Multilayer electronic component and mounting board

Abstract

To reduce the current circuits of a multilayer electronic component, improve high-frequency characteristics, minimize the bottleneck part of an internal electrode in the area where an internal electrode and an external electrode are in contact with each other to improve equivalent series resistance and equivalent series inductance, uniformly coat the internal electrode to reduce errors which occur in the manufacturing processes, and improve the reliability of the multilayer electronic component.SOLUTION: A multilayer electronic component 100 according to an embodiment of the present invention includes: an octahedral body 110 including a dielectric layer and an internal electrode; and an external body arranged on the body. The internal electrode includes: a first internal electrode in contact with a first angle surface C1 and a third angle surface C3; and a second internal electrode in contact with a second angle surface C2 and a fourth surface C4. The external electrode includes: a first external electrode 131 and a third external electrode 133 arranged in the first angle surface and in the third angle surface to be in contact with the first internal electrode; and a second external electrode 132 and a fourth external electrode 134 arranged in the second angle surface and in the fourth angle surface to be in contact with the second internal electrode.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a multilayer electronic component and a mounting substrate therefor.

Background Art

[0002] A multilayer ceramic capacitor (MLCC), which is one type of multilayer electronic component, is a chip-shaped capacitor that is mounted on a printed circuit board of various electronic products such as video devices like liquid crystal display (LCD) devices and plasma display panel (PDP) devices, computers, smartphones, and mobile phones, and serves to charge or discharge electricity.

[0003] Such a multilayer ceramic capacitor can be used as a component of various electronic devices due to its advantages of being small in size while ensuring high capacitance and being easy to mount. As various electronic devices such as computers and mobile devices are miniaturized and have increased output power, the requirements for miniaturization and high capacitance of multilayer ceramic capacitors are increasing.

[0004] On the other hand, an MLCC is also widely used for decoupling to remove electrical signal noise in a set due to its excellent high-frequency characteristics and low equivalent series inductance (ESL).

[0005] To solve the noise problem of high-speed integrated circuits (ICs), land side capacitors (LSCs) can be applied adjacent to the ICs. It is known that LSCs have a thin thickness and at the same time require high-frequency characteristics. To reduce the equivalent series inductance (ESL), it is important to minimize the number of magnetic flux linkages per unit current in the high-frequency region. For this purpose, various methods are used to solve this problem, such as controlling the formation and structure to minimize the current path or current loop, or arranging the internal and external electrodes so that the magnetic fields can cancel each other out.

[0006] Since LSCs are generally placed at the bottom of the IC substrate, they are required to have low ESL characteristics while having a thin thickness. At this time, the LSCs are mounted at the positions where the solder balls at the bottom of the substrate are removed, and capacitors in the form of low inductance ceramic capacitors (LICCs) are mainly used. However, the need for capacitors with a square form factor is increasing gradually.

Prior Art Documents

Patent Documents

[0007]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0008] One of the various problems to be solved by the present invention is to provide a multilayer electronic component with improved high-frequency characteristics (low ESL) by reducing the current path of the multilayer electronic component.

[0009] One of the various problems to be solved by the present invention is to minimize the bottleneck portion of the internal electrode in the region where the internal electrode and the external electrode are in contact, and improve the equivalent series resistance (ESR) and equivalent series inductance (ESL).

[0010] One of the various problems to be solved by the present invention is to uniformly apply the internal electrode, reduce the error in the manufacturing process, and improve the reliability of the multilayer electronic component.

[0011] However, the various problems to be solved by the present invention are not limited to the above-described content, and can be more easily understood in the process of describing the specific embodiments of the present invention.

Means for Solving the Problems

[0012] A multilayer electronic component according to an embodiment of the present invention includes a dielectric layer and internal electrodes alternately arranged with the dielectric layer in a first direction, a first surface and a second surface facing each other in the first direction, a third surface and a fourth surface facing each other in a second direction perpendicular to the first direction, a fifth surface and a sixth surface facing each other in a third direction perpendicular to the first direction and the second direction, a first corner surface connected to the first surface, the second surface, the third surface and the fifth surface, a second corner surface connected to the first surface, the second surface, the fourth surface and the fifth surface, a third corner surface connected to the first surface, the second surface, the fourth surface and the sixth surface and facing the first corner surface, and a fourth corner surface connected to the first surface, the second surface, the third surface and the sixth surface and facing the second corner surface, and an external electrode disposed on the main body. The internal electrode includes a first internal electrode in contact with the first corner surface and the third corner surface, and a second internal electrode in contact with the second corner surface and the fourth corner surface. The external electrode may include a first external electrode and a third external electrode respectively disposed on the first corner surface and the third corner surface and in contact with the first internal electrode, and a second external electrode and a fourth external electrode respectively disposed on the second corner surface and the fourth corner surface and in contact with the second internal electrode.

[0013] The mounting substrate for a multilayer electronic component according to another embodiment of the present invention includes a printed circuit board, a multilayer electronic component disposed on the printed circuit board, and solder balls disposed on the printed circuit board and surrounding the multilayer electronic component. The multilayer electronic component includes a dielectric layer and internal electrodes alternately arranged with the dielectric layer in a first direction. The multilayer electronic component includes a first surface and a second surface facing each other in the first direction, a third surface and a fourth surface facing each other in a second direction perpendicular to the first direction, and a fifth surface and a sixth surface facing each other in a third direction perpendicular to the first direction and the second direction. The multilayer electronic component includes a first corner surface connected to the first surface, the second surface, the third surface, and the fifth surface, a second corner surface connected to the first surface, the second surface, the fourth surface, and the fifth surface, a third corner surface connected to the first surface, the second surface, the fourth surface, and the sixth surface and facing the first corner surface, and a fourth corner surface connected to the first surface, the second surface, the third surface, and the sixth surface and facing the second corner surface. The multilayer electronic component includes a main body and external electrodes disposed on the main body. The internal electrodes include a first internal electrode in contact with the first corner surface and the third corner surface, and a second internal electrode in contact with the second corner surface and the fourth corner surface. The external electrodes can include a first external electrode and a third external electrode respectively disposed on the first corner surface and the third corner surface and in contact with the first internal electrode, and a second external electrode and a fourth external electrode respectively disposed on the second corner surface and the fourth corner surface and in contact with the second internal electrode.

