Suction device, film deposition apparatus, suction method, and manufacturing method

Abstract

To provide a technique advantageous for reducing suction failure of a substrate on a suction plate.SOLUTION: A suction device has: a substrate support part which supports a peripheral part of a first face of a substrate having the first face and a second face on the opposite side of the first face; a suction plate which adsorbs the second face of the substrate supported by the substrate support part; a first adjusting part which adjusts a relative inclination between the suction plate and a mask stage on which a mask for depositing a pattern onto the first face of the substrate is mounted or the mask; a plurality of pressing members which is provided opposing to each of a plurality of areas of a peripheral part of the second face on the substrate, and used for pressing the substrate from the second face side; and a second adjusting part which adjusts pressing force, in which each of the plurality of pressing members presses the second face of the substrate supported by the substrate support part corresponding to an inclination of the suction plate, in a state where the suction plate is inclined by the first adjusting part.SELECTED DRAWING: Figure 7

Description

Technical Field

[0001] The present invention relates to an adsorption device, a film forming device, an adsorption method, and a manufacturing method.

Background Art

[0002] An organic EL display device (organic EL display) is applied to, for example, a smartphone, a television, an automotive display, a VR HMD (Virtual Reality Head Mount Display), and the like. In the process of manufacturing an organic EL display device, a film forming device is generally used when forming an organic light emitting element (organic EL element: OLED) on a substrate.

[0003] The film forming device attaches a deposited substance (film forming material) emitted from an evaporation source to a substrate through a mask on which a pattern corresponding to a pixel pattern is formed, thereby forming (film forming) a film such as an organic film or a metal film. At this time, it is necessary to accurately align (align) the substrate and the mask.

[0004] Technologies related to the alignment of the substrate and the mask have been proposed conventionally (see Patent Documents 1 and 2). Patent Document 1 discloses a technique for suppressing a decrease in alignment accuracy by adjusting the relative inclination between a suction plate that sucks a substrate and a mask stage on which a mask is placed. Patent Document 2 discloses a technique for reducing the deflection of a substrate supported by a substrate support unit by pressing a plurality of locations (corners) of the substrate before the suction plate sucks the substrate.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0006] However, in the prior art, when a plurality of locations of the substrate supported by the substrate support unit are pressed while the suction plate is tilted in accordance with the tilt of the mask stage, and then the substrate is adsorbed (stuck) to the suction plate, the adsorption failure of the substrate increases. The adsorption failure of the substrate on the suction plate is a factor that increases the process time (Tact Time) and reduces the yield and productivity.

[0007] In view of such problems of the prior art, the present invention is made, and an exemplary object is to provide a technique advantageous for reducing the adsorption failure of the substrate on the suction plate.

Means for Solving the Problems

[0008] In order to achieve the above object, a suction device according to one aspect of the present invention includes a substrate support portion that supports a peripheral portion of a first surface of a substrate including a first surface and a second surface on a side opposite to the first surface, a suction plate that sucks the second surface of the substrate supported by the substrate support portion, a first adjustment portion that adjusts a relative tilt between the suction plate and a mask stage on which a mask for forming a pattern on the first surface of the substrate is placed or the mask, a plurality of pressing members provided to face each of a plurality of locations on a peripheral portion of the second surface of the substrate and configured to press the substrate from the side of the second surface, and a second adjustment portion that adjusts a pressing force with which each of the plurality of pressing members presses the second surface of the substrate supported by the substrate support portion in accordance with the tilt of the suction plate in a state where the suction plate is tilted by the first adjustment portion.

[0009] A further object or other aspect of the present invention will be clarified by embodiments described below with reference to the accompanying drawings.

Effects of the Invention

[0010] According to the present invention, for example, it is possible to provide a technique advantageous for reducing the adsorption failure of the substrate on the suction plate.

Brief Description of the Drawings

[0011]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Embodiments for Carrying Out the Invention

[0012] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the invention according to the claims, and not all combinations of the features described in the embodiments are essential for the invention. Two or more of the plurality of features described in the embodiments may be arbitrarily combined. Also, the same or similar configurations are given the same reference numerals, and duplicate explanations are omitted.

[0013] FIG. 1 schematically shows a part of the configuration (layout) of a manufacturing line of an electronic device to which a film forming apparatus as one aspect of the present invention can be applied. The manufacturing line shown in FIG. 1 is used, for example, for manufacturing a display panel of an organic EL display device for a smartphone, and a substrate 100 is sequentially conveyed to a film forming block 301 (film forming section), and a film forming process for organic EL is performed on the substrate 100.

[0014] Around a transfer chamber 302 having an octagonal shape in plan view in the film forming block 301, a plurality of film forming chambers 303a to 303d for performing a film forming process on the substrate 100 and a mask storage chamber 305 for storing a mask used in the film forming process are arranged. In the transfer chamber 302, a transfer robot 302a for transferring the substrate 100 is provided. The transfer robot 302a includes a hand for holding the substrate 100 and an articulated arm for moving the hand in the horizontal direction. In other words, the film forming block 301 is a cluster type film forming unit in which a plurality of film forming chambers 303a to 303d are arranged so as to surround the transfer robot 302a. When the film forming chambers 303a to 303d are collectively referred to, or when the film forming chambers 303a to 303d are not particularly distinguished, they are denoted as film forming chamber 303.

[0015] On each of the upstream side and the downstream side of the film forming block 301 in the transfer direction (arrow direction) of the substrate 100, a buffer chamber 306, a turning chamber 307, and a delivery chamber 308 are arranged. In the manufacturing process, each of the film forming chamber 303, the mask storage chamber 305, the buffer chamber 306, the turning chamber 307, and the delivery chamber 308 is maintained in a vacuum state (vacuum atmosphere). In FIG. 1, only one film forming block 301 is shown, but it is not limited thereto. For example, the manufacturing line may have a plurality of film forming blocks 301, and the plurality of film forming blocks 301 may be connected by a connecting device composed of a buffer chamber 306, a turning chamber 307, and a delivery chamber 308. However, the connecting device may be composed of, for example, only the buffer chamber 306 or the delivery chamber 308.

[0016] The transfer robot 302a transfers the substrate 100 from the upstream delivery chamber 308 to the transfer chamber 302 and also transfers the substrate 100 between the plurality of film deposition chambers 303a to 303d. Further, the transfer robot 302a also transfers the mask between the mask storage chamber 305 and the film deposition chamber 303 and discharges the substrate 100 from the transfer chamber 302 to the downstream buffer chamber 306.

[0017] The buffer chamber 306 is a chamber for temporarily storing the substrate 100 according to the operating status of the manufacturing line. The buffer chamber 306 is provided with a substrate storage shelf, also referred to as a cassette, and a lifting mechanism. The substrate storage shelf has a multi-stage structure capable of storing a plurality of substrates 100 while maintaining the state (horizontal state) in which the first surface (film deposition surface) of the substrate 100 faces downward in the direction of gravity (vertical direction). The lifting mechanism adjusts the stage for loading or unloading the substrate 100 to the transfer position by raising and lowering the substrate storage shelf. Thus, the buffer chamber 306 has a function of temporarily storing and retaining a plurality of substrates 100.

[0018] The turning chamber 307 is provided with a transfer robot as a mechanism for changing the orientation of the substrate 100. In the present embodiment, in the turning chamber 307, the transfer robot provided in the turning chamber 307 rotates the orientation of the substrate 100 by 180 degrees. The transfer robot provided in the turning chamber 307 supports the substrate 100 carried in from the buffer chamber 306 and turns 180 degrees to discharge it to the delivery chamber 308, so that the front end and the rear end of the substrate 100 are interchanged between the buffer chamber 306 and the delivery chamber 308. Therefore, since the orientation when the substrate 100 is loaded into the film deposition chamber 303 is the same in each film deposition block 301, in each film deposition block 301, the scan direction and the orientation of the mask in the film deposition process for the substrate 100 can be made to coincide. As a result, in each film deposition block 301, the orientation of storing the mask in the mask storage chamber 305 can be made uniform, the management of the mask is simplified, and the usability can be improved.

