Multilayer electronic component

Abstract

To provide a multilayer electronic component having excellent reliability, excellent moisture resistance reliability, low equivalent series resistance (ESR), and excellent bending strength.SOLUTION: A multilayer electronic component according to an exemplary embodiment in the present disclosure may include a dielectric layer and internal electrodes alternately disposed with the dielectric layer, and may include a body and external electrodes. Third and fourth surfaces of the body may include: an exposed portion in which the dielectric layer and the internal electrodes are alternately exposed; and a non-exposed portion other than the exposed portions. The external electrodes may include: a base electrode layer; an intermediate electrode layer disposed on the base electrode layer; and an upper electrode layer disposed on the intermediate electrode layer. The base electrode layer is disposed on the exposed portion and the non-exposed portion, the intermediate electrode layer is disposed on the non-exposed portion, the base electrode layer is disposed on the non-exposed portion, the base electrode layer may include a metal, the intermediate electrode layer may include a metal and a resin, and the upper electrode layer may include Sn and a resin.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a multilayer electronic component.

Background Art

[0002] A multilayer ceramic capacitor (MLCC), which is one type of multilayer electronic component, is a chip-shaped capacitor mounted on a printed circuit board of various electronic products such as video devices like liquid crystal display (LCD) and plasma display panel (PDP), computers, smartphones, and mobile phones, and serves to charge or discharge electricity.

[0003] Due to the advantages of being small in size while ensuring high capacitance and being easy to mount, multilayer ceramic capacitors can be used as components in various electronic devices. As various electronic devices such as computers and mobile devices are miniaturized and have increased output, the requirements for miniaturization and high capacitance of multilayer ceramic capacitors are increasing.

[0004] Also, as the application to automotive electrical components and the like increases, high reliability in various environments is required.

[0005] As an external electrode of a multilayer ceramic capacitor, a fired electrode formed by applying and firing a paste containing a conductive metal and glass has generally been used.

[0006] However, in the case of a fired electrode, there is a problem of being vulnerable to the generation of cracks due to tensile stress generated in a mechanical or thermal environment. Therefore, in order to absorb the tensile stress generated in a mechanical or thermal environment and prevent the generation of cracks caused by stress, a technique of applying a conductive resin layer to an external electrode has been disclosed.

[0007] Such a conductive resin layer serves to electrically and mechanically bond between the fired electrode and the plating layer of the external electrode of the multilayer ceramic capacitor, and protects the multilayer ceramic capacitor from mechanical and thermal stresses due to the process temperature and the bending impact of the substrate during the mounting of the circuit board.

[0008] However, since the conductive particles of the conductive resin layer are in a dispersed form, there is a possibility that the adhesion to the fired electrode is weak and a polymer-metal bond may cause lifting at the interface. Also, there may be a problem of weak electrical conductivity due to the dispersed form of the conductive particles in the conductive resin layer.

[0009] In addition, since the fired electrode and the conductive resin layer are generally formed using a dipping method, the thickness of the corner portion may become thin, which may deteriorate the moisture resistance reliability or increase the equivalent series resistance (ESR).

Prior Art Documents

Patent Documents

[0010]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0011] One of the various objects of the present invention is to provide a multilayer electronic component with excellent reliability.

[0012] One of the various objects of the present invention is to provide a multilayer electronic component with excellent moisture resistance reliability.

[0013] One of the various objects of the present invention is to provide a multilayer electronic component with a low equivalent series resistance (ESR).

[0014] One of the various objects of the present invention is to provide a laminated electronic component having excellent bending strength.

[0015] However, the object of the present invention is not limited to the above-described content, and can be more easily understood in the process of explaining specific embodiments of the present invention.

Means for Solving the Problems

[0016] A laminated electronic component according to an embodiment of the present invention includes a dielectric layer and internal electrodes alternately arranged with the dielectric layer, a first and a second surface facing each other in a first direction, a third and a fourth surface connected to the first and second surfaces and facing each other in a second direction, a fifth and a sixth surface connected to the first to fourth surfaces and facing each other in a third direction, a main body including the above, and external electrodes disposed on the main body. The third and fourth surfaces of the main body include an exposed portion where the dielectric layer and the internal electrodes are alternately exposed, and a non-exposed portion other than the exposed portion. The external electrodes include a base electrode layer, an intermediate electrode layer disposed on the base electrode layer, and an upper electrode layer disposed on the intermediate electrode layer. The base electrode layer is disposed on the exposed portion and the non-exposed portion, the intermediate electrode layer is disposed on the non-exposed portion, the upper electrode layer is disposed on the non-exposed portion, the base electrode layer contains metal, the intermediate electrode layer contains metal and resin, and the upper electrode layer can contain Sn and resin.

Effects of the Invention

[0017] One of the various effects of the present invention is that by disposing an intermediate electrode layer containing metal and resin between the upper electrode layer containing Sn and resin and the base electrode layer, the reliability of the laminated electronic component is improved.

[0018] One of the various effects of the present invention is that the moisture resistance reliability of the laminated electronic component is improved.

[0019] One of the various effects of the present invention is that the equivalent series resistance (ESR) of the laminated electronic component is lowered.

[0020] One of the various effects of the present invention is that the bending strength of the multilayer electronic component has been improved.

[0021] However, the diverse and significant advantages and effects of the present invention are not limited to the above-described content, and can be more easily understood in the process of explaining the specific embodiments of the present invention.

Brief Description of the Drawings

[0022]

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Embodiments for Carrying Out the Invention

[0023] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into several other forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to an ordinary technician. Therefore, the shape and size of elements in the drawings may be enlarged or reduced (or emphasized or simplified) for a clearer explanation, and elements denoted by the same reference numerals in the drawings are the same elements.

[0024] In addition, parts not related to the explanation are omitted in the drawings for clearly explaining the present invention, and the sizes and thicknesses of the illustrated components are arbitrarily shown for the convenience of explanation, so the present invention is not necessarily limited by the illustration. Also, components having the same function within the scope of the same idea can be described using the same reference numerals. Further, throughout the specification, when a part "includes" a certain component, it means that other components can be further included, rather than excluding other components, unless otherwise stated to the contrary.

[0025] In the drawings, the first direction can be defined as the stacking direction or the thickness (T) direction, the second direction as the length (L) direction, and the third direction as the width (W) direction.

[0026] Multilayer electronic component FIG. 1 schematically shows a perspective view of a multilayer electronic component according to an embodiment of the present invention, FIG. 2 schematically shows a cross-sectional view taken along line I-I' of FIG. 1, FIG. 3 schematically shows a cross-sectional view taken along line II-II' of FIG. 1, FIG. 4 is an exploded perspective view showing the main body of FIG. 1 disassembled, FIG. 5 is an enlarged view of the first external electrode in FIG. 2, FIG. 6 is an enlarged view of the K1 region in FIG. 2, and FIG. 7 is an enlarged view of the K2 region in FIG. 2.

