Reinforcement resin composition and mounting structure

Abstract

To provide a reinforcement resin composition improving heat cycle resistance of a cured product.SOLUTION: A reinforcement resin composition contains: a specific epoxy compound (A) imparting composition thermosetting property; and an amine compound (B) having high stiffness and also having an aromatic ring showing high physical heat resistance. The epoxy compound (A) contains an epoxy compound (A1) comprising at least one kind selected from a group composed of a naphthalene type, a biphenylaralkyl type, a trisphenolmethane type, a biphenyl type and a dicyclopentadiene type. The amino compound (B) is for example 4,4'-diaminodiphenyl sulfone, and 1,3-bis(3-aminophenoxy)benzene.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure relates to a reinforcing resin composition and a mounting structure, and more particularly to a reinforcing resin composition containing an epoxy compound and a mounting structure including a reinforcing portion containing a cured product of the reinforcing resin composition.

Background Art

[0002] Patent Document 1 discloses a flux composition containing 20 wt% or more and 50 wt% or less of an epoxy compound, 15 wt% or more and 45 wt% or less of diallylbisphenol A, and 1 wt% or more and 30 wt% or less of an organic acid, a solder joint using this flux composition, and a solder joining method using this flux composition.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] When mounting an electronic component and a substrate or the like by soldering, the joint portion between the two may be reinforced with a reinforcing portion including a cured product of a resin composition such as a flux composition (see Patent Document 1).

[0005]

[0006] With the increasing requirements for heat resistance and heat cycle resistance of electronic components and the like, it is necessary to improve the heat cycle resistance of the reinforcing portion.

Means for Solving the Problems

[0007] ​The reinforcing resin composition according to one aspect of the present disclosure contains an epoxy compound (A) and an amine compound (B) composed of at least one selected from the group consisting of a compound (B1) represented by the following formula (1), a compound (B2) represented by the following formula (2), a compound (B3) represented by the following formula (3), a compound (B4) represented by the following formula (4), and a compound (B5) represented by the following formula (5).

[0008]

Chemical formula

[0009] In formula (1), R1 and R2 are each independently a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, R3 to R6 are each independently a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, and X is -CH 2 -, an oxygen atom, -SO 2 -, or -C(CF 3 ) 2 -.

[0010]

Chemical formula

[0011] In formula (2), R1 and R2 are each independently a hydrogen atom or an alkyl group having 1 to 5 carbon atoms.

[0012]

Chemical formula

[0013] In formula (3), X is -C(CH 3 ) 2 - or an oxygen atom, and Z is -C(CH 3 ) 2 - or an oxygen atom.

[0014]

Chemical formula

[0015] In formula (4), one of R1 and R2 is —NH 2 and the other is a hydrogen atom, and one of R3 and R4 is —NH 2 and the other is a hydrogen atom, and X is —C(CH 3 ) 3 — or an oxygen atom, and Z is —C(CH 3 ) 3 — or an oxygen atom.

[0016]

Chemical formula

[0017] In formula (5), R1 is a methyl group or an ethyl group, R2 is a methyl group, an ethyl group or —SCH 3 , and Z is —CH 2 — or a sulfur atom.

[0018] An implementation structure according to one aspect of the present disclosure includes a base material including a first conductor, a mounting component including a second conductor, a solder bump interposed between the first conductor and the second conductor and electrically connecting the first conductor and the second conductor, and a cured product of the reinforcing resin composition, and includes a reinforcing portion covering at least one of the joints between the first conductor and the solder bump and the joints between the second conductor and the solder bump.

Advantages of the Invention

[0019] According to one aspect of the present disclosure, it is possible to provide a reinforcing resin composition capable of improving the heat cycle resistance of a cured product, and an implementation structure including a reinforcing portion including a cured product of this reinforcing resin composition.

Brief Description of the Drawings

[0020]

Figure 1

Figure 2

Figure 3

Mode for Carrying Out the Invention

[0021] Embodiments and modifications will be described with reference to FIGS. 1 to 3. Note that the following embodiments and modifications are only a part of various embodiments of the present disclosure. Further, the following embodiments and modifications can be variously changed according to design and the like as long as the object of the present disclosure can be achieved. It is also possible to appropriately combine the configuration of the embodiment and the configuration of the modification, and it is also possible to appropriately combine the configurations of the modifications. The drawings referred to below are schematic drawings, and the dimensional ratios of the components in the drawings do not necessarily reflect the actual dimensional ratios. Although the mechanism related to the operation and effect may be described below, all the mechanisms are analogized, and the present disclosure is not restricted by the description of the mechanism.

[0022] 1. Reinforcing resin composition The reinforcing resin composition according to the embodiment (hereinafter, also referred to as composition (X)) contains an epoxy compound (A) and a specific amine compound (B). Therefore, according to the embodiment, the cured product of the composition (X) can have a glass transition temperature, and the heat resistance of the cured product is increased. For this reason, the heat cycle resistance of the cured product and the mounting structure 1 including the reinforcing portion 4 containing the cured product can be enhanced.

[0023] The composition (X) will be described in more detail.

[0024] The epoxy compound (A) is a compound having an epoxy group. The epoxy compound (A) may contain a monomer or may contain an oligomer. The epoxy compound (A) can impart thermosetting properties to the composition (X). The epoxy compound (A) preferably contains a compound having two or more epoxy groups in one molecule.

[0025] The epoxy compound (A) is preferably liquid at room temperature. In that case, in the composition (X), the epoxy compound (A) and other components can be well mixed. Note that being liquid at room temperature means having fluidity under atmospheric pressure and when the ambient temperature is 5°C or higher and 28°C or lower (especially around 20°C). The epoxy compound (A) may contain only components that are liquid at room temperature, or may contain components that are liquid at room temperature and components that are not liquid at room temperature. Note that even if the epoxy compound (A) is not liquid at room temperature and the composition (X) is liquid because the epoxy compound (A) is compatible with a reactive diluent, a solvent, etc. in the composition (X), it is acceptable.

[0026] The proportion of the epoxy compound (A) is preferably 48% by mass or more and 85% by mass or less based on the solid content of the composition (X). In this case, the composition (X) can have good fluidity and is easy to apply to the joint between the composition (X) conductor and the solder bump. This proportion is more preferably 49% by mass or more. It is also more preferably 80% by mass or less. Note that the solid content is the components among the components in the composition (X) excluding the components that volatilize (such as solvents) during the process of producing the cured product, in other words, the components that can constitute the cured product.