[0019] The manufacturing line has, as a control system, a host device 300 that controls the entire line as a host computer, and control devices 14a to 14d, 309, and 310 that control each component. The host device 300, the control devices 14a to 14d, 309, and 310 can communicate via a wired or wireless communication line 300a. The control devices 14a to 14d are provided corresponding to each of the plurality of film deposition chambers 303a to 303d, and control the film deposition apparatus 1 provided in each film deposition chamber. Incidentally, when collectively referring to the control devices 14a to 14d, or when not particularly distinguishing, they are denoted as the control device 14.

[0020] The control device 309 controls the transfer robot 302a. The control device 310 controls the devices provided in the turntable chamber 307. The host device 300 transmits instructions such as information regarding the substrate 100 and transfer timing to the control devices 14, 309, and 310. The control devices 14, 309, and 310 control each device based on the instructions received from the host device 300.

[0021] FIG. 2 is a diagram schematically showing the configuration of a film forming apparatus 1 as one aspect of the present invention. The film forming apparatus 1 is provided in a film forming chamber 303. The film forming apparatus 1 performs a film forming process of depositing (vapor depositing) a deposition material on a substrate 100 to form a film. In the present embodiment, through a mask 101, a predetermined pattern (thin film of the deposition material) is formed on the first surface 100A of the substrate 100. As the material of the substrate 100, materials such as glass, resin, and metal can be appropriately selected, and a substrate having a resin layer such as polyimide formed on glass is preferably used. As the deposition material, substances such as organic materials and inorganic materials (for example, metals, metal oxides, etc.) are used. The film forming apparatus 1 can be applied to manufacturing apparatuses for manufacturing electronic devices such as display devices (flat panel displays, etc.), thin film solar cells, organic optoelectronic conversion elements (organic thin film imaging elements), and optical members. The film forming apparatus 1 is particularly suitable for a manufacturing apparatus for manufacturing an organic EL panel. Here, an example in which the film forming apparatus 1 performs a film forming process on the substrate 100 by vacuum evaporation will be described, but the present invention is not limited to this, and various film forming processes (film forming methods) such as sputtering and CVD can be applied. In each figure, the arrow Z indicates the vertical direction (gravity direction), and the arrows X and Y indicate horizontal directions orthogonal to each other.

[0022] The film forming apparatus 1 has a box-shaped vacuum chamber 3. The internal space 3a of the vacuum chamber 3 is maintained in a vacuum atmosphere or an inert gas atmosphere such as nitrogen gas. In the present embodiment, the vacuum chamber 3 is connected to a vacuum pump (not shown) in order to maintain the internal space 3a in a vacuum atmosphere. Note that "vacuum" means a state filled with a gas having a pressure lower than atmospheric pressure, that is, a reduced pressure state. The vacuum chamber 3 defines an internal space 3a that houses a substrate support unit 6, a mask stage 5 on which the mask 101 is placed, a film forming unit 4, a plate unit 9, and a suction plate 15.

[0023] Mask 101 has an opening pattern corresponding to a pattern (thin film) formed on the first surface 100A of the substrate 100. The mask 101 is placed on the mask stage 5 and fixed at a predetermined position. The mask stage 5 can be replaced with other mechanisms for fixing the mask 101 at a predetermined position. As the mask 101, a mask having a structure in which a mask foil with a thickness of about several μm to several tens of μm is welded to a frame-shaped mask frame can be used. The material of the mask 101 is not particularly limited, but it is preferable to use a metal with a small coefficient of thermal expansion such as an Invar material. The film forming process is performed in a state where the substrate 100 is placed on the mask 101 and the substrate 100 and the mask 101 are overlapped with each other.

[0024] The plate unit 9 includes a cooling plate 10 and a magnet plate 11. The cooling plate 10 is suspended below the magnet plate 11 so as to be displaceable in the Z direction with respect to the magnet plate 11. The cooling plate 10 is a plate-like member having a function of cooling the substrate 100 adsorbed by the adsorption plate 15 by contacting the adsorption plate 15 in the film forming process. The cooling plate 10 is not limited to a plate that actively cools the substrate 100 including a water cooling mechanism or the like. Even if a water cooling mechanism or the like is not provided, it may be a plate that takes away the heat of the substrate 100 by contacting the adsorption plate 15 to cool it. The magnet plate 11 is a plate that attracts the mask 101 by magnetic force. The magnet plate is disposed above the second surface 100B on the side opposite to the first surface 100A of the substrate 100, and improves the adhesion between the substrate 100 and the mask 101 in the film forming process. However, the cooling plate 10 and the magnet plate 11 (plate unit 9) are not necessarily provided. For example, when a cooling mechanism is provided on the adsorption plate 15, the cooling plate 10 may not be provided. Also, when the adsorption plate 15 adsorbs the mask 101, the magnet plate 11 may not be provided.

[0025] The film forming unit 4 includes a heater, a shutter, a drive mechanism, an evaporation rate monitor, etc., and is an evaporation source for depositing a deposition material on the substrate 100. In this embodiment, the film forming unit 4 is embodied as a linear evaporation source in which a plurality of nozzles (not shown) are arranged side by side in the X direction, and the deposition material is discharged upward from each nozzle, and is reciprocally driven in the Y direction.

[0026] The film forming apparatus 1 includes a substrate support unit 6, a suction plate 15, a position adjustment unit 20, a distance adjustment unit 22, a plate unit lifting unit 13, a first measurement unit 7, a second measurement unit 8, and an adjustment unit 17. Further, the film forming apparatus 1 includes a plurality of pressing members 80 and a control device 14 (control unit).

[0027] The substrate support unit 6 (substrate support portion) supports the substrate 100 carried into the film forming apparatus 1 by the transfer robot 302a in a horizontal posture. The substrate support unit 6 includes a base portion 61 that constitutes its outer frame and a plurality of support portions 62 that protrude inward from the base portion 61.

[0028] The plurality of support portions 62 are arranged on the base portion 61 at intervals along the peripheral edge of the substrate 100. The plurality of support portions 62 have a function of supporting the peripheral edge of the first surface 100A of the substrate 100, and are also referred to as "receiving claws" or "fingers". Note that the "peripheral edge" does not necessarily include the peripheral edge of the substrate 100. For example, the plurality of support portions 62 may support the substrate 100 by not contacting the peripheral edge of the first surface 100A of the substrate 100 and contacting a portion that is separated from the peripheral edge by a predetermined distance toward the center of the substrate 100.

[0029] In this embodiment, the plurality of support portions 62 are configured by leaf springs. Therefore, when the substrate 100 supported by the plurality of support portions 62 is adsorbed to the suction plate 15, the substrate 100 can be pressed against the suction plate 15 by the elastic force of the leaf springs. Further, a configuration may be adopted in which a plurality of clamp portions corresponding to each of the plurality of support portions 62 are provided, and the substrate 100 is supported by sandwiching the substrate 100 between the plurality of support portions 62 and the plurality of clamp portions.

