Thermal conductor, heating device, and heat treatment apparatus, and heat conduction performance measuring device

Abstract

To provide a thermal conductor, a heating device, a heat treatment apparatus, and a heat conduction performance measuring device capable of applying a high heat quantity to a work with an optional area and shape.SOLUTION: A thermal conductor includes: a heat receiving section 23 having a heat receiving surface for receiving heat from a heat source 10; a heat constriction section 24 that is continuous to the heat receiving section 23 and has a tapered shape that is thinned in a direction separated from the heat receiving section 23; and a heat radiation section 22 that has columnar structure extending in a first direction from the end of the heat constriction section 24 and transfers heat by allowing the tip of the columnar structure to abut on a work. A sectional area in an orthogonal direction relative to the first direction of columnar structure is smaller than a sectional area in an orthogonal direction of the heat receiving section 23.SELECTED DRAWING: Figure 1

Description

Technical Field

[0001] The present invention relates to a heat conductor, a heating device, a heat treatment device, and a heat conduction performance measuring device.

Background Art

[0002] Conventionally, a heat conduction performance measuring device for measuring the heat conduction performance of a workpiece such as a metal member has been known. In such a heat conduction performance measuring device, the heat conduction performance such as the thermal conductivity and the thermal resistance value has been measured based on the amount of heat input to the workpiece and the amount of heat radiated from the workpiece.

[0003] For example, in Patent Document 1, a workpiece is sandwiched between a heating-side clamping member connected to a heating unit and a cooling-side clamping member connected to a cooling unit, and the temperature is measured at a plurality of locations on the heating-side clamping member and the cooling-side clamping member, so that the heat conduction performance of the workpiece is calculated from the measured temperature gradient. A configuration is disclosed.

Prior Art Documents

Patent Documents

[0004]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0005] In recent years, with the increase in power consumption due to the high integration of semiconductor elements, the amount of heat generated by these semiconductor elements has tended to increase. In order to suppress the temperature rise of such semiconductor elements, a heat dissipation member having a higher heat dissipation ability than before is required. Such a heat dissipation member has a high heat generation amount, and a semiconductor element having a smaller area than the heat dissipation member is mounted thereon. Therefore, for a thermal conductivity measurement device that measures the thermal conductivity performance of the heat dissipation member, it is required to be able to provide a heat spot with an area, shape, and / or heat amount corresponding to the mounted semiconductor element to the heat dissipation member to be measured, and to measure the thermal conductivity performance when the heat spot is provided. Here, as a method of applying an arbitrary heat spot to the heat dissipation member, a method can be considered in which a heater serving as a heat source has an area and shape corresponding to the heat spot and increases the heat generation density of the heater. However, from the viewpoint of the heater life, there is an allowable limit for the heat generation density, and it is impossible to generate a high heat amount with a small heat generation area, and there is a problem that a heat source cannot be manufactured with an arbitrary area and shape due to manufacturing restrictions of the heater. Therefore, even when using an existing heater, a heat conductor, or a heating device, a heat treatment device, or a thermal conductivity measurement device that can apply a heat spot with a desired area, shape, and / or heat amount corresponding to the semiconductor element to the heat dissipation member (work) is required.

[0006] An object of the present invention is to provide a heat conductor, a heating device, a heat treatment device, and a thermal conductivity measurement device that can apply a high heat amount to a work with an arbitrary area and shape even when using an existing heater.

Means for Solving the Problem

[0007] The heat conductor according to the present invention includes a heat receiving portion having a heat receiving surface that receives heat from a heat source, a heat convergence portion that is continuous with the heat receiving portion and has a tapered shape that becomes thinner in a direction away from the heat receiving portion, and a columnar structure that extends in a first direction from an end of the heat convergence portion, and a heat dissipation portion that contacts the work at the tip of the columnar structure to transfer heat. The cross-sectional area of the columnar structure in a direction orthogonal to the first direction is smaller than the cross-sectional area of the heat receiving portion in the orthogonal direction. Thereby, the heat conductor according to the present invention can apply a heat spot with an arbitrary area, shape, and / or heat amount to the work. In the above heat conductor, the heat receiving part may adopt a configuration having a rotationally symmetric outer edge in a plan view. In the above heat conductor, a configuration may be adopted in which a fixing part for fixing the heat source disposed on the heat receiving surface of the heat receiving part is provided. The heating device according to the present invention is a heating device including the above heat conductor, a heat source that inputs heat to the heat receiving part, and a plurality of first temperature measuring devices. The heat radiating part has substantially the same cross-sectional area from the root part to the tip part, and the plurality of first temperature measuring devices are arranged along the first direction. In the above heating device, a configuration may be adopted in which a heat insulating member that covers at least the side surface of the heat receiving part of the heat conductor is provided. The heat treatment device according to the present invention is a heat conduction performance measuring device including the above heating device, a temperature control device that is provided opposite to the heating device and holds the workpiece, a driving device that adjusts the distance between the heating device and the temperature control device, and a second temperature measuring device that measures the temperature of the workpiece or the temperature control device. The tip of the heat radiating part of the heat conductor is brought into contact with the surface of the workpiece on the side opposite to the temperature control device to heat the workpiece. In the above heat treatment device, a connecting device that connects the heating device and the driving device may be provided, and the connecting device may adopt a configuration including one or a plurality of connecting members that are connected to the heat receiving part of the heat conductor at a rotationally symmetric position in a plan view. In the above heat treatment device, a configuration may be adopted in which a sensor that measures the distance of the heating device from the temperature control device is provided. The heat conduction performance measuring device according to the present invention includes the above heat treatment device, an arithmetic device that calculates the heat conduction performance of the workpiece based on the temperature of the heating device measured by the plurality of first temperature measuring devices and the temperature of the workpiece or the temperature control device measured by the second temperature measuring device. Thereby, the heat conduction performance measuring device according to the present invention can apply a heat spot of an arbitrary area, shape, and / or heat quantity to the workpiece to be measured, and can measure the heat conduction performance when the heat spot is applied.

[0008] Moreover, the present invention is not limited to a thermal conductivity measurement device for measuring the thermal conductivity performance of a workpiece, and can be applied to a heat treatment device that transfers heat to the workpiece in order to process and manufacture any workpiece. For example, the present invention can be configured as a heat treatment device having the following characteristics and a mounting table used for processing a workpiece in a heat treatment device or the like. The mounting table according to the present invention is a mounting table on which a workpiece is placed and which provides a fluid for use in processing the workpiece when processing the workpiece, and includes a mounting surface on which the workpiece is placed and a liquid flow path through which a liquid circulates inside, and a liquid discharge hole communicating with the first end side of the liquid flow path is provided in the mounting surface, and a liquid supply hole communicating with the second end side of the liquid flow path is provided in a surface different from the mounting surface. In the above mounting table, the mounting surface may further include a gas flow path through which a gas circulates inside, a gas blowing hole communicating with the first end side of the gas flow path is provided in the mounting surface, and a gas supply hole communicating with the second end side of the gas flow path is provided in a surface different from the mounting surface. In the above mounting table, at least one of the liquid discharge hole and the gas blowing hole may be provided at a position closer to the center of the mounting surface than the outer edge of the mounting surface. In the above mounting table, the liquid supply hole can be connected to a liquid supply device via a first pipe to send out liquid from the liquid discharge hole on the mounting surface, and the gas supply hole can be connected to a gas supply device via a second pipe to send out gas from the gas blowing hole on the mounting surface. In the above mounting table, the liquid discharge hole can also serve as a liquid suction hole for sucking the liquid discharged onto the mounting surface, or the mounting surface can have a liquid suction hole for sucking the liquid discharged onto the mounting surface separately from the liquid discharge hole. In the above-described mounting table, an operation unit for a user to input instructions and a control unit are provided, and the control unit controls the liquid supply device and / or the gas supply device based on the user's instructions input to the operation unit, so that the liquid can be sent out and / or the gas can be sent out on the mounting table. In the above-described mounting table, a temperature sensor can be installed on the mounting surface. The heat treatment apparatus according to the present invention includes a heat source, a heat conductor that conducts the heat generated by the heat source to the workpiece, and a temperature control device that has the above-described mounting table and adjusts the temperature of the mounting surface of the mounting table. When heat-treating the workpiece, the heat conductor contacts the workpiece to apply the heat conducted from the heat source to the workpiece, and the mounting table adjusts the temperature of the workpiece to the temperature adjusted by the temperature control device.

