Multilayer type electronic component

Abstract

To provide a multilayer type electronic component in which the reliability is excellent.SOLUTION: The multilayer type electronic component includes a main body, a plurality of internal electrodes 121 and 122, and an external electrode. The plurality of internal electrodes include a main part and a lead part 121b extending from the main part to a third surface or a fourth surface and having a connection end E11 in contact with the external electrode. The lead part has a width in a third direction gradually decreasing from the main part 121a to the connection end. The main part includes a first saddle part disposed at an end part apart from the lead part. The lead part includes a second saddle part disposed at a side end in the third direction. The first saddle part and the second saddle part are thicker in a first direction than a central part of the main part in a second direction. The lead part has an overlap region that overlaps in the first direction with the main part of another adjacent internal electrode among the plurality of internal electrodes.SELECTED DRAWING: Figure 4c

Description

Technical Field

[0001] The present invention relates to a multilayer electronic component.

Background Art

[0002] A multilayer ceramic capacitor (MLCC), which is one type of multilayer electronic component, is a chip-shaped capacitor that is mounted on a printed circuit board of various electronic products such as video devices like liquid crystal display (LCD) devices and plasma display panel (PDP) panels, computers, smartphones, and mobile phones, and serves to charge or discharge electricity. Such a multilayer ceramic capacitor can be used as a component of various electronic devices due to its advantages of being small in size while ensuring high capacitance and being easy to mount.

[0003] The main body of a multilayer ceramic capacitor generally has a structure in which dielectric layers and internal electrodes are alternately arranged. On the other hand, the breakdown voltage (BDV) of a multilayer ceramic capacitor is proportional to the thickness of the dielectric layer. Therefore, in order to improve the capacitance of the multilayer ceramic capacitor, the dielectric layer is thinned, but it is important to make the thickness of the dielectric layer uniform in order to improve the dispersion of the breakdown voltage.

[0004] On the other hand, when forming an internal electrode pattern by printing a conductive paste for the internal electrode, the periphery of the internal electrode pattern can have a saddle shape that is locally thicker than other parts of the internal electrode pattern.

[0005] At this time, when the ends of the internal electrode pattern overlap in the stacking direction, a phenomenon occurs in which the thickness of the dielectric layer becomes locally thin in this region, and there may be a problem that the dispersion of the breakdown voltage of the multilayer ceramic capacitor becomes non-uniform.

[0006] In particular, in order to improve the moisture resistance reliability and the like of a multilayer ceramic capacitor, when there is a bottleneck structure in which the width of the lead portion where the internal electrode contacts the external electrode is narrow, it is necessary to surely prevent the end portions of the internal electrode pattern from overlapping in the stacking direction. Summary of the Invention Problems to be Solved by the Invention

[0007] One of the various objects of the present invention is to provide a multilayer electronic component with excellent reliability.

[0008] However, the object of the present invention is not limited to the above-described content, and can be more easily understood in the process of explaining specific embodiments of the present invention. Means for Solving the Problems

[0009] One embodiment of the present invention includes a dielectric layer and a plurality of internal electrodes alternately arranged with the dielectric layer in a first direction, a first surface and a second surface facing each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a second direction, a fifth surface and a sixth surface connected to the first surface to the fourth surface and facing each other in a third direction, a main body, and external electrodes disposed on the third surface and the fourth surface. The plurality of internal electrodes include a main portion and a lead portion extending from the main portion toward the third surface or the fourth surface and having a connection end in contact with the external electrode. The width of the lead portion in the third direction gradually decreases from the main portion toward the connection end. The main portion includes a first saddle portion disposed at an end portion separated from the lead portion. The lead portion includes a second saddle portion disposed at a side end in the third direction. The first saddle portion and the second saddle portion are each thicker in the first direction than the central portion of the main portion in the second direction. The lead portion provides a multilayer electronic component having an overlapping region that overlaps with the main portion of another adjacent internal electrode in the first direction among the plurality of internal electrodes.

[0010] One embodiment of the present invention includes a dielectric layer and a plurality of internal electrodes alternately arranged with the dielectric layer in a first direction, a first surface and a second surface facing each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in a second direction, a fifth surface and a sixth surface connected to the first surface, the second surface, the third surface and the fourth surface and facing each other in a third direction, a main body, and external electrodes disposed on the third surface and the fourth surface. The plurality of internal electrodes include a main portion and a lead portion extending from the main portion toward the third surface or the fourth surface and having a connection end in contact with the external electrode. The width of the lead portion in the third direction gradually decreases from the main portion toward the connection end. Among the plurality of internal electrodes, there is an overlapping region where the main portion of another adjacent internal electrode overlaps in the first direction. When the width of the connection end in the third direction is W1 and the width of the main portion in the third direction is W2, W1 / W2 provides a multilayer electronic component that is 0.4 or more and 0.75 or less.

Advantages of the Invention

[0011] Among various effects of the present invention, one is that a multilayer electronic component with excellent reliability can be provided.

Brief Description of the Drawings

[0012]

Figure 1

Figure 2

Figure 3

Figure 4a

Figure 4b

Figure 4c

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Mode for Carrying Out the Invention

[0013] Hereinafter, embodiments of the present invention will be described with reference to specific embodiments and the accompanying drawings. However, the embodiments of the present invention can be modified into several other forms, and the scope of the present invention is not limited to the embodiments described below. Also, the embodiments of the present invention are provided to more fully explain the present invention to an ordinary technician. Therefore, the shape and size of elements in the drawings may be enlarged or reduced (or emphasized or simplified) for clearer explanation, and elements denoted by the same reference numerals in the drawings are the same elements.

[0014] In addition, parts not related to the explanation are omitted in the drawings for clearly explaining the present invention, and the sizes and thicknesses of the illustrated configurations are arbitrarily shown for convenience of explanation, so the present invention is not necessarily limited by the illustration. Also, components having the same function within the scope of the same idea can be described using the same reference numerals. Furthermore, throughout the specification, when a certain part "includes" a certain component, it means that other components can be further included, rather than excluding other components, unless otherwise stated to the contrary.