[0030] The suction plate 15 is provided above the substrate support unit 6 (a plurality of support portions 62) in the internal space 3a of the vacuum chamber 3, and sucks the second surface 100B of the substrate 100 supported by the substrate support unit 6. As shown in FIG. 2, the suction plate 15 is provided between the substrate support unit 6 and the plate unit 9 and is supported by one or a plurality of support shafts R1. In the present embodiment, the suction plate 15 is supported by four support shafts R1. The support shaft R1 is constituted by, for example, a cylindrical shaft.

[0031] In the present embodiment, the suction plate 15 is embodied as an electrostatic chuck that sucks the substrate 100 by electrostatic force. For example, the suction plate 15 has a structure in which an electric circuit such as a metal electrode is embedded inside a matrix (substrate) made of a ceramic material. When a plus (+) and a minus (-) voltage are applied to the metal electrodes arranged in the electrode arrangement region, polarized charges are induced in the substrate 100 through the matrix. Thereby, the substrate 100 is adsorbed (fixed) to the adsorption surface 150 of the suction plate 15 by the electrostatic attractive force (electrostatic force) between the substrate 100 and the suction plate 15. A plurality of electrode arrangement regions may be provided on the suction surface 150 of the suction plate 15 so as to be separated from each other. Also, one electrode arrangement region may be provided over substantially the entire surface of the suction surface 150 of the suction plate 15.

[0032] A plurality of touch sensors 1621 are embedded in the suction plate 15, specifically, in the suction surface 150, as sensors for detecting the contact between the suction plate 15 and the substrate 100. By providing the touch sensors 1621 at a plurality of locations on the suction surface 150 of the suction plate 15, it becomes possible to detect (confirm) that the entire second surface 100B of the substrate 100 is adsorbed to the suction surface 150. The number and arrangement of the touch sensors 1621 can be set as appropriate.

[0033] In this embodiment, the touch sensor 1621 mechanically detects the contact between the suction plate 15 and the substrate 100. For example, the tip of the touch sensor 1621 is biased by a spring or the like, and is provided so that the tip protrudes from the suction surface 150 when it is not in contact with the substrate 100 (the second surface 100B thereof). When the substrate 100 comes into contact with the tip of the touch sensor 1621, the tip is pushed into the substrate 100, moves inside the suction surface 150, and contacts the internal contacts to output a predetermined electrical signal. Thereby, the touch sensor 1621 can substantially detect the contact between the suction plate 15 and the substrate 100. Note that the plurality of touch sensors 1621 also function as a detection unit that detects the inclination (parallelism) between the suction plate 15 and the mask stage 5.

[0034] The position adjustment unit 20 adjusts the relative position between the substrate 100 supported by the substrate support unit 6 or the substrate 100 adsorbed by the suction plate 15 and the mask 101. The position adjustment unit 20 adjusts the relative position of the substrate 100 with respect to the mask 101 by displacing the substrate support unit 6 or the suction plate 15 on the XY plane. In other words, the position adjustment unit 20 adjusts the relative horizontal position between the mask 101 and the substrate 100. For example, the position adjustment unit 20 is configured to be able to displace the substrate support unit 6 in the X direction, the Y direction, and the rotational directions around the axes in the Z direction. In this embodiment, the relative position between the mask 101 and the substrate 100 is adjusted by fixing the position of the mask 101 and displacing the substrate 100. However, the relative position between the mask 101 and the substrate 100 may be adjusted by displacing the mask 101, or the relative position between the mask 101 and the substrate 100 may be adjusted by displacing both the substrate 100 and the mask 101.

[0035] The position adjustment unit 20 includes, for example, a fixed plate 20a, a movable plate 20b, and a plurality of actuators 201 disposed between the fixed plate 20a and the movable plate 20b. The fixed plate 20a is fixed to the upper wall portion 30 of the vacuum chamber 3. Further, a frame-shaped mount 21 is placed on the movable plate 20b. The mount 21 supports the distance adjustment unit 22 and the plate unit lifting unit 13. When the movable plate 20b is displaced horizontally with respect to the fixed plate 20a by the actuator 201, the mount 21, the distance adjustment unit 22, and the plate unit lifting unit 13 are displaced integrally.

[0036] The plurality of actuators 201 include, for example, an actuator capable of displacing the movable plate 20b in the X direction and an actuator capable of displacing the movable plate 20b in the Y direction. By driving (controlling) the plurality of actuators 201, the movable plate 20b can be displaced in the X direction, the Y direction, and the rotational direction around the axes in the Z direction. For example, each of the plurality of actuators 201 includes a motor as a drive source and a ball screw mechanism that converts the driving force of the motor into linear motion.

[0037] The distance adjustment unit 22 has a function of adjusting the distance between the suction plate 15 and the substrate support unit 6 and the mask table 5 by raising and lowering the suction plate 15 and the substrate support unit 6. In this embodiment, the distance adjustment unit 22 approaches and separates (separates) the substrate 100 and the mask 101 in the thickness direction (Z direction) of the substrate 100. In other words, the distance adjustment unit 22 approaches the substrate 100 and the mask 101 in the overlapping direction or separates them in the opposite direction. The "distance" adjusted by the distance adjustment unit 22 is a vertical distance (perpendicular distance). Therefore, it can be said that the distance adjustment unit is a unit that adjusts the relative position between the mask 101 and the substrate 100 in the vertical direction.

[0038] As shown in Fig. 2, the distance adjustment unit 22 includes a first lifting plate 220. The first lifting plate 220 is configured to be movable up and down in the Z direction along a guide rail 21a extending in the Z direction formed on the side of the gantry 21. The first lifting plate 220 supports the suction plate 15 via a plurality of support shafts R1. When the first lifting plate 220 moves up and down, the suction plate 15 moves up and down accordingly. Specifically, since the first lifting plate 220 supports a plurality of support shafts R1 that support the suction plate 15, the plurality of support shafts R1 move up and down synchronously with the up and down movement of the first lifting plate 220, and the suction plate 15 moves up and down while maintaining parallelism.

[0039] Further, the first lifting plate 220 supports the substrate support unit 6 via a plurality of actuators 65 and a plurality of support shafts R3. When the first lifting plate 220 moves up and down, the substrate support unit 6 moves up and down accordingly. Each of the plurality of actuators 65 is connected to the plurality of support shafts R3. The actuator 65 includes, for example, a motor, a ball screw mechanism, etc., and drives the support shaft R3 in the vertical direction. The substrate support unit 6 is driven relatively in the vertical direction with respect to the suction plate 15 by the plurality of actuators 65.

[0040] The distance adjustment unit 22 is supported by the gantry 21 and includes a drive unit 221 that functions as an actuator for raising and lowering the first lifting plate 220. The drive unit 221 is a transmission mechanism that transmits the driving force of the motor 221a (driving source) to the first lifting plate 220. In this embodiment, as the transmission mechanism, the drive unit 221 employs a ball screw mechanism including a ball screw shaft 221b and a ball nut 221c. The ball screw shaft 221b extends in the Z direction and rotates around the axis in the Z direction by the driving force of the motor 221a. The ball nut 221c is fixed to the first lifting plate 220 and engages with the ball screw shaft 221b. By rotating the ball screw shaft 221b and switching the rotation direction of the ball screw shaft 221b, the first lifting plate 220 can be raised and lowered in the Z direction. The amount of lifting of the first lifting plate 220 is controlled based on the detection result of a sensor such as a rotary encoder that detects the rotation amount of each motor 221a. Thereby, the position of the suction plate 15 that sucks the substrate 100 in the Z direction can be controlled, and the contact and separation between the substrate 100 and the mask 101 can be controlled.