Advantages of the Invention

[0014] One of the various advantages of the present invention is to reduce the current path of the multilayer electronic component and improve the high-frequency characteristics (Low ESL) of the multilayer electronic component.

[0015] One of the various advantages of the present invention is to minimize the bottleneck portion of the internal electrode in the region where the internal electrode and the external electrode are in contact, and improve the equivalent series resistance (ESR) and equivalent series inductance (ESL) of the multilayer electronic component.

[0016] One of the various advantages of the present invention is to fabricate internal electrodes of uniform size and improve the reliability of the multilayer electronic component.

[0017] However, the diverse and significant advantages and effects of the present invention are not limited to the above-described content and can be more easily understood in the process of explaining the specific embodiments of the present invention.

Brief Description of the Drawings

[0018]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Modes for Carrying Out the Invention

[0019] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into several other forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to an ordinary technician. Therefore, the shapes and sizes of elements in the drawings may be enlarged or reduced (or emphasized or simplified) for clearer explanation, and elements denoted by the same reference numerals in the drawings are the same elements.

[0020] In order to clearly describe the present invention in the drawings, parts not related to the description are omitted. The sizes and thicknesses of the illustrated components are arbitrarily shown for convenience of explanation, and thus the present invention is not necessarily limited by the illustration. Also, components having the same functions within the scope of the same concept can be described using the same reference numerals. Further, throughout the specification, when a certain part "includes" a certain component, it means that other components can be further included, rather than excluding other components, unless otherwise stated to the contrary.

[0021] In the drawings, the first direction can be defined as the stacking direction or the thickness (T) direction, the second direction as the length (L) direction, and the third direction as the width (W) direction.

[0022] Stacked electronic component FIG. 1 schematically shows a perspective view of a stacked electronic component according to an embodiment of the present invention. FIG. 2 schematically shows a separated perspective view showing the stacked structure of internal electrodes. FIG. 3(a) schematically shows a cross-sectional view including a first internal electrode, and (b) schematically shows a cross-sectional view including a second internal electrode. FIG. 4 schematically shows a plane perspective view obtained by stacking cross-sectional views including the first internal electrode and the second internal electrode. FIG. 5(a) schematically shows a design drawing of a cross-sectional view including the first internal electrode, and (b) schematically shows a design drawing of a cross-sectional view including the second internal electrode. FIG. 6 schematically shows a plan view of a mounting substrate of a stacked electronic component according to an embodiment of the present invention.

[0023] Hereinafter, with reference to FIGS. 1 to 6, a stacked electronic component and a mounting substrate for the stacked electronic component according to an embodiment of the present invention will be described in detail. However, although a multilayer ceramic capacitor will be described as an example of the stacked electronic component, the present invention can also be applied to various electronic products using a dielectric composition, such as an inductor, a piezoelectric element, a varistor, or a thermistor.

[0024] The stacked electronic component 100 according to an embodiment of the present invention includes a dielectric layer 111 and internal electrodes 121 and 122 alternately arranged with the dielectric layer 111 in a first direction, a first surface 1 and a second surface 2 facing each other in the first direction, a third surface 3 and a fourth surface 4 facing each other in a second direction perpendicular to the first direction, a fifth surface 5 and a sixth surface 6 facing each other in a third direction perpendicular to the first and second directions, a first corner surface C1 connected to the first surface 1, the second surface 2, the third surface 3 and the fifth surface 5, a second corner surface C2 connected to the first surface 1, the second surface 2, the fourth surface 4 and the fifth surface 5, a third corner surface C3 connected to the first surface 1, the second surface 2, the fourth surface 4 and the sixth surface 6 and facing the first corner surface C1, and a fourth corner surface C4 connected to the first surface 1, the second surface 2, the third surface 3 and the sixth surface 6 and facing the second corner surface C2. The stacked electronic component 100 also includes external electrodes 131 and 132 disposed on the main body 110. The internal electrodes 121 and 122 include a first internal electrode 121 in contact with the first corner surface C1 and the third corner surface C3, and a second internal electrode 122 in contact with the second corner surface C2 and the fourth corner surface C4. The external electrodes 131, 132, 133, and 134 can include a first external electrode 131 and a third external electrode 133 respectively disposed on the first corner surface C1 and the third corner surface C3 and in contact with the first internal electrode 121, and a second external electrode 132 and a fourth external electrode 134 respectively disposed on the second corner surface C2 and the fourth corner surface C4 and in contact with the second internal electrode 122.

[0025] In the main body 110, the dielectric layer 111 and the internal electrodes 121 and 122 are alternately stacked.

[0026] More specifically, the main body 110 can include a capacitance forming portion disposed inside the main body 110 and including a first internal electrode 121 and a second internal electrode 122 stacked in the first direction with the dielectric layer 111 interposed therebetween to form a capacitance.

[0027] There is no particular limitation on the specific shape of the main body 110. However, as shown in the figure, the main body 110 can be in the shape of an octahedron or a shape similar thereto. Due to the shrinkage of the ceramic particles contained in the main body 110 during the firing process, the main body 110 is not an octahedron with perfect straight lines, but can have a substantially octahedral shape.

