Electrical connector and connection body between electrical connector and circuit board

Abstract

To provide an electrical connector capable of stabilizing the electrical connection of the ground between the electrical connector and a circuit board while ensuring the respective functions of the signal contact and the ground contact.SOLUTION: An electrical connector of the present invention comprises an organizer 30 having a plurality of signal contacts 13, a plurality of ground contacts 15, and a wafer 11 supporting the plurality of signal contacts 13 and the plurality of ground contacts 15, and attached to the wafer 11 and conducting with the plurality of ground contacts 15, and at least one ground plate 40 attached to the organizer 30 and conducting with the organizer 30, and the ground plate 40 is formed with a plurality of plate springs 42 as a plurality of spring bodies in contact with a circuit board 20.SELECTED DRAWING: Figure 6

Description

[Technical field]

[0001] The present invention relates to an electrical connector for connection with a substrate. [Background technology]

[0002] In a server or router in a connection system used for data communication purposes in a data center or the like, it may be required to connect two circuit boards oriented at 90° to each other. In this case, a male connector and a female connector as electrical connectors are connected to each of the two circuit boards, and the two circuit boards are connected to each other by connecting the male connector and the female connector. This type of electrical connector is disclosed in, for example, Patent Document 1 and Patent Document 2, in which signal contacts for transmitting signals and ground contacts for ground (GND) are arranged at high density. The electrical connectors in Patent Document 1 and Patent Document 2 are configured by stacking the required number of wafers supporting the signal contacts and the ground contacts. An example of the wafer is described in detail in, for example, Patent Document 3. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Special Publication No. 2005-527068 [Patent Document 2] Special Publication No. 2008-535185 [Patent Document 3] Patent Publication No. 2021-2465 Summary of the Invention [Problem to be solved by the invention]

[0004] In a connection between an electrical connector having high density signal contacts and ground contacts and a circuit board, which requires high data transfer speeds, it is necessary to stabilize the electrical ground connection between the electrical connector and the circuit board while ensuring the functionality of the connections of the signal contacts and each of the other signal contacts. Therefore, an object of the present invention is to provide an electrical connector that can stabilize the electrical ground connection between the electrical connector and the circuit board while ensuring the respective functions of the signal contacts and the ground contacts. [Means for solving the problem]

[0005] The electrical connector of the present invention includes a plurality of signal contacts, a plurality of ground contacts, a wafer supporting the plurality of signal contacts and the plurality of ground contacts, an organizer attached to the wafer and in electrical communication with the plurality of ground contacts, and at least one ground member attached to the organizer and in electrical communication with the organizer, the ground member having a plurality of spring bodies formed thereon for contacting a circuit board.

[0006] In the electrical connector of the present invention, each of the spring bodies is preferably formed in a cantilever structure, with at least a portion of the cantilever structure extending in a direction approaching the circuit board.

[0007] In the electrical connector of the present invention, each of the spring bodies is preferably composed of a spring body extending in the lateral direction and a spring body extending in the vertical direction.

[0008] In the electrical connector of the present invention, preferably, at least one spring body is formed for each pair of signal contacts.

[0009] In the electrical connector of the present invention, each of the plurality of ground contacts is preferably a press-fit type contact.

[0010] In the electrical connector of the present invention, the organizer preferably includes a conductive film formed on the conductive portion with the ground contact and the mounting portion with the ground member, and a molded body made of an electrically insulating material that supports the conductive film.

[0011] The present invention provides a connection between any of the above-described electrical connectors and a circuit board, in which the circuit board includes a signal electrode and a ground electrode, the signal contact of the electrical connector being electrically connected to the signal electrode of the circuit board, and the ground contact of the electrical connector being electrically connected to the ground electrode of the circuit board. Effect of the Invention

[0012] The electrical connector of the present invention comprises an organizer that is attached to a wafer and is electrically conductive with a plurality of ground contacts, and at least one ground member that is attached to the organizer and is electrically conductive with the organizer, the ground member having a plurality of spring bodies formed thereon that contact the circuit board. This makes it possible to stabilize the electrical connection of the ground between the organizer and the circuit board while ensuring the respective functions of the signal contacts and the ground contacts. [Brief description of the drawings]