[0027] Hereinafter, with reference to FIGS. 1 to 7, a multilayer electronic component 100 according to an embodiment of the present invention will be described in detail. Further, as an example of the multilayer electronic component, a multilayer ceramic capacitor (hereinafter referred to as "MLCC") will be described, but the present invention is not limited thereto, and it can also be applied to various multilayer electronic components using ceramic materials, such as inductors, piezoelectric elements, varistors, or thermistors.

[0028] The multilayer electronic component 100 according to an embodiment of the present invention includes a dielectric layer 111 and internal electrodes 121 and 122 alternately arranged with the dielectric layer, and first and second surfaces 1 and 2 facing each other in a first direction, a third and a fourth surface 3 and 4 connected to the first and second surfaces and facing each other in a second direction, and a fifth and a sixth surface 5 and 6 connected to the first to fourth surfaces and facing each other in a third direction. The multilayer electronic component 100 includes a main body 110 and external electrodes 131 and 132 disposed on the main body. The third and fourth surfaces include an exposed portion EP where the dielectric layer and the internal electrodes are alternately exposed and a non-exposed portion NEP other than the exposed portion. The external electrodes include a base electrode layer 131a, 132a, an intermediate electrode layer 131b, 132b disposed on the base electrode layer, and an upper electrode layer 131c, 132c disposed on the intermediate electrode layer. The base electrode layers 131a, 132a are disposed on the exposed portion EP and the non-exposed portion NEP, the intermediate electrode layers 131b, 132b are disposed on the non-exposed portion NEP, and the upper electrode layers 131c, 132c are disposed on the non-exposed portion NEP. The base electrode layers 131a, 132a contain a metal, the intermediate electrode layers 131b, 132b contain a metal and a resin, and the upper electrode layers 131c, 132c can contain Sn and a resin.

[0029] Hereinafter, each component included in the multilayer electronic component 100 according to an embodiment of the present invention will be described.

[0030] The main body 110 can have the dielectric layer 111 and the internal electrodes 121 and 122 alternately laminated.

[0031] There is no particular limitation on the specific shape of the main body 110. As shown in the figure, the main body 110 can have a hexahedron shape or a shape similar thereto. Due to the shrinkage of the ceramic powder contained in the main body 110 during the firing process, the main body 110 does not have a perfect hexahedron shape with straight lines, but can substantially have a hexahedron shape.

[0032] The main body 110 can have a first surface 1 and a second surface 2 facing each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first and second surfaces 1 and 2 and facing each other in a second direction, and a fifth surface 5 and a sixth surface 6 connected to the third and fourth surfaces 3 and 4 and facing each other in a third direction. The first surface 1 can be a mounting surface arranged to face the substrate when mounted on the substrate.

[0033] Due to the overlapping of the margin areas where the internal electrodes 121 and 122 are not arranged on the dielectric layer 111, a step is generated due to the thickness of the internal electrodes 121 and 122. The corners connecting the first surface to the third to fifth surfaces and / or the corners connecting the second surface to the third to fifth surfaces can have a form that is contracted toward the central side in the first direction of the main body 110 when viewed with reference to the first surface or the second surface. Alternatively, due to the shrinkage behavior during the sintering process of the main body, the corners connecting the first surface 1 to the third to sixth surfaces 3, 4, 5, 6 and / or the corners connecting the second surface 2 to the third to sixth surfaces 3, 4, 5, 6 can have a form that is contracted toward the central side in the first direction of the main body 110 when viewed with reference to the first surface or the second surface. Alternatively, in order to prevent chipping defects or the like, the corners connecting the respective surfaces of the main body 110 are rounded by performing a separate process, so that the corners connecting the first surface to the third to sixth surfaces and / or the corners connecting the second surface to the third to sixth surfaces can have a rounded form.

[0034] On the other hand, in order to suppress the step due to the internal electrodes 121 and 122, after cutting so that the internal electrodes are exposed on the fifth and sixth surfaces 5 and 6 of the main body after lamination, when a single dielectric layer or two or more dielectric layers are laminated in the third direction (width direction) on both side surfaces of the capacitance forming portion Ac to form the margin portions 114 and 115, the portions connecting the first surface to the fifth and sixth surfaces and the portions connecting the second surface to the fifth and sixth surfaces can not have a contracted form.

[0035] The third and fourth surfaces of the main body can be composed of exposed portions EP where the internal electrodes 121, 122 and the dielectric layer 111 are alternately exposed, and non-exposed portions NEP other than the exposed portions. In the exposed portion EP of the third surface 3 of the main body, the first internal electrode 121 and the dielectric layer can be alternately exposed, and in the exposed portion EP of the fourth surface 4 of the main body, the second internal electrode 122 and the dielectric layer 111 can be alternately exposed. Further, the exposed portion EP can mean the region from the internal electrodes 121, 122 located at the uppermost part in the first direction to the internal electrodes 121, 122 located at the lowermost part in the first direction. On the other hand, in the present invention, the first, second, fifth, and sixth surfaces of the main body can be generally flat surfaces, and the third and fourth surfaces can include corners connecting to the first, second, fifth, and sixth surfaces.

[0036] The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated to such an extent that they are difficult to confirm without using a scanning electron microscope (SEM). The number of stacked dielectric layers does not particularly need to be limited and can be determined in consideration of the size of the multilayer electronic component. For example, 400 or more dielectric layers can be stacked to form the main body.

[0037] The dielectric layer 111 can be formed by manufacturing a ceramic slurry containing ceramic powder, an organic solvent, and a binder, applying and drying the slurry on a carrier film to provide a ceramic green sheet, and then firing the ceramic green sheet. The ceramic powder is not particularly limited as long as a sufficient capacitance can be obtained. For example, a barium titanate-based (BaTiO 3 )-based powder can be used. More specifically, the ceramic powder can be a barium titanate (BaTiO 3 )-based powder, a CaZrO 3 -based base normal dielectric powder, etc. More specifically, the barium titanate (BaTiO 3 )-based powder can be BaTiO 3 , (Ba1-x Ca x )TiO 3 (0 < x < 1), Ba(Ti 1-y Ca y )O 3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O 3 (0 < x < 1, 0 < y < 1) and Ba(Ti 1-y Zr y )O 3 (0 < y < 1) can be one or more of them, and the paraelectric powder of the CaZrO 3 substrate can be (Ca 1-x Sr x )(Zr 1-y Ti y )O 3 (0 < x < 1, 0 < y < 1).