[0028] The main body 110 includes a first surface 1 and a second surface 2 facing each other in a first direction, a third surface 3 and a fourth surface 4 facing each other in a second direction perpendicular to the first direction and connected to the first surface 1 and the second surface 2, a fifth surface 5 and a sixth surface 6 facing each other in a third direction perpendicular to the first direction and the second direction and not connected to the third surface 3 and the fourth surface 4. The main body 110 can also include a first corner surface C1 connected to the first surface 1, the second surface 2, the third surface 3 and the fifth surface 5, a second corner surface C2 connected to the first surface 1, the second surface 2, the fourth surface 4 and the fifth surface 5, a third corner surface C3 connected to the first surface 1, the second surface 2, the fourth surface 4 and the sixth surface 6 and facing the first corner surface C1, and a fourth corner surface C4 connected to the first surface 1, the second surface 2, the third surface 3 and the sixth surface 6 and facing the second corner surface C2.

[0029] That is, the first corner surface C1, the second corner surface C2, the third corner surface C3, and the fourth corner surface C4 can be spaced apart from each other.

[0030] In the present invention, the "surface" can mean all surfaces including the first surface 1, the second surface 2, the third surface 3, the fourth surface 4, the fifth surface 5, the sixth surface 6, the first corner surface C1, the second corner surface C2, the third corner surface C3, and the fourth corner surface C4. If necessary, the first surface 1, the second surface 2, the third surface 3, the fourth surface 4, the fifth surface 5, the sixth surface 6, and the first corner surface C1, the second corner surface C2, the third corner surface C3, and the fourth corner surface C4 are described separately, but an ordinary technician can understand appropriately.

[0031] Also, with reference to the cross-sections in the second direction and the third direction, the first corner surface C1, the second corner surface C2, the third corner surface C3, and the fourth corner surface C4 can be not substantially parallel to the second direction and the third direction.

[0032] In the present invention, the meaning of "not parallel" can mean that the angle formed by a certain line, plane, direction, etc. and another certain line, plane, direction, etc. is more than 0° and less than 180°. Specifically, it can mean 1° or more and 179° or less, and more specifically 5° or more and 175° or less.

[0033] For example, the meaning that the fourth corner surface C4 is not substantially parallel to the second direction and the third direction from the first corner surface C1, the second corner surface C2, and the third corner surface C3 means that, based on the cross-section of the main body 110 in the second direction and the third direction, the angle formed by the fourth corner surface C4 and the second direction and the angle formed by the fourth corner surface C4 and the third direction from the first corner surface C1, the second corner surface C2, and the third corner surface C3 are more than 0° and less than 180°. Specifically, it can mean 1° or more and 179° or less, and more specifically 5° or more and 175° or less.

[0034] The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and the boundary between adjacent dielectric layers 111 can be integrated to such an extent that it is difficult to confirm without using a Scanning Electron Microscope (SEM).

[0035] The raw material for forming the dielectric layer 111 is not limited as long as sufficient capacitance can be obtained. Generally, perovskite (ABO 3 )-based materials can be used. For example, barium titanate-based materials, lead composite perovskite-based materials, or strontium titanate-based materials can be used. The barium titanate-based material can include BaTiO 3 -based ceramic powder. As an example of ceramic particles, BaTiO 3 , BaTiO 3 in which Ca (calcium), Zr (zirconium), etc. are partially solid-solved (Ba 1-x Ca x )TiO 3 (0 < x < 1), Ba(Ti 1-y Ca y )O 3(0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O 3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O 3 (0 < y < 1), etc. can be mentioned.

[0036] Also, as raw materials for forming the dielectric layer 111, various ceramic additives, organic solvents, binders, dispersants, etc. can be added to particles such as barium titanate (BaTiO 3 ).

[0037] The thickness of the dielectric layer 111 does not particularly need to be limited.

[0038] However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component, the thickness of the dielectric layer 111 can be 1.0 μm or less, preferably 0.6 μm or less, and more preferably 0.4 μm or less.

[0039] Here, the thickness of the dielectric layer 111 can mean the thickness of the dielectric layer 111 disposed between the first internal electrode 121 and the second internal electrode 122.

[0040] On the other hand, the thickness of the dielectric layer 111 can mean the size of the dielectric layer 111 in the first direction. Also, the thickness of the dielectric layer 111 can mean the average thickness of the dielectric layer 111, and can mean the average size of the dielectric layer 111 in the first direction.

[0041] The average size of the dielectric layer 111 in the first direction can be measured by scanning the cross-sections of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, the average size of one dielectric layer 111 in the first direction can mean the average value calculated by measuring the size in the first direction at 30 equally spaced points in the second direction for one dielectric layer 111 in the scanned image. The 30 equally spaced points can be specified in the capacitance forming part. Also, when such average value measurement is extended to 10 dielectric layers 111 to measure the average value, the average size of the dielectric layer 111 in the first direction can be further generalized.

[0042] The internal electrodes 121 and 122 can be alternately laminated with the dielectric layer 111 in the first direction.

[0043] The internal electrodes 121 and 122 can include a first internal electrode 121 and a second internal electrode 122, and the first internal electrode 121 and the second internal electrode 122 can be alternately arranged so as to face each other with the dielectric layer 111 constituting the main body 110 interposed therebetween. The first internal electrode 121 and the second internal electrode 122 can be electrically separated from each other by the dielectric layer 111 arranged between them in the first direction.

[0044] Specifically, the internal electrodes 121 and 122 can include a first internal electrode 121 in contact with the first corner surface C1 and the third corner surface C3, and a second internal electrode 122 in contact with the second corner surface C2 and the fourth corner surface C4.

