Connector and connector unit

Abstract

To provide a connector which can be downsized and suppresses incidence of noise of an external space to a conductor layer of the connector and emission of noise from the conductor layer of the connector to the external space, and provide a connector unit.SOLUTION: A connector 100 includes a metal support layer 10, a first insulation layer 20 and a conductor layer 30 and is used for connection with the other connection component. The conductor layer 30 includes a plurality of terminal parts 32 and a plurality of wiring parts 31 formed to respectively extend from the plurality of terminal parts 32 and is formed on one face of the insulation layer 20. The metal support layer 10 includes a plurality of bending parts and is formed on the other face of the insulation layer 20. The metal support layer 10 is bent long the plurality of bending parts, thereby forming a connection region for the connection with the other connection component. In the first insulation layer 20, an opening 21 is formed in a portion of a region overlapping with the conductor layer 30 in a lamination direction of the first insulation layer 20 and the metal support layer 10.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a connector and a connector unit.

Background Art

[0002] A connector is used to connect circuit boards in an electronic device. The connector includes a plurality of conductive contacts and is mounted on one circuit board by soldering or the like. The plurality of contacts of the connector mounted on one circuit board are each brought into contact with the plurality of contacts of the connector mounted on the other circuit board. Thereby, an electrical connection between the circuit boards is established.

[0003] Patent Document 1 describes a connector in which a plurality of contacts are arranged in a row. The plurality of contacts are formed by punching or pressing from a conductive metal thin plate material and inserted into a plurality of slots arranged in a row. Here, each slot includes a central connecting portion and two leg portions at both ends thereof. Each contact can be selectively inserted into either the central connecting portion or the leg portion of the slot. Thereby, the pitch between adjacent contacts can be changed between a first pitch and a second pitch smaller than the first pitch.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In recent years, with the miniaturization of electronic devices such as mobile devices, it has been required to miniaturize the circuit boards mounted on the electronic devices and also to miniaturize the connectors used for connecting the circuit boards. Therefore, it is necessary to reduce the width of a plurality of contacts of the connector and also to reduce the pitch between the plurality of contacts.

[0006] However, in Patent Document 1, due to the limit of the processing accuracy of the metal thin plate material, it is difficult to reduce the width of the contact. Further, in the circuit board, land portions for mounting contacts are arranged relatively widely spaced from each other in order to prevent short circuits due to solder contact. In this case, a plurality of contacts are also provided relatively widely spaced from each other, and the pitch between the plurality of contacts cannot be reduced.

[0007] By the way, when the connector is used, noise is generated according to the signal passing through the connector. It is not preferable that the noise generated from the connector is radiated toward other electronic devices. Also, when noise enters from the external space into the inside of the connector during use of the connector, the reliability of the signal passing through the connector is lowered. As countermeasures against these noises, in the connector described in Patent Document 1, a configuration in which a shield plate is provided so as to surround a plurality of contacts can be considered. However, such a configuration makes it difficult to miniaturize the connector.

[0008] An object of the present invention is to provide a connector and a connector unit that can be miniaturized and in which the incidence of noise from the external space to the conductor layer of the connector and the emission of noise from the conductor layer of the connector to the external space are suppressed.

Means for Solving the Problems

[0009] A connector according to an aspect of the present invention is a connector used for connection with other connection components, and includes an insulating layer, a mounting portion, a conductor layer formed on one surface of the insulating layer, a bending portion, and a metal support layer formed on the other surface of the insulating layer. When the metal support layer is bent along the bending portion, a connection region for connection with the other connection components is formed, and an opening is formed in a part of a region of the insulating layer that overlaps the conductor layer in the stacking direction of the insulating layer and the metal support layer.

[0010] A connector unit according to another aspect of the present invention includes a first connector that is the above-described connector and a second connector connected to the connection region of the first connector.

Advantages of the Invention

[0011] According to the present invention, it is possible to miniaturize the connector and the connector unit, and it is possible to suppress the incidence of noise in the external space on the conductor layer of the connector and the emission of noise from the conductor layer of the connector to the external space.

Brief Description of the Drawings

[0012]

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Mode for Carrying Out the Invention

[0013] Hereinafter, a connector and a connector unit according to an embodiment of the present invention will be described with reference to the drawings.

[0014] 1. First Embodiment <1> Configuration of Connector FIG. 1 is a perspective view showing the configuration of a connector unit according to the first embodiment. As shown in FIG. 1, the connector unit 1 includes two connectors 100. Each connector 100 is manufactured by bending a laminate including a metal support layer 10, a first insulating layer 20, a conductor layer 30, and a second insulating layer 40 into a predetermined shape. In FIG. 1, for easy understanding of the structure, a hatching pattern is applied to the metal support layer 10, and a dot pattern is applied to the first insulating layer 20. Further, in FIG. 1 and predetermined figures such as FIG. 2 and subsequent figures described later, only the outer shape of the second insulating layer 40 is shown by a thick two-dot chain line so that the structure of the portion covered by the second insulating layer 40 can be easily understood.

[0015] In the following description, when distinguishing between the two connectors 100, the two connectors 100 are referred to as connector 100A and 100B, respectively. Connector 100A is a plug-type connector and has a convex portion 101 formed by bending. Connector 100B is a receptacle-type connector and has a concave portion 102 formed by bending. When the convex portion 101 of connector 100A and the concave portion 102 of connector 100B are fitted, the conductor layers 30 of each other come into contact. Thereby, connector 100A and connector 100B are electrically connected.

[0016] FIG. 2 is a plan view showing the configuration of the connector 100A before bending. As shown in FIG. 2, before bending, the metal support layer 10 has a substantially rectangular shape extending in one direction. The longitudinal direction of the metal support layer 10 is referred to as the first direction, and the width direction (short side direction) of the metal support layer 10 is referred to as the second direction. The metal support layer 10 is formed of a material having, for example, spring characteristics. In this example, the metal support layer 10 is formed of stainless steel. The first insulating layer 20 includes, for example, a resin material and is formed on the entire surface of the metal support layer 10. In this example, the first insulating layer 20 includes polyimide. The thickness of the first insulating layer 20 is, for example, 3 μm or more and 30 μm or less.

[0017] The conductor layer 30 is mainly made of copper and is formed on the first insulating layer 20. The conductor layer 30 has a plurality (six in this example) of terminal portions 31 and a plurality (six in this example) of wiring portions 32. The plurality of terminal portions 31 are provided so as to be arranged at equal intervals in the second direction near one end portion of the first insulating layer 20 in the first direction. The plurality of wiring portions 32 are provided on the first insulating layer 20 so as to extend from the plurality of terminal portions 31 in the first direction and to be arranged in the second direction. In the present embodiment, the terminal portion of the connector 100 refers to the portion of the connector 100 on which solder is placed when the connector 100 is mounted on a circuit board or the like using solder. More specifically, it refers to the portion of the conductor layer 30 with which the solder comes into contact when the connector 100 is mounted.

