Two-component liquid resin composition and power module

Abstract

To provide a two-component liquid resin composition which achieves improved performance balance between storage stability and fluidity.SOLUTION: A two-component liquid resin composition comprises a first liquid and a second liquid, wherein the first liquid contains an epoxy resin (A), an inorganic filler (C), and a sedimentation inhibitor (D); the second liquid contains an acid anhydride (B), an inorganic filler (C), and a sedimentation inhibitor (D); the sedimentation inhibitor (D) includes an inorganic thickener (excluding the inorganic filler (C)); and the viscosity η5A of the first liquid is from 1.0 Pa s to 50.0 Pa s as measured under conditions of 5 rpm and 25°C using an E-type viscometer and a 3°×R14 cone rotor.SELECTED DRAWING: None

Description

Technical Field

[0001] The present invention relates to a two-component liquid resin composition and a power module.

Background Art

[0002] Epoxy resins are used as encapsulants for encapsulating substrates and semiconductor elements in power modules. As a technique related to an encapsulant for a power module, for example, the technique described in Patent Document 1 can be cited.

[0003] Patent Document 1 aims to provide a filler for a semiconductor encapsulant that is blended into an encapsulant to reduce the linear expansion coefficient of the encapsulant and, moreover, maintains the encapsulant at a low viscosity to improve invasiveness, and a semiconductor encapsulant composition using the same. A filler for a semiconductor encapsulant characterized by comprising an inorganic substance and an organic layer having a functional group capable of reacting with an epoxy resin chemically bonded to the surface of the inorganic substance, and a semiconductor encapsulant containing this filler and an epoxy resin are described.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] The present invention provides a two-component liquid resin composition with improved performance balance of storage stability and fluidity.

Means for Solving the Problems

[0006] The inventors of the present invention have intensively studied to achieve the above problems. As a result, by including an inorganic thickener as an anti-settling agent and adjusting the viscosity of the liquid resin composition containing an epoxy resin in the two-component liquid resin composition to a specific range, it has been found that the performance balance of the storage stability and fluidity of the two-component liquid resin composition can be improved, and the present invention has been completed.

[0007] According to the present invention, the following two-component liquid resin composition and power module are provided.

[0008] [1] A two-component liquid resin composition composed of a first liquid and a second liquid, wherein the first liquid contains an epoxy resin (A), an inorganic filler (C), and an anti-settling agent (D), the second liquid contains an acid anhydride (B), an inorganic filler (C), and an anti-settling agent (D), the anti-settling agent (D) contains an inorganic thickener (excluding the inorganic filler (C)), the viscosity η of the first liquid measured using an E-type viscometer and a 3°×R14 cone rotor under the conditions of a rotation speed of 5 rpm and a temperature of 25°C 5A is a two-component liquid resin composition that is 1.0 Pa·s or more and 50.0 Pa·s or less. [2] The viscosity η of the first liquid measured using an E-type viscometer and a 3°×R14 cone rotor under the conditions of a rotation speed of 10 rpm and a temperature of 25°C 10A is a two-component liquid resin composition according to [1] above that is 1.0 Pa·s or more and 50.0 Pa·s or less. [3] The viscosity ratio Ti of the above viscosity η 10A to the above viscosity η 5A is a two-component liquid resin composition according to [2] above that is 0.1 or more and 1.5 or less. A (η 5A / η 10A ) [4] The viscosity η of the second liquid measured using an E-type viscometer and a 3°×R14 cone rotor under the conditions of a rotation speed of 5 rpm and a temperature of 25°C 5BThe two-component liquid resin composition according to any one of [1] to [3] above, having a viscosity of 1.0 Pa·s or more and 50.0 Pa·s or less. [5] The viscosity η of the second liquid, measured using an E-type viscometer and a 3°×R14 cone rotor under the conditions of a rotation speed of 10 rpm and a temperature of 25°C. 10B The two-component liquid resin composition according to [4] above, having a viscosity of 1.0 Pa·s or more and 50.0 Pa·s or less. [6] The viscosity η above 10B The viscosity η above with respect to 5B The viscosity ratio Ti B (η 5B / η 10B ) is 0.5 or more and 2.5 or less. The two-component liquid resin composition according to [5] above. [7] The viscosity η of the mixed liquid of the first liquid and the second liquid, measured using an E-type viscometer and a 3°×R14 cone rotor under the conditions of a rotation speed of 5 rpm and a temperature of 25°C. 5P The two-component liquid resin composition according to any one of [1] to [6] above, having a viscosity of 1.0 Pa·s or more and 50.0 Pa·s or less. [8] The viscosity η of the mixed liquid of the first liquid and the second liquid, measured using an E-type viscometer and a 3°×R14 cone rotor under the conditions of a rotation speed of 10 rpm and a temperature of 25°C. 10P The two-component liquid resin composition according to [7] above, having a viscosity of 10.0 Pa·s or more and 50.0 Pa·s or less. [9] The viscosity η above 10P The viscosity η above with respect to 5P The viscosity ratio Ti P (η 5P / η 10P ) is 0.5 or more and 2.0 or less. The two-component liquid resin composition according to [8] above.

[10] The two-component liquid resin composition according to any one of [1] to [9] above, wherein the inorganic thickener contains one or more selected from the group consisting of layered inorganic minerals and nanosilica.

[11] The two-component liquid resin composition according to the above

[10] , wherein the layered inorganic mineral contains one or more selected from the group consisting of clay and talc.

[12] The two-component liquid resin composition according to any one of the above [1] to

[11] , wherein the content of the anti-settling agent (D) is 0.01% by mass or more and 2.00% by mass or less when the total amount of the two-component liquid resin composition is 100% by mass.

[13] The two-component liquid resin composition according to any one of the above [1] to

[12] , wherein the epoxy resin (A) contains an alicyclic epoxy resin.

[14] The two-component liquid resin composition according to

[13] above, wherein the content of the alicyclic epoxy resin is 50 parts by mass or more and 100 parts by mass or less when the content of the epoxy resin (A) is 100 parts by mass.

[15] The two-component liquid resin composition according to any one of the above [1] to

[14] , wherein the content of the epoxy resin (A) is 5% by mass or more and 30% by mass or less when the total amount of the two-component liquid resin composition is 100% by mass.

[16] The two-component liquid resin composition according to any one of the above [1] to

[15] , wherein the acid anhydride (B) contains one or more selected from the group consisting of methyl-5-norbornene-2,3-dicarboxylic anhydride, methylcyclohexane-1,2-dicarboxylic anhydride, and methyltetrahydrophthalic anhydride.

[17] The two-component liquid resin composition according to any one of the above [1] to

[16] , wherein the content of the acid anhydride (B) is 5% by mass or more and 20% by mass or less when the total amount of the two-component liquid resin composition is 100% by mass.

[18] The two-component liquid resin composition according to any one of the above [1] to

[17] , wherein the inorganic filler (C) contains one or more selected from the group consisting of silica, alumina, aluminum hydroxide, and calcium carbonate.

[19] In the volume frequency particle size distribution of the inorganic filler (C) measured by the laser diffraction scattering method, the average particle diameter D when the cumulative value is 50% 50 is 0.5 μm or more and 100.0 μm or less, and the two-component liquid resin composition according to any one of the above [1] to

[18] .

[20] The content of the inorganic filler (C) is 65% by mass or more and 85% by mass or less when the total amount of the two-component liquid resin composition is 100% by mass, and the two-component liquid resin composition according to any one of the above [1] to

[19] .

[21] The two-component liquid resin composition according to any one of the above [1] to

[20] , further comprising a curing accelerator (E).

[22] The curing accelerator (E) contains one or more selected from the group consisting of tertiary amines, quaternary ammonium salts, imidazoles, organic phosphines, and Lewis acid catalysts, and the two-component liquid resin composition according to the above

[21] .

[23] The content of the curing accelerator (E) is 0.01% by mass or more and 1.00% by mass or less when the total amount of the two-component liquid resin composition is 100% by mass, and the two-component liquid resin composition according to the above

[21] or

[22] .

