive element 34 is a long piezoelectric element along the X-axis in plan view. The drive element 34 includes, for example, a pair of electrodes and a piezoelectric body sandwiched between the pair of electrodes. Note that the drive element 34 may be an electrothermal conversion element that generates thermal energy.

[0034] The housing portion 36 is a case for storing ink supplied to the plurality of pressure chambers C1 and is formed, for example, by injection molding of a resin material. A space Rc and a supply port 361 are formed in the housing portion 36. The supply port 361 is a pipe through which ink is supplied from the liquid storage portion 10 and communicates with the space Rc. The space Rc of the housing portion 36 and the communication space Ra of the communication plate 31 communicate with each other. The communication space Ra, the common flow path Rb, and the space Rc constitute a common space R common to the plurality of nozzles N. The common space R functions as a liquid storage chamber for storing ink supplied to the plurality of pressure chambers C1. The ink stored in the common space R branches to each throttle portion 312 and is supplied and filled in parallel to the plurality of pressure chambers C1.

[0035] The vibration absorber 38 is a flexible film that constitutes the wall surface of the communication space Ra and absorbs pressure fluctuations of the ink in the common space R. By providing the vibration absorber 38, the natural frequency of the flow path from the nozzle N through the pressure chamber C1 to the throttle portion 312 is stabilized regardless of the nozzle N being driven.

[0036] A frame body 45 is joined to the surface of the vibration absorber 38 facing the Z1 direction by an adhesive or the like. The frame body 45 is a frame-shaped member along the outer periphery of the vibration absorber 38. The frame body 45 is made of, for example, a metal material. A fixing plate 4 is joined to the surface of the frame body 45 facing the Z1 direction by an adhesive or the like as shown by the two-dot chain line in the figure.

[0037] The sealing substrate 35 is a structure that protects the plurality of drive elements 34 and reinforces the mechanical strength of the pressure chamber substrate 32 and the diaphragm 33, and is fixed to the surface of the diaphragm 33 with an adhesive or the like. The plurality of drive elements 34 are housed inside a recess formed on the surface of the sealing substrate 35 facing the diaphragm 33.

[0038] The flexible substrate 39 is inserted through the through-hole 362 of the housing portion 36 and the through-hole 353 of the sealing substrate 35. The flexible substrate 39 is joined to the surface of the diaphragm 33. The flexible substrate 39 is a mounting component on which a plurality of wirings are formed for electrically connecting the relay substrate 7 electrically connected to the control unit 20 and the head chip 3. The flexible substrate 39 includes a driving IC (not shown). The driving IC is a circuit including a switching element that selects whether to supply the driving signal Com to the driving element 34. As the flexible substrate 39, for example, a TCP (Tape Carrier Package) or an FPC (Flexible Printed Circuit) etc. are used. A driving signal and a reference voltage for driving the driving element 34 are supplied from the flexible substrate 39 to each driving element 34.

[0039] When the driving element 34 contracts due to energization, the diaphragm 33 is bent and deflected in a direction in which the volume of the pressure chamber C1 decreases, the pressure in the pressure chamber C1 rises, and ink droplets are ejected from the nozzle N. At this time, the pressure also propagates from the pressure chamber C1 toward the throttle portion 312, and ink also flows through the throttle portion 312 into the common flow path Rb. After the ink is ejected, the driving element 34 returns to its original position. At this time, the ink in the common flow path Rb from the nozzle N also vibrates. Then, when the meniscus of the nozzle N is restored, ink is supplied from the throttle portion 312 at the same time. Through the above series of operations, ink is ejected from the nozzle N.

[0040] 1-2B. First flow path member 5 As shown in FIGS. 2 and 3, the first flow path member 5 is located in the Z2 direction of the plurality of head chips 3. The first flow path member 5 is a member for distributing and supplying ink to the plurality of head chips 3. The first flow path member 5 has a first flow path substrate 51 and a second flow path substrate 52. The first flow path substrate 51 is located in the Z1 direction with respect to the second flow path substrate 52. The material of each part of the first flow path member 5 is resin. Further, the second flow path substrate 52 has a first member 521 and a second member 522.

[0041] FIG. 6 is a bottom-side perspective view of the first flow path substrate 51 shown in FIG. 2. FIG. 7 is a top-side perspective view of the first flow path substrate 51 shown in FIG. 2. As shown in FIGS. 6 and 7, the first flow path substrate 51 is an elongated member extending along the Y1 direction. A plurality of head chips 3 are fixed to the first flow path member 5. The first flow path substrate 51 includes a holding portion 514, a fourth side wall portion 512, and two flange portions 513. The holding portion 514 includes a flat plate portion 510 and a third side wall portion 511.

[0042] The holding portion 514 is a portion that holds a plurality of head chips 3. The flat plate portion 510 of the holding portion 514 is a flat plate-like portion along the X-Y plane of the first flow path substrate 51 and extends in the Y1 direction. A plurality of wiring holes 51h and a plurality of flow paths 50h are provided in the flat plate portion 510. Each of the plurality of wiring holes 51h and the plurality of flow paths 50h is a hole that penetrates the flat plate portion 510 along the Z axis.

