Method for recovering resin components from plated resin parts

Abstract

To provide a highly versatile recovery method that can easily and efficiently recover resin components from all types of plated resin components using a small amount of energy, with separating the plating component from the plated resin component with plating on the surface of the resin component and recovering the resin component, without requiring ultra-high temperature heating treatment, ultra-low temperature cooling treatment, or large, expensive, special equipment.SOLUTION: A method for recovering resin components by separating plated components from a plated resin component plated on the surface of a resin component, comprising a treatment step A of heating the plated resin component, a treatment step B of cooling it after the treatment step A, and a treatment step C of crushing it after the treatment step B. A method for recovering resin components from a resin member.SELECTED DRAWING: None

Description

Technical Field

[0001] The present invention relates to a method for recovering a resin component from a plated resin member. Specifically, the present invention relates to a method for efficiently separating a plating component from a plated resin member having a plating applied to the surface of a resin member by a simple method and recovering the resin component.

Background Art

[0002] Molded articles made of ABS resin are excellent in impact resistance, mechanical strength, and chemical resistance, and are therefore used in a wide range of fields such as office equipment, information and communication equipment, electronic and electrical equipment, household electrical appliances, vehicles such as automobiles, and construction. In addition, molded articles made of ABS resin have excellent plating appearance, high adhesion strength of the plating film, and excellent thermal cycle characteristics when subjected to plating treatment to form a plated product, and are therefore used in a variety of applications as plated resin members.

[0003] In recent years, due to the increasing concern about environmental problems, for waste materials and non-conforming products of plated resin members, the plating component and the resin component are separated, the resin component is recovered and recycled, and various methods therefor have been proposed. For example, Patent Document 1 proposes a method of exposing a plastic part with a coating film formed on the surface of the plastic part to a high-temperature atmosphere of 400°C or higher and 1000°C or lower to embrittle and remove the coating film. Further, Patent Document 2 proposes a method for recovering a resin component from a plated resin material by a fine pulverization step of pulverizing a coarsely pulverized product obtained by coarsely pulverizing a plated resin material by causing the coarsely pulverized product to collide with each other in a high-speed vortex, and a separation step of separating the plating component while dividing the pulverized product into a plurality of blocks according to the particle size.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Patent Document 2

[0005] All of the conventional methods require high-temperature heat treatment (for example, Patent Document 1) or cryogenic cooling treatment, or special equipment for grinding (for example, Patent Document 2). The processes are complicated, and expensive equipment and large amounts of energy consumption are required. There are problems such as not obtaining results commensurate with the recovery cost. In particular, in the method of directly grinding a plated resin member, the plating film may bite into the resin member during grinding, making it difficult to peel off from the resin member, resulting in poor recovery efficiency. In addition, in the conventional methods, although many studies have been conducted on the recovery of metals as plating components, almost no studies have been conducted on the recovery of resin components.

[0006] The present invention is a method for separating a plating component from a plated resin member having a plating applied to the surface of a resin member and recovering the resin component, without requiring ultra-high temperature heat treatment, cryogenic cooling treatment, or large, expensive, or special equipment, and with only a small amount of energy, and provides a highly versatile method for recovering a resin component from any plated resin member that can easily and efficiently recover the resin component. MEANS FOR SOLVING THE PROBLEMS

[0007] As a result of repeated studies to solve the above problems, the present inventor has found that the above problems can be solved by heating a plated resin member, then cooling it, and then grinding it. The present invention has been achieved based on such findings and has the following gist.

[0008] [1] A method for separating a plating component from a plated resin member having a plating applied to the surface of a resin member and recovering the resin component, A treatment step A of heating the plated resin member, After the treatment step A, a treatment step B of cooling, A method for recovering a resin component from a plated resin member, including a treatment step C of crushing after the treatment step B.

[0009] [2] The method for recovering a resin component from a plated resin member according to [1], wherein the heat treatment temperature in the treatment step A is 100 to 200 °C.

