Level adjustment device

Abstract

To provide a level adjustment device capable of reducing the time required for level adjustment of a processing apparatus.SOLUTION: A level adjustment device (50) adjusts the level of a processing apparatus (1) that processes a wafer (W) held by a holding surface (34) of a chuck table (30) by operating four jacks (20) arranged between an installation surface (F) on which the processing apparatus is installed and itself. The level adjustment device includes: a level gauge (85) that is placed on the holding surface of the chuck table to measure the level in the XY direction relative to the horizontal surface; operation units (51, 511-514) that are attached to the respective jacks to expand or contract a distance between the installation surface and the processing apparatus by operating the respective jacks; and a control unit (90) that reads the values from the level gauge and controls the operation units attached to the corresponding jacks.SELECTED DRAWING: Figure 8

Description

Technical Field

[0001] The present invention relates to a level adjustment device that adjusts the level by means of a jack of a processing device.

Background Art

[0002] Patent Documents 1, 2, and 3 disclose a level (level meter) for checking the level. For example, when performing a level adjustment operation of a processing device, an operator operates at least two of a plurality of jacks that constitute the legs of the processing device while observing the bubble of the level placed on the chuck table of the processing device.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Patent Document 3

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the above-described level adjustment operation, it is necessary for an operator to perform both the operation of the jack and the reading of the value of the level, and there is a problem that it takes time to adjust the level of the processing device.

[0005] In view of this point, the present invention has been made, and one of the objects is to provide a level adjustment device that can shorten the time required for adjusting the level of a processing device.

Means for Solving the Problems

[0006] A level adjusting device according to an aspect of the present invention is a level adjusting device that operates at least three jacks arranged between an installation surface on which a processing device for holding and processing a workpiece by a holding surface of a chuck table is installed, and adjusts the level of the processing device. The level adjusting device includes a level meter that is placed on a reference surface pre-arranged on the holding surface or in the processing device and measures the level in the XY direction with respect to the horizontal plane, an operation unit that is attached to each jack and operates each jack to expand and contract the distance between the installation surface and the processing device, and a control unit that reads the value of the level meter and controls the operation unit attached to the corresponding jack.

Effect of the Invention

[0007] According to the present invention, since the control unit controls each operation unit and operates a plurality of jacks to adjust the level of the processing device, it is possible to reduce or eliminate the manual work by the operator and shorten the time required for level adjustment.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Figure 13

[0009] Hereinafter, with reference to the accompanying drawings, a processing apparatus to which the level adjustment apparatus according to each embodiment is applied will be described. Note that the processing apparatus according to each embodiment is not limited to the configuration shown below, and can be changed as appropriate.

[0010] [First Embodiment] FIG. 1 is a perspective view of the processing apparatus of the first embodiment. First, with reference to FIG. 1, the overall configuration of the processing apparatus 1 will be described. The X-axis direction, Y-axis direction, and Z-axis direction shown in FIG. 1 are perpendicular to each other. The X-axis direction and the Y-axis direction are substantially horizontal directions, and the Z-axis direction is the vertical direction (up and down direction). Also, in the following figures, the front side in the X-axis direction may be referred to as the +X side, the rear side as the -X side, the left side in the Y-axis direction as the +Y side, the right side as the -Y side, the upper side in the Z-axis direction as the +Z side, and the lower side as the -Z side.

[0011] The processing apparatus 1 can employ, for example, the grinding apparatus shown in FIG. 1. Note that the processing apparatus 1 of the present invention is not limited to a grinding apparatus, and other processing apparatuses that are installed on the installation surface F and hold and process the wafer W (workpiece) by the holding surface 34 of the chuck table 30 can also be employed.

[0012] The wafer W is an example of a workpiece, and is, for example, a substantially circular semiconductor wafer. Devices (not shown) are formed on the surface W1 of the wafer W. The surface W1 of the wafer W is directed downward in FIG. 1 and is protected by attaching a protective tape T. The back surface W2 of the wafer W is a surface to be ground. Note that the wafer W may be any plate-shaped workpiece to be ground, such as a semiconductor substrate such as silicon or gallium arsenide, an inorganic material substrate such as ceramic, glass, or sapphire, or even a package substrate of a semiconductor product.

[0013] The processing apparatus 1 includes a substantially rectangular apparatus base 11 and a column 13 extending upward from the rear (-X side) of the apparatus base 11. Further, the processing apparatus 1 includes a jack 20 disposed between the lower surface of the apparatus base 11 and the installation surface F. The jack 20 also functions as a leg of the processing apparatus 1 and is shown in a simplified block shape in FIG. 1. The specific configuration of the jack 20 will be described later. The jacks 20 are respectively provided in the vicinity of the four corners of the apparatus base 11 when viewed from above the processing apparatus 1 (one is not shown in FIG. 1), and four are arranged as a whole for the processing apparatus 1. Further, the jack 20 is provided on both sides in the Y-axis direction on both sides in the X-axis direction of the apparatus base 11.