[0018] The width (length in the second direction) of each wiring portion 32 is, for example, 10 μm or more and 400 μm or less, preferably 50 μm or more and 250 μm or less, and more preferably 50 μm or more and 150 μm or less. The widths of the plurality of wiring portions 32 may be the same, or the widths of some of the plurality of wiring portions 32 may be different from the widths of the other wiring portions 32.

[0019] The pitch of the wiring portions 32 (the interval between adjacent wiring portions 32) is, for example, 50 μm or more and 400 μm or less, preferably 50 μm or more and 250 μm or less, and more preferably 0.2 mm (200 μm) or less. In this case, the connector 100A can be easily miniaturized. The plurality of terminal portions 31 are respectively connected to a plurality of land portions of a circuit board (not shown) by solder. Thereby, the connector 100A is mounted on the circuit board. Note that the pitches of the plurality of wiring portions 32 may be set to a common value, or some pitches and other pitches may be set to different values.

[0020] In the conductor layer 30, the boundaries between the plurality of terminal portions 31 and the plurality of wiring portions 32 are set at a common position in the first direction. In FIG. 2, a virtual straight line VL1 extending in the second direction is indicated by a dashed-dotted line. This virtual straight line VL1 is a straight line passing through a plurality of boundaries between the plurality of terminal portions 31 and the plurality of wiring portions 32.

[0021] The dimension D1 of each terminal portion 31 in the first direction is 30 μm or more and 750 μm or less. The dimension D2 of each terminal portion 31 in the second direction is equal to the width of the wiring portion 32 connected to the terminal portion 31, and is, for example, 10 μm or more and 400 μm or less, preferably 10 μm or more and 250 μm or less, and more preferably 10 μm or more and 100 μm or less.

[0022] The dimensions D1 of the plurality of terminal portions 31 in the first direction may be the same, or the dimension D1 of some of the terminal portions 31 in the first direction may be different from the dimension D1 of other terminal portions 31 in the first direction. Also, the dimensions D2 of the plurality of terminal portions 31 in the second direction may be the same, or the dimension D2 of some of the terminal portions 31 in the second direction may be different from the dimension D2 of other terminal portions 31 in the second direction.

[0023] Here, the plurality of wiring portions 32 include two power supply lines used to supply power to the electronic device and a plurality of signal lines used to transmit electrical signals. In the following description, when distinguishing the plurality of wiring portions 32 based on their uses, the two wiring portions used as power supply lines are respectively referred to as a ground-side power supply line 32A and a non-ground-side power supply line 32B. Also, each of the plurality (four in this example) of wiring portions used as signal lines is referred to as a signal line 32C. Further, in the following description, when distinguishing the plurality of terminal portions 31, the terminal portion connected to the ground-side power supply line 32A is referred to as a first terminal portion 31A. Also, the terminal portion connected to the non-ground-side power supply line 32B is referred to as a second terminal portion 31B, and each of the plurality of terminal portions connected to the plurality of signal lines 32C is referred to as a third terminal portion 31C.

[0024] In the connector 100A according to the present embodiment, the ground-side power supply line 32A and the non-ground-side power supply line 32B are arranged so as to sandwich the plurality of signal lines 32C in the second direction. The widths of the ground-side power supply line 32A and the non-ground-side power supply line 32B are equal to each other. On the other hand, it is preferable that the width of each of the ground-side power supply line 32A and the non-ground-side power supply line 32B is larger than the width of each of the plurality of signal lines 32C.

[0025] As shown by the dotted lines in FIGS. 1 and 2, in the stacking direction of the connector 100 (the stacking direction of the metal support layer 10 and the first insulating layer 20), one opening 21 is formed in the portion of the first insulating layer 20 that overlaps the ground-side power supply line 32A. The opening 21 according to the present embodiment has a circular shape when viewed in the stacking direction of the connector 100. The opening 21 is filled with a part of the conductor constituting the ground-side power supply line 32A (the plating layer 30B in FIG. 16 described later). Thereby, the ground-side power supply line 32A and the metal support layer 10 are electrically connected through the opening 21.

[0026] The second insulating layer 40 includes, for example, a resin material and is formed on the first insulating layer 20 so as to cover a part of the conductor layer 30. Specifically, the second insulating layer 40 is formed on the first insulating layer 20 so as to cover a part of a plurality of wiring portions 32 from the position of the virtual straight line VL1 in the conductor layer 30. In this example, the second insulating layer 40 includes polyimide. The thickness of the second insulating layer 40 is, for example, 5 μm or more and 30 μm or less. In the example of FIG. 2, a part of the second insulating layer 40 is formed between the plurality of wiring portions 32. In this case, the thickness of the second insulating layer 40 is preferably 20 μm or more and 30 μm or less.

[0027] The configuration of the connector 100B is basically the same as the configuration (the configuration inverted in the second direction) obtained by inverting the configurations of the first insulating layer 20 and the conductor layer 30 of the connector 100A in FIG. 2 with respect to the straight line extending in the first direction. Since the configurations of the connectors 100A and 100B have been described with reference to FIG. 2, further features of each of the connectors 100A and 100B will be described below.

[0028] FIG. 3 is a diagram showing the configuration of one connector 100A. A plan view of the connector 100A before bending is shown in the left part of FIG. 3, and a perspective view of the connector 100A after bending is shown in the right part of FIG. 3. As shown in the left part of FIG. 3, the metal support layer 10 of the connector 100A extends in the second direction and has three bent portions A1, A2, and A3 arranged in this order in the first direction.

[0029] In this example, the region of the connector 100A including the bent portions A2 and A3 becomes a connection region 50 for connecting to the connector 100B. That is, the portion of the wiring portion 32 in the connection region 50 becomes a contact portion 51 for contacting the wiring portion 32 of the connector 100B. Therefore, the contact portion 51 is provided so as to straddle the bent portions A2 and A3. In the left part of FIG. 3, the contact portion 51 in each wiring portion 32 is shown in a hatching pattern. Nickel plating or gold plating may be formed on the contact portion 51. In this case, the electrical connectivity of the contact portion 51 is improved.

[0030] Connector 100A is bent along the bending portions A1 to A3 such that the metal support layer 10 is on the inner side and the conductor layer 30 is on the outer side. In this example, the bending angle of the connector 100A at each of the bending portions A1 to A3 is approximately 90 degrees. That is, in the metal support layer 10, the connector 100A is bent such that the angle formed by the two regions sandwiching each of the bending portions A1 to A3 is approximately 90 degrees.