[0010] [3] The method for recovering a resin component from a plated resin member according to [1] or [2], wherein the cooling treatment temperature in the treatment step B is 0 °C or lower.

[0011] [4] The method for recovering a resin component from a plated resin member according to any one of [1] to [3], wherein the treatment step C is carried out continuously after the treatment step B under a temperature condition of 0 °C or lower.

[0012] [5] The method for recovering a resin component from a plated resin member according to any one of [1] to [4], including a treatment step E of dissolving and removing the plating component remaining on the surface of the resin member after the treatment step C.

[0013] [6] The method for recovering a resin component from a plated resin member according to [5], including a treatment step D of separating the plating component peeled from the resin member by crushing in the treatment step C between the treatment step C and the treatment step E.

[0014] [7] The method for recovering a resin component from a plated resin member according to any one of [1] to [6], wherein the resin component contains a styrene-based resin.

[0015] [8] The method for recovering a resin component from a plated resin member according to [7], wherein the resin component is a styrene-based resin.

[0016] [9] The method for recovering a resin component from the plated resin member according to [7] or [8], wherein the styrenic resin is an ABS resin.

[0017]

[10] The method for recovering a resin component from the plated resin member according to any one of [1] to [9], wherein the plated resin member is a vehicle part or a waste material thereof.

Advantages of the Invention

[0018] According to the method for recovering a resin component from the plated resin member of the present invention, without requiring ultra-high temperature heat treatment, cryogenic cooling treatment, or large, expensive, or special equipment, the resin component can be easily and efficiently recovered from any plated resin member with a small amount of energy. The resin component recovered by the present invention can be recycled alone or mixed with a new resin without significantly impairing the physical properties required for resin products. Further, according to the present invention, the metal component of the plating can also be separated and recovered from the resin component and recycled as a valuable metal.

Embodiments for Carrying Out the Invention

[0019] The embodiments of the present invention will be described in detail below.

[0020] The method for recovering a resin component from the plated resin member of the present invention is a method for separating a plating component from a plated resin member having a plating on the surface of the resin member and recovering the resin component, and sequentially performs the following treatment steps A to C. The method for recovering a resin component from the plated resin member of the present invention preferably includes the following treatment step E after treatment step C, and may further include the following treatment step D between treatment step C and treatment step E. Further, the following treatment step F may be included after treatment step E. Furthermore, the following treatment steps G and H may be included. Treatment step A: A treatment step of heating the plated resin member Treatment step B: A treatment step of cooling the plated resin member that has undergone treatment step A Treatment step C: A treatment step of crushing the plated resin member that has undergone treatment step B Treatment step D: A treatment step of separating the plating component peeled from the resin member by the crushing in treatment step C Treatment step E: A treatment step of dissolving and removing the plating component remaining on the surface of the resin member after treatment step C or treatment step D Treatment step F: A treatment step of washing and drying the resin member that has undergone treatment step E Treatment step G: A treatment step of polishing and separating the crushed product of the resin member obtained in treatment step C or treatment step D Treatment step H: A treatment step of pelletizing the resin component obtained in treatment step C, treatment step D, or treatment step G

[0021] In the present invention, treatment steps A to C or treatment steps A to D are carried out in the order of treatment step A → treatment step B → treatment step C or treatment step A → treatment step B → treatment step C → treatment step D. However, for treatment step E, treatment step F, treatment step G, and treatment step H, there are no particular restrictions on their order or combination. Depending on the treatment situation, the necessary treatment steps can be selected and carried out in any combination at any stage. Therefore, in the process up to treatment steps A to C or treatment steps A to D, or in the subsequent processes, after observing the separation state of the plating component, etc., the necessary treatment steps can be selected from these treatment steps E to H, and their order can be determined and carried out.

[0022] Hereinafter, the plated resin member to be treated in the present invention, the operation methods, treatment conditions, etc. of each treatment step will be described.

[0023] <Plated resin member> The plated resin member to be treated in the present invention is one in which plating is applied to the surface of the resin member.