[0014] The processing apparatus 1 further includes a chuck table 30 that sucks and holds the wafer W. In the processing apparatus 1, a rectangular opening extending in the X-axis direction is formed in the upper surface of the apparatus base 11. This opening is covered with a moving plate 31 movable in the X-axis direction together with the chuck table 30 and a bellows-shaped waterproof cover 32. Below the waterproof cover 32, a table moving mechanism (not shown) for moving the chuck table 30 in the X-axis direction is provided.

[0015] The chuck table 30 is connected to table rotation means (not shown) and can rotate about an axis oriented in the Z-axis direction by driving the table rotation means. The chuck table 30 has a holding surface 34 formed of a porous ceramic material, and the wafer W is sucked and held by the negative pressure generated on the holding surface 34.

[0016] The processing apparatus 1 includes a lifting mechanism 36 provided on the column 13 and a grinding mechanism (processing mechanism) 40 that moves in the vertical direction (Z-axis direction) by the lifting mechanism 36. By driving the lifting mechanism 36, the grinding mechanism 40 can be moved closer to and away from the chuck table 30.

[0017] The grinding mechanism 40 is attached to the front surface of the lifting table 37 in the lifting mechanism 36 via a housing 41, and is configured to rotate the grinding wheel 43 by a spindle unit 42. The spindle unit 42 is, for example, an air spindle, and rotatably supports a spindle shaft 44 via high-pressure air inside a casing. The spindle shaft 44 is a shaft body extending in the Z-axis direction.

[0018] A mount 45 is connected to the tip (lower end) of the spindle shaft 44, and the grinding wheel 43 is mounted on the mount 45. A plurality of grinding abrasives 46 are provided annularly on the lower surface side of the grinding wheel 43. The grinding mechanism 40 grinds the back surface W2 of the wafer W held by suction on the chuck table 30 with the grinding abrasives 46.

[0019] In the grinding process of the wafer W, the chuck table 30 that sucks and holds the wafer W is positioned at the processing position below the grinding mechanism 40. Subsequently, the grinding mechanism 40 is lowered by the lifting mechanism 36 to bring the grinding abrasives 46 into contact with the back surface W2 of the wafer W, and the back surface W2 side is ground while pressing the wafer W with the high-speed rotating grinding abrasives 46. When the back surface W2 side of the wafer W is ground to a desired thickness, the grinding mechanism 40 is lifted by the lifting mechanism 36 to separate the grinding abrasives 46 from the wafer W on the chuck table 30, and the grinding process is terminated.

[0020] Figure 2A is a schematic perspective view of the jack, and Figure 2B is an exploded view of Figure 2A. Figures 2A and 2B show that the jack 20 includes a rectangular base 21 having a thickness in the vertical direction, a mounting plate (mounting portion) 22 disposed above the base 21, and a lifting operation portion 23 disposed between the base 21 and the mounting plate 22.

[0021] The mounting plate 22 is formed in a disc shape. The upper surface of the mounting plate 22 serves as a mounting surface on which the apparatus base 11 of the processing apparatus 1 is mounted, and a convex portion protruding upward is formed at the center of the mounting surface. Such a convex portion can be fitted into a recess or a hole (not shown) formed on the lower surface of the apparatus base 11.

[0022] The lifting operation portion 23 includes a screw hole 25 formed in the base 21, a screw shaft 26 extending in the vertical direction and screwed into the screw hole 25, and a handle 27 provided on the upper portion of the screw shaft 26.

[0023] The handle 27 includes a block-shaped protrusion 28 protruding outward. Four protrusions 28 are provided at 90° intervals around the axis of the screw shaft 26. The upper surface of the handle 27 is formed in a bowl shape and recessed so that the mounting plate 22 can be mounted inside.

[0024] In the jack 20, by rotating the handle 27 with the lifting operation portion 23, the screw shaft 26 rotates in the screw hole 25, and due to the screw action, the screw shaft 26, the handle 27, and the mounting plate 22 move up and down. Therefore, by adjusting the rotation direction and the rotation amount of the handle 27, the vertical position of the apparatus base 11 mounted on the mounting plate 22 can be adjusted. Further, when viewed from above, when the handle 27 is rotated clockwise, it can be adjusted in the upward direction, and when the handle 27 is rotated counterclockwise, it can be adjusted in the downward direction.