[0031] When the connector 100A is bent, as shown in the right part of FIG. 3, the connection region 50 becomes a convex shape. As a result, a convex portion 101 is formed on the connector 100A. After bending, the dimensions of the connector 100A in the second direction (width direction), height direction, and depth direction are, for example, 1 mm or more and 3 mm or less. In the example in the right part of FIG. 3, the vertical direction is the height direction, and the direction orthogonal to the width direction and the height direction is the depth direction.

[0032] FIG. 4 is a diagram showing the configuration of the other connector 100B. The left part of FIG. 4 shows a plan view of the connector 100B before bending, and the right part of FIG. 4 shows a perspective view of the connector 100B after bending. As shown in the left part of FIG. 4, the metal support layer 10 of the connector 100B extends in the second direction and has six bending portions B1 to B6 arranged in this order in the first direction.

[0033] In this example, the region of the connector 100B including the bending portions B4 and B5 becomes the connection region 50 for connecting to the connector 100A. That is, the portion of the wiring portion 32 in the connection region 50 becomes the contact portion 51 for contacting the wiring portion 32 of the connector 100A. Therefore, the contact portion 51 is provided so as to straddle the bending portions B4 and B5. In the left part of FIG. 4, the contact portion 51 in each wiring portion 32 is shown in a hatching pattern. Similar to the connector 100A, nickel plating or gold plating may be formed on the contact portion 51.

[0034] Connector 100B is bent along the bending portions B1 to B6 such that the metal support layer 10 is on the inner side and the conductor layer 30 is on the outer side. In this example, the bending angle of the connector 100B at each of the bending portions B1 to B6 is approximately 90 degrees. That is, in the metal support layer 10, the connector 100B is bent such that the angle formed by the two regions sandwiching each of the bending portions B1 to B6 is approximately 90 degrees.

[0035] When the connector 100B is bent, as shown in the right part of FIG. 4, the connection region 50 becomes concave. As a result, a recess 102 is formed in the connector 100B. After bending, the dimensions of the connector 100B in the second direction (width direction), height direction, and depth direction are, for example, 1 mm or more and 3 mm or less. In the example shown in the right part of FIG. 4, the vertical direction is the height direction, and the direction orthogonal to the width direction and the height direction is the depth direction.

[0036] <2>Manufacturing method of the connector FIG. 5 is a perspective view showing the connector assembly sheet. As shown in FIG. 5, in the present embodiment, the connector assembly sheet 2 is formed in a state where a plurality of connectors 100 are aligned by a roll-to-roll method. The connector 100A and the connector 100B may be formed on separate connector assembly sheets 2.

[0037] Hereinafter, the manufacturing method of the connector 100A will be described with reference to the cross section of one connector 100A formed on the connector assembly sheet 2. FIGS. 6 to 19 are diagrams for explaining an example of the manufacturing method of the connector 100A. FIGS. 6 to 19 correspond to the cross-sectional view taken along line A-A of the connector 100A in FIG. 2. Note that in FIGS. 6 to 19, the manufacturing method of the connector 100A is described. The manufacturing method of the connector 100B is basically the same as that of the connector 100A in FIGS. 6 to 19, except that the bending portions B1 to B6 are formed in the metal support layer 10 instead of the bending portions A1 to A3, and the configurations of the first insulating layer 20 and the conductor layer 30 are reversed in the second direction.

[0038] First, as shown in FIG. 6, prepare a metal sheet 2A made of, for example, stainless steel. The thickness of the metal sheet 2A is, for example, 35 μm or more and 100 μm or less, preferably 50 μm or more and 100 μm or less. The material of the metal sheet 2A is not limited to stainless steel and may be other metals such as aluminum. Next, as shown in FIG. 7, form a mask 110 on a specific portion of the metal sheet 2A. The mask 110 may be formed, for example, by exposing and developing a photosensitive dry film resist.

[0039] Subsequently, perform etching on the portion of the metal sheet 2A exposed from the mask 110 using an etching solution. The etching solution may be, for example, a ferric chloride solution. As a result, as shown in FIG. 8, the portion of the metal sheet 2A exposed from the mask 110 is removed, and the metal support layer 10 is formed. Thereafter, as shown in FIG. 9, the mask 110 is removed from the metal support layer 10.

[0040] Next, as shown in FIG. 10, form a mask 120 having a plurality (three in this example) of linear slits 121 on the metal support layer 10. The method of forming the mask 120 is the same as the method of forming the mask 110. Subsequently, perform etching on the portion of the metal support layer 10 exposed from the slits 121 of the mask 120 for a relatively short time using an etching solution. The etching solution may be the same as the etching solution used in the steps of FIGS. 7 to 8. As a result, as shown in FIG. 11, a plurality (three in this example) of linear shallow groove portions a1, a2, and a3 are formed in the metal support layer 10.

[0041] Thereafter, as shown in FIG. 12, the mask 120 is removed from the metal support layer 10. In the metal support layer 10, the portions where the groove portions a1 to a3 are formed become the bent portions A1 to A3 of the metal support layer 10, respectively. Also, the region including the bent portions A2 and A3 becomes the connection region 50 of the connector 100. Note that the steps of FIGS. 10 to 12 may be performed prior to the steps of FIGS. 7 to 9. Also, instead of the steps of FIGS. 10 to 12, the groove portions a1 to a3 may be formed, for example, by laser processing using a YAG (yttrium aluminum garnet) laser or the like.

[0042] Next, as shown in FIG. 13, a first insulating layer 20 is formed on the upper surface of the metal support layer 10. Further, an opening 21 is formed in a part (in this example, one place) of the region of the first insulating layer 20 where the ground-side power line 32A is planned to be laminated and formed in a later process. The opening 21 is a through hole that penetrates the first insulating layer 20 in the vertical direction. The first insulating layer 20 may be formed by applying a photosensitive resin precursor to the entire upper surface of the metal support layer 10 and exposing the photosensitive resin precursor using ultraviolet light. In this case, by appropriately setting the exposed portion and the non-exposed portion in the photosensitive resin precursor, the formation of the first insulating layer 20 and the formation of the opening 21 can be performed simultaneously. For example, when using a negative-type photosensitive resin precursor, the region except for the portion where the opening 21 is to be formed is irradiated with ultraviolet light and developed. Thereby, the first insulating layer 20 having the opening 21 can be easily formed. In this example, the material of the first insulating layer 20 is polyimide, but other resins such as epoxy may also be used.

[0043] Subsequently, as shown in FIG. 14, a seed layer 30A is formed so as to cover the upper surface of the first insulating layer 20, the inner peripheral surface of the opening 21, and the bottom surface of the opening 21. Here, the bottom surface of the opening 21 is the upper surface portion of the metal support layer 10 exposed upward through the opening 21. In FIGS. 14 to 19, the seed layer 30A is shown by a thick solid line. The seed layer 30A is formed, for example, by sputtering. Examples of the material of the seed layer 30A include chromium, copper, nickel, titanium, or alloys thereof.