[0045] More specifically, the first internal electrode 121 can include a first corner surface 121c1 of the first internal electrode arranged to be in contact with the first corner surface C1 of the main body, a second corner surface 121c2 of the first internal electrode arranged to be separated from the second corner surface C2 of the main body, a third corner surface 121c3 of the first internal electrode arranged to be in contact with the third corner surface C3 of the main body, and a fourth corner surface 121c4 of the first internal electrode arranged to be separated from the fourth corner surface C4 of the main body.

[0046] And the second internal electrode 122 can include a first corner surface 122c1 of the second internal electrode arranged to be separated from the first corner surface C1 of the main body, a second corner surface 122c2 of the second internal electrode arranged to be in contact with the second corner surface C2 of the main body, a third corner surface 122c3 of the second internal electrode arranged to be separated from the third corner surface C3 of the main body, and a fourth corner surface 122c4 of the second internal electrode arranged to be in contact with the fourth corner surface C4 of the main body.

[0047] At this time, a first external electrode 131 and a third external electrode 133 are respectively arranged on the first corner surface C1 and the third corner surface C3 of the main body, and are respectively connected to the first corner surface 121c1 and the third corner surface 121c3 of the first internal electrode. A second external electrode 132 and a fourth external electrode 134 are respectively arranged on the second corner surface C2 and the fourth corner surface C4 of the main body, and can be respectively connected to the second corner surface 122c2 and the fourth corner surface 122c4 of the second internal electrode.

[0048] That is, the first internal electrode 121 is not connected to the second external electrode 132 and the fourth external electrode 134, but is connected to the first external electrode 131 and the third external electrode 133. The second internal electrode 122 is not connected to the first external electrode 131 and the third external electrode 133, but can be connected to the second external electrode 132 and the fourth external electrode 134.

[0049] In other words, the first corner surface 121c1 and the third corner surface 121c3 of the first internal electrode are respectively in contact with the first corner surface C1 and the third corner surface C3, and can be respectively exposed on the first corner surface C1 and the third corner surface C3, but can be separated from the third surface 3, the fourth surface 4, the fifth surface 5, the sixth surface 6, as well as the second corner surface C2 and the fourth corner surface C4. The second corner surface 122c2 and the fourth corner surface 122c4 of the second internal electrode are respectively in contact with the second corner surface C2 and the fourth corner surface C4, and can be respectively exposed on the second corner surface C2 and the fourth corner surface C4, but can be separated from the third surface 3, the fourth surface 4, the fifth surface 5, the sixth surface 6, as well as the first corner surface C1 and the third corner surface C3.

[0050] On one hand, when taking the cross-sections in the second direction and the third direction as a reference, and setting the lengths of the corner surfaces C1, C2, C3, C4 as BL and the lengths of the internal electrodes 121, 122 in contact with the corner surfaces C1, C2, C3, C4 as IEL, IEL < BL can be satisfied.

[0051] For example, the first corner surface 121c1 and the third corner surface 121c3 of the first internal electrode can be in contact with the first corner surface C1 and the third corner surface C3 of the main body respectively. When setting the length of the first corner surface C1 as BL and the length of the first corner surface 121c1 of the first internal electrode as IEL, it can mean that IEL < BL is satisfied. This can be similarly applied to the length of the third corner surface C3 of the main body and the length of the third corner surface 121c3 of the first internal electrode, and it is obvious that it can also be similarly applied to the case of the second internal electrode.

[0052] That is, based on the cross-sections in the second direction and the third direction, the area of the internal electrode exposed through the corner surface can be not in contact with the entire surface of the corner surface, but only in contact with a partial area of the corner surface.

[0053] By satisfying IEL < BL for the lengths BL of the respective corner surfaces C1, C2, C3, C4 and the lengths IEL of the corner surfaces 121c1, 122c2, 121c3, 122c4 of the respective internal electrodes, the area where the internal electrodes 121, 122 are in contact with the external electrodes 131, 132, 133, 134 can contain the bottleneck part to a minimum or not contain it. Thereby, the equivalent series resistance (ESR) or the equivalent series inductance (ESL) can be improved, and the path of moisture penetration from the outside becomes longer, and the moisture resistance reliability can be improved. On the other hand, in the present invention, the bottleneck part of the internal electrode can mean a shape in which the width or area of the internal electrode decreases from the central part of the internal electrode to the area in contact with the external electrode in the internal electrode structure. In other words, the meaning that the internal electrode contains the bottleneck part to a minimum or does not contain it can mean that the width or area of the internal electrode does not decrease in the area where the internal electrode is in contact with the external electrode, but is not particularly limited thereto.

[0054] Further, based on the cross-sections in the second direction and the third direction, the internal electrodes 121 and 122 can include regions substantially parallel to the surfaces 3, 4, 5, and 6 adjacent to the corner surfaces C1, C2, C3, and C4 that contact the main body 110 among the internal electrodes 121 and 122.

[0055] For example, the first internal electrode 121 can contact the first corner surface C1 and the third corner surface C3. At this time, the first internal electrode 121 is separated from the third surface 3 and the fifth surface 5 adjacent to the first corner surface C1, and can include a region substantially parallel to the third surface 3 and the fifth surface 5. The first internal electrode 121 is separated from the fourth surface 4 and the sixth surface 6 adjacent to the third corner surface C3, and can include a region substantially parallel to the fourth surface 4 and the sixth surface 6.

[0056] In one embodiment of the present invention, all of the internal angles of the internal electrodes 121 and 122 can be obtuse angles.

[0057] That is, based on the cross-sections in the second direction and the third direction, the internal angles formed by the corners of the internal electrodes 121 and 122 where the corners of the internal electrodes 121 and 122 are in contact can be greater than 90° and less than 180°.