Effect of the Invention

[0009] According to the present invention, in the heat conductor, by making the heat dissipation part smaller in shape than the cross-sectional area of the heat receiving part via the heat convergence part, the heat dissipation part can have an arbitrary area and shape smaller than the heat receiving surface, and by converging the heat from the heat source by the heat convergence part, the amount of heat dissipated from the heat dissipation part can be increased. Therefore, even when an existing heater is used, it is possible to apply a high-heat hot spot with an arbitrary area and shape to the workpiece.

Brief Description of the Drawings

[0010]

Figure 1

Figure 2

Figure 3

Figure 4

Figure 5

Figure 6

Figure 7

Figure 8

Figure 9

Figure 10

Figure 11

Figure 12

Mode for Carrying Out the Invention

[0011] Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following, as an example of the heat treatment apparatus of the present invention, a heat conduction performance measuring apparatus that heats a workpiece (including work-in-progress, parts, and products to be worked on) to measure the heat conduction performance of the workpiece will be exemplified and described. FIG. 1 is a perspective view of the heat conduction performance measuring apparatus 1 according to the present embodiment, and FIG. 2 is a configuration diagram showing the heat conduction performance measuring apparatus 1 according to the present embodiment, showing a cross section along line II-II of FIG. 1. As shown in FIGS. 1 and 2, the heat conduction performance measuring apparatus 1 according to the present embodiment includes a heater 10, a heat conductor 20, a heat insulating portion 30, a connecting device 40, a driving portion (driving device) 50, a temperature control portion (temperature control device) 60, and a control portion 70. In the present embodiment, it is assumed that the heater 10, the heat conductor 20, and the heat insulating portion 30 constitute a heating portion (heating device) 2. Further, in the present embodiment, the lower side of each figure (for example, the direction in which the temperature control portion 60 is located with respect to the heating portion 2) is referred to as the lower side, and the upper side of the figure (for example, the direction in which the heating portion 2 is located with respect to the temperature control portion 60) is referred to as the upper side for explanation. In FIG. 2, the input / output of the electrical signal to the control portion 70 is indicated by a broken line, and the tubes 651, 661, 671 to which the pumps 65, 66 and the refrigerant circulation device 67 to be described later are connected are indicated by a one-dot chain line.

[0012] The heater 10 is a heat source, and for example, a ceramic heater of 900 to 1500 W is exemplified. In the present embodiment, the heater 10 is disposed on the upper surface of the heat conductor 20, and the heat generated by the heater 10 is input to the heat conductor 20. Note that the heater 10 can be configured to be in direct contact with the heat conductor 20, or can be configured to be indirectly in contact with the heat conductor 20 via heat conductive grease, grease, elastomer, metal, or other members having high thermal conductivity in addition to the heat conductive grease.

[0013] The heat conductor 20 is a member for conducting the heat received from the heater 10 and applying it to the work W. FIG. 3 is a configuration diagram showing the heat conductor 20 according to the present embodiment. The heat conductor 20 includes a heat receiving member 21 that holds the heater 10, and a columnar heat radiating portion 22 that extends from the heat receiving member 21.

[0014] The heat receiving member 21 is also referred to as a heater block, and as shown in FIG. 3, includes a heat receiving portion 23 that holds the heater 10, which is a heat source, and a tapered heat converging portion 24. The heat receiving portion 23 is the portion of the heat receiving member 21 that has the widest diameter in plan view, and the heater 10 is placed on its upper surface (heat receiving surface 23a). Note that the heat receiving surface 23a of the heat receiving portion 23 on which the heater 10 is placed may be a flat surface, or may have a shape in which the portion on which the heater 10 is placed is recessed, and the heater 10 can be embedded in the recess. The area of the heat receiving surface 23a of the heat receiving portion 23 is wider than the area of the heater 10, and the heat of the heater 10 can be efficiently applied to the heat receiving portion 23. Above the heat receiving portion 23, a flat fixing portion 26 is provided for biasing and fixing the heater 10 to the heat receiving surface 23a of the heat receiving portion 23. The fixing portion 26 can be switched between an open position and a fixed position by a locking member (not shown).

[0015] Further, the heat convergence portion 24 is formed on the lower end side of the heat receiving portion 23, and the diameter in plan view becomes thinner in the direction away from the heat receiving portion 23 (from the heat receiving portion 23 side toward the heat radiating portion 22 side). Thereby, the heat generated by the heater 10 is input to the heat receiving member 21, conducted from the heat receiving portion 23 to the heat convergence portion 24, then heat is converged in the heat convergence portion 24, and is conducted to the heat radiating portion 22 with a high heat flux. Although the configuration may be such that the heater 10 is disposed in the heat convergence portion 24, in order to transfer heat evenly, it is preferable not to dispose the heater 10 in the heat convergence portion 24. In the present embodiment, the heat convergence portion 24 is configured not to have the heater 10.

[0016] As shown in FIG. 3, the heat radiating portion 22 is a columnar member extending from the lower end of the heat convergence portion 24 of the heat receiving member 21, and the cross-sectional area in the horizontal direction is substantially the same from the root portion to the tip portion. Further, the diameter (cross-sectional area) of the heat radiating portion 22 is formed smaller than the diameter (cross-sectional area) of the heat receiving portion 23. For example, the diameter of the heat radiating portion 22 can be 1 / 2 or less of the diameter of the heat receiving portion 23, and more preferably 1 / 3 or less. Further, as shown in FIG. 2, the lower end portion of the heat radiating portion 22 is exposed from a heat insulating portion 30 described later, and has a heat radiating surface 25 that directly or indirectly contacts the work W. Thereby, the heat converged in the heat convergence portion 24 is conducted from the heat radiating portion 22 upward (toward the heater 10 side) to downward (toward the work W side), and is applied to the work W from the heat radiating surface 25. In particular, in the present embodiment, since the cross-sectional area of the heat radiating portion 22 in the horizontal direction is smaller than that of the heat receiving member 21, it is possible to directly apply the heat with a high heat flux converged in the heat convergence portion 24 from the heat radiating surface 25 to the work W. Further, the diameter of the planar heat radiating surface 25 is smaller than the area of the plane of the work W (for example, several mm to several tens of mm or 5 mm to 20 mm), but since no temperature measuring device is provided on the heat radiating surface 25, a sufficient contact area can be ensured, and heat can be efficiently applied to the work W. For example, in the present embodiment, even when a ceramic heater of 900 to 1500 W is used as the heater 10, 1000 W / cm 2The heat of the above heat flux can be applied to the work W. The heat dissipation part 22 is provided with a plurality of holes for arranging a thermocouple 71, which will be described later, in the length direction.

[0017] Note that the material of the heat conductor 20 is not particularly limited as long as it has high thermal conductivity. For example, it can be composed of silver, copper, gold, aluminum, iron, nickel, platinum, etc. In this embodiment, the heat conductor 20 is made of copper. Further, in this embodiment, the heat conductor 20 is integrally formed to enhance its thermal conductivity. On the other hand, among the heat conductor 20, the heat receiving member 21 and the heat dissipation part 22 can be separately molded, and the heat dissipation part 22 can be joined to the joint surface provided at the lower end of the heat receiving member 21 to manufacture the heat conductor 20. In this way, by joining the heat receiving member 21 and the heat dissipation part 22 as separate bodies, the thermal resistance at the joint surface increases, and this thermal resistance can be utilized to promote the uniformization of heat in the horizontal direction. Furthermore, in this embodiment, as shown in FIG. 1, the heat receiving member 21 is surrounded by the heat insulation part 30, and is configured to suppress the heat generated by the heater 10 from diffusing to the outside. Note that the material of the heat insulation part 30 is not particularly limited. For example, the inside can be made of a heat insulation material such as an inorganic porous material or a fiber material (such as glass fiber), and this heat insulation material can be covered with a heat-resistant resin cover.

[0018] Also, in the present embodiment, the heat conductor 20 has a structure in which the heat receiving member 21 (the heat receiving portion 23 and the heat convergence portion 24) is formed in a circular shape in plan view. By forming the heat receiving member 21 (the heat receiving portion 23 and the heat convergence portion 24) in a circular shape in plan view, when the heat generated by the heater 10 is conducted to the heat dissipation surface 25 of the heat dissipation portion 22, the heat can be evenly converged in the horizontal direction, and it becomes possible to reduce the temperature unevenness on the heat dissipation surface 25. In the present embodiment, a configuration in which the heat receiving member 21 (the heat receiving portion 23 and the heat convergence portion 24) and the heat dissipation portion 22 are formed in a circular shape in plan view is illustrated, but the present invention is not limited to this configuration, and the heat receiving member 21 (the heat receiving portion 23 and the heat convergence portion 24) and the heat dissipation portion 22 may be formed in a regular polygon shape in plan view. Also in this case, when the heat is conducted through the heat receiving member 21, the heat can be converged substantially evenly. Further, in the present embodiment, since the heat dissipation surface of the heat dissipation portion 22 can have an arbitrary area and / or shape, heat input according to the situation in which each workpiece is used becomes possible.