[0015] In the drawings, the first direction can be defined as the thickness (T) direction, the second direction as the length (L) direction, and the third direction as the width (W) direction.

[0016] Multilayer electronic component FIG. 1 is a perspective view schematically showing a multilayer electronic component according to an embodiment of the present invention, FIG. 2 is a cross-sectional view schematically showing a cut cross-section along the line I-I' of FIG. 1, FIG. 3 is a cross-sectional view schematically showing a cut cross-section along the line II-II' of FIG. 1, FIG. 4a is a plan view schematically showing a first internal electrode of an embodiment of the present invention, FIG. 4b is a plan view schematically showing a second internal electrode of an embodiment of the present invention, FIG. 4c is a plan view showing a state where the first internal electrode and the second internal electrode of an embodiment of the present invention overlap, FIG. 5 is an enlarged view of the K1 region of FIG. 4c, FIG. 6 is a cross-sectional view schematically showing a cut cross-section along the line III-III' of FIG. 1, FIG. 7 is an enlarged view of the K2 region of FIG. 6, FIG. 8 is a plan view schematically showing a ceramic green sheet on which an internal electrode pattern for manufacturing a multilayer electronic component according to an embodiment of the present invention is printed, FIG. 9 is a plan view showing a state where the first internal electrode and the second internal electrode of a comparative example overlap, a drawing corresponding to FIG. 4c, and FIG. 10 is a cross-sectional view showing a cut cross-section of the comparative example, a drawing corresponding to FIG. 6.

[0017] Hereinafter, with reference to FIGS. 1 to 10, a multilayer electronic component 100 according to an embodiment of the present invention will be described in detail. Further, a multilayer ceramic capacitor will be described as an example of the multilayer electronic component, but the present invention is not limited thereto, and it can also be applied to various multilayer electronic components, for example, inductors, piezoelectric elements, varistors, or thermistors.

[0018] Referring to FIGS. 1 to 3, a multilayer electronic component 100 according to an embodiment of the present invention can include a main body 110 including a dielectric layer 111 and internal electrodes 121 and 122, and external electrodes 131 and 132.

[0019] There is no particular limitation on the specific shape of the main body 110. However, as shown in the figure, the main body 110 can be formed in a hexahedron shape or a shape similar thereto. Although the main body 110 is not a hexahedron with perfect straight lines due to the polishing process on the corner portions of the main body 110, it can have a substantially hexahedron shape.

[0020] The main body 110 can have a first surface 1 and a second surface 2 facing each other in a first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and facing each other in a second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface 1, the second surface 2, the third surface 3, and the fourth surface 4 and facing each other in a third direction.

[0021] The main body 110 can include a dielectric layer 111 and a plurality of internal electrodes 121, 122 alternately arranged with the dielectric layer 111 in a first direction. The plurality of dielectric layers 111 forming the main body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated to such an extent that they are difficult to confirm without using a scanning electron microscope (SEM).

[0022] The dielectric layer 111 can contain, for example, a perovskite-type compound represented by ABO 3 as a main component. The perovskite-type compound represented by ABO 3 can be, for example, BaTiO 3 , (Ba 1-x Ca x )TiO 3 (0 < x < 1), Ba(Ti 1-y Ca y )O 3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O 3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O 3 (0 < y < 1).

[0023] The internal electrodes 121 and 122 can include, for example, a first internal electrode 121 and a second internal electrode 122 that are alternately arranged in the first direction with the dielectric layer 111 interposed therebetween. That is, the first internal electrode 121 and the second internal electrode 122, which are a pair of electrodes having different polarities from each other, can be arranged so as to face each other with the dielectric layer 111 interposed therebetween. The first internal electrode 121 and the second internal electrode 122 can be electrically separated from each other by the dielectric layer 111 disposed therebetween.

[0024] The first internal electrode 121 can be separated from the fourth surface 4 and can be connected to the first external electrode 131 on the third surface 3 side. The second internal electrode 122 can be separated from the third surface 3 and can be connected to the second external electrode 132 on the fourth surface 4 side.

[0025] The conductive metal included in the internal electrodes 121 and 122 can be one or more of Ni, Cu, Pd, Ag, Au, Pt, Sn, W, Ti, and alloys thereof, and more preferably can include Ni, but the present invention is not limited thereto.

[0026] The main body 110 can include a capacitance forming portion Ac that is disposed inside the main body 110 and includes a first internal electrode 121 and a second internal electrode 122 that are alternately arranged with the dielectric layer 111 interposed therebetween to form a capacitance, and a first cover portion 112 and a second cover portion 113 that are respectively disposed on both surfaces facing each other in the first direction of the capacitance forming portion Ac.

[0027] The main body 110 can include a first margin portion 114 and a second margin portion 115 that are respectively disposed on both surfaces facing each other in the third direction of the capacitance forming portion Ac. That is, the margin portions 114 and 115 can mean the regions between the boundary surfaces of both ends of the internal electrodes 121 and 122 and the main body 110 in a cross section obtained by cutting the main body 110 in the first direction and the third direction.

[0028] The cover portions 112 and 113 and the margin portions 114 and 115 can basically play a role in preventing damage to the internal electrodes due to physical or chemical stress. The cover portions 112 and 113 and the margin portions 114 and 115 can have a configuration similar to that of the dielectric layer 111, except that they do not include the internal electrodes.

[0029] The external electrodes 131 and 132 can be disposed on the third surface 3 and the fourth surface 4 of the main body 110, and can extend onto a part of the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6. The external electrodes 131 and 132 can include a first external electrode 131 connected to the first internal electrode 121 and a second external electrode 132 connected to the second internal electrode 122.

[0030] The external electrodes 131 and 132 can include first electrode layers 131a and 132a that contact the internal electrodes 121 and 122, and second electrode layers 132a and 132b disposed on the first electrode layers 131a and 132a.

