Soldering device and production method of joint object

Abstract

To improve quality of joining by soldering.SOLUTION: A soldering device joins a joint object W1 and a joint object W2 by solder disposed between the joint objects. The soldering device includes: a heater which heats a workpiece comprising the joint object W1, the joint object W2, and the solder; a vibration application part which is disposed spaced apart from the heater and applies supersonic vibration to a portion, which is different from a contact portion of the heater, of the workpiece; and a controller which performs control to cause the vibration application part to start applying supersonic vibration which breaks an oxide film of the workpiece to the workpiece in a period that the workpiece is heated by the heater and the solder is in a solid-liquid mixed state.SELECTED DRAWING: Figure 3

Description

Technical Field

[0001] The present invention relates to a soldering apparatus and a method for producing a soldered joint.

Background Art

[0002] Patent Documents 1 and 2 disclose a soldering apparatus that applies ultrasonic vibration when melting the solder of a workpiece including a first joining target, a second joining target, and solder disposed therebetween. The ultrasonic vibration improves the wetting of the solder.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the soldering apparatuses described in Patent Documents 1 and 2, a heater that generates heat for melting the solder is attached to the ultrasonic horn. In this configuration, for example, since the heater becomes a foreign object with respect to the ultrasonic horn, the ultrasonic vibration may become unstable. This is particularly true when the heater is wound around the ultrasonic horn as in Patent Document 2. Further, for example, when the temperature of the ultrasonic horn increases due to the heat of the heater, the heat is transmitted to the vibrator and the frequency fluctuation becomes large, making it difficult to accurately generate (or track) the desired vibration. Furthermore, in the soldering apparatuses described in Patent Documents 1 and 2, the heating for melting the solder and the application of ultrasonic vibration are performed simultaneously. In such a case, many voids may remain in the solder. As described above, in the soldering apparatuses described in Patent Documents 1 and 2, the improvement of the wetting of the solder is insufficient and the amount of remaining voids increases, and it may not be possible to obtain a good-quality joint.

[0005] The present invention aims to improve the quality of solder joints.

Means for Solving the Problem

[0006] (1) To solve the above problem, a soldering apparatus according to the present invention is a soldering apparatus that joins a first joining target and a second joining target with solder disposed therebetween, and includes a heater that heats a workpiece including the first joining target, the second joining target, and the solder, a vibration application unit that is disposed at a distance from the heater and applies ultrasonic vibration to a location on the workpiece different from the contact location of the heater, and a controller that controls to start applying the ultrasonic vibration from the vibration application unit to the workpiece during a period when the workpiece is heated by the heater and the solder is in a solid-liquid mixed state. (2) A method for producing a bonded object according to the present invention is a method for producing a bonded object that joins a first joining target and a second joining target with solder disposed therebetween, and uses a soldering apparatus including a heater that heats a workpiece including the first joining target, the second joining target, and the solder therebetween to melt the solder, and a vibration application unit that is disposed at a distance from the heater and applies ultrasonic vibration to a location on the workpiece different from the contact location of the heater, and starts applying the ultrasonic vibration that breaks the oxide film of the workpiece from the vibration application unit to the workpiece during a period when the workpiece is heated by the heater and a part of the solder is in a solid-liquid mixed state where it has melted.

Advantages of the Invention

[0007] According to the present invention, the quality of solder joints is improved.

Brief Description of the Drawings

[0008]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, the vertical direction is the up-down direction, but the up-down direction does not necessarily coincide with the vertical and horizontal directions.

[0010] The soldering apparatus 10 according to the present embodiment shown in FIG. 1 is a reflow soldering apparatus that joins a joining target W1 and a joining target W2 with solder S disposed therebetween. Here, a joining target W2 such as an electronic component (for example, a semiconductor chip) is soldered to the joining target W1 such as a circuit board. Although the solder S is drawn in a single film shape, it may be composed of a plurality of discretely arranged solders (such as bumps). A combination of the joining target W1, the joining target W2, and the solder S disposed between the joining targets W1 and W2 is also referred to as a workpiece W.

[0011] The soldering apparatus 10 includes a preheating heater 20, a vibration applying unit 30, a main heating heater 40, a moving mechanism 50, a moving mechanism 60, a sensor 70, and a controller 80.

