Hot-melt adhesive resin laminate

Abstract

To provide a holt-melt adhesive resin laminate using a resin composition capable of suppressing lowering tensile breaking stress.SOLUTION: A hot-melt adhesive resin laminate has a first resin layer 1 containing a resin as a formation material, and second resin layers 2 on both surfaces of the first resin layer 1, wherein the first resin layer 1 is formed of a resin composition containing a polyester resin other than a liquid crystal polymer, and a low melting point liquid crystal polymer having a crystal melting temperature of 250°C or lower, and the second resin layers 2 are formed of an acid-modified polyethylene resin or an imine-modified polyolefin resin.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a hot-melt adhesive resin laminate.

Background Art

[0002] Among polyester resins, liquid crystal polymers have good hydrolysis resistance. However, it is difficult to knead a liquid crystal polymer with a crystal melting temperature of 280°C or higher with other resins to form a polymer alloy. Therefore, a resin composition obtained by polymer alloying a low-melting liquid crystal polymer with a crystal melting temperature of 250°C or lower and other resins is commercially available (see, for example, Patent Documents 1 and 2). Further, Patent Document 3 discloses a hot-melt adhesive resin laminate.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Patent Document 2

Patent Document 3

Summary of the Invention

Problems to be Solved by the Invention

[0004] In a resin composition in which a low-melting liquid crystal polymer with a crystal melting temperature of 250°C or lower is finely dispersed, the hydrolysis resistance of the liquid crystal polymer is affected and decreases. When stored or used under humid conditions, there is a problem that the tensile fracture stress of the resin composition decreases.

[0005] The present invention has been made in view of the above circumstances, and an object thereof is to provide a hot-melt adhesive resin laminate using a resin composition capable of suppressing a decrease in tensile fracture stress.

Means for Solving the Problems

[0006] The first aspect is a hot-melt adhesive resin laminate including a first resin layer made of a resin as a forming material and second resin layers on both sides of the first resin layer, wherein the first resin layer is formed from a resin composition containing a polyester resin other than a liquid crystal polymer and a low-melting-point liquid crystal polymer having a crystal melting temperature of 250°C or lower, and the second resin layer is formed from an acid-modified polyethylene resin or an imine-modified polyolefin resin.

[0007] The second aspect is that in the first aspect, the first resin layer is a base material layer and the second resin layer is an adhesive layer. The third aspect is that in the first aspect, third resin layers are respectively provided on the sides of the second resin layers opposite to the first resin layer, the third resin layer is formed from an acid-modified polypropylene resin, the first resin layer is a base material layer, the second resin layer is an intermediate layer, and the third resin layer is an adhesive layer.

[0008] The fourth aspect is that in any one of the first to third aspects, the resin composition of the first resin layer further contains an acid-modified polyolefin resin. The fifth aspect is that in the fourth aspect, the acid-modified polyolefin resin contained in the first resin layer is an acid-modified polyethylene resin. The sixth aspect is that in the fourth or fifth aspect, in the first resin layer, with the total of the resin composition being 100 parts by weight, the polyester resin other than the liquid crystal polymer is 40 to 60 parts by weight, the low-melting-point liquid crystal polymer is 20 to 40 parts by weight, and the acid-modified polyolefin resin is 5 to 30 parts by weight.

Advantages of the Invention

[0009] According to the present invention, it is possible to provide a hot-melt adhesive resin laminate using a resin composition capable of suppressing a decrease in tensile fracture stress.

Brief Description of the Drawings

[0010]

Figure 1

Figure 2

Mode for Carrying Out the Invention

[0011] Hereinafter, the present invention will be described based on preferred embodiments.

[0012] The hot-melt adhesive resin laminate of the embodiment has a first resin layer 1 made of a resin as a forming material and second resin layers 2 on both surfaces of the base material layer.

[0013] In the hot-melt adhesive resin laminate 10 shown in FIG. 1, the first resin layer 1 is a base material layer 11, and the second resin layer 2 is an adhesive layer 12. The layer structure of the hot-melt adhesive resin laminate 10 is composed of three layers of adhesive layer 12 / base material layer 11 / adhesive layer 12.