[0044] Thereafter, as shown in FIG. 15, a mask 130 having an opening 131 with a predetermined pattern is formed on the upper surface of the seed layer 30A. The pattern of the opening 131 is a pattern opposite to the pattern of the conductor layer 30 in FIG. 2. The method of forming the mask 130 is the same as the method of forming the mask 110.

[0045] Next, as shown in FIG. 16, a plating layer 30B is formed on the upper surface of the seed layer 30A through the opening 131 of the mask 130, for example, by copper plating. At this time, the plating layer 30B is filled inside the opening 21. Subsequently, as shown in FIG. 17, the exposed portions of the mask 130 and the seed layer 30A are sequentially removed. Thereby, a conductor layer 30 having a laminated structure of the seed layer 30A and the plating layer 30B is formed. In each part of the conductor layer 30, a terminal portion 31 and a wiring portion 32 are set so as to be adjacent to each other with a predetermined boundary interposed therebetween on the first insulating layer 20. In FIG. 17, the boundary portion between the terminal portion 31 and the wiring portion 32 is indicated by a white arrow. The portion of the wiring portion 32 located on the connection region 50 becomes a contact portion 51.

[0046] Next, as shown in FIG. 18, a second insulating layer 40 is formed on the upper surface of the first insulating layer 20 so as to cover a part of each wiring portion 32 of the conductor layer 30. Here, a part of each wiring portion 32 includes a portion having a predetermined length in the first direction from the boundary between the corresponding terminal portion 31 and the wiring portion 32. The predetermined length is, for example, 3250 μm or more and 3970 μm or less, and it is preferably set so that the second insulating layer 40 does not overlap any of the bent portions A1, A2, and A3.

[0047] The second insulating layer 40 may be formed by applying a photosensitive resin precursor to the entire upper surface of the first insulating layer 20 and exposing the photosensitive resin precursor in a predetermined region using ultraviolet light. In this example, the material of the second insulating layer 40 is polyimide, but other resins such as epoxy may also be used.

[0048] By forming the second insulating layer 40, the connector assembly sheet 2 of FIG. 5 in which a plurality of connectors 100A before bending are formed is completed. In this example, further, as shown in FIG. 19, a first metal coating layer MC1 and a second metal coating layer MC2 are formed on the surface (upper surface and side surface) of the terminal portion 31.

[0049] The first metal coating layer MC1 is, for example, nickel, and the second metal coating layer MC2 is, for example, gold. In this case, the first metal coating layer MC1 improves the adhesion between the plating layer 30B (FIG. 17) made of copper and the second metal coating layer MC2. Also, the second metal coating layer MC2 protects the plating layer 30B and prevents corrosion of the plating layer 30B and the like.

[0050] In FIGS. 14 to 17, the conductor layer 30 is formed by the semi-additive method, but the embodiment is not limited to this. The conductor layer 30 may be formed by the additive method or the subtractive method.

[0051] Thereafter, the connector 100A is recovered from the connector assembly sheet 2. Finally, the recovered connector 100A is bent along the bent portions A1 to A3. Thereby, the connector 100A on the right side of FIG. 3 is completed. According to the above manufacturing method, in the manufacture of the connector 100, it is not necessary to use an adhesive layer. Therefore, the heat resistance of the connector 100 can be improved.

[0052] <3> Effects (a) In the connector 100 according to the first embodiment, a conductor layer 30 having a plurality of terminal portions 31 and a plurality of wiring portions 32 is formed on one surface of the first insulating layer 20. Also, a metal support layer 10 having bent portions A1 to A3 or bent portions B1 to B6 is formed on the other surface of the first insulating layer 20. By bending the metal support layer 10 along the bent portions A1 to A3 or the bent portions B1 to B6, a connection region 50 is formed.

[0053] According to this configuration, it is possible to manufacture the connector 100 using the manufacturing technology of a wiring circuit board. Therefore, the connection area 50 can be formed in a small size. Also, since the pattern of the conductor layer 30 can be arbitrarily formed by the manufacturing technology of the wiring circuit board, the degree of freedom in arranging the plurality of terminal portions 31 is improved. Therefore, even when the connection area 50 is formed in a small size, the plurality of terminal portions 31 can be arranged so that no short circuit occurs when the connector 100 is mounted on a circuit board or the like by solder. As a result of these, the connector 100 can be miniaturized.

[0054] Specifically, in the connection area 50, a plurality of contact portions 51 that come into contact with other connectors 100 are provided so as to extend in a first direction and be arranged in a second direction intersecting the first direction. In this case, the connector 100 can be used for transmitting various electrical signals. Also, by the manufacturing technology of the wiring circuit board, in the second direction, it is possible to reduce the width of each contact portion 51 and reduce the pitch between the plurality of contact portions 51. Therefore, even when the plurality of contact portions 51 are provided so as to be arranged in the second direction, the connector 100 can be miniaturized.

[0055] Also, in the above connector 100, a ground-side power line 32A and a non-ground-side power line 32B are formed as a part of the conductor layer 30 on the first insulating layer 20. Thereby, by applying a voltage between the first terminal portion 31A connected to the ground-side power line 32A and the second terminal portion 31B connected to the non-ground-side power line 32B, it is possible to supply power to an electronic device connected to the connector 100. Also, a plurality of signal lines 32C are formed as another part of the conductor layer 30 on the first insulating layer 20. Thereby, it is possible to transmit an electrical signal to an electronic device connected to the connector 100 through the plurality of signal lines 32C. Also, it is possible to receive an electrical signal from an electronic device connected to the connector 100 through the plurality of signal lines 32C.

[0056] Furthermore, an opening 21 is formed in the first insulating layer 20, and the ground-side power line 32A and the metal support layer 10 are electrically connected through the opening 21. Therefore, the metal support layer 10 can be grounded through the ground-side power line 32A. The metal support layer 10 functions as a shield layer that blocks noise by being adjusted to the ground potential. The ground-side power line 32A, the non-ground-side power line 32B, and the plurality of signal lines 32C are located on the metal support layer 10. Thereby, the incidence of noise from the external space of the connector 100 to the plurality of terminal portions 31 and the plurality of wiring portions 32 is suppressed. Also, even when noise is generated in the plurality of terminal portions 31 and the plurality of wiring portions 32, the emission of the noise to the outside of the connector 100 is suppressed.

[0057] As a result, while miniaturizing the connector 100, it is possible to suppress the incidence of noise from the external space to the conductor layer 30 of the connector 100 and the emission of noise from the conductor layer 30 of the connector 100 to the external space.

