Semiconductor device handling apparatus and semiconductor device testing apparatus

Abstract

To provide a semiconductor device handling apparatus capable of accurately adjusting temperatures of a plurality of DUTs.SOLUTION: A semiconductor device handling apparatus 30 includes: a plurality of holding bodies 51 which are respectively provided corresponding to probe heads 22 of a probe card 20 and which hold each of DUTs 100; a moving device 42 for moving the plurality of holding bodies 51; and a drive control section 85 for controlling the moving device 42. The plurality of holding bodies 51 respectively include: heaters 611 for adjusting temperatures of the DUTs 100; and cooling blocks 612. The moving device 42 raises the plurality of holding bodies 51 so as to press the DUTs 100 held by the plurality of holding bodies 51 to the prove heads 22.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a semiconductor device handling apparatus that handles semiconductor devices under test (DUTs), such as dies formed by dicing a semiconductor wafer, in order to test the semiconductor devices, and a semiconductor device testing apparatus that tests the semiconductor devices. [Background technology]

[0002] An electronic component handling device is known that includes a thermal head that holds multiple bare dies and a moving device that moves the thermal head, and an alignment unit that individually positions the multiple bare dies relative to the contact portions and then presses the multiple bare dies against the contact portions simultaneously (see, for example, Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2016-85203 A Summary of the Invention [Problem to be solved by the invention]

[0004] In the above electronic device handling device, since a plurality of bare dies are held on the same holding surface of the thermal head, there is a problem in that it is difficult to adjust the temperature of each bare die with high precision.

[0005] An object of the present invention is to provide a semiconductor device handling apparatus and a semiconductor device testing apparatus capable of adjusting the temperatures of a plurality of DUTs with high precision. [Means for solving the problem]

[0006] [1] A first aspect of the present invention is a semiconductor device handling apparatus that moves a DUT to press the DUT against a contact portion, the semiconductor device handling apparatus comprising: a plurality of holders that are each arranged to correspond to the contact portion and each hold the DUT; a first moving device that moves the plurality of holders; and a control device that controls the first moving device, wherein the plurality of holders each have a temperature adjustment mechanism that adjusts the temperature of the DUT, and the first moving device raises the plurality of holders to press the DUT held by the plurality of holders against the contact portion.

[0007] [2] A second aspect of the present invention may be a semiconductor device handling apparatus according to the first aspect, comprising a holding member for holding the plurality of holders individually and freely, a first moving device for moving the holding member, and a support member for abutting against and supporting one of the plurality of holders.

[0008] [3] A third aspect of the present invention may be a semiconductor device handling device according to the second aspect, wherein the holding member has a plurality of holding holes into which the plurality of holders are individually inserted, and the holding member holds the holders inserted into the holding holes in a freely movable manner.

[0009] [4] A fourth aspect of the present invention may be the semiconductor device handling apparatus of the second or third aspect, wherein the holding member is detachably attached to the first moving device.

[0010] [5] A fifth aspect of the present invention may be a semiconductor device handling device according to any one of the first to fourth aspects, wherein the temperature adjustment mechanism includes a heating device that contacts the DUT and heats the DUT, and a cooling block that has a flow path through which a refrigerant passes and holds the heating device.

[0011] [6] A sixth aspect of the present invention may be a semiconductor device handling apparatus according to the fifth aspect, wherein the heating device includes a planar heater having a first surface in contact with the DUT and a second surface opposite the first surface, and the cooling block includes a third surface in contact with the second surface.

[0012] [7] A seventh aspect of the present invention may be a semiconductor device handling device according to any one of the first to sixth aspects, wherein the holder has a contact surface that contacts the DUT and an adsorption holding mechanism that opens onto the contact surface and holds the DUT by suction.

[0013] [8] Aspect 8 of the present invention may be a semiconductor device handling device according to any one of aspects 1 to 7, wherein the multiple holders each include a parallelism adjustment device that adjusts the parallelism of the DUT relative to the contact portion.

[0014] [9] A ninth aspect of the present invention may be a semiconductor device handling device according to the eighth aspect, wherein the parallelism adjustment device includes a first tilt adjustment device that tilts the DUT around a first axis and a second tilt adjustment device that tilts the DUT around a second axis, wherein the first axis is an axis substantially parallel to the planar direction of the contact portion, and the second axis is substantially parallel to the planar direction of the contact portion and is substantially perpendicular to the first axis when the second axis is projected onto a normal direction of the contact portion.

[0015]

[10] A tenth aspect of the present invention may be a semiconductor device handling apparatus according to the eighth or ninth aspect, further comprising a parallelism detection device that detects the parallelism of the DUT relative to the contact portion, and the control device that controls the parallelism adjustment device based on the parallelism detected by the parallelism detection device.

[0016]

[11] An eleventh aspect of the present invention may be a semiconductor device handling apparatus according to the tenth aspect, wherein the parallelism detection device includes a first sensor that detects the height of a predetermined position on the DUT, a second sensor that detects the height of a predetermined position on the contact portion, and a parallelism calculation device that calculates the parallelism of the DUT relative to the contact portion based on the detection results of the first and second sensors, and the control device controls the parallelism detection device based on the parallelism calculated by the parallelism calculation device.

[0017]

[12] A twelfth aspect of the present invention may be a semiconductor device handling apparatus according to any one of aspects 8 to 11, wherein the multiple holders each include a height adjustment device for adjusting the height of the DUT relative to the contact portion, the semiconductor device handling apparatus includes a height detection device for detecting the height of the DUT relative to the contact portion, and the control device controls the height adjustment device based on the height detected by the height detection device.

[0018]

[13] A thirteenth aspect of the present invention is a semiconductor device handling apparatus according to the twelfth aspect, wherein the height detection device includes a first sensor for detecting a height of a predetermined position on the DUT, a second sensor for detecting a height of a predetermined position on the contact portion, and a height calculation device for calculating a height of the DUT relative to the contact portion based on detection results of the first and second sensors, and the control device may be a semiconductor device handling apparatus that controls the height adjustment device based on the height calculated by the height calculation device.

[0019]

[14] A fourteenth aspect of the present invention may be a semiconductor device handling apparatus according to any one of the first to thirteenth aspects, wherein the DUT is a bare die alone, a 2.5D device intermediate having multiple bare dies arranged in a row on a silicon interposer, or a 3D device intermediate having multiple bare dies stacked on top of each other.

[0020]

[15] A fifteenth aspect of the present invention may be a semiconductor device handling apparatus according to any one of the first to fourteenth aspects, comprising a holding member which holds the plurality of holders so that they can move individually, the first moving device which moves the holding member, and a support member which abuts against and supports one of the plurality of holders, wherein the support member abuts against and supports the one holder as the first moving device moves the holding member, and the control device controls the first moving device to move the holding member while the support member supports the one holder.

[0021]

[16] A sixteenth aspect of the present invention may be the semiconductor device handling apparatus of the fifteenth aspect, wherein the first moving device and the support member are fixed relatively to a same base member.

[0022]

[17] A seventeenth aspect of the present invention may be a semiconductor device handling apparatus according to the fifteenth or sixteenth aspect, further comprising a position detection device for detecting a relative position of the DUT with respect to the contact portion, and the control device for controlling the first moving device based on the relative position detected by the position detection device.

