Connector and wafer assembly

Abstract

To provide a connector and a wafer assembly having a conductor density and small footprint needed for high data rate applications, while having electrical characteristics desired for transmission of data with integrity.SOLUTION: A connector 10 and a wafer assembly are described. The connector includes a housing and a wafer assembly. The wafer assembly includes a terminal row, a wafer mold insert, and a ground path assembly. The terminal row includes a plurality of terminal conductors, the ground path assembly includes a ground shield, and contact surface regions of the ground shield are terminated at surface regions of ground terminals included in the plurality of terminal conductors in the wafer assembly. In one example, the contact surface regions of the ground shield are laser welded to surfaces of the ground terminals. Shield extension regions of the ground shield also extend over signal terminals in the wafer assembly. The ground path assembly can also include both rigid and flexible shields in some cases.SELECTED DRAWING: Figure 1A

Description

[Technical field]

[0001] The present disclosure relates to a connector having a stiffening shield and further to a wafer assembly. [Background technology]

[0002] A range of input / output (I / O) connectors are designed for use in power, data and power and data interconnection systems, including board-to-board, wire-to-wire and wire-to-board systems. There are various designs for each type of system, depending on the requirements of the power and data communications environment in which the connector will be used. For example, wire-to-board systems include a free-end connector attached to the wire and a fixed-end connector attached to the board.

[0003] For example, for high data rate applications with limited physical space, designing an interconnect system connector can be challenging due to many competing considerations. High data rate interconnect systems typically rely on differentially coupled signal pairs, in which two conductors are arranged in a pair to transmit a differential signal. The transmitted signal is manifested by the electrical difference measured between the conductor pair. Differential signaling helps to avoid spurious signals and crosstalk, and to avoid unexpected signaling modes between adjacent signal pairs. At the connector interface, ground terminals are utilized to create an electrical ground return path, provide shielding between differential pairs, and can be used for other purposes.

[0004] Connectors used in high data rate applications are typically designed to meet a set of mechanical and electrical requirements. For example, high data rate connectors are often used in backplane applications that require very high conductor density and data rates. Connectors used in such applications typically include one or more wafer assemblies to meet the necessary mechanical and electrical requirements. The wafer assembly may include an insulating mesh that supports the terminal conductors in the wafer assembly. The use of wafer assemblies helps to manufacture connectors that can achieve high data rates using a set of different assembly processes. In either case, it remains challenging to design wafers and connectors that have the conductor density and small footprint required for high data rate applications in new systems while retaining the electrical properties required for full data transmission. Summary of the Invention

[0005] The present disclosure describes aspects of a connector having a reinforcement shield. An exemplary connector includes a housing and a wafer assembly. The wafer assembly includes a terminal row, a wafer mold insert, and a ground path assembly. The terminal row includes a plurality of terminal conductors, and the ground path assembly includes a ground shield, and a contact surface area of ​​the ground shield is terminated to a surface area of ​​a ground terminal of the plurality of terminal conductors in the wafer assembly. In one example, the contact surface area of ​​the ground shield is laser welded to a surface of the ground terminal. A shield extension area of ​​the ground shield also extends across the signal terminal in the wafer assembly. In some cases, the ground path assembly may further include a rigid shield and a flexible shield. The ground structure and ground path assembly are advantageous for higher data rate applications of the connector.

[0006] In another aspect of this embodiment, the ground shield includes a plurality of segments and bends between the plurality of segments, and a contact surface area of ​​each of the plurality of segments of the ground shield is terminated to a corresponding surface area of ​​a ground terminal on the wafer assembly. In another aspect, the contact surface area of ​​the rigid ground shield is terminated to a lower surface area of ​​the ground terminal on the wafer assembly, and the contact surface area of ​​the flexible ground shield is terminated to an upper surface area of ​​the ground terminal.

[0007] In another example, the wafer mold insert includes an interlocking flange and the housing includes latch fingers formed on a side of the housing. When the wafer assembly is inserted into the housing, the latch fingers of the housing engage in a mechanically interfering position with the interlocking flange of the wafer mold insert. In another example, the wafer mold insert includes an interlocking leg and the housing includes foot latch fingers formed on a bottom of the housing. When the wafer assembly is inserted into the housing, the foot latch fingers of the housing engage in a mechanically interfering position with the interlocking leg of the wafer mold insert. In another example, the wafer mold insert includes an interlocking flange and the housing includes latch fingers and wafer datum tracks formed on a side of the housing. When the wafer assembly is inserted into the housing, the interlocking flange of the wafer mold insert slides into the wafer datum tracks of the housing and the latch fingers of the housing engage in a mechanically interfering position with the interlocking flange of the wafer mold insert.

[0008] In another aspect, the connector further includes a second wafer assembly. The second wafer assembly includes a second terminal row, a second wafer mold insert, and a second ground path assembly. The second wafer mold insert includes a positioning receptacle, the wafer mold insert includes a positioning post, and the positioning post of the wafer assembly extends into the positioning receptacle of the second wafer assembly. A ground shield of the wafer assembly may extend between the terminal row of the wafer assembly and the second terminal row of the second wafer assembly.

[0009] An exemplary wafer assembly includes a terminal array, a wafer mold insert, and a ground path assembly. The terminal array includes a plurality of terminal conductors. The ground path assembly includes a rigid ground shield and a flexible ground shield. A contact surface area of ​​the rigid ground shield is terminated to a first surface area of ​​a ground terminal of the plurality of terminal conductors in the wafer assembly, and a contact surface area of ​​the flexible ground shield is terminated to a second surface area of ​​the ground terminal of the wafer assembly. In another aspect, a shield extension area of ​​the rigid ground shield extends across a signal terminal of the plurality of terminal conductors in the wafer assembly, and a shield extension area of ​​the flexible ground shield extends across the signal terminal of the wafer assembly. In another aspect, a contact surface area of ​​the rigid ground shield is terminated to a lower surface area of ​​the ground terminal of the wafer assembly, and a contact surface area of ​​the flexible ground shield is terminated to an upper surface area of ​​the ground terminal of the wafer assembly.

[0010] Another exemplary connector includes a housing, a first wafer assembly, and a second wafer assembly, the first wafer assembly including a first row of terminals, a first wafer mold insert, and a first ground path assembly, the second wafer assembly including a second row of terminals, a second wafer mold insert, and a second ground path assembly, the first ground path assembly including a first ground shield, and the second ground path assembly including a second ground shield, a contact surface area of ​​the first ground shield terminated to a first surface area of ​​a ground terminal of the first row of terminals of the first wafer assembly, and a contact surface area of ​​the second ground shield terminated to a second surface area of ​​a ground terminal of the second row of terminals of the second wafer assembly.

[0011] In another aspect, the first wafer mold insert includes a first interlocking flange and the second wafer mold insert includes a second interlocking flange. The housing further includes a first latch finger portion and a second latch finger portion formed on a side of the housing. When the first wafer assembly and the second wafer assembly are inserted into the housing, the first latch finger portion of the housing engages into a mechanically interfering position with the first interlocking flange and the second latch finger portion of the housing engages into a mechanically interfering position with the second interlocking flange. In another aspect, the second wafer mold insert includes a positioning receptacle, the first wafer mold insert includes a positioning post, and the positioning post extends into the positioning receptacle to align the first wafer assembly and the second wafer assembly. [Brief description of the drawings]

[0012] Many aspects of the present disclosure can be better understood with reference to the following drawings, in which elements are not necessarily to scale, emphasis instead being placed upon clearly illustrating the principles of the present disclosure, and in which like reference numerals represent corresponding parts in the several views.

[0013] [Figure 1A] It is a top perspective view showing an exemplary connector according to various embodiments of the present disclosure. [Figure 1B] It is a bottom perspective view showing the connector shown in FIG. 1A according to various embodiments of the present disclosure. [Figure 1C] It is a front view showing the connector shown in FIG. 1A according to various embodiments of the present disclosure. [Figure 1D] It is a cross-sectional view showing the housing of the connector denoted as A-A in FIG. 1A according to various embodiments of the present disclosure. [Figure 2A] It is a top perspective view showing an exemplary wafer assembly of the connector shown in FIG. 1A according to various embodiments of the present disclosure. [Figure 2B] It is a bottom perspective view showing the wafer assembly shown in FIG. 2A according to various embodiments of the present disclosure. [Figure 2C] It is a side view showing the wafer assembly shown in FIG. 2A according to various embodiments of the present disclosure. [Figure 3A] It is a top perspective view showing the wafer assembly of the connector shown in FIG. 2A according to various embodiments of the present disclosure. [Figure 3B] It is a top perspective view showing the wafer assembly of the connector shown in FIG. 2A according to various embodiments of the present disclosure. [Figure 3C] It is a bottom perspective view showing the wafer assembly shown in FIG. 3B according to various embodiments of the present disclosure. [Figure 4A] It is an exploded view showing a part of the wafer assembly of the connector shown in FIG. 1A according to various embodiments of the present disclosure. [Figure 4B] It is an exploded view showing a part of another wafer assembly of the connector shown in FIG. 1A according to various embodiments of the present disclosure. [Figure 4C] It is an exploded view showing a part of another wafer assembly of the connector shown in FIG. 1A according to various embodiments of the present disclosure. [Figure 4D]1B is a partially exploded view illustrating another wafer assembly of the connector shown in FIG. 1A according to various embodiments of the present disclosure. [Diagram 5] 1D according to various embodiments of the present disclosure. FIG. 1C is a cross-sectional view showing the connector labeled BB in FIG. [Figure 6] FIG. 13 is a top perspective view illustrating an exemplary connector according to another embodiment of the present disclosure. [Figure 7] 7 is a bottom perspective view showing the connector shown in FIG. 6 according to another embodiment of the present disclosure. FIG. [Figure 8] 13 is an exploded top perspective view showing a connector housing according to another embodiment of the present disclosure. FIG. [Figure 9] 13 is an exploded bottom perspective view showing a connector housing according to another embodiment of the present disclosure. FIG. [Figure 10] 11A to 11C are perspective views showing different angles of the internal structure of a connector housing according to another embodiment of the present disclosure. [Figure 11] 11A to 11C are perspective views showing different angles of the internal structure of a connector housing according to another embodiment of the present disclosure. [Figure 12] 13A and 13B are exploded top and bottom perspective views, respectively, showing a wafer assembly of a connector according to another embodiment of the present disclosure. [Figure 13] 13A and 13B are exploded top and bottom perspective views, respectively, showing a wafer assembly of a connector according to another embodiment of the present disclosure. [Figure 14] 11A and 11B are a perspective view and a schematic cross-sectional view, respectively, of an assembled first wafer, second wafer, third wafer, and fourth wafer of a connector according to another embodiment of the present disclosure. [Figure 15] 11A and 11B are a perspective view and a schematic cross-sectional view, respectively, of an assembled first wafer, second wafer, third wafer, and fourth wafer of a connector according to another embodiment of the present disclosure. [Figure 16A] FIG. 13 is an overall schematic top view showing a connector according to another embodiment of the present disclosure. [Figure 16B]16B is a cross-sectional view taken along line AA of FIG. 16A showing a connector according to another embodiment of the present disclosure. [Figure 17] FIG. 13 is a schematic diagram showing another embodiment of a flexible shield. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] Connectors are typically designed to meet a set of mechanical and electrical requirements. As an example, high data rate connectors are often used in backplane applications that require very high conductor density and data rates. Connectors used in such applications typically include one or more wafer assemblies to meet the necessary mechanical and electrical requirements. The wafer assembly may include an insulating mesh that supports the terminal conductors in the wafer assembly. The use of wafer assemblies helps to produce connectors that can achieve high data rates using a set of different assembly processes. In either case, it remains challenging to design wafers and connectors that have the conductor density and small footprint required for high data rate applications in new systems while retaining the electrical properties required for full data transmission.

[0015] In the above context, the present disclosure describes aspects and embodiments of a connector having a reinforcement shield. An exemplary connector includes a housing and a wafer assembly. The wafer assembly includes a terminal row, a wafer mold insert, and a ground path assembly. The terminal row includes a plurality of terminal conductors, and the ground path assembly includes a ground shield, and a contact surface area of ​​the ground shield is terminated to a surface area of ​​a ground terminal of the plurality of terminal conductors in the wafer assembly. In one example, the contact surface area of ​​the ground shield is laser welded to a surface of the ground terminal. A shield extension area of ​​the ground shield also extends across the signal terminal in the wafer assembly. In some cases, the ground path assembly may further include a rigid ground shield and a flexible ground shield. The ground structure and the ground path assembly are advantageous for higher data rate applications of the connector.