[0019] Further, in the present embodiment, as shown in FIG. 3, a plurality of thermocouples 71, which are temperature measuring devices, are installed at equal intervals (for example, a 2 mm pitch) along the extending direction of the heat radiating portion 22. The plurality of thermocouples 71 are respectively connected to a control unit 70, and temperature data measured by each thermocouple 71 is periodically output to the control unit 70. The control unit 70 measures the heat conduction performance of the workpiece W based on the temperature data of the plurality of thermocouples 71. In particular, in the present embodiment, since the plurality of thermocouples 71 are installed at equal intervals along the extending direction of the heat radiating portion 22, based on the temperature data of these thermocouples 71, the temperature gradient of the heat radiating portion 22 is obtained, and based on the temperature gradient of the heat radiating portion 22, the temperature of the heat radiating surface 25 can be calculated with high precision. Since the temperature of the heat radiating surface 25 is used for calculating the heat conduction performance of the workpiece W, by calculating the temperature of the heat radiating surface 25 with high precision, the control unit 70 can calculate the heat conduction performance such as the thermal conductivity and thermal resistance of the workpiece W with high accuracy. In the present embodiment, a configuration using the thermocouple 71 as the temperature measuring device is illustrated, but the temperature measuring device is not limited to the thermocouple 71, and a configuration using a contact type temperature sensor such as a platinum resistance thermometer or a thermistor, or a non-contact type temperature sensor such as a thermograph can also be adopted. Further, in the present embodiment, a configuration in which the thermocouples 71 are installed at equal intervals along the extending direction of the heat radiating portion 22 is illustrated, but the thermocouples 71 do not necessarily need to be installed at equal intervals as long as they are installed along the extending direction of the heat radiating portion 22, and the temperature gradient of the heat radiating portion 22 can be calculated in consideration of the interval between the thermocouples 71 and the positions of the respective thermocouples 71.

[0020] Next, the connecting device 40 will be described. The connecting device 40 has a plurality of shafts 41 that are connecting members, and the lower end portions of the respective shafts 41 are connected to the upper surface of the heat conductor 20. The shaft 41 is a straight columnar member, and is a cylindrical shape in the present embodiment. Further, the connecting device 40 is connected to the driving unit 50 directly or indirectly at the upper part, and together with the heat conductor 20, it can move up and down in the vertical direction by the driving unit 50.

[0021] Here, referring to FIG. 4, the arrangement method of the shaft 41 in the connecting device 40 will be described. FIG. 4 is a diagram for explaining the arrangement method of the shaft 41, (A1)-(A3) are top views of the connecting device 40, and (B1)-(B3) are perspective views of the connecting device 40. In addition, in FIG. 4, the illustration of the fixing portion 26 is omitted. In the present embodiment, as shown in (A1) and (B1), in the connecting device 40, a plurality of shafts 41 are arranged so as to surround the heater 10. Specifically, the connecting device 40 has three shafts 41, and these plurality of shafts 41 are arranged at an equal distance from the center point O of the heater 10 (or on a concentric circle of the center point O), and the angle θ formed by two adjacent shafts 41 and the center point of the heater 10 is substantially the same (in the examples shown in (A1) and (B1), each angle θ is 120°). In other words, the three shafts 41 that connect the heat conductor 20 and the drive unit 50 are connected to the heat receiving surface 23a of the heat receiving portion 23 at positions that are rotationally symmetric about the center point O in a plan view. Thereby, in the present embodiment, heat is evenly conducted from the heater 10 to each shaft 41, and even when the shaft 41 thermally expands, the expansion amount of each shaft 41 can be made the same, and it is possible to prevent the heat dissipation surface 25 of the heat conductor 20 from tilting in the horizontal direction. That is, if the distance from the shaft 41 to the heater 10 is different for each shaft 41, the elongation accompanying the thermal expansion of the shaft 41 becomes non-uniform, and there is a possibility that the heat dissipation surface 25 may tilt in the horizontal direction. Also, when the shaft 41 is disposed unevenly on the heat receiving surface 23a of the heat receiving portion 23, there is a bias in the pressure on the heat conductor 20 accompanying the thermal expansion of the shaft 41, and there is a possibility that the heat dissipation surface 25 may tilt in the horizontal direction. And when the heat dissipation surface 25 tilts in the horizontal direction, it cannot be in surface contact with the work W, and there is a problem that the measurement accuracy of the heat conduction performance of the work W decreases.In contrast, in the connecting device 40 according to the present embodiment, a plurality of shafts 41 are arranged at equal distances (or on concentric circles) from the center point O of the heater 10, and the angle θ formed by two adjacent shafts 41 and the center point of the heater 10 is arranged to be substantially the same. Therefore, it is possible to suppress the heat dissipation surface 25 of the heat conductor 20 from tilting.

[0022] Note that, as the connecting device 40 according to the present embodiment, the configurations shown in FIGS. 4(A1) and (B1) are exemplified, but the present invention is not limited to this configuration, and the configurations shown in FIGS. 4(A2) and (B2) or (A3) and (B3) can also be adopted. That is, in the configurations shown in FIGS. 4(A2) and (B2), four shafts 41 are arranged at equal distances (or on concentric circles) from the center point O of the heater 10, and are arranged to be line-symmetric with respect to two or more lines passing through the center point O. Specifically, in the examples shown in FIGS. 4(A2) and (B2), four shafts 41 are arranged to be line-symmetric with respect to four lines L1 to L4 passing through the center point O. Also in this case, the thermal expansion amounts of the shafts 41 can be made uniform, and the heat dissipation surface 25 of the heat conductor 20 can be prevented from tilting. Further, in the examples shown in FIGS. 4(A3) or (B3), a plurality of shafts 41 are arranged line-symmetrically with respect to the line L1 passing through the center point O of the heater 10, and each shaft 41 is arranged such that the angle θ formed by two adjacent shafts 41 and the center point O of the heater 10 is substantially the same. Thus, also in the examples shown in FIGS. 4(A3) or (B3), since a plurality of shafts 41 are arranged symmetrically and at regular intervals, the inclination of the heat dissipation surface 25 of the heat conductor 20 due to the shafts 41 can be suppressed.

[0023] As described above, the drive unit 50 is connected to the heat conductor 20 via the connecting device 40, and drives the connecting device 40 and the heat conductor 20 in the vertical direction. In particular, in the present embodiment, the drive unit 50 operates based on the control of the control unit 70. When measuring the work W, the heat conductor 20 is moved downward to a position where it contacts the work W. After measuring the work W, the heat conductor 20 is moved upward to a predetermined height position where it does not contact the work W. In the present embodiment, the drive unit 50 is connected to a proximity sensor or a contact sensor (not shown). Based on the signals from these sensors, when the heat conductor 20 is moved downward, it can be determined whether the heat dissipation surface 25 of the heat dissipation unit 22 has contacted the work W. Further, the drive unit 50 can be configured to determine whether the heat dissipation surface 25 of the heat dissipation unit 22 has contacted the work W based on the signal from the load sensor installed on the temperature control unit 60 side. By these sensors, it is possible to prevent damage to the work W due to overload while ensuring that the heat dissipation surface 25 contacts the work W. The type of the drive unit 50 is not particularly limited. For example, an air cylinder can be used. By using an air cylinder, the heat conductor 20 can be brought into contact with the work W with a constant thrust while performing drive control in the vertical direction, and the measurement accuracy of the heat conduction performance of the work W can be improved.

[0024] Next, the temperature control unit 60 will be described. The temperature control unit 60 has a temperature control function for maintaining the work W at a predetermined set temperature with the work W placed on its upper surface. In the present embodiment, as shown in FIGS. 2 and 5, the temperature control unit 60 includes a temperature control block 61 on which the work W is placed, a heat spreader 62 for horizontally diffusing the heat conducted from the lower surface of the temperature control block 61, a heating and cooling device 63 that contacts the central portion of the lower surface of the heat spreader 62, and a cooling device 64 that contacts the lower surface of the heating and cooling device 63. In the present embodiment, the work W is held by the temperature control block 61 due to its own weight. However, for example, a holding mechanism for holding the work W by clamping or suction may be provided.