[0025] FIG. 3 is a schematic perspective view of a preparatory state for attaching the operation unit to the jack. FIG. 4 is a schematic perspective view of a state immediately before attaching the operation unit to the jack. FIG. 5 is a schematic perspective view of a state where the operation unit is attached to the jack. As shown in FIGS. 3 to 5, the jack 20 is provided so that the operation unit 51 constituting the level adjusting device 50 can be attached thereto.

[0026] The operation unit 51 is attached to each of the four jacks 20 of the device base 11 (see FIG. 1). In other words, the level adjusting device 50 is configured to include four operation units 51. The four operation units 51 can be arranged with their orientations appropriately changed according to the position of the jack 20 and the like. In FIGS. 3 to 5, as an example, the operation unit 51 attached to the jack 20 provided on the -Y side on the -X side of the device base 11 among the four jacks 20 will be described.

[0027] The operation unit 51 includes a unit base 52, a clamp portion 53, and an operation portion 60.

[0028] The unit base 52 is formed in a rectangular shape having a thickness in the vertical direction. The clamp portion 53 is provided on the mounting surface 54 which is the +X side surface among the four side surfaces of the unit base 52.

[0029] The clamp portion 53 includes two clamp shafts 56 extending in a direction orthogonal to the mounting surface 54 (the X-axis direction in FIGS. 3 to 5), a clamp piece 57 provided at the tip of each clamp shaft 56, and a clamp handle 58 provided at an intermediate portion of one of the clamp shafts 56.

[0030] In the Y-axis direction, the two clamp shafts 56 are provided at an interval that allows the base 21 of the jack 20 to be disposed therebetween. Each clamp shaft 56 is rotatably supported about a central axis with respect to the unit base 52. Also, the length of the clamp shaft 56 extending in the X-axis direction is set to be substantially the same as the width of the base 21 of the jack 20 in the X-axis direction.

[0031] The clamping piece 57 is oriented in the vertical direction. For example, in the states shown in FIGS. 3 and 4, it is provided in a shape where the vertical width is larger than the width in the Y-axis direction. Here, in the states shown in FIGS. 3 and 4, the lower end portion of the clamping piece 57 is taken as the base portion, and the upper end portion is taken as the tip portion. The clamping piece 57 is connected to the clamping shaft 56 at the base portion and is arranged such that the tip side protrudes from the clamping shaft 56.

[0032] In the state shown in FIG. 3, the base 21 of the jack 20 can be passed between the two clamping pieces 57, and the mounting surface 54 of the unit base 52 can be brought into contact with the -X side surface of the base 21 as shown in FIG. 4. From this state, when each clamping shaft 56 is rotated about 90° in the direction of the arrow in FIG. 4, as shown in FIG. 5, the tips of the respective clamping pieces 57 face each other and approach. As a result, the two clamping pieces 57 come into contact with the -X side surface of the base 21, and the base 21 of the jack 20 can be clamped by the mounting surface 54 of the unit base 52 and the two clamping pieces 57.

[0033] The clamping handle 58 is formed in a rod shape orthogonal to the clamping shaft 56 and is provided so as to be usable as a gripping portion for an operator. In the states shown in FIGS. 3 and 4 where the tip side of the clamping piece 57 is upward, the clamping handle 58 is horizontal (outward). On the other hand, as shown in FIG. 5, when the clamping handle 58 is set upward, it becomes operable at a position where the tips of the respective clamping pieces 57 face each other. Thereby, by operating the clamping handle 58, the mounting and dismounting of the base 21 of the jack 20 by the clamping portion 53 are operated.

[0034] Here, a height measuring device 59 is provided at the tip of the clamping handle 58. The height measuring device 59 has a light projecting portion 591 and a light receiving portion 592, and is constituted by, for example, a laser displacement meter using a spot laser beam. The light projecting portion 591 projects measurement light toward the lower surface of the device base 11 located above. The light receiving portion 592 receives the measurement light reflected by the lower surface of the device base 11 and measures the height (position in the Z-axis direction) of the device base 11.

[0035] The operation unit 60 is mainly disposed above the unit base 52 and has a structure for operating the lifting operation unit 23 of the jack 20. The operation unit 60 has an output shaft 61, a drive shaft 62, a first rotating body 63, and a second rotating body 64 that respectively rotate about an axis extending in the vertical direction.

[0036] The operation unit 60 further includes a motor 65, and the output shaft 61 is configured as a part of the motor 65. The rotational driving force of the motor 65 is transmitted to the drive shaft 62 by an output shaft pulley 66 provided on the output shaft 61, a drive shaft pulley 67 provided on the drive shaft 62, and an endless belt 68 wound around these pulleys 66 and 67.

