Composition containing hexafluoropropene trimer

Abstract

To provide a composition as a novel mixture.SOLUTION: The present invention provides a composition containing a hexafluoropropene trimer represented by C9F18, (i) CmF2m and / or CnF(2n-2) (in the formula, m is an integer from 4 to 12 other than 9. n is an integer from 4 to 12), (ii) water (the content of water is 0.0001-0.1 pt.mass relative to 100 pts.mass of the total amount of the hexafluoropropene trimer represented by C9F18), and / or (iii) fluoride ions (the content of the fluoride ions is 0.0000001 to 5 pts.mass relative to 100 pts.mass of the total amount of the hexafluoropropene trimer represented by C9F18).SELECTED DRAWING: None

Description

Technical Field

[0001] The present disclosure relates to a composition containing a hexafluoropropene trimer.

Background Art

[0002] The trimer of hexafluoropropene (HFP) has been used as a composition or the like (Patent Document 1).

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] An object of the present disclosure is to provide a composition containing a hexafluoropropene trimer as a novel mixture having excellent stability.

Means for Solving the Problems

[0005] The present disclosure includes the following aspects. [Item 1] C 9 F 18 The hexafluoropropene trimer represented by, and (i) C m F 2m and / or C n F (2n-2) 〔wherein, m is an integer of 4 or more and 12 or less and other than 9. n is an integer of 4 or more and 12 or less.〕, (ii) water (wherein the content of such water is 0.0001 to 0.1 parts by mass with respect to 100 parts by mass of the total amount of the hexafluoropropene trimer represented by the above C 9 F 18 ), and / or (iii) fluoride ion (wherein the content of such fluoride ion is C 9 F 18The composition contains (0.0000001 to 5 parts by mass based on 100 parts by mass of the total amount of the hexafluoropropene trimer represented by [Item 2] The composition according to item 1, wherein the hexafluoropropene trimer contains at least one selected from the group consisting of compounds represented by the following formulas (I) to (III). [Chemical formula 1] TIFF2025089520000001.tif151167[Item 3] The composition according to item 2, wherein the compound represented by formula (I) is 85% by mass or more based on the total amount of the hexafluoropropene trimer. [Item 4] The composition according to item 2, wherein the compound represented by formula (I) is less than 85% by mass based on the total amount of the hexafluoropropene trimer. [Item 5] The composition according to item 2, wherein the compound represented by formula (I) is 50% by mass or more and less than 85% by mass based on the total amount of the hexafluoropropene trimer. [Item 6] C 9 F 18 The hexafluoropropene trimer represented by and (i) C m F 2m and / or C n F (2n-2) [wherein, m is an integer of 4 or more and 12 or less and other than 9. n is an integer of 4 or more and 12 or less.], the composition according to item 1. [Item 7] The composition according to item 1, wherein m is an integer of 6 or more and 11 or less and other than 9, and n is an integer of 6 or more and 11 or less. [Item 8] C m F 2m and / or C n F (2n-2) The content of is 0.0001 to 10 parts by mass based on 100 parts by mass of the total amount of the hexafluoropropene trimer represented by C 9 F 18 , the composition according to item 1. [Item 9] C 9 F 18The composition according to claim 1, comprising (i) a hexafluoropropene trimer represented by and (ii) water. [Claim 10] C 9 F 18 The composition according to claim 1, comprising (i) a hexafluoropropene trimer represented by and (iii) fluoride ions. [Claim 11] C 12 F 24 The composition according to claim 1, further comprising a hexafluoropropene tetramer represented by , wherein the content of the hexafluoropropene trimer is 80% by mass or more based on the total of the hexafluoropropene trimer and the hexafluoropropene tetramer. [Claim 12] The composition according to claim 11, wherein the content of the hexafluoropropene trimer is 90% by mass or more and 99.99% by mass or less based on the total of the hexafluoropropene trimer and the hexafluoropropene tetramer. [Claim 13] The composition according to claim 11, wherein the hexafluoropropene tetramer comprises 1,1,1,2,5,6,6,6 - octafluoro - 2,3,5 - tris(trifluoromethyl)-4-(perfluoropropyl - 2 - yl)-3 - hexene. [Claim 14] The composition according to claim 1, further comprising a conductive substance, wherein the content of the conductive substance is 100 ppm by mass or less. [Claim 15] The composition according to claim 1, further comprising a conductive substance, wherein the content of insoluble matter of 5 μm or more is 10 or less per mL. [Advantages of the Invention]

[0006] The composition according to the present disclosure thus formed can provide a composition as a novel mixture. [Modes for Carrying Out the Invention]

[0007] In this specification, "comprising" is a concept that encompasses any of "comprise", "consist essentially of", and "consist of". Also, in this specification, when a numerical range is indicated as "A to B", it means A or more and B or less.

[0008] (1. Hexafluoropropene trimer-containing composition) The hexafluoropropene (HFP) trimer-containing composition of the present disclosure comprises (i) C m F 2m and / or C n F (2n-2) 〔wherein, m is an integer of 4 or more and 12 or less and other than 9. n is an integer of 4 or more and 12 or less.〕, (ii) water (wherein the content of such water is 0.0001 to 0.1 part by mass with respect to 100 parts by mass of the total amount of the hexafluoropropene trimer represented by the above C 9 F 18 ), and / or (iii) fluoride ions (wherein the content of such fluoride ions is 0.0000001 to 5 parts by mass with respect to 100 parts by mass of the total amount of the hexafluoropropene trimer represented by C 9 F 18 ).

[0009] As the hexafluoropropene trimer, known ones represented by C 9 F 18 can be widely adopted, and there is no particular limitation.

[0010] As such a hexafluoropropene trimer, specifically, at least one trimer selected from the group consisting of compounds represented by the following formulas (I) to (III) can be exemplified.

[0011] [Chemical formula]

[0012] In this specification, the compound represented by the above formula (I) shall include both the E-form and the Z-form of the diastereomers unless otherwise specified.

[0013] As the hexafluoropropene trimer contained in the composition of the present disclosure, only one kind of the compounds represented by the above formulas (I) to (III) may be included, or a mixture containing two or three of these may also be used.

