Electronic component

Abstract

To provide an electronic component capable of suppressing a warp.SOLUTION: An electronic component 1 includes: a function element 2 with an electrode 21; and a bus bar 3 that is electrically and mechanically connected to the electrode 21. The bus bar 3 includes: a body part 30 having along a longer direction D1; and a connection conductor 33 formed integrally with the body part 30. The connection conductor 33 includes: a straight part 4 parallel to the longer direction D1; a connecting part 5 connecting an intermediate part 40 of the straight part 4 and the body part 30; and two connections 6 that are provided at both ends of the straight part 4 and are connected to the electrodes 21 via a conductive material 60.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present disclosure generally relates to electronic components, and more particularly to an electronic component including a functional element and a bus bar.

Background Art

[0002] Patent Document 1 discloses a capacitor. This capacitor includes a plurality of elements and a pair of bus bars.

[0003] Here, each of the plurality of elements has a flat shape including a pair of flat portions and a pair of curved portions. Each of the plurality of elements has a pair of end face electrodes at both ends thereof. The plurality of elements are arranged in a row such that the pair of flat portions are located on the same plane or parallel planes, respectively.

[0004] On the other hand, each of the pair of bus bars has an electrode connection portion connected to each end face electrode of the plurality of elements and an external connection portion for electrically connecting the plurality of elements to the outside. The pair of bus bars are arranged along the arrangement direction of the plurality of elements.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] However, in the capacitor of Patent Document 1, when a thermal load is applied, there is a problem that warping easily occurs with respect to the arrangement direction of the plurality of elements.

[0007] An object of the present disclosure is to provide an electronic component capable of suppressing warping.

Means for Solving the Problems

[0008] An electronic component according to one aspect of the present disclosure includes a functional element having electrodes, and a bus bar electrically and mechanically connected to the electrodes. The bus bar includes a main body portion having a longitudinal direction, and a connection conductor integrally formed with the main body portion. The connection conductor has a linear portion parallel to the longitudinal direction, a connecting portion connecting an intermediate portion of the linear portion and the main body portion, and two connection portions provided at both ends of the linear portion and connected to the electrodes by conductive members.

Advantages of the Invention

[0009] According to the present disclosure, warping can be suppressed.

Brief Description of the Drawings

[0010]

Figure 1

Figure 2

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Figure 11

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Figure 14

MODE FOR CARRYING OUT THE INVENTION

[0011] 1. Overview FIGS. 9A and 9B show an example of a general electronic component 1. This electronic component 1 includes a functional element 2 and a bus bar 3. The functional element 2 has electrodes 21. The bus bar 3 is electrically and mechanically connected to the electrodes 21.

[0012] More specifically, the bus bar 3 has a main body portion 30 and a plurality of connection portions 6. The main body portion 30 has a longitudinal direction D1. The plurality of connection portions 6 are directly formed on the main body portion 30 and extend in a direction D2 orthogonal to the longitudinal direction D1. And, two connection portions 6 are electrically and mechanically connected to one functional element 2. Note that the capacitor of Patent Document 1 also has a similar structure.

[0013] Here, when a thermal load is applied to the above-described electronic component 1, as shown in FIG. 9B, warping is likely to occur in the arrangement direction (longitudinal direction D1) of the plurality of functional elements 2. In order to suppress this warping, when the inventors conducted research, it was found that the difference in the thermal physical properties (e.g., coefficient of linear expansion) between the functional element 2 and the bus bar 3 is one of the causes of the above warping. Further research continued, and it was found that a large stress is likely to occur at the portion where the connection portion 6 and the main body portion 30 are connected (portion R in FIG. 9A).

[0014] Based on the above, the inventors presume the mechanism of warping generation in the electronic component 1 as follows. That is, when a thermal load is applied to the electronic component 1 (including the case where the functional element 2 itself generates heat due to energization), the degree of thermal expansion of the functional element 2 (indicated by the double arrow f2 in FIG. 9A) and the degree of thermal expansion of the bus bar 3 (indicated by the double arrow f3 in FIG. 9A) are different, so warping (indicated by the double arrow w2 in FIG. 9A) occurs in the functional element 2. In the electronic component 1 shown in FIGS. 9A and 9B, since the plurality of functional elements 2 are arranged in the longitudinal direction D1, the warping generated in each of the plurality of functional elements 2 accumulates, and as a whole for the electronic component 1, as shown by the double arrow w1 in FIG. 9A, it will warp in an arch shape. Note that δ1 in FIG. 9B indicates the amount of deformation of the warping generated in the electronic component 1.

[0015] Based on the above presumed mechanism, the inventors continued their intensive research and as a result, developed an electronic component 1 capable of suppressing warping.