[0013] [Figure 1] 1A and 1B are diagrams showing an electrical connector according to a first embodiment. [Diagram 2] 2A and 2B are diagrams illustrating the relationship between the electrical connector and a circuit board according to the first embodiment. [Diagram 3] 3A and 3B are diagrams illustrating the relationship between a ground member and the ground of a circuit board according to the first embodiment. [Figure 4] FIG. 2 shows the electrical connector according to the first embodiment, in which a ground member is installed on the ground of a circuit board. [Diagram 5] 1 is a perspective view showing a portion of a circuit board according to a first embodiment. [Figure 6] 1 is a perspective view showing signal contacts, ground contacts, and a portion of an organizer of an electrical connector according to a first embodiment. FIG. [Figure 7] FIG. 2 is a diagram showing an organizer and a ground member according to the first embodiment. [Figure 8] FIG. 11 is a diagram showing an organizer and a ground member according to a second embodiment. [Figure 9] FIG. 13 is a diagram showing an organizer and a ground member according to a third embodiment. [Figure 10] FIG. 11 is a perspective view showing a signal contact, a ground contact, an organizer, and a portion of a ground member of an electrical connector according to a fourth embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] Hereinafter, a connection between an electrical connector and a circuit board according to an embodiment of the present invention will be described with reference to the accompanying drawings. This connection means that it involves both electrical connection and mechanical connection. [First embodiment: see Figs. 1 to 7] As shown in Fig. 1, the electrical connector 10 of the first embodiment includes a wafer 11, a plurality of signal contacts 13, a plurality of ground contacts 15, and an organizer 30. As shown in Fig. 2, the electrical connector 10 is connected to a circuit board 20 to form a connection body. Although not shown, as an example, the electrical connector 10 and another electrical connector are fitted together to form a DPO (Direct Plug Orthogonal) in which the circuit board 20 and the other circuit board are oriented orthogonally to each other. In the DPO, electrical signals transmitted and received between the circuit board 20 of the connection body of this embodiment and the circuit board of the other connection body are passed between the electrical connector 10 and the other electrical connector. The electrical connector 10 in this embodiment comprises an organizer 30 that is electrically connected to a plurality of ground contacts 15, and a ground plate 40 as at least one ground member that is attached to the organizer 30 and is electrically connected to the organizer 30. The ground plate 40 as a ground member has a plurality of leaf springs 42 formed thereon as a plurality of spring bodies that contact the circuit board 20.

[0015] [Electrical connector 10: see Figures 1, 2, 3, and 6] The electrical connector 10 is configured by stacking a plurality of wafers 11. To explain a schematic configuration example of the wafer 11, it is provided with two wiring boards and two shielding plates. The wiring boards and the shielding plates are generally rectangular in plan view. The two wiring boards are plate-like members in which metal wiring consisting of an array of multiple individual wirings is insert-molded into a resin plate. At one end of each of the individual wirings constituting the metal wiring, a contact is formed to contact a contact of another electrical connector, which is a mating connector. At the other end of each of these individual wirings, multiple pressure-displacement signal contacts 13 are arranged, which are in electrical contact with multiple signal electrode pads 23 formed on a circuit board 20 (FIG. 2). The signal electrode pads 23 correspond to the signal electrodes of the present invention. The two shield plates are arranged to sandwich the two overlapping wiring boards from both sides. On one side of each of these two shield plates, a plurality of ground contacts are arranged to be connected to ground contacts of another mating electrical connector. In addition, on the other side of these two shield plates 14 (FIG. 3), a plurality of ground contacts 15 are arranged to be inserted into a plurality of through-hole electrodes 25 as a plurality of ground electrodes. The through-hole electrodes 25 function as ground electrodes formed on the circuit board 20.

[0016] As an example, a spring contact is applied as the signal contact 13. The contact portion side of the signal contact 13 is the tip. When the contact portion is pressed against the signal electrode pad 23 during the process of assembling the electrical connector 10 and the circuit board 20, the contact portion is pressed against the signal electrode pad 23. The signal contacts 13 are formed by punching and bending a plate material made of a copper alloy having excellent electrical conductivity and elasticity, for example. The ground contacts 15 are also formed in the same manner.