[0014] Regarding the blending ratio of the compound represented by the above formula (I) in the total amount of the HFP trimer (that is, the total of the compounds represented by formulas (I), (II), and (III)), it is preferably 1% by mass or more, more preferably 10% by mass or more, still more preferably 30% by mass or more, even more preferably 40% by mass or more, particularly preferably 45% by mass or more, and most preferably 50% by mass or more with respect to the total amount of the HFP trimer. Further, the compound represented by formula (I) may be 85% by mass or more with respect to the total amount of the HFP trimer. In this case, the viscosity of the HFP trimer mixture becomes low. Also, the compound represented by formula (I) is preferably 99% by mass or less, more preferably 90% by mass or less, still more preferably 85% by mass or less (or less than), even more preferably 80% by mass or less, particularly preferably 70% by mass or less, and most preferably 60% by mass or less with respect to the total amount of the HFP trimer. Regarding the blending ratio of the compound represented by the above formula (I), with respect to the total amount of the HFP trimer, for example, it can be 10% by mass or more and 90% by mass or less, 30% by mass or more and 90% by mass or less, 10% by mass or more and 85% by mass or less, 35% by mass or more and 85% by mass or less, 10% by mass or more and less than 85% by mass, 20% by mass or more and less than 85% by mass, 30% by mass or more and less than 85% by mass, 40% by mass or more and less than 85% by mass, 50% by mass or more and less than 85% by mass, 40% by mass or more and 80% by mass or less, 55% by mass or more and 80% by mass or less, 60% by mass or more and 75% by mass or less, or 65% by mass or more and 70% by mass or less, 35% by mass or more and 60% by mass or less, 50% by mass or more and 60% by mass or less, and can preferably be 30% by mass or more and 90% by mass or less, preferably 40% by mass or more and less than 85% by mass, more preferably 40% by mass or more and 80% by mass or less, still more preferably 45% by mass or more and 70% by mass or less, and even more preferably 50% by mass or more and 60% by mass or less.

[0015] Similarly, with respect to the compounding ratio of the compound represented by formula (II), it is preferably 1% by mass or more, more preferably 5% by mass or more, and particularly preferably 10% by mass or more with respect to the total amount of the HFP trimer. Further, the compound represented by formula (II) is preferably 70% by mass or less, more preferably 50% by mass or less, even more preferably 30% by mass or less, and particularly preferably 20% by mass or less with respect to the total amount of the HFP trimer.

[0016] Similarly, with respect to the compounding ratio of each of the compounds represented by formula (III), it is preferably 1% by mass or more, more preferably 5% by mass or more, and particularly preferably 10% by mass or more with respect to the total amount of the HFP trimer. Further, the compound represented by formula (III) is preferably 70% by mass or less, more preferably 50% by mass or less, even more preferably 30% by mass or less, and particularly preferably 20% by mass or less in 100% by mass of the total amount of the HFP trimer.

[0017] In the composition of the present disclosure, the mass ratio of the compound represented by formula (II) and the compound represented by formula (III) is not particularly limited, and for example, it may be 1:9 to 9:1, 2:8 to 8:2, 3:7 to 7:3, 4:6 to 6:4, or 4.5:5.5 to 5.5:4.5.

[0018] The compounds represented by the above formulas (I) to (III) may be produced by conventional methods. For example, they can be obtained by the method described in International Publication No. 2018 / 172919, but of course, it is not limited thereto. Further, they may be obtained by trimerizing HFP as a raw material, and it is not necessarily limited thereto, and known methods may be widely adopted for obtaining them.

[0019] The composition of the present disclosure may contain a hexafluoropropene trimer represented by C 9 F 18 other than the compounds represented by formulas (I) to (III).

[0020] The composition of the present disclosure may contain hexafluoropropene dimer.

[0021] The hexafluoropropene dimer may include (E)-1,1,1,2,3,4,5,5,5-nonafluoro-4-(trifluoromethyl)-2-pentene, (Z)-1,1,1,2,3,4,5,5,5-nonafluoro-4-(trifluoromethyl)-2-pentene, or 1,1,3,4,4,5,5-nonafluoro-2-(trifluoromethyl)-2-pentene.

[0022] In one aspect, the composition of the present disclosure may contain hexafluoropropene tetramer.

[0023] The hexafluoropropene tetramer may include 1,1,1,2,5,6,6,6-octafluoro-2,3,5-tris(trifluoromethyl)-4-(perfluoropropyl-2-yl)-3-hexene.

[0024] In the composition of the present disclosure, the content of the hexafluoropropene trimer may be 80% by mass or more, preferably 85% by mass or more, more preferably 90% by mass or more, for example 95% by mass or more, 98% by mass or more, 99% by mass or more, 99.9% by mass or more, based on the total of the hexafluoropropene trimer and the hexafluoropropene tetramer.

[0025] In the composition of the present disclosure, the content of the hexafluoropropene trimer may be preferably 99.999% by mass or less, more preferably 99.99% by mass or less, for example 99.9% by mass or less, 99% by mass or less, 95% by mass or less, 90% by mass or less, or 85% by mass or less, based on the total of the hexafluoropropene trimer and the hexafluoropropene tetramer.

[0026] In the composition of the present disclosure, the content of hexafluoropropene trimer is preferably 80% by mass or more and 99.999% by mass or less, more preferably 85% by mass or more and 99.99% by mass or less, for example, 90% by mass or more and 99.99% by mass or less, 95% by mass or more and 99.99% by mass or less, 99% by mass or more and 99.99% by mass or less, or 99% by mass or more and 99.9% by mass or less, based on the total of hexafluoropropene trimer and hexafluoropropene tetramer.

[0027] The total amount of hexafluoropropene trimer and hexafluoropropene tetramer is preferably 80% by mass or more, more preferably 85% by mass or more, still more preferably 90% by mass or more, and even more preferably 95% by mass or more, for example, 98% by mass or more, 99% by mass or more, or 99.9% by mass or more in the composition. The total amount of hexafluoropropene trimer and hexafluoropropene tetramer may be substantially 100% by mass in the composition. In other words, the composition of the present disclosure may be a mixture of hexafluoropropene trimer and hexafluoropropene tetramer.

[0028] (1-1.C m F 2m and / or C n F (2n-2) ) In one aspect, the composition of the present disclosure may contain a hexafluoropropene (HFP) trimer represented by C 9 F 18 and C m F 2m and / or C n F (2n-2) [wherein m is an integer of 4 or more and 12 or less and other than 9. n is an integer of 4 or more and 12 or less.].

[0029] m is an integer of 4 or more, preferably an integer of 5 or more, and more preferably an integer of 6 or more. Also, n is an integer of 12 or less, preferably an integer of 11 or less, and more preferably an integer of 10 or less. However, m does not include 9. Further, m is particularly preferably 8.

[0030] n is an integer of 4 or more, preferably an integer of 5 or more, more preferably an integer of 6 or more. Further, n is an integer of 12 or less, preferably an integer of 11 or less, more preferably an integer of 10 or less. In particular, n is preferably 9.

[0031] C m F 2m may be a chain compound or a cyclic compound which may have a substituted structure. The chain compound may be a so-called alkene, and may be linear or branched.

[0032] C n F (2n-2) may be a chain compound or a cyclic compound which may have a substituted structure. The chain compound may be a so-called diene or alkyne, and may be linear or branched.

[0033] The composition of the present disclosure contains C m F 2m and / or C n F (2n-2) and thereby improves the stability of the HFP trimer.

[0034] Also, the content of C m F 2m and / or C n F (2n-2) is preferably 0.0001% by mass or more based on the whole composition of the present disclosure.

[0035] On the other hand, the content of C m F 2m and / or C n F (2n-2) is preferably 10% by mass or less, preferably 5% by mass or less, and more preferably 1% by mass or less based on the whole composition of the present disclosure.