[0016] Referring to the drawings, FIG. 1A shows a perspective view of an exemplary connector 10 (also referred to as "connector 10") according to various embodiments of the present disclosure. FIG. 1B shows a bottom perspective view of connector 10, and FIG. 1C shows a front view of connector 10. Connector 10 is shown to have a length, width, and height in the orientation shown in FIG. 1A. However, connector 10 is shown as a representative example and is not drawn to any particular proportion or size. The shape, size, proportions, and other features of connector 10 may differ from those shown. For example, connector 10 may accommodate larger or smaller terminal rows (e.g., wider or narrower terminal rows), and other variations are also within the scope of the examples described in this disclosure. In some cases, multiple connectors similar to connector 10 may be arranged side-by-side for higher data rate interconnections. Also, as shown and described in this disclosure, one or more parts or components of connector 10 may be omitted in some cases. Connector 10 may further include other parts or components not shown.

[0017] 1A-1C, connector 10 includes a front port opening 12 and terminal pins 13. Connector 10 is designed to establish and maintain an electrical connection with contacts on a free end interface of a cable assembly. For example, a printed circuit board (PCB) type interface, such as a Small Form Factor Pluggable (SFP), Octal Small Form Factor Pluggable (OSFP), Quad Small Form Factor Pluggable (QSFP) or cable assembly, can be inserted into front port opening 12 of connector 10.

[0018] Connector 10 includes a terminal row of terminal conductors extending from a front port opening 12 to a terminal pin 13 for communication of data signals on the terminal conductors. Connector 10 includes several structural features to align and hold the position of the terminal conductors within connector 10. Connector 10 is further designed to provide a shield to maintain the signal integrity of differential signals on the terminal conductors when the terminal conductors extend from the front port opening 12 to the terminal pin 13. Connector 10 may further be designed to be used with SFP, OSFP, QSFP, and related interconnect systems, but the concepts described in this disclosure are not limited to being used with any particular type or style of interconnect system. The terminal pins 13 of connector 10 are designed as surface mount technology (SMT) pins for connection to contact pads on the surface of a printed circuit board (PCB), but in some cases, connector 10 may be designed to have through-hole leads or other lead types at the terminal pins 13.

[0019] As shown in FIGS. 1A - 1C, connector 10 includes a housing 100. In one example, housing 100 may be formed of plastic or other insulating material, but in some cases, the housing may be formed of a combination of insulating and conductive materials. Housing 100 may be formed by any suitable additive or subtractive manufacturing technique (e.g., molding, injection molding, printing, and other techniques). In some cases, one or more plating metals may be plated on the outer surface or certain surface regions of housing 100 for conductivity, and housing 100 may, in some cases, be implemented as a plated plastic member.

[0020] Housing 100 includes a bottom mounting surface 110, a back surface 112, mounting posts 122 and 124, solder rings 126 and 128, and other features described below. Connector 10 is adapted to accept a PCB-style tip of an SFP, OSFP, QSFP, or related connector module at the end of a cable assembly. The PCB-style tip of the cable assembly is mountable in front port opening 12 of connector 10. Upon insertion, an array of terminals of a wafer assembly within housing 100 abuts and makes electrical contact with contacts on the surface of the PCB-style tip.

[0021] The mounting posts 122 and 124 extend downwardly from the bottom mounting surface 110 of the housing 100. In one example, the mounting posts 122 and 124 can be integrally formed of the same insulating material as the remainder of the housing 100. However, in other cases, the mounting posts 122 and 124 can be formed of a different material (e.g., a conductive metal) than the remainder of the housing 100, and the remainder of the housing 100 can be molded around the mounting posts 122 and 124. The mounting posts 122 and 124 can be inserted through openings or holes (e.g., mounting holes, plated through holes, etc.) in a PCB board, and the housing 100 is surface mounted to the PCB board. The solder rings 126 and 128 are formed (e.g., pressed, sheared, or otherwise formed) from a piece of metal, and in some cases may be plated. The mounting posts 122 and 124 extend through central holes in the solder rings 126 and 128. Housing 100 may be molded around solder rings 126 and 128, or solder rings 126 and 128 may be inserted into housing 100 after housing 100 is molded. In instances where the exterior surface of housing 100 is plated to be conductive, solder rings 126 and 128 may be electrically connected to the outer conductive surface of housing 100.

[0022] Figure 1D shows a cross-sectional view 100 of the housing of connector 10, designated AA in Figure 1A. As mentioned above, connector 10 includes a number of wafer assemblies located within housing 100. In the illustration of Figure 1D, these wafer assemblies are omitted so as to show the internal features within housing 100. The housing includes an interior space region 102 in which the wafer assemblies are positioned and secured when connector 10 is assembled.

[0023] As shown in FIG. 1D, the housing 100 includes wafer reference passages 130-132 formed in a side of the housing 100 and wafer reference passages 133-135 formed in another opposite side of the housing 100. The housing 100 further includes a wafer reference passage 136 located in a side of the housing 100 and a similar wafer reference passage (not shown in FIG. 1D) located in the opposite side of the housing 100. The wafer reference passages 130-136 (also referred to as "channels 130-136") are formed as recessed channels in the interior region 102 of the housing 100 at the side of the housing 100. The channels 130-136 extend from the rear surface 112 toward the front port opening 12 within the interior region 102 of the housing 100. The length, width, and depth of the channels 130-136 may vary depending on the embodiment. In some cases, the orientation of the channels 130-136 may be different than that shown. Channels 130-136 are configured to mate with guide and interlock flanges of the wafer assembly of connector 10 to position and secure the wafer assembly in place within interior region 102 of housing 100, as described in more detail below.

[0024] The housing 100 further includes openings 140 and 142 (see FIG. 1A) through a side of the housing 100 and openings 144 and 146 (see FIG. 1B) through the other opposite side of the housing 100. The openings 140, 142, 144 and 146 extend from the exterior of the housing 100 to the interior region 102 within the housing 100. The openings 140, 142, 144 and 146 extend from the exterior of the housing 100 to the interior region 102 within the housing 100. The latch fingers are in a cantilevered arrangement and extend into each of the openings 140, 142, 144 and 146. In particular, the latch fingers 150, 152, 154 and 156 are in a cantilevered arrangement and extend from a side edge or wall of the openings 140, 142, 144 and 146, respectively. Latch finger portions 150, 152, 154 and 156 are integrally formed with housing 100 from the same material as housing 100 in the illustrated example, although latch finger portions 150, 152, 154 and 156 may be formed from other materials and positioned or assembled with housing 100 in other manners.

[0025] Latch fingers 150, 152, 154 and 156 are cantilevered and formed of a relatively compliant (e.g., polymer) material such that they may flex to a certain degree when force is applied. Latch fingers 150, 152, 154 and 156 are also resilient and will return to the positions shown in Figures 1A and 1B when such force is released. Latch fingers 150, 152, 154 and 156 are designed to mechanically interface with and interfere with interlocking flanges of a wafer assembly of connector 10 to secure the wafer assembly in place within interior region 102 of housing 100, as described in more detail below.

[0026] Housing 100 further includes openings 147 and 148 (see FIG. 1B) extending through the bottom of housing 100. Openings 147 and 148 extend from the exterior of housing 100 to interior region 102 within housing 100. Leg latch fingers are in a cantilevered arrangement and extend into each of openings 147 and 148. In particular, leg latch fingers 157 and 158 are in a cantilevered arrangement and extend from the perimeter of openings 147 and 148, respectively. Leg latch fingers 157 and 158 are integrally formed with housing 100 from the same material as housing 100 in the illustrated example, although leg latch fingers 157 and 158 may be formed from other materials and may be arranged or assembled with housing 100 in other manners. The leg latch fingers 157 and 158 mechanically mate and interfere with interlocking legs of the wafer assembly within the housing 100 to retain and secure the wafer assembly in place, as described in more detail below with reference to FIG. 5.

[0027] FIG. 2A shows a top perspective view of exemplary wafer assemblies 200, 300, 400, and 500 of the connector 10 shown in FIG. 1A, with the housing 100 omitted from the illustration. FIG. 2B shows a bottom perspective view of the wafer assemblies 200, 300, 400, and 500, and FIG. 2C shows a side view of the wafer assemblies 200, 300, 400, and 500. The wafer assemblies 200, 300, 400, and 500 are shown as representative examples and are not drawn to any particular scale or size. FIG. 3A shows a top perspective view of the wafer assemblies 200 and 500 of the connector 10 shown in FIG. 2A. FIG. 3B shows a top perspective view of the wafer assemblies 300 and 400, and FIG. 3C shows a bottom perspective view of the wafer assemblies 300 and 400. The shapes, sizes, proportions, and other features of the wafer assemblies 200, 300, 400, and 500 may differ from those shown. For example, the wafer assemblies 200, 300, 400, and 500 can accommodate larger or smaller terminal rows (e.g., wider or narrower terminal rows), and other variations are within the scope of the examples described in this disclosure. Also, in some cases, one or more parts or members of the wafer assemblies 200, 300, 400, and 500 illustrated and described in this disclosure can be omitted. The wafer assemblies 200, 300, 400, and 500 may further include other parts or members not shown. Below, the wafer assemblies 200, 300, 400, and 500 of the connector 10 will be introduced with reference to Figures 2A-2C and 3A-3C, and then detailed illustrations of the wafer assemblies 200, 300, 400, and 500 will be described with reference to Figures 4A-4D.

[0028] 2A to 2C and 3A to 3C, the wafer assembly 200 includes a terminal row 210, a wafer mold insert 230, and other members described below. The wafer assembly 200 supports, spaces, and aligns the terminal conductors of the terminal row 210. The wafer assembly 300 includes a terminal row 310, a wafer mold insert 330, and other members described below. The wafer assembly 300 supports, spaces, and aligns the terminal conductors of the terminal row 310. The wafer assembly 400 includes a terminal row 410, a wafer mold insert 430, a wafer mold insert 430A, and other members described below. The wafer assembly 400 supports, spaces, and aligns the terminal conductors of the terminal row 410. The wafer assembly 500 includes a terminal row 510, a wafer mold insert 530, a wafer mold insert 530A, and other members described below. Wafer assembly 500 supports, spaces and aligns terminal conductors in terminal array 510. Each wafer assembly 200, 300, 400 and 500 further includes a ground path assembly, which includes one or more shields. The ground path assemblies of wafer assemblies 200, 300, 400 and 500 are described in further detail below.

[0029] Each terminal row 210, 310, 410, and 510 includes a row of terminal conductors, including signal conductors, power conductors, and ground conductors. Each of the signal and power conductors in the terminal rows 210, 310, 410, and 510 includes a lead contact at one distal end (i.e., located in the front port opening 12 of the connector 10 shown in FIGS. 1A-1D), a tail contact at the other distal end (i.e., located at the terminal pin 13), and one or more conductor bends located between the lead and tail contacts. The signal and power conductors in the terminal rows 210, 310, 410, and 510 are electrically isolated from each other within the connector 10. The signal and power conductors extend from the lead contacts at the front port opening 12 to the tail contacts at the terminal pin 13 of the connector 10. The tail contacts of the signal and power conductors may be SMT tail contacts (as shown in the example) or through-hole or other types of contacts. Each of the ground conductors in terminal rows 210, 310, 410 and 510 includes a lead contact at one distal end and a tail contact at the other distal end. The ground conductors extend from the lead contacts in the front port opening 12 to the tail contacts at the terminal pins 13 of the connector 10.

[0030] 2A and 2B, the terminal row 210 includes a first group 210A of terminal conductors, a second group 210B of terminal conductors, and a central group 210C of terminal conductors located between the first group 210A and the second group 210B. The groups 210A and 210B include ground conductors and signal conductors. For example, the group 210A includes a ground conductor 211, a differential pair of signal conductors 212 and 213, and a ground conductor 214. The conductors 211-214 include lead contacts 211A-214A, respectively, located at the front port opening 12 of the connector 10, and tail contacts 211B-214B, respectively, located at the terminal pins 13 of the connector 10. The conductors 211 and 214 are ground conductors of the terminal row 210, and the conductors 212 and 213 are signal conductors of the terminal row 210. As shown, the signal conductors 212 and 213 are located between the ground conductors 211 and 214. Each terminal conductor in terminal row 210 includes a conductor bend located between a lead contact and a tail contact.

[0031] 3A and 3B, the terminal row 310 includes a first group 310A of terminal conductors, a second group 310B of terminal conductors, and a central group 310C of terminal conductors located between the first group 310A and the second group 310B. The groups 310A and 310B include ground conductors and signal conductors. For example, also referring to FIG. 3B, the group 310A includes a ground conductor 311, a differential pair of signal conductors 312 and 313, and a ground conductor 314. The conductors 311-314 include lead contacts 311A-314A, respectively, located at the front port opening 12 of the connector 10, and tail contacts 311B-314B, respectively, located at the terminal pins 13 of the connector 10. The conductors 311 and 314 are ground conductors in the terminal row 310, and the conductors 312 and 313 are signal conductors in the terminal row 310. As shown, signal conductors 312 and 313 are located between ground conductors 311 and 314. Each terminal conductor in terminal row 310 includes a conductor loop located between a lead contact and a tail contact.