[0027] The epoxy compound (A) preferably contains an epoxy compound (A1) selected from at least one of the group consisting of a naphthalene-type epoxy resin, a biphenyl aralkyl-type epoxy resin, a trisphenol methane-type epoxy resin, a biphenyl-type epoxy resin, and a dicyclopentadiene-type epoxy resin. In this case, the glass transition temperature of the cured product can be further increased. This is presumably because the epoxy compound (A1) has a highly rigid structure.

[0028] Specifically, each of the naphthalene-type epoxy resin, the biphenyl aralkyl-type epoxy resin, the trisphenol methane-type epoxy resin, the biphenyl-type epoxy resin, and the dicyclopentadiene-type epoxy resin has two or more cyclic structures in one molecule, so the movement of the molecular chain is restricted, and therefore it is presumed that the glass transition point of the cured product becomes higher.

[0029] The naphthalene-type epoxy resin is an epoxy compound containing one or more naphthalene skeletons in one molecule. Due to the rigid and hydrophobic naphthalene skeleton in the naphthalene-type epoxy resin, the glass transition temperature of the cured product of the composition (X) can be increased.

[0030] The biphenyl aralkyl-type epoxy resin is an epoxy compound containing one or more aralkyl skeletons having a biphenyl group in one molecule. Since the aralkyl skeleton in the biphenyl aralkyl-type epoxy resin has a rigid biphenyl group, the glass transition temperature of the cured product of the composition (X) can be increased.

[0031] The trisphenol methane-type epoxy resin is an epoxy compound having epoxy groups of three phenylmethane skeletons in one molecule. Due to the high density of the functional groups (epoxy groups) of the trisphenol methane-type epoxy resin, the glass transition temperature of the cured product of the composition (X) can be increased.

[0032] The dicyclopentadiene-type epoxy resin is an epoxy compound having one or more dicyclopentadiene skeletons in one molecule. Due to the rigid dicyclopentadiene skeleton in the dicyclopentadiene-type epoxy resin, the glass transition temperature of the cured product of the composition (X) can be increased.

[0033] The epoxy equivalent of the epoxy compound (A1) is preferably 100 or more and 500 or less.

[0034] The naphthalene-type epoxy resin contains at least one selected from the group consisting of, for example, the compound represented by the following formula (11), the compound represented by the following formula (12), the compound represented by the following formula (13), the compound represented by the following formula (14), the compound represented by the following formula (15), and the compound represented by the following formula (16). Examples of the compound represented by formula (11) include HP-4032D (semi-solid) manufactured by DIC Corporation. Examples of the compound represented by formula (12) include HP-4700 (softening point 85°C - 95°C) and HP-4710 (softening point 85°C - 105°C) manufactured by DIC Corporation. Examples of the compound represented by formula (13) include EXA-4750 (softening point 80°C) manufactured by DIC Corporation. Examples of the compound represented by formula (14) include HP-4770 (softening point 67°C - 77°C) manufactured by DIC Corporation. Examples of the mixture of the compound represented by formula (15) and the compound represented by formula (16) include HP-6000 (softening point 65°C - 85°C) and HP-6000L (softening point 59°C) manufactured by DIC Corporation.

[0035] The tris-phenol methane-type epoxy resin contains at least one selected from the group consisting of, for example, the compound represented by the following formula (17), the compound represented by the following formula (18), and the compound represented by the following formula (19). Examples of the compound represented by formula (17) include HP-7241 (softening point 66°C) manufactured by DIC Corporation. Examples of the compound represented by formula (18) include HP-7250 (semi-solid) manufactured by DIC Corporation. Examples of the compound represented by formula (19) include EPPN-501H (softening point 51°C - 57°C), EPPN-501HY (softening point 57°C - 63°C), and EPPN-502H (softening point 60°C - 72°C) manufactured by Nippon Kayaku Co., Ltd.

[0036] The biphenyl aralkyl-type epoxy resin contains, for example, the compound represented by formula (20). Examples of the compound represented by formula (20) include NC-3000 (softening point 53°C - 63°C), NC-3000L (softening point 45°C - 60°C), NC-3000-H (softening point 65°C - 75°C), and NC-3100 (softening point 90°C - 103°C) manufactured by Nippon Kayaku Co., Ltd.

[0037] Biphenyl type epoxy resins contain, for example, the compounds shown in formula (21). Examples of the compounds shown in formula (21) include YH4000 (softening point 105 °C) and YX4000H (softening point 105 °C) manufactured by Mitsubishi Chemical Corporation.

[0038] Dicyclopentadiene type epoxy resins contain, for example, the compounds shown in formula (22). Examples of the compounds shown in formula (22) include HP-7200 (softening point 56 °C - 66 °C), HP-7200L (softening point 50 °C - 60 °C), HP-7200H (softening point 78 °C - 88 °C), HP-7200HH (softening point 88 °C - 98 °C), HP-7200HHH (softening point 100 °C - 110 °C) manufactured by DIC Corporation, and XD-1000 (softening point 68 °C - 78 °C) manufactured by Nippon Kayaku Co., Ltd.

[0039]

Chemical formula

[0040]

Chemical formula

[0041]

Chemical formula

[0042]

Chemical formula

[0043]

Chemical formula

[0044]

Chemical formula

[0045]

Chemical formula

[0046] In formula (17), n represents an integer in the range from 1 to 10.

[0047]

Chemical formula

[0048] In formula (18), n represents an integer in the range from 1 to 10.

[0049]

Chemical formula

[0050] In formula (19), n represents an integer in the range from 1 to 10.

[0051]

Chemical formula

[0052] In formula (20), n represents an integer in the range from 1 to 10.

[0053]

Chemical formula

[0054] In formula (21), R represents a methyl group.

[0055]

Chemical formula

[0056] In formula (22), n represents an integer in the range from 1 to 10.

[0057] The proportion of the epoxy compound (A1) is preferably 16% by mass or more and 35% by mass or less based on the solid content of the composition (X). When the proportion is 16% by mass or more, the glass transition temperature of the cured product can be further increased. More preferably, the proportion is 18% by mass or more. When the proportion is 35% by mass or less, there is an advantage that the fluidity of the composition (X) can be easily ensured. More preferably, the proportion is 32% by mass or less.

[0058] The epoxy compound (A) may contain a compound other than the above epoxy compound (A1) (hereinafter referred to as epoxy compound (A2)).

[0059] When the epoxy compound (A) contains the epoxy compound (A1), the epoxy compound (A1) is often semi-solid or solid. Therefore, by the epoxy compound (A) containing the epoxy compound (A2) in addition to the epoxy compound (A1), it is preferable that the epoxy compound (A) is liquid as a whole. In this case, the composition (X) can have better fluidity.