[0023]

[18] Aspect 18 of the present invention may be a semiconductor device handling apparatus according to aspect 17, wherein the position detection device includes a first camera that images the DUT held by the holder, a second camera that images the contact portion, and a position calculation device that calculates the relative position of the DUT with respect to the contact portion based on image information captured by the first camera and the second camera.

[0024]

[19] A nineteenth aspect of the present invention is a semiconductor device handling apparatus according to any one of aspects one to fourteen, comprising: a holding member which holds the plurality of holders so that they can move individually; a first moving device which moves the holding member; a support member which abuts against and supports one of the plurality of holders; and a second moving device which moves the support member, wherein the support member abuts against and supports the one holder as the first moving device moves the holding member or the second moving device moves the support member, and the control device controls the second moving device to move the support member while the support member supports the holder.

[0025]

[20] A twentieth aspect of the present invention may be a semiconductor device handling apparatus according to the nineteenth aspect, further comprising a position detection device for detecting a relative position of the DUT with respect to the contact portion, and the control device for controlling the second moving device based on the relative position detected by the position detection device.

[0026]

[21] A twenty-first aspect of the present invention may be a semiconductor device handling apparatus according to the twenty-first aspect, wherein the position detection device includes a first camera that images the DUT held by the holder, a second camera that images the contact portion, and a position calculation device that calculates the relative position of the DUT with respect to the contact portion based on image information captured by the first camera and the second camera.

[0027]

[22] A twenty-second aspect of the present invention may be a semiconductor device testing apparatus for testing a DUT, comprising a semiconductor device handling apparatus according to any one of aspects one to twenty-one, and a tester to which the contact portion is electrically connected. Effect of the Invention

[0028] In the present invention, since a plurality of holders each holding a DUT are each provided with a temperature adjustment mechanism for adjusting the temperature of the DUT, it becomes possible to adjust the temperature of a plurality of DUTs with high precision. [Brief description of the drawings]

[0029] [Figure 1] FIG. 1 is a diagram showing the overall configuration of a semiconductor device testing apparatus and the internal structure of a handler in a first embodiment of the present invention. [Diagram 2] FIG. 2 is a cross-sectional view taken along line II-II in FIG. [Diagram 3] FIG. 3 is a diagram showing a holding unit in the first embodiment of the present invention, and is an enlarged view of part III in FIG. [Figure 4] FIG. 4 is a cross-sectional view of the thermal chuck and a block diagram showing a control system in the first embodiment of the present invention. [Diagram 5] FIG. 5 is a partial cross-sectional view showing the semiconductor device testing apparatus after the probe card and the holding unit have been replaced in the first embodiment of the present invention. [Figure 6] Figures 6(a) and 6(b) are diagrams showing the positioning operation of a DUT in the first embodiment of the present invention, where Figure 6(a) is a diagram showing a state in which the fixed arm abuts against the holder to support the holder, and Figure 6(b) is a diagram showing a state in which the holder is moved relative to the holding member. [Figure 7] FIG. 7 is a side view showing an operating device according to the second embodiment of the present invention. [Figure 8] Figures 8(a) to 8(c) are figures showing the positioning operation of a DUT in the second embodiment of the present invention, where Figure 8(a) is a figure showing a state in which the support member of the operating device is positioned below the holder, Figure 8(b) is a figure showing a state in which the support member abuts against the holder and the operating device lifts the holder, and Figure 8(c) is a figure showing a state in which the operating device moves the holder relative to the holder. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0030] Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

[0031] First Embodiment Fig. 1 is a diagram showing the overall configuration of a semiconductor device testing apparatus 1 and the internal structure of a handler 30 in a first embodiment of the present invention, and Fig. 2 is a cross-sectional view taken along line II-II in Fig. 1. Fig. 3 is a diagram showing a holding unit 41 in this embodiment, and is an enlarged view of part III in Fig. 2. Fig. 4 is a cross-sectional view of a thermal chuck 61 in this embodiment, and a block diagram showing a control system. Note that, for ease of understanding, in Figs. 3 and 4, the DUT 100 is separated from the holder 51, but in reality, the DUT 100 is held by the holder 51, and therefore the DUT 100 is in contact with the holder 51.

[0032] The semiconductor device testing apparatus 1 of this embodiment is an apparatus for testing a DUT 100. As shown in Fig. 1 and Fig. 2, this semiconductor device testing apparatus 1 includes a tester 10 for testing the DUT 100, and a handler 30 for moving the DUT 100 and pressing it against a probe card 20. This handler 30 corresponds to an example of a "semiconductor device handling apparatus" in an aspect of the present invention.

[0033] A specific example of the DUT 100 to be tested is a bare die (bare chip) formed by dicing a semiconductor wafer. The semiconductor device test apparatus 1 tests the electrical characteristics of an electronic circuit built into the bare die 100. Note that the DUT 100 is not limited to a bare die alone, and may be, for example, a 2.5D device intermediate or a 3D device intermediate.

[0034] Here, the 2.5D device intermediate is a device intermediate having a silicon interposer and a plurality of bare dies arranged on the silicon interposer. This 2.5D device intermediate is, for example, mounted on a wiring board and packaged with a resin material to become a final product (i.e., a 2.5D device (i.e., a 2.5-dimensional device)).

[0035] On the other hand, a 3D device intermediate is a device intermediate having multiple bare dies stacked on top of each other and electrically connected by through-silicon vias (TSVs). Like the above-mentioned 2.5D device intermediate, this 3D device intermediate is also mounted on a wiring board and packaged with a resin material to become a final product (i.e., a 3D device (three-dimensional device)).

[0036] 1, the tester 10 includes a test head 11, a main frame (tester body) 12, and a probe card 20. The test head 11 is connected to the main frame 12 via a cable. The probe card 20 is electrically connected to the test head 11. The probe card 20 enters the inside of the handler 30 through an opening 32 formed in an upper base 31 of the handler 30.

[0037] The probe card 20 includes a wiring board 21 and a plurality of (two in this embodiment) probe heads 22 mounted on the wiring board 21. One probe head 22 corresponds to one DUT 100, and in this embodiment, it is possible to test two DUTs 100 simultaneously. The two probe heads 22 are arranged on the wiring board 21 with a gap therebetween along the X direction in the figure. The probe heads 22 correspond to an example of a "contact portion" in this aspect of the present invention.

[0038] Each of the probe heads 22 includes a probe 23 that contacts the terminal 110 of the DUT 100, and a housing 24 that holds the probe 23. The probe 23 is not particularly limited, but examples thereof include a pogo pin, a vertical probe needle, a cantilever probe needle, an anisotropic conductive rubber sheet, a bump on a membrane, or a contactor fabricated using MEMS technology. For example, the housing 24 is screwed to the wiring board 21, thereby fixing each of the probe heads 22 to the wiring board 21.

[0039] As shown in FIGS. 1 and 2, the handler 30 includes a transport device 35, an alignment device 40, a first camera 36, ​​a first height sensor 37, a fixed arm 70, and a control device 80 (see FIG. 4).

[0040] The transport device 35 picks up an untested DUT 100 from a tray (not shown) and transports the DUT 100 to the alignment device 40. The transport device 35 also picks up a tested DUT 100 from the alignment device 40 and transports the DUT 100 to the tray. At this time, the transport device 35 may sort the DUTs 100 according to the test results of the DUTs 100 while transporting them to the tray.