[24] A power module including a substrate for a power module including a circuit layer and a power semiconductor element on the circuit layer of the substrate for a power module, which can be used for encapsulation by an injection molding method, and the two-component liquid resin composition according to any one of the above [1] to

[23] .

[25] A substrate for a power module including a circuit layer, a power semiconductor element on the circuit layer of the substrate for a power module, a sealing material for sealing the substrate for a power module and the power semiconductor element, and comprising, a power module, wherein the sealing material contains a cured product of the two-component liquid resin composition according to any one of the above [1] to

[24] .

[26] The power module according to the above

[25] , wherein the power semiconductor element includes one or more selected from the group consisting of a MOS transistor and an insulated gate bipolar transistor (IGBT).

Advantages of the Invention

[0009] According to the present invention, it is possible to provide a two-component liquid resin composition with improved performance balance of storage stability and fluidity, and a power module using the two-component liquid resin composition.

Embodiments for Carrying Out the Invention

[0010] Hereinafter, embodiments of the present invention will be described. In this specification, a numerical range indicated by "~" means a range including the numerical values described before and after "~" as the minimum value and the maximum value, respectively. In the numerical ranges described stepwise in this specification, the upper limit value or the lower limit value of a numerical range at a certain step can be arbitrarily combined with the upper limit value or the lower limit value of a numerical range at another step. In the numerical ranges described in this specification, the upper limit value or the lower limit value of the numerical range may be replaced with the values shown in the examples. "A or B" means that either A or B may be included, or both may be included. The materials exemplified in this specification can be used alone or in combination of two or more, unless otherwise specified. In this specification, the content of each component in the composition means the total amount of the plurality of substances corresponding to each component present in the composition, unless otherwise specified, when there are a plurality of substances corresponding to each component in the composition. In this specification, the description "when the total of the two-component liquid resin composition (or the first liquid and the second liquid) is 100% by mass" means excluding components such as solvents that volatilize when the two-component liquid resin composition is cured.

[0011] [Two-Component Liquid Resin Composition] The two-component liquid resin composition of this embodiment is a two-component liquid resin composition composed of a first liquid and a second liquid. The first liquid contains an epoxy resin (A), an inorganic filler (C), and an anti-settling agent (D). The second liquid contains an acid anhydride (B), an inorganic filler (C), and an anti-settling agent (D). The anti-settling agent (D) contains an inorganic thickener (excluding the inorganic filler (C)). The viscosity η of the first liquid, measured using an E-type viscometer and a 3°×R14 cone rotor under the conditions of a rotational speed of 5 rpm and a temperature of 25°C 5A is 1.0 Pa·s or more and 50.0 Pa·s or less.

[0012] By satisfying the above configuration, the two-component liquid resin composition of this embodiment can improve the performance balance between storage stability and fluidity. In the two-component liquid resin composition of this embodiment, specific components in the first liquid and the second liquid of the two-component liquid resin composition are considered to contribute to maintaining a preferable dispersion state of the inorganic filler (C) in the first liquid and the second liquid. Furthermore, when the viscosity η of the first liquid 5A is within the above numerical range, the fluidity of the first liquid at rest becomes preferable from the viewpoint of storage stability, and it is considered that the sedimentation of the inorganic filler (C) in the first liquid can be physically suppressed. As a result, it is considered that the two-component liquid resin composition of this embodiment can improve the performance balance of storage stability and fluidity suitable for the casting workability in the state of the first liquid and the second liquid.

[0013] In the two-component liquid resin composition of this embodiment, the above viscosity η 5A is preferably 3.0 Pa·s or more, more preferably 5.0 Pa·s or more, still more preferably 8.0 Pa·s or more, and preferably 40.0 Pa·s or less, more preferably 30.0 Pa·s or less, still more preferably 25.0 Pa·s or less, from the viewpoint of further improving the performance balance between storage stability and fluidity of the two-component liquid resin composition. The above viscosity η of the two-component liquid resin composition of this embodiment 5A refers to the viscosity 1 minute after starting the rotation of the cone rotor set in the E-type viscometer.

[0014] In the two-component liquid resin composition of the present embodiment, the viscosity η of the first liquid measured using an E-type viscometer and a 3°×R14 cone rotor under the conditions of a rotation speed of 10 rpm and a temperature of 25°C 10A is preferably 1.0 Pa·s or more, more preferably 3.0 Pa·s or more, still more preferably 5.0 Pa·s or more, and even more preferably 8.0 Pa·s or more, from the viewpoint of further improving the balance of the storage stability and fluidity performance of the two-component liquid resin composition, and is preferably 50.0 Pa·s or less, more preferably 40.0 Pa·s or less, and still more preferably 30.0 Pa·s or less. The viscosity η of the two-component liquid resin composition of the present embodiment 10A refers to the viscosity 1 minute after starting the rotation of the cone rotor set in the E-type viscometer.

[0015] In the two-component liquid resin composition of the present embodiment, the viscosity ratio Ti of the viscosity η 10A to the viscosity η 5A is preferably 0.1 or more, more preferably 0.3 or more, still more preferably 0.5 or more, and even more preferably 0.8 or more, from the viewpoint of further improving the balance of the storage stability and fluidity performance of the two-component liquid resin composition, and is preferably 1.5 or less, more preferably 1.3 or less, and still more preferably 1.1 or less. A (η 5A / η 10A )

[0016] In the two-component liquid resin composition of the present embodiment, the viscosity η of the second liquid measured using an E-type viscometer and a 3°×R14 cone rotor under the conditions of a rotation speed of 5 rpm and a temperature of 25°C 5BFrom the viewpoint of further improving the performance balance between the storage stability and fluidity of the two-component liquid resin composition, it is preferably 1.0 Pa·s or more, more preferably 5.0 Pa·s or more, still more preferably 10.0 Pa·s or more, still more preferably 15.0 Pa·s or more, still more preferably 20.0 Pa·s or more, and preferably 50.0 Pa·s or less, more preferably 45.0 Pa·s or less, still more preferably 40.0 Pa·s or less, still more preferably 35.0 Pa·s or less, still more preferably 30.0 Pa·s or less. The viscosity η of the two-component liquid resin composition of the present embodiment 5B refers to the viscosity 1 minute after starting the rotation of the cone rotor set in the E-type viscometer.

[0017] In the two-component liquid resin composition of the present embodiment, the viscosity η of the second liquid measured under the conditions of a rotation speed of 10 rpm and a temperature of 25 °C using an E-type viscometer and a 3°×R14 cone rotor 10B From the viewpoint of further improving the performance balance between the storage stability and fluidity of the two-component liquid resin composition, it is preferably 1.0 Pa·s or more, more preferably 3.0 Pa·s or more, still more preferably 5.0 Pa·s or more, still more preferably 10.0 Pa·s or more, still more preferably 15.0 Pa·s or more, and preferably 50.0 Pa·s or less, more preferably 45.0 Pa·s or less, still more preferably 40.0 Pa·s or less, still more preferably 35.0 Pa·s or less, still more preferably 30.0 Pa·s or less, still more preferably 25.0 Pa·s or less. The viscosity η of the two-component liquid resin composition of the present embodiment 10B refers to the viscosity 1 minute after starting the rotation of the cone rotor set in the E-type viscometer.

[0018] In the two-component liquid resin composition of the present embodiment, the above viscosity η 10B with respect to the above viscosity η 5B viscosity ratio Ti B (η 5B / η 10B) is preferably 0.5 or more, more preferably 0.8 or more, still more preferably 1.0 or more, and preferably 2.5 or less, more preferably 2.2 or less, still more preferably 2.0 or less, still more preferably 1.7 or less, still more preferably 1.5 or less, from the viewpoint of further improving the performance balance between the storage stability and fluidity of the two-component liquid resin composition.