[0058] Since all of the internal angles of the internal electrodes 121 and 122 correspond to obtuse angles, the region where the internal electrodes 121 and 122 contact the external electrodes 131, 132, 133, and 134 can minimally include or not include a bottleneck portion. As a result, the current path can be improved, and the equivalent series resistance (ESR) or the equivalent series inductance (ESL) can be improved. Further, since all of the internal angles of the internal electrodes 121 and 122 correspond to obtuse angles, the diffusion of bleeding that may occur when printing the corner region during the application of the internal electrode paste can be easily controlled, and an internal electrode with a certain size and shape can be applied. Therefore, it is easy to control to minimize the difference in the internal electrode shape.

[0059] Also, all of the internal angles of the region where the first internal electrode 121 and the second internal electrode 122 overlap can be obtuse angles.

[0060] In other words, all the internal angles of the capacitance forming region where the first internal electrode 121 and the second internal electrode 122 overlap in the first direction to form a capacitance can correspond to obtuse angles. Thus, while minimizing the bottleneck portion shape of the internal electrode, it is possible to maximize the area for forming the capacitance, facilitating the design of the maximum capacitance within the same area.

[0061] The main body 110 can be formed by alternately laminating a first ceramic green sheet printed with a first internal electrode pattern and a second ceramic green sheet printed with a second internal electrode pattern, and then firing them. Here, the first internal electrode pattern and the second internal electrode pattern can be formed by applying an internal electrode paste, and can become the first internal electrode 121 and the second internal electrode 122 after firing.

[0062] At this time, by removing a part of the ceramic green sheet and the first internal electrode pattern and the second internal electrode pattern, an octagonal dielectric layer and internal electrodes can be fabricated, and further an octahedral main body can be fabricated.

[0063] Fig. 5(a) schematically shows a design drawing of a cross-sectional view including the first internal electrode, and (b) schematically shows a design drawing of a cross-sectional view including the second internal electrode.

[0064] Taking Figs. 5(a) and (b) for designing the dielectric layer and the internal electrodes as an example, first, based on Fig. 5(a), a square can be set as one pattern in the first ceramic green sheet. When the size of one side of the square first ceramic green sheet is A1, an octahedral first ceramic green sheet can be fabricated by removing the line (thick dotted line) connecting points separated by A1a from the vertices among the corner regions of the square first ceramic green sheet.

[0065] At this time, the distance from the second vertex and the fourth vertex adjacent to the third vertex to the point in the angular region adjacent to the third vertex can correspond to A1b, and the total magnitude of A1a and A1b can correspond to A. At this time, it is preferable to fabricate the magnitude of A1a to be 1 / 3×A.

[0066] On the other hand, before removing the corner regions of the first ceramic green sheet, among the four corner regions (0.5×A1a×A1a) to be removed, for two mutually facing corner regions, for example, the two corner regions including the first vertex and the third vertex, the paste for the first internal electrode can be applied closer to the first vertex and the third vertex of the first ceramic green sheet, and for the remaining two corner regions, for example, the two corner regions including the second vertex and the fourth vertex, the paste for the first internal electrode can be applied farther from the second vertex and the fourth vertex of the first ceramic green sheet.

[0067] That is, based on Fig. 5(a), the paste for the first internal electrode can be applied closer to the first vertex and the third vertex of the first ceramic green sheet and farther from the second vertex and the fourth vertex of the first ceramic green sheet.

[0068] By applying the paste for the first internal electrode in this way, when the corner regions of the first ceramic green sheet are removed, the first internal electrode is exposed through the first corner surface and the third corner surface of the main body, and is not exposed on the second corner surface and the fourth corner surface of the main body and can be separated.

[0069] When applying the paste for the first internal electrode, it is also preferable to apply it so that all the internal angles of the first internal electrode pattern are obtuse angles. By applying it so that all the internal angles of the first internal electrode pattern are obtuse angles, the bottleneck portion shape of the first internal electrode can be minimized, and it can be fabricated into the above-described preferable shape of the first internal electrode.

[0070] For example, in the first internal electrode pattern, a square can be set as one virtual pattern. Similar to the first ceramic green sheet described above, the virtual first internal electrode pattern can also include a first vertex, a second vertex, a third vertex, and a fourth vertex located clockwise from the upper left. When the size of one side of the virtual square first internal electrode pattern is B1, the first internal electrode paste can be applied so as to have a shape connecting points separated by B1a from the second vertex and the fourth vertex of the first internal electrode pattern that are not exposed, among the corner regions of the virtual square first internal electrode pattern. At this time, based on the first vertex and the third vertex of the virtual square first internal electrode pattern, the distance from the second vertex and the fourth vertex of the virtual square first internal electrode pattern to the points separated by B1a can correspond to B1b, and the total size of B1a and B1b can correspond to B. At this time, it is preferable to fabricate such that the size of B1a is 0.3×B.

[0071] The method of forming the first ceramic green sheet and the first internal electrode pattern described above can be similarly applied to the method of forming the second ceramic green sheet and the second internal electrode pattern, and an ordinary technician can more easily understand by referring to FIG. 5(b) corresponding symmetrically as shown in FIG. 5(a).

[0072] Here, the method of removing the corner regions of the first internal electrode pattern and the second internal electrode pattern including the first ceramic green sheet and the second ceramic green sheet is not particularly limited, but laser cutting can be performed on the region to be removed, or it can be removed using a blade. Alternatively, a scribing method can be used in which after scratching the line of the corner to be removed from the bar shape in which the ceramic green sheets are laminated before firing, it is physically fractured in a subsequent process.