[0043] The plurality of wiring holes 51h are arranged in a staggered manner along the Y2 direction when viewed in the Z1 direction. The plurality of wiring holes 51h are provided in a one-to-one correspondence with the plurality of head chips 3. The flexible substrate 39 of the head chip 3 is inserted into each wiring hole 51h. Also, the flow path 50h is provided for each supply port 361 of the head chip 3. The flow path 50h communicates with the common space R of the head chip 3 through the supply port 361. Further, for example, the head chip 3 and the first flow path substrate 51 are fixed by connecting the wall portion constituting the supply port 361 of each head chip 3 and the wall portion constituting the flow path 50h of the first flow path substrate 51 in a liquid-tight manner with an adhesive.

[0044] As shown in FIGS. 3 and 6, the third side wall portion 511 protrudes from the flat plate portion 510 in the Z1 direction. As shown in FIG. 6, the third side wall portion 511 is formed in a frame shape that surrounds the plurality of head chips 3 when viewed in the direction along the Z axis. As shown in FIG. 3, the fixing plate 4 contacts the third side wall portion 511. Further, a third recess 511r is defined by the flat plate portion 510 and the third side wall portion 511. A plurality of head chips 3 are arranged inside the third recess 511r. The plurality of head chips 3 are accommodated in the space formed by the third recess 511r and the fixing plate 4.

[0045] As shown in FIGS. 3 and 7, the fourth side wall portion 512 protrudes from the flat plate portion 510 in the Z2 direction. As shown in FIG. 7, the fourth side wall portion 512 is formed in a frame shape along the outer edge of the flat plate portion 510 when viewed in the direction along the Z axis. As shown in FIG. 3, the fourth side wall portion 512 contacts the support member 6. Further, a fourth recess 512r is defined by the flat plate portion 510 and the fourth side wall portion 512. The second flow path substrate 52 is arranged inside the fourth recess 512r. The second flow path substrate 52 is accommodated in the space formed by the fourth recess 512r and the support member 6. The second flow path substrate 52 contacts the flat plate portion 510.

[0046] As shown in FIGS. 6 and 7, the two flange portions 513 protrude outward along the X-Y plane from the flat plate portion 510. One of the two flange portions 513 is provided in the X1 direction of the flat plate portion 510, and the other is provided in the X2 direction of the flat plate portion 510. Each flange portion 513 extends in the Y1 direction. A plurality of engaging portions 515 are provided on each flange portion 513. Each engaging portion 515 protrudes from the flange portion 513 in the Z2 direction. The plurality of engaging portions 515 are spaced apart from each other and are provided on the flange portion 513 at substantially equal intervals. Note that the plurality of engaging portions 515 do not have to be arranged at equal intervals. Each engaging portion 515 is used to fix the first flow path member 5 and the support member 6.

[0047] As shown in FIG. 2, the second flow path substrate 52 is a member extending along the Y1 direction. The second flow path substrate 52 is disposed between the first flow path substrate 51 and the support member 6. The second flow path substrate 52 includes a first member 521 and a second member 522 as described above. The first member 521 is located in the Z2 direction with respect to the second member 522.

[0048] The first member 521 has a plurality of wiring holes 521h. The plurality of wiring holes 521h are arranged in a staggered pattern along the Y2 direction when viewed in the Z1 direction. The plurality of wiring holes 521h are provided in a one-to-one correspondence with the plurality of head chips 3. The flexible substrate 39 of the head chip 3 is inserted into each wiring hole 521h. Similarly, the second member 522 has a plurality of wiring holes 522h. The plurality of wiring holes 522h are arranged in a staggered pattern along the Y2 direction when viewed in the Z1 direction. The plurality of wiring holes 522h are provided in a one-to-one correspondence with the plurality of head chips 3. The flexible substrate 39 of the head chip 3 is inserted into each wiring hole 522h. The wiring holes 521h and 522 overlap when viewed in the direction along the Z axis.

[0049] Further, the first member 521 has a recess 521r that opens in the Z1 direction. The recess 521r is a depression formed in the first member 521. Similarly, the second member 522 has a recess 522r that opens in the Z2 direction. The recess 522r is a depression formed in the second member 522. The recess 521r and the recess 522r form the distribution flow path 52h shown in FIG. 3. The distribution flow path 52h is a flow path for distributing the ink supplied through the second flow path member 8 described later to each head chip 3. The distribution flow path 52h communicates with each of the plurality of flow paths 50h of the first flow path substrate 51 shown in FIG. 6 described above.

[0050] Also, as shown in FIG. 2, a flow path tube 50 having a hole communicating with the distribution flow path 52h inside protrudes in the Z2 direction on the surface of the first member 521 facing the Z2 direction.

[0051] 1-2C. Support Member 6 As shown in FIGS. 2 and 3, the support member 6 is positioned in the Z2 direction with respect to the first flow path member 5. Further, the support member 6 is disposed between the first flow path member 5 and the second flow path member 8. The support member 6 is a member that supports the first flow path member 5. The material of the support member 6 is metal. The support member 6 is a long member extending in the Y1 direction. The support member 6 is a member that supports the first flow path member 5. The support member 6 is made of metal such as aluminum or stainless steel and has rigidity for supporting the first flow path member 5. The support member 6 has a partition wall portion 60, a first side wall portion 61, and a second side wall portion 62.