[0019] In the two-component liquid resin composition of the present embodiment, the viscosity η of the mixed liquid of the first liquid and the second liquid, measured under the conditions of a rotation speed of 5 rpm and a temperature of 25°C, using an E-type viscometer and a 3°×R14 cone rotor 5P is preferably 1.0 Pa·s or more, more preferably 5.0 Pa·s or more, still more preferably 10.0 Pa·s or more, still more preferably 15.0 Pa·s or more, still more preferably 20.0 Pa·s or more, and preferably 50.0 Pa·s or less, more preferably 45.0 Pa·s or less, still more preferably 40.0 Pa·s or less, still more preferably 35.0 Pa·s or less, from the viewpoint of further improving the performance balance between the storage stability and fluidity of the two-component liquid resin composition. The viscosity η of the two-component liquid resin composition of the present embodiment 5P refers to the viscosity 1 minute after starting the rotation of the cone rotor set in the E-type viscometer.

[0020] In the two-component liquid resin composition of the present embodiment, the viscosity η of the mixed liquid of the first liquid and the second liquid, measured under the conditions of a rotation speed of 10 rpm and a temperature of 25°C, using an E-type viscometer and a 3°×R14 cone rotor 10PFrom the viewpoint of further improving the performance balance between the storage stability and fluidity of the two-component liquid resin composition, it is preferably 10.0 Pa·s or more, more preferably 12.0 Pa·s or more, still more preferably 14.0 Pa·s or more, still more preferably 16.0 Pa·s or more, still more preferably 18.0 Pa·s or more, still more preferably 20.0 Pa·s or more, still more preferably 21.0 Pa·s or more, and preferably 50.0 Pa·s or less, more preferably 45.0 Pa·s or less, still more preferably 40.0 Pa·s or less, still more preferably 35.0 Pa·s or less, still more preferably 30.0 Pa·s or less. The viscosity η of the two-component liquid resin composition of the present embodiment 10P refers to the viscosity 1 minute after starting the rotation of the cone rotor set in the E-type viscometer.

[0021] In the two-component liquid resin composition of the present embodiment, the above viscosity η 10P with respect to the above viscosity η 5P viscosity ratio Ti P (η 5P / η 10P ) From the viewpoint of further improving the performance balance between the storage stability and fluidity of the two-component liquid resin composition, it is preferably 0.5 or more, more preferably 0.6 or more, still more preferably 0.7 or more, still more preferably 0.8 or more, still more preferably 0.9 or more, still more preferably 1.0 or more, and preferably 2.0 or less, more preferably 1.9 or less, still more preferably 1.8 or less, still more preferably 1.7 or less, still more preferably 1.6 or less, still more preferably 1.5 or less, still more preferably 1.4 or less, still more preferably 1.3 or less, still more preferably 1.2 or less.

[0022] Hereinafter, the components used in the resin composition of the present embodiment will be described in detail.

[0023] (Epoxy resin (A)) The two-component liquid resin composition of the present embodiment contains an epoxy resin (A). As the epoxy resin of the present embodiment, from the viewpoint of further improving the performance balance of strength, hardness, elastic modulus, coefficient of thermal expansion, thermal conductivity, heat dissipation, and electrical properties of the cured product of the two-component liquid resin composition, preferably, an alicyclic epoxy resin; bisphenol A type epoxy resin, bisphenol F type epoxy resin, bisphenol E type epoxy resin, bisphenol S type epoxy resin, bisphenol M type epoxy resin (4,4'-(1,3-phenylene diisoprene) bisphenol type epoxy resin), bisphenol P type epoxy resin (4,4'-(1,4-phenylene diisoprene) bisphenol type epoxy resin), bisphenol Z type epoxy resin (4,4'-cyclohexadiene bisphenol type epoxy resin), etc. bisphenol type epoxy resins; phenol novolac type epoxy resin, cresol novolac type epoxy resin, tris-phenol group methane type novolac type epoxy resin, tetra-phenol group ethane type novolac type epoxy resin, novolac type epoxy resins having a condensed ring aromatic hydrocarbon structure, etc.; aromatic glycidylamine type epoxy resins such as N,N-diglycidylaniline, N,N-diglycidyltoluidine, diaminodiphenylmethane type glycidylamine, aminophenol type glycidylamine; aminophenol type epoxy resin; biphenyl type epoxy resin; arylalkylene type epoxy resins such as xylylene type epoxy resin, biphenyl aralkyl type epoxy resin; naphthylene ether type epoxy resin, naphthol type epoxy resin, naphthalene diol type epoxy resin, bifunctional to tetrafunctional epoxy type naphthalene resin, binaphthyl type epoxy resin, naphthalene aralkyl type epoxy resin, etc. naphthalene type epoxy resins; anthracene type epoxy resin; phenoxy type epoxy resin; dicyclopentadiene type epoxy resin; norbornene type epoxy resin; adamantane type epoxy resin; fluorene type epoxy resin, and contains one or more selected from the group consisting of, and from the viewpoint of further improving the fluidity of the two-component liquid resin composition, more preferably contains an alicyclic epoxy resin.

[0024] The alicyclic epoxy resin of the present embodiment preferably contains an alicyclic epoxy resin that is liquid at 25°C, more preferably vinylcyclopentadiene dioxide, vinylcyclohexene monodioxide, vinylcyclohexene dioxide, dicyclopentadiene oxide, 3,4-epoxy-1-[8,9-epoxy-2,4-dioxaspiro[5.5]undecane-3-yl]-cyclohexane and other epoxy-[epoxy-oxaspiro C 8-15 alkyl]-cyclo C 5-12 alkane; 3,4-epoxycyclohexylmethyl-3’,4’-epoxycyclohexanecarboxylate, 4,5-epoxycyclooctylmethyl-4’,5’-epoxycyclooctanecarboxylate and other epoxy C 5-12 cycloalkyl C 1-3 alkyl-epoxy C 5-12 cycloalkanecarboxylate; bis(2-methyl-3,4-epoxycyclohexylmethyl)adipate and other bis(C 1-3 alkylepoxy C 5-12 cycloalkyl C 1-3 alkyl)dicarboxylate selected from the group consisting of one or more, more preferably epoxy C 5-12 cycloalkyl C 1-3 alkyl-epoxy C 5-12 cycloalkanecarboxylate, more preferably 3,4-epoxycyclohexylmethyl-3’,4’-epoxycyclohexanecarboxylate. Commercially available products of 3,4-epoxycyclohexylmethyl-3’,4’-epoxycyclohexanecarboxylate include those manufactured by Daicel Corporation, trade name: Celoxide #2021P (epoxy equivalent: 128 to 140), and are preferably used.

[0025] When the epoxy resin (A) of the present embodiment contains an alicyclic epoxy resin, from the viewpoint of further improving the fluidity of the two-component liquid resin composition, when the content of the above epoxy resin (A) is 100 parts by mass, it is preferably 50 parts by mass or more, more preferably 60 parts by mass or more, still more preferably 70 parts by mass or more, still more preferably 80 parts by mass or more, still more preferably 90 parts by mass or more, still more preferably 95 parts by mass or more, and the upper limit is not particularly limited, for example, it may be 100 parts by mass or less.

[0026] From the viewpoint of further improving the performance balance of strength, hardness, elastic modulus, thermal expansion coefficient, thermal conductivity, heat dissipation property and electrical properties of the cured product of the two-component liquid resin composition, when the total amount of the two-component liquid resin composition is 100% by mass, the content of the epoxy resin (A) in the two-component liquid resin composition of the present embodiment is preferably 5% by mass or more, more preferably 6% by mass or more, still more preferably 7% by mass or more, still more preferably 8% by mass or more, still more preferably 9% by mass or more, still more preferably 10% by mass or more. And from the viewpoint of further improving the performance balance of the storage stability and fluidity of the two-component liquid resin composition, it is preferably 30% by mass or less, more preferably 28% by mass or less, still more preferably 25% by mass or less, still more preferably 23% by mass or less, still more preferably 20% by mass or less, still more preferably 18% by mass or less, still more preferably 15% by mass or less, still more preferably 13% by mass or less.