[0060] When the epoxy compound (A) contains the epoxy compound (A1) and the epoxy compound (A2), the proportion of the epoxy compound (A1) with respect to the epoxy compound (A) is preferably 30% by mass or more and 40% by mass or less.

[0061] The epoxy compound (A2) contains, for example, a compound that is liquid and has lower rigidity than the epoxy compound (A1). The epoxy compound (A2) can contain at least one selected from the group consisting of, for example, glycidyl ether type epoxy resins, glycidyl amine type epoxy resins, glycidyl ester type epoxy resins, olefin oxidation type (alicyclic) epoxy compounds, bisphenol A type epoxy resins, bisphenol F type epoxy resins and other bisphenol type epoxy resins, hydrogenated bisphenol A type epoxy resins, hydrogenated bisphenol F type epoxy resins and other hydrogenated bisphenol type epoxy resins, alicyclic epoxy compounds, phenol novolak type epoxy resins, cresol novolak type epoxy resins, aliphatic epoxy compounds, and triglycidyl isocyanurate.

[0062] The epoxy compound (A2) preferably contains at least one selected from the group consisting of bisphenol A type epoxy resin, bisphenol F type epoxy resin, hydrogenated bisphenol A type epoxy resin, and hydrogenated bisphenol F type epoxy resin. In this case, the composition (X) can have a lower viscosity, and the physical properties of the cured product of the composition (X) can be improved.

[0063] As described above, the composition (X) contains a specific amine compound (B). The amine compound (B) consists of at least one selected from the group consisting of the compound (B1) represented by the following formula (1), the compound (B2) represented by the following formula (2), the compound (B3) represented by the following formula (3), the compound (B4) represented by the following formula (4), and the compound (B5) represented by the following formula (5).

[0064]

Chemical formula

[0065] In formula (1), R1 and R2 are each independently a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, R3 to R6 are each independently a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, and X is -CH 2 -, an oxygen atom, -SO 2 -, or -C(CF 3 ) 2 -.

[0066]

Chemical formula

[0067] In formula (2), R1 and R2 are each independently a hydrogen atom or an alkyl group having 1 to 5 carbon atoms.

[0068]

Chemical formula

[0069] In formula (3), X is -C(CH3 ) 2 - or an oxygen atom, and Z is -C(CH 3 ) 2 - or an oxygen atom.

[0070]

Chem.

[0071] In formula (4), one of R1 and R2 is -NH 2 and the other is a hydrogen atom, one of R3 and R4 is -NH 2 and the other is a hydrogen atom, X is -C(CH 3 ) 3 - or an oxygen atom, and Z is -C(CH 3 ) 3 - or an oxygen atom.

[0072]

Chem.

[0073] In formula (5), R1 is a methyl group or an ethyl group, R2 is a methyl group, an ethyl group or -SCH 3 , and Z is -CH 2 - or a sulfur atom.

[0074] Due to this amine compound (B), the cured product can have a high glass transition temperature, and thus the heat cycle resistance of the cured product and the mounting structure can be enhanced. The reason is presumed to be as follows.

[0075] The molecule of the amine compound (B) has an aromatic ring with high rigidity and high physical heat resistance. Also, since the amine compound (B) has two to four active hydrogen groups which are reaction points with the epoxy compound (A) in the molecule, it is possible to form a high-density crosslinked structure by reacting with the epoxy compound (A), and thus the physical heat resistance of the cured product is increased. For the above reasons, the glass transition temperature of the cured product is increased. Among the compounds that can be contained in the amine compound (B), for the compounds having two or more aromatic rings in the molecule (see the compounds represented by each of Formula (1) to Formula (4)), since the substitution position of the amino group in the aromatic ring is the meta or para position with respect to the bond of -X-, the crosslink formation between the amine compound (B) and the epoxy compound (A) is less likely to be inhibited. Also, among the compounds that can be contained in the amine compound (B), for the compounds having only one aromatic ring in the molecule (see the compound represented by Formula (5)), since the substitution positions of the two amino groups in the aromatic ring are in the meta position relationship with each other, the crosslink formation between the amine compound (B) and the epoxy compound (A) is less likely to be inhibited.

[0076] The proportion of the amine compound (B) is preferably 5% by mass or more and 38% by mass or less based on the solid content of the composition (X). When the proportion is 5% by mass or more, the glass transition temperature of the cured product can be further increased. When the proportion is 38% by mass or less, the increase in the viscosity of the composition (X) during storage is suppressed, and the storage stability of the composition (X) can be enhanced. It is more preferable that this proportion is 7% by mass or more. It is more preferable that this proportion is 37% by mass or less.

[0077] The composition (X) may contain an activator (C). The activator (C) is a substance that exhibits a fluxing action in soldering. The fluxing action means a reducing action of removing the oxide film formed on the solder and the conductor, and an action of reducing the surface tension of the molten solder to enhance the wettability of the solder to the metal surface. When the composition (X) contains the activator (C), the conduction reliability between the solder and the conductor can be improved.

[0078] The activator (C) preferably contains at least one of an organic acid (C1) having a carboxyl group equivalent of 40 g / eq or more and 400 g / eq or less and a melting point of 220°C or less, and an amine (C2) having a nitrogen atom equivalent of 10 g / eq or more and 300 g / eq or less and a melting point of 220°C or less. When the melting point of the activator (C) is 220°C or less, even when using a solder having a melting point near 200°C or 200°C or higher, the oxide film of the solder can be removed before melting the solder. Here, the "carboxyl group equivalent" is a value obtained by dividing the mass (g) of 1 mole of a substance by the number of carboxyl groups per molecule of the substance, and the "nitrogen atom equivalent" is a value obtained by dividing the mass (g) of 1 mole of a substance by the number of nitrogen atoms per molecule of the substance.

[0079] The organic acid (C1) can contain, for example, at least one selected from the group consisting of rosin component materials, adipic acid, glutaric acid, succinic acid, malonic acid, citric acid, cork acid, sebacic acid, and pimelic acid. The organic acid (C1) preferably contains at least one selected from the group consisting of particularly succinic acid (carboxyl group equivalent: 59 g / eq), glutaric acid (carboxyl group equivalent: 66 g / eq), adipic acid (carboxyl group equivalent: 73 g / eq), cork acid (carboxyl group equivalent: 87 g / eq), sebacic acid (carboxyl group equivalent: 101 g / eq), and Tsunodaime 395 (carboxyl group equivalent: 288 g / eq).