[0016] That is, in the electronic component 1 according to the present embodiment, the bus bar 3 includes a connection conductor 33 (see FIGS. 1 and 11). The connection conductor 33 is integrally formed with the main body portion 30. Further, the connection conductor 33 has a linear portion 4, a connecting portion 5, and two connection portions 6. The linear portion 4 is parallel to the longitudinal direction D1. The connecting portion 5 connects the intermediate portion 40 of the linear portion 4 and the main body portion 30. The two connection portions 6 are provided at both ends of the linear portion 4. The two connection portions 6 are connected to the electrode 21 by a conductive member 60 (see FIG. 2).

[0017] The electronic component 1 shown in FIGS. 9A and 9B and the electronic component 1 according to the present embodiment are common in that two connection portions 6 are electrically and mechanically connected to one functional element 2. In this way, by electrically and mechanically connecting two connection portions 6 instead of one connection portion 6 to one functional element 2, any of the above electronic components 1 can pass a high current and ensure the required current capacity.

[0018] On the other hand, the electronic component 1 shown in FIGS. 9A and 9B and the electronic component 1 according to the present embodiment differ in the following points. That is, in the electronic component 1 shown in FIGS. 9A and 9B, two connection portions 6 are directly connected (connected at two locations) to the main body portion 30, whereas in the electronic component 1 according to the present embodiment, the two connection portions 6 are connected to the main body portion 30 via the connecting portion 5. That is, a linear portion provided with two connection portions 6 at both ends is connected (connected at one location) via one connecting portion 5. In this way, in the present embodiment, since one-point connection is adopted, even if stress is generated, it is easy to relieve the stress.

[0019] Therefore, according to the electronic component 1 according to the present embodiment, warping can be suppressed.

[0020] 2. Details (1) First Embodiment Hereinafter, the electronic component 1 according to the first embodiment will be described with reference to FIGS. 1 to 9B. Each figure is a schematic diagram, and the respective ratios of the sizes and thicknesses of the respective components in each figure do not necessarily reflect the actual dimensional ratios.

[0021] The arrows indicating the respective directions in each figure are not intended to define the direction during the use of the electronic component 1, but are merely shown for easier understanding of the description and have no physical entity. The first direction D1, the second direction D2, and the third direction D3 are mutually orthogonal. The first direction D1 is the longitudinal direction of the main body 30 of the bus bar 3 and may be referred to as the "left-right direction". One side of the first direction D1 means "left", and the other side means "right". The second direction D2 is the thickness direction (minor axis direction) of the functional element 2 and may be referred to as the "up-down direction". One side of the second direction D2 means "up", and the other side means "down". The third direction D3 is the direction connecting the two electrodes 21 of the functional element 2 and may be referred to as the "front-back direction". One side of the third direction D3 means "front", and the other side means "back". Viewing along the first direction D1 is called a side view. Viewing along the second direction D2 is called a plan view. Viewing along the third direction D3 is called a front view. The same applies to embodiments other than the first embodiment.

[0022] Figures 1 to 4 show the electronic component 1 according to the present embodiment. The electronic component 1 includes a plurality (four in the present embodiment) of functional elements 2 and a plurality (two in the present embodiment) of bus bars 3. As shown in FIGS. 3 and 4, the four functional elements 2 are arranged in the left-right direction, and the two bus bars 3 are arranged in the front-back direction.

[0023] <Functional element> The functional element 2 is not particularly limited, and examples thereof include passive elements and active elements. In the present embodiment, the functional element 2 is a film capacitor element 27.

[0024] As shown in FIG. 5, the functional element 2 has an element body 20 and two electrodes 21.

[0025] ≪Element body≫ The element body 20 has a shape of a rounded rectangle in a front view and extends in the front-rear direction. The element body 20 has two end faces 22 and an outer peripheral face 23. The two end faces 22 are the first end face 221 and the second end face 222. The first end face 221 is the face facing forward, and the second end face 222 is the face facing backward. The outer peripheral face 23 connects the first end face 221 and the second end face 222. Specifically, the outer peripheral face 23 connects the outer peripheral edge of the first end face 221 and the outer peripheral edge of the second end face 222.

[0026] The element body 20 is formed by winding two metallized films 24. Specifically, the two metallized films 24 are wound around an axis parallel to the front-rear direction to form a cylindrical shape, and then pressed in the up-down direction to be flattened, thereby obtaining the element body 20. As a result, the element body 20 has a major axis parallel to the left-right direction and a minor axis parallel to the up-down direction. The two metallized films 24 are the first metallized film 241 and the second metallized film 242.

[0027] The metallized film 24 has a dielectric film 25 and a metal layer 26.

[0028] The dielectric film 25 has a predetermined thickness and is in a long strip shape having a predetermined width in the front-rear direction. The thickness of the dielectric film 25 is not particularly limited, but for example, it is 1 μm or more and 10 μm or less. The material of the dielectric film 25 is not particularly limited, but for example, polypropylene (PP), polyethylene terephthalate (PET), etc. may be mentioned. The dielectric film 25 of the first metallized film 241 is the first dielectric film 251, and the dielectric film 25 of the second metallized film 242 is the second dielectric film 252.

