Manufacturing method for vehicular illuminating device

Abstract

To provide a manufacturing method for a vehicular illuminating device that can restrain a position shift of a light emitting element with respect to a socket.SOLUTION: A manufacturing method for a vehicular illuminating device according to an embodiment is a manufacturing method for a vehicular illuminating device comprising: a socket; a board bonded to the side of one end part of the socket, and comprising a wiring pattern; and a light emitting element joined to the wiring pattern. The manufacturing method for the vehicular illuminating device comprises a step of bonding the board to the side of the one end part of the socket, and a step of joining the light emitting element to the wiring pattern after an adhesive for bonding the board is cured.SELECTED DRAWING: Figure 5

Description

Technical Field

[0001] Embodiments of the present invention relate to a method for manufacturing a vehicle lighting device.

Background Art

[0002] From the viewpoints of energy saving and long life, etc., instead of a vehicle lighting device including a lamp having a filament, etc., the spread of a vehicle lighting device including a light emitting element such as a light emitting diode has been progressing. Such a vehicle lighting device includes a socket and a light emitting module provided on one end side of the socket. The light emitting module includes, for example, a substrate and a light emitting element provided on the substrate.

[0003] When manufacturing such a vehicle lighting device, a substrate to which a light emitting element is joined is adhered to one end side of the socket. However, until the adhesive cures, since the adhesive has a certain degree of fluidity, the position of the substrate to which the light emitting element is joined with respect to the socket, and thus the position of the light emitting element with respect to the socket, may shift.

[0004] The socket is attached to a housing provided in a vehicle lamp. Therefore, if the position of the light emitting element with respect to the socket shifts, the position of the light emitting element with respect to the vehicle lamp may shift, so there is a possibility that predetermined light distribution characteristics cannot be obtained. Therefore, the development of a method for manufacturing a vehicle lighting device capable of suppressing the shift of the position of the light emitting element with respect to the socket has been desired.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0006] The problem to be solved by the present invention is to provide a method for manufacturing a vehicle lighting device that can suppress displacement of the position of a light-emitting element with respect to a socket.

Means for Solving the Problem

[0007] The method for manufacturing a vehicle lighting device according to an embodiment is a method for manufacturing a vehicle lighting device including a socket, a substrate adhered to one end side of the socket and having a wiring pattern, and a light-emitting element joined to the wiring pattern. The method for manufacturing the vehicle lighting device includes a step of adhering the substrate to one end side of the socket; and a step of joining the light-emitting element to the wiring pattern after the adhesive for adhering the substrate has cured.

Effects of the Invention

[0008] According to an embodiment of the present invention, it is possible to provide a method for manufacturing a vehicle lighting device that can suppress displacement of the position of a light-emitting element with respect to a socket.

Brief Description of the Drawings

[0009]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Mode for Carrying Out the Invention

[0010] Hereinafter, embodiments will be exemplified with reference to the drawings. In each drawing, the same components are denoted by the same reference numerals, and detailed descriptions thereof will be omitted as appropriate.

[0011] First, a vehicle lighting device 1 manufactured by the manufacturing method of the vehicle lighting device according to the present embodiment and a vehicle lamp 100 to which the vehicle lighting device 1 is attached will be described. The vehicle lighting device 1 can be provided, for example, in an automobile, a railway vehicle, or the like. Examples of the vehicle lighting device 1 provided in an automobile include, for example, a front combination lamp (for example, a combination of a daytime running lamp (DRL), a position lamp, a turn signal lamp, etc. as appropriate), a rear combination lamp (for example, a combination of a stop lamp, a tail lamp, a turn signal lamp, a back lamp, a fog lamp, etc. as appropriate), and the like. However, the use of the vehicle lighting device 1 is not limited to these.

[0012] FIG. 1 is a schematic perspective view for exemplifying the vehicle lighting device 1 according to the present embodiment. As shown in FIG. 1, the vehicle lighting device 1 is provided with, for example, a socket 10, a light emitting module 20, a power supply unit 30, and a heat transfer unit 40.

[0013] The socket 10 has, for example, a mounting portion 11, a bayonet 12, a flange 13, heat dissipation fins 14, and a connector holder 15. The mounting portion 11 is provided on the surface of the flange 13 on the side opposite to the side where the heat dissipation fins 14 are provided. The outer shape of the mounting portion 11 is, for example, cylindrical. The mounting portion 11 has, for example, a recess 11a that opens at the end on the side opposite to the flange 13 side.