[0080] The amine (C2) is not particularly limited as long as it is an amine used as a flux, and can contain, for example, at least one or more selected from the group consisting of various amine salts, alkanolamines, and guanidines. The amine (C2) preferably contains at least one selected from the group consisting of particularly diethanolamine (nitrogen atom equivalent: 105 g / eq), triethanolamine (TEA) (nitrogen atom equivalent: 149 g / eq), triisopropanolamine (nitrogen atom equivalent: 191 g / eq), 1,3-diphenylguanidine (nitrogen atom equivalent: 70 g / eq), and 1,3-di-o-tolylguanidine (nitrogen atom equivalent: 80 g / eq).

[0081] The activator (C) may contain components other than the organic acid (C1) and the amine (C2). For example, the activator (C) may contain an organic acid or an amine having a melting point exceeding 220°C.

[0082] The proportion of the activator (C) is preferably 1.5% by mass or more and 25% by mass or less based on the solid content of the composition (X). When this proportion is 4% by mass or more, the flux action can be exhibited well and the conduction reliability between the conductor and the solder can be further enhanced. When this proportion is 25% by mass or less, a decrease in the storage stability of the composition (X) can be suppressed, a decrease in the glass transition temperature of the cured product can be suppressed, and a decrease in the bonding strength between the conductor and the solder can be suppressed. It is more preferable that this proportion is 2.5% by mass or more. It is more preferable that this proportion is 23% by mass or less.

[0083] The composition (X) may contain a thixotropic agent (D). The thixotropic agent (D) is a compound that imparts thixotropy to the composition (X). Thixotropy is a property in which the viscosity of a substance decreases when subjected to shear stress. Thixotropy is quantified by the thixotropy ratio (thixotropy index). The thixotropic agent (D) can also be said to be a compound that can increase the thixotropy ratio. For example, at a certain temperature, the viscosity is measured under two conditions with different rotation speeds of a rotational viscometer, and the ratio of the two viscosities obtained as a result can be defined as the thixotropy ratio.

[0084] The thixotropic agent (D) contains, for example, at least one selected from the group consisting of 1,3:2,4-bis-O-benzylidene-D-glucitol (dibenzylidene sorbitol) (for example, manufactured by Shin Nippon Rika Co., Ltd., product name Gelol D), 1,3:2,4-bis-O-(4-methylbenzylidene)-D-sorbitol (for example, manufactured by Shin Nippon Rika Co., Ltd., product name Gelol MD), and N,N'-methylenebis(stearamide) (for example, manufactured by Mitsubishi Chemical Corporation, product name Bisamide LA).

[0085] The proportion of the thixotropic agent (D) is preferably 1% by mass or more and 7% by mass or less based on the solid content of the composition (X). In this case, the composition (X) can have an appropriate thixotropy ratio.

[0086] The composition (X) may optionally contain a solvent (E). The solvent (E) is preferably an ether-based solvent. It is preferable that the solvent (E) contains glycol ethers. For example, the solvent (E) includes at least one selected from the group consisting of diethylene glycol diethyl ether, ethylene glycol mono-2-ethylhexyl ether, and hexyl diglycol.

[0087] The amount of the solvent (E) can be appropriately set so that the composition (X) has an appropriate viscosity. The proportion of the solvent is, for example, 2% by mass or more and 25% by mass or less based on the composition (X).

[0088] The composition (X) may contain an additive (F) which is a component other than the above epoxy compound (A), amine compound (B), activator (C), thixotropic agent (D), and solvent (E). The additive (F) contains at least one selected from the group consisting of, for example, phenolic compounds, imidazole compounds, benzoxazine compounds, component modifiers, and fillers. The proportion of the additive (F) with respect to the solid content of the composition (X) is preferably 5% by mass or less.

[0089] The viscosity of the composition (X) is preferably 10 Pa·s or more and 250 Pa·s or less. In this case, it is easy to apply the composition (X) to the joint between the conductor and the solder bump. That is, the coatability of the composition (X) can be enhanced. The viscosity is more preferably 25 Pa·s or more, and even more preferably 30 Pa·s or more. The viscosity is more preferably 120 Pa·s or less, and even more preferably 110 Pa·s or less. The viscosity of the composition (X) is a value measured using an E-type viscometer under the conditions of 25°C and a rotation speed of 2.5 rpm.

[0090] The thixotropy ratio of the composition (X) is preferably 1.5 or more and 8 or less. In this case, the coatability of the composition (X) can be enhanced. The thixotropy ratio is the viscosity η measured with an E-type viscometer under the conditions of 25°C and a rotation speed of 0.25 rpm. 0.25and the viscosity η measured with an E-type viscometer under the conditions of 25°C and a rotation speed of 2.5 rpm 2.5 and the value η 0.25 / η 2.5 is. If the thixotropy ratio is 1.5 or more, it is more preferable, and if it is 2.0 or more, it is even more preferable. If the thixotropy ratio is 5.0 or less, it is more preferable, and if it is 4.5 or less, it is even more preferable.

[0091] The glass transition temperature of the cured product of the composition (X) is preferably 100°C or higher. In this case, the heat resistance of the cured product is more likely to be improved, and therefore the heat cycle resistance of the cured product and the mounting structure can be further enhanced. If the glass transition temperature is 125°C or higher, it is more preferable.

[0092] 2. Mounting structure From the composition (X), the reinforcing portion 4 in the mounting structure 1 can be produced.

[0093] The mounting structure 1 of the embodiment includes a base material 2, a mounting component 3, a solder bump 32, and a reinforcing portion 4. The base material 2 includes a first conductor 21. The mounting component 3 includes a second conductor 31. The solder bump 32 is interposed between the first conductor 21 and the second conductor 31 and electrically connects the first conductor 21 and the second conductor 31. The reinforcing portion 4 includes a cured product of the composition (X) and covers at least one of the joint 20 between the first conductor 21 and the solder bump 32 and the joint 20 between the second conductor 31 and the solder bump 32.

[0094] FIG. 1 shows the mounting structure 1 of the embodiment.

[0095] The base material 2 is, for example, a mother board, a package board, or an interposer board. The base material 2 includes an insulating board such as a glass epoxy board, a polyimide board, a polyester board, or a ceramic board, and a first conductor 21 formed on the insulating board. The first conductor 21 is, for example, a conductor wiring made of metal.