[0037] The drive shaft pulley 67 is provided at an intermediate portion in the vertical direction of the drive shaft 62. A first driving pulley 71 and a second driving pulley 72 are provided at the upper portion of the drive shaft 62. An endless first belt 73 is wound around the first driving pulley 71, and an endless second belt 74 is wound around the second driving pulley 72.

[0038] The first rotating body 63 includes a first rotating shaft 76, a first driven pulley 77 provided at the upper portion of the first rotating shaft 76, and a first gear 78 provided at an intermediate portion in the vertical direction of the first rotating shaft 76.

[0039] The first driven pulley 77 has the first belt 73 wound around the first driving pulley 71 wound around it, and the rotational driving force of the drive shaft 62 is transmitted to the first rotating body 63 by the first driving pulley 71, the first belt 73, and the first driven pulley 77.

[0040] The first gear 78 is formed by disposing four teeth at every 90° in the circumferential direction on the outer periphery of a disk. The tips of the teeth of the first gear 78 are formed in a semi-circular arc shape when viewed from above.

[0041] The second rotating body 64 has a configuration similar to that of the first rotating body 63 and is provided side by side with the first rotating body 63 in the Y-axis direction. The second rotating body 64 includes a second rotating shaft 80, a second driven pulley 81 provided at the upper part of the second rotating shaft 80, and a second gear 82 provided at the middle part in the vertical direction of the second rotating shaft 80.

[0042] A second belt 74 wound around the second driving pulley 72 is wound around the second driven pulley 81, and the rotational driving force of the driving shaft 62 is transmitted to the second rotating body 64 by the second driving pulley 72, the second belt 74, and the second driven pulley 81.

[0043] The second gear 82 is provided with the same shape as the first gear 78. Similar to the first gear 78, four teeth are arranged at every 90° in the circumferential direction on the outer periphery of the disc. The second gear 82 is arranged below the first gear 78, and the respective teeth located between the first gear 78 and the second gear 82 are arranged so as to be non-contact while overlapping in the vertical direction. The teeth located on the +X side of each of the gears 78 and 82 protrude from the unit base 52 to the +X side and are provided so as to be able to contact the protrusion 28 of the handle 27 in the jack 20.

[0044] When the output shaft 61 is rotated by driving the motor 65 at the operation unit 60, the rotational driving force of the motor 65 is transmitted to the first rotating body 63 and the second rotating body 64 via the driving shaft 62, each pulley 66, 67, 71, 72, 77, 81, and each belt 68, 73, 74. The first rotating body 63 and the second rotating body 64 are both rotated clockwise by the clockwise rotation of the output shaft 61, and both are rotated counterclockwise by the counterclockwise rotation of the output shaft 61.

[0045] Figures 6 and 7 are explanatory diagrams of the operation of the jack by the operation unit. Figure 6 shows the operation when adjusting the position in the upward direction by the jack 20, and Figure 7 shows the operation when adjusting the position in the downward direction by the jack 20. As shown in Figure 6, when the first rotating body 63 and the second rotating body 64 are rotated clockwise as viewed from above at the operation unit 60, at least one of the first gear 78 and the second gear 82 contacts the handle 27 and transmits the rotational force, rotating the handle 27 counterclockwise. Due to the rotation of such a handle 27, the mounting plate 22 and the device base 11 (not shown in Figure 6, see Figure 1) can be positionally adjusted to rise by the screw action between the screw hole 25 and the screw shaft 26.

[0046] On the other hand, as shown in Figure 7, when the first rotating body 63 and the second rotating body 64 are rotated counterclockwise as viewed from above at the operation unit 60, at least one of the first gear 78 and the second gear 82 contacts the handle 27 and transmits the rotational force, rotating the handle 27 clockwise. Due to the rotation of such a handle 27, the mounting plate 22 and the device base 11 (not shown in Figure 7, see Figure 1) can be positionally adjusted to descend by the screw action between the screw hole 25 and the screw shaft 26. In this way, by rotating the handle 27 of the jack 20 by the operation unit 51, the device base 11 in the processing device 1 can be raised and lowered, and the distance between the installation surface F and the device base 11 can be expanded and contracted.

[0047] Figure 8 is a schematic configuration diagram of the level adjustment device. The level adjustment device 50 includes four of the above-described operation units 51, and also includes a level meter 85 and a control unit 90. The four operation units 51 are constituted by a first operation unit 511, a second operation unit 512, a third operation unit 513, and a fourth operation unit 514 that are attached to the four jacks 20 described above.