[0027] (Acid anhydride (B)) The two-component liquid resin composition of the present embodiment contains an acid anhydride (B). The acid anhydride (B) functions as a curing agent for the epoxy resin (A).

[0028] As the acid anhydride (B) of the present embodiment, from the viewpoint of improving the curability of the two-component liquid resin composition, preferably, dodecenyl succinic anhydride, polyadipic anhydride, polyazelaic anhydride, polysebacic anhydride, poly(ethyl octadecanedioic) anhydride, poly(phenylhexadecanedioic) anhydride, methyltetrahydrophthalic anhydride, methylhexahydrophthalic anhydride, hexahydrophthalic anhydride, methyl hymic anhydride, tetrahydrophthalic anhydride, trialkyltetrahydrophthalic anhydride, methylcyclohexenedicarboxylic anhydride, phthalic anhydride, trimellitic anhydride, pyromellitic anhydride, benzophenonetetracarboxylic anhydride, ethylene glycol bistrimellitate, het acid anhydride, tetrahydrophthalic anhydride, methyl nadic anhydride (methyl-5-norbornene-2,3-dicarboxylic anhydride), methyl hymic anhydride (methyl-3,6-endomethylene-1,2,3,6-tetrahydrophthalic anhydride), methylcyclohexane-1,2-dicarboxylic anhydride, 5-(2,5-dioxotetrahydro-3-furanyl)-3-methyl-3-cyclohexane-1,2-dicarboxylic anhydride, and the like, and from the viewpoint of further improving the performance balance of the storage stability and fluidity of the two-component liquid resin composition, more preferably, it contains one or more selected from the group consisting of methyl-5-norbornene-2,3-dicarboxylic anhydride, methylcyclohexane-1,2-dicarboxylic anhydride, and methyltetrahydrophthalic anhydride, and still more preferably, it contains methyl-5-norbornene-2,3-dicarboxylic anhydride.

[0029] When the content of the acid anhydride (B) in the two-component liquid resin composition of the present embodiment is based on 100% by mass of the entire two-component liquid resin composition, from the viewpoint of improving the curability of the two-component liquid resin composition, preferably, it is 5% by mass or more, more preferably, it is 7% by mass or more, still more preferably, it is 9% by mass or more, and still more preferably, it is 11% by mass or more. And from the viewpoint of further improving the performance balance of the storage stability and fluidity of the two-component liquid resin composition, preferably, it is 20% by mass or less, more preferably, it is 18% by mass or less, still more preferably, it is 16% by mass or less, and still more preferably, it is 14% by mass or less.

[0030] (Inorganic filler (C)) The two-component liquid resin composition of the present embodiment contains an inorganic filler (C). As the inorganic filler (C), from the viewpoint of further improving the performance balance of strength, hardness, elastic modulus, coefficient of thermal expansion, thermal conductivity, heat dissipation property, and electrical properties of the cured product of the two-component liquid resin composition, preferably, silica, alumina, zircon, iron oxide, zinc oxide, titanium oxide, silicon nitride, boron nitride, aluminum nitride, silicon carbide, glass fiber, glass flake, alumina fiber, carbon fiber, graphite, carbon black, ferrite, graphite, aluminum hydroxide, magnesium hydroxide, calcium carbonate, manganese carbonate, magnesium carbonate, barium sulfate, potassium titanate, calcium silicate, inorganic balloon, and silver powder, and more preferably, one or more selected from the group consisting of silica, alumina, aluminum hydroxide, and calcium carbonate, from the viewpoint of further improving the performance balance of storage stability and fluidity of the two-component liquid resin composition. Further, the inorganic filler may be surface-treated. Examples of the surface treatment include, but are not particularly limited to, alkylation treatment, trimethylsilylation treatment, silicone treatment, treatment with a silane coupling agent, etc.

[0031] The shape of the inorganic filler (C) of the present embodiment is preferably fibrous, amorphous, or spherical from the viewpoint of further improving the performance balance of strength, hardness, elastic modulus, coefficient of thermal expansion, thermal conductivity, heat dissipation property, and electrical properties of the cured product of the two-component liquid resin composition, and more preferably spherical from the viewpoint of further improving the performance balance of storage stability and fluidity of the two-component liquid resin composition. Here, the spherical shape may be a true sphere, an ellipse, or a substantially spherical shape including an oval shape. The aspect ratio (ratio of the major axis to the minor axis) of the inorganic filler (C) of the present embodiment is preferably 1.3 or less, more preferably 1.2 or less, and even more preferably 1.1 or less.

[0032] In the volume frequency particle size distribution of the inorganic filler (C) of the present embodiment measured by the laser diffraction scattering method, the average particle diameter D when the cumulative value is 50% 50 is preferably 0.5 μm or more, more preferably 1.0 μm or more, still more preferably 3.0 μm or more, still more preferably 5.0 μm or more, still more preferably 7.0 μm or more, still more preferably 10.0 μm or more, still more preferably 12.0 μm or more, still more preferably 15.0 μm or more, still more preferably 17.0 μm or more, still more preferably 20.0 μm or more, and preferably 100.0 μm or less, more preferably 90.0 μm or less, still more preferably 80.0 μm or less, still more preferably 70.0 μm or less, still more preferably 60.0 μm or less, still more preferably 50.0 μm or less, still more preferably 40.0 μm or less, still more preferably 30.0 μm or less, from the viewpoint of further improving the performance balance between the storage stability and fluidity of the two-component liquid resin composition. The inorganic filler (C) of the present embodiment has the above average particle diameter D 50 and may contain an inorganic filler having two or more different average particle diameters D 50 within the range.

[0033] The average particle diameter D of the inorganic filler (C) of the present embodiment 50 can be measured, for example, by a laser diffraction scattering measurement method using a laser diffraction type particle size distribution measuring device (for example, SALD-7000 manufactured by Shimadzu Corporation).

[0034] The content of the inorganic filler (C) in the two-component liquid resin composition of the present embodiment is preferably 65% by mass or more, more preferably 67% by mass or more, still more preferably 69% by mass or more, still more preferably 71% by mass or more, still more preferably 73% by mass or more, still more preferably 75% by mass or more, and preferably 85% by mass or less, more preferably 83% by mass or less, still more preferably 81% by mass or less, still more preferably 79% by mass or less, still more preferably 77% by mass or less, when the total of the two-component liquid resin composition is 100% by mass, from the viewpoint of further improving the performance balance between the storage stability and fluidity of the two-component liquid resin composition.

[0035] From the viewpoint of further improving the performance balance between the storage stability and fluidity of the first liquid, the content of the inorganic filler (C) in the first liquid of the present embodiment is preferably 65% by mass or more, more preferably 67% by mass or more, still more preferably 69% by mass or more, still more preferably 71% by mass or more, still more preferably 73% by mass or more, and preferably 85% by mass or less, more preferably 83% by mass or less, still more preferably 81% by mass or less, still more preferably 79% by mass or less, when the total amount of the first liquid is 100% by mass.

[0036] From the viewpoint of further improving the performance balance between the storage stability and fluidity of the second liquid, the content of the inorganic filler (C) in the second liquid of the present embodiment is preferably 65% by mass or more, more preferably 67% by mass or more, still more preferably 69% by mass or more, still more preferably 71% by mass or more, still more preferably 73% by mass or more, and preferably 85% by mass or less, more preferably 83% by mass or less, still more preferably 81% by mass or less, still more preferably 79% by mass or less, still more preferably 77% by mass or less, when the total amount of the second liquid is 100% by mass.

[0037] (Anti-settling agent (D)) The two-component liquid resin composition of the present embodiment contains an inorganic thickener other than the inorganic filler (C) described above as the anti-settling agent (D). By including an inorganic thickener as the anti-settling agent (D), the sedimentation of the inorganic filler (C) in the two-component liquid resin composition can be suppressed. From the viewpoint of further improving the performance balance between the storage stability and fluidity of the two-component liquid resin composition, the inorganic thickener of the present embodiment preferably contains one or more selected from the group consisting of layered inorganic minerals and nanosilica.

