Printed circuit board, injection molding machine or die casting machine including the same, and method for protecting printed circuit board from electric shock

Abstract

To provide a printed circuit board that can completely avoid an increase in the manufacturing steps and cost of a printed circuit board, an increase in the man-hours required for maintenance and other operations, and the possibility of generation of defects in protection from electric shocks.SOLUTION: In a printed circuit board 100 having a component surface A and a solder surface B used in an injection molding machine 10 or in a die casting machine, contactable high-pressure parts are all arranged in the solder surface B.SELECTED DRAWING: Figure 2

Description

Technical Field

[0001] The present invention relates to a printed circuit board used in an injection molding machine for obtaining a molded product of a predetermined shape by injecting molten resin at high pressure, a die-casting machine for injecting molten metal into a mold to form a molded product, and the electric shock protection direction of the printed circuit board.

Background Art

[0002] Conventionally used injection molding machines and die-casting machines generally have control devices for controlling the operations of the respective machines arranged within their respective frames or control panels.

[0003] During maintenance of an injection molding machine or a die-casting machine, etc., when an operator opens a frame cover or a control panel in an energized state to access a printed circuit board constituting the control device.

[0004] When accessing the printed circuit board while energized in this way, in order to prevent the operator from accidentally getting an electric shock at a high-voltage part (for example, a part where the touch voltage exceeds 50 V) arranged on the printed circuit board, measures such as manually applying an insulating silicon bond to the high-voltage part or attaching an insulating cover are taken.

[0005] For example, Patent Document 1 discloses a technique of covering a high-voltage part with an insulating cover layer by silk printing.

Prior Art Documents

Patent Documents

[0006]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0007] However, conventional electric shock countermeasures have problems such as an increase in the manufacturing man-hours and costs of printed circuit boards, an increase in the man-hours of workers during maintenance, etc. due to the need to attach and remove insulation covers, and the possibility of electric shock remaining if there are defects in the countermeasures.

[0008] The present invention has been made in view of such problems, and its object is to avoid all of the increase in the manufacturing man-hours and costs of printed circuit boards, the increase in the man-hours of workers during maintenance, etc., and further the possibility of defects in electric shock countermeasures. To provide a printed circuit board, an injection molding machine or a die-casting machine equipped with the same, and a method for protecting a printed circuit board from electric shock.

Means for Solving the Problems

[0009] According to one aspect of the present invention, A printed circuit board used in an injection molding machine or a die-casting machine, Having a component side and a soldering side, Characterized in that all accessible high-voltage parts are arranged on the soldering side A printed circuit board is provided.

[0010] According to another aspect of the present invention, An injection molding machine or a die-casting machine equipped with the above-described printed circuit board is provided.

[0011] According to another aspect of the present invention, In a printed circuit board having a component side and a soldering side, which is used in an injection molding machine or a die-casting machine, All high-voltage parts that can come into contact with the soldering side are arranged, The soldering side is arranged inside the frame or control panel of the injection molding machine or the die-casting machine with the soldering side facing inward A method for protecting a printed circuit board from electric shock is provided.

Effects of the Invention

[0012] According to the printed circuit board of the present invention, since all the accessible high-voltage parts are arranged on the solder side, when arranging the printed circuit board inside the frame or control panel of an injection molding machine or a die-casting machine, just arranging the solder side facing inward can eliminate the chance for the operator to touch the high-voltage parts, and thus implement electric shock protection measures.

[0013] Thus, according to the printed circuit board of the present invention, it is possible to avoid all of the increase in the manufacturing man-hours and costs of the printed circuit board, the increase in the man-hours of the operator during maintenance, etc., and further the possibility of defects in electric shock countermeasures.

Brief Description of the Drawings

[0014]

Figure 1

Figure 2

Modes for Carrying Out the Invention

[0015] (Configuration of Injection Molding Machine 10) The injection molding machine 10 according to the present embodiment is a machine that manufactures molded products by repeating a molding cycle such as mold closing, mold clamping, injection filling of molten resin, metering, mold opening, and removal of molded products. As shown in FIG. 1, it generally includes a machine base 11, a mold clamping device 12, an injection device 14, and a control device 15.

[0016] The mold clamping device 12 is arranged on the machine base 11 and is a device that receives the molten resin injected from the injection device 14 into a mold (cavity) to form a molded product.

[0017] The injection device 14 is a device that injects and fills molten resin into a mold (cavity).

[0018] The control device 15 is a device that controls all of the molding cycles of the injection molding machine 10. In the present embodiment, a printed circuit board 100 that constitutes this control device 15 is disposed within a printed circuit board accommodation recess 104 formed in a frame 102 of the machine base 11.