[0048] The level meter 85 is placed on the holding surface 34 of the chuck table 30 and used. The level meter 85 measures the level in the XY direction with respect to the horizontal plane (XY plane) of the placed holding surface 34. More specifically, the level meter 85 is constituted by, for example, a spirit level or a level that can measure the inclination angle in two orthogonal axial directions, namely the X-axis direction and the Y-axis direction, and outputs the measured value to the control unit 90. In the present embodiment, the level meter 85 measures the inclination angle using a spirit level that indicates the horizontal direction by the air bubble B in the liquid indicating the center of gravity position.

[0049] Note that the position where the level meter 85 is placed may be changed as long as the level in the XY direction with respect to the horizontal plane at a predetermined location of the processing apparatus 1 can be measured. For example, a reference plane that is arranged in advance in the processing apparatus 1 may be provided near the column 13 or the like, and the level meter 85 may be placed on the reference plane.

[0050] The control unit 90 is constituted by a processor, a memory, etc. that execute various processes. The control unit 90 reads the value of the level meter 85 and controls the driving of the motors 65 of the respective operation units 511 to 514, for example, according to a control program stored in the memory, and raises and lowers the apparatus base 11 through the operation of the jack 20.

[0051] Note that the control unit 90 of the level adjustment device 50 may use a control unit (not shown) that comprehensively controls each part of the processing apparatus 1, or may have a separate configuration independent of the control unit. Further, the control unit 90 communicates with the level adjustment device 50 and the level meter 85 by wire or wirelessly.

[0052] Subsequently, the flow of the level adjustment method of the processing apparatus 1 using the level adjustment device 50 of the present embodiment will be described with reference to the flow of FIG. 9. FIG. 9 is a flowchart showing the flow of the level adjustment method in the first embodiment.

[0053] Here, it is assumed that the first operation unit 511, the second operation unit 512, the third operation unit 513, and the fourth operation unit 514 are attached to the four jacks 20. First, as shown in the flowchart of FIG. 9, step ST1 is implemented.

[0054] In step ST1, under the control of the control unit 90, the four operation units 511 to 514 are driven one by one, and the four jacks 20 are operated one by one to raise and lower the device base 11. At the same time, the control unit 90 reads the movement amounts of the bubble B in the X-axis direction and the Y-axis direction, which are the values measured by the level meter 85. The movement amounts read by the control unit 90 can also have the movement directions read according to the positive and negative of each axis direction.

[0055]

[0054] Then, in step ST1, the relationship between the driving amounts of the motors 65 in the respective operation units 511 to 514 and the movement amounts measured by the level meter 85 is input to and stored in the control unit 90. Thereby, at least one jack 20 (the corresponding jack 20) that requires operation from the four jacks 20 and the operation units 511 to 514 attached to the jack 20 are recognized according to the positions of the bubble B in the X-axis direction and the Y-axis direction, which are the values measured by the level meter 85. Also, by driving the motors 65 of the four operation units 511 to 514 respectively, the movement amount (including the movement direction) of the bubble B of the level meter 85 is recognized.

[0056] After the completion of step ST1, in step ST2, the measurement of the positions of the bubble B in the X-axis direction and the Y-axis direction by the level meter 85 and the reading of the measured values by the control unit 90 are performed continuously or intermittently. At the same time, based on the measured values of the level meter 85 read by the control unit 90 and the relationship stored in the control unit 90 in step ST1, the control unit 90 controls the driving amounts of the motors 65 of the respective operation units 511 to 514 so that the bubble B of the level meter 85 approaches the central position C. In this control, in order to bring the bubble B of the level meter 85 closer to the central position C, the driving amounts of at least one of the four operation units 511 to 514 are adjusted so as to appropriately operate the corresponding jack 20 that requires operation.

[0057] By performing step ST2, the bubble B of the level gauge 85 overlaps with the central position C, and the level of the holding surface 34 of the chuck table 30 in the processing apparatus 1 is adjusted so that the holding surface 34 becomes parallel to the horizontal plane (leveled). In step ST2, while the control unit 90 receives the value of the level gauge 85, the operation units 511 to 514 may be operated according to the value to perform leveling. That is, the control unit 90 may continuously jog-rotate the motors 65 of the operation units 511 to 514 to perform leveling. Further, the control unit 90 sets two rotation angles, for example, 180° as the rotation angle for rough adjustment and 30° as the rotation angle for fine adjustment, for the rotation angles of the motors 65 of the operation units 511 to 514. Until the bubble B of the level gauge 85 approaches the central position C, the operation units 511 to 514 are operated at the rotation angle for rough adjustment. When entering a predetermined range near the central position C, the operation units 511 to 514 may be switched to the fine adjustment angle and operated to perform leveling. That is, the control unit 90 may perform leveling by step-rotating the motors 65 of the operation units 511 to 514.