[0038] Therefore, the dielectric layer 111 is BaTiO 3 , (Ba 1-x Ca x )TiO 3 (0 < x < 1), Ba(Ti 1-y Ca y )O 3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O 3 (0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O 3 (0 < y < 1) and (Ca 1-x Sr x )(Zr 1-y Ti y )O 3 (0 < x < 1, 0 < y < 1) can include one or more of them. In one embodiment, the dielectric layer 111 can mainly include (Ca 1-x Sr x )(Zr 1-y Ti y )O 3 (0 < x < 1, 0 < y < 1).

[0039] On the other hand, when a magnetic material is applied to the main body 110 instead of the dielectric material, the multilayer electronic component can function as an inductor. The magnetic material can be, for example, ferrite and / or metal magnetic particles. When the multilayer electronic component functions as an inductor, the internal electrodes can be coil-shaped conductors.

[0040] Also, when a piezoelectric material is applied to the main body 110 instead of the dielectric material, the multilayer electronic component can function as a piezoelectric element. The piezoelectric material can be, for example, PZT (lead zirconate titanate).

[0041] Also, when a ZnO-based or SiC-based material is applied to the main body 110 instead of the dielectric material, the multilayer electronic component can function as a varistor, and when a spinel-based material is applied to the main body 110 instead of the dielectric material, the multilayer electronic component can function as a thermistor.

[0042] That is, the multilayer electronic component 100 according to an embodiment of the present invention can function not only as a multilayer ceramic capacitor but also as an inductor, a piezoelectric element, a varistor, or a thermistor by appropriately changing the material and structure of the main body 110.

[0043] The main body 110 includes a capacitance forming portion Ac that is disposed inside the main body 110 and in which a capacitance is formed by including a first internal electrode 121 and a second internal electrode 122 that are disposed to face each other with the dielectric layer 111 interposed therebetween, and cover portions 112 and 113 formed at the upper and lower portions in the first direction of the capacitance forming portion Ac.

[0044] Also, the capacitance forming portion Ac is a portion that contributes to the formation of the capacitance of the capacitor, and can be formed by repeatedly laminating a plurality of first and second internal electrodes 121 and 122 with the dielectric layer 111 interposed therebetween.

[0045] The cover parts 112 and 113 can include an upper cover part 112 disposed at the upper part of the capacitance forming part Ac in the first direction and a lower cover part 113 disposed at the lower part of the capacitance forming part Ac in the first direction.

[0046] The upper cover part 112 and the lower cover part 113 can be formed by laminating a single dielectric layer or two or more dielectric layers in the thickness direction on the upper and lower surfaces of the capacitance forming part Ac, respectively, and can basically play a role in preventing damage to the internal electrodes due to physical or chemical stress.

[0047] The upper cover part 112 and the lower cover part 113 do not include internal electrodes and can include the same material as the dielectric layer 111.

[0048] That is, the upper cover part 112 and the lower cover part 113 can include a ceramic material, for example, barium titanate (BaTiO 3 )-based ceramic material.

[0049] On the other hand, the thickness of the cover parts 112 and 113 does not need to be particularly limited. For example, the thickness tc of the cover parts 112 and 113 can be 100 μm or less, 30 μm or less, or 20 μm or less. Here, the average thickness of the cover parts 112 and 113 means the respective average thicknesses of the first cover part 112 and the second cover part 113.

[0050] The average thickness tc of the cover parts 112 and 113 can mean the size in the first direction, and can be a value obtained by averaging the sizes in the first direction of the cover parts 112 and 113 measured at five points equally spaced in the second direction in the cross section in the first and second directions cut at the center in the third direction of the main body 110.

[0051] In addition, margin parts 114 and 115 can be disposed on the side surface of the capacitance forming part Ac.

[0052] The margin portions 114 and 115 can include a first margin portion 114 disposed on the fifth surface 5 of the main body 110 and a second margin portion 115 disposed on the sixth surface 6. That is, the margin portions 114 and 115 can be disposed on both end surfaces in the width direction of the ceramic main body 110.

[0053] As shown in FIG. 3, the margin portions 114 and 115 can mean the regions between the interfaces of both ends of the first and second internal electrodes 121 and 122 and the main body 110 in a cross-section obtained by cutting the main body 110 in the width-thickness (W-T) direction.

[0054] The margin portions 114 and 115 can basically play a role in preventing damage to the internal electrodes due to physical or chemical stress.

[0055] The margin portions 114 and 115 can be formed by applying a conductive paste to form internal electrodes, except where the margin portions are formed on the ceramic green sheet.

[0056] Also, in order to suppress the step difference caused by the internal electrodes 121 and 122, after cutting so that the internal electrodes are exposed on the fifth and sixth surfaces 5 and 6 of the main body after lamination, a single dielectric layer or two or more dielectric layers are laminated in the third direction (width direction) on both side surfaces of the capacitance forming portion Ac to form the margin portions 114 and 115.

[0057] On the other hand, the width of the margin portions 114 and 115 does not need to be particularly limited. For example, the average width of the margin portions 114 and 115 can be 100 μm or less, 20 μm or less, or 15 μm or less. Here, the average width of the margin portions 114 and 115 means the respective average thicknesses of the first margin portion 114 and the second margin portion 115.

[0058] The average widths of the margin portions 114 and 115 can mean the average size in the third direction of the region where the internal electrode is separated from the fifth surface and the average size in the third direction of the region where the internal electrode is separated from the sixth surface, and can be the value obtained by averaging the sizes in the third direction of the margin portions 114 and 115 measured at five equally spaced points on the side surface of the capacitance forming portion Ac.

[0059] The internal electrodes 121 and 122 can include the first and second internal electrodes 121 and 122. The first and second internal electrodes 121 and 122 are alternately arranged so as to face each other with the dielectric layer 111 constituting the main body 110 interposed therebetween, and can be respectively exposed on the third and fourth surfaces 3 and 4 of the main body 110.

[0060] The first internal electrode 121 is separated from the fourth surface 4 and is exposed through the third surface 3, and the second internal electrode 122 is separated from the third surface 3 and can be exposed through the fourth surface 4. A first external electrode 131 is arranged on the third surface 3 of the main body and is connected to the first internal electrode 121, and a second external electrode 132 can be arranged on the fourth surface 4 of the main body and connected to the second internal electrode 122.

[0061] That is, the first internal electrode 121 is not connected to the second external electrode 132 but is connected to the first external electrode 131, and the second internal electrode 122 is not connected to the first external electrode 131 but is connected to the second external electrode 132. Therefore, the first internal electrode 121 can be formed at a certain distance from the fourth surface 4, and the second internal electrode 122 can be formed at a certain distance from the third surface 3. Further, the first and second internal electrodes 121 and 122 can be arranged separated from the fifth and sixth surfaces of the main body 110.