[0052] FIG. 8 is a bottom-side perspective view of the support member 6 shown in FIG. 2. FIG. 9 is a top-side perspective view of the support member 6 shown in FIG. 2. As shown in FIGS. 8 and 9, the partition wall portion 60 is a flat plate-like portion along the X-Y plane of the support member 6 and extends in the Y1 direction. A plurality of wiring holes 601h, through holes 602h, and a plurality of through holes 6h are provided in the partition wall portion 60. Each of the plurality of wiring holes 601h, the through holes 602h, and the plurality of through holes 6h is a hole penetrating the partition wall portion 60 along the Z axis.

[0053] The plurality of wiring holes 601h are arranged in a staggered pattern along the Y2 direction when viewed in the Z1 direction. The plurality of wiring holes 601h are provided in a one-to-one correspondence with the plurality of head chips 3. The flexible substrate 39 of the head chip 3 is inserted into each wiring hole 601h. Further, the flow path tube 50 is inserted into the through hole 602h. The through hole 602h is disposed near the center of the support member 6 on the Y axis in the illustrated example. The plurality of through holes 6h are spaced apart from each other and are arranged at substantially equal intervals along the Y1 direction. The plurality of through holes 6h are formed at positions corresponding to the plurality of engagement portions 515 described above. A part of the engagement portion 515 described above is disposed in each through hole 6h.

[0054] Also, as shown in FIG. 3, the partition wall portion 60 is provided with a plurality of protruding pins 63 that protrude in the Z1 direction from the surface facing the Z1 direction. A metal leaf spring 40 for electrically connecting the fixed plate 4 and the support member 6 is attached to each protruding pin 63. The end of the leaf spring 40 on the side opposite to the end fixed to the protruding pin 43 is inserted between the third side wall portion 511 of the first flow path substrate 51 and the bent portion of the outer peripheral end of the fixed plate 4.

[0055] As shown in FIGS. 3 and 8, the first side wall portion 61 protrudes in the Z1 direction from the partition wall portion 60. As shown in FIG. 8, the first side wall portion 61 has a frame shape along the outer edge of the partition wall portion 60 when viewed in the direction along the Z axis. As will be described later, the first flow path substrate 51 is fixed to the support member 6 by the engagement between the first side wall portion 61 and the engaging portion 515.

[0056] Also, as shown in FIG. 3, the first side wall portion 61 and the partition wall portion 60 define a first recess 61r. A part of the second flow path substrate 52 is disposed inside the first recess 61r. Also, a first surface 601, which is the bottom surface of the first recess 61r, is spaced apart from the second flow path substrate 52. The first surface 601 is the surface of the partition wall portion 60 facing the Z1 direction.

[0057] As shown in FIGS. 3 and 9, the second side wall portion 62 protrudes in the Z2 direction from the partition wall portion 60. As shown in FIG. 9, the second side wall portion 62 has a frame shape along the outer edge of the partition wall portion 60 when viewed in the direction along the Z axis. The second side wall portion 62 is located outside the aforementioned first side wall portion 61 when viewed in the direction along the Z axis.

[0058] As shown in FIG. 3, the second side wall portion 62 and the partition wall portion 60 define a second recess 62r. A relay substrate 7 and a part of the second flow path member 8, which will be described later, are disposed in an accommodation space S, which is the space inside the second recess 62r. Also, a second surface 602, which is the bottom surface of the second recess 62r, is where the relay substrate 7 is disposed. The second surface 602 is the surface of the partition wall portion 60 facing the Z2 direction.

[0059] As shown in FIG. 9, a plurality of fastening locations 620 and a plurality of positioning pins 621 are provided on the second side wall portion 62. For example, screw holes are provided at the plurality of fastening locations 620. The plurality of fastening locations 620 are used to fix the second flow path member 8 described later to the support member 6 by, for example, screw fastening. Further, each positioning pin 621 protrudes in the Z2 direction from the second side wall portion 62. Each positioning pin 621 is used for alignment of the support member 6 with the second flow path member 8 described later.

[0060] 1-2D. Relay Substrate 7 FIG. 10 is a top view showing the relay substrate 7 disposed in the support member 6 shown in FIG. 2. As shown in FIGS. 2 and 10, the relay substrate 7 is an elongated substrate along the Y1 direction. Further, as shown in FIGS. 3 and 10, the relay substrate 7 is disposed in the second recess 62r of the support member 6 and laminated on the second surface 602. Further, the relay substrate 7 is disposed so as to close the plurality of through holes 6h described above. Note that it is preferable not to dispose electronic components such as wirings on the surface of the relay substrate 7 in the Z1 direction. This makes it easier to flatly dispose the relay substrate 7 on the second surface 602, thereby preventing ink mist or the like from entering the accommodation space S through the plurality of through holes 6h.

[0061] Further, as described above, the support member 6 is made of metal. Therefore, in order to ensure the insulation of the relay substrate 7, it is preferable that the relay substrate 7 is disposed on the second surface 602 of the support member 6 via an insulating sheet or the like. Note that "the relay substrate 7 is laminated on the second surface 602" includes that the relay substrate 7 is disposed indirectly on the second surface 602 of the support member 6 via an insulating sheet or the like.