[0038] From the viewpoint of further improving the performance balance between the storage stability and fluidity of the two-component liquid resin composition, the layered inorganic mineral of the present embodiment preferably contains one or more selected from the group consisting of clay and talc, and more preferably contains organoclay.

[0039] As the clay of the present embodiment, preferably, it contains one or more selected from the group consisting of kaolin, smectite, illite, bentonite (montmorillonite), hectorite, pyrophyllite, attapulgite, sepiolite and laponite, and from the viewpoint of further improving the performance balance of the storage stability and fluidity of the two-component liquid resin composition, more preferably it contains bentonite. Further, the organic clay of the present embodiment preferably contains one or more selected from the group consisting of organic kaolin, organic smectite, organic illite, organic bentonite (organic montmorillonite), organic hectorite, organic pyrophyllite, organic attapulgite, organic sepiolite and organic laponite. From the viewpoint of further improving the performance balance of the storage stability and fluidity of the two-component liquid resin composition, more preferably it contains organic bentonite, and even more preferably it contains bentonite ion-exchanged with a quaternary ammonium salt, and even more preferably it contains bentonite ion-exchanged with a quaternary alkylammonium salt, and even more preferably it contains bentonite ion-exchanged with a quaternary alkylammonium salt containing at least one alkyl group having 6 or more and 24 or less carbon atoms, and even more preferably it contains bentonite ion-exchanged with a quaternary alkylammonium salt containing at least one alkyl group having 12 or more and 22 or less carbon atoms. Here, the organic clay is one in which an organic compound is intercalated between the layers of the layered silicate plane in the layered silicate (clay). Between the layered silicate planes, intermediate layer cations such as sodium ions and calcium ions are present to maintain the layered crystal structure. By ion-exchanging the intermediate layer cation with an organic cation, the organic compound chemically binds to the surface of the silicate plane and is inserted between the layers.

[0040] In the organic clay, the organic compound ion-exchanged with the intermediate layer cation preferably contains a quaternary ammonium salt, more preferably contains a quaternary alkylammonium salt, and still more preferably contains a quaternary alkylammonium salt containing at least one alkyl group having 6 or more and 24 or less carbon atoms, and still more preferably contains a quaternary alkylammonium salt containing at least one alkyl group having 12 or more and 22 or less carbon atoms, and still more preferably contains one or more selected from the group consisting of trimethylstearylammonium salt, dimethylstearylbenzylammonium salt, dimethyloctadecylammonium salt, oleylbis(2-hydroxyethyl)methylammonium salt, dimethylstearylammonium salt, benzyldimethylstearylammonium salt, and dimethyldistearylammonium salt.

[0041] Examples of commercially available products of the organophilic bentonite used in this embodiment include Benton 34, Benton SD-1, Benton SD-2, Benton SD-3, Benton 57, Benton 52, etc. manufactured by ELEMENTIS; Esben NX, Esben N400, Esben WX, Esben NZ, Esben, Esben W, Esben C, Esben E, Esben NZ70, Esben NTO, Esben NX80, Esben NO12S, Esben NEZ, Esben NO12, Esben NE, etc. manufactured by Hoejun; Kunibis 110, Kunibis 120, Kunibis 127, etc. manufactured by Kunimine Industries Co., Ltd. Examples of commercially available products of the organophilic hectorite used in this embodiment include Benton 27, Benton 38, etc. manufactured by ELEMENTIS.

[0042] The nanosilica contained in the inorganic thickener of this embodiment refers to silica in which the average particle diameter D of the primary particles when the cumulative value is 50% in the volume frequency particle size distribution measured by the laser diffraction scattering method 50 is less than 0.100 μm. The above average particle diameter D of the nanosilica of this embodiment 50From the viewpoint of further improving the balance of the storage stability and fluidity performance of the two-component liquid resin composition, it is preferably 0.090 μm or less, more preferably 0.080 μm or less, still more preferably 0.070 μm or less, still more preferably 0.060 μm or less, still more preferably 0.050 μm or less, still more preferably 0.040 μm or less, still more preferably 0.030 μm or less, still more preferably 0.020 μm or less. The lower limit is not particularly limited, and for example, it may be 0.001 μm or more, 0.003 μm or more, 0.005 μm or more, 0.008 μm or more, or 0.010 μm or more. The average particle diameter D of the nanosilica of the present embodiment 50 can be measured, for example, by a laser diffraction scattering measurement method using a laser diffraction particle size distribution measuring device (for example, SALD-7000 manufactured by Shimadzu Corporation).

[0043] As the nanosilica of the present embodiment, for example, Rheoleasil QS09, Rheoleasil QS10, Rheoleasil QS102, Rheoleasil CP102, Rheoleasil QS20, Rheoleasil QS20L, Rheoleasil QS30, Rheoleasil QS40, etc. manufactured by Tokuyama Corporation can be used.

[0044] When the content of the anti-settling agent (D) in the two-component liquid resin composition of the present embodiment is 100% by mass of the entire two-component liquid resin composition, from the viewpoint of further suppressing the sedimentation of the inorganic filler (C) in the two-component liquid resin composition, it is preferably 0.01% by mass or more, more preferably 0.03% by mass or more, still more preferably 0.05% by mass or more, still more preferably 0.08% by mass or more. And from the viewpoint of further improving the balance of the storage stability and fluidity performance of the two-component liquid resin composition, it is preferably 2.00% by mass or less, more preferably 1.50% by mass or less, still more preferably 1.00% by mass or less, still more preferably 0.80% by mass or less, still more preferably 0.50% by mass or less, still more preferably 0.30% by mass or less, still more preferably 0.20% by mass or less.

[0045] From the perspective of suppressing the sedimentation of the inorganic filler (C) in the first liquid, the content of the anti-settling agent (D) in the first liquid of the present embodiment is preferably 0.01% by mass or more, more preferably 0.03% by mass or more, still more preferably 0.05% by mass or more, and even more preferably 0.08% by mass or more when the total amount of the first liquid is 100% by mass. From the perspective of further improving the performance balance between the storage stability and fluidity of the first liquid, it is preferably 2.00% by mass or less, more preferably 1.50% by mass or less, still more preferably 1.00% by mass or less, even more preferably 0.80% by mass or less, still more preferably 0.50% by mass or less, and even more preferably 0.30% by mass or less.

[0046] From the perspective of suppressing the sedimentation of the inorganic filler (C) in the second liquid, the content of the anti-settling agent (D) in the second liquid of the present embodiment is preferably 0.01% by mass or more, more preferably 0.03% by mass or more, still more preferably 0.05% by mass or more, and even more preferably 0.08% by mass or more when the total amount of the second liquid is 100% by mass. From the perspective of further improving the performance balance between the storage stability and fluidity of the second liquid, it is preferably 2.00% by mass or less, more preferably 1.50% by mass or less, still more preferably 1.00% by mass or less, even more preferably 0.80% by mass or less, still more preferably 0.50% by mass or less, and even more preferably 0.30% by mass or less, still more preferably 0.20% by mass or less, and even more preferably 0.15% by mass or less.

[0047] (Curing accelerator (E)) From the perspective of promoting the reaction between the epoxy resin (A) and the acid anhydride (B) and improving the curability of the two-component liquid resin composition, the two-component liquid resin composition of the present embodiment preferably further contains a curing accelerator (E). From the perspective of further improving the performance balance between the storage stability and fluidity of the two-component liquid resin composition, the curing accelerator (E) of the present embodiment is preferably contained in the second liquid.

[0048] From the viewpoint of improving the curability of the two-component liquid resin composition, the curing accelerator (E) of the present embodiment preferably contains one or more selected from the group consisting of tertiary amines, quaternary ammonium salts, imidazoles, organic phosphines, and Lewis acid catalysts, and more preferably contains a quaternary ammonium salt.

[0049] The tertiary amine preferably contains one or more selected from the group consisting of trimethylamine, triethylamine, tripropylamine, tributylamine, and benzyldimethylamine.