[0041] In this embodiment, the distance adjustment unit 22 adjusts the distance between the mask stage 5 and the substrate support unit 6 and the suction plate 15 in the Z direction by fixing the position of the mask stage 5 and displacing the substrate support unit 6 and the suction plate 15. However, the distance between the mask stage 5 and the substrate support unit 6 and the suction plate 15 may be adjusted by fixing the position of the substrate support unit 6 or the suction plate 15 and displacing the mask stage 5. Also, the distance between the mask stage 5 and the substrate support unit 6 and the suction plate 15 may be adjusted by displacing each of the substrate support unit 6, the suction plate 15, and the mask stage 5.

[0042] The plate unit lifting unit 13 lifts the plate unit 9 that is connected to the second lifting plate 12 and disposed inside the vacuum chamber 3 by lifting the second lifting plate 12 disposed outside the vacuum chamber 3. The plate unit 9 is connected to the second lifting plate 12 via one or a plurality of support shafts R2. In the present embodiment, the plate unit 9 is supported by two support shafts R2. The support shaft R2 extends upward from the magnet plate 11, passes through the openings of the upper wall portion 30, the fixed plate 20a and the movable plate 20b, and the opening of the first lifting plate 220, and is connected to the second lifting plate 12.

[0043] The second lifting plate 12 is configured to be movable up and down in the Z direction along the guide shaft 12a. The plate unit lifting unit 13 is supported by the gantry 21 and includes a drive mechanism for lifting the second lifting plate 12. The plate unit lifting unit 13 is a transmission mechanism that transmits the driving force of the motor 13a (driving source) to the second lifting plate 12. In the present embodiment, the plate unit lifting unit 13 employs a ball screw mechanism including a ball screw shaft 13b and a ball nut 13c as the transmission mechanism. The ball screw shaft 13b extends in the Z direction and rotates around the axis in the Z direction by the driving force of the motor 13a. The ball nut 13c is fixed to the second lifting plate 12 and engages with the ball screw shaft 13b. By the rotation of the ball screw shaft 13b and the switching of the rotation direction of the ball screw shaft 13b, the second lifting plate 12 can be lifted and lowered in the Z direction. The lifting amount of the second lifting plate 12 is controlled based on the detection result of a sensor such as a rotary encoder that detects the rotation amount of each motor 13a. Thereby, the position of the plate unit 9 in the Z direction can be controlled, and the contact and separation between the plate unit 9 and the substrate 100 can be controlled.

[0044] The openings in the upper wall portion 30 of the vacuum chamber 3 through which the respective support shafts R1 to R3 pass have dimensions that allow the respective support shafts R1 to R3 to be displaced in the X and Y directions. In order to maintain the airtightness of the vacuum chamber 3, bellows or the like are provided in the openings in the upper wall portion 30 through which the respective support shafts R1 to R3 pass. For example, the support shaft R1 that supports the first lifting plate 220 is covered with a bellows.

[0045] The first measurement unit 7 and the second measurement unit 8 function as measurement units that measure the positional displacement between the substrate 100 and the mask 101 supported by the substrate support unit 6. In the present embodiment, the first measurement unit 7 and the second measurement unit 8 include an imaging device (camera) that images the substrate 100 and the mask 101 to acquire an image. The first measurement unit 7 and the second measurement unit 8 are disposed above the upper wall portion 30, and image the substrate 100 and the mask 101 disposed in the internal space 3a of the vacuum chamber 3 through a window portion (not shown) formed in the upper wall portion 30 to acquire an image.

[0046] The first measurement unit 7 includes a low-magnification CCD camera (rough camera) that has a relatively wide field of view and a low resolution. The first measurement unit 7 images the rough alignment marks formed on the substrate 100 and the rough alignment marks formed on the mask 101 to acquire an image, and measures the rough positional displacement between the substrate 100 and the mask 101 from the relative positions of those marks.

[0047] The second measurement unit 8 includes a high-magnification CCD camera (fine camera) that has a relatively narrow field of view and a high resolution (for example, on the order of several μm). The second measurement unit 8 images the fine alignment marks formed on the substrate 100 and the fine alignment marks formed on the mask 101 to acquire an image, and measures the positional displacement between the substrate 100 and the mask 101 with high precision from the relative positions of those marks.

[0048] In the present embodiment, under the control of the control device 14, as alignment between the substrate 100 and the mask 101, rough alignment and fine alignment are sequentially performed. In the rough alignment, based on the measurement result of the first measurement unit 7, the relative position between the substrate 100 and the mask 101 is roughly adjusted. In the fine alignment, based on the measurement result of the second measurement unit 8, the relative position between the substrate 100 and the mask 101 is precisely adjusted.

[0049] The adjustment unit 17 (first adjustment unit) has a function of adjusting the relative inclination between the suction plate 15 and the mask stage 5. In the present embodiment, the adjustment unit 17 adjusts the relative inclination between the suction plate 15 and the mask stage 5 by tilting (driving) the suction plate 15 with respect to the mask stage 5. Specifically, the adjustment unit 17 adjusts the relative inclination between the suction plate 15 and the mask stage 5 by adjusting the axial positions of at least a part of the plurality of support shafts R1.

[0050] FIG. 3 is a diagram schematically showing the configuration of the adjustment unit 17. As shown in FIG. 3, the adjustment unit 17 includes a bent portion 18 provided between the support shaft R1 and the suction plate 15. The bent portion 18 variably connects the support shaft R1 and the suction plate 15 such that the angle of the suction plate 15 with respect to the support shaft R1 can be changed. In the present embodiment, the plurality of support shafts R1 are configured to be drivable only in the vertical direction (axial direction). Therefore, as shown as state ST1 on the left side of FIG. 3, in the state where the suction plate 15 is maintained horizontally, and as shown as state ST2 on the right side of FIG. 3, in the state where the suction plate 15 is tilted, the angle formed by the suction plate 15 with respect to the support shaft R1 is different. In the present embodiment, by bending the suction plate 15 with respect to the support shaft R1 at the bent portion 18, the support shaft R1 can support the suction plate 15 even when the suction plate 15 is tilted. Note that the bent portion 18 can be appropriately set to have a structure that connects two members such as a universal joint so that the connection angle can be changed. Further, in order to reduce the load applied to the mask 101 when the suction plate 15 contacts the mask 101 and to ensure the escape of the suction plate 15 when the suction plate 15 and the mask 101 come into contact, it is preferable to provide a floating portion 19 between the bent portion 18 and the suction plate 15.

[0051] The pressing member 80 is provided so as to face each of a plurality of locations on the peripheral edge of the second surface 100B of the substrate 100 supported by the substrate support unit 6 above the suction plate 15. In the present embodiment, the pressing member 80 is a pin-shaped member for pressing the corner portion of the second surface 100B of the substrate 100 supported by the substrate support unit 6 from the side of the second surface 100B of the substrate 100, and includes a contact end 81 that contacts (abuts) the second surface 100B of the substrate 100. Therefore, as shown in FIG. 4, through holes 151 that penetrate the suction plate 15 are formed in the suction plate 15 between the suction surface 150 and the surface opposite to the suction surface corresponding to each of the plurality of pressing members 80. In this way, the pressing member 80 is configured to be able to press from the side of the second surface 100B of the substrate 100 by protruding the contact end 81 from the suction surface 150 of the suction plate 15 through the through hole 151. Note that the corner portion of the substrate 100 does not mean a mathematically exact "corner", and may be a rounded corner by, for example, R processing. FIG. 4 is a diagram showing the positional relationship between the through hole 151 formed in the suction plate 15 and the pressing member 80. In FIG. 4, only the suction plate 15 and the substrate support unit 6 (support portion 62) are simply illustrated in order to more clearly show the technical features of the present embodiment.