[0096] The mounting component 3 is, for example, a semiconductor chip. More specifically, the mounting component 3 is a flip-chip type chip such as, for example, BGA (Ball Grid Array), LGA (Land Grid Array), or CSP (Chip Size Package). Further, the mounting component 3 may be a WLP (Wafer Level Package). The mounting component 3 may be a PoP (Package on Package) type chip.

[0097] The mounting component 3 includes a second conductor 31. The second conductor 31 is, for example, a pad (terminal electrode) in a semiconductor chip. For example, when the mounting component 3 is a BGA, the mounting component 3 is a package formed by encapsulating a die mounted on a substrate with an encapsulating resin, and the second conductor 31 is a terminal electrode electrically connected to the die. For example, when the mounting component 3 is a WLP, the mounting component 3 includes a silicon substrate provided with a redistribution layer, and the second conductor 31 is a pillar electrically connected to the redistribution layer. Note that the structure of the mounting component 3 is not limited to the above, and any appropriate structure according to the type of the mounting component 3 may be used.

[0098] The solder bump 32 is interposed between the first conductor 21 of the base material 2 and the second conductor 31 of the mounting component 3. The solder bump 32 electrically connects the first conductor 21 and the second conductor 31. The solder bump 32 may be, for example, Sn-Ag-Cu (SAC) based solder or Sn-Bi (tin-copper) based solder.

[0099] When the solder bump 32 is SAC based solder, the melting point of the solder bump 32 is, for example, 217°C or higher and 230°C or lower.

[0100] The Sn-Bi based solder may contain at least one material selected from the group consisting of Ag, Ni, Fe, Ge, Cu, and In, etc. in addition to Sn and Bi. In order to improve the mechanical performance of the Sn-Bi based solder, it is preferable that the Sn-Bi based solder contains at least one material selected from the group consisting of Ag, Ni, Fe, and Ge, etc.

[0101] As described above, the reinforcing portion 4 includes a cured product of the composition (X). In the mounting structure 1 shown in FIG. 1, the reinforcing portion 4 covers the joint 20 between the solder bump 32 and the first conductor 21. Therefore, the reinforcing portion 4 can reinforce the joint 20 between the solder bump 32 and the first conductor 21. For this reason, poor conduction between the first conductor 21 and the solder bump 32 is suppressed, and the mounting structure 1 can have good connection reliability. Further, in the embodiment, the reinforcing portion 4 can have high heat resistance and heat cycle resistance, and as a result, the mounting structure 1 can have high heat resistance and heat cycle resistance.

[0102] In the embodiment, the reinforcing portion 4 covers the joint 20 between the second conductor 31 and the solder bump 32.

[0103] A method for manufacturing this mounting structure 1 will be described.

[0104] By interposing the composition (X) between at least one of the space between the first conductor 21 and the solder bump 32 and the space between the second conductor 31 and the solder bump 32, and in this state, flip-mounting the mounting component 3 on the base material 2 by soldering, a mounting structure 1 including the reinforcing portion 4 can be manufactured.

[0105] Specifically, first, the composition (X), the base material 2 including the first conductor 21, the mounting component 3 including the second conductor 31, and the solder bump 32 are prepared.

[0106] The composition (X) is disposed on the first conductor 21 by, for example, applying the composition (X) on the first conductor 21 of the base material 2. The application method of the composition (X) is a printing method, a transfer method, or the like, but is not limited thereto. Examples of the printing method include an inkjet method.

[0107] The solder bump 32 is provided on the mounting component 3 so as to be in contact with the second conductor 31. The solder bump 32 is, for example, a solder ball.

[0108] The base material 2 and the mounted component 3 are arranged such that the first conductor 21 of the base material 2 and the second conductor 31 of the mounted component 3 face each other, and the solder bump 32 contacts the composition (X). Thereby, the composition (X) is interposed between the solder bump 32 and the first conductor 21.

[0109] In this state, the solder bump 32 and the composition (X) are heated in a heating furnace such as a reflow furnace.

[0110] When heating the solder bump 32 and the composition (X), for example, first, the solder bump 32 and the composition (X) are heated to near the melting point of the composition (X). For example, the composition (X) and the solder bump 32 are heated to a temperature of 140°C or higher and 160°C or lower. Thereby, as the viscosity of the composition (X) decreases, the composition (X) flows, and accordingly, the solder bump 32 contacts the first conductor 21.

[0111] Subsequently, the solder bump 32 and the composition (X) are heated to a temperature higher than the melting point of the solder. For example, the composition (X) and the solder bump 32 are heated to a temperature of 232°C or higher and 255°C or lower. Thereby, the solder bump 32 melts and spreads by wetting between the first conductor 21 and the second conductor 31. Thereby, the first conductor 21 and the second conductor 31 are electrically connected via the solder bump 32.

[0112] Subsequently, as the composition (X) is further heated, the curing of the composition (X) progresses, and a reinforcing portion 4 including a cured product of the composition (X) is produced.

[0113] As described above, the mounting structure 1 including the reinforcing portion 4 is manufactured.

[0114] 3. Modification The first modification and the second modification of the mounting structure 1 will be described with reference to FIGS. 2 and 3, respectively. In these modifications, for the components similar to those of the mounting structure 1 of the embodiment, the same reference numerals as those in the embodiment are given in the drawings, and the detailed description thereof will be omitted as appropriate.

[0115] In the mounting structure 1 of the first modified example shown in FIG. 2, the joint 20 between the first conductor 21 of the mounted component 3 and the solder bump 32 is not covered by the reinforcing portion 4, and the joint 20 between the second conductor 31 of the mounted component 3 and the solder bump 32 is covered by the reinforcing portion 4. Even in this case, the heat cycle resistance of the mounting structure 1 can be improved.

[0116] When manufacturing the mounting structure 1 of the first modified example, for example, with the solder bumps 32 provided on the base material 2 so as to be in contact with the first conductor 21, the base material 2 and the mounted component 3 are arranged such that the first conductor 21 of the base material 2 and the second conductor 31 of the mounted component 3 face each other and the solder bumps 32 are in contact with the composition (X). Thereby, the composition (X) is interposed between the solder bump 32 and the second conductor 31.

[0117] In this state, the solder bumps 32 and the composition (X) are heated in a heating furnace such as a reflow furnace. As a result, the first conductor 21 and the second conductor 31 are electrically connected via the solder bumps 32, and the joint 20 between the second conductor 31 of the mounted component 3 and the solder bump 32 is covered by the reinforcing portion 4 including the curing of the composition (X). Thereby, the mounting structure 1 is manufactured.