[0025] The heat spreader 62 is a metal member with good horizontal thermal conductivity and can be constituted by, for example, a heat pipe or a vapor chamber for transferring heat horizontally using a working fluid. The heating and cooling device 63 is a Peltier element that can heat and cool the temperature control block 61 via the heat spreader 62 under the energization control by the control unit 70. The cooling device 64 includes a water-cooled block in which a flow path through which the refrigerant supplied from the refrigerant circulation device 67 circulates is formed inside.

[0026] In this embodiment, by executing the preheating process by the heating and cooling device 63, it is possible to significantly shorten the time of the measurement test of the heat conduction performance. For example, when heating a workpiece W with a predetermined amount of heat and measuring the heat conduction performance at that amount of heat, since the temperature of the workpiece W changes until the workpiece W reaches the temperature corresponding to the heat of that amount, the heat conduction performance of the workpiece W may fluctuate. Also, when the preheating process is not executed, even when the workpiece W reaches the temperature corresponding to the heat of that amount, the calculated thermal resistance value may not be stable until a certain period of time has elapsed (until the temperature of the workpiece W stabilizes). Thus, conventionally, it has been necessary to wait for the measurement of the heat conduction performance of the workpiece W until the temperature of the workpiece W reaches the temperature corresponding to the heat input thereto and until the temperature of the workpiece W stabilizes after reaching the temperature corresponding to the heat input thereto. However, in this embodiment, by preheating the temperature control block 61, the workpiece W can be stabilized at the temperature corresponding to the heat input in a short time, and the heat conduction performance of the workpiece W can be measured.

[0027] Further, the control unit 70 can also measure the thermal conductivity performance of the work W at a predetermined temperature. For example, when measuring the thermal conductivity performance of the work W at 60°C, the control unit 70 adjusts the temperature of the work W before and after the measurement to 60°C. When the temperature of the temperature control block 61 is less than 60°C, the control unit 70 performs energization control to cause the heating and cooling device 63 to generate heat, thereby heating the temperature control block 61 by the heating and cooling device 63 and quickly heating the temperature of the work W in contact with the temperature control block 61 to the target 60°C. On the other hand, when the temperature of the temperature control block 61 is 60°C or higher, the control unit 70 operates the refrigerant circulation device 67 communicating with the cooling device 64, and circulates the refrigerant from the refrigerant circulation device 67 to the cooling device 64, thereby reducing the temperature of the temperature control block 61 and adjusting the temperature of the work to the target 60°C. Further, when cooling the work W, the control unit 70 can also be configured to cool the work W by the Peltier element which is the heating and cooling device 63. That is, the heating and cooling device 63 can function as a heating device when heating the work W and as a cooling device when cooling the work W. Note that the set temperature of the temperature control block 61 (60°C in the above example) can be set as appropriate, but it is preferably set to a temperature lower than the temperature of the heat applied to the work W by the heating unit 2. In this embodiment, a configuration in which the Peltier element is used as the heating and cooling device 63 to heat the work W is illustrated, but the configuration is not limited thereto. As the heating mechanism, instead of or in addition to the Peltier element, a heater can be provided in the temperature control unit 60, and the work W can be heated by the heater.

[0028] Also, as shown in FIGS. 5 and 6(A) and (B), in the present embodiment, the temperature control block 61 has a TIM flow path 612 and a TIM discharge hole 613 for discharging a thermal interface material (TIM) onto the upper surface 611 of the temperature control block 61, and an air flow path 615 and an air discharge hole 616 for ejecting air onto the upper surface 611 of the temperature control block 61. Note that FIG. 6(A) is a plan view of the temperature control block 61 according to the present embodiment, and FIG. 6(B) is a cross-sectional view of the temperature control block 61 according to the present embodiment.

[0029] Specifically, the TIM flow path 612 is a flow path formed inside the temperature control block 61. One end communicates with the TIM discharge hole 613 formed on the upper surface 611 of the temperature control block 61, and the other end communicates with the TIM supply hole 614 formed on the side surface of the temperature control block 61. Also, the TIM flow path 612 is connected to the tube 651 at the TIM supply hole 614, and the tube 651 is connected to the TIM pump 65. Thus, the TIM pumped by the TIM pump 65 passes through the TIM flow path 612 and is discharged from the TIM discharge hole 613 onto the upper surface 611 of the temperature control block 61. In particular, in the present embodiment, with the work W placed on the upper surface 611 of the temperature control block 61, by discharging the TIM onto the upper surface 611 of the temperature control block 61 (between the temperature control block 61 and the work W), the work W can be brought into contact with the upper surface 611 of the temperature control block 61 via the TIM. Therefore, the adhesion between the work W and the temperature control block 61 is enhanced, heat conduction between the work W and the temperature control block 61 becomes easier, and heat can be input to the work W more efficiently.

[0030] In addition, the air flow path 615 is a flow path formed inside the temperature control block 61. One end communicates with an air blowing hole 616 formed on the upper surface of the temperature control block 61, and the other end communicates with an air supply hole 617 opened on the side surface of the temperature control block 61. Further, the air flow path 615 is connected to a tube 661 at the air supply hole 617, and the tube 661 is connected to an air pump 66. Thus, the air blown from the air pump 66 passes through the air flow path 615 and is ejected from the air blowing hole 616. Therefore, even when the workpiece W is adsorbed to the upper surface 611 of the temperature control block 61 by the TIM, the workpiece W can be easily removed from the temperature control block 61.

[0031] In addition, the temperature control block 61 can be configured to be provided with a TIM suction hole for sucking the TIM discharged onto the upper surface 611. The TIM suction hole can be configured to be shared with the TIM discharge hole 613, or a TIM suction hole can be provided separately from the TIM discharge hole 613. Further, the control unit 70 can be configured to control the TIM discharge operation from the TIM discharge hole 613 and the TIM suction operation of the TIM discharged from the TIM suction hole for each workpiece W.

[0032] In addition, in the thermal conductivity measurement device 1 according to the present embodiment, it can be configured to detect an abnormality in the discharge or suction of the TIM. For example, in the present embodiment, the drive unit 50 can be configured to include a sensor that detects a drive amount (the amount of movement in the upward or downward direction of the heating unit 2), and the sensor detects the drive amount from a predetermined fixed position until the heat dissipation surface 25 contacts the workpiece W when measuring the workpiece W, and transmits it to the control unit 70. In this case, the control unit 70 calculates the thickness of the TIM based on the drive amount acquired from the drive unit 50 (for example, calculates as drive amount - thickness of the workpiece W = thickness of the TIM), and determines the thickness of the TIM applied to the workpiece W. Then, when the thickness of the TIM applied to the workpiece W is outside a predetermined range, the control unit 70 can be configured to issue an alarm by an alarm unit (not shown) for reasons such as less TIM or more TIM.

[0033] In addition, a plurality of thermocouples 72 are installed in the temperature control block 61. Specifically, as shown in FIG. 5, a plurality of thermocouples 72 are arranged in parallel on the upper surface 611 of the temperature control block 61. Thereby, the temperature on the lower surface side (heat dissipation side) of the work W placed on the upper surface 611 of the temperature control block 61 can be measured in the plane direction of the upper surface 611 of the temperature control block 61. The temperature data measured by the plurality of thermocouples 72 is output to the control unit 70 and used for calculating the heat conduction performance of the work W. In addition, the temperature data measured by the plurality of thermocouples 72 is output to the control unit 70 and used for controlling the heating / cooling device 63 and the refrigerant circulation device 67 in order to adjust the temperature of the temperature control block 61.

[0034] The control unit 70 controls the operations of the heater 10, the drive unit 50, the heating / cooling device 63, the TIM pump 65, the air pump 66, and the refrigerant circulation device 67 in order to measure the heat conduction performance of the work W. Specifically, the control unit 70 causes the heater 10 to generate heat, drives the heat conductor 20 by the drive unit 50, and brings the heat dissipation surface 25 of the heat dissipation unit 22 into contact with the work W, so that the heat converged by the heat conductor 20 can be applied to the work W. In addition, the control unit 70 controls the operations of the heating / cooling device 63 and the refrigerant circulation device 67 based on the temperature of the temperature control block 61, and maintains the temperature of the work W at a predetermined set temperature. Further, the control unit 70 controls the operation of the TIM pump 65 to supply and recover TIM between the temperature control block 61 and the work W, and controls the operation of the air pump 66, so that the operations of applying TIM to the work W by the operator and wiping off TIM from the work W can be omitted or facilitated, and the operation of the operator removing the work W from the temperature control block 61 can be facilitated.