[0031] The first electrode layers 131a and 132a can include metal and glass. The first electrode layers 131a and 132a can be, for example, fired electrodes. The metal included in the first electrode layers 131a and 132a can include Cu, Ni, Pd, Pt, Au, Ag, Pb, and / or an alloy containing the same, but the present invention is not limited thereto.

[0032] The second electrode layers 131b and 132b can improve the mounting characteristics. The type of the second electrode layers 131b and 132b is not particularly limited, and can be a plating layer including Ni, Sn, Pd, and / or an alloy containing the same, and can also be formed of a plurality of layers. The second electrode layers 131b and 132b can be, for example, a Ni plating layer or a Sn plating layer, or can be in a form in which a Ni plating layer and a Sn plating layer are sequentially formed. Further, the second electrode layers 131b and 132b can also include a plurality of Ni plating layers and / or a plurality of Sn plating layers.

[0033] In the drawings, a structure in which the multilayer electronic component 100 has two external electrodes 131 and 132 is described, but the present invention is not limited thereto, and the number and shape of the external electrodes 131 and 132 can be changed according to the form of the internal electrodes 121 and 122 and other purposes.

[0034] Hereinafter, with reference to FIGS. 4a to 7, the internal electrodes 121 and 122 of the multilayer electronic component 100 according to an embodiment of the present invention will be described in more detail.

[0035] Referring to FIGS. 4a and 4b, the plurality of internal electrodes 121 and 122 can include main portions 121a and 122a and lead portions 121b and 122b that extend from the main portions 121a and 122a toward the third surface 3 or the fourth surface 4 and have connection ends E11 and E21 that are in contact with the external electrodes 131 and 132.

[0036] That is, the first internal electrode 121 can include a first main portion 121a and a first lead portion 121b that extends from the first main portion 121a toward the third surface 3 and has a connection end E11 that is in contact with the first external electrode 131. The outer periphery of the first internal electrode 121 can have, for example, a connection end E11 that is in contact with the first external electrode 131, an end E12 of the first main portion 121a that is separated from the first lead portion 121b, a side end E13 of the first lead portion 121b in the third direction, and a side end E14 of the first main portion 121a in the third direction.

[0037] The second internal electrode 122 can include a second main portion 122a and a second lead portion 122b that extends from the second main portion 122a toward the fourth surface 4 and has a connection end E21 that is in contact with the second external electrode 132. The outer periphery of the second internal electrode 122 can have, for example, a connection end E21 that is in contact with the second external electrode 132, an end E22 of the second main portion 122a that is separated from the second lead portion 122b, a side end E23 of the second lead portion 122b in the third direction, and a side end E24 of the second main portion 122a in the third direction.

[0038] The main portions 121a and 122a can have a flat plate shape perpendicular to the first direction. The main portions 121a and 122a can be arranged spaced apart from the outer surface of the main body 110. The main portions 121a and 122a can have a substantially rectangular shape. The side ends E14 and E24 of the main portions 121a and 122a in the third direction can be substantially parallel to the fifth surface 5 and the sixth surface 6. The fact that the side ends E14 and E24 of the main portions 121a and 122a in the third direction are substantially parallel to the fifth surface 5 and the sixth surface 6 means that not only when the side ends E14 and E24 of the main portions 121a and 122a in the third direction are completely parallel to the fifth surface 5 or the sixth surface 6, but also the angle formed by the extension lines of the side ends E14 and E24 of the main portions 121a and 122a in the third direction and the extension lines of the fifth surface 5 or the sixth surface 6 can be 10° or less, or 5° or less. At least a part of the first main portion 121a can overlap with the second main portion 122a in the first direction to form the capacitance of the multilayer electronic component 100. The lead portions 121b and 122b can be drawn out to the third surface 3 or the fourth surface 4 and can be arranged spaced apart from the first surface 1, the second surface 2, the fifth surface 5, and the sixth surface 6. The lead portions 121b and 122b can serve to connect the main portions 121a and 122a to the external electrodes 131 and 132.

[0039] Referring to FIG. 4c, the width W1 of the connection end in the third direction can be narrower than the width W2 of the main portion in the third direction. Thereby, the area of the internal electrodes 121 and 122 that is exposed to the outside can be reduced, the moisture resistance reliability of the multilayer electronic component 100 can be improved, and the occurrence of cracks in the main body 110 can be suppressed. Also, the occurrence of cracks (so-called A / C cracks) between the capacitance forming portion Ac and the cover portions 112 and 113 can be suppressed.

[0040] The ratio of W1 to W2 (W1 / W2) does not particularly need to be limited, but preferably, W1 / W2 can be 0.4 or more and 0.75 or less. When W1 / W2 exceeds 0.75, the effect of improving the moisture resistance reliability and the effect of suppressing the occurrence of A / C cracks of the present invention may be slight. Further, when W1 / W2 is less than 0.4, there may occur a side effect that the connectivity between the internal electrodes 121 and 122 and the external electrodes 131 and 132 decreases.

[0041] The shape of the lead portions 121b and 122b may be any shape as long as W1 < W2 is satisfied. However, in one embodiment, the widths of the lead portions 121b and 122b in the third direction can gradually decrease as they go from the main portions 121a and 122a toward the connection ends E11 and E21. That is, the width of the first lead portion 121b in the third direction can gradually decrease as it gets closer to the third surface 3 from the first main portion 121a, and the width of the second lead portion 122b in the third direction can gradually decrease as it gets closer to the fourth surface 4 from the second main portion 122a. For example, as shown in FIGS. 4a and 4b, the side ends E13 and E23 of the lead portions 121b and 122b in the third direction can have a curved shape. For example, the side ends E13 and E23 of the lead portions 121b and 122b in the third direction can have a convex shape toward the central portion of the main body 110 in the third direction.