[0017] As an example, the ground contact 15 is a press-fit type contact. The ground contact 15 is also called a needle-eye type, and as shown in FIG. 6, is composed of a press-fit portion 15A, a guide portion 15B connected to one side of the press-fit portion 15A, and a base portion 15C connected to the other side of the press-fit portion 15A. The press-fit portion 15A includes a pair of elastic press-connecting pieces 15A1, 15A1, and a gap 15A2 sandwiched between the elastic press-connecting pieces 15A1, 15A1. The elastic press-connecting pieces 15A1, 15A1 each have a double-support structure, and are curved in an arc shape outward with the gap 15A2 between them. Therefore, the elastic press-connecting pieces 15A1, 15A1 can bend inward or outward with the gap 15A2 between them, and can be elastically deformed. When the ground contact 15 is inserted into the through-hole electrode 25, the elastic insulation displacement pieces 15A1, 15A1 are elastically deformed inward using the gap 15A2 as a bending gap, and the outer circumferential surfaces of the elastic insulation displacement pieces 15A1, 15A1 are pressed against the through-hole electrode 25 by the reaction force.

[0018] [Circuit board 20: see Figures 2, 3, and 5] The circuit board 20 comprises a substrate body 21 having a front surface 21A and a rear surface 21B, a plurality of signal electrode pads 23 formed on the front surface 21A of the substrate body 21, and a plurality of through-hole electrodes 25 formed to penetrate the front surface 21A and the rear surface 21B of the substrate body 21.

[0019] The substrate body 21 is formed by laminating a plurality of substrate materials. The substrate materials have signal paths (not shown) formed therein, which are connected to a plurality of signal electrode pads 23 formed on the front surface 21A. The substrate body 21 has a conductive film CP formed by plating, for example, on the front surface 21A, except for the periphery of a pair of adjacent signal electrode pads 23, 23 and the periphery of an opening of a non-plate through hole.

[0020] The signal electrode pads 23 are pressed against the signal contacts 13 of the electrical connector 10 attached to the circuit board 20, thereby transmitting and receiving electrical signals between the electrical connector 10 and the circuit board 20. In Fig. 2, Fig. 3 and Fig. 5, the signal electrode pads 23 are shown on the front surface 21A of the board body 21, but inside the board body 21, a signal path related to the transmission and reception of electrical signals electrically connected to each of the multiple signal electrode pads 23 is formed along the planar direction of the board body 21. This signal path is formed so as to avoid the through-hole electrodes 25.

[0021] Although an example is shown here in which the signal electrode pads 23 are used to electrically connect to the pressure-displacement signal contacts 13, the signal contacts 13 may be press-fit like the ground contacts 15, and the press-fit signal contacts 13 may be inserted into through-hole electrodes formed in the circuit board 20. However, the signal electrode pads 23 are advantageous in terms of ensuring the mechanical strength of the board body 21 since there is no need to form through holes in the board body 21, and in addition, a signal path can be formed inside the board body 21 even if the signal electrode pads 23 are formed on the front surface 21A.

[0022] 5, the through-hole electrode 25 is composed of a through hole TH formed in the substrate body 21 and a conductive film CP formed, for example by plating, on the wall surface in the thickness direction of the substrate body 21 surrounding the through hole TH. The conductive film CP is usually also formed around the opening of the through-hole electrode 25 on the front surface 21A and the back surface 21B. When the ground contact 15 is inserted into the through-hole electrode 25, the elastic pressure-displacement pieces 15A1, 15A1 of the press-fit portion 15A elastically deform toward the inner gap, as shown in Fig. 6. The reaction force presses the outer circumferential surfaces of the elastic pressure-displacement pieces 15A1, 15A1 against the conductive film CP of the through-hole electrode 25, thereby establishing a ground (GND) between the electrical connector 10 and the circuit board 20.

[0023] [Organizer 30: See Figures 6 and 7] The organizer 30 functions as a ground (GND) between itself and the ground contacts 15 via a ground plate 40 serving as a ground member, so that both are at the same potential. The organizer 30 is formed as a single unit by injection molding an electrically insulating resin material, for example. The organizer 30 has a conductive film CP formed by plating on the conductive portion with the ground contact 15 and the mounting portion with the ground plate 40 as the ground member. In this embodiment, the conductive film CP is formed by plating on the entire surface of the organizer 30. The plating constituting the conductive film CP is a known plating such as gold plating, silver plating, etc. The conductive film CP is not limited to plating, and may be formed by other means such as deposition, sputtering, etc. The signal electrode pad 23 is also formed from a similar conductive film. For convenience of explanation, a horizontal direction W, a vertical direction D, and a height direction H are defined as shown in FIG.

