Electronic apparatus and electric power conversion system

Abstract

To suppress an increase in pressure loss while achieving miniaturization.SOLUTION: An electronic apparatus comprises: a first heating component; a second heating component; a first channel that is provided to face one surface of the first and second heating components; a second channel which is provided to face the other surface of the second heating component and which is connected to the first channel; and a feed-water inlet which is provided so that an extension direction of the first channel and an inflow direction of cooling water can be equal to each other and which supplies the cooling water to the first and second channels. An inclined part inclined toward the first channel is provided on a surface, which faces the feed-water inlet, of the second channel.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] The present invention relates to an electronic device and a power conversion device, and is suitable for application to, for example, an electronic device and a power conversion device having a cooling function. [Background technology]

[0002] Generally, a power conversion device is equipped with a cooling device for cooling heat-generating components. For example, Patent Document 1 discloses a configuration in which a part of the wall surface of the cooling water flow path of the cooling device also serves as a capacitor case in order to simplify the overall structure while cooling the heat-generating components, and also discloses a configuration in which the heat-generating components are cooled on two surfaces, a horizontal surface and a vertical surface. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] International Publication No. 2021 / 220563 Summary of the Invention [Problem to be solved by the invention]

[0004] In the configuration disclosed in Patent Document 1, the direction in which the cooling water flows does not match the direction in which the cooling water flows, so excessive pressure loss may occur at the point where the cooling water flow direction changes. Also, in the configuration disclosed in Patent Document 1, if an attempt is made to narrow the cross section of the cooling water flow path in order to reduce the size of the entire structure, there is a risk that the pressure loss will increase rapidly.

[0005] The present invention has been made in consideration of the above points, and aims to propose an electronic device and a power conversion device that can be miniaturized while suppressing an increase in pressure loss. [Means for solving the problem]

[0006] In order to solve such problems, the present invention comprises a first heat generating component, a second heat generating component, a first flow path arranged to face one side of the first heat generating component and the second heat generating component, a second flow path arranged to face another side of the second heat generating component and connected to the first flow path, and a water supply port arranged so that the extension direction of the first flow path and the inflow direction of cooling water are aligned, and which supplies cooling water to the first flow path and the second flow path, and an inclined portion inclined toward the first flow path is provided on the surface of the second flow path facing the water supply port.

[0007] In addition, in the present invention, an electronic device is mounted which comprises a first heat generating component, a second heat generating component, a first flow path arranged to face one side of the first heat generating component and the second heat generating component, a second flow path arranged to face another side of the second heat generating component and connected to the first flow path, and a water supply port arranged so that the extension direction of the first flow path and the inflow direction of cooling water are aligned, and which supplies cooling water to the first flow path and the second flow path, and in which an inclined portion inclined toward the first flow path is provided on the surface of the second flow path facing the water supply port. Effect of the Invention

[0008] According to the present invention, it is possible to suppress an increase in pressure loss while achieving miniaturization. [Brief description of the drawings]

[0009] [Figure 1] 1 is a system configuration diagram showing a configuration example of a power conversion device equipped with a cooling device according to an embodiment of the present invention. [Diagram 2] 2 is a perspective view showing an example of the external configuration of the cooling device shown in FIG. 1. [Diagram 3] 3 is a cross-sectional view showing a configuration example of the cooling device shown in FIG. 2. [Figure 4] 3 is a cross-sectional view showing a configuration example of the cooling device shown in FIG. 2. [Diagram 5] 3 is a cross-sectional view showing a configuration example of the cooling device shown in FIG. 2. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings.

[0011] 1 is a diagram showing a configuration example of a power conversion device 1 equipped with an electronic device 10 according to the present embodiment. The power conversion device 1 according to the present embodiment includes a power module 3, a DC (Direct Current) capacitor 5, a bus bar 7, an electronic device 10 having a cooling function, and an HVDC (High Voltage Direct Current) terminal 11, and has a power conversion function. Note that the configuration of the power conversion device 1 shown below is one example, and the power conversion device equipped with the electronic device 10 in this embodiment is not limited to the following configuration and may have other configurations.