[0024] There is no particular limitation on the resin constituting the resin member, and various thermoplastic resins or thermosetting resins can be used. Specifically, engineering plastics or super engineering plastics such as nylon, polyacetal, modified polyphenylene ether, polycarbonate, polyethylene terephthalate, polybutylene terephthalate, polyphenylene sulfide, polyamide, polyethersulfone, liquid crystal polymer, etc.; polyolefin resins such as polyethylene, polypropylene, polyvinyl chloride, polystyrene, acrylonitrile-butadiene-styrene copolymer resin (ABS resin), acrylonitrile-styrene copolymer resin, methyl methacrylate-butadiene-styrene copolymer resin (MBS resin), etc.; polymer alloys or polymer blends of these resins, etc. can be mentioned. Among these, since they have excellent plating compatibility, it is preferable to contain a styrene-based resin. More preferably, rubber-containing styrene-based resins such as rubber-reinforced polystyrene (HI resin), ABS resin, and MBS resin can be mentioned. In particular, ABS resin is suitable.

[0025] The plated resin members to be treated in the present invention include waste materials or off-spec products of various products such as office equipment, information and communication equipment, electronic and electrical equipment, household electrical appliances, vehicles such as automobiles, and building members. In particular, the present invention relates to vehicle parts such as automobiles or their waste materials, for example, automobile front grills, headlight housings, door handles, wheel caps, emblems, etc.

[0026] Usually, metal plating is applied to the surfaces of these plated resin members with a thickness of about 0.1 μm to 200 μm. Here, as the plating components, for example, metals such as copper, nickel, chromium, tin, lead, ruthenium, aluminum, indium, etc., especially metals such as copper, nickel, chromium or two or more of these metals can be mentioned.

[0027] If these plated resin members are excessively large in size, they can be cut into smaller pieces before the heat treatment in Treatment Step A. However, if a crusher or grinder is used as the cutting means, the plating (metal part) of the plated resin member will penetrate into the resin member, making it difficult to peel off and remove during subsequent processing. Therefore, it is preferable from the perspective of processing efficiency that the plated resin members be subjected to the treatment of the present invention in the state taken out from the product or, even when cutting, be cut to about 1 / 2 to 1 / 4 with a cutting tool such as a saw or a cutter knife and then be subjected to the heat treatment in Treatment Step A. Further, if necessary, they may be divided into pieces up to about 10 cm square.

[0028] <Treatment Step A: Heat treatment> The apparatus used for the heat treatment has a heating means and can heat to a suitable heat treatment temperature described later. Any apparatus can be used as long as it can accommodate or load the plated resin member in its heating container, heating tank, or heating furnace, etc., and there is no particular limitation. For example, a hot air dryer that blows hot air onto the plated resin member for heating is simple, the apparatus cost is relatively low, and it can be easily obtained and used, so it is preferable. Also, an apparatus that continuously combines hot air dryers and continuously heat-treats the plated resin members by placing them on a conveyor or the like is efficient because loading, unloading, etc. can be performed continuously and is preferable industrially.

[0029] When the heat treatment temperature in Treatment Step A is 300°C or higher, for example, 400°C, the resin of the plated resin member is likely to decompose and deteriorate. Therefore, the heat treatment temperature is preferably less than 300°C, for example, 100 - 200°C. Within this temperature range, it is possible to effectively suppress the decomposition and deterioration of the resin component and perform the peeling and separation of the plating component of the plated resin member.

[0030] Also, when the heat-resistant temperature (ISO: 75) of the resin member of the plated resin member is known, the heat treatment temperature is preferably the heat-resistant temperature + 50 to 100°C. If the heat treatment temperature is less than the heat-resistant temperature + 50°C, although the plated portion of the plated resin member may peel off, it may not be sufficient. If it exceeds the heat-resistant temperature + 100°C, the resin may decompose and deteriorate.

[0031] There is no particular limitation on the heat treatment time in treatment step A. For example, if the temperature inside the apparatus is maintained at 100 to 200°C, there is no problem even if it is kept inside the apparatus for a long time, including resin decomposition. However, from the viewpoints of the peeling efficiency of the plating component and the treatment efficiency, it is preferably 15 to 30 minutes.