[0052] In the present embodiment, the suction plate 15 sucks the substrate 100 pressed by the pressing member 80. In other words, before sucking the second surface 100B of the substrate 100 by the suction plate 15, the substrate 100 is pressed from the side of the second surface 100B by the plurality of pressing members 80. Thereby, the central portion of the substrate 100, which was supported at the peripheral edge by the substrate support unit 6 and was bent downward due to its own weight, is lifted, and the substrate 100 can be sucked to the suction plate 15 in a state where the bending of the substrate 100 is reduced or the bending of the substrate 100 is removed. Therefore, not only can the time required to suck the substrate 100 to the suction plate 15 be shortened, but also it is possible to suppress wrinkles from remaining on the substrate 100 sucked to the suction plate 15.

[0053] In this embodiment, the pressing region where the pressing member 80 presses the second surface 100B of the substrate 100 is located at the corner of the substrate 100. Therefore, the pressing member 80 is provided at a position facing the corner of the second surface 100B of the substrate 100 supported by the substrate support unit 6. Specifically, the pressing region of the pressing member 80 is located at at least two of the four corners of the substrate 100. For example, as shown in FIG. 5, the pressing region 80a of the pressing member 80 is provided so as to face a pair of corners located on the diagonal line among the four corners of the substrate 100. Thereby, it is possible to effectively press the substrate 100 while minimizing the number of pressing members 80. Further, as shown in FIG. 6, the pressing region 80a of the pressing member 80 may be provided so as to face all of the four corners of the substrate 100. In this way, by pressing two or four corners of the substrate 100 with the pressing member 80, the deflection of the central portion of the substrate 100 supported by the substrate support unit 6 is lifted, so that the deflection of the substrate 100 can be reduced to be substantially flat. In particular, by pressing the corners away from the central portion where the deflection of the substrate 100 is the largest with the pressing member 80, the deflection of the substrate 100, particularly the deflection of the central portion, can be effectively reduced. FIGS. 5 and 6 are diagrams schematically showing an example of the pressing region 80a of the pressing member 80 on the second surface 100B of the substrate 100.

[0054] As shown in FIGS. 5 and 6, the pressing member 80 is provided at a position facing the corner of the second surface 100B of the substrate 100 supported by the substrate support unit 6. Therefore, the pressing region 80a of the pressing member 80 and the support region 6a which is the region of the first surface 100 where the substrate support unit 6 (support portion 62) supports the substrate 100 do not overlap when viewed from a direction (vertical direction) perpendicular to the first surface 10A or the second surface 100B. Further, the projection region obtained by vertically projecting the support region 6a onto the second surface 100B of the substrate 100 and the pressing region 80a are arranged along the virtual line L forming a rectangle as shown in FIG. 6. Thereby, the pressing member 80 can sufficiently press the substrate 100 without being restricted by the substrate support unit 6 (support portion 62).

[0055] The control device 14 controls the entire film forming apparatus 1. The control device 14 includes a processing unit 141, a storage unit 142, an input / output interface (I / O) 143, a communication unit 144, a display unit 145, and an input unit 146. The processing unit 141 includes a processor represented by a CPU, and executes a program stored in the storage unit 142 to control the film forming apparatus 1. The storage unit 142 includes storage devices such as a ROM, a RAM, and an HDD, and stores programs executed by the processing unit 141 and various control information. The I / O 143 is an interface that transmits and receives signals between the processing unit 141 and external devices. The communication unit 144 is a communication device that communicates with a host device 300 or control devices 14, 309, and 310 via a communication line 300a. The processing unit 141 receives information from the host device 300 or transmits information to the host device 300 via the communication unit 144. The display unit 145 includes, for example, a liquid crystal display and displays various information. The input unit 146 includes, for example, a keyboard and a pointing device and receives various inputs from the user. Note that all or part of the control devices 14, 309, and 310 and the host device 300 may be configured by a PLC, an ASIC, or an FPGA.

[0056] In the film forming apparatus 1, when performing alignment between the substrate 100 and the mask 101, the relative inclination between the suction plate 15 and the mask stage 5 may affect the alignment accuracy. For example, by bringing the substrate 100 and the mask 101 closer to perform alignment, the alignment accuracy can be improved. However, if there is a relative inclination between the suction plate 15 and the mask stage 5, a part of the substrate 100 may contact the mask 101 and the substrate 100 may be damaged. Therefore, in order to avoid damage to the substrate 100, it is necessary to separate the substrate 100 and the mask 101, and the increase in the distance between the substrate 100 and the mask 101 reduces the alignment accuracy.

[0057] In order to suppress such a decrease in alignment accuracy, in the film forming apparatus 1, generally, in a state where the internal space 3a of the vacuum chamber 3 is in an atmospheric pressure environment, the relative inclination between the suction plate 15 and the mask stage 5 is adjusted so that the suction plate 15 and the mask stage 5 are parallel. Such adjustment is performed, for example, by inserting a shim into the connecting portion of the substrate support unit 6.

[0058] On the other hand, even if the suction plate 15 and the mask stage 5 are adjusted to be parallel in an atmospheric pressure environment, when the internal space 3a of the vacuum chamber 3 is changed to a vacuum atmosphere, the vacuum chamber 3 may be distorted due to the pressure difference between the inside and outside of the vacuum chamber 3. When the vacuum chamber 3 is distorted, an inclination occurs between the suction plate 15 and the mask stage 5. However, when the internal space 3a of the vacuum chamber 3 is in a vacuum atmosphere, the inclination between the suction plate 15 and the mask stage 5 cannot be adjusted in the same manner as in the atmospheric environment.

[0059] Therefore, in the present embodiment, in a state where the internal space 3a of the vacuum chamber 3 is in a vacuum atmosphere, the adjustment unit 17 adjusts the inclination between the suction plate 15 and the mask stage 5. Such adjustment is performed in a state where the mask 101 is not placed on the mask stage 5, the substrate 100 is not adsorbed on the suction plate 15, and the substrate 100 is not supported by the substrate support unit 6. Specifically, while lowering the suction plate 15 by the distance adjustment unit 22, for each of the plurality of touch sensors 1621, the timing of contacting the mask stage 5 is monitored to detect the inclination of the mask stage 5, that is, the inclination between the suction plate 15 and the mask stage 5. Then, based on the inclination detected by the touch sensor 1621, the adjustment unit 17 adjusts the axial position of at least a part of the plurality of support shafts R1 so that the suction plate 15 and the mask stage 5 are parallel, and tilts the suction plate 15 with respect to the mask stage 5.

[0060] FIG. 7 is a view showing a state in which the substrate 100 is supported by the substrate support unit 6 (support portion 62) after adjusting the inclination between the suction plate 15 and the mask table 5 so that the suction plate 15 and the mask table 5 are parallel in a vacuum atmosphere. Referring to FIG. 7, although the suction plate 15 and the mask table 5 are parallel, the suction plate 15 is inclined in accordance with the inclination of the mask table 5. In such a state, as described above, consider a case where the substrate 100 is pressed from the side of the second surface 100B by the plurality of pressing members 80 before the second surface 100B of the substrate 100 is adsorbed by the suction plate 15. In this case, when each of the plurality of pressing members 80 is relatively displaced in the vertical direction (Z direction) by the same amount with respect to the suction plate 15, since the suction plate 15 is inclined, the positions of the contact ends 81 of the respective pressing members 80 protruding from the suction surface 150, that is, the protruding amounts are different. This means that the pressing forces for pressing the second surface 100B of the substrate 100 by the respective plurality of pressing members 80 are different (that is, the pressing forces of the respective pressing members 80 with respect to the second surface 100B of the substrate 100 are different). Thus, when the pressing forces of the respective pressing members 80 vary and become non-uniform within the plane of the second surface 100B of the substrate 100, the substrate 100 cannot be uniformly pressed. Therefore, it becomes difficult to effectively reduce the deflection of the substrate 100 supported by the substrate support unit 6, leading to poor adsorption of the substrate 100 on the suction plate 15.