[0012] The HVDC terminal 11 is connected to a DC power source, and receives a high-voltage DC current from the DC power source. The bus bar 7 is a terminal made of a conductor that conducts a large amount of current, and generates heat due to the influence of the large amount of current. Heat from the bus bar 7 is particularly likely to be transmitted to the current sensor 206, which is an electronic component that is more likely to reach a high temperature and generate a larger amount of heat than the capacitors 207 and 208.

[0013] The electronic device 10 has a flow path through which cooling water flows to cool the current sensor 206 and the capacitors 207 and 208. The current sensor 206 and the capacitors 207 and 208 are each an example of an electronic component that generates heat when activated by passing current. The current sensor 206 (second heat-generating component) generates more heat than the capacitors 207 and 208 (first heat-generating component), due in part to the influence of heat from the bus bar 7.

[0014] The power module 3 is connected to the DC capacitor 5, and includes an AC (Alternating Current) output terminal 3a. The power module 3 includes a main circuit, and outputs a current after power conversion from the AC output terminal 3a.

[0015] Fig. 2 is a perspective view showing an example of the external configuration of the electronic device 10 shown in Fig. 1. The electronic device 10 includes a water supply port 201, an inclined portion 202, a cooling device horizontal portion 203, a thermally conductive material 204, a cooling water channel inclined portion 205, a current sensor 206 as an example of a second heat generating component, capacitors 207 and 208 as examples of a first heat generating component, a cooling device vertical portion 209, and a drain port 210. The drain port 210 is a member for discharging the cooling water to the outside of the electronic device 10. In this embodiment, the cooling device horizontal portion 203 and the cooling device vertical portion 209 are substantially perpendicular to each other.

[0016] The inclined portion 202 is hollow inside, and has a flow path formed therein through which the cooling water flows in from the water supply port 201. The inclined portion 202 is, for example, a funnel-shaped quadrangular pyramid member continuing from the water supply port 201, and is configured such that the cross-sectional area of ​​the flow path increases with increasing distance from the water supply port 201 along the inflow direction of the cooling water.

[0017] The cooling device horizontal section 203 is a flat plate-like member extending from one side of the rectangular end of the funnel-shaped pyramidal member described above that has the widest flow passage area. The inside of the cooling device horizontal section 203 is also hollow, and a flow passage for cooling water is formed inside the cooling device horizontal section 203. The flow passage inside the cooling device horizontal section 203 is continuous with the flow passage of the inclined section 202 described above.

[0018] The cooling device vertical part 209 is a flat plate-like member extending from the other side of the rectangle constituting the end of the above-mentioned rectangle, and is provided so as to be perpendicular to the cooling device horizontal part 203. The inside of the cooling device vertical part 209 is also hollow, and a flow path for cooling water is formed inside the cooling device vertical part 209. The flow path inside the cooling device vertical part 209 is continuous with the flow path of the above-mentioned inclined part 202, and is also continuous with the flow path of the cooling device horizontal part 203.

[0019] The above-mentioned water supply port 201 is arranged so that the extension direction of the flow path of the horizontal portion 203 of the cooling device, which is an example of a first flow path, is aligned with the inflow direction of the cooling water, and supplies cooling water to the flow path of the horizontal portion 203 of the cooling device and to the flow path of the horizontal portion 203 of the cooling device, which is an example of a second flow path, via the inclined portion 202.

[0020] The flow paths of the cooling device vertical part 209 are provided so as to face the surfaces of the capacitor 207, the capacitor 208, and the current sensor 206. The capacitor 207, the capacitor 208, and the current sensor 206 are provided on the cooling device vertical surface 209a of the cooling device vertical part 209 with the thermal conductive materials 204 interposed therebetween.

[0021] Capacitor 207 , capacitor 208 and current sensor 206 are arranged on cooling device vertical surface 209 a of cooling device vertical part 209 so that their installation positions are slightly different in the direction perpendicular to cooling device horizontal surface 203 a of cooling device horizontal part 203 .