[0050] The quaternary ammonium salt preferably contains one or more selected from the group consisting of organic acid salts of diazabicycloundecene such as octylate of DBU [1,8-diazabicyclo[5.4.0]undecene-7] (manufactured by San-Apro Ltd., trade name: SA102), DBN [1,5-diazabicyclo[4.3.0]-5-nonene], quaternary ammonium salts which are salts of tertiary amines and carboxylic acids (manufactured by San-Apro Ltd., trade name: U-CAT2313), octadecyltrimethylammonium chloride (manufactured by NOF Corporation, trade name: Nissan Cation), and tetraalkyl (each alkyl group having 1 to 18 carbon atoms) ammonium salts (for example, tetraethylammonium bromide, tetrabutylammonium bromide, tetraalkylammonium carboxylates (the carboxylic acid having 1 to 12 carbon atoms)). From the viewpoint of improving the curability of the two-component liquid resin composition, the curing accelerator (E) of the present embodiment more preferably contains an organic acid salt of diazabicycloundecene.

[0051] The imidazoles preferably contain one or more selected from the group consisting of 1-benzyl-2-methylimidazole, 2-ethyl-4-methylimidazole, 2-undecylimidazole, 1,2-dimethylimidazole, and 1-benzyl-2-phenylimidazole.

[0052] The organic phosphine preferably contains one or more selected from the group consisting of triphenylphosphine, triphenylphosphine-triphenylborate, tris(p-methoxyphenyl)phosphine, and tetraphenylphosphonium tetraphenylborate.

[0053] The Lewis acid catalyst preferably contains one or more selected from the group consisting of boron trifluoride amine complex, boron trichloride amine complex, and boron trifluoride ethylamine complex.

[0054] From the viewpoint of improving the curability of the two-component liquid resin composition of the present embodiment, when the total amount of the two-component liquid resin composition is 100% by mass, the content of the curing accelerator (E) is preferably 0.01% by mass or more, more preferably 0.05% by mass or more, still more preferably 0.10% by mass or more, still more preferably 0.15% by mass or more, and still more preferably 0.20% by mass or more. And from the viewpoint of further improving the performance balance of the storage stability and fluidity of the two-component liquid resin composition, it is preferably 1.00% by mass or less, more preferably 0.80% by mass or less, still more preferably 0.50% by mass or less, and still more preferably 0.30% by mass or less.

[0055] (Other components) The two-component liquid resin composition of the present embodiment may contain, if necessary, a coupling agent, a colorant such as carbon black, an antifoaming agent such as a silicone antifoaming agent, and the like.

[0056] From the viewpoint of improving the interfacial strength between the epoxy resin (A) and the inorganic filler (C), the coupling agent of the present embodiment preferably contains one or more selected from the group consisting of epoxy silane coupling agent, amino silane coupling agent, ureido silane coupling agent, and mercapto silane coupling agent, and more preferably contains an epoxy silane coupling agent.

[0057] The epoxy silane coupling agent preferably contains one or more selected from the group consisting of γ-glycidoxypropyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldimethoxysilane, and β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, and more preferably contains γ-glycidoxypropyltrimethoxysilane. The amino silane coupling agent preferably contains one or more selected from the group consisting of γ-aminopropyltriethoxysilane, γ-aminopropyltrimethoxysilane, N-β(aminoethyl)γ-aminopropyltrimethoxysilane, N-β(aminoethyl)γ-aminopropylmethyldimethoxysilane, N-phenyl-γ-aminopropyltriethoxysilane, N-phenyl-γ-aminopropyltrimethoxysilane, N-β(aminoethyl)γ-aminopropyltriethoxysilane, N-(6-aminohexyl)3-aminopropyltrimethoxysilane, and N-(3-(trimethoxysilylpropyl)-1,3-benzenedimethanamine. The ureido silane coupling agent contains one or more selected from the group consisting of, for example, γ-ureidopropyltriethoxysilane and hexamethyldisilazane.

[0058] From the viewpoint of improving the interfacial strength between the epoxy resin (A) and the inorganic filler (C), the content of the coupling agent in the two-component liquid resin composition of this embodiment is preferably 0.01% by mass or more, more preferably 0.03% by mass or more, still more preferably 0.05% by mass or more, still more preferably 0.08% by mass or more, and preferably 1.00% by mass or less, more preferably 0.80% by mass or less, still more preferably 0.60% by mass or less, still more preferably 0.40% by mass or less, still more preferably 0.20% by mass or less when the total amount of the two-component liquid resin composition is 100% by mass.

[0059] The colorant of the present embodiment preferably contains one or more selected from the group consisting of carbon black, titanium oxide, barium sulfate, iron black, cadmium yellow, aniline black, and alizarin, and more preferably contains carbon black.

[0060] When the total amount of the two-component liquid resin composition of the present embodiment is 100% by mass, the content of the colorant in the two-component liquid resin composition is preferably 0.01% by mass or more, more preferably 0.02% by mass or more, still more preferably 0.03% by mass or more, still more preferably 0.04% by mass or more, still more preferably 0.05% by mass or more, and preferably 0.50% by mass or less, more preferably 0.40% by mass or less, still more preferably 0.30% by mass or less, still more preferably 0.20% by mass or less, still more preferably 0.10% by mass or less.

[0061] The defoaming agent of the present embodiment preferably contains one or more selected from the group consisting of silicone-based defoaming agents, fluorine-based defoaming agents, and polymer-based defoaming agents, and more preferably contains a silicone-based defoaming agent.

[0062] When the total amount of the two-component liquid resin composition of the present embodiment is 100% by mass, the content of the defoaming agent in the two-component liquid resin composition is preferably 0.01% by mass or more, more preferably 0.03% by mass or more, still more preferably 0.05% by mass or more, still more preferably 0.08% by mass or more, and preferably 1.00% by mass or less, more preferably 0.80% by mass or less, still more preferably 0.60% by mass or less, still more preferably 0.40% by mass or less, still more preferably 0.20% by mass or less.

[0063] (Manufacturing method of two-component liquid resin composition) The manufacturing method of the two-component liquid resin composition of the present embodiment will be described in detail. The two-component liquid resin composition of the present embodiment can be produced by sufficiently mixing and stirring, by a known method, among the above-described respective components, as the first liquid, an epoxy resin (A), an inorganic filler (C), an anti-settling agent (D), and other components, and as the second liquid, an acid anhydride (B), an inorganic filler (C), an anti-settling agent (D), and other components. When the two-component liquid resin composition of the present embodiment contains a curing accelerator (E), preferably the second liquid contains the curing accelerator (E).

[0064] Examples of the method for mixing and stirring the respective components to obtain the first liquid or the second liquid in the two-component liquid resin composition of the present embodiment include methods using a mixer such as a mixer, a kneader such as a roll and a kneader.

[0065] The two-component liquid resin composition of the present embodiment is used in a state of a mixed liquid obtained by mixing the above first liquid and second liquid. Examples of the method for mixing the first liquid and the second liquid include methods using a mixer such as a mixer, a kneader such as a roll and a kneader.

[0066] In the two-component liquid resin composition of the present embodiment, from the viewpoint of being able to further improve the performance balance of the fluidity, heat resistance during curing, and mechanical properties of the two-component liquid resin composition, when the amount of the first liquid is 100 parts by mass, the content of the second liquid when further mixing the above first liquid and second liquid is preferably 50 parts by mass or more, more preferably 70 parts by mass or more, still more preferably 90 parts by mass or more, and preferably 150 parts by mass or less, more preferably 130 parts by mass or less, still more preferably 110 parts by mass or less.

[0067] (Use of the two-component liquid resin composition) The two-component liquid resin composition of the present embodiment can preferably be used for encapsulating, by a casting method, a power module substrate including a circuit layer and a power semiconductor element on the circuit layer of the power module substrate.

[0068] [Power module] The power module of this embodiment includes a power module substrate including a circuit layer, a power semiconductor element on the circuit layer of the power module substrate, and a sealing material for sealing the power module substrate and the power semiconductor element, and the sealing material includes a cured product of the two-component liquid resin composition of this embodiment described above.