[0062] The conductive metal contained in the internal electrodes 121 and 122 can be one or more of Ni, Cu, Pd, Ag, Au, Pt, In, Sn, Al, Ti, and alloys thereof, but the present invention is not limited thereto.

[0063] The average thickness td of the dielectric layer 111 does not particularly need to be limited, but it can be, for example, 0.1 μm to 10 μm. The average thickness te of the internal electrodes 121 and 122 does not particularly need to be limited, but it can be, for example, 0.05 μm to 3.0 μm. Also, the average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 can be arbitrarily set according to desired characteristics and applications.

[0064] The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 respectively mean the sizes in the first direction of the dielectric layer 111 and the internal electrodes 121 and 122. The average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 can be measured by scanning the cross-sections in the first and second directions of the main body 110 with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, the average thickness td of the dielectric layer 111 can be measured by measuring the thicknesses at a number of points of one dielectric layer 111, for example, 30 points at equal intervals in the second direction, and then measuring the average value. Also, the average thickness te of the internal electrodes 121 and 122 can be measured by measuring the thicknesses at a number of points of one internal electrode 121 or 122, for example, 30 points at equal intervals in the second direction, and then measuring the average value. The 30 points at equal intervals can be specified by the capacitance forming portion Ac. On the other hand, after performing such average value measurements for 10 dielectric layers 111 and 10 internal electrodes 121 and 122 respectively, and then measuring the average values, the average thickness td of the dielectric layer 111 and the average thickness te of the internal electrodes 121 and 122 can be further generalized.

[0065] The external electrodes 131 and 132 can be disposed on the main body 110. The external electrodes 131 and 132 can be disposed on the third and fourth surfaces 3 and 4 of the main body 110 respectively, and can include first and second external electrodes 131 and 132 respectively connected to the first and second internal electrodes 121 and 122.

[0066] The external electrodes 131 and 132 can include base electrode layers 131a and 132a, intermediate electrode layers 131b and 132b disposed on the base electrode layers, and upper electrode layers 131c and 132c disposed on the intermediate electrode layers.

[0067] In one embodiment, the external electrodes 131 and 132 include band portions P1b and P2b extending on a part of the first surface and a part of the second surface, and the band portions P1b and P2b can include a part of the underlying electrode layers 131a and 132a, a part of the intermediate electrode layers 131b and 132b, and a part of the upper electrode layers 131c and 132c. By including the band portions P1b and P2b in the external electrodes 131 and 132, they can be easily mounted on the substrate. On the other hand, the portions disposed on the exposed portions EP of the third and fourth surfaces of the external electrodes 131 and 132 can be made into connection portions P1a and P2a, and among the regions disposed between the extension line E1 of the first surface and the extension line E2 of the second surface of the external electrodes 131 and 132, the regions excluding the connection portions can be made into the corner portions P1c and P2c of the external electrodes 131 and 132.

[0068] Hereinafter, the first external electrode 131 will be mainly described. However, the first external electrode 131 is disposed on the third surface, and the only difference is that the second external electrode 132 is disposed on the fourth surface. Since the configurations of the first external electrode 131 and the second external electrode 132 are similar, this is regarded as including the description regarding the second external electrode 132.

[0069] The underlying electrode layers 131a and 132a contain metal and can be entirely disposed on the exposed portions EP and the non-exposed portions NEP. The underlying electrode layers 131a and 132a can play a role of directly contacting the internal electrodes 121 and 122 to electrically connect the external electrodes 131 and 132 and the internal electrodes 121 and 122.

[0070] In one embodiment, the underlying electrode layers 131a and 132a can further contain glass. Since the underlying electrode layers 131a and 132a further containing glass can improve the bonding force with the main body, the bonding force between the external electrodes 131 and 132 and the main body 110 can be improved. The underlying electrode layers 131a and 132a can be fired electrodes formed by applying and firing a paste containing glass and metal to the main body.

[0071] Although a material excellent in electrical conductivity can be used as the metal contained in the underlying electrode layers 131a and 132a, it is not particularly limited. For example, the metal contained in the underlying electrode layers 131a and 132a can be one or more of nickel (Ni), copper (Cu), and their alloys, and more preferably can be Cu.

[0072] The intermediate electrode layers 131b and 132b include a metal 131b-2 and a resin 131b-1, and can be disposed on the non-exposed portions NEP of the third and fourth surfaces.

[0073] The intermediate electrode layers 131b and 132b are disposed on the non-exposed portions NEP and can serve to prevent the corner portions of the external electrodes 131 and 132 from being formed thinly. Further, since the intermediate electrode layers 131b and 132b include the resin 131b-1, they can serve to improve the bending strength of the laminated electronic component 100.

[0074] The method of forming the intermediate electrode layers 131b and 132b does not need to be particularly limited, and can be formed by applying and curing a paste containing a metal 131b-2 and a resin 131b-1 on the corner portions of the underlying electrode layers 131a and 132a.

[0075] The intermediate electrode layers 131b and 132b can be further disposed on a part of the exposed portion EP. That is, the intermediate electrode layers 131b and 132b do not necessarily need to be disposed only on the non-exposed portions NEP, and can be extended and disposed from the non-exposed portions NEP onto a part of the exposed portion EP. However, it is preferable that the intermediate electrode layers 131b and 132b are not disposed on at least a part of the exposed portion EP. When the intermediate electrode layers 131b and 132b are disposed on the entire exposed portion EP, the thickness of the external electrode may increase, and the capacitance per unit volume of the laminated electronic component may decrease.

[0076] The resin 131b-1 contained in the intermediate electrode layers 131b and 132b can include a thermosetting resin having electrical insulating properties.

[0077] At this time, the thermosetting resin can be, for example, an epoxy resin, but the present invention is not limited thereto, and for example, it can be a resin having a small molecular weight and being liquid at room temperature among bisphenol A resins, glycol epoxy resins, novolak epoxy resins, or derivatives thereof.

[0078] In one embodiment, the metal 131b-2 included in the intermediate electrode layers 131b and 132b can contain Ag.