[0041] Although not particularly limited, a pick-and-place device equipped with a suction pad can be exemplified as a specific example of the transport device 35. Furthermore, although not particularly limited, a customer tray conforming to the JEDEC (Joint Electron Device Engineering Council) standard can be exemplified as a specific example of the tray.

[0042] Note that, instead of the above-mentioned tray, the DUT 100 may be held on a plate. Although not particularly limited, a specific example of this plate is a buffer plate capable of holding the DUT 100. Alternatively, instead of the above-mentioned tray, the DUT 100 may be held on a ring frame (wafer ring).

[0043] The alignment device 40 is a device that moves the DUT 100. The alignment device 40 positions the DUT 100 transported by the transport device 35 relative to the probe head 22, and then presses the DUT 100 against the probe head 22. The alignment device 40 includes a holding unit 41 and a moving device 42.

[0044] The holding unit 41 includes a plurality of (two in this embodiment) holding bodies 51, a holding member 52, a second camera 53, and a second height sensor 54. As shown in FIG. 3, each holding body 51 includes a thermal chuck 61, a parallelism adjustment device 62, a height adjustment device 63, and a base portion 64.

[0045] The thermal chuck 61 includes a suction holding mechanism that suction-holds the DUT 100, and a temperature adjustment mechanism that adjusts the temperature of the DUT 100. Specifically, as shown in Fig. 3 and Fig. 4, the thermal chuck 61 includes a heater 611, a cooling block 612, a temperature sensor 613, and a suction nozzle 614.

[0046] The heater 611 is a planar heater having an upper surface 611a that contacts the DUT 100 and a lower surface 611b opposite to the upper surface 611a. The upper surface 611a of the heater 611 constitutes the upper surface of the holder 51. That is, the heater 611 is exposed to the outside of the holder 51 and directly contacts the DUT 100. The upper surface 611a of the heater 611 corresponds to an example of a "first surface" in the aspect of the present invention, and the lower surface 611b of the heater 611 corresponds to an example of a "second surface" in the aspect of the present invention. Although not particularly limited, specific examples of the heater 611 include an aluminum nitride heater, a silicon nitride heater, and a ceramic heater such as a PTC heater, a polyimide heater, and a Peltier element.

[0047] The cooling block 612 is a block-shaped member that holds the heater 611 described above. An upper surface 612a of the cooling block 612 is in contact with a lower surface 611b of the heater 611. The heater 611 is fixed to the cooling block 612. The upper surface 612a of the cooling block 612 corresponds to an example of a "third surface" in this aspect of the present invention.

[0048] The cooling block 612 has a flow path 612b to which the coolant supply device 91 is connected. The flow path 612b is formed inside the cooling block 612 so as to cover the entire area of ​​the upper surface 612a. The coolant supply device 91 includes, for example, a heat exchanger for cooling the coolant and a pump for circulating the coolant. Although not particularly limited, the coolant supply device 91 is, for example, a chiller.

[0049] A coolant at a temperature lower than room temperature is supplied from coolant supply device 91 to flow path 612b, and the coolant passes through flow path 612b. The coolant flowing through flow path 612b may be liquid or gas. Although not particularly limited, specific examples of liquid coolants include water and fluorine-based inert liquids. On the other hand, specific examples of gas coolants include air and nitrogen.

[0050] The heater 611 is connected to the control device 80, and generates heat by power supplied from the control device 80. Meanwhile, the cooling block 612 is cooled by the cooling medium supplied from the cooling medium supply device 91 passing through a flow path 612b in the cooling block 612.

[0051] At this time, since the upper surface 611a of the heater 611 is in direct contact with the DUT 100, the heater 611 directly heats the DUT 100. Meanwhile, the cooling block 612 cools the heater 611 in contact with the DU 100. For example, the temperature of the DUT 100 is adjusted by adjusting the output of the heater 611 while keeping the flow rate of the coolant passing through the flow path 612b of the cooling block 612 constant. This makes it possible to suppress the occurrence of vibrations caused by fluctuations in the flow rate of the coolant, and to suppress the occurrence of miscontact between the DUT 100 and the probe card 20.

[0052] The configuration of the temperature adjustment device for adjusting the temperature of the DUT 100 is not particularly limited to the above. For example, the heater 611 may be embedded in the cooling block 612, and the upper surface 612a of the cooling block 612 may directly contact the DUT 100. In this case, a planar heater may not be used as the heater 611, and for example, a cartridge heater may be used as the heater 611. Alternatively, instead of a heater, a hot medium having a temperature higher than room temperature may be passed through a flow path in the cooling block 612. Alternatively, a fluid formed by mixing a coolant and a hot medium may be passed through the above-mentioned flow path 612b. Alternatively, a Peltier element may be used as the heater, or a Peltier element may be used instead of the coolant. Also, the holder 51 may include only one of the heating device or the cooling device, and may not include the other of the heating device or the cooling device.

[0053] The temperature sensor 613 is embedded in the cooling block 612. The temperature sensor 613 is provided inside the cooling block 612 so as to be located near the upper surface 612a. The temperature sensor 613 is connected to the control device 80 so as to be able to output the detection result.

[0054] The suction nozzle 614 opens at the center of the upper surface 611a of the heater 611, and is connected to the pressure reducing device 92 via a flow path 612c formed in the cooling block 612. With the DUT 100 placed on the upper surface 611a of the holder 51, the suction nozzle 614 is sucked by the pressure reducing device 92, whereby the DUT 100 is sucked and held by the holder 51. Although not particularly limited, a specific example of the pressure reducing device 92 can be a vacuum pump or the like.

[0055] 3, the parallelism adjustment device 62 is disposed below the thermal chuck 61, and the thermal chuck 61 is fixed to the parallelism adjustment device 62. The parallelism adjustment device 62 is a device that adjusts the rolling and pitching of the DUT 100 held by the thermal chuck 61, and is, for example, a so-called two-axis goniostage that includes a first adjustment unit 621 and a second adjustment unit 622. Although not particularly limited, in this embodiment, the second adjustment unit 622 is provided below the first adjustment unit 621, and the first and second adjustment units 621 and 622 are fixed to each other.

[0056] The first adjustment unit 621 is a goniostage that rotates (tilts) the thermal chuck 61 about a first axis, and is a device that adjusts the rolling of the DUT 100. Here, the above-mentioned first axis is an axis that is substantially parallel to the planar direction (XY direction in the figure) of the probe head 22. For example, this first axis is an axis that is substantially parallel to the Y axis in the figure.

[0057] This first adjustment unit 621 is driven by a first actuator 623. A specific example of such first actuator 623 is not particularly limited, but may be, for example, an electric motor equipped with a worm gear mechanism.

[0058] On the other hand, the second adjustment unit 622 is a goniostage that rotates (tilts) the thermal chuck 61 about a second axis, and is a device that adjusts the pitching of the DUT 100. Here, the second axis is an axis that is substantially parallel to the planar direction of the probe head 22 (XY direction in the figure), and is substantially perpendicular to the first axis when the second axis is projected onto the normal direction of the probe head 22 (Z direction in the figure) (direction in which the DUT 100 is pressed against the probe head 22). For example, the second axis is an axis that is substantially parallel to the X axis in the figure.