[0069] The power module of this embodiment may be a small to medium-sized power module such as a home appliance or a computer, or may be a large-sized power module such as for automotive, railway vehicle, or substation control. The power module of this embodiment is preferably one or more selected from the group consisting of a rectifier, a frequency converter, a regulator, and an inverter.

[0070] The power semiconductor element in the power module of this embodiment preferably includes one or more selected from the group consisting of a rectifier diode, a power transistor, a MOS transistor, an insulated gate bipolar transistor (IGBT), a thyristor, a gate turn-off thyristor (GTO), and a triac, and more preferably includes one or more selected from the group consisting of a MOS transistor and an insulated gate bipolar transistor (IGBT).

[0071] The power module of this embodiment can be obtained by casting the two-component liquid resin composition of this embodiment described above so as to cover the power semiconductor element mounted on the power module substrate on which the circuit layer is formed, and curing it by heating the two-component liquid resin composition. It is preferable to perform vacuum degassing of the two-component liquid resin composition during casting and / or before and after casting. By performing vacuum degassing, air and the like contained in the two-component liquid resin composition can be removed, and a power module with few voids in the cured product of the two-component liquid resin composition can be obtained. The heating method used to cure the two-component liquid resin composition of the present embodiment is not particularly limited, and for example, conventionally known methods such as hot air circulation heating, infrared heating, and high-frequency heating can be employed.

[0072] From the perspective of the manufacturing efficiency of the power module, the heating temperature of the power module of the present embodiment is preferably 100°C or higher, more preferably 110°C or higher, still more preferably 120°C or higher, and even more preferably 130°C or higher. From the perspective of improving the performance balance of the reliability and mechanical strength of the power module, it is preferably 220°C or lower, more preferably 210°C or lower, and still more preferably 200°C or lower.

[0073] From the perspective of improving the performance balance of the reliability and mechanical strength of the power module, the heating time of the power module of the present embodiment is preferably 30 seconds or longer, more preferably 60 seconds or longer, and still more preferably 300 seconds or longer. From the perspective of the manufacturing efficiency of the power module, it is preferably 10 hours or shorter, more preferably 5 hours or shorter, and still more preferably 3 hours or shorter.

[0074] The embodiments of the present invention have been described above, but these are examples of the present invention, and various configurations other than the above can be adopted. Further, the present invention is not limited to the above-described embodiments, and modifications, improvements, etc. within the scope capable of achieving the object of the present invention are included in the present invention.

Examples

[0075] Hereinafter, the present invention will be described in more detail with reference to examples, but the present invention is not limited thereby.

[0076] <Examples, Comparative Examples> The components shown in the "First Liquid" in Table 1 were mixed in the amounts (parts by mass) shown in Table 1 to obtain a first liquid (main agent). Separately, the components shown in the "Second Liquid" in Table 1 were mixed in the amounts (parts by mass) shown in Table 1 to obtain a second liquid (curing agent). Then, the first liquid and the second liquid were mixed at the ratio shown in the "Mixing Ratio (First Liquid / Second Liquid)" in Table 1 to produce a mixed liquid (liquid resin composition). The details of each component in Table 1 are as follows.

[0077] <Epoxy resin (A)> · Epoxy resin 1: 3,4-epoxycyclohexylmethyl-3’,4’-epoxycyclohexanecarboxylate (alicyclic epoxy resin, manufactured by Daicel Corporation, Celoxide 2021P) · Epoxy resin 2: Bisphenol A type epoxy resin (manufactured by Mitsubishi Chemical Corporation, jER828EL) · Epoxy resin 3: Bisphenol F type epoxy resin (manufactured by Mitsubishi Chemical Corporation, jER807) · Epoxy resin 4: Aminophenol type epoxy resin (manufactured by Mitsubishi Chemical Corporation, JER630) <Acid anhydride (B)> · Acid anhydride 1: Methyl nadic anhydride (manufactured by Showa Denko Materials Co., Ltd., MHAC-P) <Curing accelerator (E)> · Curing accelerator 1: DBU-octylate (manufactured by San-Apro Ltd., U-CAT SA102) <Inorganic filler (C)> · Inorganic filler 1: Spherical fused silica (manufactured by Denka Co., Ltd., FB-950, average particle diameter D 50 : 23 μm) <Anti-settling agent (D)> · Anti-settling agent 1: Organophilic bentonite (manufactured by Hoejung Co., Ltd., Esven NTO) · Anti-settling agent 2: Organophilic bentonite (manufactured by Elementis plc, Benton SD-2) · Anti-settling agent 3: Organophilic bentonite (manufactured by Hoejung Co., Ltd., Esven N400) · Anti-settling agent 4: Organophilic bentonite (manufactured by Hoejung Co., Ltd., Esven NZ) · Anti-settling agent 5: Nano silica (manufactured by Tokuyama Corporation, Rheoseal QS20, average particle diameter D 50 : 12 nm)

[0078] <Other components> · Colorant: Carbon black (manufactured by Mitsubishi Chemical Corporation, Carbon #5) · Coupling agent: Epoxysilane coupling agent (manufactured by Momentive Performance Materials, A-187) · Defoaming agent: Silicone defoaming agent (manufactured by Nisshō Sangyō Co., Ltd., TSA750)

[0079] The average particle diameter D of the above inorganic filler and the above anti-settling agent 50 was the measured value at 50% of the integrated value of the volume-based particle size distribution by the laser diffraction scattering measurement method using a laser diffraction particle size distribution measuring device (manufactured by Shimadzu Corporation, SALD-7000).

[0080] <Physical property evaluation> For the first liquid, second liquid, and mixed liquid obtained in each example and each comparative example, the following physical properties were measured.

[0081] (Viscosity and thixotropy at 25°C) For the first liquid obtained in each example and each comparative example, the viscosity η at a rotational speed of 5 rpm and a temperature of 25°C was measured using an E-type viscometer and a cone rotor of 3°×R14 (rotor No. 4). 5A At this time, for the measurement result of the viscosity η 5A the viscosity 1 minute after starting the rotation of the cone rotor set in the E-type viscometer was used. Next, the viscosity η of the first liquid was measured in the same manner as above except that the rotational speed was changed to 10 rpm. 10A was measured. Furthermore, the thixotropy of the first liquid was calculated from the following formula using the above measurement results. (Thixotropy of the first liquid) = (viscosity η 5A ) / (viscosity η 10A ) Similarly, for the second liquid and the mixed liquid, the viscosities η 5B and η 5P at a rotational speed of 5 rpm and a temperature of 25°C, and the viscosities η 10B and η 10P at a rotational speed of 10 rpm and a temperature of 25°C, and the thixotropy were measured in the same manner as above. The measurement results are shown in Table 1. Note that the description "unmeasurable" in Table 1 indicates that the viscosities of the first liquid, second liquid, and mixed liquid obtained in each example and each comparative example were high, and the measurement torque exceeded 100%, so correct measurement values could not be obtained.

[0082] (Fluidity) 0.05 ml of the mixed liquid was applied onto a glass plate such that the diameter of the mixed liquid was 1 cm or less. Subsequently, the glass plate was held at an inclined angle of 45° at a temperature of 60°C for 3 minutes. The distance that the mixed liquid flowed during that time was measured as the flow distance (mm) and evaluated according to the following criteria. The evaluation results are shown in Table 1. A: The flow distance is 30 mm or more. B: The flow distance is 15 mm or more and less than 30 mm. C: The flow distance is less than 15 mm.

[0083] (Storage stability) The storage stabilities of the first liquid and the second liquid were evaluated by the following method. First, the first liquid was poured into a 120 mL plastic container with a lid to a height of 50 - 55 mm, covered with the lid, and the height of the filler sediment (hard cake) deposited at the bottom after 60°C × 240 hr was measured and evaluated according to the following criteria. A: The height of the hard cake is 0 mm. B: The height of the hard cake is more than 0 mm and less than 3 mm. C: The height of the hard cake is 3 mm or more. For the second liquid as well, the storage stability was evaluated in the same manner as for the first liquid. The evaluation results are shown in Table 1.

