Dielectric substrate and method of forming the same

Abstract

To provide a dielectric substrate for use in a copper-clad laminate structure, and a method of forming the same.SOLUTION: The present disclosure relates to a dielectric substrate that may include a first fluoropolymer based adhesive layer, a polyimide layer overlying the fluoropolymer based adhesive layer, and a first filled polymer layer overlying the polyimide layer. The first filled polymer layer may include a resin matrix component, and a first ceramic filler component. The first ceramic filler component may include a first filler material. The first filler material may further have a mean particle size of about 10 μm or less.SELECTED DRAWING: Figure 2a

Description

Technical Field

[0001] The present disclosure relates to a dielectric substrate and a method for forming the same. Specifically, the present disclosure relates to a dielectric substrate for use in a copper-clad laminate plate structure and a method for forming the same.

Background Art

[0002] A copper-clad laminate (CCL) includes a dielectric material laminated on or between two layers of conductive copper foil. Subsequent operations convert such a CCL into a printed circuit board (PCB). When used to form a PCB, the conductive copper foil is selectively etched to form a circuit having through-holes, and the through-holes are drilled through the layers and metallized, i.e., plated, to establish conductivity between the layers within the multilayer PCB. Therefore, the CCL must exhibit excellent thermomechanical stability. The PCB is also routinely exposed to overly high temperatures during manufacturing operations, such as soldering, and during use. As a result, the PCB must function at continuous temperatures exceeding 200° C. without deformation and withstand very large temperature fluctuations while resisting moisture absorption. The dielectric layer of the CCL functions as a spacer between the conductive layers and can minimize electrical signal loss and crosstalk by interrupting conductivity. The lower the dielectric constant (permittivity) of the dielectric layer, the faster the speed of the electrical signal through the layer. Therefore, a low dissipation factor that depends on temperature and frequency, as well as the polarization rate of the material, is very important for high-frequency applications. Accordingly, improved dielectric materials and dielectric layers that can be used in PCBs and other high-frequency applications are desired. temperatures during manufacturing operations, such as soldering, and during use. As a result, the PCB must function at continuous temperatures exceeding 200° C. without deformation and withstand very large temperature fluctuations while resisting moisture absorption. The dielectric layer of the CCL functions as a spacer between the conductive layers and can minimize electrical signal loss and crosstalk by interrupting conductivity. The lower the dielectric constant (permittivity) of the dielectric layer, the faster the speed of the electrical signal through the layer. Therefore, a low dissipation factor that depends on temperature and frequency, as well as the polarization rate of the material, is very important for high-frequency applications. Accordingly, improved dielectric materials and dielectric layers that can be used in PCBs and other high-frequency applications are desired. temperatures exceeding 200° C. without deformation and withstand very large temperature fluctuations while resisting moisture absorption. The dielectric layer of the CCL functions as a spacer between the conductive layers and can minimize electrical signal loss and crosstalk by interrupting conductivity. The lower the dielectric constant (permittivity) of the dielectric layer, the faster the speed of the electrical signal through the layer. Therefore, a low dissipation factor that depends on temperature and frequency, as well as the polarization rate of the material, is very important for high-frequency applications. Accordingly, improved dielectric materials and dielectric layers that can be used in PCBs and other high-frequency applications are desired. temperatures exceeding 200° C. without deformation and withstand very large temperature fluctuations while resisting moisture absorption. The dielectric layer of the CCL functions as a spacer between the conductive layers and can minimize electrical signal loss and crosstalk by interrupting conductivity. The lower the dielectric constant (permittivity) of the dielectric layer, the faster the speed of the electrical signal through the layer. Therefore, a low dissipation factor that depends on temperature and frequency, as well as the polarization rate of the material, is very important for high-frequency applications. Accordingly, improved dielectric materials and dielectric layers that can be used in PCBs and other high-frequency applications are desired. temperatures exceeding 200° C. without deformation and withstand very large temperature fluctuations while resisting moisture absorption. The dielectric layer of the CCL functions as a spacer between the conductive layers and can minimize electrical signal loss and crosstalk by interrupting conductivity. The lower the dielectric constant (permittivity) of the dielectric layer, the faster the speed of the electrical signal through the layer. Therefore, a low dissipation factor that depends on temperature and frequency, as well as the polarization rate of the material, is very important for high-frequency applications. Accordingly, improved dielectric materials and dielectric layers that can be used in PCBs and other high-frequency applications are desired. temperatures exceeding 200° C. without deformation and withstand very large temperature fluctuations while resisting moisture absorption. The dielectric layer of the CCL functions as a spacer between the conductive layers and can minimize electrical signal loss and crosstalk by interrupting conductivity. The lower the dielectric constant (permittivity) of the dielectric layer, the faster the speed of the electrical signal through the layer. Therefore, a low dissipation factor that depends on temperature and frequency, as well as the polarization rate of the material, is very important for high-frequency applications. Accordingly, improved dielectric materials and dielectric layers that can be used in PCBs and other high-frequency applications are desired. temperatures exceeding 200° C. without deformation and withstand very large temperature fluctuations while resisting moisture absorption. The dielectric layer of the CCL functions as a spacer between the conductive layers and can minimize electrical signal loss and crosstalk by interrupting conductivity. The lower the dielectric constant (permittivity) of the dielectric layer, the faster the speed of the electrical signal through the layer. Therefore, a low dissipation factor that depends on temperature and frequency, as well as the polarization rate of the material, is very important for high-frequency applications. Accordingly, improved dielectric materials and dielectric layers that can be used in PCBs and other high-frequency applications are desired. temperatures exceeding 200° C. without deformation and withstand very large temperature fluctuations while resisting moisture absorption. The dielectric layer of the CCL functions as a spacer between the conductive layers and can minimize electrical signal loss and crosstalk by interrupting conductivity. The lower the dielectric constant (permittivity) of the dielectric layer, the faster the speed of the electrical signal through the layer. Therefore, a low dissipation factor that depends on temperature and frequency, as well as the polarization rate of the material, is very important for high-frequency applications. Accordingly, improved dielectric materials and dielectric layers that can be used in PCBs and other high-frequency applications are desired. temperatures exceeding 200° C. without deformation and withstand very large temperature fluctuations while resisting moisture absorption. The dielectric layer of the CCL functions as a spacer between the conductive layers and can minimize electrical signal loss and crosstalk by interrupting conductivity. The lower the dielectric constant (permittivity) of the dielectric layer, the faster the speed of the electrical signal through the layer. Therefore, a low dissipation factor that depends on temperature and frequency, as well as the polarization rate of the material, is very important for high-frequency applications. Accordingly, improved dielectric materials and dielectric layers that can be used in PCBs and other high-frequency applications are desired.​ Summary of the Invention

[0003] According to a first aspect, the dielectric substrate comprises a first fluoropolymer adhesive layer and a fluoropolymer-based adhesive layer. a polyimide layer overlying the polypolymer-based adhesive layer; and a first filled polymer layer overlying the polyimide layer. The first filled polymer layer may include a resin matrix component and a first ceramic. and a ceramic filler component. The first ceramic filler component may include a first filler. The first filler material may include a filler material having an average particle size of about 10 micrometers or less. It may further have a particle size.

[0004] According to another aspect, the copper clad laminate may include a copper foil layer and a dielectric substrate covering the copper foil layer. The dielectric substrate has a first fluoropolymer adhesive layer and a fluoropolymer adhesive layer. a polyimide layer overlying the layer; and a first filled polymer layer overlying the polyimide layer. The first filled polymer layer can include a resin matrix component and a first ceramic filler component. and the first ceramic filler component includes a first filler material. The first filler material can further have an average particle size of less than or equal to about 10 micrometers. This can be done.

[0005] According to yet another aspect, a printed circuit board includes a copper foil layer and a dielectric substrate covering the copper foil layer. The dielectric substrate may include a first fluoropolymer adhesive layer and a fluoropolymer adhesive layer. a polyimide layer covering the polymeric adhesive layer; and a first filled polymer layer covering the polyimide layer. The first filled polymer layer may include a resin matrix component and a first ceramic. and a ceramic filler component. The first ceramic filler component may include a first filler component. It can include a filler material. The first filler material can further have an average particle size of about 10 micrometers or less.

[0006] According to another aspect, a method of forming a dielectric substrate includes providing a first fluoropolymer-based adhesive layer, providing a polyimide layer covering the first fluoropolymer-based adhesive layer, combining a first resin matrix precursor component and a first ceramic filler precursor component to form a first forming mixture, and forming the first forming mixture in a first filled polymer layer covering the polyimide layer. The first ceramic filler precursor component can include a first filler precursor material. The first filler precursor material can further have an average particle size of about 10 micrometers or less.

[0007] According to yet another aspect, a method of forming a copper-clad laminate can include providing a copper foil and forming a dielectric layer covering the copper foil. Forming the dielectric layer can include providing a first fluoropolymer-based adhesive layer, providing a polyimide layer covering the first fluoropolymer-based adhesive layer, combining a first resin matrix precursor component and a first ceramic filler precursor component to form a first forming mixture, and forming the first forming mixture in a first filled polymer layer covering the polyimide layer. The first ceramic filler precursor component can include a first filler material. The first filler precursor material can further have an average particle size of about 10 micrometers or less.

[0008] ​​​​​​​​​​​​​​​According to yet another aspect, a method of forming a printed circuit board can include providing a copper foil and forming a dielectric layer covering the copper foil. Forming the dielectric layer can include providing a first fluoropolymer-based adhesive layer, providing a polyimide layer covering the first fluoropolymer-based adhesive layer, forming a first forming mixture by combining a first resin matrix precursor component and a first ceramic filler precursor component, and forming the first forming mixture in a first filled polymer layer covering the polyimide layer. The first ceramic filler precursor component can include a first filler material. The first filler precursor material can further have an average particle size of about 10 micrometers or less.

Brief Description of the Drawings

[0009] Embodiments are shown by way of example and are not limited to the accompanying drawings.

Figure 1

Figure 2a

Figure 2b

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Figure 6b

[0010] Those skilled in the art should understand that the elements in the figure are illustrated for the purpose of simplification and clarity and are not necessarily drawn to scale. It should be understood that they are not drawn to scale.

Mode for Carrying Out the Invention

[0011] The following discussion focuses on specific embodiments and implementations of the teachings. The detailed description is provided to assist in explaining the specific embodiments and should not be construed as a limitation on the scope or applicability of the present disclosure or teachings. It will be understood that other embodiments can be used based on the present disclosure and teachings provided herein.

[0012] The terms "comprises", "comprising", "includes", " including", "has", "having", or any other variations thereof are intended to cover non-exclusive inclusion. For example, a method, article, or device that includes a list of features is not necessarily limited to only those features but may include other features not explicitly listed or other features inherent to such a method, article, or device. Further, unless there is a conflicting description, "or" refers to inclusive or and not exclusive or. For example, condition A or B is satisfied by any one of the following: A is true (or exists) and B is false (or does not exist), or A is false (or does not exist) and B is true (or exists). or A is false (or does not exist) and B is true (or exists). For example, condition A or B is satisfied by any one of the following: A is true (or exists) and B is false (or does not exist), or A is false (or does not exist) and B is true (or exists). A is false (or does not exist), B is true (or exists), and both A and B are true (or exist).

[0013] Also, the use of "a" or "an" is employed to describe the elements and components described herein. This is done merely for convenience and to give a general meaning to the scope of the present invention. This description is clearly meant not to mean otherwise, unless one, at least one, or the singular form is understood to include the plural form or vice versa as appropriate. For example, if a single article is described herein, two or more articles can be used instead of the single article. Similarly, if two or more articles are described herein, the two or more articles can be replaced with a single article .

[0014] The embodiments described herein generally relate to a dielectric substrate that can include a first fluoropolymer-based adhesive layer , a polyimide layer covering the fluoropolymer-based adhesive layer, and a first filled polymer layer covering the polyimide layer. The first filled polymer layer can include a first resin matrix component and a first ceramic filler component.

[0015] Referring first to a method of forming a dielectric substrate, FIG. 1 includes a diagram showing a forming method 100 for forming a dielectric substrate according to the embodiments described herein. According to a particular embodiment , the forming method 100 includes a first step 110 of providing a first fluoropolymer-based adhesive layer, a second step 120 of providing a polyimide layer covering the first fluoropolymer-based adhesive layer, and a first resin matrix precursor component and a first ceramic filler precursor component, and a first ceramic filler precursor component​ A third step 130 of forming a first forming mixture by combining with body components, and the first forming mixture is formed in a first filling polymer layer covering the polyimide layer in a fourth step 14 0, can be included.

[0016] According to still other embodiments, the first fluoropolymer-based adhesive layer may have a specific average thickness . For example, the first fluoropolymer-based adhesive layer is at least about 0.2 microns rometer, for example, at least about 0.5 micrometer, or at least about 1.0 m icrometer, or at least about 1.5 micrometers, or at least about 2.0 m icrometer, or at least about 2.5 micrometers, or even at least about 3 .0 micrometers. According to still other embodiments, the average thickness of the first fluoropolymer -based adhesive layer is about 7 micrometers or less, for example, about 6.5 or less, or about 6 .0 or less, or about 5.5 or less, or about 5.0 or less, about 4.9 micrometers or less, or about 4.8 micrometers or less, or about 4.7 micrometers or less, or about 4.6 microns rometer or less, or about 4.5 micrometers or less, or about 4.4 micrometers or less, or about 4.3 micrometers or less, or about 4.2 micrometers or less, or about 4.1 micrometers or less, or about 4.1 micrometers or less, or about 4.0 microns rometer or less, or about 3.9 micrometers or less, or about 3.8 micrometers or less, or about 3.7 micrometers or less, or about 3.6 micrometers or less, or even may be about 3.5 micrometers or less. The first fluoropolymer-based adhesive layer The average thickness may be any value between any of the above-mentioned minimum values and any of the maximum values and including them. It will be understood that it may be any value including them. The average thickness of the first fluoropolymer-based adhesive layer may be between any of the above-mentioned minimum values and any of the maximum values and including them. It will be further understood that it may be within the range including them.

[0017] According to still other embodiments, the first fluoropolymer-based adhesive layer may contain specific materials. For example, the first fluoropolymer-based adhesive layer may be a fluoropolymer (e.g., polytetrafluoroethylene (PTFE), modified polytetrafluoroethylene (mPTFE), fluorinated ethylene-propylene (FEP), etc., copolymers and terpolymers of tetrafluoroethylene, perfluoroalkoxy polymer resin (PFA), and modified perfluoroalkoxy polymer resin (mPFA), and derivatives and blends thereof, but is not limited thereto. According to still other embodiments, the first fluoropolymer-based adhesive layer may be a fluoropolymer (e.g., polytetrafluoroethylene (PTFE), modified polytetrafluoroethylene (mPTFE), fluorinated ethylene-propylene (FEP), etc., copolymers and terpolymers of tetrafluoroethylene, perfluoroalkoxy polymer resin (PFA), and modified perfluoroalkoxy polymer resin (mPFA), and derivatives and blends thereof, but is not limited thereto. The first fluoropolymer-based adhesive layer may be a fluoropolymer (e.g., polytetrafluoroethylene (PTFE), modified polytetrafluoroethylene (mPTFE), fluorinated ethylene-propylene (FEP), etc., copolymers and terpolymers of tetrafluoroethylene, perfluoroalkoxy polymer resin (PFA), and modified perfluoroalkoxy polymer resin (mPFA), and derivatives and blends thereof, but is not limited thereto. It may be composed of PFA), as well as derivatives and blends thereof.

[0018] According to certain embodiments, the first ceramic filler precursor component may have specific properties that can improve the performance of the dielectric substrate formed by Method 100. It can include a first filler precursor material.

[0019] According to certain embodiments, the first filler precursor material may have a specific size distribution. For the purposes of the embodiments described herein, the particle size distribution of the material, e.g., the particle size distribution of the first filler precursor material, can be described using any combination 10 of D 50 and D 90 values from the particle size distribution. The D value from the particle size distribution is defined as the particle size value at which 10% of the particles are smaller than that value 10 and 90% of the particles are larger than that value. The D value from the particle size distribution is defined as the particle size value at which 50% of the particles are smaller than that value and 50% of the particles are larger than that value. 50 The D value from the particle size distribution is defined as the particle size value at which 90% of the particles are smaller than that value and 10% of the particles are larger than that value. For the purposes of the embodiments described herein, the particle size measurement of a specific material is performed using laser diffraction spectroscopy. 90 10% of the particles are larger than that value. For the purposes of the embodiments described herein, the particle size measurement of a specific material is performed using laser diffraction spectroscopy. 10% of the particles are larger than that value. For the purposes of the embodiments described herein, the particle size measurement of a specific material is performed using laser diffraction spectroscopy. For the purposes of the embodiments described herein, the particle size measurement of a specific material is performed using laser diffraction spectroscopy.

[0020] According to certain embodiments, the first filler precursor material may have a specific size distribution D 10 value. For example, for example, the D 10 of the first filler precursor material is at least about 0. 2 micrometers, e.g., at least about 0.3 micrometers, or at least about 0.4 micrometers, or at least about 0.5 micrometers, or at least about 0.6 micrometers, or at least about 0.7 micrometers, or at least about 0.8 micrometers, or at least about 0.9 micrometers, or at least about 1.0 micrometers, or at least about 1.1 micrometers, or even at least about 1.2 micrometers. According to yet other embodiments, the D of the first filling agent material 10 is about 1.6 micrometers or less, for example, about 1.5 micrometers or less, or even about 1.4 micrometers or less. The D of the first filler precursor material 10 may be any value between any of the above minimum values and any of the above maximum values and including them. It will be understood that the D of the first filler precursor material may also be within a range between any of the above minimum values and any of the above maximum values and 10 including them.

[0021] According to other embodiments, the first filler precursor material has a specific size distribution D 50 value. For example, the D of the first filler precursor material is at least about 0.6, or at least 50 about 0.7, or at least about 0.8, or at least about 0.9 micrometers , or at least about 1.0 micrometers, or at least about 1.1 micrometers , or at least about 1.2 micrometers, or at least about 1.3 micrometers , or at least about 1.4 micrometers, or at least about 1.5 micrometers , or at least about 1.6 micrometers, or at least about 1.7 micrometers , or at least about 1.6 micrometers, or at least about 1.7 micrometers , or at least about 1.8 micrometers, or at least about 1.9 micrometers , or at least about 2.0 micrometers, or at least about 2.1 micrometers , or even at least about 2.2 micrometers, etc., may be at least about 0.5 micro meters. According to yet other embodiments, the D of the first filler material 50 is about 2.7 micrometers or less, for example, about 2.6 micrometers or less, or about 2.5 ma icrometers or less, or even about 2.4 micrometers or less. The first D of the filler precursor material 50 may be any value between and including any of the above minimum values and any of the maximum values . It will be understood that the D of the first filler precursor material 50 may further be within and including the range between any of the above minimum values and any of the maximum values.

[0022] According to other embodiments, the first filler precursor material may have a specific size distribution D 90 value. For example, the D of the first filler precursor material is at least about 0.9, or at least 90 about 1.0, or at least about 1.1, or at least about 1.2, or at least about 1.3, or at least about 1.4, or at least about 1.5, or at least about 1.6 micrometers, or at least about 1.7 micrometers, or at least about 1.8 micrometers, or at least about 1.9 micrometers, or at least about 2.0 micrometers, or at least about 2.1 micrometers, or at least about 2.1 micrometers, or at least about 2.2 micrometers, or at least about 2.3 micrometers, or at least about 2.4 micrometers, or at least about 2.5 micrometers, or at least about 2.6 micrometers, or even at least about 2.7 micrometers, etc., at least about 0.8 micrometers may be sufficient. According to still other embodiments, the first filler material D of the material 90 is about 8.0 micrometers or less, for example, about 7.5 micrometers or less , or about 7.0 micrometers or less, or about 6.5 micrometers or less, or about 6. 0 micrometers or less, or about 5.5 micrometers or less, or about 5.4 micrometers or less, or about 5.3 micrometers or less, or about 5.2 micrometers or less, or even about 5.1 micrometers or less may be sufficient. D of the first filler precursor material 90 is understood to be any value between and including any of the above minimum values and any of the above maximum values It will be understood that D of the first filler precursor material 90 is understood to be within and including the range between any of the above minimum values and any of the above maximum values It will be further understood that it may be within.

[0023] According to still other embodiments, the first filler precursor material may have a specific average particle size measured using laser diffraction spectroscopy For example, the average particle size of the first filler precursor material is about 10 micrometers or less, for example, about 9 micrometers or less, or about 8 micrometers or less, or about 7 micrometers or less, or about 6 micrometers or less, Or about 5 micrometers or less, or about 4 micrometers or less, or about 3 micrometers or less The first filler precursor material may be about 2 micrometers or less. The average particle size of the material may be any value between and including any of the values ​​recited above. It will be understood that the average particle size of the first filler precursor material may be within the range of the values ​​given above. It is further understood that the value may be any value in the range between and including the above values. It will be.

[0024] According to yet another embodiment, the first filler precursor material has a particle size distribution span (p The particle size distribution span (PSDS) is described as The first filler precursor material PSDS can be (D 90 -D 10 ) / D 50 Equal to , where D 90 is the D of the first filler precursor material 90 D is equal to the particle size distribution measurement 10 teeth , D of the first filler precursor material 10 D is equal to the particle size distribution measurement 50 Before the first filler D of the core material 50 Equivalent to a particle size distribution measurement. For example, the PSDS of the first filler precursor material is about 5 or less, for example, about 4.5 or less, or about 4.0 or less, or about 3.5 or less, or about 3 The PSDS of the first filler precursor material may be about 0.0 or less, or even about 2.5 or less. may be any value between and including any of the values ​​listed above. It will be understood that the PSDS of the first filler precursor material is within the range between the above values. It will be further understood that the value may be any value inclusive of the values ​​recited above.

[0025] According to still other embodiments, the first filler precursor material is Brunauer-Emm ett-Teller (BET) surface area analysis (nitrogen adsorption) and can be described as having a specific average surface area. For example, the first filler precursor material has an average surface area of about 10 m 2 / g or less, for example, about 7.9 m 2 / g or less, or about 7.5 m 2 / g or less, or about 7.0 m 2 / g or less, or about 6.5 m 2 / g or less, or about 6.0 m 2 / g or less, or is about 5.5 m 2 / g or less, or about 5.0 m 2 / g or less, or about 4.5 m 2 / g or less, or about 4.0 m 2 / g or less, or even about 3.5 m 2 / g or less. According to still other embodiments, the first filler precursor material has an average surface area of at least about 1.2 m 2 / g, for example, at least about 2.2 m 2 / g. The average surface area of the first filler precursor material may be any value between any of the above minimum values and any of the maximum values, or including those values. It will be understood that the average surface area of the first filler precursor material may also be within a range between any of the above minimum values and any of the maximum values, or including those values.

[0026] According to other embodiments, the first filler precursor material may include a specific material. In particular according to certain embodiments, the first filler precursor material may include a silica-based compound. Further According to other embodiments, the first filler precursor material may also be composed of a silica-based compound. According to other embodiments, the first filler precursor material may contain silica. According to still other embodiments, the first filler precursor material may be composed of silica.

[0027] According to still other embodiments, the first forming mixture may contain a specific content of the first ceramic filler precursor component. For example, the content of the first ceramic filler precursor component is at least about 31% by volume, or at least about 32% by volume, or at least about 33% by volume, or at least about 34% by volume, or at least about 35% by volume, or at least about 36% by volume, or at least about 37% by volume, or at least about 38% by volume, or at least about 39% by volume, or at least about 40% by volume, or at least about 41% by volume, or at least about 42% by volume, or at least about 43% by volume is at least about 44% by volume, or at least about 45% by volume, or at least about 46% by volume is at least about 47% by volume, or at least about 48% by volume, or at least about 49% by volume, or at least about 50% by volume, or at least about 51% by volume, or at least about 52% by volume, or at least about 53% by volume, or even at least about 54% by volume, etc., and may be at least about 30% by volume. According to still other embodiments, the content of the first ceramic filler precursor component may be about 57% by volume or less, such as about 56% by volume or less, or even about 55% by volume or less. The content of the first ceramic filler precursor component may be any of the above minimum values and any of the maximum values. According to still other embodiments, the content of the first ceramic filler precursor component is about 57% by volume or less, such as about 56% by volume or less, or even about 55% by volume or less. The content of the first ceramic filler precursor component may be any of the above minimum values and any of the maximum values. The content of the first ceramic filler precursor component is any of the above minimum values and any of the maximum values. It will be understood that the value may be any value between and including the first ceramic. The content of the filler precursor component is between any of the above minimum values ​​and any of the above maximum values. It will be further understood that the range may be between and including:

[0028] According to yet another embodiment, the first ceramic filler precursor component has a specific content of The first filler precursor material may be included. For example, the content of the first filler precursor material may be is at least about 81% by volume based on the total volume of the first ceramic filler precursor component, or is at least about 82% by volume, or at least about 83% by volume, or at least about 84% by volume %, or at least about 85%, or at least about 86%, or at least about 87% by volume. %, or at least about 88%, or at least about 89%, or even at least In yet another embodiment, the amount of the cellulose acetate solution is at least about 80% by volume, such as at least about 90% by volume. The content of the first filler precursor material is calculated by dividing the total volume of the first ceramic filler precursor component by the total volume of the first ceramic filler precursor component. % or less by volume, or about 98% or less by volume, or about 97% or less by volume, 6% by volume or less, or about 95% by volume or less, or about 94% by volume or less, or about 93% by volume or less; Or even about 100% by volume or less, such as about 92% by volume or less. The content of the precursor material is between one of the minimum values ​​and one of the maximum values ​​above. It will be understood that the first filler precursor may be any value inclusive of the above. The content of the body material must be between one of the minimum and maximum values ​​above and It will be further understood that the range may be inclusive.

[0029] According to still other embodiments, the first ceramic filler precursor component may include a second filler precursor material.

[0030] According to still other embodiments, the second filler precursor material may include a specific material . For example, the second filler precursor material may include a high dielectric constant ceramic material, such as a ceramic material having a dielectric constant of at least about 14. According to a specific embodiment, the second filler precursor material may include a high dielectric constant ceramic material, such as TiO2, SrTiO3, Zr Ti2O6, MgTiO3, CaTiO3, BaTiO4, or any combination thereof .

[0031] According to still other embodiments, the second filler precursor material may include TiO2. According to still other embodiments, the second filler precursor material may be composed of TiO2 .

[0032] According to still other embodiments, the first ceramic filler precursor component may include a specific content of the second filler precursor material. For example, the content of the second filler precursor material may be at least about 2 volume %, or at least about 3 volume %, or at least about 4 volume %, or at least about 5 volume %, or at least about 6 volume %, or at least about 7 volume %, or at least about 8 volume %, or at least about 9 volume %, or at least about 10 volume %, etc., of at least about 1 volume % with respect to the total volume of the first ceramic filler precursor component and may be. According to still other embodiments, the content of the second filler precursor material is about 19 volume % or less, or about 18 volume % or less, or about at most about 17 volume % or less, or about 16 volume % or less, or about 15 volume % or less, or about 14 volume % or less, or about 13 volume % or less, or about 12 volume % or less, or about 11 volume % or less, or about 10 volume % or less, or about 9 volume % or less, or about 8 volume % or less, or about 7 volume % or less, or about 6 volume % or less, or about 5 volume % or less, or about 4 volume % or less, or about 3 volume % or less, or about 2 volume % or less, or about 1 volume % or less with respect to the total volume of the first ceramic filler precursor component . According to still other embodiments, the first ceramic filler precursor component may include a specific content of the second filler precursor material. For example, the content of the second filler precursor material may be 17% by volume or less, or about 16% by volume or less, or about 15% by volume or less, or about 14% by volume or less or about 20% by volume or less, such as about 13% by volume or less, or about 12% by volume or less. The content of the second filler precursor material is within the range of any one of the above minimum values ​​and any one of the above maximum values. It will be understood that the value may be any value between and including any of the following: The content of the second filler precursor material is between one of the minimum values ​​and one of the maximum values ​​described above. It will be further understood that the range may be between and including any of the above.