[0029] The metal layer 26 is provided on the dielectric film 25. Specifically, the metal layer 26 is formed on one side of the dielectric film 25 by vapor deposition or the like. The material of the metal layer 26 is not particularly limited, and examples thereof include aluminum (Al), magnesium (Mg), and alloys thereof. The thickness of the metal layer 26 is not particularly limited, and for example, it is 5 nm or more and 100 nm or less. Note that the metal layer 26 of the first metallization film 241 is the first metal layer 261, and the metal layer 26 of the second metallization film 242 is the second metal layer 262. Inside the element body 20, the first metal layer 261 and the second metal layer 262 face each other with the dielectric film 25 interposed therebetween.

[0030] ≪Electrode≫ The two electrodes 21 are formed on the two end faces 22 of the element body 20 by metal spraying or the like. Specifically, the two electrodes 21 are the first electrode 211 and the second electrode 212. The first electrode 211 is formed on the first end face 221 of the element body 20, and the second electrode 212 is formed on the second end face 222 of the element body 20. The material of the electrode 21 is not particularly limited, and examples thereof include zinc (Zn), tin (Sn), and alloys thereof. The thickness of the electrode 21 is not particularly limited, and for example, it is 0.5 mm or more and 1.5 mm or less.

[0031] The electrode 21 is electrically connected to the metal layer 26 inside the element body 20. Specifically, since the front edge of the first metal layer 261 is exposed at the first end face 221 of the element body 20, the first electrode 211 is connected to the first metal layer 261. Note that the rear edge of the first metal layer 261 is not exposed at the second end face 222 of the element body 20, so the first metal layer 261 is not connected to the second electrode 212. On the other hand, since the rear edge of the second metal layer 262 is exposed at the second end face 222 of the element body 20, the second electrode 212 is connected to the second metal layer 262. Note that the front edge of the second metal layer 262 is not exposed at the first end face 221 of the element body 20, so the second metal layer 262 is not connected to the first electrode 211.

[0032] ≪Coefficient of linear expansion≫ The linear expansion coefficient of the functional element 2 is preferably 4.2×10 -5 / K or more and 1.7×10 -4 / K or less. In particular, the linear expansion coefficient in the left - right direction is preferably within the above numerical range. Also, the linear expansion coefficient in the temperature range from normal temperature (for example, 25°C) to 100°C is preferably within the above numerical range. The linear expansion coefficient of the functional element 2 can be measured, for example, by the compression - expansion method of thermomechanical analysis (TMA).

[0033] <Bus bar> The bus bar 3 is a conductive member interposed between the functional element 2 and an external device (not shown) and used to electrically connect the functional element 2 and the external device. The bus bar 3 is formed by cutting out a metal plate into a predetermined shape and appropriately bending it. The metal plate is not particularly limited, and examples include a copper plate and an aluminum plate.

[0034] In this embodiment, the two bus bars 3 are the first bus bar 31 and the second bus bar 32. When simply referred to as the bus bar 3 below, each of the first bus bar 31 and the second bus bar 32 is meant.

[0035] In the electronic component 1, the bus bar 3 is electrically and mechanically connected to the electrode 21. The bus bar 3 includes a main body portion 30, a plurality (four in this embodiment) of connection conductors 33, and an external connection terminal 34.

[0036] <<Main body portion>> The main body portion 30 has a longitudinal direction D1. That is, the main body portion 30 is a portion extending in the left - right direction. The main body portion 30 may be either in contact or non - contact with the electrode 21, but is not directly fixed to the electrode 21.

[0037] <<Connection conductor>> The connection conductor 33 is integrally formed with the main body portion 30. In this embodiment, the connection conductor 33 is formed on the lower side of the main body portion 30. In this embodiment, the connection conductor 33 forms an inverted Y - shape in a front view.

[0038] As shown in FIGS. 3 and 4, a plurality (four in this embodiment) of connection conductors 33 are connected one-to-one with a plurality (four in this embodiment) of functional elements 2. In this way, one bus bar 3 is connected with a plurality of functional elements 2.

[0039] One connection conductor 33 has one linear portion 4, one connecting portion 5, and two connection portions 6.

[0040] 〔Linear portion〕 The linear portion 4 is parallel to the longitudinal direction D1. That is, the linear portion 4 has a predetermined width in the vertical direction and extends in the left-right direction. The length of the linear portion 4 in the left-right direction is shorter than the length of the functional element 2 in the left-right direction (major diameter in this embodiment). Note that the linear portion 4 may be either in contact with or non-contact with the electrode 21, but it is not directly fixed to the electrode 21.

[0041] 〔Connecting portion〕 The connecting portion 5 connects the intermediate portion 40 of the linear portion 4 and the main body portion 30. The intermediate portion 40 is preferably the central portion in the left-right direction of the linear portion 4, but may be shifted to the left or right from the above central portion within a range that does not impair the effects of this embodiment.