[0024] 7, the organizer 30 includes an organizer body 31, storage spaces 32, insertion holes 33, and gaps 34. The storage spaces 32, the insertion holes 33, and the gaps 34 are arranged in a lattice or matrix in the horizontal direction W and the vertical direction D, respectively.

[0025] The accommodation space 32 is a gap penetrating in the height direction H, and a pair of signal contacts 13, 13 are accommodated in this gap. The through holes 33 have a rectangular opening shape, and the ground contacts 15 are inserted through the organizer 30 by penetrating the front and back of the organizer 30. The through holes 33 are provided in pairs, and the two through holes 33 are provided at an interval in the vertical direction D. Therefore, as a whole, the multiple through holes 33 are lined up in the vertical direction D and the horizontal direction W. The organizer 30 also has a press-fit support portion (not shown) deeper than the through holes 33 into which the bases 15C of the ground contacts 15 are press-fitted. When the bases 15C are press-fitted, the press-fit support portion mechanically restrains the bases 15C, thereby positioning the ground contacts 15. When the bases 15C of the ground contacts 15 are press-fitted into the press-fit support portion, the conductive film CP formed on the entire surface of the organizer 30 is electrically connected to the ground contacts 15. The gap 34 is a gap that penetrates in the height direction H, and a ground plate 40 serving as a ground member is attached in this gap.

[0026] [Ground plate 40: Figures 3, 4, 7] The ground plate 40 as a ground member functions as a ground (GND) between itself and the ground contacts 15 via the conductive film CP formed on the organizer 30, and both are at the same potential. As shown in FIG. 7, the ground plate 40 includes a ground plate body 41, a plurality of leaf springs 42 serving as a plurality of spring bodies in contact with the circuit board 20, and a plurality of mounting portions 43. The ground plate 40 is formed, for example, by punching and bending a plate material made of a copper alloy having excellent electrical conductivity and elasticity.

[0027] In this embodiment, the gland plate body 41 is generally ladder-shaped when viewed from above. The ladder-shaped gland plate body 41 is composed of horizontal members 45 corresponding to the rungs of the ladder and vertical members 46 corresponding to the posts of the ladder. In this embodiment, the ladder-shaped gland plate body 41 is composed of nine horizontal members 45 and two vertical members 46. The horizontal members 45 are arranged at equal intervals from each other in the vertical direction D. A pair of vertical members 46 is connected to both ends of the horizontal members 45 in the horizontal direction W. An opening surrounded by two adjacent horizontal members 45 and two vertical members 46 of the gland plate body 41 is an arrangement space 44 in which the storage space 32 and two insertion holes 33 arranged in the horizontal direction W are arranged. A plurality of arrangement spaces 44 are arranged in the vertical direction D of the gland plate body 41. The horizontal members 45 are arranged generally parallel to the storage space 32 and the two insertion holes 33 arranged in the horizontal direction W.

[0028] The horizontal member 45 is formed with a plurality of leaf springs 42 as a plurality of spring bodies contacting the circuit board 20 and two mounting portions 43. One leaf spring 42 is formed on the vertical direction D side of the accommodation space 32 in which the pair of signal contacts 13, 13 is accommodated when the ground plate 40 is attached to the organizer 30. By forming one leaf spring 42 for each pair of signal contacts 13, 13 arranged in the vertical direction D, the leaf spring 42 is arranged on both sides of the pair of signal contacts 13, 13 in the vertical direction D. In addition, by arranging the ground contacts 15 on both sides of the pair of signal contacts 13, 13 in the horizontal direction W, when the electrical connector 10 and the circuit board 20 are connected, the ground between the electrical connector 10 and the circuit board 20 functions to surround the connection portion between the signal contact 13 and the signal electrode pad 23. As a result, the connection between the electrical connector 10 and the circuit board 20 has a shielding function around the signal contact zone and can adjust impedance.