[0059] This second adjustment unit 622 is driven by a second actuator 624. A specific example of such a second actuator 624 is not particularly limited, but may be, for example, an electric motor equipped with a worm gear mechanism, similar to the above-mentioned first actuator 623.

[0060] By rotating the thermal chuck 61 around a first axis using the first adjustment unit 621 and rotating the thermal chuck 61 around a second axis using the second adjustment unit 622, the DUT 100 held by the thermal chuck 61 can be tilted as desired, and the parallelism of the DUT 100 relative to the probe head 22 can be adjusted.

[0061] The mechanism included in the parallelism adjustment device 62 is not limited to the above-mentioned goniostage, so long as it is a mechanism capable of arbitrarily tilting the DUT 100 .

[0062] The height adjustment device 63 is provided below the parallelism adjustment device 62, and the parallelism adjustment device 62 is fixed to the height adjustment device 63. The height adjustment device 63 is capable of moving the thermal chuck 61 and the parallelism adjustment device 62 in the vertical direction (Z-axis direction in the figure) by an actuator 631. The height adjustment device 63 is used to cancel the displacement of the DUT 100 in the height direction caused by the parallelism adjustment of the DUT 100 by the parallelism adjustment device 62. A specific example of the actuator 631 of the height adjustment device 63 is not particularly limited, but may be, for example, an electric motor connected to a ball screw mechanism.

[0063] The height adjustment device 63 may be disposed between the thermal chuck 61 and the parallelism adjustment device 62. When the first and second axes of the parallelism adjustment device 62 and the center of gravity of the DUT 100 held by the holder 51 coincide with each other, the height adjustment device 63 may be omitted.

[0064] The base portion 64 is provided below the height adjustment device 63, and the height adjustment device 63 is fixed to the base portion 64. The base portion 64 has a flange 641 on its upper portion, which protrudes in the horizontal direction (the XY plane direction in the figure). The flange 641 has an outer diameter larger than that of a lower portion 642 of the base portion 64 that is below the flange 641. The actuators 623, 624, 631 described above may be housed inside the base portion 64.

[0065] The above-described multiple holders 51 are held by a holding member 52. The holding member 52 includes an upper plate 521, a side plate 522, and a lower plate 523. The upper plate 521 and the lower plate 523 are connected via the side plate 522, and a space 524 is formed between the upper plate 521 and the lower plate 523. The side plate 522 connects the upper plate 521 and the lower plate 523 only on one side, and the holding member 52 has a window portion 525 that opens the space 524 in three directions (the +X direction, the +Y direction, and the -X direction in the figure). The tip portion 721 of the fixed arm 70 can enter the space 524 through the window portion 525.

[0066] 1 and 3, a plurality of (two in this embodiment) openings 526 are formed in the upper plate 521 of the holding member 52. Each opening 526 penetrates the upper plate 521 in the thickness direction of the upper plate 521 (Z direction in the figure). The plurality of openings 526 are arranged to correspond to the arrangement of the plurality of probe heads 22 provided in the probe card 20. As shown in FIG. 3, each opening 526 has an inner diameter smaller than the outer diameter of the flange 641 of the base portion 64 of the holding body 51 described above and larger than the outer diameter of the lower portion 642 of the base portion 64.

[0067] The two holders 51 are inserted from above into the openings 526 of the holder member 52. At this time, since the inner diameter of the openings 526 is larger than the outer diameter of the lower portion 642 of the base portion 64, the lower portion 642 enters the openings 526. On the other hand, since the inner diameter of the openings 526 is smaller than the outer diameter of the flange 641 of the base portion 64, the flange 641 engages with the periphery of the opening 526 of the upper plate 521.

[0068] Therefore, each holder 51 is held by the holding member 52 so as to be freely movable, and is not fixed to the holding member 52. Therefore, by moving the holder 51 horizontally while pushing up the holder 51, it is possible to move the holder 51 horizontally relative to the holding member 52 within the range of the opening 526. Since one opening 526 is assigned to one holder 51, the multiple holders 51 are held by the holding member 52 so as to be individually (independently) movable. The holding member 52 may be provided with a suction holding mechanism that suctions and holds the holder 51 inserted into the opening 526.

[0069] As shown in FIG. 1, a second camera 53 and a second height sensor 54 are attached to the holding member 52.

[0070] The second camera 53 is a camera that captures an image of the probe card 20. The second camera 53 is installed so that its optical axis faces upward (the +Z direction in the figure). Although not particularly limited, a specific example of the second camera 53 can be a camera equipped with an imaging element such as a CCD or a CMOS.

[0071] When the second camera 53 is moved to below the probe card 20 by the moving device 42, the second camera 53 captures an image of the probe card 20. As shown in FIG. 4, the second camera 53 is electrically connected to the control device 80, and is capable of outputting captured image information to the control device 80.

[0072] The second height sensor 54 is a sensor that detects the height of a predetermined position of the probe head 22 of the probe card 20. As shown in Fig. 1, the second height sensor 54 is installed so that its optical axis faces upward (the +Z direction in the figure). Although not particularly limited, a specific example of the second height sensor 54 can be, for example, a laser displacement meter.

[0073] When the second height sensor 54 is moved to below the probe card 20 by the moving device 42, the second height sensor 54 detects the height of a predetermined position of the probe head 22. As shown in Fig. 4, the second height sensor 54 is electrically connected to the control device 80, and is capable of outputting the detected height of the predetermined position of the probe head 22 to the control device 80.

[0074] Here, specific examples of the predetermined positions of the probe head 22 detected by the second height sensor 54 include the four corners of the probe head 22. The predetermined positions of the probe head 22 are not particularly limited to the above, so long as they are three or more mutually different positions on the probe head 22. Furthermore, the predetermined positions of the probe head 22 used to calculate the height of the probe head 22 may be the center of the probe head 22 instead of the four corners of the probe head 22.

[0075] The second camera 53 may detect the height of a predetermined position of the probe head 22 in addition to capturing an image of the probe card 20. In this case, the second height sensor 54 can be omitted.

[0076] Specifically, when the second camera 53 captures an image of the probe card 20, the height may be detected by adjusting the focus of the second camera 53 to a predetermined position of the probe head 22 and determining the focal length when the focus is achieved. In this case, the second camera 53 is capable of outputting the height of the predetermined position of the probe head 22 to the control device 80. In this case, the second camera 53 corresponds to an example of a "second height sensor" in the aspect of the present invention.

[0077] The moving device 42 is a device that moves the above-mentioned holding unit 41. As shown in Fig. 1 and Fig. 2, the moving device 42 includes an X-direction rail 421, an X-direction stage 422, a Y-direction rail 423, a Y-direction stage 424, and a Z drive unit 425. The moving device 42 corresponds to an example of a "first moving device" in an aspect of the present invention.

[0078] The X-direction rail 421 is provided on the lower base 34 of the handler 30, and extends along the X-direction. The X-direction stage 422 is slidably held on the X-direction rail 421, and can be moved along the X-direction by an actuator (not shown). A specific example of such an actuator is not particularly limited, but may be, for example, an electric motor equipped with a ball screw mechanism.