[0032] 3B and 3C, the terminal row 410 includes a first group 410A of terminal conductors, a second group 410B of terminal conductors, and a central group 410C of terminal conductors located between the first group 410A and the second group 410B. The groups 410A and 410B include ground conductors and signal conductors. For example, also referring to FIG. 3C, the group 410A includes a ground conductor 411, a differential pair of signal conductors 412 and 413, and a ground conductor 414. The conductors 411-414 include lead contacts 411A-414A located at the front port opening 12 of the connector 10, respectively, and tail contacts 411B-414B located at the terminal pins 13 of the connector 10, respectively. The conductors 411 and 414 are ground conductors in the terminal row 410, and the conductors 412 and 413 are signal conductors in the terminal row 410. As shown, signal conductors 412 and 413 are located between ground conductors 411 and 414. Each terminal conductor in terminal row 410 includes a conductor loop located between a lead contact and a tail contact.

[0033] 2A and 2B, the terminal row 510 includes a first group 510A of terminal conductors, a second group 510B of terminal conductors, and a central group 510C of terminal conductors located between the first group 510A and the second group 510B. The groups 510A and 510B include ground conductors and signal conductors. For example, the group 510A includes a ground conductor 511, a differential pair of signal conductors 512 and 513, and a ground conductor 514. The conductors 511-514 include lead contacts 511A-514A located at the front port opening 12 of the connector 10, respectively, and tail contacts 511B-514B located at the terminal pins 13 of the connector 10, respectively. The conductors 511 and 514 are ground conductors in the terminal row 510, and the conductors 512 and 513 are signal conductors in the terminal row 510. As shown, the signal conductors 512 and 513 are located between the ground conductors 511 and 514. Each terminal conductor in terminal row 510 includes a conductor bend located between a lead contact and a tail contact.

[0034] Group 210A of terminal row 210 includes seven terminal conductors, four signal conductors and three ground conductors, with each pair of signal conductors located side-by-side between two ground conductors. Central group 210C of terminal conductors includes power conductors and may include ground or signal conductors in some cases. Group 210B is similar to group 210A, but is located on the other side of central group 210C. Compared to terminal row 210, each terminal row 310, 410, and 510 includes a similar arrangement of signal conductors, ground conductors, and power conductors. However, the length, curvature, and other characteristics of each of the terminal conductors in terminal rows 210, 310, 410, and 510 may differ from each other.

[0035] The lead contacts of terminal row 210 are directed toward the lead contacts of terminal row 510. The lead contacts of terminal row 310 are directed toward the lead contacts of terminal row 410. In one example, the pitch between the lead contacts of each of terminal rows 210, 310, 410, and 510 is all the same. However, the terminal conductors of terminal row 210 may be offset relative to the terminal conductors of terminal row 510 such that the lead contacts are offset between the rows. The terminal conductors of terminal row 310 may be offset relative to the terminal conductors of terminal row 410 such that the lead contacts are offset between the rows. In other cases, the terminal conductors of terminal rows 210 and 510 may have the same pitch and be aligned (i.e., do not cross) relative to one another. In other cases, the terminal conductors of terminal rows 210 and 510 may have different lead contact pitches. Similarly, the terminal conductors of terminal rows 310 and 410 may have the same pitch and be aligned with one another, or the terminal rows 310 and 410 may have different lead contact pitches.

[0036] The wafer mold insert 230 of the wafer assembly 200 may be formed of plastic (e.g., liquid crystal polymer (LCP), polyethylene (PE), polytetrafluoroethylene (PTFE), fluoropolymer, or other plastic or insulating material) and molded around the terminal conductors of the terminal array 210. For example, the lead frame including the terminal array 210 may be formed (e.g., pressed, sheared, or otherwise formed) from a metal plate to form the lead frame. In some cases, the metal plate may be plated with one or more plating metals. The lead frame and terminal array 210 may be pressed or bent into the shape of the terminal array 210. The lead frame including the terminal array 210 may then be placed into a mold, and a plastic material may be injected into the mold to form the wafer mold insert 230 around the terminal array 210. The terminal array 210 may then be sheared or cut from the lead frame, and each terminal conductor of the terminal array 210 may be further bent or otherwise formed into the shape shown in the figures.

[0037] The wafer mold insert 230 of the wafer assembly 200 supports the terminal conductors by maintaining the spacing between the terminal conductors in the terminal row 210. The wafer mold insert 230 further includes structural features for positioning and fixing the wafer assembly 200 within the housing 100 of the connector 10. More specifically, the wafer mold insert 230 includes guide flanges 232 and 233 for guiding the wafer assembly 200 within the housing 100 during assembly of the connector 10, as described in more detail below. In the illustrated example, the guide flanges 232 and 233 are shaped like rectangular cubes and include a chamfer or edge located on the front side, although the size and shape of the guide flanges 232 and 233 may vary depending on the embodiment. The guide flange 233 is sized to fit and slide within the wafer reference passage 136 (see FIG. 1D ) of the housing 100 with minimal clearance, and the guide flange 232 is sized to fit and slide within a similar wafer reference passage of the housing 100. During assembly of connector 10, wafer assembly 200 is positioned to align guide flanges 232 and 233 with the wafer datum tracks of housing 100. Wafer assembly 200 may then be inserted into interior region 102 of housing 100 along direction "D" shown in FIG. 1D , and guide flanges 232 and 233 may slide within the wafer datum tracks of housing 100.

[0038] Wafer mold insert 230 further includes interlocking legs 234 and 235 for positioning and securing wafer assembly 200 within housing 100 of connector 10. Interlocking legs 234 and 235 are formed in a rectangular cube shape, although the size and shape of interlocking legs 234 and 235 may vary among different embodiments. Interlocking legs 234 and 235 are designed to mechanically mate with leg latch fingers 157 and 158 of housing 100, as described in more detail below with reference to FIG.

[0039] The wafer mold insert 230 further includes an interlock nose 239 for positioning the wafer assembly 200 in the housing 100 of the connector 10. The interlock nose 239 is formed as an elongated nose located at the relative center of the wafer assembly 200. When the connector 10 is assembled, the interlock nose 239 is fitted into and extends into a corresponding positioning recess 137 (see FIG. 1D ) in the housing 100. That is, when the connector 10 is assembled, the interlock nose 239 is fitted into and occupies the positioning recess 137, with a minimal gap between the outer surface of the interlock nose 239 and the inner surface of the positioning recess 137 in the housing 100.

[0040] The wafer mold insert 330 of the wafer assembly 300 may be formed of a plastic (e.g., LCP, PE, PTFE, fluoropolymer, or other plastic or insulating material) and molded around the terminal conductors of the terminal array 310. For example, the lead frame including the terminal array 310 may be formed (e.g., pressed, sheared, or otherwise formed) from a metal plate to form the lead frame. In some cases, the metal plate may be plated with one or more plating metals. The lead frame and terminal array 310 may be pressed or bent into the shape of the terminal array 310. The lead frame including the terminal array 310 may then be placed into a mold, and a plastic material may be injected into the mold to form the wafer mold insert 330 around the terminal array 310. The terminal array 310 may then be sheared or cut from the lead frame, and each terminal conductor of the terminal array 310 may be further bent or otherwise formed into the shape shown in the figures.

[0041] The wafer mold insert 330 of the wafer assembly 300 supports the terminal conductors by maintaining the spacing between the terminal conductors in the terminal row 310. The wafer mold insert 330 further includes structural features for positioning and fixing the wafer assembly 300 within the housing 100 of the connector 10. More specifically, the wafer mold insert 330 includes interlock flanges 332 and 333 (see FIG. 3C) located on opposite sides of the wafer mold insert 330. In the illustrated example, the shapes of the interlock flanges 332 and 333 are formed into rectangular cubes and include chamfers or edges, although the size and shape of the interlock flanges 332 and 333 may vary depending on the embodiment. When the connector 10 is assembled, the interlock flanges 332 and 333 are sized to fit and slide within the wafer reference passages 131 and 134 of the housing 100, respectively, with minimal clearance therebetween.

[0042] The interlocking flanges 332 and 333 are further designed to mechanically join the latching finger portions 152 and 156, respectively, and lock within the housing 100. As described above, the latching finger portions 152 and 156 will bend to a certain extent when a force is applied thereto. The latching finger portions 152 and 156 are also resilient, and will return to the positions shown in FIGS. 1A and 1B when such force is released. During assembly of the connector 10, the wafer assembly 300 is positioned to align the interlocking flanges 332 and 333 with the wafer reference passages 131 and 134 of the housing 100. The wafer assembly 300 may then be inserted into the interior region 102 of the housing 100 along the direction "D" shown in FIG. 1D, and the interlocking flanges 332 and 333 may slide within the wafer reference passages 131 and 134 of the housing 100. As the interlocking flanges 332 and 333 slide within the wafer reference passages 131 and 134, the interlocking flanges 332 and 333 interfere with the tips or ends of the latch finger portions 152 and 156, pushing the latch finger portions 152 and 156 out from within the openings 142 and 146. As the interlocking flanges 332 and 333 are pushed past the tips or ends of the latch finger portions 152 and 156, the latch finger portions 152 and 156 quickly return behind the interlocking flanges 332 and 333 of the wafer mold insert 330 of the wafer assembly 300, allowing the wafer assembly 300 to be secured in place within the housing 100.

[0043] Wafer mold inserts 430 and 430A of wafer assembly 400 may be formed of plastic (e.g., LCP, PE, PTFE, fluoropolymer, or other plastic or insulating material) and molded around terminal conductors of terminal array 410. For example, a lead frame including terminal array 410 may be formed (e.g., pressed, sheared, or otherwise formed) from a metal plate to form the lead frame. In some cases, the metal plate may be plated with one or more plating metals. The lead frame and terminal array 410 may be pressed or bent into the shape of terminal array 410. The lead frame including terminal array 410 may then be placed into a mold, and a plastic material may be injected into the mold to form wafer mold inserts 430 and 430A around terminal array 410. Terminal array 410 may then be sheared or cut from the lead frame, and each terminal conductor of terminal array 410 may be further bent or otherwise formed into the shape shown in the figures.

[0044] Wafer mold inserts 430 and 430A of wafer assembly 400 support terminal conductors by maintaining spacing between terminal conductors in terminal row 410. Wafer mold inserts 430 and 430A further include structural features for positioning and securing wafer assembly 400 within housing 100 of connector 10. More specifically, wafer mold insert 430 includes interlock flanges 432 and 433 (see FIG. 3B) located on opposite sides of wafer mold insert 430. In the illustrated example, interlock flanges 432 and 433 are shaped like rectangular cubes and include chamfers or edges, although the size and shape of interlock flanges 432 and 433 may vary in different embodiments. When connector 10 is assembled, interlock flanges 432 and 433 are sized to fit and slide within wafer reference passages 132 and 135 of housing 100, respectively, with minimal clearance therebetween.

[0045] The interlocking flanges 432 and 433 are further designed to mechanically join to the latching finger portions 150 and 154, respectively, and lock within the housing 100. As described above, the latching finger portions 150 and 154 will bend to a certain extent when a force is applied thereto. The latching finger portions 150 and 154 are also resilient, and will return to the positions shown in FIGS. 1A and 1B when such force is released. During assembly of the connector 10, the wafer assembly 400 is positioned to align the interlocking flanges 432 and 433 with the wafer reference passages 132 and 135 of the housing 100. The wafer assembly 400 may then be inserted into the interior region 102 of the housing 100 along the direction "D" shown in FIG. 1D, and the interlocking flanges 432 and 433 may slide within the wafer reference passages 132 and 135 of the housing 100. As the interlocking flanges 432 and 433 slide within the wafer reference passages 132 and 135, the interlocking flanges 432 and 433 interfere with the tips or ends of the latch finger portions 150 and 154 and push the latch finger portions 150 and 154 out from within the openings 140 and 144. Once the interlocking flanges 432 and 433 are pushed past the tips or ends of the latch finger portions 150 and 154, the latch finger portions 150 and 154 can quickly return behind the interlocking flanges 432 and 433 of the wafer mold insert 430 of the wafer assembly 400, thereby securing the wafer assembly 400 in place within the housing 100.