[0032] In the plated resin member heat-treated in treatment step A, due to the thermal expansion difference between the resin and the plating metal caused by heating, the plating film peels off from the resin member and floats. At the stage of taking out from the heat treatment apparatus, the plated portion has peeled off from the resin member and can be easily removed.

[0033] As described above, the plated resin member that has undergone the heat treatment in treatment step A has most of the plating components peeled off and is also referred to as the "resin member". However, in the present invention, for the sake of convenience of explanation, those that have undergone treatment steps A to C will be consistently referred to as the "plated resin member".

[0034] <Treatment Step B: Cooling Treatment> The plated resin member that has undergone the heat treatment in treatment step A is then subjected to the cooling treatment in treatment step B. The cooling treatment in treatment step B may be carried out immediately after the heat treatment, or may be carried out with an interval. It is also possible to remove the plated portion from the heat-treated plated resin member or proceed to the cooling treatment step in treatment step B after the temperature of the resin member has dropped to room temperature.

[0035] The purpose of the cooling process in treatment step B is not to make the peeling of the plated part due to the heat treatment in treatment step A more effective, but rather to include a preparatory element for efficient breaking in the crushing process of the next treatment step C. That is, since the resin member of the plated resin member has a soft surface, if it is directly put into a crusher or the like after the heat treatment in treatment step A, a large amount of resin powder will be generated, and problems often occur when the resin member is recycled and used. For this reason, in the present invention, prior to the crushing process in treatment step C, the cooling process in treatment step B is performed to harden the resin member of the plated resin member, suppress the generation of resin powder during crushing by a crusher, and facilitate the recycling of the recovered resin.

[0036] The device used for the cooling process may be any device as long as it has a cooling means and can cool to a suitable cooling process temperature described later, and can accommodate or load the plated resin member in its cooling container, cooling tank, etc., without particular limitation. For example, a low-temperature constant temperature bath is simple, has a relatively low device cost, and can be easily obtained and used, so it is preferable. Also, a continuous device that places the plated resin member on a conveyor or the like and moves it, and covers the entire conveyor with a cooling device, is efficient because it can continuously input and take out the plated resin member into the device, and is preferable industrially.

[0037] The cooling process temperature in treatment step B may be any temperature at which the resin member becomes hard and easy to crush by cooling. Although it depends on the resin type, etc., it is usually 0°C or lower, preferably -10°C or lower, more preferably -30°C or lower. If this cooling process temperature is too low, the energy cost for cooling will increase, and a special device is required as a cooling device. On the other hand, since there is almost no change in the degree of hardening of the resin, the lower limit value of the cooling process temperature is preferably -50°C or higher, particularly -30°C or higher.

[0038] The cooling treatment time in treatment step B depends on the shape, wall thickness, cooling treatment temperature, etc. of the plated resin member. However, since it is sufficient that the resin portion of the plated resin member becomes hard by the cooling treatment, about 10 to 30 minutes is preferable from the viewpoint of treatment efficiency. There is no problem even if cooling is continued for a longer time, but it is inefficient.

[0039] <Treatment step C: Crushing treatment> In the present invention, by the cooling treatment in the treatment step B, the resin portion of the plated resin member is hardened to suppress the generation of resin powder during the crushing treatment as much as possible. Therefore, the crushing treatment in the treatment step C is preferably carried out immediately continuously after the cooling treatment in the treatment step B. Here, "continuously" means that the resin member taken out from the cooling device in the treatment step B is immediately subjected to the crushing treatment, that is, the resin member taken out from the cooling device is immediately put into the crushing device. In this way, by immediately subjecting to the crushing treatment after the cooling treatment, the crushing treatment can be carried out at a low temperature almost equal to the cooling treatment temperature. It should be noted that "continuously" and "immediately" in the above description do not mean that there is no gap of "an instant". Even when the resin member cannot be "immediately" put into the device in the treatment step C due to some reasons after the resin member is taken out from the cooling device in the treatment step B, if the resin member can be kept at a temperature equal to or lower than the cooling temperature in the treatment step B, for example, 0 °C or lower, there is no problem in putting it into the device in the treatment step C.