[0079] The Y-direction rail 423 is provided on the X-direction stage 422 and extends along the Y direction. The Y-direction stage 424 is slidably held on the Y-direction rail 423 and can be moved along the Y direction by an actuator (not shown). A specific example of such an actuator is not particularly limited, but may be, for example, an electric motor equipped with a ball screw mechanism.

[0080] The Z driving section 425 is fixed to the Y direction stage 424. Furthermore, the holding unit 41 is attached to this Z driving section 425. Although not particularly shown, this Z driving section 425 is equipped with a guide mechanism and an actuator, and is capable of raising and lowering the holding unit 41 and rotating the holding unit 41 around the Z axis. As a result, the moving device 42 is capable of moving the holding unit 41 in the X, Y and Z directions and rotating it around the Z axis.

[0081] In this embodiment, the holding unit 41 is detachably fixed to the moving device 42. Specifically, as shown in Fig. 3, a lower plate 523 of the holding member 52 is fixed to an upper portion of a Z drive unit 425 of the moving device 42 by a bolt 43. By removing the bolt 43, the holding unit 41 can be removed from the moving device 42.

[0082] Here, the number of probe heads 22 included in the above-mentioned probe card 20 can be set according to the number of DUTs 100 to be tested simultaneously (the number of simultaneous measurements) in the semiconductor device test apparatus 1. For example, as shown in Fig. 5, a probe card 20B may include four probe heads 22. Fig. 5 is a partial cross-sectional view showing the semiconductor device test apparatus after the probe card and the holding unit are replaced in this embodiment.

[0083] In such a case, the holding unit 41 (see FIG. 1) corresponding to the two probe heads 22 may be removed from the moving device 42, and a holding unit 41B (see FIG. 5) corresponding to the four probe heads 22 may be attached to the moving device 42. As shown in FIG. 5, the holding unit 41B has four holding bodies 51, and the four holding bodies 51 are arranged so as to correspond to the four probe heads 22 included in the probe card 20B. In this way, when the probe card is replaced, the holding unit is replaced with one corresponding to the number and arrangement of the probe heads 22 included in the replaced probe card, so that the type of the DUT 100 can be easily replaced.

[0084] The first camera 36 is a camera that captures an image of the DUT 100 held by the holder 51 of the alignment device 40. As shown in Fig. 1 and Fig. 2, the first camera 36 is installed on the upper base 31 of the handler 30 so that its optical axis faces downward (-Z direction in the figure). A specific example of the first camera 36 is a camera equipped with an imaging element such as a CCD or a CMOS.

[0085] When the holder 51 holding the DUT 100 is moved by the moving device 42 to below the first camera 36, ​​the DUT 100 is imaged by the first camera 36. As shown in FIG. 4, the first camera 36 is electrically connected to the control device 80, and is capable of outputting captured image information to the control device 80.

[0086] The first height sensor 37 is a sensor that detects the height of a predetermined position of the DUT 100 held by the holder 51 of the alignment device 40. As shown in Fig. 1 and Fig. 2, the first height sensor 37 is installed so that its optical axis faces downward (-Z direction in the figure). Although not particularly limited, a specific example of the first height sensor 37 can be, for example, a laser displacement meter.

[0087] When the holder 51 holding the DUT 100 is moved by the moving device 42 to below the first height sensor 37, the first height sensor 37 detects the height of a predetermined position of the DUT 100. As shown in Fig. 4, the first height sensor 37 is electrically connected to the control device 80, and is capable of outputting the detected height of the predetermined position of the probe head 22 to the control device 80.

[0088] Here, specific examples of the predetermined positions of the DUT 100 detected by the first height sensor 37 include the four corners of the DUT 100. The predetermined positions of the DUT 100 are not limited to the above, as long as they are three or more mutually different positions on the DUT 100. Furthermore, the predetermined positions of the DUT 100 used to calculate the height of the DUT 100 may be the center of the DUT 100 instead of the four corners of the DUT 100.

[0089] The first camera 36 may detect the height of a predetermined position of the DUT 100 in addition to capturing an image of the DUT 100. In this case, the first height sensor 37 can be omitted.

[0090] Specifically, when the first camera 36 captures the image of the DUT 100, the height may be detected by focusing the first camera 36 on a predetermined position of the DUT 100 and determining the focal length when the image is focused. In this case, the first camera 36 is capable of outputting the height of the predetermined position of the DUT 100 to the control device 80. In this case, the first camera 36 corresponds to an example of a "first height sensor" in an aspect of the present invention.

[0091] The fixed arm 70 is a member that abuts against and supports one of the multiple holders 51 included in the alignment device 40. As shown in Fig. 1, the fixed arm 70 is provided on the lower base 34 of the handler 30 so as to face the second camera 53 and the second height sensor 54. As shown in Fig. 2, the fixed arm 70 includes a first extension portion 71 and a second extension portion 72. The fixed arm 70 corresponds to an example of a "support member" in an aspect of the present invention.

[0092] The first extending portion 71 is installed on the lower base 34 of the handler 30 so as to extend upward (in the +Z direction in the figure). In this manner, in this embodiment, the first extending portion 71 of the fixed arm 70 and the X-direction rail 421 of the moving device 42 of the alignment device 40 are fixed to the same member (specifically, the lower base 34). This lower base 34 corresponds to an example of a "base member" in this aspect of the present invention.

[0093] In this embodiment, the first extending portion 71 is provided on the lower base 34 so as to be located outside the pair of X-directional rails 421 of the moving device 42, but the first extending portion 71 may be disposed between the pair of X-directional rails 421. In this case, the fixed arm 70 is made movable up and down by an actuator, and is raised only when the fixed arm 70 is used to position the DUT 100, and is otherwise positioned below the X-directional rails 421.

[0094] The second extension portion 72 is supported at one end by the first extension portion 71 in a cantilever manner and extends in the horizontal direction (+Y direction in the figure). A tip portion 721 of the second extension portion 72 enters the space 524 through the window portion 525 of the holding member 52 as the moving device 42 of the alignment device 40 moves the holding unit 41 in the horizontal direction (moving in the X direction in the figure). Next, as the moving device 42 moves the holding member 52 down (moving in the -Z direction in the figure), the tip portion 721 of the second extension portion 72 abuts on the bottom of the holding body 51, and the fixed arm 70 supports the holding body 51. In this state, the moving device 42 moves the holding member 52 in the XY directions or rotates it around the Z direction, so that the holding body 51 can be moved relatively to the holding member 52.

[0095] The control device 80 is configured, for example, by a computer. Although not particularly shown, this computer is an electronic calculator equipped with a CPU (processor), a main storage device (RAM, etc.), an auxiliary storage device (hard disk, SSD, etc.), and an interface, etc. As shown in FIG. 4, this control device 80 functionally comprises an image processing unit 81, a position calculation unit 82, a parallelism calculation unit 83, a height calculation unit 84, and a drive control unit 85. These functions 81 to 85 are functionally realized by the processor executing a program installed in the control device 80. Note that this control device 80 may be configured by a circuit board instead of a computer.

[0096] The image processing unit 81 detects the position and orientation of the probe 23 of the probe head 22 by performing image processing on the image information output from the second camera 53. The image processing unit 81 also detects the position and orientation of the terminal 110 (see FIGS. 3 and 4) of the DUT 100 held by the holder 51 by performing image processing on the image information output from the first camera 36.