[0029] In this embodiment, the leaf spring 42 is formed in a cantilever structure, and the free end of the cantilever structure extends so as to approach the circuit board 20. As shown in FIG. 4, when the electrical connector 10 and the circuit board 20 are connected, the free end side of the leaf spring 42 of the cantilever structure comes into contact with the conductive film CP formed on the front surface 21A of the circuit board 20, so that a ground functions between the electrical connector 10 and the circuit board 20. The leaf spring 42 functions as a ground when a part of the cantilever structure extending to approach the circuit board 20 comes into contact with the circuit board 20 at any position in the lateral direction W, thereby improving the reliability of the electrical connection. In this embodiment, the free end of the cantilever structure extends so as to approach the circuit board 20, but this is not limited thereto. For example, at least a part of the cantilever structure may extend so as to approach the circuit board 20, such as a structure in which a part of the cantilever structure extends so as to approach the circuit board 20 and then the tip side of the free end hangs down. Furthermore, when the electrical connector 10 and the circuit board 20 are connected, the free end side of the cantilevered leaf spring 42 is pressed against the circuit board 20, so that stress is generated in the cantilevered leaf spring 42.

[0030] In this embodiment, the leaf spring 42 has a tapered shape toward the free end of the cantilever support structure. In such a leaf spring 42, the rigidity in the thickness direction of the leaf spring 42 decreases from the support end toward the free end. As a result, when the leaf spring 42 is pressed against the circuit board 20, the region close to the free end with low rigidity bends in accordance with the circuit board 20, making it easier to make surface contact with the circuit board 20. In addition, since the support end portion with high rigidity exists, the pressure for contacting the circuit board 20 can be secured, so that stable surface contact between the leaf spring 42 and the circuit board 20 can be realized, and stable electrical connection can be maintained at the connection portion between the electrical connector 10 and the circuit board 20.

[0031] 4 due to thermal expansion and contraction caused by temperature changes, vibration, or the like, the leaf spring 42 elastically deforms and follows the generated displacement in the height direction H, thereby maintaining the ground function between the electrical connector 10 and the circuit board 20, surrounding the connection between the signal contact 13 and the signal electrode pad 23. Thus, the ground plate 40 as a ground member can maintain a stable electrical connection between the organizer 30 on which the conductive film CP is formed, and the conductive film CP formed on the front surface 21A of the circuit board 20.

[0032] Furthermore, when the electrical connector 10 and the circuit board 20 are connected, the leaf spring 42 of the ground plate 40 generates a reaction force that tries to separate the electrical connector 10 and the circuit board 20. However, when the ground contact 15 is inserted into the through-hole electrode 25, the elastic pressure contact pieces 15A1, 15A1 of the press-fit portion 15A elastically deform toward the inner gap, and the reaction force presses the outer circumferential surfaces of the elastic pressure contact pieces 15A1, 15A1 against the conductive film CP of the through-hole electrode 25, thereby generating a holding force for the connection between the electrical connector 10 and the circuit board 20 against the reaction force of the leaf spring 42 of the ground plate 40.

[0033] In this embodiment, the press-fit type ground contacts 15 and the insulation displacement type signal contacts 13 are exemplified as electrical connections, but as described above, by making the signal contacts 13 press-fit like the ground contacts 15, the holding force of the connection between the electrical connector 10 and the circuit board 20 can be further strengthened against the reaction force of the leaf spring 42 of the ground plate 40. This allows the connection between the electrical connector 10 and the circuit board 20 to maintain an even more stable electrical connection.

[0034] The ground plate 40 is attached to the organizer 30 by inserting the attachment portion 43 into the gap 34 of the organizer 30. As shown in FIG. 7, the attachment portion 43 is formed to extend perpendicularly to the plane of the cross member 45. In this embodiment, two attachment portions 43 are formed for one cross member 45. In addition, in order to improve the attachment stability when the attachment portion 43 is inserted into the gap 34 of the organizer 30, the attachment portion 43 is formed with a protrusion 43A near the center of the attachment portion 43 in the height direction H and the horizontal direction W. In this embodiment, one attachment portion 43 is formed with one protrusion 43A, but two or more protrusions 43A may be formed for one attachment portion 43 in order to further improve the attachment stability.