[0033] According to yet another embodiment, the first ceramic filler precursor component has a specific content of For example, the first ceramic filler precursor component may include at least At least about 97%, such as at least about 98%, or even at least about 99%, of amorphous material. The content of amorphous material may be any value between any of the values ​​recited above, It will be understood that the value may include any of the values ​​recited above. The content of may be any value within the range of values ​​stated above, including the values ​​stated above. It will be further understood that

[0034] According to another embodiment, the first resin matrix precursor component comprises a specific material. For example, the first resin matrix precursor component may include a perfluoropolymer. According to yet another embodiment, the first resin matrix precursor component is a perfluoro The insulating layer may be made of a copolymer.

[0035] According to yet another embodiment, the first resin precursor matrix component is a perfluoropoly The mer may include a copolymer of tetrafluoroethylene (TFE), hexa a copolymer of hexafluoropropylene (HFP), a terpolymer of tetrafluoro ethylene (TFE), or any combination thereof. According to other embodiments, the perfluoropolymer of the first resin matrix precursor component may be composed of a copolymer of tetrafluoroethylene (TFE), a copolymer of hexafluoropropylene (HFP), a terpolymer of tetrafluoroethylene (TFE), or any combination thereof. According to still other embodiments, the perfluoropolymer of the first resin matrix

[0036] precursor component may include polytetrafluoroethylene (PTFE), perfluoroalkoxy polymer resin (PFA), fluorinated ethylene propylene (FEP), or any combination thereof. According to still other embodiments, the perfluoropolymer of the first resin matrix precursor component may be composed of polytetrafluoroethylene (PTFE), perfluoroalkoxy polymer resin (PFA), fluorinated ethylene propylene (FEP), or any combination thereof. According to still other embodiments, the first forming mixture may include a

[0037] specific content of the first resin matrix precursor component. For example, the content of the first resin matrix precursor component may be at least about 46 volume %, or at least about 47 volume %, or at least about 48 volume %, or at least about 49 volume %, or at least about 50 volume % based on the total volume of the forming mixture. by volume, or at least about 51% by volume, or at least about 52% by volume, or at least about 53% by volume, or at least about 54% by volume, or even at least about 55% by volume, etc., may be at least about 45% by volume. According to still other embodiments, the content of the first resin matrix precursor component is about 63% by volume or less, or about 62% by volume or less, or about 61% by volume or less, or about 60% by volume or less, or about 59% by volume or less, or about 58% by volume or less, or even about 57% by volume or less, with respect to the total volume of the first forming mixture. It will be understood that the content of the first resin matrix precursor component can be any value between and including any of the above minimum values and any of the above maximum values. It will be further understood that the content of the first resin matrix precursor component can be within the range between and including any of the above minimum values and any of the above maximum values.

[0038] According to still other embodiments, the first forming mixture may contain a specific content of perfluoropoly mer. For example, the content of the perfluoropolymer is at least about 45% by volume, such as at least about 46% by volume, or at least about 47% by volume, or at least about 48% by volume, or at least about 49% by volume, or at least about 50% by volume, or at least about 51% by volume, or at least about 52% by volume, or at least about 53% by volume, or at least about 54% by volume, or even at least about 55% by volume with respect to the total volume of the forming mixture. According to still other embodiments, the content of the perfluoropolymer is about 62% by volume or less, or about 61% by volume or less, or about 60% by volume or less with respect to the total volume of the first forming mixture. Less than or equal to about 59% by volume, or about 58% by volume, or even about 57% by volume etc., can be up to about 63% by volume. The content of the perfluoropolymer is any value between and including any of the above minimum values and any of the above maximum values will be understood. The content of the perfluoropolymer can be within the range between and including any of the above minimum values and any of the above maximum values will be further understood.

[0039] According to still other embodiments, the second step 120 can further include combining a second resin matrix precursor component and a second ceramic filler precursor component to form a second forming mixture . The third step 130 can further include forming the second forming mixture into a second filled polymer layer that covers under the polyimide layer, and providing a second fluoropolymer-based adhesive layer that covers under the second filled polymer layer . can.

[0040] According to still other embodiments, the second fluoropolymer-based adhesive layer can have a specific average thickness . For example, the second fluoropolymer-based adhesive layer can be at least about at least about 0.2 micrometers, for example, at least about 0.5 micrometers, or at least about 1.0 micrometers, or at least about 1.5 micrometers, or at least about 2.0 micrometers, or at least about 2.5 micrometers, or even at least about 3.0 micrometers. According to still other embodiments, the average thickness of the second fluor opolymer-based adhesive layer is about 7 micrometers or less, for example, about 6.5 or less less than, or about 6.0 or less, or about 5.5 or less, or about 5.0 or less, about 4.9 micrometers or less, or about 4.8 micrometers or less, or about 4.7 micrometers or less, or about 4.6 micrometers or less, or about 4.5 micrometers or less, or about 4.4 micro meters or less, or about 4.3 micrometers or less, or about 4.2 micrometers or less, or about 4.1 micrometers or less, or about 4.1 micrometers or less, or about 4.0 micrometers or less, or about 3.9 micrometers or less, or about 3.8 micro meters or less, or about 3.7 micrometers or less, or about 3.6 micrometers or less and may even be about 3.5 micrometers or less. The average thickness of the second fluoropolymer based adhesive layer may be any value between and including any of the above minimum values and any of the above maximum values. It will be understood that the average thickness of the second fluoropolymer based adhesive layer may be within the range between and including any of the above minimum values and any of the above maximum values. It will be further understood that the average thickness of the second fluoropolymer based adhesive layer may be within the range between and including any of the above minimum values and any of the above maximum values.

[0041] According to still other embodiments, the second fluoropolymer-based adhesive layer 207 may contain certain materials. For example, the second fluoropolymer-based adhesive layer 207 may be a fluoropolymer (e.g., polytetrafluoroethylene (PTFE), modified polytetrafluoroethylene (mPTFE), fluorinated ethylene-propylene (FEP), etc., copolymers and terpolymers of tetrafluoroethylene , perfluoroalkoxy polymer resin (PFA), and modified perfluoroalkoxy polymer resin (mPFA), as well as derivatives and blends thereof and their derivatives and blends, It may include a lend. According to still other embodiments, the second fluoropolymer-based adhesive layer 207 may be composed of a fluoropolymer (e.g., polytetrafluoroethylene (PTFE), modified polytetrafluoroethylene (mPTFE), fluorinated ethylene-propylene (FEP) such as copolymers and terpolymers of tetrafluoroethylene, perfluoroalkoxy polymer resin (PFA), and modified perfluoroalkoxy polymer resin (mPFA), and derivatives and blends thereof.

[0042] According to certain embodiments, the second ceramic filler precursor component may have certain properties that can improve the performance of the dielectric substrate formed by forming method 100, and may include a third filler precursor material.

[0043] According to certain embodiments, the third filler precursor material may have a specific size distribution. For the purposes of the embodiments described herein, the particle size distribution of the material, e.g., the particle size distribution of the third filler precursor material, may be described using any combination of particle size distribution D values D , D 10 , D 50 and D 90 . The D value from the particle size distribution is defined as the particle size value at which 10% of the particles are smaller than that value and 90% of the particles are larger than that value. The D 10 value from the particle size distribution is defined as the particle size value at which 50% of the particles are smaller than that value and 50% of the particles are larger than that value. The D value from the particle size distribution is defined as the particle size value at which 90% of the particles are smaller than that value and 10% of the particles are larger than that value. As described herein , the D 50 value is defined as the particle size value at which 50% of the particles are smaller than that value and 50% of the particles are larger than that value. The D value from the particle size distribution is defined as the particle size value at which 90% of the particles are smaller than that value and 10% of the particles are larger than that value. As described herein 90 , the D value is defined as the particle size value at which 90% of the particles are smaller than that value and 10% of the particles are larger than that value. As described herein For the purposes of the embodiments, the particle size measurement of a specific material is performed using laser diffraction spectroscopy.

[0044] According to a particular embodiment, the third filler precursor material may have a specific size distribution D 10 value. For example, the D 10 value of the third filler precursor material is at least about 0.3 micro meter, or at least about 0.4 micrometer, or at least about 0.5 micro meter, or at least about 0.6 micrometer, or at least about 0.7 micro meter, or at least about 0.8 micrometer, or at least about 0.9 micro meter, or at least about 1.0 micrometer, or at least about 1.1 micro meter, or even at least about 1.2 micrometers, etc., may be at least about 0 .2 micrometers. According to yet other embodiments, the D of the third filler material 10 is, for example, about 1.5 micrometers or less, or even about 1.4 micrometers or less, any, may be about 1.6 micrometers or less. The D 10 of the third filler precursor material may be understood to be any value between and including any of the above minimum values and any of the above maximum values. It will be further understood that the D of the third filler precursor material may be within the range between and including any of the above minimum values and any of the above maximum values. 10 is within the range between and including any of the above minimum values and any of the above maximum values. It will be further understood.

[0045] According to other embodiments, the third filler precursor material may have a specific size distribution D 50 value. For example, the D 50 of the third filler precursor material is at least about 0.6 micro meter, or at least about 0.7 micrometer, or at least about 0.8 micro meter, or at least about 0.9 micrometer, or at least about 1.0 micro meter, or at least about 1.1 micrometer, or at least about 1.2 micro meter, or at least about 1.3 micrometer, or at least about 1.4 micro meter, or at least about 1.5 micrometer, or at least about 1.6 micro meter, or at least about 1.7 micrometer, or at least about 1.8 micro meter, or at least about 1.9 micrometer, or at least about 2.0 micro meter, or at least about 2.1 micrometer, or even at least about 2.2 mic rometer and the like, and may be at least about 0.5 micrometer. Further other According to embodiments, the D of the third filler material 50 is about 2.6 micrometers or less, or about 2.5 micrometers or less, or even about 2.4 micrometers or less, such as about 2 .7 micrometers or less. The D of the third filler precursor material 50 is any value between and including any of the above minimum values and any of the above maximum values, and it will be understood that this 50 is possible. The D of the third filler precursor material is within and including the range between and including any of the above minimum values and any of the above maximum values, and it will be further understood that this

[0046] According to other embodiments, the third filler precursor material has a specific size distribution D 90 value and may have. For example, the D of the third filler precursor material 90is at least about 0.9 micrometers or at least about 1.0, or at least about 1.1, or at least about 1.2 or at least about 1.3, or at least about 1.4, or at least about 1.5, or at least about 1.6 micrometers, or at least about 1.7 micrometers, or at least about 1.8 micrometers, or at least about 1.9 micrometers, or at least about 2.0 micrometers, or at least about 2.1 micrometers, or at least about 2.2 micrometers, or at least about 2.3 micrometers, or at least about 2.4 micrometers, or at least about 2.5 micrometers, or at least about 2.6 micrometers, or even at least about 2.7 micrometers, any of which may be at least about 0.8 micrometers. According to still other embodiments the D of the third filler material 90 is about 7.5 micrometers or less, or about 7.0 micrometers or less, or about 6.5 micrometers or less, or about 6.0 micrometers or less or about 5.5 micrometers or less, or about 5.4 micrometers or less, or about 5. 3 micrometers or less, or about 5.2 micrometers or less, or even about 5.1 micro meters or less, etc., and may be about 8.0 micrometers or less. The D of the third filler precursor material 90 is understood to be any value between and including any of the above minimum values and any of the above maximum values. The D of the third filler precursor material 90 is further understood to be within and including the range between any of the above minimum values and any of the above maximum values and including them.

[0047] According to still other embodiments, the third filler precursor material may have a specific average particle size measured using laser diffraction spectroscopy. For example, the average particle size of the third filler precursor material may be about 10 micrometers or less, such as about 9 micrometers or less, or about 8 micrometers or less, or about 7 micrometers or less, or about 6 micrometers or less, or about 5 micrometers or less, or about 4 micrometers or less, or about 3 micrometers or less, or even about 2 micrometers or less. It will be understood that the average particle size of the third filler precursor material can be any value between and including any of the above values. It will be further understood that the average particle size of the third filler precursor material can be within the range between and including any of the above values.

[0048] According to still other embodiments, the third filler precursor material can be described as having a specific particle size distribution span (PSDS), and the PSDS of the third filler precursor material is equal to (D -D 90 -D 10 ) / D 50 , where D 90 is equal to the D 90 particle size distribution measurement value of the third filler precursor material, D 10 is equal to the D 10 particle size distribution measurement value of the third filler precursor material, and D 50 is equal to the D 50 particle size distribution measurement value of the third filler precursor material. For example, the PSDS of the third filler precursor material may be about 5 or less, such as about 4.5 or less, or about 4.0 or less, or about 3 .5 or less, or about 3.0 or less, or even about 2.5 or less. The PSDS of the third filler precursor material can be any value between and including any of the above values. It will be understood that the PSDS of the third filler precursor material may be within a range between and including any of the above values. According to yet other embodiments, the third filler precursor material can be described as having a specific average surface area measured using Brunauer-Emmett-Teller (BET) surface area analysis (nitrogen adsorption). For example, the third filler precursor material can have an average surface area of about 7.9 m² / g or less, or about 7.5 m² / g or less, or about 7.0 m² / g or less, or about 6.5 m² / g or less, or about 6.0 m² / g or less, or about 5.5 m² / g or less, or about 5.0 m² / g or less, or about 4.5 m² / g or less, or about 4.0 m² / g or less, or even about 3.5 m² / g or less, etc., of about 10 m² / g or less. According to yet other embodiments, the third filler precursor material can have an average surface area of at least about 1.2 m² / g, such as at least about 2.4 m² / g. It will be further understood that the average surface area of the third filler precursor material can be any value between and including any of the above minimum and maximum values. The average surface area of the third filler precursor material may be within a range between and including any of the above minimum and maximum values.

[0049] According to yet other embodiments, the third filler precursor material can be described as having a specific average surface area measured using Brunauer-Emmett-Teller (BET) surface area analysis (nitrogen adsorption). For example, the third filler precursor material can have an average surface area of about 7.9 m² / g or less, or about 7.5 m² / g or less, or about 7.0 m² / g or less, or about 6.5 m² / g or less, or about 6.0 m² / g or less, or about 5.5 m² / g or less, or about 5.0 m² / g or less, or about 4.5 m² / g or less, or about 4.0 m² / g or less, or even about 3.5 m² / g or less, etc., of about 10 m² / g or less. According to yet other embodiments, the third filler precursor material can have an average surface area of at least about 1.2 m² / g, such as at least about 2.4 m² / g. / g or less, or about 7.5 m² / g or less, or about 7.0 m² / g or less, or about 6.5 m² / g or less, or about 6.0 m² / g or less, or about 5.5 m² / g or less, or about 5.0 m² / g or less, or about 4.5 m² / g or less, or about 4.0 m² / g or less, or even about 3.5 m² / g or less, etc., of about 10 m² / g or less. 2 / g or less, or about 7.5 m² / g or less, or about 7.0 m² / g or less, or about 6.5 m² / g or less, or about 6.0 m² / g or less, or about 5.5 m² / g or less, or about 5.0 m² / g or less, or about 4.5 m² / g or less, or about 4.0 m² / g or less, or even about 3.5 m² / g or less, etc., of about 10 m² / g or less. 2 / g or less, or about 7.0 m² / g or less, or about 6.5 m² / g or less, or about 6.0 m² / g or less, or about 5.5 m² / g or less, or about 5.0 m² / g or less, or about 4.5 m² / g or less, or about 4.0 m² / g or less, or even about 3.5 m² / g or less, etc., of about 10 m² / g or less. 2 / g or less, or about 6.5 m² / g or less, or about 6.0 m² / g or less, or about 5.5 m² / g or less, or about 5.0 m² / g or less, or about 4.5 m² / g or less, or about 4.0 m² / g or less, or even about 3.5 m² / g or less, etc., of about 10 m² / g or less. m² / g or less, or about 6.0 m² / g or less, or about 5.5 m² / g or less, or about 5.0 m² / g or less, or about 4.5 m² / g or less, or about 4.0 m² / g or less, or even about 3.5 m² / g or less, etc., of about 10 m² / g or less. 2 / g or less, or about 5.5 m² / g or less, or about 5.0 m² / g or less, or about 4.5 m² / g or less, or about 4.0 m² / g or less, or even about 3.5 m² / g or less, etc., of about 10 m² / g or less. 2 / g or less, or about 5.0 m² / g or less, or about 4.5 m² / g or less, or about 4.0 m² / g or less, or even about 3.5 m² / g or less, etc., of about 10 m² / g or less. 2 / g or less, or about 4.5 m² / g or less, or about 4.0 m² / g or less, or even about 3.5 m² / g or less, etc., of about 10 m² / g or less. 2 / g or less, or about 4.0 m² / g or less, or even about 3.5 m² / g or less, etc., of about 10 m² / g or less. 2 / g or less, or even about 3.5 m² / g or less, etc., of about 10 m² / g or less. 2 / g or less, or even about 3.5 m² / g or less, etc., of about 10 m² / g or less. 5 m² / g or less, or even about 3.5 m² / g or less, etc., of about 10 m² / g or less. 2 / g or less, or even about 3.5 m² / g or less, etc., of about 10 m² / g or less. 2 According to yet other embodiments, the third filler precursor material can have an average surface area of at least about 1.2 m² / g, such as at least about 2.4 m² / g. According to yet other embodiments, the third filler precursor material can have an average surface area of at least about 1.2 m² / g, such as at least about 2.4 m² / g. 2 / g, such as at least about 2.4 m² / g. / g, such as at least about 2.4 m² / g. 2 / g, such as at least about 2.4 m² / g. It will be understood that the average surface area of the third filler precursor material can be any value between and including any of the above minimum and maximum values. It will be understood that the average surface area of the third filler precursor material can be any value between and including any of the above minimum and maximum values. It will be further understood that the average surface area of the third filler precursor material can be any value between and including any of the above minimum and maximum values. ​It will be further understood that it is possible.

[0050] According to other embodiments, the third filler precursor material may include a specific material. The specific According to an embodiment, the third filler precursor material may include a silica-based compound. Further According to another embodiment, the third filler precursor material may be composed of a silica-based compound . According to other embodiments, the third filler precursor material may include silica. Further According to another embodiment, the third filler precursor material may be composed of silica.

[0051] According to yet another embodiment, the second forming mixture can include a second ceramic filler precursor component in a specific content. For example, the content of the second ceramic filler precursor component is at least about 31% by volume, or at least about 32% by volume, or at least about 33% by volume, or at least about 34% by volume, or at least about 35% by volume, or at least about 36% by volume, or at least about 37% by volume, or at least about 38% by volume, or at least about 39% by volume, or at least about 40% by volume, or at least about 41% by volume, or at least about 42% by volume, or at least about 43% by volume , or at least about 44% by volume, or at least about 45% by volume, or at least about 46% by volume, or at least about 47% by volume, or at least about 48% by volume, or at least about 4 9% by volume, or at least about 50% by volume, or at least about 51% by volume, or at least about 52% by volume, or at least about 53% by volume, or even at least about 54% by volume, etc. , and may be at least about 30% by volume. According to yet another embodiment, the second ceramic The content of the ceramic filler precursor component is about 56% by volume or less, or even about 55% by volume or less, etc., and may be about 57% by volume or less with respect to the total volume of the second forming mixture. It will be understood that the content of the second ceramic filler precursor component can be any value between and including any of the above minimum values and any of the maximum values. It will be further understood that the content of the second ceramic filler precursor component can be within the range between and including any of the above minimum values and any of the maximum values. The content of the second ceramic filler precursor component is between any of the above minimum values and any of the maximum values and can be within the range including them.

[0052] According to still other embodiments, the second ceramic filler precursor component can include a third filler precursor material having a specific content. For example, the content of the third filler precursor material is at least about 81% by volume, or at least about 82% by volume, or at least about 83% by volume, or at least about 84% by volume with respect to the total volume of the second ceramic filler precursor component, or at least about 85% by volume, or at least about 86% by volume, or at least about 87% by volume or at least about 88% by volume, or at least about 89% by volume, or even at least about 90% by volume, etc., and may be at least about 80% by volume. According to still other embodiments the content of the third filler precursor material is about 99% by volume or less, or about 98% by volume or less, or about 97% by volume or less, or about 9 6% by volume or less, or about 95% by volume or less, or about 94% by volume or less, or about 93% by volume or less or even about 92% by volume or less, etc., and may be about 100% by volume or less with respect to the total volume of the second ceramic filler precursor component. The content of the third filler precursor material is between any of the above minimum values and any of the maximum values and can be within the range including them. The content of the third filler precursor material is between any of the above minimum values and any of the maximum values and can be within the range including them. The content of the third filler precursor material is between any of the above minimum values and any of the maximum values It will be understood that it can be any value including those. The inclusion of the third filler precursor material The amount can be further understood to be within and including any of the above minimum values and any of the maximum values thereof.

[0053] According to yet other embodiments, the second ceramic filler precursor component may include a fourth filler precursor material.

[0054] According to yet other embodiments, the fourth filler precursor material may include specific materials. For example, the fourth filler precursor material can include any high dielectric constant ceramic material having a dielectric constant of at least about 14 thereof. According to a specific embodiment, the fourth filler precursor material can include any high dielectric constant ceramic material such as TiO2, SrTiO3, ZrTi2O6, MgTiO3, CaTiO 3, BaTiO4, or any combination thereof. According to yet other embodiments, the fourth filler precursor material may include TiO2.

[0055] According to yet other embodiments, the fourth filler precursor material may be composed of TiO2. According to yet other embodiments, the fourth filler precursor material may be composed of TiO2.

[0056] According to yet other embodiments, the second ceramic filler precursor component can include a specific content of the fourth filler precursor material. For example, the content of the fourth filler precursor material is at least about 2 volume %, or at least about 3 volume %, or at least about 4 volume %, or at least about 5 volume %, or at least about 6 volume %, or at least about 7 volume %, or at least about 8 volume %, or at least about 9 volume %, or at least about 10 volume %, or at least about 11 volume %, or at least about 12 volume %, or at least about 13 volume %, or at least about 14 volume %, or at least about 15 volume %, or at least about 16 volume %, or at least about 17 volume %, or at least about 18 volume %, or at least about 19 volume %, or at least about 20 volume %, or at least about 21 volume %, or at least about 22 volume %, or at least about 23 volume %, or at least about 24 volume %, or at least about 25 volume %, or at least about 26 volume %, or at least about 27 volume %, or at least about 28 volume %, or at least about 29 volume %, or at least about 30 volume %, or at least about 31 volume %, or at least about 32 volume %, or at least about 33 volume %, or at least about 34 volume %, or at least about 35 volume %, or at least about 36 volume %, or at least about 37 volume %, or at least about 38 volume %, or at least about 39 volume %, or at least about 40 volume %, or at least about 41 volume %, or at least about 42 volume %, or at least about 43 volume %, or at least about 44 volume %, or at least about 45 volume %, or at least about 46 volume %, or at least about 47 volume %, or at least about 48 volume %, or at least about 49 volume %, or at least about 50 volume %, or at least about 51 volume %, or at least about 52 volume %, or at least about 53 volume %, or at least about 54 volume %, or at least about 55 volume %, or at least about 56 volume %, or at least about 57 volume %, or at least about 58 volume %, or at least about 59 volume %, or at least about 60 volume %, or at least about 61 volume %, or at least about 62 volume %, or at least about 63 volume %, or at least about 64 volume %, or at least about 65 volume %, or at least about 66 volume %, or at least about 67 volume %, or at least about 68 volume %, or at least about 69 volume %, or at least about 70 volume %, or at least about 71 volume %, or at least about 72 volume %, or at least about 73 volume %, or at least about 74 volume %, or at least about 75 volume %, or at least about 76 volume %, or at least about 77 volume %, or at least about 78 volume %, or at least about 79 volume %, or at least about 80 volume %, or at least about 81 volume %, or at least about 82 volume %, or at least about 83 volume %, or at least about 84 volume %, or at least about 85 volume %, or at least about 86 volume %, or at least about 87 volume %, or at least about 88 volume %, or at least about 89 volume %, or at least about 90 volume %, or at least about 91 volume %, or at least about 92 volume %, or at least about 93 volume %, or at least about 94 volume %, or at least about 95 volume %, or at least about 96 volume %, or at least about 97 volume %, or at least about 98 volume %, or at least about 99 volume %, or at least about 100 volume % of the total volume of the second ceramic filler precursor component. ​​at least about 1 volume %, such as at least about 9 volume % or at least about 10 volume % may be. According to still other embodiments, the content of the fourth filler precursor material is about 19 volume % or less, or about 18 volume % or less, or about 17 volume % or less, or about 16 volume % or less, or about 15 volume % or less, or about 14 volume % or less, or about 13 volume % or less, or about 12 volume % or less, etc., that is, about 20 volume % or less may be. It will be understood that the content of the fourth filler precursor material can be any value between and including any of the above minimum values and any of the maximum values. The fourth content of the filler precursor material can be further understood to be within and including the range between any of the above minimum values and any of the maximum values. According to still other embodiments, the second ceramic filler precursor component can include an amorphous material in a specific content. For example, the second ceramic filler precursor component can include at least about 97% of amorphous material, such as at least about 98% or even at least about 99%. The content of the amorphous material can be any value between any of the above values,

[0057] and can be a value including any of the above values. It will be understood that the content of the amorphous material can be any value within the range between the above values and can be a value including the above values. According to other embodiments, the second resin matrix precursor component may include a specific material. For example, the second resin matrix precursor component may include a perfluoropolymer.

[0058] It is also possible. According to still other embodiments, the second resin matrix precursor component may be composed of a perfluoro polymer.

[0059] According to still other embodiments, the perfluoropoly mer of the first resin precursor matrix component may include a copolymer of tetrafluoroethylene (TFE), a copolymer of hexafluoropropylene ( HFP), a terpolymer of tetrafluoroethylene (TFE), or any combination thereof. According to other embodiments, the perfluoropoly mer of the second resin matrix precursor component may be composed of a copolymer of tetrafluoroethylene (TFE), a copolymer of hexafluoropropylene (HFP), a terpolymer of tetrafluoroethylene (TF E), or any combination thereof. -ene, a copolymer of hexafluoropropylene (HFP), a terpolymer of tetrafluoroethylene (TF E), or any combination thereof.