[0042] In this way, the connecting portion 5 is interposed between the intermediate portion 40 of the linear portion 4 and the main body portion 30 in the vertical direction. The connecting portion 5 has a predetermined width in the left-right direction. The width of the connecting portion 5 is shorter than the length of the linear portion 4 in the left-right direction. More specifically, the width of the connecting portion 5 is thick enough to ensure the required current capacity and thin enough to contribute to stress relaxation by thermal deformation. Note that the connecting portion 5 may be either in contact with or non-contact with the electrode 21, but it is not directly fixed to the electrode 21.

[0043] 〔Connection portion〕 In this embodiment, the two connection portions 6 are the first connection portion 61 and the second connection portion 62. When simply referred to as the connection portion 6 below, each of the first connection portion 61 and the second connection portion 62 is meant.

[0044] The two connecting parts 6 are provided at both ends of the linear part 4. Specifically, the first connecting part 61 is provided at the left end of the linear part 4, and the second connecting part 62 is provided at the right end of the linear part 4.

[0045] In the present embodiment, the two connecting parts 6 protrude from both ends of the linear part 4 to the side opposite to the main body part 30 along a direction D2 (the vertical direction in the present embodiment) orthogonal to the longitudinal direction D1. Specifically, the first connecting part 61 protrudes downward from the left end of the linear part 4, and the second connecting part 62 protrudes downward from the right end of the linear part 4. Thus, the two connecting parts 6 are parallel along the vertical direction.

[0046] As shown in FIG. 2, the two connecting parts 6 are connected to the electrode 21 by a conductive member 60. Specifically, the connecting part 6 is overlapped on the electrode 21, and the conductive member 60 is supplied from above, and the electrode 21 and the connecting part 6 are connected by this conductive member 60. The conductive member 60 is not particularly limited, and examples thereof include solder.

[0047] In the above manner, the bus bar 3 is electrically and mechanically connected to the electrode 21.

[0048] ≪External connection terminal≫ The external connection terminal 34 is a terminal used to connect the electronic component 1 to an external device (not shown). The external connection terminal 34 is integrally formed with the main body part 30. In the present embodiment, the external connection terminal 34 protrudes forward in both the first bus bar 31 and the second bus bar 32. However, an insulating plate 93 is interposed between the external connection terminal 34 of the first bus bar 31 and the external connection terminal 34 of the second bus bar 32, and the two external connection terminals 34 are electrically insulated from each other.

[0049] ≪Coefficient of linear expansion≫ The coefficient of linear expansion of the bus bar 3 is preferably 8.5×10 -6 / K or more and 3.4×10 -5It is below / K. In particular, the linear expansion coefficient in the left - right direction is preferably within the above - mentioned numerical range. Also, the linear expansion coefficient in the temperature range from room temperature (for example, 25°C) to 100°C is preferably within the above - mentioned numerical range. Incidentally, the linear expansion coefficient of the bus bar 3 can be measured, for example, by the compression - expansion method of a thermomechanical analysis method (TMA).

[0050] <Function and effect> As shown in FIG. 1, in the electronic component 1 according to the present embodiment, the connection conductor 33 having an inverted Y - shape in a front view is connected (connected at one point) to the main body portion 30 via one connecting portion 5. Thus, in this embodiment, since the one - point connection is adopted, even if stress is generated at the portion where the connecting portion 5 and the main body portion 30 are connected, it is easy to relieve the stress. Also, the influence of expansion and contraction due to the temperature change of the functional element 2 is less likely to be transmitted to the bus bar 3. Therefore, stress is less likely to be generated in the first place at the portion where the connecting portion 5 and the main body portion 30 are connected.

[0051] Instead of one connection portion 6, two connection portions 6 are connected to the main body portion 30 via the linear portion 4 and the connecting portion 5. Therefore, a high current can flow, and the required current capacity can be ensured.

[0052] For the above reasons, according to the present embodiment, the warpage of the electronic component 1 can be reduced. Thereby, the connection reliability between the functional element 2 and the bus bar 3 and the dimensional accuracy of the electronic component 1 can also be improved.

[0053] Also, in the electronic component 1 according to the present embodiment, as described above, since the connection conductor 33 has an inverted Y - shape in a front view, when a thermal load is applied to the electronic component 1, as shown by the imaginary line (two - dot chain line) in FIG. 8, the linear portion 4 of the connection conductor 33 is likely to bend into a U - shape in a front view. Thereby, the stress generated in the connecting portion 5 and the like can also be reduced.

[0054] In the electronic component 1 according to the present embodiment, the functional element 2 is a film capacitor element 27. The film capacitor element 27 uses a plastic film as a dielectric and has a large expansion and contraction due to heat. However, in the electronic component 1 according to the present embodiment, since the bus bar 3 in which the inverted Y-shaped connection conductor 33 is connected to the main body 30 via the connecting portion 5 is adopted, even when the functional element 2 is a film capacitor element 27, it has a high utility value. When the functional element 2 is a film capacitor element 27, the electronic component 1 according to the present embodiment is used, for example, as a component of an inverter of a hybrid vehicle (HEV).