[0042] On the other hand, referring to FIG. 4c, the main body 110 can have a first corner portion C1 connecting between the third surface 3 and the fifth surface 5, a second corner portion C2 connecting between the third surface 3 and the sixth surface 6, a third corner portion C3 connecting between the fourth surface 4 and the fifth surface 5, and a fourth corner portion C4 connecting between the fourth surface 4 and the sixth surface 6. On the other hand, in order to prevent the phenomenon that the corner portions C1, C2, C3, and C4 of the main body 110 crack (so-called chipping defect), the process of polishing the fired main body 110 can be passed through. Thereby, the corner portions C1, C2, C3, and C4 can have a round shape.

[0043] In one embodiment, the connection ends E11 and E21 can be separated from the corner portions C1, C2, C3, and C4. The corner portions C1, C2, C3, and C4 may be vulnerable to the penetration of external moisture in the main body 110. Thus, when the connection ends E11 and E21 come into contact with the corner portions C1, C2, C3, and C4, the moisture resistance reliability of the multilayer electronic component 100 may decrease. Therefore, it is preferable that the connection ends E11 and E21 are arranged separated from the corner portions C1, C2, C3, and C4.

[0044] Referring to FIGS. 4a to 5, in one embodiment, the radius of curvature Rc of the corner portions C1, C2, C3, and C4 can be larger than the distance Wm from the third-direction side ends E14 and E24 of the main portions 121a and 122 to the fifth surface 5 or the sixth surface 6. That is, in one embodiment, Rc>Wm can be satisfied. The above Wm can mean the width of the margin portions 114 and 115 in the third direction. By satisfying Rc>Wm for the above Rc and Wm, it is possible to prevent the margin portions 114 and 115 from peeling off from the side surface of the capacitance forming portion Ac.

[0045] The above Rc can satisfy, for example, Rc≦22 μm. When the above Rc exceeds 22 μm, there may be a problem that the thickness of the external electrodes 131 and 132 becomes very thin on the corner portions C1, C2, C3, and C4. The lower limit of the above Rc does not particularly need to be limited, but for example, 6 μm≦Rc can be satisfied. When the above Rc is less than 6 μm, there is a possibility that chipping defects may occur.

[0046] The above Wm can satisfy, for example, Wm≦20 μm. When the above Wm exceeds 20 μm, it may be disadvantageous for miniaturization and high capacitance of the multilayer electronic component 100. The lower limit of the above Wm does not particularly need to be limited, but for example, 5 μm≦Wm can be satisfied. When the above Wm is less than 5 μm, the reliability of the multilayer electronic component 100 may decrease.

[0047] Referring to FIGS. 6 and 7, in the case of the multilayer electronic component 100 according to an embodiment of the present invention, the main portions 121a, 122a include first saddle portions 21a, 22a disposed at end portions E12, E22 separated from the lead portions 121b, 122b, and the lead portions 121b, 122b can include second saddle portions 21b, 22b disposed at side ends E13, E23 in the third direction. The first saddle portions 21a, 22a and the second saddle portions 21b, 22b can each be thicker in the first direction than the central portion in the second direction of the main portions 121a, 122a. That is, the first saddle portion 21a and the second saddle portion 21b of the first internal electrode 121 are thicker than the central portion in the second direction of the first main portion 121a, and the first saddle portion 22a and the second saddle portion 22b of the second internal electrode 122 can be thicker than the central portion in the second direction of the second main portion 122a.

[0048] As will be described later, when printing a conductive paste for an internal electrode on a ceramic green sheet to form an internal electrode pattern, the outer periphery of the internal electrode pattern can be thicker than the remaining portion. Saddle portions 21a, 22a, 21b, 22b can be formed at end portions E12, E22 separated from the lead portions 121b, 122b of the main portions 121a, 122a corresponding to the outer periphery of the internal electrode pattern and at side ends E13, E23 in the third direction of the lead portions 121b, 122b.

[0049] The thicknesses of the first saddle portions 21a and 22a and the second saddle portions 21b and 22b do not need to be particularly limited. For example, as shown in FIGS. 6 and 7, when the maximum thickness in the first direction of the first saddle portions 21a and 22a is t1, the maximum thickness in the first direction of the second saddle portions 21b and 22b is t2, and the average thickness in the first direction of the central portion in the second direction of the main portions 121a and 122a is te, the ratio (t1 / te) of t1 to te can be 1.045 or more and 1.085 or less. Also, the ratio (t2 / te) of t2 to te can be 1.045 or more and 1.085 or less. Although te does not need to be particularly limited, it can be 0.1 μm or more and 0.6 μm or less. Also, the lengths Ls1 in the second direction of the first saddle portions 21a and 22a and the lengths Ls2 in the second direction of the second saddle portions 21b and 22b do not need to be particularly limited, but Ls1 and Ls2 can be 70 μm to 85 μm, respectively.

[0050] On the other hand, t1, t2, Ls1, and Ls2 can be measured from an image obtained by photographing cross-sections in the first and second directions (for example, the cut cross-section shown in FIG. 6) passing through the side ends E13 and E23 in the third direction of the lead portion with a scanning electron microscope (SEM). t1, t2, Ls1, and Ls2 can also mean the average value of the values measured with 10 internal electrodes 121 and 122, respectively.

[0051] Te can be measured by scanning a cross-section in the first and second directions (for example, the cut cross-section shown in FIG. 6) passing through the side ends E13 and E23 in the third direction of the lead portion with a scanning electron microscope (SEM). More specifically, after measuring the thickness at a number of points located in the central portion in the second direction of one main portion 121a or 122a, for example, 30 points at equal intervals in the second direction, te can be measured by taking the average value. On the other hand, after performing such average value measurement for 10 main portions 121a and 122a and then measuring the average value, te can be further generalized.

[0052] On the one hand, referring to FIGS. 4c and 5, the lead portion can have an overlapping region Ro that overlaps with the main portions of other adjacent internal electrodes among the plurality of internal electrodes in the first direction. For example, a part of the first lead portion 121b can overlap with the second main portion 122a in the first direction, and a part of the second lead portion 122b can overlap with the first main portion 121a in the first direction. For example, the maximum length of the first lead portion 121b in the second direction can be longer than the distance between the end portion E22 separated from the second lead portion 122b of the second main portion 122a and the third surface 3, and the maximum length of the second lead portion 122b in the second direction can be longer than the distance between the end portion E12 separated from the first lead portion 121b of the first main portion 121a and the fourth surface 4.