[0035] Further, the control unit 70 measures the heat conduction performance of the workpiece W. In particular, in the present embodiment, in order to measure the heat conduction performance of the workpiece W with high precision, the control unit 70 acquires temperature data from a plurality of thermocouples 71 installed in the heat dissipation unit 22, calculates the temperature gradient of the heat dissipation unit 22, and thereby calculates the temperature of the heat dissipation surface 25 with high precision. Further, in order to measure the heat conduction performance of the workpiece W with high precision, the control unit 70 acquires temperature data from a plurality of thermocouples 72 to 73 installed in the temperature control unit 60, calculates the temperature gradient of the temperature control unit 60, and thereby calculates the temperature of the upper surface 611 of the temperature control block 61 with high precision. The control unit 70 can calculate the heat conduction performance of the workpiece W with high precision based on the temperature of the heat dissipation surface 25 and the temperature of the upper surface 611 of the temperature control block 61 calculated in this way. Further, the control unit 70 can also determine whether the workpiece W is a good product or a defective product based on the measurement result of the heat conduction performance of the workpiece W. Although details will be described later, the control unit 70 can also be configured to determine whether the workpiece W is a good product or a defective product by determining whether the heat conduction performance of the workpiece W satisfies a predetermined reference value.

[0036] Next, the operation of the heat conduction performance measuring device 1 according to the present embodiment will be described. In the present embodiment, a temperature control process for controlling the temperature of the temperature control block 61 on which the workpiece W is placed to a constant temperature and a measurement process for measuring the heat conduction performance of the workpiece W are performed in parallel. First, based on FIG. 7, the temperature control process according to the present embodiment will be described. FIG. 7 is a flowchart showing the temperature control process according to the present embodiment.

[0037] In step S101, the control unit 70 acquires the temperature data of the temperature control block 61. Specifically, the control unit 70 acquires the temperature data detected by the thermocouple 72 installed on the upper surface 611 of the temperature control block 61 as the temperature data of the temperature control block 61. In this embodiment, as shown in FIG. 5, the upper surface 611 of the temperature control block 61 has a plurality of thermocouples 72, and the average temperature of the temperatures detected by these plurality of thermocouples 72 is acquired as the temperature data of the temperature control block 61. Further, the control unit 70 may be configured to obtain the temperature gradient of the temperature control unit 60 from the average temperature of the plurality of thermocouples 72 and each temperature of the thermocouple 73, and calculate the upper surface temperature of the temperature control block 61.

[0038] Then, in step S102, the control unit 70 determines whether the temperature of the temperature control block 61 acquired in step S101 is equal to or higher than a predetermined set temperature. The set temperature is a temperature determined in advance for measuring the heat conduction performance of the work W, and the operator can appropriately set the set temperature via an input unit (not shown). When the temperature control block 61 is equal to or higher than the predetermined set temperature, the process proceeds to step S103. On the other hand, when the temperature control block 61 is lower than the predetermined set temperature, the process proceeds to step S104.

[0039] In step S103, since the temperature control block 61 is equal to or higher than the set temperature, the control unit 70 performs a process for lowering the temperature of the temperature control block 61. Specifically, the control unit 70 operates the refrigerant circulation device 67 to circulate a refrigerant such as water through the cooling device 64. Thereby, heat exchange is performed between the cooling device 64 and the temperature control block 61 via the heating and cooling device 63 and the heat spreader 62, and the temperature control block 61 can be cooled. Then, the process returns to step S101.

[0040] Also, in step S104, since the temperature control block 61 is below the set temperature, the control unit 70 performs a process to increase the temperature of the temperature control block 61. Specifically, the control unit 70 energizes the heating and cooling device 63 to generate heat in the heating and cooling device 63, thereby heating the temperature control block 61 via the heat spreader 62 to increase the temperature of the temperature control block 61. Further, in addition to the cooling device 64, the control unit 70 can also be configured to energize the Peltier element, which is the heating and cooling device 63, to cool the temperature control block 61. Then, the process returns to step S101.

[0041] Thus, the temperature control process according to the present embodiment cools the temperature control block 61 with the cooling device 64 or heats it with the heating and cooling device 63 so as to maintain the temperature of the temperature control block 61 at a constant set temperature. Thereby, in the thermal conductivity measurement device 1 according to the present embodiment, the temperature control block 61 is not excessively cooled, and the thermal conductivity of the work W can be measured. Therefore, it is possible to shorten the waiting time for waiting for the work W to reach a predetermined temperature, and the measurement efficiency of the work W can be improved (see the examples described later).

[0042] In the example shown in FIG. 7, when the temperature control block 61 is equal to or higher than a predetermined set temperature, the temperature control block 61 is cooled by the cooling device 64 (and the heating and cooling device 63), and when the temperature control block 61 is lower than the predetermined set temperature, the temperature control block 61 is heated by the heating and cooling device 63. However, the present invention is not limited to this configuration. When the temperature control block 61 is equal to or higher than a first target temperature, the control unit 70 may be configured to cool the temperature control block 61 by the cooling device 64 (and the heating and cooling device 63), and when the temperature control block 61 is lower than a second target temperature lower than the first target temperature, the control unit 70 may be configured to heat the temperature control block 61 by the heating and cooling device 63. That is, when the temperature control block 61 deviates from the range between the first target temperature and the second target temperature, the temperature control block 61 can be cooled or heated for temperature control.

[0043] Next, based on FIG. 8, the measurement process of the thermal conductivity characteristics of the workpiece W according to the present embodiment will be described. FIG. 8 is a flowchart showing the measurement process of the thermal conductivity characteristics of the workpiece W according to the present embodiment. As shown in FIG. 8, in step S201, the control unit 70 determines whether or not the workpiece W is set on the temperature control block 61. For example, in the present embodiment, when an operator places the workpiece W on the upper surface of the temperature control block 61 and presses a measurement start button (not shown), the control unit 70 can determine that the workpiece W is set. The control unit 70 waits in step S201 until the workpiece W is set, and proceeds to step S202 when the workpiece W is set.

[0044] In step S202, the control unit 70 supplies TIM to the workpiece W. Specifically, the control unit 70 operates the TIM pump 65 to discharge TIM from a TIM tank (not shown) through the tube 651 and the TIM flow path 612 in the temperature control block 61 from the TIM discharge hole 613. Thereby, TIM is supplied between the upper surface 611 of the temperature control block 61 and the workpiece W, and the adhesion between the workpiece W and the temperature control block 61 can be enhanced.

[0045] In step S203, the control unit 70 inputs heat to the workpiece W. Specifically, the control unit 70 operates the heater 10 to generate heat. Further, the control unit 70 operates the drive unit 50 to move the heating unit 2 downward until the heat dissipation surface 25 of the heat conductor 20 contacts the workpiece W. Thereby, the heat generated by the heater 10 is conducted to the heat receiving unit 23 of the heat conductor 20, converges at the heat convergence unit 24, then conducts through the heat dissipation unit 22, and heat is input from the heat dissipation surface 25 of the heat dissipation unit 22 to the workpiece W. In step S203, the control unit 70 determines whether there is an abnormality in the thickness of the TIM based on the moving amount of the heating unit 2 by the drive unit 50. When the driving amount of the heating unit 2 is outside the predetermined range, it is determined that there is an abnormality that the TIM is too much or too little, and an alarm can be output to an alarm unit (not shown).