[0062] Further, as shown in FIG. 10, a plurality of wiring holes 71h and through holes 70h are provided in the relay substrate 7. Each of the plurality of wiring holes 71h and through holes 70h is a hole penetrating the relay substrate 7 along the Z axis.

[0063] The plurality of wiring holes 71h are arranged in a staggered pattern along the Y2 direction when viewed in the Z1 direction. The plurality of wiring holes 71h are provided in a one-to-one correspondence with the plurality of head chips 3. The flexible substrate 39 of the head chip 3 is inserted into each wiring hole 71h. Then, the flexible substrate 39 is connected to the relay substrate 7. Also, in the example shown in the figure, the through hole 70h is arranged near the center of the support member 6 on the Y axis. The through hole 70h communicates with the through hole 602h provided in the support member 6 described above. The flow path tube 50 is inserted into the through hole 70h.

[0064] Also, a plurality of connectors 71 are provided on the surface of the relay substrate 7 facing the Z2 direction. The control unit 20 and the relay substrate 7 are electrically connected by a wiring member (not shown) via these connectors 71.

[0065] 1-2E. Second flow path member 8 As shown in FIGS. 2 and 3, the second flow path member 8 is located in the Z2 direction of the relay substrate 7 and is a member elongated in the Y1 direction. The second flow path member 8 has a flow path for supplying ink to the first flow path member 5. The material of the second flow path member 8 is, for example, resin. Note that the material of the second flow path member 8 may be, for example, metal. The second flow path member 8 has a third flow path substrate 81 and a fourth flow path substrate 82. The third flow path substrate 81 is arranged in the Z2 direction with respect to the fourth flow path substrate 82.

[0066] FIG. 11 is a top view of the second flow path member 8 shown in FIG. 2. As shown in FIGS. 2 and 11, the third flow path substrate 81 is a member elongated along the Y1 direction. As shown in FIG. 3, the third flow path substrate 81 is arranged so as to close the opening in the Z2 direction of the support member 6. The third flow path substrate 81 is a lid member that closes the accommodation space S of the support member 6. The third flow path substrate 81 covers the opening of the second recess 62r by being fixed to the support member 6.

[0067] The third flow path substrate 81 is fixed to the support member 6, for example, by fastening with screws. Specifically, as shown in FIG. 11, the third flow path substrate 81 has a plurality of screw holes 80h and a plurality of screw holes 82h. The plurality of screw holes 80h and the plurality of screw holes 82h are provided corresponding to the plurality of fastening locations 620. By inserting a screw (not shown) into one screw hole 80h and the screw hole provided at one fastening location 620, the third flow path substrate 81 is fixed to the support member 6.

[0068] Also, each screw hole 82h functions as a positioning hole for positioning the third flow path substrate 81 with respect to the support member 6. Specifically, a positioning pin 621 is inserted into each screw hole 82h. By inserting the positioning pin 621 into the screw hole 82h, the third flow path substrate 81 can be positioned with respect to the support member 6.

[0069] Note that the third flow path substrate 81 may be fixed to the support member 6 by an L-shaped or T-shaped pin. The method of fixing by an L-shaped or T-shaped pin is, for example, the following method. For example, one of the third flow path substrate 81 or the support member 6 has an L-shaped or T-shaped pin, and the other has a hole through which the pin is inserted. By inserting the pin into the hole and rotating the pin, the pin is prevented from coming out of the hole. Thereby, the third flow path substrate 81 can be fixed to the support member 6.

[0070] The third flow path substrate 81 has two protruding portions 811 that protrude in the Z2 direction from the surface in the Z2 direction thereof. Each protruding portion 811 is a tubular body and communicates with a filter chamber (not shown) formed between the third flow path substrate 81 and the fourth flow path substrate 82. Ink is supplied to each protruding portion 811 from the liquid storage portion 10 in FIG. 1. Note that the ink supplied through the protruding portion 811 is discharged from a flow path tube 83 provided at the tip in the Z1 direction of the fourth flow path substrate 82 through a filter (not shown) for capturing foreign matter in the filter chamber. When the liquid ejection device 100 has a circulation mechanism for circulating the ink, one of the two protruding portions 811 may function as a tube for supplying ink, and the other may function as a tube for discharging ink.

[0071] As shown in FIG. 11, a plurality of wiring connection holes 81h are provided in the third flow path substrate 81. The wiring connection holes 81h are holes that penetrate the third flow path substrate 81 along the Z axis. The plurality of wiring connection holes 81h are provided corresponding to the plurality of connectors 71. A wiring member (not shown) for electrically connecting the relay substrate 7 and the control unit 20 is inserted into the wiring connection holes 81h.

[0072] As shown in FIGS. 2 and 3, the fourth flow path substrate 82 is smaller than the third flow path substrate 81 when viewed in the direction along the Z axis. The fourth flow path substrate 82 is disposed in the second concave portion 62r of the support member 6. Ink flowing in through the protrusion 811 is supplied to the fourth flow path substrate 82. In the illustrated example, the fourth flow path substrate 82 has a funnel shape. The flow path tube 50 of the first member 521 is liquid-tightly connected to the tip of the flow path tube 83 of the fourth flow path substrate 82 via an elastic seal member 89. That is, the ink flowing into the fourth flow path substrate 82 flows into the flow path tube 50.

