Block seal

Abstract

To provide a block seal capable of easily cutting a desired block off a resin plate to paste it to an object and lowering costs of manufacture.SOLUTION: A block seal 1 includes: a resin plate 2 to the rear surface of which an adhesive layer 3 is formed and in which a pattern P is printed to a plurality of block areas R1 to R3 that are divided by scheduled division lines L, M; and a release sheet 4 pasted on the adhesive layer 3 of the resin plate 2. In the block seal which divides the resin plate 2, together with the release sheet 4, into a plurality of blocks B1 to B3 along a groove 2a, peels the release sheet 4 off the rear surface of the divided block B3, and can paste the block B3 to an object 100. The groove 2a of a prescribed depth is formed in the resin plate 2 by laser processing along the scheduled division lines L, M, and a plurality of slit holes 2b in a perforated shape go through a residual part 2A other than the groove 2a on the scheduled division lines L, M of the resin plate 2.SELECTED DRAWING: Figure 8

Description

Technical Field

[0001] The present invention relates to a block seal that can be easily separated from a resin plate together with a release sheet and attached to an object, with a pattern printed thereon.

Background Art

[0002] Seal toys that can peel off an adhesive sheet with a pattern printed thereon from a backing paper and attach it to an object have been variously proposed so far (see, for example, Patent Documents 1 and 2).

[0003] Also, instead of a flexible thin adhesive sheet, a resin plate having a certain degree of rigidity is used and commercially available as a block seal. In this block seal, grooves are formed in a grid pattern on the surface of the resin plate by die molding, and a release sheet is attached to the adhesive layer on the back surface.

[0004] In the block seal configured as described above, a desired block is separated along the groove, the release sheet is peeled off from the back surface of the separated block, and the block is attached to the object.

Prior Art Documents

Patent Documents

[0005]

Patent Document 1

Patent Document 2

Summary of the Invention

Problems to be Solved by the Invention

[0006] However, in the currently commercially available block seals, in order to separate the blocks and attach them to an object, the resin plate needs to be folded back multiple times along the grooves to soften the groove portions, and then the softened groove portions are cut with a sharp tool such as scissors or a cutter to separate the desired blocks from the resin plate. Therefore, the operation is troublesome, and there is a problem that infants and the like cannot easily separate the blocks.

[0007] In addition, since the grooves are formed on the surface of the resin plate by die molding, a plurality of dies corresponding to the size and shape of the blocks are required for forming the grooves, and there is also a problem that the die cost increases and the manufacturing cost becomes high.

[0008] The present invention has been made in view of the above problems, and its object is to provide a block seal that can be easily separated from a resin plate by hand without using scissors or the like and attached to an object, and can suppress the manufacturing cost.

Means for Solving the Problems

[0009] The present invention for achieving the above object includes a resin plate having an adhesive layer formed on the back surface and a pattern printed on each of a plurality of block regions partitioned by a planned division line, and a release sheet adhered to the adhesive layer of the resin plate. The resin plate is divided into a plurality of blocks along the planned division line together with the release sheet, and the release sheet is peeled off from the back surface of the divided block, and the block can be attached to an object. The resin plate has grooves with a predetermined depth formed by laser processing along the planned division line, and a plurality of slit holes in a perforated shape are provided in the remaining portions other than the grooves on the planned division line of the resin plate.

Effects of the Invention

[0010] According to the present invention, a desired one can be easily bent with a slight force around the slit holes from a plurality of blocks of the resin plate and separated from the resin plate together with the release sheet. Then, if the release sheet is peeled off from the back surface of the separated block and the block from which the release sheet has been peeled off is pressed against the object from the direction in which the back surface faces the object side, the block can be attached to the object by the adhesive layer on its back surface.

[0011] In addition, since the block seal according to the present invention has a plurality of slit holes in the form of grooves and perforations formed by laser processing, molding using a mold is not required, and the manufacturing cost can be kept low.

Brief Description of the Drawings

[0012]

Figure 1

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Figure 10

Mode for Carrying Out the Invention

[0013] Embodiments of the present invention will be described below with reference to the accompanying drawings.

[0014] The block seal 1 according to the present invention basically comprises a rectangular resin plate 2 and a thin rectangular release sheet 4 adhered to an adhesive layer 3 formed on the back surface (the lower surface in FIG. 1) of the resin plate 2 (see FIGS. 1 and 3). In the present embodiment, the resin plate 2 is made of a transparent or opaque acrylic resin, but any resin other than acrylic resin can be used as the material of the resin plate 2. In the present invention, a material that can be laser-processed, such as an MDF plate (medium density fiberboard), can be used instead of the resin plate.