[0061] Therefore, in the present embodiment, in a state where the suction plate 15 is tilted by the adjustment unit 17, a pressing adjustment unit 90 (second adjustment unit) is provided to adjust the pressing force with which each of the plurality of pressing members 80 presses the second surface 100B of the substrate 100 according to the tilt of the suction plate 15. The pressing adjustment unit 90 displaces the positions of the contact ends 81 of the plurality of pressing members 80 in the vertical direction (Z direction) according to the tilt of the suction plate 15 so that the pressing forces of the respective pressing members 80 become uniform (equal) within the plane of the second surface 100B of the substrate 100. Specifically, the pressing adjustment unit 90 displaces the positions of the contact ends 81 of the respective pressing members 80 in the vertical direction (Z direction) so that the protruding amounts of the contact ends 81 of the plurality of pressing members 80 protruding from the suction surface 150 of the suction plate 15 are equal. Thereby, even in a state where the suction plate 15 is tilted, the protruding amounts of the contact ends 81 of the respective pressing members 80 from the suction surface 150 are equal, so that the pressing forces of the respective pressing members 80 become uniform within the plane of the second surface 100B of the substrate 100. Therefore, in the present embodiment, it is possible to effectively reduce the deflection of the substrate 100 supported by the substrate support unit 6, and it is possible to reduce the poor suction of the substrate 100 on the suction plate 15.

[0062] In the present embodiment, the case of adjusting the inclination between the suction plate 15 and the mask table 5 has been described. However, from the viewpoint of suppressing a decrease in alignment accuracy, it is also conceivable to adjust the inclination between the suction plate 15 and the mask 101 placed on the mask table 5. In this case, in a state where the internal space 3a of the vacuum chamber 3 is in a vacuum atmosphere, the adjustment unit 17 adjusts the inclination between the suction plate 15 and the mask 101 placed on the mask table 5. Such adjustment is performed in a state where the mask 101 is placed on the mask table 5, the substrate 100 is not adsorbed to the suction plate 15, and the substrate 100 is not supported by the substrate support unit 6. Specifically, while lowering the suction plate 15 by the distance adjustment unit 22, for each of the plurality of touch sensors 1621, the timing of contact with the mask 101 is monitored to detect the inclination of the mask 101, that is, the inclination between the suction plate 15 and the mask 101. Then, based on the inclination detected by the touch sensor 1621, the adjustment unit 17 adjusts the axial position of at least a part of the plurality of support shafts R1 so that the suction plate 15 and the mask 101 are parallel, and tilts the suction plate 15 with respect to the mask 101.

[0063] Hereinafter, a specific configuration for realizing the above-described functions by the pressing adjustment unit 90 will be described.

[0064] For example, as shown in FIG. 7, the pressing adjustment unit 90 includes a plurality of operation units 901 for displacing the contact end 81 of each of the plurality of pressing members 80 operated by a user (operator) in the vertical direction (Z direction). The plurality of operation units 901 are provided outside the vacuum chamber 3, for example, on the upper wall portion 30, corresponding to each of the plurality of pressing members 80. By providing the operation unit 901 outside the vacuum chamber 3, even if the internal space 3a of the vacuum chamber 3 is in a vacuum atmosphere, the user can perform adjustment by the pressing adjustment unit 90.

[0065] The operation unit 901 is embodied as an adjustment nut that vertically displaces (drives) the pressing member 80, and such an adjustment nut is provided so that the thread formed on the pressing member 80 (or the shaft supporting the pressing member 80) engages therewith. Accordingly, when the user operates the operation unit 901 (turns the adjustment nut), the corresponding pressing member 80 vertically displaces independently of the other pressing members 80. In other words, each of the plurality of operation units 901 can independently adjust the vertical position of the contact end 81 of the corresponding pressing member 80. Accordingly, depending on the inclination of the suction plate 15, when the user operates the operation unit 901, the protrusion amount (the pressing force of each pressing member 80 from the suction surface 150) of the contact end 81 of each pressing member 80 from the suction surface 150 is optimized. From the viewpoint of the degree of freedom regarding the adjustment of the vertical position of the contact end 81 of the pressing member 80, it is preferable to provide the operation unit 901 for each of the plurality of pressing members 80.

[0066] Further, as shown in FIGS. 8(A) and 8(B), the pressing adjustment unit 90 may be embodied as an adjustment mechanism including a plurality of shafts 912, a plurality of motors 914, and the like. Referring to FIG. 8(A), each of the plurality of pressing members 80 is held so as to be vertically drivable (Z direction) above the suction plate 15 via a guide member GM supported by the suction plate 15. The shaft 912 is provided corresponding to each of the plurality of pressing members 80, and one end thereof is located inside the vacuum chamber 3 and the other end is located outside the vacuum chamber 3 via the upper wall portion 30 of the vacuum chamber 3. The shaft 912 is composed of a shaft member whose end portion located inside the vacuum chamber 3 can be connected (abutted) to the pressing member 80. The motor 914 is provided outside the vacuum chamber 3 corresponding to each of the plurality of pressing members 80 (the plurality of shafts 912), and is composed of a stepping motor or a servo motor that drives each of the plurality of shafts 912.

[0067] The rotational motion of the motor 914 is converted into the linear motion of the shaft 912 via a rack-pinion system, a belt-pulley system, or other mechanical combination systems. In this embodiment, the motor 914 and the shaft 912 are configured such that when the motor 914 rotates (is driven), the shaft 912 is driven along the vertical direction (Z direction). Therefore, by driving the shaft 912 in the vertical direction by the motor 914, as shown in FIG. 8(B), the shaft 912 abuts against the pressing member 80 that is held vertically drivable by the guide member GM. In a state where the shaft 912 and the pressing member 80 are in contact, by further driving the shaft 912 in the vertical direction by the motor 914, it becomes possible to displace the contact end 81 of the pressing member 80 in the vertical direction. Thus, when the motor 914 is driven (rotated), the pressing member 80 that abuts against the corresponding shaft 912 is displaced in the vertical direction independently of the other pressing members 80. In other words, each of the plurality of motors 914 can independently adjust the vertical position of the contact end 81 of the pressing member 80 via the corresponding shaft 912. Thereby, by driving the motor 914 according to the inclination of the suction plate 15, the protruding amount (the pressing force of each pressing member 80 from the suction surface 150) of the contact end 81 of each pressing member 80 from the suction surface 150 is optimized via the shaft 912. From the viewpoint of the degree of freedom regarding the adjustment of the vertical position of the contact end 81 of the pressing member 80, it is preferable to provide the motor 914 and the shaft 912 for each of the plurality of pressing members 80.

[0068] Also, in the pressing adjustment unit 90 shown in FIGS. 8(A) and 8(B), in the control device 14, based on the inclination of the suction plate 15, it is possible to control the driving amount of each of the plurality of shafts 912 driven by each of the plurality of motors 914. In other words, under the control of the control device 14, the adjustment of the pressing force of each pressing member 80 in the plane of the second surface 100B of the substrate 100 can be automated. In this case, the inclination of the suction plate 15 may be input by the user via the input unit 146, but from the viewpoint of automating the adjustment of the pressing force of the pressing member 80, it is preferable to provide a detection unit 92 for detecting the inclination of the suction plate 15. Specifically, as the detection unit 92, a touch sensor 922 is provided at the contact end 81 of each of the plurality of pressing members 80. The touch sensors 922 provided at the contact ends 81 of the plurality of pressing members 80 detect contact with the second surface 100 of the substrate 100 supported by the substrate support unit 6 (supporting portion 62).