[0079] Generally, in the case of a conductive resin layer containing a metal and a resin, since the metal is dispersed in the conductive resin layer in a particulate form, there may be a problem that the electrical conductivity is weak. Ag has a high electrical conductivity, and even if Ag is dispersed in the intermediate electrode layers 131b and 132b in a particulate form, it is possible to suppress a decrease in the equivalent series resistance (ESR). However, in the case of Ag, it is known as the metal in which ion migration most easily occurs. Ion migration means that when a voltage is applied, metal ions move and precipitate in the dendrite of the metal. When ion migration occurs, cracks may occur in the plating layer, the main body, etc. of the external electrode, and there may be a deterioration of the insulation resistance due to current leakage and a short circuit between the first external electrode 131 and the second external electrode 132. According to one embodiment of the present invention, by disposing the upper electrode layers 131c and 132c containing Sn and a resin on the intermediate electrode layers 131b and 132b, it is possible to minimize the occurrence of ion migration even if the intermediate electrode layers 131b and 132b contain Ag, and it is possible to suppress a decrease in the ESR. Since the Sn contained in the upper electrode layers 131c and 132c has a low melting point, an intermetallic compound can be easily formed even at the curing temperature of the upper electrode layers 131c and 132c, and the intermetallic compound of the upper electrode layers 131c and 132c can play a role of suppressing the movement of Ag in the intermediate electrode layers 131b and 132b.

[0080] Also, when the metal contained in the base electrode layers 131a and 132a is Cu, since the intermediate electrode layers 131b and 132b contain Ag which has a larger standard reduction potential than the Cu contained in the base electrode layers 131a and 132a, it can play a role in preventing oxidation of the base electrode layers 131a and 132a and preventing penetration of moisture. Also, when the metal contained in the base electrode layers 131a and 132a is Cu, a Cu-Ag alloy layer is formed at the interface between the intermediate electrode layers 131b and 132b and the base electrode layers 131a and 132a, improving the mechanical bonding force and electrical connectivity between the base electrode layers 131a and 132a and the intermediate electrode layers 131b and 132b, and further improving the moisture resistance reliability.

[0081] The metal 131b-2 contained in the intermediate electrode layers 131b and 132b can exist in the form of metal particles. The metal contained in the intermediate electrode layers 131b and 132b can exist in a form in which a plurality of metal particles 131b-2 are randomly dispersed. Also, as shown in FIG. 7, the plurality of metal particles 131b-2 can be in a form in which spherical particles SP and flake (flake) - like particles FP are mixed. Thereby, the electrical conductivity of the intermediate electrode layers 131b and 132b can be further improved. However, it is not limited thereto, and the plurality of metal particles 131b-2 can also consist only of spherical particles SP or only of flake - like particles FP.

[0082] The average size of the metal particles 131b-2 does not particularly need to be limited. For example, the average size of the metal particles 131b-2 can be 0.2 to 20 μm. On the other hand, the average size of the metal particles 131b-2 can be measured from an image obtained by scanning the cross-section (L-T cross-section) in the first and second directions taken at the central part in the third direction of the main body 110 with SEM. In the above image, it can be the value obtained by averaging the sizes of 10 or more metal particles 131b-2. On the other hand, the size of one metal particle 131b-2 can be the diameter of the virtual circle when assuming a circle having the same area as the area of the metal particle 131b-2.

[0083] Figure 10 is an image obtained by scanning the K2 region of FIG. 2 with a scanning electron microscope (SEM). Referring to FIG. 10, it can be confirmed that a plurality of metal particles 131b-2 are in a form in which spherical particles SP and flake-like particles FP are mixed and are randomly dispersed and arranged.

[0084] Also, it can be confirmed that a first alloy layer Lab is disposed at the interface between the base electrode layer 131a and the intermediate electrode layer 131b. Referring to FIG. 11(a), which is an enlarged image of the K3 region of FIG. 10, the first alloy layer Lab, which can be distinguished from the metal particles 131b-2 of the base electrode layer 131a and the intermediate electrode layer 131b by contrast, is clearly observed.

[0085] FIG. 11(b) is an image obtained by analyzing the Ag element content of the K3 region of FIG. 10 with SEM-EDS, and (c) is an image obtained by analyzing the Cu element content of the K3 region of FIG. 10 with SEM-EDS. Referring to FIGS. 11(b) and (c), it can be confirmed that the first alloy layer Lab is a Cu-Ag alloy.

[0086] Therefore, in one embodiment, a first alloy layer Lab containing a Cu-Ag alloy can be disposed at the interfaces between the base electrode layers 131a, 132a and the intermediate electrode layers 131b, 132b. The first alloy layer Lab can be formed by the mutual diffusion of Cu contained in the base electrode layers 131a, 132a and Ag in the intermediate electrode layers 131b, 132b due to the hardening heat treatment of the intermediate electrode layers 131b, 132b, the hardening heat treatment of the upper electrode layers 131c, 132c, or a separate heat treatment process or the like. At this time, the Cu-Ag alloy can be one or more of 15 Cu 6 and Ag 11 Cu 4 one or more of them.

[0087] The first alloy layer Lab can play a role in improving the mechanical bonding force and electrical connectivity between the underlying electrode layers 131a and 132a and the intermediate electrode layers 131b and 132b, thereby further improving the effect of reducing the ESR of the present invention.

[0088] On the other hand, the thickness of the first alloy layer Lab does not need to be particularly limited, but for example, it can be 10 nm or more and 500 nm or less.

[0089] In one embodiment, the first alloy layer Lab can be discontinuously disposed at the interfaces between the underlying electrode layers 131a and 132a and the intermediate electrode layers 131b and 132b. However, it is not limited thereto, and as shown in FIG. 14, the first alloy layer Lab' can also be observed as a single layer.

[0090] In one embodiment, when the length in the first direction from the extension line E1 of the first surface to the extension line E2 of the second surface is T, and the total length in the first direction of the intermediate electrode layers 131b and 132b disposed between the extension line E1 of the first surface and the extension line E2 of the second surface is BS, BS / T can be 0.2 or more and 0.6 or less.

[0091] If BS / T is less than 0.2, the effect of improving the moisture resistance reliability according to the present invention may be insufficient. If it exceeds 0.6, since the thickness of the external electrode is too thick, the capacitance per unit volume may decrease.

[0092] Referring to FIG. 5, BS can be measured in the cross-sections in the first and second directions cut at the center in the third direction of the main body. BS means the value obtained by adding BS1, which is the length in the first direction from the extension line E1 of the first surface to the region where the intermediate electrode layer is cut, and BS2, which is the length in the first direction from the extension line E2 of the second surface to the region where the intermediate electrode layer is cut. FIG. 5 shows the first external electrode 131, but the second external electrode 132 can also be measured in the same manner.

[0093] Here, the extension line E1 of the first surface can be defined as a straight line passing through the contact point between the third line and the first surface and the contact point between the fifth line and the first surface when seven straight lines in the thickness direction with equal intervals in the length direction are drawn from the third surface to the fourth surface in the length-thickness cross-section (L-T cross-section) obtained by cutting the multilayer electronic component 100 at the center in the width direction. The extension line E2 of the second surface can also be defined in the same manner as the extension line of the first surface with respect to the second surface.