[0012] The preliminary heating heater 20 is composed of, for example, a hot plate that preliminarily heats the work W. As shown in FIGS. 1 and 2, the preliminary heating heater 20 includes a plate-shaped stage 21 that supports the work W from the side of the joining target W1, and a plurality of heating resistors 22 that are inserted into the stage 21 and heat the stage 21. The stage 21 heated by the heating resistor 22 preliminarily heats the work W from the side of the joining target W1 that contacts the stage 21. The preliminary heating means heating the work W at a temperature lower than the melting point of the solder S. By this preliminary heating, the heating efficiency for the work W during the main heating (details will be described later) that melts the solder S during soldering is improved. The joining target W1 of the work W supported by the stage 21 is fixed to the stage 21 so as not to be displaced, for example, by a jig (not shown) or a toggle clamp. Here, the preliminary heating heater 20 may be a member that has, in addition to the function of preliminarily heating the work W, a function as a stage for supporting the work W.

[0013] A through hole H penetrating in the vertical direction is formed at the center of the preliminary heating heater 20 (specifically, the stage 21). The ultrasonic horn 32 of the vibration applying unit 30 described later is inserted into this through hole H. The through hole H is arranged at a position located at the center of the joining target W1 when the joining target W1 is arranged on the stage 21. The preliminary heating heater 20 contacts an outer region surrounding the central portion other than the central portion of the joining target W1 and heats the outer region. In this way, the preliminary heating heater 20 heats the work W from the side (lower side) of the joining target W1.

[0014] The vibration applying unit 30 shown in FIG. 1 is configured to apply ultrasonic vibration to the work W. The vibration applying unit 30 includes an ultrasonic vibrator 31 that oscillates ultrasonic vibration, and an ultrasonic horn 32 that can be pressed against the joining target W1 of the work W through the through hole H and can transmit the ultrasonic vibration oscillated by the ultrasonic vibrator 31 to the work W from the side of the joining target W1.

[0015] The vibration application unit 30 is arranged at a distance from the preheating heater 20 so that the heat from the preheating heater 20 is not transmitted. In particular, the ultrasonic horn 32 is formed thinner than the through-hole H so as not to contact the inner peripheral wall of the through-hole H. The vibration application unit 30 (ultrasonic horn 32) is inserted into the through-hole H and contacts the central portion of the joining target W1, and is configured to apply ultrasonic vibration to the workpiece W from the side of the joining target W1 (see also FIG. 2). The location where the vibration application unit 30 is pressed and ultrasonic vibration is applied, and the location where the preheating heater 20 contacts and is preheated are different portions in the joining target W1. Since the vibration application unit 30 applies ultrasonic vibration through the through-hole H of the preheating heater 20, the entire circumference around the location where ultrasonic vibration is applied on the joining target W1 arranged to cover the through-hole H is heated by the preheating heater 20, and thus, the heating unevenness is reduced.

[0016] The main heating heater 40 is configured to include a heater chip and perform main heating for melting the solder S of the workpiece W on the workpiece W. The main heating heater 40 is located above the workpiece W and is arranged at a position facing the vibration application unit 30 through the workpiece W (more specifically, a position overlapping when viewed from the vertical direction). The main heating heater 40 is configured to be able to contact the joining target W1, heat the workpiece W from the side of the joining target W2 at a temperature higher than the melting point of the solder S, and melt the solder S. The main heating heater 40 performs heating, for example, by a pulse heat method.

[0017] The moving mechanism 50 includes a driving device 51 configured to include a combination of a motor and a ball screw, or a linear motor or the like, and an arm 52 driven by the driving device 51 to move the vibration applying unit 30 in the vertical direction. The moving mechanism 60 has the same configuration as the moving mechanism 50, and includes a driving device 61 and an arm 62 driven by the driving device 61 to move the main heater 40 in the vertical direction. The moving mechanism 50 controls the contact and non-contact of the ultrasonic horn 32 against the workpiece W (bonding target W1) by moving the vibration applying unit 30 in the vertical direction. The moving mechanism 60 controls the contact (e.g., pressing) and non-contact of the main heater 40 against the workpiece W (bonding target W2) by moving the main heater 40 in the vertical direction.

[0018] The sensor 70 is composed of a displacement sensor or the like and detects the position of the main heater 40. The sensor 70 is fixed to any part that moves integrally with the main heater 40, such as the arm 62 of the moving mechanism 60, and detects the position to the reference position T that is immovable with respect to the stage 21 or the like, thereby detecting the position of the main heater 40. The reference position T may be any position of a member that is immovable with respect to the stage 21 or the like. For example, it may be the upper surface of the stage 21. The reference position T and the sensor 70 may be provided inside the driving device 61. For example, the reference position T may be provided on the stator of the driving device 61, and the sensor 70 may be provided on the mover of the driving device 62. Also, the sensor 70 may be immovable with respect to the stage 21 or the like, and the reference position T may be provided at a position that moves together with the main heater 40.