[0073] In the liquid ejection head 30 described above, ink is supplied from the protrusion 811. The ink flows into the distribution flow path 52h of the first flow path member 5 through a filter chamber (not shown), the flow path tube 83, the seal member 89, and the flow path tube 50 between the third flow path substrate 81 and the fourth flow path substrate 82. Then, the ink is distributed from the distribution flow path 52h corresponding to each head chip 3.

[0074] As shown in FIG. 3, the liquid ejection head 30 described above includes a plurality of head chips 3 arranged in Y1, a resin-made first flow path member 5 that distributes ink to the plurality of head chips 3, and a metal-made support member 6 that supports the first flow path member 5.

[0075] Since the first flow path member 5 is made of resin, the weight and cost of the liquid ejection head 30 can be reduced. On the other hand, when the first flow path member 5 is made of resin, the liquid ejection head 30 is likely to warp due to linear expansion, swelling, etc. A metal support member 6 is provided to reduce the influence of this warping. By supporting the resin first flow path member 5 with the metal support member 6 as a base, the influence of the warping can be reduced.

[0076] Furthermore, the first flow path member 5 is arranged in the Z1 direction with respect to the support member 6. Therefore, the support member 6, the first flow path member 5, and the plurality of head chips 3 are arranged in the Z1 direction in this order. Therefore, it is sufficient for the first flow path member 5 to have a distribution flow path 52h for distributing ink to the plurality of head chips 3, and the support member 6 does not need to have a large number of holes serving as flow paths for distributing ink. In the present embodiment, the flow path provided in the support member 6 is only one through hole 602h.

[0077] If the first flow path member 5 having the distribution flow path 52h is arranged above the support member 6, a plurality of through holes have to be formed in the support member 6 for flow path connection between the distribution flow path 52h and the plurality of supply ports 361. On the contrary, in the present embodiment, since the first flow path member 5 is arranged below the support member 6, it is not necessary to form the plurality of through holes in the support member 6. For this reason, the rigidity of the support member 6 can be improved. As a result, the warping of the liquid ejection head 30 can be reduced. Therefore, it is possible to suppress a decrease in printing quality due to the influence of the warping.

[0078] Also, as described above, the first flow path member 5 includes a first flow path substrate 51 to which the plurality of head chips 3 are fixed, and a second flow path substrate 52 arranged between the first flow path substrate 51 and the support member 6. Then, since the first flow path substrate 51 is fixed to the support member 6, the first flow path member 5 is supported by the support member 6.

[0079] For example, when the second flow path substrate 52 is fixed to the support member 6, the second flow path substrate 52 is less likely to warp due to the support member 6. However, since the first flow path substrate 51 is not supported by the metal support member 6, the first flow path substrate 51 to which a plurality of head chips 3 are fixed is more likely to warp with respect to the second flow path substrate 52. Therefore, when the second flow path substrate 52 is fixed to the support member 6, there is a possibility that misalignment of the nozzles N between the head chips 3 may occur. On the other hand, when the first flow path substrate 51 is fixed to the support member 6 as in the present embodiment, the influence of warping of the first flow path substrate 51 can be reduced. Therefore, the influence of misalignment of the nozzles N between the head chips 3 can be reduced.

[0080] In addition, when the first flow path substrate 51 is fixed to the support member 6, the second flow path substrate 52 is more likely to warp with respect to the first flow path substrate 51. However, since such warping does not affect the alignment of the nozzles N, such warping can be tolerated. Further, in the present embodiment, the first flow path substrate 51 is fixed to the support member 6, but the second flow path substrate 52 may be fixed to the support member 6. Also, both the first flow path substrate 51 and the second flow path substrate 52 may be fixed to the support member 6.

[0081] Furthermore, in the present embodiment, the second flow path substrate 52 is smaller than the first flow path substrate 51 when viewed in the Z1 direction. Specifically, the planar area of the second flow path substrate 52 is smaller than the planar area of the first flow path substrate 51.

[0082] As described above, for example, a method of fixing both the first flow path substrate 51 and the second flow path substrate 52 to the support member 6 is also conceivable. However, in the case of this method, it is necessary to clamp the first flow path substrate 51 and the second flow path substrate 52 together with a fixture such as a screw. Therefore, for example, it is necessary to form through holes for clamping on the second flow path substrate 52. Thus, the second flow path substrate 52 becomes larger. On the other hand, as described above, in the present embodiment, the first flow path substrate 51 is fixed to the support member 6. Therefore, it is not necessary to form the above-described through holes in the second flow path substrate 52, and the second flow path substrate 52 can be miniaturized. Therefore, the liquid ejection head 30 can be miniaturized.

[0083] Note that the first flow path substrate 51 and the second flow path substrate 52 are fixed, for example, by an adhesive. Also, the second flow path substrate 52 and the first flow path substrate 51 may be fixed to each other by fixing tools such as screws, L-shaped or T-shaped pins, etc.

[0084] Also, as described above, each of the plurality of head chips 3 has a flexible substrate 39. Further, the support member 6 supports the second flow path member 8 and is disposed between the first flow path member 5 and the second flow path member 8. Also, the relay substrate 7 is disposed between the support member 6 and the second flow path member 8. Therefore, the second flow path member 8 is disposed above the support member 6 and the relay substrate 7. Also, the first flow path member 5 is disposed below the support member 6 and the relay substrate 7. By arranging the first flow path member 5 and the second flow path member 8 in this way, the length of the flexible substrate 39 can be shortened compared to the case where both the first flow path member 5 and the second flow path member 8 are disposed below the support member 6 and the relay substrate 7, and cost reduction can be achieved.