[0022] The flow path of the cooling device horizontal part 203 faces the bottom surface of the current sensor 206 via a thermally conductive material 204, and is connected to the flow path of the cooling device vertical part 209. A current sensor 206 is provided on the cooling device horizontal surface 203a of the cooling device horizontal part 203 via a thermally conductive material 204. The current sensor 206 also faces the cooling device vertical part 209 via another thermally conductive material 204.

[0023] A cooling water passage inclined portion 205 is provided on a surface of the flow passage of the cooling device horizontal portion 203 facing the water supply port 201 as an example of an inclined portion inclined toward the flow passage of the cooling device vertical portion 209. The cooling water passage inclined portion 205 is provided at a portion where the flow passage of the cooling device vertical portion 209 and the flow passage of the cooling device horizontal portion 203 vertically intersect. A flow passage of cooling water is formed inside the cooling water passage inclined portion 205, and the flow passage of the cooling water passage inclined portion 205 is continuous with the flow passage of the cooling device vertical portion 209 and the flow passage of the cooling device horizontal portion 203. The cooling water passage inclined portion 205 will be described in detail later.

[0024] Fig. 3 is a cross-sectional view showing an example of the configuration of the electronic device 10 shown in Fig. 2. The drawings following Fig. 3 show a schematic configuration of the electronic device 10 shown in Fig. 2. In the electronic device 10, a water supply inlet slope 109 is formed in the vicinity of a water supply inlet 201 through which cooling water is supplied, in a portion from the water supply inlet 201 to a flow path of a horizontal portion 203 of the cooling device and a flow path of a vertical portion 209 of the cooling device.

[0025] Water inlet inclined surface 109 forms an inclined surface that is not perpendicular to the direction D1 in which the cooling water flows into water inlet 201, but is gently inclined relative to the direction D1. This allows the cooling water flowing from water inlet 201 to flow gently along water inlet inclined surface 109, thereby reducing the change in the direction in which the cooling water flows at water inlet inclined surface 109, thereby suppressing an increase in pressure loss.

[0026] As described above, the water supply port 201 is provided so that the inflow direction D1 of the cooling water from the water supply port 201 is aligned with the extension direction D2 of the flow path of the cooling device vertical part 209. The cooling water from the water supply port 201 passes through the water supply port inclined surface 109 and is supplied to the flow path (first flow path) of the cooling device vertical part 209 and the flow path of the cooling device horizontal part 203.

[0027] The capacitors 207 and 208 are fixed to a cooling device vertical surface 209a of the cooling device vertical portion 209 via the respective thermal conductive materials 204. The capacitors 207 and 208 are, for example, electronic components that generate less heat than the current sensor 206. Heat generated by the capacitors 207 and 208 is dissipated from the cooling device vertical surface 209a to the cooling device vertical portion 209 via the thermal conductive materials 204.

[0028] As described above, if the heat generated by capacitors 207, 208 is dissipated only from cooling device vertical surface 209a, multiple components can be cooled simultaneously and the amount of surface area unnecessary for cooling can be reduced, thereby enabling the electronic device 10 to be made smaller.

[0029] As described above, the electronic device 10 is provided with the cooling water passage inclined portion 205 at the downstream portion of the cooling water at the intersection of the cooling device horizontal portion 203 and the cooling device vertical portion 209. The cooling water passage inclined portion 205 is inclined so that the cross-sectional area of ​​the flow passage in the direction perpendicular to the flow direction of the cooling water gradually increases from the flow passage of the cooling device horizontal portion 203 to the flow passage of the cooling device vertical portion 209. By providing such a cooling water passage inclined portion 205, it is possible to suppress an increase in pressure loss that is likely to occur when the cross-sectional area of ​​the flow passage suddenly increases when the cooling water flowing through the flow passage of the cooling device horizontal portion 203 flows into the flow passage of the cooling device vertical portion 209.

[0030] The current sensor 206 is also fixed to the cooling device vertical surface 209a of the cooling device vertical portion 209 via the thermally conductive material 204. The current sensor 206 will be described later.