[0019] As shown in FIG. 2, the printed circuit board 100 generally has a board body 110, a number of electrical components 112, and a board pattern 114.

[0020] For the board body 110, a rigid board in which paper or glass cloth is used as a base material and both surfaces of the base material are coated with a phenolic resin or an epoxy resin is generally used. Of course, a flexible printed circuit board may be used.

[0021] Also, on the board body 110, there are a component surface A on which the electrical components 112 are disposed, and a surface opposite to the component surface A, on which many board patterns 114 are disposed, and a soldering surface B on which the lead wires of the electrical components 112 that have passed through the through holes from the component surface A are soldered to the board pattern 114.

[0022] The printed circuit board 100 according to the present embodiment is characterized in that all contactable high voltage parts X are disposed on the soldering surface. This "contactable high voltage part X" refers to parts that can reach a predetermined high voltage (for example, 50 V or more) during the operation of the injection molding machine 10, and some electrical components 112 and board patterns 114 that an operator may touch during normal maintenance work are applicable. In other words, high voltage parts that an operator cannot touch are not included in the "contactable high voltage part X". Alternatively, a high voltage part that does not meet the protection class IP1X may be defined as the "contactable high voltage part X".

[0023] The remaining electrical components 112 and board patterns 114 that do not reach a predetermined high voltage or that an operator cannot touch even if they reach a high voltage may be disposed on the component surface A as necessary.

[0024] Also, as described later, since the printed circuit board 100 is disposed in the printed circuit board accommodating recess 104 formed in the frame 102 of the injection molding machine 10 with the solder surface B facing inward, it is desirable that the electrical components 112 disposed on the solder surface B of the board body 110 can be surface-mounted, have a low maintenance frequency, and are furthermore resistant to heat. This is because, due to the space efficiency issue of the printed circuit board accommodating recess 104, the printed circuit board 100 is disposed as close as possible to the inner wall surface of the printed circuit board accommodating recess 104, and the gap between the electrical component 112 disposed on the solder surface B and the inner wall surface becomes narrow.

[0025] (Features of the printed circuit board 100 according to the embodiment) According to the printed circuit board 100 according to the above-described embodiment, since all the accessible high-voltage portions X are disposed on the solder surface B, when the printed circuit board 100 is disposed in the frame 102 of the injection molding machine 10, it is only necessary to dispose the solder surface B facing inward, thereby eliminating the chance for the operator to touch the high-voltage portion X and enabling measures for electric shock protection.

[0026] Thus, according to the printed circuit board 100 according to the embodiment, it is possible to avoid all of the increase in the manufacturing man-hours and costs of the printed circuit board, the increase in the man-hours of the operator during maintenance, etc., and furthermore, the possibility of defects in the electric shock countermeasures.

[0027] (Modification 1) In the above-described embodiment, the printed circuit board 100 is disposed in the printed circuit board accommodating recess 104 formed in the frame 102 of the injection molding machine 10. However, the present invention is not limited thereto. For example, the printed circuit board 100 may be disposed with the solder surface B facing inward within the control panel (not shown) of the injection molding machine 10.

[0028] (Modification 2) In the above-described embodiment, the printed circuit board 100 is disposed in the injection molding machine 10. However, this printed circuit board 100 can also be applied to a die-casting machine that molds molten metal. Specifically, the printed circuit board 100 is disposed with the solder surface B facing inward within the printed circuit board accommodating recess formed in the frame of the die-casting machine or within the control panel.

[0029] The embodiments disclosed this time should be considered illustrative in all respects and not restrictive. The scope of the present invention is shown not by the above description but by the claims, and it is intended that all modifications within the meaning and scope equivalent to the claims are included.

Explanation of Reference Numerals

[0030] 10... Injection molding machine, 11... Machine base, 12... Mold clamping device, 14... Injection device, 15... Control device 100... Printed circuit board, 102... Frame, 104... Printed circuit board housing recess 110... Substrate body, 112... Electrical component, 114... Substrate pattern, A... Component surface, B... Solder surface, X... High voltage part that can be contacted

Claims

1. A printed circuit board used in an injection molding machine or a die-casting machine, having a component side and a solder side, characterized in that all accessible high-voltage parts are arranged on the solder side. Printed circuit board.

2. An injection molding machine or a die-casting machine comprising the printed circuit board according to Claim 1.

3. In a printed circuit board having a component side and a solder side and used in an injection molding machine or a die-casting machine, all high-voltage parts capable of contacting the solder side are arranged, and the solder side is arranged inside the frame or the control panel of the injection molding machine or the die-casting machine facing inward. Electric shock protection method for a printed circuit board.

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