[0069] While lowering the pressing member 80 by the pressing adjustment unit 90, for each of the plurality of touch sensors 922 provided at the contact end 81 of each pressing member 80, by monitoring the timing of contact with the second surface 100 of the substrate 100, the inclination of the suction plate 15 is detected. Then, based on the inclination of the suction plate 15 detected by the touch sensor 922, the control device 14 controls the driving amount of each shaft 912 driven by each motor 914 so that the protruding amounts of the contact ends 81 of the pressing members 80 protruding from the suction surface 150 are equal. Thereby, the pressing force of each pressing member 80 becomes uniform in the plane of the second surface 100B of the substrate 100, and the deflection of the substrate 100 supported by the substrate support unit 6 can be effectively reduced, and the poor adsorption of the substrate 100 on the suction plate 15 can be reduced.

[0070] Note that the touch sensor 922 that constitutes the detection unit 92 for detecting the inclination of the suction plate 15 can be replaced with a distance measuring sensor. Specifically, a distance measuring sensor that detects the distance between the contact end 81 of the pressing member 80 and the second surface 100B of the substrate 100 supported by the substrate support unit 6 is provided at the contact end 81 of each of the plurality of pressing members 80. In this case, it is not necessary to lower the pressing member 80 by the pressing adjustment unit 90, and the inclination of the suction plate 15 can be obtained from the distances detected by the respective distance measuring sensors.

[0071] Next, in the film forming apparatus 1, a suction method for sucking the substrate 100 by the suction plate 15 will be described. In such a suction method, first, as a first step, the peripheral portion of the first surface 100A of the substrate 100 is supported by the substrate support unit 6 (support portion 62). Next, as a second step, the relative inclination between the suction plate 15 and the mask stage 5 is adjusted by the adjustment unit 17. Next, as a third step, in a state where the suction plate 15 is tilted, the substrate 100 is pressed from the side of the second surface 100B by the plurality of pressing members 80. At this time, the pressing force with which each of the plurality of pressing members 80 presses the substrate 100 is adjusted by the pressing adjustment unit 90 according to the inclination of the suction plate 15 so that the pressing force of each pressing member 80 is uniform within the plane of the second surface 100B of the substrate 100. Then, after the third step, as a fourth step, the substrate 100 pressed by the plurality of pressing members 80 is sucked by the suction plate 15. According to the suction method in the present embodiment, even in a state where the suction plate 15 is tilted, the substrate 100 can be sucked to the suction plate 15 in a state where the deflection of the substrate 100 is reduced or the deflection of the substrate 100 is removed. Therefore, not only can the time required to suck the substrate 100 to the suction plate 15 be shortened, but also the occurrence of wrinkles remaining on the substrate 100 sucked to the suction plate 15 can be suppressed.

[0072] Further, in the film forming process (film forming method) in the film forming apparatus 1, a pattern is formed on the first surface 100A of the substrate 100 adsorbed by the adsorption plate 15 through the mask 101 (fifth step) as described above. At this time, since the substrate 100 is adsorbed to the adsorption plate 15 without wrinkles or the like, a highly accurate pattern can be formed on the first surface 100A of the substrate 100.

[0073] Next, a manufacturing method for manufacturing an electronic device using the film forming apparatus 1 (manufacturing line having the same) in the present embodiment will be described. Here, an organic EL display device will be described as an example of the electronic device.

[0074] First, the organic EL display device will be described. FIG. 9(A) is a diagram showing the overall configuration of the organic EL display device 50. FIG. 9(B) is a diagram showing the cross-sectional structure of one pixel of the organic EL display device 50.

[0075] As shown in FIG. 9(A), the organic EL display device 50 has a display area 51 in which pixels 52 including a plurality of light emitting elements are arranged in a matrix. As will be described later, each of the plurality of light emitting elements has a structure including an organic layer (organic film) sandwiched between a pair of electrodes. In the present embodiment, a pixel means the smallest unit capable of displaying a predetermined color in the display area 51. For example, in the organic EL display device 50, the pixel 52 is constituted by a combination of a first light emitting element 52R, a second light emitting element 52G, and a third light emitting element 52B capable of displaying different colors. The pixel 52 is generally constituted by a combination of a red light emitting element, a green light emitting element, and a blue light emitting element, but is not limited thereto. For example, it may be constituted by a combination of a yellow light emitting element, a cyan light emitting element, and a white light emitting element, and may be constituted by at least one or more light emitting elements.

[0076] FIG. 9(B) is a partial cross-sectional view taken along line A-B shown in FIG. 9(A). The pixel 52 is composed of an organic EL element having an anode 54, a hole transport layer 55, one of light-emitting layers 56R, 56G, and 56B, an electron transport layer 57, and a cathode 58 on a substrate 53. Among these, the hole transport layer 55, the light-emitting layers 56R, 56G, and 56B, and the electron transport layer 57 correspond to organic layers. In the present embodiment, the light-emitting layer 56R is an organic EL layer that emits red light, the light-emitting layer 56G is an organic EL layer that emits green light, and the light-emitting layer 56B is an organic EL layer that emits blue light. The light-emitting layers 56R, 56G, and 56B are formed in patterns corresponding to light-emitting elements (sometimes referred to as organic EL elements) that emit red, green, and blue light, respectively. The anode 54 is formed separately for each light-emitting element. The hole transport layer 55, the electron transport layer 57, and the cathode 58 may be formed in common with the plurality of light-emitting layers 56R, 56G, and 56B, or may be formed for each light-emitting element. In order to prevent the anode 54 and the cathode 58 from being short-circuited by foreign matter, an insulating layer 59 is provided between the electrodes. Further, since the organic EL layer deteriorates due to moisture and oxygen, a protective layer PL for protecting the organic EL element from moisture and oxygen is provided.

[0077] In FIG. 9(B), the hole transport layer 55 and the electron transport layer 57 are shown as one layer, but depending on the structure of the organic EL element, they may be formed of a plurality of layers including a hole blocking layer and an electron blocking layer. Also, a hole injection layer having an energy band structure may be formed between the anode 54 and the hole transport layer 55 so that holes can be smoothly injected from the anode 54 to the hole transport layer 55. Similarly, an electron injection layer may be formed between the cathode 58 and the electron transport layer 57.

[0078] Hereinafter, a method for manufacturing an organic EL display device will be described.

[0079] First, a substrate 53 on which a circuit (not shown) for driving the organic EL display device and the anode 54 are formed is prepared.

[0080] Next, an acrylic resin is spin-coated on the substrate 53 on which the anode 54 is formed, and is patterned by a lithography method so that an opening is formed in the portion of the acrylic resin where the anode 54 is formed, thereby forming the insulating layer 59. Such an opening corresponds to the light-emitting region where the light-emitting element actually emits light.

[0081] The substrate 53 on which the insulating layer 59 is patterned is carried into the film-forming apparatus 1 (first film-forming chamber) of the manufacturing line, and the hole transport layer 55 is formed as a common layer on the anode 54 in the display region 51. The hole transport layer 55 is formed, for example, by vacuum evaporation. Since the hole transport layer 55 is actually formed in a size larger than that of the display region 51, a high-definition mask is not required.

[0082] Next, the substrate 53 on which the hole transport layer 55 is formed is carried into the film-forming apparatus 1 (second film-forming chamber). Alignment between the substrate 53 and the mask is performed, and through the mask, the red light-emitting layer 56R is formed on the portion of the substrate 53 where the red light-emitting element is to be formed.