[0094] In one embodiment, one ends of the intermediate electrode layers 131b and 132b in the band portions P1b and P2b can be arranged to cover one ends of the base electrode layers 131a and 132a. Thereby, the bending strength of the multilayer electronic component can be further improved, and the moisture resistance reliability can be further improved by hermetically sealing the base electrode layers 131a and 132a together with the upper electrode layers 131c and 132c.

[0095] At this time, the other ends of the intermediate electrode layers 131b and 132b can be arranged on the exposed portion EP. However, it is not limited thereto, and the other ends of the intermediate electrode layers 131b and 132b can also be arranged on the non-exposed portion NEP.

[0096] The upper electrode layers 131c and 132c include Sn131c-2 and resin 131c-1, and can be arranged on the non-exposed portion NEP of the third and fourth surfaces. The upper electrode layers 131c and 132c can play a role in improving the bending strength of the multilayer electronic component 100 and minimizing the occurrence of ion migration due to the metal contained in the intermediate electrode layers 132b and 132b.

[0097] In one embodiment, the upper electrode layers 131c and 132c can be further arranged on the exposed portion EP. That is, similar to the base electrode layers 131a and 132a, they can be arranged on both the non-exposed portion NEP and the exposed portion EP.

[0098] The resin 131c-1 contained in the upper electrode layers 131c and 132c can include a thermosetting resin having electrical insulation properties.

[0099] At this time, the thermosetting resin can be, for example, an epoxy resin, but the present invention is not limited thereto. For example, it can be a resin having a small molecular weight among bisphenol A resin, glycol epoxy resin, novolac epoxy resin or their derivatives and being liquid at normal temperature.

[0100] Also, the resin 131c-1 contained in the upper electrode layers 131c and 132c can be the same type of resin as the resin 131b-1 contained in the intermediate electrode layers 131b and 132b, but is not limited thereto. The resin 131c-1 contained in the upper electrode layers 131c and 132c can be a different type from the resin 131b-1 contained in the intermediate electrode layers 131b and 132b.

[0101] In one embodiment, the upper electrode layers 131c and 132c can include an intermetallic compound containing Sn. That is, at least a part of Sn131c-2 can exist in the form of an intermetallic compound.

[0102] Generally, in the case of a conductive resin layer formed by applying and curing a paste containing a metal and a resin, the melting point of the metal is higher than the curing temperature of the resin, and it is common to contain the metal in the form of metal particles. On the other hand, according to one embodiment of the present invention, since the upper electrode layers 131c and 132c contain Sn with a low melting point, Sn can be melted even at the curing temperature of the upper electrode layers 131c and 132c to easily form an intermetallic compound. The intermetallic compound of the upper electrode layers 131c and 132c can play a role in suppressing the movement of Ag in the intermediate electrode layers 131b and 132b and minimizing the occurrence of ion migration.

[0103] On the other hand, in the case of the conductive resin layer containing Sn and resin, since Sn melts in the curing process, the corner portion can become thinner after the curing process than in the coating state before the curing process, and thus there is a risk of deterioration in moisture resistance reliability. That is, when forming a conductive resin layer containing Sn and resin on the fired electrode, it was necessary to apply the conductive resin layer thicker in order to ensure the thickness of the corner portion, as compared with the conductive resin layer not containing Sn. On the other hand, according to one embodiment of the present invention, since the intermediate electrode layers 131b and 132b are disposed on the non-exposed portion NEP, it is possible to ensure moisture resistance reliability without applying the upper electrode layers 131c and 132c containing Sn and resin thickly.

[0104] The intermetallic compound containing Sn in the upper electrode layers 131c and 132c can be, for example, a tin (Sn)-bismuth (Bi) alloy, a tin (Sn)-lead (Pb) alloy, a tin (Sn)-copper (Cu) alloy, a tin (Sn)-silver (Ag) alloy, and a tin (Sn)-silver (Ag)-copper (Cu) alloy.

[0105] Also, as shown in FIG. 6, Sn131c-2 can be observed in a form that spreads widely and is connected to each other when observing the cross section of the upper electrode layers 131c and 132c. Therefore, since the electrical connectivity can be improved compared to the case where the metal exists only in the form of metal particles in the conductive resin layer, the ESR can be lowered.

[0106] Also, the intermetallic compound 131c-2 containing Sn can minimize the stress inside the main body 110 and improve the high-temperature load and moisture resistance load characteristics.

[0107] FIG. 12 is an image obtained by scanning the K1 region of FIG. 2 with a scanning electron microscope. Referring to FIG. 12, it can be confirmed that Sn131c-2 is observed not in the form of metal particles but in a form that spreads widely and is connected to each other.

[0108] In one embodiment, a second alloy layer Lac containing a Cu-Sn alloy can be disposed at the interface between the base electrode layer 131a and the upper electrode layer 131c.

[0109] The second alloy layer Lac can be formed by the mutual diffusion of Cu contained in the base electrode layers 131a and 132a and Sn in the intermediate electrode layers 131b and 132b during the hardening heat treatment of the upper electrode layers 131c and 132c, or by a separate heat treatment process or the like.

[0110] The second alloy layer Lac can play a role in improving the mechanical bonding force and electrical connectivity between the base electrode layers 131a and 132a and the upper electrode layers 131c and 132c, thereby further improving the effect of reducing the ESR of the present invention.

[0111] At this time, the Cu-Sn alloy of the second alloy layer Lac can be Cu 3 Sn. When the intermetallic compound 131c-2 of the upper electrode layer is Cu 3 Sn, it may be difficult to distinguish between the second alloy layer Lac and the intermetallic compound 131c-2.

[0112] In one embodiment, the second alloy layer Lac can be discontinuously disposed at the interface between the lower electrode layers 131a and 132a and the upper electrode layers 131c and 132c. However, it is not limited thereto, and as shown in FIG. 14, the second alloy layer Lac' can also be observed as a single layer.

[0113] On the other hand, the thickness of the second alloy layer Lab does not need to be particularly limited, but can be, for example, 10 nm or more and 500 nm or less.

[0114] FIG. 13(a) is an enlarged image of the K4 region in FIG. 12, (b) is an image of analyzing the Ag element content in the K4 region by SEM-EDS, (c) is an image of analyzing the Cu element content in the K4 region in FIG. 12 by SEM-EDS, and (d) is an image of analyzing the Sn element content in the K4 region in FIG. 12 by SEM-EDS. Referring to FIGS. 13(a) to (d), it can be confirmed that a second alloy layer Lac containing a Cu—Sn alloy is disposed at the interface between the base electrode layer 131a and the upper electrode layer 131c. Further, it can be confirmed that at least a part of Sn131c-2 forms an intermetallic compound with Ag and exists in the form of a tin (Sn)-silver (Ag) alloy.