[0014] In the hot-melt adhesive resin laminate 20 shown in FIG. 2, third resin layers 3 are provided on the sides of the second resin layer 2 opposite to the first resin layer 1, respectively. The first resin layer 1 is a base material layer 21, the second resin layer 2 is an intermediate layer 22, and the third resin layer 3 is an adhesive layer 23. The layer structure of the hot-melt adhesive resin laminate 20 is composed of five layers of adhesive layer 23 / intermediate layer 22 / base material layer 21 / intermediate layer 22 / adhesive layer 23.

[0015] The first resin layer 1 is formed from a resin composition containing a polyester resin other than a liquid crystal polymer and a low melting point liquid crystal polymer having a crystal melting temperature of 250°C or lower. The resin composition of the first resin layer 1 may further contain an acid-modified polyolefin resin.

[0016] The first resin layer 1 contains a polyester resin other than a liquid crystal polymer. These polyester resins are non-liquid crystal polyester resins, and may be, for example, linear polyester resins obtained by condensation polymerization of a dicarboxylic acid component and a diol component.

[0017] Examples of the dicarboxylic acid component of the polyester resin include aromatic dicarboxylic acids such as terephthalic acid, isophthalic acid, naphthalene-1,4-dicarboxylic acid, and naphthalene-2,6-dicarboxylic acid, and aliphatic dicarboxylic acids such as adipic acid and sebacic acid. Examples of the diol component of the polyester resin include linear diols such as ethylene glycol, 1,3-propanediol, 1,4-butanediol, 1,5-pentanediol, and 1,6-hexamethylene diol; branched diols such as neopentyl glycol and 2,2-dialkyl-1,3-propanediol; and cyclic diols such as cyclopentanedimethanol and cyclohexanedimethanol. Examples of the alkyl group of the side chain branched from the main chain of the branched diol include methyl group, ethyl group, propyl group, and butyl group.

[0018] Specific examples of the polyester resin are not particularly limited, and include polyethylene terephthalate, polybutylene terephthalate, polyethylene naphthalate, polybutylene naphthalate, polytrimethylene terephthalate, and modified polyesters obtained by modifying a part of the dicarboxylic acid component and / or diol component in these polyesters with other dicarboxylic acid components and / or diol components.

[0019] The first resin layer 1 contains a low melting point liquid crystal polymer having a crystal melting temperature of 250°C or lower. The liquid crystal polymer is a thermoplastic resin that exhibits liquid crystallinity when melted, and a liquid crystal polymer made of a polyester resin is preferred. The polyester resin other than the liquid crystal polymer may be a thermoplastic resin that does not exhibit liquid crystallinity when melted.

[0020] The low melting point liquid crystal polymer may be composed of only one type of low melting point liquid crystal polymer, or may be a mixture of a plurality of types of low melting point liquid crystal polymers. The low melting point liquid crystal polymer may be a liquid crystal polyester or liquid crystal polyester amide that forms an anisotropic molten layer called a thermotropic liquid crystal polymer, and a liquid crystal polyester is preferred.

[0021] The crystal melting temperature of the low melting point liquid crystal polymer is the temperature of the crystal melting peak measured using a differential scanning calorimeter. The measurement method using a differential scanning calorimeter is as follows: after observing the endothermic peak temperature (Tm1) observed when measuring under a temperature rising condition of 20 °C / min from room temperature, hold at a temperature 20 to 50 °C higher than Tm1 for 10 minutes, then cool the sample to room temperature under a temperature decreasing condition of 20 °C / min, and then observe the endothermic peak when measuring again under a temperature rising condition of 20 °C / min, and the temperature indicating the peak top is taken as the crystal melting temperature of the liquid crystal polymer. The crystal melting temperature of the low melting point liquid crystal polymer is 250 °C or lower, preferably 160 °C to 240 °C, more preferably 170 °C to 230 °C, and particularly preferably 200 °C to 230 °C.