[0097] The position calculation section 82 calculates the amount of correction for the position of the DUT 100 relative to the probe head 22 based on the detection result of the image processing section 81 .

[0098] Specifically, the position calculation unit 82 calculates the amount of relative deviation of the positions of the terminals 110 of the DUT 100 with respect to the positions of the probes 23 of the probe head 22 from the detection result of the image processing unit 81, and calculates an amount of position correction to cancel this amount of deviation. That is, the position calculation unit 82 calculates the amount of position correction from the detection result of the image processing unit 81 to relatively match the positions of the probes 23 of the probe head 22 and the positions of the terminals 110 of the DUT 100.

[0099] The parallelism calculation section 83 detects the parallelism of the DUT 100 with respect to the probe head 22 based on the detection results of the first and second height sensors 37 and .

[0100] Specifically, the parallelism calculation unit 83 first obtains the height of a predetermined position of the probe head 22 from the second height sensor 54, and calculates the inclination of the probe head 22 from the height of the predetermined position of the probe head 22. Although not particularly limited, for example, the inclination of the probe head 22 is calculated by obtaining an intersection angle of a virtual plane passing through all the predetermined positions of the probe head 22 with respect to a reference plane. Furthermore, the parallelism calculation unit 83 obtains the height of a predetermined position of the DUT 100 from the first height sensor 37, and calculates the inclination of the DUT 100 from the height of the predetermined position of the DUT 100. For example, the inclination of the DUT 100 is calculated by obtaining an intersection angle of a virtual plane passing through all the predetermined positions of the DUT 100 with respect to a reference plane. Then, the parallelism calculation unit 83 calculates the relative tilt (parallelism) of the DUT 100 with respect to the probe head 22 from the tilt of the probe head 22 and the tilt of the DUT 100, and further calculates a tilt correction amount for the DUT 100 that cancels this relative tilt.

[0101] The height calculation section 84 detects the relative height of the DUT 100 with respect to the probe head 22 based on the detection results of the first and second height sensors 37, 54.

[0102] Specifically, the height calculation unit 84 first acquires the height of the predetermined position of the probe head 22 from the second height sensor 54. After the parallelism adjustment device 62 corrects the tilt of the DUT 100 based on the tilt correction amount, the height calculation unit 84 acquires the height of the predetermined position of the DUT 100 from the first height sensor 37. Next, the height calculation unit 84 calculates the relative height of the DUT 100 with respect to the probe head 22 from the height of the predetermined position of the probe head 22 and the height of the predetermined position of the DUT 100. Then, the height calculation unit 84 calculates the difference between this relative height and a predetermined value, and calculates a height correction amount for the DUT 100 that cancels the difference.

[0103] The drive control unit 85 controls the driving of the parallelism adjustment device 62, the height adjustment device 63, and the movement device 42 of the alignment device 40. The drive control unit 85 corresponds to an example of a "control device" in an aspect of the present invention.

[0104] For example, the drive control unit 85 drives and controls the moving device 42 based on the position correction amount calculated by the position calculation unit 82. The drive control unit 85 also drives and controls the parallelism adjustment device 62 based on the tilt correction amount calculated by the parallelism calculation unit 83. The drive control unit 85 also drives and controls the height adjustment device 63 based on the height correction amount calculated by the height calculation unit 84.

[0105] The drive control unit 85 is also electrically connected to the heater 611, the temperature sensor 613, and the coolant supply device 91. The drive control unit 85 adjusts the temperature of the DUT 100 by controlling the heater 611 and the coolant supply device 91 based on the detection result of the temperature sensor 613. The drive control unit 85 may control the heater 611 and the coolant supply device 91 based on the output of a temperature detection circuit included in the DUT 100, instead of the temperature sensor 613. Although not particularly limited, a specific example of the temperature detection circuit may be a circuit including a thermal diode included in the DUT 100.

[0106] Furthermore, the drive control unit 85 is electrically connected to a pressure reducing device 92. The drive control unit 85 controls the pressure reducing device 92, whereby the thermal chuck 61 of the holder 51 suction-holds the DUT 100 or releases the DUT 100.

[0107] The operation of the semiconductor device testing apparatus 1 in this embodiment will be described below with reference to Figures 1, 2, 6(a) and 6(b). Figures 6(a) and 6(b) are diagrams showing the positioning operation of the DUT 100 in this embodiment, with Figure 6(a) showing a state in which the fixed arm 70 abuts against the holder 51 and supports the holder 51, and Figure 6(b) showing a state in which the holder 51 is moved relative to the holding member 52.

[0108] 1, the moving device 42 of the alignment device 40 moves the holding unit 41 so that the holding body 51 is positioned below the opening 33 of the upper base 31 of the handler 30. In this state, the transport device 35 picks up the untested DUT 100 from a tray (not shown) and transports the DUT 100 to the holding body 51 through the opening 33.

[0109] Once the DUT 100 has been placed on the holder 51 by the transport device 35, the control device 80 drives the pressure reducing device 92, and the thermal chuck 61 of the holder 51 adsorbs and holds the DUT 100. Furthermore, once the DUT 100 has been placed on the holder 51, the control device 80 starts controlling the heater 611 and the coolant supply device 91 to adjust the temperature of the DUT 100. At this time, since the multiple holders 51 are each provided with a heater 611 and a cooling block 612, the temperatures of the multiple DUTs 100 can be adjusted with high precision.

[0110] 1, the moving device 42 moves the holding unit 41 so as to face the first camera 36 and the first height sensor 37 installed on the upper base 31 of the handler 30. By this operation, the tip portion 721 of the fixed arm 70 enters the space 524 of the holding member 52 through the window portion 525, and the tip portion 721 is positioned below one of the multiple holding bodies 51, as shown in FIG.

[0111] Next, the first height sensor 37 detects the heights of the four corners of the DUT 100. The heights of the four corners of the probe head 22 are detected in advance by the second height sensor 54 at the start of a lot or when the probe card 20 is replaced. The parallelism calculation unit 83 of the control device 80 calculates the tilt correction amount of the DUT 100 from these detection results.

[0112] Next, the parallelism adjusting device 62 of the holder 51 is driven to tilt the DUT 100 by the tilt correction amount described above. This cancels the relative tilt of the DUT 100 with respect to the probe head 22, and the DUT 100 becomes parallel to the probe head 22.

[0113] Next, the first height sensor 37 again detects the heights of the four corners of the DUT 100. The height calculation unit 84 of the control device 80 calculates the height correction amount of the DUT 100 from these detection results. At this time, the parallelism calculation unit 83 of the control device 80 may check whether or not the relative tilt of the DUT 100 with respect to the probe head 22 has been appropriately canceled.

[0114] In addition, when the height of the central part of the DUT 100 is detected as the predetermined position of the DUT 100 by the first height sensor 37, the height of the central part of the probe head 22 is detected in advance using the second height sensor 54 at the start of a lot, when the probe card 20 is replaced, etc.

[0115] Then, the height of the DUT 100 is adjusted by driving the height adjustment device 63 of the holder 51 by the above-mentioned height correction amount, and the displacement in the height direction of the DUT 100 caused by the tilt adjustment of the DUT 100 by the above-mentioned parallelism adjustment device 62 is cancelled. After this, the height of the DUT 100 at the predetermined position may be detected again by the first height sensor 37, and the height calculation unit 84 of the control device 80 may check whether the relative height of the DUT 100 with respect to the probe head 22 has reached a predetermined value.