[0036] In one aspect, in the composition, C m F 2m and / or C n F(2n-2) The content is preferably 0.0001 parts by mass or more, more preferably 0.01 parts by mass or more, and even more preferably 0.1 parts by mass or more with respect to 100 parts by mass in total of the HFP trimers.

[0037] On the other hand, in the composition, C m F 2m and / or C n F (2n-2) The content is preferably 10 parts by mass or less, more preferably 5 parts by mass or less, and even more preferably 1 part by mass or less with respect to 100 parts by mass in total of the HFP trimers.

[0038] In addition, when a plurality of types of C m F 2m and / or C n F (2n-2) are included, the above content means the total amount thereof.

[0039] C m F 2m and / or C n F (2n-2) By setting the content of C 9 F 18 within the above range, the decomposition of the HFP trimers represented by C

[0040] (1-2. water) In one aspect, the composition of the present disclosure may contain water. The water content can be 1 mass ppm or more in the composition, and is preferably 5 mass ppm or more. By setting the water content to a certain level or more, for example, 1 mass ppm or more, the charging of the composition due to the decrease in the stability of the composition can be suppressed. Also, the water content is 1000 mass ppm or less in the composition, preferably 500 mass ppm or less, more preferably 100 mass ppm or less, and even more preferably 20 mass ppm or less. By setting the water content to a certain level or less, for example, 1000 mass ppm or less, C 9 F 18It is possible to suppress the decomposition of the HFP trimer represented by , and thus it is possible to suppress an excessive increase in fluoride ions and an increase in acidity.

[0041] In one aspect, the water content is C 9 F 18 It is preferably 0.0001 part by mass or more, more preferably 0.0005 part by mass or more, and even more preferably 0.001 part by mass or more with respect to 100 parts by mass in total of the compounds represented by .

[0042] On the other hand, the water content is C 9 F 18 It is preferably 10 parts by mass or less, more preferably 5 parts by mass or less, and even more preferably 1 part by mass or less with respect to 100 parts by mass in total of the compounds represented by .

[0043] By containing a predetermined amount of water, the dielectric strength of the composition of the present disclosure is improved. The dielectric strength of the composition of the present disclosure can preferably be 40 kV or more, preferably 50 kV or more, and more preferably 60 kV or more.

[0044] (1-3. Fluoride ions) In one aspect, the composition for a heat transfer fluid of the present disclosure may contain fluoride ions in an amount of 0.0000001% by mass or more based on the entire composition. The amount of fluoride ions is preferably 0.000001% by mass or more, more preferably 0.0001% by mass or more, and even more preferably 0.001% by mass or more based on the entire composition. By setting the fluoride ion concentration to 0.0000001% by mass or more, the stability of the composition is maintained and the charging of the composition can be suppressed.

[0045] Also, the amount of fluoride ions contained in the composition of the present disclosure is 5% by mass or less, preferably 1% by mass or less, and more preferably 0.1% by mass or less based on the entire composition. By setting the fluoride ions to 5% by mass or less, even during heating, C 9 F 18It is possible to suppress the decomposition of the compound represented by

[0046] In one aspect, the amount of fluoride ions is preferably 0.0000001 part by mass or more, more preferably 0.000001 part by mass or more, still more preferably 0.0001 part by mass or more, and even more preferably 0.001 part by mass or more with respect to 100 parts by mass in total of the compound represented by C 9 F 18 On the other hand, the water content is preferably 5 parts by mass or less, more preferably 1 part by mass or less, and even more preferably 0.1 part by mass or less with respect to 100 parts by mass in total of the compound represented by C

[0047] On the other hand, the water content is preferably 5 parts by mass or less, more preferably 1 part by mass or less, and even more preferably 0.1 part by mass or less with respect to 100 parts by mass in total of the compound represented by C 9 F 18 For example, to the sample, 1-fold amount (by weight) of distilled water is added, shaken for about 20 seconds, and F ions are extracted into the aqueous layer. Then, 2.5 - 3.0 mL of the aqueous layer is withdrawn with a pipette, and the solution mixed with twice the amount of TISAB solution (total ion strength adjustment buffer solution) is used as a sample and can be measured with a fluoride ion meter.

[0048] As the fluoride ion source, known fluoride ion sources can be widely used and are not particularly limited. Specifically, fluoride ions such as hydrogen fluoride, sodium fluoride, sodium hydrogen fluoride, potassium fluoride, potassium hydrogen fluoride, lithium fluoride, cesium fluoride, calcium fluoride, magnesium fluoride, aluminum fluoride, zinc fluoride, silver fluoride, and iron fluoride can be exemplified. These may contain only one kind or may contain a plurality of kinds. Preferably, the fluoride ion source is hydrogen fluoride.

[0049]

[0050] (1 - 4. Other components)(1 - 4. Other components) The composition of the present disclosure may contain perfluorotripropylamine in addition to hexafluoropropene trimer. A composition containing hexafluoropropene trimer and perfluorotripropylamine can be an azeotropic-like liquid. Since the composition is an azeotropic-like liquid, even when the composition vaporizes, the change in composition is small and handling becomes easy.

[0051] Here, the azeotropic-like liquid means a liquid in which the difference in the mole fraction of each component contained in the azeotropic-like liquid in the gas phase and the liquid phase is within 10%.

[0052] Perfluorotripropylamine is also called tris(heptafluoropropyl)amine or N,N-bis(heptafluoropropyl)(heptafluoropropyl)amine, and has the general formula: N(CF 2 CF 2 CF 3 ) a (CF(CF 3 )CF 3 ) 3-a (a is an integer from 0 to 3). Perfluorotripropylamine may contain only one kind of the compounds represented by the above general formula, or may contain a plurality of kinds. N(CF 2 CF 2 CF 3 ) 3 is preferred, but N(CF 2 CF 2 CF 3 ) a (CF(CF 3 )CF 3 ) 3-a (a is an integer from 0 to 2) may be included as an impurity. Specifically, product names such as "FLUORINERT (registered trademark)" (manufactured by 3M) (FC-3283) can be mentioned.

[0053] The composition of the present disclosure may further contain perfluoropolyether, and a mixture of methoxytridecafluoroheptene isomers, perfluorotributylamine, etc.

[0054] The perfluoropolyether is preferably General formula: RO - Rf 1 - R’ represented by wherein R and R’ are the same or different and are monovalent groups represented by - C m F 2m+1 where m is an integer from 1 to 8, and Rf 1 is a divalent fluoropolyoxyalkylene group containing 2 to 20 repeating units, and the repeating units are: (i) - CFXO - (wherein X is F or CF 3 ); (ii) - CF 2 CFXO - (wherein X is F or CF 3 ); (iii) - CFXCF 2 O - (wherein X is F or CF 3 ); (iv) - CF 2 CF 2 CF 2 O - ; or (v) - CF 2 CF 2 CF 2 CF 2 O - represented by, or Rf 1 is (vi) - (CF 2 ) n - CFY - O - (where n is an integer from 0 to 3, and Y is a monovalent group represented by the general formula - ORf 2 Z, where 2 Rf 2 is a divalent fluoropolyoxyalkylene group containing 2 to 20 repeating units represented by - CFXO -, - CF 2 CFXO -, - CF 2 CF 2 CF 2 CF 2 CF 2 CF 2 O -, and each X is the same or different and is F or CF 3 and Z is a monovalent C 1-5It is a divalent group represented by (which is a perfluoroalkyl group).