[0019] In the configuration as described above, the vibration application unit 30 is disposed at a position away from the preheating heater 20 and the main heating heater 40, and applies ultrasonic vibration to a location different from the contact locations (heating locations) of each of the heaters 20 and 40 on the workpiece W. For this reason, the heater 20 or 40 does not adhere to the vibration application unit 30 as a foreign object, and it is suppressed that the ultrasonic vibration becomes unstable. Further, the temperature rise of the vibration application unit 30 (particularly the vibrator 31) due to the heat of the heater 20 or 40 is also reduced, and the frequency fluctuation due to heat is also reduced. Therefore, a desired vibration can be generated in the workpiece W, and the joining quality is improved as compared with the case where the preheating heater 20 or the main heating heater 40 is attached to the vibration application unit 30.

[0020] Also, in this embodiment, the vibration application unit 30 and the preheating heater 20 are arranged to apply ultrasonic vibration and preheating to the work W from the side of the joining target W1. That is, the vibration application unit 30 is arranged on the side of the preheating heater 20 that generates heat at a low temperature, rather than on the side of the main heating heater 40 that generates heat at a high temperature with respect to the work W. Thereby, the thermal influence on the vibration application unit 30 is reduced compared to when it is arranged on the side of the main heating heater 40. Further, due to the vibration application unit 30 pressed against the joining target W1 of the work W, the heat applied to the work W from the main heating heater 40 in contact with the joining target W2 is reduced from the joining target W1 (particularly, the pressing portion of the vibration application unit 30) compared to when the vibration application unit 30 is not pressed. Furthermore, since the main heating heater 40 is pressed against the work W, the main heating heater 40 is configured to press the joining target W2 against the joining target W1 supported by the preheating heater 20. Therefore, the movement of the joining target W1 freely on the solder S is restricted, so that ultrasonic vibration is more easily transmitted to the entire work W, and the above cavitation effect becomes more effective. Also, among the vibration application unit 30 and the main heating heater 40, since the vibration application unit 30 is arranged on the side of the joining target W1, the ultrasonic vibration reaching the joining target W2 is reduced compared to when the vibration application unit 30 is in direct contact with the joining target W2. In particular, the ultrasonic vibration may be output at a strong output level so as to reach the joining target W2 opposite to the joining target W1 in contact with the vibration application unit 30 (due to vibration attenuation). In the above configuration, the application of this strong ultrasonic vibration directly to the joining target W2 is suppressed. Thereby, the joining target W2 such as a semiconductor chip is less likely to be affected by the ultrasonic vibration.

[0021] The controller 80 is composed of various computers and is configured to control the preheating heater 20, the vibration application unit 30, the main heating heater 40, the moving mechanism 50, the moving mechanism 60, and the sensor 70.

[0022] When soldering the work W, the controller 80 performs the process shown in FIG. 3. The soldering process in FIG. 3 starts when the work W is placed on the preheating heater 20 and a command to start soldering is input to the controller 80 via an interface (not shown). The vibration applying unit 30 and the main heating heater 40 at the start of the soldering process are assumed to be in their initial positions away from the work W.

[0023] In the soldering process, the controller 80 controls the preheating heater 20 to start preheating, which is heating the work W at a predetermined temperature lower than the melting point of the solder S by the preheating heater 20 (step S11). The controller 80 controls the amount of current supplied to the heating resistor 22 of the preheating heater 20 via wiring (not shown) for preheating. The controller 80 may perform feedback control so that the temperature of the preheating for the work W reaches the above predetermined temperature by controlling the amount of current to the heating resistor 22 using the measured value of a temperature sensor (not shown) that measures the temperature of the preheating heater 20 as a feedback value. The preheating continues until the soldering process ends.

[0024] After step S11, the controller 80 controls the moving mechanism 60 to lower the main heating heater 40 and start pressing it against the work W (step S12). The controller 80 may monitor the position of the main heating heater 40 with the sensor 70 and detect the contact of the main heating heater 40 with the work W based on the monitoring result. It may proceed to step S13 after the detection of this contact.

[0025] After step S12, the controller 80 starts supplying current to the main heater 40 via wiring (not shown), causing the main heater 40 to generate heat at a temperature equal to or higher than the melting point of the solder S, and starts the main heating of the workpiece W (step S13). Thereby, soldering for melting the solder S is started. The controller 80 controls the current supplied to the main heater 40 so that it changes over time according to a predetermined current value. The controller 80 may control the current value of the current supplied to the main heater 40 using, as a feedback value, the temperature value detected by a temperature sensor (not shown) that measures the temperature of the main heater 40.