[0060] According to still other embodiments, the perfluoropoly mer of the second resin matrix precursor component may include polytetrafluoroethylene (PTFE), perfluoroalkoxy polymer resin (PFA), fluorinated ethylene propylene (FEP), or any combination thereof. According to still other embodiments, the per fluoropolymer of the second resin matrix precursor component may be composed of polytetrafluoroethylene (PTFE), perfluoroalkoxy polymer resin (PFA), fluorinated ethylene propylene (FEP), or any combination thereof. -ene polymer resin (PFA), fluorinated ethylene propylene (FEP), or any combination thereof. According to still other embodiments, the second forming mixture may include a specific content of the second resin matrix

[0061] precursor component. For example, the content of the second resin matrix precursor component can be included. For example, the content of the second resin matrix precursor component The amount is at least about 46% by volume, or at least about 47 % by volume, or at least about 48% by volume, or at least about 49% by volume, or at least about 50% by volume, or at least about 51% by volume, or at least about 52% by volume, or at least also about 53% by volume, or at least about 54% by volume, or even at least about 55% by volume, etc and may be at least about 45% by volume. According to yet other embodiments, the content of the second resin matrix precursor component is about 63% by volume or less, or about 62% by volume or less, or about 61% by volume or less, or about 60% by volume or less, or about 59% by volume or less, or about 58% by volume or less, or even about 57% by volume or less, with respect to the total volume of the second forming mixture. It will be understood that the content of the second resin matrix precursor component can be any value between and including any of the above minimum values and any of the above maximum values. It will be further understood that the content of the second resin matrix precursor component can be within and including the range between any of the above minimum values and any of the above maximum values. According to yet other embodiments, the second forming mixture may contain a specific content of perfluoropoly mer. For example, the content of the perfluoropolymer is at least about 45% by volume, for example, at least about 46% by volume, or at least about

[0062] 47% by volume, or at least about 48% by volume, or at least about 49% by volume, or at least about 50% by volume, or at least about 51% by volume, or at least about 52% by volume, or at least also about 53% by volume, or at least about 54% by volume, or even at least about 55% by volume, with respect to the total volume of the forming mixture. 47% by volume, or at least about 48% by volume, or at least about 49% by volume, or at least about 50% by volume, or at least about 51% by volume, or at least about 52% by volume, or at least also about 53% by volume, or at least about 54% by volume, or even at least about 55% by volume, etc It may be. Further, according to other embodiments, the content of the perfluoropolymer is the second With respect to the total volume of the forming mixture, about 62% by volume or less, or about 61% by volume or less, or about 60% by Volume % or less, or about 59% by volume or less, or about 58% by volume or less, or even about 57% by Volume % or less. The content of the perfluoropolymer may be any value between and including any of the above minimum Values and any of the maximum values. It will be understood that the content of the perfluoropolymer may be any value between and including any of the above minimum Values and any of the maximum values. It will be further understood that the content of the perfluoropolymer may be within the range between and including any of the above minimum Values and any of the maximum values.

[0063] Next, referring to an embodiment of a dielectric substrate formed according to the forming method 100, FIG. 2 a includes a diagram of the dielectric substrate 200. As shown in FIG. 2a, the dielectric substrate 200 includes a first Fluoropolymer-based adhesive layer 203, a polyimide layer 202, and a first filled polymer layer 204 covering the polyimide layer 202. As shown in FIG. 2a, the first filled polymer layer 204 can include a first resin matrix component 210 and a first ceramic Filler component 220.

[0064] According to still other embodiments, the first fluoropolymer-based adhesive layer 203 can have a specific average Thickness. For example, the first fluoropolymer-based adhesive layer 203 is at least about 0.2 micrometers, for example, at least about 0.5 micrometers, or at least Also about 1.0 micrometers, or at least about 1.5 micrometers, or at least Also about 2.0 micrometers, or at least about 2.5 micrometers, or even at least​​ can be at least about 3.0 micrometers. According to still other embodiments, the first full average thickness of the fluoropolymer-based adhesive layer 203 is about 7 micrometers or less, for example, about 6 .5 or less, or about 6.0 or less, or about 5.5 or less, or about 5.0 or less, about 4.9 micrometers or less, or about 4.8 micrometers or less, or about 4.7 micrometers or less , or about 4.6 micrometers or less, or about 4.5 micrometers or less, or about 4. 4 micrometers or less, or about 4.3 micrometers or less, or about 4.2 micrometers or less, or about 4.1 micrometers or less, or about 4.1 micrometers or less, or about 4.0 micrometers or less, or about 3.9 micrometers or less, or about 3.8 micrometers or less, or about 3.7 micrometers or less, or about 3.6 micrometers or less, or even about 3.5 micrometers or less. The average thickness of the first fluoropoly mer-based adhesive layer 203 can be any value between and including any of the above minimum values and any of the above maximum values. It will be understood that the average thickness of the first fluoropolymer-based adhesive layer 203 can be within a range between and including any of the above minimum values and any of the above maximum values. It will be further understood thereof.

[0065] According to still other embodiments, the first fluoropolymer-based adhesive layer 203 can include a specific material. For example, the first fluoropolymer-based adhesive layer 203 can include a fluoropolymer (e.g., polytetrafluoroethylene (PTFE), modified polytetrafluoroethylene (mPTFE), fluorinated ethylene-propylene (FEP), etc. tetrafluoroethylene propylene copolymers and terpolymers of, perfluoroalkoxy polymer resins (PFA), and modified perfluoroalkoxy polymer resins (mPFA), and derivatives and blends thereof may be included. According to further embodiments, the first fluoropolymer-based adhesive layer 203 may be composed of fluoropolymers (e.g., polytetrafluoroethylene (PTFE), modified polytetrafluoroethylene (mPTFE), fluorinated ethylene-propylene (FEP) such as copolymers and terpolymers of tetrafluoroethylene, perfluoroalkoxy polymer resins (PFA), and modified perfluoroalkoxy polymer resins (mPFA), and derivatives and blends thereof.

[0066] According to certain embodiments, the first ceramic filler component 220 may include a first filler material having certain properties that can improve the performance of the dielectric substrate 200 and can be included.

[0067] According to certain embodiments, the first filler material of the first ceramic filler component 220 can have a specific size distribution. For the purposes of the embodiments described herein, the particle size distribution of the material, e.g., the particle size distribution of the first filler material, can be described using any combination of particle size distribution D values, D 10 50 90 and D 10 50 10 value from the particle size distribution is defined as the particle size value at which 10% of the particles are smaller than that value and 90% of the particles are larger than that value and is defined. The D value from the particle size distribution is defined as the particle size value at which 50% of the particles are smaller than that value and 50% of the particles are 50 larger than that value. The D value from the particle size distribution​​90 The value is defined as the particle size value at which 90% of the particles are smaller than that value and 10% of the particles are larger than that value. For the purposes of the embodiments described in this specification, the particle size measurement of a specific material is performed using laser diffraction spectroscopy. According to a specific embodiment, the first filler material of the first ceramic filler component 220 can have a specific size distribution D value. For example, the D

[0068] of the first filler material can be at least about 0.3 micrometers, or at least about 0.4 micrometers, or at least about 0.5 micrometers, or at least about 0.6 micrometers, 10 or at least about 0.7 micrometers, or at least about 0.8 micrometers, 10 or at least about 0.9 micrometers, or at least about 1.0 micrometers, or at least about 1.1 micrometers, or even at least about 1.2 micrometers such as, etc., and can be at least about 0.2 micrometers. According to still other embodiments, the D of the first filler material can be about 1.6 micrometers or less, for example, about 1. 5 micrometers or less, or even about 1.4 micrometers or less. It will be understood that the D of the first filler material can be any value between and including any of the above minimum values and any of the above maximum values. It will be further understood that the D 10 of the first filler material can be within the range between and including any of the above minimum values and any of the above maximum values. The D of the first filler material can be any value between and including any of the above minimum values and any of the above maximum values. 10 It will be understood that the D of the first filler material can be any value between and including any of the above minimum values and any of the above maximum values and within that range. The D 10 of the first filler material can be any value between and including any of the above minimum values and any of the above maximum values and within that range. It will be further understood.

[0069] According to other embodiments, the first filler material of the first ceramic filler component 220 may have a specific size distribution D 50 . For example, the D of the first filler material 50 is at least about 0.6 micrometers, or at least about 0.7 micrometers, or at least about 0.8 micrometers, or at least about 0.9 micrometers, or at least about 1.0 micrometers, or at least about 1.1 micrometers, or at least about 1.2 micrometers, or at least about 1.3 micrometers, or at least about 1.4 micrometers, or at least about 1.5 micrometers, or at least about 1.6 micrometers, or at least about 1.7 micrometers, or at least about 1.8 micrometers, or at least about 1.9 micrometers, or at least about 2.0 micrometers, or at least about 2.1 micrometers, or further is at least about 0.5 micrometers, such as at least about 2.2 micrometers, etc. According to still other embodiments, the D of the first filler material 50 is about 2.7 microns or less, for example, about 2.6 micrometers or less, or about 2.5 micrometers or less, or even about 2.4 or less. The D of the first filler material 50 is any value between and including any of the above minimum values and any of the maximum values . It will be understood that the D of the first filler material 50 is also within the range between and including any of the above minimum values and any of the maximum values . It will be further understood.

[0070] According to another embodiment, the first filler material of the first ceramic filler component 220 may have a specific size distribution D 90 value. For example, the D of the first filler material 90 is at least about 0.9, or at least about 1.0, or at least about 1.1, or at least about 1.2, or at least about 1.3, or at least about 1.4, or at least about 1.5, or at least about 1.6 micrometers, or at least about 1.7 micrometers, or at least about 1.8 micrometers, or at least about 1.9 micrometers, or at least about 2.0 micrometers, or at least about 2.1 micrometers, or at least about 2.2 micrometers, or at least about 2.3 micrometers, or at least about 2.4 micrometers, or at least about 2.5 micrometers, or at least about 2.6 micrometers, or even at least about 2.7 micrometers such as, and may be at least about 0.8 micrometers. According to still other embodiments the D of the first filler material 90 is about 8.0 micrometers or less, for example, about 7. 5 micrometers or less, or about 7.0 micrometers or less, or about 6.5 micrometers or less, or about 6.0 micrometers or less, or about 5.5 micrometers or less, or about 5.4 micrometers or less, or about 5.3 micrometers or less, or about 5.2 micrometers or less, or even about 5.1 micrometers or less. It will be understood that the D of the first filler material 90 may be any value between and including any of the above minimum values and any of the maximum values. The first filler material ​ Material D 90 may be between any of the above minimum values and any of the above maximum values and include them, which will be further understood.

[0071] According to still other embodiments, the first filler material of the first ceramic filler component 220 may have a specific average particle size measured by laser diffraction spectroscopy. For example, the average particle size of the first filler material is about 10 micrometers or less, for example, about 9 micrometers or less, or about 8 micrometers or less, or about 7 micrometers or less, or about 6 micrometers or less, or about 5 micrometers or less, or about 4 micrometers or less, or about 3 micrometers or less, or even about 2 micrometers or less. It will be understood that the average particle size of the first filler material may be any value between any of the above values and include any of the above values. It will be further understood that the average particle size of the first filler material may be any value within the range between the above values and include the above values.

[0072] According to still other embodiments, the first filler material of the first ceramic filler component 220 can be described as having a specific particle size distribution span (PSDS), and the PSD S is equal to (D 90 - D 10 ) / D 50 , where D 90 is equal to the D9 0 particle size distribution measurement value of the first filler material, and D 10 is equal to the D 10 particle size distribution measurement value of the first filler material, and D 50 is the D 50It is equal to the particle size distribution measurement value. For example, the first filler The PSDS of the agent material is about 5 or less, for example, about 4.5 or less, or about 4.0 or less, or about 3. 5 or less, or about 3.0 or less, or even about 2.5 or less. The first filler material The PSDS of may be any value between any of the above values and including any of the above values. It will be understood that the PSDS of the first filler material may be any value within the range between the above values and including the above values. It will be further understood that the PSDS of the first filler material may be any value within the range between the above values and including the above values. will.

[0073] According to still other embodiments, the first filler material of the first ceramic filler component 220 can be described as having a specific average surface area measured using Brunauer-Emmett-Teller (BET) surface area analysis (nitrogen adsorption). For example, the first The filler material of is about 10 m 2 / g or less, for example, about 7.9 m 2 / g or less, or about 7.5 m 2 / g or less, or about 7.0 m 2 / g or less, or about 6.5 m 2 / g or less, or about 6.0 m 2 / g or less, or about 5.5 m 2 / g or less, or about 5.0 m 2 / g or less, or about 4.5 m 2 / g or less, or about 4.0 m 2 / g or less, or even about 3.5 m 2 / g and may have an average surface area of According to still other embodiments, the first filler material has an average surface area of at least about 1.2 m 2 / g, for example, at least about 2.4 m 2 / g. The first filler The average surface area of the material may be between any of the above minimum values and any of the maximum values, or any value including them. It will be understood that the average surface area of the first filler material may also be within a range between any of the above minimum values and any of the maximum values and including them.

[0074] According to other embodiments, the first filler material of the first ceramic filler component 220 may include certain materials. According to a particular embodiment, the first filler material may include a silica based compound. According to still other embodiments, the first filler material may be composed of a silica-based compound. According to other embodiments, the first filler material may include silica. According to still other embodiments, the first filler material may be composed of silica.

[0075] According to still other embodiments, the first filled polymer layer 204 may include a specific content of the first ceramic filler component 220. For example, the content of the ceramic filler component 220 is at least about 31 volume %, or at least about 32 volume %, or at least about 33 volume %, or at least about 34 volume %, or at least about 35 volume %, or at least about 36 volume %, or at least about 37 volume %, or at least about 38 volume %, or at least about 39 volume %, or at least about 40 volume %, or at least about 41 volume %, or at least about 42 volume %, or at least also about 43 volume %, or at least about 44 volume %, or at least about 45 volume %, or at least also about 46 volume %, or at least about 47 volume %, or at least about 48 volume %, or at least about 49 volume %, or at least about 50 volume %, or at least about 51 volume %, or at least about 52 At least about 49% by volume, or at least about 50% by volume, or at least about 51% by volume, or at least about 52% by volume, or at least about 53% by volume, or even at least about 5 4% by volume, etc., may be at least about 30% by volume. According to still other embodiments, the content of the ceramic filler component 220 is relative to the total volume of the first filled polymer layer 204 , about 57% by volume or less, or even about 55% by volume or less, etc., may be about 57% by volume or less as well. It is understood that the content of the ceramic filler component 220 may be any value between and including any of the above minimum values and the maximum value thereof. It is further understood that the content of the ceramic filler component 220 may be within the range between and including any of the above minimum values and the maximum value thereof. Thereof. will.

[0076] According to still other embodiments, the first ceramic filler component 220 can include a first filler material having a specific content. For example, the content of the first filler material is, relative to the total volume of the first ceramic filler component 220, at least about 80% by volume, for example, at least about 81% by volume, or at least about 82% by volume, or at least about 83% by volume, or at least about 84% by volume, or at least about 85% by volume, or at least about 86% by volume, or at least about 87% by volume, or at least about 88% by volume, or at least about 89% by volume , or even at least about 90% by volume may be. According to still other embodiments, the content of the first filler material is, relative to the total volume of the first ceramic filler component 220, about 10 0% by volume or less, for example, about 99% by volume or less, or about 98% by volume or less, or about 97% by volume or less , etc. as well. lower, or about 96% by volume or less, or about 95% by volume or less, or about 94% by volume or less, or about 93 % by volume or less, or even about 92% by volume or less. The content of the first filler material is , any one of the above minimum values and any one of the maximum values and any value therebetween and including them may be understood. The content of the first filler material is within the range between and including any one of the above minimum values and any one of the maximum values and may be further understood.

[0077] According to still other embodiments, the first ceramic filler component 220 can include a second filler material.

[0078] According to still other embodiments, the second filler material of the first ceramic filler component 220 can include a specific material. For example, the second filler material may include a high dielectric constant ceramic material, for example, a ceramic material having a dielectric constant of at least about 14. According to a specific embodiment, the second filler material of the first ceramic filler component 220 can include any high dielectric constant ceramic material such as TiO 2, SrTiO3, ZrTi2O6, MgTiO3, CaTiO3, BaTiO4, or any combination thereof. According to still other embodiments, the second filler material of the first ceramic filler component 220 can include TiO2. According to still other embodiments, the second filler material may be composed of TiO 2.

[0079] According to still other embodiments, the second filler material of the first ceramic filler component 220 can include a specific content of

[0080] According to still other embodiments, the first ceramic filler component 220 has a specific content of It can contain a second filler material. For example, the content of the second filler material is at least about 1 volume %, such as at least also about 2 volume %, or at least about 3 volume %, or at least about 4 volume %, or at least about 5 volume %, or at least about 6 volume %, or at least about 7 volume %, or at least about 8 volume %, or at least about 9 volume %, or even at least about 10 volume % with respect to the total volume of the first ceramic filler component 220. According to still other embodiments, the content of the second filler material is about 20 volume % or less, such as about 19 volume % or less, or about 1 8 volume % or less, or about 17 volume % or less, or about 16 volume % or less, or about 15 volume % or less, or about 14 volume % or less, or about 13 volume % or less, or about 12 volume % or less with respect to the total volume of the first ceramic filler component 220. It will be understood that the content of the second filler material may be any value between and including any of the above minimum values and any of the above maximum values. It will be further understood that the content of the second filler material may be within and including the range between any of the above minimum values and any of the above maximum values. According to still other embodiments, the first ceramic filler component 220 can contain a specific content of an amorphous material. For example, the first ceramic filler component 220 can contain at least about 97%, such as at least about 98%, or even at least about 99% of the amorphous material. It will be understood that the content of the amorphous material can be any value between any of the above values and can be a value including any of the above values. The content of the amorphous material

[0081] The content may be any value within the range between the above values and may include the above values. This will be further understood.

[0082] According to other embodiments, the first resin matrix component 210 may include specific materials. For example, the first resin matrix component 210 can include a perfluoropolymer. According to still other embodiments, the first resin matrix component 210 may be composed of a perfluoropolymer.

[0083] According to still other embodiments, the perfluoropolymer of the first resin matrix component 210 can include a copolymer of tetrafluoroethylene (TFE), a copolymer of hexafluoropropylene ( HFP), a terpolymer of tetrafluoroethylene (TFE), or any combination thereof. According to other embodiments, the perfluoropolymer of the first resin matrix component 210 may be composed of a copolymer of tetrafluoroethylene (TFE), a copolymer of hexafluoropropylene (HFP), a terpolymer of tetrafluoroethylene (TF E), or any combination thereof.

[0084] According to still other embodiments, the perfluoropolymer of the first resin matrix component 210 can include polytetrafluoroethylene (PTFE), perfluoroalkoxy polymer resin (PFA), fluorinated ethylene propylene (FEP), or any combination thereof. According to still other embodiments, the perfluoropolymer of the first resin matrix component 210 can include polytetrafluoroethylene (PTFE), perfluoroalkyl The coxipolymer resin (PFA), fluorinated ethylene propylene (FEP), or a combination thereof may be composed of any combination.

[0085] According to yet another embodiment, the first filled polymer layer 204 may include a first resin matrix component 210 with a specific content. For example, the content of the first resin matrix component 210 is at least about 45% by volume, for example, at least about 46% by volume, or at least about 47% by volume, or at least about 48% by volume, or at least about 49% by volume, or at least about 50% by volume, or at least about 51% by volume, or at least about 52% by volume, or at least about 53% by volume, or at least about 54% by volume, or even at least about 55% by volume, with respect to the total volume of the first filled polymer layer 204. According to yet another embodiment, the content of the first resin matrix component 210 is about 63% by volume or less, or about 62% by volume or less, or about 61% by volume or less, or about 60% by volume or less, or about 59% by volume or less, or about 58% by volume or less, or even about 57% by volume or less, with respect to the total volume of the first filled polymer layer 204. It will be understood that the content of the first resin matrix component 210 can be any value between and including any of the above minimum values and any of the above maximum values. It will be further understood that the content of the first resin matrix component 210 can be within the range between and including any of the above minimum values and any of the above maximum values.

[0086] According to yet another embodiment, the first filled polymer layer 204 may include a specific content of perfluoro polymer. For example, the content of the perfluoropolymer is the first filled At least about 45 volume %, for example, at least about 4 6 volume %, or at least about 47 volume %, or at least about 48 volume %, or at least about 49 volume %, or at least about 50 volume %, or at least about 51 volume %, or at least about 52 volume %, or at least about 53 volume %, or at least about 54 volume %, or even up to at least about 55 volume %. According to still other embodiments, the perfluoro polymer content is about 63 volume % or less with respect to the total volume of the first filled polymer layer 204 , for example, about 62 volume % or less, or about 61 volume % or less, or about 60 volume % or less, or about 5 9 volume % or less, or about 58 volume % or less, or even about 57 volume % or less. It will be understood that the perfluoro polymer content may be any value between and including any of the above minimum values and any of the above maximum values. It will be further understood that the perfluoro polymer content may be within the range between and including any of the above minimum values and any of the above maximum values. According to still other embodiments, the dielectric substrate 200 may have a specific porosity measured using X-ray diffraction. For example, the porosity of the substrate 200 is about 10 volume % or less, for example about 9 volume % or less, or about 8 volume % or less, or about 7 volume % or less, or about 6 volume % or less, or

[0087] even further about 5 volume % or less. It will be understood that the porosity of the dielectric substrate 200 may be any value between any of the above values and including any of the above values. It will be understood that the porosity of the dielectric substrate 200 may be any value within the range between the above values and including the above values. ​​​It will be further understood that the value may be a value including a value.

[0088] According to still other embodiments, the dielectric substrate 200 may have a specific average thickness. For example, the average thickness of the dielectric substrate 200 is at least about 10 micrometers, for example, at least about 15 micrometers, or at least about 20 micrometers, or at least about 25 micrometers, or at least about 30 micrometers, or at least about 35 micrometers, or at least about 40 micrometers, or at least about 45 micrometers, or at least about 50 micrometers, or at least about 55 micrometers, or at least about 60 micrometers, or at least about 65 micr ometers, or at least about 70 micrometers, or even at least about 75 micr ometers. According to still other embodiments, the average thick ness of the dielectric substrate 200 is about 2000 micrometers or less, for example, about 1800 micrometers or less, about 1600 micrometers or less, about 1400 micrometers or less, about 1200 micro meters or less, or about 1000 micrometers or less, or about 800 micrometers or less , or about 600 micrometers or less, or about 400 micrometers or less, or about 2 00 micrometers or less, or about 190 micrometers or less, or about 180 micro meters or less, or about 170 micrometers or less, or about 160 micrometers or less , or about 150 micrometers or less, or about 140 micrometers or less, or about 12 0 micrometers or less, or even about 100 micrometers or less. The die The average thickness of the dielectric substrate 200 may be any value between and including any of the above minimum values and any of the above maximum values. It will be understood that the average thickness of the dielectric substrate 200 may be any value between and including any of the above minimum values and any of the above maximum values. It will be further understood that the average thickness of the dielectric substrate 200 may be within the range between and including any of the above minimum values and any of the above maximum values. It will be further understood that the average thickness of the dielectric substrate 200 may be within the range between and including any of the above minimum values and any of the above maximum values.

[0089] According to still other embodiments, the dielectric substrate 200 may have a specific dissipation factor (Df) measured in the range of 5 GHz at 20% RH. For example, the dielectric substrate 200 may have a dissipation factor of about 0.005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0. 0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less. It will be understood that the dissipation factor of the dielectric substrate 200 may be any value between any of the above values and including any of the above values. It will be further understood that the dissipation factor of the dielectric substrate 200 may be any value within the range between the above values and including any of the above values. It will be further understood that the dissipation factor of the dielectric substrate 200 may be any value within the range between the above values and including any of the above values. It will be further understood that the dissipation factor of the dielectric substrate 200 may be any value within the range between the above values and including any of the above values. It will be further understood that the dissipation factor of the dielectric substrate 200 may be any value within the range between the above values and

[0090] According to still other embodiments, the dielectric substrate 200 may have a specific dissipation factor (Df) measured in the range of 5 GHz at 80% RH. For example, the dielectric substrate 200 may have a dissipation factor of about 0. 005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less including any of the above values. It will be further understood that the dissipation factor of the dielectric substrate 200 may be any value within the range between the above values and including any of the above values. It will be further understood that the dissipation factor of the dielectric substrate 200 may be any value within the range between the above values and including any of the above values. It will be further understood that the dissipation factor of the dielectric substrate 200 may be any value within the range between the above values and is also acceptable. The dissipation factor of the dielectric substrate 200 may be any value between any of the above values and may include any of the above values, as will be understood. The dissipation factor of the dielectric substrate 200 may be any value within the range between the above values and may include the above values, as will be further understood.

[0091] According to still other embodiments, the dielectric substrate 200 may have a specific dissipation factor (Df) measured in the range of 10 GHz at 20% RH. For example, the dielectric substrate 200 may have a dissipation factor of about 0 .005 or less, such as about 0.004 or less, or about 0.003 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less. The dissipation factor of the dielectric substrate 200 may be any value between any of the above values and may include any of the above values, as will be understood. The dissipation factor of the dielectric substrate 200 may be any value within the range between the above values and may include the above values, as will be further understood. The dissipation factor of the dielectric substrate 200 may be any value within the range between the above values and may include the above values, as will be further understood.

[0092] According to still other embodiments, the dielectric substrate 200 may have a specific dissipation factor (Df) measured in the range of 10 GHz at 80% RH. For example, the dielectric substrate 200 may have a dissipation factor of about 0 .005 or less, such as about 0.004 or less, or about 0.003 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less. The dissipation factor of the dielectric substrate 200 may be any value between any of the above values and may include any of the above values, as will be understood. The dissipation factor of the dielectric substrate 200 may be any value between any of the above values and may include any of the above It will be understood that the value may be any value including any value of the dielectric substrate 200. The dissipation factor of the dielectric substrate 200 may be any value within the range between the above values and may be a value including the above values and this will be further understood.

[0093] According to still other embodiments, the dielectric substrate 200 may have a specific dissipation factor (Df) measured in the range of 28 GHz at 20% RH. For example, the dielectric substrate 200 may have a dissipation factor of about 0 .005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less , or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less. It will be understood that the dissipation factor of the dielectric substrate 200 may be any value between any of the above values and may be a value including any of the above values. The dissipation factor of the dielectric substrate 200 may be any value within the range between the above values and may be a value including the above values and this will be further understood. It will be understood that the value may be any value including any value of the dielectric substrate 200. The dissipation factor of the dielectric substrate 200 may be any value within the range between the above values and may be a value including the above values and this will be further understood.

[0094] According to still other embodiments, the dielectric substrate 200 may have a specific dissipation factor (Df) measured in the range of 28 GHz at 80% RH. For example, the dielectric substrate 200 may have a dissipation factor of about 0 .005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less , or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less. It will be understood that the dissipation factor of the dielectric substrate 200 may be any value between any of the above values and may be a value including any of the above values. The dissipation factor of the dielectric substrate 200 may be any value within the range between the above values and may be a value including the above values and this will be further understood. It will be understood that the value may be any value including any value of the dielectric substrate 200. The dissipation The rate may be any value within the range between the above values and may include the above values. will be further understood.

[0095] According to still other embodiments, the dielectric substrate 200 may have a specific dissipation factor (Df) measured in the range of 39 GHz at 20% RH. For example, the dielectric substrate 200 may have a dissipation factor of about 0 .005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less. It will be understood that the dissipation factor of the dielectric substrate 200 may be any value between any of the above values and may include any of the above values. It will be understood that the dissipation factor of the dielectric substrate 200 may be any value within the range between the above values and may include the above values. It will be further understood that the dissipation factor of the dielectric substrate 200 may be any value within the range between the above values and may include the above values. The rate may be any value within the range between the above values and may include the above values. will be further understood.

[0096] According to still other embodiments, the dielectric substrate 200 may have a specific dissipation factor (Df) measured in the range of 39 GHz at 80% RH. For example, the dielectric substrate 200 may have a dissipation factor of about 0 .005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less. It will be understood that the dissipation factor of the dielectric substrate 200 may be any value between any of the above values and may include any of the above values. It will be understood that the dissipation factor of the dielectric substrate 200 may be any value within the range between the above values and may include the above values. It will be understood that the dissipation factor of the dielectric substrate 200 may be any value within the range between the above values and may include the above values. The rate may be any value within the range between the above values and may include the above values. will be further understood.

[0097] According to still other embodiments, the dielectric substrate 200 may have a specific dissipation factor (Df) measured in the range of 76 - 81 GHz at 20% RH. For example, the dielectric substrate 200 may have a dissipation factor of about 0.005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.0 02 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less. It will be understood that the dissipation factor of the dielectric substrate 200 may be any value between any of the above values and may be a value including any of the above values. It will be further understood that the dissipation factor of the dielectric substrate 200 may be any value within the range between the above values and may be a value including the above values. It will be further understood that the dissipation factor of the dielectric substrate 200 may be any value within the range between the above values and may be a value including the above values.