[0035] When the ground plate 40 is viewed from above, the leaf springs 42 are formed on one side of the cross member 45 in the vertical direction D, and the mounting portions 43 are formed on the other side of the cross member 45 in the vertical direction D. The leaf springs 42 and the mounting portions 43 are alternately formed in the horizontal direction W of the cross member 45. In addition, the mounting portions 43 are formed on the vertical direction D sides of the two ground contacts 15 when the ground plate 40 is attached to the organizer 30.

[0036] One ground plate 40 is attached to one organizer 30. Therefore, the process of attaching the ground plate 40 to the organizer 30 is simplified.

[0037] [Effects of the Electrical Connector 10] The electrical connector 10 according to the first embodiment described above provides the following advantages. The electrical connector 10 is attached to the organizer 30 and includes at least one grounding member, a ground plate 40, which is electrically connected to the organizer 30. The grounding member, the ground plate 40, is formed with a plurality of leaf springs 42 serving as a plurality of spring bodies.

[0038] As a result, even if slight displacement occurs at the connection between the electrical connector 10 and the circuit board 20 due to thermal expansion and thermal contraction caused by temperature changes or vibrations when the electrical connector 10 and the circuit board 20 are connected, the leaf springs 42 elastically deform to accommodate the displacement, thereby maintaining the ground function between the electrical connector 10 and the circuit board 20, surrounding the connection between the signal contacts 13 and the signal electrode pads 23. Therefore, the ground plate 40 as a ground member can maintain a stable electrical connection between the organizer 30 on which the conductive film CP is formed, and the circuit board 20.

[0039] Furthermore, in the electrical connector 10 , each of the plurality of leaf springs 42 serving as the plurality of spring bodies is formed in a cantilever structure, with at least a portion of the cantilever structure extending toward the circuit board 20 . As a result, the spring 42 functions as a ground when it comes into contact with the circuit board 20 at any position in the lateral direction W of a part of the cantilever support structure extending toward the circuit board 20, thereby improving the reliability of the electrical connection.

[0040] In the electrical connector 10, the leaf spring 42 has a tapered shape toward the free end of the cantilever support structure. In such a leaf spring 42, the rigidity in the thickness direction of the leaf spring 42 decreases from the support end toward the free end. As a result, when the leaf spring 42 is pressed against the circuit board 20, the region close to the free end with low rigidity bends in accordance with the circuit board 20, making it easier to make surface contact with the circuit board 20. In addition, the presence of the support end portion with high rigidity ensures pressure for contact with the circuit board 20, thereby realizing stable surface contact between the leaf spring 42 and the circuit board 20 and maintaining stable electrical connection at the connection portion between the electrical connector 10 and the circuit board 20.

[0041] The leaf spring 42 is formed in a cantilever support structure, with at least a portion of the cantilever support structure extending so as to approach the circuit board 20, but is not limited to this. The leaf spring 42 may be formed in a double-support structure, with at least a portion of the leaf spring of the double-support structure extending so as to approach the circuit board 20. Even if the leaf spring has a double-support structure, it has the same effect as the leaf spring 42 of the cantilever support structure.

[0042] In the electrical connector 10, each of the ground contacts 15 is a press-fit type contact. This makes it possible to generate a retention force for the connection between the electrical connector 10 and the circuit board 20 .

[0043] In the electrical connector 10, the organizer 30 includes a conductive film CP having a conductive portion with the ground contacts 15 and a ground plate 40 as a ground member formed at an attachment portion, and a molded body made of an electrically insulating material that supports the conductive film CP. This allows the organizer 30 to be integrally formed by injection molding an electrically insulating resin material, and allows the conductive film CP to be formed on a part of the organizer 30. Such an organizer 30 is more cost-effective than an organizer 30 made entirely from a conductive material.

[0044] In addition to the above, the configurations given in the above embodiments can be selected or appropriately changed to other configurations without departing from the spirit of the present invention. The present invention is applicable only to the connection between the electrical connector 10 and the circuit board 20. In other words, the mating partner of the electrical connector 10 is not limited to other electrical connectors that are assembled with other circuit boards, and the mating partner of the electrical connector 10 can be an electrical connector that is not connected to a circuit board.