[0040] As the device for the crushing treatment, a general crusher, pulverizer, etc. can be used.

[0041] In this treatment step C, it is preferable to crush the plated resin member to about 1 cm or less by the breaking treatment and recover the resin pieces. For handling after recovery, the resin pieces are preferably sized 1 cm or less, for example, about 5 mm.

[0042] <Treatment step D: Separation treatment of plating components> Treatment step D for separating the plated component peeled off from the resin member in the crushing treatment of treatment step C is not necessarily required, but by performing this treatment step D, the plated component can be separated and recovered, and the recycling of the plated metal can also be achieved. In treatment step D, for example, the metal of the plated component can be separated and recovered by magnetic separation or the like.

[0043] <Treatment step E: Dissolution treatment> The dissolution treatment can be performed as necessary to improve the purity of the recovered resin by avoiding as much as possible the insufficient peeling of the plated part in the heating, cooling, and crushing treatments of treatment steps A to C or the mixing of the plated metal component into the recovered resin pieces.

[0044] The dissolution treatment in treatment step E is a treatment with a general chemical solution that dissolves the plated part from the plated member. There is no particular limitation on the chemical solution as long as it can dissolve the plating film, and it can be selected according to the plated metal. As described above, since the plated metal is mainly copper, nickel, chromium, or mostly their alloys, it is preferable to select a chemical solution that can dissolve copper, nickel, or chromium-based plating films.

[0045] Preferred chemical solutions include nitric acid solution, hydrogen peroxide aqueous solution, ammonium persulfate solution, etc. to minimize the impact on the resin to be recovered. The chemical concentrations of these chemical solutions are usually about 10 - 20% by mass.

[0046] The dissolution treatment in treatment step E can be performed by bringing the resin pieces that have undergone treatment step C or treatment step D into contact with the above chemical solution. There is no particular limitation on the temperature and treatment time during the dissolution treatment, but usually, since a higher temperature results in higher dissolution efficiency, it is preferably performed at 40 - 60°C for about 0.5 - 2 hours. After the dissolution treatment, the resin pieces are separated from the chemical solution by filtration or the like and, if necessary, are subjected to the water washing and drying treatments in the next treatment step F.

[0047] <Treatment Step F: Washing and Drying Process> The washing and drying process in treatment step F is not necessarily required. However, by performing the washing and drying process after the dissolution process in treatment step E to wash away the chemical solution and dry it, a high-purity resin component suitable for recycling can be recovered. Drying after water washing can usually be performed at a temperature of about 80 to 90 °C.

[0048] <Treatment Step G: Polishing Process> The polishing process in treatment step G is an additional treatment step performed when the separation between the plating layer and the resin member is not sufficient in the process up to treatment step C or treatment step D. As the polishing process, there is a step (step G-1) of putting crushed products of the resin member obtained in the process up to treatment step C or treatment step D into a container filled with water and stirring to separate the plating components remaining on the resin member. In this step, within the stirring container, the resin members collide with each other and are polished, and as a result, the plating components are peeled off. Since stronger stirring allows the resin members to collide and be polished more, and the plating components can be peeled off and separated more effectively, as the stirring device, a mixer for resin (mixer) is preferable. Furthermore, a mixer with a screw for resin, etc., is particularly preferable because the plated resin member and water can be continuously poured in, which is effective and efficient.

[0049] After peeling off the plating components with a mixer or the like, it is preferable to pass through a washing process (step G-2) to separate the plating components and the resin components. As the washing method, there are air spraying (air washing), water washing, etc. However, since it has passed through treatment step C or treatment step D, it is a treatment step in a state where there is almost no plating component, and also since the plating component is recovered as polished powder in step G-1 above, washing with water is preferable.