[0098] According to still other embodiments, the dielectric substrate 200 may have a specific dissipation factor (Df) measured in the range of 76 - 81 GHz at 80% RH. For example, the dielectric substrate 200 may have a dissipation factor of about 0.005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.0 02 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less. It will be understood that the dissipation factor of the dielectric substrate 200 may be any value between any of the above values and may be a value including any of the above values. It will be understood that the dissipation factor of the dielectric substrate 200 may be any value within the range between the above values and may be a value including the above values. It will be understood that the dissipation factor of the dielectric substrate 200 may be any value within the range between the above values and may be a value including the above values.

[0099] According to yet another embodiment, the dielectric substrate 200 is IPC-TM-650 2.4. 24 Rev.C Glass Transition Temperature an d Z-Axis Thermal Expansion by TMA and may have a specific coefficient of thermal expansion. For example, the dielectric substrate 200 may have a coefficient of thermal expansion of about 80 ppm / °C or less.

[0100] According to another embodiment of the dielectric substrate formed according to the forming method 100, FIG. 2b includes a diagram of the dielectric substrate 201. As shown in FIG. 2b, the dielectric substrate 201 includes a first full fluoropolymer-based adhesive layer 203, a polyimide layer 202, a first filled polymer layer 204 covering the polyimide layer 202, a second filled polymer layer 206 covering the bottom of the polyimide layer 202, and a second fluoropolymer-based adhesive layer 2 08 covering the bottom of the second filled polymer layer 206. As shown in FIG. 2b, the second filled polymer layer 206 can include a second resin matrix component 230 and a second ceramic filler component 240.

[0101] According to yet another embodiment, the second fluoropolymer-based adhesive layer 208 can have a specific average thickness. For example, the second fluoropolymer-based adhesive layer 208 can be at least about 0.2 micrometers, for example, at least about 0.5 micrometers, or at least about 1.0 micrometers, or at least about 1.5 micrometers, or at least about 2.0 micrometers, or at least about 2.5 micrometers, or even at least about 3.0 micrometers. According to yet another embodiment, the second full fluoropolymer-based adhesive layer 208 can be at most about 10 micrometers, for example, at most about 8 micrometers, or at most​​​​​ The average thickness of the second fluoropolymer-based adhesive layer 208 is about 7 micrometers or less, for example, about 6 .5 or less, or about 6.0 or less, or about 5.5 or less, or about 5.0 or less, about 4.9 or less, or about 4.8 micrometers or less, or about 4.7 micrometers or less, or about 4.6 mic rometers or less, or about 4.5 micrometers or less, or about 4.4 micrometers or less, or about 4.3 micrometers or less, or about 4.2 micrometers or less, or about 4.1 micrometers or less, or about 4.1 micrometers or less, or about 4.0 mic rometers or less, or about 3.9 micrometers or less, or about 3.8 micrometers or less, or about 3.7 micrometers or less, or about 3.6 micrometers or less, or further it may be about 3.5 micrometers or less. The average thickness of the second fluoropolymer-based adhesive layer 208 may be any value between any of the above minimum values and any of the maximum values or it will be understood that it may include any value therebetween. It will be further understood that the average thickness of the second fluoropoly mer-based adhesive layer 208 may be within the range between any of the above minimum values and any of the maximum values and include them.

[0102] According to still other embodiments, the second fluoropolymer-based adhesive layer 208 may include a specific material. For example, the second fluoropolymer-based adhesive layer 208 may include a fluoropolymer (e.g., polytetrafluoroethylene (PTFE), modified polytetrafluoroethylene (mPTFE), copolymers and terpolymers of tetrafluoroethylene such as fluorinated ethylene-propylene (FEP), perfluoroalkoxy polymer resin (PFA), and ​​​Modified perfluoroalkoxy polymer resin (mPFA), and derivatives and blends thereof may be included. According to still other embodiments, the second fluoropolymer-based adhesive layer 208 may be composed of a fluoropolymer (e.g., polytetrafluoroethylene (PTFE), modified polytetrafluoroethylene (mPTFE), fluorinated ethylene-propylene (FEP) and other copolymers and terpolymers of tetrafluoroethylene, perfluoroalkoxy polymer resin (PFA), and modified perfluoroalkoxy polymer resin (mPFA), and derivatives and blends thereof. According to certain embodiments, the second ceramic filler component 240 may include a third filler material that may have certain properties that can improve the performance of the dielectric substrate 201

[0103] According to certain embodiments, the third filler material of the second ceramic filler component 240 can have a specific size distribution. For the purposes of the embodiments described herein, the particle size distribution of the material, e.g., the particle size distribution of the third filler material, can be described using any combination of the particle size distribution D values D The D value from the particle size distribution is defined as the particle size value at which 10% of the particles are smaller than that value and 90% of the particles are larger than that value. The D value from the particle size distribution is defined as the particle size value at which 50% of the particles are smaller than that value and 50% of the particles are larger than that value. The D value from the particle size distribution is the particle

[0104] According to certain embodiments, the third filler material of the second ceramic filler component 240 can have a specific size distribution. For the purposes of the embodiments described herein, the particle size distribution of the material, e.g., the particle size distribution of the third filler material, can be described using any combination of the particle size distribution D values D 10 50 90 90 10 10 10 value at which 10% of the particles are smaller than that value and 90% of the particles are larger than that value. The D value from the particle size distribution is defined as the particle size value at which 50% of the particles are smaller than that value and 50% of the particles are larger than that value. The D value from the particle size distribution is the particle value at which 10% of the particles are smaller than that value and 90% of the particles are larger than that value. The D value from the particle size distribution is defined as the particle size value at which 50% of the particles are smaller than that value and 50% of the particles are larger than that value. The D value from the particle size distribution is the particle 50 value at which 50% of the particles are smaller than that value and 50% of the particles are larger than that value. The D value from the particle size distribution is the particle value at which 50% of the particles are smaller than that value and 50% of the particles are larger than that value. The D value from the particle size distribution is the particle 90 value at which 50% of the particles are smaller than that value and 50% of the particles are larger than that value. The D value from the particle size distribution is the particle Defined as a particle size value where 90% of the particles are smaller than that value and 10% of the particles are larger than that value For the purposes of the embodiments described herein, the particle size measurement of a particular material is performed using laser diffraction spectroscopy.

[0105] According to a particular embodiment, the third filler material of the second ceramic filler component 240 may have a particular size distribution D 10 value. For example, the D 10 of the third filler material is at least about 0.3 micrometers, or at least about 0.4 micrometers, or at least about 0.5 micrometers, or at least about 0.6 micrometers, or at least about 0.7 micrometers, or at least about 0.8 micrometers, or at least about 0.9 micrometers, or at least about 1.0 micrometers, or at least about 1.1 micrometers, or even at least about 1.2 micrometers, and may be any, at least about 0.2 micrometers. According to still other embodiments , the D 10 of the third filler material is about 1.5 micrometers or less, or even about 1.4 micrometers or less, etc., and may be about 1.6 micrometers or less. The D of the third filler material 10 is understood to be any value between and including any of the above minimum values and any of the above maximum values. It will be further understood that the D of the third filler material 10 is between and includes any of the above minimum values and any of the above maximum values and may be within that range.

[0106] ​According to other embodiments, the third filler material of the second ceramic filler component 240 is may have a specific size distribution D 50 value. For example, the D of the third filler material 50 is at least about 0.6 micrometers, or at least about 0.7 micrometers, or at least about 0.8 micrometers, or at least about 0.9 micrometers, or at least about 1.0 micrometers, or at least about 1.1 micrometers, or at least about 1.2 micrometers, or at least about 1.3 micrometers, or at least about 1.4 micrometers, or at least about 1.5 micrometers, or at least about 1.6 micrometers, or at least about 1.7 micrometers, or at least about 1.8 micrometers, or at least about 1.9 micrometers, or at least about 2.0 micrometers, or at least about 2.1 micrometers, or even is at least about 0.5 micrometers, such as at least about 2.2 micrometers and may be. According to still other embodiments, the D of the third filler material 50 is about 2.6 microns or less, or about 2.5 micrometers or less, or even about 2.4 micrometers or less, etc., and may be about 2.7 micrometers or less. The D of the third filler material D 50 is understood to be any value between and including any of the above minimum values and any of the above maximum values. The D of the third filler material 50 is also understood to be within the range between and including any of the above minimum values and any of the above maximum values.

[0107] ​​ According to another embodiment, the third filler material of the second ceramic filler component 240 is may have a specific size distribution D 90 value. For example, the D of the third filler material 90 is at least about 0.9, or at least about 1.0, or at least about 1.1, or at least about 1.2, or at least about 1.3, or at least about 1.4, or at least about 1.5, or at least about 1.6 micrometers, or at least about 1.7 micrometers, or at least about 1.8 micrometers, or at least about 1.9 micrometers, or at least about 2.0 micrometers, or at least about 2.1 micrometers, or at least about 2.2 micrometers, or at least about 2.3 micrometers, or at least about 2.4 micrometers, or at least about 2.5 micrometers, or at least about 2.6 micrometers, or even at least about 2.7 micrometers such as tor, etc., may be at least about 0.8 micrometers. According to still other embodiments According to another embodiment, the D of the third filler material 90 is about 7.5 micrometers or less, or about 7.0 m icrometers or less, or about 6.5 micrometers or less, or about 6.0 micrometers r or less, or about 5.5 micrometers or less, or about 5.4 micrometers or less, or about 5.3 micrometers or less, or about 5.2 micrometers or less, or even about 5. 1 micrometers or less, etc., may be about 8.0 micrometers or less. The D of the third filler material 90 is understood to be any value between and including any of the above minimum values and any of the maximum values. The D of the third filler material ​90 is between and including any one of the above minimum values and any one of the maximum values and it will be further understood that it can be within the range.

[0108] According to yet another embodiment, the third filler material of the second ceramic filler component 240 may have a specific average particle size measured according to laser diffraction spectroscopy. For example, the average particle size of the third filler material is about 10 micrometers or less, or about 8 micrometers or less, or about 7 micrometers or less, or about 6 micrometers or less, or about 5 micrometers or less, or about 4 micrometers or less, or about 3 micrometers or less, or even about 2 micrometers or less, etc., and may be about 10 micrometers or less. The average particle size of the third filler material can be understood to be any value between and including any of the above values. The average particle size of the third filler material can be further understood to be within the range between and including any of the above values.

[0109] According to yet another embodiment, the third filler material of the second ceramic filler component 240 can be described as having a specific particle size distribution span (PSDS), and the PSD S is equal to (D 90 - D 10 ) / D 50 , where D 90 is equal to the D9 0 particle size distribution measurement value of the third filler material, and D 10 is equal to the D 10 particle size distribution measurement value of the third filler material, and D is equal to the D 50 particle size distribution measurement value of the third filler material. For example, the third filler 50 is equal to the D ​​The PSDS of the agent material is about 5 or less, such as about 4.5 or less, or about 4.0 or less, or about 3.5 or less, or about 3. 0 or less, or even about 2.5 or less. The PSDS of the third filler material can be any value between and including any of the above values. It will be understood. It will be further understood that the PSDS of the third filler material can be within a range between and including any of the above values.

[0110] According to yet other embodiments, the third filler material of the second ceramic filler component 240 can be described as having a specific average surface area measured using Brunauer-Emmett-Teller (BET) surface area analysis (nitrogen adsorption). For example, the third filler material is about 9.9 m / g or less, or about 9.5 m 2 / g or less, or about 9 2 .0 m .0 m 2 / g or less, or about 8.5 m 2 / g or less, or about 8.0 m 2 / g or less, or about 7. 5 m 2 / g or less, or about 7.0 m 2 / g or less, or about 6.5 m 2 / g or less, or about 6.0 m 2 / g or less, or about 5.5 m 2 / g or less, or about 5.0 m 2 / g or less, or about 4.5 m 2 / g or less, or about 4.0 m 2 / g or less, or even about 3.5 m 2 / g or less, etc., and may have an average surface area of about 1 0 m 2 / g or less. According to yet other embodiments, the third filler material has an average surface area of at least about 1.2 m 2 / g, such as at least about 2.4 m 2 / g. may have. It will be understood that the average surface area of the third filler material can be any value between and including any of the above minimum values and any of the maximum values. It will be further understood that the average surface area of the third filler material can be within the range between and including any of the above minimum values and any of the maximum values.

[0111] According to other embodiments, the third filler material of the second ceramic filler component 240 can include specific materials. According to a specific embodiment, the third filler material can include silica-based compounds. According to still other embodiments, the third filler material may be composed of silica-based compounds. According to other embodiments, the third filler material can include silica. According to still other embodiments, the third filler material may be composed of silica.

[0112] According to still other embodiments, the first filled polymer layer 204 can include a specific content of the second ceramic filler component 240. For example, the content of the second ceramic filler component 240 is at least about 31% by volume, or at least about 32% by volume, or at least about 33% by volume, or at least about 34% by volume, or at least about 35% by volume, or at least about 36% by volume, or at least about 37% by volume, or at least about 38% by volume, or at least about 39% by volume, or at least about 40% by volume, or at least about 41% by volume, or at least about 42% by volume, or at least about 43% by volume, or at least about 44% by volume, or at least about 45% by volume with respect to the total volume of the second ceramic filler component 240. %, or at least about 46% by volume, or at least about 47% by volume, or at least about 48 % by volume, or at least about 49% by volume, or at least about 50% by volume, or at least about 51% by volume or at least about 52% by volume or at least about 53% by volume, or at least about 54% by volume, etc., may be at least about 30% by volume. According to still other embodiments , the content of the second ceramic filler component 240 is the total volume of the first filler polymer layer 204 with respect to, about 57% by volume or less, or even about 56% by volume or less, etc., about 57% by volume or less may be. The content of the ceramic filler component 220 may be any value between and including any of the above minimum values and any of the above maximum values, as will be understood. The content of the ceramic filler component 220 may be within the range between and including any of the above minimum values and any of the above maximum values, as will be further understood .

[0113] According to still other embodiments, the second ceramic filler component 240 may include a third filler material having a specific content . For example, the content of the third filler material is at least about 80% by volume with respect to the total volume of the second ceramic filler component 240, for example, at least about 81% by volume, or at least about 82% by volume, or at least about 83% by volume, or at least about 84% by volume, or at least about 85% by volume, or at least about 86% by volume, or at least about 87% by volume, or at least about 88% by volume, or at least about 89% by volume , or even at least about 90% by volume. According to still other embodiments, the content of the third filler material is about 10 with respect to the total volume of the second ceramic filler component 240 ​0% by volume or less, for example, about 99% by volume or less, or about 98% by volume or less, or about 97% by volume or less, or about 96% by volume or less, or about 95% by volume or less, or about 94% by volume or less, or about 93% by volume or less, or even about 92% by volume or less. The content of the third filler material may be any value between and including any of the above minimum values and any of the above maximum values. It will be understood that the content of the third filler material can be within the range between and including any of the above minimum values and any of the above maximum values. or less, or about 96% by volume or less, or about 95% by volume or less, or about 94% by volume or less, or about 93 % by volume or less, or even about 92% by volume or less. The content of the third filler material is any value between and including any of the above minimum values and any of the above maximum values. It will be understood that the content of the third filler material can be any value between and including any of the above minimum values and any of the above maximum values. It will be further understood that the content of the third filler material can be within the range between and including any of the above minimum values and any of the above maximum values.

[0114] According to yet another embodiment, the second ceramic filler component 240 can include a fourth filler material.

[0115] According to yet another embodiment, the fourth filler material of the second ceramic filler component 240 can include a specific material. For example, the fourth filler material can include a high dielectric constant ceramic material such as a ceramic material having a dielectric constant of at least about 14. According to a specific embodiment, the fourth filler material of the second ceramic filler component 240 can include any high dielectric constant ceramic material such as TiO2, SrTiO3, ZrTi2O6, MgTiO3, CaTiO3, BaTiO4, or any combination thereof. For example, the fourth filler material can include a high dielectric constant ceramic material such as a ceramic material having a dielectric constant of at least about 14. According to a specific embodiment, the fourth filler material of the second ceramic filler component 240 can include any high dielectric constant ceramic material such as TiO2, SrTiO3, ZrTi2O6, MgTiO3, CaTiO3, BaTiO4, or any combination thereof. According to yet another embodiment, the fourth filler material of the second ceramic filler component 240 can include TiO2. According to yet another embodiment, the fourth filler material can be composed of TiO2. 2, SrTiO3, ZrTi2O6, MgTiO3, CaTiO3, BaTiO4, or any combination thereof.

[0116] According to yet another embodiment, the fourth filler material of the second ceramic filler component 240 can include TiO2. According to yet another embodiment, the fourth filler material can be composed of TiO2.

[0117] ​​​According to still other embodiments, the second ceramic filler component 240 may include a specific content of a fourth filler material. For example, the content of the fourth filler material may be at least about 1 volume %, such as at least about 2 volume %, or at least about 3 volume %, or at least about 4 volume %, or at least about 5 volume %, or at least about 6 volume %, or at least about 7 volume %, or at least about 8 volume %, or at least about 9 volume %, or even at least about 10 volume % with respect to the total volume of the second ce ramic filler component 240. According to still other embodiments, the content of the fourth filler material may be about 19 volume % or less, or about 18 volume % or less, or about 17 vo lume % or less, or about 16 volume % or less, or about 15 volume % or less, or about 14 volume % or less, or about 13 volume % or less, or about 12 volume % or less, etc., up to about 20 volume % with respect to the total volume of the second ceramic filler component 240. It will be understood that the content of the fourth filler material can be any value between and including any of the above minimum values and any of the above maximum values. It will be further understood that the content of the fourth filler material can be within the range between and including any of the above minimum values and any of the above maximum values.

[0118] According to still other embodiments, the second ceramic filler component 240 may include a specific content of an amorphous material. For example, the second ceramic filler component 240 may include at least about 97%, such as at least about 98%, or even at least about 99% of the amorphous ma terial. It will be understood that the content of the amorphous material can be any value between any of the above values and can be a value including any of the above values. The content of the amorphous material ​ The content may be any value within the range between the above values and may include the above values. This will be further understood.

[0119] According to still other embodiments, the second resin matrix component 230 may include a specific material. For example, the second resin matrix component 230 may include a perfluoropolymer. According to still other embodiments, the second resin matrix component 230 may be composed of a perfluoropolymer.

[0120] According to still other embodiments, the perfluoropolymer of the second resin matrix component 230 may include a copolymer of tetrafluoroethylene (TFE), a copolymer of hexafluoropropylene (HFP), a terpolymer of tetrafluoroethylene (TFE), or any combination thereof. According to other embodiments, the perfluoropolymer of the second resin matrix component 230 may be composed of a copolymer of tetrafluoroethylene (TFE), a copolymer of hexafluoropropylene (HFP), a terpolymer of tetrafluoroethylene (TFE), or any combination thereof. HFP), a terpolymer of tetrafluoroethylene (TFE), or any combination thereof. According to other embodiments, the perfluoropolymer of the second resin matrix component 230 may include a copolymer of tetrafluoroethylene (TFE), a copolymer of hexafluoropropylene (HFP), a terpolymer of tetrafluoroethylene (TFE), or any combination thereof. According to other embodiments, the perfluoropolymer of the second resin matrix component 230 may be composed of a copolymer of tetrafluoroethylene (TFE), a copolymer of hexafluoropropylene (HFP), a terpolymer of tetrafluoroethylene (TFE), or any combination thereof. E), a terpolymer of tetrafluoroethylene (TFE), or any combination thereof.

[0121] According to still other embodiments, the perfluoropolymer of the second resin matrix component 230 may include polytetrafluoroethylene (PTFE), perfluoroalkoxy polymer resin (PFA), fluorinated ethylene propylene (FEP), or any combination thereof. According to still other embodiments, the perfluoropolymer of the second resin matrix component 230 may include polytetrafluoroethylene (PTFE), perfluoroalkyl oxy polymer resin (PFA), fluorinated ethylene propylene (FEP), or any combination thereof. According to still other embodiments, the perfluoropolymer of the second resin matrix component 230 may include polytetrafluoroethylene (PTFE), perfluoroalkoxy polymer resin (PFA), fluorinated ethylene propylene (FEP), or any combination thereof. According to still other embodiments, the perfluoropolymer of the second resin matrix component 230 may include polytetrafluoroethylene (PTFE), perfluoroalkyl A perfluoropolymer resin (PFA), fluorinated ethylene propylene (FEP), or any combination thereof may be used.

[0122] According to yet another embodiment, the second filled polymer layer 206 can include a specific content of a second resin matrix component 230. For example, the content of the second resin matrix component 230 can be at least about 46 volume %, or at least about 47 volume %, or at least about 48 volume %, or at least about 49 volume %, or at least about 50 volume %, or at least about 51 volume %, or at least about 52 volume %, or at least about 53 volume %, or at least about 54 volume %, or even at least about 55 volume %, etc., and can be at least about 45 volume %. According to yet another embodiment, the content of the second resin matrix component 230 can be about 63 volume % or less, or about 62 volume % or less, or about 61 volume % or less, or about 60 volume % or less, or about 59 volume % or less, or about 58 volume % or less, or even about 57 volume % or less, with respect to the total volume of the second filled polymer layer 206. It will be understood that the content of the second resin matrix component 230 can be any value between and including any of the above minimum values and any of the above maximum values. It will be further

[0123] understood that the content of the second resin matrix component 230 can be in a range between and including any of the above minimum values and any of the With respect to the total volume of the polymer layer 206, at least about 45% by volume, for example, at least about 4 6% by volume, or at least about 47% by volume, or at least about 48% by volume, or at least about 49% by volume, or at least about 50% by volume, or at least about 51% by volume, or at least about 52% by volume, or at least about 53% by volume, or at least about 54% by volume, or even up to at least about 55% by volume. According to still other embodiments, the perfluoro polymer content is about 63% by volume or less with respect to the total volume of the second filled polymer layer 206 , for example, about 62% by volume or less, or about 61% by volume or less, or about 60% by volume or less, or about 5 9% by volume or less, or about 58% by volume or less, or even about 57% by volume or less. It will be understood that the perflu oropolymer content may be any value between and including any of the above minimum values and any of the above maximum values. The perfluoro polymer content may further be understood to be within a range between and including any of the above minimum values and any of the above maximum values. The perfluoropolymer content may be between any of the above minimum values and any of the above maximum values and within a range including them. It will be further understood.

[0124] According to still other embodiments, the dielectric substrate 201 may have a specific porosity measured using X-ray diffraction. For example, the porosity of the substrate 200 is about 10% by volume or less, for example , about 9% by volume or less, or about 8% by volume or less, or about 7% by volume or less, or about 6% by volume or less, or even further about 5% by volume or less. The porosity of the dielectric substrate 201 may be any value between any of the above values and any value including any of the above values. It will be understood. The porosity of the dielectric substrate 201 may be any value within the range between the above values and including the above It will be further understood that it may be a value including a value.

[0125] According to still other embodiments, the dielectric substrate 201 may have a specific average thickness. For example, the average thickness of the dielectric substrate 201 is at least about 10 micrometers, for example, at least about 15 micrometers, or at least about 20 micrometers, or at least about 25 micrometers, or at least about 30 micrometers, or at least about 35 micrometers, or at least about 40 micrometers, or at least about 45 micrometers, or at least about 50 micrometers, or at least about 55 micrometers, or at least about 60 micrometers, or at least about 65 micro meters, or at least about 70 micrometers, or even at least about 75 micro meters. According to still other embodiments, the average thickness of the dielectric substrate 201 is about 2000 micrometers or less, for example, about 1800 micrometers or less, about 1600 micrometers or less, about 1400 micrometers or less, about 1200 micro meters or less, or about 1000 micrometers or less, or about 800 micrometers or less , or about 600 micrometers or less, or about 400 micrometers or less, or about 2 00 micrometers or less, or about 190 micrometers or less, or about 180 micro meters or less, or about 170 micrometers or less, or about 160 micrometers or less , or about 150 micrometers or less, or about 140 micrometers or less, or about 12 0 micrometers or less, or even about 100 micrometers or less. The dielectric The average thickness of the dielectric substrate 201 may be any value between and including any of the above minimum values and any of the above maximum values. It will be understood that the average thickness of the dielectric substrate 201 may be any value between and including any of the above minimum values and any of the above maximum values. It will be further understood that the average thickness of the dielectric substrate 201 may be within the range between and including any of the above minimum values and any of the above maximum values.

[0126] According to still other embodiments, the dielectric substrate 201 may have a specific dissipation factor (Df) measured in the range of 5 GHz at 20% RH. For example, the dielectric substrate 201 may have a dissipation factor of about 0. 005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less , or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less. It will be understood that the dissipation factor of the dielectric substrate 201 may be any value between any of the above values and including any of the above values. It will be further understood that the dissipation factor of the dielectric substrate 201 may be any value within the range between the above values and including the above values. According to still other embodiments, the dielectric substrate 201 may have a specific dissipation factor (Df) measured in the range of 5 GHz at 80% RH. For example, the dielectric substrate 201 may have a dissipation factor of about 0. 005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less

[0127] , or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less. It will be understood that the dissipation factor of the dielectric substrate 201 may be any value between any of the above values and including any of the above values. It will be further understood that the dissipation factor of the dielectric substrate 201 may be any value within the range between the above values and including the above values. is also acceptable. The dissipation factor of the dielectric substrate 201 can be any value between any of the above values and can include any of the above values, which will be understood. The dissipation factor of the dielectric substrate 201 can be any value within the range between the above values and can include the above values, which will be further understood.

[0128] According to still other embodiments, the dielectric substrate 201 may have a specific dissipation factor (Df) measured in the range of 10 GHz at 20% RH. For example, the dielectric substrate 201 may have a dissipation factor of about 0 .005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less. The dissipation factor of the dielectric substrate 201 can be any value between any of the above values and can include any of the above values, which will be understood. The dissipation factor of the dielectric substrate 201 can be any value within the range between the above values and can include the above values, which will be further understood. The dissipation factor of the dielectric substrate 201 can be any value within the range between the above values and can include the above values, which will be further understood.

[0129] According to still other embodiments, the dielectric substrate 201 may have a specific dissipation factor (Df) measured in the range of 10 GHz at 80% RH. For example, the dielectric substrate 201 may have a dissipation factor of about 0 .005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less. The dissipation factor of the dielectric substrate 201 can be any value between any of the above values and can include any of the above values, which will be understood. The dissipation factor of the dielectric substrate 201 can be any value within the range between the above values and can include the above values, which will be understood. The dissipation factor of the dielectric substrate 201 can be any value between any of the above values and can include any of the above It will be understood that the value may be any value including the values described above. The dissipation factor of the dielectric substrate 201 may be any value within the range between the above values, and may be a value including the above values, which will be further understood.

[0130] According to yet another embodiment, the dielectric substrate 201 may have a specific dissipation factor (Df) measured in the range of 28 GHz at 20% RH. For example, the dielectric substrate 201 may have a dissipation factor of about 0 .005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less. It will be understood that the dissipation factor of the dielectric substrate 201 may be any value between any of the above values and may be a value including any of the above values. The dissipation factor of the dielectric substrate 201 may be any value within the range between the above values, and may be a value including the above values, which will be further understood. factor of the dielectric substrate 201 may be any value within the range between the above values, and may be a value including the above values, which will be further understood.

[0131] According to yet another embodiment, the dielectric substrate 201 may have a specific dissipation factor (Df) measured in the range of 28 GHz at 80% RH. For example, the dielectric substrate 201 may have a dissipation factor of about 0 .005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less. It will be understood that the dissipation factor of the dielectric substrate 201 may be any value between any of the above values and may be a value including any of the above values. The dissipation factor of the dielectric substrate 201 may be any value between any of the above values and may be a value including any of the above values, which will be understood. The dissipation The rate may be any value within the range between the above values and may include the above values. will be further understood.