[0045] Although the organizer 30 is shown as an example made of a composite material in which a conductive film CP is formed on a molded body made of a resin material, the entire organizer 30 can also be made of a conductive material in the present invention. In this case, the organizer 30 can be obtained by injection molding a conductive resin material, or by MIM of a conductive metal powder. A conductive resin material is not a dendritic material that is itself conductive, but can be obtained by dispersing conductive powder, fiber, etc. in a resin material.

[0046] [Second embodiment: see FIG. 8] Unlike the integrally formed ground plate 40 attached to the electrical connector 10 of the first embodiment, the ground plate 50 attached to the electrical connector 10 of the second embodiment is divided and molded in the vertical direction D, and multiple ground plates 50 are attached to the electrical connector 10. As shown in Fig. 8, the ground plate 50 includes a ground plate body 51, multiple leaf springs 52 as multiple spring bodies, and an attachment portion 53. 8 due to thermal expansion and contraction caused by temperature changes, or due to vibration, the leaf springs 52 elastically deform to follow the generated displacement in the height direction H, thereby maintaining the ground function between the electrical connector 10 and the circuit board 20, surrounding the connection between the signal contacts 13 and the signal electrode pads 23. Thus, the ground plate 50 as a ground member can maintain a stable electrical connection between the organizer 30 on which the conductive film CP is formed, and the conductive film CP formed on the front surface 21A of the circuit board 20.

[0047] Moreover, the ground plate 40 according to the first embodiment is formed as a single piece, whereas the ground plate 50 according to the second embodiment is formed divided in the vertical direction D. In this embodiment, the ground plate 50 is divided into nine pieces in the vertical direction D. The ground plates 50 are formed so that one ground plate 50 corresponds to one row of the accommodation spaces 32 in which a pair of signal contacts 13, 13 arranged in the horizontal direction W of the organizer 30 are accommodated. In the ground plate 40 according to the first embodiment, a member having a large area when viewed in a plan view of the ground plate 40 needs to be processed as a single piece. However, in the ground plate 50 according to the second embodiment, a member having a small area is processed, so that a small processing device can be used. In addition, since each ground plate 50 is smaller than the ground plate 40, the processing accuracy can be stabilized, and the cost incurred in the processing process is more advantageous than that of the ground plate 40 according to the first embodiment.

[0048] [Third embodiment: see FIG. 9] Unlike the integrally formed ground plate 40 attached to the electrical connector 10 of the first embodiment, the ground plate 60 attached to the electrical connector 10 of the third embodiment is divided in the vertical direction D and in the horizontal direction W, and multiple ground plates 60 are attached to the electrical connector 10. As shown in Fig. 9, the ground plate 60 includes a ground plate body 61, multiple leaf springs 62 as multiple spring bodies, and an attachment portion 63. Even in such a ground plate 60, when the electrical connector 10 and the circuit board 20 are connected, even if there is a minute displacement in the connection part between the electrical connector 10 and the circuit board 20 due to thermal expansion and contraction caused by temperature change or vibration or the like in the height direction H in FIG. 9, the leaf spring 62 elastically deforms and follows the generated displacement in the height direction H, so that the ground function between the electrical connector 10 and the circuit board 20 that surrounds the connection part between the signal contact 13 and the signal electrode pad 23 is maintained. Therefore, the ground plate 60 as a ground member can maintain a stable electrical connection between the organizer 30 formed with the conductive film CP and the conductive film CP formed on the front surface 21A of the circuit board 20.

[0049] Also, although the ground plate 40 according to the first embodiment is integrally formed, the ground plate 60 according to the third embodiment is formed by being divided into a plurality of parts in the longitudinal direction D and divided into two parts in the lateral direction W. In the present embodiment, the ground plate 60 is divided into nine parts in the longitudinal direction D and divided into two parts in the lateral direction W. The ground plate 60 is shaped such that one ground plate 60 corresponds to adjacent accommodation spaces 32, 32 of the accommodation space 32 in which the pair of signal contacts 13, 13 arranged in the lateral direction W of the organizer 30 are accommodated. In the ground plate 50 according to the second embodiment, it was shaped such that one ground plate 50 corresponds to a row of the accommodation spaces 32, but the ground plate 60 according to the third embodiment is a member having an area approximately half that of the ground plate 50 according to the second embodiment to be processed. Thereby, a small processing apparatus can be used, and since each ground plate 60 is smaller than the ground plate 50, the processing accuracy can be further stabilized, which is more advantageous than the ground plate 50 according to the second embodiment in terms of processing cost.