[0046] In step S204, the control unit 70 measures the heat conduction performance of the workpiece W. For example, based on the temperature data of a plurality of thermocouples 71 provided in the heat dissipation unit 22, the control unit 70 obtains the temperature gradient of the heat dissipation unit 22, and based on the temperature data of a plurality of thermocouples 72, 73 provided in the temperature control unit 60, obtains the temperature gradient of the temperature control unit 60. Note that the control unit 70 may be configured to obtain the average temperature of the plurality of thermocouples 72 as the temperature at the height position of the thermocouple 72, and obtain the temperature gradient of the temperature control unit 60 from the average temperature of the thermocouple 72 and each temperature of the thermocouple 73. Then, the control unit 70 calculates the temperature T1 of the heat dissipation surface 25 of the heat dissipation unit 22 from the temperature gradient of the heat dissipation unit 22, and calculates the temperature T2 of the upper surface of the temperature control block 61 from the temperature gradient of the temperature control unit 60. Further, as shown in the following formula, the control unit 70 calculates the temperature T1 of the heat dissipation surface 25, the temperature T2 of the upper surface of the temperature control block 61, and the heat input amount Q of the heater 10 In (for example, 1000 W / cm 2 ) based on which, the thermal resistance R of the workpiece W, which is one of the heat conduction performances of the workpiece W W can be calculated. [Number] Note that the heat conduction performance measuring device 1 has been exemplified as having a configuration for calculating the thermal resistance as the heat conduction performance, but is not limited to this configuration, and may also have a configuration for measuring other heat conduction performances such as the thermal conductivity. Also, the method for measuring the heat conduction performance is not limited to the above, and the heat conduction performance can be appropriately measured by a known measuring method.

[0047] In step S205, the control unit 70 performs a process for removing the workpiece W. Specifically, the control unit 70 causes the driving unit 50 to move the heating unit 2 upward and move the heat conductor 20 to a predetermined height position. As a result, the upper surface 611 of the temperature control block 61 is exposed, and the operator can take out the workpiece W for which the measurement has been completed from the upper surface 611 of the temperature control block 61. Further, in the present embodiment, the control unit 70 can also operate the TIM pump 65 to recover the TIM supplied to the upper surface 611 of the temperature control block 61. Furthermore, the control unit 70 operates the air pump 66 to eject air from the air ejection holes 616 through the tube 661 and the air flow path 615. Thereby, even when the workpiece W is in close contact with the upper surface 611 of the temperature control block 61 by the TIM, the workpiece W can be easily removed from the temperature control block 61. In this way, by taking out the workpiece W for which the measurement has been completed, the measurement process of the heat conduction performance of the workpiece W shown in FIG. 8 is completed. Note that the operator can directly place a new workpiece W on the upper surface 611 of the temperature control block 61 and measure the heat conduction performance of the workpiece W. In this case, the process returns to step S201.

[0048] Note that in the present embodiment, as described above, since the measurement process of the heat conduction performance of the workpiece W and the temperature control process are performed in parallel, even if the temperature control block 61 is heated in steps S202 and S203, the temperature control block 61 can be cooled to prevent excessive heating of the temperature control block 61. Further, in the present embodiment, when the cooling of the temperature control block 61 is excessively performed and the temperature of the temperature control block 61 is lower than the set temperature, heating by the heating and cooling device 63 is performed. Therefore, when continuously measuring the heat conduction performance of the workpiece W, even if the temperature of the workpiece W is lower than the temperature suitable for measurement, the temperature of the workpiece W can be quickly raised to the temperature suitable for measurement.

Example

[0049] Next, an example of the thermal conductivity performance measuring apparatus 1 according to the present embodiment will be described. In this example, using the thermal conductivity performance measuring apparatus 1 according to the present embodiment, the thermal resistance value, which is one of the thermal conductivity performances, was measured for (1) a copper plate, (2) a normal product of a flat heat pipe, and (3) a defective product of a flat heat pipe as the work W. Note that, for (2) and (3), normal products and defective products of the flat heat pipes that had been previously determined to be normal and defective were used. FIG. 9 is a graph showing the measurement results of the thermal conductivity performance in this example. In the example shown in FIG. 9, the control unit 70 repeatedly calculates the thermal resistance value of the work W, and when the thermal resistance value after a certain time from when the heat dissipation surface 25 of the heat dissipation unit 22 is brought into contact with the work W to input heat is lower than a predetermined reference value, it is determined to be a non-defective product with no abnormality in the thermal conductivity performance. When the thermal resistance value after a certain time is higher than the predetermined reference value, it is determined to be a defective product with an abnormality in the thermal conductivity performance. The reference value was set based on the thermal resistance value of the copper plate.

[0050] Also, in the example shown in FIG. 9, for (1) the copper plate, the thermal resistance value was measured only once. For (2) the normal product of the flat heat pipe and (3) the defective product of the flat heat pipe, the thermal resistance value was measured three times to improve the measurement accuracy. If the thermal resistance value exceeded the reference value even once, it was determined that there was an abnormality. Also, in the example shown in FIG. 9, the thermal resistance values were measured in the order of the copper plate, the normal product of the flat heat pipe, and the defective product of the flat heat pipe. The thermal resistance values were measured for 3 copper plates, 3 normal products of the flat heat pipes, and 3 defective products of the flat heat pipes, respectively. In FIG. 9, the measurement results of the thermal resistance value of the copper plate are shown as C1 to C3, the measurement results of the thermal resistance value of the normal product of the flat heat pipe are shown as WG1 to WG3, and the measurement results of the thermal resistance value of the defective product of the flat heat pipe are shown as WR1 to WR3.

[0051] As shown in Fig. 9, in the case of normal products of the (2) flat heat pipe, all three (WG1 to WG3) had heat resistance values below the reference value in all three measurements and were determined to be non-defective products. Also, in the case of defective products of the (3) flat heat pipe, all three (WR1 to WR3) had heat resistance values exceeding the reference value in at least one of the three measurements (for example, in the second WR2, the heat resistance value exceeded the reference value in the second measurement), and all were determined to be defective products. Thus, in the heat conduction performance measurement apparatus 1 according to the present embodiment, the heat conduction performance of the work W can be appropriately measured, and based on the measurement result of the heat conduction performance, it was possible to appropriately determine whether the work W is a non-defective product or not.

[0052] Also, in the embodiment shown in Fig. 10, the relationship between the temperature control process of the temperature control block 61 and the measurement time of the heat conduction performance was verified. That is, using each of a copper plate (indicated by C4 in Fig. 10) and a normal product of a flat heat pipe (indicated by WG4 in Fig. 10), the measurement time Tt required for measuring the heat conduction performance (heat resistance value) was verified in the case where no temperature control process was performed and in the case where a temperature control process was performed. In this embodiment, the heater 10 was caused to generate heat at 170 W, and the time from the time Ts when heat input to the work W was started to the time Te when the heat input amount and the temperature (Tave) of the upper surface 611 of the temperature control block 61 became stable was detected as the measurement time Tt. In this embodiment, the time Te when the heat input amount and the temperature (Tave) of the upper surface 611 of the temperature control block 61 became stable was defined as the time when the temperature (Tave) of the upper surface 611 of the temperature control block 61 was within ±0.2% / 10 seconds of the set value and the heat input amount was within ±1.0% / 10 seconds of the set value, but it is not limited thereto.

[0053] Among the examples shown in Fig. 10, when using the copper plate C4, without temperature adjustment treatment, the temperature of the temperature adjustment block 61 was 20°C, but with temperature adjustment treatment, the temperature of the temperature adjustment block 61 was 36°C due to preheating. When 170 W of heat was input to the copper plate C4, regardless of the presence or absence of temperature adjustment treatment, the temperature of the heat dissipation surface 25 of the heat conductor 20 in contact with the copper plate C4 rose to 83°C and stabilized at 83°C, and the temperature of the temperature adjustment block 61 stabilized at 45°C. However, without temperature adjustment treatment, it took 542 seconds for the temperature of the heat dissipation surface 25 of the heat conductor 20 in contact with the copper plate C4 and the temperature of the temperature adjustment block 61 to stabilize. On the other hand, with temperature adjustment treatment, it took 60 seconds for the temperature of the heat dissipation surface 25 of the heat conductor 20 in contact with the copper plate C4 and the temperature of the temperature adjustment block 61 to stabilize.

[0054] Furthermore, among the examples shown in Fig. 10, when using the normal product WG4 of the flat heat pipe as the workpiece W, without temperature adjustment treatment, the temperature of the temperature adjustment block 61 was 30°C, and with temperature adjustment treatment, the temperature of the temperature adjustment block 61 was 40°C due to preheating. When 170 W of heat was input to the normal product WG4 of the flat heat pipe, the stable temperatures differed depending on the presence or absence of temperature adjustment treatment. Without temperature adjustment treatment, the temperature of the heat dissipation surface 25 of the heat conductor 20 in contact with the normal product WG4 of the flat heat pipe stabilized at 83°C, and the temperature of the temperature adjustment block 61 stabilized at 45°C. On the other hand, with temperature adjustment treatment, the temperature of the heat dissipation surface 25 of the heat conductor 20 in contact with the normal product WG4 of the flat heat pipe stabilized at 80°C, and the temperature of the temperature adjustment block 61 stabilized at 45°C. Also, without temperature adjustment treatment, it took 302 seconds for the temperature of the heat dissipation surface 25 of the heat conductor 20 in contact with the normal product WG4 of the flat heat pipe and the temperature of the temperature adjustment block 61 to stabilize. On the other hand, with temperature adjustment treatment, it took 55 seconds for the temperature of the heat dissipation surface 25 of the heat conductor 20 in contact with the normal product WG4 of the flat heat pipe and the temperature of the temperature adjustment block 61 to stabilize.