[0132] According to still other embodiments, the dielectric substrate 201 may have a specific dissipation factor (Df) measured in the range of 39 GHz at 20% RH. For example, the dielectric substrate 201 may have a dissipation factor of about 0 .005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less. It will be understood that the dissipation factor of the dielectric substrate 201 may be any value between any of the above values and may include any of the above values. It will be understood that the dissipation factor of the dielectric substrate 201 may be any value within the range between the above values and may include the above values. will be further understood.

[0133] According to still other embodiments, the dielectric substrate 201 may have a specific dissipation factor (Df) measured in the range of 39 GHz at 80% RH. For example, the dielectric substrate 201 may have a dissipation factor of about 0 .005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less. It will be understood that the dissipation factor of the dielectric substrate 201 may be any value between any of the above values and may include any of the above values. It will be understood that the dissipation factor of the dielectric substrate 201 may be any value within the range between the above values and may include the above values. will be further understood.

[0134] According to yet other embodiments, the dielectric substrate 201 may have a specific dissipation factor (Df) measured in the range of 76 - 81 GHz at 20% RH. For example, the dielectric substrate 201 may have a dissipation factor of about 0.005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.0 02 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less. It will be understood that the dissipation factor of the dielectric substrate 201 may be any value between any of the above values and may be a value including any of the above values. It will be further understood that the dissipation factor of the dielectric substrate 201 may be any value within the range between the above values and may be a value including the above values. It will be further understood that. will be further understood.

[0135] According to yet other embodiments, the dielectric substrate 201 may have a specific dissipation factor (Df) measured in the range of 76 - 81 GHz at 80% RH. For example, the dielectric substrate 201 may have a dissipation factor of about 0.005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.0 02 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less. It will be understood that the dissipation factor of the dielectric substrate 201 may be any value between any of the above values and may be a value including any of the above values. It will be understood that the dissipation factor of the dielectric substrate 201 may be any value within the range between the above values and may be a value including the above values. It will be further understood that the dissipation factor of the dielectric substrate 201 may be any value within the range between the above values and may be a value including the above values. It will be further understood that.

[0136] According to still other embodiments, the dielectric substrate 201 is IPC-TM-650 2.4. 24 Rev.C Glass Transition Temperature an d Z-Axis Thermal Expansion by TMA and may have a specific coefficient of thermal expansion. For example, the dielectric substrate 201 may have a coefficient of thermal expansion of about 80 ppm / °C or less.

[0137] The filled polymer layer described with reference to the embodiments of the dielectric substrate disclosed herein may be in direct contact with the polyimide layer, or it will be understood that an additional layer may be present between the filled polymer layer and the polyimide layer. For example, a fluoropolymer layer (filled or unfilled) may be disposed between the polyimide layer of the dielectric substrate and the filled polymer layer.

[0138] Now, refer to embodiments of a copper-clad laminate that may include the dielectric substrate described herein By way of reference. Such additional embodiments described herein generally relate to copper-clad laminates that may include a copper foil layer and a dielectric substrate covering the copper foil layer. According to a particular embodiment the dielectric substrate may include a first fluoropolymer-based adhesive layer, a polyimide layer covering the fluoropolymer-based adhesive layer, and a first filled polymer layer covering the polyimide layer, and the first filled polymer layer can include a first resin matrix component and a first ceramic filler component

[0139] Next, referring to a method of forming a copper-clad laminate, FIG. 3 includes a diagram showing a forming method 300 for forming a copper-clad laminate according to the embodiments described herein In a particular embodiment ​​​​According to the method 300, the first step 310 is to provide a copper foil layer, and a dielectric layer covering the copper foil layer. and a second step 320 of forming a conductive substrate. In this case, forming the dielectric layer includes providing a first fluoropolymer-based adhesive layer. providing a polyimide layer covering the first fluoropolymer adhesive layer; The matrix precursor component and the first ceramic filler precursor component are combined to form a first shape. forming a compound mixture and depositing the first compound mixture on a first filled polymer layer overlying the polyimide layer; and forming a layer on the substrate.

[0140] According to certain embodiments, the first ceramic filler precursor component is formed by the method 300. The first may have certain properties that can improve the performance of the copper clad laminate formed therefrom. Filler precursor materials may be included.

[0141] According to yet another embodiment, the first fluoropolymer adhesive layer has a particular average thickness For example, the first fluoropolymer adhesive layer may have a viscosity of at least about 0.2 microns. For example, at least about 0.5 micrometers, or at least about 1.0 micrometers. micrometers, or at least about 1.5 micrometers, or at least about 2.0 micrometers micrometers, or at least about 2.5 micrometers, or even at least about 3 According to yet another embodiment, the first fluoropolymer may be The average thickness of the adhesive layer is about 7 micrometers or less, for example, about 6.5 or less, or about 6 0.0 or less, or about 5.5 or less, or about 5.0 or less, about 4.9 micrometers or less, or Approximately 4.8 micrometers or less, or approximately 4.7 micrometers or less, or approximately 4.6 micrometers or less less than or equal to 4.5 micrometers, or less than or equal to about 4.4 micrometers, or about 4.4 micrometers or less, or less than or equal to about 4.3 micrometers, or less than or equal to about 4.2 micrometers, or about 4.1 micrometers or less, or less than or equal to about 4.1 micrometers, or about 4.0 microm eters or less, or less than or equal to about 3.9 micrometers, or less than or equal to about 3.8 micrometers or less, or less than or equal to about 3.7 micrometers, or less than or equal to about 3.6 micrometers, or even it may be less than or equal to about 3.5 micrometers. The average thickness of the first fluoropolymer-based adhesive layer is understood to be any value between any of the above minimum values and any of the maximum values and including them It will be understood that the average thickness of the first fluoropolymer-based adhesive layer is between any of the above minimum values and any of the maximum values and including them It will be further understood that it may be within the range including them.

[0142] According to yet another embodiment, the first fluoropolymer-based adhesive layer 207 may contain a specific material For example, the first fluoropolymer-based adhesive layer 207 may contain a fluoropolymer (e.g., polytetrafluoroethylene (PTFE), modified polytetrafluoroethylene (mPTFE), copolymers and terpolymers of tetrafluoroethylene such as fluorinated ethylene-propylene (FEP), perfluoroalkoxy polymer resin (PFA), and modified perfluoroalkoxy polymer resin (mPFA), as well as derivatives and blends thereof and may include them. According to yet another embodiment, the first fluoropolymer-based adhesive layer 207 may contain a fluoropolymer (e.g., polytetrafluoroethylene (PTFE), modified polytetrafluoroethylene (PTFE), modified Polytetrafluoroethylene (mPTFE), fluorinated ethylene-propylene (FEP) Copolymers and terpolymers of tetrafluoroethylene such as perfluoroalkoxy polymer resin (PFA), and modified perfluoroalkoxy polymer resin (mPFA), and may be composed of derivatives and blends thereof.

[0143] According to a particular embodiment, the first filler precursor material may have a particular size distribution. For the purposes of the embodiments described herein, the particle size distribution of the material, e.g., the particle size distribution of the first filler precursor material, may be described using any combination of particle size distribution D values, D 10 , D 50 and D 90 The D value from the particle size distribution is defined as the particle size value such that 10% of the particles are smaller than that value 10 and 90% of the particles are larger than that value. The D value from the particle size distribution 50 is defined as the particle size value such that 50% of the particles are smaller than that value and 50% of the particles are larger than that value. The D value from the particle size distribution is defined as the particle size value such that 90% of the particles are smaller than that value and 90 10% of the particles are larger than that value. For the purposes of the embodiments described herein, the particle size measurement of a particular material is performed using laser diffraction spectroscopy. According to a particular embodiment, the first filler precursor material may have a particular size distribution D value.

[0144] For example, the D 10 of the first filler precursor material may be at least about 0.3 micrometers, or at least about 0.4 micrometers, or at least about 0.5 10 micrometers or at least about 0.6 micrometers Arometer, or at least about 0.6 micrometers, or at least about 0.7 mic rometer, or at least about 0.8 micrometers, or at least about 0.9 mic rometer, or at least about 1.0 micrometers, or at least about 1.1 mic rometer, or even at least about 1.2 micrometers, etc., at least about 0. 2 micrometers may be sufficient. According to yet other embodiments, the D of the first filler material 10 is about 1.6 micrometers or less, for example, about 1.5 micrometers or less, or even about 1.4 micrometers or less. The D of the first filler precursor material 10 may be any value between and including any of the above minimum values and any of the above maximum values, as will be understood by those skilled in the art. The D of the first filler precursor material 10 is also understood to be any value between and including any of the above minimum values and any of the above maximum values within a range.

[0145] According to other embodiments, the first filler precursor material may have a specific size distribution D 50 value. For example, the D of the first filler precursor material is at least about 0.6 mic 50 rometer, or at least about 0.7 micrometers, or at least about 0.8 mic rometer, or at least about 0.9 micrometers, or at least about 1.0 mic rometer, or at least about 1.1 micrometers, or at least about 1.2 mic rometer, or at least about 1.3 micrometers, or at least about 1.4 mic rometer, or at least about 1.5 micrometers, or at least about 1.6 mic Meters, or at least about 1.5 micrometers, or at least about 1.6 micro Meters, or at least about 1.7 micrometers, or at least about 1.8 micro Meters, or at least about 1.9 micrometers, or at least about 2.0 micro Meters, or at least about 2.1 micrometers, or even at least about 2.2 mic rometers and the like, and may be at least about 0.5 micrometers. Further, other According to other embodiments, the D of the first filler material 50 is about 2.7 micrometers or less, for example about 2.6 micrometers or less, or about 2.5 micrometers or less, or even about 2.4 micrometers or less. The D of the first filler precursor material 50 is any value between and including any of the minimum values and any of the maximum values of the above and it will be understood that it may be. The D of the first filler precursor material is any value between and including any of the minimum values and any of the maximum values of the above and within the range including them, and it will be further understood that it may be. 50 The D of the first filler precursor material is between and including any of the minimum values and any of the maximum values of the above and within the range including them, and it will be further understood that it may be. It will be further understood that it may be within the range between and including any of the minimum values and any of the maximum values of the above and including them.

[0146] According to other embodiments, the first filler precursor material may have a specific size distribution D 90 value. For example, the D of the first filler precursor material is at least about 0.9, or at least 90 about 1.0, or at least about 1.1, or at least about 1.2, or at least about 1.3, or at least about 1.4, or at least about 1.5, or at least about 1.6 micrometers, or at least about 1.7 micrometers, or at least about 1.8 micrometers, or at least about 1.9 micrometers, or at least about 2.0 micrometers, or at least about 2.1 micrometers, or at least about 2.2​ micrometer, or at least about 2.1 micrometers, or at least about 2.2 micrometers, or at least about 2.3 micrometers, or at least about 2.4 micrometers, or at least about 2.5 micrometers, or at least about 2.6 micrometers, or even at least about 2.7 micrometers, etc., at least about 0.8 micrometers may be sufficient. According to still other embodiments, the first filler material D of the material 90 is about 8.0 micrometers or less, for example, about 7.5 micrometers or less , or about 7.0 micrometers or less, or about 6.5 micrometers or less, or about 6. 0 micrometers or less, or about 5.5 micrometers or less, or about 5.4 micrometers or less, or about 5.3 micrometers or less, or about 5.2 micrometers or less, or even about 5.1 micrometers or less may be sufficient. D of the first filler precursor material 90 is understood to be any value between and including any of the above minimum values and any of the above maximum values will be understood. D of the first filler precursor material 90 is understood to be within and including the range between any of the above minimum values and any of the above maximum values will be further understood.

[0147] According to still other embodiments, the first filler precursor material may have a specific average particle size measured using laser diffraction spectroscopy . For example, the average particle size of the first filler precursor material is about 10 micrometers or less, for example, about 9 micrometers or less, or about 8 micrometers or less, or about 7 micrometers or less, or about 6 micrometers or less, or about 5 micrometers or less, or about 4 micrometers or less, or about 3 micrometers or less, or even about 2 micrometers or less. The average particle size of the first filler precursor material is any value between any of the above values and includes any of the above values. It will be understood that the average particle size of the first filler precursor material can be any value within the range between the above values and includes the above values.

[0148] According to yet another embodiment, the first filler precursor material can be described as having a specific particle size distribution span (PSDS). The PSDS of the (D 90 -D 10 ) / D 50 first filler precursor material is equal to, where D 90 is equal to the D 90 particle size distribution measurement value of the first filler precursor material, and D 10 is equal to the D 10 particle size distribution measurement value of the first filler precursor material, and D 50 is equal to the D 50 particle size distribution measurement value of the first filler precursor material. For example, the PSDS of the first filler precursor material can be about 5 or less, for example, about 4.5 or less, or about 4 .0 or less, or about 3.5 or less, or about 3.0 or less, or even about 2.5 or less. It will be understood that the PSDS of the first filler precursor material can be any value between any of the above values and includes any of the above values. It will be further understood that the PSDS of the first filler precursor material can be any

[0149] According to yet another embodiment, the first filler precursor material can be described as having a specific average surface area measured using the Brunauer-Emmett-Teller (BET) surface area analysis method (nitrogen adsorption). For example, the first filler precursor material can have an average surface area of about 9.9 m / g or less, or about 9.5 m / g or less, or about 9.0 m 2 / g or less, or 2 about 8.5 m 2 / g or less, or about 8.0 m / g or less, or about 7.5 m 2 / g or less, or about 7.0 m 2 / g or less, or about 6.5 m 2 / g or less, or about 6.0 m 2 / g or less, or about 5.5 m 2 / g or less, or about 5.0 m 2 / g or less, or about 5.5 m 2 / g or less, or about 5.0 m 2 / g or less, or about 4.5 m 2 / g or less, or about 4 .0 m 2 / g or less, or even about 3.5 m 2 / g or less, etc., and can have an average surface area of about 10 m 2 / g or less. According to yet another embodiment, the first filler precursor material can have an average surface area of at least about 1.2 m / g, for example, at least about 2.4 m 2 / g. It is understood that the average surface area of the first filler precursor material can be any value between and including any of the above minimum values and any of the maximum values 2 . It is further understood that the average surface area of the first filler precursor material can be within the range between and including any of the above minimum values and any of the maximum values . . . . .

[0150] According to other embodiments, the first filler precursor material may include a specific material. In particular According to certain embodiments, the first filler precursor material may include a silica-based compound. Further According to other embodiments, the first filler precursor material may be composed of a silica-based compound. According to other embodiments, the first filler precursor material may include silica. Further according to other embodiments, the first filler precursor material may be composed of silica.

[0151] According to still other embodiments, the first forming mixture can include a specific content of the first ceramic filler precursor component. For example, the content of the first ceramic filler precursor component is at least about 31% by volume, or at least about 32% by volume, or at least about 33% by volume, or at least about 34% by volume, or at least about 35% by volume, or at least about 36% by volume, or at least about 37% by volume, or at least about 38% by volume, or at least about 39% by volume, or at least about 40% by volume, or at least about 41% by volume, or at least about 42% by volume, or at least about 43% by volume at least about 44% by volume, or at least about 45% by volume, or at least about 46% by volume at least about 47% by volume, or at least about 48% by volume, or at least about 49% by volume, or at least about 50% by volume, or at least about 51% by volume, or at least about 52% by volume, or at least about 53% by volume, or even at least about 54% by volume, etc., and may be at least about 30% by volume. According to still other embodiments, the content of the first ceramic filler precursor component is about 56% by volume or less with respect to the total volume of the first forming mixture. ​, or even about 55% by volume or less, such as about 57% by volume or less. The first ceramic The content of the filler precursor component can be understood to be any value between and including any of the above minimum values and any of the above maximum values. The first ceramic It will be further understood that the content of the filler precursor component can be within and including the range between any of the above minimum values and any of the above maximum values. The content of the first ceramic filler precursor component can be understood to be any value between and including any of the above minimum values and any of the above maximum values. It will be further understood that the content of the first ceramic filler precursor component can be within and including the range between any of the above minimum values and any of the above maximum values.

[0152] According to still other embodiments, the first ceramic filler precursor component can include a first filler precursor material having a specific content. For example, the content of the first filler precursor material can be at least about 81% by volume, or at least about 82% by volume, or at least about 83% by volume, or at least about 84% by volume with respect to the total volume of the first ceramic filler precursor component, or at least about 85% by volume, or at least about 86% by volume, or at least about 87% by volume , or at least about 88% by volume, or at least about 89% by volume, or even at least about 90% by volume, such as at least about 80% by volume. According to still other embodiments , the content of the first filler precursor material can be about 100% by volume or less, or about 99% by volume or less, or about 98% by volume or less, or about 9 6% by volume or less, or about 95% by volume or less, or about 94% by volume or less, or about 93% by volume or less , or even about 92% by volume or less, such as about 100% by volume or less, with respect to the total volume of the first ceramic filler precursor component. It will be understood that the content of the first filler precursor material can be any value between and including any of the above minimum values and any of the above maximum values. The first filler precursor It will be understood that the content of the first filler precursor material can be any value between and including any of the above minimum values and any of the above maximum values. It will be understood that the content of the first filler precursor material can be any value between and including any of the above minimum values and any of the above maximum values. It will be understood that the content of the first filler precursor material can be any value between and including any of the above minimum values and any of the above maximum values. It will be understood that the content of the first filler precursor material can be any value between and including any of the above minimum values and any of the above maximum values. It will be understood that the content of the first filler precursor material can be any value between and including any of the above minimum values and any of the above maximum values. The content of the bulk material may be between any of the above-mentioned minimum values and any of the maximum values and it will be further understood that it may also be within the range including them.

[0153] According to still other embodiments, the first ceramic filler precursor component may include a second filler pre- cursor material.

[0154] According to still other embodiments, the second filler precursor material may include a specific material . For example, the second filler precursor material may include a high dielectric constant ceramic material, for example, at least about a ceramic material having a dielectric constant of 14. According to a specific embodiment, the second filler precursor material may include a high dielectric constant ceramic material, for example, TiO2, SrTiO3, Zr Ti2O6, MgTiO3, CaTiO3, BaTiO4, or any combination thereof .

[0155] According to still other embodiments, the second filler precursor material may include TiO2. According to still other embodiments, the second filler precursor material may be composed of TiO2 .

[0156] According to still other embodiments, the first ceramic filler precursor component may include a second filler precursor material having a specific content. For example, the content of the second filler precursor material may be at least about 2% by volume, or at least about 3% by volume, or at least about 4% by volume, or at least about 5% by volume, or at least about 6% by volume, or at least about 7% by volume, or at least about 8% by volume, or at least about 9% by volume, or at least about 10% by volume, etc., of at least about 1% by volume with respect to the total volume of the first ceramic filler precursor component, and may be also. According to yet another embodiment, the content of the second filler precursor material is equal to or greater than the content of the first ceramic. about 19% by volume or less, or about 18% by volume or less, or about 17% by volume or less, or about 16% by volume or less, or about 15% by volume or less, or about 14% by volume or less or about 20% by volume or less, such as about 13% by volume or less, or about 12% by volume or less. The content of the second filler precursor material is within the range of any one of the above minimum values ​​and any one of the above maximum values. It will be understood that the value may be any value between and including any of the following: The content of the second filler precursor material is between one of the minimum values ​​and one of the maximum values ​​described above. It will be further understood that the range may be between and including any of the above.

[0157] According to yet another embodiment, the first ceramic filler precursor component has a specific content of For example, the first ceramic filler precursor component may include at least At least about 97%, such as at least about 98%, or even at least about 99%, of amorphous material. The content of amorphous material may be any value between any of the values ​​recited above, It will be understood that the value may include any of the values ​​recited above. The content of may be any value within the range of values ​​stated above, including the values ​​stated above. It will be further understood that

[0158] According to another embodiment, the first resin matrix precursor component comprises a specific material. For example, the first resin matrix precursor component may include a perfluoropolymer. According to yet another embodiment, the first resin matrix precursor component is a perfluoro The insulating layer may be made of a copolymer.

[0159] According to still other embodiments, the perfluoropolymer of the first resin precursor matrix component may include a copolymer of tetrafluoroethylene (TFE), a copolymer of hexafluoropropylene ( HFP), a terpolymer of tetrafluoroethylene (TFE), or any combination thereof. According to other embodiments, the perfluoropolymer of the first resin matrix precursor component may be composed of a copolymer of tetrafluoroethylene (TFE), a copolymer of hexafluoropropylene (HFP), a terpolymer of tetrafluoroethylene (TF E), or any combination thereof. According to still other embodiments, the perfluoropolymer of the first resin matrix precursor component may include polytetrafluoroethylene (PTFE), perfluoroalkoxy polymer resin (PFA), fluorinated ethylene propylene (FEP), or any combination thereof. According to still other embodiments, the perfluoropolymer of the first resin matrix precursor component may be composed of polytetrafluoroethylene (PTFE), perfluoroalkoxy polymer resin (PFA), fluorinated ethylene propylene (FEP), or any combination thereof.

[0160] According to still other embodiments, the first forming mixture may include a specific content of the first resin matrix precursor component. For example, the content of the first resin matrix precursor component is at least about 46% by volume, or at least about 4 7% by volume, or at least about 48% by volume, or at least about 49% by volume, or at least with respect to the total volume of the first forming mixture. polytetrafluoroethylene (PTFE), perfluoroalkoxy polymer resin (PFA), fluorinated ethylene propylene (FEP), or any combination thereof. be composed of polytetrafluoroethylene (PTFE), perfluoroalkoxy polymer resin (PFA), fluorinated ethylene propylene (FEP), or any combination thereof.

[0161] According to still other embodiments, the first forming mixture may include a specific content of the first resin matrix precursor component. For example, the content of the first resin matrix precursor component is at least about 46% by volume, or at least about 4 7% by volume, or at least about 48% by volume, or at least about 49% by volume, or at least About 50% by volume, or at least about 51% by volume, or at least about 52% by volume, or at least about 53% by volume, or at least about 54% by volume, or even at least about 55% by volume, any of which may be at least about 45% by volume. According to still other embodiments, the content of the first resin matrix precursor component is about 63% by volume or less, or about 62% by volume or less, or about 61% by volume or less, or about 60% by volume or less, or about 59 % by volume or less, or about 58% by volume or less, or even about 57% by volume or less, based on the total volume of the first forming mixture. It will be understood that the content of the first resin ma trix precursor component can be any value between and including any of the above minimum values and any of the above maximum values. It will be further understood that the content of the first resin matrix precursor component can be within and including the range between any of the above minimum values and any of the above maximum values.

[0162] According to still other embodiments, the first forming mixture may include a specific content of perfluoropoly mer. For example, the content of the perfluoropolymer is at least about 46% by volume, or at least about 47% by volume, or at least about 48% by volume, or at least about 49% by volume, or at least about 50% by volume, or at least about 51% by volume, or at least about 52% by volume, or at least about 53% by volume, or at least about 54% by volume, or even at least about 55% by volume, etc., and may be at least about 45% by volume. According to still other embodiments, the content of the perfluoropolymer is about 62% by volume or less, or about 61% by volume or less, or about 6 % by volume or less, based on the total volume of the first forming mixture. 1 0 volume % or less, or about 59 volume % or less, or about 58 volume % or less, or even about 57 volume % It can be, for example, about 63 volume % or less, such as the following. The content of the perfluoropolymer is any value between and including any of the above minimum values and any of the above maximum values It will be understood that it may be. The content of the perfluoropolymer may be within the range between and including any of the above minimum values and any of the above maximum values It will be further understood that it may be. It will be further understood that it may be within the range between and including any of the above minimum values and any of the above maximum values

[0163] According to still other embodiments, forming the dielectric substrate can further include combining a second resin matrix precursor component and a second ceramic filler precursor component to form a second forming mixture forming the second forming mixture into a second filled polymer layer that covers under the polyimide layer providing a second fluoropolymer - based adhesive layer that covers under the second filled polymer layer

[0164] According to still other embodiments, the second fluoropolymer - based adhesive layer can have a specific average thickness For example, the second fluoropolymer - based adhesive layer can be at least about 0.2 micrometers, such as at least about 0.5 micrometers, or at least about 1.0 micrometer or at least about 1.5 micrometers, or at least about 2.0 micrometers, or at least about 2.5 micrometers, or even at least about 3 .0 micrometers. According to still other embodiments, the average thickness of the second fluoropolymer - based adhesive layer is about 7 micrometers or less, such as about 6.5 or less, or about 6 .0 or less, or about 5.5 or less, or about 5.0 or less, about 4.9 micrometers or less, or .0 or less​​​​​ 4.8 micrometers or less, or about 4.7 micrometers or less, or about 4.6 mic rometers or less, or about 4.5 micrometers or less, or about 4.4 micrometers or less, or about 4.3 micrometers or less, or about 4.2 micrometers or less, or about 4.1 micrometers or less, or about 4.1 micrometers or less, or about 4.0 mic rometers or less, or about 3.9 micrometers or less, or about 3.8 micrometers or less or less, or about 3.7 micrometers or less, or about 3.6 micrometers or less, or even less than about 3.5 micrometers. The average thickness of the second fluoropolymer-based adhesive layer may be any value between any of the above minimum values and any of the above maximum values and including them It will be understood that. The average thickness of the second fluoropolymer-based adhesive layer may be between any of the above minimum values and any of the above maximum values and including them It will be further understood that within the range.

[0165] According to still other embodiments, the second fluoropolymer-based adhesive layer 207 may contain specific materials For example, the second fluoropolymer-based adhesive layer 207 may be a fluoropolymer (e.g., polytetrafluoroethylene (PTFE), modified polytetrafluoroethylene (mPTFE), fluorinated ethylene-propylene (FEP), etc., copolymers and terpolymers of tetrafluoroethylene , perfluoroalkoxy polymer resin (PFA), and modified perfluoroalkoxy polymer resin (mPFA), as well as derivatives and blends thereof . According to still other embodiments, the second fluoropolymer-based adhesive layer 207 may be composed of fluoropolymers (e.g., polytetrafluoroethylene (PTFE), modified polytetrafluoroethylene (mPTFE), fluorinated ethylene-propylene (FEP) such as copolymers and terpolymers of tetrafluoroethylene, perfluoroalkoxy polymer resin (PFA), and modified perfluoroalkoxy polymer resin (mPFA), and their derivatives and blends.

[0166] According to certain embodiments, the second ceramic filler precursor component may include a third filler precursor material having certain properties that can improve the performance of the copper-clad laminate formed by forming method 300.

[0167] According to certain embodiments, the third filler precursor material may have a specific size distribution. For the purposes of the embodiments described herein, the particle size distribution of a material, e.g., the particle size distribution of the third filler precursor material, may be described using any combination of 10 particle size distribution D values D 50 and D 90 . The D value from the particle size distribution is defined as the particle size value at which 10% of the particles are smaller 10 than that value and 90% of the particles are larger than that value. The D value from the particle size distribution is defined as the particle size value at which 50% of the particles are smaller than that value and 50% of the particles are larger than that value. The D 50 value from the particle size distribution is defined as the particle size value at which 90% of the particles are smaller than that value and 10% of the particles are larger than that value. For the purposes of the embodiments described herein, 90 the particle size measurement of a specific material is performed using laser diffraction spectroscopy.

[0168] According to certain embodiments, the third filler precursor material may have a specific size distribution D 10 value . For example, the D 10 value of the third filler precursor material is at least about 0.3 micro meter, or at least about 0.4 micrometer, or at least about 0.5 micro meter, or at least about 0.6 micrometer, or at least about 0.7 micro meter, or at least about 0.8 micrometer, or at least about 0.9 micro meter, or at least about 1.0 micrometer, or at least about 1.1 micro meter, or even at least about 1.2 micrometer, etc., and may be at least about 0 .2 micrometer. According to still other embodiments, the D of the third filler material 10 is about 1.5 micrometer or less, or even about 1.4 micrometer or less, and may be about 1.6 micrometer or less. The D 10 of the third filler precursor material may be any value between and including any of the above minimum values and any of the above maximum values. It will be understood that the D of the third filler precursor material 10 is within and including the range between any of the above minimum values and any of the above maximum values . It will be further understood that this may be the case.