[0073] The materials for forming the internal electrodes 121 and 122 are not particularly limited, and materials with excellent electrical conductivity can be used. For example, the internal electrodes 121 and 122 can include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0074] Also, the internal electrodes 121 and 122 can be formed by printing a conductive paste for internal electrodes containing one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof on a ceramic green sheet to form an internal electrode pattern. As the printing method of the conductive paste for internal electrodes, a screen printing method, a gravure printing method, or the like can be used, but the present invention is not limited thereto.

[0075] On the other hand, the thickness of the internal electrodes 121 and 122 does not need to be particularly limited.

[0076] However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component, the thickness of the internal electrodes 121 and 122 can be 1.0 μm or less, preferably 0.6 μm or less, and more preferably 0.4 μm or less.

[0077] Here, the thickness of the internal electrodes 121 and 122 can mean the size of the internal electrodes 121 and 122 in the first direction. Note that the thickness of the internal electrodes 121 and 122 can mean the average thickness of the internal electrodes 121 and 122, and can mean the average size of the internal electrodes 121 and 122 in the first direction.

[0078] The average size of the internal electrodes 121 and 122 in the first direction can be measured by scanning an image of the cross-section of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, the average size of one internal electrode in the first direction can be the average value calculated by measuring the size of one internal electrode in the first direction at 30 equally spaced points in the second direction in the scanned image. The 30 equally spaced points can be specified in the capacitance forming portion. Further, when such average value measurement is extended to the 10 internal electrodes 121 and 122 to measure the average value, the average size of the internal electrodes 121 and 122 in the first direction can be further generalized.

[0079] On the other hand, the main body 110 can include cover portions 112 and 113 disposed on both end-surfaces in the first direction of the capacitance forming portion.

[0080] More specifically, it can include a first cover portion 112 disposed on one surface in the first direction of the capacitance forming portion and a second cover portion 113 disposed on the other surface in the first direction of the capacitance forming portion, or it can include an upper cover portion 112 disposed on the upper part in the first direction of the capacitance forming portion and a lower cover portion 113 disposed on the lower part in the first direction of the capacitance forming portion.

[0081] The upper cover portion 112 and the lower cover portion 113 can be formed by laminating a single dielectric layer 111 or two or more dielectric layers 111 in the first direction on the upper and lower surfaces of the capacitance forming portion, and can basically play a role in preventing damage to the internal electrodes 121 and 122 due to physical or chemical stress.

[0082] The upper cover portion 112 and the lower cover portion 113 do not include the internal electrodes 121 and 122 and can include the same material as the dielectric layer 111. That is, the upper cover portion 112 and the lower cover portion 113 can include a ceramic material, for example, a barium titanate (BaTiO 3 )-based ceramic material.

[0083] On the one hand, the thicknesses of the cover portions 112 and 113 do not need to be particularly limited.

[0084] However, in order to more easily achieve miniaturization and high capacitance of the stacked electronic component, the thickness of the cover portion can be 100 μm or less, preferably 30 μm or less, and more preferably 20 μm or less in the case of ultra-small products.

[0085] Here, the thickness of the cover portion can mean the distance in the first direction of the cover portions 112 and 113. Also, the thickness of the cover portion can mean the average thickness of the cover portion, and can mean the average size in the first direction of the cover portions 112 and 113.

[0086] The average size in the first direction of the cover portions 112 and 113 can be measured by scanning an image of the cross-section in the first and second directions of the main body 110 with a scanning electron microscope (SEM) at a magnification of 10,000 times. For example, it can mean the average value calculated by measuring the size in the first direction at 30 equally spaced points in the second direction in the image scanned for the first cover portion.

[0087] Note that the average size in the first direction of the first cover portion measured by the above-described method can have substantially the same size as the average size in the first direction of the first cover portion based on the cross-section in the first and third directions of the main body 110.

[0088] In one embodiment of the present invention, the structure in which the ceramic electronic component 100 has four external electrodes 131, 132, 133, and 134 is described. However, the number, shape, etc. of the external electrodes 131, 132, 133, and 134 can vary according to the form of the internal electrodes 121 and 122 and other purposes.

[0089] The external electrodes 131, 132, 133, and 134 are arranged on the main body 110 and can be connected to the internal electrodes 121 and 122.

[0090] The external electrodes 131, 132, 133, and 134 can include a first external electrode 131, a second external electrode 132, a third external electrode 133, and a fourth external electrode 134, and can be arranged separately from each other on the main body 110.

[0091] More specifically, the first external electrode 131 can be arranged on the first corner surface C1 and can be in contact with the first internal electrode 121, the second external electrode 132 can be arranged on the second corner surface C2 and can be in contact with the second internal electrode 122, the third external electrode 133 can be arranged on the third corner surface C3 and can be in contact with the first internal electrode 121, and the fourth external electrode 134 can be in contact with the second internal electrode 122 arranged on the fourth corner surface C4.

[0092] At this time, the first external electrode 131 can completely cover the first corner surface C1 and can be arranged on a part of the third and fifth surfaces 3 and 5, the second external electrode 132 can completely cover the second corner surface C2 and can be arranged on a part of the fourth and fifth surfaces 4 and 5, the third external electrode 133 can completely cover the third corner surface C3 and can be arranged on a part of the fourth and sixth surfaces 4 and 6, and the fourth external electrode 134 can completely cover the fourth corner surface C4 and can be arranged on a part of the third and sixth surfaces 3 and 6.

[0093] The external electrodes 131, 132, 133, and 134 can be formed using any material as long as it has electrical conductivity such as metal, and a specific material can be determined in consideration of electrical characteristics, structural stability, etc., and can further have a multilayer structure.

[0094] For example, the external electrode can include an electrode layer arranged on the main body 110 and a plating layer arranged on the electrode layer.