[0053] As a result, as shown in FIG. 6, in the cross-sections of the main body 110 in the first and second directions passing through the regions adjacent to the side ends E14 and E24 in the third direction of the main portions 121a and 122a, the ends of the first saddle portions 21a and 22a in the third direction can be prevented from overlapping with the second saddle portions 22b and 21b of other adjacent internal electrodes among the plurality of internal electrodes in the first direction. For example, in the cross-sections of the main body 110 in the first and second directions passing through the regions adjacent to the side ends E14 and E24 in the third direction of the main portions 121a and 122a, the end of the first saddle portion 21a of the first internal electrode 121 in the third direction can be prevented from overlapping with the second saddle portion 22b of the second internal electrode 122 in the first direction, and the end of the first saddle portion 22a of the second internal electrode 122 in the third direction can be prevented from overlapping with the second saddle portion 21b of the first internal electrode 121 in the first direction.

[0054] FIG. 9 is a plan view showing a state where the first internal electrode and the second internal electrode of the comparative example overlap, and is a drawing corresponding to FIG. 4c. FIG. 10 is a cross-sectional view showing a cut cross-section of the comparative example, and is a drawing corresponding to FIG. 6.

[0055] Referring to FIGS. 9 and 10, in the case of the comparative example, the first lead portion 121b' of the first internal electrode 121' does not overlap with the second main portion 122a' of the second internal electrode 122' in the first direction. Also, the second lead portion 122b' of the second internal electrode 122' does not overlap with the first main portion 121a' of the first internal electrode 121' in the first direction. In this case, in the cross-sections of the main body 110 in the first and second directions passing through the regions adjacent to the side ends of the main portions 121a', 122a' in the third direction, the end portion in the third direction of the first saddle portion 21a' disposed at the end portion E12' separated from the first lead portion 121b' of the first main portion 121a' and the second saddle portion 22b' disposed at the side end E23' in the third direction of the second lead portion 122b' can overlap in the first direction. Also, in the cross-sections of the main body 110 in the first and second directions passing through the regions adjacent to the side ends of the main portions 121a', 122a' in the third direction, the end portion in the third direction of the first saddle portion 22a' disposed at the end portion E22' separated from the second lead portion 122b' of the second main portion 122a' and the second saddle portion 21b' disposed at the side end E13' in the third direction of the first lead portion 121b' can overlap in the first direction.

[0056] As shown in FIG. 10, in the comparative example, the regions where the first saddle portions 21a', 22a' and the second saddle portions 22b', 21b' overlap in the first direction, that is, the regions where the thickness of the dielectric layer 111 becomes locally thin, increase, and the characteristics of the breakdown voltage of the multilayer electronic component may deteriorate. On the other hand, in the case of one embodiment of the present invention, the regions where the first saddle portions 21a, 22a and the second saddle portions 22b, 21b overlap in the first direction, that is, the regions where the thickness of the dielectric layer 111 becomes locally thin, can be reduced, and as a result, it is possible to prevent the characteristics of the breakdown voltage of the multilayer electronic component 100 from deteriorating.

[0057] The length of the overlapping region Ro does not particularly need to be limited. However, referring to FIG. 5, when the maximum length Lo of the overlapping region Ro in the second direction is defined, Lo can be 25 μm or more. When Lo is less than 25 μm, the effect of improving the breakdown voltage (BDV) characteristics of the present invention may be slight. The upper limit of Lo does not particularly need to be limited, but for example, it can be 75 μm or less. When Lo exceeds 75 μm, the length of the main part in the second direction decreases, the area of the non-overlapping region Rn described later increases, and there may be a secondary effect that the capacitance of the multilayer electronic component 100 decreases.

[0058] On the other hand, referring to FIG. 5, when the region of the lead portion 121b excluding the overlapping region Ro is defined as the margin region Rm, the maximum length Lm of the margin region Rm in the second direction can be 5 μm or more and 45 μm or less. When Lm is less than 5 μm, the moisture penetration path from the outside to the internal electrode becomes short, and there is a risk that the moisture resistance reliability of the multilayer electronic component 100 decreases. Also, when Lm exceeds 45 μm, the overlapping region Ro decreases, and there is a risk that the capacitance of the multilayer electronic component 100 decreases.

[0059] On the other hand, referring to FIGS. 4a to 5, the main parts 121a and 122a can include non-overlapping regions Rn that do not overlap with other adjacent internal electrodes in the first direction among the plurality of internal electrodes 121 and 122. The non-overlapping regions Rn can be arranged at both ends in the third direction of the end portions E12 and E22 of the main parts 121a and 122a that are separated from the lead portions 121b and 122b. That is, the first main part 121a and the second main part 122a can each have two non-overlapping regions Rn.

[0060] In one embodiment, the area ratio of the non-overlapping region Rn to the total area of the main parts 121a and 122a can be 0.8% or more and 1.5% or less. That is, the area ratio of the two non-overlapping regions Rn included in the first main part 121a to the total area of the first main part 121a can be 0.8% or more and 1.5% or less, and the area ratio of the two non-overlapping regions Rn included in the second main part 122a to the total area of the second main part 122a can be 0.8% or more and 1.5% or less. When the area ratio of the non-overlapping region Rn to the total area of the main parts 121a and 122a is less than 0.8%, the improvement effect of the breakdown voltage characteristics of the present invention may be slight. When the area ratio of the non-overlapping region Rn to the total area of the main parts 121a and 122a exceeds 1.5%, there may be a secondary effect that the capacitance of the multilayer electronic component 100 decreases significantly.