[0058] (b) In the first insulating layer 20, the opening 21 is formed at a position that does not overlap any of the plurality of bent portions A1 to A3 and B1 to B6 in the stacking direction of the connector 100. Thereby, the portion of the first insulating layer 20 where the opening 21 is formed is not bent. Therefore, it is possible to prevent the reliability of the electrical connection between the ground-side power line 32A and the metal support layer 10 from being reduced due to the bending process of the metal support layer 10.

[0059] (c) Since the connector unit 1 includes connectors 100A and 100B that are connected to each other, it is possible to miniaturize the connector unit 1. Thereby, the connector unit 1 can be mounted on a small electronic device such as a mobile device. Also, a decrease in the reliability of the connector unit 1 due to the incidence of noise inside the connector 100 and the emission of noise from the connector 100 to the external space is suppressed.

[0060] 2. Second Embodiment <1> Configuration of Connector Regarding the connector according to the second embodiment, differences from the connector 100 according to the first embodiment will be described. FIG. 20 is a plan view showing a configuration example of the connector according to the second embodiment, FIG. 21 is a bottom view of the connector 100 in FIG. 20, and FIG. 22 is a cross-sectional view taken along line B-B of the connector 100 in FIG. 20. The plan view of FIG. 20 corresponds to the plan view of FIG. 2 described in the first embodiment. In FIGS. 20 to 22, the connector 100 before bending is shown.

[0061] As shown in FIG. 20, in the connector 100 according to the present embodiment, two openings 21 are formed in the first insulating layer 20. The two openings 21 have a common circular shape when viewed in the stacking direction of the connector 100. One of the two openings 21 is formed in a portion of the first insulating layer 20 that overlaps the ground-side power line 32A in the stacking direction of the connector 100, similar to the opening 21 according to the first embodiment. On the other hand, the other of the two openings 21 is formed in a portion of the first insulating layer 20 that overlaps the non-ground-side power line 32B in the stacking direction of the connector 100. In the following description, when distinguishing these two openings 21, the opening 21 that overlaps the ground-side power line 32A is called the first opening 21A, and the opening 21 that overlaps the non-ground-side power line 32B is called the second opening 21B.

[0062] Similar to the example of the opening 21 according to the first embodiment, a part of the conductor constituting the ground-side power line 32A is filled in the first opening 21A. Thereby, the ground-side power line 32A and the metal support layer 10 are electrically connected through the first opening 21A. A part of the conductor constituting the non-ground-side power line 32B is also filled in the second opening 21B. Thereby, the non-ground-side power line 32B and the metal support layer 10 are electrically connected through the second opening 21B.

[0063] Here, in the connector 100 according to the present embodiment, as shown in FIGS. 20 to 22, a separation groove 11 is formed in a part of the metal support layer 10. The separation groove 11 extends linearly from one end to the other end of the metal support layer 10 in the first direction. Thereby, the metal support layer 10 has two support portions that are electrically separated from each other. In the examples of FIGS. 20 to 22, the separation groove 11 is located between the plurality of third terminal portions 31C and the plurality of signal lines 32C and the plurality of second terminal portions 31B and the non-grounded power supply line 32B when viewed in the stacking direction of the connector 100.

[0064] In the following description, the support portion of the metal support layer 10 that overlaps the first terminal portion 31A, the grounded power supply line 32A, the plurality of third terminal portions 31C, and the plurality of signal lines 32C when viewed in the stacking direction of the connector 100 is referred to as the first support portion 10A. On the other hand, the support portion of the metal support layer 10 that overlaps the second terminal portion 31B and the non-grounded power supply line 32B when viewed in the stacking direction of the connector 100 is referred to as the second support portion 10B.

[0065] <2> Effect (a) In the connector 100 according to the second embodiment, the grounded power supply line 32A and the first support portion 10A of the metal support layer 10 are connected through the first opening 21A of the first insulating layer 20. Also, the non-grounded power supply line 32B and the second support portion 10B of the metal support layer 10 are connected through the second opening 21B of the first insulating layer 20. The first support portion 10A and the second support portion 10B of the metal support layer 10 are electrically separated by the separation groove 11. Therefore, a short circuit between the grounded power supply line 32A and the non-grounded power supply line 32B through the metal support layer 10 is prevented.

[0066] According to the above configuration, since the grounded power line 32A and the first support portion 10A are connected, when current flows through the grounded power line 32A, the heat generated in the grounded power line 32A is transmitted to the first support portion 10A and dissipated from the first support portion 10A. Also, since the non-grounded power line 32B and the second support portion 10B are connected, when current flows through the non-grounded power line 32B, the heat generated in the non-grounded power line 32B is transmitted to the second support portion 10B and dissipated from the second support portion 10B.

[0067] Furthermore, compared with the case where the grounded power line 32A and the first support portion 10A are not connected, the heat capacity of the grounded power line 32A increases. Also, compared with the case where the non-grounded power line 32B and the second support portion 10B are not connected, the heat capacity of the non-grounded power line 32B increases.

[0068] Therefore, compared with the case where each power line (32A, 32B) is not connected to the metal support layer 10, the degree of temperature rise of each power line (32A, 32B) when current flows through each power line (32A, 32B) is reduced. As a result, while suppressing an increase in the size of each cross-section (the cross-section of the power line perpendicular to the direction in which the power line extends) of the grounded power line 32A and the non-grounded power line 32B, it is possible to increase the amount of current that can be supplied to each power line.

[0069] (b) In the connector 100 according to the second embodiment, when viewed in the stacking direction of the connector 100, a plurality of third terminal portions 31C and a plurality of signal lines 32C overlap the first support portion 10A of the metal support layer 10. The first support portion 10A is connected to the grounded power line 32A. Therefore, the first support portion 10A is grounded, and by functioning as a shield layer, the incidence of noise from the external space of the connector 100 to the plurality of third terminal portions 31C and the plurality of signal lines 32C is sufficiently suppressed. Also, the emission of noise from the plurality of third terminal portions 31C and the plurality of signal lines 32C to the external space of the connector 100 is sufficiently suppressed.

[0070] (c) Further, in the connector 100 according to the present embodiment, since the separation groove 11 is formed in the metal support layer 10, the single-layer metal support layer 10 is separated into the first support portion 10A and the second support portion 10B. As described above, the first support portion 10A functions as a shield layer and also functions as a layer for dissipating heat. On the other hand, the second support portion 10B functions as a layer for dissipating heat. In this way, a plurality of support portions that realize different functions from each other are formed in a single layer. Therefore, it is not necessary to stack a plurality of metal support layers having a plurality of functions via an insulating layer, and an increase in the thickness of the stacked structure is suppressed. Thereby, the processing (bending) during the production of the connector 100 is also facilitated.