[0118] In the mounting structure 1 of the second modified example shown in FIG. 3, each of the joint 20 between the first conductor 21 of the mounted component 3 and the solder bump 32 and the joint 20 between the second conductor 31 of the mounted component 3 and the solder bump 32 is covered by the reinforcing portion 4. That is, the mounting structure 1 includes a reinforcing portion 4 that covers the joint 20 between the first conductor 21 of the mounted component 3 and the solder bump 32 and a reinforcing portion 4 that covers the joint 20 between the second conductor 31 of the mounted component 3 and the solder bump 32. Even in this case, the heat cycle resistance of the mounting structure 1 can be improved.

[0119] When manufacturing the mounting structure 1 of the second modification example, for example, the composition (X) is disposed on each of the first conductor 21 and the second conductor 31. In this state, the base material 2 and the mounting component 3 are arranged such that the first conductor 21 of the base material 2 and the second conductor 31 of the mounting component 3 face each other, and the solder bump 32 is interposed between the first conductor 21 and the second conductor 31 so as to be in contact with both the composition (X) on the first conductor 21 and the composition (X) on the second conductor 31.

[0120] In this state, the solder bump 32 and the composition (X) are heated in a heating furnace such as a reflow furnace. Thereby, the first conductor 21 and the second conductor 31 are electrically connected via the solder bump 32. Further, each of the joint 20 between the first conductor 21 of the base material 2 and the solder bump 32 and the joint 20 between the second conductor 31 of the mounting component 3 and the solder bump 32 is covered with the reinforcing portion 4 including the curing of the composition (X). Thereby, the mounting structure 1 is manufactured.

[0121] Note that first, the first conductor 21 and the solder bump 32 may be joined, and after the joint 20 between the first conductor 21 and the solder bump 32 is covered with the reinforcing portion 4, the second conductor 31 and the solder bump 32 may be joined, and the joint 20 between the second conductor 31 and the solder bump 32 may be covered with the reinforcing portion 4. Further, first, the second conductor 31 and the solder bump 32 may be joined, and after the joint 20 between the second conductor 31 and the solder bump 32 is covered with the reinforcing portion 4, the first conductor 21 and the solder bump 32 may be joined, and the joint 20 between the first conductor 21 and the solder bump 32 may be covered with the reinforcing portion 4.

[0122] Also, the reinforcing portion 4 covering the joint 20 between the second conductor 31 and the solder bump 32 and the reinforcing portion 4 covering the joint 20 between the first conductor 21 and the solder bump 32 may be separated or may be integrated without separation.

[0123] 4. Aspect The reinforcing resin composition of the first aspect contains an epoxy compound (A) and an amine compound (B) composed of at least one selected from the group consisting of a compound (B1) represented by the following formula (1), a compound (B2) represented by the following formula (2), a compound (B3) represented by the following formula (3), a compound (B4) represented by the following formula (4), and a compound (B5) represented by the following formula (5).

[0124]

Chem.

[0125] In formula (1), R1 and R2 are each independently a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, R3 to R6 are each independently a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, and X is -CH 2 -, an oxygen atom, -SO 2 -, or -C(CF 3 ) 2 -.

[0126]

Chem.

[0127] In formula (2), R1 and R2 are each independently a hydrogen atom or an alkyl group having 1 to 5 carbon atoms.

[0128]

Chem.

[0129] In formula (3), X is -C(CH 3 ) 2 - or an oxygen atom, and Z is -C(CH 3 ) 2 - or an oxygen atom.

[0130]

Chem.

[0131] In formula (4), one of R1 and R2 is -NH2 and one of the other is a hydrogen atom, and one of R3 and R4 is —NH 2 and one of the other is a hydrogen atom, X is —C(CH 3 ) 3 — or an oxygen atom, Z is —C(CH 3 ) 3 — or an oxygen atom.

[0132]

Chemical formula

[0133] In formula (5), R1 is a methyl group or an ethyl group, R2 is a methyl group, an ethyl group or —SCH 3 , Z is —CH 2 — or a sulfur atom.

[0134] According to this aspect, the glass transition temperature of the cured product of the reinforcing resin composition can be increased, and the heat cycle resistance of the cured product can be improved.

[0135] In the second aspect, in the first aspect, the proportion of the epoxy compound (A) is 48% by mass or more and 85% by mass or less based on the solid content of the reinforcing resin composition, and the proportion of the amine compound (B) is 5% by mass or more and 38% by mass or less based on the solid content of the reinforcing resin composition.

[0136] In the third aspect, in the first or second aspect, the epoxy compound (A) contains an epoxy compound (A1) composed of at least one selected from the group consisting of a naphthalene-type epoxy resin, a biphenyl aralkyl-type epoxy resin, a trisphenol methane-type epoxy resin, a biphenyl-type epoxy resin, and a dicyclopentadiene-type epoxy resin.

[0137] In the fourth aspect, in the third aspect, the proportion of the epoxy compound (A1) is 16% by mass or more and 35% by mass or less based on the solid content of the reinforcing resin composition.

[0138] In the fifth aspect, in any one of the first to fourth aspects, the reinforcing resin composition further contains an activator (C).

[0139] In the sixth aspect, in the fifth aspect, the proportion of the activator (C) is 1.5% by mass or more and 25% by mass or less based on the solid content of the reinforcing resin composition.

[0140] In the seventh aspect, in any one of the first to sixth aspects, the reinforcing resin composition further contains a thixotropic agent (D).

[0141] In the eighth aspect, in the seventh aspect, the proportion of the thixotropic agent (D) is 1% by mass or more and 7% by mass or less based on the solid content of the reinforcing resin composition.

[0142] In the ninth aspect, in any one of the first to eighth aspects, the glass transition temperature of the cured product of the reinforcing resin composition is 100°C or higher.

[0143] The mounting structure (1) according to the tenth aspect includes a base material (2) provided with a first conductor (21), a mounting component (3) provided with a second conductor (31), a solder bump (32) interposed between the first conductor (21) and the second conductor (31) and electrically connecting the first conductor (21) and the second conductor (31), and a cured product of the reinforcing resin composition according to any one of the first to ninth aspects, and includes a reinforcing portion (4) that covers at least one of the joint (20) between the first conductor (21) and the solder bump (32) and the joint (20) between the second conductor (31) and the solder bump (32).

[0144] According to this aspect, by increasing the glass transition temperature of the reinforcing portion (4) to improve the heat cycle resistance, the heat cycle resistance of the mounting structure (1) can be improved.