[0026] At the timing after the start of the main heating in step S13, the solder S begins to melt. When the solder S begins to melt, the joining target W2 that has been pushed downward by the main heater 40 begins to crush the solder S and approaches the joining target W1, that is, sinks downward. The controller 80 detects that the solder S has begun to melt by detecting this downward sinking. Specifically, after step S13, the controller 80 starts monitoring the position of the main heater 40 detected by the sensor 70 (step S14). Here, since the main heater 40 is in contact with the joining target W2, it can be said that the sensor 70 detects the position of the joining target W2, and the monitoring of the position of the main heater 40 can also be said to be the monitoring of the position of the joining target W2. After starting the position monitoring, the controller 80 determines whether the position of the joining target W2 detected by the sensor 70 has reached a predetermined position on the side of the joining target W1 (step S15). For example, the controller 80 determines whether the downward displacement amount of the main heater 40 based on the position of the main heater 40 at the start of the position monitoring exceeds a predetermined threshold value. The controller 80 waits until the position of the joining target W2 reaches the predetermined position, for example, until the displacement amount exceeds the threshold value (step S15; No, step S16; No). Note that if the controller 80 determines that the waiting time has reached a predetermined time (step S16; Yes), since an abnormality is likely to have occurred, it proceeds to the end process (step S19) described later. Thereby, the soldering process is forcibly terminated.

[0027] The specific manner in which the controller 80 determines whether or not the position of the joining target W2 detected by the sensor 70 has reached a predetermined position on the side of the joining target W1 is arbitrary. For example, the sensor 70 irradiates a laser for distance measurement in the horizontal direction, and before the joining target W2 sinks, it faces the first part (for example, the joining target W2) in the horizontal direction, and after the joining target W2 sinks, it may be provided to face a second part (for example, the main heater 40) whose position is different from that of the first part in the horizontal direction. In this case, since the horizontal distance from the sensor 70 to the part (the first part or the second part) facing the sensor 70 in the horizontal direction changes depending on the position before and after the joining target W2 sinks, the sensor 70 detects the horizontal distance to the part facing in the horizontal direction to detect the position of the joining target W2 (more specifically, the position before or after sinking). The controller 80 monitors the horizontal distance (the position of the joining target W2) detected by the sensor 70, and when the horizontal distance changes, determines that the position of the joining target W2 has reached the predetermined position.

[0028] When the controller 80 determines that the displacement amount of the main heater 40 (the displacement amount of the joining target W2) exceeds the above-mentioned threshold value and the position of the joining target W2 has reached a predetermined position (step S15; Yes), assuming that it has detected the timing when the solder S starts to melt and enters a solid-liquid mixed state (a state where the solid phase and the liquid phase are mixed) and the joining target W2 sinks, the controller 80 performs control to start applying ultrasonic vibration to the workpiece W (step S17). The controller 80 controls the ultrasonic vibrator 31 of the vibration application unit 30 to generate ultrasonic vibration, and controls the moving mechanism 50 to press the vibration application unit 30 against the workpiece W. As a result, ultrasonic vibration is applied to the workpiece W from the side of the joining target W1. When ultrasonic vibration is applied to the workpiece W, due to the cavitation effect, the oxide films of the joining targets W1 and W2 are broken, the wettability of the solder S is improved, and the joining quality of the joining targets W1 and W2 is improved. Further, the controller 80 may control the vibration application unit 30 to continue applying ultrasonic vibration even after the oxide film is broken. As a result, a defoaming effect is obtained, the amount of voids (bubbles) in the solder S is reduced, and the amount of voids in the solder S after soldering is reduced compared to the case where the application of ultrasonic vibration is not continued and the case where there is no application of ultrasonic vibration itself.

[0029] In step S17, the controller 80 performs processing to start applying ultrasonic vibration during the period when the solder S is in a solid-liquid mixed state (before the solder S becomes completely liquid). The above period is specified through experiments or the like, and various settings of the soldering apparatus 10 are performed based on the specified period, thereby realizing the application of ultrasonic vibration during the period of the solid-liquid mixed state.

[0030] As described above, in step S17, the vibration application unit 30 moves upward and contacts the workpiece W only when generating ultrasonic vibration. Thereby, the thermal influence from the workpiece W and the preliminary heater 20 can be minimized.

[0031] Note that the timing for causing the vibration application unit 30 to output the ultrasonic vibration (more specifically, ultrasonic vibration at a level that destroys the oxide film) can also be set to a timing earlier than step S17. In step S17, the controller 80 may move the vibration application unit 30 that is outputting ultrasonic vibration for destroying the oxide film and press it against the workpiece W. As a result, since the output of ultrasonic vibration with an amplitude for destroying the oxide film is prepared in advance, the waiting time until the output is obtained in step S17 is eliminated, and the ultrasonic vibration can be applied quickly.