[0046] Wafer mold insert 430A also includes guide flanges 432A and 433A (see FIG. 3C) located on opposite ends of wafer mold insert 430A. In the illustrated example, guide flanges 432A and 433A are formed into a rectangular cube shape and include chamfers or edges, although the size and shape of guide flanges 432A and 433A may vary depending on the embodiment. When connector 10 is assembled, guide flanges 432A and 433A are sized to fit and slide within wafer datum passages 130 and 133 of housing 100, respectively, with minimal clearance therebetween. During assembly of connector 10, wafer assembly 400 is positioned to align guide flanges 432A and 433A with wafer datum passages 130 and 133 of housing 100. Wafer assembly 400 may be inserted into interior region 102 of housing 100 along direction "D" shown in FIG. 1D , and guide flanges 432A and 433A may slide within wafer reference paths 130 and 133 of housing 100. In some cases, wafer assembly 400 may be associated or coupled (e.g., assembled) with wafer assembly 500, and wafer assemblies 400 and 500 may be inserted together into housing 100. However, in other embodiments, wafer assemblies 400 and 500 may each be inserted into interior region 102 of housing 100.

[0047] Wafer mold insert 430 further includes alignment receptacles. In particular, as shown in FIGURE 3B, wafer mold insert 430 includes alignment receptacles 442 and 443 formed in the top surfaces of interlocking flanges 432 and 433, respectively. Alignment receptacles 442 and 443 are formed in recessed receptacles in interlocking flanges 432 and 433. Alignment posts of wafer assembly 500 may be positioned to extend into alignment receptacles 442 and 443, as described in more detail below.

[0048] Wafer mold inserts 530 and 530A of wafer assembly 500 may be formed of plastic (e.g., LCP, PE, PTFE, fluoropolymer, or other plastic or insulating material) and molded around terminal conductors of terminal array 510. For example, a lead frame including terminal array 510 may be formed (e.g., pressed, sheared, or otherwise formed) from a metal plate to form the lead frame. In some cases, the metal plate may be plated with one or more plating metals. The lead frame and terminal array 510 may be pressed or bent into the shape of terminal array 510. The lead frame including terminal array 510 may then be placed into a mold, and a plastic material may be injected into the mold to form wafer mold inserts 530 and 530A around terminal array 510. Terminal array 510 may then be sheared or cut from the lead frame, and each terminal conductor of terminal array 510 may be further bent or otherwise formed into the shape shown in the figures.

[0049] Wafer mold inserts 530 and 530A of wafer assembly 500 support the terminal conductors by maintaining spacing between the terminal conductors in terminal row 510. Wafer mold inserts 530 and 530A further include structural features for positioning and securing wafer assembly 500 within housing 100 of connector 10. More specifically, wafer mold insert 530 includes guide flanges 532 and 533 (see FIG. 3A) located on opposite sides of wafer mold insert 530. When connector 10 is assembled, guide flanges 532 and 533 are sized to fit and slide within wafer reference passages of housing 100 and have minimal clearance therebetween.

[0050] Wafer mold insert 530A also includes guide flanges 532A and 533A (see FIG. 3A) located on opposite ends of wafer mold insert 530A. In the illustrated example, guide flanges 532A and 533A are formed into a rectangular cube shape and include chamfers or edges, although the size and shape of guide flanges 532A and 533A may vary depending on the embodiment. When connector 10 is assembled, guide flanges 532A and 533A are sized to fit and slide within wafer datum passages 130 and 133 of housing 100, respectively, with minimal clearance therebetween. During assembly of connector 10, wafer assembly 500 is positioned to align guide flanges 532A and 533A with wafer datum passages 130 and 133 of housing 100. Wafer assembly 500 may be inserted into interior region 102 of housing 100 along direction "D" shown in FIG. 1D, and guide flanges 532A and 533A may slide within wafer reference tracks 130 and 133 of housing 100.

[0051] The wafer mold insert 530 further includes alignment posts. In particular, the wafer mold insert 530 includes alignment posts 542 and 543 extending downwardly along the bottom edges of the guide flanges 532 and 533, as shown in FIG. 3A. The alignment posts 542 and 543 of the wafer assembly 500 may be positioned to extend into the alignment receptacles 442 and 443 of the wafer assembly 400. That is, the wafer assembly 500 may be positioned above the wafer assembly 400, and the alignment posts 542 and 543 may be inserted into the alignment receptacles 442 and 443 of the wafer assembly 400. The alignment posts 542 and 543 and the alignment receptacles 442 and 443 provide a mechanism for aligning the wafer assemblies 400 and 500. The wafer assemblies 400 and 500 may then be inserted together into the interior region 102 of the housing 100, as described in this disclosure.

[0052] Wafer mold insert 530 further includes an interlock nose 539 for positioning wafer assembly 500 within housing 100 of connector 10. Interlock nose 539 is formed as an elongated nose located at the relative center of wafer assembly 500. When connector 10 is assembled, interlock nose 539 fits into and extends from a corresponding locating hole 138 (see FIG. 1A ) in housing 100. That is, when connector 10 is assembled, interlock nose 539 fits into and occupies locating hole 137 with minimal clearance between the outer surface of interlock nose 539 and the inner surface of the locating hole.

[0053] Referring to another aspect of the embodiment, FIG. 4A illustrates a partial exploded view of the wafer assembly 200 of the connector 10 shown in FIG. 1A. The wafer assembly 200 includes flexible shields 250 and 260 and rigid shields 270 and 280. The flexible shields 250 and 260 and the rigid shields 270 and 280 form a ground path assembly for the wafer assembly 200. The ground path assembly further includes and is electrically connected to the ground conductors of the terminal array 210 (including the ground conductors 211, 214, etc.). The rigid shields 270 and 280 of the wafer assembly 200 are formed (e.g., pressed, sheared, or otherwise formed) from flat metal sheets, which may be plated in some cases. The flat metal sheets forming the rigid shields 270 and 280 may be thicker than the flat metal sheets forming the flexible shields 250 and 260, as described in more detail below. Rigidity shields 270 and 280 are secured together with wafer assembly 200 and are designed to provide strength, support and additional rigidity to wafer assembly 200 and connector 10 .

[0054] In the example shown in FIG. 4A, the rigid shield 270 includes a first segment 270A, a second segment 270B, and a third segment 270C, with a curved portion between the segments 270A-270C. The segments 270A-270C extend in different directions and are at a certain angle with respect to each other. The rigid shield 270 is generally formed to follow the curved portion in the conductor terminal row 210. The rigid shield 270 further includes a contact surface area 271, a shield extending area 272, and a staking aperture 273. Similar to the rigid shield 270, the rigid shield 280 includes a plurality of segments, with a curved portion between the segments. The rigid shield 280 further includes a contact surface area 281, a shield extending area 282, and a staking aperture 283.

[0055] Rigid shields 270 and 280 are formed separately from terminal row 210 and wafer mold insert 230. As shown in FIGURE 4A, wafer mold insert 230 includes crimping posts, such as crimping posts 236 and 237. When wafer mold insert 230 is initially molded around terminal row 210, crimping posts 236 and 237 may be cylindrical, as shown in FIGURE 4A. To assemble wafer assembly 200, rigid shields 270 and 280 are positioned with wafer mold insert 230 such that crimping posts 236 and 237 extend through crimping holes 273 and 283 in rigid shields 270 and 280. A heat staking process is then performed to heat the crimping posts 236 and 237 to a temperature above the melting temperature of the material forming the wafer mold insert 230, and the ends of the crimping posts 236 and 237 are pressed to form a cap, a portion of which is pressed against the backside of the rigid shields 270 and 280. This process secures the rigid shields 270 and 280 together with the wafer mold insert 230.

[0056] When the wafer assembly 200 is assembled, the contact surface area 271 of the rigid shield 270 contacts the surface of the ground conductors of the terminal row 210. For example, the contact surface area 271 of the rigid shield 270 contacts the length of the ground conductors of the first group 210A of terminal conductors (including ground conductors 211 and 214, etc.) of the terminal row 210. The shield extension area 272 is mechanically and electrically spaced one gap from the signal conductors of the first group 210A of terminal conductors and does not contact the signal conductors. For example, the rigid shield 270 does not contact the signal conductors 212 and 213 or any other signal conductors of the terminal row 210.

[0057] When wafer assembly 200 is assembled, contact surface area 281 of rigid shield 280 also contacts surfaces of ground conductors in terminal row 210. For example, contact surface area 281 of rigid shield 280 may connect or terminate ground conductors in second group 210B of terminal conductors in terminal row 210. Shield extension area 282 is spaced apart from and does not contact signal conductors in second group 210B of terminal conductors.

[0058] In some cases, contact surface area 271 of rigid shield 270 and contact surface area 281 of rigid shield 280 may be electrically connected or terminated to a top surface area of ​​the ground conductor of terminal array 210 by welding (e.g., laser welding, spot welding, etc.), soldering, conductive adhesive, or otherwise. For example, electrical contact and termination may be established along the length of the ground conductor of terminal array 210 and contact surface areas 271 and 281, or at certain points or blocks along the ground conductor of terminal array 210 and contact surface areas 271 and 281.

[0059] The flexible shields 250 and 260 of the wafer assembly 200 are formed (e.g., pressed, sheared, or otherwise formed) from flat metal sheets, which may be plated in some cases. In some cases, the flat metal sheets forming the flexible shields 250 and 260 may be thinner than the flat metal sheets used to form the rigid shields 270 and 280. The flexible shields 250 and 260 are designed to be relatively more compliant than the rigid shields 270 and 280, allowing the lead contacts of the terminal row 210 to bend and bounce up to a certain extent when the PCB-type interface of the connector is inserted into the front port opening 12 of the connector 10 and positioned between the terminal rows 210 and 510.

[0060] The flexible shield 250 includes a contact surface area 251 and a shield extension area 252. Similar to the flexible shield 250, the flexible shield 260 includes a contact surface area 261 and a shield extension area 262. When the wafer assembly 200 is assembled, the contact surface area 251 of the flexible shield 250 contacts the lower surface of the ground conductor of the terminal row 210. For example, the contact surface area 251 of the flexible shield 250 contacts the length of the ground conductor of the first group 210A of the terminal conductors (including the ground conductors 211 and 214, etc.) of the terminal row 210. The shield extension area 252 is mechanically and electrically spaced one gap from the signal conductor of the first group 210A of the terminal conductors and does not contact the signal conductor. When the wafer assembly 200 is assembled, the contact surface area 261 of the flexible shield 260 also contacts the lower surface of the ground conductor of the terminal row 210. For example, contact surface area 261 of flexible shield 260 contacts a length of a ground conductor of second group 210B of terminal conductors in terminal row 210. Shield extension area 262 is mechanically and electrically spaced one gap from, and does not contact, the signal conductors of second group 210B of terminal conductors.

[0061] In some cases, the contact surface area 251 of the flexible shield 250 and the contact surface area 261 of the flexible shield 260 may be electrically connected or terminated to the lower surface area of the ground conductor among the terminal rows 210 by welding (e.g., laser welding, spot welding, etc.), soldering, conductive adhesive, or other means. For example, along the length of the ground conductor among the terminal rows 210 and the contact surface areas 251 and 261, or at a certain point or block along the ground conductor among the terminal rows 210 and the contact surface areas 251 and 261, electrical contact and termination can be established by welding, soldering, adhesive, or other means.

[0062] The flexible shields 250 and 260 and the rigid shields 270 and 280 form a ground path assembly for the wafer assembly 200. The flexible shields 250 and 260 and the rigid shields 270 and 280 provide a ground structure to reduce crosstalk, electromagnetic interference, and other undesirable effects between the wafer assembly 200 and the wafer assemblies 200, 300, 400, and 500 within the connector 10. The ground structure also helps to control the impedance of the signal conductors among the terminal rows 210, and the signal conductors function as transmission paths for data communication. The ground structure provided by the flexible shields 250 and 260 and the rigid shields 270 and 280 is advantageous for higher data rate applications of the connector 10, such as 56 gigabytes per second (Gb / s), 112 Gb / s, 224 Gb / s, and higher data rates.

[0063] FIG. 4B illustrates a partial exploded view of the wafer assembly 300 of the connector 10 shown in FIG. 1A. The wafer assembly 300 includes flexible shields 350 and 360 and rigid shields 370 and 380. The flexible shields 350 and 360 and rigid shields 370 and 380 form a ground path assembly for the wafer assembly 300. The ground path assembly further includes the ground conductors (including ground conductors 311, 314, etc.) electrically connected to the ground conductors of the terminal row 310. The rigid shields 370 and 380 of the wafer assembly 300 are formed (e.g., pressed, sheared, or otherwise formed) from flat metal sheets, which may be plated in some cases. The flat metal sheets forming the rigid shields 370 and 380 may be thicker than the flat metal sheets forming the flexible shields 350 and 360, as described in more detail below. Rigidity shields 370 and 380 are secured together with wafer assembly 300 and are designed to provide strength, support and additional rigidity to wafer assembly 300 and connector 10 .