Examples

[0145] Hereinafter, specific examples of the present disclosure will be presented. Note that the present disclosure is not limited to only the following examples.

[0146] 1. Preparation of Resin Composition A resin composition was obtained by mixing the components shown in Table 1 at the ratios shown in Table 1. The details of the components shown in Table 1 are as follows. - Epoxy Compound #1: A mixture of a naphthalene-type epoxy resin represented by formula (15) and a naphthalene-type epoxy resin represented by formula (16). Epoxy equivalent 215. Manufactured by DIC Corporation. Product name HP-6000L. - Epoxy Compound #2: A naphthalene-type epoxy resin represented by formula (11). Epoxy equivalent 136 - 148. Manufactured by DIC Corporation. Product name HP-4032D. - Epoxy Compound #3: A trisphenolmethane-type epoxy resin represented by formula (18). Epoxy equivalent 162. Manufactured by DIC Corporation. Product name HP-7250. - Epoxy Compound #4: A biphenylaralkyl-type epoxy resin represented by formula (20). Epoxy equivalent 280 - 300. Manufactured by Nippon Kayaku Co., Ltd. Product name NC-3000-H. - Epoxy Compound #5: A biphenyl-type epoxy resin represented by formula (21). Epoxy equivalent 187 - 197. Manufactured by Mitsubishi Chemical Corporation. Product name YX4000H. - Epoxy Compound #6: A dicyclopentadiene-type epoxy resin represented by formula (22). Epoxy equivalent 280 - 292. Manufactured by DIC Corporation. Product name HP-7200HHH. - Epoxy Compound #7: A bisphenol-type epoxy resin that is liquid at 25°C. Manufactured by Nippon Steel Chemical & Material Co., Ltd. Product name YD8125. - Epoxy Compound #8: A bisphenol-type epoxy resin that is liquid at 25°C. Manufactured by Nippon Steel Chemical & Material Co., Ltd. Product name YDF8170. - Amine Compound #1: 4,4'-Diaminodiphenyl sulfone represented by the following formula. Manufactured by Tokyo Chemical Industry Co., Ltd.

Chemical Formula

[0147] - Amine Compound #2: 3,3'-Diaminodiphenyl sulfone represented by the following formula. Manufactured by Tokyo Chemical Industry Co., Ltd.

Chem.

[0148] - Amine Compound #3: 4,4'-Methylenebis(2-ethylaniline) represented by the following formula. Manufactured by Tokyo Chemical Industry Co., Ltd.

Chem.

[0149] - Amine Compound #4: 4,4'-Methylenebis(2-ethyl-6-methylaniline) represented by the following formula. Manufactured by Tokyo Chemical Industry Co., Ltd.

Chem.

[0150] - Amine Compound #5: 4,4'-Methylenebis[N-(1-methylpropyl)aniline] represented by the following formula. Manufactured by Mitsui Chemicals Fine Co., Ltd.

Chem.

[0151] - Amine Compound #6: 4,4'-Diaminodiphenyl ether represented by the following formula. Manufactured by Tokyo Chemical Industry Co., Ltd.

Chem.

[0152] - Amine Compound #7: 1,3-Bis(3-aminophenoxy)benzene represented by the following formula. Manufactured by Tokyo Chemical Industry Co., Ltd.

Chem.

[0153] - Amine Compound #8: Diethyltoluenediamine represented by the following formula. Manufactured by Mitsui Chemicals Fine Co., Ltd.

Chem.

[0154] - Amine compound #9: Dimethylthiotoluenediamine represented by the following formula. Manufactured by Mitsui Chemicals Fine Inc. [Chemical formula]

[0155] - Phenol compound: Diallylbisphenol A represented by the following formula. [Chemical formula]

[0156] - Activator #1: Adipic acid. Manufactured by Tokyo Chemical Industry Co., Ltd. - Activator #2: Glutaric acid. Manufactured by Tokyo Chemical Industry Co., Ltd. - Activator #3: Triethanolamine. Manufactured by Tokyo Chemical Industry Co., Ltd. - Activator #4: 1,3-Diphenylguanidine. Manufactured by Tokyo Chemical Industry Co., Ltd. - Activator #5: Manufactured by Tsuno Food Industry Co., Ltd. Product name: Tsunodaim 395. Contains 94% dimer acid. - Thixotropic agent #1: 1,3:2,4-Bis-O-benzylidene-D-glucitol (dibenzylidene sorbitol). Manufactured by Shin Nippon Rika Co., Ltd. Product name: Gelol D. - Thixotropic agent #2: 1,3:2,4-Bis-O-(4-methylbenzylidene)-D-sorbitol. Manufactured by Shin Nippon Rika Co., Ltd. Product name: Gelol MD. - Thixotropic agent #3: N,N’-Methylenebis(stearamide). Manufactured by Mitsubishi Chemical Corporation. Product name: Bisamide LA. - Solvent #1: Diethylene glycol diethyl ether. Manufactured by Nippon Emulsifier Co., Ltd. - Solvent #2: Diethylene glycol monohexyl ether. Manufactured by Nippon Emulsifier Co., Ltd.

[0157] 2. Evaluation The following evaluation tests were carried out on the resin composition. The results are shown in Table 1.

[0158] (1) Viscosity Using an E-type viscometer (manufactured by Toki Sangyo Co., Ltd., product number: RE-215U), the viscosity of the resin composition at 25°C and a rotational speed of 2.5 rpm was measured.

[0159] (2) Thixotropy ratio Using an E-type viscometer (manufactured by Toki Sangyo Co., Ltd., product number: RE-215U), the viscosity η of the resin composition at 25°C and a rotational speed of 0.25 rpm 0.25 and the viscosity η of the resin composition at 25°C and a rotational speed of 2.5 rpm 2.5 were measured. Based on the measurement results, the ratio value η 0.25 / η 2.5 was calculated as the thixotropy ratio.

[0160] (3) Coating property On a substrate having a plurality of pads made of Ni-Pd-Au alloy with a diameter of 300 μm arranged at 0.5 mm intervals, the resin composition was applied onto each pad using a printing machine (SP-80V, manufactured by Panasonic Smart Factory Solutions Co., Ltd.) to form a coating film of the resin composition covering each pad. The state of the coating film was observed with a microscope and evaluated according to the following criteria. A: There is no problem with the shape of the coating film. B: Bridges between coating films and chipping of the coating film exist, but there is no problem in practical use. C: There are many bridges between coating films and chipping of the coating film.