[0022] Examples of the repeating unit constituting the low melting point liquid crystal polymer include an aromatic hydroxycarboxylic acid unit (-O-Ar-CO-), an aromatic dicarboxylic acid unit (-CO-Ar-CO-), an aromatic diol unit (-O-Ar-O-), an aromatic aminocarboxylic acid unit (-NH-Ar-CO-), an aromatic hydroxyamine unit (-O-Ar-NH-), an aromatic diamine unit (-NH-Ar-NH-), an aliphatic diol unit (-O-Ra-O-), and an aliphatic dicarboxylic acid unit (-O-Ra-O-). Here, -Ar- represents an aromatic group, and -Ra- represents an aliphatic group. The -CO- group contained in these units is not limited to being derived from a carboxylic acid (-CO-OH), and may also be derived from an acyl compound (-CO-O-COR), an ester derivative (-CO-OR), an acid halide (-CO-X), etc. Further, the -O- group and the -NH- group are not limited to being derived from a hydroxy group (-OH) and an amino group (-NH2), respectively, and may also be derived from an acyl compound (-O-COR and -NH-COR), etc. Here, R represents an organic group such as an alkyl group or an aryl group, and X represents a halogen atom. These repeating units constituting the liquid crystal polymer may be only one kind or a combination of two or more kinds as long as a polyester is formed as the low melting point liquid crystal polymer, but it is desirable to contain at least one kind of hydroxycarboxylic acid unit. As the low melting point liquid crystal polymer, an all-aromatic low melting point liquid crystal polymer in which each repeating unit contains all aromatic groups is preferable.

[0023] Specific examples of the aromatic hydroxycarboxylic acid unit include 4-hydroxybenzoic acid, 3-hydroxybenzoic acid, 2-hydroxybenzoic acid, 6-hydroxy-2-naphthoic acid, 5-hydroxy-2-naphthoic acid, 7-hydroxy-2-naphthoic acid, 3-hydroxy-2-naphthoic acid, 4'-hydroxyphenyl-4-benzoic acid, 3'-hydroxyphenyl-4-benzoic acid, 4'-hydroxyphenyl-3-benzoic acid, and units derived from their alkyl, alkoxy, or halogen substituents. Among these, from the viewpoint of easily adjusting the heat resistance, mechanical strength, and melting point of the resulting liquid crystal polymer, units derived from one or more selected from the group consisting of 4-hydroxybenzoic acid and 6-hydroxy-2-naphthoic acid are preferred.

[0024] Specific examples of the aromatic dicarboxylic acid unit include terephthalic acid, isophthalic acid, 2,6-naphthalenedicarboxylic acid, 1,6-naphthalenedicarboxylic acid, 2,7-naphthalenedicarboxylic acid, 4,4'-dicarboxybiphenyl, 3,4'-dicarboxybiphenyl, and 4,4''-dicarboxytriphenyl, and units derived from their alkyl, alkoxy, or halogen substituents. Among these, from the viewpoint of effectively enhancing the heat resistance of the resulting liquid crystal polymer, units derived from one or more selected from the group consisting of terephthalic acid, isophthalic acid, and 2,6-naphthalenedicarboxylic acid are preferred, and terephthalic acid units or 2,6-naphthalenedicarboxylic acid units are more preferred.

[0025] Specific examples of the aromatic diol units include units derived from hydroquinone, resorcinol, 2,6-dihydroxynaphthalene, 2,7-dihydroxynaphthalene, 1,6-dihydroxynaphthalene, 3,3'-dihydroxybiphenyl, 3,4'-dihydroxybiphenyl, 4,4'-dihydroxybiphenyl, 4,4'-dihydroxybiphenyl ether, and 2,2'-dihydroxybinaphthyl, and their alkyl, alkoxy, or halogen substitution products. Among these, from the viewpoint of excellent reactivity during polymerization, units derived from one or more selected from the group consisting of hydroquinone, resorcinol, 4,4'-dihydroxybiphenyl, and 2,6-dihydroxynaphthalene are preferred, and units derived from one or more selected from the group consisting of hydroquinone, 4,4'-dihydroxybiphenyl, and 2,6-dihydroxynaphthalene are more preferred.

[0026] Specific examples of the aliphatic diol units include units derived from ethylene glycol, 1,4-butanediol, and 1,6-hexanediol. Also, during production, a polymer containing an aliphatic diol such as polyethylene terephthalate or polybutylene terephthalate may be reacted with the above-mentioned aromatic hydroxycarboxylic acid, aromatic dicarboxylic acid, aromatic diol, and their acylates, ester derivatives, acid halides, etc.

[0027] Specific examples of the aliphatic dicarboxylic acid units include units derived from oxalic acid, malonic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, dodecanedioic acid, tetradecanedioic acid, fumaric acid, maleic acid, 1,4-cyclohexanedicarboxylic acid, and hexahydroterephthalic acid. Among these, from the viewpoint of excellent reactivity during polymerization, units derived from oxalic acid, succinic acid, adipic acid, suberic acid, sebacic acid, dodecanedioic acid, and 1,4-cyclohexanedicarboxylic acid are preferred.