[0064] In the example shown in FIG. 4B, the rigid shield 370 includes a first segment 370A and a second segment 370B, with a bend between the segments 370A and 370B. The segments 370A and 370B extend in different directions and are angled relative to each other. The rigid shield 370 is generally shaped to follow the bend in the terminal row 310 of the conductor. The rigid shield 370 further includes a contact surface area 371, a shield extension area 372, and a crimping hole 373. Similar to the rigid shield 370, the rigid shield 380 includes multiple segments, with a bend between the segments. The rigid shield 380 further includes a contact surface area 381, a shield extension area 382, ​​and a crimping hole 383.

[0065] Rigid shields 370 and 380 are formed independently of terminal row 310 and wafer mold insert 330. As shown in FIGURE 4B, wafer mold insert 330 includes crimping posts, such as crimping posts 336 and 337. When wafer mold insert 330 is initially molded around terminal row 310, crimping posts 336 and 337 may be cylindrical, as shown in FIGURE 4B. To assemble wafer assembly 300, rigid shields 370 and 380 are positioned with wafer mold insert 330 such that crimping posts 336 and 337 extend through crimping holes 373 and 383 in rigid shields 370 and 380. A heat staking process is then performed to heat crimping posts 336 and 337 to a temperature above the melting temperature of the material forming wafer mold insert 330, and the ends of crimping posts 336 and 337 are pressed to form a cap, a portion of which is pressed against the backside of rigid shields 370 and 380. This process secures rigid shields 370 and 380 together with wafer mold insert 330.

[0066] When the wafer assembly 300 is assembled, the contact surface area 371 of the rigid shield 370 contacts the surface of the ground conductor of the terminal row 310. For example, the contact surface area 371 of the rigid shield 370 contacts the length of the ground conductor of the terminal row 310 (including the ground conductors 311 and 314, etc.). The shield extension area 372 is mechanically and electrically spaced apart from the signal conductor of the terminal row 310 by one gap and does not contact the signal conductor. When the wafer assembly 300 is assembled, the contact surface area 381 of the rigid shield 380 also contacts the surface of the ground conductor of the terminal row 310. The shield extension area 382 is spaced apart from the signal conductor of the terminal row 310 and does not contact the signal conductor.

[0067] In some cases, contact surface area 371 of rigid shield 370 and contact surface area 381 of rigid shield 380 may be electrically connected or terminated to an underside area of ​​a ground conductor of terminal array 310 by welding (e.g., laser welding, spot welding, etc.), soldering, conductive adhesive, or otherwise. For example, electrical contact and termination may be established by welding, soldering, adhesive, or otherwise along the length of the ground conductor of terminal array 310 and contact surface areas 371 and 381, or at certain points or blocks along contact surface areas 371 and 381.

[0068] The flexible shields 350 and 360 of the wafer assembly 300 are formed (e.g., pressed, sheared, or otherwise formed) from flat metal sheets, which may be plated in some cases. In some cases, the flat metal sheets forming the flexible shields 350 and 360 may be thinner than the flat metal sheets used to form the rigid shields 370 and 380. The flexible shields 350 and 360 are designed to be relatively more compliant than the rigid shields 370 and 380, allowing the lead contacts of the terminal row 310 to bend and bounce up to a certain extent when the PCB-type interface of the connector is inserted into the front port opening 12 of the connector 10 and positioned between the terminal rows 310 and 410.

[0069] The flexible shield 350 includes a contact surface area 351 and a shield extension area 352. Similar to the flexible shield 350, the flexible shield 360 includes a contact surface area 361 and a shield extension area 362. When the wafer assembly 300 is assembled, the contact surface area 351 of the flexible shield 350 contacts the lower surface of the ground conductor of the terminal row 310. For example, the contact surface area 351 of the flexible shield 350 contacts the length of the ground conductor of the terminal row 310 (including the ground conductors 311 and 314, etc.). The shield extension area 352 is mechanically and electrically spaced apart from the signal conductor of the terminal row 310 by one gap and does not contact the signal conductor. When the wafer assembly 300 is assembled, the contact surface area 361 of the flexible shield 360 also contacts the lower surface of the ground conductor of the terminal row 310. The shield extension region 362 is mechanically and electrically separated from the signal conductors of the terminal row 310 and does not contact the signal conductors.

[0070] In some cases, contact surface area 351 of flexible shield 350 and contact surface area 361 of flexible shield 360 may be electrically connected or terminated to an underside region of a ground conductor in terminal array 310 by welding (e.g., laser welding, spot welding, etc.), soldering, conductive adhesive, or otherwise. For example, electrical contact or termination may be established along the length of contact surface areas 351 and 361 or at certain points or blocks along contact surface areas 351 and 361 by welding, soldering, adhesive, or otherwise.

[0071] The flexible shields 350 and 360 and the rigid shields 370 and 380 form a ground path assembly for the wafer assembly 300. The flexible shields 350 and 360 and the rigid shields 370 and 380 provide a ground structure to reduce crosstalk, electromagnetic interference and other undesirable effects between the wafer assembly 300 and the wafer assemblies 200, 300, 400 and 500 in the connector 10. The ground structure also helps to control the impedance of the signal conductors in the terminal row 310, which act as transmission paths for data communications. The ground structure provided by the flexible shields 350 and 360 and the rigid shields 370 and 380 is advantageous for higher data rate applications of the connector 10.

[0072] FIG. 4C illustrates a partial exploded view of wafer assembly 400 of connector 10 shown in FIG. 1A. Wafer assembly 400 includes flexible shields 450 and 460 and rigid shields 470 and 480. Flexible shields 450 and 460 and rigid shields 470 and 480 form a ground path assembly for wafer assembly 400. The ground path assembly further includes and is electrically connected to the ground conductors of terminal row 410 (including ground conductors 411, 414, etc.). Rigid shields 470 and 480 of wafer assembly 400 are formed (e.g., pressed, sheared, or otherwise formed) from flat metal sheets, which may be plated in some cases. The flat metal sheets forming rigid shields 470 and 480 may be thicker than the flat metal sheets forming flexible shields 450 and 460, as described in more detail below. Rigidity shields 470 and 480 are secured together with wafer assembly 400 and are designed to provide strength, support and additional rigidity to wafer assembly 400 and connector 10 .

[0073] In the example shown in FIG. 4C, the rigid shield 470 includes a first segment 470A and a second segment 470B, with a bend between the segments 470A and 470B. The segments 470A and 470B extend in different directions and are angled relative to each other. The rigid shield 470 is generally shaped to follow the bend in the terminal row 410 of the conductor. The rigid shield 470 further includes a contact surface area 471, a shield extension area 472, and a crimping hole 473. Similar to the rigid shield 470, the rigid shield 480 includes multiple segments, with a bend between the segments. The rigid shield 480 further includes a contact surface area 481, a shield extension area 482, and a crimping hole 483.

[0074] Rigid shields 470 and 480 are formed independently of terminal row 410 and wafer mold insert 430. As shown in FIGURE 4C, wafer mold insert 430 includes crimping posts, such as crimping posts 436 and 437. When wafer mold insert 430 is initially molded around terminal row 410, crimping posts 436 and 437 may be cylindrical, as shown in FIGURE 4C. To assemble wafer assembly 400, rigid shields 470 and 480 are positioned with wafer mold insert 430 such that crimping posts 436 and 437 extend through crimping holes 473 and 483 in rigid shields 470 and 480. A heat staking process is then performed to heat crimping posts 436 and 437 to a temperature above the melting temperature of the material forming wafer mold insert 430, and the ends of crimping posts 436 and 437 are pressed to form a cap, a portion of which is pressed against the backside of rigid shields 470 and 480. This process secures rigid shields 470 and 480 together with wafer mold insert 440.

[0075] When the wafer assembly 400 is assembled, the contact surface area 471 of the rigid shield 470 contacts the surface of the ground conductor of the terminal row 410. For example, the contact surface area 471 of the rigid shield 470 contacts the length of the ground conductor of the terminal row 410 (including the ground conductors 411 and 414, etc.). The shield extension area 472 is mechanically and electrically spaced apart from the signal conductor of the terminal row 410 by one gap and does not contact the signal conductor. When the wafer assembly 400 is assembled, the contact surface area 481 of the rigid shield 480 also contacts the surface of the ground conductor of the terminal row 410. The shield extension area 482 is spaced apart from the signal conductor of the terminal row 410 and does not contact the signal conductor.

[0076] In some cases, contact surface area 471 of rigid shield 470 and contact surface area 481 of rigid shield 480 may be electrically connected or terminated to a top surface area of ​​a ground conductor of terminal array 410 by welding (e.g., laser welding, spot welding, etc.), soldering, conductive adhesive, or otherwise. For example, electrical contact and termination may be established by welding, soldering, adhesive, or otherwise along the length of the ground conductor of terminal array 410 and contact surface areas 471 and 481, or at certain points or blocks along contact surface areas 471 and 481.

[0077] The flexible shields 450 and 460 of the wafer assembly 400 are formed (e.g., pressed, sheared, or otherwise formed) from flat metal sheets, which may be plated in some cases. In some cases, the flat metal sheets forming the flexible shields 450 and 460 may be thinner than the flat metal sheets used to form the rigid shields 470 and 480. The flexible shields 450 and 460 are designed to be relatively more compliant than the rigid shields 470 and 480, allowing the lead contacts of the terminal row 410 to bend and bounce up to a certain extent when the PCB-type interface of the connector is inserted into the front port opening 12 of the connector 10 and positioned between the terminal rows 410.

[0078] The flexible shield 450 includes a contact surface area and a shield extension area, and the flexible shield 460 also includes a contact surface area and a shield extension area. When the wafer assembly 400 is assembled, the contact surface area of ​​the flexible shield 450 contacts the upper surface of the ground conductor of the terminal row 410. The shield extension area of ​​the flexible shield 450 is mechanically and electrically spaced apart from the signal conductor of the terminal row 410 by one gap, and does not contact the signal conductor. When the wafer assembly 400 is assembled, the contact surface area of ​​the flexible shield 460 also contacts the upper surface of the ground conductor of the terminal row 410. The shield extension area of ​​the flexible shield 460 is mechanically and electrically spaced apart from the signal conductor of the terminal row 410 by one gap, and does not contact the signal conductor. In some cases, the contact surface areas of flexible shield 450 and flexible shield 460 may be electrically connected or terminated by welding (e.g., laser welding, spot welding, etc.), soldering, conductive adhesive, or otherwise to top regions of ground conductors in terminal array 410. For example, electrical contact and termination may be established by welding, soldering, adhesive, or otherwise along the length of the contact surface areas or at certain points or blocks along the contact surface areas.

[0079] The flexible shields 450 and 460 and the rigid shields 470 and 480 form a ground path assembly for the wafer assembly 400. The flexible shields 450 and 460 and the rigid shields 470 and 480 provide a ground structure to reduce crosstalk, electromagnetic interference and other undesirable effects between the wafer assembly 400 and the wafer assemblies 200, 300, 400 and 500 in the connector 10. The ground structure also helps to control the impedance of the signal conductors in the terminal row 410, which act as transmission paths for data communications. The ground structure provided by the flexible shields 450 and 460 and the rigid shields 470 and 480 is advantageous for higher data rate applications of the connector 10.

[0080] 4D illustrates a partial exploded view of wafer assembly 500 of connector 10 shown in FIG. 1A. Wafer assembly 500 includes flexible shields 550 and 560 and rigid shields 570 and 580. Flexible shields 550 and 560 and rigid shields 570 and 580 form a ground path assembly for wafer assembly 500. Ground path assembly further includes and is electrically connected to ground conductors of terminal row 510 (including ground conductors 511, 514, etc.). Rigid shields 570 and 580 of wafer assembly 500 are formed (e.g., pressed, sheared, or otherwise formed) from flat metal sheets, which may be plated in some cases. The flat metal sheets forming rigid shields 570 and 580 may be thicker than the flat metal sheets forming flexible shields 550 and 560, as described in more detail below. Rigidity shields 570 and 580 are secured together with wafer assembly 500 and are designed to provide strength, support and additional rigidity to wafer assembly 500 and connector 10 .

[0081] In the example shown in FIG. 4D, the rigid shield 570 includes a first segment 570A, a second segment 570B, and a third segment 570C, with bends between the segments 570A-570C. The segments 570A-570C extend in different directions and are angled relative to one another. The rigid shield 570 is typically shaped to follow the bends in the terminal row 510 of the conductor. The rigid shield 570 further includes a contact surface area 571, a shield extension area 572, and a crimping hole 573. Similar to the rigid shield 570, the rigid shield 580 includes multiple segments, with bends between the segments. The rigid shield 580 further includes a contact surface area 581, a shield extension area 582, and a crimping hole 583.