[0085] Also, as described above, the support member 6 includes a partition wall portion 60 disposed between the first flow path member 5 and the second flow path member 8, a first side wall portion 61 extending from the partition wall portion 60 in the Z1 direction, and a second side wall portion 62 extending from the partition wall portion 60 in the Z2 direction.

[0086] Since the support member 6 has the partition wall portion 60, the first side wall portion 61, and the second side wall portion 62, the rigidity of the support member 6 can be increased compared to the case where the support member 6 is composed of only the partition wall portion 60. Therefore, the warping of the liquid ejection head 30 described above can be further reduced.

[0087] Further, the support member 6 has a first recess 61r defined by a partition wall portion 60 and a first side wall portion 61. By having the first recess 61r in the support member 6, a gap can be formed between the second flow path substrate 52 and the support member 6. That is, the surface of the second flow path substrate 52 facing the first surface 601 is arranged with a gap from the first surface 601. That is, the second flow path substrate 52 and the support member 6 are separated. Since the second flow path substrate 52 and the support member 6 are separated, heat from the relay substrate 7 laminated on the second surface 602 of the support member 6 can be reduced from being transmitted to the second flow path substrate 52 having the distribution flow paths 52h with a high arrangement density. Therefore, it is possible to suppress a change in the ejection characteristics due to a change in the viscosity of the ink flowing through the distribution flow paths 52h.

[0088] Further, the support member 6 has a second recess 62r defined by a partition wall portion 60 and a second side wall portion 62. In other words, the support member 6 has a second recess 62r that houses the relay substrate 7 between the support member 6 and the second flow path member 8. By having the second recess 62r in the support member 6, heat of the relay substrate 7 can be radiated from the second side wall portion 62 to the outside from the inner wall surface of the second recess 62r through the second surface 602 which is the bottom wall surface of the second recess 62r. Therefore, it is possible to reduce the heat from the relay substrate 7 from being transmitted to the first flow path member 5. Thus, it is possible to prevent a change in the ejection characteristics due to a change in the viscosity of the ink in the distribution flow paths 52h.

[0089] Furthermore, the second flow path member 8 is arranged to cover the opening of the second recess 62r. Therefore, it is possible to prevent ink mist or paper powder of the medium from entering the second recess 62r.

[0090] Further, the second flow path member 8 includes a third flow path substrate 81 that covers the opening of the second recess 62r and a fourth flow path substrate 82 arranged in the second recess 62r. The third flow path substrate 81 is fixed to the support member 6. Since the long and easily warped third flow path substrate 81 arranged far from the partition wall portion 60 of the support member 6 is fixed to the support member 6, the influence of the warping of the third flow path substrate 81 can be reduced.

[0091] Furthermore, the fourth flow path substrate 82 is smaller than the third flow path substrate 81 when viewed in the Z1 direction. Specifically, the planar area of the fourth flow path substrate 82 when viewed in the Z1 direction is smaller than the planar area of the third flow path substrate 81 when viewed in the Z1 direction. Since the planar area of the fourth flow path substrate 82 is smaller than the planar area of the third flow path substrate 81, it is easy to arrange the fourth flow path substrate 82 within the second concave portion 62r. When the fourth flow path substrate 82 is accommodated within the second concave portion 62r, the miniaturization in the stacking direction of each member of the liquid ejection head 30 can be achieved as compared with the case where the fourth flow path substrate 82 is not arranged within the second concave portion 62r and is arranged in the Z2 direction with respect to the second concave portion 62r.

[0092] Also, the relay substrate 7 is accommodated within the second concave portion 62r of the support member 6. The depth D2 of the second concave portion 62r is larger than the depth D1 of the first concave portion 61r. Since the depth D2 is larger than the depth D1, the distance between the relay substrate 7 and the third flow path substrate 81 of the second flow path member 8, which are arranged on the same side with reference to the partition portion 60, can be increased as compared with the case where the depth D2 is smaller than the depth D1. Therefore, it is possible to suppress the third flow path substrate 81 from being heated by the heat of the relay substrate 7. Thus, the warping of the third flow path substrate 81 can be reduced.

[0093] 1-3. Fixing of the First Flow Path Substrate 51 to the Support Member 6 FIG. 12 is an enlarged view of the engaging portion 515 shown in FIG. 3. As described above, the first flow path substrate 51 has the engaging portion 515. The engaging portion 515 includes a first portion 5150 and a second portion 5151. The first portion 5150 is a portion extending in the Z2 direction from the flange portion 513. The second portion 5151 is a portion extending from the first portion 5150 along the X-Y plane and inward of the first portion 5150. The first portion 5150 and the second portion 5151 are connected to each other. The extending direction of the first portion 5150 and the extending direction of the second portion 5151 intersect.