[0058] After completion of step ST2, as step ST3, the height of the apparatus base 11 in the processing apparatus 1 is measured by the height measuring instruments 59 in the four operation units 511 to 514, and the control unit 90 reads the measured value.

[0059] After completion of step ST3, as step ST4, the control unit 90 obtains the average value of the measured values of the height measuring instruments 59 in the four operation units 511 to 514. Then, the difference between the average value and the predetermined height of the apparatus base 11 stored in advance in the control unit 90 is obtained, and the driving of the motors 65 of the four operation units 511 to 514 is controlled so that the apparatus base 11 moves up and down via the jack 20 according to the difference. By performing step ST4, the apparatus base 11 moves up and down to a predetermined height, and the height of the apparatus base 11 can be adjusted.

[0060] Thus, according to the first embodiment, in step ST2, the control unit 90 controls the plurality of operation units 511 to 514 based on the measured value of the level gauge 85, and can adjust the level of the processing apparatus 1 by operating the four jacks 20. As a result, it is possible to eliminate or reduce the manual operation in which an operator operates the jack while reading the value of the level gauge as in the prior art, and it is possible to reduce the burden on the operator and shorten the time required for level adjustment.

[0061] In addition, the control unit 90 can also control the plurality of operation units 511 to 514 based on the measured value of the height measuring instrument 59, and adjust the height of the apparatus base 11. Therefore, with the level adjusting device 50 of the present embodiment, both level adjustment and height adjustment can be performed simultaneously or continuously, and the work efficiency and time can be shortened.

[0062] In addition, since the jack 20 can be clamped by the clamp unit 53, it is possible to facilitate and speed up the work of attaching the operation unit 51 to the jack 20.

[0063] [Second Embodiment] Next, a second embodiment of the present invention will be described with reference to FIGS. 10 to 13. In the following description, the same reference numerals may be used for the same or equivalent components as those in the first embodiment, and the description may be omitted or simplified.

[0064] FIG. 10A is a schematic perspective view of the jack of the second embodiment, and FIG. 10B is an exploded view of FIG. 10A. FIGS. 11A and 11B are schematic perspective views of the jack and the operation unit of the second embodiment. FIGS. 12A to 12C are schematic plan views of the jack and the operation unit of the second embodiment. In the second embodiment, the configurations of the jacks 20, 100 and the operation units 51, 120 are changed with respect to the first embodiment.

[0065] As shown in FIGS. 10A and 10B, the jack 100 of the second embodiment includes an intermediate block 102 provided with a threaded portion 101 formed of a hexagonal socket head bolt. Further, the jack 100 includes an upper block 103 disposed above the intermediate block 102 and a lower block 104 disposed below the intermediate block 102. The central axis position of the threaded portion 101 is oriented parallel to the horizontal direction.

[0066] The upper surface of the upper block 103 is a mounting surface on which the apparatus base 11 (see FIG. 11) of the processing apparatus 1 is placed, and the lower surface of the lower block 104 is placed on the installation surface F. The upper surface of the upper block 103 and the lower surface of the lower block 104 are each formed parallel to the horizontal direction. On the other hand, the upper surface of the intermediate block 102 and the lower surface of the upper block 103 are inclined with respect to the horizontal direction so that the screw head 105 side of the threaded portion 101 is higher while being in slidable surface contact. Also, the lower surface of the intermediate block 102 and the upper surface of the lower block 104 are inclined with respect to the horizontal direction so that the screw head 105 side of the threaded portion 101 is lower while being in slidable surface contact.

[0067] A hole 106 is formed in the lower block 104 so as to open the upper surface. Also, a hole 107 is formed in the upper block 103 so as to open the lower surface. Both end sides of a round shaft-shaped piece member 108 are inserted into the respective holes 106 and 107, and the piece member 108 is integrated with the lower block 104 and the upper block 103.

[0068] An elongated hole 110 extending parallel to the threaded portion 101 is formed in the intermediate block 102. The elongated hole 110 is formed to penetrate the intermediate block 102 in the vertical direction so that the male threaded portion of the threaded portion 101 is exposed. Also, the piece member 108 is inserted into the elongated hole 110, and the threaded portion 101 passes through the piece member 108 so as to be screwed thereinto. Therefore, by rotating the threaded portion 101, the piece member 108 can be relatively moved in the extending direction of the elongated hole 110 by a feed screw action.

