Inspection socket

The inspection socket addresses the challenge of accommodating electronic components of different sizes by using a V-shaped mounting groove and adjustable electrode terminals, ensuring reliable contact and improved versatility in inspection processes.

JP2025077659AInactive Publication Date: 2025-05-19MIS TECH CO LTD

Patent Information

Application Number
JP2023190025
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-11-07
Publication Date
2025-05-19
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

Existing inspection sockets require dedicated configurations for each size of multilayer ceramic chip capacitors (MLCCs), limiting versatility and efficiency in accommodating electronic components of varying sizes.

Method used

The inspection socket features a main body substrate with fixed and moving electrode terminals, and a V-shaped electronic component mounting groove, allowing for the secure clamping of electronic components of different sizes by adjusting the position of the moving block portion.

Benefits of technology

This solution enables the inspection socket to accommodate electronic components of various sizes, ensuring reliable contact with both electrode surfaces, thereby enhancing versatility and efficiency in inspection processes.

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Abstract

To provide an inspection socket capable of dealing with electronic components of inspection objects having different sizes respectively.SOLUTION: An inspection socket is equipped with: a body substrate 4; a fixed block part 8 that is equipped with a fixed electrode terminal 6 contacting one electrode surface 51 of an electronic component 5, wherein the fixed electrode terminal 6 protrudes to a groove 7 placing the electronic component and is fixed to the substrate 4; a movable block part 10 that is equipped with a movable electrode terminal 9 being electrically connected to the other electrode part 3, extending toward the groove 7 placing the electronic component so as to face the fixed electrode terminal 6, and contacting the other electrode surface 52 of the electronic component 5, and that is movable in a freely slidable manner relative to the fixed block part 8; and a spring 11 as energizing means for energizing the movable block part 10 toward the fixed block part 8. The groove 7 placing the electronic component has a substantially triangular prism shape with its lower side as the apex and its rectangular equilateral triangle shape as the bottom plane.SELECTED DRAWING: Figure 1
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Description

Technical Field

[0001] The present invention relates to a socket for inspection for inspecting an electronic component having a positive electrode at one end in the longitudinal direction and a negative electrode at the other end, and is a socket for inspection that can be generally used to mount an electronic component regardless of the size of the electronic component.

Background Art

[0002] The contact probe unit and the inspection socket disclosed in Patent Document 1 (Japanese Patent Application Laid-Open No. 2008-96390) include a plurality of contact probes and a support member that integrally supports the contact probes at intervals from each other. Further, Patent Document 1 discloses that the support member includes a substrate, an electronic component is mounted on the substrate, and each contact probe is connected to the electronic component. Here, it is also disclosed that the electronic component is a capacitor. Patent Document 1 also discloses an inspection socket in which the contact probe unit and a single contact probe are incorporated together.

[0003] Patent Document 2 (Japanese Patent Application Laid-Open No. 2009-85948) discloses an inspection socket having a structure capable of mounting components such as chip capacitors. This inspection socket has a first surface, a second surface opposite to the first surface, and a first through hole and a second through hole communicating the first surface and the second surface. The first surface, the second surface, the first through hole, and the second through hole are covered with a conductive plating film. It has a support block made of an insulating material, a first probe provided in the first through hole for electrically connecting a terminal of a device under test provided on the first surface side and a terminal connected to an inspection device provided on the second surface side and conducting with the plating film of the first through hole, a second probe provided in the second through hole and conducting with the plating film of the second through hole, and a component. A pattern fixed to a first region conducting with the first probe through the plating film and a second region conducting with the second probe through the plating film and electrically separated from the first region is formed by partially removing the plating films on the first surface and the second surface. Electrodes of the electronic component are connected to each of the first region and the second region.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0005] The above-mentioned Patent Documents 1 and 2 provide an inspection socket having a structure capable of mounting components such as chip capacitors and being excellent in reliability and durability. Currently, for multilayer ceramic chip capacitors (MLCCs), there are sizes 0402 (0.4×0.2 mm), 0603 (0.6×0.3 mm), 1005 (1.0×0.5 mm), 1608 (1.6~0.8 mm), 2012 (2.0×1.25 mm), 3216 (3.2×1.6 mm), and 5025 (5.0×2.5 mm). For each of them, a dedicated socket is required for inspection.