[0055] In the electronic component 1 according to the present embodiment, the linear expansion coefficient of the functional element 2 is preferably 4.2×10 -5 / K or more and 1.7×10 -4 / K or less. Thereby, the warpage of the electronic component 1 can be further suppressed (for details, refer to the section of "Examples").

[0056] In the electronic component 1 according to the present embodiment, the linear expansion coefficient of the bus bar 3 is preferably 8.5×10 -6 / K or more and 3.4×10 -5 / K or less. Thereby, the warpage of the electronic component 1 can be further suppressed (for details, refer to the section of "Examples").

[0057] The electronic component 1 according to the present embodiment includes a plurality of functional elements 2, but even when only one functional element 2 is provided, warpage can be suppressed.

[0058] <Modification Example> Next, the electronic component 1 according to the modification example of the first embodiment will be described with reference to FIGS. 6A to 7B. In this modification example, the same components as those in the first embodiment may be denoted by the same reference numerals as those in the first embodiment, and detailed description thereof may be omitted.

[0059] This modified example differs from the first embodiment in that the electronic component 1 further includes a sealing body 9. Also, in this modified example, although the bus bar 3 includes a connection conductor 33 similar to that of the first embodiment (see FIGS. 7A and 7B), it differs from the first embodiment in that the external connection terminal 34 is formed to protrude upward.

[0060] The sealing body 9 includes a case 90 and a filling resin 91.

[0061] The case 90 is open upward. Inside the case 90, a plurality (four in this modified example) of functional elements 2 and a plurality (two in this modified example) of bus bars 3 shown in FIGS. 7A and 7B are accommodated.

[0062] The case 90 has a mounting portion 92. The mounting portion 92 is a portion used to attach the case 90 to an external device. In this modified example, the mounting portions 92 are formed on both the left and right sides of the case 90.

[0063] The filling resin 91 is a resin filled inside the case 90. The filling resin 91 is not particularly limited, and examples thereof include thermosetting resins such as epoxy resins.

[0064] In this way, the sealing body 9 seals at least a part of the bus bar 3 (the part excluding the external connection terminal 34 in this modified example) and the functional element 2. The external connection terminal 34 is exposed to the outside.

[0065] <Operating effects of the modified example> In this modified example, when at least a part of the bus bar 3 and the functional element 2 are sealed with the sealing body 9, a thermal load may be applied to the bus bar 3 and the functional element 2. However, also in this modified example, since the bus bar 3 in which the connection conductor 33 having an inverted Y shape is connected to the main body portion 30 via the connecting portion 5 is adopted, for example, warping can be suppressed until the filling resin 91 cures through the gel state from the liquid state. Moreover, since the functional element 2 and the bus bar 3 can be sealed in a state where warping is suppressed, residual stress and strain can be reduced.

[0066] (2) Second Embodiment Next, the electronic component 1 according to the second embodiment will be described with reference to FIGS. 11 to 13B. In the second embodiment, the same components as those in the first embodiment may be denoted by the same reference numerals as in the first embodiment, and detailed descriptions thereof may be omitted.

[0067] In the second embodiment, the shape of the connection conductor 33 is different from the shape of the connection conductor 33 in the first embodiment.

[0068] ≪Connection Conductor≫ In the present embodiment, the connection conductor 33 has an inverted T shape when viewed from the front. That is, the two connection portions 6 project in opposite directions from both ends of the linear portion 4 along the longitudinal direction D1 (left - right direction). Specifically, the first connection portion 61 projects leftward from the left - hand end of the linear portion 4, and the second connection portion 62 projects rightward from the right - hand end of the linear portion 4. In this way, the two connection portions 6 exist on the same straight line parallel to the left - right direction.

[0069] Furthermore, in the present embodiment, an elastic portion 7 is formed between the two connection portions 6 and the intermediate portion 40 of the linear portion 4. Specifically, an elastic portion 7 (first elastic portion 71) is formed between the first connection portion 61 and the intermediate portion 40 of the linear portion 4, and an elastic portion 7 (second elastic portion 72) is formed between the second connection portion 62 and the intermediate portion 40 of the linear portion 4.

[0070] As shown in FIG. 12, in the present embodiment, the elastic portion 7 is a corrugated spring portion 73 that expands and contracts in the longitudinal direction D1 (left - right direction). The corrugated spring portion 73 has a plurality of peak portions 731 and a plurality of valley portions 732. The peak portions 731 project in a direction away from the electrode 21, and the valley portions 732 are recessed in a direction approaching the electrode 21. The peak portions 731 and the valley portions 732 extend in the up - down direction. The peak portions 731 and the valley portions 732 are arranged alternately along the left - right direction. In this way, the corrugated spring portion 73 forms a wave shape (pleated shape or bellows shape) by the plurality of peak portions 731 and the plurality of valley portions 732.

[0071] Here, the height H of the peak portion 731 is preferably 1.5 mm or more and 2.5 mm or less.