[0055] Specific examples of the perfluoropolyether include product names such as GALDEN (registered trademark) "HT135" and GALDEN (registered trademark) "HT110" (both manufactured by Solvay).

[0056] The methoxytridecafluoroheptene isomer mixture specifically contains methyl-perfluoroheptene ether (MPHE) (C 7 F 13 OCH 3 ). Specific examples include the product name "Opteon SF10" (manufactured by Chemours).

[0057] When the composition of the present disclosure contains perfluorotripropylamine, perfluoropolyether, and a methoxytridecafluoroheptene isomer mixture, since their properties are similar to those of the compound represented by C 9 F 18 regardless of their content ratios, the properties of the entire composition are basically unchanged. Therefore, in this case, the composition of the present disclosure preferably contains the compound represented by C 9 F 18 in an amount of 40% to 99.9% by mass, more preferably 60% to 99.9% by mass, and even more preferably 80% to 99.9% by mass, based on the entire composition.

[0058] (1 - 5. Other components) The composition of the present invention can be used in combination with components other than the composition. The composition of the present disclosure may contain, in addition to the compounds represented by the above formulas (I) to (III), and C m F 2m and / or C n F (2n-2) , water and / or fluoride ions, any additives other than the composition, within the range that does not inhibit its effects and purposes. Examples of such optional additives include stabilizers.

[0059] The stabilizer exerts a stabilizing effect and functions as a so-called acid acceptor or antioxidant. As the stabilizing effect, the main ones include the effect of preventing the decomposition of the HFP trimer by scavenging radicals generated in the system, and the acid acceptor effect of preventing further decomposition of the HFP trimer by acid, etc., by capturing the acid generated in the system.

[0060] As such a stabilizer, it is possible to widely adopt known stabilizers. Among them, since it is possible to effectively suppress the occurrence of metal corrosion due to the composition, it is preferable to use one or more stabilizers selected from the group consisting of unsaturated alcohol-based stabilizers, nitro-based stabilizers, amine-based stabilizers, phenol-based stabilizers, and epoxy-based stabilizers.

[0061] As the unsaturated alcohol-based stabilizer, it is possible to widely adopt known ones. For example, one or more selected from the group consisting of 3-buten-2-ol, 2-buten-1-ol, 4-propen-1-ol, 1-propen-3-ol, 2-methyl-3-buten-2-ol, 3-methyl-3-buten-2-ol, 3-methyl-2-buten-1-ol, 2-hexen-1-ol, 2,4-hexadien-1-ol, and oleyl alcohol can be used.

[0062] As the nitro-based stabilizer, it is possible to widely adopt known ones. As aliphatic nitro compounds, for example, nitromethane, nitroethane, 1-nitropropane, 2-nitropropane, etc. can be mentioned. As aromatic nitro compounds, for example, one or more selected from the group consisting of nitrobenzene, o-, m- or p-dinitrobenzene, o-, m- or p-nitrotoluene, dimethylnitrobenzene, m-nitroacetophenone, o-, m- or p-nitrophenol, o-nitroanisole, m-nitroanisole, and p-nitroanisole can be used.

[0063] As the amine stabilizer, known ones can be widely adopted. For example, one or more selected from the group consisting of pentylamine, hexylamine, diisopropylamine, diisobutylamine, di-n-propylamine, diallylamine, triethylamine, N-methylaniline, pyridine, morpholine, N-methylmorpholine, triallylamine, allylamine, α-methylbenzylamine, dimethylamine, trimethylamine, ethylamine, diethylamine, triethylamine, propylamine, isopropylamine, dipropylamine, tripropylamine, butylamine, isobutylamine, dibutylamine, tributylamine, dibenzylamine, tribenzylamine, 2-ethylhexylamine, aniline, N,N-dimethylaniline, N,N-diethylaniline, ethylenediamine, propylenediamine, diethylenetriamine, tetraethylenepentamine, benzylamine, dibenzylamine, diphenylamine and diethylhydroxylamine can be used.

[0064] As the phenolic stabilizer, known ones can be widely adopted. For example, one or more selected from the group consisting of 2,6-di-tert-butyl-4-methylphenol, 3-cresol, phenol, 1,2-benzenediol, 2-isopropyl-5-methylphenol, and 2-methoxyphenol can be used.

[0065] As the epoxy stabilizer, known ones can be widely adopted. For example, one or more selected from the group consisting of butylene oxide, 1,2-propylene oxide, 1,2-butylene oxide, butyl glycidyl ether, diethylene glycol diglycidyl ether, and 1,2-epoxy-3-phenoxypropane can be used.

[0066] By using a combination of stabilizers having different stabilizing effects, it is possible to more effectively prevent the decomposition of HFP trimers that may occur for various reasons. Therefore, it is preferable that the epoxy-based stabilizer described above, and one or more selected from the group consisting of unsaturated alcohol-based stabilizers, nitro-based stabilizers, and phenol-based stabilizers.

[0067] From the viewpoint of effectively suppressing the acid dissociation from the above-mentioned HFP trimer and suppressing the corrosion of metals by the liquid composition, the content of the stabilizer in the entire composition of the present disclosure is preferably 0.0001% by mass or more, and more preferably 0.01% by mass or more. On the other hand, considering the point of avoiding unfavorable physical property changes of the liquid composition due to excessive addition of the stabilizer, the content of the stabilizer in the entire composition of the present disclosure is preferably 10% by mass or less, and more preferably 5% by mass or less.

[0068] (1-6. Impurities)

[0069] The composition of the present disclosure may contain a conductive substance. The content of the conductive substance is 100 ppm by mass or less, preferably 75 ppm by mass or less, more preferably 50 ppm by mass or less, and even more preferably 10 ppm by mass or less. Since there is a possibility that the conductive substance, particularly metals and metal ions, may enter through the gaps of the device and cause a short circuit in the circuit, the content of the conductive substance in the present disclosure can also be considered by focusing on "at least one of metals and metal ions" as necessary.

[0070] In another aspect, the composition of the present disclosure preferably has a content of insoluble matter of 5 μm or more (including solid components such as resin pieces of the container, dust and dirt mixed from the air, regardless of conductivity) of 10 pieces / mL or less, more preferably 5 pieces / mL or less, and even more preferably 3 pieces / mL or less.

[0071] (1-7. Method for producing a composition with reduced impurities) The present disclosure provides a method for producing a composition with reduced impurities. The method for producing the composition of the present disclosure is C9 F 18 and a conductive substance, to obtain a composition having a reduced amount of the conductive substance from the composition, (1) The purification treatment is a treatment using at least one selected from the group consisting of a filtration filter, an ion exchange resin, a metal ion removal filter, a metal ion removal agent, distillation, rectification, centrifugation, and electrostatic adsorption. In the present disclosure, the term "reduction" in the purification refers to decreasing the content of the conductive substance in the composition.