[0083] Similar to the formation of the light-emitting layer 56R, the green light-emitting layer 56G is formed in the film-forming apparatus 1 (third film-forming chamber), and further, the blue light-emitting layer 56B is formed in the film-forming apparatus 1 (fourth film-forming chamber). After the light-emitting layers 56R, 56G, and 56B are formed, the electron transport layer 57 is formed over the entire display region 51 in the film-forming apparatus 1 (fifth film-forming chamber). The electron transport layer 57 is formed as a common layer for the three light-emitting layers 56R, 56G, and 56B.

[0084] Next, the substrate 53 on which the electron transport layer 57 is formed is carried into the film-forming apparatus 1 (sixth film-forming chamber), and the cathode 58 is formed.

[0085] Then, the substrate 53 on which the cathode 58 is formed is carried into a sealing device, and a protective layer PL is formed by plasma CVD (sealing process), and the organic EL display device 50 is completed. Here, the protective layer PL is formed by the CVD method, but is not limited thereto. For example, the protective layer PL may be formed by the ALD method or the inkjet method.

[0086] Note that if the substrate 53 with the patterned insulating layer 59 is exposed to an atmosphere containing moisture or oxygen between the time it is carried into the film forming apparatus 1 and the time the protective layer PL is formed, the light emitting layer made of the organic EL material may deteriorate. Therefore, it is preferable that the loading and unloading of the substrate 53 between the film forming apparatuses be performed under a vacuum atmosphere or an inert gas atmosphere.

[0087] The invention is not limited to the above-described embodiments, and various modifications and changes are possible within the scope of the gist of the invention.

Explanation of Reference Numerals

[0088] 1: Film forming apparatus 5: Mask stage 6: Substrate support unit 15: Suction plate 17: Adjustment unit 80: Pressing member 90: Pressing adjustment unit 100: Substrate 100A: First surface 100B: Second surface 101: Mask

Claims

1. a substrate support portion that supports a peripheral portion of the first surface of a substrate including the first surface and a second surface on a side opposite to the first surface; a suction plate that sucks the second surface of the substrate supported by the substrate support portion; a first adjustment portion that adjusts an inclination relative to a mask stage on which a mask for forming a pattern on the first surface of the substrate is placed or the mask, with respect to the suction plate; a plurality of pressing members provided opposite to respective ones of a plurality of locations on a peripheral portion of the second surface of the substrate, for pressing the substrate from the side of the second surface; a second adjustment portion that adjusts a pressing force with which each of the plurality of pressing members presses the second surface of the substrate supported by the substrate support portion, according to the inclination of the suction plate, in a state where the suction plate is inclined by the first adjustment portion; An adsorption device, comprising:

2. Each of the plurality of pressing members includes a contact end that contacts the second surface of the substrate supported by the substrate support portion; The second adjustment portion adjusts the pressing force by displacing the position of the contact end of each of the plurality of pressing members in the vertical direction. The adsorption device according to claim 1, characterized in that.

3. The suction plate includes a suction surface that sucks the second surface of the substrate; Each of the plurality of pressing members presses the substrate from the side of the second surface by protruding the contact end from the suction surface through a through hole that penetrates the suction plate between the suction surface and a surface on a side opposite to the suction surface; The second adjustment portion displaces the position of the contact end of each of the plurality of pressing members in the vertical direction so that the protruding amounts of the contact ends of the plurality of pressing members protruding from the suction surface are equal. The adsorption device according to claim 2, characterized in that.

4. The adsorption device according to claim 2, characterized in that the second adjustment portion includes an operation portion for displacing the contact end of each of the plurality of pressing members in the vertical direction.

5. further comprising a chamber that defines a space for accommodating the substrate support portion, the suction plate, and the mask stage, and maintains the space in a vacuum atmosphere; The operation portion is provided outside the chamber. The adsorption device according to claim 4, characterized in that.

6. The second adjustment portion includes a plurality of shafts provided corresponding to each of the plurality of pressing members and connectable to each of the plurality of pressing members; A plurality of motors provided corresponding to each of the plurality of pressing members, and driving each of the plurality of shafts; comprising; By driving each of the plurality of shafts by the plurality of motors, the contact ends of each of the plurality of pressing members are displaced in the vertical direction. The adsorption device according to claim 2, characterized in that.

7. Further comprising a chamber that defines a space for accommodating the substrate support portion, the adsorption plate, and the mask table, and maintains the space in a vacuum atmosphere; The plurality of motors are provided outside the chamber. The adsorption device according to claim 6, characterized in that.

8. A detection unit for detecting the inclination of the adsorption plate; A control unit for controlling the driving amount of each of the plurality of shafts driven by each of the plurality of motors based on the inclination of the adsorption plate detected by the detection unit; The adsorption device according to claim 7, characterized by comprising.

9. The adsorption plate includes an adsorption surface that adsorbs the second surface of the substrate; Each of the plurality of pressing members presses the substrate from the side of the second surface by protruding the contact end through a through hole that penetrates the adsorption plate between the adsorption surface and the surface opposite to the adsorption surface. The control unit controls the driving amount of each of the plurality of shafts driven by each of the plurality of motors so that the protruding amounts of the contact ends of each of the plurality of pressing members protruding from the adsorption surface are equal. The adsorption device according to claim 8, characterized in that.

10. The adsorption device according to claim 1, further comprising a detection unit for detecting the inclination of the adsorption plate.

11. Each of the plurality of pressing members includes a contact end that contacts the second surface of the substrate supported by the substrate support portion; The detection unit includes a touch sensor provided at the contact end of each of the plurality of pressing members for detecting contact with the second surface. The adsorption device according to claim 10, characterized in that.

12. Each of the plurality of pressing members includes a contact end that contacts the second surface of the substrate supported by the substrate support portion; The detection unit includes a distance measuring sensor provided at the contact end of each of the plurality of pressing members for detecting the distance between the contact end and the second surface. The adsorption device according to claim 10, characterized in that.

13. Before adsorbing the second surface of the substrate by the adsorption plate, the substrate is pressed from the side of the second surface by the plurality of pressing members. The adsorption device according to claim 1, characterized in that.

14. A support region which is a region on the first surface where the substrate support portion supports the substrate, and a pressing region which is a region on the second surface where the plurality of pressing members press the substrate do not overlap when viewed from a direction perpendicular to the first surface or the second surface. The adsorption device according to claim 1, characterized in that.

15. The adsorption device according to any one of claims 1 to 14, A film forming portion for forming a pattern on the first surface of the substrate adsorbed by the adsorption plate of the adsorption device, A film forming device, characterized by comprising.

16. A first step of supporting a peripheral portion of the first surface of a substrate including the first surface and a second surface opposite to the first surface by a substrate support portion, A second step of adjusting the relative inclination of an adsorption plate that adsorbs the second surface of the substrate and a mask stage on which a mask for forming a pattern on the first surface of the substrate is placed or the mask, A third step of pressing the substrate from the side of the second surface by a plurality of pressing members provided opposite to each of a plurality of locations on the peripheral portion of the second surface of the substrate in a state where the adsorption plate is tilted by the second step, A fourth step of adsorbing the substrate pressed by the plurality of pressing members with the adsorption plate after the third step, Comprising, The third step includes a step of adjusting the pressing force with which each of the plurality of pressing members presses the second surface of the substrate supported by the substrate support portion according to the inclination of the adsorption plate. An adsorption method, characterized in that.

17. Further comprising a fifth step of forming the pattern on the first surface of the substrate adsorbed by the adsorption plate. The adsorption method according to claim 16, characterized in that.

18. A manufacturing method, characterized by manufacturing an electronic device using the film forming device according to claim 15.

Images