[0014] The bayonet 12 is provided, for example, on the side surface of the mounting portion 11. The bayonet 12 protrudes outward from the vehicle lighting device 1. The bayonet 12 faces the flange 13. A plurality of bayonets 12 can be provided. The bayonet 12 is used when mounting the vehicle lighting device 1 to the housing 101 of the vehicle lamp 100 described later. The bayonet 12 can be used for a twist lock.

[0015] The flange 13 is plate-shaped. The flange 13 is, for example, disc-shaped. The side surface of the flange 13 is located outside the vehicle lighting device 1 with respect to the side surface of the bayonet 12.

[0016] The heat dissipation fins 14 are provided on the side of the flange 13 opposite to the mounting portion 11 side. At least one heat dissipation fin 14 can be provided. For example, as shown in FIG. 1, a plurality of heat dissipation fins 14 can be provided on the socket 10. The plurality of heat dissipation fins 14 can be arranged in a predetermined direction. The heat dissipation fins 14 are, for example, plate-shaped or cylindrical.

[0017] The connector holder 15 is provided on the side of the flange 13 opposite to the mounting portion 11 side. The connector holder 15 can be provided side by side with the heat dissipation fins 14. The connector holder 15 is cylindrical, and a connector 105 having a seal member 105a inside is inserted therein.

[0018] The socket 10 has a function of holding the light emitting module 20 and the power supply unit 30, and a function of transferring the heat generated in the light emitting module 20 to the outside. Therefore, the socket 10 is preferably formed of a material having a high thermal conductivity. The socket 10 can be formed of a metal such as an aluminum alloy, for example.

[0019] In addition, the socket 10 can also be formed from a high thermal conductivity resin. The high thermal conductivity resin is, for example, a resin such as PET (Polyethylene terephthalate) or Nylon, with fillers such as carbon or aluminum oxide mixed therein.

[0020] The light emitting module 20 (substrate 21) is adhered to one end side of the socket 10. For example, the light emitting module 20 (substrate 21) is directly or indirectly adhered to the mounting portion 11. The light emitting module 20 has, for example, a substrate 21, a light emitting element 22, a frame portion 23, a sealing portion 24, and a circuit element 25.

[0021] The substrate 21 is plate-shaped. The planar shape of the substrate 21 (the shape when viewed from the direction along the central axis 1a of the vehicle lighting device 1) is, for example, substantially rectangular. The substrate 21 is formed from, for example, an inorganic material such as ceramics (e.g., aluminum oxide or aluminum nitride), an organic material such as paper phenol or glass epoxy, etc. Further, the substrate 21 may be a metal core substrate in which the surface of a metal plate is coated with an insulating material. The substrate 21 may have a single-layer structure or a multi-layer structure.

[0022] Also, a wiring pattern 21a is provided on the surface of the substrate 21. The wiring pattern 21a is formed from, for example, a material mainly composed of silver, a material mainly composed of copper, etc. Further, a coating portion for covering the wiring pattern 21a and a film-like resistor described later can also be provided. The coating portion can contain, for example, a glass material.

[0023] The light emitting element 22 is provided on the substrate 21 (the surface of the substrate 21 opposite to the socket 10 side). The light emitting element 22 is joined to the wiring pattern 21a. At least one light emitting element 22 can be provided. When a plurality of light emitting elements 22 are provided, the plurality of light emitting elements 22 can be connected in series.

[0024] The light-emitting element 22 can be, for example, a light-emitting diode, an organic light-emitting diode, a laser diode, or the like.

[0025] FIG. 2 is a schematic plan view for illustrating the arrangement of a plurality of light-emitting elements 22. Note that FIG. 2 is a schematic plan view when the plurality of light-emitting elements 22 are viewed from a direction along the central axis 10a of the socket 10. The central axis 10a of the socket 10 can be coaxial with the central axis 1a of the vehicle lighting device 1.

[0026] The light-emitting element 22 can also be a chip-shaped light-emitting element, or can be a surface-mount type light-emitting element such as a PLCC (Plastic Leaded Chip Carrier) type. The light-emitting element 22 illustrated in FIG. 2 is a chip-shaped light-emitting element. In this case, considering the miniaturization of the light-emitting module 20 and thus the miniaturization of the vehicle lighting device 1, it is preferable to use a chip-shaped light-emitting element. Hereinafter, as an example, the case where the light-emitting element 22 is a chip-shaped light-emitting element will be described.