[0050] 〔Fourth Embodiment: Refer to FIG. 10〕 In the ground plate 70 mounted on the electrical connector 10 of the fourth embodiment, the leaf springs 42 of the ground plate 40 of the first embodiment extend in the horizontal direction W, whereas the leaf springs 72 of the ground plate 70 are composed of leaf springs 72A extending in the vertical direction D and leaf springs 72B extending in the horizontal direction W. As shown in Fig. 10, the ground plate 70 includes a ground plate body 71, a plurality of leaf springs 72 as a plurality of spring bodies, and a plurality of mounting portions 73. In this embodiment, the plurality of leaf springs 72 are composed of leaf springs 72A extending in the vertical direction D and height direction H, and leaf springs 72B extending in the horizontal direction W and height direction H. The leaf springs 72A are arranged in the same direction as the ground contacts 15 arranged in the vertical direction D. The electrical connection portions between the ground contacts 15 and the through-hole electrodes 25 and the electrical connection portions between the leaf springs 72A and the conductive film CP on the front surface 21A of the circuit board 20 are arranged at a high density. When the ground plate 70 is viewed in a plan view, the adjacent pair of signal contacts 13B, 13B is closer to the pair of signal contacts 13A, 13A than the adjacent pair of signal contacts 13C, 13C. Therefore, in order to ensure that the ground functions reliably, the ground contacts 15 and the leaf springs 72A are arranged at a high density between the signal contacts 13A and 13B.

[0051] The gland plate 70 according to this embodiment is processed as a single piece, similar to the gland plate 40 according to the first embodiment, so that the process of attaching the gland plate 70 to the organiser 30 is simplified. [Explanation of symbols]

[0052] 10 Electrical Connectors 11 Wafer 13 Signal Contacts 15 Ground Contact 15A Pressfit Part 15A1 Elastic pressure-welding piece 15A2 void 15B Information Department 15C base 20 Circuit Board 21 Board body 21A Front 21B Back 23 Signal electrode pad 25 Through-hole electrode 30 Organizer 31 Organizer body 32 Storage Space 33 Insertion hole 34 Gap 40 Grand Plate 41 Ground plate body 42 Leaf spring 43 Mounting part 44 Placement Space 45 Horizontal member 50 Grand Plate 51 Ground plate body 52 Leaf spring 53 Mounting part 60 Grand Plate 61 Ground plate body 62 Leaf spring 63 Mounting part 70 Grand Plate 71 Ground plate body 72 Leaf spring 73 Mounting part CP conductive film TH through hole D. Vertical H Height direction W Horizontal

Claims

1. An electrical connector for connection to a circuit board, A plurality of signal contacts; A plurality of ground contacts; a wafer supporting a plurality of said signal contacts and a plurality of said ground contacts; an organizer attached to the wafer and electrically connected to the ground contacts; At least one ground member attached to the organizer and electrically connected to the organizer; The ground member is formed with a plurality of spring bodies that contact the circuit board.

2. Each of the plurality of spring bodies is formed in a cantilever support structure, and at least a portion of the cantilever support structure extends in a direction approaching the circuit board.

2. The electrical connector of claim 1.

3. Each of the plurality of spring bodies is The spring body extends in a lateral direction (W); The spring body extends in the vertical direction (D).

3. The electrical connector of claim 2.

4. At least one of the spring bodies is formed for each pair of the signal contacts.

2. The electrical connector of claim 1.

5. Each of the plurality of ground contacts is a press-fit type contact.

2. The electrical connector of claim 1.

6. The organizer: a conductive film formed on a conductive portion with the ground contact and on a mounting portion with the ground member; A molded body made of an electrically insulating material supporting the conductive film.

2. The electrical connector of claim 1.

7. A connection between a circuit board and the electrical connector according to any one of claims 1 to 6, The circuit board includes: A signal electrode and a ground electrode are provided. the signal contacts of the electrical connector are electrically connected to the signal electrodes of the circuit board; A connection between an electrical connector and a circuit board, wherein the ground contact of the electrical connector is electrically connected to the ground electrode of the circuit board.

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