[0055] In this way, by performing a temperature control process for pre-adjusting the temperature of the temperature control block 61, the temperature of the workpiece W can be stabilized, and the waiting time until the thermal conductivity performance of the workpiece W can be measured can be shortened, and it has been found that the measurement time Tt in the case of repeatedly measuring the thermal conductivity performance of a plurality of workpieces W can be significantly shortened. Further, in this embodiment, in the normal product WG4 of the flat heat pipe, when the temperature control process was not performed, the thermal resistance value R at the measurement time of 302 seconds was 0.228 ° C / W, but the thermal resistance value R at the measurement time of 2400 seconds was 0.220 ° C / W, and the measured thermal resistance value R did not stabilize even after a long time had passed. However, when the temperature control process was performed, after the measurement time of 55 seconds, the thermal resistance value R fluctuated only within the range of ±0.001 ° C / W, and it was also found that the measurement result of the thermal resistance value R was stabilized.

[0056] As described above, the thermal conductivity performance measuring device 1 according to the present embodiment includes a heating unit 2 that heats the work W, a temperature control unit 60 provided opposite to the heating unit 2 and having a temperature control block 61 that contacts the work W, a drive unit 50 that adjusts the distance between the heating unit 2 and the temperature control unit 60, and a control unit 70 that measures the temperature of the work W or the temperature control unit 60. Further, the heating unit 2 according to the present embodiment has a heat conductor 20, and the heat conductor 20 includes a heat receiving portion 23 having a heat receiving surface 23a that receives heat from the heater 10, a heat convergence portion 24 that is continuous with the heat receiving portion 23 and has a tapered shape that becomes thinner in a direction away from the heat receiving portion 23, and a heat radiating portion 22 that has a columnar structure extending from an end of the heat convergence portion 24 and transfers heat by bringing the tip of the columnar structure into contact with the work. The cross-sectional area in a direction orthogonal to the extending direction of the columnar structure is smaller than the cross-sectional area in the orthogonal direction of the heat receiving portion 23. Thereby, in the thermal conductivity performance measuring device 1 according to the present embodiment, the heat of the heater 10 input to the heat receiving member 21 can be converged by the heat radiating portion 22. As a result, heat with a high heat flux can be efficiently input to the work W from the heat radiating portion 22 with an arbitrary area and shape and a high amount of heat. That is, in a conventional thermal conductivity performance measuring device (for example, the thermal conductivity performance measuring device of Patent Document 1), since the heating-side clamping member has a cylindrical shape and its cross-sectional area is uniform, the heat introduced from the heat source into the heating-side clamping member is conducted through the heating-side clamping member without converging, and there are cases where heat cannot be efficiently input to the heat radiating member that is the measurement object. However, in the thermal conductivity performance measuring device 1 according to the present embodiment, by converging the heat of the heater 10 input to the heat receiving member 21 by the heat radiating portion 22, it becomes possible to efficiently input heat with a higher heat flux from the heat radiating portion 22 to the work W than in the past. Further, in the present embodiment, the area and shape of the cross-section of the heat radiating portion 22 can be arbitrarily changed, whereby it is possible to give the work W a heat spot with an area, shape, and / or amount of heat according to the usage situation of the work W, and it is also possible to appropriately measure the thermal conductivity of the work W according to the usage situation of the work W.

[0057] 《Second Embodiment》 Next, a second embodiment of the present invention will be described. In the above-described embodiment, the present invention has been described by exemplifying the thermal conductivity measurement device 1 for measuring the thermal conductivity performance of the work W. However, the present invention is not limited to the thermal conductivity measurement device 1 for measuring the thermal conductivity performance of the work W, and can be applied to a test device for evaluating other performances of the work W or a processing device such as a heat treatment device for heat-treating the work W. For example, when evaluating the work W or processing the work W, a liquid (agent) according to the purpose may be applied to the work W. Such an application operation is troublesome when performed manually, and there are problems such as an error in the application amount. In addition, when the work W is picked up from the workbench after the evaluation test or the processing, there is also a problem that the work W with the liquid applied thereto adheres to the workbench and is difficult to pick up. In view of such problems, it is an issue to improve the working efficiency when testing or processing the work W. In the first embodiment described above, in the temperature control block 61, the TIM can be applied to the work W by discharging the TIM from the TIM discharge hole 613, and the TIM adhered to the temperature control block 61 can be easily removed by ejecting air from the air ejection hole 616. Also in the second embodiment of the present invention, similar to the first embodiment, the above problems can be solved by discharging the agent and ejecting air on the mounting table on which the work W is mounted. In the following, the second embodiment of the present invention will be described by exemplifying a heat treatment device 1a for processing and manufacturing the work W by introducing the heat of the heater 10 into the work W such as metal. In the heat treatment device 1a according to the second embodiment, the description of the same configuration as that of the thermal conductivity measurement device 1 according to the first embodiment will be omitted, and the different parts will be described in detail.

[0058] The heat treatment apparatus 1a according to the second embodiment has a mounting table 81 instead of the temperature control block 61 according to the first embodiment. FIG. 11 is a configuration diagram showing the mounting table 81 according to the second embodiment. The mounting table 81 is a table on which the workpiece W is mounted, and can have the same configuration as the temperature control block 61 according to the first embodiment. However, in the second embodiment, the mounting table 81 may be configured to control the temperature of the workpiece W, or may not be configured to control the temperature. That is, the mounting table 81 can be used alone without being combined with the heating and cooling device 63 or the cooling device 64 in the first embodiment.

[0059] As shown in FIG. 11, the mounting table 81 includes a mounting surface 811 for mounting the workpiece W on the upper surface, and inside, a liquid flow path 812 and a gas flow path 815. Further, a liquid discharge hole 813 communicating with the first end side of the liquid flow path 812 is provided in the mounting surface 811. Furthermore, a liquid supply hole 814 communicating with the second end side of the liquid flow path 812 is provided on the side surface (main body surface) of the mounting table 81. In the example shown in FIG. 11, a configuration having a single liquid discharge hole 813 and a single liquid supply hole 814 is illustrated, but the configuration is not limited thereto. For example, a configuration having a plurality of liquid discharge holes 813 and / or a plurality of liquid supply holes 814 can be adopted.

[0060] Also, a gas blowing hole 816 communicating with the first end side of the internal gas flow path 815 is provided in the mounting surface 811. Further, a gas supply hole 817 communicating with the second end side of the gas flow path 815 is provided on the side surface (main body surface) of the mounting table 81. In the example shown in FIG. 11, a configuration having a single gas blowing hole 816 and a single gas supply hole 817 is illustrated, but the configuration is not limited thereto. For example, a configuration having a plurality of gas blowing holes 816 and / or a plurality of gas supply holes 817 can be adopted.

[0061] Also, since the workpiece W is often placed near the center of the placement surface 811, it is preferable in terms of work efficiency that the liquid discharge holes 813 and the gas blow holes 816 are provided at positions closer to the center of the placement surface 811 than to the outer edge of the placement surface 811. However, they may be provided on the outer edge side of the placement surface 811 so as not to interfere during testing or processing. Alternatively, one of the liquid discharge holes 813 and the gas blow holes 816 may be provided on the center side of the placement surface 811, and the other may be provided on the outer edge side of the placement surface 811.

[0062] Also, in the second embodiment as well, the placement surface 811 of the mounting table 81 may have a liquid supply device for supplying liquid and a gas supply device for supplying gas, and may also have an operation unit for the user to instruct the operations of the liquid supply device and the gas supply device, and a control unit for controlling the operations. The liquid supply device (also referred to as a liquid pump) may be a positive displacement pump (for example, a reciprocating pump such as a plunger pump or a piston pump, a tube pump, a gear pump, a vane pump, a screw pump, etc.), a non-positive displacement pump (a centrifugal pump such as a volute pump or a turbine pump, a propeller pump such as an axial flow pump or a mixed flow pump, a viscous pump such as a cascade pump, etc.). However, as long as it can supply liquid, it is not limited to these. Further, a flow meter sensor may be attached to the liquid supply device to stably supply a predetermined amount of liquid. The gas supply device (also referred to as an air pump) may include a compression pump and a vacuum pump. However, as long as it can supply gas, it is not limited to these.