[0032] After step S17, the controller 80 determines whether the end timing when the time change of the predetermined current value ends has arrived (step S18). Until the end timing arrives (step S18; No), control for joining (soldering) by the solder S, such as control of the current value to the main heater 40, continues. When the end timing arrives, the controller 80 performs end processing for soldering (step S19). The end processing includes stopping the current supply to the heaters 20 and 40, returning the heaters 20 and 40 to their initial positions, stopping the oscillation of the ultrasonic wave, etc. The end processing may include a process of cooling the workpiece W, the heaters 20 and / or 40 by a cooling mechanism (not shown).

[0033] Through the series of soldering processes as described above, joining (soldering) of the joining targets W1 and W2 by the solder S is performed, and a joined product in which the joining target W2 is joined to the joining target W1 by soldering is produced.

[0034] In this embodiment, there are also features in the application timing of the ultrasonic vibration. The inventor of the present application compared the joining state (state of the hardened solder S) of the joining targets W1 and W2 in case A (conventional example) where the start of main heating and the application of ultrasonic vibration are simultaneous, case B (comparative example) where the application of ultrasonic vibration is started and then main heating is started, and case C where, as in the above-described soldering process, the application of ultrasonic vibration is started during the period when the solder S is in a solid-liquid mixed state after the start of main heating. As a result, the evaluation was as shown in Table 1 below.

Table 1

[0035] From Table 1 above, it can be seen that Case C is relatively good compared to other cases. In particular, in Case C, the void amount (number of voids) is small and the bonding strength is high.

[0036] As described above, according to the present embodiment in which the controller 80 performs control to start applying ultrasonic vibration from the vibration application unit 30 to the work W to break the oxide film of the work W during the period when the work W is heated by the main heater 40 and the solder S is in a solid-liquid mixed state in which a part of the solder S is melted, in addition to the improvement in bonding quality due to the separation of the vibration application unit 30 and the heaters 20 and 40 described above, a reduction in the void amount can also be obtained, and a better-quality bond can be obtained.

[0037] In this embodiment, as the above-described process, the controller 80 detects, as the timing when the solder S becomes a solid-liquid mixed state, the timing when the position of the joining target W2 detected by the sensor 70 reaches a predetermined position on the side of the first joining target W1, and based on the detection of this timing, performs control to start applying ultrasonic vibration to the work W. The timing at which the solder S changes to a solid-liquid mixed state varies depending on the heat capacity, heat dissipation, etc. of the work W (particularly the joining target W2). By performing the detection of the above timing based on the position of the joining target W2, the start timing of applying ultrasonic vibration can be set during the period of the solid-liquid mixed state regardless of such variation.

[0038] The present invention is not limited to the configuration of the above embodiment. Each configuration of the above embodiment can be appropriately changed. Hereinafter, modification examples will be exemplified.

[0039] (Modification Example 1) The controller 80 controls the vibration application unit 30, and instead of suddenly increasing the output level of the ultrasonic vibration output from the vibration application unit 30 and applied to the workpiece W in a pulsed manner, it gradually increases the output level so that during the period when the solder S is in a solid-liquid mixed state, the output level may reach the level that destroys the oxide film. The output level is, for example, output energy, and more specifically, the amplitude of the ultrasonic vibration. The output level (output energy) may be the frequency instead of or in addition to the amplitude. The transition of such an output level is shown in FIG. 4. The mode in which the output level gradually increases is not limited to the linear increase as shown in FIG. 4, and may be, for example, a curve increase or a plurality of stepwise increases. The output level may be any physical quantity for which the destruction of the oxide film is likely to occur as the output level increases. The increase in the output level includes an increase in the amplitude and / or the frequency. Further, the increase in the output level also includes a mode in which one of the amplitude and the frequency is increased and the other is decreased so that the entire output level increases. The vibration application unit 30 may, for example, contact the workpiece W before the solder S reaches the solid-liquid mixed state at an output level that has not reached the level that destroys the oxide film, and gradually increase the output level therefrom. The output level that has not reached the level that destroys the oxide film includes non-output of ultrasonic vibration. The vibration application unit 30 may be stationary at the position where it contacts the workpiece W. Thus, the load on the vibration application unit 30 due to the sudden and pulsed increase in the output of the vibration application unit 30, and / or the load on the workpiece W due to the sudden application of ultrasonic vibration with a large output level to the workpiece W are suppressed. Further, the mode of increase in the output level may be preset. In such a case, monitoring of the position of the joining target W2 such as steps S14 to S17 becomes unnecessary. Further, the controller 80 first increases the output level in a preset increase mode, and then, when detecting the timing when the joining target W2 reaches a predetermined position (step S15; Yes), may increase the degree of increase in the output level and make the output level reach the level that destroys the oxide film. Such a mode is also an example of the above mode of gradually increasing the output level.