[0031] Fig. 4 is a cross-sectional view showing a configuration example of the electronic device 10 shown in Fig. 2. In the illustrated example, the current sensor 206 is mainly fixed to the cooling device horizontal surface 203a of the cooling device horizontal part 203 via a thermally conductive material 204, and is also fixed to the cooling device vertical surface 209a of the cooling device vertical part 209 via another thermally conductive material 204.

[0032] As described above, the current sensor 206 tends to become hot due to heat from the bus bar 7, for example, and therefore generates more heat than the capacitors 207, 208. However, this heat is dissipated from the cooling device horizontal surface 203a to the cooling device horizontal part 203 via each thermal conductive material 204, and also dissipated from the cooling device vertical surface 209a to the cooling device vertical part 209.

[0033] Fig. 5 is a cross-sectional view showing an example of the configuration of the electronic device 10 shown in Fig. 2. The current sensor 206 has a different height from the capacitors 207 and 208. The current sensor 206 is an example of an electronic component that is taller than the capacitors 207 and 208. Depending on the performance and shape of the current sensor 206 and the capacitor 208, the capacitor 208 may be configured to be taller.

[0034] Current sensor 206, capacitor 207, and capacitor 208 are in contact with cooling device vertical surface 209a of cooling device vertical part 209 via heat conductive material 204, and even if current sensor 206, capacitor 207, and capacitor 208 generate heat, they are cooled by the cooling water flowing inside cooling device vertical part 209. This makes it possible to simultaneously cool multiple components at different heights.

[0035] The power conversion device 1 incorporating the electronic device 10 according to this embodiment is configured as described above. Next, a cooling operation of the power conversion device 1 using the electronic device 10 will be described.

[0036] As shown in Figure 3, cooling water supplied from the water inlet 201 along direction D1 gradually spreads along the water inlet inclined surface 109 of the inclined portion 202 and flows into the flow path of the horizontal portion 203 of the cooling device and the flow path of the vertical portion 209 of the cooling device.

[0037] Since electronic device 10 is provided with water inlet inclined surface 109 near water inlet 201, the cross-sectional area of ​​the flow path at water inlet inclined surface 109 does not change suddenly. Therefore, it is possible to suppress an increase in pressure loss due to the flow of cooling water near water inlet inclined surface 109.

[0038] The cooling water flows into the flow path of the cooling device vertical part 209 and the flow path of the cooling device horizontal part 203 downstream of the water supply port inclined surface 109. The direction D2 of the cooling water that flows into the flow path of the cooling device vertical part 209 is the same as the direction D1 in which the water is supplied from the water supply port 201, so the flow direction does not change, and pressure loss can be suppressed.

[0039] Inside electronic device 10, from water inlet 201 towards drain outlet 210, heat generating components such as current sensor 206, capacitor 207 and capacitor 208 are arranged in order from closest to water inlet 201.

[0040] As described above, the current sensor 206 is fixed to the cooling device horizontal surface 203a and the cooling device vertical surface 209a via the thermally conductive material 204. The capacitors 207 and 208 are fixed to the cooling device vertical surface 209a via the respective thermally conductive materials 204.

[0041] The cooling water in the flow path of the cooling device vertical part 209 absorbs heat from the current sensor 206 and capacitors 207 and 208 fixed to the cooling device vertical surface 209a via a thermal conductive material 204 as shown in Figure 3, and is discharged from a drain outlet 210 provided at the most downstream side of the cooling device vertical part 209.

[0042] On the other hand, the cooling water in the flow path of the horizontal part 203 of the cooling device absorbs heat from the current sensor 206 which is fixed to the vertical surface 209a of the cooling device via a thermal conductive material 204 and is also fixed to the horizontal surface 203a of the cooling device via a thermal conductive material 204 as shown in FIG. 4, and is similarly discharged from the drain outlet 210 provided at the most downstream position of the vertical part 209 of the cooling device.