[0095] As a more specific example for the electrode layer, the electrode layer can be a fired electrode including a conductive metal and glass, or a resin-based electrode including a conductive metal and a resin.

[0096] Also, the electrode layer can be in a form in which a fired electrode and a resin-based electrode are sequentially formed on the main body 110.

[0097] Alternatively, the electrode layer can be formed by a method of transferring a sheet containing a conductive metal onto the main body 110, or can be formed by a method of transferring a sheet containing a conductive metal onto a fired electrode.

[0098] The conductive metal used for the electrode layer is not particularly limited as long as it can be electrically connected to the internal electrodes 121 and 122 for capacitance formation. For example, it can include one or more selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0099] The electrode layer can be formed by applying a conductive paste provided by adding glass frit to the above conductive metal powder and then firing it.

[0100] The plating layer can play a role in improving the mounting characteristics.

[0101] The type of the plating layer is not particularly limited, and it can be a single-layer plating layer containing one or more of nickel (Ni), tin (Sn), palladium (Pd), and alloys thereof, and can be formed of a plurality of layers.

[0102] As a more specific example of the plating layer, the plating layer can be a Ni plating layer or a Sn plating layer, and can be in a form where a Ni plating layer and a Sn plating layer are sequentially formed on the electrode layer, or can be in a form where a Sn plating layer, a Ni plating layer, and a Sn plating layer are sequentially formed. Also, the plating layer can include a plurality of Ni plating layers and / or a plurality of Sn plating layers.

[0103] The size of the multilayer electronic component 100 does not need to be particularly limited.

[0104] However, in order to simultaneously achieve the Low ESL reduction effect in the high-frequency region, the improvement of moisture resistance reliability and mechanical strength improvement effect, and the convenience of capacitance measurement, it can be below the size of 0606 (length × width: 0.6 mm × 0.6 mm), and the length (the size in the second direction) and width (the size in the third direction) of the multilayer electronic component 100 are substantially the same. In the multilayer electronic component 100 having a form-factor shape with an ultra-small size, the effects according to the present invention can become more remarkable.

[0105] Here, the length and width being substantially the same does not mean being completely the same, but includes an acceptable error range, preferably meaning that the difference between the length and width is 10% or less, and more preferably the difference between the length and width is 5% or less. When the length and width are substantially the same, the improvement of the current loop can be possible, and the multilayer electronic component 100 having Low ESL can be more easily achieved.

[0106] Mounting substrate of multilayer electronic component On the other hand, MLCCs are also widely used for decoupling to remove noise of electrical signals in the set due to their excellent high-frequency characteristics (Low ESL).

[0107] In addition, in order to solve the noise of a high-speed integrated circuit (Integrated Circuit, IC), an LSC (Land Side Capacitor) can be applied adjacent to the IC, but it is known that the LSC requires a thin thickness and high-frequency characteristics. In order to reduce ESL, it is important to minimize the number of magnetic flux linkages per unit current in the high-frequency region. For this purpose, it is solved in various ways such as controlling the formation and structure to minimize the loop current, or arranging the internal electrodes and external electrodes so as to cancel the magnetic field.

[0108] As described above, since the LSC is generally disposed below the IC substrate, it has a thin thickness while Low ESL characteristics are required. At this time, the LSC is mounted at the position where the solder balls below the substrate are removed, and a capacitor in the form of LICC (Low Inductance Ceramic Capacitor) is mainly used. However, the need for a capacitor having a square form factor is gradually increasing.

[0109] Therefore, the present invention is designed to include an octahedral body and a multilayer electronic component in a structure capable of achieving Low ESL, thereby minimizing the current path to improve the ESR and ESL characteristics and minimizing the solder balls (SOL) to be removed. Thus, it can have an advantageous design structure when mounted on a substrate.

[0110] Hereinafter, the mounting substrate of the multilayer electronic component will be described, but the same description as that regarding the above-described multilayer electronic component will be omitted.

[0111] The mounting substrate of the multilayer electronic component according to another embodiment of the present invention includes a printed circuit board, a multilayer electronic component disposed on the printed circuit board, and solder balls disposed on the printed circuit board and surrounding the multilayer electronic component. The multilayer electronic component 100 includes a dielectric layer 111 and internal electrodes 121 and 122 alternately arranged with the dielectric layer 111 in a first direction. The multilayer electronic component 100 includes a first surface 1 and a second surface 2 facing each other in the first direction, a third surface 3 and a fourth surface 4 facing each other in a second direction perpendicular to the first direction, and a fifth surface 5 and a sixth surface 6 facing each other in a third direction perpendicular to the first and second directions. The multilayer electronic component 100 includes a first corner surface C1 connected to the first surface 1, the second surface 2, the third surface 3, and the fifth surface 5, a second corner surface C2 connected to the first surface 1, the second surface 2, the fourth surface 4, and the fifth surface 5, a third corner surface C3 connected to the first surface 1, the second surface 2, the fourth surface 4, and the sixth surface 6 and facing the first corner surface C1, and a fourth corner surface C4 connected to the first surface 1, the second surface 2, the third surface 3, and the sixth surface 6 and facing the second corner surface C2. The multilayer electronic component 100 further includes external electrodes 131 and 132 disposed on the main body 110. The internal electrodes 121 and 122 include a first internal electrode 121 in contact with the first corner surface C1 and the third corner surface C3, and a second internal electrode 122 in contact with the second corner surface C2 and the fourth corner surface C4. The external electrodes 131, 132, 133, and 134 may include a first external electrode 131 and a third external electrode 133 respectively disposed on the first corner surface C1 and the third corner surface C3 and in contact with the first internal electrode 121, and a second external electrode 132 and a fourth external electrode 134 respectively disposed on the second corner surface C2 and the fourth corner surface C4 and in contact with the second internal electrode 122.