[0072] According to the present inventors' research, C 9 F 18 The compositions containing the compound represented by the formula (I) contain conductive substances (metals, metal ions, carbon, conductive polymers, superconducting ceramics, etc.). These conductive substances include not only those that are inevitably mixed in due to the process during the production of the composition, but also those that are mixed in after production when used. When these compositions are used for transferring heat to or from a device, the conductive substances may enter the device through gaps, causing a short circuit. Furthermore, repeated use of the composition may cause clogging of the pipes through which the composition circulates. The conventionally known compositions are classified as "C" because they contain conductive substances. 9 F 18 The method for producing a composition according to the present disclosure is characterized in that a composition containing an HFP trimer and a conductive substance (hereinafter also referred to as a "pre-purification composition") is subjected to a specific purification treatment to obtain a composition in which the conductive substance is reduced.

[0073] (1-7-1)C 9 F 18 A composition containing a compound represented by the formula (I) and a conductive material (pre-purification composition) The pre-purification composition is C 9 F 18 and a conductive substance.

[0074] (1-7-2)C 9 F 18 The compound represented by C 9 F 18 The compound represented by is the hexafluoropropene trimer described above.

[0075] (1-7-3) Compounds that may additionally be contained In the composition of the present disclosure, C 9 F 18 An additional compound different from the compound represented by is also referred to as an "additional component".) may be included. The additional component may be one or more, and examples of the additional component include a hexafluoropropene dimer, a hexafluoropropene tetramer, and the like.

[0076] The hexafluoropropene dimer may include (E)-1,1,1,2,3,4,5,5,5-nonafluoro-4-(trifluoromethyl)-2-pentene, (Z)-1,1,1,2,3,4,5,5,5-nonafluoro-4-(trifluoromethyl)-2-pentene, or 1,1,3,4,4,5,5-nonafluoro-2-(trifluoromethyl)-2-pentene.

[0077] The hexafluoropropene tetramer may include 1,1,1,2,5,6,6,6-octafluoro-2,3,5-tris(trifluoromethyl)-4-(perfluoropropyl-2-yl)-3-hexene.

[0078] In the composition of the present disclosure, when containing the compound represented by C 9 F 18 and the additional component, it is preferable that the compound represented by C 9 F 18 in the entire composition is contained in an amount of 80% by mass or more, more preferably 85% by mass or more, still more preferably 90% by mass or more, and most preferably 95% by mass or more. In the production method of the present disclosure, C 9 F 18The kinematic viscosity, freezing point, and boiling point characteristics of a composition (pre-purification composition) containing a compound represented by and a conductive substance are related to a predetermined purification treatment (a treatment using at least one selected from the group consisting of a filtration filter, an ion exchange resin, a metal ion removal filter, a metal ion remover, distillation, rectification, centrifugation, and electrostatic adsorption). Since they affect the efficiency of removing the conductive substance from the pre-purification composition, it is preferably free of additional components. However, when additional components are contained, with respect to the whole composition as described above, C 9 F 18 It is preferable to contain 80% by mass or more of the compound represented by .

[0079] In the case of the C of the present disclosure 9 F 18 When containing additional components in addition to the compound represented by , and also when not containing them, for example, C 9 F 18 As the composition (pre-purification composition) containing the compound represented by and the conductive substance, as described above, the synthetic products or commercially available products of each of the compounds represented by the C of the present disclosure 9 F 18 , and / or those in which conductive substances are subsequently mixed by using them for a certain period can be widely adopted.

[0080] (1-7-4) Conductive substance Examples of the conductive substance include at least one selected from the group consisting of metals, metal ions, metal oxides, metal nitrides, carbon, conductive polymers, and superconducting ceramics. When using a composition containing a conductive substance in a device, there is a possibility that the conductive substance may enter through the gaps of the device and cause a short circuit in the circuit. Also, when repeatedly using the composition of the present disclosure, C 9 F 18 may cause blockage of the pipes through which the compound represented by circulates. Therefore, C 9 F 18 In order to enhance the performance of the compound represented by , it is important to reduce the content of these conductive substances. The shape and size of the conductive substance vary depending on the type of the conductive substance, but generally are about 0.001 to 10 μm.

[0081] Examples of metal species in metals, metal ions, metal oxides, and metal nitrides as conductive substances include Al, Ba, Be, Bi, Ca, Co, Cr, Cu, Fe, Ga, K, Li, Mg, Mn, Na, Ni, Pb, Sr, V, Zn, and the like.

[0082] The metal as a conductive substance may be a single substance or an alloy. The metal as a conductive substance is typically contained in the form of fine particles.

[0083] The ions as conductive substances include all ionic forms that each metal species can take. The ions as conductive substances may exist in a dissolved form as ions having any valence, or may exist in the form of ions in a substance, for example, in a coordinated form.

[0084] The metal oxide as a conductive substance may be an oxide of one metal species or an oxide of a plurality of metal species (i.e., a composite oxide).

[0085] The metal nitride as a conductive substance may be a nitride of one metal species or a nitride of a plurality of metal species (i.e., a composite nitride).

[0086] Examples of carbon as a conductive substance include carbon black.

[0087] Examples of conductive polymers as conductive substances include polyacetylene and polythiophene.

[0088] The content of the conductive substance contained in the pre-purification composition is not limited. For example, if it is 150 mass ppm or more (more preferably 500 mass ppm or more), the content of the conductive substance can be effectively reduced in the production method of the present disclosure. The content of the conductive substance can be measured as described in the examples using an inductively coupled plasma mass spectrometer (ICP-MS).

[0089] In addition, the pre-purification composition may contain insoluble substances including resin pieces of the container, dust, dirt, etc. mixed from the air, regardless of the presence or absence of conductivity. For example, if the content of insoluble substances of 5 μm or more is 50 pieces / mL or more (more preferably 100 pieces / mL or more), in the purification treatment of reducing the content of the conductive substance according to the present disclosure, the content of insoluble substances can be effectively reduced at the same time. The number of insoluble substances (fine particles) of the conductive substance contained in the composition can be measured as described in the examples using a liquid particle counter.

[0090] (1-7-5) Physical properties of the pre-purification composition The pre-purification composition is a composition containing a compound represented by C 9 F 18 and a conductive substance, and in the production method of the present disclosure, it is subjected to a purification treatment using at least one selected from the group consisting of a filtration filter, an ion exchange resin, a metal ion removal filter, a metal ion remover, distillation, rectification, centrifugation, and electrostatic adsorption.

[0091] When reducing the content of the conductive substance by the above purification treatment, it is preferable from the viewpoint of purification efficiency that the pre-purification composition has a low kinematic viscosity, a low freezing point, and a high boiling point. C 9 F 18 By using a compound represented by as a main component (preferably 80% by mass or more), the physical properties of the pre-purification composition having a low kinematic viscosity, a low freezing point, and a high boiling point are easily provided.