[0050] When washing with water, it is necessary to remove moisture, and it is preferable to remove moisture (step G-3) using a dryer, a dehydrator, or the like. In this case, since it is efficient to perform water washing and moisture removal continuously, it is preferable to put them into equipment for washing and dehydration to separate the resin member from others (such as plating components and resin fragment powder). Here, examples of the equipment for washing and dehydration include a centrifuge and a dehydrator, but a pellet dehydrator for resin is preferable because it can process continuously.

[0051] Furthermore, in order to effectively separate the plating component from the resin member and to more effectively perform the treatment in step G-1, as a pre-step of step G-1, it is preferable to wash the plated resin member with water or put it into a wet pulverizer or the like to remove the plating component attached to the resin member in the treatment up to this treatment step or to polish it with a pulverizer. Here, when passing through the polishing step by a pulverizer, it is preferable to further remove moisture by washing and dehydration or the like.

[0052] <Processing step H: Pelletization treatment> In order to recover the resin component from the resin member, it is possible to directly utilize the resin component obtained in processing step C, processing step D, or processing step G, but it is preferable to put the resin component into an extruder once to pelletize it, because the utilization methods such as mixing with other resins and transportation are expanded. When pelletizing with an extruder, the extrusion conditions and the like may be determined in consideration of the performance of the recovered resin component.

[0053] <Recycling of recovered resin> The resin component recovered by the method for recovering the resin component from the plated resin member of the present invention can be recycled as a molding raw material for various products alone or by mixing the recovered resin with a new resin at a ratio of about 10 to 50% by mass.

Examples

[0054] The present invention will be described more specifically with reference to the following examples. However, the present invention is not limited to the following examples as long as the gist thereof is not exceeded.

[0055] [Example 1] The following treatment steps A, B, and C were performed to recover the resin component from the plated resin member. [Treatment Step A: Heat Treatment] The plated resin member (automobile front grille: approximate dimensions 1 m × 40 cm, chromium plating on the surface, ABS resin imprint on the back of the member) was placed in a hot air dryer set at 120°C and taken out after 15 minutes. [Treatment Step B: Cooling Treatment] The heat-treated plated resin member was placed in a thermostatic bath set at 0°C and taken out after 20 minutes. [Treatment Step C: Crushing Treatment] The plated resin member taken out from the cooling treatment (thermostatic bath) was immediately put into a crusher and crushed to a size of 1 cm or less to recover resin pieces. This crushing treatment is performed immediately after the cooling treatment in Treatment Step B. Therefore, the plated resin member can be processed under temperature conditions approximately the same as the cooling treatment temperature in Treatment Step B.

[0056] [Examples 2 to 4] The same procedures as in Example 1 were carried out except that the heat treatment temperature in Treatment Step A and / or the cooling treatment temperature in Treatment Step B were changed as shown in Table 1.

[0057] [Example 5] The same procedures as in Example 1 were carried out except that after the crushing treatment in Treatment Step C in Example 1, the following Treatment Step E: Dissolution Treatment and Treatment Step F: Washing and Drying Treatment were performed. [Treatment Step E: Dissolution Treatment] The crushed resin pieces were put into a 15 L beaker containing an aqueous solution of 10% by mass of ammonium persulfate, heated to 50°C, held for 1 hour with stirring, and then filtered through a metal filtration mesh to recover the resin pieces. [Treatment Step F: Washing and Drying Treatment] After washing the recovered resin pieces with water, they were placed in a hot air dryer set at 80 °C for 2 hours to dry, obtaining good-quality resin crushed pieces.

[0058] [Examples 6 - 8] The procedure was carried out in the same manner as in Example 5, except that the heat treatment temperature in Treatment Step A and / or the cooling treatment temperature in Treatment Step B were changed as shown in Table 1.

[0059] [Example 9] In Example 8, the procedure was carried out in the same manner as in Example 8, except that a treatment step D was performed between the crushing treatment in Treatment Step C and the dissolution treatment in Treatment Step E to separate the plating components peeled off from the resin member by the crushing in Treatment Step C. Here, Treatment Step D was carried out by putting the resin member crushed in Treatment Step C into a magnetic separator (manufactured by Nippon Magnetics Co., Ltd.) to separate the plating components from the resin part and recover the plating components.