[0161] (4) Wettability spreadability In accordance with JIS Z 3198-3, the resin composition was placed on a copper plate, and a solder sample was placed thereon. With the resin composition and the solder sample heated, the spread rate of the solder sample was calculated based on the result. As the solder sample, a solder ball with a diameter of 300 μm made of lead-free solder SAC305 (composition: Sn 96.5%, Ag 3.0%, Cu 0.5%, melting point 219°C) was used. As the heating conditions, first, the temperature of the resin composition and the solder sample was raised to the range of 220 - 225°C and maintained at this range for 60 seconds. Subsequently, the temperature was lowered to room temperature.

[0162] If the spreading rate is 50% or more, it can be evaluated that the wet spreading property is excellent, and if it is 60% or more, it can be evaluated that the wet spreading property is particularly excellent.

[0163] (5) Storage stability The initial viscosity of the resin composition was measured by the method of the above “(1) Viscosity”. Subsequently, the resin composition was stored at a temperature of 25°C. The storage stability was evaluated by the time until the viscosity of the resin composition measured by the method of the above “(1) Viscosity” reached 120% of the initial viscosity from the start of storage.

[0164] If this time is 20 hours or more, it can be evaluated that the storage stability is excellent, and if it is 24 hours or more, it can be evaluated that the storage stability is particularly excellent.

[0165] (6) Glass transition temperature (Tg) The resin composition was heated at 150°C for 1 hour and then cured by heating at 200°C for 300 hours to prepare a sample piece. The glass transition temperature of this sample was measured by thermomechanical analysis (TMA, in accordance with JIS K 7197:1991).

[0166] If the glass transition temperature is 100°C or higher, it can be evaluated that the cured product of the resin composition is excellent in heat resistance and heat cycle resistance, and if it is 125°C or higher, it can be evaluated that the heat resistance and heat cycle resistance are particularly excellent.

[0167] (7) Solder joint strength A substrate having a plurality of Ni-Pd-Au alloy pads with a diameter of 300 μm arranged at intervals of 0.5 mm, a metal mask with a thickness of 60 μm having an opening with a diameter of 300 μm corresponding to the pads, and solder balls with a diameter of 300 μm made of lead-free solder SAC305 (composition: Sn 96.5%, Ag 3.0%, Cu 0.5%, melting point 219°C) were prepared.

[0168] Using a metal mask, a resin composition was applied onto a pad to form a coating film. Solder balls were placed on the coating film. In this state, the resin composition and the solder balls were heated in a reflow oven at a peak temperature of 260°C to join the solder balls to the pad.

[0169] Using a bond tester (manufactured by Nodecson Advanced Technology Co., Ltd.), a bump share test was conducted in accordance with JEITA ED-4703 to measure the bonding strength of the solder balls to the pad.

[0170] When the bonding strength is 1.96 N or more (200 gf or more), it can be evaluated that the bonding strength is excellent, and when it is 2.16 N or more (220 gf or more), it can be evaluated that the bonding strength is particularly excellent.

[0171] [Table 1]

[0172] [Table 2]

[0173] [Table 3] [Explanation of Reference Signs]

[0174] 1 Mounting Structure 2 Base Material 21 First Conductor 3 Mounted Component 31 Second Conductor 32 Solder Bump 4 Reinforcing Portion 20 Joint

Claims

1. An epoxy compound (A), and an amine compound (B) consisting of at least one selected from the group consisting of a compound (B1) represented by the following formula (1), a compound (B2) represented by the following formula (2), a compound (B3) represented by the following formula (3), a compound (B4) represented by the following formula (4), and a compound (B5) represented by the following formula (5), 【Chemistry 1】 In formula (1), R1 and R2 each independently represent a hydrogen atom or an alkyl group having 1 to 5 carbon atoms, R3 to R6 each independently represent a hydrogen atom or an alkyl group having 1 to 3 carbon atoms, and X represents -CH ２ -, oxygen atom, -SO ２ - or -C (CF ３ ) ２ -- and 【Chemistry 2】 In formula (2), R1 and R2 each independently represent a hydrogen atom or an alkyl group having 1 to 5 carbon atoms. 【Chemistry 3】 In formula (3), X is —C(CH ３ ) ２ - or oxygen atom, Z is -C(CH ３ ) ２ - or an oxygen atom, 【Chemistry 4】 In formula (4), one of R1 and R2 is -NH ２ and the other is a hydrogen atom, and one of R3 and R4 is -NH ２ And the other is a hydrogen atom, and X is -C(CH ３ ) ３ - or oxygen atom, Z is -C(CH ３ ) ３ - or an oxygen atom, 【Chemistry 5】 In formula (5), R1 is a methyl group or an ethyl group, R2 is a methyl group, an ethyl group, or -SCH ３ , Z is -CH ２ - or a sulfur atom, Reinforcing resin composition.

2. The ratio of the epoxy compound (A) is 48% by mass or more and 85% by mass or less based on the solid content of the reinforcing resin composition, The proportion of the amine compound (B) is 5% by mass or more and 38% by mass or less based on the solid content of the reinforcing resin composition. The reinforcing resin composition according to claim 1 .

3. The epoxy compound (A) contains at least one epoxy compound (A1) selected from the group consisting of naphthalene type epoxy resins, biphenyl aralkyl type epoxy resins, trisphenolmethane type epoxy resins, biphenyl type epoxy resins, and dicyclopentadiene type epoxy resins. The reinforcing resin composition according to claim 1 .

4. The ratio of the epoxy compound (A1) is 16% by mass or more and 35% by mass or less based on the solid content of the reinforcing resin composition. The reinforcing resin composition according to claim 3.

5. Further containing an activator (C), The reinforcing resin composition according to claim 1 .

6. The proportion of the activator (C) is 1.5% by mass or more and 25% by mass or less based on the solid content of the reinforcing resin composition. The reinforcing resin composition according to claim 5 .

7. Further containing a thixotropic agent (D), The reinforcing resin composition according to claim 1 .

8. The ratio of the thixotropic agent (D) is 1% by mass or more and 7% by mass or less based on the solid content of the reinforcing resin composition. The reinforcing resin composition according to claim 7.

9. The glass transition temperature of the cured product is 100°C or higher. The reinforcing resin composition according to claim 1 .

10. a substrate including a first conductor; a mounting component including a second conductor; a solder bump interposed between the first conductor and the second conductor and electrically connecting the first conductor and the second conductor; A reinforcing portion comprising a cured product of the reinforcing resin composition according to claim 1 and covering at least one of a joint between the first conductor and the solder bump and a joint between the second conductor and the solder bump. The implementation structure.

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