[0072] Also, the distance P between two adjacent peak portions 731 in the left - right direction is preferably 1.5 mm or more and 2.0 mm or less.

[0073] Also, the width W7 of the elastic portion 7 is preferably 3.5 mm or more and 4.5 mm or less.

[0074] Also, the width W6 of the connecting portion 6 is preferably 1.5 mm or more and 2.5 mm or less.

[0075] Note that the shape of the bus bar 3 of the second embodiment shown in FIGS. 13A and 13B is the same as the shape of the bus bar 3 of the modified example of the first embodiment shown in FIGS. 7A and 7B, except for the connecting conductor 33.

[0076] <Function and Effect> The second embodiment also exhibits the same function and effect as the first embodiment.

[0077] In the second embodiment, since the elastic portion 7 is formed between the two connecting portions 6 and the intermediate portion 40 of the linear portion 4, when a thermal load is applied to the electronic component 1, the elastic portion 7 elastically deforms, thereby reducing the stress generated in the connecting portion 5 and the like. Therefore, warping can be further suppressed.

[0078] Furthermore, in the second embodiment, since the elastic portion 7 is a corrugated spring portion 73, when a thermal load is applied to the electronic component 1, the corrugated spring portion 73 expands and contracts in the longitudinal direction D1, thereby reducing the stress generated in the connecting portion 5 and the like. Therefore, warping can be further suppressed.

[0079] 3. Other Modification Examples In the first and second embodiments, the number of functional elements 2 provided in the electronic component 1 is plural, but the number of functional elements 2 provided in the electronic component 1 may be one.

[0080] In the first and second embodiments, the functional element 2 is a film capacitor element 27, but it is not limited thereto. The functional element 2 may be, for example, a power choke coil or the like.

[0081] In the first and second embodiments, the film capacitor element 27 is of a wound type, but it may also be of a stacked type. In the case of the stacked type, a plurality of metallized films 24 are stacked in one direction (for example, the vertical direction).

[0082] In the first and second embodiments, the number of connection conductors 33 included in the bus bar 3 is plural, but the number of connection conductors 33 included in the bus bar 3 may be one.

[0083] 4. Aspect As is apparent from the above embodiments and modification examples, the present disclosure includes the following aspects. Hereinafter, for the sole purpose of clarifying the correspondence with the embodiments, reference numerals are attached in parentheses.

[0084] A first aspect is an electronic component (1), comprising: a functional element (2) having an electrode (21); and a bus bar (3) electrically and mechanically connected to the electrode (21). The bus bar (3) includes a main body portion (30) having a longitudinal direction (D1), and a connection conductor (33) integrally formed with the main body portion (30). The connection conductor (33) has a linear portion (4) parallel to the longitudinal direction (D1), a connection portion (5) connecting an intermediate portion (40) of the linear portion (4) and the main body portion (30), and two connection portions (6) provided at both ends of the linear portion (4) and connected to the electrode (21) by a conductive member (60).

[0085] According to this aspect, warping can be suppressed.

[0086] A second aspect is the electronic component (1) based on the first aspect. In the second aspect, the two connection portions (6) protrude from both ends of the linear portion (4) to the side opposite to the main body portion (30) along a direction (D2) orthogonal to the longitudinal direction (D1).

[0087] According to this aspect, warping can be further suppressed.

[0088] The third aspect is the electronic component (1) based on the first aspect. In the third aspect, the two connection parts (6) protrude from both ends of the linear part (4) in opposite directions along the longitudinal direction (D1). An elastic part (7) is formed between the two connection parts (6) and the middle part (40) of the linear part (4).

[0089] According to this aspect, warping can be further suppressed.

[0090] The fourth aspect is the electronic component (1) based on the third aspect. In the fourth aspect, the elastic part (7) is a corrugated spring part (73) that expands and contracts in the longitudinal direction (D1).

[0091] According to this aspect, warping can be further suppressed.

[0092] The fifth aspect is the electronic component (1) based on any one of the first to fourth aspects. In the fifth aspect, it further includes a sealing body (9) that seals at least a part of the bus bar (3) and the functional element (2).

[0093] According to this aspect, warping can be further suppressed.

[0094] The sixth aspect is the electronic component (1) based on any one of the first to fifth aspects. In the sixth aspect, the functional element (2) is a film capacitor element (27) formed by winding or laminating a metallized film (24). The metallized film (24) has a dielectric film (25) and a metal layer (26) provided on the dielectric film (25) and electrically connected to the electrode (21).

[0095] According to this aspect, warping can be further suppressed.

[0096] The seventh aspect is the electronic component (1) based on any one of the first to sixth aspects. In the seventh aspect, the linear expansion coefficient of the functional element (2) is 4.2×10 -5 / K or more and 1.7×10 -4It is below / K.

[0097] According to this aspect, warpage can be further suppressed.