[0015] As shown in FIG. 2, the resin plate 2 is partitioned into a plurality of rectangular block regions R1, R2, R3 of different sizes by a plurality of vertical and horizontal division planned lines L, M arranged in a grid pattern. In the present embodiment, the resin plate 2 is partitioned into one large-sized block region R1, three medium-sized block regions R2, and twelve small-sized block regions R3, respectively. On the front or back surface of each block region R1, R2, R3, a pattern P such as a character is printed. For the printing of the pattern P, UV inkjet printing, silk printing, transfer printing, etc. are used. When the resin plate 2 is made of a transparent resin, the pattern P can also be printed on its back surface.

[0016] On the surface of the resin plate 2 configured as described above, as shown in FIG. 4, grooves 2a of a predetermined depth d as shown in FIG. 5 are formed along the division planned lines L, M by laser processing that irradiates laser light emitted from the laser head 10 along the division planned lines L, M. Here, the formation of the grooves 2a along the division planned lines L, M on the surface of the resin plate 2 is achieved by moving the laser head 10 that emits laser light along the division lines L, M of the resin plate 2, or by moving the resin plate 2 relative to the fixed laser head 10.

[0017] On the surface of the resin plate 2 by the above laser processing, as shown in FIG. 6, lattice-shaped grooves 2a are formed along the division planned lines, and a plurality of blocks B1, B2, B3 of different sizes are formed in the resin plate 2 by these grooves 2a. Specifically, in the resin plate 2, one large-sized block B1, three medium-sized blocks B2, and twelve small-sized blocks B3 are formed. Incidentally, as shown in FIG. 5, the depth d of each groove 2a is set to be smaller than the thickness T of the resin plate 2 (d < T). Therefore, below the groove 2a of the resin plate 2, there exists a remaining portion 2A with a thickness t (= T - d) where no groove 2a is formed. For this reason, among the plurality of blocks B1, B2, B3 of the resin plate 2, those adjacent to each other are connected to each other by the remaining portion 2A. In this embodiment, the thickness t of the remaining portion 2A of the resin plate 2 is set to about 0.5 mm.

[0018] As described above, when the grooves 2a are formed in a lattice shape on the surface side of the resin plate 2 by laser processing, at the positions on the division planned lines L, M of the resin plate 2 where the grooves 2a are formed, a plurality of perforated slit holes 2b as shown in FIGS. 6 and 7 are linearly formed in a perforated shape by the laser light emitted from the laser head 10 (see FIG. 4) to the remaining portion 2A (the portion where no groove 2a is formed) of the resin plate 2 and the peeling sheet 4. In this case, the laser head 10 emits laser light from above the resin plate 2 along the division planned lines L, M toward the remaining portion 2A (see FIG. 5) of the resin plate 2 and the peeling sheet 4. In this way, the plurality of perforated slit holes 2b formed in the remaining portion 2A of the resin plate 2 and the peeling sheet 4 function as cutting lines when cutting out a desired block B1 (B2, B3) from the resin plate 2 as described later.

[0019] Thus, in the block seal 1 configured as described above, a desired one of the plurality of blocks B1 to B3 of the resin plate 2 is cut out together with the release sheet 4, the release sheet 4 is peeled off from the back surface of the cut-out block B1 (B2, B3), and the block B1 (B2, B3) from which the release sheet 4 has been peeled off is pressed against the object 100 from a direction in which its back surface faces the object 100 (see FIG. 8), then the block B1 (B2, B3) is attached to the object 100 by the adhesive layer 3 on its back surface. Here, as an example, the procedure of cutting out the small-sized block B3 and attaching it to the object 100 will be described below based on FIGS. 8(a) to (d).

[0020] That is, as shown in FIG. 8(a), to cut out a desired block B3 from the plurality of blocks B1, B2, B3 of the block seal 1 together with the release sheet 4 attached to its back surface from the resin plate 2, the block B3 is bent downward (in the direction of the arrow shown in the figure) around a plurality of slit holes 2b in the form of perforations that function as cutting lines, and further bent around another slit hole 2b orthogonal to the slit holes 2b, then, as shown in FIG. 8(b), the desired block B3 can be cut out together with the release sheet 4. In this case, since the thickness t of the remaining portion 2A (see FIG. 5) of the resin plate 2 where the slit holes 2b are formed is as thin as about 0.5 mm as described above in this embodiment, even an infant can easily bend and cut out the desired block B3 with a small force around the slit holes 2b. Note that FIGS. 8(a) and (b) illustrate the case of cutting out one block B3 as an example, but blocks B1 and B2 of other different sizes can also be easily cut out in the same manner.