[0071] <3>Modification example of the opening 21 formed in the first insulating layer 20 In the connector 100 according to the second embodiment, one first opening 21A having a circular shape is formed in a portion of the first insulating layer 20 that overlaps the ground-side power line 32A. Also, one second opening 21B having a circular shape is formed in a portion of the first insulating layer 20 that overlaps the non-ground-side power line 32B. However, the shape and number of the openings 21 formed so as to overlap each power line (32A, 32B) in the first insulating layer 20 are not limited to the above example.

[0072] FIG. 23 is a plan view of the connector 100 for explaining a first modification example of the opening 21. In the connector 100 of FIG. 23, one rectangular opening 21 is formed in a part of the region of the first insulating layer 20 that overlaps each power line (32A, 32B). In this way, one opening 21 that overlaps each power line (32A, 32B) when viewed in the stacking direction of the connector 100 may be formed in a rectangular shape.

[0073] In this case, the opening 21 is preferably formed so as to extend along the power lines (32A, 32B). By forming the opening 21 so as to extend along the power lines (32A, 32B), the opening area of the opening 21 becomes larger, and the contact area between each power line (32A, 32B) and the metal support layer 10 can be increased.

[0074] Thereby, the heat generated in the grounded power supply line 32A is smoothly transmitted to the first support portion 10A of the metal support layer 10 and dissipated from the first support portion 10A. Also, the heat generated in the non-grounded power supply line 32B is smoothly transmitted to the second support portion 10B of the metal support layer 10 and dissipated from the second support portion 10B. As a result, while suppressing an increase in the size of each cross section of each power supply line (32A, 32B), the amount of current that can be supplied to each power supply line (32A, 32B) can be made larger.

[0075] FIG. 24 is a plan view of the connector 100 for explaining a second modification of the opening 21. In the connector 100 of FIG. 24, the opening 21 formed so as to overlap a part of each power supply line (32A, 32B) in the first insulating layer 20 is formed so as to extend to a region that does not overlap each power supply line (32A, 32B). In other words, each opening 21 according to the second modification is formed so as to cross the power supply line in the second direction when viewed in the stacking direction of the connector 100.

[0076] FIG. 25 is a plan view of the connector 100 for explaining a third modification of the opening 21. In the connector 100 of FIG. 25, the opening 21 is formed so as to overlap the entire length of each power supply line (32A, 32B) in the first insulating layer 20. In this case, a sufficiently large contact area is ensured between each power supply line (32A, 32B) and the metal support layer 10. Therefore, while suppressing an increase in the size of each cross section of each power supply line (32A, 32B), the amount of current that can be supplied to each power supply line (32A, 32B) can be made even larger.

[0077] FIG. 26 is a plan view of a connector 100 for explaining a fourth modification of the opening 21. In the connector 100 of FIG. 26, two openings 21 are formed in a part of the region of the first insulating layer 20 that overlaps each power line (32A, 32B). Each opening 21 is formed so as to continuously extend from one end to the other end of the corresponding power line. Also in this configuration, as in the example of FIG. 25, a sufficiently large contact area is ensured between each power line (32A, 32B) and the metal support layer 10. Therefore, while suppressing an increase in the size of each cross-section of each power line (32A, 32B), the amount of current that can be supplied to each power line (32A, 32B) can be further increased. Note that in this modification, the number of openings 21 formed in the region of the metal support layer 10 that overlaps each power line (32A, 32B) may be one, or may be three or more.

[0078] FIG. 27 is a plan view of a connector 100 for explaining a fifth modification of the opening 21. In the connector 100 of FIG. 27, a number (13 in this example) of openings 21 are formed in a part of the region of the first insulating layer 20 that overlaps each power line (32A, 32B). The number of openings 21 are arranged at equal intervals from one end to the other end of the corresponding power line. In other words, in this modification, the openings 21 are formed so as to intermittently extend from one end to the other end of the corresponding power line. Also in this configuration, as in the example of FIG. 25, a sufficiently large contact area is ensured between each power line (32A, 32B) and the metal support layer 10. Therefore, while suppressing an increase in the size of each cross-section of each power line (32A, 32B), the amount of current that can be supplied to each power line (32A, 32B) can be further increased.

[0079] 3. Other Embodiments (a) In the connector 100 according to the second embodiment, the separation groove 11 formed in the metal support layer 10 is located between the plurality of third terminal portions 31C and the plurality of signal lines 32C and the plurality of second terminal portions 31B and the non-ground side power line 32B when viewed in the stacking direction of the connector 100, but the present invention is not limited to this example.

[0080] FIG. 28 is a plan view of a connector 100 according to another embodiment. As indicated by the white arrow AA and the dashed-dotted line in FIG. 28, the separation groove 11 may be formed so as to be located between the first terminal portion 31A and the ground-side power line 32A and the plurality of third terminal portions 31C and the plurality of signal lines 32C when viewed in the stacking direction of the connector 100. Alternatively, as indicated by the white arrow AB and the dotted line in FIG. 28, the separation groove 11 may be formed so as to pass between two adjacent third terminal portions 31C and between two adjacent signal lines 32C when viewed in the stacking direction of the connector 100.

[0081] Even in these cases, at least the first support portion 10A connected to the ground-side power line 32A functions as a shield layer, thereby suppressing a decrease in the reliability of the connector 100 due to noise.

[0082] (b) In the connector 100 according to the first embodiment, one circular opening 21 is formed in the portion of the first insulating layer 20 that overlaps the ground-side power line 32A, but the present invention is not limited to this.

[0083] In the connector 100 according to the first embodiment, one or a plurality of openings 21 having a shape other than a circular shape, for example, an elliptical shape or a rectangular shape, may be formed in the portion of the first insulating layer 20 that overlaps the ground-side power line 32A. Alternatively, in the connector 100 according to the first embodiment, one or a plurality of openings 21 according to the first to fifth modification examples (FIGS. 23 to 24) of the second embodiment may be formed in the portion of the first insulating layer 20 that overlaps the ground-side power line 32A.

[0084] (c) In the connector 100A of FIG. 2 according to the first embodiment, the opening 21 is formed so as to overlap the ground-side power line 32A, but the present invention is not limited to this. The opening 21 may be formed so as to overlap the first terminal portion 31A.

[0085] (d) In the connector 100 of FIG. 20 according to the second embodiment, the two openings 21 are formed so as to overlap the ground-side power line 32A and the non-ground-side power line 32B, respectively. However, the present invention is not limited to this. The two openings 21 may be formed so as to overlap the first terminal portion 31A and the second terminal portion 31B, respectively.

[0086] (e) The connector 100 according to the first and second embodiments has four signal lines 32C as part of the plurality of wiring portions 32. Not limited to these examples, the connector 100 may have five or more signal lines 32C.