[0063] Also, in the second embodiment, the placement surface 811 may be configured to be provided with a liquid suction hole communicating with the first end side of the liquid suction flow path inside the mounting table 81, and a liquid suction access hole communicating with the second end side of the liquid suction flow path may be provided on the side surface (the main body surface). Further, the liquid suction hole may be configured to be shared with the liquid discharge hole 813, or a liquid suction hole may be provided separately from the liquid discharge hole 813.

[0064] In the second embodiment, the heat treatment apparatus 1a can be configured to perform a process of coating the surface of the workpiece W. In this case, the mounting table 81 can supply a coating agent for coating the workpiece W placed on the mounting table 81 from a liquid pump to the mounting table 81 via the tube 851, and discharge it from the liquid discharge holes 813 via the liquid flow path 812. The coating agent is not particularly limited, and examples thereof include a coating agent containing a water repellent, an antibacterial agent, a photocatalyst, silicon, or a fluororesin. Further, the heat treatment apparatus 1a can be configured to perform a process of polishing the workpiece W. In this case, the mounting table 81 can supply an abrasive for polishing the workpiece W placed on the mounting table 81 from a liquid pump to the mounting table 81 via the tube 851, and discharge it from the liquid discharge holes 813 via the liquid flow path 812. The abrasive is also not particularly limited, and examples thereof include abrasives containing silica, diamond, boron nitride, silicon carbide, aluminum(III) oxide, chromium oxide, iron(II) oxide, alumina, etc. as abrasive grains.

[0065] Also, in the first embodiment, the temperature near the upper surface 611 of the temperature control block 61 was detected by the thermocouple 72. In the second embodiment, a temperature sensor such as a contact type temperature sensor such as a platinum resistance thermometer or a thermistor, or a non-contact type temperature sensor such as a thermograph can be used to measure the temperature near the mounting surface 811 of the mounting table 81.

[0066] Note that the mounting table 81 is preferably made of a material with good thermal conductivity in order to warm the liquid agent, and can be configured to heat the mounting table 81 using a heater or a Peltier element. Further, the mounting table 81 can also be configured to have a thermocouple or a temperature sensor for managing the temperature of the liquid agent.

[0067] As described above, in the heat treatment apparatus 1a according to the second embodiment, similar to the heat conduction performance measuring apparatus 1 according to the first embodiment, the heat generated by the heater 10 is converged at the heat convergence portion 24 of the heat conductor 20, and heat can be efficiently input to the workpiece W. Therefore, the workpiece W can be heated to a predetermined temperature in a short time. Further, in the heat treatment apparatus 1a according to the second embodiment, since the liquid agent used for processing and manufacturing the workpiece W can be provided around the workpiece W at an appropriate temperature, the processing and manufacturing of the workpiece W can be performed more efficiently.

[0068] Note that the mounting table 81 according to the second embodiment can be applied not only to the heat treatment apparatus 1a having the heating unit 2 but also to a processing apparatus not having the heating unit 2. For example, as described above, it can be applied to a processing apparatus that performs a coating process or a polishing process by mounting the workpiece W on the mounting table 81 and supplying a coating agent or a polishing agent to the workpiece W. Further, it is also possible to dry the workpiece W by blowing hot air from the gas blowing holes 816 of the mounting table 81.

[0069] As described above, the preferred embodiments of the present invention have been described. However, the technical scope of the present invention is not limited to the description of the above embodiments. Various changes and improvements can be made to the above embodiments, and forms with such changes or improvements are also included in the technical scope of the present invention.

[0070] For example, in the above-described embodiment, a connecting device having a plurality of shafts around the heater 10 is exemplified. However, the present invention is not limited to this configuration, and it may be configured to have one shaft at the center of the upper surface of the heat conductor 20, or may be configured to have a donut-shaped or annular connecting member instead of the shaft.

[0071] Further, in the above-described embodiment, a configuration in which the temperature control unit 60 is disposed below the heating unit 2 is exemplified. However, a configuration in which the temperature control unit 60 is disposed above the heating unit 2 may be adopted, or a configuration in which the temperature control unit 60 is disposed on the side of the heating unit 2 may be adopted.

[0072] Furthermore, in the above-described embodiment, the heat convergence portion 24 of the heat conductor 20 has been exemplified as having a tapered structure. However, the heat convergence portion 24 is not limited to a tapered shape as long as it becomes narrower in the direction away from the heat receiving portion 23. For example, as shown in FIG. 12(A), a configuration in which a part of the heat convergence portion 24a has a cylindrical shape (a configuration in which a part extends vertically) can also be adopted. Alternatively, as shown in FIG. 12(B), a configuration in which the heat convergence portion 24b has a step can also be adopted. Note that FIGS. 12(A) and 12(B) are schematic side views showing other embodiments of the heat conductor 20.

Explanation of Reference Numerals

[0073] 1…Heat conduction performance measuring device 2…Heating portion (heating device) 10…Heater 20…Heat conductor 21…Heat receiving member 22…Heat dissipation portion 23…Heat receiving portion 23a…Heat receiving surface 24…Heat convergence portion 25…Heat dissipation surface 26…Fixing portion 30…Heat insulation portion 40…Connecting device 41…Shaft 50…Driving portion (driving device) 60…Temperature control portion (temperature control device) 61…Temperature control block 611…Upper surface 612…TIM flow path 613…TIM discharge hole 614…TIM supply hole 615…Air flow path 616…Air blow hole 617…Air supply hole 62…Heat spreader 63…Heating and cooling device 64…Cooling device 65…TIM pump 651…Tube 66…Air pump 661…Tube 67…Refrigerant circulation device (chiller) 70…Control unit 71~73…Thermocouple 1a…Heat treatment apparatus 81…Placement table 811…Placement surface 812…Liquid flow path 813…Liquid discharge hole 814…Liquid supply hole 815…Gas flow path 816…Gas blowing hole 817…Gas supply hole

Claims

1. A heat receiving part having a heat receiving surface that receives heat from a heat source, A heat convergence part that is continuous with the heat receiving part and has a tapered shape that becomes narrower in a direction away from the heat receiving part, A heat dissipation part having a columnar structure extending in a first direction from an end of the heat convergence part, and transferring heat by bringing a tip of the columnar structure into contact with a workpiece, The heat conductor is characterized in that a cross-sectional area of the columnar structure in a direction orthogonal to the first direction is smaller than a cross-sectional area of the heat receiving part in the orthogonal direction.

2. The heat conductor according to claim 1, wherein the heat receiving part has a rotationally symmetric outer edge in a plan view.

3. The heat conductor according to claim 1, further comprising a fixing part for fixing the heat source disposed on the heat receiving surface of the heat receiving part.

4. A heating device comprising the heat conductor according to any one of claims 1 to 3, a heat source for introducing heat into the heat receiving part, and a plurality of first temperature measuring devices, The heat dissipation part has a substantially uniform cross-sectional area from a root part to a tip part, and the plurality of first temperature measuring devices are arranged along the first direction.

5. The heating device according to claim 4, further comprising a heat insulating member covering at least a side surface of the heat receiving part of the heat conductor.

6. The heating device according to claim 4, A temperature control device provided opposite to the heating device for holding the workpiece, A driving device for adjusting a distance between the heating device and the temperature control device, A second temperature measuring device for measuring a temperature of the workpiece or the temperature control device, A heat treatment device for heating the workpiece by bringing a tip of the heat dissipation part of the heat conductor into contact with a surface of the workpiece opposite to the temperature control device.

7. The heating device further comprises a connecting device for connecting the heating device and the driving device, The heat treatment apparatus according to claim 6, wherein the connecting device includes one or more connecting members connected to the heat receiving portion of the heat conductor at a rotationally symmetric position in a plan view.

8. The heat treatment apparatus according to claim 6, further comprising a sensor for measuring a distance from the heating device to the temperature control device.

9. The heat treatment apparatus according to claim 6, and a computing device that calculates a heat conduction performance of the workpiece based on the temperature of the heating device measured by the plurality of first temperature measuring devices and the temperature of the workpiece or the temperature control device measured by the second temperature measuring device. A heat conduction performance measuring device having the above.

Images