[0082] Rigid shields 570 and 580 are formed independently of terminal row 510 and wafer mold insert 530. As shown in FIGURE 4D, wafer mold insert 530 includes crimping posts, such as crimping posts 536 and 537. When wafer mold insert 530 is initially molded around terminal row 510, crimping posts 536 and 537 may be cylindrical, as shown in FIGURE 4D. To assemble wafer assembly 500, rigid shields 570 and 580 are positioned with wafer mold insert 530 such that crimping posts 536 and 537 extend through crimping holes 573 and 583 in rigid shields 570 and 580. A heat staking process is then performed to heat crimping posts 536 and 537 to a temperature above the melting temperature of the material forming wafer mold insert 530, and the ends of crimping posts 536 and 537 are pressed to form a cap, a portion of which is pressed against the backside of rigid shields 570 and 580. The process secures rigid shields 570 and 580 together with wafer mold insert 530.

[0083] When the wafer assembly 500 is assembled, the contact surface area 571 of the rigid shield 570 contacts the surface of the ground conductor of the terminal row 510. For example, the contact surface area 571 of the rigid shield 570 contacts the length of the ground conductor of the terminal row 510 (including the ground conductors 511 and 514, etc.). The shield extension area 572 is mechanically and electrically spaced apart from the signal conductor of the terminal row 510 by one gap and does not contact the signal conductor. When the wafer assembly 500 is assembled, the contact surface area 581 of the rigid shield 580 also contacts the surface of the ground conductor of the terminal row 510. The shield extension area 582 is spaced apart from the signal conductor of the terminal row 510 and does not contact the signal conductor.

[0084] In some cases, contact surface area 571 of rigid shield 570 and contact surface area 581 of rigid shield 580 may be electrically connected and terminated to an underside area of ​​a ground conductor of terminal array 510 by welding (e.g., laser welding, spot welding, etc.), soldering, conductive adhesive, or otherwise. For example, electrical contact and termination may be established by welding, soldering, adhesive, or otherwise along the length of the ground conductor of terminal array 510 and contact surface areas 571 and 581, or at certain points or blocks along contact surface areas 571 and 581.

[0085] The flexible shields 550 and 560 of the wafer assembly 500 are formed (e.g., pressed, sheared, or otherwise formed) from flat metal sheets, which may be plated in some cases. In some cases, the flat metal sheets forming the flexible shields 550 and 560 may be thinner than the flat metal sheets used to form the rigid shields 570 and 580. The flexible shields 550 and 560 are designed to be relatively more compliant than the rigid shields 570 and 580, such that when the PCB-type interface of the connector is inserted into the front port opening 12 of the connector 10 and positioned between the terminal rows 210 and 510, the lead contacts of the terminal row 510 can bend and flip up to a certain extent.

[0086] The flexible shield 550 includes a contact surface area and a shield extension area, and the flexible shield 560 also includes a contact surface area and a shield extension area. When the wafer assembly 500 is assembled, the contact surface area of ​​the flexible shield 550 contacts an upper surface of the ground conductor of the terminal row 510. The shield extension area of ​​the flexible shield 550 is mechanically and electrically spaced apart from the signal conductor of the terminal row 510 by one gap and does not contact the signal conductor. When the wafer assembly 500 is assembled, the contact surface area of ​​the flexible shield 560 also contacts an upper surface of the ground conductor of the terminal row 510. The shield extension area of ​​the flexible shield 560 is mechanically and electrically spaced apart from the signal conductor of the terminal row 510 and does not contact the signal conductor. In some cases, the contact surface areas of flexible shield 550 and flexible shield 560 may be electrically connected and terminated to top regions of ground conductors of terminal array 510 by welding (e.g., laser welding, spot welding, etc.), soldering, conductive adhesive, or otherwise. For example, electrical contact and termination may be established along the length of the contact surface areas or at certain points or blocks along the contact surface areas by welding, soldering, adhesive, or otherwise.

[0087] The flexible shields 550 and 560 and the rigid shields 570 and 580 form a ground path assembly for the wafer assembly 500. The flexible shields 550 and 560 and the rigid shields 570 and 580 provide a ground structure to reduce crosstalk, electromagnetic interference and other undesirable effects between the wafer assembly 500 and the wafer assemblies 200, 300, 400 and 500 in the connector 10. The ground structure also helps to control the impedance of the signal conductors in the terminal row 510, which act as transmission paths for data communications. The ground structure provided by the flexible shields 550 and 560 and the rigid shields 570 and 580 is advantageous for higher data rate applications of the connector 10.

[0088] FIG. 5 illustrates a cross-sectional view of the connector 10, labeled BB in FIG. 1D, according to various embodiments of the present disclosure. As shown in FIG. 5, the housing 100 includes openings 147 and 148 extending through a bottom of the housing 100. The openings 147 and 148 extend from the exterior of the housing 100 to an interior region 102 within the housing 100 (see also FIG. 1D). The latch fingers are cantilevered and extend into each of the openings 147 and 148. In particular, the leg latch fingers 157 and 158 are cantilevered and extend around the perimeter of the openings 147 and 148, respectively. Tapered edges of the leg latch fingers 157 and 158 also extend partially into the openings 147 and 148.

[0089] As further shown in FIG. 2B, the wafer mold insert 230 of the wafer assembly 200 includes interlocking legs 234 and 235 for positioning and securing the wafer assembly 200 within the housing 100. The interlocking legs 234 and 235 are designed to mechanically mate with the leg latch fingers 157 and 158 of the housing 100 to retain and secure the wafer assembly 200 in place. More specifically, during assembly of the connector 10, the wafer assembly 200 is positioned to align the guide flanges 232 and 233 (see FIG. 2B) with the wafer reference passages of the housing 100. The wafer assembly 200 is then inserted into the interior region 102 of the housing 100 along the direction "D" shown in FIG. 1D, and the guide flanges 232 and 233 slide within the wafer reference passages of the housing 100. At this time, the interlocking legs 234 and 235 slide into the openings 148 and 147 of the housing 100 and press against the tapered edges of the leg latch fingers 157 and 158. The interlocking legs 234 and 235 of the wafer assembly 200 press the leg latch fingers 157 and 158 against the outer periphery edges of the openings 148 and 147, moving them away from the outer periphery edges of the openings 148 and 147. As the interlocking legs 234 and 235 are pushed over the tips or ends of the latch fingers 157 and 158, the leg latch fingers 157 and 158 resiliently return to their positions behind the interlocking legs 234 and 235 of the wafer mold insert 230 of the wafer assembly 200, securing the wafer assembly 200 in place within the housing 100, as shown in FIG.

[0090] 5 further illustrates how the contact surface areas of the rigid shields 270, 280, 370, 380, 470, 480, 570 and 580 contact the ground conductors in the wafer assemblies 200, 300, 400 and 500 of the connector 10. The shield extension areas of the rigid shields 270, 280, 370, 380, 470, 480, 570 and 580 are mechanically and electrically spaced from and do not contact the signal conductors in the wafer assemblies 200, 300, 400 and 500 of the connector 10.

[0091] Next, a connector 10 according to another embodiment of the present disclosure will be described. The same components as those in the above-described embodiments will be given the same reference numerals, and in order to avoid duplication, duplicated descriptions of the same parts will be omitted.

[0092] 6 and 7, FIG. 6 is a top perspective view illustrating an exemplary connector according to another embodiment of the present disclosure, and FIG. 7 is a bottom perspective view illustrating the connector shown in FIG. 6 according to another embodiment of the present disclosure, which, like the connector 10 of the other embodiment, includes a front port opening 12, terminal pins 13 (shown in FIG. 7), and a row of terminal conductors extending from the front port opening 12 to the terminal pins 13 for communication of data signals on the terminal conductors. The connector 10 also includes several structural features to maintain alignment and position of the terminal conductors within the connector 10. The connector 10 is further designed to provide shielding to maintain signal integrity of differential signals on the terminal conductors as they extend from the front port opening 12 to the terminal pins 13. The connector 10 also includes a housing 100, which includes a bottom mounting surface 110, a back surface 112, mounting posts 122 and 124, solder rings 126 and 128, and other features described below.

[0093] The differences from the above-mentioned embodiments are as follows: the housing 100 of this other embodiment is composed of two parts, a plastic part 160 and a metal part 170, and the front port opening 12 is formed in the plastic part 160, which can avoid scratches that may occur when the mating connector is inserted through the front port opening 12, while also avoiding short circuits with the housing during mating; the metal part 170 can be formed by, for example, molding, injection molding, die casting, printing or other techniques to increase the overall strength of the housing 100, and the metal part 170 can also increase the deformation resistance of the housing 100 when the wafer assembly applies force to the housing 100.

[0094] 8 and 9, FIG. 8 is an exploded top perspective view showing the connector housing shown in FIG. 6 according to another embodiment of the present disclosure, and FIG. 9 is an exploded bottom perspective view showing the connector housing shown in FIG. 6 according to another embodiment of the present disclosure, in which the plastic portion 160 of the housing 100 includes a first engagement portion 162, and accordingly, the metal portion 170 of the housing 100 includes a second engagement portion 172, and in the example shown in FIG. 8 and FIG. 9, both the first engagement portion 162 and the second engagement portion 172 are approximately U-shaped, the first engagement portion 162 includes an engagement groove portion 1621 and a convex rib 1622 located on one side or both sides within the engagement groove portion 1621 (only the convex rib 1622 located on one side is shown in FIG. 8 and FIG. 9), and the second engagement portion 172 includes an engagement arm portion 1721. However, without being limited thereto, the first engaging portion 162 and the second engaging portion 172 may have other shapes, for example, a protrusion and a recessed groove or a locking hole.

[0095] The plastic part 160 of the housing 100 further includes a connecting protrusion 161, which is located on the top surface of the plastic part 160 and is three cylindrical protrusions, but is not limited thereto, and the connecting protrusion 161 may have other shapes, for example, a rectangular column shape. Three connecting holes 171 are provided on the top surface of the metal part 170 corresponding to the connecting protrusion 161, and the shape of the connecting holes 171 may correspond to the shape of the connecting protrusion 161. An appropriate number of connecting protrusions 161 and connecting holes 171 may be provided according to actual needs.

[0096] When assembling the plastic part 160 and the metal part 170, the first engaging part 162 and the second engaging part 172 are engaged with each other, and at the same time, the connecting protrusion 161 is drilled through the connecting hole 171, and then, for example, an end of the connecting protrusion 161 is pressed by hot pressing to form a cap, thereby fixing the plastic part 160 and the metal part 170. Of course, the plastic part 160 and the metal part 170 can also be fixed to each other by tight fitting the connecting protrusion 161 and the connecting hole 171. Alternatively, the connecting protrusion 161 and the connecting hole 171 can be tightly fitted together, and then the end of the connecting protrusion 161 can be hot pressed to form a cap fixed to the connecting hole 171. 8 and 9, when the first engaging portion 162 and the second engaging portion 172 are engaged with each other, the engaging arm portion 1721 of the second engaging portion 172 enters the engaging groove portion 1621 of the first engaging portion 162 and presses the protruding rib 1622 located on one or both sides of the engaging groove portion 1621, thereby forming a tight fit / interference fit between the first engaging portion 162 and the second engaging portion 172. The fixation between the connecting protrusion 161 and the connecting hole 171 and the tight fit between the first engaging portion 162 and the second engaging portion 172 firmly assembles the plastic portion 160 and the metal portion 170 of the housing 100 with each other.

[0097] As in the previous embodiments, the housing 100 includes an internal space region 102 in which the wafer assemblies 200, 300, 400, 500 are positioned and fixed when the connector 10 is assembled. To achieve positioning and fixing of the wafer assemblies 200, 300, 400, 500 in the internal space region 102 of the housing 100, the metal part 170 of this other embodiment further includes the following features: a second positioning groove 173 is provided at one end of the top surface of the metal part 170 away from the plastic part 160, an engagement groove 177 is provided at one end of the top surface of the metal part 170 close to the plastic part 160, and a first positioning groove 174 is provided at one end of the bottom surface of the metal part 170 close to the plastic part 160. The second positioning groove 173 may be in the form of, for example, a dovetail groove, and the engagement groove 177 may be in the form of, for example, a slot. The metal part 170 has two side walls each provided with a first engagement hole 175 and a second engagement hole 176, and Figures 8 and 9 show the first engagement hole 175 and the second engagement hole 176 located on the two side walls, respectively. The above features and the mating relationship of the wafer assemblies 200, 300, 400, 500 will be described below.