[0087] (f) In the example of FIG. 19, the first metal coating layer MC1 and the second metal coating layer MC2 are formed on the surface of the terminal portion 31. However, the embodiment is not limited to this. The first metal coating layer MC1 and the second metal coating layer MC2 may not be formed on the surface of the terminal portion 31. Alternatively, only one of the first metal coating layer MC1 and the second metal coating layer MC2 may be formed on the surface of the terminal portion 31.

[0088] (g) In the above embodiment, the connection region 50 has a convex shape or a concave shape. Therefore, the metal support layer 10 has two or more bent portions A1 to A3 or bent portions B1 to B6. In this case, the connector 100 comes into reliable contact with other connection components. Thereby, the connection reliability of the connector 100 can be improved.

[0089] However, the embodiment is not limited to this. As long as the connector 100 contacts other connection components with sufficient reliability, the metal support layer 10 may have one bent portion, and the connection region 50 may not have a convex shape or a concave shape. For example, in the connector unit 1, two or more metal support layers 10 connected to each other may have the same shape.

[0090] (h) In the above-described embodiment, the bent portions A1 to A3 or the bent portions B1 to B6 are formed by forming groove portions at predetermined positions of the metal support layer 10, but the present invention is not limited thereto. The bent portions A1 to A3 or the bent portions B1 to B6 may be formed by forming linear marks or the like on the metal support layer 10. Alternatively, if the metal support layer 10 can be bent at the bent portions A1 to A3 or the bent portions B1 to B6, nothing particularly may be formed on the metal support layer 10.

[0091] (i) In the above-described embodiment, the connector 100 is circulated in a bent state, but the embodiment is not limited thereto. The connector 100 may be circulated in a state before being bent.

[0092] Even in this case, in the connector 100, a conductor layer 30 having a plurality of terminal portions 31 and a plurality of wiring portions 32 is formed on one surface of the first insulating layer 20. Further, a metal support layer 10 having bent portions A1 to A3 or bent portions B1 to B6 is formed on the other surface of the first insulating layer 20. The metal support layer 10 is bendable along the bent portions A1 to A3 or the bent portions B1 to B6, and the contact portions 51 are provided so as to straddle the bent portions A1 to A3 or the bent portions B1 to B6.

[0093] According to this configuration, the connector 100 is circulated in a state before being bent. After the connector 100 is circulated, a user of the connector 100 can form a connection region 50 for connecting to other connection components by bending the metal support layer 10 along the bent portions A1 to A3 or the bent portions B1 to B6.

[0094] 4. Corresponding relationship between each component of the claims and each part of the embodiment Hereinafter, examples of the correspondence between each component of the claims and each part of the embodiment will be described, but the present invention is not limited to the following examples. As each component of the claims, various other elements having the configurations or functions described in the claims can also be used.

[0095] In the above-described embodiment, the connectors 100, 100A, and 100B are examples of connectors, one of the connectors 100A and 100B is another example of a connector, the other of the connectors 100A and 100B is an example of another connecting component, the first insulating layer 20 is an example of an insulating layer, the terminal portions 31, the first terminal portion 31A, the second terminal portion 31B, and the third terminal portion 31C are examples of mounting portions, and the conductor layer 30 is an example of a conductor layer.

[0096] Also, the bent portions A1 to A3 and B1 to B6 are examples of bent portions, the metal support layer 10 is an example of a metal support layer, the connection region 50 is an example of a connection region, the opening 21 is an example of an opening, the first terminal portion 31A is an example of a first mounting portion, the second terminal portion 31B is an example of a second mounting portion, and the third terminal portion 31C is an example of a third mounting portion.

[0097] Also, the ground-side power line 32A is an example of a ground-side power line, the non-ground-side power line 32B is an example of a non-ground-side power line, the signal line 32C is an example of a signal line, the first opening 21A is an example of a first opening, the second opening 21B is an example of a second opening, the first support portion 10A is an example of a first support portion, the second support portion 10B is an example of a second support portion, and the separation groove 11 is an example of a separation groove.

[0098] Also, one of the connectors 100A and 100B is an example of a first connector, the other of the connectors 100A and 100B is an example of a second connector, and the connector unit 1 is an example of a connector unit.

[0099] 5. Summary of the Embodiment (Item 1) The connector according to Item 1 is a connector used for connection with other connecting components, an insulating layer, has a mounting portion, a conductor layer formed on one surface of the insulating layer, has a bent portion, and includes a metal support layer formed on the other surface of the insulating layer, by bending the metal support layer along the bent portion, a connection region for connection with the other connecting component is formed, An opening is formed in a part of the region of the insulating layer that overlaps with the conductor layer in the stacking direction of the insulating layer and the metal support layer.

[0100] In the connector, a conductor layer having a mounting portion is formed on one surface of the first insulating layer, and a metal support layer having a bent portion is formed on the other surface of the first insulating layer. By bending the metal support layer along the bent portion, a connection region is formed.

[0101] According to this configuration, it is possible to manufacture the connector using the manufacturing technology of the wiring circuit board. Therefore, the connection region can be formed in a small size. In addition, since the pattern of the conductor layer can be arbitrarily formed by the manufacturing technology of the wiring circuit board, the degree of freedom in arranging the mounting portions is improved. Therefore, even when the connection region is formed in a small size, the mounting portions can be arranged so that no short circuit occurs when the mounting portions are mounted on a circuit board or the like by solder.

[0102] An opening is formed in a part of the region of the insulating layer that overlaps with the conductor layer in the stacking direction. In this case, a part of the conductor layer and the metal support layer are connected through the opening of the insulating layer. Therefore, the metal support layer can be grounded through a part of the conductor layer. The metal support layer functions as a shield layer that blocks noise by being adjusted to the ground potential. Thereby, the incidence of noise from the external space of the connector to other parts of the conductor layer is suppressed. In addition, the emission of noise from other parts of the conductor layer to the external space of the connector is suppressed.

[0103] As a result, while miniaturizing the connector, it is possible to suppress the incidence of noise from the external space to the conductor layer of the connector and the emission of noise from the conductor layer of the connector to the external space.

[0104] (Item 2) In the connector according to Item 1, The mounting portion includes a first mounting portion, a second mounting portion, and a third mounting portion, The conductor layer is, A ground-side power line extending from the first mounting portion, The non-grounded power line extending from the second mounting portion, and the signal line extending from the third mounting portion, The opening may include a first opening formed in a portion of the insulating layer that overlaps the grounded power line or the first mounting portion in the stacking direction.

[0105] In this case, by applying a voltage between the first mounting portion and the second mounting portion, power can be supplied to other connecting components. Also, various signals can be transmitted to other connecting components through the signal line, and various signals can be received from other connecting components through the signal line.