[0169] According to other embodiments, the third filler precursor material may have a specific size distribution D 50 value . For example, the D 50 of the third filler precursor material is at least about 0.6 micro meter, or at least about 0.7 micrometer, or at least about 0.8 micro meter, or at least about 0.9 micrometer, or at least about 1.0 micro meter, or at least about 1.1 micrometer, or at least about 1.2 micro meter, or at least about 1.3 micrometer, or at least about 1.4 micro meter, or at least about 1.5 micrometer, or at least about 1.6 micro meter, or at least about 1.7 micrometer, or at least about 1.8 micro meter, or at least about 1.9 micrometer, or at least about 2.0 micro meter, or at least about 2.1 micrometer, or even at least about 2.2 mic rometer or the like, may be at least about 0.5 micrometer. Further other According to other embodiments, the D of the third filler material 50 is about 2.6 micrometers or less, or about 2.5 micrometers or less, or even about 2.4 micrometers or less, etc., about 2 .7 micrometers or less may be sufficient. The D of the third filler precursor material 50 is between any of the above minimum values and any of the maximum values and may be any value including them It will be understood. The D of the third filler precursor material 50 is the above minimum It will be further understood that it may be within the range between any of the values and any of the maximum values and including them as well.

[0170] According to other embodiments, the third filler precursor material has a specific size distribution D 90 value may have. For example, the D of the third filler precursor material 90 is at least about 0.9, or at least at least about 1.0, or at least about 1.1, or at least about 1.2, or at least about 1.3, or at least about 1.4, or at least about 1.5, or at least about 1.6 micrometers, or at least about 1.7 micrometers, or at least about 1.8 micrometers, or at least about 1.9 micrometers, or at least about 2.0 micrometers, or at least about 2.1 micrometers, or at least about 2.2 micrometers, or at least about 2.3 micrometers, or at least about 2.4 micrometers, or at least about 2.5 micrometers, or at least about 2.6 micrometers, or even at least about 2.7 micrometers, etc., at least may be about 0.8 micrometers. According to still other embodiments, the third filler material D of the material 90 is about 7.5 micrometers or less, or about 7.0 micrometers or less, or is about 6.5 micrometers or less, or about 6.0 micrometers or less, or about 5.5 micrometers or less, or about 5.4 micrometers or less, or about 5.3 micrometers or less, or about 5.2 micrometers or less, or even about 5.1 micrometers or less etc., may be about 8.0 micrometers or less. The D9 0 of the third filler precursor material is between and including any of the above minimum values and any of the above maximum values and it should be understood that it can be any value. The D 90 of the third filler precursor material is within and including the range between and including any of the above minimum values and any of the above maximum values and it should be further understood that it can be.

[0171] According to still other embodiments, the third filler precursor material uses laser diffraction spectroscopy It may have a specific average particle size measured thereby. For example, the average particle size of the third filler precursor material is about 9 micrometers or less, or about 8 micrometers or less, or about 7 micro meters or less, or about 6 micrometers or less, or about 5 micrometers or less, or about 4 micrometers or less, or about 3 micrometers or less, or even about 2 micrometer s or less, etc., and may be about 10 micrometers or less. The average particle size of the third filler precursor material can be any value between and including any of the above values, which should be understood. The average particle size of the third filler precursor material can be further understood to be within the range between and including any of the above values.

[0172] According to still other embodiments, the third filler precursor material can be described as having a specific particle size distribution span (P SDS). The PSDS of the third filler precursor material is , (D 90 -D 10 ) / D 50 , where D 90 is equal to the D 90 particle size distribution measurement value of the third filler precursor material, and D 10 is equal to the D 10 particle size distribution measurement value of the third filler precursor material, and D 50 is equal to the D 50 particle size distribution measurement value of the third filler precursor material. For example , the PSDS of the third filler precursor material can be about 5 or less, such as about 4.5 or less, or about 4.0 or less, or about 3 .5 or less, or about 3.0 or less, or even about 2.5 or less. The PSDS of the third filler precursor material can be any value between and including any of the above values, which should be understood. The PSDS of the third filler precursor material is the above ​​​​ It should be further understood that it may be within and include any of the values among them. That's it.

[0173] According to still other embodiments, the third filler precursor material can be described as having a specific average surface area measured using Brunauer-Emmett-Teller (BET) surface area analysis (nitrogen adsorption). For example, the third filler precursor material can have an average surface area of about 9. 9 m / g or less, or about 9.5 m / g or less, or about 9.0 m 2 / g or less, or about 8.5 2 m 2 / g or less, or about 8.0 m m 2 / g or less, or about 7.5 m 2 / g or less, or about 7.0 m 2 / g or less, or about 6.5 m 2 / g or less, or about 6.0 m 2 / g or less, or about 5.5 m 2 / g or less, or about 5.0 m 2 / g or less, or about 4.5 m 2 / g or less, or about 4.0 m 2 / g or less, or about 3.5 m 2 / g or less, or even about 3.5 m 2 / g or less, etc., and can have an average surface area of about 10 m 2 / g or less. According to still other embodiments, the third filler precursor material can have an average surface area of at least about 1.2 m 4 m 2 / g or at least about 2. 2 / g. The average surface area of the third filler precursor material can be understood to be any value between and including any of the above minimum values and any of the above maximum values. The average surface area of the third filler precursor material can be between any of the above minimum values and any of the above maximum values. That's it. That's it. That's it. It will be further understood that it can be within the range including them.

[0174] According to other embodiments, the third filler precursor material may include a specific material. The specific According to an embodiment, the third filler precursor material may include a silica-based compound. Further, according to another embodiment, the third filler precursor material may be composed of a silica-based compound. According to other embodiments, the third filler precursor material may include silica. Further, according to another embodiment, the third filler precursor material may be composed of silica.

[0175] According to still another embodiment, the second forming mixture can include a second ceramic filler precursor component in a specific content. For example, the content of the second ceramic filler precursor component is at least about 31% by volume, or at least about 32% by volume, or at least about 33% by volume, or at least about 34% by volume, or at least about 35% by volume, or at least about 36% by volume, or at least about 37% by volume, or at least about 38% by volume, or at least about 39% by volume, or at least about 40% by volume, or at least about 41% by volume, or at least about 42% by volume, or at least about 43% by volume or at least about 44% by volume, or at least about 45% by volume, or at least about 46% by volume, or at least about 47% by volume, or at least about 48% by volume, or at least about 4 9% by volume, or at least about 50% by volume, or at least about 51% by volume, or at least about 52% by volume, or at least about 53% by volume, or even at least about 54% by volume, etc., and may be at least about 30% by volume. According to still another embodiment, the second ceramic The content of the ceramic filler precursor component is about 56% by volume or less, or even about 55% by volume or less, or about 57% by volume or less, based on the total volume of the second forming mixture. , or even about 57% by volume or less, such as about 56% by volume or less, or even about 55% by volume or less. The content of the second ceramic filler precursor component can be understood to be any value between and including any of the above minimum values and any of the maximum values. The content of the second ceramic filler precursor component can be further understood to be within the range between and including any of the above minimum values and any of the maximum values. The content of the second ceramic filler precursor component can be understood to be any value between and including any of the above minimum values and any of the maximum values. It can be further understood that it is within the range between and including any of the above minimum values and any of the maximum values.

[0176] According to yet another embodiment, the second ceramic filler precursor component can include a third filler precursor material having a specific content. For example, the content of the third filler precursor material can be at least about 80% by volume, such as at least about 81% by volume, or at least about 82% by volume, or at least about 83% by volume, or at least about 84% by volume , or at least about 85% by volume, or at least about 86% by volume, or at least about 87% by volume , or at least about 88% by volume, or at least about 89% by volume, or even at least about 90% by volume, based on the total volume of the second ceramic filler precursor component. According to yet another embodiment , the content of the third filler precursor material can be about 100% by volume or less, such as about 99% by volume or less, or about 98% by volume or less, or about 97% by volume or less, or about 9 6% by volume or less, or about 95% by volume or less, or about 94% by volume or less, or about 93% by volume or less , or even about 92% by volume or less, based on the total volume of the second ceramic filler precursor component. The content of the third filler precursor material can be between and including any of the above minimum values and any of the maximum values. The content of the third filler precursor material can be between and including any of the above minimum values and any of the maximum values. The content of the third filler precursor material can be between and including any of the above minimum values and any of the maximum values. The content of the third filler precursor material can be between and including any of the above minimum values and any of the maximum values. The content of the third filler precursor material is between any of the above minimum values and any of the maximum values It will be understood that they can be any value including those. The inclusion of the third filler precursor material amount can further be understood to be within and including any of the above minimum values and any of the maximum values.

[0177] According to still other embodiments, the second ceramic filler precursor component may include a fourth filler precursor material.

[0178] According to still other embodiments, the fourth filler precursor material may include a specific material. For example, the fourth filler precursor material can include any high dielectric constant ceramic material having a dielectric constant of at least about 14. According to certain embodiments, the fourth filler precursor material can include any high dielectric constant ceramic material such as TiO2, SrTiO3, ZrTi2O6, MgTiO3, CaTiO 3, BaTiO4, or any combination thereof.

[0179] According to still other embodiments, the fourth filler precursor material may include TiO2. According to still other embodiments, the fourth filler precursor material may be composed of TiO2.

[0180] According to still other embodiments, the second ceramic filler precursor component can include a specific content of the fourth filler precursor material. For example, the content of the fourth filler precursor material is at least about 2 volume %, or at least about 3 volume %, or at least about 4 volume %, or at least about 5 volume %, or at least about 6 volume %, or at least about 7 volume %, or at least about 8 volume %, or at least about 9 volume %, or at least about 10 volume %, or at least about 11 volume %, or at least about 12 volume %, or at least about 13 volume %, or at least about 14 volume %, or at least about 15 volume %, or at least about 16 volume %, or at least about 17 volume %, or at least about 18 volume %, or at least about 19 volume %, or at least about 20 volume %, or at least about 21 volume %, or at least about 22 volume %, or at least about 23 volume %, or at least about 24 volume %, or at least about 25 volume %, or at least about 26 volume %, or at least about 27 volume %, or at least about 28 volume %, or at least about 29 volume %, or at least about 30 volume %, or at least about 31 volume %, or at least about 32 volume %, or at least about 33 volume %, or at least about 34 volume %, or at least about 35 volume %, or at least about 36 volume %, or at least about 37 volume %, or at least about 38 volume %, or at least about 39 volume %, or at least about 40 volume %, or at least about 41 volume %, or at least about 42 volume %, or at least about 43 volume %, or at least about 44 volume %, or at least about 45 volume %, or at least about 46 volume %, or at least about 47 volume %, or at least about 48 volume %, or at least about 49 volume %, or at least about 50 volume %, or at least about 51 volume %, or at least about 52 volume %, or at least about 53 volume %, or at least about 54 volume %, or at least about 55 volume %, or at least about 56 volume %, or at least about 57 volume %, or at least about 58 volume %, or at least about 59 volume %, or at least about 60 volume %, or at least about 61 volume %, or at least about 62 volume %, or at least about 63 volume %, or at least about 64 volume %, or at least about 65 volume %, or at least about 66 volume %, or at least about 67 volume %, or at least about 68 volume %, or at least about 69 volume %, or at least about 70 volume %, or at least about 71 volume %, or at least about 72 volume %, or at least about 73 volume %, or at least about 74 volume %, or at least about 75 volume %, or at least about 76 volume %, or at least about 77 volume %, or at least about 78 volume %, or at least about 79 volume %, or at least about 80 volume %, or at least about 81 volume %, or at least about 82 volume %, or at least about 83 volume %, or at least about 84 volume %, or at least about 85 volume %, or at least about 86 volume %, or at least about 87 volume %, or at least about 88 volume %, or at least about 89 volume %, or at least about 90 volume %, or at least about 91 volume %, or at least about 92 volume %, or at least about 93 volume %, or at least about 94 volume %, or at least about 95 volume %, or at least about 96 volume %, or at least about 97 volume %, or at least about 98 volume %, or at least about 99 volume %, or at least about 100 volume % of the total volume of the second ceramic filler precursor component. ​​​​at least about 1 volume %, such as at least about 9 volume % or at least about 10 volume % may be. According to still other embodiments, the content of the fourth filler precursor material is about 19 volume % or less, or about 18 volume % or less, or about 17 volume % or less, or about 16 volume % or less, or about 15 volume % or less, or about 14 volume % or less, or about 13 volume % or less, or about 12 volume % or less, etc., about 20 volume % or less may be. It will be understood that the content of the fourth filler precursor material can be any value between and including any of the above minimum values and any of the maximum values. The fourth filler precursor material content can be further understood to be within and including the range between any of the above minimum values and any of the maximum values.

[0181] According to still other embodiments, the second ceramic filler precursor component can include an amorphous material in a specific content. For example, the second ceramic filler precursor component can include at least about 97% of an amorphous material, such as at least about 98% or even at least about 99%. The content of the amorphous material can be any value between any of the above values, including the above values. It will be understood that the content of the amorphous material can be any value within the range between the above values, including the above values. It will be further understood that the content of the amorphous material can be any value within the range between the above values, including the above values.

[0182] According to other embodiments, the second resin matrix precursor component may include a specific material. For example, the second resin matrix precursor component may include a perfluoropolymer. It is also possible. According to still other embodiments, the second resin matrix precursor component may be composed of a perfluoropolymer.

[0183] According to still other embodiments, the perfluoropolymer of the first resin precursor matrix component may include a copolymer of tetrafluoroethylene (TFE), a copolymer of hexafluoropropylene (HFP), a terpolymer of a polymer of tetrafluoroethylene (TFE), or any combination thereof. According to other embodiments, the perfluoropolymer of the second resin matrix precursor component may be composed of a copolymer of tetrafluoroethylene (TFE), a copolymer of hexafluoropropylene (HFP), a terpolymer of tetrafluoroethylene (TFE), or any combination thereof.

[0184] According to still other embodiments, the perfluoropolymer of the second resin matrix precursor component may include polytetrafluoroethylene (PTFE), perfluoroalkoxy polymer resin (PFA), fluorinated ethylene propylene (FEP), or any combination thereof. According to still other embodiments, the perfluoropolymer of the second resin matrix precursor component may be composed of polytetrafluoroethylene (PTFE), perfluoroalkoxy polymer resin (PFA), fluorinated ethylene propylene (FEP), or any combination thereof.

[0185] According to still other embodiments, the second forming mixture may include a specific content of the second resin matrix precursor component. For example, the content of the second resin matrix precursor component The amount is at least about 46% by volume, or at least about 47% by volume, or at least about 48% by volume, or at least about 49% by volume, or at least about 50% by volume, or at least about 51% by volume, or at least about 52% by volume, or at least about 53% by volume, or at least about 54% by volume, or even at least about 55% by volume such as, etc., and may be at least about 45% by volume. According to still other embodiments, the content of the second resin matrix precursor component is about 63% by volume or less, or about 62% by volume or less, or about 61% by volume or less, or about 60% by volume or less, or about 59% by volume or less, or about 58% by volume or less, or even about 57% by volume or less, based on the total volume of the second forming mixture. It will be understood that the content of the second resin matrix precursor component can be any value between and including any of the above minimum values and any of the above maximum values. It will be further understood that the content of the second resin ma trix precursor component can be within the range between and including any of the above minimum values and any of the above maximum values.

[0186] According to still other embodiments, the second forming mixture may contain a specific content of perfluoropoly mer. For example, the content of the perfluoropolymer is at least about 46% by volume, or at least about 47% by volume, or at least about 48% by volume, or at least about 49% by volume, or at least about 50% by volume, or at least about 51% by volume, or at least about 52% by volume, or at least about 53% by volume, or at least about 54% by volume, or at least about 55% by volume such as, etc., and may be at least about 45% by volume based on the total volume of the second forming mixture. It may be in terms of percentage by volume. According to still other embodiments, the content of the perfluoropolymer is the second For the total volume of the forming mixture of 2, it may be about 62% by volume or less, or about 61% by volume or less, or about 6 0% by volume or less, or about 59% by volume or less, or about 58% by volume or less, or even about 57% by volume It may be about 63% by volume or less, such as the following. The content of the perfluoropolymer is any value between and including any of the above Minimum values and any of the maximum values and is understood to be acceptable. The content of the perfluoropolymer is between any of the above minimum Values and any of the maximum values and is understood to be within the range including them. It will be further understood that it may be within the range between and including any of the above minimum Values and any of the maximum values.

[0187] Next, referring to an embodiment of a copper-clad laminate formed according to forming method 300, FIG. 4 a includes a view of a copper-clad laminate 400. As shown in FIG. 4a, the copper-clad laminate 400 can include a copper foil Layer 401 and a dielectric substrate 405 covering the surface of the copper foil layer 401. As further shown in FIG. 4 a, the dielectric substrate 405 can include a first fluoropolymer-based adhesive layer 403 A polyimide layer 402, and a first filled polymer layer 404 covering the polyimide layer 402 And can include. As shown in FIG. 4a, the first filled polymer layer 404 is the first Resin matrix component 410 and a first ceramic filler component 420 and can include.

[0188] According to still other embodiments, the first fluoropolymer-based adhesive layer 403 can have a specific average Thickness. For example, the first fluoropolymer-based adhesive layer 403 is at least about 0.2 micrometers, for example, at least about 0.5 micrometers, or at least is also about 1.0 micrometer, or at least about 1.5 micrometers, or at least also about 2.0 micrometers, or at least about 2.5 micrometers, or even at least about 3.0 micrometers. According to still other embodiments, the average thickness of the first fluoropolymer-based adhesive layer 403 is about 7 micrometers or less, for example, about 6 .5 or less, or about 6.0 or less, or about 5.5 or less, or about 5.0 or less, about 4.9 or less, or about 4.8 micrometers or less, or about 4.7 micrometers or less, or about 4.6 micrometers or less, or about 4.5 micrometers or less, or about 4.4 micrometers or less, or about 4.3 micrometers or less, or about 4.2 micrometers or less, or about 4.1 micrometers or less, or about 4.1 micrometers or less, or about 4.0 micrometers or less, or about 3.9 micrometers or less, or about 3.8 micrometers or less, or about 3.7 micrometers or less, or about 3.6 micrometers or less, or even about 3.5 micrometers or less. It will be understood that the average thickness of the first fluoropolymer-based adhesive layer 403 may be any value between any of the above minimum values and any of the above maximum values and may include any of them. It will be further understood that the average thickness of the first fluoropolymer-based adhesive layer 403 may be within a range between and including any of the above minimum values and any of the above maximum values. According to still other embodiments, the first fluoropolymer-based adhesive layer 403 may contain a specific material. For example, the first fluoropolymer-based adhesive layer 403 may contain a fluoropolymer 403. The average thickness of the first fluoropolymer-based adhesive layer 403 may be any value between any of the above minimum values and any of the above maximum values and may include any of them. It will be further understood that the average thickness of the first fluoropolymer-based adhesive layer 403 may be within a range between and including any of the above minimum values and any of the above maximum values. It will be understood that the average thickness of the first fluoropolymer-based adhesive layer 403 may be any value between any of the above minimum values and any of the above maximum values and may include any of them. It will be further understood that the average thickness of the first fluoropolymer-based adhesive layer 403 may be within a range between and including any of the above minimum values and any of the above maximum values. It will be understood that the average thickness of the first fluoropolymer-based adhesive layer 403 may be any value between any of the above minimum values and any of the above maximum values and may include any of them. It will be further understood that the average thickness of the first fluoropolymer-based adhesive layer 403 may be within a range between and including any of the above minimum values and any of the above maximum values. It will be further understood that the average thickness of the first fluoropolymer-based adhesive layer 403 may be within a range between and including any of the above minimum values and any of the above maximum values.

[0189] According to still other embodiments, the first fluoropolymer-based adhesive layer 403 may contain a specific material. For example, the first fluoropolymer-based adhesive layer 403 may contain a fluoropolymer 403. The average thickness of the first fluoropolymer-based adhesive layer 403 may be any value between any of the above minimum values and any of the above maximum values and may include any of them. It will be further understood that the average thickness of the first fluoropolymer-based adhesive layer 403 may be within a range between and including any of the above minimum values and any of the above maximum values. (For example, polytetrafluoroethylene (PTFE), modified polytetrafluoroethylene (mPTFE), copolymers and terpolymers of tetrafluoroethylene such as fluorinated ethylene-propylene (FEP), perfluoroalkoxy polymer resin (PFA), and modified perfluoroalkoxy polymer resin (mPFA), and derivatives and blends thereof may be included. According to still other embodiments, the first fluoropolymer-based adhesive layer 403 may be composed of a fluoropolymer (e.g., polytetrafluoroethylene (PTFE), modified polytetrafluoroethylene (mPTFE), copolymers and terpolymers of tetrafluoroethylene such as fluorinated ethylene-propylene (FEP), perfluoroalkoxy polymer resin (PFA), and modified perfluoroalkoxy polymer resin (mPFA), and derivatives and blends thereof. According to certain embodiments, the first ceramic filler component 420 may include a first filler material having certain properties that can improve the performance of the dielectric substrate 405.

[0190] According to certain embodiments, the first filler material of the first ceramic filler component 420 can have a specific size distribution. For the purposes of the embodiments described herein, the particle size distribution of a material, e.g., the particle size distribution of the first filler material, can be described using any combination of particle size distribution D values, D

[0191] The D value from the particle size distribution can be defined as the particle size value at which 10% of the particles are smaller than that value and 90% of the particles are larger than that value. For the purposes of the embodiments described herein, the particle size distribution of a material, e.g., the particle size distribution of the first filler material, can be described using any combination of particle size distribution D values, D The D value from the particle size distribution can be defined as the particle size value at which 10% of the particles are smaller than that value and 90% of the particles are larger than that value. 10 D 50 and D 90 The D value from the particle size distribution can be defined as the particle size value at which 10% of the particles are smaller than that value and 90% of the particles are larger than that value. 10 The D value from the particle size distribution is defined as the particle size value at which 10% of the particles are smaller than that value and 90% of the particles are larger than that value. The D value from the particle size distribution is defined as the particle size value at which 10% of the particles are smaller than that value and 90% of the particles are larger than that value. is obtained. The D value from the particle size distribution is defined as the particle size value at which 50% of the particles are smaller and 50% of the particles are larger than that value. The D value from the particle size distribution is defined as the particle size value at which 90% of the particles are smaller and 10% of the particles are larger than that value. For the purposes of the embodiments described in this specification, the particle size measurement of a specific material is performed using laser diffraction spectroscopy. 50 The value is defined as the particle size value at which 50% of the particles are smaller and 50% of the particles are larger than that value. The D value from the particle size distribution is defined as the particle size value at which 50% of the particles are smaller and 50% of the particles are larger than that value. 90 The D value from the particle size distribution is defined as the particle size value at which 90% of the particles are smaller and 10% of the particles are larger than that value. are smaller and 10% of the particles are larger than that value. For the purposes of the embodiments described in this specification, the particle size measurement of a specific material is performed using laser diffraction spectroscopy. For the purposes of the embodiments described in this specification, the particle size measurement of a specific material is performed using laser diffraction spectroscopy. is performed using laser diffraction spectroscopy.

[0192] According to a particular embodiment, the first filler material of the first ceramic filler component 420 can have a specific size distribution D value. For example, the D of the first filler material can be at least about 0.3 micrometers, or at least about 0.4 micrometers, or at least about 0.5 micrometers, or at least about 0.6 micrometers, or at least about 0.7 micrometers, or at least about 0.8 micrometers, or at least about 0.9 micrometers, or at least about 1.0 micrometers, or at least about 1.1 micrometers, or even at least about 1.2 micrometers, such as at least about 0.2 micrometers. According to yet another embodiment, the D of the first filler material can be about 1.6 micrometers or less, for example, about 1.5 micrometers or less, or even about 1.4 micrometers or less. It will be understood that the D of the first filler material can be any value between and including any of the above minimum values and any of the above maximum values. According to a particular embodiment, the first filler material of the first ceramic filler component 420 can have a specific size distribution D value. 10 For example, the D of the first filler material can be at least about 0.3 micrometers, or at least about 0.4 micrometers, or at least about 0.5 micrometers, or at least about 0.6 micrometers, or at least about 0.7 micrometers, or at least about 0.8 micrometers, or at least about 0.9 micrometers, or at least about 1.0 micrometers, or at least about 1.1 micrometers, or even at least about 1.2 micrometers, such as at least about 0.2 micrometers. 10 For example, the D of the first filler material can be at least about 0.3 micrometers, or at least about 0.4 micrometers, or at least about 0.5 micrometers, or at least about 0.6 micrometers, or at least about 0.7 micrometers, or at least about 0.8 micrometers, or at least about 0.9 micrometers, or at least about 1.0 micrometers, or at least about 1.1 micrometers, or even at least about 1.2 micrometers, such as at least about 0.2 micrometers. or at least about 0.5 micrometers, or at least about 0.6 micrometers, or at least about 0.7 micrometers, or at least about 0.8 micrometers, or at least about 0.9 micrometers, or at least about 1.0 micrometers, or at least about 1.1 micrometers, or even at least about 1.2 micrometers, such as at least about 0.2 micrometers. or at least about 0.7 micrometers, or at least about 0.8 micrometers, or at least about 0.9 micrometers, or at least about 1.0 micrometers, or at least about 1.1 micrometers, or even at least about 1.2 micrometers, such as at least about 0.2 micrometers. or at least about 0.9 micrometers, or at least about 1.0 micrometers, or at least about 1.1 micrometers, or even at least about 1.2 micrometers, such as at least about 0.2 micrometers. or at least about 1.1 micrometers, or even at least about 1.2 micrometers, such as at least about 0.2 micrometers. or at least about 1.2 micrometers, such as at least about 0.2 micrometers. According to yet another embodiment, the D of the first filler material can be about 1.6 micrometers or less, for example, about 1.5 micrometers or less, or even about 1.4 micrometers or less. It will be understood that the D of the first filler material can be any value between and including any of the above minimum values and any of the above maximum values. According to yet another embodiment, the D of the first filler material can be about 1.6 micrometers or less, for example, about 1.5 micrometers or less, or even about 1.4 micrometers or less. 10 According to yet another embodiment, the D of the first filler material can be about 1.6 micrometers or less, for example, about 1.5 micrometers or less, or even about 1.4 micrometers or less. or even about 1.4 micrometers or less. The D of the first filler material can be about 1.6 micrometers or less, for example, about 1.5 micrometers or less, or even about 1.4 micrometers or less. 10 It will be understood that the D of the first filler material can be any value between and including any of the above minimum values and any of the above maximum values. It will be understood that the D of the first filler material can be any value between and including any of the above minimum values and any of the above maximum values. The D of the first filler material can be any value between and including any of the above minimum values and any of the above maximum values. 10may be between any of the above-mentioned minimum values and any of the maximum values and within a range including them, which will be further understood.

[0193] According to other embodiments, the first filler material of the first ceramic filler component 420 may have a specific size distribution D 50 value. For example, the D of the first filler material 50 is at least about 0.8 micrometers, for example, at least about 0.9 micrometers, or at least about 1.0 micrometers, or at least about 1.1 micrometers, or at least about 1.2 micrometers, or at least about 1.3 micrometers, or at least about 1.4 micrometers, or at least about 1.5 micrometers, or at least about 1.6 micrometers, or at least about 1.7 micrometers, or at least about 1.8 micrometers, or at least about 1.9 micrometers, or at least about 2.0 micrometers, or at least about 2.1 micrometers, or even at least about 2.2 micrometers. According to still other embodiments , the D of the first filler material 50 is about 2.7 micrometers or less, for example, about 2.6 microns or less, or about 2.5 micrometers or less, or even about 2.4 micrometers or less. The D of the first filler material 50 may be any value between any of the above-mentioned minimum values and any of the maximum values and including them, which will be understood . The D of the first filler material 50 is any of the above-mentioned minimum values and the maximum value It is further understood that it may be between any one of them and within the range including them. It will be.