[0094] On one hand, the support member 6 has a first side wall portion 61. The first side wall portion 61 includes a connection portion 612 and an engaged portion 611. The connection portion 612 is a portion extending in the Z1 direction from the partition portion 60 and connecting the partition portion 60 and the engaged portion 611. The engaged portion 611 is a portion extending outward along the X-Y plane from the connection portion 612. The engaging portion 515 engages with the engaged portion 611. Note that the connection portion 612 may be omitted. In this case, the engaged portion 611 is connected to the partition portion 60.

[0095] The first flow path substrate 51 is fixed to the support member 6 when the engaging portion 515 engages with the engaged portion 611 of the first side wall portion 61. By fixing the first flow path substrate 51 to the support member 6 through the engagement between the engaging portion 515 and the engaged portion 611, the attachment and detachment of the first flow path substrate 51 can be easily performed. Therefore, the assemblability of the liquid ejection head 30 is improved. In addition, since the unit including the head chip 3 and the first flow path substrate 51 can be easily replaced, the repair of the liquid ejection head 30 can be easily performed.

[0096] As shown in FIG. 12, a first contact portion 60a where the engaging portion 515 and the engaged portion 611 contact each other and a second contact portion 60b where the support member 6 and the first flow path substrate 51 contact each other at a position different from the first contact portion 60a do not overlap when viewed in the Z1 direction. The first contact portion 60a is a contact portion between the second portion 5151 of the engaging portion 515 and the engaged portion 611.

[0097] The second contact portion 60b is a contact portion between the fourth side wall portion 512 of the first flow path substrate 51 and the first side wall portion 61 of the support member 6. The presence of the second contact portion 60b enables the support member 6 and the first flow path substrate 51 to be stably fixed in contact with each other. In addition, since the first contact portion 60a and the second contact portion 60b do not overlap when viewed in the Z1 direction, the attachability and detachability of the first flow path substrate 51 with respect to the support member 6 can be improved.

[0098] FIG. 13 is a side view of the engaging portion 515 shown in FIG. 3. FIG. 14 is a perspective view of the engaging portion 515 shown in FIG. 13. FIG. 15 is a perspective view of the engaging portion 515 shown in FIG. 13.

[0099] As shown in FIGS. 13, 14 and 15, a plurality of engaging portions 515 are provided on the flange portion 513 of the first flow path substrate 51. The surface of the flange portion 513 facing the Z2 direction has a protruding surface 5130 and a peripheral surface 5131 surrounding the same. The peripheral surface 5131 is a portion other than the protruding surface 5130 among the surfaces of each flange portion 513 facing the Z2 direction, and is a surface adjacent to the protruding surface 5130. The protruding surface 5130 is the surface on which the engaging portion 515 is provided. Therefore, the engaging portion 515 protrudes in the Z2 direction, which is the protruding direction, from the protruding surface 5130 of the first flow path substrate 51.

[0100] Furthermore, the protruding surface 5130 is recessed in the Z2 direction with respect to the peripheral surface 5131. In other words, the thickness D01 of the portion of the flange portion 513 where the engaging portion 515 is provided is thinner than the thickness D02 of the other portions. The thickness D01 is the length along the Z axis in the portion where the protruding surface 5130 is provided. The thickness D02 is the length along the Z axis in the portion where the peripheral surface 5131 is provided. For this reason, the engaging portion 515 can be lengthened and is easily deformed. Therefore, the attachment and detachment of the first flow path substrate 51 to and from the support member 6 can be easily performed.

[0101] As shown in FIGS. 12, 14 and 15, an opening 513h is formed in the protruding surface 5130. The opening 513h is provided at a position overlapping the first contact portion 60a where the engaging portion 515 and the engaged portion 611 come into contact when viewed in the Z2 direction. By providing the opening 513h, the engaging portion 515 is more easily deformed than when it is not provided. Also, for example, by inserting a jig through the opening 513h, the engagement between the engaging portion 515 and the engaged portion 611 can be easily released.

[0102] In addition, a through hole 6h is provided in the partition wall portion 610 of the support member 6. The through hole 6h is a hole that opens to the second surface 602 and the first surface 601 of the support member 6. A part of the engaging portion 515 is located in the through hole 6h. Therefore, an opening is formed in the second surface 602 of the support member 6, in which the engaging portion 515 is located when viewed in the Z1 direction. By providing the through hole 6h, the engagement can be easily released by accessing the engaging portion 515 from above.

[0103] In addition, the relay substrate 7 closes the opening of the support member 6. That is, the relay substrate 7 is arranged so as to overlap the opening on the second surface 602 side of the through hole 6h when viewed in the Z1 direction. By the relay substrate 7 closing the through hole 6h, it is possible to prevent ink mist from entering the through hole 6h.

[0104] In addition, as described above, the support member 6 is made of metal. On the other hand, the first flow path substrate 51 is made of resin. By making the support member 6 with a low replacement frequency out of metal and the first flow path substrate 51 with a high replacement frequency for fixing the head chip 3 out of resin, the engaged portion 611 of the support member 6 is less likely to break, and the first flow path substrate 51 can be easily replaced. The support member 6 can be reused without being replaced.

[0105] 2. Modification Each of the embodiments exemplified above can be variously modified. Specific modification modes applicable to the above-described embodiments are exemplified below. Two or more modes arbitrarily selected from the following examples can be appropriately combined within a range where they do not conflict with each other.

[0106] In the above description, the second flow path substrate 52 has the first member 521 and the second member 522, but the second flow path substrate 52 may be composed of only the first member 521, or may be composed of three or more plate-like members.