[0061] The above W1, W2, Rc, Wm, Lo, Lm, and the area ratio of the non-overlapping region Rn, etc. can be measured from an image obtained by photographing cross-sections of the multilayer electronic component 100 in the second and third directions passing through the center of the main body 110 in the first direction with a scanning electron microscope (SEM) or an optical microscope (OM). The above Rc can mean the average value after measuring the radii of curvature at the first to fourth corner portions C1, C2, C3, C4 respectively. The above Wm can mean the average value of the widths in the third direction of the margin portions 114 and 115 measured at five equally spaced points in the second direction. Also, the above Wm can mean the average width in the third direction of each of the first margin portion 114 and the second margin portion 115.

[0062] The size of the multilayer electronic component 100 does not need to be particularly limited. For example, the maximum length of the multilayer electronic component 100 in the second direction can be 0.6 mm to 1.6 mm, and the maximum width of the multilayer electronic component 100 in the third direction can be 0.3 mm to 0.8 mm, but the present invention is not limited thereto.

[0063] The average thickness of the dielectric layer 111 does not particularly need to be limited. However, in order to achieve miniaturization and high capacitance of the multilayer electronic component 100, the average thickness of the dielectric layer 111 can be 0.1 μm or more and 0.6 μm or less. The average thickness of the dielectric layer 111 means the size of the dielectric layer 111 in the first direction. The average thickness of the dielectric layer 111 can be measured by scanning the cross-sections of the main body 110 in the first and second directions with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, after measuring the thicknesses at a number of points of one dielectric layer 111, for example, 30 points at equal intervals in the second direction, the average thickness of the dielectric layer 111 can be measured by taking the average value. The above 30 points can be specified, for example, at the central portions in the second direction of the main portions 121a and 122a. On the other hand, after performing such average value measurement on 10 dielectric layers 111, the average thickness of the dielectric layer 111 can be further generalized by measuring the average value.

[0064] The average thicknesses of the cover portions 112 and 113 do not particularly need to be limited. However, for miniaturization and high capacitance of the multilayer electronic component for miniaturization and high capacitance, the average thicknesses of the cover portions 112 and 113 can be 20 μm or less, but the present invention is not limited thereto. Here, the average thicknesses of the cover portions 112 and 113 mean the respective average thicknesses of the first cover portion 112 and the second cover portion 113. The average thickness tc of the cover portions 112 and 113 can mean the average size of the cover portions 112 and 113 in the first direction, and can be a value obtained by averaging the sizes in the first direction measured at 5 points at equal intervals in the second direction in the cross-section in the first and second directions passing through the center in the third direction of the main body 110.

[0065] Hereinafter, with reference to FIG. 8, an example of a method for manufacturing the multilayer electronic component 100 according to an embodiment of the present invention will be described.

[0066] First, a ceramic slurry containing ceramic powder, an organic solvent, and a binder is manufactured, and the slurry is applied and dried on a carrier film to provide a ceramic green sheet 211. The ceramic green sheet 211 can form a dielectric layer 111 by firing. The ceramic powder is not particularly limited as long as sufficient capacitance can be obtained. For example, a barium titanate-based material, a lead composite perovskite-based material, a strontium titanate-based material, etc. can be used. As an example of the above ceramic powder, BaTiO 3 、BaTiO 3 in which Ca (calcium), Zr (zirconium), etc. are partially solid-solved (Ba 1-x Ca x )TiO 3 (0 < x < 1), Ba(Ti 1-y Ca y )O 3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O 3 (0 < x < 1, 0 < y < 1) or Ba(Ti 1-y Zr y )O 3 (0 < y < 1), etc. can be mentioned. Ethanol, etc. can be used as the above organic solvent, polyvinyl butyral, etc. can be used as the above binder, and the above organic solvent and binder can be known substances used in the industry.

[0067] Next, a first internal electrode pattern 221 or a second internal electrode pattern 222 is printed on the ceramic green sheet 211. The internal electrode patterns 221, 222 can form internal electrodes 121, 122 by firing. The internal electrode patterns 221, 222 can be formed by printing a conductive paste for internal electrodes containing metal powder, binder, solvent, etc. on the ceramic green sheet 211 using a screen printing method, a gravure printing method, etc.

[0068] Specifically, a plurality of first internal electrode patterns 221 arranged at predetermined intervals on the first ceramic green sheet can be formed. The plurality of first internal electrode patterns 221 can have a strip shape and can be formed parallel to each other. Also, a plurality of second internal electrode patterns 222 arranged at predetermined intervals on the second ceramic green sheet can be formed. The plurality of second internal electrode patterns 222 can have a strip shape and can be formed parallel to each other.

[0069] Next, a plurality of hole portions 205 can be formed in the first internal electrode pattern 221, and a plurality of hole portions 206 can be formed in the second internal electrode pattern 222. The hole portions 205 and 206 can mean regions where no internal electrode pattern is formed. The hole portions 205 and 206 can be bisected by a first cutting line CL1 parallel to the width direction (third direction) and can be bisected by a second cutting line CL2 parallel to the length direction (second direction). The shape of the hole portions 205 and 206 does not need to be particularly limited, but in order to prevent problems such as printing bleeding, it is preferably circular or elliptical. On the other hand, the maximum length of the hole portions 205 and 206 in the second direction is preferably longer than the distance in the second direction between the internal electrode patterns 221 and 222.

[0070] The outer peripheries 201, 202 of the first internal electrode pattern 221 and the outer peripheries 203, 204 of the second internal electrode pattern 222 shown in FIG. 8 can have a saddle shape that is thicker than the remaining portions of the internal electrode patterns 221 and 222.

[0071] The outer peripheries 201, 202 of the first internal electrode pattern 221 and the outer peripheries 203, 204 of the second internal electrode pattern 222 can correspond to the end portions E12, E22 separated from the lead portions 121b, 122b of the main portions 121a, 122a. That is, the first saddle portions 21a, 22a shown in FIG. 6 can be formed from the outer peripheries 201, 202 of the first internal electrode pattern 221 and the outer peripheries 203, 204 of the second internal electrode pattern 222.