[0194] According to other embodiments, the first filler material of the first ceramic filler component 420 may have a specific size distribution D 90 value. For example, the D of the first filler material 90 is at least about 0.9, or at least about 1.0, or at least about 1.1, or at least about 1.2, or at least about 1.3, or at least about 1.4, or at least about 1.5, or at least about 1.6, or at least about 1.7 micrometers, or at least about 1.8 micrometers, or at least about 1.9 micrometers, or at least about 2.0 micrometers, or at least about 2.1 micrometers, or at least about 2.2 micrometers, or at least about 2.3 micrometers, or at least about 2.4 micrometers, or at least about 2.5 micrometers, or at least about 2.6 micrometers, or even at least about 2.7 micrometers, etc., may be at least about 0.8 micrometers. According to still other embodiments, the first fill The D of the agent material 90 is about 8.0 micrometers or less, for example, about 7.5 micrometers or less, or about 7.0 micrometers or less, or about 6.5 micrometers or less, or about 6.0 micrometers or less, or about 5.5 micrometers or less, or about 5.4 microns rometers or less, or about 5.3 micrometers or less, or about 5.2 micrometers or less, or even about 5.1 micrometers or less. The D of the first filler material 90It will be understood that it may be any value between and including any of the above minimum values and any of the above maximum values. The D of the first filler material will also be understood to be within and including the range between any of the above minimum values and any of the above maximum values. 90 is the above will also be understood to be within and including the range between any of the above minimum values and any of the above maximum values. It will be further understood that it may be any value between and including any of the above minimum values and any of the above maximum values.

[0195] According to yet another embodiment, the first filler material of the first ceramic filler component 420 may have a specific average particle size measured by laser diffraction spectroscopy. For example, the average particle size of the first filler material is about 10 micrometers or less, for example, about 9 micrometers or less, or about 8 micrometers or less, or about 7 micrometers or less, or about 6 micrometers or less, or about 5 micrometers or less, or about 4 micrometers or less, or even about 2 micrometers or less. The average particle size of the first filler material may be any value between any of the above values and including any of the above values. It will be understood that the average particle size of the first filler material may be any value within the range between the above values and including the above values. It will be further understood that it may be any value within the range between the above values and including the above values.

[0196] According to yet another embodiment, the first filler material of the first ceramic filler component 420 can be described as having a specific particle size distribution span (PSDS), and the PSD S is equal to (D 90 - D 10 ) / D 50 , where D 90 is equal to the D9 0 particle size distribution measurement value of the first filler material, and D 10 is the D of the first filler material10 equal to the particle size distribution measurement value , D 50 is equal to the D of the first filler material 50 particle size distribution measurement value. For example, the first filler material's PSDS is about 5 or less, for example, about 4.5 or less, or about 4.0 or less, or about 3. 5 or less, or about 3.0 or less, or even about 2.5 or less. The first filler material 's PSDS can be any value between the above-mentioned arbitrary values and can be a value including the above-mentioned arbitrary values as will be understood. The PSDS of the first filler material can be any value within the range between the above-mentioned values and can be a value including the above-mentioned values as will be further understood .

[0197] According to yet another embodiment, the first filler material of the first ceramic filler component 420 can be described as having a specific average surface area measured using Brunauer-Emmett-Teller (BET) surface area analysis (nitrogen adsorption) . For example, the first filler material is about 9.9 m 2 / g or less, or about 9.5 m 2 / g or less, or about 9.0 m 2 / g or less, or about 8.5 m 2 / g or less, or about 8.0 m 2 / g or less, or about 7.5 m 2 / g or less, or about 7.0 m 2 / g or less, or about 6.5 m 2 / g or less, or about 6.0 m 2 / g or less, or about 5.5 m 2 / g or less, or about 5.0 m 2 / g or less, or about 4.5 m 2 / g or less, or about 4.0 m 2 / g or less, or even about 3.5 m 2 / g or less, etc., about 10 m 2 / It may have an average surface area of less than g. According to still other embodiments, the first filler material is at least about 1.2 m 2 / g, for example, at least about 2.4 m 2 / g and may have an average surface area of It will be understood that the average surface area of the first filler material may be any value between and including any of the above minimum values and any of the maximum values It will be understood that the average surface area of the first filler material may be within the range between and including any of the above minimum values and any of the maximum values. It will be further understood that the average surface area of the first filler material may be within the range between and including any of the above minimum values and any of the maximum values. It will be further understood that the average surface area of the first filler material may be within the range between and including any of the above minimum values and any of the maximum values.

[0198] According to other embodiments, the first filler material of the first ceramic filler component 420 may include certain materials. According to certain embodiments, the first filler material may include silica -based compounds. According to still other embodiments, the first filler material may be composed of silica -based compounds. According to other embodiments, the first filler material may include silica and may also be composed of silica according to still other embodiments .

[0199] According to still other embodiments, the first filled polymer layer 404 may include a specific content of the first ceramic filler component 420. For example, the content of the first ceramic filler component 420 may be at least about 51% by volume, or at least about 52% by volume, or at least about 53% by volume, or even at least about 54% by volume, etc., of at least about 50% by volume with respect to the total volume of the first filled polymer layer 404. According to still other embodiments it may be at least about 50% by volume. According to still other embodiments the content of the ceramic filler component 220 may be based on the total volume of the first filled polymer layer 404 On the other hand, it can be, for example, about 56% by volume or less, or even about 55% by volume or less, i.e., about 57% by volume or less. The content of the first ceramic filler component 420 can be any value between and including any of the above minimum values and any of the maximum values, as will be understood. It is understood that the content of the first ceramic filler component 420 can be any value between and including any of the above minimum values and any of the maximum values. The content of the first ceramic filler component 420 can be any value between and including any of the above minimum values and any of the maximum values. It is further understood that the content of the first ceramic filler component 420 can be within the range between and including any of the above minimum values and any of the maximum values.

[0200] According to still other embodiments, the first ceramic filler component 420 can include a first filler material having a specific content. For example, the content of the first filler material can be at least about 81% by volume, or at least about 82% by volume, or at least about 83% by volume, or at least about 84% by volume, or at least about 85% by volume, or at least about 86% by volume, or at least about 87% by volume, or at least about 88% by volume, or at least about 89% by volume, or even at least about 90% by volume or the like, based on the total volume of the first ceramic filler component 420. According to still other embodiments, the content of the first filler material can be about 100% by volume or less, such as about 99% by volume or less, or about 98% by volume or less, or about 97% by volume or less, or about 96% by volume or less, or about 95% by volume or less, or about 94% by volume or less, or about 93% by volume or less, or even about 92% by volume or less, based on the total volume of the first ceramic filler component 420. It will be understood that the content of the first filler material can be any value between and including any of the above minimum values and any of the maximum values. The content of the first filler material is the above minimum value and any of the maximum values between and including any value. It will be understood that the content of the first filler material can be any value between and including any of the above minimum values and any of the maximum values. The content of the first filler material is the above minimum value and any of the maximum values between and including any value. value and any value between and including any of the maximum values, as will be understood. The content of the first filler material is the above minimum value and any value between and including any of the maximum values. ​It may also be within and including the range between any one of them and the maximum value. This will be further understood.

[0201] According to still other embodiments, the first ceramic filler component 420 can include a second filler material. It can include a second filler material.

[0202] According to still other embodiments, the second filler material of the first ceramic filler component 420 can include a specific material. For example, the second filler material can include a high dielectric constant ceramic material, for example, a ceramic material having a dielectric constant of at least about 14. According to specific embodiments, the second filler material of the first ceramic filler component 420 is TiO 2, SrTiO3, ZrTi2O6, MgTiO3, CaTiO3, BaTiO4, or any high dielectric constant ceramic material such as any combination thereof.

[0203] According to still other embodiments, the second filler material of the first ceramic filler component 420 can include TiO2. According to still other embodiments, the second filler material can be composed of T iO2.

[0204] According to still other embodiments, the first ceramic filler component 420 can include a specific content of the second filler material. For example, the content of the second filler material is at least about 2 volume %, or at least about 3 volume %, or at least about 4 volume %, or at least about 5 volume %, or at least about 6 volume %, or at least about 7 volume %, or at least about 8 volume %, or at least about 9 volume %, or at least about 10 volume % with respect to the total volume of the first ceramic filler component 420. It may be at least about 1% by volume, such as at least about 10% by volume or more. Further According to other embodiments, the content of the second filler material is based on the total volume of the first ceramic filler component 42 It may be about 19% by volume or less, or about 18% by volume or less, or about 17% by volume or less Or about 16% by volume or less, or about 15% by volume or less, or about 14% by volume or less, or about 13% by volume % or less, or about 12% by volume or less, etc., and may be about 20% by volume or less. The content of the second filler It will be understood that the material may be any value between and including any of the above minimum values and any of the above maximum values. It will be further understood that the content of the second filler material may be within and including the range between any of the above minimum values and any of the above maximum values. The content of the second filler material may be between any of the above minimum values and any of the above maximum values and within the range including them. It will be further understood.

[0205] According to still other embodiments, the first ceramic filler component 420 may include an amorphous material having a specific content. For example, the first ceramic filler component 420 may include at least About 97% of amorphous material, such as at least about 98% or even at least about 99%. The content of the amorphous material may be any value between any of the above values and including any of the above values. It will be understood that the content of the amorphous material may be any value within the range between the above values and including the above values. It will be further understood. The content of the amorphous material may be any value within the range between the above values and including the above values. It will be further understood.

[0206] According to other embodiments, the first resin matrix component 410 may include a specific material. For example, the first resin matrix component 410 may include a perfluoropolymer. ​​​​It is possible. According to still other embodiments, the first resin matrix component 410 may be composed of a perfluoro polymer.

[0207] According to still other embodiments, the perfluoropoly mer of the first resin matrix component 410 may include a copolymer of tetrafluoroethylene (TFE), a copolymer of hexafluoropropylene ( HFP), a terpolymer of tetrafluoroethylene (TFE), or any combination thereof. According to other embodiments, the perfluoropoly mer of the first resin matrix component 410 may be composed of a copolymer of tetrafluoroethylene (TFE), a copolymer of hexafluoropropylene (HFP), a terpolymer of tetrafluoroethylene (TF E), or any combination thereof. mer of the first resin matrix component 410 may include a copolymer of tetrafluoroethylene (TFE), a copolymer of hexafluoropropylene (HFP), a terpolymer of tetrafluoroethylene (TF E), or any combination thereof.

[0208] According to still other embodiments, the perfluoropoly mer of the first resin matrix component 410 may include polytetrafluoroethylene (PTFE), perfluoroalkoxy polymer resin (PFA), fluorinated ethylene propylene (FEP), or any combination thereof. According to still other embodiments, the perfluoropoly mer of the first resin matrix component 410 may be composed of polytetrafluoroethylene (PTFE), perfluoroalk oxy polymer resin (PFA), fluorinated ethylene propylene (FEP), or any combination thereof. mer of the first resin matrix component 410 may include polytetrafluoroethylene (PTFE), perfluoroalkoxy polymer resin (PFA), fluorinated ethylene propylene (FEP), or any combination thereof. According to still other embodiments, the perfluoropoly mer of the first resin matrix component 410 may be composed of polytetrafluoroethylene (PTFE), perfluoroalkoxy polymer resin (PFA), fluorinated ethylene propylene (FEP), or any combination thereof.

[0209] According to still other embodiments, the first filled polymer layer 404 may include a specific content of the first resin matrix component 410. For example, the first resin matrix component The content of 410 is at least about 46% by volume, or at least about 47% by volume, or at least about 48% by volume, or at least about 4 9% by volume, or at least about 50% by volume, or at least about 51% by volume, or at least about 52% by volume, or at least about 53% by volume, or at least about 54% by volume, or even at least about 55% by volume, etc., and may be at least about 45% by volume. According to still other embodiments the content of the first resin matrix component 410 is about 63% by volume or less, or about 62% by volume or less, or about 61% by volume or less with respect to the total volume of the first filled polymer layer 4 04, or about 60% by volume or less, or about 59% by volume or less, or about 58% by volume or less , or even about 57% by volume or less. The content of the first resin matrix component 410 can be any value between and including any of the above minimum values and any of the above maximum values. It will be understood that the content of the first resin matrix component 410 can be within the range between and including any of the above minimum values and any of the above maximum values. It will be further understood.

[0210] According to still other embodiments, the first filled polymer layer 404 may contain a specific content of perfluoro polymer. For example, the content of the perfluoropolymer is at least about 46% by volume, or at least about 47% by volume with respect to the total volume of the first filled polymer layer 404, or at least about 48% by volume, or at least about 49% by volume, or at least about 5 0% by volume, or at least about 51% by volume, or at least about 52% by volume, or at least about 53% by volume, or at least about 54% by volume, or even at least about 55% by volume, etc of the total volume of the first filled polymer layer 404. , it may be at least about 45% by volume. According to yet other embodiments, the content of the perfluoropolymer is about 62% by volume or less, or about 61% by volume or less, or about 60% by volume or less, or about 59% by volume or less, or about 58% by volume % or less, or even about 57% by volume or less, etc., and may be about 63% by volume or less. The perfluoro The content of the polymer may be any value between and including any of the above minimum values and any of the above maximum values. It will be understood that the perfluoro The content of the polymer may be between and including any of the above minimum values and any of the above maximum values. It will be further understood that the perfluoro The content of the polymer may be between and including any of the above minimum values and any of the above maximum values. It will be further understood that the perfluoro The content of the polymer may be within a range between and including any of the above minimum values and any of the above maximum values.

[0211] According to yet other embodiments, the dielectric substrate 405 may have a specific porosity measured using X-ray diffraction. For example, the porosity of the substrate 405 may be about 10% by volume or less, for example , about 9% by volume or less, or about 8% by volume or less, or about 7% by volume or less, or about 6% by volume or less, or even about 5% by volume or less. The porosity of the dielectric substrate 405 may be any value between any of the above values and including any of the above values. It will be understood that the porosity of the dielectric substrate 405 may be any value within a range between the above values and including any of the above values. It will be further understood that the porosity of the dielectric substrate 405 may be any value within a range between the above values and including any of the above values.

[0212] According to yet other embodiments, the dielectric substrate 405 may have a specific average thickness. For example, the average thickness of the dielectric substrate 405 is at least about 10 micrometers, for example, at least about 15 micrometers, or at least about 20 micrometers, or at least At least about 25 micrometers, or at least about 30 micrometers, or at least about 35 micrometers, or at least about 40 micrometers, or at least about 45 micrometers, or at least about 50 micrometers, or at least about 55 micrometers, or at least about 60 micrometers, or at least about 65 micr ometers, or at least about 70 micrometers, or even at least about 75 micr ometers may be. According to still other embodiments, the average thick ness of the dielectric substrate 405 is about 2000 micrometers or less, f or example, about 1800 micrometers or less, about 1600 micrometers or less, about 1400 micrometers or less, about 1200 micr ometers or less, or about 1000 micrometers or less, or about 800 micromet ers or less, or about 600 micrometers or less, or about 400 micrometers o r less, or about 200 micrometers or less, or about 190 micrometers or le ss, or about 170 micrometers or less, or about 160 micrometers or less , or about 150 micrometers or less, or about 140 micrometers or less, or about 120 micrometers or less, or even about 100 micrometers or less may be. It will be understood that the average thickness of the dielectric sub strate 405 may be any value between and including any of the above min imum values and any of the above maximum values. It will be further und

[0213] According to yet other embodiments, the dielectric substrate 405 may have a specific dissipation factor (Df) measured in the range of 5 GHz at 20% RH. For example, the dielectric substrate 405 may have a dissipation factor of about 0. 005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less , or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less. It will be understood that the dissipation factor of the dielectric substrate 405 may be any value between any of the above values and may include any of the above values. It will be further understood that the dissipation factor of the dielectric substrate 405 may be any value within the range between the above values and may include the above values.

[0214] According to yet other embodiments, the dielectric substrate 405 may have a specific dissipation factor (Df) measured in the range of 5 GHz at 80% RH. For example, the dielectric substrate 405 may have a dissipation factor of about 0. 005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less , or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less. It will be understood that the dissipation factor of the dielectric substrate 405 may be any value between any of the above values and may include any of the above values. It will be further understood that the dissipation factor of the dielectric substrate 405 may be any value within the range between the above values and may include the above values.

[0215] According to yet other embodiments, the dielectric substrate 405 may have a range of 10 GHz at 20% RH It may have a specific dissipation factor (Df) measured at. For example, the dielectric substrate 405 may have a dissipation factor of about 0 .005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less , or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less. It will be understood that the dissipation factor of the dielectric substrate 405 can be any value between any of the above values and can include any of the above values. It will be further understood that the dissipation factor of the dielectric substrate 405 can be any value within the range between the above values and can include the above values. According to yet other embodiments, the dielectric substrate 405 may have a specific dissipation factor (Df) measured in the range of 10 GHz at 80% RH. For example, the dielectric substrate 405 may have a dissipation factor of about 0 .005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less

[0216] , or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or .005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less .005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less , or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less. It will be understood that the dissipation factor of the dielectric substrate 405 can be any value between any of the above values and can include any of the above values. It will be further understood that the dissipation factor of the dielectric substrate 405 can be any value within the range between the above values and can include the above values. According to yet other embodiments, the dielectric substrate 405 may have a specific dissipation factor (Df) measured in the range of 28 GHz at 20% RH. For example, the dielectric substrate 405 may have a dissipation factor of about 0 .005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less

[0217] , or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or .005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less Less than 0.005, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less dissipation factor may be had. The dissipation factor of the dielectric substrate 405 may be any value between any of the above values and may be a value including any of the above values. It will be understood that the dissipation factor of the dielectric substrate 405 may be any value within the range between the above values and may be a value including the above values. According to yet another embodiment, the dielectric substrate 405 may have a specific dissipation factor (Df) measured in the range of 28 GHz at 80% RH. For example, the dielectric substrate 405 may have a dissipation factor of about 0 .005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less. The dissipation factor of the dielectric substrate 405 may be any value between any of the above values and may be a value including any of the above values. It will be understood that the dissipation factor of the dielectric substrate 405 may be any value within the range between the above values and may be a value including the above values.

[0218] According to yet another embodiment, the dielectric substrate 405 may have a specific dissipation factor (Df) measured in the range of 39 GHz at 20% RH. For example, the dielectric substrate 405 may have a dissipation factor of about 0 .005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or .005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less dissipation factor may be had. The dissipation factor of the dielectric substrate 405 may be any value between any of the above values and may be a value including any of the above values. It will be understood that the dissipation factor of the dielectric substrate 405 may be any value within the range between the above values and may be a value including the above values. According to yet another embodiment, the dielectric substrate 405 may have a specific dissipation factor (Df) measured in the range of 39 GHz at 20% RH. For example, the dielectric substrate 405 may have a dissipation factor of about 0 .005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or .005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less dissipation factor may be had. The dissipation factor of the dielectric substrate 405 may be any value between any of the above values and may be a value including any of the above

[0219] According to yet another embodiment, the dielectric substrate 405 may have a specific dissipation factor (Df) measured in the range of 39 GHz at 20% RH. For example, the dielectric substrate 405 may have a dissipation factor of about 0 .005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or .005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or less than or about 0.0019 or less than or about 0.0018 or less than or about 0.0017 or having a dissipation factor of less than or about 0.0016 or less than or about 0.0015 or less than or about 0.0014 may be. It will be understood that the dissipation factor of the dielectric substrate 405 may be any value between any of the above values and may include any of the above values. It will be further understood that the dissipation factor of the dielectric substrate 405 may be any value within the range between the above values and may include the above values and. will be further understood.

[0220] According to still other embodiments, the dielectric substrate 405 may have a specific dissipation factor (Df) measured in the range of 39 GHz at 80% RH . For example, the dielectric substrate 405 may have a dissipation factor of about 0 .005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or having a dissipation factor of less than or about 0.0016 or less than or about 0.0015 or less than or about 0.0014 may be. It will be understood that the dissipation factor of the dielectric substrate 405 may be any value between any of the above values and may include any of the above values. It will be further understood that the dissipation factor of the dielectric substrate 405 may be any value within the range between the above values and may include the above values and. will be further understood.

[0221] According to still other embodiments, the dielectric substrate 405 may have a specific dissipation factor (Df) measured in the range of 76 - 81 GHz at 20% RH . For example, the dielectric substrate 405 may , about 0.005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.0 02 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less , or a dissipation factor of about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less may be included. It will be understood that the dissipation factor of the dielectric substrate 405 may be any value between any of the above values and may include any of the above values. The dissipation factor of the dielectric substrate 405 may be any value within the range between the above values and may include the above values will be further understood.

[0222] According to yet another embodiment, the dielectric substrate 405 may have a specific dissipation factor (Df) measured in the range of 76 - 81 GHz at 80% RH . For example, the dielectric substrate 405 may have a dissipation factor of about 0.005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.0 02 or less, or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less , or a dissipation factor of about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less may be included. It will be understood that the dissipation factor of the dielectric substrate 405 may be any value between any of the above values and may include any of the above values. The dissipation factor of the dielectric substrate 405 may be any value within the range between the above values and may include the above values will be further understood.

[0223] According to yet another embodiment, the dielectric substrate 405 may have a specific coefficient of thermal expansion measured according to IPC-TM-650 2.4. 24 Rev.C Glass Transition Temperature an d Z-Axis Thermal Expansion by TMA. For example, the dielectric substrate 405 may have a coefficient of thermal expansion of about 80 ppm / °C or less.

[0224] According to another embodiment of the copper-clad laminate formed according to forming method 300, FIG. 4b shows a diagram of a copper-clad laminate 401. As shown in FIG. 4b, the copper-clad laminate 400b can include a copper foil layer 4 01 and a dielectric substrate 405 covering the surface of the copper foil layer 401. As shown in FIG. 4b the dielectric substrate 405 can include a first fluoropolymer-based adhesive layer 403, a poly imide layer 402, a first filled polymer layer 404 covering the polyimide layer 402, a poly imide layer 402, a second filled polymer layer 406 covering the bottom of the polyimide layer 402, and a second filled polymer layer 406 a second fluoropolymer-based adhesive layer 408 covering the bottom of the second filled polymer layer 406. As shown in FIG. 4b the second filled polymer layer 406 can include a second resin matrix component 430 and a second ceramic filler component 440.

[0225] According to yet another embodiment, the second fluoropolymer-based adhesive layer 408 can have a specific average thickness. For example, the second fluoropolymer-based adhesive layer 408 can be at least about 0.2 micrometers, for example, at least about 0.5 micrometers, or at least about 1.0 micrometers, or at least about 1.5 micrometers, or at least about 2.0 micrometers, or at least about 2.5 micrometers, or even at least about 3.0 micrometers. According to yet another embodiment, the average thickness of the second fluoropolymer-based adhesive layer 408 is about 7 micrometers or less, for example, about 6 .5 or less, or about 6.0 or less, or about 5.5 or less, or about 5.0 or less, about 4.9 micrometers or less, or about 4.8 micrometers or less, or about 4.7 micrometers or less or about 4.6 micrometers or less, or about 4.5 micrometers or less, or about 4. 4 micrometers or less, or about 4.3 micrometers or less, or about 4.2 micrometer or less, or about 4.1 micrometers or less, or about 4.1 micrometers or less, or about 4.0 micrometers or less, or about 3.9 micrometers or less, or about 3.8 micrometers or less, or about 3.7 micrometers or less, or about 3.6 micrometer or less, or even about 3.5 micrometers or less. The average thickness of the second fluoropoly mer-based adhesive layer 408 may be any value between and including any of the above minimum values and any of the above maximum values. It will be understood that the average thickness of the second fluoropoly mer-based adhesive layer 408 may be within a range between and including any of the above minimum values and any of the above maximum values. It will be further understood that the average thickness of the second fluoropolymer-based adhesive layer 408 may be within a range between and including any of the above minimum values and any of the above maximum values. It will be further understood that the average thickness of the second fluoropolymer-based adhesive layer 408 may be within a range between and including any of the above minimum values and any of the above maximum values.

[0226] According to still other embodiments, the second fluoropolymer-based adhesive layer 408 may include certain materials. For example, the second fluoropolymer-based adhesive layer 408 may include a fluoropolymer (e.g., polytetrafluoroethylene (PTFE), modified polytetrafluoroethylene (mPTFE), copolymers and terpolymers of tetrafluoroethylene such as fluorinated ethylene-propylene (FEP), perfluoroalkoxy polymer resin (PFA), and modified perfluoroalkoxy polymer resin (mPFA), as well as derivatives and blends thereof. According to still other embodiments, the second fluoropolymer-based adhesive layer 408 may include a fluoropolymer (e.g., polytetrafluoroethylene (PTFE), modified According to still other embodiments, the second fluoropolymer-based adhesive layer 408 may include a fluoropolymer (e.g., polytetrafluoroethylene (PTFE), modified polytetrafluoroethylene (PTFE), modified ​​Polytetrafluoroethylene (mPTFE), fluorinated ethylene-propylene (FEP) Copolymers and terpolymers of tetrafluoroethylene such as perfluoroalkoxy polymer resin (PFA), and modified perfluoroalkoxy polymer resin (mPFA), and may be composed of derivatives and blends thereof.

[0227] According to a particular embodiment, the second ceramic filler component 440 may comprise a third filler material having particular properties that can improve the performance of the dielectric substrate 405 .

[0228] According to a particular embodiment, the third filler material of the second ceramic filler component 440 can have a particular size distribution. For the purposes of the embodiments described herein, the particle size distribution of the material, e.g., the particle size distribution of the third filler material, may be described using any combination of the particle size distribution D values D , D 10 , D 50 and D 90 . The D 10 value from the particle size distribution is defined as the particle size value such that 10% of the particles are smaller than that value and 90% of the particles are larger than that value. The D 50 value from the particle size distribution is defined as the particle size value such that 50% of the particles are smaller than that value and 50% of the particles are larger than that value. The D 90 value from the particle size distribution is defined as the particle size value such that 90% of the particles are smaller than that value and 10% of the particles are larger than that value. For the purposes of the embodiments described herein, the particle size measurement of a particular material is performed using laser diffraction spectroscopy.

[0229] ​​According to certain embodiments, the third filler material of the second ceramic filler component 440 is , and may have a specific size distribution D 10 value. For example, the D 10 of the third filler material is at least about 0.3 micrometers, or at least about 0.4 micrometers, or at least about 0.5 micrometers, or at least about 0.6 micrometers, or at least about 0.7 micrometers, or at least about 0.8 micrometers, or at least about 0.9 micrometers, or at least about 1.0 micrometers, or at least about 1.1 micrometers, or even at least about 1.2 micrometers, and may be any, at least about 0.2 micrometers. According to still other embodiments , the D 10 of the third filler material is about 1.5 micrometers or less, or even about 1.4 micrometers or less, etc., and may be about 1.6 micrometers or less. The D of the third filler material 10 may be any value between and including any of the above minimum values and any of the above maximum values. It will be understood that the D of the third filler material 10 may be between and including any of the above minimum values and any of the above maximum values. It will be further understood that it may be within the range.