[0040] (Modification Example 2) The heating temperature of the preliminary heating heater 20, which also functions as a stage for the work W, may be set higher than the melting point of the solder S, and the preliminary heating heater 20 may be operated as the main heating heater. This example is shown in FIG. 5. In FIG. 5, the same components as those in the above-described embodiment are denoted by the same reference numerals, and detailed description thereof is omitted. The soldering apparatus 110 according to this modified example shown in FIG. 5 has the same structure as the preliminary heating heater 20, but includes a main heating heater 120 that heats the work W at a temperature equal to or higher than the melting point of the solder S. Further, the soldering apparatus 110 has a pressing member 140 that presses the work W from the side of the joining target W2 toward the main heating heater 120 instead of the main heating heater 40. The pressing member 140 does not generate heat. Such a configuration is effective when it is not desired to directly heat the joining target W2. If the joining target W2 can be heated at a certain temperature, the pressing member 140 may operate as a preliminary heating heater.

[0041] The soldering apparatus 110 may further include a heat insulating portion 191 provided between the main heating heater 120 and the vibration applying portion 30 to insulate the heat from the main heating heater 120. The heat insulating portion 191 is configured to cover the main heating heater 120 from below (depicted as an end view showing a cross section in FIG. 5). The heat insulating portion 191 is preferably provided so as to cover the inner wall of the through hole H in particular. Thereby, it becomes difficult for the heat from the main heating heater 120 to be transmitted to the vibration applying portion 30. Further, the soldering apparatus 110 may further include a cooling portion 192 that suppresses the temperature rise of the vibration applying portion 30 due to the heat from the main heating heater 120. The cooling portion 192 is composed of, for example, an air-cooled air blow. By this cooling, it is possible to suppress the vibrator 31 from becoming high temperature. The heat insulating portion 191 and the cooling portion 192 may be applied to the above-described embodiment. In this case, the heat insulating portion 191 is provided between the preliminary heating heater 20 and the vibration applying portion 30 to insulate the heat from the preliminary heating heater 20.

[0042] The soldering device 110 further includes a sensor 170 that measures the temperature of a predetermined location on the workpiece W. The predetermined location may be, for example, the joining target W2, the solder S, etc. The controller 80 detects the timing when the temperature measured by the sensor 170 reaches a predetermined temperature (a predetermined temperature equal to or higher than the melting point of the solder S) as the timing when the solder S enters a solid-liquid mixed state, and may perform control to start applying the ultrasonic vibration upon detecting the detected timing. The sensor 70 may be any temperature sensor such as a thermocouple or a thermography. When the sensor 70 is a thermography, the sensor 70 measures the temperature of the predetermined location by generating a thermal distribution (for example, a two-dimensional image) of a portion including at least the predetermined location of the workpiece. The controller 80 analyzes the thermal distribution generated by the thermography, detects the temperature of a predetermined region (the region corresponding to the predetermined location) of the thermal distribution, and detects the timing based on the temperature. Note that the sensor 170 may be applied to the above-described embodiment. Further, in this modification, the sensor 70 may be employed.

[0043] The pressing member 140 may not be employed. In this case, when the solder S starts to melt, the joining target W2 may move toward the joining target W1 side due to its own weight. In this case, when the sensor 70 is employed, a non-contact position sensor such as an optical sensor that directly measures the position of the joining target W2 is employed as the sensor 70.

[0044] (Modification 3) The structure and adoption or non - adoption of each member constituting the soldering devices 10 and 110 are arbitrary. For example, the pre - heating heater 20 may not be adopted. In this case, a non - heating stage is adopted instead of the pre - heating heater 20. The hardware configuration of the controller 80 is also arbitrary. The controller 80 may detect the displacement by the sensor 70 via an external device such as a sensor monitor. The vibration application unit 30 may be treated only as a vibration transmission unit such as an ultrasonic horn. The soldering device 10 or 110 may be configured as a device that performs soldering while sequentially supplying solder S between the joining target W1 and the joining target W2. In this case, the joining target W1, the joining target W2, and the solder S supplied between them constitute the work W.