[0043] The cooling water in the flow path of the cooling device horizontal part 203 absorbs heat from the current sensor 206 via the thermally conductive material 204, and flows into the flow path of the cooling device vertical part 209. As described above, the electronic device 10 is provided with the cooling water path inclination part 205 at a location where the cooling water flows from the cooling device horizontal part 203 to the cooling device vertical part 209. This cooling water path inclination part 205 controls the flow direction of the cooling water at this location so that the inflow direction of the cooling water flowing from the flow path of the cooling device horizontal part 203 is not perpendicular but forms an obtuse angle with respect to the flow direction D2 of the cooling water in the flow path of the cooling device vertical part 209, and therefore an increase in pressure loss can be suppressed.

[0044] The electronic device 10 of the power conversion device 1 according to this embodiment includes capacitors 207, 208, a current sensor 206, a flow path of a vertical part 209 of the cooling device arranged opposite the surfaces of the capacitors 207, 208 and the current sensor 206, a flow path of a horizontal part 203 of the cooling device arranged opposite the bottom surface of the current sensor 206 and connected to the flow path of the vertical part 209 of the cooling device, and a water supply port 201 arranged so that the extension direction D2 of the flow path of the vertical part 209 of the cooling device and the inflow direction D1 of the cooling water are aligned, and which supplies cooling water to the flow path of the vertical part 209 of the cooling device and the flow path of the horizontal part 203 of the cooling device, and a cooling water channel inclined portion 205 inclined toward the flow path of the vertical part 209 of the cooling device is provided on the surface of the flow path of the horizontal part 203 of the cooling device facing the water supply port 201.

[0045] In this way, by making the direction D1 in which the cooling water flows in from the water supply port 201 approximately the same as the direction D2 of the flow path of the cooling device vertical section 209, and by providing a cooling water channel inclined section 205 that inclines toward the flow path of the cooling device vertical section 209, it is possible to suppress an increase in pressure loss while achieving miniaturization.

[0046] The electronic device 10 according to this embodiment includes a water inlet inclined surface 109 including an inclined surface inclined with respect to the direction D1 in which the cooling water flows into the water inlet 201, in the portion from the water inlet to the flow path of the cooling device vertical portion 209 and the flow path of the cooling device horizontal portion 203 near the water inlet through which the cooling water is supplied. In this way, the cooling water flowing in from the water inlet 21 gradually spreads due to the inclined surface of the water inlet inclined surface 109, so that an increase in pressure loss due to a sudden expansion in the cross-sectional area of ​​the flow path can be suppressed.

[0047] In this embodiment, current sensor 206, which is an example of a second heat-generating component, is configured to generate more heat than capacitors 207, 208, which are examples of a first heat-generating component. In this manner, current sensor 206, which is likely to become hot due to the influence of heat generated by bus bar 7 as described above, is simultaneously cooled by cooling device horizontal surface 203a of cooling device horizontal portion 203 and cooling device vertical surface 209a of cooling device vertical portion 209, so that current sensor 206 is also maintained at an appropriate temperature, thereby preventing component failure and improving reliability.

[0048] The electronic device 10 according to this embodiment includes a cooling device horizontal portion 203 having the above-mentioned flow path (second flow path) formed therein, and a cooling device vertical portion 209 having the above-mentioned flow path (first flow path) formed therein and substantially perpendicular to the cooling device horizontal portion 203. In such a configuration, since both flow paths are substantially perpendicular to each other, there is a concern that pressure loss may easily occur, but the presence of the above-mentioned cooling water channel inclined portion 205 makes it possible to suppress an increase in pressure loss.

[0049] In this embodiment, the current sensor 206, which is an example of the second heat generating component, is configured to be taller than the capacitors 207, 208, which are examples of the first heat generating component. Even if the current sensor 206 and the capacitors 207, 208 have different heights, they are in contact with the cooling device vertical surface 209a of the cooling device vertical portion 209 via the respective thermal conductive materials 204, and thus not only can the heat be dissipated simultaneously, but also the space created by the difference in height can be effectively utilized.