[0092] The kinematic viscosity of the pre-purification composition at -40°C is preferably 15 cSt or less, more preferably 10 cSt or less, and even more preferably 7 cSt or less. Since the kinematic viscosity is as low as 15 cSt or less, the filterability is improved, and in particular, the efficiency of the purification treatment using a filtration filter, a metal ion removal filter, etc. can be enhanced. The method for measuring the kinematic viscosity at -40°C in the present disclosure is based on the method described in the examples.

[0093] The freezing point of the composition before purification is preferably -35°C or lower, more preferably -50°C or lower, still more preferably -70°C or lower, and most preferably -100°C or lower. Since the purification treatment at low temperatures is possible due to the low freezing point of -35°C or lower, the loss of the compound represented by C 9 F 18 can be reduced, and the efficiency of the purification treatment can be enhanced. The method for measuring the freezing point in the present disclosure is the method described in the examples.

[0094] The boiling point of the composition before purification is preferably 90°C or higher, more preferably 95°C or higher, and still more preferably 105°C or higher. Since the boiling point is 90°C or higher, for the same reason as the low freezing point, the loss of the compound represented by C 9 F 18 can be reduced, and the efficiency of the purification treatment can be enhanced. The method for measuring the boiling point in the present disclosure is the method described in the examples.

[0095] (1-7-6) Purification treatment of the composition before purification In the production method of the present disclosure, the composition before purification is subjected to a purification treatment using at least one selected from the group consisting of a filtration filter, an ion exchange resin, a metal ion removal filter, a metal ion remover, distillation, rectification, centrifugation, and electrostatic adsorption.

[0096] These purification means may be applied according to conventional methods. In the production method of the present disclosure, a purification treatment using a filtration filter is particularly preferred. The upper and lower limits of the filter pore size when using a filtration filter are not limited. For example, the upper limit can be set to 5 μm or less, 1 μm or less, 0.5 μm or less, or 0.1 μm or less. Also, for example, the lower limit can be set to 1.0 nm or more, 0.5 nm or more, 0.2 nm or more, or 0.1 nm or more.

[0097] As the ion exchange resin, either a cation exchange resin or an anion exchange resin may be used. As the anion exchange resin, for example, an ion exchange resin having an amino group and / or a quaternary ammonium group as a functional group can be used. The ion exchange resin is preferably a strongly basic anion exchange resin. The basicity of the anion exchange resin can be variously set depending on the type of the polymer skeleton and / or the functional group. As the anion exchange resin, commercially available products may be used. For example, “Diaion (registered trademark) SA” series manufactured by Mitsubishi Chemical Corporation, “A200” manufactured by Purolite Company, “Amberlite (registered trademark)” series manufactured by Organo Corporation, etc. can be used. As the cation exchange resin, for example, an ion exchange resin having a carboxylic acid group and / or a sulfonic acid group as a functional group can be used. The acidity of the cation exchange resin can be variously set depending on the type of the polymer skeleton and / or the functional group. As the cation exchange resin, commercially available products may be used. For example, “Diaion (registered trademark) SK” series manufactured by Mitsubishi Chemical Corporation, “C100” manufactured by Purolite Company, “Amberlite (registered trademark)” series manufactured by Organo Corporation, etc. can be used.

[0098] Examples of the metal ion remover include chelating agents, activated carbon, etc. As the chelating agent, for example, CRB03, CRB05, CR20 (all manufactured by Mitsubishi Chemical Corporation), Si-Thiol, Si-Thiourea, Si-TMT, Si-DMT, Si-SCX-2, Si-Amine, Si-Trisamine, Si-Imidazole, Si-TBD, Si-PHI (all manufactured by SiliCycle), MuromacXMS-5418 (manufactured by Muromachi Chemical Co., Ltd.), IRC76-HG, IRC748, IRC747UPS (all manufactured by Organo Corporation), S910 (manufactured by Purolite Company), MPA (manufactured by Reaxa QuadraPure), etc. can be used. Examples of the activated carbon include “Shirasagi (registered trademark)” manufactured by Osaka Gas Chemical Co., Ltd., “Filtrasorb (registered trademark) CAL”, “Diahope (registered trademark)”, “DiaSorb (registered trademark)” manufactured by Calgon Carbon Japan Co., Ltd., “EvaDia (registered trademark)” series manufactured by Suishin Co., Ltd., etc.

[0099] By undergoing the above purification treatment, a composition (post-purification composition) with a reduced content of the conductive substance can be obtained.

[0100] The above manufacturing method has the step of the above purification treatment, but in addition, it may have steps such as blending additives such as stabilizers into the composition and other steps.

[0101] (2. Use of the composition) The composition of the present disclosure can be used for various applications. For example, the composition of the present disclosure can be used as a heat transfer fluid, a synthetic solvent, etc.

[0102] As described above, the embodiments of the present invention have been explained, but the present invention is not limited to such examples, and it goes without saying that the present invention can be implemented in various forms without departing from the gist of the present invention.

Examples

[0103] Hereinafter, based on examples, the embodiments of the present invention will be described more specifically, but the present invention is not limited thereto.

[0104] (Production Example 1) Based on the method described in Chem Bar (1973), Vol. 106, pp2950 - 2959, a HFP trimer was obtained. The obtained HFP trimer was purified by distillation to remove impurities such as dimers and tetramers of hexafluoropropene. Further, the purified HFP trimer was separated into the compounds represented by formulas (I), (II), and (III) by distillation. Each of the separated HFP trimers was dehydrated using silica gel.

[0105] The compounds represented by formulas (I), (II), and (III) obtained above were mixed so that the ratios of the compounds represented by formulas (I), (II), and (III) were the ratios shown in the following table to obtain trimer mixtures 1 to 4.

[0106]

Table 1

[0107] (Production Example 2) Based on the method described in Journal of the Chemical Society, Perkin Transactions 1: Organic and Bio-Organic Chemistry (1981), Vol. 4, pp1064 - 1067, C 9 F 16 was synthesized.

[0108] (Production Example 3) C 8 F 16 was purchased as a reagent manufactured by Wako Pure Chemical Industries, Ltd.

[0109] (Examples 1 - 43) Trimer mixtures 1 - 4 and C 9 F 16 from Production Example 2 or C 8 F 16 from Production Example 3 as an additive were mixed at the ratios shown in the following table to obtain the compositions for heat transfer fluids of Examples 1 - 43.

[0110] (Stability Test) The obtained composition for heat transfer fluid was put into a SUS autoclave, sealed, and heated and held under the conditions shown in the following table.

[0111] (Measurement of Fluoride Ion Concentration) An equal amount (by weight) of distilled water was added to the sample, shaken for about 20 seconds to extract F ions into the aqueous layer. Then, 2.5 - 3.0 mL of the aqueous layer was withdrawn with a pipette, and the solution mixed with twice the amount of TISAB solution (Total Ion Strength Adjustment Buffer Solution: manufactured by HORIBA) was used as a sample and measured with a fluoride ion meter (manufactured by HORIBA). Since it is diluted with the TISAB solution, three times the measured value is the fluoride ion concentration. The results are shown in the following table.