[0084] (Casting workability) The casting workability of the mixed liquid was evaluated according to the following criteria. A: All of the following (Requirement 1) to (Requirement 3) are satisfied. B: Any two of the following (Requirement 1) to (Requirement 3) are satisfied. C: Any one of the following (Requirement 1) to (Requirement 3) is satisfied, or none of them are satisfied. Requirement 1: The viscosity η of the mixed liquid at 25°C 5Pand viscosity η 10P are both 50 Pa·s or less. Requirement 2: The evaluation result of the fluidity of the mixture is "A". Requirement 3: The evaluation results of the storage stability are both "A" for the first liquid and the second liquid.

[0085]

Table 1

[0086] In the two-component liquid resin composition of the example, the first liquid contains an epoxy resin (A), an inorganic filler (C), and an anti-settling agent (D), the second liquid contains an acid anhydride (B), an inorganic filler (C), and an anti-settling agent (D), the anti-settling agent (D) contains an inorganic thickener, and the viscosity η of the first liquid 5A is 1.0 Pa·s or more and 50.0 Pa·s or less, thereby improving the performance balance between storage stability and fluidity.

Claims

1. A two-component liquid resin composition comprising a first liquid and a second liquid, wherein the first liquid contains an epoxy resin (A), an inorganic filler (C), and an anti-settling agent (D), the second liquid contains an acid anhydride (B), an inorganic filler (C), and an anti-settling agent (D), the anti-settling agent (D) contains an inorganic thickener (excluding the inorganic filler (C)), The viscosity η of the first liquid, measured using an E-type viscometer and a cone rotor of 3°×R14, under the conditions of a rotational speed of 5 rpm and a temperature of 25°C ５Ａ A two-component liquid resin composition, wherein η is 1.0 Pa·s or more and 50.0 Pa·s or less.

2. The viscosity η of the first liquid, measured using an E-type viscometer and a 3°×R14 cone rotor under the conditions of a rotational speed of 10 rpm and a temperature of 25°C １０Ａ The two-component liquid resin composition according to claim 1, wherein η is 1.0 Pa·s or more and 50.0 Pa·s or less.

3. The viscosity η １０Ａ The viscosity η with respect to ５Ａ The viscosity ratio Ti Ａ (η ５Ａ / η １０Ａ ) is 0.1 or more and 1.5 or less. The two-component liquid resin composition according to claim 2.

4. The viscosity η of the second liquid, measured using an E-type viscometer and a 3°×R14 cone rotor, at a rotational speed of 5 rpm and a temperature of 25°C ５Ｂ The two-component liquid resin composition according to claim 1, wherein η is 1.0 Pa·s or more and 50.0 Pa·s or less.

5. The viscosity η of the second liquid, measured using an E-type viscometer and a 3°×R14 cone rotor under the conditions of a rotational speed of 10 rpm and a temperature of 25°C １０Ｂ The two-component liquid resin composition according to claim 4, wherein η is 1.0 Pa·s or more and 50.0 Pa·s or less.

6. The viscosity η １０Ｂ The viscosity η with respect to ５Ｂ The viscosity ratio Ti Ｂ (η ５Ｂ / η １０Ｂ ) is 0.5 or more and 2.5 or less. The two-component liquid resin composition according to claim 5.

7. The viscosity η of the mixed liquid of the first liquid and the second liquid, measured using an E-type viscometer and a 3°×R14 cone rotor, under the conditions of a rotation speed of 5 rpm and a temperature of 25°C ５Ｐ The two-component liquid resin composition according to claim 1, wherein η is 1.0 Pa·s or more and 50.0 Pa·s or less.

8. The viscosity η of the mixed liquid of the first liquid and the second liquid, measured using an E-type viscometer and a 3°×R14 cone rotor, under the conditions of a rotation speed of 10 rpm and a temperature of 25°C １０Ｐ The two-component liquid resin composition according to claim 7, wherein １０Ｐ is 10.0 Pa·s or more and 50.0 Pa·s or less.

9. The viscosity η １０Ｐ The viscosity η with respect to ５Ｐ The viscosity ratio Ti Ｐ (η ５Ｐ / η １０Ｐ ) is 0.5 or more and 2.0 or less. The two-component liquid resin composition according to claim 8.

10. The two-component liquid resin composition according to any one of Claims 1 to 9, wherein the inorganic thickener contains one or more selected from the group consisting of layered inorganic minerals and nanosilica.

11. The two-component liquid resin composition according to Claim 10, wherein the layered inorganic mineral contains one or more selected from the group consisting of clay and talc.

12. The two-component liquid resin composition according to any one of Claims 1 to 9, wherein the content of the anti-settling agent (D) is 0.01% by mass or more and 2.00% by mass or less when the total amount of the two-component liquid resin composition is 100% by mass.

13. The two-component liquid resin composition according to any one of Claims 1 to 9, wherein the epoxy resin (A) contains an alicyclic epoxy resin.

14. The two-component liquid resin composition according to Claim 13, wherein the content of the alicyclic epoxy resin is 50 parts by mass or more and 100 parts by mass or less when the content of the epoxy resin (A) is 100 parts by mass.

15. The two-component liquid resin composition according to any one of Claims 1 to 9, wherein the content of the epoxy resin (A) is 5% by mass or more and 30% by mass or less when the total amount of the two-component liquid resin composition is 100% by mass.

16. The two-component liquid resin composition according to any one of Claims 1 to 9, wherein the acid anhydride (B) contains one or more selected from the group consisting of methyl-5-norbornene-2,3-dicarboxylic anhydride, methylcyclohexane-1,2-dicarboxylic anhydride, and methyltetrahydrophthalic anhydride.

17. The two-component liquid resin composition according to any one of Claims 1 to 9, wherein the content of the acid anhydride (B) is 5% by mass or more and 20% by mass or less when the total amount of the two-component liquid resin composition is 100% by mass.

18. The two-component liquid resin composition according to any one of claims 1 to 9, wherein the inorganic filler (C) contains one or more selected from the group consisting of silica, alumina, aluminum hydroxide, and calcium carbonate.

19. The average particle diameter D at which the cumulative value becomes 50% in the volume frequency particle size distribution of the inorganic filler (C) measured by the laser diffraction scattering method ５０ is 0.5 μm or more and 100.0 μm or less, and the two-component liquid resin composition according to any one of claims 1 to 9.

20. The two-component liquid resin composition according to any one of claims 1 to 9, wherein the content of the inorganic filler (C) is 65% by mass or more and 85% by mass or less when the total amount of the two-component liquid resin composition is 100% by mass.

21. The two-component liquid resin composition according to any one of claims 1 to 9, further comprising a curing accelerator (E).

22. The two-component liquid resin composition according to claim 21, wherein the curing accelerator (E) contains one or more selected from the group consisting of tertiary amines, quaternary ammonium salts, imidazoles, organic phosphines, and Lewis acid catalysts.

23. The two-component liquid resin composition according to claim 21, wherein the content of the curing accelerator (E) is 0.01% by mass or more and 1.00% by mass or less when the total amount of the two-component liquid resin composition is 100% by mass.

24. The two-component liquid resin composition according to any one of claims 1 to 9, which can be used for encapsulating a power module including a circuit layer-containing substrate for a power module and a power semiconductor element on the circuit layer of the substrate for a power module by an injection molding method.

25. A substrate for a power module including a circuit layer, a power semiconductor element on the circuit layer of the substrate for a power module, and a sealing material for sealing the substrate for a power module and the power semiconductor element, wherein the power module includes a cured product of the two-component liquid resin composition according to any one of claims 1 to 9 as the sealing material.

26. The power module according to claim 25, wherein the power semiconductor element contains one or more selected from the group consisting of MOS transistors and insulated gate bipolar transistors (IGBTs).

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