[0112] Referring to FIG. 6, the octahedral multilayer electronic component 100 according to an embodiment of the present invention can minimize the removal of solder balls (SOL) compared to a conventional hexahedral multilayer electronic component, and has an advantage that it is easier to design by further arranging solder balls (SOL) in a corner region of the conventional hexahedral shape.

[0113] In addition, by arranging the octahedral laminated electronic component 100 on the substrate with LSC, the size of the solder ball (SOL) can be minimized, and the Fine BGA (Ball Grid Array) pitch and height characteristics can be realized on the packaging substrate. Therefore, the Low ESL characteristics can be improved while maintaining excellent thermal characteristics.

[0114] As described above, the embodiments of the present invention have been described in detail. However, the present invention is not limited by the above-described embodiments and the attached drawings, but is limited by the attached claims. Therefore, within the scope not departing from the technical idea of the present invention described in the claims, various forms of substitution, modification, and change are possible by those having ordinary knowledge in the technical field, and this can also be said to belong to the scope of the present invention.

[0115] In addition, the expression "one embodiment" used in the present disclosure does not mean the same embodiment, but is provided to emphasize and explain each different unique feature. However, the above-presented one embodiment does not exclude being realized in combination with the features of other one embodiments. For example, even if the matter described in a specific one embodiment is not described in another one embodiment, it can be understood as an explanation related to the other one embodiment as long as there is no explanation contrary to or conflicting with that matter in the other one embodiment.

[0116] The terms used in the present disclosure are merely used to explain one embodiment and are not intended to limit the present disclosure. At this time, the singular expression includes the plural expression unless the context clearly indicates otherwise.

Explanation of Reference Numerals

[0117] 100 Laminated electronic component 110 Body 111 Dielectric layer 112 First cover part 113 Second cover part 121 First internal electrode 122 Second internal electrode 131 First external electrode 132 Second external electrode 133 Third external electrode 134 Fourth external electrode SOL Solder ball

Claims

1. a body including dielectric layers and internal electrodes alternately disposed with the dielectric layers in a first direction, the body including first and second surfaces facing each other in the first direction, third and fourth surfaces facing each other in a second direction perpendicular to the first direction, and fifth and sixth surfaces facing each other in a third direction perpendicular to the first and second directions, the body including a first corner surface connected to the first, second, third and fifth surfaces, a second corner surface connected to the first, second, fourth and fifth surfaces, a third corner surface connected to the first, second, fourth and sixth surfaces and facing the first corner surface, and a fourth corner surface connected to the first, second, third and sixth surfaces and facing the second corner surface; an external electrode disposed on the body; the internal electrodes include a first internal electrode in contact with the first corner surface and the third corner surface, and a second internal electrode in contact with the second corner surface and the fourth corner surface, the external electrodes include a first external electrode and a third external electrode arranged on the first corner face and the third corner face, respectively, in contact with the first internal electrode, and a second external electrode and a fourth external electrode arranged on the second corner face and the fourth corner face, respectively, in contact with the second internal electrode.

2. 2. The multilayer electronic component according to claim 1, wherein, based on a cross section in the second direction and the third direction, the first corner surface, the second corner surface, the third corner surface, and the fourth corner surface are not substantially parallel to the second direction and the third direction.

3. the first internal electrode is spaced apart from the third surface, the fourth surface, the fifth surface, the sixth surface, the second corner surface, and the fourth corner surface; 2 . The multilayer electronic component according to claim 1 , wherein the second internal electrode is spaced apart from the third surface, the fourth surface, the fifth surface, and the sixth surface, as well as the first corner surface and the third corner surface.

4. 2. The multilayer electronic component according to claim 1, wherein when a length of the corner surface is taken as BL and a length of the internal electrode that is in contact with the corner surface is taken as IEL, the relationship IEL<BL is satisfied, based on cross sections in the second direction and the third direction.

5. 2. The multilayer electronic component according to claim 1, wherein, based on cross sections in the second direction and the third direction, the internal electrode includes a region that is substantially parallel to a surface of the internal electrode adjacent to a corner surface that contacts the main body.

6. 2. The multilayer electronic component according to claim 1, wherein the internal electrodes do not include any region where the width is narrowed.

7. 7. The multilayer electronic component according to claim 1, wherein all of the internal angles of the internal electrodes are obtuse angles.

8. 7. The multilayer electronic component according to claim 1, wherein all internal angles in an area where the first internal electrodes and the second internal electrodes overlap are obtuse angles.

9. A printed circuit board; a laminated electronic component disposed on the printed circuit board; a solder ball disposed on the printed circuit board and surrounding the laminated electronic component; The multilayer electronic component comprises: a body including dielectric layers and internal electrodes alternately disposed with the dielectric layers in a first direction, the body including first and second surfaces facing each other in the first direction, third and fourth surfaces facing each other in a second direction perpendicular to the first direction, and fifth and sixth surfaces facing each other in a third direction perpendicular to the first and second directions, the body including a first corner surface connected to the first, second, third and fifth surfaces, a second corner surface connected to the first, second, fourth and fifth surfaces, a third corner surface connected to the first, second, fourth and sixth surfaces and facing the first corner surface, and a fourth corner surface connected to the first, second, third and sixth surfaces and facing the second corner surface; an external electrode disposed on the body; the internal electrodes include a first internal electrode in contact with the first corner surface and the third corner surface, and a second internal electrode in contact with the second corner surface and the fourth corner surface, the external electrodes include a first external electrode and a third external electrode arranged on the first corner face and the third corner face, respectively, in contact with the first internal electrode, and a second external electrode and a fourth external electrode arranged on the second corner face and the fourth corner face, respectively, in contact with the second internal electrode.

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