[0116] Next, the first camera 36 captures an image of the DUT 100 held by the holder 51. The probe card 20 has been captured in advance by the second camera 53, and the position and orientation of the probe 23 of the probe head 22 of the probe card 20 have been detected in advance by the image processor 81. The timing for capturing an image of the probe card 20 by the second camera 53 is, for example, when the probe card is replaced in response to a change in the type of the DUT 100. The image processor 81 calculates a position correction amount for the DUT 100 from these detection results.

[0117] Next, as shown in Fig. 6(a), the control device 80 controls the moving device 42 to lower the holding member 52. As the holding member 52 lowers, the fixed arm 70 rises relative to the holding body 51, so that the tip portion 721 of the fixed arm 70 comes into contact with and supports the holding body 51. Then, as shown in Fig. 6(b), when the moving device 42 further lowers the holding member 52, the fixed arm 70 lifts the holding body 51, and the holding body 51 moves away from the upper plate 521 of the holding member 52.

[0118] Next, in a state where the holder 51 is separated from the holding member 52, the control device 80 drives the moving device 42 based on the above-mentioned position correction amount to move the holder 51 in the XY directions and rotate it around the Z direction. Here, since the inner diameter of the opening 526 of the holding member 52 is larger than the outer diameter of the lower part 642 of the base part 64 of the holder 51, the holder 51 is permitted to move and rotate relative to the holding member 52. By this moving operation, the DUT 100 is positioned relative to the probe head 22, and the positions of the probes 23 of the probe head 22 and the positions of the terminals 110 of the DUT 100 relatively coincide with each other.

[0119] When the positioning of the DUT 100 is completed, the control device 80 controls the moving device 42 to raise the holding member 52. This raising operation causes the fixed arm 70 to lower relative to the holding body 51, so that the holding body 51 is held by the holding member 52 and the tip portion 721 of the fixed arm 70 moves away from the holding body 51. After this, the first camera 36 may capture an image of the DUT 100 again, and the position calculation unit 82 of the control device 80 may check whether the positions of the probes 23 of the probe head 22 and the positions of the terminals 110 of the DUT 100 relatively match.

[0120] When the tilt correction, height correction, and positioning operations described above are completed for all DUTs 100 held by the holding unit 41, the moving device 42 moves the holding unit 41 so that the DUTs 100 face the probe heads 22 of the probe card 20, as shown by solid lines in Fig. 1. During this movement, the probe heads 22 of the probe card 20 may be imaged by the second camera 53. During this movement, the height of the probe heads 22 at a predetermined position may be detected by the second height sensor 54.

[0121] Next, the moving device 42 raises the holding unit 41, and simultaneously presses all of the DUTs 100 held by the holding bodies 51 of the holding unit 41 against the probe card 20. As a result, the terminals 110 of the DUTs 100 are electrically connected to the probes 23 of the probe head 22. In this state, the tester 10 tests the DUTs 100.

[0122] As described above, in this embodiment, each of the multiple holders 51 that hold a DUT 100 is individually equipped with a heater 611 and a cooling block 612 that adjusts the temperature of the DUT 100, so that the temperature of the multiple DUTs 100 can be adjusted with high precision.

[0123] In this embodiment, the holder 51, which is held movably by the holding member 52, is supported by the fixed arm 70, and the fixed arm 70 is moved by the moving device 42 relative to the holding member 52 to individually position the DUTs 100. This eliminates the need to provide a positioning actuator for each holder 51, and makes it possible to increase the number of simultaneous measurements while suppressing increases in costs.

[0124] In this embodiment, since the fixed arm 70 is moved relatively to the holding member 52 by the moving device 42, the number of actuators can be further reduced, leading to cost reduction. Moreover, since the only error factor related to the positioning of the DUT 100 is the fixed arm 70, the DUT 100 can be positioned with respect to the probe card 20 with high accuracy.

[0125] Furthermore, in this embodiment, since the holder 51 of the holding unit 41 is provided with the parallelism adjustment device 62, it is possible to cancel the relative inclination of the DUT 100 with respect to the probe head 22, and to suppress the occurrence of contact errors between the probe head 22 and the DUT 100. In particular, when the DUT 100 is a 2.5D device intermediate or a 3D device intermediate having a layered structure, the effect of suppressing the above-mentioned contact errors is remarkable.

[0126] Furthermore, in this embodiment, since the holding body 51 of the holding unit 41 is equipped with a height adjustment device 63, it is possible to cancel the height displacement of the DUT 100 caused by the parallelism adjustment of the DUT 100 by the parallelism adjustment device 62, and the occurrence of contact errors between the probe head 22 and the DUT 100 can be further suppressed.

[0127] Second Embodiment Fig. 7 is a side view showing an operation device 75 in the second embodiment of the present invention. Also, Fig. 8(a) to Fig. 8(c) are diagrams showing the positioning operation of the DUT 100 in this embodiment, Fig. 8(a) is a diagram showing a state in which a support member 755 of the operation device 75 is located below the holder 51, Fig. 8(b) is a diagram showing a state in which the support member 755 abuts against the holder 51 and the operation device 75 lifts up the holder 51, and Fig. 8(c) is a diagram showing a state in which the operation device 75 moves the holder 51 relative to the holder 52.

[0128] This embodiment differs from the first embodiment in that an operating device 75 is provided instead of the fixed arm 70, but other configurations are similar to those of the first embodiment. Below, only the differences between the semiconductor device testing apparatus in the second embodiment and the first embodiment will be described, and the same reference numerals will be used to denote portions having the same configuration as the first embodiment, and description thereof will be omitted.

[0129] 7, the operation device 75 in this embodiment is a device that directly operates the holder 51 to move the holder 51 relative to the holding member 52, and includes an X-direction rail 751, a Z drive unit 752, an expandable arm 753, a rotation drive unit 754, and a support member 755. This operation device 75 corresponds to an example of a "second moving device" and a "support member" in the aspects of the present invention.

[0130] The X-direction rail 751 is provided on the lower base 34 of the handler 30 and extends along the X-direction. The Z-drive unit 752 is slidably held on the X-direction rail 751 and can move along the X-direction. A telescopic arm 753 is attached to the Z-drive unit 752. The Z-drive unit 752 can raise and lower the telescopic arm 753. The telescopic arm 753 can be extended and retracted in the Y-direction and has a rotary drive unit 754 attached to its tip. A support member 755 that abuts against the holder 51 from below is attached to the rotary drive unit 754. The rotary drive unit 754 can rotate the support member 755 around the Z-axis.

[0131] As a result, the support member 755 is capable of moving in the X, Y and Z directions and rotating around the Z axis by the X-direction rail 751, the Z drive unit 752, the extendable arm 753, and the rotation drive unit 754.

[0132] In this embodiment, as shown in Fig. 8(a), the movement device 42 operates to cause the support member 755 to enter the space 524 of the holding member 52 and position itself below the holding body 51. Then, as shown in Fig. 8(b), the Z drive unit 752 operates to raise the support member 755 so that it abuts against the holding body 51 from below, thereby further lifting the holding body 51. Then, as shown in Fig. 8(c), the X-direction rail 751, the extendable arm 753, and the rotation drive unit 754 are driven to position the DUT 100 relative to the probe head 22.