[0027] As shown in FIG. 2, the center of one light-emitting element 22 can be provided at the position of the central axis 10a of the socket 10. The centers of the four light-emitting elements 22 can be provided at positions that are rotationally symmetric on the circumference centered on the central axis 10a of the socket 10. Although, as an example, the case where five light-emitting elements 22 are provided has been described, the number and arrangement of the light-emitting elements 22 can be appropriately changed according to the use of the vehicle lighting device 1, the required light quantity, luminance distribution, and the like.

[0028] The chip-shaped light-emitting element 22 is joined to the wiring pattern 21a by COB (Chip On Board). For example, the chip-shaped light-emitting element 22 can be joined to the wiring pattern 21a using a silver paste. Note that the surface-mount type light-emitting element 22 can be joined (soldered) to the wiring pattern 21a using solder.

[0029] The chip-shaped light-emitting element 22 can be any of a top electrode type light-emitting element, a top and bottom electrode type light-emitting element, and a flip chip type light-emitting element. The top electrode of the top electrode type light-emitting element and the top electrode of the top and bottom electrode type light-emitting element can be electrically connected to the wiring pattern 21a, for example, using the wire bonding method.

[0030] The frame portion 23 is provided on the substrate 21. The frame portion 23 is adhered to the substrate 21. The frame portion 23 has a frame shape and surrounds the light-emitting element 22. The frame portion 23 is formed of, for example, a thermoplastic resin. The frame portion 23 can have a function of defining the formation range of the sealing portion 24 and a function of a reflector. The contour of the planar shape of the frame portion 23 can be, for example, a quadrangle, a circle, or the like. The contour of the planar shape of the frame portion 23 can be appropriately changed according to the required luminance distribution and the like.

[0031] The sealing portion 24 is provided inside the frame portion 23. The sealing portion 24 is provided so as to cover the region surrounded by the frame portion 23. The sealing portion 24 is provided so as to cover the light-emitting element 22. The sealing portion 24 contains a resin having translucency. For example, the resin is a silicone resin or the like. Further, a phosphor can also be included in the resin. For example, the resin can be filled inside the frame portion 23 using a dispenser or the like.

[0032] In addition, when the light-emitting element 22 is a surface mount type light-emitting element, the frame portion 23 and the sealing portion 24 can be omitted.

[0033] The circuit element 25 can be a passive element or an active element used to constitute a light-emitting circuit having the light-emitting element 22. The circuit element 25 is provided on the substrate 21. The circuit element 25 is provided, for example, around the frame portion 23 and joined to the wiring pattern 21a. The circuit element 25 can be joined (soldered) to the wiring pattern 21a using solder.

[0034] The circuit element 25 illustrated in FIG. 1 is a protection element 25a, a resistor 25b, and a control element 25c. However, the type of the circuit element 25 is not limited to the exemplified ones, and can be appropriately changed according to the configuration of the light-emitting circuit having the light-emitting element 22. For example, in addition to the ones described above, the circuit element 25 may be a capacitor, a positive characteristic thermistor, a negative characteristic thermistor, an inductor, a surge absorber, a varistor, a transistor, an integrated circuit, an arithmetic element, or the like.

[0035] The protection element 25a is provided, for example, to prevent the reverse voltage from being applied to the light-emitting element 22 and to prevent the pulse noise from the reverse direction from being applied to the light-emitting element 22. The protection element 25a can be, for example, a diode. The protection element 25a exemplified in FIG. 1 is a surface-mounted diode.

[0036] The resistor 25b can be, for example, a surface-mounted resistor, a film resistor formed using a screen printing method, or the like. The resistor 25b exemplified in FIG. 1 is a surface-mounted resistor. The resistor 25b is connected in series with the light-emitting element 22. The resistor 25b is provided to make the value of the current flowing through the light-emitting element 22 fall within a predetermined range.

[0037] The control element 25c is provided, for example, to switch the voltage applied to the light-emitting element 22 or to perform temperature derating. However, the functions and applications of the control element 25c are not limited to the exemplified ones. The control element 25c can be, for example, a transistor or an integrated circuit. The control element 25c exemplified in FIG. 1 is a surface-mounted integrated circuit.