[0028] The first resin layer 1 preferably contains an acid-modified polyolefin resin. Examples of the acid-modified polyolefin resin include acid-modified polyethylene resins and acid-modified polypropylene resins. Examples of polyethylene include low-density polyethylene, high-density polyethylene, and linear low-density polyethylene. Examples of polypropylene include homopolypropylene, block polypropylene, and random polypropylene. The proportion of the acid-modified polyolefin resin in the first resin layer 1 is, for example, 5 to 30% by weight.

[0029] Examples of the method for producing the acid-modified polyolefin resin include a method of graft-modifying an unmodified polyolefin resin with an acid-functional group-containing monomer by melt-kneading, and a method of copolymerizing an olefin monomer and an acid-functional group-containing monomer. Examples of the acid-functional group-containing monomer include a carboxylic acid group-containing monomer and an acid anhydride group-containing monomer. Examples of the carboxylic acid group-containing monomer include α,β-unsaturated carboxylic acid monomers such as acrylic acid, methacrylic acid, maleic acid, nadic acid, fumaric acid, itaconic acid, citraconic acid, crotonic acid, isocrotonic acid, tetrahydrophthalic acid, and endo-bicyclo[2.2.1]-5-heptene-2,3-dicarboxylic acid (endomethylenehexahydrophthalic acid). Examples of the acid anhydride group-containing monomer include unsaturated dicarboxylic acid anhydride monomers such as maleic anhydride, nadic anhydride, itaconic anhydride, citraconic anhydride, and endomethylenehexahydrophthalic anhydride.

[0030] As a method for producing the resin composition of the first resin layer 1, there is a method of blending at least a polyester resin and a low melting point liquid crystal polymer by a method such as melt kneading. The acid-modified polyolefin resin may be added and blended simultaneously with or after the blend of the polyester resin and the low melting point liquid crystal polymer. The apparatus for melt kneading is not particularly limited, but a single screw extruder, a multi-screw extruder, a Banbury mixer, a plast mill, a heating roll kneader, etc. can be used. Further, the polyester resin, the low melting point liquid crystal polymer, and the acid-modified polyolefin can also be blended by forming a film with an extruder or the like after dry blending.

[0031] As a result of blending, the resin composition of the first resin layer 1 may form a sea-island structure in which the polyester resin constitutes the sea portion and the low melting point liquid crystal polymer and the acid-modified polyolefin resin each constitute the island portion. Since the acid-modified polyolefin resin is well dispersed with respect to the polyester resin and the low melting point liquid crystal polymer, hydrolysis of ester bonds and the like contained in the polyester resin and the low melting point liquid crystal polymer can be suppressed even in a high temperature and high humidity environment such as during thermoforming. Furthermore, a decrease in the tensile fracture stress of the resin composition can be suppressed.

[0032] Assuming the total of the resin composition of the first resin layer 1 is 100 parts by weight, it is preferable that the polyester resin other than the liquid crystal polymer is in a proportion of 40 to 60 parts by weight, the low melting point liquid crystal polymer is in a proportion of 20 to 40 parts by weight, and the acid-modified polyolefin resin is in a proportion of 5 to 30 parts by weight. It is preferable that the proportion of the polyester resin other than the liquid crystal polymer is more than the proportion of the low melting point liquid crystal polymer, and it is preferable that the proportion of the low melting point liquid crystal polymer is more than the proportion of the acid-modified polyolefin resin.

[0033] The resin composition of the first resin layer 1 may contain optional components. Examples of optional resin components include polyolefin resins, olefin-based elastomers, styrene-based elastomers, etc. Examples of additives, although not particularly limited, include fillers, colorants, antioxidants, defoaming agents, leveling agents, light absorbers, etc.

[0034] The resin composition of the first resin layer 1 may be a composition that does not contain a high melting point liquid crystal polymer having a crystal melting temperature exceeding 250°C. Further, the resin composition of the first resin layer 1 may be a composition that does not contain a resin component having a melting temperature (melting point) exceeding 250°C. The thickness of the first resin layer 1 is not particularly limited, but examples include 60 to 120 μm.