[0115] On the other hand, the metals contained in the upper electrode layers 131c and 132c are not limited to only Sn131c-2 and the intermetallic compound containing Sn.

[0116] Referring to FIG. 8, in one embodiment, the upper electrode layers 131c' and 132c' may further include a plurality of metal particles 131c-3', and Sn131c-2' may be disposed so as to connect at least a part of the plurality of metal particles 131c-3'. That is, the upper electrode layers 131c' and 132c' may include a plurality of metal particles 131c-3', Sn131c-2' disposed so as to connect at least a part of the plurality of metal particles 131c-3', and a resin 131c-1'.

[0117] At this time, the plurality of metal particles 131c-3' may include one or more of Ag and Cu. Further, at least a part of Sn131c-2' may exist in the form of an intermetallic compound, for example, Ag 3 Sn, Cu 6 Sn 5 and Cu 3 Sn in one or more forms.

[0118] Sn131c-2' can play a role in connecting at least a part of a plurality of metal particles to improve electrical connectivity. Also, even if the plurality of metal particles 131c-3' contain Ag, ion migration can be suppressed by Sn131c-2'. Sn131c-2' can be arranged in a form surrounding at least a part of the plurality of metal particles 131c-3'. Further, by having at least a part of Sn131c-2' exist in the form of an intermetallic compound, the stress inside the main body 110 can be minimized, and the characteristics of high-temperature load and moisture resistance load can be improved.

[0119] At this time, the intermetallic compound can be an intermetallic compound between a low-melting-point metal and a metal particle. The low-melting-point metal contained in the paste for the conductive resin layer partially melts during the drying and curing heat treatment process, and can form an intermetallic compound with a part of the metal particles.

[0120] To give a more specific example, the above low-melting-point metal can be one or more selected from Sn, Sn 96.5 Ag 3.0 Cu 0.5 , Sn 42 Bi 58 and Sn 72 Bi 28 After applying the paste for the conductive resin layer onto the main body and going through the drying and curing process, Sn melts, and the melted Sn wets high-melting-point metal particles such as Ag or Cu by capillary action and reacts with a part of the Ag or Cu metal particles to form intermetallic compounds such as Ag 3 Sn, Cu 6 Sn 5 Cu 3 Sn, etc. Ag or Cu that has not participated in the reaction remains in the form of metal particles 131c-3' as shown in FIG. 6.

[0121] Since Sn131c-2' is arranged to connect at least a part of the plurality of metal particles 131c-3', sufficient electrical connectivity can be ensured even if the metal particles 131c-3' exist only as spherical particles. Therefore, the metal particles 131c-3' can be composed of only spherical particles. However, it is not necessary to be limited to this. As shown in FIG. 9, the upper electrode layer 131c'' can include a plurality of metal particles 131c-3'' in which spherical particles SP and flake-shaped particles FP are mixed, Sn131c-2'' arranged to connect at least a part of the plurality of metal particles 131c-3'', and resin 131c-1''. Also, the metal particles can be composed of only flake-shaped particles.

[0122] In one embodiment, the upper electrode layers 131c and 132c can be arranged to cover the intermediate electrode layers 131b and 132b. By arranging the upper electrode layers 131c and 132c to cover the intermediate electrode layers 131b and 132b, the effect of minimizing ion migration can be further improved.

[0123] In FIG. 2, the upper electrode layers 131c and 132c cover all the exposed portions EP and non-exposed portions NEP of the third and fourth surfaces and are shown to have a convex shape, but the present invention is not limited thereto.

[0124] For example, as shown in FIG. 15, the external electrodes 231 and 232 can have a concave shape on the non-exposed portion NEP. The base electrode layers 231a and 232a are arranged on the exposed portion EP and the non-exposed portion NEP, the intermediate electrode layers 231b and 232b are arranged on the non-exposed portion NEP, and the upper electrode layers 231c and 232c are arranged on the exposed portion EP and the non-exposed portion NEP and can be arranged not on at least a part of the exposed portion EP. By the upper electrode layers 231c and 232c covering the intermediate electrode layers 231b and 232b, the occurrence of ion migration can be minimized, and the decrease in ESR can be suppressed.

[0125] Also, on at least a part of the exposed portion EP where the upper electrode layers 231c and 232c are not disposed, the plating layers 231d and 232d can be in contact with the underlying electrode layers 231a and 232a, and the second alloy layer Lac'' can be not disposed on at least a part of the exposed portion EP where the upper electrode layers 231c and 232c are not disposed.

[0126] Referring to FIG. 5, in one embodiment, the maximum thickness t3 of the upper electrode layer 131c can be 10 μm or more and 30 μm or less.

[0127] When the maximum thickness t3 of the upper electrode layer 131c is less than 10 μm, the upper electrode layer 131c may not be able to cover a part of the intermediate electrode layer 131b, and the effect of suppressing ion migration may be insufficient. When it exceeds 30 μm, since the thickness of the external electrode is too thick, the capacitance per unit volume of the multilayer electronic component may decrease.

[0128] Referring to FIG. 5, in one embodiment, when the maximum thickness of the underlying electrode layer 131a is t1, the maximum thickness of the intermediate electrode layer 131b is t2, and the maximum thickness of the upper electrode layer 131c is t3, t2 < t1 < t3 can be satisfied. Thereby, while reducing the ESR and suppressing ion migration, the effect of further improving the bending strength and moisture resistance reliability can be achieved.

[0129] In one embodiment, the underlying electrode layers 131a and 132a can contain Cu as a metal component, the intermediate electrode layers 131b and 132b can contain Ag as a metal component, and the upper electrode layers 131c and 132c can contain Cu and Sn as metal components. Thereby, while further suppressing the ion migration of Ag contained in the intermediate electrode layers 131b and 132b, the ESR can be made lower.

[0130] Further, the base electrode layers 131a and 132a contain Cu as the main component as a metal component, the intermediate electrode layers 131b and 132b contain Ag as the main component as a metal component, and the upper electrode layers 131c and 132c can contain Cu and Sn as the main components as a metal component. Here, the fact that the base electrode layers 131a and 132a contain Cu as the main component as a metal component means that when elemental analysis is performed on the cross-sections of the base electrode layers 131a and 132a in the first and second directions by SEM-EDS, in the base electrode layers 131a and 132a, the area occupied by the Cu element is 80% or more of the area occupied by all metal elements. The same can be applied to the intermediate electrode layers 131b and 132b and the upper electrode layers 131c and 132c as well.

[0131] Further, the metal components contained in the intermediate electrode layers 131b and 132b can be in the form of metal particles, and at least a part of the metal components contained in the upper electrode layers 131c and 132c can be in the form of intermetallic compounds.