[0098] 10 and 11, which are perspective views showing different angles of the internal structure of the connector housing shown in FIG. 6 according to another embodiment of the present disclosure, the housing 100 includes wafer reference passages 130, 131, 132 (shown in FIG. 10) formed on one side wall inside the housing 100 and wafer reference passages 133, 134, 135 (shown in FIG. 11) formed on the other opposite side wall inside the housing 100. The wafer reference passages 130 and 133 are provided opposite to each other to form a reference passage into which the wafer assembly 200 (hereinafter also referred to as the first wafer assembly 200) is inserted, and stopper edges 1301 and 1331 are formed at the ends of the wafer reference passages 130 and 133 adjacent to the front port opening 12 or the plastic portion 160 (shown in FIGS. 6 and 7), respectively, to limit the position into which the first wafer assembly 200 is inserted. Similarly, the wafer reference paths 131 and 134 are provided opposite to each other and form a reference path into which the wafer assemblies 300 and 400 (hereinafter also referred to as the second wafer assembly 300 and the third wafer assembly 400, respectively) are inserted, and stopper edges 1311 and 1341 are formed at the ends of the wafer reference paths 131 and 134 adjacent to the front port opening 12, respectively, so as to define the positions into which the second wafer assembly 300 and the third wafer assembly 400 are inserted. The wafer reference paths 132 and 135 are provided opposite to each other and form a reference path into which the wafer assembly 500 (hereinafter also referred to as the fourth wafer assembly 500, respectively) is inserted, and stopper edges 1321 and 1351 are formed at the ends of the wafer reference paths 132 and 135 adjacent to the front port, respectively, so as to define the positions into which the fourth wafer assembly 500 is inserted.

[0099] 10 and 11, two opposing side walls of the interior of the housing 100 are further formed with two slots 139, respectively, into which both ends of a support plate 600 (described below) can be inserted.

[0100] Next, with reference to Figures 12 and 13, a first wafer-like assembly 200, a second wafer assembly 300, a third wafer assembly 400 and a fourth wafer assembly 500 according to another embodiment of the present disclosure will be described in detail, with Figure 12 being an exploded top perspective view showing a wafer assembly of a connector according to another embodiment of the present disclosure, and Figure 13 being an exploded bottom perspective view showing a wafer assembly of a connector according to another embodiment of the present disclosure.

[0101] A first wafer assembly 200 according to another embodiment of the present disclosure similarly includes a terminal row 210 and a wafer mold insert 230, and the wafer mold insert 230 supports the terminal conductors of the terminal row 210 by maintaining a spacing between the terminal conductors. The wafer mold insert 230 further includes a structural feature for positioning and fixing the wafer assembly 200 in the housing 100 of the connector 10. More specifically, the wafer mold insert 230 includes guide flanges 232 and 233 located on both sides for guiding the wafer assembly 200 in the housing 100 during the assembly process of the connector 10, and the guide flanges 232 and 233 are respectively joined to the wafer reference passages 130 and 133 (i.e., fitted and slidably fitted into the wafer reference passages 130 and 133 with a minimum gap) and limit the limit position for inserting the first wafer assembly 200 into the housing 100 by stopper edges 1301 and 1331, respectively. The guide flanges 232 and 233 are provided with first protrusions 2321 (shown in FIG. 12) and 2331 (shown in FIG. 13), respectively. Referring to FIG. 10 and FIG. 11, when the first wafer assembly 200 is inserted into the housing 100, the first protrusions 2321 and 2331 are respectively engaged with the first engagement holes 175 provided in the two side walls of the metal part 170 of the housing 100, so as to realize the positioning of the first wafer assembly 200 in the housing 100. The installation positions of the first protrusions 2321, 2331 and the first engagement holes 175 are interchangeable, and other structural forms may be adopted. According to the embodiment shown in FIG. 12 and FIG. 13, the first protrusions 2321, 2331 are further provided with inclined surfaces so as to engage and guide the first protrusions 2321, 2331 with the first engagement holes 175. As shown in FIG. 13, a first positioning block 2301 is provided on the bottom surface of the wafer mold insert 230, and the first positioning block 2301 is provided closer to the front port opening 12 or the plastic portion 160 than the first protrusions 2321, 2331.When the first wafer assembly 200 is inserted into the housing 100, the first positioning block 2301 is joined to the first positioning groove 174 provided on the bottom surface of the metal part 170 of the housing 100. According to an embodiment, the first positioning block 2301 is a bump, and the first positioning groove 174 is a recessed groove. Referring to FIG. 9 and FIG. 13, the first positioning block 2301 is biased into the first positioning groove 174 by a support plate 600 (described below) to regulate the position, thereby realizing positioning along the left-right direction and the up-down direction. The first positioning block 2301 and the first positioning groove 174 may be tight-fitted or loose-fitted. Of course, the first positioning block 2301 and the first positioning groove 174 may also be mutually interchangeable to set the positions, or other forms may be adopted.

[0102] A second wafer assembly 300 according to another embodiment of the present disclosure similarly includes terminal row 310 and wafer mold insert 330 that supports and maintains the spacing between the terminal conductors in terminal row 310. Wafer mold insert 330 further includes structural features for positioning and securing wafer assembly 300 within housing 100 of connector 10. More specifically, wafer mold insert 330 includes interlocking flanges 332 (shown in FIG. 12) and 333 (shown in FIG. 13).

[0103] A third wafer assembly 400 according to another embodiment of the present disclosure similarly includes terminal row 410 and wafer mold insert 430 that supports and maintains the spacing between the terminal conductors in terminal row 410. Wafer mold insert 430 further includes structural features for positioning and securing wafer assembly 400 within housing 100 of connector 10. More specifically, wafer mold insert 430 includes interlocking flanges 432 (shown in FIG. 12) and 433 (shown in FIG. 13).

[0104] In addition, as shown in Figures 12 and 13, first positioning holes 3301 are provided on both side end surfaces of the wafer mold insert 330 of the second wafer assembly 300, and first positioning pillars 4301 are provided corresponding to both side end surfaces of the wafer mold insert 430 of the third wafer 400, and the first positioning pillars 4301 of the third wafer 400 can be inserted into the first positioning holes 3301 of the second wafer 300 so as to realize positioning between the second wafer 300 and the third wafer 400. The cross section of the first positioning hole 3301 shown in Figures 12 and 13 is semicircular, and correspondingly, the first positioning pillar 4301 is also semicylindrical to fit into each other, but is not limited to this, the first positioning pillar 4301 may also be cylindrical, rectangular, etc., and correspondingly, the cross section of the first positioning hole 3301 may be circular or rectangular, and the installation positions of the first positioning pillar 4301 and the first positioning hole 3301 are also interchangeable. A locking post 3302 is further provided on the top surface of the wafer mold insert 330 of the second wafer 300, and correspondingly, a locking hole 4302 is provided on the top surface of the wafer mold insert 430 of the third wafer 400. The locking post 3302 of the second wafer 300 may be drilled into the locking hole 4302 of the third wafer 400, and then melted and fixed in the locking hole 4302 by a method such as heat pressing, or the locking post 3302 may be fixed in the locking hole 4302 by interference fit, or the locking post 3302 and the locking hole 4302 may be interference fit and then melted and fixed to each other by heat pressing. 12 and 13 is a quadrangular prism, and the cross section of the locking hole 4302 is a corresponding rectangular shape, but is not limited thereto, and the locking post 3302 may be a semi-cylindrical, cylindrical, or other rectangular prism, and the cross section of the locking hole 4302 may be a semi-circular, circular, or other rectangular shape, and the installation positions of the locking post 3302 and the locking hole 4302 are interchangeable, and an appropriate number of the locking post 3302 and the locking hole 4302 can be installed as required. Through the engagement of the first positioning post 4301 with the first positioning hole 3301 and the engagement of the locking post 3302 with the locking hole 4302, the second wafer assembly 300 and the third wafer assembly 400 are integrally coupled to each other.After the connector 10 is attached, the interlock flanges 332 and 432 and the interlock flanges 333 and 433 which are joined to each other are respectively positioned in the reference passages 131 and 134 in the housing 100 with a minimum clearance and are slidable along the reference passages 131 and 134.

[0105] 12 and 13, wafer mold insert 430 of third wafer assembly 400 includes guide flanges 432A (shown in FIG. 12) and 433A (shown in FIG. 13) in addition to interlock flanges 432 and 433. Second positioning holes 4303 are provided on both ends of the top surface of wafer mold insert 430 of third wafer assembly 400.

[0106] A fourth wafer assembly 500 according to another embodiment of the present disclosure similarly includes a terminal row 510 and a wafer mold insert 530, and the wafer mold insert 530 supports the terminal conductors in the terminal row 510 by maintaining a space between the terminal conductors. The wafer mold insert 530 further includes a structural feature for positioning and fixing the wafer assembly 500 in the housing 100 of the connector 10. More specifically, the wafer mold insert 530 includes first guide flanges 532 (shown in FIG. 12 ) and 533 (shown in FIG. 13 ) and second guide flanges 532A (shown in FIG. 12 ) and 533A (shown in FIG. 13 ). Second positioning posts 5302 are provided on both sides of the wafer mold insert 530 of the fourth wafer assembly 500, and the second positioning posts 5302 may be inserted into the second positioning holes 4303 of the third wafer 400 to realize the positioning and fitting of the third wafer assembly 400 and the fourth wafer assembly 500. The second positioning pillar 5302 shown in Figures 12 and 13 is a rectangular pillar, and correspondingly, the cross section of the second positioning hole 4303 is also a rectangular shape that fits together, but is not limited to this, the second positioning pillar 5302 can also be a semi-cylindrical, cylindrical, other rectangular pillar, etc., and correspondingly, the cross section of the second positioning hole 4303 can also be a semi-circular, circular, or other rectangular shape, the installation positions of the second positioning pillar 5302 and the second positioning hole 4303 can also be interchangeable, and an appropriate number of second positioning pillars 5302 and second positioning holes 4303 can be installed according to needs. After the second wafer assembly 300 and the third wafer assembly 400 are entirely attached and positioned to each other via the engagement of the fourth wafer assembly 500 with the second positioning pillar 5302 and the second positioning hole 4303, the guide flanges 432A and 433A of the third wafer assembly 400 are aligned with the second guide flanges 532A and 533A of the fourth wafer assembly 500, respectively, and are positioned overall in the reference passage 136 (shown in Figures 10 and 11) in the housing 100 with minimal gap, and are able to slide along the reference passage 136.

[0107] A second protrusion 5301 is provided on both sides of the wafer mold insert 530 of the fourth wafer assembly 500, and as shown in Figures 8 and 9, the second protrusion 5301 of the fourth wafer assembly 500 can be inserted into a corresponding second engagement hole 176 provided on both side walls of the housing 100. Also, a protrusion 5304 is provided on one end of the top surface of the wafer mold insert 530 of the fourth wafer assembly 500 close to the front port opening 12, and the protrusion 5304 is inserted into an engagement groove 177 provided on the top surface of the housing 100. The protrusion 5304 can be tightly fitted into the engagement groove 177.

[0108] Considering that the length of the fourth wafer assembly 500 is long and the span distance when the fourth wafer assembly 500 is installed in the housing 100 is also large, a second positioning block 5303 is provided at one end of the top surface of the wafer mold insert 530 of the fourth wafer assembly 500 that is away from the front port opening 12 so that the rear end of the fourth wafer assembly 500 (i.e., the end away from the front port opening 12) does not sag or warp left and right, and the second positioning block 5303 is preferably provided at a middle position along the left and right direction. When the fourth wafer assembly 500 is installed in the housing 100, the second positioning block 5303 is fitted with the second positioning groove 173 provided on the top surface of the metal part 170 of the housing 100. When the second positioning groove 173 is in the form of a dovetail groove, the second positioning block 5303 is also in the form of a dovetail groove, but is not limited thereto.

[0109] 12 and 13 further show a support plate 600, the middle part of which abuts against the bottom of the second wafer 300, and both ends of which are inserted into slots 139 (shown in FIGS. 10 and 11 ) provided on the two inner walls of the housing 100, respectively. The support plate 600 abuts against the lower middle part of the second wafer 200 to avoid sinking and warping thereof. Meanwhile, the support plate 600 has a certain elasticity, so as to provide a certain elasticity to the second wafer assembly 300, the third wafer assembly 400 and the fourth wafer assembly 500 mounted as a whole, to compensate for the mounting error thereof, to ensure the tight fit of the second wafer assembly 300, the third wafer assembly 400 and the fourth wafer assembly 500, and to absorb the force of the second wafer assembly 300, the third wafer assembly 400 and the fourth wafer assembly 500 when they are pressed against each other.