[0098] The eighth aspect is the electronic component (1) based on any one of the first to seventh aspects. In the eighth aspect, the linear expansion coefficient of the bus bar (3) is 8.5×10 -6 / K or more and 3.4×10 -5 / K or less.

[0099] According to this aspect, warpage can be further suppressed.

[0100] The ninth aspect is the electronic component (1) based on any one of the first to eighth aspects. In the ninth aspect, a plurality of the functional elements (2) are provided. The bus bar (3) includes a plurality of the connection conductors (33). The plurality of functional elements (2) and the plurality of connection conductors (33) are connected one-to-one.

[0101] According to this aspect, warpage can be further suppressed.

Example

[0102] Hereinafter, the present disclosure will be specifically described by way of examples. However, the present disclosure is not limited to the following examples.

[0103] <Example 1 (e1)> Six analysis models of the electronic component 1 shown in FIG. 3 were created. These six types are e1(a), e1(b), e1(c), e1(d), e1(e), and e1(f) (see Tables 1 and 2), and these have different combinations of the linear expansion coefficient of the functional element 2 and the linear expansion coefficient of the bus bar 3. An example of the size of the electronic component 1 is that the overall length (longitudinal direction) is 60 mm, the overall width (depth direction = electrode direction) is 40 mm, and the overall height (lateral direction) is 30 mm.

[0104] That is, as shown in Table 1, the three types of e1(a), e1(b), and e1(c) have a constant linear expansion coefficient of the bus bar 3 and different linear expansion coefficients of the functional element 2.

[0105] On the other hand, as shown in Table 2, the three types of e1(d), e1(e), and e1(f) are those in which the linear expansion coefficient of the functional element 2 is made constant and the linear expansion coefficient of the bus bar 3 is changed.

[0106] <Comparative Example 1 (c1)> Six types of analysis models of the electronic component 1 shown in FIG. 9B were created. Note that the electronic component 1 of Comparative Example 1 is the same as the electronic component 1 of Example 1, except that two connection portions 6 protrude directly downward from the main body portion 30 of the bus bar 3 instead of the connection conductor 33 of the electronic component 1 of Example 1.

[0107] The above six types are c1(a), c1(b), c1(c), c1(d), c1(e), and c1(f) (see Tables 1 and 2), and these have different combinations of the linear expansion coefficient of the functional element 2 and the linear expansion coefficient of the bus bar 3.

[0108] That is, as shown in Table 1, the three types of c1(a), c1(b), and c1(c) are those in which the linear expansion coefficient of the bus bar 3 is made constant and the linear expansion coefficient of the functional element 2 is changed.

[0109] On the other hand, as shown in Table 2, the three types of c1(d), c1(e), and c1(f) are those in which the linear expansion coefficient of the functional element 2 is made constant and the linear expansion coefficient of the bus bar 3 is changed.

[0110] <Evaluation> Using the analysis models of the electronic component 1 of Example 1 (e1(a), e1(b), and e1(c)) and Comparative Example 1 (c1(a), c1(b), and c1(c)), CAE (Computer Aided Engineering) analysis was performed to measure the warpage deformation amount of each electronic component 1. Under the conditions of the CAE analysis, the ambient temperature was raised from 25°C to 85°C. The results are shown in Table 1. FIG. 10A is a graph of Table 1.

[0111]

Table 1

[0112] Here, the warpage deformation amount means the deformation amount (δ1) of the warp of the electronic component 1 with respect to the arrangement direction (first direction D1) of the plurality of functional elements 2, as shown in FIG. 9B.

[0113] The warpage improvement rate (%) was calculated by the following formula (1).

[0114]

Equation

[0115] From Table 1 and FIG. 10A, it can be seen that the warp deformation amount of Example 1 is smaller than that of Comparative Example 1. Also, it can be seen that the smaller the linear expansion coefficient of the functional element 2, the smaller the warp deformation amount. Further, it can be seen that as the linear expansion coefficient of the functional element 2 increases, it approaches the linear expansion coefficient of the bus bar 3, so the warpage improvement rate increases.

[0116] On the other hand, using the analysis models of the electronic component 1 of Example 1 (e1(d), e1(e), and e1(f)) and Comparative Example 1 (c1(d), c1(e), and c1(f)), CAE analysis was performed under the same conditions as above to measure the warp deformation amount of each electronic component 1. The results are shown in Table 2. FIG. 10B is a graph of Table 2.

[0117]

Table 2

[0118] From Table 2 and FIG. 10B, it can be seen that the warp deformation amount of Example 1 is smaller than that of Comparative Example 1. Also, it can be seen that the smaller the linear expansion coefficient of the bus bar 3, the closer it approaches the linear expansion coefficient of the functional element 2, so the warpage improvement rate increases.

[0119] <Example 2 (e2)> Six types of analysis models of the electronic component 1 shown in FIG. 11 were created. Note that the electronic component 1 of Example 2 is the same as the electronic component 1 of Example 1 except for the shape of the connection conductor 33.