[0132] In one embodiment, the external electrodes 131 and 132 can further include plating layers 131d and 132d disposed on the upper electrode layer.

[0133] The plating layers 131d and 132d serve to improve the mounting characteristics. The types of the plating layers 131d and 132d are not particularly limited, and can be plating layers containing one or more of Ni, Sn, Pd, and alloys thereof, and can be formed of a plurality of layers.

[0134] To give a more specific example of the plating layers 131d and 132d, the plating layers 131d and 132d can be Ni plating layers or Sn plating layers, and can be in a form in which a Ni plating layer and a Sn plating layer are sequentially formed on the upper electrode layers 131c and 132c, or can be in a form in which a Sn plating layer, a Ni plating layer, and a Sn plating layer are sequentially formed. Further, the plating layers 131d and 132d can also include a plurality of Ni plating layers and / or a plurality of Sn plating layers.

[0135] Although the embodiments of the present invention have been described in detail above, the present invention is not limited by the above-described embodiments and the accompanying drawings, but is limited by the appended claims. Therefore, various forms of substitution, modification, and change are possible by those having ordinary knowledge in the art within the scope not departing from the technical idea of the present invention described in the claims, and it can be said that these also belong to the scope of the present invention.

[0136] In addition, the expression "one embodiment" used in the present disclosure does not mean the same embodiment, but is provided to emphasize and explain each different unique feature. However, the above-presented one embodiment does not exclude being implemented in combination with the features of other one embodiments. For example, even if the matter described in a specific one embodiment is not described in another one embodiment, it can be understood as an explanation related to another one embodiment as long as there is no explanation contrary to or conflicting with that matter in another one embodiment.

[0137] The terms used in the present disclosure are merely used to explain one embodiment and are not intended to limit the present disclosure. At this time, the singular expression includes the plural expression unless the context clearly indicates otherwise.

Explanation of Reference Numerals

[0138] 100 Multilayer electronic component 110 Body 111 Dielectric layer 112, 113 Cover part 114, 115 Margin part 121, 122 Internal electrode 131, 132 External electrode 131a, 132a Base electrode layer Lab First alloy layer Lac Second alloy layer 131b, 132b Intermediate electrode layer 131c, 132c Upper electrode layer 131d, 132d Plating layer EP Exposed part NEP non-exposed portion Ac capacitance forming portion

Claims

1. a body including dielectric layers and internal electrodes alternately disposed with the dielectric layers, the body including first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction; an external electrode disposed on the body; the third and fourth surfaces of the body include exposed portions where the dielectric layers and the internal electrodes are alternately exposed, and non-exposed portions other than the exposed portions; the external electrode includes a base electrode layer, an intermediate electrode layer disposed on the base electrode layer, and an upper electrode layer disposed on the intermediate electrode layer; the base electrode layer is disposed on the exposed portion and the unexposed portion, the intermediate electrode layer is disposed on the unexposed portion, and the upper electrode layer is disposed on the unexposed portion; The underlying electrode layer contains a metal, the intermediate electrode layer contains a metal and a resin, and the upper electrode layer contains Sn and a resin.

2. the external electrode includes a band portion extending over a portion of the first surface and a portion of the second surface; 2. The multilayer electronic component according to claim 1, wherein the band portion includes a part of the base electrode layer, a part of the intermediate electrode layer, and a part of the upper electrode layer.

3. The multilayer electronic component according to claim 1 , wherein the intermediate electrode layer is further disposed on a portion of the exposed portion.

4. The multilayer electronic component according to claim 1 , wherein the upper electrode layer is further disposed on the exposed portion.

5. 2. The multilayer electronic component according to claim 1, wherein the metal contained in the base electrode layer includes Cu.

6. 2. The multilayer electronic component according to claim 1, wherein the metal contained in the intermediate electrode layer includes Ag.

7. 2. The multilayer electronic component according to claim 1, wherein a first alloy layer containing a Cu--Ag alloy is disposed at an interface between the base electrode layer and the intermediate electrode layer.

8. 8. The multilayer electronic component according to claim 1, further comprising a second alloy layer containing a Cu--Sn alloy disposed at an interface between the base electrode layer and the upper electrode layer.

9. 9. The multilayer electronic component according to claim 8, wherein the second alloy layer is discontinuously disposed at the interface between the base electrode layer and the upper electrode layer.

10. The Cu-Sn alloy is Cu ３ The multilayer electronic component according to claim 8 , wherein the metal is Sn.

11. 2. The multilayer electronic component according to claim 1, wherein a first alloy layer containing a Cu-Ag alloy is disposed at an interface between the base electrode layer and the intermediate electrode layer, and a second alloy layer containing a Cu-Sn alloy is disposed at an interface between the base electrode layer and the upper electrode layer.

12. The multilayer electronic component according to claim 1 , wherein the base electrode layer further includes glass.

13. 3. The multilayer electronic component according to claim 2, wherein one end of the intermediate electrode layer in the band portion is disposed so as to cover one end of the base electrode layer.

14. The multilayer electronic component according to claim 13 , wherein the other end of the intermediate electrode layer is disposed on the exposed portion.

15. 2. The multilayer electronic component according to claim 1, wherein, when a length in a first direction from an extension line of the first surface to an extension line of the second surface is T and a total length in the first direction of the intermediate electrode layers disposed between the extension line of the first surface and the extension line of the second surface is Bs, Bs / T is 0.2 or more and 0.6 or less.

16. The multilayer electronic component according to claim 1 , wherein the upper electrode layer includes an intermetallic compound containing Sn.

17. the upper electrode layer further comprises a plurality of metal particles; The multilayer electronic component according to claim 1 , wherein the Sn is arranged so as to connect at least a portion of the plurality of metal particles.

18. The multilayer electronic component according to claim 17 , wherein the plurality of metal particles include one or more of Ag and Cu.

19. 2. The multilayer electronic component according to claim 1, wherein the maximum thickness of the upper electrode layer is 10 μm or more and 30 μm or less.

20. The multilayer electronic component according to claim 1 , wherein the upper electrode layer is disposed so as to cover the intermediate electrode layer.

21. The multilayer electronic component according to claim 1 , wherein the external electrodes further include a plating layer disposed on the upper electrode layer.

22. 2. The multilayer electronic component according to claim 1, wherein t2<t1<t3 is satisfied, where t1 is the maximum thickness of the base electrode layer, t2 is the maximum thickness of the intermediate electrode layer, and t3 is the maximum thickness of the upper electrode layer.

23. the base electrode layer contains Cu as a metal component, the intermediate electrode layer contains Ag as a metal component, 2. The multilayer electronic component according to claim 1, wherein the upper electrode layer contains Cu and Sn as metal components.

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