[0021] As described above, when the desired block B3 is cut out (see FIG. 8(b)), as shown in FIG. 8(c), the release sheet 4 is turned up and peeled off from the back surface of the cut-out block B3. Then, as shown in FIG. 8(d), the block B3 from which the release sheet 4 has been peeled off from the back surface is pressed against the object 100 with the adhesive layer 3 on the back surface facing the object 100, and the block B3 is attached to the object 100 by adhesion of the adhesive layer 3.

[0022] Therefore, according to the block seal 1 according to the present invention, the desired block B1 (B2, B3) can be easily cut out from the resin plate 2 by hand and attached to the object 100. Further, since the groove 2a and the plurality of perforations 2b in a perforated shape are formed in the block seal 1 according to the present invention by laser processing, molding using a mold is not required, and the effect that the manufacturing cost can be kept low is also obtained.

[0023] By the way, in the above embodiment, the laser light was irradiated on the resin plate 2 from the surface side to form the groove 2a on the surface side. However, as shown in FIG. 9, the laser light is irradiated from the surface side and the back side of the resin plate 2 to form the first groove 2a1 and the second groove 2a2 on the surface side and the road surface side, respectively. You may make it form the slit hole which is not shown in a perforated shape in the remaining part 2A in which the grooves 2a1 and 2a2 of the resin plate 2 are not formed.

[0024] Further, as shown in FIG. 10, a plurality of through holes 2c having, for example, a rectangular shape in plan view may be provided through the resin plate 2 and the release sheet 4 to form a plurality of blocks B having an octagonal shape in plan view. In addition, by appropriately making the through hole 2c into an arbitrary shape, the shape of the block B can be changed into an arbitrary shape such as a polygon, a circle, a star, etc. other than a quadrilateral or an octagon.

[0025] The present invention using the resin plate 2 described above can be applied to a plate made of a material that can be laser processed, such as an MDF plate, instead of the resin plate 2. Further, the present invention is not limited to the application to the above-described embodiment, and it goes without saying that various modifications are possible within the scope of the technical idea described in the utility model registration claims, the specification, and the drawings.

Explanation of reference numerals

[0026] 1 Block seal 2 Resin plate 2A Remaining part of resin plate 2a Groove 2a1 First groove 2a2 Second groove 2b Slit hole 2c Through hole 3 Adhesive layer 4 Release sheet 10 Laser head 100 Object B, B1 to B3 Blocks d Depth of groove L, M Predetermined dividing line P Pattern R1 to R3 Block regions T Thickness of resin plate t Thickness of remaining portion of resin plate

Claims

1. a resin plate having an adhesive layer formed on the back surface thereof and having a pattern printed on each of a plurality of block areas defined by division lines; a release sheet attached to the adhesive layer of the resin plate; Equipped with A block seal in which the resin plate is divided into a plurality of blocks along a division line together with the release sheet, and the blocks can be attached to an object by peeling off the release sheet from the back surface of the divided blocks, A block seal characterized in that a groove of a predetermined depth is formed in the resin plate by laser processing along the intended division line, and a plurality of perforated slit holes are provided in the remaining part of the resin plate on the intended division line other than the groove.

2. 2. The block seal according to claim 1, wherein the slit holes in the form of perforations are formed through the remaining portion of the resin plate and the release sheet by laser processing from the front side of the resin plate.

3. 2. The block seal according to claim 1, characterized in that a first groove is formed on the front side of the resin plate by laser processing from the front side of the resin plate, a second groove is formed on the back side of the resin plate and in the release sheet by laser processing from the back side of the resin plate, and the slit hole in the form of a perforation is provided in the remaining portion between the first groove and the second groove of the resin block.

4. 2. The block seal according to claim 1, wherein a plurality of through holes are formed in the resin plate and the release sheet.

5. 5. The block seal according to claim 1, wherein the pattern is printed on the front or back surface of the resin plate.

6. 5. The block seal according to claim 1, wherein the resin plate is replaced with an MDF plate (medium density fiberboard).

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