[0107] In the above description, the first flow path member 5 has the engaging portion 515, and the support member 6 has the engaged portion 611. However, the first flow path member 5 may have an "engaged portion", and the support member 6 may have an "engaging portion".

[0108] The "liquid ejection device" can be adopted not only in equipment dedicated to printing but also in various equipment such as facsimile machines and copying machines. The use of the liquid ejection device is not limited to printing. For example, a liquid ejection device that ejects a solution of a coloring material is used as a manufacturing device for forming a color filter of a display device such as a liquid crystal display panel. In addition, a liquid ejection device that ejects a solution of a conductive material is used as a manufacturing device for forming wirings and electrodes on a relay substrate. Further, a liquid ejection device that ejects a solution of an organic substance related to a living body is used, for example, as a manufacturing device for manufacturing a biochip.

[0109] As described above, the present invention has been described based on the preferred embodiments, but the present invention is not limited to the foregoing embodiments. Further, the configuration of each part of the present invention can be replaced with any configuration that exhibits the same functions as those of the foregoing embodiments, and any configuration can be added.

Explanation of Reference Numerals

[0110] 3... head chip, 4... fixing plate, 5... first flow path member, 6... support member, 6r... second recess, 7... relay substrate, 8... second flow path member, 10... liquid storage portion, 20... control unit, 30... liquid ejection head, 34... drive element, 39... flexible substrate, 51... first flow path substrate, 51h... hole for wiring, 52... second flow path substrate, 52h... distribution flow path, 60... partition portion, 60a... first contact portion, 60b... second contact portion, 61... first side wall portion, 61r... first recess, 62... second side wall portion, 62r... second recess, 81... third flow path substrate, 82... fourth flow path substrate, 100... liquid ejection device, 510... flat portion, 511... third side wall portion, 511r... third recess, 512... fourth side wall portion, 512r... fourth recess, 513... flange portion, 515... engaging portion, 523... engaging portion, 601... first surface, 602... second surface, 611... engaged portion, 5130... protruding surface, 5131... peripheral surface, D1... depth, D2... depth, N... nozzle, S... accommodation space.

Claims

1. A plurality of head chips arranged in a first direction and configured to eject liquid in an ejection direction; a first flow path member made of resin that is elongated in the first direction and distributes and supplies liquid to the plurality of head chips; a metal support member that is elongated in the first direction and supports the first flow path member; Equipped with The first flow path member is disposed in the ejection direction relative to the support member. A liquid jet head comprising:

2. The first flow path member is a first flow path substrate to which the plurality of head chips are fixed; a second flow path substrate disposed between the first flow path substrate and the support member, The first flow path substrate is fixed to the support member, and the first flow path member is supported by the support member. The liquid jet head according to claim 1 .

3. The second flow path substrate is smaller than the first flow path substrate when viewed in the ejection direction. The liquid jet head according to claim 2 .

4. a relay substrate connected to the plurality of head chips and elongated in the first direction; The support member includes a first recess having a first surface facing the ejection direction as a bottom surface, and a second surface opposite to the first surface, the relay substrate is laminated on the second surface, a surface of the second flow path substrate facing the first surface is disposed with a gap therebetween; The liquid jet head according to claim 3 .

5. Each of the plurality of head chips has a flexible substrate, an intermediate substrate that is long in the first direction and is connected to the plurality of flexible substrates; a second flow path member made of resin and elongated in the first direction, the second flow path member supplying liquid to the first flow path member, the support member supports the second flow path member and is disposed between the first flow path member and the second flow path member, The relay substrate is disposed between the support member and the second flow path member. The liquid jet head according to claim 1 .

6. a second flow path member made of resin and elongated in the first direction, the second flow path member supplying liquid to the first flow path member; a relay substrate that is long in the first direction and is connected to the plurality of head chips; Further comprising: the support member is disposed between the first flow path member and the second flow path member, and has a second recess for accommodating the relay substrate between the support member and the second flow path member; The liquid jet head according to claim 1 .

7. The second flow path member covers an opening of the second recess. The liquid jet head according to claim 6 .

8. The second flow path member is a third flow path substrate that is fixed to the support member to cover the opening of the second recess; a fourth flow path substrate disposed in the second recess, The fourth flow path substrate is smaller than the third flow path substrate when viewed in the ejection direction. The liquid jet head according to claim 7 .

9. a second flow path member that is elongated in the first direction and is made of resin and supplies liquid to the first flow path member, the support member supports the second flow path member and is disposed between the first flow path member and the second flow path member, The support member is a partition wall portion disposed between the first flow path member and the second flow path member; a first side wall portion extending from the partition portion in the ejection direction; a second side wall portion extending from the partition portion in a direction opposite to the ejection direction, The liquid jet head according to claim 1 .

10. a relay substrate connected to the plurality of head chips and elongated in the first direction; the relay board is accommodated in a second recess defined by the second side wall portion and the partition wall portion; a depth of the second recess is greater than a depth of a first recess defined by the first side wall portion and the partition portion; The liquid jet head according to claim 9 .

11. A liquid jet head according to claim 1 , a liquid reservoir for storing a liquid to be supplied to the liquid jet head; A liquid ejection apparatus comprising:

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