[0112]

Table 2

[0113]

Table 3

[0114] From the above results, C 9 F 16 Or C 8 F 16 Examples 1 to 43 containing were confirmed to be stable with no increase in fluorine concentration observed even after long-term storage at high temperature.

[0115] <Boiling Point, Pour Point and Dielectric Constant Measurement> The boiling point of the trimer mixture was taken as the temperature at which a peak derived from endotherm was observed when the temperature was raised from 25°C at a rate of 5°C / min using DSC (Differential Scanning Calorimetry). The pour point was taken as the temperature at which a peak derived from endotherm was observed when the temperature was raised at a rate of 5°C / min after cooling below the freezing point with liquid nitrogen using DSC. The dielectric constant was measured at a frequency of 1 kHz by the capacitance method in an environment of temperature 25°C and humidity 60%.

[0116] <Kinematic Viscosity and Density Measurement> The kinematic viscosity and density of the trimer mixture were measured using a kinematic viscometer SVM3001 manufactured by Anton Paar.

[0117] <Specific Heat Measurement> The specific heat of the trimer mixture was measured using DSC. The measurement conditions were as follows. Measuring device: Differential Scanning Calorimeter DSC8500 manufactured by Perkin-Elmer Heating rate: 10°C / min Standard sample: Sapphire (-Al2O3) Atmosphere: In a dry nitrogen stream Sample container: Aluminum sealed container

[0118] <Thermal Conductivity Measurement> The thermal conductivity of the trimer mixture was measured by the transient thin wire method.

[0119] <Compatibility> The compatibility of the trimer mixture was evaluated by mixing each trimer mixture with the following three solvents in equal amounts. Galden HT135 (manufactured by Solvay) SF-10 (manufactured by Chemours) FC3283 (manufactured by 3M)

[0120]

Table 4

[0121] (Examples 44 - 59) The trimer mixtures 1 - 4 and water were mixed in the amounts shown in the following table to obtain the compositions of Examples 44 - 59.

[0122]

Table 5

[0123] (Stability test) The compositions of Examples 44 - 59 and Comparative Examples 3 - 6 were placed in an SUS autoclave, sealed, and heated and held under the conditions shown in the following table.

[0124] (Insulation resistance measurement) The insulation resistance was measured as the breakdown voltage when a liquid sample was immersed between spherical electrodes adjusted to a predetermined interval and the voltage was increased at a constant rate. The detailed measurement conditions were as follows. Electrode shape: spherical (φ12.5 mm) Electrode interval: 2.5 mm Voltage increase rate: 2 kV / second Measurement atmosphere: in air (22°C, 57% RH)

[0125]

Table 6

[0126] From the above results, it was confirmed that Examples 44 to 59 containing a predetermined amount of water were stable, with no increase in fluorine concentration observed even after long-term storage at high temperature. Also, Examples 44 to 59 were confirmed to have high dielectric strength.

[0127] (Examples 60 to 83) Anhydrous hydrofluoric acid was added to Trimer Mixtures 1 to 4 to prepare a reference solution, which was diluted with each trimer mixture to obtain the compositions of Examples 60 to 83 with the fluoride ion concentrations shown in the following table.

[0128] (Stability Test) The samples were placed in a SUS autoclave, sealed, and heated and held under the conditions shown in the following table.

[0129] (Measurement of Purity of Hexafluoropropene Trimer) The purity of the hexafluoropropene trimer before and after the stability test was measured by gas chromatography.

[0130]

Table 7

[0131]

Table 8

[0132] From the above results, it was confirmed that in Examples 60 to 83 containing a predetermined amount of fluoride ions, the purity of the hexafluoropropene trimer was maintained high even after long-term storage at high temperature.

[0133] The compounds represented by the above formulas (I), (II), and (III) were mixed so that the ratios of the compounds represented by the formulas (I), (II), and (III) were as shown in the following table to obtain Trimer Mixtures 5 to 6.

[0134]

Table 9

[0135] (Production of hexafluoropropene tetramer) (Production Example 4) Based on the method described in Tetrahedron Lett. 1974, 24, 2129 - 2132, hexafluoropropene tetramer was obtained.

[0136] By mixing the trimer mixture 5 or 6 with the hexafluoropropene tetramer obtained in Production Example 4, the composition of the present disclosure can be obtained.

[0137] (Evaluation method) (Boiling point) The boiling point was measured as the temperature at which a peak derived from endotherm was observed when the temperature was raised from 25°C at a rate of 5°C / min using DSC.

[0138] (Kinematic viscosity) The kinematic viscosity was measured at 25°C using an Ubbelohde viscometer based on JIS K 2283.

[0139] (Dielectric constant) The dielectric constant was measured at a frequency of 1 kHz by the capacitance method in an environment of 25°C and 60% humidity.

[0140] (Examples 84 - 85) They were mixed at a weight ratio of trimer mixture 5:hexafluoropropene tetramer = 91:9 (Example 84) and trimer mixture 6:hexafluoropropene tetramer = 91:9 (Example 85). Each physical property was measured, and the results are shown in Table 2.

[0141]

Table 10

[0142] (Examples 86 - 87) In Examples 86 to 87, a pre-purification composition (Composition 1 containing an HFP trimer and a conductive substance) to be subjected to a purification process was prepared. Specifically, 750 g of DMF and 7.2 g of cesium fluoride were placed in an autoclave made of SUS and sealed. After degassing the inside of the autoclave under vacuum, 2268 g of hexafluoropropylene was added over 4.5 hours while maintaining the temperature inside the autoclave at 70 to 110°C. The lower layer was separated from the resulting reaction solution and washed with ultrapure water to obtain 2219 g of a composition (Composition 1 which is the pre-purification composition) containing an HFP trimer. GCFID and GC-MS analyses were carried out, and it was confirmed by the area percentage method that the HFP trimer was contained at 87% by mass in the total amount of 100% by mass of the composition, and the compounds represented by the formulas (I), (II), and (III) described in this specification were contained at 78% by mass, 9% by mass, and 13% by mass, respectively, in the total amount of 100% by mass of the HFP trimer.

[0143] <Example 88> The same operations as in Examples 86 to 87 were carried out to isolate the compounds represented by the formulas (I), (II), and (III), and they were mixed so that the compounds represented by the formulas (I), (II), and (III) were 55% by mass, 15% by mass, and 30% by mass, respectively, to prepare 2200 g of a composition.

[0144] <Example 89> The same operations as in Examples 86 to 87 were carried out to isolate the compounds represented by the formulas (I), (II), and (III), and they were mixed so that the compounds represented by the formulas (I), (II), and (III) were 3% by mass, 33% by mass, and 64% by mass, respectively, to prepare 2200 g of a composition.

[0145] <Example 90> The same operations as in Examples 86 to 87 were carried out to isolate the compounds represented by the formulas (I), (II), and (III), and they were mixed so that the compounds represented by the formulas (I), (II), and (III) were 90% by mass, 5% by mass, and 5% by mass, respectively, to prepare 2200 g of a composition.