[0006] Therefore, the present invention provides an inspection socket capable of corresponding to electronic components to be inspected with different sizes respectively.

Means for Solving the Problems

[0007] The inspection socket according to the present invention is a socket for inspecting a rectangular parallelepiped-shaped electronic component having electrode surfaces at both ends in the longitudinal direction. It includes a main body substrate to which a pair of electrode portions connected to wiring terminals on the inspection substrate are fixed, a fixed electrode terminal electrically connected to the one electrode portion and contacting one electrode surface of the electronic component, an electronic component mounting groove having a V-shaped cross section for mounting the electronic component is formed, the fixed electrode terminal protrudes into the electronic component mounting groove, and a fixed block portion fixed to the main body substrate. It also includes a moving electrode terminal electrically connected to the other electrode portion, extending into the electronic component mounting groove so as to face the fixed electrode terminal and contacting the other electrode surface of the electronic component, a moving block portion movably slidable with respect to the fixed block portion, and a biasing means for biasing the moving block portion with respect to the fixed block portion. Incidentally, it is desirable that the electronic component mounting groove has a substantially triangular prism shape with a bottom surface in the shape of a right-angled isosceles triangle having its vertex at the bottom.

[0008] Thus, the moving block portion is moved against the biasing means in a direction away from the fixed electrode terminal with respect to the fixed block portion, an electronic component to be inspected is placed in the electronic component placement groove, and by releasing the biasing force on the moving block portion, the electronic component can be sandwiched between the fixed electrode terminal and the moving electrode terminal, so that it can correspond to the size of the electronic component.

[0009] Further, since the electronic component placement groove has a substantially triangular prism shape with a right-angled isosceles triangle shape having its bottom at the bottom, when a rectangular parallelepiped-shaped electronic component is placed, one of the diagonals of the electrode surfaces of the electronic components with different sizes overlaps in the vertical direction, so that the moving electrode terminal and the fixed electrode terminal can be surely brought into contact with the electrode surface of the electronic component.

[0010] The fixed electrode terminal and the moving electrode terminal each have a double-headed tip portion composed of contact portions arranged side by side vertically, and it is preferable that the respective double-headed tip portions face each other.

[0011] Also, the contact portions of the fixed electrode terminal and the moving electrode terminal are arranged side by side vertically along the vertical diagonal of the electronic component placed in the electronic component placement groove, whereby it becomes possible to correspond to each of the electronic components with different sizes.

[0012] The electronic component is preferably a capacitor, particularly a multilayer ceramic chip capacitor (MLCC).

Advantages of the Invention

[0013] According to the present invention, by moving the moving block portion against the biasing means relative to the fixed block portion, an electronic component can be placed as a test item in the electronic component placement groove. By releasing the biasing force of the moving block portion against the fixed block portion, the electronic component can be clamped and fixed by the fixed electrode terminal of the fixed block portion and the moving electrode terminal of the moving block portion. As a result, the fixed electrode terminal and the moving electrode terminal can each contact the electrode surface of the electronic component, making it possible to accommodate electronic components of different sizes.

[0014] In addition, the fixed electrode terminal and the moving electrode terminal each have a double-headed tip portion composed of contact portions arranged side by side vertically, and the respective double-headed tip portions are arranged to face each other. Therefore, it is possible to reliably contact both the electrode surface of a small electronic component and the electrode surface of a large electronic component.

Brief Description of the Drawings

[0015]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Modes for Carrying Out the Invention

[0016] As shown in FIGS. 1 and 2, the inspection socket 1 according to the present invention includes a main body substrate 4 to which a pair of electrode portions 2 and 3 connected to wiring terminals on an inspection substrate are fixed, and is electrically connected to the one electrode portion 2 and contacts one electrode surface 51 of the electronic component 5. It is provided with a fixed electrode terminal 6, and a substantially triangular prism-shaped electronic component mounting groove 7 having a bottom surface in the shape of a right-angled isosceles triangle with the bottom as the apex is formed. The fixed electrode terminal 6 projects into the electronic component mounting groove 7, and is fixed to the main body substrate 4. A fixed block portion 8, which is electrically connected to the other electrode portion 3 and extends into the electronic component mounting groove 7 so as to face the fixed electrode terminal 6, and contacts the other electrode surface 52 of the electronic component 5. It is provided with a movable electrode terminal 9, a movable block portion 10 that is slidably movable with respect to the fixed block portion 8, and a spring 11 as biasing means for biasing the movable block portion 10 with respect to the fixed block portion 8.