[0069] In the jack 100, with the piece member 108 and the long hole 110 as guides, the middle block 102 between the upper block 103 and the lower block 104 is provided so as to be movable in the directions of arrows A1 and A2 shown in FIG. 10A. The movement of the middle block 102 is operated by rotating the screw portion 101. By moving the middle block 102 in the direction of arrow A1, the upper block 103 rises, and by moving the middle block 102 in the direction of arrow A2, the upper block 103 descends. Therefore, by adjusting the rotation direction and the rotation amount of the screw portion 101, the device base 11 placed on the upper block 103 can be raised and lowered to adjust the vertical position of the device base 11.

[0070] Here, in the jack 100, the base is constituted by the lower block 104, and the lifting operation unit is constituted by each configuration for lifting and lowering the upper block 103.

[0071] FIGS. 11A and 12A show the state in which the operation unit 120 is attached to the jack 100, FIGS. 11B and 12B show the state immediately before the operation unit 120 is attached to the jack 100, and FIG. 12C shows the preparation state for attaching the operation unit 120 to the jack 100. Also in the second embodiment, the operation unit 120 attached to the jack 100 provided on the -Y side on the -X side of the device base 11 will be described.

[0072] The operation unit 120 in the second embodiment includes a unit base 121, a clamp portion 122 that clamps the lower block 104, and an operation portion 140 that rotates the screw portion 101 of the jack 100 to operate the forward and backward movement of the middle block 102.

[0073] The unit base 121 includes a horizontal wall portion 123 placed on the installation surface F, and a pair of vertical wall portions 124 that rise from both sides in the X-axis direction at the +Y side end of the horizontal wall portion 123. The length of the unit base 121 in the X-axis direction is formed larger than the width of the jack 100 in the X-axis direction.

[0074] The clamping portion 122 includes a pair of stoppers 126 arranged in the X-axis direction (one is not shown in FIG. 11). Although detailed illustration is omitted, each stopper 126 has its -Y side end supported by the vertical wall portion 124 via a slide mechanism and is provided so as to be slidable and positionable in the X-axis direction. Thus, the clamping portion 122 can clamp the lower block 104 from the X-axis direction by the pair of stoppers 126.

[0075] Also, each stopper 126 is provided with a length corresponding to the length of the lower block 104 in the Y-axis direction while the tip is formed in a hook shape, and the lower block 104 can be clamped from the Y-axis direction by the tip of each stopper 126 and the +Y side end of the unit base 121. In this way, with the operation unit 120 placed on the installation surface F, the clamping portion 122 clamps from the X-axis and Y-axis directions, and the operation unit 120 is attached to the lower block 104 of the jack 100 by the clamping portion 122.

[0076] Each stopper 126 is provided with an L-shaped handle 128 for an operator to grip. Also, on the upper surface of the stopper 126, a height measuring device 130 having a light projecting portion 131 and a light receiving portion 132 is provided. The height measuring device 130 functions in the same manner as the height measuring device 59 of the first embodiment.

[0077] The operation portion 140 is mainly disposed above the unit base 121 and has a structure for rotating the screw portion 101 of the jack 100 to move the middle block 102 in the Y-axis direction. The operation portion 140 includes a motor 142 that rotates an output shaft 141 extending in the Y-axis direction (horizontal direction), and a slide wall 143 that supports the motor 142. Further, the operation portion 140 includes a pair of guide shafts 145 provided on each vertical wall portion 124, and a spring member 146 provided so that each guide shaft 145 passes therethrough. The operation portion 140 including the driving of the motor 142 is controlled by a control portion 90 (see FIG. 8).

[0078] The motor 142 is fixed to the -Y side surface of the slide wall 143. In the motor 142, the output shaft 141 is provided so as to penetrate the slide wall 143. The output shaft 141 extends coaxially with the threaded portion 101, and the tip thereof is formed in a hexagonal column shape and is provided so as to be fitted into the screw head 105 of the threaded portion 101 and can be rotated.

[0079] The slide wall 143 is disposed on the horizontal wall portion 123 of the unit base 121 and is provided so as to be slidable in the Y-axis direction on the -Y side of the vertical wall portion 124. Guide holes 148 for inserting the guide shafts 145 are formed on both sides of the slide wall 143 in the X-axis direction.

[0080] The pair of guide shafts 145 extend in the Y-axis direction and guide the slide movement of the slide wall 143 in the Y-axis direction by being inserted into the guide holes 148. A flange-shaped retaining portion 149 is formed at the -Y side end of the guide shaft 145.

[0081] The pair of spring members 146 are configured by compression coil springs, although they are omitted and shown by broken lines in the figure. The spring member 146 is disposed in a state of being sandwiched between the slide wall 143 and the retaining portion 149. The spring member 146 is compressed so that the length in the Y-axis direction becomes shorter, and exerts a force to constantly press the slide wall 143 and the motor 142 toward the +Y side.