[0072] Further, the outer peripheries of the hole portions 205 and 206 shown in FIG. 8 can have a saddle shape that is thicker than the remaining portions of the internal electrode patterns 221 and 222.

[0073] The outer periphery of the hole portion 205 of the first internal electrode pattern 221 and the outer periphery of the hole portion 206 of the second internal electrode pattern 222 can correspond to the third-direction side ends E13 and E23 of the lead portions 121b and 122b. That is, the second saddle portions 21b and 22b shown in FIG. 6 can be formed from the outer peripheries of the hole portions 205 and 206 of the internal electrode patterns 221 and 222.

[0074] Next, a ceramic laminate is formed by alternately laminating a first ceramic green sheet printed with the first internal electrode pattern 221 and a second ceramic green sheet printed with the second internal electrode pattern 222 shown in FIG. 8. A predetermined number of cover portion forming sheets on which no internal electrode pattern is printed can be laminated on the upper and lower portions of the ceramic laminate. The cover portion forming sheet can form the cover portions 112 and 113 by firing.

[0075] Next, after pressing the ceramic laminate, a ceramic chip can be obtained by cutting along the cutting lines CL1 and CL2. Next, a margin portion forming sheet can be attached to both side surfaces in the third direction of the ceramic chip. The margin portion forming sheet can form the margin portions 114 and 115 by firing.

[0076] After that, when the ceramic chip to which the margin portion forming sheet is attached is fired, a main body 110 including the dielectric layer 111 and the internal electrodes 121 and 122 shown in FIGS. 1 to 3 can be formed. The firing temperature for forming the main body 110 does not need to be particularly limited, but for example, it can be performed at a temperature of 1100° C. or higher and 1300° C. or lower. After that, a barrel polishing process or the like can be performed to round the corner portions C1, C2, C3, and C4 of the main body 110.

[0077] Next, the external electrodes 131 and 132 can be formed. After dipping the main body 110 into a conductive paste containing metal powder and glass, the first electrode layers 131a and 132a can be formed by firing. The firing temperature for forming the first electrode layers 131a and 132a does not need to be particularly limited, but can be, for example, 700°C to 900°C.

[0078] After that, the second electrode layers 131b and 132b can be formed on the first electrode layers 131a and 132a. The method for forming the second electrode layers 131b and 132b does not need to be particularly limited, and for example, an electrolytic plating method and / or an electroless plating method can be used.

[0079] However, the above-described manufacturing method is an example, and the manufacturing method of the multilayer electronic component 100 is not limited to the above-described manufacturing method.

[0080] (Experimental Example) A sample chip was prepared by the above-described manufacturing method. Specifically, a ceramic green sheet was manufactured using a ceramic slurry containing BaTiO 3 powder, and an internal electrode pattern was printed on the ceramic green sheet using a conductive paste containing Ni powder. Also, the first metal layer of the sample chip was formed with a conductive paste containing Cu powder, and the second metal layer of the sample chip had a structure in which a Ni plating layer and a Sn plating layer were sequentially laminated.

[0081] The sample chip was manufactured in the 1005 standard (length: about 1.0 mm, width: about 0.5 mm, thickness: about 0.5 mm), the width W2 of the main part was 600 μm, the distance Wm from the side end in the third direction of the main part to the fifth or sixth surface was about 14 μm, the curvature radius Rc of the corner part was about 15 μm, and the maximum length Lm of the margin region was about 40 μm.

[0082] Next, after preparing 10 sample chips for each sample number, the cross-sections in the second and third directions polished to the central part in the first direction of each sample chip were observed with an optical microscope (OM) at a magnification of 500 times or more. Thereafter, Lo was measured at the side end in the third direction of a total of four lead parts, and the average value was obtained. After performing such average value measurement on 10 sample chips, the final average value was described in Table 1 below. Similarly, after measuring W1 and W2 with 10 sample chips respectively, the average values were described in Table 1 below. For sample numbers 1 to 3 where Lo is 0 μm, there is no overlapping region as in the comparative examples shown in FIGS. 9 and 10.

[0083] Next, for the sample chips of each sample number, the presence or absence of crack (A / C crack) generation between the capacitance forming part and the cover part was measured. After preparing 50 sample chips for each test number, the cross-sections in the first and second directions passing through the center in the third direction of the sample chips were observed, and when even one sample chip with a lift of 100 nm or more was observed between the capacitance forming part and the cover part, it was judged as defective (NG), and when none occurred, it was judged as normal (OK).

[0084] Also, for a total of 30 sample chips for each sample number, the average value of the breakdown voltage, the standard deviation (Stdv, Standard deviation) of the breakdown voltage, and the coefficient of variation (CV, coefficient of variation) of the breakdown voltage were measured under the conditions of a voltage increase rate of 20 V / sec and a current limit of 20 mA. Thereafter, when all of the average value of the breakdown voltage is 90 V or more, the standard deviation of the breakdown voltage is 12 V or less, and the coefficient of variation of the breakdown voltage is 12.5% or less are satisfied, it was judged as normal (OK), and when even one is not satisfied, it was judged as defective (NG).

[0085]

Table 1

[0086] Referring to Table 1 above, it can be confirmed that sample numbers 3, 6, 9, and 12 with a W1 / W2 ratio exceeding 0.75 have A / C cracks. Also, for sample numbers 1 to 3 where the lead part has no overlapping area, it can be confirmed that the characteristics of the breakdown voltage deteriorate.

[0087] The present invention is not limited by the above-described embodiments and the attached drawings, but is intended to be limited by the attached claims. Therefore, various forms of substitution, modification, and change can be made by those having ordinary knowledge in the technical field without departing from the technical idea of the present invention described in the claims, and this can also be said to belong to the scope of the present invention.

[0088] Note that the expression "one embodiment" does not mean the same embodiment, but is provided to emphasize and explain each different unique feature. However, the above-presented one embodiment does not exclude being realized in combination with the features of other embodiments. For example, even if the matter described in a specific one embodiment is not described in another one embodiment, it can be understood as an explanation related to the other one embodiment as long as there is no explanation contrary to or conflicting with that matter in the other one embodiment.