[0017] Thereby, the movable block portion 10 is moved with respect to the fixed block portion 8 in a direction away from the fixed electrode terminal 6 against a biasing means such as a spring, and the electronic component 5 to be inspected is placed in the electronic component mounting groove 7. By releasing the biasing force on the movable block portion 10, the electronic component 5 can be sandwiched between the fixed electrode terminal 6 and the movable electrode terminal 9, so that it can correspond to the size of the electronic component 5.

[0018] Further, since the electronic component mounting groove 7 has a V-shaped cross section, for example, a substantially triangular prism shape with a bottom surface in the shape of a right-angled isosceles triangle with the bottom as the apex, when a rectangular parallelepiped-shaped electronic component 5 is placed, one of the diagonals of the electrode surfaces of the electronic components 5 with different sizes overlaps in the vertical direction. Therefore, the movable electrode terminal 9 and the fixed electrode terminal 6 can be surely brought into contact with the electrode surfaces 51 and 52 of the electronic component 5.

Embodiment

[0019] As shown in FIGS. 1 to 4, the inspection socket 1 according to the embodiment of the present invention is composed of a main body substrate 4, a fixed block portion 8, and a movable block portion 10. In this inspection socket 1, the electronic component 5 to be inspected is, for example, a multilayer ceramic chip capacitor (MLCC), and has various sizes from small to large.

[0020] The main body substrate 4 has one electrode portion 2 connected to one of the wiring terminals on an inspection substrate (not shown) and the other electrode portion 3 connected to the other of the wiring terminals, and printed wirings 2A and 3A extending from the respective electrode portions 2 and 3 are wired.

[0021] The fixed block portion 8 is integrally formed with a shaft portion 81 fixed to the main body substrate 4, a fixed plate portion 82 made of an insulator fixed on the shaft portion 81, a fixed electrode terminal portion 6 fixed on the fixed plate portion 82, a contact electrode 84 for a movable electrode terminal fixed on the fixed plate portion 82, and a block plate portion 85 that sandwiches and fixes the fixed electrode terminal 83.

[0022] Incidentally, the fixed electrode terminal 6 is composed of a connection and fixing terminal 6A connected and fixed to the printed wiring 3A, a fixing portion 6B fixed to the fixed plate 82, and a fixed-side electrode contact portion 6C for contacting the electrode surface 51 of the electronic component 5. Further, the contact electrode 84 is composed of a fixed terminal 84A that is contact-fixed to the printed wiring 2A and a sliding electrical terminal 84B that is electrically connected to the movable electrode terminal 9 of the movable block portion 10. Further, a clip portion 86 for moving the movable block portion 10 against the spring 11 is formed in the fixed block portion 8.

[0023] Further, on the upper surface of the block plate portion 85, an electronic component mounting groove 7 with a V-shaped cross-section for mounting the electronic component 5 to be inspected is formed. This electronic component mounting groove 7 is preferably formed in a substantially triangular prism shape with a bottom surface in the shape of an isosceles right triangle having its apex downward. Thereby, the rectangular parallelepiped-shaped electronic component 5 can be reliably mounted. Also, it can accommodate cylindrical electronic components.

[0024] The moving block portion 10 is composed of a clamping block 101 for clamping and fixing the moving electrode terminal 9, a holding plate 102 for holding the spring 11 between the fixed block portion 8, and a connecting portion 103 for connecting between the clamping block 101 and the holding plate 102.

[0025] The moving electrode terminal 9 is composed of a moving-side electrode contact portion 9A for contacting the electrode surface 52 of the electronic component 5, a moving-side electrode terminal 9B for manually contacting the sliding electrical terminal 84B of the contact electrode 84, and a connecting portion 9C for connecting the moving-side electrode contact portion 9A and the moving-side electrode terminal 9B.