[0050] In this embodiment, the current sensor 206 is a current sensor for a direct current supplied from the outside to the power module 3. In this way, it is possible to selectively cool the current sensor 206, which is easily heated due to being provided near the HVDC terminal 11 that generates a large amount of heat.

[0051] It should be noted that the present invention is not limited to the above-described embodiments, and includes various modifications and equivalent configurations within the spirit and scope of the appended claims. For example, the above-described embodiments have been described in detail to clearly explain the present invention, and the present invention is not necessarily limited to those including all of the described configurations.

[0052] In the above-described embodiment, for example, the current sensor 206 is exemplified as a heat generating component (second heat generating component) having a higher heat generating temperature, but this is not limited thereto and may be other electronic components. Also, the capacitors 207 and 208 are exemplified as heat generating components (first heat generating components) having a lower heat generating temperature than the current sensor 206, but this is not limited thereto and may be other electronic components. [Industrial Applicability]

[0053] The present invention can be applied to electronic devices and power conversion devices equipped with a cooling function. [Explanation of symbols]

[0054] 1: power conversion device, 10: electronic device, 201: water inlet, 203: horizontal part of cooling device, 203a: horizontal surface of cooling device, 205: inclined part of cooling water passage, 206: current sensor, 207, 208: capacitor, 209: vertical part of cooling device, 209a: vertical surface of cooling device

Claims

1. A first heating component, a second heating component, a first flow path provided so as to face one surface of the first heating component and the second heating component, a second flow path provided so as to face the other surface of the second heating component and connected to the first flow path, a water supply port provided such that the extending direction of the first flow path and the inflow direction of cooling water are aligned, and supplying cooling water to the first flow path and the second flow path, comprising: An electronic device, characterized in that an inclined portion inclined toward the first flow path is provided on a surface of the second flow path facing the water supply port.

2. In the vicinity of the water supply port to which cooling water is supplied, a water supply port inclined portion including an inclined surface inclined with respect to the direction in which the cooling water flowing into the water supply port advances is provided in a portion from the water supply port to the first flow path and the second flow path. The electronic device according to claim 1, characterized in that it has such a structure.

3. a device horizontal portion in which the second flow path is formed inside, a device vertical portion in which the first flow path is formed inside and is substantially orthogonal to the device horizontal portion, The electronic device according to claim 1, characterized in that it comprises such a structure.

4. The second heating component, The electronic device according to claim 1, characterized in that the amount of heat generated is larger than that of the first heating component.

5. The second heating component, The electronic device according to claim 1, characterized in that the height is higher than that of the first heating component.

6. The second heating component is a current sensor for a direct current supplied from the outside to the main circuit. The electronic device according to claim 1, characterized in that it has such a structure.

7. A first heating component, a second heating component, a first flow path provided so as to face one surface of the first heating component and the second heating component, a second flow path provided so as to face the other surface of the second heating component and connected to the first flow path, a water supply port provided such that the extending direction of the first flow path and the inflow direction of cooling water are aligned, and supplying cooling water to the first flow path and the second flow path, comprising: an electronic device provided with an inclined portion inclined toward the first flow path on a surface of the second flow path facing the water supply port. A power conversion device, characterized in that it mounts such an electronic device.

8. In the vicinity of the water supply port to which cooling water is supplied, a water supply port inclined portion including an inclined surface inclined with respect to the direction in which the cooling water flowing into the water supply port advances is provided in a portion from the water supply port to the first flow path and the second flow path. The power conversion device according to claim 7, characterized in that it has such a structure.

9. The apparatus horizontal portion in which the second flow path is formed inside; The apparatus vertical portion in which the first flow path is formed inside and which is substantially orthogonal to the apparatus horizontal portion; The power conversion device according to claim 7, characterized by comprising the above.

10. The second heat generating component is such that the amount of heat generated is larger than that of the first heat generating component The power conversion device according to claim 7, characterized by the above.

11. The second heat generating component is such that the height is higher than that of the first heat generating component The power conversion device according to claim 7, characterized by the above.

12. The second heat generating component is a current sensor for a direct current supplied from the outside to the main circuit The power conversion device according to claim 7, characterized by the above.

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