[0146] (Measurement of the content of metals and metal ions in the pre-purification composition) The content of the conductive substance (in this example, particular attention was paid to the content of metal and metal ions) in the pre-purification composition was determined by the following procedure using an inductively coupled plasma mass spectrometer (ICP-MS) (the same applies to the post-purification composition). Each measured value was as shown in Table 1 below. (1) Pour 2000 g of the pre-purification composition into a beaker made of polytetrafluoroethylene (PTFE), place the beaker on a hot plate at 250 °C, and volatilize the volatile components. (2) Dilute nitric acid for ultra-trace precision analysis with a concentration of 70% (manufactured by Wako Pure Chemical Industries, Ltd.) with ultrapure water to obtain nitric acid with a concentration of approximately 4% by mass, and then put about 50 mL of this into a PTFE beaker. (3) Place the PTFE beaker on a hot plate at 150 °C for 1 hour to dissolve the metal remaining in the beaker. (4) Measure the amount of metal ions dissolved in the nitric acid using ICP-MS. Calculate the content of metal and metal ions in the solution using the amount of metal ions in the nitric acid, the amount of nitric acid, and the amount of the volatilized solution. (5) For all operations related to the above measurements, a table coach manufactured by Koken Co., Ltd. was installed in a cleanroom of class 10000, and the working environment was set as an environment equivalent to class 1 for implementation.

[0147] (Measurement of the number of insoluble substances (fine particles) in the pre-purification composition) Regarding the number of particles with a particle size of 5.0 μm or more, the number of particles with a particle size of more than 1.0 μm and less than 5.0 μm, the number of particles with a particle size of more than 0.5 μm and less than 1.0 μm, and the number of particles with a particle size of more than 0.3 μm and less than 0.5 μm in the pre-purification composition, they were measured at a temperature of 23 °C using a liquid particle counter ("KL-22" manufactured by RION) (the same applies to the post-purification composition). All operations related to the measurement were carried out in a cleanroom of class 10000 with a table coach manufactured by Koken Co., Ltd. installed, and the working environment was set as an environment equivalent to class 1 for implementation.

[0148] (Measurement of the boiling point, freezing point, and kinematic viscosity of the pre-purification composition) The boiling point was defined as the temperature at which a peak resulting from endothermic absorption was observed when the temperature was raised from 25 °C at a rate of 5 °C / min using DSC. The freezing point was defined as the temperature at which a peak resulting from endothermic absorption was observed when the temperature was raised at a rate of 5 °C / min after cooling to -150 °C or lower (a temperature at which solidification was confirmed) using liquid nitrogen with DSC. The kinematic viscosity was measured using an Ubbelohde viscometer based on JIS K 2283. Each measured value was as shown in Table 1 below.

[0149] (Purification treatment) As a filtration device, a unit in which one filter was packed in one container was prepared for each filter, and a multi-stage filtration device in which the required number of these units were connected in series was prepared.

[0150] The pre-purification composition was placed in a pressure vessel and cooled to -5 °C or lower, and under a high-purity argon atmosphere, it was pressure-filtered up to 0.02 MPa using the above filtration device to obtain a post-purification composition. At that time, as the filter packed in each unit of the filtration device, · Filter A (ION CLEAN SL manufactured by Nippon Pall Co., Ltd., filtration area: 0.58 m2), · Filter B (ULTRA PLEATS P-NYLON manufactured by Nippon Pall Co., Ltd., pore diameter: 0.15 μm, filtration area: 1.2 m2), and · Filter C (ULTRA PLEATS P-NYLON manufactured by Nippon Pall Co., Ltd., pore diameter: 40 nm, filtration area: 1.2 m2) were used as described in Table 1. The results are shown in Table 1.

[0151] From the results in Table 1, it was found that by subjecting the pre-purification composition to a predetermined purification treatment, the content of conductive substances (especially metals and metal ions) can be reduced.

[0152]

Table 11

[0153]

Table 12

Claims

1. C ９ F １８ (i) a hexafluoropropene trimer represented by C ｍ F ２ｍ and / or C ｎ F （２ｎ－２） [wherein m is an integer of 4 or more and 12 or less, other than 9; and n is an integer of 4 or more and 12 or less], (ii) water (wherein the content of such water is determined by the above-mentioned C ９ F １８ and / or (iii) fluoride ions (wherein the content of such fluoride ions is within the range of C ９ F １８ and 0.0000001 to 5 parts by mass relative to 100 parts by mass of the total amount of the hexafluoropropene trimer represented by the formula:

2. The composition according to claim 1, wherein the hexafluoropropene trimer comprises at least one selected from the group consisting of compounds represented by the following formulas (I) to (III): 【Chemistry 1】

3. The composition according to claim 2, wherein the compound represented by formula (I) is present in an amount of 85 mass% or more based on the total amount of the hexafluoropropene trimer.

4. The composition according to claim 2, wherein the compound represented by formula (I) is present in an amount of less than 85% by mass based on the total amount of hexafluoropropene trimer.

5. The composition according to claim 2, wherein the compound represented by formula (I) is present in an amount of 50% by mass or more and less than 85% by mass based on the total amount of the hexafluoropropene trimer.

6. C ９ F １８ (i) a hexafluoropropene trimer represented by C ｍ F ２ｍ and / or C ｎ F （２ｎ－２） wherein m is an integer from 4 to 12, inclusive, other than 9; and n is an integer from 4 to 12, inclusive.

7. 2. The composition of claim 1, wherein m is an integer between 6 and 11, inclusive, other than 9, and n is an integer between 6 and 11, inclusive.

8. C ｍ F ２ｍ and / or C ｎ F （２ｎ－２） The content of C ９ F １８ The composition according to claim 1, wherein the amount of the hexafluoropropene trimer represented by the formula (I) is 0.0001 to 10 parts by mass per 100 parts by mass of the total amount of the hexafluoropropene trimer represented by the formula (I).

9. C ９ F １８ and (ii) water.

10. C ９ F １８ and (iii) a fluoride ion.

11. C １２ F ２４ The composition according to claim 1, further comprising a hexafluoropropene tetramer represented by the formula: wherein the content of the hexafluoropropene trimer is 80 mass% or more based on the total content of the hexafluoropropene trimer and the hexafluoropropene tetramer.

12. The composition according to claim 11, wherein the content of the hexafluoropropene trimer is 90% by mass or more and 99.99% by mass or less based on the total content of the hexafluoropropene trimer and the hexafluoropropene tetramer.

13. The composition of claim 11, wherein the hexafluoropropene tetramer comprises 1,1,1,2,5,6,6,6-octafluoro-2,3,5-tris(trifluoromethyl)-4-(perfluoropropyl-2-yl)-3-hexene.

14. The composition according to claim 1 , further comprising a conductive material, the content of the conductive material being 100 ppm by mass or less.

15. The composition according to claim 1 , further comprising a conductive substance, and having a content of insoluble matter having a size of 5 μm or more of 10 particles / mL or less.

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