[0026] The fixed-side electrode contact portion 6C is composed of a pair of tip electrode terminals 6D and 6E in a double-headed shape arranged side by side in the vertical direction, and the moving-side electrode terminal 9A is composed of a pair of tip electrode terminals 9D and 9E in a double-headed shape arranged side by side in the vertical direction.

[0027] Thereby, by pinching the holding plate 102 and the clip portion 86, the distance between the fixed-side electrode contact portion 6C and the electrode contact portion 9A can be widened, so that the electronic component 5 can be mounted. Further, by releasing the pinched state, as shown in FIG. 4, the tip electrode terminals 6D and 6E of the fixed-side electrode contact portion 6C contact one electrode surface 51 of the electronic component 5, and further, the tip electrode terminals 9D and 9E of the moving-side electrode contact portion 9A contact the other electrode surface 52 of the electronic component 5, and thus the electronic component 5 is clamped and fixed by the fixed-side electrode contact portion 6C and the moving-side electrode contact portion 9A.

[0028] Also, as shown in FIG. 5(a), since the electronic component mounting groove 7 has a substantially triangular prism shape with a right isosceles triangle shape having its bottom at the lower vertex as the bottom surface, when the rectangular parallelepiped-shaped electronic component 5 is mounted, the vertical diagonals of the electrode surfaces 51, 52 of the electronic components 5 having different sizes overlap with the vertical line 5A. Therefore, the moving-side electrode terminal 9A and the fixed-side electrode terminal 6C can be surely brought into contact with the electrode surfaces 51, 52 of the electronic component 5.

[0029] FIG. 5(b) shows a state in which a large-type electronic component 5 is mounted. In this case, the tip electrode terminals 6D, 6E and 9D, 9E respectively come into contact with the electrode surfaces 51, 52 of the electronic component 5 and sandwich and fix the electronic component 5.

[0030] FIG. 5(c) shows a state in which a small-type electronic component 5 is mounted. In this case, the tip electrode terminals 6E and 9E respectively come into contact with the electrode surfaces 51, 52 of the electronic component 5 and sandwich and fix the electronic component 5.

[0031] As described above, according to the inspection socket 1 according to the present invention, the problem of the present invention that it can correspond to rectangular parallelepiped-shaped electronic components 5 having electrode surfaces on both longitudinal sides of various sizes can be achieved.

Explanation of reference numerals

[0032] 1 Inspection socket 2, 3 Electrode part 4 Main body substrate 5 Electronic component 6 Fixed electrode terminal 7 Electronic component mounting groove 8 Fixed block part 9 Moving electrode terminal 10 Moving block part 11 Spring 51, 52 Electrode surface

Claims

1. A socket for testing a rectangular parallelepiped electronic component having electrode surfaces on both longitudinal ends, a main substrate on which a pair of electrodes to be connected to wiring terminals on a test substrate are fixed; a fixed block portion which is fixed to the main body substrate and which is provided with a fixed electrode terminal electrically connected to the one electrode portion and which contacts one electrode surface of the electronic component, an electronic component mounting groove having a V-shaped cross section for mounting the electronic component thereon is formed, the fixed electrode terminal protruding into the electronic component mounting groove; a movable block portion which is electrically connected to the other electrode portion, extends into the electronic component mounting groove so as to face the fixed electrode terminal, and is provided with a movable electrode terminal which contacts the other electrode surface of the electronic component, and is slidably movable relative to the fixed block portion; and a biasing means for biasing the moving block portion against the fixed block portion.

2. 2. The testing socket according to claim 1, wherein the electronic component mounting groove is substantially in the shape of a triangular prism having a bottom surface in the shape of a right-angled isosceles triangle.

3. 3. The testing socket according to claim 1, wherein said fixed electrode terminal and said movable electrode terminal each have a double-headed tip portion consisting of contact portions arranged in a vertical line, and the double-headed tip portions face each other.

4. 4. The inspection socket according to claim 1, wherein the electronic component is a capacitor.

Citation Information

Patent Citations

  • JP1980040338U

  • Measurement jig for chip-shaped electrical components

    JP1990135877U

  • Circuit element measuring device

    JP2003172754A

  • Contact probe unit and inspection socket

    JP2008096390A

  • Inspection socket

    JP2009085948A

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