[0120] The above six types are e2(a), e2(b), e2(c), e2(d), e2(e), and e2(f) (see Tables 3 and 4), and these have different combinations of the linear expansion coefficient of the functional element 2 and the linear expansion coefficient of the bus bar 3.

[0121] That is, as shown in Table 3, the three types of e2(a), e2(b), and e2(c) are those in which the linear expansion coefficient of the bus bar 3 is fixed and the linear expansion coefficient of the functional element 2 is changed.

[0122] On the other hand, as shown in Table 4, the three types of e2(d), e2(e), and e2(f) are those in which the linear expansion coefficient of the functional element 2 is fixed and the linear expansion coefficient of the bus bar 3 is changed.

[0123] <Comparative Example 2 (c2)> Six types of analysis models of the electronic component 1 similar to Comparative Example 1 were created. These six types are c2(a), c2(b), c2(c), c2(d), c2(e), and c2(f) (see Tables 3 and 4), and these have different combinations of the linear expansion coefficient of the functional element 2 and the linear expansion coefficient of the bus bar 3.

[0124] That is, as shown in Table 3, the three types of c2(a), c2(b), and c2(c) are those in which the linear expansion coefficient of the bus bar 3 is fixed and the linear expansion coefficient of the functional element 2 is changed.

[0125] On the other hand, as shown in Table 4, the three types of c2(d), c2(e), and c2(f) are those in which the linear expansion coefficient of the functional element 2 is fixed and the linear expansion coefficient of the bus bar 3 is changed.

[0126] <Evaluation> Using the analysis models of the electronic component 1 of Example 2 (e2(a), e2(b), and e2(c)) and Comparative Example 2 (c2(a), c2(b), and c2(c)), CAE analysis was performed under the same conditions as above, and the warpage deformation amount of each electronic component 1 was measured. The results are shown in Table 3. Figure 14A is a graph of Table 3. Note that the warpage deformation amount and the warpage improvement rate (%) are as described above.

[0127]

Table 3

[0128] It can be seen from Table 3 and FIG. 14A that the amount of warpage deformation of Example 2 is smaller than that of Comparative Example 2.

[0129] On the other hand, using the analysis models of the electronic component 1 of Example 2 (e2(d), e2(e) and e2(f)) and Comparative Example 2 (c2(d), c2(e) and c2(f)), CAE analysis was performed under the same conditions as above to measure the amount of warpage deformation of each electronic component 1. The results are shown in Table 4. FIG. 14B is a graph of Table 4.

[0130]

Table 4

[0131] It can be seen from Table 4 and FIG. 14B that the amount of warpage deformation of Example 2 is smaller than that of Comparative Example 2.

Explanation of Signs

[0132] 1 Electronic component 2 Functional element 21 Electrode 24 Metallized film 25 Dielectric film 26 Metal layer 3 Bus bar 30 Body part 33 Connection conductor 4 Linear part 40 Intermediate part 5 Connecting part 6 Connecting portion 60 Conductive member 7 Elastic part 73 Wavy spring part 9 Sealing body D1 First direction (longitudinal direction, left - right direction) D2 Second direction (a direction perpendicular to the longitudinal direction, up - down direction)

Claims

1. A functional element having an electrode, and a bus bar electrically and mechanically connected to the electrode, The bus bar includes a main body portion having a longitudinal direction, and a connection conductor integrally formed with the main body portion, The connection conductor has a linear portion parallel to the longitudinal direction, a connection portion connecting an intermediate portion of the linear portion and the main body portion, and two connection portions provided at both ends of the linear portion and connected to the electrode by a conductive member. An electronic component.

2. The two connection portions project from both ends of the linear portion to the side opposite to the main body portion along a direction orthogonal to the longitudinal direction. The electronic component according to Claim 1.

3. The two connection portions project from both ends of the linear portion in opposite directions along the longitudinal direction, An elastic portion is formed between the two connection portions and the intermediate portion of the linear portion. The electronic component according to Claim 1.

4. The elastic portion is a corrugated spring portion that expands and contracts in the longitudinal direction. The electronic component according to Claim 3.

5. Further comprising a sealing body that seals at least a part of the bus bar and the functional element. The electronic component according to any one of Claims 1 to 4.

6. The functional element is a film capacitor element formed by winding or laminating a metallized film, The metallized film has a dielectric film and a metal layer provided on the dielectric film and electrically connected to the electrode. The electronic component according to any one of Claims 1 to 5.

7. The linear expansion coefficient of the functional element is 4.2×10 －５ / K or more and 1.7×10 －４ / K or less, The electronic component according to any one of Claims 1 to 6.

8. The linear expansion coefficient of the bus bar is 8.5×10 －６ / K or more and 3.4×10 －５ / K or less, The electronic component according to any one of Claims 1 to 7.

9. A plurality of the functional elements are provided, The bus bar includes a plurality of the connection conductors, The plurality of functional elements and the plurality of connection conductors are connected one-to-one. The electronic component according to any one of Claims 1 to 8.

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