[0045] (Supplementary Note) A configuration taking the above - mentioned embodiments and modification examples as examples is appended. The appended configurations can be combined with each other. In particular, the configurations of Supplementary Notes 1 to 10 are applicable to the configurations of Supplementary Notes 11 and later. The symbols in parentheses in the following supplementary notes show an example of the correspondence relationship between the elements described in the supplementary notes and the elements of the above - mentioned embodiments and modification examples, and are not intended to limit the elements described in the supplementary notes to the elements of the above - mentioned embodiments and modification examples with the symbols in parentheses. (Supplementary Note 1) A soldering device (10, 110) that joins a first joining target (W1) and a second joining target (W2) with solder (S) disposed therebetween, a heater (20, 40, 120) that heats a work including the first joining target, the second joining target, and the solder, a vibration application unit (30) that is disposed at a distance from the heater and applies ultrasonic vibration to a location of the work different from the contact location of the heater, The soldering device comprising the above. (Supplementary Note 2) The heater includes a first heater (20, 120) that contacts the first joining target and heats the work from the side of the first joining target, The vibration application unit contacts the first joining target and applies the ultrasonic vibration to the work from the side of the first joining target. The soldering apparatus described in Supplementary Note 1. (Supplementary Note 3) The heater further includes a second heater (40) that contacts the second object to be joined and heats the workpiece. The first heater (20) heats the workpiece below the melting point of the solder. The second heater heats the workpiece at a temperature equal to or higher than the melting point of the solder to melt the solder. The soldering apparatus (10) described in Supplementary Note 2. (Supplementary Note 4) The first heater supports the workpiece by supporting the first object to be joined. The second heater presses the second object to be joined against the first object to be joined supported by the first heater. The soldering apparatus described in Supplementary Note 3. (Supplementary Note 5) The first heater (120) heats the workpiece at a temperature equal to or higher than the melting point of the solder to melt the solder. The soldering apparatus (110) described in Supplementary Note 2. (Supplementary Note 6) The first heater supports the workpiece by supporting the first object to be joined. A pressing member (140) is further provided to press the workpiece from the side of the second object to be joined. The soldering apparatus described in Supplementary Note 5. (Supplementary Note 7) The first heater includes a through hole (H) into which the vibration applying portion is inserted so as to contact the first object to be joined, and supports the first object to be joined in a state where the first object to be joined covers the through hole. The soldering apparatus according to any one of Supplementary Notes 2 to 6. (Supplementary Note 8) A heat insulating portion (191) is further provided between the first heater and the vibration applying portion to insulate heat from the first heater. The soldering apparatus according to any one of Supplementary Notes 1 to 7. (Supplementary Note 9) A cooling portion (192) for suppressing the temperature rise of the vibration applying portion is further provided. The soldering apparatus according to any one of Supplementary Notes 1 to 8. (Supplementary Note 10) The heater (40) contacts the second object to be joined and heats the workpiece from the side of the second object to be joined at a temperature equal to or higher than the melting point of the solder. The vibration applying unit contacts the first object to be joined and applies the ultrasonic vibration to the workpiece from the side of the first object to be joined. The soldering apparatus (10) according to Supplementary Note 1. (Supplementary Note 11) A soldering apparatus (10, 110) for joining a first object to be joined (W1) and a second object to be joined (W2) with solder (S) disposed therebetween, A heater (40, 140) for heating a workpiece (W) including the first object to be joined, the second object to be joined, and the solder, A vibration applying unit (30) disposed at a distance from the heater and applying ultrasonic vibration to a location on the workpiece different from the contact location of the heater, A controller (80) that performs control to start applying the ultrasonic vibration from the vibration applying unit to the workpiece to break an oxide film of the workpiece during a period in which the workpiece is heated by the heater and the solder is in a solid-liquid mixed state, A soldering apparatus comprising the same. (Supplementary Note 12) As the control, the controller performs control to gradually increase an output level of the ultrasonic vibration output from the vibration applying unit to reach a level that breaks the oxide film during the period. The soldering apparatus according to Supplementary Note 11. (Supplementary Note 13) As the control, the controller detects, as a timing when the solder becomes the solid-liquid mixed state, a timing when a position of the second object to be joined detected by a sensor (70) reaches a predetermined position on the side of the first object to be joined, and performs control to start the application upon detection of the timing. The soldering apparatus according to Supplementary Note 11 or 12. (Supplementary Note 14) As the control, the controller detects, as the timing when the temperature of a predetermined portion of the workpiece measured by the sensor (170) reaches a predetermined temperature, the timing when the solder reaches the solid-liquid mixed state, and starts the application upon detection of the detected timing. The soldering apparatus according to appended claim 11 or 12. (Appended claim 15) The sensor is a thermography that generates a thermal distribution of the workpiece. In the control, the controller detects the timing based on the thermal distribution generated by the thermography. The soldering apparatus according to appended claim 14. (Appended claim 16) In the control, the controller starts the application by pressing the vibration application unit that outputs the ultrasonic vibration for breaking the oxide film against the workpiece upon detection of the timing. The soldering apparatus according to any one of appended claims 11 to 15. (Appended claim 17) A method for producing a bonded object that bonds a first bonding target and a second bonding target with solder disposed therebetween, using a soldering apparatus including a heater that heats a workpiece including the first bonding target, the second bonding target, and the solder therebetween to melt the solder, and a vibration application unit that is disposed at a distance from the heater and applies ultrasonic vibration to a location of the workpiece different from the contact location of the heater, starting to apply the ultrasonic vibration for breaking the oxide film of the workpiece from the vibration application unit to the workpiece during a period in which the workpiece is heated by the heater and a part of the solder is in a solid-liquid mixed state where it is melted. A method for producing a bonded object.