[0106] Further, according to the above configuration, the grounded power line or the first mounting portion and the metal support layer are electrically connected through the first opening of the insulating layer. Thereby, the metal support layer can be grounded via the grounded power line. The metal support layer functions as a shield layer by being adjusted to a ground potential. Thereby, the incidence of noise from the external space of the connector to the signal line is suppressed. Also, the emission of noise from the signal line to the external space of the connector is suppressed.

[0107] (Item 3) In the connector according to Item 2, the opening further includes a second opening, the first opening is formed in a portion of the insulating layer that overlaps the grounded power line in the stacking direction, the second opening is formed in a portion of the insulating layer that overlaps the non-grounded power line in the stacking direction, A separation groove may be formed in the metal support layer to interrupt electrical conduction between a first support portion that overlaps the first opening and a second support portion that overlaps the second opening in the stacking direction.

[0108] In this case, the ground-side power line is connected to the first support portion of the metal support layer through the first opening of the insulating layer. Also, the non-ground-side power line is connected to the second support portion of the metal support layer through the second opening of the insulating layer. In this state, the first support portion and the second support portion of the metal support layer are electrically separated by the separation groove. Therefore, a short circuit between the ground-side power line and the non-ground-side power line in the metal support layer is prevented from occurring.

[0109] In the above configuration, since the ground-side power line is connected to the first support portion, the heat capacity of the ground-side power line becomes larger compared to the case where the ground-side power line and the first support portion are not connected. Also, since the non-ground-side power line is connected to the second support portion, the heat capacity of the non-ground-side power line becomes larger compared to the case where the non-ground-side power line and the second support portion are not connected. Thereby, while suppressing an increase in the cross-sectional area (the cross-section of each power line perpendicular to the direction in which each power line extends) of each of the ground-side power line and the non-ground-side power line, the amount of current that can be supplied to each power line can be increased.

[0110] (Item 4) In the connector according to Item 3, the first opening is formed so as to extend continuously or intermittently in the direction in which the ground-side power line extends, and the second opening may be formed so as to extend continuously or intermittently in the direction in which the non-ground-side power line extends.

[0111] In this case, a large contact area between the ground-side power line and the first support portion of the metal support layer can be ensured. Thereby, the heat generated in the ground-side power line is smoothly transmitted to the first support portion of the metal support layer and dissipated from the first support portion. Also, a large contact area between the non-ground-side power line and the second support portion of the metal support layer can be ensured. Thereby, the heat generated in the non-ground-side power line is smoothly transmitted to the second support portion of the metal support layer and dissipated from the second support portion. As a result, while suppressing an increase in the cross-sectional area of each of the ground-side power line and the non-ground-side power line, the amount of current that can be supplied to each power line can be made larger.

[0112] (Item 5) In the connector according to Item 3 or Item 4, the signal line is disposed between the ground-side power line and the non-ground-side power line on the one surface of the insulating layer, the separation groove may be located between the signal line and the non-ground-side power line when viewed in the stacking direction.

[0113] In this case, the signal line of the conductor layer overlaps with the first support portion of the metal support layer when viewed in the stacking direction. The first support portion is connected to the ground-side power line. Therefore, by the first support portion functioning as a shield layer, the incidence of noise from the external space of the connector to the signal line is sufficiently suppressed. Also, the emission of noise from the signal line to the external space of the connector is sufficiently suppressed.

[0114] (Item 6) The connector unit according to Item 6 is a first connector which is the connector according to any one of Items 1 to 5, and a second connector connected to the connection region of the first connector.

[0115] In this case, since the connector unit can be miniaturized, the connector unit can be mounted on a small electronic device such as a mobile device. Also, a decrease in the reliability of the connector unit due to the incidence of noise in the external space on the conductor layer of the first connector and the emission of noise from the conductor layer of the first connector to the external space is suppressed.

Explanation of Reference Numerals

[0116] 1... Connector unit, 2... Connector assembly sheet, 2A... Metal sheet, 10... Metal support layer, 10A... First support portion, 10B... Second support portion, 11... Separation groove, 20... First insulating layer, 21... Opening, 21A... First opening, 21B... Second opening, 30... Conductor layer, 30A... Seed layer, 30B... Plating layer, 31... Terminal portion, 31A... First terminal portion, 31B... Second terminal portion, 31C... Third terminal portion, 32... Wiring portion, 32A... Ground-side power line, 32B... Non-ground-side power line, 32C... Signal line, 40... Second insulating layer, 50... Connection region, 51... Contact portion, 100, 100A, 100B... Connectors, 101... Protrusion, 102... Recess, 110, 120, 130... Masks, 121... Slit, 131... Opening, A1, A2, A3... Bending portions, B1, B2, B3, B4, B5, B6... Bending portions, MC1... First metal coating layer, MC2... Second metal coating layer, VL1... Virtual straight line, a1, a2, a3... Groove portions

Claims

1. A connector used for connection with other connection components, comprising an insulating layer, a mounting portion, and a conductor layer formed on one surface of the insulating layer, and a metal support layer having a bent portion and formed on the other surface of the insulating layer, wherein a connection region for connecting with the other connection components is formed by bending the metal support layer along the bent portion, and an opening is formed in a part of a region of the insulating layer that overlaps the conductor layer in the lamination direction between the insulating layer and the metal support layer.

2. The mounting portion includes a first mounting portion, a second mounting portion, and a third mounting portion, and the conductor layer includes a ground-side power line extending from the first mounting portion, a non-ground-side power line extending from the second mounting portion, and a signal line extending from the third mounting portion, wherein the opening includes a first opening formed in a portion of the insulating layer that overlaps the ground-side power line or the first mounting portion in the lamination direction. The connector according to claim 1.

3. The opening further includes a second opening, wherein the first opening is formed in a portion of the insulating layer that overlaps the ground-side power line in the lamination direction, the second opening is formed in a portion of the insulating layer that overlaps the non-ground-side power line in the lamination direction, and a separation groove for blocking electrical conduction between a first support portion overlapping the first opening and a second support portion overlapping the second opening in the lamination direction is formed in the metal support layer. The connector according to claim 2.

4. The first opening is formed to extend continuously or intermittently in the direction in which the ground-side power line extends, and the second opening is formed to extend continuously or intermittently in the direction in which the non-ground-side power line extends. The connector according to claim 3.

5. The signal line is disposed between the ground-side power line and the non-ground-side power line on the one surface of the insulating layer, and the separation groove is located between the signal line and the non-ground-side power line when viewed in the lamination direction. The connector according to claim 3 or 4.

6. A first connector which is the connector according to any one of claims 1 to 4, and a second connector connected to the connection region of the first connector. A connector unit.

Images