[0110] After assembling the first wafer assembly 200, the second wafer assembly 300, the third wafer assembly 400, and the fourth wafer assembly 500, the structure is as shown in FIGS. 14 and 15. FIGS. 14 and 15 are a perspective view and a schematic cross-sectional view showing the first wafer assembly 200, the second wafer assembly 300, the third wafer assembly 400, and the fourth wafer assembly 500 of the connector according to other embodiments of the present disclosure, respectively. The lead contacts of the terminal row 210 of the first wafer assembly 200 are directed toward the lead contacts of the terminal row 510 of the fourth wafer 500, and the lead contacts of the terminal row 310 of the second wafer assembly 300 are directed toward the lead contacts of the terminal row 410 of the third wafer plastic 400. As shown in FIG. 15, the terminal tail structures of the first wafer assembly 200, the second wafer assembly 300, the third wafer assembly 400, and the fourth wafer assembly 500 are all bent at about 90° to improve the coplanarity of the terminal tails. Also, the tips of the guide flanges 232 and 233 of the first wafer assembly 200 (proximate to the front port opening 12) are the first edge L1, the tips of the interlock flanges 332, 432 and 333, 433 of the second wafer assembly 300 and the third wafer assembly 400 (proximate to the front port opening 12) are the second edge L2, and the tips of the first guide flanges 532 and 533 of the fourth wafer 500 (proximate to the front port opening 12) are the third edge L3. As shown in FIG. 15, the first edge L1 is closest to the front port opening 12, followed by the third edge L3, and then the second edge L2. Correspondingly, referring to FIGS. 10 and 11, after attaching the connector 10, the stopper edges 1301 and 1331 of the wafer reference passages 130 and 133 join the first edge L1 and are closest to the front port opening 12, and the stopper edges 1311 and 1341 of the wafer reference passages 131 and 134 join the second edge L2 and are farthest from the front port opening 12.Stop edges 1321 and 1351 of wafer reference passages 132 and 135 join third edge L3 and are slightly away from front port opening 12 and closer to stop edges 1301 and 1331.

[0111] Next, referring to Figures 16A and 16B, Figure 16A is a schematic top view of a connector according to another embodiment of the present disclosure, and Figure 16B is a cross-sectional view taken along line AA in Figure 16A, showing the connector according to another embodiment of the present disclosure. When the connector according to the present disclosure requires belly-to-belly soldering attachment, that is, when both the front and back sides of the PCB board need to be soldered, four tabs 20 can be provided on the bottom surface of the connector 10 to solder to the PCB board and assist the double-sided soldering operation. The cross-sectional view of Figure 16B shows a support plate 600 that supports the first wafer assembly 200, and the support plate 600 abuts against the center position of the bottom surface of the first wafer assembly 200, and its specific installation and function are as described above.

[0112] Connectors according to other embodiments of the present disclosure may include the rigid and flexible shields described in the above embodiments to form a ground path assembly for each wafer 200, 300, 400, 500. Connectors according to other embodiments of the present disclosure and the above embodiments may also include a flexible shield 290 as follows.

[0113] Referring to FIG. 17, which is a schematic diagram showing a flexible shield according to another embodiment, the flexible shield 290 has a contact surface area terminated on a surface area of ​​a ground terminal among a plurality of terminal conductors of each wafer so as to sandwich the contact surface area. Specifically, as shown in FIG. 17, the flexible shield 290 includes a plurality of beam portions 291, a plurality of clamping portions 292, a plurality of abutting portions 293, a plurality of first shielding portions 294, and a plurality of second shielding portions 295. The plurality of clamping portions 292 of each flexible shield 290 are spaced apart along the left-right direction Y, and are aligned with a plurality of ground terminals of the corresponding wafers. Each clamping portion 292 of each flexible shield 290 has a rib portion 296 extending along the up-down direction Z, and a pair of clamp arms 297 that extend from both sides of the rib portion 296 in the same direction (i.e., in the direction approaching the corresponding ground terminal) and curl inward. The clamp arms 297 are clamped to the welded segments of the ground terminals, respectively. The beam portions 291 of each flexible shield 290 are vertically spaced apart from each other and disposed between two adjacent clamping portions 292, and both left and right ends of each beam portion 291 are connected to the two adjacent clamping portions 292. In the embodiment shown in Fig. 17, the number of the clamping portions 292 is equal to the number of the ground terminals, but is not limited to a specific number, and the number of the clamping portions 292 may be less than the number of the ground terminals.

[0114] Terms such as "top", "bottom", "side", "front", "rear", "right" and "left" are not intended to provide an absolute reference system. On the contrary, these terms are relative and are intended to identify certain features relative to one another as the orientation of the structures described in this disclosure may vary. Terms such as "comprise", "include", "have" and the like are synonymous, used in an open manner and do not exclude additional elements, features, acts, operations, etc. Additionally, the term "or" is used in an inclusive rather than exclusive sense, so that, for example, when used to connect a series of elements, the term "or" means one, some or all of the elements in the list.

[0115] Unless otherwise indicated, combination language, such as "at least one of X, Y, and Z" or "at least one of X, Y, or Z" is generally used to represent one of them, a combination of any two of them, or all three (or more, if a larger group is determined), such as X with only X, Y with only Y, Z with only Z, a combination of X and Y, a combination of X and Z, a combination of Y and Z, and all combinations of X, Y, and Z. Such combination language is generally not intended and does not indicate or require the inclusion of at least one of X, at least one of Y, and at least one of Z, unless otherwise indicated. The terms "about" and "essentially" describe at least some manufacturing tolerances between theoretically designed and manufactured products or assemblies, such as the geometric dimensioning and tolerance standards set forth in American Society of Mechanical Engineers (ASME®) Y14.5 and related International Organization for Standardization (ISO®) standards, unless otherwise defined in this disclosure as relating to a specific range, percentage, or related deviation measure. As one skilled in the art will appreciate, this manufacturing tolerance is taken into account when theoretical terms, such as the geometric terms "perpendicular," "orthogonal," "vertex," "collinear," "coplanar," and other terms are used in combination, even without expressly reciting the terms "approximately," "essentially," or related terms.

[0116] The above-described embodiments of the present disclosure are merely examples implemented to provide a clear understanding of the principles of the present disclosure. Many changes and modifications can be made to the above-described embodiments without substantially departing from the spirit and principles of the present disclosure. In addition, elements and features described with respect to one embodiment may be included in another embodiment. All of these modifications and changes are intended to be included within the scope of the present disclosure.

Claims

1. Housing and a wafer assembly including a terminal array, a wafer mold insert, and a ground path assembly, The terminal row includes a plurality of terminal conductors, the ground path assembly includes a ground shield; A connector, wherein a contact surface area of ​​the ground shield is terminated to a surface area of ​​a ground terminal of a plurality of terminal conductors in the wafer assembly.

2. The connector of claim 1 , wherein the shield extension region of the ground shield extends across signal terminals of a plurality of terminal conductors in the wafer assembly.

3. the ground shield includes a plurality of segments and bends between the plurality of segments; 2. The connector of claim 1, wherein a contact surface area of ​​each of the plurality of segments of the ground shield is terminated to a corresponding surface area of ​​a ground terminal on the wafer assembly.

4. the ground shield comprises a rigid ground shield; the ground path assembly further comprising a flexible ground shield; a contact surface area of ​​the rigid ground shield being terminated to a bottom surface area of ​​a ground terminal of a plurality of terminal conductors of the wafer assembly; The connector of claim 1 , wherein a contact surface area of ​​the flexible ground shield is terminated to a top surface area of ​​a ground terminal of a plurality of terminal conductors in the wafer assembly.

5. The connector of claim 1 , wherein the ground path assembly includes a plurality of rigid ground shields and a plurality of flexible ground shields.

6. 2. The connector of claim 1, wherein said housing includes foot latch fingers formed on a bottom of said housing and wafer reference passages and latch fingers formed on a side of said housing.

7. the wafer mold insert includes an interlocking flange; the housing includes latch fingers formed on a side of the housing; 2. The connector of claim 1, wherein latch fingers of the housing engage an interlocking flange of the wafer mold insert in a mechanically interfering position when the wafer assembly is inserted into the housing.

8. the wafer mold insert includes interlocking legs; the housing includes latch fingers formed on a bottom of the housing; 2. The connector of claim 1, wherein leg latch fingers of the housing engage interlocking legs of the wafer mold insert in a mechanical interference position when the wafer assembly is inserted into the housing.

9. the wafer mold insert includes an interlocking flange; the housing includes a wafer reference passage and a latch finger portion formed in a side of the housing; 2. The connector of claim 1, wherein when the wafer assembly is inserted into the housing, an interlocking flange of the wafer mold insert slides into a wafer reference passage of the housing and a latch finger portion of the housing engages in a mechanically interfering position with the interlocking flange of the wafer mold insert.

10. a second wafer assembly including a second row of terminals, a second wafer mold insert, and a second ground path assembly; the second wafer mold insert includes a positioning receptacle; the wafer mold insert includes a positioning post; The connector of claim 1 , wherein alignment posts of said wafer assembly extend into alignment receptacles of said second wafer assembly.

11. 2. The connector of claim 1, further comprising a second wafer assembly including a second row of terminals, the ground shield of the wafer assembly extending between the row of terminals of the wafer assembly and the second row of terminals of the second wafer assembly.

12. The connector of claim 1 , wherein a contact surface area of ​​the ground shield is laser welded to a surface area of ​​the ground terminal.

13. A terminal row; A wafer mold insert; a ground path assembly, The terminal row includes a plurality of terminal conductors, the ground path assembly includes a rigid ground shield and a flexible ground shield; a contact surface area of ​​the rigid ground shield terminated to a first surface area of ​​a ground terminal of a plurality of terminal conductors in the wafer assembly; A wafer assembly, wherein a contact surface area of ​​the flexible ground shield is terminated to a second surface area of ​​a ground terminal on the wafer assembly.

14. a shield extension region of the rigid ground shield extends across signal terminals of a plurality of terminal conductors in the wafer assembly; The wafer assembly of claim 13 , wherein the shield extension area of ​​the flexible ground shield extends across signal terminals in the wafer assembly.

15. the rigid ground shield includes a plurality of segments and a curved portion between the plurality of segments; 14. The wafer assembly of claim 13, wherein a contact surface area of ​​each of the plurality of segments of the rigid ground shield is terminated to a corresponding surface area of ​​a ground terminal on the wafer assembly.

16. a contact surface area of ​​the rigid ground shield terminates to an underside area of ​​a ground terminal of the wafer assembly; The wafer assembly of claim 13 , wherein a contact surface area of ​​the flexible ground shield is terminated to a top surface area of ​​a ground terminal on the wafer assembly.

17. Housing and a first wafer assembly including a first row of terminals, a first wafer mold insert, and a first ground path assembly; a second wafer assembly including a second row of terminals, a second wafer mold insert, and a second ground path assembly, the first ground path assembly includes a first ground shield; the second ground path assembly includes a second ground shield; a contact surface area of ​​the first ground shield terminates to a first surface area of ​​a ground terminal of a first row of terminals of the first wafer assembly; A connector, wherein a contact surface area of ​​the second ground shield is terminated to a second surface area of ​​a ground terminal of a second row of terminals in the second wafer assembly.

18. the first ground path assembly includes a first plurality of rigid ground shields and a flexible ground shield; 20. The connector of claim 17, wherein the second ground path assembly includes a second plurality of rigid ground shields and a flexible ground shield.

19. the first wafer mold insert includes a first interlocking flange; the second wafer mold insert includes a second interlocking flange; the housing includes first and second latch finger portions formed on a side of the housing; 18. The connector of claim 17, wherein when the first wafer assembly and the second wafer assembly are inserted into the housing, a first latch finger portion of the housing engages into a position that mechanically interferes with the first interlocking flange and a second latch finger portion of the housing engages into a position that mechanically interferes with the second interlocking flange.

20. the second wafer mold insert includes a positioning receptacle; the first wafer mold insert includes a positioning post; 20. The connector of claim 17, wherein the alignment posts extend into the alignment receptacles to align the first and second wafer assemblies.

21. 20. The connector of claim 1 or 17, wherein the housing includes a plastic portion and a metal portion, and the front port opening of the connector is formed in the plastic portion.

22. 22. The connector of claim 21, wherein the plastic portion includes a first engagement portion and the metal portion includes a second engagement portion, the first engagement portion and the second engagement portion mating to couple the plastic portion and the metal portion.

23. 23. The connector of claim 22, wherein the plastic portion has a connecting protrusion, the metal portion has a connecting hole, and the connecting protrusion is insertable and fixed into the connecting hole to realize a connection between the plastic portion and the metal portion.

Images