[0038] The power supply unit 30 has, for example, a plurality of power supply terminals 31 and a holding unit 32. The plurality of power supply terminals 31 can be in the form of rod-shaped bodies. One end of the plurality of power supply terminals 31 protrudes from the bottom surface 11a1 of the recess 11a. One end of the plurality of power supply terminals 31 is soldered to the wiring pattern 21a provided on the substrate 21. The other end of the plurality of power supply terminals 31 is exposed inside the hole of the connector holder 15. The connector 105 is fitted onto the plurality of power supply terminals 31 that are exposed inside the hole of the connector holder 15. The plurality of power supply terminals 31 are formed of a metal such as a copper alloy, for example.

[0039] The holding portion 32 is provided to insulate between the plurality of power supply terminals 31 and the conductive socket 10. Note that when the socket 10 is formed of an insulating high thermal conductivity resin or the like, the holding portion 32 can be omitted. The holding portion 32 can be press-fitted into a hole provided in the socket 10 or adhered to the inner wall of the hole, for example.

[0040] The heat transfer portion 40 is provided between the socket 10 and the light emitting module 20 (substrate 21). For example, the heat transfer portion 40 can be adhered to the bottom surface 11a1 of the recess 11a. Also, the heat transfer portion 40 can be adhered inside the recess provided in the bottom surface 11a1 of the recess 11a, or the heat transfer portion 40 can be attached inside the recess via a heat conductive grease, or the heat transfer portion 40 can be embedded inside the recess using an insert molding method.

[0041] The heat transfer portion 40 is formed of a material having a high thermal conductivity. For example, the heat transfer portion 40 is formed of a metal such as aluminum, an aluminum alloy, copper, or a copper alloy. Note that when the heat generated in the light emitting module 20 is relatively small, or when the socket 10 is formed of a metal, etc., the heat transfer portion 40 can be omitted. When the heat transfer portion 40 is omitted, the light emitting module 20 (substrate 21) is adhered to the bottom surface 11a1 of the recess 11a or the like.

[0042] Next, the vehicle lamp 100 to which the vehicle lighting device 1 is mounted will be described. In the following, as an example, a case where the vehicle lamp 100 is a front combination lamp provided on an automobile will be described. However, the vehicle lamp 100 is not necessarily limited to a front combination lamp provided on an automobile. The vehicle lamp 100 may be any vehicle lamp provided on an automobile, a railway vehicle, or the like.

[0043] FIG. 3 is a schematic partial cross-sectional view for illustrating the vehicle lamp 100. As shown in FIG. 3, the vehicle lamp 100 includes, for example, a vehicle lighting device 1, a housing 101, a cover 102, an optical element 103, a seal member 104, and a connector 105.

[0044] The vehicle lighting device 1 is attached to the housing 101. The housing 101 holds the mounting portion 11. The housing 101 has a box shape with one end open. The housing 101 is formed of, for example, a resin that does not transmit light. On the bottom surface of the housing 101, a mounting hole 101a into which a portion of the mounting portion 11 provided with the bayonet 12 is inserted is provided. A recess into which the bayonet 12 provided on the mounting portion 11 is inserted is provided at the periphery of the mounting hole 101a. Although the case where the mounting hole 101a is directly provided in the housing 101 has been illustrated, a mounting member having the mounting hole 101a may be provided on the housing 101.

[0045] When attaching the vehicle lighting device 1 to the vehicle lamp 100, the portion of the mounting portion 11 provided with the bayonet 12 is inserted into the mounting hole 101a, and the vehicle lighting device 1 is rotated. Then, for example, the bayonet 12 is held by a fitting portion provided at the periphery of the mounting hole 101a. Such an attachment method is called a twist lock.

[0046] The cover 102 is provided so as to close the opening of the housing 101. The cover 102 is formed of a translucent resin or the like. The cover 102 can also have functions such as a lens.

[0047] Light enters the optical element 103 from the vehicle lighting device 1. The optical element 103 reflects, diffuses, guides, condenses the light emitted from the vehicle lighting device 1, and forms a predetermined light distribution pattern. For example, the optical element 103 illustrated in FIG. 3 is a reflector. In this case, the optical element 103 reflects the light emitted from the vehicle lighting device 1 to form a predetermined light distribution pattern.