[0082] FIGS. 13A and 13B are operation explanatory views of the jack by the operation unit of the second embodiment. FIG. 13A is a perspective view similar to FIG. 11A, and FIG. 13B is a plan view similar to FIG. 12A. When the output shaft 141 is rotated by driving the motor 142 in the operation unit from the states shown in FIGS. 11A and 12A, the threaded portion 101 of the jack 100 is rotationally operated. By such a rotational operation, the threaded portion 101 and the middle block 102 are moved in the Y-axis direction by the feed screw action between the threaded portion 101 and the piece member 108.

[0083] For example, as shown in FIGS. 13A and 13B, when the output shaft 141 and the screw portion 101 are rotated in the direction of the arrow in the figure by driving the motor 142, the middle block 102 is moved to the -Y side. Due to this movement, the thickness of the middle block 102 located between the upper block 103 and the lower block 104 becomes smaller, and the upper block 103 and the apparatus base 11 can be position-adjusted to descend.

[0084] On the other hand, when the output shaft 141 and the screw portion 101 are rotated in the direction opposite to the above, the middle block 102 is moved to the +Y side. Due to this movement, the thickness of the middle block 102 located between the upper block 103 and the lower block 104 becomes larger, and the upper block 103 and the apparatus base 11 can be position-adjusted to ascend. In this way, by rotating the screw portion 101 of the jack 100 by the operation unit 140, the apparatus base 11 in the processing apparatus 1 can be lifted and lowered, and the distance between the installation surface F and the apparatus base 11 can be expanded and contracted.

[0085] Incidentally, along with the movement of the middle block 102 in the Y-axis direction, the motor 142 and the slide wall 143 also move, and the length of the spring member 146 expands and contracts according to the movement. Since the motor 142 is constantly pushed to the +Y side by the elastic force of the spring member 146, even when the middle block 102 moves, the state where the tip of the output shaft 141 is fitted into the screw head 105 of the screw portion 101 is maintained.

[0086] In the second embodiment, the operation unit 120 can also be attached to the jack 100 as described above and can be operated, and the level adjustment and height adjustment of the processing apparatus 1 can be performed in the same manner as in the first embodiment.

[0087] Note that the present invention is not limited to the above-described embodiments, and various modifications can be made and implemented. In the above-described embodiments, the sizes, shapes, etc. illustrated in the attached drawings are not limited thereto, and can be appropriately changed within the range in which the effects of the present invention are exhibited. In addition, various modifications can be made and implemented as long as the scope of the object of the present invention is not deviated from.

[0088] For example, in the above-described first embodiment, the case where there are four jacks 20 in the processing apparatus 1 has been described, but the number may be changed to three or five or more.

[0089] Also, the jacks 20 and 100 can be placed on the installation surface F and the level of the processing apparatus 1 can be adjusted, and various changes are possible as long as they can be operated by the operation units 51 and 120 at the operation parts 60 and 140.

[0090] Also, the clamp parts 53 and 122 may have other configurations as long as they can clamp the jacks 20 and 100 and the operation units 51 and 120 can be attached.

Industrial Applicability

[0091] As described above, the present invention has the effect of shortening the time required for level adjustment by eliminating or reducing manual work by an operator when performing horizontal extraction of the processing apparatus.

Explanation of Reference Numerals

[0092] 1: Processing apparatus 20: Jack 21: Base 23: Lifting operation part 30: Chuck table 34: Holding surface 50: Level adjustment device 51: Operation unit 53: Clamp part 60: Operation part 85: Level meter 90: Control part 100: Jack 104: Lower block (base) 120: Operation unit 122: Clamp part 140: Operation part 511: First operation unit (operation unit) 512: Second operation unit (operation unit) 513: Third operation unit (operation unit) 514: Fourth operation unit (operation unit) F: Installation surface W: Wafer (workpiece)

Claims

1. A level adjusting device that operates at least three jacks arranged between an installation surface on which a processing device for holding and processing a workpiece by a holding surface of a chuck table is installed, and adjusts the level of the processing device, comprising: a level meter that is placed on the holding surface or a reference surface pre-arranged in the processing device and measures the level in the XY directions with respect to the horizontal plane; an operation unit that is attached to each of the jacks and operates each of the jacks to expand and contract the distance between the installation surface and the processing device; and a control unit that reads the value of the level meter and controls the operation unit attached to the corresponding jack. The level adjusting device is provided with these components.

2. The level adjusting device according to claim 1, wherein the operation unit includes a clamping unit that clamps a base of the jack and an operation unit that operates a lifting operation unit of the jack.

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