[0230] According to other embodiments, the third filler material of the second ceramic filler component 440 is , and may have a specific size distribution D 50 value. For example, the D 50 of the third filler material is at least about 0.8 micrometers, for example, at least about 0.9 micrometers, or At least about 1.0 micrometer, or at least about 1.1 micrometer, or At least about 1.2 micrometer, or at least about 1.3 micrometer, or At least about 1.4 micrometer, or at least about 1.5 micrometer, or At least about 1.6 micrometer, or at least about 1.7 micrometer, or At least about 1.8 micrometer, or at least about 1.9 micrometer, or At least about 2.0 micrometer, or at least about 2.1 micrometer, or Furthermore, it may be at least about 2.2 micrometers. According to still other embodiments , the D of the third filler material 50 is about 2.6 micrometers or less, or about 2.5 micrometers or less, or even about 2.4 micrometers or less, etc., of about 2.7 micrometers or less. The D of the third filler material 50 may be any value between and including any of the above minimum values and any of the maximum values. It will be understood that the D of the third filler material 50 may be within and including the range between any of the above minimum values and any of the maximum values. This will be further understood to be the case.

[0231] According to other embodiments, the third filler material of the second ceramic filler component 440 may have a specific size distribution D 90 value. For example, the D of the third filler material 90 is at least about 0.9, or at least about 1.0, or at least about 1.1, or at least about 1.2, or at least about 1.3, or at least about 1.4, or at least about 1.5, or at least about 1.6 micrometers, or at least about 1.7 micrometers, or at least about 1.8 micrometers, or at least about 1.9 micrometers, or at least about 2.0 micrometers, or at least about 2.1 micrometers, or at least about 2.2 micrometers, or at least about 2.3 micrometers, or at least about 2.4 micrometers, or at least about 2.5 micrometers, or at least about 2.6 micrometers, or even at least about 2.7 micrometers etc., may be at least about 0.8 micrometers. In yet other embodiments according to, the D of the third filler material 90 is about 7.5 micrometers or less, or about 7.0 micr ometers or less, or about 6.5 micrometers or less, or about 6.0 micrometers or less, or about 5.5 micrometers or less, or about 5.4 micrometers or less, or about 5.3 micrometers or less, or about 5.2 micrometers or less, or even about 5. 1 micrometers or less etc., may be about 8.0 micrometers or less. The third filler material's D 90 is understood to be any value between and including any of the above minimum values and any of the above maximum values. The D of the third filler material is understood to be any value between and including any of the above minimum values and any of the above maximum values and within the range 90 thereof. It will be further understood that the D of the third filler material is within the range between and including any of the above minimum values and any of the above maximum values and may be within that range.

[0232] In yet other embodiments, the third filler material of the second ceramic filler component 440 may have a specific average particle size measured according to laser diffraction spectroscopy. For example, the The average particle size of the filler material of 3 is about 9 micrometers or less, or about 8 micrometers or less, or about 7 micrometers or less, or about 6 micrometers or less, or about 5 micrometers or less, or about 4 micrometers or less, or about 3 micrometers or less, or even about 2 micrometers or less, etc., and may be about 10 micrometers or less. It will be understood that the average particle size of the filler material of 3 can be any value between and including any of the above values. It will be further understood that the average particle size of the third filler material can be within the range between and including any of the above values.

[0233] According to still other embodiments, the third filler material of the second ceramic filler component 440 can be described as having a specific particle size distribution span (PSDS), and the PSD S is equal to (D 90 -D 10 ) / D 50 wherein D 90 is equal to the D9 0 particle size distribution measurement value of the third filler material, and D 10 is equal to the D 10 particle size distribution measurement value of the third filler material, and D is equal to the D 50 particle size distribution measurement value of the third filler material. For example, the PSDS of the third filler material can be about 5 or less, such as about 4.5 or less, or about 4.0 or less, or about 3.5 or less, or about 3. 50 0 or less, or even about 2.5 or less. It will be understood that the PSDS of the third filler material can be any value between and including any of the above values. It will be further understood that the PSDS of the third filler material can be within the range between and including any of the above values.

[0234] ​​​​​​​​​​​​ According to yet another embodiment, the third filler material of the second ceramic filler component 440 can be described as having a specific average surface area measured using Brunauer-Emmett-Teller (BET) surface area analysis (nitrogen adsorption). For example the third filler material can have an average surface area of about 9.9 m / g or less, or about 9.5 m 2 / g or less, or about 9 2 .0 m / g or less, or about 8.5 m 2 / g or less, or about 8.0 m 2 / g or less, or about 7. 2 / g or less, or about 7 .5 m 2 / g or less, or about 7.0 m 2 / g or less, or about 6.5 m 2 / g or less, or about 6.0 m 2 / g or less, or about 5.5 m 2 / g or less, or about 5.0 m 2 / g or less, or about 4.5 m 2 / g or less, or about 4.0 m 2 / g or less, or even about 3.5 m 2 / g or less, etc., and may have an average surface area of about 1 0 m 2 / g or less. According to yet another embodiment, the third filler material may have an average surface area of at least about 1.2 m 2 / g, such as at least about 2.4 m 2 / g. It will be understood that the average surface area of the third filler material can be any value between and including any of the above minimum values and any of the above maximum values. It will be further understood that the average surface area of the third filler material can be within a range between and including any of the above minimum values and any of the above maximum values.

[0235] According to other embodiments, the third filler material of the second ceramic filler component 440 may include certain materials. According to certain embodiments, the third filler material may be silica -based compounds. According to still other embodiments, the third filler material may be composed of silica-based compounds. According to other embodiments, the third filler material may include silica . According to still other embodiments, the third filler material may be composed of silica .

[0236] According to still other embodiments, the first filled polymer layer 404 may include a specific content of the second ceramic filler component 440. For example, the content of the second ceramic filler component 440 may be at least about 31 volume %, or at least about 32 volume %, or at least about 33 volume %, or at least about 3 4 volume %, or at least about 35 volume %, or at least about 36 volume %, or at least about 37 volume %, or at least about 38 volume %, or at least about 39 volume %, or at least about 40 volume %, or at least about 41 volume %, or at least about 42 volume %, or at least about 43 volume %, or at least about 44 volume %, or at least about 45 volume %, or at least about 46 volume %, or at least about 47 volume %, or at least about 48 volume % , or at least about 49 volume %, or at least about 50 volume %, or at least about 51 volume %, or at least about 52 volume %, or at least about 53 volume %, or even at least about 54 volume %, etc., and may be at least about 30 volume %. According to still other embodiments, the content of the second ceramic filler component 440 is the total With respect to volume, it may be about 57% by volume or less, for example, about 56% by volume or less, or even about 55% by volume. It may be as follows. The content of the ceramic filler component 220 may be any value between and including any of the above minimum values and any of the maximum values, which will be understood. It will be understood that the content of the ceramic filler component 220 may be within the range between and including any of the above minimum values and any of the maximum values. According to yet another embodiment, the second ceramic filler component 440 can include a third filler material having a specific content. For example, the content of the third filler material is at least about 81% by volume, or at least about 82% by volume, or at least about 83% by volume, or at least about 84% by volume, or at least about 85% by volume, or at least about 86% by volume, or at least about 87% by volume, or at least

[0237] about 88% by volume, or at least about 89% by volume, or even at least about 90% by volume, etc., and may be at least about 80% by volume. According to yet another embodiment, the content of the third filler material is about 99% by volume or less, or about 98% by volume or less, or about 97% by volume or less, or about 96% by volume or less, or about 95% by volume or less, or about 94% by volume or less, or about 93% by volume or less, or even about 92% by volume or less, etc., and may be about 100% by volume or less. It will be understood that the content of the third filler material can be any value between and including any of the above minimum values and any of the maximum values. The content of the third filler material is within the range between and including any of the above minimum values and any of the maximum values, which will be further understood. It will be understood that the content of the third filler material can be any value between and including any of the above minimum values and any of the maximum values. about 82% by volume, or at least about 83% by volume, or at least about 84% by volume, or at least about 85% by volume, or at least about 86% by volume, or at least about 87% by volume, or at least about 88% by volume, or at least about 89% by volume, or even at least about 90% by volume, etc., and may be at least about 80% by volume. According to yet another embodiment, the content of the third filler material is about 99% by volume or less, or about 98% by volume or less, or about 97% by volume or less, or about 96% by volume or less, or about 95% by volume or less, or about 94% by volume or less, or about 93% by volume or less, or even about 92% by volume or less, etc., and may be about 100% by volume or less. The content of the third filler material is between any of the above minimum values and any of the maximum values and can include any value therebetween, which will be understood. The content of the third filler material is within the range between any of the above minimum values and any of the maximum values and including them, which will be further understood. It will be understood that the content of the third filler material can be any value between and including any of the above minimum values and any of the maximum values. about 98% by volume or less, or about 97% by volume or less, or about 96% by volume or less, or about 95% by volume or less, or about 94% by volume or less, or about 93% by volume or less, or even about 92% by volume or less, etc., and may be about 100% by volume or less. The content of the third filler material is between any of the above minimum values and any of the maximum values and can include any value therebetween, which will be understood. It will be understood that the content of the third filler material can be any value between and including any of the above minimum values and any of the maximum values. It will be understood that the content of the third filler material can be any value between and including any of the above minimum values and any of the maximum values. It will be understood that the content of the third filler material can be any value between and including any of the above minimum values and any of the maximum values. It can be further understood that it can be within and including the range between any one of the deviations and the maximum value. be understood.

[0238] According to yet another embodiment, the second ceramic filler component 440 can include a fourth filler material. be included.

[0239] According to yet another embodiment, the fourth filler material of the second ceramic filler component 440 can include a specific material. For example, the fourth filler material can include a high dielectric constant ceramic material such as a ceramic material having a dielectric constant of at least about 14. According to a specific embodiment, the fourth filler material of the second ceramic filler component 440 can include any high dielectric constant ceramic material such as TiO2, SrTiO3, ZrTi2O6, MgTiO3, CaTiO3, BaTiO4, or any combination thereof. can include a specific material. For example, the fourth filler material can include a high dielectric constant ceramic material such as a ceramic material having a dielectric constant of at least about 14. According to a specific embodiment, the fourth filler material of the second ceramic filler component 440 can include any high dielectric constant ceramic material such as TiO2, SrTiO3, ZrTi2O6, MgTiO3, CaTiO3, BaTiO4, or any combination thereof. According to a specific embodiment, the fourth filler material of the second ceramic filler component 440 can include TiO2, SrTiO3, ZrTi2O6, MgTiO3, CaTiO3, BaTiO4, or any combination thereof. According to yet another embodiment, the fourth filler material of the second ceramic filler component 440 can include TiO2. According to yet another embodiment, the fourth filler material can be composed of TiO2.

[0240] According to yet another embodiment, the second ceramic filler component 440 can include a specific content of the fourth filler material. For example, the content of the fourth filler material can be at least about 1 volume %, such as at least about 2 volume %, or at least about 3 volume %, or at least about 4 volume %, or at least about 5 volume %, or at least about 6 volume %, or at least about 7 volume %, or at least about 8 volume %, or at least about 9 volume %, or at least about 10 volume % with respect to the total volume of the second ceramic filler component 440. According to yet another embodiment, the fourth filler material of the second ceramic filler component 440 can include a specific content of the fourth filler material. For example, the content of the fourth filler material can be at least about 1 volume %, such as at least about 2 volume %, or at least about 3 volume %, or at least about 4 volume %, or at least about 5 volume %, or at least about 6 volume %, or at least about 7 volume %, or at least about 8 volume %, or at least about 9 volume %, or at least about 10 volume % with respect to the total volume of the second ceramic filler component 440. According to yet another embodiment, the fourth filler material can be composed of TiO2.

[0241] According to yet another embodiment, the second ceramic filler component 440 can include a specific content of the fourth filler material. For example, the content of the fourth filler material can be at least about 1 volume %, such as at least about 2 volume %, or at least about 3 volume %, or at least about 4 volume %, or at least about 5 volume %, or at least about 6 volume %, or at least about 7 volume %, or at least about 8 volume %, or at least about 9 volume %, or at least about 10 volume % with respect to the total volume of the second ceramic filler component 440. According to yet another embodiment, the second ceramic filler component 440 can include a specific content of the fourth filler material. For example, the content of the fourth filler material can be at least about 1 volume %, such as at least about 2 volume %, or at least about 3 volume %, or at least about 4 volume %, or at least about 5 volume %, or at least about 6 volume %, or at least about 7 volume %, or at least about 8 volume %, or at least about 9 volume %, or at least about 10 volume % with respect to the total volume of the second ceramic filler component 440. According to yet another embodiment, the fourth filler material can be at least about 1 volume %, such as at least about 2 volume %, or at least about 3 volume %, or at least about 4 volume %, or at least about 5 volume %, or at least about 6 volume %, or at least about 7 volume %, or at least about 8 volume %, or at least about 9 volume %, or at least about 10 volume % with respect to the total volume of the second ceramic filler component 440. According to yet another embodiment, the fourth filler material can be at least about 1 volume %, such as at least about 2 volume %, or at least about 3 volume %, or at least about 4 volume %, or at least about 5 volume %, or at least about 6 volume %, or at least about 7 volume %, or at least about 8 volume %, or at least about 9 volume %, or at least about 10 volume % with respect to the total volume of the second ceramic filler component 440. According to yet another embodiment, the fourth filler material can be at least about 1 volume %, such as at least about 2 volume %, or at least about 3 volume %, or at least about 4 volume %, or at least about 5 volume %, or at least about 6 volume %, or at least about 7 volume %, or at least about 8 volume %, or at least about 9 volume %, or at least about 10 volume % with respect to the total volume of the second ceramic filler component 440. According to yet another embodiment, the fourth filler material can be at least about 1 volume %, such as at least about 2 volume %, or at least about 3 volume %, or at least about 4 volume %, or at least about 5 volume %, or at least about 6 volume %, or at least about 7 volume %, or at least about 8 volume %, or at least about 9 volume %, or at least about 10 volume % with respect to the total volume of the second ceramic filler component 440. According to other embodiments, the content of the fourth filler material is the second ceramic filler component 44 For the total volume of 0, it may be about 20% by volume or less, for example, about 19% by volume or less, or about 18% by volume Or less, or about 17% by volume or less, or about 16% by volume or less, or about 15% by volume or less, or about 1 4% by volume or less, or about 13% by volume or less, or about 12% by volume or less. The fourth filling It will be understood that the content of the agent material can be any value between any of the above minimum values and any of the maximum values and can include them. The content of the fourth filler material is It will be further understood that it can be within and include the range between any of the above minimum values and any of the maximum values and within that range.

[0242] According to still other embodiments, the second ceramic filler component 440 can include an amorphous material having a specific content. For example, the second ceramic filler component 440 can include at least At least about 97% of an amorphous material, such as at least about 98% or even at least about 99%. The content of the amorphous material can be any value between any of the above values, and can be a value including any of the above values, as will be understood It will be further understood that the content of the amorphous material can be any value within the range between the above values and can be a value including the above values and within that range. It will be understood that the content of the amorphous material can be any value between any of the above values and can be a value including any of the above values It will be further understood that the content of the amorphous material can be any value within the range between the above values and can be a value including the above values and within that range.

[0243] According to still other embodiments, the second resin matrix component 430 can include a specific material. For example, the second resin matrix component 430 can include a perfluoropolymer and can. According to still other embodiments, the second resin matrix component 430 can be composed of a perfluoro ropolymer. It may be composed of a perfluoropolymer.

[0244] According to still other embodiments, the perfluoropolymer of the second resin matrix component 430 may include a copolymer of tetrafluoroethylene (TFE), a copolymer of hexafluoropropylene ( HFP), a terpolymer of tetrafluoroethylene (TFE), or any combination thereof. According to other embodiments, the perfluoropolymer of the second resin matrix component 430 may be composed of a copolymer of tetrafluoroethylene (TFE), a copolymer of hexafluoropropylene (HFP), a terpolymer of tetrafluoroethylene (TF E), or any combination thereof. According to still other embodiments, the perfluoropolymer of the second resin matrix component 430 may include polytetrafluoroethylene (PTFE), perfluoroalkoxy polymer resin (PFA), fluorinated ethylene propylene (FEP), or any combination thereof. According to still other embodiments, the perfluoropolymer of the second resin matrix component 430 may be composed of polytetrafluoroethylene (PTFE), perfluoroalkoxy polymer resin (PFA), fluorinated ethylene propylene (FEP), or any combination thereof.

[0245] According to still other embodiments, the first filled polymer layer 404 may include a specific content of the second resin matrix component 430. For example, the content of the second resin matrix component 43 0 may be at least, at least about 31% by volume, or at least about 32% by volume, or at least about 33% by volume, or at least to the total volume of the first filled polymer layer 404. copolymer resin (PFA), fluorinated ethylene propylene (FEP), or any combination thereof. It may also be composed of any combination thereof.

[0246] According to still other embodiments, the first filled polymer layer 404 may include a specific content of the second resin matrix component 430. For example, the content of the second resin matrix component 43 0 is at least, at least about 31% by volume, or at least about 32% by volume, or at least about 33% by volume, or at least Also about 34% by volume, or at least about 35% by volume, or at least about 36% by volume, or at least about 37% by volume, or at least about 38% by volume, or at least about 39% by volume, or at least about 40% by volume, or at least about 41% by volume, or at least about 42% by volume, or at least about 43% by volume, or at least about 44% by volume, or at least about 45% by volume %, or at least about 46% by volume, or at least about 47% by volume, or at least about 48 % by volume, or at least about 49% by volume, or at least about 50% by volume, or at least about 51% by volume, or at least about 52% by volume, or at least about 53% by volume, or at least about 54% by volume, or even at least about 55% by volume, etc., may be about 30% by volume. According to yet other embodiments, the content of the first resin matrix component 410 is about 63% by volume or less, or about 62% by volume or less, or about 61% by volume or less, or about 60% by volume or less, or about 59% by volume or less, or about 58% by volume or less or even about 57% by volume or less, with respect to the total volume of the first filled polymer layer 404. The content of the second resin matrix component 430 is understood to be any value between and including any of the above minimum values and any of the above maximum values. It will be understood that the content of the second resin matrix component 430 can be within and including the range between any of the above minimum values and any of the above maximum values.

[0247] According to yet other embodiments, the second filled polymer layer 406 may contain a perfluoropolymer with a specific content. For example, the content of the perfluoropolymer is at least about 46% by volume, or at least about 47% by volume, with respect to the total volume of the second filled polymer layer 406 or at least about 48% by volume, or at least about 49% by volume, or at least about 50% by volume, or at least about 51% by volume, or at least about 52% by volume, or at least about 53% by volume, or at least about 54% by volume, or at least about 55% by volume, or at least about 56% by volume, or at least about 57% by volume, or at least about 58% by volume, or at least about 59% by volume, or at least about 60% by volume, or at least about 61% by volume, or at least about 62% by volume, or at least about 63% by volume, or at least about 64% by volume, or at least about 65% by volume, or at least about 66% by volume, or at least about 67% by volume, or at least about 68% by volume, or at least about 69% by volume, or at least about 70% by volume, or at least about 71% by volume, or at least about 72% by volume, or at least about 73% by volume, or at least about 74% by volume, or at least about 75% by volume, or at least about 76% by volume, or at least about 77% by volume, or at least about 78% by volume, or at least about 79% by volume, or at least about 80% by volume, or at least about 81% by volume, or at least about 82% by volume, or at least about 83% by volume, or at least about 84% by volume, or at least about 85% by volume, or at least about 86% by volume, or at least about 87% by volume, or at least about 88% by volume, or at least about 89% by volume, or at least about 90% by volume, or at least about 91% by volume, or at least about 92% by volume, or at least about 93% by volume, or at least about 94% by volume, or at least about 95% by volume, or at least about 96% by volume, or at least about 97% by volume, or at least about 98% by volume, or at least about 99% by volume, or 100% by volume. %, or at least about 48% by volume, or at least about 49% by volume, or at least about 5 0% by volume, or at least about 51% by volume, or at least about 52% by volume, or at least about 53% by volume, or at least about 54% by volume, or even at least about 55% by volume, etc. , may be at least about 45% by volume. According to yet other embodiments, the perfluoro polymer content is about 62% by volume or less, or about 61% by volume or less, or about 60% by volume or less, or about 59% by volume or less, or about 58% by volume % or less, or even about 57% by volume or less, etc., may be about 63% by volume or less. The perflu oropolymer content may be any value between and including any of the above minimum values and any of the above maximum values. It will be understood that the perfluoro polymer content may be within the range between and including any of the above minimum values and any of the above maximum values.

[0248] According to yet other embodiments, the dielectric substrate 405 may have a specific porosity measured using X-ray diffraction. For example, the porosity of the substrate 200 is about 10% by volume or less, for example , about 9% by volume or less, or about 8% by volume or less, or about 7% by volume or less, or about 6% by volume or less, or even about 5% by volume or less. The porosity of the dielectric substrate 405 may be any value between any of the above values and including any of the above values. It will be understood that the porosity of the dielectric substrate 405 may be any value within the range between the above values and including the above values. It will be further understood that the porosity of the dielectric substrate 405 may be any value within the range between the above values and including the above values.

[0249] According to yet another embodiment, the dielectric substrate 405 may have a specific average thickness. For example, the average thickness of the dielectric substrate 405 is at least about 10 micrometers, for example, at least about 15 micrometers, or at least about 20 micrometers, or at least about 25 micrometers, or at least about 30 micrometers, or at least about 35 micrometers, or at least about 40 micrometers, or at least about 45 micrometers, or at least about 50 micrometers, or at least about 55 micrometers, or at least about 60 micrometers, or at least about 65 micr ometers, or at least about 70 micrometers, or even at least about 75 micr ometers. According to yet another embodiment, the average thickness of the dielectric substrate 405 is about 2000 micrometers or less, for example, about 1800 micrometers or less, about 1600 micrometers or less, about 1400 micrometers or less, about 1200 microm eters or less, or about 1000 micrometers or less, or about 800 micrometers or less , or about 600 micrometers or less, or about 400 micrometers or less, or about 2 00 micrometers or less, or about 190 micrometers or less, or about 180 microm eters or less, or about 170 micrometers or less, or about 160 micrometers or less , or about 150 micrometers or less, or about 140 micrometers or less, or about 12 0 micrometers or less, or even about 100 micrometers or less. It will be understood that the average thickness of the dielectric substrate 405 may be any value between and including any of the above minimum values and any of the above maximum values. The dielectric substrate ​ The average thickness of 405 may be between any of the above minimum values and any of the maximum values or within a range including them, which will be further understood.

[0250] According to still other embodiments, the dielectric substrate 405 may have a specific dissipation factor (Df) measured in the range of 5 GHz at 20% RH. For example, the dielectric substrate 405 may have a dissipation factor of about 0. 005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less , or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less. It will be understood that the dissipation factor of the dielectric substrate 405 may be any value between any of the above values and may be a value including any of the above values. It will be further understood that the dissipation factor of the dielectric substrate 405 may be any value within the range between the above values and may be a value including the above values.

[0251] According to still other embodiments, the dielectric substrate 405 may have a specific dissipation factor (Df) measured in the range of 5 GHz at 80% RH. For example, the dielectric substrate 405 may have a dissipation factor of about 0. 005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less , or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less. It will be understood that the dissipation factor of the dielectric substrate 405 may be any value between any of the above values and may be a value including the above values. It will be understood that the dissipation factor of the dielectric substrate 405 can be any value within the range between the above values and may also be a value including the above values will be further understood

[0252] According to still other embodiments, the dielectric substrate 405 may have a specific dissipation factor (Df) measured in the range of 10 GHz at 20% RH For example, the dielectric substrate 405 may have a dissipation factor of about 0 .005 or less, for example, about 0.004 or less, or about 0.003 or less, or about 0.002 or less or about 0.0019 or less, or about 0.0018 or less, or about 0.0017 or less, or about 0.0016 or less, or about 0.0015 or less, or about 0.0014 or less It will be understood that the dissipation factor of the dielectric substrate 405 can be any value between any of the above values and may also be a value including any of the above values It will be further understood th...

Claims

1. A copper clad laminate comprising a copper foil layer and a dielectric substrate covering the copper foil layer, The substrate is A first fluoropolymer adhesive layer and a po- a polyimide layer and a first filled polymer layer covering the polyimide layer, The first filled polymer layer comprises a first resin matrix component and a first ceramic a filler component, the first ceramic filler component comprising a first filler material, the first filler material further comprising an average particle size of about 10 micrometers or less. 。

2. The first fluoropolymer adhesive layer has a thickness of at least about 0.2 micrometers.

10. The copper clad laminate of claim 1 having an average thickness of about 7 micrometers or less.

3. The silica filler material of the first ceramic filler component has a particle size distribution spectrum of about 8 or less. Pan (PSDS), PSDS is (D ９０ -D １０ ) / D ５０ where D ９０ is the D of the silica filler material ９０ D is equal to the particle size distribution measurement １０ is the first Filler material D １０ D is equal to the particle size distribution measurement ５０ is the D of the first filler material ５０ The copper clad laminate of claim 1 , wherein the particle size distribution is equal to the particle size distribution measurement.

4. The first filler material is about 10 m ２ 10. The method of claim 1 further comprising an average surface area of ​​less than or equal to 100 nm. The copper clad laminate described herein.

5. The copper clad laminate of claim 1 , wherein the first filler material comprises a silica-based compound.

6. The copper clad laminate of claim 1 , wherein the first filler material comprises silica.

7. The composition of claim 1 , wherein the first resin matrix component comprises a perfluoropolymer. Copper clad laminate.

8. The content of the first resin matrix component is based on the total volume of the first filled polymer layer.

2. The copper clad stack of claim 1, wherein the copper clad stack is at least about 45% by volume and no more than about 63% by volume. Layer plate.

9. The content of the ceramic filler component is based on the total volume of the dielectric coating.

10. The copper clad laminate of claim 1, wherein the copper clad laminate is at least about 30% by volume and no more than about 57% by volume.

10. The content of the first filler material is based on the total volume of the first ceramic filler component.

10. The copper clad laminate of claim 1, wherein the copper clad laminate comprises at least about 80% by volume and no more than about 100% by volume. Board.

11. The dielectric coating comprises a dissipation factor of about 3.5 or less (5 GHz, 20% RH). The copper clad laminate of claim 1.

12. 1. A printed circuit board comprising a copper clad laminate, the copper clad laminate comprising: A copper foil layer and a dielectric substrate covering the copper foil layer, the dielectric substrate comprising: a first fluoropolymer adhesive layer and a second fluoropolymer adhesive layer covering the first fluoropolymer adhesive layer; a polyimide layer and a first filled polymer layer overlying the polyimide layer; The first filled polymer layer comprises a first resin matrix component and a first ceramic matrix component. and a first ceramic filler component, the first ceramic filler component comprising a first filler material; The first filler material further comprises an average particle size of about 10 micrometers or less. Circuit board.

13. The first fluoropolymer adhesive layer has a thickness of at least about 0.2 micrometers.

13. The printed circuit board of claim 12 having an average thickness of about 7 micrometers or less. 。

14. The silica filler material of the first ceramic filler component has a particle size distribution spectrum of about 8 or less. Pan (PSDS), PSDS is (D ９０ -D １０ ) / D ５０ where D ９０ is the D of the silica filler material ９０ D is equal to the particle size distribution measurement １０ is the first Filler material D １０ D is equal to the particle size distribution measurement ５０ is the D of the first filler material ５０ The printed circuit board of claim 12, wherein the particle size distribution measurement is equal to the particle size distribution measurement.

15. 1. A method of forming a dielectric substrate, the method comprising: Providing a first fluoropolymer based adhesive layer; providing a polyimide layer overlying the first fluoropolymer based adhesive layer; A first resin matrix precursor component and a first ceramic filler precursor component are combined. and combining the above to form a formed mixture. forming the forming mixture into a first filled polymer layer overlying the polyimide layer; said first ceramic filler precursor component comprising a first filler precursor material; The first filler precursor material further comprises an average particle size of about 10 micrometers or less. Law.

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