[0048] The seal member 104 is provided between the flange 13 and the housing 101. The seal member 104 has an annular shape and is formed of an elastic material such as rubber or silicone resin.

[0049] The connector 105 is fitted to the ends of a plurality of power supply terminals 31 exposed inside the connector holder 15. A lighting circuit or the like is electrically connected to the connector 105. Therefore, by fitting the connector 105 to the ends of the plurality of power supply terminals 31, the lighting circuit or the like and the light emitting element 22 can be electrically connected.

[0050] In addition, a seal member 105a is provided on the connector 105. When the connector 105 having the seal member 105a is inserted into the connector holder 15, the inside of the connector holder 15 is sealed so as to be watertight.

[0051] Next, a method for manufacturing the vehicle lighting device according to the present embodiment will be described. FIGS. 4(a) to 4(c) are schematic process cross-sectional views for illustrating a method for manufacturing a vehicle lighting device according to a comparative example. As shown in FIG. 4(a), in the method for manufacturing a vehicle lighting device according to the comparative example, the light emitting element 22 and the circuit element 25 are joined to the wiring pattern 21a of the substrate 21, and the frame portion 23 and the sealing portion 24 are sequentially provided on the substrate 21 to pre-manufacture the light emitting module 20. Also, as shown in FIG. 4(a), an adhesive 26 is applied to the upper surface of the heat transfer portion 40.

[0052] Next, as shown in FIG. 4(b), the light-emitting module 20 is placed on the adhesive 26, and the light-emitting module 20 is adhered to the heat transfer portion 40. In the manufacturing method of the vehicle lighting device according to the comparative example, the vehicle lighting device is manufactured in this way. When placing the light-emitting module 20 on the adhesive 26, the position of the light-emitting module 20 with respect to the socket 10, and thus the position of the light-emitting element 22 with respect to the socket 10, are aligned.

[0053] However, until the adhesive cures, the adhesive has a certain degree of fluidity. Therefore, as shown in FIG. 4(c), the position of the light-emitting module 20 with respect to the socket 10, and thus the position of the light-emitting element 22 with respect to the socket 10, may shift.

[0054] As shown in FIG. 3, the vehicle lighting device 1 (the socket 10 to which the light-emitting module 20 is adhered) is mounted on the housing 101 provided in the vehicle lamp 100. Therefore, if the position of the light-emitting element 22 shifts with respect to the socket 10, the position of the light-emitting element 22 shifts with respect to the vehicle lamp 100 (housing 101), so there is a possibility that the predetermined light distribution characteristics cannot be obtained. In this case, using a jig or the like can suppress the shift of the position of the light-emitting element 22. However, the allowable range of the shift of the position of the light-emitting element 22 is, for example, about ±0.3 mm. Therefore, it is difficult to keep the shift of the position of the light-emitting element 22 within the allowable range using a jig or the like.

[0055] Therefore, in the manufacturing method of the vehicle lighting device according to the present embodiment, the vehicle lighting device 1 is manufactured by the following procedure. FIGS. 5(a) to (d) are schematic process cross-sectional views for exemplifying the manufacturing method of the vehicle lighting device according to the present embodiment.

[0056] First, as shown in FIG. 5(a), the adhesive 26 is applied to the upper surface of the heat transfer portion 40. Then, the substrate 21 is placed on the adhesive 26, and the substrate 21 is adhered to the heat transfer portion 40. The adhesive 26 is preferably an adhesive with high thermal conductivity. The adhesive 26 with high thermal conductivity can be, for example, an adhesive containing a filler using an inorganic material or a metal material. When the heat transfer part 40 is omitted, the substrate 21 is adhered to the bottom surface 11a1 of the concave part 11a of the socket 10 or the like.

[0057] Next, as shown in FIGS. 5(b) and 5(c), after the adhesive 26 is cured, the light-emitting element 22 is joined to a predetermined position on the substrate 21. The curing of the adhesive 26 includes not only the state where the adhesive 26 is completely cured but also the state where it is cured to such an extent that the position of the adhered substrate 21 does not change.