[0035] The second resin layer 2 is formed of an acid-modified polyethylene resin or an imine-modified polyolefin resin. Examples of the acid-modified polyethylene resin of the second resin layer 2 include a graft polymer obtained by graft-modifying an unmodified polyethylene resin with an acid functional group-containing monomer by melt kneading, a copolymer obtained by copolymerizing an ethylene monomer and an acid functional group-containing monomer, and the like. Examples of the acid functional group-containing monomer include the carboxylic acid group-containing monomer and the acid anhydride group-containing monomer. Examples of polyethylene include low density polyethylene, high density polyethylene, linear low density polyethylene, and the like. Examples of the imine-modified polyolefin resin of the second resin layer 2 include a polymer compound obtained by modifying a polyolefin resin such as a polyethylene resin or polypropylene with an imine compound.

[0036] When the second resin layer 2 is the adhesive layer 12, good adhesiveness can be obtained with respect to the adherend of the hot melt adhesive resin laminate 10. The thickness of the adhesive layer 12 is not particularly limited, but examples include 10 to 40 μm.

[0037] When the second resin layer 2 is the intermediate layer 22, the adhesive strength (interlayer peeling strength) can be improved between the base material layer 21 and the adhesive layer 23. The thickness of the intermediate layer 22 is not particularly limited, but examples include 1 to 20 μm. The acid-modified polyethylene resin contained in the intermediate layer 22 may be of the same grade or a different grade from the acid-modified polyethylene resin contained in the base material layer 21.

[0038] The resin composition of the second resin layer 2 may contain optional components. Examples of optional resin components include polyolefin resins, olefin-based elastomers, styrene-based elastomers, and the like. Although not particularly limited as additives, examples include fillers, colorants, antioxidants, defoaming agents, leveling agents, light absorbers, and the like.

[0039] The third resin layer 3 is formed of an adhesive polypropylene resin such as an acid-modified polypropylene resin. Examples of the acid-modified polypropylene resin include a graft polymer obtained by graft-modifying a non-acid-modified polypropylene resin with an acid functional group-containing monomer by melt kneading, a copolymer obtained by copolymerizing a propylene monomer and an acid functional group-containing monomer, and the like. Examples of the acid functional group-containing monomer include the carboxylic acid group-containing monomer and the acid anhydride group-containing monomer. Examples of polypropylene include homopolypropylene, block polypropylene, random polypropylene, and the like.

[0040] The third resin layer 3 is an adhesive layer 23, and good adhesiveness can be obtained with respect to the adherend of the hot melt adhesive resin laminate 20. Although not particularly limited, the thickness of the adhesive layer 23 is, for example, 10 to 40 μm.

[0041] The resin composition of the third resin layer 3 may contain optional components. Examples of optional resin components include polyolefin resins, olefin-based elastomers, styrene-based elastomers, and the like. Although not particularly limited as additives, examples include fillers, colorants, antioxidants, defoaming agents, leveling agents, light absorbers, and the like. As the antioxidant, phenolic, phosphite-based, thioether-based, etc. can be used alone or in combination. In particular, it is preferable to add an antioxidant to the resin layer that becomes the outermost layer.

[0042] The hot melt adhesive resin laminates 10 and 20 of the embodiment can be used as an adhesive material, a sealing material, etc. in various electric devices, electronic equipment, etc. Although not particularly limited, examples of the applications include solar cells, fuel cells, electrolysis devices, electrochemical devices, and the like.

Example

[0043] Hereinafter, the present invention will be specifically described with reference to examples.

[0044] <Base material layer> A polymer alloy of a polyester resin and a low melting point liquid crystal polymer, and an acid-modified polyolefin resin were melt-kneaded, and the obtained resin composition was formed into a film with a thickness of 90 μm to obtain a base material layer (first resin layer).

[0045] As the polyester resin and the low melting point liquid crystal polymer, a polymer alloy (trade name: TECROS (registered trademark) T-440HS, manufactured by Ueno Pharmaceutical Co., Ltd., denoted as "PET / LCP" in the table) in which polyethylene terephthalate (PET) and liquid crystal polymer (LCP) are blended at a weight ratio of 60:40 was used. The liquid crystal polymer contained in this polymer alloy is a low melting point liquid crystal polymer having a crystal melting temperature of 220°C.