[0060] [Evaluation] The following evaluations were performed on the resin pieces recovered in Examples 1 - 9. The results are shown in Table 1.

[0061] <Peeling state> After the crushing treatment in Treatment Step C, the peeling state (remaining state) of the plating layer part of the resin pieces was visually observed.

[0062] <Recovery rate> The mixing state of the plating components in the finally recovered resin pieces was visually observed and evaluated according to the following criteria. ◎: No plating components were observed at all. (As a result of performing TGA measurement on the recovered resin pieces, the metal components contained in the ash were below the detection limit.) 〇: A very small amount of plating components were observed. (Among 100 recovered resin pieces, 1 resin piece had plating components adhering and remaining.) △: A small amount of plating components were observed. (Among 100 recovered resin pieces, 2 or more and 4 or less resin pieces had plating components adhering and remaining.) ×: Many plating components were observed. (Among 100 recovered resin pieces, there are 5 or more resin pieces with adhering and remaining plating components)

[0063] <Impact resistance (Charpy impact test)> For the performance evaluation of the finally recovered resin component, 30 mass% of the recovered resin pieces were blended with a new resin (ABS resin / manufactured by Techno UMG) and test pieces were prepared by an injection molding machine. A Charpy impact test (notched) was conducted under the condition of 23 °C according to ISO 179 standard, and the Charpy impact strength (kJ / m 2 ) was measured. In addition, when the Charpy impact test was measured in the same manner for the test pieces of only the new resin, it was 25 kJ / m 2 .

[0064]

Table 1

[0065] From Table 1, according to the present invention, without performing excessive high-temperature heat treatment or excessive low-temperature cooling treatment, using a general treatment apparatus, the plating component can be separated from the plated resin member, and the resin component can be efficiently recovered. It can be seen that the recovered resin component can be recycled without significantly impairing its physical properties. Also, it can be seen that the effect of the present invention can be more effectively exhibited by performing the dissolution treatment in treatment step E in particular.

[0066] In addition, in the above embodiment, the separation treatment of the plating component peeled from the resin member in treatment step D is not performed. However, by performing the separation and recovery of the peeled plating component by magnetic separation or the like between the crushing treatment in treatment step C and the dissolution treatment in treatment step E, the recovered metal can be recycled.

Claims

1. A method for separating a plating component from a plated resin member having plating applied to the surface of a resin member and recovering the resin component, comprising: a treatment step A of heating the plated resin member; a treatment step B of cooling after the treatment step A; and a treatment step C of crushing after the treatment step B. A method for recovering a resin component from a plated resin member.

2. The method for recovering a resin component from a plated resin member according to claim 1, wherein the heat treatment temperature in the treatment step A is 100 to 200°C.

3. The method for recovering a resin component from a plated resin member according to claim 1, wherein the cooling treatment temperature in the treatment step B is 0°C or lower.

4. The method for recovering a resin component from a plated resin member according to claim 1, wherein the treatment step C is continuously performed at a temperature condition of 0°C or lower following the treatment step B.

5. The method for recovering a resin component from a plated resin member according to claim 1, further comprising a treatment step E of dissolving and removing the plating component remaining on the surface of the resin member after the treatment step C.

6. The method for recovering a resin component from a plated resin member according to claim 5, further comprising a treatment step D of separating the plating component peeled from the resin member by crushing in the treatment step C between the treatment step C and the treatment step E.

7. The method for recovering a resin component from a plated resin member according to claim 1, wherein the resin component contains a styrene-based resin.

8. The method for recovering a resin component from a plated resin member according to claim 7, wherein the resin component is a styrene-based resin.

9. The method for recovering a resin component from a plated resin member according to claim 7, wherein the styrene-based resin is an ABS resin.

10. The method for recovering a resin component from a plated resin member according to any one of claims 1 to 9, wherein the plated resin member is a vehicle part or its waste material.

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