[0058] When the light-emitting element 22 is a chip-shaped light-emitting element, for example, the chip-shaped light-emitting element can be joined to the wiring pattern 21a using silver paste. The joining of the chip-shaped light-emitting element 22 can be performed, for example, using a die bonding apparatus. Also, the electrical connection between the upper electrode of the chip-shaped light-emitting element 22 and the wiring pattern 21a can be performed, for example, using a wire bonding apparatus.

[0059] Next, as shown in FIG. 5(d), a frame portion 23 is adhered onto the substrate 21 so as to surround the chip-shaped light-emitting element 22 joined to the wiring pattern 21a. Subsequently, using a dispenser or the like, the inside of the frame portion 23 is filled with resin to form a sealing portion 24 that covers the chip-shaped light-emitting element 22.

[0060] When the light-emitting element 22 is a surface-mount type light-emitting element, for example, using a soldering apparatus, the surface-mount type light-emitting element 22 is joined (soldered) to the wiring pattern 21a. When the light-emitting element 22 is a surface-mount type light-emitting element, the adhesion of the frame portion 23 and the formation of the sealing portion 24 can be omitted.

[0061] Here, as described above, the circuit element 25 is also provided on the substrate 21. However, even if the position of the circuit element 25 with respect to the socket 10 is displaced, it has no influence on the light distribution characteristics. Therefore, the circuit element 25 may be pre-bonded to the wiring pattern 21a of the substrate 21. For example, the substrate 21 provided with the circuit element 25 can be adhered to the heat transfer portion 40, the bottom surface 11a1 of the recess 11a of the socket 10, etc., and the bonding of the light emitting element 22 described above can be performed after the hardening of the adhesive. Also, the substrate 21 can be adhered to the heat transfer portion 40, the bottom surface 11a1 of the recess 11a of the socket 10, etc., and after the hardening of the adhesive, the bonding of the light emitting element 22 and the bonding of the circuit element 25 described above can be sequentially performed.

[0062] The circuit element 25 can be bonded (soldered) to the wiring pattern 21a using, for example, a soldering device. Here, when soldering the circuit element 25 to the wiring pattern 21a, the flux used for soldering may scatter around. The chip-shaped light emitting element 22 is often bonded to the wiring pattern 21a using silver paste. Therefore, if the scattered flux adheres to the wiring pattern 21a to which the chip-shaped light emitting element 22 is bonded, it may be difficult to bond the chip-shaped light emitting element 22, or the bonding strength between the chip-shaped light emitting element 22 and the wiring pattern 21a may decrease. Therefore, in the case of the chip-shaped light emitting element 22, it is preferable to adhere the substrate 21 provided with the circuit element 25 to the heat transfer portion 40, the bottom surface 11a1 of the recess 11a of the socket 10, etc., and perform the bonding of the light emitting element 22 described above after the hardening of the adhesive.

[0063] On the one hand, the surface-mounted light-emitting element 22 is often soldered to the wiring pattern 21a. Therefore, even if the scattered flux adheres to the wiring pattern 21a to which the surface-mounted light-emitting element 22 is joined, it is less likely that the joining of the surface-mounted light-emitting element 22 becomes difficult or the joining strength between the surface-mounted light-emitting element 22 and the wiring pattern 21a decreases. Therefore, in the case of the surface-mounted light-emitting element 22, the substrate 21 provided with the circuit element 25 may be adhered to the heat transfer part 40, the bottom surface 11a1 of the concave part 11a of the socket 10, etc., and the light-emitting element 22 may be joined after the adhesive 26 is cured. Or, the substrate 21 may be adhered to the heat transfer part 40, the bottom surface 11a1 of the concave part 11a of the socket 10, etc., and after the adhesive is cured, the joining of the light-emitting element 22 and the joining of the circuit element 25 may be sequentially performed.

[0064] Also, when joining the light-emitting element 22 to the wiring pattern 21a, the positioning of the light-emitting element 22 with respect to the socket 10 can be performed. As described above, the socket 10 is provided with the flange 13 and the mounting part 11. Therefore, the positioning of the light-emitting element 22 with respect to the socket 10 can be performed based on the contour of the flange 13 or the contour of the mounting part 11 when viewed from the direction along the central axis 10a of the socket 10.

[0065] In this case, since the concave part 11a opens at the end of the mounting part 11, the positioning of the light-emitting element 22 with respect to the socket 10 can also be performed based on the contour of the outer wall of the mounting part 11 or the contour of the inner wall of the mounting part 11. Also, as described in FIG. 3, the mounting part 11 of the vehicle lighting device 1 is mounted in the mounting hole 101a of the housing 101 of the vehicle lamp 100.