[0133] In this embodiment, the support member 755 may be brought into contact with the holder 51 by lowering the holder 52 using the moving device 42. In addition, while the operation device 75 supports the holder 51, the moving device 42 may move the holder 52 in the XY directions or rotate it about the Z direction to position the DUT 100.

[0134] As described above, in this embodiment, similar to the first embodiment, the multiple holders 51 each holding a DUT 100 are each equipped with a heater 611 and a cooling block 612 for adjusting the temperature of the DUT 100, and therefore the temperature of the multiple DUTs 100 can be adjusted with high precision.

[0135] In this embodiment, the DUTs 100 are individually positioned by moving the holder 51 using the operation device 75 while the holder 51, which is held movably by the holding member 52, is supported by the operation device 75. This eliminates the need to provide a positioning actuator for each holder 51, and makes it possible to increase the number of simultaneous measurements while suppressing increases in costs.

[0136] The above-described embodiments are described to facilitate understanding of the present invention, and are not described to limit the present invention. Therefore, each element disclosed in the above embodiments is intended to include all design modifications and equivalents that fall within the technical scope of the present invention.

[0137] For example, the holding unit 41 may be provided with a positioning mechanism for individually positioning the multiple holding bodies 51. Furthermore, the holding body 51 does not have to be provided with both the parallelism adjustment device 62 and the height adjustment device 63, or it does not have to be provided with only the height adjustment device 63. [Explanation of symbols]

[0138] 1. Semiconductor device testing equipment 10…Tester 11...Test head 12…Mainframe 20,20B...Probe card 22…Probe head 30…Handler 36…First camera 37…First height sensor 40...Alignment device 41, 41B…Holding unit 51...Holding body 61...Thermal chuck 611…Heater 612…Cooling block 612b, 612c...Flow path 62…Parallelism adjustment device 621…First adjustment part 622…Second adjustment part 63…Height adjustment device 64…Base section 641...Flange 52...Retaining member 526…Aperture 53…Second camera 54…Second height sensor 42...Moving device 43…Bolt 70…Fixed arm 75...Operating device 80...Control device 81...Image processing unit 82...Position calculation section 83...Parallelism calculation section 84…Height calculation unit 85...Drive control unit 91... Refrigerant supply device 92...Decompression device 100…DUT 110...Terminal

Claims

1. A semiconductor device handling apparatus that moves a DUT and presses the DUT against a contact portion, comprising: a plurality of holders each arranged to correspond to the contact portion and each holding a corresponding one of the DUTs; A first moving device that moves the plurality of holders; A control device that controls the first moving device, each of the plurality of holders includes a temperature adjustment mechanism for adjusting a temperature of the DUT; The first moving device is a semiconductor device handling device that presses the DUTs held by the plurality of holders against the contact portions by lifting the plurality of holders.

2. 2. The semiconductor device handling apparatus of claim 1, The semiconductor device handling apparatus includes: A holding member that holds the plurality of holding bodies so as to be individually movable; The first moving device that moves the holding member; a support member that abuts against and supports one of the plurality of holders.

3. 3. The semiconductor device handling apparatus according to claim 2, the holding member has a plurality of holding holes into which the plurality of holding bodies are individually inserted, The holding member holds the holder inserted into the holding hole in a freely movable manner.

4. 3. The semiconductor device handling apparatus according to claim 2, The holding member is detachably attached to the first moving device.

5. 2. The semiconductor device handling apparatus of claim 1, The temperature adjustment mechanism includes: a heating device that contacts the DUT and heats the DUT; a cooling block having a flow path through which a coolant passes and supporting the heating device.

6. 6. The semiconductor device handling apparatus according to claim 5, the heating device includes a planar heater having a first surface in contact with the DUT and a second surface opposite to the first surface; The cooling block has a third surface in contact with the second surface.

7. 2. The semiconductor device handling apparatus of claim 1, a semiconductor device handling apparatus, wherein each of the plurality of holders is provided with a parallelism adjustment device for adjusting parallelism of the DUT with respect to the contact portion.

8. 8. A semiconductor device handling apparatus according to claim 7, The parallelism adjustment device is a first tilt adjustment device for tilting the DUT about a first axis; a second tilt adjustment device for tilting the DUT about a second axis; the first axis is an axis substantially parallel to a planar direction of the contact portion, A semiconductor device handling device, wherein the second axis is substantially parallel to a planar direction of the contact portion and is an axis substantially perpendicular to the first axis when the second axis is projected onto a normal direction of the contact portion.

9. 8. A semiconductor device handling apparatus according to claim 7, the semiconductor device handling apparatus includes a parallelism detection device for detecting parallelism of the DUT with respect to the contact portion, The control device of the semiconductor device handling apparatus controls the parallelism adjustment device based on the parallelism detected by the parallelism detection device.

10. 10. The semiconductor device handling apparatus of claim 9, The parallelism detection device includes: a first sensor for detecting a height of a predetermined position on the DUT; a second sensor that detects a height of a predetermined position on the contact portion; a parallelism calculation device that calculates a parallelism of the DUT with respect to the contact portion based on detection results of the first and second sensors, The control device controls the parallelism detection device based on the parallelism calculated by the parallelism calculation device.

11. 8. A semiconductor device handling apparatus according to claim 7, each of the plurality of holders includes a height adjustment device for adjusting a height of the DUT relative to the contact portion; the semiconductor device handling apparatus includes a height detection device that detects a height of the DUT relative to the contact portion, The control device of the semiconductor device handling apparatus controls the height adjustment device based on the height detected by the height detection device.

12. 12. A semiconductor device handling apparatus according to claim 11, The height detection device is a first sensor for detecting a height of a predetermined position on the DUT; a second sensor that detects a height of a predetermined position on the contact portion; a height calculation device that calculates a height of the DUT relative to the contact portion based on detection results of the first and second sensors, The control device controls the height adjustment device based on the height calculated by the height calculation device.

13. 2. The semiconductor device handling apparatus of claim 1, The DUT includes: Bare die only, A 2.5D device intermediate in which multiple bare dies are arranged side-by-side on a silicon interposer; or A semiconductor device handling device that is a 3D device intermediate having multiple bare dies stacked on top of each other.

14. 2. The semiconductor device handling apparatus of claim 1, The semiconductor device handling apparatus includes: A holding member that holds the plurality of holding bodies so as to be individually movable; The first moving device that moves the holding member; a support member that abuts against and supports one of the plurality of holders, the support member abuts against and supports the one of the holders as the holding member is moved by the first moving device, The control device controls the first moving device to move the holding member while the support member supports the one holder.

15. 2. The semiconductor device handling apparatus of claim 1, The semiconductor device handling apparatus includes: A holding member that holds the plurality of holding bodies so as to be individually movable; The first moving device that moves the holding member; a support member that abuts against and supports one of the plurality of holders; A second moving device that moves the support member, the support member abuts against and supports the one of the holders in accordance with the movement of the holding member by the first moving device or the movement of the supporting member by the second moving device; The control device controls the second moving device to move the support member while the support member supports the holder.

16. A semiconductor device test apparatus for testing a DUT, comprising: A semiconductor device handling apparatus according to any one of claims 1 to 15, a tester to which the contact portion is electrically connected.

Images