[0046] (Scope of the present invention) The present invention has been described with reference to the embodiments and modified examples above, but the present invention is not limited to the above embodiments and modified examples. For example, the present invention includes various changes to the above embodiments and modified examples that can be understood by those skilled in the art within the scope of the technical idea of the present invention. Each configuration described in the above embodiments and modified examples can be appropriately combined within a non - conflicting range. Also, the omission of each configuration is optional.

Description of Reference Numerals

[0047] 10, 110... Soldering device, 20... Pre - heating heater, 21... Stage, 22... Heating resistor, 30... Vibration applying unit, 31... Ultrasonic vibrator, 32... Ultrasonic horn, 40... Main heating heater, 50... Moving mechanism, 51... Driving device, 52... Arm, 60... Moving mechanism, 61... Driving device, 62... Arm, 70, 170... Sensor, 80... Controller, 120... Main heating heater, 140... Pressing member, 191... Heat - insulating part, 192... Cooling part, H... Through - hole, S... Solder, T... Reference position, W... Workpiece, W1... Joining target, W2... Joining target.

Claims

1. A soldering device for joining a first joining target and a second joining target with solder disposed therebetween, comprising: a heater for heating a workpiece including the first joining target, the second joining target, and the solder; a vibration application unit disposed at a distance from the heater and applying ultrasonic vibration to a location of the workpiece different from a contact location of the heater; a controller that performs control to start application of the ultrasonic vibration from the vibration application unit to the workpiece to break an oxide film of the workpiece during a period in which the workpiece is heated by the heater and the solder is in a solid-liquid mixed state; A soldering device comprising the above.

2. The controller performs control to gradually increase an output level of the ultrasonic vibration output from the vibration application unit to reach a level for breaking the oxide film during the period. The soldering device according to claim 1. The soldering device according to claim 1.

3. The controller performs control to detect, as a timing when the solder becomes the solid-liquid mixed state, a timing when a position of the second joining target detected by a sensor reaches a predetermined position on the side of the first joining target, and starts the application upon detection of the timing. The soldering device according to claim 1. The soldering device according to claim 1.

4. The controller performs control to detect, as a timing when the solder becomes the solid-liquid mixed state, a timing when a temperature of a predetermined location of the workpiece measured by a sensor reaches a predetermined temperature, and starts the application upon detection of the detected timing. The soldering device according to claim 1. The soldering device according to claim 1.

5. The sensor is a thermography that generates a heat distribution of the workpiece, and the controller detects the timing based on the heat distribution generated by the thermography in the control. The soldering device according to claim 4. The soldering device according to claim 4.

6. In the control, the controller starts the application by pressing the vibration application unit that is outputting the ultrasonic vibration for breaking the oxide film against the workpiece upon detection of the timing. The soldering device according to any one of claims 3 to 5. The soldering device according to any one of claims 3 to 5.

7. A method for producing a joined object by joining a first joining target and a second joining target with solder disposed therebetween, comprising: ​ A soldering apparatus comprising: a heater that heats a workpiece including a first joining target, a second joining target, and solder therebetween to melt the solder; and a vibration application unit that is disposed at a distance from the heater and applies ultrasonic vibration to a location of the workpiece different from a contact location of the heater, is used. During a period in which the workpiece is heated by the heater and a part of the solder is in a solid-liquid mixed state in which it is melted, the ultrasonic vibration that destroys the oxide film of the workpiece is started to be applied from the vibration application unit to the workpiece. A method for producing a joined object.

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