[0089] Furthermore, expressions such as first, second, etc. are used to distinguish one component from another component, and do not limit the order and / or importance, etc. of the corresponding components. In some cases, without departing from the scope of the rights, the first component can also be named the second component, and similarly, the second component can also be named the first component.

Explanation of Reference Numerals

[0090] 100 Multilayer Electronic Component 110 Body 111 Dielectric Layer 112, 113 Cover Part 114, 115 Margin Part C1, C2, C3, C4 Corner Part Internal electrodes 121, 122, 121', 122' Main portions 121a, 122a, 121a', 122a' Lead portions 121b, 122b, 121b', 122b' First saddle portions 21a, 22a, 21a', 22a' Second saddle portions 21b, 22b, 21b', 22b' Overlap region Ro Margin region Rm Non - overlap region Rn External electrodes 131, 132 First electrode layers 131a, 132a Second electrode layers 131b, 132b Ceramic green sheet 211 Internal electrode patterns 221, 222 Outer perimeters 201, 202, 203, 204 Hole portions 205, 206

Claims

1. a body including a dielectric layer and a plurality of internal electrodes alternately disposed with the dielectric layer in a first direction, the body including first and second surfaces facing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in the second direction, and fifth and sixth surfaces connected to the first, second, third and fourth surfaces and facing each other in the third direction; external electrodes disposed on the third surface and the fourth surface; the plurality of internal electrodes include a main portion and a lead portion extending from the main portion toward the third surface or the fourth surface and having a connection end contacting the external electrode, the lead portion has a width in the third direction that gradually decreases from the main portion toward the connection end, the main portion includes a first saddle portion disposed at an end portion spaced apart from the lead portion, and the lead portion includes a second saddle portion disposed at a side end in the third direction, the first saddle portion and the second saddle portion each have a thickness in the first direction greater than a central portion of the main portion in the second direction; the lead portion has an overlapping region that overlaps in the first direction with a main portion of another adjacent one of the plurality of internal electrodes.

2. 2. The multilayer electronic component according to claim 1, wherein W1 / W2 is 0.4 or more and 0.75 or less, where W1 is a width of the connection end in the third direction and W2 is a width of the main portion in the third direction.

3. 2. The multilayer electronic component according to claim 1, wherein the maximum length of the overlapping region in the second direction is Lo, and the Lo is 25 μm or more.

4. 4. The multilayer electronic component according to claim 3, wherein said Lo is 75 μm or less.

5. 2. The multilayer electronic component according to claim 1, wherein when a maximum thickness of the first saddle portion in the first direction is t1 and an average thickness of a central portion of the main portion in the second direction is te, a ratio of t1 to te (t1 / te) is 1.045 or more and 1.085 or less.

6. When the area of ​​the lead portion excluding the overlapping area is defined as a margin area, 2. The multilayer electronic component according to claim 1, wherein the maximum length of the margin region in the second direction is not less than 5 μm and not more than 45 μm.

7. 2. The multilayer electronic component according to claim 1, wherein a side end of each of said leads in said third direction has a curved shape.

8. the main portion includes a non-overlapping region that does not overlap with another adjacent one of the plurality of internal electrodes in the first direction, 2. The multilayer electronic component according to claim 1, wherein a ratio of an area of ​​the non-overlapping region to a total area of ​​the main portion is 0.8% or more and 1.5% or less.

9. 9. The multilayer electronic component according to claim 8, wherein the non-overlapping regions are disposed on both ends in the third direction of an end of the main portion separated from the lead portion.

10. the main body has corner portions having rounded shapes connecting the third surface and the fifth surface, the third surface and the sixth surface, the fourth surface and the fifth surface, and the fourth surface and the sixth surface, The multilayer electronic component according to claim 1 , wherein the connection end is spaced apart from the corner portion.

11. When the radius of curvature of the corner portion is Rc and the distance from the side end of the main portion in the third direction to the fifth surface or the sixth surface is Wm, The multilayer electronic component according to claim 10 , wherein Rc and Wm satisfy Rc>Wm.

12. 12. The multilayer electronic component according to claim 11, wherein Rc and Wm satisfy Rc≦22 μm and Wm≦20 μm.

13. a body including a dielectric layer and a plurality of internal electrodes alternately disposed with the dielectric layer in a first direction, the body including first and second surfaces facing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in the second direction, and fifth and sixth surfaces connected to the first, second, third and fourth surfaces and facing each other in the third direction; external electrodes disposed on the third surface and the fourth surface; the plurality of internal electrodes include a main portion and a lead portion extending from the main portion toward the third surface or the fourth surface and having a connection end contacting the external electrode, the lead portion has a width in the third direction gradually decreasing from the main portion toward the connection end, and has an overlapping region overlapping in the first direction with a main portion of another adjacent internal electrode among the plurality of internal electrodes, a width W1 of the connection end in the third direction and a width W2 of the main portion in the third direction, the width W1 / W2 being 0.4 or more and 0.75 or less.

14. The multilayer electronic component according to claim 13 , wherein when the maximum length of the overlapping region in the second direction is Lo, the Lo is 25 μm or more.

15. 15. The multilayer electronic component according to claim 14, wherein the Lo is 75 μm or less.

16. When the area of ​​the lead portion excluding the overlapping area is defined as a margin area, 16. The multilayer electronic component according to claim 13, wherein the maximum length of the margin region in the second direction is not less than 5 μm and not more than 45 μm.

17. the main portion includes a non-overlapping region that does not overlap with another adjacent one of the plurality of internal electrodes in the first direction, 16. The multilayer electronic component according to claim 13, wherein an area ratio of the non-overlapping region to a total area of ​​the main portion is 0.8% or more and 1.5% or less.

18. 18. The multilayer electronic component according to claim 17, wherein the non-overlapping regions are disposed on both ends in the third direction of an end of the main portion separated from the lead portion.

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