[0046] As the acid-modified polyolefin resin, a commercially available acid-modified polyethylene (trade name: Admer (registered trademark) SF728, manufactured by Mitsui Chemicals, Inc., denoted as "APE" in the table) was used. In No. 1, only PET / LCP (without APE) was used, in No. 2, PET / LCP and APE were in a weight ratio of 90:10, and in No. 3, PET / LCP and APE were in a weight ratio of 80:20.

[0047] For the measurement of the tensile fracture stress, samples obtained by punching the film of the obtained base material layer into a dumbbell shape of No. 5 were measured under the conditions of a chuck distance: 80 mm, a gauge length: 45 mm, and a tensile speed: 300 mm / min. After preparing each sample so that the tensile direction was the MD direction (flow direction) or the TD direction (width direction), the tensile fracture stress was determined from the cross-sectional area (width 6 mm, thickness 0.09 mm) at the narrow part of the sample width.

[0048] The Pressure Cooker Test (PCT) was carried out under the conditions of 110 °C, 85% RH, and 96 h. The tensile fracture stress before and after PCT was measured for the same sample, and the retention rate before and after PCT was calculated. This retention rate is obtained by (tensile fracture stress after PCT) / (tensile fracture stress before PCT) × 100 (%). The measurement results of the tensile fracture stress are shown in Table 1.

[0049]

Table 1

[0050] As shown in Table 1, it was confirmed that by blending an acid-modified polyolefin resin, a decrease in the tensile fracture stress after PCT can be suppressed.

[0051] <Hot Melt Adhesive Resin Laminate> A hot melt adhesive resin laminate composed of five layers of adhesive layer / intermediate layer / base material layer / intermediate layer / adhesive layer was fabricated. The thickness of the intermediate layer was 5 μm, and the thickness of the adhesive layer was 25 μm.

[0052] As the intermediate layer, APE of the same grade as the acid-modified polyolefin resin used for the base material layer was used.

[0053] As the adhesive layer, two types of acid-modified polypropylene resins (trade name: Admer® QE060, manufactured by Mitsui Chemicals, Inc., denoted as "APP1" in the table) and (trade name: Admer® QF575, manufactured by Mitsui Chemicals, Inc., denoted as "APP2" in the table) and an antioxidant (a mixture of phenolic, phosphite, and thioether types) were blended at a weight ratio of 55:40:5 and added at 3500 ppm to the resin content of the adhesive layer. The resin composition thus obtained was used.

[0054] The interlayer peeling strength of the hot melt adhesive resin laminate was measured as the average of N = 3 (average of the measured values measured three times). The results are shown in Table 2.

[0055]

Table 2

[0056] As shown in Table 2, the sample No. 2 had the highest delamination strength.

Description of Reference Numerals

[0057] 1... first resin layer, 2... second resin layer, 3... third resin layer, 10, 20... hot-melt adhesive resin laminate, 11, 21... base material layer, 22... intermediate layer, 12, 23... adhesive layer.

Claims

1. A hot-melt adhesive resin laminate having a first resin layer made of a resin as a forming material and second resin layers on both sides of the first resin layer, wherein the first resin layer is formed from a resin composition containing a polyester resin other than a liquid crystal polymer and a low melting point liquid crystal polymer having a crystal melting temperature of 250°C or lower, and the second resin layer is formed from an acid-modified polyethylene resin or an imine-modified polyolefin resin.

2. The hot-melt adhesive resin laminate according to claim 1, wherein the first resin layer is a base material layer and the second resin layer is an adhesive layer.

3. The hot-melt adhesive resin laminate according to claim 1, further having third resin layers on the sides of the second resin layers opposite to the first resin layer, wherein the third resin layer is formed from an acid-modified polypropylene resin, and the first resin layer is a base material layer, the second resin layer is an intermediate layer, and the third resin layer is an adhesive layer.

4. The hot-melt adhesive resin laminate according to claim 1, wherein the resin composition of the first resin layer further contains an acid-modified polyolefin resin.

5. The hot-melt adhesive resin laminate according to claim 4, wherein the acid-modified polyolefin resin contained in the first resin layer is an acid-modified polyethylene resin.

6. The hot-melt adhesive resin laminate according to claim 4, wherein in the first resin layer, based on 100 parts by weight of the total resin composition, the polyester resin other than the liquid crystal polymer is 40 to 60 parts by weight, the low melting point liquid crystal polymer is 20 to 40 parts by weight, and the acid-modified polyolefin resin is 5 to 30 parts by weight.

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