[0066] Therefore, the positioning of the vehicle lighting device 1 with respect to the vehicle lamp 100 is performed based on the outer wall of the mounting part 11. Therefore, when positioning the light-emitting element 22 with respect to the socket 10, it is preferable to use the contour of the outer wall of the mounting part 11 as a reference. In this way, the misalignment of the light-emitting element 22 with respect to the vehicle lamp 100 can be effectively suppressed. Therefore, it becomes even easier to obtain a predetermined light distribution characteristic.

[0067] As described above, the manufacturing method of the vehicle lighting device according to the present embodiment can include the following steps. A step of adhering the substrate 21 to one end side of the socket 10. After the adhesive for adhering the substrate 21 has hardened, a step of joining the light-emitting element 22 to the wiring pattern 21a. In addition, in the step of adhering the substrate 21 to one end side of the socket 10, the substrate 21 may be adhered to the heat transfer portion 40 provided on one end side of the socket 10. When the heat transfer portion 40 is omitted, the substrate 21 may be adhered to the bottom surface 11a1 of the recess 11a of the socket 10 or the like.

[0068] Further, in the step of joining the light-emitting element 22 to the wiring pattern 21a, the positioning of the light-emitting element 22 with respect to the socket 10 can be performed based on the contour of the flange 13 or the contour of the mounting portion 11 when viewed from the direction along the central axis 10a of the socket 10.

[0069] Also, when positioning the light-emitting element 22 with respect to the socket 10, the positioning of the light-emitting element 22 with respect to the socket 10 can be performed based on the contour of the outer wall of the mounting portion 11.

[0070] The circuit element 25 can be joined to the wiring pattern 21a before the substrate 21 is adhered to one end side of the socket 10. Alternatively, the circuit element 25 can be joined to the wiring pattern 21a in the step of joining the light-emitting element 22 to the wiring pattern 21a.

[0071] As described above, several embodiments of the present invention have been illustrated. However, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, changes, etc. can be made without departing from the gist of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are also included in the invention described in the claims and the equivalent scope thereof. In addition, the above-described embodiments can be implemented in combination with each other.

Explanation of Reference Numerals

[0072] 1 Vehicle lighting device, 1a Central axis, 10 Socket, 10a Central axis, 11 Mounting portion, 11a Recess, 20 Light emitting module, 22 Light emitting element, 23 Frame portion, 24 Sealing portion, 100 Vehicle lamp, 101 Housing

Claims

1. A method for manufacturing a vehicle lighting device, comprising a socket, a substrate adhered to one end side of the socket and having a wiring pattern, and a light-emitting element joined to the wiring pattern, the method comprising: a step of adhering the substrate to one end side of the socket; a step of joining the light-emitting element to the wiring pattern after the adhesive for adhering the substrate has hardened; A method for manufacturing a vehicle lighting device comprising the above steps.

2. The socket has a flange and a mounting portion provided on one surface of the flange to which the substrate is adhered. In the step of joining the light-emitting element to the wiring pattern, the positioning of the light-emitting element with respect to the socket is performed with reference to the contour of the flange or the contour of the mounting portion when viewed from a direction along the central axis of the socket. The manufacturing method of the vehicle lighting device according to Claim 1.

3. When positioning the light-emitting element with respect to the socket, the positioning of the light-emitting element with respect to the socket is performed with reference to the contour of the outer wall of the mounting portion. The manufacturing method of the vehicle lighting device according to Claim 2.

4. The vehicle lighting device further has a circuit element joined to the wiring pattern. The circuit element is joined to the wiring pattern before the substrate is adhered to one end side of the socket, or is joined to the wiring pattern in the step of joining the light-emitting element to the wiring pattern. The manufacturing method of the vehicle lighting device according to any one of Claims 1 to 3.

5. The light-emitting element is a chip-shaped light-emitting element or a surface-mount type light-emitting element. The chip-shaped light-emitting element is joined to the wiring pattern using silver paste. The surface-mount type light-emitting element is joined to the wiring pattern using solder. The circuit element is joined to the wiring pattern using the solder. The manufacturing method of the vehicle lighting device according to Claim 4.

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